WO2020119025A1 - Oled装置及其制作方法 - Google Patents

Oled装置及其制作方法 Download PDF

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Publication number
WO2020119025A1
WO2020119025A1 PCT/CN2019/087582 CN2019087582W WO2020119025A1 WO 2020119025 A1 WO2020119025 A1 WO 2020119025A1 CN 2019087582 W CN2019087582 W CN 2019087582W WO 2020119025 A1 WO2020119025 A1 WO 2020119025A1
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WIPO (PCT)
Prior art keywords
display area
groove structure
substrate
parallel
oled device
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Ceased
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PCT/CN2019/087582
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English (en)
French (fr)
Inventor
张兴永
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/481,096 priority Critical patent/US11322719B2/en
Publication of WO2020119025A1 publication Critical patent/WO2020119025A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the field of electronic display, in particular to an OLED device and a manufacturing method thereof.
  • the organic layer in the bent area is exposed to the atmosphere, and its surface is not encapsulated. This is because the inorganic thin film used for encapsulation has poor ductility, and cracks are easily generated when bent, and if the cracks spread to the display area, the screen may be damaged. However, if the organic layer is directly exposed to the atmosphere, the underlying metal is easily corroded by water vapor, shortening the service life of the OLED device.
  • the invention provides an OLED device and a manufacturing method thereof to solve the technical problem that the packaging structure of the OLED bending area in the prior art is prone to cracks.
  • the present invention provides an OLED device including a substrate, a display area on the first surface of the substrate, non-display areas on both sides of the display area, and covering the display area and the non-display area Packaging structure; wherein, the non-display area is composed of a flexible substrate that can be bent, the flexible substrate is bent toward the second surface of the substrate, the second surface is opposite to the first surface, located in the first The back of the surface; at least one groove structure is provided at an edge of the non-display area adjacent to the display area, the groove structure extends along a first direction, and the first direction is The parallel direction of the boundary line of the non-display area; the encapsulation structure includes an inorganic thin film covering the display area, the non-display area and the groove structure; wherein,
  • the depth of the groove structure is less than or equal to two thirds of the thickness of the non-display area; the cross-section of the groove structure along the second direction is an inverted triangle, and the second direction is parallel to the direction where the substrate is located It is perpendicular to the first direction; wherein, an apex angle of the inverted triangle is located on the boundary between the display area and the non-display area.
  • the depth of the groove structure is less than or equal to two-thirds of the thickness of the non-display area;
  • the cross-section of the groove structure along the second direction is a positive trapezoid, the second direction Parallel to the direction in which the substrate is located and perpendicular to the first direction; wherein, the trapezoid is an isosceles trapezoid, and the symmetry axis of the trapezoid is located on the boundary line between the display area and the non-display area.
  • the number of the inorganic thin film is at least one layer, and the material thereof is any one of silicon nitride, silicon oxynitride, silicon carbonitride, silicon oxide, and aluminum oxide.
  • the non-display area has a laminated structure
  • the laminated structure includes at least: an organic deep hole layer, the organic deep hole layer includes deep holes penetrating the substrate, and a flexible organic material is used Filling the deep hole to enhance the flexibility of the non-display area; a metal layer above the organic deep hole layer to form a metal trace with an electrical connection function; a planarization layer above the metal layer , Used to planarize the metal layer; and a support pillar located above the metal layer, used to support the mask used when forming the light-emitting layer.
  • the top of the non-display area is provided with at least one parallel groove structure, the groove structure extends along a first direction, and the first direction is In the direction parallel to the boundary line of the display area, the cross section of the groove structure along the second direction is an inverted triangle, and the second direction is parallel to the direction where the substrate is located and perpendicular to the first direction.
  • the present invention provides an OLED device including a substrate, a display area on the first surface of the substrate, non-display areas on both sides of the display area, and covering the display area and the non-display area Packaging structure; wherein, the non-display area is composed of a flexible substrate that can be bent, the flexible substrate is bent toward the second surface of the substrate, the second surface is opposite to the first surface, located in the first The back of the surface; at least one groove structure is provided at an edge of the non-display area adjacent to the display area, the groove structure extends along a first direction, and the first direction is The boundary line of the non-display area is parallel to the direction; the packaging structure includes an inorganic thin film covering the display area, the non-display area and the groove structure.
