WO2020116497A1 - Procédé de retrait d'un ruban adhésif sensible à la pression, ruban adhésif sensible à la pression et composant électronique - Google Patents

Procédé de retrait d'un ruban adhésif sensible à la pression, ruban adhésif sensible à la pression et composant électronique Download PDF

Info

Publication number
WO2020116497A1
WO2020116497A1 PCT/JP2019/047375 JP2019047375W WO2020116497A1 WO 2020116497 A1 WO2020116497 A1 WO 2020116497A1 JP 2019047375 W JP2019047375 W JP 2019047375W WO 2020116497 A1 WO2020116497 A1 WO 2020116497A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive tape
adhesive layer
peeling
Prior art date
Application number
PCT/JP2019/047375
Other languages
English (en)
Japanese (ja)
Inventor
春 小谷野
嘉謨 郭
諒 小宮山
泰志 石堂
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Publication of WO2020116497A1 publication Critical patent/WO2020116497A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive

Definitions

  • the present invention relates to a method for peeling an adhesive tape that is less likely to be damaged when the component fixed by the adhesive tape is collected, an adhesive tape used for the peeling method, and an electronic component using the adhesive tape used for the peeling method.
  • a double-sided adhesive tape is used for assembly.
  • a cover panel for protecting the surface of the mobile electronic device is bonded to the touch panel module or the display panel module, the touch panel module and the display panel module are bonded, or the sensor or the battery pack is fixed.
  • a double-sided pressure-sensitive adhesive tape is used for this purpose (for example, Patent Documents 1 and 2).
  • the double-sided adhesive tape is also used for fixing vehicle parts (for example, a vehicle-mounted panel) to the vehicle body.
  • the present invention uses a method of peeling an adhesive tape in which a component is less likely to be damaged when collecting a component fixed by the adhesive tape, an adhesive tape used in the peeling method, and an adhesive tape used in the peeling method.
  • the purpose is to provide electronic components.
  • the method for peeling off an adhesive tape of the present invention is, in the pressure-sensitive adhesive layer of a laminate in which an adhesive tape having a pressure-sensitive adhesive layer and an adherend are bonded together, after contacting a peeling liquid, the adherend and the adherend. Peel off the adhesive tape.
  • the release liquid By bringing the release liquid into contact with the adhesive layer of the adhesive tape, the release liquid permeates between the adherend and the adhesive layer, reducing the adhesive strength of the adhesive tape and suppressing damage to the adherend.
  • the adherend can be peeled off from the adhesive tape.
  • the specific method for peeling off the adhesive tape is not particularly limited.
  • the release liquid is poured into the gap between the adherend and the substrate, and the pressure-sensitive adhesive layer and the release liquid are brought into contact with each other, and thereafter.
  • Examples include a method of inserting a pick or the like into a gap and lifting.
  • the time for contacting the stripper is not particularly limited, and the time for which the stripper sufficiently penetrates can be appropriately selected according to the state of the adherend, but considering the influence of the stripper on the adherend, It is preferably 3 seconds or more and 60 seconds or less.
  • the pressure-sensitive adhesive layer contains a styrene elastomer.
  • a styrene-based elastomer for the pressure-sensitive adhesive layer, the adherend can be fixed with sufficient adhesive force. Further, by bringing the pressure-sensitive adhesive layer into contact with the peeling liquid, the pressure-sensitive adhesive force can be reduced, and the pressure-sensitive adhesive tape can be peeled off while suppressing damage to the adherend.
  • the styrene elastomer is not particularly limited, and examples thereof include styrene ethylene propylene styrene block copolymer (SEPS), hydrogenated styrene butadiene rubber (HSBR), styrene ethylene butylene styrene block copolymer (SEBS), styrene ethylene propylene block.
  • SEPS styrene ethylene propylene styrene block copolymer
  • HSBR hydrogenated styrene butadiene rubber
  • SEBS styrene ethylene butylene styrene block copolymer
  • SEP Styrene Ethylene Butylene Block Copolymer
  • SEB Styrene Isoprene Block Copolymer
  • SI Styrene Isoprene Styrene Block Copolymer
  • SI Styrene Isoprene Styrene Block Copolymer
  • SB Styrene Butadiene Block Copolymer
  • SBS butadiene styrene block copolymer
  • the styrene-based elastomer is preferably a hydrogenated styrene-based elastomer because it is easy to adjust the viscoelasticity to an appropriate degree in the design of the polymer primary structure.
  • the hydrogenated styrene elastomer include styrene ethylene propylene styrene block copolymer (SEPS), hydrogenated styrene butadiene rubber (HSBR), and styrene ethylene butylene styrene block copolymer (SEBS).
  • the styrene-based elastomer preferably has a hydrogenation rate of 95% or more, and more preferably 96% or more, from the viewpoint of further suppressing contamination of the adherend.
  • the hydrogenation rate of the styrene-based elastomer is at least the above lower limit, it is possible to further suppress the contamination of the adherend.
  • the hydrogenation rate of the styrene elastomer is usually 100% or less.
  • the styrene elastomer preferably has a structure in which a spherical phase and other phases are phase-separated.
  • Styrene-based elastomer is composed of a rubber segment that exhibits rubber elasticity and a styrene segment.Since the rubber segment and the styrene segment have low compatibility, the rubber segment and the styrene segment have a spherical phase and other phases in the molecule.
  • a non-uniform phase-separated structure that exists as a separated structure may be formed.
  • the rubber segment interacts with a material having a low SP value
  • the styrene segment interacts with a material having a high SP value.
  • the adhesive force of the agent layer can be improved.
  • there is a trade-off relationship between the adhesive force and the peeling property and therefore, when a large amount of tacky fire or the like is used to improve the adhesive force, the peeling performance also deteriorates.
  • the effect of improving the adhesive force by the phase separation hardly affects the releasability when the above-mentioned release liquid is brought into contact, so that both high adhesive force and releasability can be achieved.
