WO2020113715A1 - 柔性oled显示装置 - Google Patents

柔性oled显示装置 Download PDF

Info

Publication number
WO2020113715A1
WO2020113715A1 PCT/CN2018/123867 CN2018123867W WO2020113715A1 WO 2020113715 A1 WO2020113715 A1 WO 2020113715A1 CN 2018123867 W CN2018123867 W CN 2018123867W WO 2020113715 A1 WO2020113715 A1 WO 2020113715A1
Authority
WO
WIPO (PCT)
Prior art keywords
encapsulation layer
boundary
area
inorganic
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/123867
Other languages
English (en)
French (fr)
Inventor
潘坤
朱小光
王硕晟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/320,103 priority Critical patent/US11101445B2/en
Publication of WO2020113715A1 publication Critical patent/WO2020113715A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of display technology, in particular to a flexible OLED display device.
  • OLED organic light emitting diode
  • the market's urgent demand for OLED full screens has driven flexible display devices to achieve greater progress from screen size to display quality.
  • the flexible display device has many advantages such as impact resistance, strong earthquake resistance, light weight, small size, easy portability, low cost and so on.
  • Existing flexible products are also widely used in the field of touch control.
  • the touch in the flexible touch display panel usually adopts a plug-in design, and the electrode binding of the flexible touch display panel usually adopts the binding method of an external flexible drive circuit
  • the electrode binding area is large, and a narrow bezel cannot be realized. Therefore, increasing the display area of the display screen has attracted more and more attention, and narrow bezels have become more and more important.
  • the width of the outer frame is too large, which further reduces the area of the display area of the display screen and cannot achieve a narrow frame.
  • the width of the outer frame is too large, which further reduces the area of the display area of the display screen and cannot achieve a narrow frame.
  • the present application provides a flexible OLED display device, so that the flexible substrate and the thin film encapsulation layer of the edge of the flexible OLED display device are all folded to the side or back of the display screen to solve the existing flexible OLED display device. If the width is too large, the width of the outer frame is too large, which further reduces the area of the display area of the display screen, and the technical problem of narrow frame cannot be achieved.
  • the present application provides a flexible OLED display device, including: a flexible substrate, a buffer layer, an OLED light-emitting layer, and a thin-film encapsulation layer; wherein the flexible substrate includes a display area and a non-display area located at an edge of the display area, the non-display area
  • the display area includes a first frame area, a second frame area, a third frame area, and a fourth frame area, the first frame area is opposite to the second frame area, and the third frame area and the fourth frame area
  • the area is opposite;
  • the thin film encapsulation layer is located in the display area and the non-display area, and the thickness of the thin film encapsulation layer in a portion of the non-display area is from a position close to the display area to a distance away from the display area
  • the positions decrease in sequence; part of the flexible substrate and part of the thin film encapsulation layer located in the first frame area and the second frame area are bent along the direction facing away from the display surface.
  • part of the flexible substrate and part of the thin film encapsulation layer located in the third frame area are bent and arranged along a direction facing away from the display surface.
  • part of the flexible substrate and part of the thin film encapsulation layer located in the third frame area and the fourth frame area are bent in a direction away from the display surface Fold settings.
  • the thin film encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer that are stacked.
  • the boundary of the first organic encapsulation layer is disposed inside the first inorganic encapsulation layer.
  • the boundary of the second inorganic encapsulation layer is larger than the boundary of the first organic encapsulation layer, and the boundary of the second inorganic encapsulation layer is different from the boundary of the first inorganic The boundary of the encapsulation layer is in contact.
  • the thin film encapsulation layer includes a third inorganic encapsulation layer, a second organic encapsulation layer, a fourth inorganic encapsulation layer, a third organic encapsulation layer, and a fifth inorganic encapsulation layer Encapsulation layer.
  • the boundary of the second organic encapsulation layer is disposed inside the third inorganic encapsulation layer; the boundary of the third organic encapsulation layer is disposed in the fourth Inside the inorganic encapsulation layer.
  • the boundary of the fourth inorganic encapsulation layer is larger than the boundary of the second organic encapsulation layer, and the boundary of the fourth inorganic encapsulation layer is different from the third inorganic encapsulation layer
  • the boundary of the encapsulation layer is in contact;
  • the boundary of the fifth inorganic encapsulation layer is larger than the boundary of the third organic encapsulation layer, and the boundary of the fifth inorganic encapsulation layer is in contact with the boundary of the fourth inorganic encapsulation layer.
  • the present application also provides a flexible OLED display device, including: a flexible substrate, a buffer layer, an OLED light emitting layer, and a thin film encapsulation layer; wherein, the flexible substrate includes a display area and a non-display area located at an edge of the display area, The non-display area includes a first bezel area, a second bezel area, a third bezel area, and a fourth bezel area, the first bezel area is opposite to the second bezel area, and the third bezel area and the fourth The frame area is opposite; the thin film encapsulation layer is located in the display area and the non-display area, and the thickness of the thin film encapsulation layer in a portion of the non-display area is from a position close to the display area to a distance away from the display area The positions of the are sequentially reduced; part of the flexible substrate and part of the thin film encapsulation layer located in the first frame area and the second frame area are bent and arranged along a direction away from the display surface.
  • part of the flexible substrate and part of the thin film encapsulation layer located in the third frame area are bent and arranged along a direction facing away from the display surface.
  • part of the flexible substrate and part of the thin film encapsulation layer located in the third frame area and the fourth frame area are bent in a direction away from the display surface Fold settings.
  • the thin film encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer that are stacked.
  • the boundary of the first organic encapsulation layer is disposed inside the first inorganic encapsulation layer.