  • the depth of the groove structure is less than or equal to two thirds of the thickness of the non-display area; the cross section of the groove structure along the second direction is an inverted triangle, and the second direction Parallel to the direction in which the substrate is located and perpendicular to the first direction; wherein, an apex angle of the inverted triangle is located on the boundary line between the display area and the non-display area.
  • the depth of the groove structure is less than or equal to two-thirds of the thickness of the non-display area;
  • the cross-section of the groove structure along the second direction is a positive trapezoid, the second direction Parallel to the direction in which the substrate is located and perpendicular to the first direction; wherein, the trapezoid is an isosceles trapezoid, and the symmetry axis of the trapezoid is located on the boundary line between the display area and the non-display area.
  • the number of the inorganic thin film is at least one layer, and the material thereof is any one of silicon nitride, silicon oxynitride, silicon carbonitride, silicon oxide, and aluminum oxide.
  • the non-display area has a laminated structure
  • the laminated structure includes at least: an organic deep hole layer, the organic deep hole layer includes deep holes penetrating the substrate, and a flexible organic material is used Filling the deep hole to enhance the flexibility of the non-display area; a metal layer above the organic deep hole layer to form a metal trace with an electrical connection function; a planarization layer above the metal layer , Used to planarize the metal layer; and a support pillar located above the metal layer, used to support the mask used when forming the light-emitting layer.
  • the top of the non-display area is provided with at least one parallel groove structure, the groove structure extends along a first direction, and the first direction is In the direction parallel to the boundary line of the display area, the cross section of the groove structure along the second direction is an inverted triangle, and the second direction is parallel to the direction where the substrate is located and perpendicular to the first direction.
  • the present invention also provides a method for manufacturing an OLED device, which includes the following steps:
  • the non-display area being composed of a flexible substrate that can be bent, the flexible substrate is bent toward a second surface of the substrate, the second surface and the first surface Opposite, located on the back of the first surface; wherein, at least one groove structure is provided at an edge of the non-display area adjacent to the display area, the groove structure extends along a first direction, the first direction Is a direction parallel to the boundary between the display area and the non-display area;
  • a packaging structure covering the display area and the non-display area is formed, and the packaging structure includes an inorganic thin film covering the display area, the non-display area and the groove structure.
  • the depth of the groove structure is less than or equal to two thirds of the thickness of the non-display area; wherein,
  • the cross-section of the groove structure along the second direction is an inverted triangle, and the second direction is parallel to the direction where the substrate is located and perpendicular to the first direction; wherein, an apex angle of the inverted triangle is located at The boundary between the display area and the non-display area; or,
  • the cross section of the groove structure along the second direction is a positive trapezoid, and the second direction is parallel to the direction where the substrate is located and perpendicular to the first direction; wherein, the trapezoid is an isosceles trapezoid, and the The symmetry axis of the trapezoid is located on the boundary between the display area and the non-display area.
  • the non-display area has a laminated structure
  • the laminated structure includes at least: an organic deep hole layer, the organic deep hole layer includes deep holes penetrating the substrate, and a flexible organic material is used Filling the deep hole to enhance the flexibility of the non-display area; a metal layer above the organic deep hole layer to form a metal trace with an electrical connection function; a planarization layer above the metal layer , Used to planarize the metal layer; and a support pillar located above the metal layer, used to support the mask used when forming the light-emitting layer.
  • the top of the non-display area is provided with at least one parallel groove structure, the groove structure extends along a first direction, and the first direction is In the direction parallel to the boundary line of the display area, the cross section of the groove structure along the second direction is an inverted triangle, and the second direction is parallel to the direction where the substrate is located and perpendicular to the first direction.
  • At least one groove structure is provided at the edge of the display area adjacent to the display area, so that the cracks of the inorganic film due to bending are restricted in the groove structure, so that the cracks will not display
  • the area expands to protect the bending area while avoiding the cracks that affect the display area.
  • the present invention further provides at least one parallel groove structure on the top of the non-display area to form wrinkles on the top of the display area. During bending, the wrinkled region is flattened, so that part of the stress due to the deformation of the bent region is relieved, so that the inorganic film as a protective layer is not easily broken.
  • FIG. 1 is a schematic structural diagram of an OLED device in a specific embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of an OLED device in another specific embodiment of the present invention.
  • FIG. 3 is an enlarged schematic diagram of the groove structure in FIG. 2;
  • FIG. 4 is an enlarged schematic diagram of a groove structure in another specific embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of an OLED device in a specific embodiment of the present invention.
  • the invention provides an OLED device and a manufacturing method thereof to solve the technical problem that the packaging structure of the OLED bending area in the prior art is prone to cracks.
