WO2020248325A1 - 晶圆上料设备与晶圆处理系统 - Google Patents

晶圆上料设备与晶圆处理系统 Download PDF

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Publication number
WO2020248325A1
WO2020248325A1 PCT/CN2019/096213 CN2019096213W WO2020248325A1 WO 2020248325 A1 WO2020248325 A1 WO 2020248325A1 CN 2019096213 W CN2019096213 W CN 2019096213W WO 2020248325 A1 WO2020248325 A1 WO 2020248325A1
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WIPO (PCT)
Prior art keywords
wafer
empty
wafer cassette
cassette
horizontal
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PCT/CN2019/096213
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English (en)
French (fr)
Inventor
李�杰
王利强
丁双生
赵建龙
葛林海
Original Assignee
上海提牛机电设备有限公司
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Publication of WO2020248325A1 publication Critical patent/WO2020248325A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Definitions

  • the invention relates to the field of semiconductors, in particular to a wafer loading equipment and a wafer processing system.
  • Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called wafer. Wafers can be loaded in a wafer frame box.
  • the wafer frame box can be further understood as: wafer cassette, which can also be referred to as wafer cassette for short.
  • wafer loading equipment when loading wafers, wafer loading equipment can be used, wherein a conveying mechanism can be used to translate the wafers to the separation mechanism, and the separation mechanism separates the wafer from the cassette. , Can use this conveying mechanism to send out the empty wafer cassette.
  • a conveying mechanism must not only receive the wafer cassettes, but also send the wafer cassettes into the separation mechanism, and also be responsible for sending them out. While waiting for the separation, it can only wait and cannot perform other processes at the same time. The material process efficiency is low.
  • the invention provides a wafer loading equipment and a wafer processing system to solve the problem of low efficiency of the loading process.
  • a wafer loading equipment including a cassette moving mechanism, a lateral moving mechanism, an internal moving mechanism, a separating mechanism, an empty cassette moving mechanism and an empty cassette removing mechanism;
  • the box moving mechanism, horizontal moving mechanism, internal moving mechanism, separating mechanism, empty box moving mechanism and empty box moving mechanism are directly or indirectly installed on the rack;
  • the wafer cassette moving mechanism is used to receive the wafer cassette loaded with wafers from the loading window, and send the wafer cassette to the internal preparation position by moving in a first horizontal direction;
  • the lateral movement mechanism is used to laterally move the loaded wafer cassette in the internal preparation position to the internal movement mechanism by a movement in a second horizontal direction;
  • the internal moving mechanism is used to transport the loaded wafer cassettes that have moved laterally to the separating mechanism through the first horizontal movement and/or the lifting movement, and through the first horizontal movement and / Or lifting movement to send the empty wafer cassette obtained by the separation mechanism to the empty cassette moving mechanism;
  • the separation mechanism is used to separate the wafers in the delivered wafer cassette from the wafer cassette to obtain wafers and the empty wafer cassette;
  • the empty cassette moving mechanism is used to send the delivered empty wafer cassette to the empty cassette removal mechanism through horizontal movement and/or lifting movement;
  • the empty cassette removal mechanism is used to remove the delivered empty wafer cassette through the movement in the second horizontal direction.
  • the wafer obtained by the separation mechanism is located in an internal space after separation, and the internal space can communicate with an external wafer processing tank area, and a wafer processing tank area is provided between the internal space and the wafer processing tank area.
  • the air blocking mechanism is blocked between the internal space and the wafer processing tank area, and can cancel the blocking when the wafer needs to be taken out from the internal space to the wafer processing tank area.
  • the air barrier mechanism includes: a base, a telescopic mechanism, and an air barrier; the base is provided on the frame, and the telescopic mechanism is connected between the base and the air barrier;
  • the telescopic mechanism is used to control the expansion and contraction of the air barrier relative to the base;
  • the air barrier plate When the air barrier plate extends relative to the substrate, it can be blocked between the internal space and the wafer processing tank area;
  • the internal space and the wafer processing tank section can be connected through a communication space, so that the robot can transfer the crystal in the internal space through the communication space.
  • the circle is transported to the wafer processor slot area.
  • the telescopic mechanism includes a telescopic rod, a rod sleeve structure, and a telescopic drive structure, the rod sleeve structure is provided on the base, the telescopic rod passes through the rod sleeve structure, and the telescopic drive structure is connected to the base.
  • the base body and the air barrier, and the telescopic rod is fixedly connected to the air barrier;
  • the telescopic drive structure is used to drive the telescopic rod to expand and contract with respect to the base body along its length direction, so that the air barrier plate expands and contracts with respect to the base body.
  • the telescopic mechanism further includes a buffer structure, which connects the base and the air barrier, and is used to provide a buffering force when the air barrier is telescopic relative to the base.
  • the wafer cassette moving mechanism includes a first sliding rail, a first sliding block, a first horizontal movement driving structure, a first lifting structure, and a first supporting structure, and the first supporting structure is installed on the A first lifting structure, the first sliding block is directly or indirectly fixedly connected to the first lifting structure;
  • the lifting structure is used to drive the corresponding first supporting structure to perform lifting movement, so that the first supporting structure can be supported on the lower side of the loaded wafer cassette that enters from the loading window after being raised for loading The loaded wafer cassette;
  • the first horizontal movement driving structure is used to drive the first sliding block to move horizontally along the first sliding rail, so that the first lifting structure and the first lifting structure directly or indirectly connected to the first sliding block
  • the first supporting structure and the loaded wafer cassette simultaneously move horizontally.
  • first slide rail, the first sliding block, and the first lifting structure are provided between the first layer of the rack and the second layer of the rack, and the second The laminate is located on the upper side of the first laminate, and the second laminate is provided with elongated through slots penetrating both sides of the second laminate;
  • the first supporting structure can be inserted into the through slot after ascending and support the loaded wafer cassette thereon, so that the loaded wafer cassette The wafer cassette is loaded on the first supporting structure;
  • the length direction of the through groove matches the length direction of the first slide rail, so that when the first sliding block moves horizontally along the first slide rail, the first supporting structure can drive it thereon
  • the loaded wafer cassette moves horizontally along the through slot.
  • the empty box removal mechanism includes a second sliding rail, a second sliding block, a second horizontal movement driving mechanism, a second lifting structure, a horizontal adjustment structure, and a second bearing structure;
  • the second bearing structure is installed on the horizontal adjustment structure, the horizontal adjustment structure is installed on the second lifting structure, and the second sliding block is directly or indirectly fixedly connected to the second lifting structure; the first Two sliding rails are arranged along the second horizontal direction,
  • the horizontal adjustment structure is used to adjust the position of the second bearing structure along the second horizontal direction
  • the second lifting structure is used to drive the horizontal adjustment structure and the second bearing structure thereon to perform a lifting movement
  • the second horizontal movement drive mechanism is used to drive the second sliding block to move along the second sliding rail, so that the second lifting structure and the horizontal
  • the adjusting structure, the second supporting structure and the empty wafer cassette simultaneously move horizontally to send out the empty wafer cassette.
  • the horizontal adjustment structure includes a horizontal adjustment drive structure, a horizontal adjustment slide rail, and a horizontal adjustment slide block, the horizontal adjustment slide block is directly or indirectly connected to the second bearing structure, and the horizontal adjustment slide rail runs along the The second horizontal direction setting, the horizontal adjustment drive structure is used to drive the horizontal adjustment slider to move along the horizontal adjustment slide rail to adjust the positions of the horizontal adjustment slider and the second bearing structure.
  • a wafer processing system including the wafer loading equipment related to the first aspect and its optional solutions.
  • the wafer loading equipment and wafer processing system provided by the present invention can utilize the cassette moving mechanism to realize the access of the loaded wafer cassette, and can also use the transfer and transportation of the lateral shift mechanism and the internal moving mechanism to transfer the loaded wafer
  • the round box is fed into the separation mechanism, so that the separation mechanism separates the wafer from the wafer cassette, and can also use the empty cassette moving mechanism and the empty cassette removal mechanism to send out the empty wafer cassettes obtained after separation. It can be seen that the entire process of wafer loading can be realized through the operation of the above-mentioned institutions.