  • the boundary of the second inorganic encapsulation layer is larger than the boundary of the first organic encapsulation layer, and the boundary of the second inorganic encapsulation layer is different from the boundary of the first inorganic The boundary of the encapsulation layer is in contact.
  • the thin film encapsulation layer includes a third inorganic encapsulation layer, a second organic encapsulation layer, a fourth inorganic encapsulation layer, a third organic encapsulation layer, and a fifth inorganic encapsulation layer Encapsulation layer.
  • the boundary of the second organic encapsulation layer is disposed inside the third inorganic encapsulation layer; the boundary of the third organic encapsulation layer is disposed in the fourth Inside the inorganic encapsulation layer.
  • the boundary of the fourth inorganic encapsulation layer is larger than the boundary of the second organic encapsulation layer, and the boundary of the fourth inorganic encapsulation layer is different from the third inorganic encapsulation layer
  • the boundary of the encapsulation layer is in contact;
  • the boundary of the fifth inorganic encapsulation layer is larger than the boundary of the third organic encapsulation layer, and the boundary of the fifth inorganic encapsulation layer is in contact with the boundary of the fourth inorganic encapsulation layer.
  • the flexible OLED display device provided by the present application prepares multiple thin film encapsulation layer boundaries, and folds the flexible substrate and the thin film encapsulation layer outside the edge of the display area to the side or back of the display screen, The width of the outer frame is reduced, the area of the display area of the display screen is further enlarged, and the ultra-narrow frame of the display screen is further realized.
  • FIG. 1 is a plan view of a flexible OLED display device of the present application before being bent.
  • FIG. 2 is a side view of the flexible OLED display device of the present application after being bent.
  • 3A-3C are preparation flow charts of the flexible OLED display device of the present application before the first bending.
  • FIG. 4A is a side view of the flexible OLED display device of the present application on the carrier table before being bent.
  • 4B is a side view of the flexible OLED display device of the present application on the carrier table after being bent.
  • FIG. 5 is a side view of the second flexible OLED display device of the present application after being bent.
  • This application is directed to the existing flexible OLED display device. Due to the large electrode binding area, the width of the outer frame is too large, which further reduces the area of the display area of the display screen and cannot achieve the technical problem of narrow frame. This embodiment can Solve the defect.
  • FIG. 1 it is a top view of the flexible OLED display device of the present application before being bent;
  • FIG. 2 is a side view of the flexible OLED display device of the present application after being bent.
  • the first solution of the flexible OLED display device of the present application includes: a flexible substrate 10, a buffer layer 20, an OLED light-emitting layer 30, and a thin film encapsulation layer 40; wherein, the flexible substrate 10 includes a display area 11 and is located in the A non-display area 12 at the edge of the display area 11, the non-display area 12 includes a first border area 121, a second border area 122, a third border area 123 and a fourth border area 124, the first border area 121 and all
  • the second bezel area 122 is opposite, the third bezel area 123 and the fourth bezel area 124 are opposite;
  • the thin film encapsulation layer 40 is located in the display area 11 and the non-display area 12 and is located in the non-display
  • the thickness of the thin film encapsulation layer 40 in the portion of the area 12 decreases in sequence from a position close to the display area 11 to a position away from the display area 11; located in the first frame area 121 and the second frame area
  • the flexible substrate 10 may be a thin metal sheet, or may be made of polyimide (PI), polycarbonate (PC), polyethersulfone (PES), or polyethylene terephthalate ( PET), polyethylene naphthalate (PEN), polyarylate (PAR) or glass fiber reinforced plastic (FRP) and other polymer materials.
  • PI polyimide
  • PC polycarbonate
  • PES polyethersulfone
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PAR polyarylate
  • FRP glass fiber reinforced plastic
  • the buffer layer 20 is disposed on the surface of the flexible substrate 10 and located in the display area 11.
  • the material of the buffer layer 20 is one or two of silicon nitride or silicon oxide.
  • the OLED light-emitting layer 30 is disposed on the surface of the buffer layer 20 and is located in the display area 11, and the OLED light-emitting layer 30 generally includes a switching layer (having several thin film transistors), a flat layer, and a pixel defining layer , Anode, luminescent material layer and cathode, etc.
  • a switching layer having several thin film transistors
  • a flat layer having several thin film transistors
  • a pixel defining layer Anode, luminescent material layer and cathode, etc.
  • the thin film encapsulation layer 40 is disposed on the surface of the flexible substrate 10 and completely covers the buffer layer 20 and the OLED light emitting layer 30, and the thin film encapsulation layer 40 is located in the display area 11 and the In the non-display area 12, the thickness of the thin-film encapsulation layer 40 in a portion of the non-display area 12 decreases in sequence from a position close to the display area 11 to a position away from the display area 11; the thin-film encapsulation layer 40 It includes a first inorganic encapsulation layer 41, a first organic encapsulation layer 42 and a second inorganic encapsulation layer 43 that are stacked.
  • the first inorganic encapsulating layer 41 is made of an inorganic material, such as an inorganic thin film such as silicon nitride or alumina; the first inorganic encapsulating layer 41 is a hydrophilic thin film; the first inorganic encapsulating layer 41 is preferably used Plasma enhanced chemical vapor deposition or atomic layer deposition process.
  • the plasma-enhanced chemical vapor deposition method uses microwave or radio frequency to ionize a gas containing thin film constituent atoms to form a plasma locally, and the plasma is very chemically active and easily reacts, so that the flexible substrate 10
  • the desired thin film is deposited on the surface.
  • the atomic layer deposition method is a method that can plate the substance layer by layer in the form of a monoatomic film.
  • the material of the first organic encapsulation layer 42 is an organic copolymer, preferably polyacrylate; the first organic encapsulation layer 42 is formed on the first inorganic encapsulation layer 41 by spraying technology; the second inorganic The material of the encapsulation layer 43 is the same as that of the first inorganic encapsulation layer 41.
  • the second inorganic encapsulation layer 43 is preferably manufactured by a plasma enhanced chemical vapor deposition method or an atomic layer deposition method.