  • the present invention provides a An OLED device, including a substrate 210, a display area 100 on the first surface of the substrate 210, non-display areas on both sides of the display area 100, and a packaging structure covering the display area 100 and the non-display area;
  • the non-display area is composed of a flexible substrate that can be bent, and the flexible substrate is bent toward the second surface of the substrate 210, and the second surface is opposite to the first surface and is located on the back of the first surface;
  • At least one groove structure 270 is provided at an edge of the non-display area adjacent to the display area 100, the groove structure 270 extends along a first direction, the first direction is the same as the display area 100 The direction parallel to the boundary of the non-display area;
  • the packaging structure includes an inorganic film 280 covering the display area 100, the non-display area and the groove structure 270.
  • the non-display area is a stacked structure, and the stacked structure includes at least an organic deep hole layer 220, the organic deep hole layer includes deep holes penetrating the substrate 210, and the flexible organic material is used to fill the structure Deep holes for enhancing the flexibility of the non-display area; a metal layer 230 above the organic deep hole layer 220 for forming metal traces with electrical connection function; a first flat layer above the metal layer 230
  • the planarization layer 240 and the second planarization layer 250 are used to planarize the metal layer 230; and the support pillar 260 located above the metal layer is used to support the mask used when forming the light emitting layer.
  • the depth of the groove structure 270 is less than or equal to two thirds of the thickness of the non-display area; the cross section of the groove structure 270 in the second direction is an inverted triangle, so The second direction is parallel to the direction in which the substrate 210 is located and perpendicular to the first direction; wherein, an apex angle of the inverted triangle is located on the boundary line between the display area 100 and the non-display area.
  • the design of the inverted triangle groove structure can ensure that the crack is controlled at the vertex position of the inverted triangle when bending, and will not extend to the display area in the longitudinal direction of the device, which affects the packaging effect of the display area.
  • the cross-section of the groove structure 270 along the second direction is a positive trapezoid, and the second direction is parallel to the direction where the substrate 210 is located and is parallel to the first One direction is vertical; wherein, the trapezoid is an isosceles trapezoid, and the symmetry axis of the trapezoid is located on the boundary line between the display area 100 and the non-display area.
  • the inner walls on both sides of the groove structure 270 are difficult to form a uniform thin film due to an excessive angle, and even film formation is impossible, so that an inorganic thin film is formed only on the bottom of the groove.
  • the bending position is the middle position of the bottom of the groove structure. Since the inner walls on both sides cannot be formed into a film, when the inorganic film on the lower opening cracks, it does not cause cracks on the inorganic films on both sides of the upper opening, thereby ensuring the integrity of the inorganic film on the display area.
  • FIG. 2 is a schematic structural diagram of an inorganic thin film-covered OLED device in a specific embodiment of the present invention, wherein the number of the inorganic thin film 280 is at least one layer, and the material is silicon nitride, silicon oxynitride, Any one of silicon carbonitride, silicon oxide, and aluminum oxide.
  • FIG. 5 is a schematic structural diagram of an OLED device without an inorganic thin film in a specific embodiment of the present invention.
  • at least one parallel groove structure 290 is provided on the top of the non-display area, the groove structure 290 extends along a first direction, the first direction is the same as that of the display area 100 and the non-display area
  • the cross-section of the groove structure 290 along the second direction is an inverted triangle
  • the second direction is parallel to the direction in which the substrate 210 is located and perpendicular to the first direction. Since the surface of the top of the non-display area is zigzag, the inorganic thin film at this place is wrinkled. When bent, the wrinkled inorganic film is unfolded, which reduces the tensile stress due to deformation and makes it less likely to break.
  • the present invention also provides a method for manufacturing an OLED device, which includes the following steps:
  • a non-display area surrounding the display area 100 is formed.
  • the non-display area is composed of a flexible substrate that can be bent, and the flexible substrate is bent toward the second surface of the substrate 210.
  • a surface is opposite to the back of the first surface; wherein at least one groove structure 270 is provided at an edge of the non-display area adjacent to the display area 100, the groove structure 270 extends along the first direction, The first direction is a direction parallel to the boundary between the display area 100 and the non-display area;
  • a packaging structure covering the display area 100 and the non-display area is formed.
  • the packaging structure includes an inorganic thin film 280 covering the display area 100, the non-display area, and the groove structure 270.
