WO2020113894A1 - 电性测试设备及电性测试设备十字线缺陷精确定位方法 - Google Patents

电性测试设备及电性测试设备十字线缺陷精确定位方法 Download PDF

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Publication number
WO2020113894A1
WO2020113894A1 PCT/CN2019/084099 CN2019084099W WO2020113894A1 WO 2020113894 A1 WO2020113894 A1 WO 2020113894A1 CN 2019084099 W CN2019084099 W CN 2019084099W WO 2020113894 A1 WO2020113894 A1 WO 2020113894A1
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Prior art keywords
array substrate
cross
electrical
line defect
electrical test
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English (en)
French (fr)
Inventor
刘强
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136254—Checking; Testing

Definitions

  • the invention relates to the technical field of display, in particular to an electrical testing device and a method for accurately positioning crosshair defects of the electrical testing device.
  • LCD liquid crystal displays
  • other flat display devices have been widely used in mobile phones, TVs, and individuals due to their advantages of high image quality, power saving, thin body, and wide application range.
  • Various consumer electronic products such as digital assistants, digital cameras, notebook computers, and desktop computers have become the mainstream in display devices.
  • a liquid crystal display panel is composed of a color filter (CF) substrate, a thin film transistor (TFT) thin film transistor (TFT) array substrate, a liquid crystal (LC) liquid crystal (LC) sandwiched between the color filter substrate and the array substrate, and a sealant frame ( Sealant), the molding process generally includes: front-end Array process (thin film, yellow light, etching and stripping), middle-stage cell (Cell) process (array substrate and color film substrate bonding) and rear-end module Assembly process (drive IC and printed circuit board pressed together).
  • front-end Array process thin film, yellow light, etching and stripping
  • middle-stage cell (Cell) process array substrate and color film substrate bonding
  • rear-end module Assembly process drive IC and printed circuit board pressed together.
  • the front-end array manufacturing process specifically includes: forming horizontal conductive lines (including scan lines and common electrode lines), vertical conductive lines (including data lines), TFTs electrically connected to the horizontal conductive lines and the vertical conductive lines, and transparent on the transparent substrate Structures such as electrodes are used to produce array substrates, in which horizontal wires and vertical wires are formed in two layers of insulating laminates respectively. Since the process is prone to short-circuit at the position where the horizontal wires and vertical wires cross, forming cross-hair defects, so in After the production of the array substrate is completed, the array substrate needs to be inspected to find out the specific position of the cross-line defect for the subsequent repair station to repair according to the specific position of the cross-line defect.
  • the cross-line GDS defect and DCS defect are the scan line and the data line, respectively, the data line and the common electrode line are short-circuited, which is an invisible defect, and it is very difficult to locate.
  • Existing electrical test equipment (ATS) cannot currently give an accurate position Positioning makes the repair machine unable to repair, resulting in huge yield and cost losses.
  • an object of the present invention is to provide an electrical test device and a method for accurately positioning crosshair defects of an electrical test equipment to solve the problem of accurate positioning of crosshair defects on an array substrate.
  • the present invention provides a method for accurately locating crosshair defects in electrical testing equipment, including:
  • Step 10 Add an infrared probe to the electrical test equipment
  • Step 20 Use the electrical test equipment to power the array substrate
  • Step 30 Detect the position of the cross-line defect on the array substrate by detecting the position of the cross-line defect in the array substrate through the infrared probe.
  • the electrical test equipment is provided with a power-up head for powering up the array substrate.
  • the electrical test equipment is provided with a test head for testing the array substrate.
  • the invention also provides an electrical property testing device, which has a test head for testing the array substrate and a power supply head for powering the array substrate, and further includes an infrared probe; the electrical property testing device passes the power supply head to the array substrate After power-on, the infrared probe detects the position of the cross-line defect heat generated in the array substrate, thereby locating the position of the cross-line defect on the array substrate.
  • the invention also provides a method for accurately locating crosshair defects of electrical testing equipment, including:
  • Step 11 Add an electromagnetic probe to the electrical test equipment
  • Step 21 Use electrical test equipment to power the array substrate
  • Step 31 Detect the position of the waveform interference caused by the cross-line defect in the array substrate by the electromagnetic probe, so as to locate the position of the cross-line defect on the array substrate.