  • the preferred lower limit of the diameter of the spherical phase is 5 nm, and the more preferred lower limit thereof is 6 nm.
  • the upper limit of the diameter of the spherical phase is not particularly limited, but is about 100 nm from the viewpoint of the stability of the spherical structure.
  • the styrene elastomer preferably has a styrene content of 5% by weight or more and 40% by weight or less.
  • a styrene content of 5% by weight or more and 40% by weight or less.
  • the shape of the phase separation structure can be easily made spherical, and the adhesive force and the releasability when brought into contact with the release liquid can be further enhanced.
  • the styrene content of the styrene elastomer is more A preferred lower limit is 7% by weight, and a more preferred upper limit is 35% by weight.
  • the pressure-sensitive adhesive layer preferably contains tacky fire.
  • tacky fire is not particularly limited, but it is preferable to be a hydrogenated petroleum-based and/or terpene phenol-based tacky fire, since it is possible to further improve the adhesive strength, and it is more preferable to be a hydrogenated petroleum-based tacky fire. preferable.
  • an alicyclic saturated hydrocarbon tacky fire is more preferable. This is because the alicyclic saturated hydrocarbon tacky fire, which has a low affinity with the stripping solution, can be used to more effectively penetrate the stripping solution into the interface between the adhesive tape and the adherend. The peeling can be made more effective.
  • the hydrogenation rate of the tacky fire is preferably 95% or more, more preferably 96% or more.
  • the upper limit of the hydrogenation rate of the tacky fire is usually 100% or less.
  • the preferable lower limit of the content of the tacky fire with respect to 100 parts by weight of the styrene-based elastomer is 10 parts by weight, and the more preferable lower limit is 20 parts by weight.
  • the preferable upper limit of the content of the tacky fire is 100 parts by weight, and the more preferable upper limit is 100 parts by weight, relative to 100 parts by weight of the styrene-based elastomer.
  • the pressure-sensitive adhesive layer may further contain additives such as a softening agent, an antioxidant, an anti-adhesive agent, and a release agent, if necessary.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but the preferred lower limit is 5 ⁇ m, the more preferred lower limit is 8 ⁇ m, the still more preferred lower limit is 10 ⁇ m, the preferred upper limit is 500 ⁇ m, and the more preferred upper limit is 300 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer is within this range, the weight of the electronic component including the pressure-sensitive adhesive tape can be reduced, and the pressure-sensitive adhesive tape having sufficient adhesive force and handleability can be obtained.
  • the adhesive tape may be a support type having a base material layer or a non-support type having no base material layer.
  • the pressure-sensitive adhesive tape has a base material layer, it is preferably a double-sided pressure-sensitive adhesive tape having a base material layer and a pressure-sensitive adhesive layer on both surfaces of the base material layer.
  • the raw material for the base material layer is not particularly limited, and examples thereof include polyethylene, polypropylene, polyethylene terephthalate, ⁇ -olefin copolymer, polyurethane, and styrene elastomer.
  • the raw material of the base material layer is polyethylene, polypropylene, from the viewpoint of becoming a pressure-sensitive adhesive tape having more excellent tensile rupture strength and tensile rupture elongation, and suppressing delamination between the base material layer and the pressure-sensitive adhesive layer. It preferably contains at least one selected from the group consisting of polyethylene terephthalate, ⁇ -olefin copolymer, polyester and polyurethane. Further, it is more preferable to contain at least one selected from the group consisting of polyethylene, polypropylene and polyethylene terephthalate.
  • the raw material of the base material layer may be only one kind or two or more kinds.
  • the thickness of the base material layer is not particularly limited, but a preferred lower limit is 10 ⁇ m, and a more preferred lower limit is 20 ⁇ m. When the thickness of the base material layer is equal to or more than the above lower limit, the strength of the obtained adhesive tape is improved, and it becomes difficult to tear the adhesive tape during peeling.
  • the upper limit of the thickness of the base material layer is not particularly limited, but is preferably 1 mm or less. When the thickness of the base material layer is equal to or less than the upper limit, the weight of the electronic component including the pressure-sensitive adhesive tape can be reduced, and the double-sided pressure-sensitive adhesive tape having excellent flexibility and handleability can be obtained.
  • the adhesive tape preferably has a peel strength of 8 N/25 mm or more with respect to the stainless steel plate, and a peel strength of 6 N/25 mm or less with respect to the stainless steel plate after being immersed in a peeling solution for 30 seconds.
  • the peeling strength before being immersed in the peeling solution is 8 N/25 mm or more
  • the adherend can be fixed with sufficient adhesive force.
  • the peel strength after immersion in the peeling solution is 6 N/25 mm or less, damage can be suppressed and the adherend can be peeled from the adhesive tape.
  • the peel strength with respect to the stainless steel plate is more preferably 10 N/25 mm or more, and further preferably 12 N/25 mm or more.
  • the upper limit of the peel strength for the stainless steel plate is not particularly limited, and the higher the better, the better, but the limit is about 35 N/25 mm. Further, from the viewpoint of suppressing damage to the adherend and peeling the adherend from the adhesive tape with a lighter force, the peel strength with respect to the stainless steel plate after being immersed in the peeling liquid for 30 seconds is 4 N/25 mm or less. More preferably, it is more preferably 3 N/25 mm or less.
  • the lower limit of the peel strength with respect to the stainless steel plate after being immersed in the peeling solution for 30 seconds is not particularly limited, and the lower the better, the better, but the limit is about 0.05 N/25 mm.