  • the non-display area is a stacked structure, and the stacked structure includes at least an organic deep hole layer 220, the organic deep hole layer includes deep holes penetrating the substrate 210, and the flexible organic material is used to fill the structure Deep holes for enhancing the flexibility of the non-display area; a metal layer 230 above the organic deep hole layer 220 for forming metal traces with electrical connection function; a first flat layer above the metal layer 230
  • the planarization layer 240 and the second planarization layer 250 are used to planarize the metal layer 230; and the support pillar 260 located above the metal layer is used to support the mask used when forming the light emitting layer.
  • the depth of the groove structure 270 is less than or equal to two thirds of the thickness of the non-display area; wherein, as shown in FIG. 3, the cross section of the groove structure 270 along the second direction is Inverted triangle, the second direction is parallel to the direction in which the substrate 210 is located and perpendicular to the first direction; wherein, an apex angle of the inverted triangle is located on the boundary line between the display area 100 and the non-display area .
  • the cross-section of the groove structure 270 along the second direction is a positive trapezoid, and the second direction is parallel to the direction in which the substrate 210 is located and is The first direction is perpendicular; wherein, the trapezoid is an isosceles trapezoid, and the symmetry axis of the trapezoid is located on the boundary line between the display area 100 and the non-display area.
  • FIG. 5 is a schematic structural diagram of an OLED device without an inorganic thin film in a specific embodiment of the present invention.
  • at least one parallel groove structure 290 is provided on the top of the non-display area, the groove structure 290 extends along a first direction, the first direction is the same as that of the display area 100 and the non-display area
  • the cross-section of the groove structure 290 along the second direction is an inverted triangle
  • the second direction is parallel to the direction in which the substrate 210 is located and perpendicular to the first direction. Since the surface of the top of the non-display area is zigzag, the inorganic thin film at this place is wrinkled. When bent, the wrinkled inorganic film is unfolded, which reduces the tensile stress due to deformation and makes it less likely to break.