  • the electrical test equipment is provided with a power-up head for powering up the array substrate.
  • the electrical test equipment is provided with a test head for testing the array substrate.
  • the invention also provides an electrical property testing device, which has a test head for testing the array substrate and a power supply head for powering the array substrate, and also includes an electromagnetic probe; the electrical property testing device supplies the array substrate via the power supply head After power-on, the electromagnetic probe detects the position of the waveform interference caused by the cross-line defect in the array substrate, thereby locating the position of the cross-line defect on the array substrate.
  • the electrical test equipment and the method for accurately positioning crosshair defects of the present invention can accurately locate the crosshair defects on the array substrate, thereby improving repair efficiency and product yield.
  • FIG. 1 is a flowchart of an embodiment of a method for accurately positioning a crosshair defect of an electrical testing device of the present invention
  • FIG. 2 is a schematic structural diagram of an embodiment of an electrical test device of the present invention.
  • FIG. 3 is a flowchart of another embodiment of a method for accurately positioning a crosshair defect of an electrical testing device of the present invention
  • FIG. 4 is a schematic structural diagram of yet another embodiment of the electrical test device of the present invention.
  • FIG. 1 is a flowchart of an embodiment of a method for accurately positioning a crosshair defect of an electrical testing device according to the present invention.
  • the embodiment mainly includes:
  • Step 10 Add an infrared probe (thermal camera) to the electrical test equipment (ATS); this method can be implemented by adding an infrared probe to the existing electrical test equipment.
  • thermo camera thermo camera
  • ATS electrical test equipment
  • Step 20 Use the electrical test equipment to power the array substrate; when accurately positioning the cross-hair defects, first use the original power-on function of the electrical test equipment to power the array substrate.
  • Step 30 Detect the position of the cross-line defect on the array substrate by detecting the position of the cross-line defect in the array substrate through the infrared probe.
  • the scanning lines, common electrode lines, data lines, etc. generate heat due to the passage of current, and the position of the crosshair defect is different from the position without defect due to the heat (temperature) generated by the short circuit, so it can be accurately positioned by the infrared probe.
  • the location where the short circuit occurs that is, the location where the temperature is high in the array substrate, can provide the precise coordinates for the repairing machine to repair, thereby saving the yield and saving the cost.
  • FIG. 2 is a schematic structural diagram of an embodiment of an electrical test device of the present invention, which can be used to implement the method shown in FIG. 1.
  • the electrical test device 1 of this embodiment has a test head 2 for testing the array substrate 4 and a power-up head 3 for powering up the array substrate 4, and further includes an infrared probe 5; the electrical test device 1 passes the power-up head 3 After power is applied to the array substrate 4, the infrared probe 5 detects the position of the array substrate 4 where heat is generated due to the cross-line defect, so that the position of the cross-line defect on the array substrate 4 can be located.
  • the test head 2 and the power-on head 3 are the original structure of the electrical test device 1, and the test head 2 has no infrared detection function.
  • an infrared probe 5 is added to the original electrical test device 1, and the array substrate 4 is connected to the array substrate 4 by using a power head 3 to power up the array substrate 4.
  • Cross-hair defects will generate heat at the short-circuit position.
  • the probe 5 detects the heating position and accurately locates the cross-hair defects, thereby improving the repair efficiency and product yield.
  • FIG. 3 is a flowchart of another embodiment of the method for accurately positioning the crosshair defects of the electrical testing equipment of the present invention.
  • the embodiment mainly includes:
  • Step 11 Add an electromagnetic probe to the electrical test equipment; this method can be implemented by adding an electromagnetic probe to the existing electrical test equipment.
  • Step 21 Use the electrical test equipment to power the array substrate; when accurately positioning the crosshair defects, first use the original power-on function of the electrical test equipment to power the array substrate.
  • Step 31 Detect the position of the waveform interference caused by the cross-line defect in the array substrate by an electromagnetic probe, so as to locate the position of the cross-line defect on the array substrate.