  • each mechanism can be operated at the same time, there is no need to waste time waiting for the transportation of the mechanism, and there is no need to waste time waiting for the separation process of the separation mechanism, which effectively improves the efficiency of the feeding process.
  • FIG. 1 is a first structural diagram of a wafer loading equipment in an embodiment of the present invention
  • FIG. 2 is a second structural diagram of a wafer loading equipment in an embodiment of the present invention.
  • FIG. 3 is a third structural diagram of a wafer loading equipment in an embodiment of the present invention.
  • Fig. 4 is a fourth structural diagram of a wafer loading equipment in an embodiment of the present invention.
  • FIG. 5 is a schematic view five of the structure of a wafer loading equipment in an embodiment of the present invention.
  • FIG. 6 is a sixth structural diagram of a wafer loading equipment in an embodiment of the present invention.
  • FIG. 7 is a first structural diagram of an air blocking mechanism in an embodiment of the present invention.
  • Figure 8 is a second structural diagram of an air blocking mechanism in an embodiment of the present invention.
  • Fig. 9 is a third structural diagram of an air blocking mechanism in an embodiment of the present invention.
  • FIG. 10 is a first structural diagram of a wafer cassette moving mechanism in an embodiment of the present invention.
  • FIG. 11 is a second structural diagram of the wafer cassette moving mechanism in an embodiment of the present invention.
  • Figure 12 is a structural diagram 1 of a hollow box removal mechanism according to an embodiment of the present invention.
  • Figure 13 is a second structural diagram of a hollow box removing mechanism according to an embodiment of the present invention.
  • Fig. 1 is a structural schematic diagram 1 of a wafer loading equipment in an embodiment of the present invention
  • Fig. 2 is a structural schematic diagram 2 of a wafer loading equipment in an embodiment of the present invention
  • Fig. 3 is a wafer loading apparatus in an embodiment of the present invention
  • Fig. 4 is a schematic diagram four of the structure of the wafer loading equipment in an embodiment of the present invention
  • Fig. 5 is a schematic diagram five of the structure of the wafer loading equipment in an embodiment of the present invention
  • Fig. 6 is the present invention
  • the structure diagram of the wafer loading equipment in one embodiment is six.
  • the wafer loading equipment includes a cassette moving mechanism 1, a lateral moving mechanism 2, an internal moving mechanism 3, a separating mechanism 6, an empty cassette moving mechanism 9 and an empty cassette removing mechanism 4;
  • the wafer cassette moving mechanism 1, the lateral moving mechanism 2, the internal moving mechanism 3, the separating mechanism 6, the empty cassette moving mechanism and the empty cassette moving mechanism 4 are directly or indirectly mounted on the rack 7.
  • the cassette moving mechanism 1 is used to receive the wafer cassette 5 loaded with wafers from the loading window 701, and transport the cassette 5 to the internal preparation position by moving in the first horizontal direction .
  • the internal reserved position can be understood as any position that can be traversed by the traverse mechanism 2, for example, it can be the end position of the wafer cassette moving mechanism 1.
  • the traverse mechanism 2 is used to traverse the wafer cassette 5 in the internal preparation position to the internal movement mechanism 3 in the horizontal direction by moving in the second horizontal direction.
  • the structure of the traverse mechanism 2 can be, for example, the cassette moving mechanism 1, but its transportation direction is the same as that of the cassette moving mechanism 1, and its structure may also be the empty cassette moving mechanism 4, and further, any description about the cassette moving mechanism 1 Or the description about the empty box removal mechanism 4 can be applied to the traverse mechanism 2.
  • this embodiment does not exclude any other structures that can realize horizontal linear movement.
  • the internal moving mechanism 3 is used to transport the laterally moved wafer cassette 5 to the separating mechanism 6 through movement and/or lifting movement in the first horizontal direction, and pass through the first horizontal direction.
  • the movement and/or the up-and-down movement of the empty wafer cassette 11 obtained by the separation mechanism 6 is sent to the empty cassette moving mechanism 9.
  • the structure of the internal moving mechanism 3 may be, for example, the cassette moving-in mechanism 1, or the empty cassette moving-out mechanism 4. Furthermore, any description about the wafer cassette moving-in mechanism 1 or the description about the empty cassette moving-out mechanism 4 can be applied to Internal mobile mechanism 3. In addition, this embodiment does not exclude any other structures that can realize horizontal and/or vertical movement.
  • the separation mechanism 6 is used to separate the wafers in the delivered wafer cassette 5 from the wafer cassette to obtain wafers and the empty wafer cassette 11.
  • the empty wafer cassette 11 obtained after separation by the separation mechanism 6 can be sent to the upper side of the separation mechanism 6 for further transportation.
  • the separation mechanism 6 can be, for example, a "silicon wafer and cassette separation mechanism" with the publication number CN108372963A.
  • this embodiment does not exclude the application of other separation mechanisms 6.
  • the empty cassette moving mechanism 9 is used to deliver the delivered empty wafer cassette 11 to the empty cassette removing mechanism 4 through horizontal movement and/or lifting movement.
  • the empty box moving mechanism 9 may, for example, include an empty box lifting structure, which can use the structural principle of a screw nut or the structural principle of a cylinder to achieve vertical lifting.
  • the empty cassette removal mechanism 4 is used to remove the delivered empty wafer cassette 11 through the second horizontal movement.
  • the above embodiments can use the cassette moving mechanism to realize the access of the loaded wafer cassette, and can also use the transfer and transportation of the lateral movement mechanism and the internal moving mechanism to send the loaded wafer cassette into the separating mechanism, thereby making the separation
  • the mechanism separates the wafer from the wafer cassette, and can also use the empty cassette moving mechanism and the empty cassette removal mechanism to send out the empty wafer cassettes obtained after separation. It can be seen that the entire process of wafer loading can be realized through the operation of the above-mentioned institutions.
  • each mechanism can be operated at the same time, there is no need to waste time waiting for the transportation of the mechanism, and there is no need to waste time waiting for the separation process of the separation mechanism, which effectively improves the efficiency of the feeding process.
  • the rack 7 may also have a maintenance window 702, which may be provided on the side wall of the rack 7 on the lower side of the cassette moving mechanism 1.
  • the side wall of the frame 7 may also be provided with a maintenance door 704, which may be suitable for maintenance of the structure therein after being opened.
  • the frame 7 may also have a protective cover 703 which may be provided on one side of the empty box removal mechanism 4.
  • the rack 7 may also be provided with an interactive component 8.
  • the interactive component 8 may include, for example, an operation screen 801 and a button 802; the operation screen 801 and the button 802 can be connected to the cassette moving mechanism 1, the horizontal The moving mechanism 2, the internal moving mechanism 3, the separating mechanism 6, the empty box moving mechanism 9 and the empty box removing mechanism 4, so as to control the electronic components, such as the motor, the control assembly of the cylinder, etc., and the operation screen 801 can also be used
  • the display function shows the operating status of the above electronic components.
  • the rack 7 may also be provided with an air purification device 12, which may be located on the top of the rack 7.
  • the air purification device 12 may specifically include, for example, an empty box removal mechanism 4 and an empty box moving mechanism 9
  • the air filter at the top can help filter and protect the air in the entire equipment.
  • Fig. 7 is a structural schematic diagram 1 of an air blocking mechanism in an embodiment of the present invention
  • Fig. 8 is a structural schematic diagram 2 of an air blocking mechanism in an embodiment of the present invention
  • Fig. 9 is a structural schematic diagram 3 of an air blocking mechanism in an embodiment of the present invention .
  • the wafers separated by the separation mechanism 6 are located in the internal space after separation.
  • the internal space can refer to any part or all of the space in the wafer loading equipment, and during specific implementation, it can be specifically a part of the space on the upper side of the separation mechanism 6 used to separate the wafer from the wafer cassette.
  • the wafer processing tank area can be understood as any area capable of processing wafers.
  • An air blocking mechanism 10 is provided between the internal space and the wafer processing tank area.
  • the air blocking mechanism 10 is blocked between the internal space and the wafer processing tank area, and can cancel the blocking when the wafer needs to be taken out from the internal space to the wafer processing tank area.