  • At least one groove structure is provided at the edge of the display area adjacent to the display area, so that the cracks of the inorganic film due to bending are restricted in the groove structure, so that the cracks will not display
  • the area expands to protect the bending area while avoiding the cracks that affect the display area.
  • the present invention further provides at least one parallel groove structure on the top of the non-display area to form wrinkles on the top of the display area. During bending, the wrinkled region is flattened, so that part of the stress due to the deformation of the bent region is relieved, so that the inorganic film as a protective layer is not easily broken.

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Abstract

一种OLED装置及其制作方法，所述OLED装置包括基板（210）、显示区（100）、非显示区、以及封装结构；其中，所述非显示区由可弯折的柔性衬底构成，所述柔性衬底朝向所述基板（210）的第二表面弯曲；所述非显示区与所述显示区（100）相邻的边缘处设置有至少一个凹槽结构（270），所述凹槽结构（270）沿着第一方向延伸，所述第一方向为与所述显示区（100）和非显示区的交界线平行的方向。

Description

OLED装置及其制作方法 技术领域
本发明涉及电子显示领域，尤其涉及一种OLED装置及其制作方法。
 背景技术
为了进一步增大OLED显示屏的屏占比，即显示区的面积与显示屏面积的比值，本领域的技术人员提出了可弯曲边框，即对显示屏的非显示区域进行挖孔设计，然后进行金属走线布局和有机层涂覆，之后将所述非显示区域向下弯折，从而减小非显示区在显示屏上的投影面积，从而提高屏占比。
 技术问题
通常，弯折区域的有机层会暴露在大气中，其表面不会进行封装处理。这是由于用于封装的无机薄膜具有较差的延展性，在弯折时容易产生裂纹，如果所述裂纹扩散至显示区，则会造成屏幕损坏。但如果直接将有机层暴露在大气中，则下层金属容易被水汽腐蚀，缩短OLED器件的使用寿命。
 技术解决方案
本发明提供一种OLED器件及其制作方法，以解决现有技术中OLED弯折区的封装结构易产生裂痕的技术问题。
具体的，本发明提供了一种OLED装置，其包括基板、位于所述基板第一表面上的显示区、位于所述显示区两侧的非显示区、以及覆盖所述显示区和非显示区的封装结构；其中，所述非显示区由可弯折的柔性衬底构成，所述柔性衬底朝向所述基板的第二表面弯曲，所述第二表面与第一表面相对，位于第一表面背面；所述非显示区与所述显示区相邻的边缘处设置有至少一个凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向；所述封装结构包括覆盖所述显示区、非显示区和所述凹槽结构的无机薄膜；其中，
所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述倒三角形的一个顶角位于所述显示区和非显示区的交界线上。
根据本发明的其中一个方面，所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；所述凹槽结构沿第二方向的横截面为正梯形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述梯形为等腰梯形，且所述梯形的对称轴位于所述显示区和非显示区的交界线上。
根据本发明的其中一个方面，所述无机薄膜的数量为至少一层，其材料为氮化硅、氮氧化硅、碳氮化硅、氧化硅、氧化铝中的任意一种。
根据本发明的其中一个方面，所述非显示区域为叠层结构，所述叠层结构至少包括：有机深孔层，所述有机深孔层包括贯穿所述基板的深孔，并用柔性有机材料填充所述深孔，用于增强非显示区的柔韧性；位于所述有机深孔层上方的金属层，用于形成具有电连接功能的金属走线；位于所述金属层上方的平坦化层，用于对所述金属层进行平坦化；以及位于所述金属层上方的支撑柱，用于支撑形成发光层时使用的掩膜。
根据本发明的其中一个方面，所述非显示区域的顶部设置有至少一条平行的凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向，所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直。
具体的，本发明提供了一种OLED装置，其包括基板、位于所述基板第一表面上的显示区、位于所述显示区两侧的非显示区、以及覆盖所述显示区和非显示区的封装结构；其中，所述非显示区由可弯折的柔性衬底构成，所述柔性衬底朝向所述基板的第二表面弯曲，所述第二表面与第一表面相对，位于第一表面背面；所述非显示区与所述显示区相邻的边缘处设置有至少一个凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向；所述封装结构包括覆盖所述显示区、非显示区和所述凹槽结构的无机薄膜。