  • an electromagnetic probe After the array substrate is powered on, current will pass through the scan lines, common electrode lines, data lines, etc., and cross-line defects will produce waveform interference at the short-circuit position, which is different from the position without defects, so the location of the short-circuit can be accurately located by the electromagnetic probe , That is, the location of the waveform interference in the array substrate, which can provide precise coordinates for the repair machine to repair, which can save the yield and save costs.
  • FIG. 4 is a schematic structural diagram of yet another embodiment of an electrical test device of the present invention, which can be used to implement the method shown in FIG. 3.
  • the electrical test device 1 of this embodiment has a test head 2 for testing the array substrate 4 and a power-up head 3 for powering up the array substrate 4, and also includes an electromagnetic probe 6; the electrical test device 1 passes the power-up head 3 After power is applied to the array substrate 4, the electromagnetic probe 6 detects the position of the waveform interference caused by the cross-line defect in the array substrate 4, so as to locate the position of the cross-line defect on the array substrate 4.
  • the test head 2 and the power-on head 3 are the original structure of the electrical test device 1, and the test head 2 has no electromagnetic detection function.
  • the electrical test device 1 of this embodiment incorporates an electromagnetic probe 6 on the original electrical test device 1 and connects the array substrate 4 to the array substrate 4 with a power-on head 3 to power up the array substrate 4.
  • Cross-hair defects will cause waveform interference at the short-circuit position.
  • the electromagnetic probe 6 detects the position where the waveform interference occurs, and accurately locates the cross-hair defect, thereby improving the repair efficiency and product yield.
  • the electrical test equipment and the method for accurately positioning the crosshair defects of the electrical test equipment of the present invention can be combined with the existing electrical test equipment and the method of testing the array substrate by the existing electrical test equipment, or can be based on The existing electrical test equipment and the existing electrical test equipment are used to test the array substrate.