  • the air blocking mechanism 10 includes: a base 1002, a telescopic mechanism, and an air blocking partition 1001; the base 1002 is provided on the frame 7, and the telescopic mechanism is connected to the base 1002 and Between the air barriers 1001.
  • the expansion and contraction mechanism is used to control the expansion and contraction of the air barrier relative to the base.
  • the telescopic mechanism can be understood to be able to control the air barrier 1 to move in a linear direction, so that it can move linearly relative to the base 2. Because the air barrier 1 can exceed the shielding range of the base 2 during linear motion, the Linear motion can be understood as telescopic motion.
  • the air barrier 1001 When the air barrier 1001 extends relative to the base 1002, it can block between the internal space and the wafer processing tank area.
  • the internal space and the wafer processing tank section can be connected through a communication space, so that the robot can move the internal space into the internal space through the communication space.
  • the wafers are transported to the wafer processor tank area.
  • the air barrier 1001 can be used to block between the internal space and the wafer processing tank area, so as to prevent foreign matter such as acid mist and acid gas generated during wafer processing in the wafer processing tank area from entering In the internal space, prevent the wafers and wafer cassettes from being contaminated and damaged.
  • the air barrier can also be retracted to ensure that the robot can still transport the wafers smoothly.
  • the telescopic mechanism includes a telescopic rod 1003, a rod sleeve structure 1004, and a telescopic drive structure 1005.
  • the rod sleeve structure 1004 is provided on the base 1002, and the telescopic rod 1003 passes through the rod sleeve.
  • the telescopic drive structure 1005 connects the base body 1002 and the air barrier 1001, and the telescopic rod 1003 is fixedly connected to the air barrier 1001.
  • the rod sleeve structure 1004 can play a guiding and limiting role for the telescopic rod 1003 to avoid deviation of its telescopic direction and position.
  • the telescopic drive structure 1005 is used to drive the telescopic rod 1003 to expand and contract relative to the base 1002 along its length direction, so that the air barrier 1001 expands and contracts relative to the base 1002.
  • the telescopic drive structure 1005 can be any structure that can produce linear motion.
  • the telescopic drive structure 1005 may be a telescopic cylinder structure.
  • the telescopic drive structure 1005 may also be a screw nut structure driven by a motor. It can be seen that any existing or improved linear motion solution can be applied to the telescopic drive structure 1005 of this embodiment without departing from the scope of this embodiment.
  • the telescopic rod 1003 is fixedly connected to the air barrier 1001 through a fixing bar 1006 provided at its end.
  • the fixing bar 1006 is arranged along the surface of the air barrier 1001 and is perpendicular to the air barrier 1001. Telescopic rod 1003.
  • the telescopic mechanism 10 may further include a buffer structure 1007, which connects the base 1002 and the air barrier 1001, and is used to connect the air barrier 1002 to the base 1002. Provides cushioning force when stretching.
  • the buffer structure 1007 can be a cylinder buffer structure, which can be understood as the gas pressure of any cylinder can passively change under the telescopic movement of the telescopic rod 1003, and it is usually difficult to match the telescopic rod due to changes in gas pressure.
  • the expansion and contraction of 1003 can produce a certain buffer force for the expansion and contraction of the expansion rod 1003, avoiding impact and wear between components due to the rapid and direct expansion and contraction movement, and further improving the service life of the structure.
  • FIG. 10 is a structural schematic diagram 1 of the wafer cassette moving mechanism in an embodiment of the present invention
  • FIG. 11 is a structural schematic diagram 2 of the wafer cassette moving mechanism in an embodiment of the present invention.
  • the cassette moving mechanism 1 includes a first sliding rail 102, a first sliding block 101, a first horizontal movement driving structure, a first lifting structure, and a first supporting structure.
  • a supporting structure is installed on the first lifting structure, and the first sliding block 101 is directly or indirectly fixedly connected to the first lifting structure.
  • the lifting structure is used to drive the corresponding first supporting structure to perform lifting movement, so that the first supporting structure can be supported on the lower side of the wafer cassette 5 entering from the loading window 701 after being raised, To load the loaded wafer cassette 5.
  • the loaded wafer cassette 5 supported by the first supporting structure may be in the loading window 701, or may be the loaded wafer cassette 5 in any position after passing through the loading window 701.
  • the first horizontal movement driving structure is used to drive the first slider 101 to move horizontally along the first slide rail 102, so that the first lifter that is directly or indirectly connected to the first slider 101
  • the structure, the first supporting structure and the wafer cassette 5 move horizontally synchronously.
  • the horizontal movement of the sliding block along the sliding rail can drive the lifting structure directly or indirectly connected to the sliding block, the carrying structure and the wafer cassette on it to synchronously move horizontally, which will not cause the telescopic arm to move horizontally. Hang in the air, thereby avoiding the unstable situation caused by the lower side hanging in the air, and effectively improving the stability of the transmission process.
  • the first sliding rail 102, the first sliding block 101, and the first lifting structure are provided on the first layer 705 and the first layer of the frame 7 Between the second layer of laminate 706, the second layer of laminate 706 is located on the upper side of the first layer of laminate 705, the second layer of laminate 706 is provided with a long strip penetrating the second layer The through slots on both sides of the laminate 706.
  • the first supporting structure can be inserted into the through slot and support the loaded wafer cassette 5 after ascending, so that all The loaded wafer cassette 5 is loaded on the first supporting structure.
  • the length direction of the through groove matches the length direction of the first slide rail, so that when the first slider 101 moves horizontally along the first slide rail 102, the first bearing structure can drive The loaded wafer cassette 5 moves horizontally along the through slot.
  • the second layer of laminate can also provide certain support for the wafer cassette, further improving the stability of the transmission process.
  • the first horizontal movement driving mechanism includes a first driving motor 104, a first driving wheel 105, a first driven wheel 106, and a transmission between the first driving wheel 105 and the first driven wheel. 106 between the first timing belt 103.
  • the positions of the first driving wheel 105 and the first driven wheel 106 relative to the first sliding rail 102 are fixed, and the first sliding block 101 can move synchronously with the first timing belt 103.
  • the first driving motor 104 is used to directly or indirectly drive the first driving wheel 105 to rotate, so that the movement of the first timing belt 103 around the first driving wheel 105 and the first driven wheel 106 drives the
  • the first sliding block 101 moves horizontally along the first sliding rail 102.
  • the number of the first sliding rail 102 and the horizontal movement driving mechanism may be one, and the number of the first sliding block 1, the first lifting structure, and the first supporting structure may be multiple.
  • the plurality of first sliding blocks 101 may be evenly distributed along the length direction of the first sliding rail 102.
  • the lifting structure includes a lifting cylinder structure and a fixed bracket 107.
  • the lifting cylinder structure includes a cylinder body 108 and a piston rod 109 provided on the cylinder body 108.
  • the cylinder body 108 is connected to the second cylinder through the fixed bracket 107.
  • a slider 101, the piston rod 109 is vertical, and can move in the vertical direction under the driving of the air pressure in the cylinder body 108, the piston rod 109 is supported by the first bearing structure Down side.
  • the first supporting structure includes a support base 110, and the wafer cassette 5 can be loaded on the support base 110.
  • the support base 110 may be an I-shaped support base to provide uniform supporting force.
  • the I-shaped support seat it can also be suitable for inserting the second layer of laminate, and at the same time, the second layer of laminate does not need to pass through a through slot with an excessively large width.
  • Fig. 12 is a structural schematic diagram 1 of a hollow box removing mechanism according to an embodiment of the present invention
  • Fig. 13 is a structural schematic diagram 2 of a hollow box removing mechanism according to an embodiment of the present invention.
  • the empty box removal mechanism 4 includes a second sliding rail 402, a second sliding block 401, a second horizontal movement driving mechanism, a second lifting structure, a horizontal adjustment structure, and a second bearing structure.
  • the second bearing structure is installed on the horizontal adjustment structure, the horizontal adjustment structure is installed on the second lifting structure, and the second sliding block 401 is directly or indirectly fixedly connected to the second lifting structure;
  • the second sliding rail 402 is arranged along the second horizontal direction.