根据本发明的其中一个方面，所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述倒三角形的一个顶角位于所述显示区和非显示区的交界线上。
根据本发明的其中一个方面，所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；所述凹槽结构沿第二方向的横截面为正梯形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述梯形为等腰梯形，且所述梯形的对称轴位于所述显示区和非显示区的交界线上。
根据本发明的其中一个方面，所述无机薄膜的数量为至少一层，其材料为氮化硅、氮氧化硅、碳氮化硅、氧化硅、氧化铝中的任意一种。
根据本发明的其中一个方面，所述非显示区域为叠层结构，所述叠层结构至少包括：有机深孔层，所述有机深孔层包括贯穿所述基板的深孔，并用柔性有机材料填充所述深孔，用于增强非显示区的柔韧性；位于所述有机深孔层上方的金属层，用于形成具有电连接功能的金属走线；位于所述金属层上方的平坦化层，用于对所述金属层进行平坦化；以及位于所述金属层上方的支撑柱，用于支撑形成发光层时使用的掩膜。
根据本发明的其中一个方面，所述非显示区域的顶部设置有至少一条平行的凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向，所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直。
相应的，本发明还提供了一种OLED装置的制作方法，其中，包括以下步骤：
提供基板；
形成位于所述基板第一表面上的显示区；
形成环绕所述显示区的非显示区，所述非显示区由可弯折的柔性衬底构成，所述柔性衬底朝向所述基板的第二表面弯曲，所述第二表面与第一表面相对，位于第一表面背面；其中，所述非显示区与所述显示区相邻的边缘处设置有至少一个凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向；
形成覆盖所述显示区和非显示区的封装结构，所述封装结构包括覆盖所述显示区、非显示区和所述凹槽结构的无机薄膜。
根据本发明的其中一个方面，所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；其中，
所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述倒三角形的一个顶角位于所述显示区和非显示区的交界线上；或者，
所述凹槽结构沿第二方向的横截面为正梯形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述梯形为等腰梯形，且所述梯形的对称轴位于所述显示区和非显示区的交界线上。
根据本发明的其中一个方面，所述非显示区域为叠层结构，所述叠层结构至少包括：有机深孔层，所述有机深孔层包括贯穿所述基板的深孔，并用柔性有机材料填充所述深孔，用于增强非显示区的柔韧性；位于所述有机深孔层上方的金属层，用于形成具有电连接功能的金属走线；位于所述金属层上方的平坦化层，用于对所述金属层进行平坦化；以及位于所述金属层上方的支撑柱，用于支撑形成发光层时使用的掩膜。
根据本发明的其中一个方面，所述非显示区域的顶部设置有至少一条平行的凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向，所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直。
 有益效果
本发明通过在显示区与所述显示区相邻的边缘处设置有至少一个凹槽结构，从而将所述无机薄膜由于弯折而产生的裂纹限制在凹槽结构中，使裂纹不会向显示区扩张，从而在对弯折区进行保护的同时避免其产生影响显示区的裂纹。同时，本发明进一步在非显示区的顶部设置有至少一条平行的凹槽结构，在所述显示区顶部形成皱褶。在弯折时，所述皱褶区域被展平，从而消解一部分由于弯折区的形变而产生的应力，使作为保护层的无机薄膜不易断裂。
 附图说明
图1为本发明一个具体实施例中的OLED器件的结构示意图；
图2为本发明另一个具体实施例中的OLED器件的结构示意图；
图3为图2中的凹槽结构的放大示意图；
图4为本发明另一个具体实施例中的凹槽结构的放大示意图；
图5为本发明一个具体实施例中的OLED器件的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明提供一种OLED器件及其制作方法，以解决现有技术中OLED弯折区的封装结构易产生裂痕的技术问题。
具体的，参见图1，本发明提供了一种      OLED装置，其包括基板210、位于所述基板210第一表面上的显示区100、位于所述显示区100两侧的非显示区、以及覆盖所述显示区100和非显示区的封装结构；其中，所述非显示区由可弯折的柔性衬底构成，所述柔性衬底朝向所述基板210的第二表面弯曲，所述第二表面与第一表面相对，位于第一表面背面；所述非显示区与所述显示区100相邻的边缘处设置有至少一个凹槽结构270，所述凹槽结构270沿着第一方向延伸，所述第一方向为与所述显示区100和非显示区的交界线平行的方向；所述封装结构包括覆盖所述显示区100、非显示区和所述凹槽结构270的无机薄膜280。
具体的，所述非显示区域为叠层结构，所述叠层结构至少包括：有机深孔层220，所述有机深孔层包括贯穿所述基板210的深孔，并用柔性有机材料填充所述深孔，用于增强非显示区的柔韧性；位于所述有机深孔层220上方的金属层230，用于形成具有电连接功能的金属走线；位于所述金属层230上方的第一平坦化层240和第二平坦化层250，用于对所述金属层230进行平坦化；以及位于所述金属层上方的支撑柱260，用于支撑形成发光层时使用的掩膜。