  • the electrical test equipment and the method for accurately positioning crosshair defects of the present invention can accurately locate the crosshair defects on the array substrate, thereby improving repair efficiency and product yield.

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  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种电性测试设备及电性测试设备十字线缺陷精确定位方法，该方法包括：步骤10、在电性测试设备上加入红外探头；步骤20、利用电性测试设备向阵列基板加电；步骤30、通过红外探头侦测阵列基板内因十字线缺陷产生热量的位置，从而定位阵列基板上十字线缺陷的位置。还提供了一种电性测试设备。该设备和方法能够精确定位阵列基板上的十字线缺陷，进而提升修补效率和产品良率。

Description

电性测试设备及电性测试设备十字线缺陷精确定位方法 技术领域
本发明涉及显示技术领域，尤其涉及一种电性测试设备及电性测试设备十字线缺陷精确定位方法。
 背景技术
随着显示技术的发展，液晶显示器(Liquid Crystal Display，LCD)等平面显示装置因具有高画质、省电、机身薄及应用范围广等优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。
通常液晶显示面板由彩膜(CF，Color Filter)基板、薄膜晶体管(TFT，Thin Film Transistor)阵列基板、夹于彩膜基板与阵列基板之间的液晶(LC，Liquid Crystal)及密封胶框(Sealant)组成，其成型工艺一般包括：前段阵列(Array)制程(薄膜、黄光、蚀刻及剥膜)、中段成盒(Cell)制程(阵列基板与彩膜基板贴合)及后段模组组装制程(驱动IC与印刷电路板压合)。
其中，前段阵列制程中具体包括：在透明基板上形成水平导线(包括扫描线和公共电极线)、竖直导线(包括数据线)、与水平导线和竖直导线电性连接的TFT、以及透明电极等结构以制得阵列基板，其中水平导线和竖直导线分别形成于绝缘层叠的两金属层中，由于制程在水平导线和竖直导线交叉的位置容易出现短路，形成十字线缺陷，因此在阵列基板制作完成之后需要进行阵列基板检测，以找出十字线缺陷的具体位置，供后续修复站点根据十字线缺陷的具体位置进行修复。
因为十字线 GDS缺陷、DCS缺陷分别为扫描线与数据线, 数据线与公共电极线发生短路，属于不可见缺陷，定位十分困难，现有电性测试设备（ATS）目前无法给出精确的位置定位，造成修补机台无法修补，造成巨大的良率及成本损失。
 技术问题
因此，本发明的目的在于提供一种电性测试设备及电性测试设备十字线缺陷精确定位方法，解决阵列基板上十字线缺陷精确定位的问题。
 技术解决方案
为实现上述目的，本发明提供了一种电性测试设备十字线缺陷精确定位方法，包括：
步骤10、在电性测试设备上加入红外探头；
步骤20、利用电性测试设备向阵列基板加电；
步骤30、通过红外探头侦测阵列基板内因十字线缺陷产生热量的位置，从而定位阵列基板上十字线缺陷的位置。
其中，该电性测试设备设有用于向阵列基板加电的加电头。
其中，该电性测试设备设有用于测试阵列基板的测试头。
本发明还提供了一种电性测试设备，具有用于测试阵列基板的测试头以及用于向阵列基板加电的加电头，还包括红外探头；电性测试设备经由加电头向阵列基板加电后，该红外探头侦测阵列基板内因十字线缺陷产生热量的位置，从而定位阵列基板上十字线缺陷的位置。
本发明还提供了一种电性测试设备十字线缺陷精确定位方法，包括：
步骤11、在电性测试设备上加入电磁探头；
步骤21、利用电性测试设备向阵列基板加电；
步骤31、通过电磁探头侦测阵列基板内因十字线缺陷产生波形干扰的位置，从而定位阵列基板上十字线缺陷的位置。
其中，该电性测试设备设有用于向阵列基板加电的加电头。
其中，该电性测试设备设有用于测试阵列基板的测试头。
 有益效果
本发明还提供了一种电性测试设备，具有用于测试阵列基板的测试头以及用于向阵列基板加电的加电头，还包括电磁探头；电性测试设备经由加电头向阵列基板加电后，该电磁探头侦测阵列基板内因十字线缺陷产生波形干扰的位置，从而定位阵列基板上十字线缺陷的位置。
综上，本发明的电性测试设备及电性测试设备十字线缺陷精确定位方法能够精确定位阵列基板上的十字线缺陷，进而提升修补效率和产品良率。
 附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
附图中，
图1为本发明电性测试设备十字线缺陷精确定位方法一实施例的流程图；
图2为本发明电性测试设备一实施例的结构示意图；
图3为本发明电性测试设备十字线缺陷精确定位方法又一实施例的流程图；
图4为本发明电性测试设备又一实施例的结构示意图。