  • the horizontal adjustment structure is used to adjust the position of the second bearing structure along the second horizontal direction
  • the second lifting structure is used to drive the horizontal adjustment structure and the second bearing structure thereon to perform a lifting movement
  • the second horizontal movement driving mechanism is used to drive the second sliding block 401 to move along the second sliding rail 402 so that the second lifting structure directly or indirectly connected to the second sliding block 402,
  • the horizontal adjustment structure, the second supporting structure, and the empty wafer cassette 11 synchronously move horizontally to send out the empty wafer cassette 11.
  • the above embodiments utilize the horizontal movement of the second sliding block along the second sliding rail, which can drive the lifting mechanism directly or indirectly connected to the sliding block, the carrying structure, and the horizontal adjustment mechanism to synchronously move horizontally with the wafer cassette on it. It will not cause the hanging of the telescopic arm, and can avoid the unstable situation caused by the hanging of the lower side, which effectively improves the stability in the transmission process.
  • the horizontal adjustment mechanism and the lifting mechanism can be used to adjust the carrying structure to a position suitable for loading the wafer cassette. Furthermore, no matter where the wafer cassette is sent, only The position of the level adjustment mechanism needs to be adjusted adaptively to support the wafer cassette. It can be seen that the above embodiment can facilitate the extraction of wafer cassettes in various positions, which can facilitate more accurate positioning and receiving of empty wafer cassettes.
  • the horizontal adjustment structure includes a horizontal adjustment drive structure 410, a horizontal adjustment slide 408, and a horizontal adjustment slider 409.
  • the horizontal adjustment slider 409 is directly or indirectly connected to the second bearing structure, so
  • the horizontal adjustment sliding rail 408 is arranged along the second horizontal direction, and the horizontal adjustment driving structure 410 is used to drive the horizontal adjustment sliding block 409 to move along the horizontal adjustment sliding rail 408 to adjust the horizontal adjustment sliding block 409 and the position of the second bearing structure.
  • the second horizontal movement driving mechanism includes a second driving motor 406, a second driving wheel 404, a second driven wheel 405, and a transmission to the second driving wheel. 404 and the second timing belt 403 between the second driven wheel 405.
  • the position of the second driving wheel 4 and the second driven wheel 5 relative to the second sliding rail 402 is fixed, the second sliding block 401 can move synchronously with the second timing belt 403, and the first
  • the second driving motor 406 is used to directly or indirectly drive the second driving wheel 404 to rotate, so that the movement of the second timing belt 403 around the second driving wheel 404 and the second driven wheel 405 drives the second sliding wheel.
  • the block 401 moves horizontally along the second slide rail 402.
  • the second lifting structure includes a lifting driving structure 407, a lifting base structure 412 and a lifting base structure 413.
  • the lifting driving structure 407 is installed on the lifting base structure 412.
  • the lifting drive structure 407 may adopt a lifting cylinder structure, which may include a cylinder body and a piston rod provided on the cylinder body.
  • the cylinder body may be connected to the lifting base structure 412 and/or the lifting base structure 413,
  • the piston rod may be in the vertical direction and can move in the vertical direction under the driving of the air pressure in the cylinder body, and the piston rod may be directly or indirectly connected to the horizontal adjustment mechanism.
  • the lifting cylinder structure can be any structure in the field with a piston rod and a cylinder body based on the operating principle of a cylinder.