在本实施例中，参见图3，所述凹槽结构270的深度小于等于所述非显示区厚度的三分之二；所述凹槽结构270沿第二方向的横截面为倒三角形，所述第二方向与所述基板210所在的方向平行且与所述第一方向垂直；其中，所述倒三角形的一个顶角位于所述显示区100和非显示区的交界线上。设计倒三角的凹槽结构可保证在弯折时裂纹控制在倒三角的顶点位置，不会沿器件纵向延伸到显示区，影响显示区的封装效果。
在本发明的另一个实施例中，参见图4，所述凹槽结构270沿第二方向的横截面为正梯形，所述第二方向与所述基板210所在的方向平行且与所述第一方向垂直；其中，所述梯形为等腰梯形，且所述梯形的对称轴位于所述显示区100和非显示区的交界线上。在无机成膜过程中，凹槽结构270两侧内壁由于角度过大难以形成均匀薄膜，甚至无法成膜，从而只在凹槽底部形成无机薄膜。弯折时，弯折位置为凹槽结构底部的中间位置。由于两侧内壁无法成膜，所以当下开口的无机膜出现裂纹时，不会引起上开口两侧无机薄膜出现裂纹，从而保证了显示区的无机薄膜的完整性。
参见图2，图2为本发明一个具体实施例中的覆盖无机薄膜的OLED器件的结构示意图，其中，所述无机薄膜280的数量为至少一层，其材料为氮化硅、氮氧化硅、碳氮化硅、氧化硅、氧化铝中的任意一种。
优选的，参见图5，图5为本发明一个具体实施例中的没有覆盖无机薄膜的OLED器件的结构示意图。其中，所述非显示区域的顶部设置有至少一条平行的凹槽结构290，所述凹槽结构290沿着第一方向延伸，所述第一方向为与所述显示区100和非显示区的交界线平行的方向，所述凹槽结构290沿第二方向的横截面为倒三角形，所述第二方向与所述基板210所在的方向平行且与所述第一方向垂直。由于非显示区域的顶部的表面为锯齿状，使得该处无机薄膜呈褶皱状。弯折时，皱褶状的无机薄膜被展开，从而减小其由于形变而产生的拉应力，使其不易断裂。
相应的，本发明还提供了一种       OLED装置的制作方法，其包括以下步骤：
提供基板210；
形成位于所述基板210第一表面上的显示区100；
形成环绕所述显示区100的非显示区，所述非显示区由可弯折的柔性衬底构成，所述柔性衬底朝向所述基板210的第二表面弯曲，所述第二表面与第一表面相对，位于第一表面背面；其中，所述非显示区与所述显示区100相邻的边缘处设置有至少一个凹槽结构270，所述凹槽结构270沿着第一方向延伸，所述第一方向为与所述显示区100和非显示区的交界线平行的方向；
形成覆盖所述显示区100和非显示区的封装结构，所述封装结构包括覆盖所述显示区100、非显示区和所述凹槽结构270的无机薄膜280。
具体的，所述非显示区域为叠层结构，所述叠层结构至少包括：有机深孔层220，所述有机深孔层包括贯穿所述基板210的深孔，并用柔性有机材料填充所述深孔，用于增强非显示区的柔韧性；位于所述有机深孔层220上方的金属层230，用于形成具有电连接功能的金属走线；位于所述金属层230上方的第一平坦化层240和第二平坦化层250，用于对所述金属层230进行平坦化；以及位于所述金属层上方的支撑柱260，用于支撑形成发光层时使用的掩膜。
在本实施例中，所述凹槽结构270的深度小于等于所述非显示区厚度的三分之二；其中，如图3所示，所述凹槽结构270沿第二方向的横截面为倒三角形，所述第二方向与所述基板210所在的方向平行且与所述第一方向垂直；其中，所述倒三角形的一个顶角位于所述显示区100和非显示区的交界线上。
在本发明的另一个实施例中，如图4所示，所述凹槽结构270沿第二方向的横截面为正梯形，所述第二方向与所述基板210所在的方向平行且与所述第一方向垂直；其中，所述梯形为等腰梯形，且所述梯形的对称轴位于所述显示区100和非显示区的交界线上。
优选的，参见图5，图5为本发明一个具体实施例中的没有覆盖无机薄膜的OLED器件的结构示意图。其中，所述非显示区域的顶部设置有至少一条平行的凹槽结构290，所述凹槽结构290沿着第一方向延伸，所述第一方向为与所述显示区100和非显示区的交界线平行的方向，所述凹槽结构290沿第二方向的横截面为倒三角形，所述第二方向与所述基板210所在的方向平行且与所述第一方向垂直。由于非显示区域的顶部的表面为锯齿状，使得该处无机薄膜呈褶皱状。弯折时，皱褶状的无机薄膜被展开，从而减小其由于形变而产生的拉应力，使其不易断裂。
本发明通过在显示区与所述显示区相邻的边缘处设置有至少一个凹槽结构，从而将所述无机薄膜由于弯折而产生的裂纹限制在凹槽结构中，使裂纹不会向显示区扩张，从而在对弯折区进行保护的同时避免其产生影响显示区的裂纹。同时，本发明进一步在非显示区的顶部设置有至少一条平行的凹槽结构，在所述显示区顶部形成皱褶。在弯折时，所述皱褶区域被展平，从而消解一部分由于弯折区的形变而产生的应力，使作为保护层的无机薄膜不易断裂。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (15)

  1. 一种OLED装置，其中，包括基板、位于所述基板第一表面上的显示区、位于所述显示区两侧的非显示区、以及覆盖所述显示区和非显示区的封装结构；其中，
    所述非显示区由可弯折的柔性衬底构成，所述柔性衬底朝向所述基板的第二表面弯曲，所述第二表面与第一表面相对，位于第一表面背面；
    所述非显示区与所述显示区相邻的边缘处设置有至少一个凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向；
    所述封装结构包括覆盖所述显示区、非显示区和所述凹槽结构的无机薄膜；其中，
    所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述倒三角形的一个顶角位于所述显示区和非显示区的交界线上。
  2. 根据权利要求1所述的OLED装置，其中，所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；所述凹槽结构沿第二方向的横截面为正梯形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述梯形为等腰梯形，且所述梯形的对称轴位于所述显示区和非显示区的交界线上。