  • the boundary of the first organic encapsulation layer 42 is disposed inside the first inorganic encapsulation layer 41; the boundary of the second inorganic encapsulation layer 43 is larger than the boundary of the first organic encapsulation layer 42, and The boundary of the second inorganic encapsulation layer 43 is in contact with the boundary of the first inorganic encapsulation layer 41.
  • a portion of the flexible substrate 10 and a portion of the thin film encapsulation layer 40 located in the third frame area 123 are bent along the direction facing away from the display surface.
  • part of the flexible substrate 10 and part of the thin-film encapsulation layer 40 located in the third frame region 123 and the fourth frame region 124 are bent and arranged along a direction facing away from the display surface.
  • the bending angle when the bending is set is greater than or equal to 90° and less than or equal to 180°, and the bending angle is preferably 90° as shown in FIG. 2.
  • a flexible substrate 10 is provided, and a buffer layer 20 and an OLED light emitting layer 30 are sequentially deposited on the flexible substrate 10, the flexible substrate 10 includes a display area 11 and a non-display area 12, and then the OLED light emitting layer is completed 30
  • the film-formed flexible substrate 10 is fed into a chemical vapor deposition chamber, a mask plate is provided at the non-display area 12 at the edge of the display area 11, and the mask plate and the flexibility are controlled
  • the distance of the substrate 10 is H1
  • the first inorganic encapsulation layer 41 is deposited using the mask plate, so that the thickness of the first inorganic encapsulation layer 41 in the portion of the non-display area 12 is close to the display area
  • the position of 11 decreases from the position away from the display area 11 in sequence, as shown in FIG. 3A.
  • the distance between the reticle and the flexible substrate 10 is controlled to be H2, and the first organic encapsulation layer 42 is deposited using the reticle, so that a portion of the first The thickness of the organic encapsulation layer 42 decreases in sequence from a position close to the display area 11 to a position away from the display area 11 and ensures that the boundary of the first organic encapsulation layer 42 is set on the first inorganic encapsulation layer 41 Inside, as shown in Figure 3B.
  • the distance between the reticle and the flexible substrate 10 is controlled to be H3, and the second inorganic encapsulation layer 43 is deposited using the reticle, so that the second portion located in the non-display area 12
  • the thickness of the inorganic encapsulation layer 43 decreases in sequence from a position close to the display area 11 to a position away from the display area 11, and ensures that the boundary of the second inorganic encapsulation layer 43 is larger than that of the first organic encapsulation layer 41 Boundary, and the boundary of the second inorganic encapsulation layer 43 is in contact with the boundary 41 of the first inorganic encapsulation layer, as shown in FIG. 3C.
  • the module process flow is entered.
  • the four corners of the thin film encapsulation layer 40 are provided with alignment marks, and the alignment marks are preferably cross marks. As shown in FIG. 1, the alignment marks are preferably cross marks.
  • FIG. 4A it is a side view of the flexible OLED display device of the present application on the carrier table before bending; wherein, the thin film encapsulated OLED display device 50 is placed on the carrier platform 60 of the bending machine , And vacuum suction, the edge of the OLED display device 50 is clamped or adhered by the clamp 70, the clamp 70 is a special material, does not damage the OLED display device 50, and then through the roller 80 to the OLED
  • the display device 50 is bent, and the bending angle when the bending is set is greater than or equal to 90° and less than or equal to 180°, and the bending angle is preferably 90°, as shown in FIG. 4B.
  • a portion of the flexible substrate 10 and a portion of the thin film encapsulation layer 40 located in the first frame area 121 and the second frame area 122 are bent along the direction facing away from the display surface.
  • the display area 11 of the screen is the smallest.
  • part of the flexible substrate 10 and part of the thin-film encapsulation layer 40 located in the first frame region 121, the second frame region 122, and the third frame region 123 can also be displayed along the back The direction of the face is bent.
  • part of the flexible substrate 10 and part of the film located in the first frame region 121, the second frame region 122, the third frame region 123, and the fourth frame region 124 may also be
  • the encapsulation layer 40 is bent along the direction facing away from the display surface, and at this time, the display area 11 of the display screen is the largest.
  • the thin film encapsulation layer includes a third inorganic encapsulation layer 44, a second organic encapsulation layer 45, a fourth inorganic encapsulation layer 46, a third organic encapsulation layer 47, and a fifth inorganic encapsulation layer 48 that are stacked.
  • the boundary of the second organic encapsulation layer 45 is disposed inside the third inorganic encapsulation layer 44; the boundary of the third organic encapsulation layer 47 is disposed inside the fourth inorganic encapsulation layer 46.
  • the boundary of the fourth inorganic encapsulation layer 46 is larger than the boundary of the second organic encapsulation layer 45, and the boundary of the fourth inorganic encapsulation layer 46 is in contact with the boundary of the third inorganic encapsulation layer 44;
  • the boundary of the fifth inorganic encapsulation layer 48 is larger than the boundary of the third organic encapsulation layer 47, and the boundary of the fifth inorganic encapsulation layer 48 is in contact with the boundary of the fourth inorganic encapsulation layer 46.
  • the preparation process of the second solution of the flexible OLED display device of the present application is the same as the first solution, and will not be repeated here.
  • the flexible OLED display device of the present application prepares a boundary of a multi-layer thin-film encapsulation layer with a variable thickness by adjusting the distance between the mask and the substrate, which is beneficial to improve its bending resistance, thereby achieving a large-angle bending of the edge of the display area, further It can realize the ultra-narrow border of the display screen or even no border.
  • the flexible OLED display device provided by the present application prepares a multi-thin film encapsulation layer boundary, and folds the flexible substrate and the film encapsulation layer outside the edge of the display area to the side or back of the display screen, reducing the outer frame
  • the width of the display further increases the area of the display area of the display screen, further realizing the ultra-narrow border of the display screen.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种柔性OLED显示装置，包括：柔性基板、缓冲层、OLED发光层以及薄膜封装层；其中，位于非显示区域的部分所述薄膜封装层的厚度由靠近显示区域的位置到远离显示区域的位置依次减小；位于第一边框区域以及第二边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。

Description

柔性OLED显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种柔性OLED显示装置。
 背景技术
目前随着信息技术的快速发展，有机发光二极管(OLED)显示器作为用于显示图像的显示设备已备受关注。市场对OLED全面屏的迫切需求，由此带动柔性显示装置从屏幕的尺寸到显示的质量都取得了较大的进步。柔性显示装置具有耐冲击、抗震能力强、重量轻、体积小、便于携带、成本低廉等诸多优点。现有的柔性产品也广泛的应用到触控领域，柔性触控显示面板中的触控通常采用外挂式的设计方式，柔性触控显示面板的电极绑定通常采用外接柔性驱动电路的绑定方式，现有技术的柔性OLED显示装置的电极绑定区域较大，无法实现窄边框。因此增大显示屏的显示区域越来越受到人们的关注，窄边框也变的越来越重要。
综上所述，现有的柔性OLED显示装置，由于电极绑定区域较大，导致外边框的宽度过大，进一步使显示屏显示区域的面积变小，无法实现窄边框。
 技术问题
现有的柔性OLED显示装置，由于电极绑定区域较大，导致外边框的宽度过大，进一步使显示屏显示区域的面积变小，无法实现窄边框。
 技术解决方案
本申请提供一种柔性OLED显示装置，使柔性OLED显示装置得边缘的柔性基板以及薄膜封装层全部折到显示屏的侧面或背面，以解决现有的柔性OLED显示装置，由于电极绑定区域较大，导致外边框的宽度过大，进一步使显示屏显示区域的面积变小，无法实现窄边框的技术问题。
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种柔性OLED显示装置，包括：柔性基板、缓冲层、OLED发光层以及薄膜封装层；其中，所述柔性基板包括显示区域以及位于所述显示区域边缘的非显示区域，所述非显示区域包括第一边框区域、第二边框区域、第三边框区域和第四边框区域，所述第一边框区域和所述第二边框区域相对，所述第三边框区域和所述第四边框区域相对；所述薄膜封装层位于所述显示区域以及所述非显示区域，位于所述非显示区域的部分所述薄膜封装层的厚度由靠近所述显示区域的位置到远离所述显示区域的位置依次减小；位于所述第一边框区域以及所述第二边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置，所述弯折设置时的弯折角度大于或等于90°并且小于或等于180°。
在本申请实施例所提供的柔性OLED显示装置中，位于所述第三边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
在本申请实施例所提供的柔性OLED显示装置中，位于所述第三边框区域以及所述第四边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
在本申请实施例所提供的柔性OLED显示装置中，所述薄膜封装层包括层叠设置的第一无机封装层、第一有机封装层以及第二无机封装层。
在本申请实施例所提供的柔性OLED显示装置中，所述第一有机封装层的边界设置于所述第一无机封装层的内部。
在本申请实施例所提供的柔性OLED显示装置中，所述第二无机封装层的边界大于所述第一有机封装层的边界，并且所述第二无机封装层的边界与所述第一无机封装层的边界相接触。
在本申请实施例所提供的柔性OLED显示装置中，所述薄膜封装层包括层叠设置的第三无机封装层、第二有机封装层、第四无机封装层、第三有机封装层以及第五无机封装层。
在本申请实施例所提供的柔性OLED显示装置中，所述第二有机封装层的边界设置于所述第三无机封装层的内部；所述第三有机封装层的边界设置于所述第四无机封装层的内部。
在本申请实施例所提供的柔性OLED显示装置中，所述第四无机封装层的边界大于所述第二有机封装层的边界，并且所述第四无机封装层的边界与所述第三无机封装层的边界相接触；所述第五无机封装层的边界大于所述第三有机封装层的边界，并且所述第五无机封装层的边界与所述第四无机封装层的边界相接触。
本申请提供还一种柔性OLED显示装置，包括：柔性基板、缓冲层、OLED发光层以及薄膜封装层；其中，所述柔性基板包括显示区域以及位于所述显示区域边缘的非显示区域，所述非显示区域包括第一边框区域、第二边框区域、第三边框区域和第四边框区域，所述第一边框区域和所述第二边框区域相对，所述第三边框区域和所述第四边框区域相对；所述薄膜封装层位于所述显示区域以及所述非显示区域，位于所述非显示区域的部分所述薄膜封装层的厚度由靠近所述显示区域的位置到远离所述显示区域的位置依次减小；位于所述第一边框区域以及所述第二边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
在本申请实施例所提供的柔性OLED显示装置中，位于所述第三边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
在本申请实施例所提供的柔性OLED显示装置中，位于所述第三边框区域以及所述第四边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
在本申请实施例所提供的柔性OLED显示装置中，所述薄膜封装层包括层叠设置的第一无机封装层、第一有机封装层以及第二无机封装层。
在本申请实施例所提供的柔性OLED显示装置中，所述第一有机封装层的边界设置于所述第一无机封装层的内部。
在本申请实施例所提供的柔性OLED显示装置中，所述第二无机封装层的边界大于所述第一有机封装层的边界，并且所述第二无机封装层的边界与所述第一无机封装层的边界相接触。
在本申请实施例所提供的柔性OLED显示装置中，所述薄膜封装层包括层叠设置的第三无机封装层、第二有机封装层、第四无机封装层、第三有机封装层以及第五无机封装层。
在本申请实施例所提供的柔性OLED显示装置中，所述第二有机封装层的边界设置于所述第三无机封装层的内部；所述第三有机封装层的边界设置于所述第四无机封装层的内部。
在本申请实施例所提供的柔性OLED显示装置中，所述第四无机封装层的边界大于所述第二有机封装层的边界，并且所述第四无机封装层的边界与所述第三无机封装层的边界相接触；所述第五无机封装层的边界大于所述第三有机封装层的边界，并且所述第五无机封装层的边界与所述第四无机封装层的边界相接触。
 有益效果
本申请的有益效果为：本申请提供的柔性OLED显示装置，制备出多薄层的薄膜封装层边界，并将显示区域边缘外的柔性基板以及薄膜封装层全部折到显示屏的侧面或背面，减少了外边框的宽度，进一步使显示屏显示区域的面积变大，更进一步实现了显示屏的超窄边框。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请柔性OLED显示装置方案一弯折前的俯视图。
图2为本申请柔性OLED显示装置方案一弯折后的侧视图。
图3A-图3C为本申请柔性OLED显示装置方案一弯折前的制备流程图。
图4A为本申请柔性OLED显示装置方案一弯折前在载物机台上的侧视图。
图4B为本申请柔性OLED显示装置方案一弯折后在载物机台上的侧视图。
图5为本申请柔性OLED显示装置方案二弯折后的侧视图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有的柔性OLED显示装置，由于电极绑定区域较大，导致外边框的宽度过大，进一步使显示屏显示区域的面积变小，无法实现窄边框的技术问题，本实施例能够解决该缺陷。
如图1所示，为本申请柔性OLED显示装置方案一弯折前的俯视图；图2为本申请柔性OLED显示装置方案一弯折后的侧视图。
参照图1和图2，本申请柔性OLED显示装置方案一包括：柔性基板10、缓冲层20、OLED发光层30以及薄膜封装层40；其中，所述柔性基板10包括显示区域11以及位于所述显示区域11边缘的非显示区域12，所述非显示区域12包括第一边框区域121、第二边框区域122、第三边框区域123和第四边框区域124，所述第一边框区域121和所述第二边框区域122相对，所述第三边框区域123和所述第四边框区域124相对；所述薄膜封装层40位于所述显示区域11以及所述非显示区域12，位于所述非显示区域12的部分所述薄膜封装层40的厚度由靠近所述显示区域11的位置到远离所述显示区域11的位置依次减小；位于所述第一边框区域121以及所述第二边框区域122的部分所述柔性基板10和部分所述薄膜封装层40沿着背向显示面的方向弯折设置。
具体地，所述柔性基板10可以为薄的金属片，也可以由聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜 (PES)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、多芳基化合物(PAR)或玻璃纤维增强塑料(FRP)等聚合物材料形成。
具体地，所述缓冲层20设置于所述柔性基板10的表面并位于所述显示区域11，所述缓冲层20的材料为氮化硅或氧化硅其中的一种或两种。
具体地，所述OLED发光层30，设置于所述缓冲层20的表面并位于所述显示区域11，所述OLED发光层30通常包含开关层(具有若干薄膜晶体管)、平坦层、像素限定层、阳极、发光材料层以及阴极等。
具体地，所述薄膜封装层40，设置于所述柔性基板10的表面并完全覆盖所述缓冲层20以及所述OLED发光层30，所述薄膜封装层40位于所述显示区域11以及所述非显示区域12，位于所述非显示区域12的部分所述薄膜封装层40的厚度由靠近所述显示区域11的位置到远离所述显示区域11的位置依次减小；所述薄膜封装层40包括层叠设置的第一无机封装层41、第一有机封装层42以及第二无机封装层43。
其中，所述第一无机封装层41为无机材料制备，例如氮化硅或氧化铝等无机薄膜；所述第一无机封装层41为亲水性薄膜；所述第一无机封装层41优选采用等离子体增强化学气相沉积法或原子层沉积法工艺制作。其中等离子体增强化学气相沉积法是借助微波或射频等使含有薄膜组成原子的气体电离，在局部形成等离子体，而等离子体化学活性很强，很容易发生反应，从而在所述柔性基板10的表面上沉积出所期望的薄膜。而原子层沉积法是一种可以将物质以单原子膜形式一层一层的镀在基板表面的方法。
所述第一有机封装层42的材料为有机共聚物优选为聚烯酸酯；所述第一有机封装层42是通过喷涂技术形成于所述第一无机封装层41上；所述第二无机封装层43的材料与所述第一无机封装层41相同，所述第二无机封装层43优选采用等离子体增强化学气相沉积法或原子层沉积法工艺制作。
具体地，所述第一有机封装层42的边界设置于所述第一无机封装层41的内部；所述第二无机封装层43的边界大于所述第一有机封装层42的边界，并且所述第二无机封装层43的边界与所述第一无机封装层41的边界相接触。
具体地，位于所述第三边框区域123的部分所述柔性基板10和部分所述薄膜封装层40沿着背向显示面的方向弯折设置。
具体地，位于所述第三边框区域123以及所述第四边框区域124的部分所述柔性基板10和部分所述薄膜封装层40沿着背向显示面的方向弯折设置。
具体地，所述弯折设置时的弯折角度大于或等于90°并且小于或等于180°，所述弯折角度如图2所示优选为90°。
本申请柔性OLED显示装置方案一的制备过程如下：
首先，提供一柔性基板10，在所述柔性基板10上依次沉积出缓冲层20以及OLED发光层30，所述柔性基板10包括显示区域11以及非显示区域12，然后将完成所述OLED发光层30成膜后的所述柔性基板10送入化学气相沉积腔体中，在所述显示区域11边缘处的所述非显示区域12提供掩膜版，并控制所述掩膜版与所述柔性基板10的距离为H1，使用所述掩膜版沉积出所述第一无机封装层41，使得位于所述非显示区域12的部分所述第一无机封装层41的厚度由靠近所述显示区域11的位置到远离所述显示区域11的位置依次减小，如图3A所示。
然后，控制所述掩膜版与所述柔性基板10的距离为H2，使用所述掩膜版沉积出所述第一有机封装层42，使得位于所述非显示区域12的部分所述第一有机封装层42的厚度由靠近所述显示区域11的位置到远离所述显示区域11的位置依次减小，并且确保所述第一有机封装层42的边界设置于所述第一无机封装层41的内部，如图3B所示。
之后，控制所述掩膜版与所述柔性基板10的距离为H3，使用所述掩膜版沉积出所述第二无机封装层43，使得位于所述非显示区域12的部分所述第二无机封装层43的厚度由靠近所述显示区域11的位置到远离所述显示区域11的位置依次减小，并且确保所述第二无机封装层43的边界大于所述第一有机封装层41的边界，并且所述第二无机封装层43的边界与所述第一无机封装层的边界41相接触，如图3C所示。
完成所述薄膜封装层40的制备之后，进入模组工艺流程中。如图1所示，其中，所述薄膜封装层40的边缘四角设置有对位标志，所述对位标志优选为十字标志。图4A所示，为本申请柔性OLED显示装置方案一弯折前在载物机台上的侧视图；其中，将已完成薄膜封装的OLED显示装置50放置在弯折机台载物平台60上，并真空吸附，所述OLED显示装置50的边缘用夹钳70夹住或者粘附住，所述夹钳70为特殊材质，不损伤所述OLED显示装置50，之后通过滚筒80对所述OLED显示装置50进行弯折，弯折设置时的弯折角度大于或等于90°并且小于或等于180°，所述弯折角度优选为90°，如图4B所示。
具体地，将位于所述第一边框区域121以及所述第二边框区域122的部分所述柔性基板10和部分所述薄膜封装层40沿着背向显示面的方向弯折设置，此时显示屏的所述显示区域11最小。
具体地，还可以将位于所述第一边框区域121、所述第二边框区域122以及所述第三边框区域123的部分所述柔性基板10和部分所述薄膜封装层40沿着背向显示面的方向弯折设置。
具体地，还可以将位于所述第一边框区域121、所述第二边框区域122、所述第三边框区域123以及所述第四边框区域124的部分所述柔性基板10和部分所述薄膜封装层40沿着背向显示面的方向弯折设置，此时显示屏的所述显示区域11最大。
如图5所示，为本申请柔性OLED显示装置方案二弯折后的侧视图。其中，所述薄膜封装层包括层叠设置的第三无机封装层44、第二有机封装层45、第四无机封装层46、第三有机封装层47以及第五无机封装层48。
具体地，所述第二有机封装层45的边界设置于所述第三无机封装层44的内部；所述第三有机封装层47的边界设置于所述第四无机封装层46的内部。
具体地，所述第四无机封装层46的边界大于所述第二有机封装层45的边界，并且所述第四无机封装层46的边界与所述第三无机封装层44的边界相接触；所述第五无机封装层48的边界大于所述第三有机封装层47的边界，并且所述第五无机封装层48的边界与所述第四无机封装层46的边界相接触。
本申请柔性OLED显示装置方案二的制备过程与方案一相同，在此不作重复说明。
本申请柔性OLED显示装置通过调节掩膜与基板的间距来制备厚度渐变的多薄层的薄膜封装层的边界，有利于提升其耐弯折性能，从而实现显示区域边缘的大角度弯折，进一步能够实现显示屏超窄边框乃至无边框。
有益效果：本申请提供的柔性OLED显示装置，制备出多薄层的薄膜封装层边界，并将显示区域边缘外的柔性基板以及薄膜封装层全部折到显示屏的侧面或背面，减少了外边框的宽度，进一步使显示屏显示区域的面积变大，更进一步实现了显示屏的超窄边框。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种柔性OLED显示装置，其中，包括：
    柔性基板，包括显示区域以及位于所述显示区域边缘的非显示区域，所述非显示区域包括第一边框区域、第二边框区域、第三边框区域和第四边框区域，所述第一边框区域和所述第二边框区域相对，所述第三边框区域和所述第四边框区域相对；
    缓冲层，设置于所述柔性基板的表面并位于所述显示区域；
    OLED发光层，设置于所述缓冲层的表面；
    薄膜封装层，设置于所述柔性基板的表面并完全覆盖所述缓冲层以及所述OLED发光层，所述薄膜封装层位于所述显示区域以及所述非显示区域，位于所述非显示区域的部分所述薄膜封装层的厚度由靠近所述显示区域的位置到远离所述显示区域的位置依次减小；
    其中，位于所述第一边框区域以及所述第二边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置，所述弯折设置时的弯折角度大于或等于90°并且小于或等于180°。
  2. 根据权利要求1所述的柔性OLED显示装置，其中，位于所述第三边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
  3. 根据权利要求1所述的柔性OLED显示装置，其中，位于所述第三边框区域以及所述第四边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
  4. 根据权利要求1所述的柔性OLED显示装置，其中，所述薄膜封装层包括层叠设置的第一无机封装层、第一有机封装层以及第二无机封装层。
  5. 根据权利要求4所述的柔性OLED显示装置，其中，所述第一有机封装层的边界设置于所述第一无机封装层的内部。
  6. 根据权利要求4所述的柔性OLED显示装置，其中，所述第二无机封装层的边界大于所述第一有机封装层的边界，并且所述第二无机封装层的边界与所述第一无机封装层的边界相接触。
  7. 根据权利要求1所述的柔性OLED显示装置，其中，所述薄膜封装层包括层叠设置的第三无机封装层、第二有机封装层、第四无机封装层、第三有机封装层以及第五无机封装层。
  8. 根据权利要求7所述的柔性OLED显示装置，其中，所述第二有机封装层的边界设置于所述第三无机封装层的内部；所述第三有机封装层的边界设置于所述第四无机封装层的内部。
  9. 根据权利要求7所述的柔性OLED显示装置，其中，所述第四无机封装层的边界大于所述第二有机封装层的边界，并且所述第四无机封装层的边界与所述第三无机封装层的边界相接触；所述第五无机封装层的边界大于所述第三有机封装层的边界，并且所述第五无机封装层的边界与所述第四无机封装层的边界相接触。
  10. 一种柔性OLED显示装置，其中，包括：
    柔性基板，包括显示区域以及位于所述显示区域边缘的非显示区域，所述非显示区域包括第一边框区域、第二边框区域、第三边框区域和第四边框区域，所述第一边框区域和所述第二边框区域相对，所述第三边框区域和所述第四边框区域相对；
    缓冲层，设置于所述柔性基板的表面并位于所述显示区域；
    OLED发光层，设置于所述缓冲层的表面；
    薄膜封装层，设置于所述柔性基板的表面并完全覆盖所述缓冲层以及所述OLED发光层，所述薄膜封装层位于所述显示区域以及所述非显示区域，位于所述非显示区域的部分所述薄膜封装层的厚度由靠近所述显示区域的位置到远离所述显示区域的位置依次减小；
    其中，位于所述第一边框区域以及所述第二边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
  11. 根据权利要求10所述的柔性OLED显示装置，其中，位于所述第三边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
  12. 根据权利要求10所述的柔性OLED显示装置，其中，位于所述第三边框区域以及所述第四边框区域的部分所述柔性基板和部分所述薄膜封装层沿着背向显示面的方向弯折设置。
  13. 根据权利要求10所述的柔性OLED显示装置，其中，所述薄膜封装层包括层叠设置的第一无机封装层、第一有机封装层以及第二无机封装层。
  14. 根据权利要求13所述的柔性OLED显示装置，其中，所述第一有机封装层的边界设置于所述第一无机封装层的内部。
  15. 根据权利要求13所述的柔性OLED显示装置，其中，所述第二无机封装层的边界大于所述第一有机封装层的边界，并且所述第二无机封装层的边界与所述第一无机封装层的边界相接触。
  16. 根据权利要求10所述的柔性OLED显示装置，其中，所述薄膜封装层包括层叠设置的第三无机封装层、第二有机封装层、第四无机封装层、第三有机封装层以及第五无机封装层。
  17. 根据权利要求16所述的柔性OLED显示装置，其中，所述第二有机封装层的边界设置于所述第三无机封装层的内部；所述第三有机封装层的边界设置于所述第四无机封装层的内部。
  18. 根据权利要求16所述的柔性OLED显示装置，其中，所述第四无机封装层的边界大于所述第二有机封装层的边界，并且所述第四无机封装层的边界与所述第三无机封装层的边界相接触；所述第五无机封装层的边界大于所述第三有机封装层的边界，并且所述第五无机封装层的边界与所述第四无机封装层的边界相接触。
PCT/CN2018/123867 2018-12-04 2018-12-26 柔性oled显示装置 Ceased WO2020113715A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/320,103 US11101445B2 (en) 2018-12-04 2018-12-26 Flexible OLED display device having a bending angle