  • the peel strength is measured by using a stainless steel plate (SUS304) conforming to JIS G4305 and JIS B0601 as an adherend and performing a tensile test in a 180° direction at a peeling speed of 300 mm/min according to JIS Z0237. can do.
  • SUS304 stainless steel plate
  • the pressure-sensitive adhesive layer has a peel strength with respect to a stainless steel plate after being immersed in a peeling liquid having an SP value of 22.0 or less for 30 seconds, which is 0.5 times or less than a peel strength with respect to the stainless steel plate before being immersed in the peeling liquid. Is preferred.
  • the peel strength of the pressure-sensitive adhesive layer after immersion in the peeling solution is preferably 0.2 times or less, and more preferably 0.1 times or less, the peel strength before immersion in the peeling solution.
  • the lower limit of the peeling strength of the pressure-sensitive adhesive layer after immersion in the peeling solution is not particularly limited, and the lower the better, the better.
  • the peeling strength can be adjusted by the type of the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer and the content of additives such as tacky fire.
  • the peel strength of the pressure-sensitive adhesive layer can be measured by the same method as the peel strength.
  • the stripper having the SP value of 22.0 or less the same stripper as described below can be used.
  • the method for producing the pressure-sensitive adhesive tape is not particularly limited, for example, by applying a solution of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer on the release film, and drying, to manufacture a non-support type pressure-sensitive adhesive tape.
  • the pressure-sensitive adhesive tape of the present invention is a support type having a base material layer, a pressure-sensitive adhesive layer is formed separately from the above-mentioned pressure-sensitive adhesive layer, and two pressure-sensitive adhesive layers and a base material layer are bonded to each other. It can be manufactured. Further, it can be produced by a coextrusion laminating method.
  • the coextrusion laminating method is a manufacturing method in which a base material layer and an adhesive layer are simultaneously formed by extruding a base material resin and a pressure sensitive adhesive resin with a coextrusion machine. There is no contamination and the cost is low because the adhesive tape can be manufactured in one step.
  • a transition layer is formed between the base material layer and the pressure-sensitive adhesive layer.
  • the transition layer refers to a layer in which the components of the base material layer and the components of the pressure-sensitive adhesive layer are gradually replaced with each other from the base material layer side to the pressure-sensitive adhesive layer side.
  • the presence of the transition layer was obtained by cutting out a cross section of the double-sided pressure-sensitive adhesive tape using a microtome, making it a test sample for observation, and changing the hardness at the interface between the base material layer and the pressure-sensitive adhesive layer with a scanning probe microscope (SPM). It can be confirmed by observing and the hardness changes continuously. It can also be confirmed by observing a change in the phase separation structure at the interface between the base material layer and the pressure-sensitive adhesive layer with a transmission electron microscope (TEM).
  • SPM scanning probe microscope
  • the pressure-sensitive adhesive layer contains a styrene-based elastomer and has a phase-separated structure having a spherical styrene segment in the molecule
  • the transition layer when the transition layer is present, the spherical styrene segment in the pressure-sensitive adhesive layer approaches the base material layer.
  • the density of spherical styrene segments decreases.
  • the stripper has an SP value of 22.0 or less.
  • the peeling liquid permeates between the pressure-sensitive adhesive layer and the adherend, and the pressure-sensitive adhesive tape It is possible to reduce the adhesive strength of the adherend, suppress the damage to the adherend, and peel the adherend from the adhesive tape. Further, by using the styrene-based elastomer and the release liquid, the styrene-based elastomer is unlikely to dissolve in the release liquid, and the adherend is less likely to be contaminated by the adhesive.
  • the preferable upper limit is 20.0, and the more preferable upper limit is 15.0.
  • the lower limit of the SP value is not particularly limited, but a preferable lower limit is 7.0 and a more preferable lower limit is 9.0 from the viewpoint of further lowering the adhesive force of the pressure-sensitive adhesive tape and making the adherend less likely to be contaminated. ..
  • the SP value is called a solubility parameter (Solubility Parameter), and is an index that can express the ease of dissolution.
  • Solubility Parameter Solubility Parameter
  • the Fedors method RF Fedors, Polym. Eng. Sci., 14(2), 147-154 (1974)
  • the SP value of the mixed solution is obtained by multiplying the SP value of each component by the content ratio of the component and adding them together.
  • the stripping solution is not particularly limited as long as it satisfies the SP value range, and examples thereof include alcohol, ester, and aromatic hydrocarbon.
  • the peeling liquid preferably contains at least one selected from the group consisting of alcohols and esters because the adherend can be peeled off from the adhesive tape while further suppressing the damage to the adherend.
  • the alcohol include methanol, ethanol, propanol, isopropanol and the like, and among them, ethanol and isopropanol are preferable.
  • the ester include ethyl acetate and butyl acetate, and among them, ethyl acetate is preferable.
  • the pressure-sensitive adhesive tape used in the method for peeling off the pressure-sensitive adhesive tape of the present invention is not particularly limited as long as it has a pressure-sensitive adhesive tape containing the styrene elastomer.
  • the pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer containing a styrene-based elastomer and treated with a release liquid having an SP value of 22.0 or less has a peel strength of SP value 22.
  • Adhesive tapes having a peel strength of 0.5 times or less of the pressure-sensitive adhesive tape before being treated with a stripping solution of 0.0 or less are mentioned. Such an adhesive tape is also one aspect of the present invention.
  • the adhesive tape of the present invention has an adhesive layer containing a styrene elastomer.