  3. 根据权利要求1所述的OLED装置，其中，所述无机薄膜的数量为至少一层，其材料为氮化硅、氮氧化硅、碳氮化硅、氧化硅、氧化铝中的任意一种。
  4. 根据权利要求1所述的OLED装置，其中，所述非显示区域为叠层结构，所述叠层结构至少包括：
    有机深孔层，所述有机深孔层包括贯穿所述基板的深孔，并用柔性有机材料填充所述深孔，用于增强非显示区的柔韧性；
    位于所述有机深孔层上方的金属层，用于形成具有电连接功能的金属走线；
    位于所述金属层上方的平坦化层，用于对所述金属层进行平坦化；以及
    位于所述金属层上方的支撑柱，用于支撑形成发光层时使用的掩膜。
  5. 根据权利要求1所述的OLED装置，其中，所述非显示区域的顶部设置有至少一条平行的凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向，所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直。
  6. 一种OLED装置，其中，包括基板、位于所述基板第一表面上的显示区、位于所述显示区两侧的非显示区、以及覆盖所述显示区和非显示区的封装结构；其中，
    所述非显示区由可弯折的柔性衬底构成，所述柔性衬底朝向所述基板的第二表面弯曲，所述第二表面与第一表面相对，位于第一表面背面；
    所述非显示区与所述显示区相邻的边缘处设置有至少一个凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向；
    所述封装结构包括覆盖所述显示区、非显示区和所述凹槽结构的无机薄膜。
  7. 根据权利要求6所述的OLED装置，其中，所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述倒三角形的一个顶角位于所述显示区和非显示区的交界线上。
  8. 根据权利要求6所述的OLED装置，其中，所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；所述凹槽结构沿第二方向的横截面为正梯形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述梯形为等腰梯形，且所述梯形的对称轴位于所述显示区和非显示区的交界线上。
  9. 根据权利要求6所述的OLED装置，其中，所述无机薄膜的数量为至少一层，其材料为氮化硅、氮氧化硅、碳氮化硅、氧化硅、氧化铝中的任意一种。
  10. 根据权利要求6所述的OLED装置，其中，所述非显示区域为叠层结构，所述叠层结构至少包括：
    有机深孔层，所述有机深孔层包括贯穿所述基板的深孔，并用柔性有机材料填充所述深孔，用于增强非显示区的柔韧性；
    位于所述有机深孔层上方的金属层，用于形成具有电连接功能的金属走线；
    位于所述金属层上方的平坦化层，用于对所述金属层进行平坦化；以及
    位于所述金属层上方的支撑柱，用于支撑形成发光层时使用的掩膜。
  11. 根据权利要求6所述的OLED装置，其中，所述非显示区域的顶部设置有至少一条平行的凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向，所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直。
  12. 一种OLED装置的制作方法，其中，包括以下步骤：
    提供基板；
    形成位于所述基板第一表面上的显示区；
    形成环绕所述显示区的非显示区，所述非显示区由可弯折的柔性衬底构成，所述柔性衬底朝向所述基板的第二表面弯曲，所述第二表面与第一表面相对，位于第一表面背面；其中，所述非显示区与所述显示区相邻的边缘处设置有至少一个凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向；
    形成覆盖所述显示区和非显示区的封装结构，所述封装结构包括覆盖所述显示区、非显示区和所述凹槽结构的无机薄膜。
  13. 根据权利要求12所述的OLED装置的制作方法，其中，所述凹槽结构的深度小于等于所述非显示区厚度的三分之二；其中，
    所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述倒三角形的一个顶角位于所述显示区和非显示区的交界线上；或者，
    所述凹槽结构沿第二方向的横截面为正梯形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直；其中，所述梯形为等腰梯形，且所述梯形的对称轴位于所述显示区和非显示区的交界线上。
  14. 根据权利要求12所述的OLED装置的制作方法，其中，所述非显示区域为叠层结构，所述叠层结构至少包括：
    有机深孔层，所述有机深孔层包括贯穿所述基板的深孔，并用柔性有机材料填充所述深孔，用于增强非显示区的柔韧性；
    位于所述有机深孔层上方的金属层，用于形成具有电连接功能的金属走线；
    位于所述金属层上方的平坦化层，用于对所述金属层进行平坦化；以及
    位于所述金属层上方的支撑柱，用于支撑形成发光层时使用的掩膜。
  15. 根据权利要求12所述的OLED装置的制作方法，其中，所述非显示区域的顶部设置有至少一条平行的凹槽结构，所述凹槽结构沿着第一方向延伸，所述第一方向为与所述显示区和非显示区的交界线平行的方向，所述凹槽结构沿第二方向的横截面为倒三角形，所述第二方向与所述基板所在的方向平行且与所述第一方向垂直。
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