WO2020119227A1 - 传送装置及刻蚀设备 - Google Patents

传送装置及刻蚀设备 Download PDF

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Publication number
WO2020119227A1
WO2020119227A1 PCT/CN2019/109360 CN2019109360W WO2020119227A1 WO 2020119227 A1 WO2020119227 A1 WO 2020119227A1 CN 2019109360 W CN2019109360 W CN 2019109360W WO 2020119227 A1 WO2020119227 A1 WO 2020119227A1
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WIPO (PCT)
Prior art keywords
carrier
buffer
track
transmission
coils
Prior art date
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Ceased
Application number
PCT/CN2019/109360
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English (en)
French (fr)
Inventor
刘俊领
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication of WO2020119227A1 publication Critical patent/WO2020119227A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/37—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Definitions

  • the invention relates to the field of etching technology, in particular to a conveying device and etching equipment.
  • the manufacturing process of the array substrate mainly includes cleaning, film formation, exposure and development, etching, stripping and other processes.
  • the etching process is divided into dry and wet etching processes.
  • Wet etching is mainly performed by spraying.
  • the chemical solution is attached to the target film layer not covered by the photoresist by showering, immersing or infiltrating, and chemically reacts with it, and the set pattern is never obtained.
  • the invention provides a conveying device and an etching device to solve the existing conveying device. Since the glass substrate is directly contacted and conveyed with the guide wheel in the process tank, fragments, cards, and transmission timeout are prone to occur during the conveying process, resulting in Product yield is reduced, which in turn affects production capacity.
  • the invention provides a transmission device, comprising: two tracks arranged in parallel, two sets of interconnected buffer stations, and a transfer carrier; two sets of the buffer stations are respectively arranged at the two ends of the track;
  • the transport carrier slides in the track, and a drive member is provided on the transport carrier;
  • the transport carrier includes a first support portion and a second support portion, and the first support portion is formed by horizontally and vertically staggered support rods Hollow structure, the second supporting part is fixedly connected to the driving member; wherein, a plurality of power transmission coils are arranged at intervals below the track, and a plurality of power reception coils are arranged at intervals on the transmission carrier, the power transmission An electromagnetic induction is generated between the coil and the power receiving coil to provide power to the driving member;
  • the buffer table is provided with a plurality of buffer units that can be raised and lowered to carry the transmission carrier, and a plurality of the buffer units
  • the stack is arranged on the buffer stage from bottom to top.
  • a row of power receiving coils are respectively provided on two opposite sides of the transmission carrier and the two tracks.
  • the bottom of the conveying carrier is provided with pulleys respectively corresponding to the two rails, and the pulleys slide within the rails.
  • a limiting member is provided around the first support portion.
  • a conveyor line is connected between the two sets of the buffer stations, and the conveyor line is used to transfer the buffer unit back and forth.
  • the present invention provides another transmission device, including: two tracks arranged in parallel, two sets of interconnected buffer stations, and a transfer carrier; the two sets of the buffer stations are respectively provided at both ends of the track;
  • the transport carrier slides in the track, and a driving member is provided on the transport carrier; wherein, a plurality of power transmitting coils are arranged at intervals below the track, and a plurality of power receiving coils are arranged at intervals on the transport carrier, An electromagnetic induction is generated between the power transmission coil and the power reception coil to provide power to the driving member.
  • a row of power receiving coils are respectively provided on two opposite sides of the transmission carrier and the two tracks.
  • the bottom of the conveying carrier is provided with pulleys respectively corresponding to the two rails, and the pulleys slide within the rails.
  • the transfer carrier includes a first support portion and a second support portion, the first support portion is a hollow structure formed by horizontally and vertically staggered support rods, and the second support The part is fixedly connected to the driving member.
  • a limiting member is provided around the first support portion.
  • the buffer table is provided with a plurality of liftable buffer units for carrying the transport carrier, and the plurality of buffer units are stacked in the buffer from bottom to top On stage.
  • a conveyor line is connected between the two sets of the buffer stations, and the conveyor line is used to transfer the buffer unit back and forth.
  • the track is U-shaped or I-shaped.