  • the horizontal adjustment mechanism includes a horizontal adjustment driving structure 410, a horizontal adjustment sliding rail 408, and a horizontal adjustment sliding block 409.
  • the horizontal adjustment sliding rail 408 may be installed on the horizontal adjustment base, and the horizontal adjustment driving structure 10 may also be installed at The horizontal adjustment base can be installed in the second lifting structure.
  • the horizontal adjustment sliding block 409 is directly or indirectly connected to the second bearing structure, the horizontal adjustment sliding rail 408 is arranged along the second horizontal direction, and the horizontal adjustment driving structure 410 is used to drive the horizontal adjustment sliding block 409 moves along the horizontal adjustment sliding rail 408 to adjust the position of the horizontal adjustment slider 409 and the second bearing structure.
  • the level adjustment drive structure 410 can adopt a level adjustment cylinder structure, which can be understood as a structure that uses the principle of a cylinder to drive the level adjustment slider 409 to move horizontally.
  • a screw nut assembly can also be used. Horizontal adjustment.
  • the second supporting structure includes two supporting parts 411, and each supporting part 411 is used to support a lower side of a handle part 1101 of the empty wafer cassette 11.
  • the supporting portion 411 may be L-shaped, and further have two in-line portions, and one of the in-line portions can be fixedly connected to the horizontal adjustment slider 409 in the horizontal adjustment mechanism.
  • This embodiment also provides a wafer processing system, including the wafer loading equipment involved in the above optional solutions.
  • the wafer loading equipment and wafer processing system can use the cassette moving mechanism to realize the access of the loaded wafer cassette, and can also use the transfer and transportation of the lateral movement mechanism and the internal moving mechanism to transport the loaded wafer.
  • the wafer cassette is fed into the separation mechanism, so that the separation mechanism separates the wafer from the wafer cassette, and the empty cassette moving mechanism and the empty cassette removal mechanism can also be used to send out the separated empty wafer cassette. It can be seen that the entire process of wafer loading can be realized through the operation of the above-mentioned institutions.
  • each mechanism can be operated at the same time, there is no need to waste time waiting for the transportation of the mechanism, and there is no need to waste time waiting for the separation process of the separation mechanism, which effectively improves the efficiency of the feeding process.

Abstract

晶圆上料设备与晶圆处理系统，能够利用晶圆盒移入机构（1）实现载货晶圆盒（5）的接入，还能够利用横移机构（2）与内部移动机构（3）的转移输送将载货晶圆盒（5）送入分离机构（6），进而使得分离机构（6）分离晶圆与晶圆盒，也能够利用空盒移动机构（9）与空盒移出机构（4）将分离后得到的空晶圆盒（11）送出。通过以上各机构的运作，可实现晶圆上料的整个过程。

Description

晶圆上料设备与晶圆处理系统 技术领域
本发明涉及半导体领域，尤其涉及一种晶圆上料设备与晶圆处理系统。
背景技术
晶圆是指硅半导体集成电路制作所用的硅晶片，由于其形状为圆形，故称为晶圆。晶圆可装载于晶圆框架盒，晶圆框架盒进一步可理解为：wafer cassettee，也可简称为晶圆盒。
现有相关技术中，在对晶圆进行上料时，可采用晶圆上料设备，其中，可利用一输送机构将晶圆平移至分离机构，进而分离机构将晶圆与晶圆盒分离后，可利用该输送机构再将空晶圆盒送出。
可见，一个输送机构既要接收晶圆盒，又要将晶圆盒送入分离机构，还要负责送出，其在等待分离的过程中，只能等待，不能同时执行其他过程，这会导致上料过程效率较低。
发明内容
本发明提供一种晶圆上料设备与晶圆处理系统，以解决上料过程效率较低的问题。
根据本发明的第一方面，提供了一种晶圆上料设备，包括晶圆盒移入机构、横移机构、内部移动机构、分离机构、空盒移动机构与空盒移出机构；所述晶圆盒移入机构、横移机构、内部移动机构、分离机构、空盒移动机构与空盒移出机构直接或间接安装于机架；
所述晶圆盒移入机构用于自上料窗口接收载有晶圆的载货晶圆盒，并通过第一水平方向的移动将所述载货晶圆盒送至内部预备位置；
所述横移机构用于通过第二水平方向的移动将处于所述内部预备位置的载货晶圆盒沿水平方向横移至所述内部移动机构；
所述内部移动机构用于通过所述第一水平方向的移动和/或升降移动将横移而来的载货晶圆盒送至所述分离机构，并通过所述第一水平方向的移动 和/或升降移动将所述分离机构所得到的空晶圆盒送至所述空盒移动机构；
所述分离机构用于将送至的载货晶圆盒中的晶圆与晶圆盒分离，得到晶圆与所述空晶圆盒；
所述空盒移动机构用于通过水平移动和/或升降移动将送至的空晶圆盒送至所述空盒移出机构；
所述空盒移出机构用于通过所述第二水平方向的移动将送至的空晶圆盒移出。
可选的，所述分离机构分离得到的晶圆在分离后处于内部空间，所述内部空间能够与外部的晶圆处理槽区连通，所述内部空间与所述晶圆处理槽区之间设有空气阻隔机构；
所述空气阻隔机构阻隔于所述内部空间与晶圆处理槽区之间，且能够在需将所述晶圆自所述内部空间取出至所述晶圆处理槽区时取消阻隔。
可选的，所述空气阻隔机构包括：基体、伸缩机构，以及空气阻隔板；所述基体设于所述机架，所述伸缩机构连接于所述基体与所述空气阻隔板之间；
所述伸缩机构用于控制所述空气阻隔板相对于所述基体伸缩；
所述空气阻隔板相对于所述基体伸出时，能够阻挡于所述内部空间与所述晶圆处理槽区之间；