  • a styrene elastomer As for the specific type of the styrene-based elastomer, the type and content of additives such as tacky fire, and the thickness of the pressure-sensitive adhesive layer, the same one as the pressure-sensitive adhesive layer in the method for peeling the pressure-sensitive adhesive tape of the present invention may be used. it can.
  • the pressure-sensitive adhesive tape of the present invention may be a support type having a base material layer or a non-support type not having a base material layer, but an adherend whose strength is required for the pressure-sensitive adhesive tape When used for, it is preferable to have a base material layer.
  • the type and thickness of the base material layer the same material and thickness as the base material layer in the method for peeling an adhesive tape of the present invention can be used.
  • the adhesive tape of the present invention has a base material layer
  • the adhesive tape of the present invention is preferably an adhesive tape in which an adhesive layer, a base material layer, and a second adhesive layer are laminated in this order.
  • the pressure-sensitive adhesive forming the second pressure-sensitive adhesive layer is not particularly limited, and may be the same as or different from the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer. Of these, an acrylic pressure-sensitive adhesive is preferable because it is easy to satisfy the peel strength described below.
  • the pressure-sensitive adhesive layer has a first surface and a second surface opposite to the first surface, and the first surface has an embossed shape.
  • the first surface is the surface opposite to the surface on which the base material layer is laminated, that is, the surface in contact with the adherend.
  • the 2 surface refers to the surface on which the base material layers are laminated.
  • the embossed shape is formed by a plurality of grooves that are connected from one end to the other side surface of the pressure-sensitive adhesive layer.
  • the embossed shape is composed of a plurality of grooves penetrating in the surface direction of the pressure-sensitive adhesive layer, the peeling liquid permeates the entire first surface of the pressure-sensitive adhesive layer by bringing the peeling liquid into contact with the side surface of the pressure-sensitive adhesive layer. The peelability can be improved.
  • the groove is preferably linear. Since the groove is linear, the peeling liquid is less likely to be caught when passing through the groove, and the peeling liquid can more smoothly permeate the entire first surface. Further, it is preferable that the embossed shape includes a first groove and a second groove that intersects with the first groove. By using a combination of a plurality of grooves that intersect the embossed shape, preferably a plurality of linear grooves that intersect, the stripper can be more evenly and efficiently permeated into the entire first surface. Examples of the shape of such embossing include a lattice shape.
  • the depth of the groove forming the embossed shape is preferably 8 ⁇ m or more. When the depth of the groove forming the embossed shape is within the above range, the peeling liquid can more smoothly permeate the entire first surface. More preferably, the depth of the groove is 10 ⁇ m or more.
  • the upper limit of the depth of the groove is not particularly limited, but when the pressure-sensitive adhesive tape of the present invention does not have a base material layer, the depth is preferably 80% or less of the thickness of the pressure-sensitive adhesive layer, and the base material layer. When it has, it may be the same as the thickness of the pressure-sensitive adhesive layer.
  • the width of the groove forming the embossed shape is preferably 10 ⁇ m or more and 500 ⁇ m or less. When the width of the groove forming the embossed shape is within the above range, the peeling liquid can more smoothly permeate the entire first surface.
  • the width of the groove is more preferably 30 ⁇ m or more, and more preferably 150 ⁇ m or less.
  • the proportion of the grooves forming the embossed shape on the first surface is preferably 10% or more and 50% or less.
  • the area of the groove is more preferably 15% or more, and more preferably 40% or less.
  • the method of forming the embossed shape on the first surface is not particularly limited, and for example, a method of applying a pressure-sensitive adhesive to a release paper having a convex shape in a lattice shape and drying it to transfer the shape, , A release paper having a convex shape in a lattice shape is attached to a molded adhesive tape, and the shape is transferred over a period of time.
  • the pressure-sensitive adhesive layer has a peel strength for a stainless steel plate after being immersed in a peeling solution having an SP value of 22.0 or less for 30 seconds, which is 0.5 times or less of a peel strength for a stainless steel plate before being immersed in the peeling liquid.
  • the peel strength of the pressure-sensitive adhesive layer after immersion in the peeling solution is preferably 0.2 times or less, and more preferably 0.1 times or less, the peel strength before immersion in the peeling solution.
  • the lower limit of the peeling strength of the pressure-sensitive adhesive layer after immersion in the peeling solution is not particularly limited, and the lower the better, the better.
  • the peeling strength can be adjusted by the type of the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer and the content of additives such as tacky fire.
  • the peel strength of the pressure-sensitive adhesive layer can be measured by the same method as the peel strength in the pressure-sensitive adhesive tape peeling method of the present invention. Further, as the peeling liquid having the SP value of 22.0 or less, the same peeling liquid as used in the method for peeling an adhesive tape of the present invention can be used.
  • the pressure-sensitive adhesive layer preferably has a peel strength of 5 N/25 mm or more with respect to stainless steel before being immersed in the peeling liquid having an SP value of 22.0 or less.
  • the peel strength of the pressure-sensitive adhesive layer before immersion in the peeling solution is more preferably 8 N/25 mm or more, further preferably 10 N/25 mm or more.
  • the upper limit of the peel strength of the pressure-sensitive adhesive layer before immersion in the peeling solution is not particularly limited, but is preferably 35 N/25 mm from the viewpoint of handleability.