  • the invention also provides an etching device, which includes a plurality of process chambers and a transfer device, the process chamber includes a first isolation door and a second isolation door; the transfer device includes two tracks and two groups arranged in parallel A buffer station and a transfer carrier connected to each other; the two sets of buffer stations are respectively arranged at the first and the end of the track; the transfer carrier slides in the track, and the transfer carrier is provided with a driving member; Among them, a plurality of power transmission coils are arranged at intervals below the track, and a plurality of power reception coils are arranged at intervals on the transmission carrier, and electromagnetic induction is generated between the power transmission coils and the power reception coils as Drive parts provide power.
  • a first position sensor and a second position sensor are respectively provided on the inner wall of the process chamber close to the first isolation door and the second isolation door.
  • a third position sensor is provided between the first position sensor and the second position sensor.
  • the two tracks sequentially pass through the plurality of process chambers.
  • the transfer carrier includes a first support portion and a second support portion, the first support portion is a hollow structure formed by horizontally and vertically staggered support rods, and the second support The part is fixedly connected to the driving member.
  • a limiting member is provided around the first support portion.
  • the buffer table is provided with a plurality of liftable buffer units for carrying the transport carrier, and the plurality of buffer units are stacked in the buffer from bottom to top On the stage; a conveyor line is connected between the two groups of the cache stations, and the conveyor line is used to transfer the cache unit back and forth.
  • the beneficial effects of the present invention are: the conveying device and the etching equipment provided by the present invention, the substrate is conveyed by the conveying carrier instead of the substrate directly contacting and conveying with the guide wheel, which greatly avoids the chipping and carding of the substrate during the conveying process ⁇ Slippage of substrates, transmission overtime, etc., improve product yield, make equipment operate more stably, and then increase productivity.
  • FIG. 1 is a schematic structural diagram of a transmission device of the present invention
  • FIG. 2 is a schematic structural diagram of a transmission device according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of a transmission device according to another embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the structure of the etching device of the present invention.
  • the present invention is directed to the existing conveying device. Since the glass substrate is directly contacted and conveyed with the guide wheel in the process tank, during the conveying process, fragments, cards, and conveying overtime are prone to occur, resulting in a decrease in product yield, which in turn affects the problem of productivity This embodiment can solve this defect.
  • the present invention provides a conveying device 100 including: two rails 10 arranged in parallel, two sets of interconnected buffer tables 30, and a transport carrier 20 sliding on the two rails .
  • two sets of buffer tables 30 are respectively connected to both ends of the track 10, a plurality of power transmission coils 50 are arranged at intervals below the track 10, and a plurality of power reception coils 60 are arranged at intervals on the transmission carrier 20 .
  • the conveying carrier 20 is provided with a driving member 40 which drives the conveying carrier 20 to move forward in the process chamber according to process requirements.
  • the power transmission coil 50 is connected to a power source. When a certain voltage is applied to the power transmission coil 50, the power transmission coil 50 acts as a power transmitter, sends out electromagnetic waves of a specific frequency, and then diffuses to the receiver through an electromagnetic field
  • the electric coil 60, the power receiving coil 60 serves as a power receiver, receives an electromagnetic field, so that power is transmitted wirelessly, thereby providing power to the driving member 40, so that the driving member 40 drives the transmission carrier 20 to move.
  • the two rails 10 have a U-shaped structure, two sets of buffer tables 30 are respectively arranged at the opening of the U-shaped structure, one set of buffer tables 30 is located at the entrance of the process line, and the other set of buffer tables 30 Located at the exit of the process line, a conveyor line 32 is connected between the two sets of buffer stations 30.
  • the conveying line 32 may be provided as two parallel conveying lines.
  • the conveyor line 32 is provided above the rail 10.
  • a plurality of buffer units 31 are provided on the buffer platform 30, and the plurality of buffer units 31 are stacked on the buffer platform 30 from bottom to top, the buffer unit 31 can be raised and lowered in the vertical direction, and the buffer unit 31 is used to carry the transfer carrier 20.
  • the transfer carrier 20 carries the substrate and completes the process along the guide rail route
  • the robot takes the substrate away and places the empty transfer carrier 20 in the buffer unit 31
  • the cache unit 31 rises to the upper end of the cache station 30.
  • the empty carrier 20 is transferred to the buffer station 30 at the entrance, and the empty carrier 20 is lowered and placed on the track 10 at the entrance to complete the process cycle.
  • the rail 10, the carrier 20, the driving member 40, the power transmission coil 50, the power receiving coil 60, the driving member 40, the limiting member 212, and the support rod 211 in the conveying device 100 are made of acid and alkali resistant materials.
  • the track 10 has an I-shaped structure, that is, the track 10 is linear.