所述空气阻隔板相对于所述基体缩回时，所述内部空间与所述晶圆处理槽区间能够经连通空间相连通，以使得机械手能够经所述连通空间将所述内部空间中的晶圆运输至所述晶圆处理器槽区。
可选的，所述伸缩机构包括伸缩杆、杆套结构与伸缩驱动结构，所述杆套结构设于所述基体，所述伸缩杆穿过所述杆套结构，所述伸缩驱动结构连接所述基体与所述空气阻隔板，所述伸缩杆与所述空气阻隔板固定连接；
所述伸缩驱动结构用于驱动所述伸缩杆沿其长度方向相对于所述基体伸缩，以使得所述空气阻隔板相对于所述基体伸缩。
可选的，所述伸缩机构还包括缓冲结构，所述缓冲结构连接所述基体与所述空气阻隔板，用于在所述空气阻隔板相对所述基体伸缩时提供缓冲作用力。
可选的，所述晶圆盒移入机构包括第一滑轨、第一滑块、第一水平运动 驱动结构、第一升降结构，以及第一承载结构，所述第一承载结构安装于所述第一升降结构，所述第一滑块与所述第一升降结构直接或间接固定连接；
所述升降结构用于驱动对应的第一承载结构做升降运动，以使得所述第一承载结构能够在上升后支撑于自所述上料窗口进入的载货晶圆盒的下侧，以装载所述载货晶圆盒；
所述第一水平运动驱动结构用于驱动所述第一滑块沿所述第一滑轨做水平运动，以使得直接或间接连接于所述第一滑块的所述第一升降结构、所述第一承载结构和所述载货晶圆盒同步发生水平运动。
可选的，所述第一滑轨、所述第一滑块，以及所述第一升降结构设于所述机架的第一层层板与第二层层板之间，所述第二层层板位于所述第一层层板的上侧，所述第二层层板设有长条形的贯通所述第二层层板两侧的通槽；
所述载货晶圆盒装载于所述第二层层板时，所述第一承载结构能够在上升后插入所述通槽并支撑其上的载货晶圆盒，以使得所述载货晶圆盒装载于所述第一承载结构；
所述通槽的长度方向与所述第一滑轨的长度方向相匹配，以使得所述第一滑块沿所述第一滑轨做水平运动时，所述第一承载结构能够带动其上的载货晶圆盒沿所述通槽做水平运动。
可选的，所述空盒移出机构包括第二滑轨、第二滑块、第二水平移动驱动机构、第二升降结构、水平调整结构，以及第二承载结构；
所述第二承载结构安装于所述水平调整结构，所述水平调整结构安装于所述第二升降结构，所述第二滑块与所述第二升降结构直接或间接固定连接；所述第二滑轨沿所述第二水平方向设置，
所述水平调整结构用于沿所述第二水平方向调整所述第二承载结构的位置，所述第二升降结构用于驱动所述水平调整结构及其上的第二承载结构做升降运动，以使得沿所述第二水平方向调整至所需位置的第二承载结构能够在上升后支撑于空晶圆盒的两个提手部的下侧，以装载所述空晶圆盒；
所述第二水平移动驱动机构用于驱动所述第二滑块沿所述第二滑轨运动，以使得直接或间接连接于所述第二滑块的所述第二升降结构、所述水平调整结构、所述第二承载结构和所述空晶圆盒同步发生水平运动，以将所述空晶圆盒送出。
可选的，所述水平调整结构包括水平调整驱动结构、水平调整滑轨与水平调整滑块，所述水平调整滑块直接或间接连接所述第二承载结构，所述水平调整滑轨沿所述第二水平方向设置，所述水平调整驱动结构用于驱动所述水平调整滑块沿所述水平调整滑轨运动，以调整所述水平调整滑块与所述第二承载结构的位置。
根据本发明的第二方面，提供了一种晶圆处理系统，包括第一方面及其可选方案涉及的晶圆上料设备。
本发明提供的晶圆上料设备与晶圆处理系统，能够利用晶圆盒移入机构能够实现载货晶圆盒的接入，还能够利用横移机构与内部移动机构的转移输送将载货晶圆盒送入分离机构，进而使得分离机构分离晶圆与晶圆盒，也能够利用空盒移动机构与空盒移出机构将分离后得到的空晶圆盒送出。可见，通过以上各机构的运作，可实现晶圆上料的整个过程。
同时，各机构之间可以是同时运作的，无需浪费时间等待机构的运输，也无需浪费时间等待分离机构的分离过程，有效提高了上料过程的效率。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明一实施例中晶圆上料设备的结构示意图一；
图2是本发明一实施例中晶圆上料设备的结构示意图二；
图3是本发明一实施例中晶圆上料设备的结构示意图三；
图4是本发明一实施例中晶圆上料设备的结构示意图四；
图5是本发明一实施例中晶圆上料设备的结构示意图五；
图6是本发明一实施例中晶圆上料设备的结构示意图六；
图7是本发明一实施例中空气阻隔机构的结构示意图一；
图8是本发明一实施例中空气阻隔机构的结构示意图二；
图9是本发明一实施例中空气阻隔机构的结构示意图三；
图10是本发明一实施例中晶圆盒移入机构的结构示意图一；
图11是本发明一实施例中晶圆盒移入机构的结构示意图二；
图12是本发明一实施例中空盒移出机构的结构示意图一；
图13是本发明一实施例中空盒移出机构的结构示意图二。
附图标记说明：
1-晶圆盒移入机构；
101-第一滑块；
102-第一滑轨；
103-第一同步皮带；
104-第一驱动电机；
105-第一主动轮；
106-第一从动轮；
107-固定支架；
108-气缸本体
109-活塞杆；
110-支撑座；
2-横移机构；
3-内部移动机构；
4-空盒移出机构；
401-第二滑块；
402-第二滑轨；
403-第二同步皮带；
404-第二主动轮；
405-第二从动轮；
406-第二驱动电机；
407-升降驱动结构；
408-水平调整滑轨；
409-水平调整滑块；
410-水平调整驱动结构；
411-支撑部；
412-升降基础结构；
413-升降基板结构；
5-载货晶圆盒；
6-分离机构；
7-机架；
701-上料窗口；
702-维修窗口；
703-保护罩；
704-维修门；
705-第一层层板；
706-第二层层板；
8-交互组件；
801-操作屏；
802-按键；
9-空盒移动机构；
10-空气阻隔机构
1001-空气阻隔板；
1002-基体；
1003-伸缩杆；
1004-杆套结构；
1005-伸缩驱动结构；
1006-固定条；
1007-缓冲结构；
10-分离机构。
11-空晶圆盒；
1101-提手部；
12-空气净化设备；
1201-空气过滤器；
1202-空气过滤器。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本发明的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
下面以具体地实施例对本发明的技术方案进行详细说明。下面这几个具体的实施例可以相互结合，对于相同或相似的概念或过程可能在某些实施例不再赘述。
图1是本发明一实施例中晶圆上料设备的结构示意图一；图2是本发明一实施例中晶圆上料设备的结构示意图二；图3是本发明一实施例中晶圆上料设备的结构示意图三；图4是本发明一实施例中晶圆上料设备的结构示意图四；图5是本发明一实施例中晶圆上料设备的结构示意图五；图6是本发明一实施例中晶圆上料设备的结构示意图六。
请参考图1至图6，晶圆上料设备，包括晶圆盒移入机构1、横移机构2、内部移动机构3、分离机构6、空盒移动机构9与空盒移出机构4；所述晶圆盒移入机构1、横移机构2、内部移动机构3、分离机构6、空盒移动机构与空盒移出机构4直接或间接安装于机架7。
可见，以上各机构与机架7可形成一个整体，从而便于运输。
所述晶圆盒移入机构1用于自上料窗口701接收载有晶圆的载货晶圆盒5，并通过第一水平方向的移动将所述载货晶圆盒5送至内部预备位置。
其中的内部预留位置可理解为任意的能够适于被横移机构2横移的位置，例如可以是晶圆盒移入机构1的终点位置。
所述横移机构2用于通过第二水平方向的移动将处于所述内部预备位置的载货晶圆盒5沿水平方向横移至所述内部移动机构3。
横移机构2的结构可以例如晶圆盒移入机构1，但其运输方向与晶圆盒移入机构1，其结构也可以例如空盒移出机构4，进而，任意有关晶圆盒移入机构1的描述或者有关空盒移出机构4的描述均可适用于横移机构2。此外，本实施例也不排除其他任意可实现水平向直线移动的结构。
所述内部移动机构3用于通过所述第一水平方向的移动和/或升降移动将横移而来的载货晶圆盒5送至所述分离机构6，并通过所述第一水平方向的移动和/或升降移动将所述分离机构6所得到的空晶圆盒11送至所述空盒移动机构9。
该内部移动机构3的结构可以例如晶圆盒移入机构1，也可以例如空盒移出机构4，进而，任意有关晶圆盒移入机构1的描述或者有关空盒移出机构4的描述均可适用于内部移动机构3。此外，本实施例也不排除其他任意可实现水平向和/或竖直向移动的结构。
所述分离机构6用于将送至的载货晶圆盒5中的晶圆与晶圆盒分离，得到晶圆与所述空晶圆盒11。
具体实施过程中，分离机构6分离后得到的空晶圆盒11可以被送至分离机构6上侧，从而被进一步运输。
一种举例中，该分离机构6可以例如公开号为CN108372963A的“硅片与片盒脱离机构”。同时，本实施例也不排除其他分离机构6的应用，本实施例中，即便分离得到的空晶圆盒11非处于分离机构6上侧，也可适用于本实施例的相关描述，从而落在本实施例的范围。
所述空盒移动机构9用于通过水平移动和/或升降移动将送至的空晶圆盒11送至所述空盒移出机构4。
空盒移动机构9可例如包括空盒升降结构，其可利用丝杠螺母的结构原理，或者气缸的结构原理来实现竖直向的升降。
所述空盒移出机构4用于通过所述第二水平方向的移动将送至的空晶圆盒11移出。
可见，以上实施方式能够利用晶圆盒移入机构能够实现载货晶圆盒的接入，还能够利用横移机构与内部移动机构的转移输送将载货晶圆盒送入分离 机构，进而使得分离机构分离晶圆与晶圆盒，也能够利用空盒移动机构与空盒移出机构将分离后得到的空晶圆盒送出。可见，通过以上各机构的运作，可实现晶圆上料的整个过程。
同时，各机构之间可以是同时运作的，无需浪费时间等待机构的运输，也无需浪费时间等待分离机构的分离过程，有效提高了上料过程的效率。