  • the pressure-sensitive adhesive layer preferably has a peel strength of 3 N/25 mm or less with respect to stainless steel after being immersed in the peeling solution having the SP value of 22.0 or less.
  • the peel strength of the pressure-sensitive adhesive layer after immersion in the peeling solution is within the above range, the pressure-sensitive adhesive tape can be peeled off while further suppressing damage to the adherend.
  • the peel strength of the pressure-sensitive adhesive layer after immersion in the above-mentioned peeling liquid is more preferably 1 N/25 mm or less, and further preferably 0.7 N/25 mm or less.
  • the lower limit of the peeling strength of the pressure-sensitive adhesive layer before immersion in the peeling solution is not particularly limited, but is preferably 0.05 N/25 mm from the viewpoint of balance with the adhesive strength.
  • the second pressure-sensitive adhesive layer has a peel strength with respect to a stainless steel plate after being immersed in a peeling liquid having an SP value of 22.0 or less for 30 seconds that is greater than 0.5 times the peel strength with respect to the stainless steel plate before being immersed in the peeling liquid. Is preferred.
  • peel strength of the second pressure-sensitive adhesive layer can be adjusted by the type of the pressure-sensitive adhesive layer forming the second pressure-sensitive adhesive layer and additives such as tacky fire.
  • the peel strength of the second pressure-sensitive adhesive layer can be measured by the same method as the peel strength in the peeling method of the pressure-sensitive adhesive tape of the present invention. Further, as the peeling liquid having the SP value of 22.0 or less, the same peeling liquid as used in the method for peeling an adhesive tape of the present invention can be used.
  • the thickness of the second pressure-sensitive adhesive layer is not particularly limited, but the preferred lower limit is 5 ⁇ m, the more preferred lower limit is 8 ⁇ m, the still more preferred lower limit is 10 ⁇ m, the preferred upper limit is 200 ⁇ m, and the more preferred upper limit is 150 ⁇ m.
  • the thickness of the second pressure-sensitive adhesive layer is within this range, the weight of the electronic component including the pressure-sensitive adhesive tape can be reduced, and the pressure-sensitive adhesive tape having sufficient pressure-sensitive adhesive force and handleability can be obtained.
  • the pressure-sensitive adhesive layer has a release film having protrusions corresponding to the embossed grooves on the first surface.
  • a release film having a convex portion that fills the embossed groove it is possible to prevent the groove from being crushed or deformed during storage or transportation, and thus it is possible to suppress deterioration of the peeling performance. it can.
  • the material of the release film is not particularly limited, and for example, a release film of a normal adhesive tape such as a release-treated polyethylene terephthalate film, release-treated clean paper or paper laminated with polyethylene or polypropylene. The materials used as are.
  • the method for producing the release film is not particularly limited, and examples thereof include extrusion film formation.
  • the thickness of the pressure-sensitive adhesive tape is not particularly limited, but the preferred lower limit is 20 ⁇ m, the more preferred lower limit is 30 ⁇ m, the preferred upper limit is 1.7 mm, the more preferred upper limit is 500 ⁇ m, and the still more preferred upper limit is 250 ⁇ m.
  • the thickness of the pressure-sensitive adhesive tape is in the above range, the weight of the electronic component including the pressure-sensitive adhesive tape can be reduced, and the pressure-sensitive adhesive tape having sufficient adhesive force and handleability can be obtained.
  • the method for producing the pressure-sensitive adhesive tape of the present invention is not particularly limited, for example, by applying a solution of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer on the release film produced by the above method, and drying, a non-support type It can be manufactured as an adhesive tape.
  • the pressure-sensitive adhesive tape of the present invention is a support type having a base material layer
  • a solution of the pressure-sensitive adhesive constituting the second pressure-sensitive adhesive layer is applied on a release film, and dried, separately from the pressure-sensitive adhesive layer.
  • the second pressure-sensitive adhesive layer is formed, and the pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are bonded to the base material layer, respectively. Further, it can be produced by the coextrusion laminating method as described above.
  • FIG. 1 a schematic diagram showing an example of the adhesive tape of the present invention is shown in FIG. 1
  • FIG. 1 and 2 show an example of an adhesive tape having an adhesive layer, a base material layer, and a second adhesive layer.
  • the pressure-sensitive adhesive tape of the present invention has a pressure-sensitive adhesive layer 1 having a first surface 11 and a second surface 12, a base material layer 2, and a second pressure-sensitive adhesive layer 3.
  • the adherend By setting the peel strength of the pressure-sensitive adhesive layer 1 to stainless steel within the above range before and after the immersion in the peeling solution, the adherend can be firmly fixed, while after being brought into contact with the peeling solution, the adhesion of the adherend is suppressed and the adhesion is suppressed.
  • the tape can be easily peeled off.
  • the pressure-sensitive adhesive tape of the present invention may be flat as long as it satisfies the above peel strength, but as shown in FIGS. It is preferable to have the embossed shape 13 on the first surface 11 in contact with the body. Since the pressure-sensitive adhesive layer 1 has the embossed shape 13, when the peeling liquid is brought into contact with the side surface of the pressure-sensitive adhesive layer 1, the peeling liquid permeates the entire first surface 11 through the grooves forming the embossed shape. Even if the adhesive tape is used in a large area for fixing hard and large parts, the adhesive tape can be easily peeled off while suppressing damage to the adherend.
  • the embossed groove 14 is a plurality of grooves which are connected from one end to the other on the side surface of the pressure-sensitive adhesive layer 1 as shown in FIG. 1, particularly a linear groove having a width and a depth in the above range, a peeling liquid is used. Can be more easily penetrated into the entire first surface 11, and the releasability can be further enhanced.