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811474006.7A CN109560113A (zh) 2018-12-04 2018-12-04 柔性oled显示装置
CN201811474006.7 2018-12-04

Publications (1)

Publication Number Publication Date
WO2020113715A1 true WO2020113715A1 (zh) 2020-06-11

Family

ID=65868866

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/123867 Ceased WO2020113715A1 (zh) 2018-12-04 2018-12-26 柔性oled显示装置

Country Status (3)

Country Link
US (1) US11101445B2 (zh)
CN (1) CN109560113A (zh)
WO (1) WO2020113715A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102801661B1 (ko) * 2019-04-09 2025-04-30 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN116322159A (zh) * 2019-12-20 2023-06-23 京东方科技集团股份有限公司 显示面板及其制作方法和对位方法
CN111584743A (zh) * 2020-05-13 2020-08-25 武汉华星光电半导体显示技术有限公司 一种显示面板及显示装置
CN111952481B (zh) * 2020-08-25 2022-11-04 湖北长江新型显示产业创新中心有限公司 显示面板及电子设备
KR20220095312A (ko) * 2020-12-29 2022-07-07 삼성디스플레이 주식회사 표시 장치 및 이를 포함하는 타일형 표시 장치
CN113112913A (zh) * 2021-03-18 2021-07-13 武汉华星光电半导体显示技术有限公司 显示装置
KR20230057017A (ko) * 2021-10-21 2023-04-28 삼성전자주식회사 유기 박막 트랜지스터 및 그 제조 방법, 박막 트랜지스터 어레이 패널 및 전자 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103660A (zh) * 2013-04-04 2014-10-15 谢再锋 一种复合薄膜封装的有机发光二极管显示器及其制造方法
CN107728396A (zh) * 2017-10-31 2018-02-23 武汉华星光电技术有限公司 显示面板及显示器
CN108122497A (zh) * 2018-02-02 2018-06-05 京东方科技集团股份有限公司 一种柔性阵列基板、柔性显示装置及组装方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5167624B2 (ja) * 2005-12-28 2013-03-21 セイコーエプソン株式会社 電気泳動表示装置及び電子機器
KR101074806B1 (ko) * 2009-12-10 2011-10-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
KR102080008B1 (ko) * 2013-07-12 2020-02-24 삼성디스플레이 주식회사 유기발광표시장치 및 그 제조방법
KR102096054B1 (ko) * 2013-08-14 2020-04-02 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
KR102076098B1 (ko) * 2013-11-25 2020-02-11 엘지디스플레이 주식회사 표시장치
CN104269498A (zh) * 2014-09-03 2015-01-07 京东方科技集团股份有限公司 一种有机电致发光器件及其制备方法、显示装置
CN105047829B (zh) 2015-09-18 2017-05-10 京东方科技集团股份有限公司 有机电致发光器件的封装结构及封装方法、柔性显示装置
KR102329978B1 (ko) * 2015-10-28 2021-11-22 엘지디스플레이 주식회사 플렉서블 유기발광다이오드 표시장치
KR102541448B1 (ko) * 2016-03-08 2023-06-09 삼성디스플레이 주식회사 디스플레이 장치
WO2018198262A1 (ja) * 2017-04-27 2018-11-01 シャープ株式会社 フレキシブル表示装置
CN107863452A (zh) 2017-11-02 2018-03-30 武汉华星光电技术有限公司 柔性显示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103660A (zh) * 2013-04-04 2014-10-15 谢再锋 一种复合薄膜封装的有机发光二极管显示器及其制造方法
CN107728396A (zh) * 2017-10-31 2018-02-23 武汉华星光电技术有限公司 显示面板及显示器
CN108122497A (zh) * 2018-02-02 2018-06-05 京东方科技集团股份有限公司 一种柔性阵列基板、柔性显示装置及组装方法

Also Published As

Publication number Publication date
US20210184165A1 (en) 2021-06-17
US11101445B2 (en) 2021-08-24
CN109560113A (zh) 2019-04-02

Similar Documents

Publication Publication Date Title
WO2020113715A1 (zh) 柔性oled显示装置
JP7558236B2 (ja) 表示装置
US11061438B2 (en) Flexible display panel, manufacturing method thereof and display device
US11296308B2 (en) Flexible display device manufacturing method and flexible display device
US10083997B2 (en) Mask for deposition, apparatus for manufacturing display apparatus having the same, and method of manufacturing display apparatus with manufacturing display apparatus having mask for deposition
WO2019037220A1 (zh) 柔性盖板及其制作方法、柔性oled显示装置
US11329252B2 (en) Display model, manufacturing method thereof, and electronic device
CN102541348B (zh) 触摸面板和具有触摸面板的平板显示设备
US8586171B2 (en) Display panel
CN104600092B (zh) Oled触控显示装置及其制造方法
WO2020073745A1 (zh) 柔性衬底、柔性显示面板、柔性显示装置及其制作方法
CN102402067B (zh) 制造柔性液晶显示器的系统和制造柔性显示器的方法
WO2017117961A1 (zh) 显示面板及其制备方法、显示装置
KR102818641B1 (ko) 표시 장치의 제조장치 및 표시 장치의 제조방법
CN107946479B (zh) 掩模组件及通过使用掩模组件制造显示装置的装置和方法
WO2020113754A1 (zh) 显示模组及其制作方法、电子装置
US11629397B2 (en) Mask assembly, apparatus, and method of manufacturing display device
WO2021036179A1 (zh) 一种显示面板及掩膜板
CN108663852A (zh) 显示面板和显示装置
US20220049342A1 (en) Mask and fabricating method thereof, and displaying base plate and fabricating method thereof
US9335587B2 (en) Liquid crystal cell and method for manufacturing the same
JP2020531914A (ja) Ａｍｏｌｅｄ表示パネル及び表示装置
WO2020082718A1 (zh) 胶框的制作方法及显示面板
WO2021036177A1 (zh) 一种触控显示面板及其制备方法和触控显示装置
CN103499903B (zh) 辅助封框胶结构、对盒基板及显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18942203

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18942203

Country of ref document: EP

Kind code of ref document: A1