其中一种实施方式中，除了上料窗口701，机架7还可具有维修窗口702，其可设于晶圆盒移入机构1下侧的机架7的侧壁。机架7的侧壁还可设有维修门704，打开后可适于对其中结构的维护。
其中一种实施方式中，机架7还可具有保护罩703，该保护罩703可设于空盒移出机构4的一侧。
其中一种实施方式中，机架7还可设有交互组件8，该交互组件8可例如包括操作屏801与按键802；该操作屏801与按键802可分别连接晶圆盒移入机构1、横移机构2、内部移动机构3、分离机构6、空盒移动机构9与空盒移出机构4，从而对其中的电子部件，例如电机、气缸的控制组件等等进行控制，也可利用操作屏801的显示功能对以上各电子部件的运作状态进行显示。
其中一种实施方式中，机架7还可设有空气净化设备12，其可位于机架7的顶部，空气净化设备12具体可例如包括设于空盒移出机构4与空盒移动机构9上侧的空气过滤器1202，以及设于圆盒移入机构1、内部移动机构3与分离机构6上侧的空气过滤器1201。
通过设于顶部的空气过滤器，可有利于对整个设备内空气的过滤保护。
图7是本发明一实施例中空气阻隔机构的结构示意图一；图8是本发明一实施例中空气阻隔机构的结构示意图二；图9是本发明一实施例中空气阻隔机构的结构示意图三。
请参考图7至图9，并结合图2，所述分离机构6分离得到的晶圆在分离后处于内部空间。
内部空间，其中的内部空间可以指晶圆上料设备内的任意部分或全部空间，具体实施过程中，可以具体为用于分离晶圆与晶圆盒的分离机构6上侧的部分空间。
其中的晶圆处理槽区，可理解为任意能够对晶圆进行处理的区域。
所述内部空间与所述晶圆处理槽区之间设有空气阻隔机构10。
所述空气阻隔机构10阻隔于所述内部空间与晶圆处理槽区之间，且能够在需将所述晶圆自所述内部空间取出至所述晶圆处理槽区时取消阻隔。
其中一种实施方式中，所述空气阻隔机构10包括：基体1002、伸缩机构，以及空气阻隔板1001；所述基体1002设于所述机架7，所述伸缩机构连接于所述基体1002与所述空气阻隔板1001之间。
所述伸缩机构用于控制所述空气阻隔板相对于所述基体伸缩。
其中的伸缩机构，可理解为能够控制空气阻隔板1沿直线方向移动，从而使其相对于基体2发生直线运动，因空气阻隔板1在直线运动时可超出基体2的遮挡范围，故而，该直线运动可理解为伸缩运动。
所述空气阻隔板1001相对于所述基体1002伸出时，能够阻挡于所述内部空间与所述晶圆处理槽区之间。
所述空气阻隔板1001相对于所述基体1002缩回时，所述内部空间与所述晶圆处理槽区间能够经连通空间相连通，以使得机械手能够经所述连通空间将所述内部空间中的晶圆运输至所述晶圆处理器槽区。
以上实施方式中，利用空气阻隔板1001，可以阻隔在内部空间与晶圆处理槽区之间，从而避免晶圆处理槽区中对晶圆进行处理时产生的酸雾和酸气等异物进入到内部空间中，防止其中的晶圆、晶圆盒等被污染、损坏。同时，需传输晶圆时，也可缩回空气阻隔板，以保障机械手依旧能顺利运输晶圆。
其中一种实施方式中，所述伸缩机构包括伸缩杆1003、杆套结构1004与伸缩驱动结构1005，所述杆套结构1004设于所述基体1002，所述伸缩杆1003穿过所述杆套结构1004，所述伸缩驱动结构1005连接所述基体1002与所述空气阻隔板1001，所述伸缩杆1003与所述空气阻隔板1001固定连接。
利用杆套结构1004，可为伸缩杆1003起到导向与限位作用，避免其伸缩方向以及位置发生偏离。
所述伸缩驱动结构1005用于驱动所述伸缩杆1003沿其长度方向相对于所述基体1002伸缩，以使得所述空气阻隔板1001相对于所述基体1002伸缩。
其中的伸缩驱动结构1005，可以为任意能够产生直线运动的结构。具体实施过程中，伸缩驱动结构1005可以为伸缩气缸结构。另一具体实施过程中，伸缩驱动结构1005也可以为采用电机驱动的丝杆螺母结构。可见，任意已有或改进的直线运动的方案，均可应用于本实施例的伸缩驱动结构1005，进而不脱离本实施例的范围。
具体实施过程中，所述伸缩杆1003通过设于其末端的固定条1006与所述空气阻隔板1001固定连接，所述固定条1006沿所述空气阻隔板1001的表面设置，且垂直于所述伸缩杆1003。
其中一种实施方式中，所述伸缩机构10还可包括缓冲结构1007，所述缓冲结构1007连接所述基体1002与所述空气阻隔板1001，用于在所述空气阻隔板相对所述基体1002伸缩时提供缓冲作用力。
具体实施过程中，缓冲结构1007可以为气缸缓冲结构，该气缸缓冲结构可以理解为任意气缸的气体压力能够被动在伸缩杆1003的伸缩运动下发生变化，进而因气体气压变化通常难以匹配于伸缩杆1003的伸缩，其可对伸缩杆1003的伸缩产生一定缓冲力，避免其因快速、直接的伸缩运动而使得部件之间发生冲击、磨损等，进一步提高结构的使用寿命。
图10是本发明一实施例中晶圆盒移入机构的结构示意图一；图11是本发明一实施例中晶圆盒移入机构的结构示意图二。
请参考图10与图11，所述晶圆盒移入机构1包括第一滑轨102、第一滑块101、第一水平运动驱动结构、第一升降结构，以及第一承载结构，所述第一承载结构安装于所述第一升降结构，所述第一滑块101与所述第一升降结构直接或间接固定连接。
所述升降结构用于驱动对应的第一承载结构做升降运动，以使得所述第一承载结构能够在上升后支撑于自所述上料窗口701进入的载货晶圆盒5的下侧，以装载所述载货晶圆盒5。
其中，第一承载结构所支撑的载货晶圆盒5，可以是处于上料窗口701的，也可以是经上料窗口701后处于任意位置的载货晶圆盒5。
所述第一水平运动驱动结构用于驱动所述第一滑块101沿所述第一滑轨102做水平运动，以使得直接或间接连接于所述第一滑块101的所述第一升降结构、所述第一承载结构和所述载货晶圆盒5同步发生水平运动。
以上实施方式中，利用滑块沿滑轨的水平运动，能够带动直接或间接连接滑块的升降结构、所述承载结构与其上的晶圆盒同步发生水平运动，其并不会造成伸缩臂的悬空，进而可避免下侧悬空而带来的不平稳的情况，有效提高了传输过程中的平稳性。
其中一种实施方式中，请参考图11，所述第一滑轨102、所述第一滑块101，以及所述第一升降结构设于所述机架7的第一层层板705与第二层层板706之间，所述第二层层板706位于所述第一层层板705的上侧，所述第二层层板706设有长条形的贯通所述第二层层板706两侧的通槽。
所述载货晶圆盒5装载于所述第二层层板706时，所述第一承载结构能够在上升后插入所述通槽并支撑其上的载货晶圆盒5，以使得所述载货晶圆盒5装载于所述第一承载结构。
所述通槽的长度方向与所述第一滑轨的长度方向相匹配，以使得所述第一滑块101沿所述第一滑轨102做水平运动时，所述第一承载结构能够带动其上的载货晶圆盒5沿所述通槽做水平运动。
其中，第二层层板也能为晶圆盒提供一定支撑，进一步提高传输过程中的平稳。
其中一种实施方式中，所述第一水平运动驱动机构包括第一驱动电机104、第一主动轮105、第一从动轮106、传动于所述第一主动轮105与所述第一从动轮106之间的第一同步皮带103。
所述第一主动轮105与所述第一从动轮106相对于所述第一滑轨102的位置固定，所述第一滑块101能够随所述第一同步皮带103同步运动。
所述第一驱动电机104用于直接或间接驱动所述第一主动轮105转动，以利用所述第一同步皮带103绕所述第一主动轮105与第一从动轮106的运动带动所述第一滑块101沿所述第一滑轨102做水平运动。
所述第一滑轨102与所述水平运动驱动机构的数量可以为一个，所述第一滑块1、所述第一升降结构，以及所述第一承载结构的数量为多个。其中的多个第一滑块101可以沿第一滑轨102的长度方向均匀分布。
基于多样的数量，可以同时传输多个晶圆盒，进而，水平运动驱动机构仅需在较短的形成间做往复运动，即可将一端送入的晶圆盒送至另一端，其可进一步提高传输的效率。
所述升降结构包括升降气缸结构与固定支架107，所述升降气缸结构包括气缸本体108与设于所述气缸本体108的活塞杆109，所述气缸本体108通过所述固定支架107连接所述第一滑块101，所述活塞杆109是沿竖直向的，且能在所述气缸本体108中气压的驱动下沿竖直向运动，所述活塞杆109支撑于所述第一承载结构的下侧。
其中一种实施方式中，所述第一承载结构包括支撑座110，载货晶圆盒5可装载于所述支撑座110。具体实施过程中，所述支撑座110可以为工字型支撑座，以提供均匀的支撑力。同时，通过工字型支撑座，还能够适于插入第二层层板，同时，第二层层板无需为其穿过开设过大宽度的通槽。
图12是本发明一实施例中空盒移出机构的结构示意图一；图13是本发明一实施例中空盒移出机构的结构示意图二。
请参考图12与图13，所述空盒移出机构4包括第二滑轨402、第二滑块401、第二水平移动驱动机构、第二升降结构、水平调整结构，以及第二承载结构。
所述第二承载结构安装于所述水平调整结构，所述水平调整结构安装于所述第二升降结构，所述第二滑块401与所述第二升降结构直接或间接固定连接；所述第二滑轨402沿所述第二水平方向设置。
所述水平调整结构用于沿所述第二水平方向调整所述第二承载结构的位置，所述第二升降结构用于驱动所述水平调整结构及其上的第二承载结构做升降运动，以使得沿所述第二水平方向调整至所需位置的第二承载结构能够在上升后支撑于空晶圆盒11的两个提手部1101的下侧，以装载所述空晶圆盒11。
所述第二水平移动驱动机构用于驱动所述第二滑块401沿所述第二滑轨402运动，以使得直接或间接连接于所述第二滑块402的所述第二升降结构、所述水平调整结构、所述第二承载结构和所述空晶圆盒11同步发生水平运动，以将所述空晶圆盒11送出。
以上实施方式利用第二滑块沿第二滑轨的水平运动，能够带动直接或间接连接滑块的升降机构、所述承载结构、水平调整机构与其上的晶圆盒同步发生水平运动，其并不会造成伸缩臂的悬空，进而可避免下侧悬空而带来的不平稳的情况，有效提高了传输过程中的平稳性。