  • the adherend can be more reliably fixed and the peelability can be improved.
  • the release film 4 having the protrusions 41 corresponding to the embossed grooves.
  • the embossed groove 14 is less likely to be deformed during movement or storage, so that the peeling liquid can be less likely to be clogged when brought into contact with the peeling liquid.
  • the second pressure-sensitive adhesive layer 3 may also be protected by a release film as in a normal pressure-sensitive adhesive tape.
  • the base material layer 2 and the second pressure-sensitive adhesive layer 3 may or may not be provided, but the strength and handleability are improved by having the base material layer 2. Can be made Further, when the difference between the peel strength of the second pressure-sensitive adhesive layer with respect to the stainless steel before immersion in the peeling liquid and the peel strength with respect to the stainless steel after immersion of the peeling liquid is within the above range, the interface between the adherend and the adhesive tape that should be collected more reliably It can cause peeling.
  • the method for peeling off the pressure-sensitive adhesive tape of the present invention and the field of use of the pressure-sensitive adhesive tape of the present invention are not particularly limited, but since it is difficult to damage the adherend, from an electronic device having an electronic component fixed by the pressure-sensitive adhesive tape to the electronic component Can be suitably used when peeling. Among them, it can be used particularly preferably when peeling a battery pack used in a portable electronic device such as a smartphone or a tablet. The battery pack and the case are becoming thinner, and the strength thereof is not so high, so that the possibility of damage at the time of peeling increases. However, by using the peeling method of the present invention and the adhesive tape of the present invention, it is possible to perform peeling while suppressing damage to the battery pack and the casing at the time of peeling.
  • the present invention is particularly effective.
  • the pressure-sensitive adhesive tape of the present invention has an embossed shape, the peelability is further enhanced, so that not only the fixing of electronic components used in a portable electronic device or the like having a relatively small area but also the large-area electronic device Even when the adhesive tape is used for fixing components, the adhesive tape can be peeled off while suppressing damage to the members.
  • An electronic component having such an adhesive tape of the present invention is also one aspect of the present invention.
  • the peeling method of the adhesive tape which is hard to be damaged at the time of collecting the components fixed by the adhesive tape, the adhesive tape used for the peeling method, and the electronic component using the adhesive tape used for the peeling method Can be provided.
  • Base resin for pressure-sensitive adhesive layer The following commercially available products and the compound synthesized by the following method were used as the base resin for the pressure-sensitive adhesive layer.
  • Base Resin for Base Layer The following was used as the base resin for the base layer.
  • ⁇ Toughmer PN-0040 ⁇ -polyolefin resin, manufactured by Mitsui Chemicals Inc.
  • ⁇ J715 Polypropylene resin, manufactured by Prime Polymer Cosmoshine A4300: Polyethylene terephthalate film, thickness 50 ⁇ m, manufactured by Toyobo Co., Ltd.
  • ⁇ Polyurethane NES85, manufactured by Okura Industry Co., Ltd.
  • Tackifier (Tacky Fire) The following tackifiers were used in the pressure-sensitive adhesive layer.
  • ⁇ Alcon P-100 Petroleum-based tackifier, Arakawa Chemical Co., Ltd.
  • ⁇ Alcon P-125 Petroleum-based tackifier, Arakawa Chemical Co., Ltd.
  • ⁇ Arcon P-140 Petroleum-based tackifier, Arakawa Chemical Co., Ltd.
  • Tuck PT90HS C5-C9 petroleum-based tackifier, Tosoh Corp.
  • YS Polystar UH115 Terpene phenolic tackifier
  • Yasuhara Chemical Co. A100: Rosin ester tackifier, Arakawa Chemical Co., Ltd.
  • Example 1 100 parts by weight of DR8300P, 40 parts by weight of Alcon P100 and 1 part by weight of an antioxidant (IRGANOX 1010, manufactured by BASF) were mixed to obtain an adhesive composition for forming an adhesive layer. .. Both sides of the base material layer having a thickness of 50 ⁇ m were formed by coextrusion molding using the T-die method using the above-mentioned Toughmer PN-0040 as the base material layer and the adhesive composition obtained above as the raw material for the adhesive layer. A double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer having a thickness of 30 ⁇ m was obtained. Before winding, the release-treated PET separator was laminated on both sides and wound to obtain a roll-shaped double-sided adhesive tape. The presence or absence of the phase separation structure was confirmed by observing the pressure-sensitive adhesive layer of the obtained pressure-sensitive adhesive tape with a transmission electron microscope JEM-2100 (manufactured by JEOL Ltd.).
  • the obtained double-sided adhesive tape was cut into 25 mm wide strips to prepare test pieces.
  • the test piece was placed on a stainless steel plate (SUS304, No. 360 water-resistant abrasive paper surface-polished, size 50 mm ⁇ 125 mm) in accordance with JIS G4305 and JIS B0601 so that the pressure-sensitive adhesive layer faced the stainless steel plate. .. Then, the test piece and the stainless steel plate were bonded together by reciprocating a 2 kg rubber roller on the test piece at a speed of 300 mm/min.
  • JIS Z0237 a polyethylene terephthalate film specified in JIS C2318 having a nominal thickness of 25 ⁇ m is superposed on the test piece, and another 2 kg rubber roller is reciprocated on the film at a speed of 300 mm/min to make 180°.
  • a test sample for peel strength evaluation was used. After that, using a tensile tester (STA1225, manufactured by AND Co., Ltd.), the sample was allowed to stand at a temperature of 23° C. and a humidity of 50% for 24 hours, and a tensile test was performed in a 180° direction at a peeling rate of 300 mm/min according to JIS Z0237.
  • the peel strength (A) (N/25 mm) of the pressure-sensitive adhesive layer before immersion in the peeling solution was measured.
  • the same operation was performed except that the adhesive layer to be attached to the stainless steel plate was the second adhesive layer, and the peel strength (A) (N/25 mm) of the second adhesive layer before immersion in the release liquid was measured. ..