  • the bottom of the conveying carrier 20 is provided with pulleys 70 corresponding to the two rails 10 for sliding in the rails 10 respectively.
  • the number of pulleys 70 corresponding to each rail 10 may be two, or the number of the pulleys 70 may be increased. number.
  • a row of power receiving coils 60 is provided on two opposite sides of the carrier 20 corresponding to the two tracks, and the arrangement direction of the power receiving coils 60 on each side is the same as the extending direction of the track 10, and the power receiving coil 60 It can also be arranged on the side of the carrier 20.
  • the transfer carrier 20 includes a first support portion 21 and a second support portion 22.
  • the first support portion 21 is used to carry a substrate, and the second support portion 22 is used to fixedly connect the drive member 40.
  • the second support portion 22 is provided near the forward direction of the rail 10.
  • the first support portion 21 is a hollow structure formed by horizontally and vertically staggered support rods 211, which supports the substrate and facilitates the flow of chemical liquid.
  • Limiting members 212 are provided around the first supporting portion 21, specifically, two limiting members 212 are provided at the edge of each side of the first supporting portion 21 at intervals to correct the position of the substrate and prevent The substrate moves during the transfer.
  • the transfer carrier 20 is provided with a pressure sensor for sensing whether there is a substrate on the transfer carrier 20, so as to prevent the transfer carrier from moving on the track 10 without the substrate.
  • the power transmission coil 50 and the power reception coil 60 may be made of metal materials such as copper, aluminum, and iron.
  • the driving member 40 may be a motor, or other components having a driving function.
  • the total number of the support rods 211 may be 1-50, or it may be replaced with an integrally formed mesh member.
  • the present invention also provides an etching device, which includes a plurality of process chambers 200 and the above-mentioned transfer device 100.
  • the process chamber 200 includes a first isolation door 201 and a second isolation door 202, the first isolation door is provided at the entrance of the process chamber 200, and the second isolation door is provided in the process chamber Exit 200.
  • a first position sensor A is provided on the inner wall of the process chamber 200 near the first isolation door 201, and a second position is provided on the inner wall of the process chamber 200 near the second isolation door 202 A sensor B, a third position sensor C is provided between the first position sensor A and the second position sensor B, and the third position sensor C is provided near the second position sensor B .
  • the rail 10 sequentially passes through a plurality of process chambers 200.
  • an etching process chamber is used as an example. Wet etching is divided into three basic modes of spraying, standing, and infiltration. In this embodiment, spraying is used.
  • the process chamber 200 is provided with a plurality of chemical liquid spray heads 203, and a spray rod 204 connected to the plurality of chemical liquid spray heads 203.
  • the spray rod 204 can move in the horizontal direction.
  • the process chamber 200 A medicine liquid tank 205 and a delivery pump 206 connected to the medicine liquid tank are provided below the inlet of the delivery pump 206 is connected to the medicine liquid tank 205, and an outlet is connected to the spray rod 204.
  • the medicine liquid tank recovers medicine The liquid sprayed by the liquid spray head 203, and supplying the liquid chemical to the liquid spray head 203 through the delivery pump 206.
  • the transfer carrier 20 carries the substrate sliding in the track 10 according to the set transfer speed, after entering the process chamber 200 through the first isolation door 201, after the substrate reaches the first position sensor A, the first isolation door 201 After the substrate is closed and the substrate reaches the third position sensor C, the transport carrier 20 stops advancing, and reciprocates between the first position sensor A and the third position sensor C according to the set reciprocating times and moving speed.
  • the chemical liquid spraying head 203 located above the base plate swings back and forth to spray the chemical liquid, and when the preset time is reached, the transfer carrier 20 continues to move forward, and after reaching the second position sensor B, the second isolation door 202 After opening, the transfer carrier 20 is removed to complete the process requirements of the process chamber 200.
  • the number of the spray rods 204 is 3-30, and each of the spray rods 204 is connected with 3 ⁇ 30 chemical liquid spray heads 203.
  • the spray flow rate of the chemical liquid spray head 203 is 500 liters per minute .
  • the first position sensor A, the second position sensor B, and the third position sensor C may be pressure sensors, light sensors, or electromagnetic sensors, and the etching device further includes a controller To control the sensor.
  • the conveying device and the etching equipment provided by the present invention replace the substrate by directly contacting the guide wheel with the conveying carrier loading the substrate conveying, which greatly avoids the occurrence of chipping, card, substrate slippage of the substrate during the conveying process, Phenomenon such as transmission timeout improves the product yield and makes the equipment run more steadily, thereby increasing the production capacity.

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

一种传送装置，包括轨道和在轨道内滑动的传送载体，传送载体上设置有驱动件，轨道的下方设置有送电线圈，传送载体上设置有受电线圈，两种线圈之间产生电磁感应，向驱动件提供动力。通过传送载体装载基板传送来代替基板与导向轮接触传送，避免了基板在传送过程中发生的破片、卡片等现象，提高了产品良率，使设备更稳定运转。

Description

传送装置及刻蚀设备 技术领域
本发明涉及刻蚀技术领域，尤其涉及一种传送装置及刻蚀设备。
 背景技术
在阵列基板制造过程中，主要包括清洗、成膜、曝光显影、刻蚀、剥离等工艺，其中，刻蚀工艺分为干法和湿法两种刻蚀工艺，湿法刻蚀主要是通过喷淋、浸泡或浸润的方式将化学药液附着在未被光刻胶覆盖的目标膜层上，与其发生化学反应，从未得到设定的图案。
现有的湿法刻蚀工艺中，将玻璃基板放置在工艺槽内沿导向轮进行传送，但是，在实际生产中，采用此传送方式极易导致玻璃基板在传送过程中发生破片、卡片、基板打滑、传送超时等现象，从而导致基板良率降低，影响产能。
 技术问题
本发明提供一种传送装置及刻蚀设备，以解决现有的传送装置，由于玻璃基板在工艺槽内直接与导向轮接触传送，在传送过程中易发生破片、卡片、传送超时等现象，导致产品良率降低，进而影响产能的问题。
 技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种传送装置，包括：并行排列的两条轨道、两组相互连接的缓存台、以及传送载体；两组所述缓存台分别设置于所述轨道的首尾两个端部；所述传送载体在所述轨道内滑动，所述传送载体上设置有驱动件；所述传送载体包括第一支撑部和第二支撑部，所述第一支撑部为由横纵交错的支撑杆形成的镂空结构，所述第二支撑部固定连接所述驱动件；其中，所述轨道的下方间隔设置有多个送电线圈，所述传送载体上间隔设置有多个受电线圈，所述送电线圈与所述受电线圈之间产生电磁感应，向所述驱动件提供动力；所述缓存台上设置有多个可升降的用于承载所述传送载体的缓存单元，多个所述缓存单元由下至上叠层设置于所述缓存台上。
在本发明的至少一种实施例中，所述传送载体与两条所述轨道对应的两相对侧分别设置有一排受电线圈。
在本发明的至少一种实施例中，所述传送载体底部设置有分别与两条所述轨道对应的滑轮，所述滑轮在所述轨道内滑动。
在本发明的至少一种实施例中，所述第一支撑部的四周均设置有限位件。
在本发明的至少一种实施例中，两组所述缓存台之间连接有输送线，所述输送线用以来回传送所述缓存单元。
本发明提供另一种传送装置，包括：并行排列的两条轨道、两组相互连接的缓存台、以及传送载体；两组所述缓存台分别设置于所述轨道的首尾两个端部；所述传送载体在所述轨道内滑动，所述传送载体上设置有驱动件；其中，所述轨道的下方间隔设置有多个送电线圈，所述传送载体上间隔设置有多个受电线圈，所述送电线圈与所述受电线圈之间产生电磁感应，向所述驱动件提供动力。
在本发明的至少一种实施例中，所述传送载体与两条所述轨道对应的两相对侧分别设置有一排受电线圈。
在本发明的至少一种实施例中，所述传送载体底部设置有分别与两条所述轨道对应的滑轮，所述滑轮在所述轨道内滑动。