同时，以上实施方式通过将水平调整机构安装于升降机构，可利用水平调整机构与升降机构将承载结构调整至适于装载晶圆盒的位置，进而，不论晶圆盒被送至什么位置，只需适应性调整水平调整机构的位置，就可支承起晶圆盒，可见，以上实施方式可便于提取多种位置的晶圆盒，其可有利于更准确地对位接收空晶圆盒。
其中一种实施方式中，所述水平调整结构包括水平调整驱动结构410、水平调整滑轨408与水平调整滑块409，所述水平调整滑块409直接或间接连接所述第二承载结构，所述水平调整滑轨408沿所述第二水平方向设置，所述水平调整驱动结构410用于驱动所述水平调整滑块409沿所述水平调整滑轨408运动，以调整所述水平调整滑块409与所述第二承载结构的位置。
其中一种实施方式中，请参考图12和图13，所述第二水平移动驱动机构包括第二驱动电机406、第二主动轮404、第二从动轮405、传动于所述第二主动轮404与所述第二从动轮405之间的第二同步皮带403。
所述第二主动轮4与所述第二从动轮5相对于所述第二滑轨402的位置固定，所述第二滑块401能够随所述第二同步皮带403同步运动，所述第二驱动电机406用于直接或间接驱动所述第二主动轮404转动，以利用所述第二同步皮带403绕所述第二主动轮404与第二从动轮405的运动带动所述第二滑块401沿所述第二滑轨402做水平运动。
其中一种实施方式中，请参考图12和图13，所述第二升降结构包括升降驱动结构407、升降基础结构412与升降基板结构413。
所述升降驱动结构407安装于所述升降基础结构412。
具体实施过程中，升降驱动结构407可采用升降气缸结构，其可包括气缸本体与设于所述气缸本体的活塞杆，所述气缸本体可连接于升降基础结构412和/或升降基板结构413，所述活塞杆可以是沿竖直向的，且能在所述气缸本体中气压的驱动下沿竖直向运动，所述活塞杆可直接或间接连接水平调整机构。
其中的升降气缸结构，可以为本领域任意的基于气缸的运作原理的具有活塞杆与气缸本体的结构。
所述水平调整机构包括水平调整驱动结构410、水平调整滑轨408与水平调整滑块409，具体实施过程中，水平调整滑轨408可安装于水平调整基 体，水平调整驱动结构10也可设于水平调整基体，水平调整基体可安装于第二升降结构。
所述水平调整滑块409直接或间接连接所述第二承载结构，所述水平调整滑轨408沿所述第二水平方向设置，所述水平调整驱动结构410用于驱动所述水平调整滑块409沿所述水平调整滑轨408运动，以调整所述水平调整滑块409与所述第二承载结构的位置。
具体实施过程中，水平调整驱动结构410可采用水平调整气缸结构，其可理解为利用气缸原理驱动水平调整滑块409水平移动的结构，在其他实施过程中，也可采用丝杆螺母组件来实现水平向的调整。
其中一种实施方式中，所述第二承载结构包括两个支撑部411，每个支撑部411用于支撑于空晶圆盒11的一个提手部1101的下侧。其中的支撑部411可以呈L型，进而具有两个一字型部，其中的一个一字型部可以与水平调整机构中的水平调整滑块409固定连接。
本实施例还提供了一种晶圆处理系统，包括以上可选方案涉及的晶圆上料设备。
本实施例提供的晶圆上料设备与晶圆处理系统，能够利用晶圆盒移入机构能够实现载货晶圆盒的接入，还能够利用横移机构与内部移动机构的转移输送将载货晶圆盒送入分离机构，进而使得分离机构分离晶圆与晶圆盒，也能够利用空盒移动机构与空盒移出机构将分离后得到的空晶圆盒送出。可见，通过以上各机构的运作，可实现晶圆上料的整个过程。
同时，各机构之间可以是同时运作的，无需浪费时间等待机构的运输，也无需浪费时间等待分离机构的分离过程，有效提高了上料过程的效率。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (10)

  1. 一种晶圆上料设备，其特征在于，包括晶圆盒移入机构、横移机构、内部移动机构、分离机构、空盒移动机构与空盒移出机构；所述晶圆盒移入机构、横移机构、内部移动机构、分离机构、空盒移动机构与空盒移出机构直接或间接安装于机架；
    所述晶圆盒移入机构用于自上料窗口接收载有晶圆的载货晶圆盒，并通过第一水平方向的移动将所述载货晶圆盒送至内部预备位置；
    所述横移机构用于通过第二水平方向的移动将处于所述内部预备位置的载货晶圆盒沿水平方向横移至所述内部移动机构；
    所述内部移动机构用于通过所述第一水平方向的移动和/或升降移动将横移而来的载货晶圆盒送至所述分离机构，并通过所述第一水平方向的移动和/或升降移动将所述分离机构所得到的空晶圆盒送至所述空盒移动机构；
    所述分离机构用于将送至的载货晶圆盒中的晶圆与晶圆盒分离，得到晶圆与所述空晶圆盒；
    所述空盒移动机构用于通过水平移动和/或升降移动将送至的空晶圆盒送至所述空盒移出机构；
    所述空盒移出机构用于通过所述第二水平方向的移动将送至的空晶圆盒移出。
  2. 根据权利要求1所述的晶圆上料设备，其特征在于，所述分离机构分离得到的晶圆在分离后处于内部空间，所述内部空间能够与外部的晶圆处理槽区连通，所述内部空间与所述晶圆处理槽区之间设有空气阻隔机构；
    所述空气阻隔机构阻隔于所述内部空间与晶圆处理槽区之间，且能够在需将所述晶圆自所述内部空间取出至所述晶圆处理槽区时取消阻隔。
  3. 根据权利要求2所述的设备，其特征在于，所述空气阻隔机构包括：基体、伸缩机构，以及空气阻隔板；所述基体设于所述机架，所述伸缩机构连接于所述基体与所述空气阻隔板之间；
    所述伸缩机构用于控制所述空气阻隔板相对于所述基体伸缩；
    所述空气阻隔板相对于所述基体伸出时，能够阻挡于所述内部空间与所述晶圆处理槽区之间；
    所述空气阻隔板相对于所述基体缩回时，所述内部空间与所述晶圆处理 槽区间能够经连通空间相连通，以使得机械手能够经所述连通空间将所述内部空间中的晶圆运输至所述晶圆处理器槽区。
  4. 根据权利要求3所述的设备，其特征在于，所述伸缩机构包括伸缩杆、杆套结构与伸缩驱动结构，所述杆套结构设于所述基体，所述伸缩杆穿过所述杆套结构，所述伸缩驱动结构连接所述基体与所述空气阻隔板，所述伸缩杆与所述空气阻隔板固定连接；
    所述伸缩驱动结构用于驱动所述伸缩杆沿其长度方向相对于所述基体伸缩，以使得所述空气阻隔板相对于所述基体伸缩。
  5. 根据权利要求4所述的设备，其特征在于，所述伸缩机构还包括缓冲结构，所述缓冲结构连接所述基体与所述空气阻隔板，用于在所述空气阻隔板相对所述基体伸缩时提供缓冲作用力。
  6. 根据权利要求1至5任一项所述的设备，其特征在于，所述晶圆盒移入机构包括第一滑轨、第一滑块、第一水平运动驱动结构、第一升降结构，以及第一承载结构，所述第一承载结构安装于所述第一升降结构，所述第一滑块与所述第一升降结构直接或间接固定连接；
    所述升降结构用于驱动对应的第一承载结构做升降运动，以使得所述第一承载结构能够在上升后支撑于自所述上料窗口进入的载货晶圆盒的下侧，以装载所述载货晶圆盒；
    所述第一水平运动驱动结构用于驱动所述第一滑块沿所述第一滑轨做水平运动，以使得直接或间接连接于所述第一滑块的所述第一升降结构、所述第一承载结构和所述载货晶圆盒同步发生水平运动。
  7. 根据权利要求6所述的设备，其特征在于，所述第一滑轨、所述第一滑块，以及所述第一升降结构设于所述机架的第一层层板与第二层层板之间，所述第二层层板位于所述第一层层板的上侧，所述第二层层板设有长条形的贯通所述第二层层板两侧的通槽；
    所述载货晶圆盒装载于所述第二层层板时，所述第一承载结构能够在上升后插入所述通槽并支撑其上的载货晶圆盒，以使得所述载货晶圆盒装载于所述第一承载结构；
    所述通槽的长度方向与所述第一滑轨的长度方向相匹配，以使得所述第一滑块沿所述第一滑轨做水平运动时，所述第一承载结构能够带动其上的载 货晶圆盒沿所述通槽做水平运动。
  8. 根据权利要求1至5任一项所述的设备，其特征在于，所述空盒移出机构包括第二滑轨、第二滑块、第二水平移动驱动机构、第二升降结构、水平调整结构，以及第二承载结构；
    所述第二承载结构安装于所述水平调整结构，所述水平调整结构安装于所述第二升降结构，所述第二滑块与所述第二升降结构直接或间接固定连接；所述第二滑轨沿所述第二水平方向设置，
    所述水平调整结构用于沿所述第二水平方向调整所述第二承载结构的位置，所述第二升降结构用于驱动所述水平调整结构及其上的第二承载结构做升降运动，以使得沿所述第二水平方向调整至所需位置的第二承载结构能够在上升后支撑于空晶圆盒的两个提手部的下侧，以装载所述空晶圆盒；
    所述第二水平移动驱动机构用于驱动所述第二滑块沿所述第二滑轨运动，以使得直接或间接连接于所述第二滑块的所述第二升降结构、所述水平调整结构、所述第二承载结构和所述空晶圆盒同步发生水平运动，以将所述空晶圆盒送出。
  9. 根据权利要求8所述的设备，其特征在于，所述水平调整结构包括水平调整驱动结构、水平调整滑轨与水平调整滑块，所述水平调整滑块直接或间接连接所述第二承载结构，所述水平调整滑轨沿所述第二水平方向设置，所述水平调整驱动结构用于驱动所述水平调整滑块沿所述水平调整滑轨运动，以调整所述水平调整滑块与所述第二承载结构的位置。
  10. 一种晶圆处理系统，其特征在于，包括权利要求1至9任一项所述的晶圆上料设备。
PCT/CN2019/096213 2019-06-13 2019-07-16 晶圆上料设备与晶圆处理系统 WO2020248325A1 (zh)

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