  • Examples 4, 6 to 12, Comparative Example 3 A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the composition of the pressure-sensitive adhesive layer, the thickness, the base resin of the base material, and the stripping solution were changed as shown in Tables 1 and 3, and the presence/absence of a phase separation structure was confirmed. The peel strength was measured.
  • Example 2 The pressure-sensitive adhesive composition obtained in Example 1 was extrusion-molded to obtain a non-support type double-sided pressure-sensitive adhesive tape having a thickness of 100 ⁇ m, and each peel strength was measured. The presence or absence of the phase separation structure was confirmed by observing the pressure-sensitive adhesive layer of the obtained pressure-sensitive adhesive tape with a transmission electron microscope JEM-2100 (manufactured by JEOL Ltd.). The obtained double-sided pressure-sensitive adhesive tape was protected on both sides with a light-peelable release PET film until use.
  • Example 3 DR8300P was dissolved in toluene so that the solid content was 30%, and 40 parts by weight of Alcon P100 was added to 100 parts by weight of the solid content to obtain a pressure-sensitive adhesive composition.
  • the obtained pressure-sensitive adhesive composition was applied onto one surface of the base material layer, Cosmoshine A4300, so that the thickness after drying was 30 ⁇ m, and dried at 100 to 130° C. for 7 minutes to obtain a single-sided pressure-sensitive adhesive tape. ..
  • a light release type release PET film was laminated on the adhesive layer to protect the adhesive layer.
  • a second pressure-sensitive adhesive layer was formed on the other surface of the base material layer by the same method, and a light-release type release PET film was laminated to obtain a double-sided pressure-sensitive adhesive tape.
  • the presence or absence of the phase separation structure was confirmed by observing the adhesive layer and the second adhesive layer of the obtained adhesive tape with a transmission electron microscope JEM-2100 (manufactured by JEOL Ltd.).
  • Each peel strength of the obtained double-sided pressure-sensitive adhesive tape was measured in the same manner as in Example 1.
  • Examples 17 to 28, Comparative Example 5 The type of base resin, the type of tackifier, and the compounding amount are as shown in Tables 2 and 3, and a double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 3 except that the base material layer was not used. Was confirmed and each peel strength was measured.
  • Examples 5, 13 to 16, Reference Example 1 A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 3 except that the composition of the pressure-sensitive adhesive layer, the thickness, the base resin of the base material, and the stripping solution were changed as shown in Tables 1 to 3, and the presence or absence of a phase separation structure was confirmed. The peel strength was measured.
  • Example 29 A release film having a square lattice-shaped embossed shape composed of a plurality of convex portions made of polyethylene on one surface of clean paper was prepared.
  • the protrusions are linear and continuous from one end of the clean paper to the end of the opposite side, and the protrusions are arranged at equal intervals.
  • the height of the protrusions is 5 ⁇ m
  • the width is 50 ⁇ m
  • the ratio of the protrusions to the surface of the release film is 10%.
  • the embossed surface of this release film was coated with the adhesive composition in the same manner as in Example 3 and dried to form an adhesive layer having a thickness of 50 ⁇ m and having an embossed shape in which the convex portions were grooves. Formed.
  • Example 30 to 33 A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 29 except that the embossed shape of the release film and the type of base resin were changed as shown in Table 3.
  • the embossing 2 has a shape in which the groove of FIG. 1 is a convex portion
  • the embossing 3 has the same shape as the embossing 1
  • the embossing 2 is a convex portion having a height of 20 ⁇ m and a width of 70 ⁇ m.
  • the proportion of the convex portion occupying is 20%.
  • the emboss 3 is composed of a convex portion having a height of 15 ⁇ m and a width of 8 ⁇ m, and the proportion of the convex portion on the surface of the release film is 15%. Further, the random embossing has a shape in which irregularities appear irregularly and does not have a specific width or height.
  • Example 34 An adhesive layer was formed in the same manner as in Example 29 except that the embossed shape of the release film was the same as that in Example 30 and the thickness was 30 ⁇ m. Then, Cosmoshine A4300 was laminated as a base material layer on the obtained pressure-sensitive adhesive layer. On the other hand, a second pressure-sensitive adhesive layer was formed in the same manner as the pressure-sensitive adhesive layer on another light-releasing release film. The obtained second adhesive layer and the surface of the base material layer on which the adhesive layer was not laminated were laminated to obtain a double-sided adhesive tape.
  • Example 35 and 36 Comparative Examples 2 and 6
  • a double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 34 except that the base resin, tackifier, and base material used were as shown in Table 3, and the presence or absence of a phase separation structure was confirmed and the peel strengths were measured.
  • Comparative Example 1 0.5 parts by weight of isocyanate (trade name "Coronate HX", manufactured by Tosoh Corporation) was mixed with the acrylic compound solution, and the mixture was stirred for 30 minutes to obtain a pressure-sensitive adhesive composition.
  • a double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 3 except that the obtained pressure-sensitive adhesive composition was used, and the presence or absence of a phase separation structure was confirmed and the peel strengths were measured.
  • Example 4 A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 30 except that the pressure-sensitive adhesive composition of Comparative Example 1 was used, and the presence or absence of a phase separation structure was confirmed and the peel strengths were measured.
  • the peeling method of the adhesive tape which is hard to be damaged at the time of collecting the components fixed by the adhesive tape, the adhesive tape used for the peeling method, and the electronic component using the adhesive tape used for the peeling method Can be provided.