在本发明的至少一种实施例中，所述传送载体包括第一支撑部和第二支撑部，所述第一支撑部为由横纵交错的支撑杆形成的镂空结构，所述第二支撑部固定连接所述驱动件。
在本发明的至少一种实施例中，所述第一支撑部的四周均设置有限位件。
在本发明的至少一种实施例中，所述缓存台上设置有多个可升降的用于承载所述传送载体的缓存单元，多个所述缓存单元由下至上叠层设置于所述缓存台上。
在本发明的至少一种实施例中，两组所述缓存台之间连接有输送线，所述输送线用以来回传送所述缓存单元。
在本发明的至少一种实施例中，所述轨道为U型结构或I型结构。
本发明还提供一种刻蚀设备，包括多个工艺腔室和传送装置，所述工艺腔室包括第一隔离门和第二隔离门；所述传送装置包括并行排列的两条轨道、两组相互连接的缓存台、以及传送载体；所述两组缓存台分别设置于所述轨道的首尾两个端部；所述传送载体在所述轨道内滑动，所述传送载体上设置有驱动件；其中，所述轨道的下方间隔设置有多个送电线圈，所述传送载体上间隔设置有多个受电线圈，所述送电线圈与所述受电线圈之间产生电磁感应，为所述驱动件提供动力。
在本发明的至少一种实施例中，靠近所述第一隔离门和所述第二隔离门的所述工艺腔室内壁上分别对应设置有第一位置感应器、第二位置感应器。
在本发明的至少一种实施例中，所述第一位置感应器与所述第二位置感应器之间设置有第三位置感应器。
在本发明的至少一种实施例中，所述两条轨道依次穿过多个所述工艺腔室。
在本发明的至少一种实施例中，所述传送载体包括第一支撑部和第二支撑部，所述第一支撑部为由横纵交错的支撑杆形成的镂空结构，所述第二支撑部固定连接所述驱动件。
在本发明的至少一种实施例中，所述第一支撑部的四周均设置有限位件。
在本发明的至少一种实施例中，所述缓存台上设置有多个可升降的用于承载所述传送载体的缓存单元，多个所述缓存单元由下至上叠层设置于所述缓存台上；两组所述缓存台之间连接有输送线，所述输送线用以来回传送所述缓存单元。
 有益效果
本发明的有益效果为：本发明提供的传送装置及刻蚀设备，通过传送载体装载基板传送来代替基板直接与导向轮接触传送，极大程度地避免了基板在传送过程中发生的破片、卡片、基板打滑、传送超时等现象，提高了产品良率，使设备更稳定运转，进而提高了产能。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明的传送装置的结构示意图；
图2为本发明实施例一的传送装置的结构示意图；
图3为本发明其他实施例的传送装置的结构示意图；
图4为本发明的刻蚀设备的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的传送装置，由于玻璃基板在工艺槽内直接与导向轮接触传送，在传送过程中，易发生破片、卡片、传送超时等现象，导致产品良率降低，进而影响产能的问题，本实施例能够解决该缺陷。
如图1和图2所示，本发明提供一种传送装置100，包括：并行排列的两条轨道10、两组相互连接的缓存台30、以及在所述两条轨道上滑动的传送载体20。
其中，两组缓存台30分别连接在所述轨道10的首尾两端，所述轨道10的下方间隔设置有多个送电线圈50，所述传送载体20上间隔设置有多个受电线圈60。
所述传送载体20上设置有驱动件40，所述驱动件40驱动所述传送载体20在工艺腔室内按照工艺要求向前移动。
所述送电线圈50连接有电源，当所述送电线圈50通入一定的电压后，所述送电线圈50作为电力传送方，发送出特定频率的电磁波后，经过电磁场扩散到所述受电线圈60，所述受电线圈60作为电力接受方，接受电磁场，这样电力就实现了无线传导，从而为所述驱动件40提供动力，从而所述驱动件40带动所述传送载体20移动。
如图2所示，两条所述轨道10为U型结构，两组缓存台30分别设置在U型结构的开口处，一组缓存台30位于工艺线的入口处，另一组缓存台30位于工艺线的出口处，两组缓存台30之间连接有输送线32。所述输送线32可设置为并列的两条输送线。所述输送线32设置于所述轨道10的上方。
所述缓存台30上设置有多个缓存单元31，多个缓存单元31由下至上叠层设置于所述缓存台30上，所述缓存单元31在竖直方向上可升降，所述缓存单元31用于承载传送载体20，当传送载体20承载基板沿着导轨路线完成工艺后，到达出口处的缓存台30时，机械手将基板取走，将空的传送载体20置于所述缓存单元31,上，缓存单元31升至所述缓存台30的上端。沿着输送线32，将空的传送载体20传送到进口处的缓存台30上，将空的传送载体20下降置于进口处的轨道10上，完成工艺循环。
所述传送装置100中的轨道10、传送载体20、驱动件40、送电线圈50、受电线圈60、驱动件40、限位件212、以及支撑杆211等部件均为耐酸碱材质。
如图3所示，根据不同的工艺要求，传送载体20转回工艺线入口方式不同，在其他实施例中，所述轨道10为I型结构，即所述轨道10为直线型。
所述传送载体20底部设置有分别与两条轨道10对应的滑轮70，用于在轨道10内滑动，每一条轨道10对应的滑轮70的个数可为2个，也可增加滑轮70的个数。
所述传送载体20的与两条轨道对应的两相对侧设置有一排受电线圈60，每一侧的所述受电线圈60的排列方向与轨道10的延伸方向相同，所述受电线圈60也可设置在所述传送载体20的侧面。
所述传送载体20包括第一支撑部21和第二支撑部22，所述第一支撑部21用以承载基板，所述第二支撑部22用以固定连接所述驱动件40，所述第二支撑部22靠近所述轨道10的前进方向设置。
所述第一支撑部21为由横纵交错的支撑杆211形成的镂空结构，在支撑基板的同时，易于药液流动。
所述第一支撑部21的四周均设置有限位件212，具体地，在所述第一支撑部21的每一侧的边沿间隔设置两个限位件212，用于校正基板位置，并防止基板在传送过程中发生移动。
所述传送载体20上设置有压力感应器，用于感测所述传送载体20上是否有基板存在，避免未载有基板的情况下，传送载体在轨道10上移动。
所述送电线圈50和所述受电线圈60可为铜、铝、铁等金属材质。
所述驱动件40可为马达，或者其他具有驱动功能的组件。
所述支撑杆211的总个数可为1~50根，也可以用一体成型的网格件代替。
如图4所示，本发明还提供一种刻蚀装备，包括多个工艺腔室200和上述传送装置100。
所述工艺腔室200包括第一隔离门201和第二隔离门202，所述第一隔离门设置于所述工艺腔室200的入口处，所述第二隔离门设置于所述工艺腔室200的出口处。
所述工艺腔室200的内壁靠近所述第一隔离门201的位置设置有第一位置感应器A，所述工艺腔室200的内壁靠近所述第二隔离门202的位置设置有第二位置感应器B，所述第一位置感应器A和所述第二位置感应器B之间设置有第三位置感应器C,所述第三位置感应器C靠近所述第二位置感应器B设置。
所述轨道10依次穿过多个工艺腔室200，本实施例以刻蚀工艺腔室为例，湿法刻蚀分为喷淋、静置和浸润三种基本模式，本实施例以喷淋为例进行说明。所述工艺腔室200内设置有多个药液喷头203，以及连接多个该药液喷头203的喷淋杆204，所述喷淋杆204可在水平方向上移动，所述工艺腔室200的下方设置有药液罐205和连接该药液罐的输送泵206，所述输送泵206的进口连接该药液罐205，出口连接至所述喷淋杆204，所述药液罐回收药液喷头203喷淋下来的药液，以及通过所述输送泵206向所述药液喷头203供应药液。
传送载体20载有基板按照设定的传送速度在所述轨道10内滑动，经过第一隔离门201进入工艺腔室200后，基板到达第一位置感应器A后，所述第一隔离门201关闭，基板到达第三位置感应器C后，所述传送载体20停止前进，按照设定的往复次数和移动速度在第一位置感应器A和第三位置感应器C之间进行往复移动，同时位于基板上方的药液喷头203进行前后摇摆喷淋药液，当达到预设定时间后，所述传送载体20继续向前移动，到达第二位置感应器B之后，所述第二隔离门202打开，所述传送载体20移出，完成该工艺腔室200的工艺要求。
所述喷淋杆204的个数为3~30个，每一所述喷淋杆204上连接有3~30个药液喷头203，所述药液喷头203的喷淋流量为500升每分钟。
所述第一位置感应器A、所述第二位置感应器B、以及所述第三位置感应器C可为压力感应器、光感应器或者电磁感应器，所述刻蚀设备还包括控制器，用以控制感应器。
有益效果：本发明提供的传送装置及刻蚀设备，通过传送载体装载基板传送来代替基板直接与导向轮接触传送，极大程度地避免了基板在传送过程中发生的破片、卡片、基板打滑、传送超时等现象，提高了产品良率，使设备更稳定运转，进而提高了产能。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种传送装置，其包括：
    并行排列的两条轨道；
    两组相互连接的缓存台，分别设置于所述轨道的首尾两个端部；
    传送载体，在所述轨道内滑动，所述传送载体上设置有驱动件；所述传送载体包括第一支撑部和第二支撑部，所述第一支撑部为由横纵交错的支撑杆形成的镂空结构，所述第二支撑部固定连接所述驱动件；其中，
    所述轨道的下方间隔设置有多个送电线圈，所述传送载体上间隔设置有多个受电线圈，所述送电线圈与所述受电线圈之间产生电磁感应，向所述驱动件提供动力；所述缓存台上设置有多个可升降的用于承载所述传送载体的缓存单元，多个所述缓存单元由下至上叠层设置于所述缓存台上。
  2. 根据权利要求1所述的传送装置，其中，所述传送载体与两条所述轨道对应的两相对侧分别设置有一排受电线圈。
  3. 根据权利要求1所述的传送装置，其中，所述传送载体底部设置有分别与两条所述轨道对应的滑轮，所述滑轮在所述轨道内滑动。
  4. 根据权利要求1所述的传送装置，其中，所述第一支撑部的四周均设置有限位件。
  5. 根据权利要求1所述的传送装置，其中，两组所述缓存台之间连接有输送线，所述输送线用以来回传送所述缓存单元。
  6. 一种传送装置，其包括：
    并行排列的两条轨道；
    两组相互连接的缓存台，分别设置于所述轨道的首尾两个端部；
    传送载体，在所述轨道内滑动，所述传送载体上设置有驱动件；其中，
    所述轨道的下方间隔设置有多个送电线圈，所述传送载体上间隔设置有多个受电线圈，所述送电线圈与所述受电线圈之间产生电磁感应，向所述驱动件提供动力。
  7. 根据权利要求6所述的传送装置，其中，所述传送载体与两条所述轨道对应的两相对侧分别设置有一排受电线圈。
  8. 根据权利要求6所述的传送装置，其中，所述传送载体底部设置有分别与两条所述轨道对应的滑轮，所述滑轮在所述轨道内滑动。
  9. 根据权利要求6所述的传送装置，其中，所述传送载体包括第一支撑部和第二支撑部，所述第一支撑部为由横纵交错的支撑杆形成的镂空结构，所述第二支撑部固定连接所述驱动件。
  10. 根据权利要求9所述的传送装置，其中，所述第一支撑部的四周均设置有限位件。
  11. 根据权利要求6所述的传送装置，其中，所述缓存台上设置有多个可升降的用于承载所述传送载体的缓存单元，多个所述缓存单元由下至上叠层设置于所述缓存台上。
  12. 根据权利要求11所述的传送装置，其中，两组所述缓存台之间连接有输送线，所述输送线用以来回传送所述缓存单元。
  13. 根据权利要求12所述的传送装置，其中，所述轨道为U型结构或I型结构。
  14. 一种刻蚀设备，其包括：
    多个工艺腔室，所述工艺腔室包括第一隔离门和第二隔离门；
    传送装置，所述传送装置包括：
    并行排列的两条轨道；
    两组相互连接的缓存台，分别设置于所述轨道的首尾两个端部；
    传送载体，在所述轨道内滑动，所述传送载体上设置有驱动件；其中，
    所述轨道的下方间隔设置有多个送电线圈，所述传送载体上间隔设置有多个受电线圈，所述送电线圈与所述受电线圈之间产生电磁感应，为所述驱动件提供动力。
  15. 根据权利要求14所述的刻蚀设备，其中，靠近所述第一隔离门和所述第二隔离门的所述工艺腔室内壁上分别对应设置有第一位置感应器、第二位置感应器。
  16. 根据权利要求14所述的刻蚀设备，其中，所述第一位置感应器与所述第二位置感应器之间设置有第三位置感应器。
  17. 根据权利要求14所述的刻蚀设备，其中，所述两条轨道依次穿过多个所述工艺腔室。
  18. 根据权利要求14所述的刻蚀设备，其中，所述传送载体包括第一支撑部和第二支撑部，所述第一支撑部为由横纵交错的支撑杆形成的镂空结构，所述第二支撑部固定连接所述驱动件。
  19. 根据权利要求18所述的刻蚀设备，其中，所述第一支撑部的四周均设置有限位件。
  20. 根据权利要求14所述的刻蚀设备，其中，所述缓存台上设置有多个可升降的用于承载所述传送载体的缓存单元，多个所述缓存单元由下至上叠层设置于所述缓存台上；两组所述缓存台之间连接有输送线，所述输送线用以来回传送所述缓存单元。
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