 本发明的实施方式
参见图1，其为本发明电性测试设备十字线缺陷精确定位方法一实施例的流程图，该实施例主要包括：
步骤10、在电性测试设备（ATS）上加入红外探头（thermal camera）；该方法可以通过在现有电性测试设备增加红外探头来实现。
步骤20、利用电性测试设备向阵列基板加电；进行十字线缺陷精确定位时，首先利用电性测试设备原有的加电功能向阵列基板加电。
步骤30、通过红外探头侦测阵列基板内因十字线缺陷产生热量的位置，从而定位阵列基板上十字线缺陷的位置。通过在现有电性测试设备加入红外侦测十字线缺陷功能为十字线类型缺陷进行精准定位。阵列基板加电后，扫描线、公共电极线、数据线等因电流经过产生热量，而十字线缺陷的位置因为短路所产生热量（温度）区别于没有缺陷的位置，因此通过红外探头可精确定位短路发生位置，也就是阵列基板内温度高的位置，从而可以为修补机台提供精确坐标以进行修补，从而可以挽救良率，节省成本。
图2为本发明电性测试设备一实施例的结构示意图，可用于实现图1所示的方法。该实施例的电性测试设备1具有用于测试阵列基板4的测试头2以及用于向阵列基板4加电的加电头3，还包括红外探头5；电性测试设备1经由加电头3向阵列基板4加电后，该红外探头5侦测阵列基板4内因十字线缺陷产生热量的位置，从而可以定位阵列基板4上十字线缺陷的位置。
测试头2和加电头3均为电性测试设备1原有的结构，测试头2无红外侦测功能。该实施例的电性测试设备1在原有的电性测试设备1上加入红外探头5，利用加电头3连接阵列基板4给阵列基板4加电，十字线缺陷会在短路位置产生热量，红外探头5侦测发热位置，为十字线缺陷精确定位，从而提升修补效率和产品良率。
参见图3，其为本发明电性测试设备十字线缺陷精确定位方法又一实施例的流程图，该实施例主要包括：
步骤11、在电性测试设备上加入电磁探头；该方法可以通过在现有电性测试设备上增加电磁探头来实现。
步骤21、利用电性测试设备向阵列基板加电；进行十字线缺陷精确定位时，首先利用电性测试设备原有的加电功能向阵列基板加电。
步骤31、通过电磁探头侦测阵列基板内因十字线缺陷产生波形干扰的位置，从而定位阵列基板上十字线缺陷的位置。阵列基板加电后，扫描线、公共电极线、数据线等会有电流经过，而十字线缺陷会在短路位置产生波形干扰，区别于没有缺陷的位置，因此通过电磁探头可精确定位短路发生位置，也就是阵列基板内波形干扰发生的位置，从而可以为修补机台提供精确坐标以进行修补，从而可以挽救良率，节省成本。
图4为本发明电性测试设备又一实施例的结构示意图，可用于实现图3所示的方法。该实施例的电性测试设备1具有用于测试阵列基板4的测试头2以及用于向阵列基板4加电的加电头3，还包括电磁探头6；电性测试设备1经由加电头3向阵列基板4加电后，该电磁探头6侦测阵列基板4内因十字线缺陷产生波形干扰的位置，从而定位阵列基板4上十字线缺陷的位置。
测试头2和加电头3均为电性测试设备1原有的结构，测试头2无电磁侦测功能。该实施例的电性测试设备1在原有的电性测试设备1上加入电磁探头6，利用加电头3连接阵列基板4给阵列基板4加电，十字线缺陷会在短路位置产生波形干扰，电磁探头6侦测产生波形干扰的位置，为十字线缺陷精确定位，从而提升修补效率和产品良率。
本领域技术人员可以理解，本发明的电性测试设备及电性测试设备十字线缺陷精确定位方法可以与现有电性测试设备以及现有电性测试设备测试阵列基板的方法结合，或者可基于现有电性测试设备以及现有电性测试设备测试阵列基板的方法实现。
综上，本发明的电性测试设备及电性测试设备十字线缺陷精确定位方法能够精确定位阵列基板上的十字线缺陷，进而提升修补效率和产品良率。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (7)

  1. 一种电性测试设备十字线缺陷精确定位方法，包括：
    步骤10、在电性测试设备上加入红外探头；
    步骤20、利用电性测试设备向阵列基板加电；
    步骤30、通过红外探头侦测阵列基板内因十字线缺陷产生热量的位置，从而定位阵列基板上十字线缺陷的位置。
  2. 如权利要求1所述的电性测试设备十字线缺陷精确定位方法，其中，该电性测试设备设有用于向阵列基板加电的加电头。
  3. 如权利要求1所述的电性测试设备十字线缺陷精确定位方法，其中，该电性测试设备设有用于测试阵列基板的测试头。
  4. 一种电性测试设备，具有用于测试阵列基板的测试头以及用于向阵列基板加电的加电头，还包括红外探头或电磁探头；电性测试设备经由加电头向阵列基板加电后，该红外探头侦测阵列基板内因十字线缺陷产生热量的位置或者该电磁探头侦测阵列基板内因十字线缺陷产生波形干扰的位置，从而定位阵列基板上十字线缺陷的位置。
  5. 一种电性测试设备十字线缺陷精确定位方法，包括：
    步骤11、在电性测试设备上加入电磁探头；
    步骤21、利用电性测试设备向阵列基板加电；
    步骤31、通过电磁探头侦测阵列基板内因十字线缺陷产生波形干扰的位置，从而定位阵列基板上十字线缺陷的位置。
  6. 如权利要求5所述的电性测试设备十字线缺陷精确定位方法，其中，该电性测试设备设有用于向阵列基板加电的加电头。
  7. 如权利要求5所述的电性测试设备十字线缺陷精确定位方法，其中，该电性测试设备设有用于测试阵列基板的测试头。
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