Abstract

L'objet de la présente invention est de fournir : un procédé de retrait d'un ruban adhésif sensible à la pression, le procédé permettant qu'un composant fixé avec le ruban adhésif sensible à la pression soit moins susceptible d'être endommagé lorsqu'il est récupéré ; un ruban adhésif sensible à la pression devant être soumis au procédé de retrait ; et un composant électronique comprenant le ruban adhésif sensible à la pression devant être soumis au procédé de retrait. Le procédé consiste à retirer un ruban adhésif sensible à la pression qui comprend une couche adhésive sensible à la pression comprenant un élastomère à base de styrène et qui a été lié à une partie adhérée pour former une structure multicouche et consiste à mettre en contact un liquide décapant ayant une valeur SP inférieure ou égale à 22,0 avec la couche adhésive sensible à la pression de la structure multicouche, puis à retirer le ruban adhésif sensible à la pression de la partie adhérée.
PCT/JP2019/047375 2018-12-04 2019-12-04 Procédé de retrait d'un ruban adhésif sensible à la pression, ruban adhésif sensible à la pression et composant électronique WO2020116497A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-227199 2018-12-04
JP2018227199 2018-12-04

Publications (1)

Publication Number Publication Date
WO2020116497A1 true WO2020116497A1 (fr) 2020-06-11

Family

ID=70974684

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/047375 WO2020116497A1 (fr) 2018-12-04 2019-12-04 Procédé de retrait d'un ruban adhésif sensible à la pression, ruban adhésif sensible à la pression et composant électronique

Country Status (2)

Country Link
TW (1) TW202033697A (fr)
WO (1) WO2020116497A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024024829A1 (fr) * 2022-07-29 2024-02-01 日東電工株式会社 Procédé de pelage de feuille adhésive

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729569U (ja) * 1993-11-04 1995-06-02 株式会社フジシール 易剥離性タックラベル
JP2002206078A (ja) * 2001-01-11 2002-07-26 Keiwa Inc 粘着シート
JP2002544364A (ja) * 1999-05-13 2002-12-24 スリーエム イノベイティブ プロパティズ カンパニー 接着剤付き物品
JP2011233680A (ja) * 2010-04-27 2011-11-17 Tokyo Ohka Kogyo Co Ltd 剥離装置及び剥離方法
JP2015214675A (ja) * 2014-04-22 2015-12-03 東京応化工業株式会社 接着剤組成物、積層体及び剥離方法
JP2016011361A (ja) * 2014-06-27 2016-01-21 東京応化工業株式会社 剥離用組成物及び剥離方法
CN105950043A (zh) * 2016-05-16 2016-09-21 东莞市澳中电子材料有限公司 一种提高电池抗跌落性能的胶粘带及其制作方法
JP2017043775A (ja) * 2015-08-27 2017-03-02 積水化学工業株式会社 プリズムシート用表面保護フィルム及びプリズムシート用表面保護フィルム付きプリズムシート
EP3156466A1 (fr) * 2015-10-15 2017-04-19 3M Innovative Properties Company Ruban en mousse à adhésif multicouche sensible à la pression pour applications extérieures

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729569U (ja) * 1993-11-04 1995-06-02 株式会社フジシール 易剥離性タックラベル
JP2002544364A (ja) * 1999-05-13 2002-12-24 スリーエム イノベイティブ プロパティズ カンパニー 接着剤付き物品
JP2002206078A (ja) * 2001-01-11 2002-07-26 Keiwa Inc 粘着シート
JP2011233680A (ja) * 2010-04-27 2011-11-17 Tokyo Ohka Kogyo Co Ltd 剥離装置及び剥離方法
JP2015214675A (ja) * 2014-04-22 2015-12-03 東京応化工業株式会社 接着剤組成物、積層体及び剥離方法
JP2016011361A (ja) * 2014-06-27 2016-01-21 東京応化工業株式会社 剥離用組成物及び剥離方法
JP2017043775A (ja) * 2015-08-27 2017-03-02 積水化学工業株式会社 プリズムシート用表面保護フィルム及びプリズムシート用表面保護フィルム付きプリズムシート
EP3156466A1 (fr) * 2015-10-15 2017-04-19 3M Innovative Properties Company Ruban en mousse à adhésif multicouche sensible à la pression pour applications extérieures
CN105950043A (zh) * 2016-05-16 2016-09-21 东莞市澳中电子材料有限公司 一种提高电池抗跌落性能的胶粘带及其制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024024829A1 (fr) * 2022-07-29 2024-02-01 日東電工株式会社 Procédé de pelage de feuille adhésive

Also Published As

Publication number Publication date
TW202033697A (zh) 2020-09-16

Similar Documents

Publication Publication Date Title
JP4620806B2 (ja) 表面保護フィルム
JP5563788B2 (ja) 表面保護接着シート
JP5596462B2 (ja) プリズムシート用表面保護フィルム、およびその製造方法、およびそれが貼り付けられたプリズムシート
KR20120024928A (ko) 연신 분리가능한 감압성 접착제
KR101894741B1 (ko) 점착 시트
MX2010012898A (es) Adhesivo sensible a la presion compuesto de resina de polip'ropileno.
US20110033699A1 (en) Pressure-sensitive adhesive tape
TW201202037A (en) Surface protective film
WO2011122287A1 (fr) Film de protection de surfaces
JP4987361B2 (ja) 表面保護フィルム
CN110878190B (zh) 一种泡棉双面胶带及其制造方法
JP2008127447A (ja) 表面保護フィルム
JP6454091B2 (ja) 粘着製品
WO2020116497A1 (fr) Procédé de retrait d'un ruban adhésif sensible à la pression, ruban adhésif sensible à la pression et composant électronique
WO2008032691A1 (fr) Film protecteur de surface
WO2012105338A1 (fr) Agent de démoulage
JP2009114407A (ja) 表面保護フィルム
JP2018119138A (ja) 積層フィルム
JP6274095B2 (ja) 粘着剤の除去方法
JP6721335B2 (ja) 両面粘着テープ
JP6992250B2 (ja) 粘着テープ
JP4981270B2 (ja) 表面保護フィルム
JP2017149948A (ja) ハーフカット加工用粘着フィルム及び被着体の加工方法
JP7020907B2 (ja) 両面粘着テープ
JP5814036B2 (ja) 粘着テープ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19892386

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19892386

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP