WO2020107381A1 - 光学指纹传感器模组及其形成方法 - Google Patents

光学指纹传感器模组及其形成方法 Download PDF

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Publication number
WO2020107381A1
WO2020107381A1 PCT/CN2018/118450 CN2018118450W WO2020107381A1 WO 2020107381 A1 WO2020107381 A1 WO 2020107381A1 CN 2018118450 W CN2018118450 W CN 2018118450W WO 2020107381 A1 WO2020107381 A1 WO 2020107381A1
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Prior art keywords
layer
light
area
pixel
fingerprint sensor
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PCT/CN2018/118450
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English (en)
French (fr)
Inventor
凌严
朱虹
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上海箩箕技术有限公司
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Priority to PCT/CN2018/118450 priority Critical patent/WO2020107381A1/zh
Publication of WO2020107381A1 publication Critical patent/WO2020107381A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition

Definitions

  • the invention relates to the field of optical fingerprint identification, and in particular to an optical fingerprint sensor module and a method of forming the same.
  • Fingerprint imaging recognition technology is to collect the fingerprint image of the human body through the optical fingerprint sensor, and then compare with the existing fingerprint imaging information in the system to judge whether it is correct or not, and then realize the identification technology. Due to the convenience of its use and the uniqueness of human fingerprints, fingerprint imaging recognition technology has been widely used in various fields, such as security inspection fields such as public security bureaus and customs, building access control systems, and consumer products such as personal computers and mobile phones.
  • the imaging methods of fingerprint imaging recognition technology include optical imaging, capacitive imaging, ultrasonic imaging and other technologies. Relatively speaking, the imaging effect of optical fingerprint imaging recognition technology is relatively good, and the equipment cost is relatively low.
  • the problem solved by the present invention is to provide an optical fingerprint sensor module and a forming method thereof to improve the performance of the optical fingerprint sensor module.
  • an optical fingerprint sensor module including: a self-luminous display panel; an optical fingerprint sensor, the optical fingerprint sensor includes a sensor transparent substrate and a fingerprint sensor on the surface of the sensor transparent substrate A circuit layer, the fingerprint sensing circuit layer includes a first pixel area and a first peripheral area located around the first pixel area, the fingerprint sensing circuit layer includes a first sensing surface, and the first sensing surface Sensor-oriented light-transmitting substrate; a light collimator layer between the optical fingerprint sensor and the self-luminous display panel, the light collimator layer facing the first sensing surface of the first pixel area; a light absorbing layer, The light absorbing layer is located on the first sensing surface of the first peripheral area.
  • the method further includes: a first adhesive layer between the optical collimator layer and the optical fingerprint sensor, the first adhesive layer being in contact with the first sensing surface of the first pixel area and There is no contact with the first sensing surface of the first peripheral area.
  • the first bonding layer includes a first bonding center area and a first bonding edge area around the first bonding center area; the first pixel area includes a first pixel center area and a A first pixel edge area around a pixel center area; a first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; the light absorption
  • the layer also extends between the first adhesive edge region and the first pixel edge region.
  • the width of the edge area of the first pixel is greater than or equal to 0.5 mm and less than or equal to 2 mm.
  • the light absorbing layer also covers the entire side wall of the first adhesive layer.
  • the light collimator layer is in contact with the first sensing surface of the first pixel area.
  • the light absorption layer also covers the side wall of the light collimator layer.
  • the method further includes: a second adhesive layer between the self-luminous display panel and the light collimator layer; the light absorption layer covers the entire side wall of the light collimator layer and the second The entire side wall of the adhesive layer.
  • the light absorbing layer also covers the side wall of the sensor transparent substrate and the side wall of the fingerprint sensing circuit layer.
  • the material of the light absorption layer is epoxy resin, silica gel or ink.
  • the color of the light-absorbing layer is black.
  • the absorption rate of the light absorption layer of 400 nm to 900 nm wavelength is more than 90%.
  • the light-absorbing layer and the first sensing surface of the first peripheral area have a bottom contact area; the bottom contact area has a ring structure; and the width of the ring structure is more than 0.5 mm.
  • the sensor transparent substrate is made of glass or PI substrate.
  • the invention also provides a method for forming any of the above optical fingerprint sensor modules, including: providing a self-luminous display panel; forming a sensor collimation module, the sensor collimation module includes an optical fingerprint sensor and an optical fingerprint sensor An optical collimator layer on the surface of the fingerprint sensor, the optical fingerprint sensor includes a sensor transparent substrate and a fingerprint sensing circuit layer on the surface of the sensor transparent substrate, the fingerprint sensing circuit layer is located on the sensor transparent substrate And the optical collimator layer, the fingerprint sensing circuit layer includes a first pixel area and a first peripheral area around the first pixel area, the fingerprint sensing circuit layer includes a first sensing surface, The first sensing surface faces away from the sensor transparent substrate, and the first sensing surface of the first pixel area faces the light collimator layer; a light absorption layer is formed, and the light absorption layer is located on the first peripheral area The first sensing surface; the self-luminous display panel and the light collimator layer are bonded together.
  • the sensor collimation module further includes: a first adhesive layer between the optical collimator layer and the optical fingerprint sensor, the first adhesive layer and the first pixel area Of the first sensing surface is in contact and is not in contact with the first sensing surface in the first peripheral area; the method of forming the sensor collimation module includes: providing an optical fingerprint sensor and an optical collimator layer; using the first bonding The layer bonds the first sensing surface of the first pixel area and the light collimator layer together.
  • the first bonding layer includes a first bonding center area and a first bonding edge area around the first bonding center area; the first pixel area includes a first pixel center area and a A first pixel edge area around a pixel center area; a first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; the light absorption The layer also extends between the first adhesive edge region and the first pixel edge region; the light-absorbing layer includes a first light-absorbing layer; the first sensing layer and the first sensing surface of the first pixel region are Before the light collimator layers are bonded together, a first light absorbing layer is formed on the first sensing surface of the first peripheral region, and the first light absorbing layer extends to the first sensing surface of the first pixel edge region; After the first light absorbing layer is formed, a first bonding layer is used to bond the first sensing surface and the light collimator layer of the first pixel central area,
  • a light absorbing layer is formed on the first sensing surface of the first peripheral area.
  • the light absorbing layer is formed; or, after the light absorbing layer is formed, the self-luminous display panel and the light collimator layer are bonded together .
  • the optical fingerprint sensor includes a sensor transparent substrate, which can reduce the cost of the optical fingerprint sensor.
  • the optical fingerprint sensor module includes a light absorbing layer located on the first sensing surface of the first peripheral area, and the light absorbing layer covers the first sensing surface of the first peripheral area.
  • the light absorbing layer is used to absorb the external light incident around the light collimator layer toward the first sensing surface of the first peripheral area, thereby blocking the external light from entering the sensor transparent substrate and then reflecting or scattering to the first pixel area
  • the first sensing surface of the sensor thus reducing the optical interference of external light on the photosensitive device in the first pixel area, and improving the image quality of the optical fingerprint sensor.
  • the optical fingerprint sensor module further includes: a first adhesive layer between the optical collimator layer and the optical fingerprint sensor.
  • the light-absorbing layer also covers the entire side wall of the first adhesive layer.
  • the light absorbing layer absorbs the light incident on the side wall of the first adhesive layer.
  • the light absorbing layer can not only prevent the light from directly entering the first pixel area from the side wall of the first adhesive layer, but also block the light from the first adhesive layer.
  • the side wall of the junction layer is incident on the transparent substrate of the sensor and then reflected or scattered into the first sensing surface of the first pixel area, thereby reducing the optical interference caused by external light on the photosensitive device in the first pixel area, and improving the optical fingerprint sensor Graphic quality.
  • the light absorption layer also extends between the first adhesive edge area and the first pixel edge area, so the light absorption layer absorbs light incident from the side wall of the first adhesive layer to the first pixel area, the The light absorbing layer will not only block the direct incidence from the side wall of the first adhesive layer to the first pixel area, but also prevent the light from entering the sensor transparent substrate and then being reflected or scattered to the first sensing surface of the first pixel area.
  • the optical interference caused by external light to the photosensitive device in the first pixel area is reduced, and the image quality of the optical fingerprint sensor is improved.
  • the thickness of the light absorption layer does not need to be very thick, and the light absorption layer can be made thinner, which reduces the process difficulty and cost of the light absorption layer.
  • the light absorbing layer also covers the side wall of the light collimator layer, so the light absorbing layer can better surround the first adhesive layer to ensure that external light cannot directly enter the first adhesive layer from above and then enter the first adhesive layer In a pixel area, a signal that does not carry fingerprint information is avoided, and optical interference caused by external light on the photosensitive device in the first pixel area is reduced.
  • the light absorption layer covers the entire side wall of the light collimator layer and the entire side of the second adhesive layer wall.
  • Benefits include: blocking external light from entering the light collimator through the second adhesive layer, and then blocking external light from entering the photosensitive device of the optical sensor, avoiding generating signals that do not carry fingerprint information, generating signals, and reducing external light to the first pixel area Photosensitive devices cause optical interference.
  • the light absorption layer also covers the side wall of the sensor transparent substrate and the side wall of the fingerprint sensing circuit layer.
  • the light-absorbing layer can block external light from passing through the collimator layer and directly enter the side wall of the sensor transparent substrate and the side wall of the fingerprint sensing circuit layer into the substrate of the optical sensor to prevent the light from being reflected and scattered and entering the first pixel area
  • the first sensing surface avoids the generation of signals that do not carry fingerprint information, and reduces the optical interference caused by external light on the photosensitive device in the first pixel area.
  • Figure 1 is a schematic structural view of an optical fingerprint sensor module
  • FIGS. 2 to 11 are structural schematic diagrams of an optical fingerprint sensor module formation process in an embodiment of the invention.
  • 12 to 14 are structural schematic diagrams of the formation process of an optical fingerprint sensor module in another embodiment of the invention.
  • An optical fingerprint sensor module includes: a self-luminous display panel 130; an optical fingerprint sensor 100; and a light collimator layer 120 between the optical fingerprint sensor 100 and the self-luminous display panel 130.
  • the optical fingerprint sensor 100 includes a sensor transparent substrate and a fingerprint sensing circuit layer on the surface of the sensor transparent substrate.
  • the fingerprint sensing circuit layer includes a first pixel area and a first peripheral area located around the first pixel area.
  • the material of the sensor transparent substrate is glass or PI plastic, which can reduce the cost of the optical fingerprint sensor 100.
  • the light collimator layer 120 is in contact with the first pixel area.
  • the functions of the first peripheral area include: an anisotropic conductive film needs to be provided on the surface of a partial area of the first peripheral area, and the fingerprint sensing circuit layer is connected to the external driving circuit through the anisotropic conductive film.
  • the light collimator layer 120 is provided between the self-luminous display panel 130 and the optical fingerprint sensor 100, there is a certain space between the self-luminous display panel 130 and the first peripheral area of the optical fingerprint sensor 100.
  • the light around the light collimator layer 120 (such as light c) will pass through the first peripheral area and enter the sensor transparent substrate, and then after reflecting or scattering from the sensor transparent substrate, it will pass upward through the area between adjacent photosensitive pixels to reach the light
  • the collimator layer 120 is further reflected by the light collimator layer 120 and reaches the photosensitive pixel in the fingerprint sensing circuit layer, which causes the photosensitive pixel to generate a signal generation signal that does not carry fingerprint information.
  • Photosensitive pixels cause optical interference.
  • the optical fingerprint sensor module further includes: a first adhesive layer 110 between the optical collimator layer 120 and the optical fingerprint sensor 100.
  • the first adhesive layer 110 is in contact with the surface of the first pixel area facing the light collimator layer 120. Accordingly, in order to prevent the first adhesive layer 110 from blocking the light incident from the self-luminous display panel 130 to the optical fingerprint sensor 100, the material of the first adhesive layer 110 needs to be a light-transmitting material.
  • the light around the side of the optical fingerprint sensor module will illuminate the side of the first adhesive layer 110, and then illuminate the pixels in the first pixel area of the optical fingerprint sensor 100 (as light a in FIG. 1), so It will cause light interference to the pixels in the optical fingerprint sensor 100 and reduce the graphic effect.
  • the light irradiated to the side of the first adhesive layer 110 is incident on the sensor transparent substrate (such as light b in FIG. 1), the light b will be reflected or scattered, and then reflected or scattered on the sensor transparent substrate Upward through the area between adjacent photosensitive pixels to reach the light collimator layer 120, and then reflected by the light collimator layer 120 down to the photosensitive pixels, which will cause light interference to the pixels in the optical fingerprint sensor 100, reducing graphics effect.
  • the present invention provides an optical fingerprint sensor module, including: a self-luminous display panel; an optical fingerprint sensor, the optical fingerprint sensor includes a sensor transparent substrate and a fingerprint sensing on the surface of the sensor transparent substrate A circuit layer, the fingerprint sensing circuit layer includes a first pixel area and a first peripheral area located around the first pixel area, the fingerprint sensing circuit layer includes a first sensing surface, and the first sensing surface Sensor-oriented light-transmitting substrate; a light collimator layer between the optical fingerprint sensor and the self-luminous display panel, the light collimator layer facing the first sensing surface of the first pixel area; a light absorbing layer, The light absorbing layer is located on the first sensing surface of the first peripheral area.
  • the performance of the optical fingerprint sensor module is improved.
  • the up-down relationship in this manual is defined by placing the optical fingerprint sensor module under the user's eyes.
  • the optical fingerprint sensor module is placed under the user's eyes and the display surface of the self-luminous display panel is facing up, if one structure is located above another structure, it means that this structure is closer to the user's eyes than the other structure.
  • FIGS. 2 to 11 are structural schematic diagrams of an optical fingerprint sensor module formation process in an embodiment of the invention.
  • a self-luminous display panel 200 is provided.
  • the self-luminous display panel 200 includes a first light-transmitting substrate 201, a second light-transmitting substrate 202, and a self-luminous circuit layer 203.
  • the self-luminous circuit layer 203 is located between the first light-transmitting substrate 201 and the second light-transmitting substrate 202.
  • the materials of the first light-transmitting substrate 201 and the second light-transmitting substrate 202 may be light-transmitting materials, and the specific material is inorganic glass or organic glass, or other plastic products other than organic glass, such as plastic substrates, and the plastic substrates include PI substrates Or PET substrate.
  • the self-luminous circuit layer 203 includes a plurality of display pixel units 2031.
  • a dotted frame indicates the area where multiple display pixel units 2031 are located, and the adjacent relationship of each display pixel unit 2031. It should be noted that although the dotted frame includes part of the first light-transmitting substrate 201 and the second light-transmitting substrate 202, this is just for display convenience, and the display pixel unit 2031 does not include the first light-transmitting substrate 201 and the second light-transmitting Substrate 202.
  • the self-luminous display panel 200 is an OLED display panel.
  • the display pixel unit 2031 includes an anode layer, a hole injection layer (HIL), a light emitting layer (EML), an electron injection layer (EIL), a cathode layer, etc. Structure, the display pixel unit 2031 may further include a hole transport layer (HTL) and an electron transport layer (ETL), and the display pixel unit 2031 further includes a structure such as a TFT driving an OLED, a driving metal line, and a storage capacitor.
  • the sensor collimation module includes an optical fingerprint sensor and an optical collimator layer on the surface of the optical fingerprint sensor.
  • an optical fingerprint sensor 210 is provided.
  • the optical fingerprint sensor 210 includes a sensor transparent substrate 211 and a fingerprint sensing circuit layer 212 on the surface of the sensor transparent substrate 211.
  • the fingerprint sensing circuit layer 212 includes a A pixel area 210A and a first peripheral area 210B located around the first pixel area 210A, the fingerprint sensing circuit layer 212 includes a first sensing surface 2110, the first sensing surface 2110 faces away from the sensor transparent substrate 211 .
  • the functions of the first peripheral area 210B include: an anisotropic conductive film needs to be provided on the surface of the partial area of the first peripheral area 210B, and the fingerprint sensing circuit layer 212 is connected to the external driving circuit through the anisotropic conductive film.
  • the material of the sensor transparent substrate 211 may be glass or PI substrate.
  • the transmittance of the sensor transparent substrate 211 to visible light is greater than 50%, and the transmittance of the sensor transparent substrate 211 to ultraviolet light is greater than 20%.
  • the PI substrate has better heat resistance and better stability than other plastic substrates.
  • the cost of the sensor light-transmitting substrate 211 is smaller than that of the silicon-based material substrate, which can reduce the cost of the optical fingerprint sensor 210.
  • the fingerprint sensing circuit layer 212 (refer to FIG. 4) includes a first non-light-transmitting area and a first light-transmitting area 2123.
  • the fingerprint sensing circuit layer 212 includes a signal line 21, a drive line 22, and a photosensitive pixel array.
  • the photosensitive pixel array includes a number of photosensitive pixel units. Each photosensitive pixel unit includes a signal control switch 2121, a photosensitive device 2122, and a first light-transmitting area 2123. Neither the signal control switch 2121 nor the photosensitive device 2122 transmits light.
  • the first non-light-transmitting area includes the signal control switch 2121 and the photosensitive device 2122.
  • the first light-transmitting area 2123 is in addition to the signal line 21 and the drive line 22 , The area outside the signal control switch 2121 and the photosensitive device 2122.
  • the light transmittance of the first non-light-transmitting area to visible light is greater than 50%, and the light transmittance of the first non-light-transmitting area to ultraviolet light is greater than 20%.
  • a light collimator layer 230 is provided.
  • the optical collimator layer 230 has a first collimating surface and a second collimating surface opposite to each other. The first collimating surface and the second collimating surface are parallel.
  • the optical collimator layer 230 includes a plurality of optical collimating units 231. The extending direction of the light collimating unit 231 is perpendicular to the first collimating surface and the second collimating surface.
  • FIG. 6 is a top view corresponding to the light collimator layer 230 of FIG. 5
  • FIG. 7 is a side view corresponding to the light collimator layer 230 of FIG. 5
  • FIG. 8 is a top view of the light collimating unit 231, and FIG. 6 and FIG.
  • Each of the light collimating units 231 is selected and displayed in a dotted frame.
  • the light collimator layer 230 is used to make the light transmitted through the self-luminous display panel 200 more collimated.
  • each light collimating unit 231 has a core layer 2311 and a skin layer 2312 surrounding the core layer 2311.
  • the light collimator layer 230 mainly uses the core layer 2311 to pass light, and the skin layer 2312 is used to absorb light.
  • the core layer 2311 and the skin layer 2312 are used together to achieve the above light collimation effect.
  • the core layer 2311 is selected to have a visible light and infrared light absorption rate of ⁇ 10%.
  • the ultraviolet absorption rate of the core layer 2311 the better.
  • the light transmittance of the core layer 2311 to visible light is greater than 50%, and the light transmittance of the core layer 2311 to ultraviolet light is greater than 20%. The higher the absorption rate of visible light and infrared light by the skin layer 2312, the better, so as to absorb light beyond a specific angle.
  • the cortex 2312 is selected to have a visible light and infrared light absorption rate of >50%.
  • the light obliquely incident to the light collimator layer 230 will not be significantly reflected at the interface of the core layer 2311 and the skin layer 2312 of the light collimating fiber, nor will it be totally reflected, but will be incident from the core layer 2311 into the skin layer 2312, It is absorbed by the cortex 2312. Therefore, light with a small angle between the first collimating surface and the second collimating surface of the light collimator layer 230 will be absorbed by the skin layer 2312 after passing through the skin layer 2312 one or more times. Light rays with a larger angle between the first collimating surface and the second collimating surface can completely pass through one core layer 2311.
  • the angle between the light passing through the light collimator layer 230 and the first collimating surface and the second collimating surface is close to 90 degrees (such as 80 degrees to 90 degrees), while light in other angle ranges is
  • the light-emitting display panel 200 is absorbed.
  • the light collimator layer 230 can make the light passing through the self-luminous display panel 200 more collimated.
  • the collimating effect of the light collimator layer 230 on light helps to improve the fingerprint recognition performance of the optical fingerprint sensor.
  • the optical collimator layer 230 is a flexible collimator.
  • the first adhesive layer 240 is used to bond the optical fingerprint sensor 210 and the light collimator layer 230 together. Specifically, the first adhesive layer 240 is used to bond the first sensing of the first pixel area 210A The face 2110 and the optical collimator layer 230 are bonded together.
  • the fingerprint sensing circuit layer 212 is located between the sensor transparent substrate 211 and the light collimator layer 230, and the first sensing surface 2110 of the first pixel area 210A faces the light collimator layer 230 .
  • the first adhesive layer 240 is in contact with the first sensing surface 2110 of the first pixel area 210A and is not in contact with the first sensing surface 2110 of the first peripheral area 210B.
  • the material of the first adhesive layer 240 transmits light.
  • the thickness of the first adhesive layer 240 is 0.05 mm to 0.12 mm.
  • the sensor collimation module further includes: a first adhesive layer 240 between the optical collimator layer 230 and the optical fingerprint sensor 210, the first adhesive layer 240 and the first pixel area
  • the first sensing surface 2110 of 210A contacts and does not contact the first sensing surface 2110 of the first peripheral area 210B.
  • the self-luminous display panel 200 and the light collimator layer 230 are bonded together.
  • the second adhesive layer 250 is used to bond the self-luminous display panel 200 and the light collimator layer 230 together.
  • a light absorption layer 260 is formed, and the light absorption layer 260 is located on the first sensing surface 2110 of the first peripheral region 210B.
  • the light-absorbing layer 260 covers the first sensing surface 2110 of the first peripheral area 210B.
  • the light absorbing layer 260 is used to absorb the external light incident around the light collimator layer 230 toward the first sensing surface 2110 of the first peripheral area 210B, thereby blocking the external light from entering the sensor transparent substrate 211 and then reflecting or scattering To the first sensing surface of the first pixel area 210A, thus reducing the optical interference of external light on the photosensitive device 2122 in the first pixel area 210A, and improving the image quality of the optical fingerprint sensor.
  • a light absorption layer 260 is formed on the first sensing surface 2110 of the first peripheral area 210B.
  • a light absorption layer 260 is formed.
  • the self-luminous display panel and the light collimator layer are bonded together.
  • the light absorption layer 260 also covers the entire side wall of the first adhesive layer 240.
  • the light-absorbing layer 260 absorbs light incident on the sidewall of the first adhesive layer 240.
  • the light-absorbing layer 260 can not only prevent light from directly entering the first pixel region 210A from the sidewall of the first adhesive layer 240, but also block The light is incident on the sensor transparent substrate 211 from the side wall of the first adhesive layer 240 and then reflected or scattered into the first pixel area 210A, thus reducing the optical interference caused by external light to the photosensitive device 2122 in the first pixel area 210A Graphic quality of optical fingerprint sensor.
  • the light-absorbing layer covers a portion of the side wall of the first adhesive layer.
  • the light absorbing layer 260 also covers the side wall of the light collimator layer 230. Specifically, the light absorbing layer 260 covers the entire side wall of the light collimator layer 230 Or part of the side wall. Therefore, the light absorbing layer 260 can better surround the first adhesive layer 240 to ensure that external light cannot directly enter the first adhesive layer 240 from above and then enter the first pixel area 210A, avoid generating signals that do not carry fingerprint information, and reduce The external light causes optical interference to the photosensitive device 2122 in the first pixel area 210A.
  • the light absorbing layer does not cover the side wall of the light collimator layer.
  • the light absorbing layer also covers the entire side wall of the light collimator layer and the entire side wall of the second adhesive layer. Benefits include: it can block external light from entering the light collimator through the second adhesive layer
  • the sensor avoids entering the photosensitive device of the optical sensor, avoids generating a signal that does not carry fingerprint information, and generates a signal that reduces external light to cause optical interference to the photosensitive device in the first pixel area.
  • the light absorbing layer also covers the side walls of the sensor transparent substrate and the side walls of the fingerprint sensing circuit layer.
  • the light-absorbing layer can block external light from passing through the collimator layer and directly enter the side wall of the sensor transparent substrate and the side wall of the fingerprint sensing circuit layer into the substrate of the optical sensor, to prevent light from being reflected and scattered into the photosensitive sensor
  • the device 2122 avoids generating signals that do not carry fingerprint information, and reduces optical interference caused by external light to the pixel devices in the first pixel area.
  • the material of the light absorption layer 260 is epoxy resin, silica gel or ink.
  • the color of the light absorption layer 260 is black.
  • the light absorption layer 260 has an absorption rate of light at a wavelength of 400 nm to 900 nm above 90%.
  • the light from 400 nm to 900 is relatively sensitive to the fingerprint sensing circuit layer.
  • the light absorbing layer 260 and the first sensing surface 2110 of the first peripheral area 210B have a bottom contact area; the bottom contact area has a ring structure; the width W of the ring structure is 0.5 mm or more . If the width W of the ring structure is less than 0.5 mm, the light-absorbing layer 260 has a poor effect of blocking light.
  • a light-absorbing layer is formed on the first sensing surface of the first peripheral area, and then , The self-luminous display panel and the light collimator layer are bonded together.
  • the light absorption layer is located on the first sensing surface of the first peripheral area, and the light absorption layer covers the side wall of the first adhesive layer, and the light absorption layer covers the first adhesive layer The entire side wall of the light-absorbing layer does not cover the second adhesive layer.
  • the light absorption layer may also cover the entire side wall or part of the side wall of the light collimator layer.
  • the light absorbing layer may also cover the side wall of the sensor transparent substrate and the side wall of the fingerprint sensing circuit layer.
  • the sensor collimation module includes an optical fingerprint sensor and an optical collimator layer on the surface of the optical fingerprint sensor, the optical collimator layer and the first pixel area Of the first sensing surface is in contact with and not in contact with the first peripheral area, and the optical collimator layer is a flexible collimator.
  • the method for forming the sensor collimation module includes: providing an optical fingerprint sensor; forming a light collimator layer on the first sensing surface of the first pixel area.
  • this embodiment also provides an optical fingerprint sensor module formed by the above method, referring to FIG. 11, including: a self-luminous display panel 200; an optical fingerprint sensor 210, the optical fingerprint sensor includes a sensor transparent substrate 211 and A fingerprint sensing circuit layer 212 on the surface of the sensor transparent substrate 211, the fingerprint sensing circuit layer 212 includes a first pixel area 210A and a first peripheral area 210B around the first pixel area 210A, the fingerprint sensing
  • the detection circuit layer 212 includes a first sensing surface 2110 facing away from the sensor transparent substrate 211; a light collimator between the optical fingerprint sensor 210 and the self-luminous display panel 200 Layer 230, the light collimator layer 230 faces the first sensing surface 2110 of the first pixel area 210A; light absorbing layer 260, the light absorbing layer 260 is located on the first sensing surface 2110 of the first peripheral area 210B.
  • the optical fingerprint sensor module further includes: a first adhesive layer 240 between the optical collimator layer 230 and the optical fingerprint sensor 210, the first adhesive layer 240 and the first pixel area 210A
  • the first sensing surface 2110 contacts and does not contact the first sensing surface 2110 of the first peripheral area 210B.
  • the light absorption layer 260 covers the entire sidewall of the first adhesive layer 240.
  • the light absorbing layer 260 also covers the side wall of the light collimator layer 230.
  • the optical fingerprint sensor module further includes: a second adhesive layer 250 between the self-luminous display panel 200 and the light collimator layer 230.
  • the light absorption layer covers the entire sidewall of the light collimator layer 230 and the entire sidewall of the second adhesive layer 250.
  • the light absorbing layer also covers the side walls of the sensor transparent substrate and the side walls of the fingerprint sensing circuit layer.
  • the material of the light absorption layer 260 is epoxy resin, silica gel or ink.
  • the color of the light absorption layer 260 is black.
  • the light absorption layer 260 has an absorption rate of light at a wavelength of 400 nm to 900 nm above 90%.
  • the light absorbing layer 260 and the first sensing surface 2110 of the first peripheral area 210B have a bottom contact area; the bottom contact area has a ring structure; and the width of the ring structure is 0.5 mm or more.
  • the fingerprint sensing circuit layer 212 is located between the sensor transparent substrate 211 and the light collimator layer 230.
  • the sensor light-transmitting substrate 211 is made of glass or PI substrate.
  • the light collimator layer is in contact with the first sensing surface of the first pixel area and is not in contact with the first peripheral area, and the light collimator layer is flexible Collimator.
  • the light collimator layer is flexible Collimator.
  • the first adhesive layer includes a first adhesive center area and is located in the first A first bonding edge area around the bonding center area; the first pixel area includes a first pixel center area and a first pixel edge area around the first pixel center area; the first bonding center area and the first pixel
  • the first sensing surface of the center area is in contact with and not in contact with the first sensing surface of the first pixel edge area; the light absorption layer also extends between the first adhesive edge area and the first pixel edge area; the light absorption
  • the layer includes a first light-absorbing layer; before bonding the optical fingerprint sensor and the light collimator layer together, a first light-absorbing layer is formed on the first sensing surface of the first peripheral area, and the first light-absorbing layer extends to the first A part of the first sensing surface in the edge area of a pixel; after forming the first light absorbing layer, a first adhesive layer is used to separate
  • 12 to 14 are structural schematic diagrams of the formation process of an optical fingerprint sensor module in another embodiment of the invention.
  • a first light absorption layer 360 is formed on the first sensing surface 2110 of the first peripheral region 210B, and the first light absorption layer 360 extends to the first sensing surface 2110 of the first pixel edge region.
  • color and absorption rate of the first light absorbing layer 360 refer to the previous embodiment.
  • the first light absorbing layer 360 and the first sensing surface 2110 of the first peripheral area 210B have a bottom contact area.
  • the size of the bottom contact area refers to the size of the bottom contact area in the previous embodiment.
  • the width of the edge area of the first pixel is greater than or equal to 0.5 mm and less than or equal to 2 mm.
  • the first pixel edge area is an area in the first pixel area where the first light absorption layer 360 is bonded.
  • the width of the edge area of the first pixel is greater than 2 mm, the area in the first pixel area that is designed to be bonded to the first light absorbing layer 360 is too large, causing the first light absorbing layer 360 to light in the light collimator layer Blocking, if the width of the edge area of the first pixel is less than 0.5 mm, the size of the first light absorbing layer 360 extending to the first pixel area is smaller, and the first light absorbing layer 360 is less sensitive to light incident from the sidewall of the first adhesive layer. The blocking effect is poor.
  • the first adhesive layer 340 is used to bond the optical fingerprint sensor 210 and the light collimator layer 230 together. Specifically, the first adhesive layer 340 is used to separate the first The first sensing surface and the light collimator layer 230 in the central area of a pixel, and part of the first light absorption layer 360 and the light collimator layer are bonded together.
  • the first light absorbing layer 360 is located on the first sensing surface 2110 of the first peripheral area 210B, and the first light absorbing layer 360 covers the sidewall of the first adhesive layer 340.
  • the first bonding layer 340 includes a first bonding center area and a first bonding edge area around the first bonding center area; the first pixel area includes a first pixel center area and a first pixel center area The first pixel edge area around the area; the first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; the first light absorbing layer 360 also extends between the first adhesive edge region and the first pixel edge region.
  • the self-luminous display panel 200 and the light collimator layer 230 are bonded together.
  • the second adhesive layer 350 is used to bond the self-luminous display panel 200 and the light collimator layer 230 together.
  • the second adhesive layer 350 is used to bond the self-luminous display panel 200 and the light collimator layer 230 Together.
  • the second adhesive layer is used to bond the self-luminous display panel 200 and the light collimator layer 230 together to form a first light absorbing layer, and then the first adhesive layer is used to bond the optical fingerprint sensor 210 and the light The collimator layer 230 is bonded together; or, after the first light-absorbing layer is formed, the second adhesive layer is used to bond the self-luminous display panel 200 and the light collimator layer 230 together, and then the first adhesive layer is used The optical fingerprint sensor 210 and the light collimator layer 230 are bonded together.
  • the light absorption layer includes only the first light absorption layer 360.
  • a second light absorbing layer is formed, and the second light absorbing layer covers the side wall of the light collimator layer and Part of the side walls of the first adhesive layer, the first light absorbing layer 360 and the second light absorbing layer completely cover the side walls of the first adhesive layer.
  • the second light absorbing layer and the first light absorbing layer 360 constitute a total light absorbing layer.
  • the second adhesive layer is used to bond the self-luminous display panel 200 and the light collimator layer 230
  • a second light absorbing layer is formed, the second light absorbing layer covers the side wall of the light collimator layer and part of the side wall of the first adhesive layer, the first light absorbing layer and the second light absorbing layer bind the first adhesive layer The side walls are fully covered.
  • the second light absorbing layer may also cover the side wall of the second adhesive layer.
  • the second light absorbing layer and the first light absorbing layer constitute a total light absorbing layer.
  • it may further include: forming a third light absorbing layer on the side wall of the sensor transparent substrate and the side wall of the fingerprint sensing circuit layer.
  • the first light absorbing layer, the second light absorbing layer and the third light absorbing layer constitute a total light absorbing layer.
  • this embodiment also provides an optical fingerprint sensor module formed by the above method, please refer to FIG. 14, including: a self-luminous display panel 200; an optical fingerprint sensor 210, the optical fingerprint sensor includes a sensor transparent substrate and A fingerprint sensing circuit layer on the surface of the sensor transparent substrate, the optical fingerprint sensor 210 includes a first pixel area 210A and a first peripheral area 210B around the first pixel area 210A, the optical fingerprint sensor 210 includes a A sensing surface 2110, the first sensing surface facing away from the sensor transparent substrate; a light collimator layer 230 between the optical fingerprint sensor 210 and the self-luminous display panel 200, the light collimating The register layer 230 faces the first sensing surface of the first pixel area; the first adhesive layer 340 between the optical collimator layer 230 and the optical fingerprint sensor 210, the first adhesive layer 340 and the first The first sensing surface of the pixel area 210A is in contact and is not in contact with the first sensing surface of the first peripheral area 210B; the first bonding layer
  • the light absorbing layer and the first sensing surface 2110 of the first peripheral area 210B have a bottom contact area.
  • the light absorbing layer includes only the first light absorbing layer 360, the first light absorbing layer 360 is located on the first sensing surface 2110 of the first peripheral area 210B, and the first light absorbing layer 360 covers the first On the side wall of an adhesive layer 340, the first light absorbing layer 360 also extends between the first adhesive edge region and the first pixel edge region.
  • the width of the edge area of the first pixel is greater than or equal to 0.5 mm and less than or equal to 2 mm.
  • the light absorbing layer includes only the first light absorbing layer 360 and the second light absorbing layer, the second light absorbing layer covers the side wall of the light collimator layer and part of the side wall of the first adhesive layer, the first light absorbing layer and The second light-absorbing layer completely covers the side walls of the first adhesive layer.
  • the optical fingerprint sensor module further includes a second adhesive layer between the self-luminous display panel 200 and the light collimator layer 230.
  • the second light-absorbing layer covers the side wall of the light collimator layer and part of the side walls of the first adhesive layer, and the first light-absorbing layer and the second light-absorbing layer completely cover the side walls of the first adhesive layer
  • the second light-absorbing layer also covers the side wall of the second adhesive layer.
  • the light absorbing layer includes only the first light absorbing layer 360, the second light absorbing layer and the third light absorbing layer.
  • the third light absorbing layer is located on the side wall of the sensor transparent substrate and the side wall of the fingerprint sensing circuit layer.

Abstract

一种光学指纹传感器模组及其形成方法，光学指纹传感器模组包括：自发光显示面板；光学指纹传感器，所述光学指纹传感器包括传感器透光基板和位于所述传感器透光基板表面的指纹感测电路层，所述指纹感测电路层包括第一像素区和位于第一像素区周围的第一周边区，所述指纹感测电路层包括第一感测面，所述第一感测面背向传感器透光基板；位于所述光学指纹传感器和所述自发光显示面板之间的光准直器层，所述光准直器层朝向第一像素区的第一感测面；吸光层，所述吸光层位于所述第一周边区的第一感测面。所述光学指纹传感器模组的性能得到提高。

Description

光学指纹传感器模组及其形成方法 技术领域
本发明涉及光学指纹识别领域，尤其涉及一种光学指纹传感器模组及其形成方法。
背景技术
指纹成像识别技术，是通过光学指纹传感器采集到人体的指纹图像，然后与系统里的已有指纹成像信息进行比对，来判断正确与否，进而实现身份识别的技术。由于其使用的方便性，以及人体指纹的唯一性，指纹成像识别技术已经大量应用于各个领域，如公安局和海关等安检领域、楼宇的门禁系统、以及个人电脑和手机等消费品领域等。
指纹成像识别技术的成像方式有光学成像、电容成像、超声成像等多种技术。相对来说，光学指纹成像识别技术成像效果相对较好，设备成本相对较低。
然而，现有的光学指纹传感器模组的性能有待提高。
发明内容
本发明解决的问题是提供一种光学指纹传感器模组及其形成方法，以提高光学指纹传感器模组的性能。
为解决上述问题，本发明提供一种光学指纹传感器模组，包括：自发光显示面板；光学指纹传感器，所述光学指纹传感器包括传感器透光基板和位于所述传感器透光基板表面的指纹感测电路层，所述指纹感测电路层包括第一像素区和位于第一像素区周围的第一周边区，所述指纹感测电路层包括第一感测面，所述第一感测面背向传感器透光基板；位于所述光学指纹传感器和所述自发光显示面板之间的光准直器层，所述光准直器层朝向第一像素区的第一感测面；吸光层，所 述吸光层位于所述第一周边区的第一感测面。
可选的，还包括：位于所述光准直器层和所述光学指纹传感器之间的第一粘结层，第一粘结层与所述第一像素区的第一感测面接触且与第一周边区的第一感测面不接触。
可选的，所述第一粘结层包括第一粘结中心区和位于第一粘结中心区周围的第一粘结边缘区；所述第一像素区包括第一像素中心区和位于第一像素中心区周围的第一像素边缘区；第一粘结中心区与第一像素中心区的第一感测面接触且与第一像素边缘区的第一感测面不接触；所述吸光层还延伸至第一粘结边缘区和第一像素边缘区之间。
可选的，第一像素边缘区的宽度大于等于0.5毫米且小于等于2毫米。
可选的，所述吸光层还覆盖第一粘结层的整个侧壁。
可选的，所述光准直器层与所述第一像素区的第一感测面接触。
可选的，所述吸光层还覆盖所述光准直器层的侧壁。
可选的，还包括：位于所述自发光显示面板和所述光准直器层之间的第二粘结层；所述吸光层覆盖所述光准直器层的整个侧壁和第二粘结层的整个侧壁。
可选的，所述吸光层还覆盖所述传感器透光基板的侧壁和所述指纹感测电路层的侧壁。
可选的，所述吸光层的材料为环氧树脂、硅胶或油墨。
可选的，所述吸光层的颜色为黑色。
可选的，所述吸光层对400纳米～900纳米波长的光的吸收率为90％以上。
可选的，所述吸光层与第一周边区的第一感测面具有底部接触区域；所述底部接触区域呈环状结构；所述环状结构的宽度为0.5mm 以上。
可选的，所述传感器透光基板的材料为玻璃或者PI基板。
本发明还提供一种形成上述任意一项光学指纹传感器模组的方法，包括：提供自发光显示面板；形成传感准直模组，所述传感准直模组包括光学指纹传感器和位于光学指纹传感器表面的光准直器层，所述光学指纹传感器包括传感器透光基板和位于所述传感器透光基板表面的指纹感测电路层，所述指纹感测电路层位于所述传感器透光基板和所述光准直器层之间，所述指纹感测电路层包括第一像素区和位于第一像素区周围的第一周边区，所述指纹感测电路层包括第一感测面，所述第一感测面背向传感器透光基板，且第一像素区的第一感测面朝向所述光准直器层；形成吸光层，所述吸光层位于所述第一周边区的第一感测面；将自发光显示面板和光准直器层粘结在一起。
可选的，所述传感准直模组还包括：位于所述光准直器层和所述光学指纹传感器之间的第一粘结层，第一粘结层与所述第一像素区的第一感测面接触且与第一周边区的第一感测面不接触；形成所述传感准直模组的方法包括：提供光学指纹传感器和光准直器层；采用第一粘结层将所述第一像素区的第一感测面和所述光准直器层粘结在一起。
可选的，所述第一粘结层包括第一粘结中心区和位于第一粘结中心区周围的第一粘结边缘区；所述第一像素区包括第一像素中心区和位于第一像素中心区周围的第一像素边缘区；第一粘结中心区与第一像素中心区的第一感测面接触且与第一像素边缘区的第一感测面不接触；所述吸光层还延伸至第一粘结边缘区和第一像素边缘区之间；所述吸光层包括第一吸光层；采用第一粘结层将所述第一像素区的第一感测面和所述光准直器层粘结在一起之前，在所述第一周边区的第一感测面形成第一吸光层，且第一吸光层延伸至第一像素边缘区的第一感测面；形成第一吸光层后，采用第一粘结层分别将所述第一像素中心区的第一感测面和光准直器层、以及部分第一吸光层和光准直器 层粘结在一起。
可选的，形成传感准直模组后，在所述第一周边区的第一感测面形成吸光层。
可选的，在将自发光显示面板和光准直器层粘结在一起之后，形成所述吸光层；或者，形成所述吸光层后，将自发光显示面板和光准直器层粘结在一起。
与现有技术相比，本发明的技术方案具有以下优点：
本发明技术方案提供的光学指纹传感器模组中，所述光学指纹传感器包括传感器透光基板，这样能够降低光学指纹传感器的成本。所述光学指纹传感器模组包括吸光层，所述吸光层位于所述第一周边区的第一感测面，吸光层将第一周边区的第一感测面覆盖。所述吸光层用于吸收光准直器层周围的朝向第一周边区的第一感测面入射的外界光线，进而阻挡外界光线入射至传感器透光基板中再反射或散射至第一像素区的第一感测面，因此降低外界光线对第一像素区中感光器件的光学干扰，提高了光学指纹传感器的图形质量。
进一步，光学指纹传感器模组还包括：位于所述光准直器层和所述光学指纹传感器之间的第一粘结层。所述吸光层还覆盖第一粘结层的整个侧壁。所述吸光层将向第一粘结层侧壁入射的光吸收，所述吸光层不仅能阻挡光线直接从第一粘结层侧壁向第一像素区入射，还能阻挡光线从第一粘结层侧壁入射至传感器透光基板中再反射或散射至第一像素区的第一感测面中，因此降低外界光线对第一像素区中感光器件造成光学干扰，提高了光学指纹传感器的图形质量。
进一步，所述吸光层还延伸至第一粘结边缘区和第一像素边缘区之间，因此所述吸光层将从第一粘结层侧壁向第一像素区入射的光吸收，所述吸光层将不仅能阻挡直接从第一粘结层侧壁向第一像素区入射，还能阻挡光线入射至传感器透光基板中再反射或散射至第一像素区的第一感测面，这样降低外界光线对第一像素区中感光器件造成光 学干扰，提高了光学指纹传感器的图形质量。
其次，所述吸光层的厚度无需很厚，吸光层能做的较薄，降低了吸光层的工艺难度和成本。
进一步，所述吸光层还覆盖所述光准直器层的侧壁，因此吸光层可以更好地包围第一粘结层，确保外界光不能从上方直接进入第一粘结层进而入射到第一像素区中，避免产生不携带指纹信息的信号，降低外界光线对第一像素区中感光器件造成光学干扰。
进一步，所述自发光显示面板和所述光准直器层之间具有第二粘结层；所述吸光层覆盖所述光准直器层的整个侧壁和第二粘结层的整个侧壁。好处包括：可以阻挡外界光通过第二粘结层进入到光准直器，进而阻挡外界光进入光学传感器的感光器件，避免产生不携带指纹信息的信号产生信号降低外界光线对第一像素区中感光器件造成光学干扰。
进一步，所述吸光层还覆盖传感器透光基板的侧壁和所述指纹感测电路层的侧壁。吸光层可以阻挡外界光线过光准直器层直接从传感器透光基板的侧壁和指纹感测电路层的侧壁入射到光学传感器的基板中，避免光线被反射和散射后进入第一像素区的第一感测面，避免产生不携带指纹信息的信号产生信号，降低外界光线对第一像素区中感光器件造成光学干扰。
附图说明
图1是一种光学指纹传感器模组的结构示意图；
图2至图11是本发明一实施例中光学指纹传感器模组形成过程的结构示意图；
图12至图14是本发明另一实施例中光学指纹传感器模组形成过程的结构示意图。
具体实施方式
正如背景技术所述，现有技术的光学指纹传感器模组的性能较差。
一种光学指纹传感器模组，参考图1，包括：自发光显示面板130；光学指纹传感器100；位于所述光学指纹传感器100和所述自发光显示面板130之间的光准直器层120。
所述光学指纹传感器100包括传感器透光基板和位于所述传感器透光基板表面的指纹感测电路层。所述指纹感测电路层包括第一像素区和位于第一像素区周围的第一周边区。所述传感器透光基板的材料为玻璃或PI塑料，这样能够减小光学指纹传感器100的成本。光准直器层120与第一像素区接触。
第一周边区的作用包括：第一周边区的部分区域的表面需要设置各向异性导电膜，指纹感测电路层通过各向异性导电膜与外部驱动电路连接。
由于在自发光显示面板130和光学指纹传感器100之间设置了光准直器层120，因此自发光显示面板130和光学指纹传感器100的第一周边区之间具有一定的空间。光准直器层120周围的光线(如光线c)会穿过第一周边区进入传感器透光基板，进而在传感器透光基板反射或散射后向上穿过相邻感光像素之间的区域达到光准直器层120，进而被光准直器层120反射向下到达指纹感测电路层中的感光像素中，导致感光像素产生不携带指纹信息的信号产生信号，外界光线对第一像素区中感光像素造成光学干扰。
其次，光学指纹传感器模组还包括：位于所述光准直器层120和所述光学指纹传感器100之间的第一粘结层110。所述第一粘结层110与第一像素区朝向光准直器层120的表面均接触。相应的，为了避免第一粘结层110阻挡从自发光显示面板130向光学指纹传感器100入射的光线，因此第一粘结层110的材料需要为透光材料。
在光学指纹传感器模组的侧部周围的光线会照射至第一粘结层 110的侧部，进而照射至光学指纹传感器100的第一像素区的像素中(如图1中光线a)，这样会对光学指纹传感器100中像素造成光线干扰，降低图形效果。其次，照射至第一粘结层110的侧部的光会入射至传感器透光基板中(如图1中光线b)时，光线b会反射或散射，进而在传感器透光基板反射或散射后向上穿过相邻感光像素之间的区域达到光准直器层120，进而被光准直器层120反射向下到达感光像素中，这样会对光学指纹传感器100中像素造成光线干扰，降低图形效果。
在此基础上，本发明提供一种光学指纹传感器模组，包括：自发光显示面板；光学指纹传感器，所述光学指纹传感器包括传感器透光基板和位于所述传感器透光基板表面的指纹感测电路层，所述指纹感测电路层包括第一像素区和位于第一像素区周围的第一周边区，所述指纹感测电路层包括第一感测面，所述第一感测面背向传感器透光基板；位于所述光学指纹传感器和所述自发光显示面板之间的光准直器层，所述光准直器层朝向第一像素区的第一感测面；吸光层，所述吸光层位于所述第一周边区的第一感测面。所述光学指纹传感器模组的性能得到提高。
为使本发明的上述目的、特征和优点能够更为明显易懂，下面结合附图对本发明的具体实施例做详细的说明。
本说明书中的上下关系，是以将光学指纹传感器模组放置在用户眼睛下方进行定义的。当光学指纹传感器模组放置在用户眼睛下方，且自发光显示面板的显示面朝上时，如果说一个结构位于另一个结构的上方，则说明这个结构比另一个结构更加靠近用户眼睛，在此一并说明。
图2至图11是本发明一实施例中光学指纹传感器模组形成过程的结构示意图。
参考图2，提供自发光显示面板200。
所述自发光显示面板200包括第一透光基板201、第二透光基板202和自发光电路层203。自发光电路层203位于第一透光基板201和第二透光基板202之间。第一透光基板201和第二透光基板202的材料可以为透光材料，具体材料为无机玻璃或有机玻璃，也可以是有机玻璃以外的其它塑料制品，如塑料基板，塑料基板包括PI基板或PET基板。
所述自发光电路层203包括多个显示像素单元2031。图2中用虚线框示意出多个显示像素单元2031所在的区域，及各个显示像素单元2031相邻关系。需要说明的是，虽然虚线框包括了部分第一透光基板201和第二透光基板202，但这只是为了便于显示，显示像素单元2031并不包括第一透光基板201和第二透光基板202。
本实施例中，自发光显示面板200为OLED显示面板，相应的，显示像素单元2031包括阳极层、空穴注入层(HIL)、发光层(EML)、电子注入层(EIL)和阴极层等结构，显示像素单元2031还可以包括空穴传输层(HTL)和电子传输层(ETL)，显示像素单元2031还包括驱动OLED的TFT、驱动金属线和存储电容等结构。
接着，形成传感准直模组，所述传感准直模组包括光学指纹传感器和位于光学指纹传感器表面的光准直器层。
参考图3，提供光学指纹传感器210，所述光学指纹传感器210包括传感器透光基板211和位于所述传感器透光基板211表面的指纹感测电路层212，所述指纹感测电路层212包括第一像素区210A和位于第一像素区210A周围的第一周边区210B，所述指纹感测电路层212包括第一感测面2110，所述第一感测面2110背向传感器透光基板211。
第一周边区210B的作用包括：第一周边区210B的部分区域的表面需要设置各向异性导电膜，指纹感测电路层212通过各向异性导电膜与外部驱动电路连接。
所述传感器透光基板211的材料可以为玻璃或者PI基板。所述传感器透光基板211对可见光的透光率大于50％，所述传感器透光基板211对紫外光的透光率大于20％。
所述PI基板相比其它的塑料基板的耐热性好，稳定性好。
所述传感器透光基板211相对于硅基材料的基板的成本较小，能够降低光学指纹传感器210的成本。
所述指纹感测电路层212(参考图4)包括第一非透光区域和第一透光区域2123。所述指纹感测电路层212包括信号线21、驱动线22和感光像素阵列，所述感光像素阵列包括若干感光像素单元。其中，每个感光像素单元包括信号控制开关2121、感光器件2122和第一透光区域2123。信号控制开关2121和感光器件2122都不透光，所述第一非透光区域包括所述信号控制开关2121和感光器件2122，所述第一透光区域2123是除了信号线21、驱动线22、信号控制开关2121和感光器件2122以外的区域。
所述第一非透光区域对可见光的透光率大于50％，所述第一非透光区域对紫外光的透光率大于20％。
结合参考图5至图8，提供光准直器层230。
所述光准直器层230具有相对的第一准直面和第二准直面，第一准直面和第二准直面平行，所述光准直器层230包括多个光准直单元231，所述光准直单元231的延伸方向垂直于第一准直面和第二准直面。
图6为对应图5中光准直器层230的俯视图，图7为对应图5中光准直器层230的侧视图，图8为光准直单元231的俯视图，图6和图7中均用虚线框框选出其中一个光准直单元231进行区分显示。
所述光准直器层230用于使透过自发光显示面板200的光线更加准直。
本实施例中，每个光准直单元231具有芯层2311和包围芯层2311的皮层2312。光准直器层230主要利用芯层2311来通过光线，而皮层2312则用于吸收光线，芯层2311和皮层2312配合使用，从而达到上述光准直作用。
本实施例中，所述芯层2311对可见光和红外光的吸收率越低越好。为保证通过光准直器层230的光线强度足够，选择令芯层2311对可见光和红外光的吸收率<10％。另外，由于考虑到后续的粘合方式，芯层2311紫外光的吸收率越低越好。本实施例中，芯层2311对可见光的透光率大于50％，芯层2311对紫外光的透光率大于20％。所述皮层2312对可见光和红外光的吸收率越高越好，以便对特定角度之外的光线进行吸收。为保证对相应光线进行有效吸收，选择令皮层2312对可见光和红外光的吸收率>50％。
斜入射至光准直器层230的光在光准直纤维的芯层2311和皮层2312界面不会发生明显反射，更不会发生全反射，而是会从芯层2311入射进入皮层2312中，被皮层2312吸收。因此，与光准直器层230的第一准直面和第二准直面夹角较小的光线，会在经过一次或者多次皮层2312后被皮层2312吸收，而与光准直器层230的第一准直面和第二准直面夹角较大的光线，则可以从一个芯层2311中完全穿过。例如，通过光准直器层230的光线分别与第一准直面和第二准直面之间的夹角均较接近90度(如80度至90度)，而其他角度范围的光都被自发光显示面板200吸收掉。综上，所述光准直器层230能够使透过自发光显示面板200的光线更加准直。所述光准直器层230对光线的准直作用，有助于提高光学指纹传感器的指纹识别性能。
在其它实施例中，所述光准直器层230为柔性准直器。
参考图9，采用第一粘结层240将光学指纹传感器210和光准直器层230粘结在一起，具体的，采用第一粘结层240将所述第一像素区210A的第一感测面2110和所述光准直器层230粘结在一起。
所述指纹感测电路层212位于所述传感器透光基板211和所述光 准直器层230之间，且第一像素区210A的第一感测面2110朝向所述光准直器层230。
第一粘结层240与所述第一像素区210A的第一感测面2110接触且与第一周边区210B的第一感测面2110不接触。
本实施例中，第一粘结层240的材料透光。
本实施例中，第一粘结层240的厚度为0.05毫米～0.12毫米。
所述传感准直模组还包括：位于所述光准直器层230和所述光学指纹传感器210之间的第一粘结层240，第一粘结层240与所述第一像素区210A的第一感测面2110接触且与第一周边区210B的第一感测面2110不接触。
参考图10，将自发光显示面板200和光准直器层230粘结在一起。
本实施例中，采用第二粘结层250将自发光显示面板200和光准直器层230粘结在一起。
参考图11，形成吸光层260，所述吸光层260位于所述第一周边区210B的第一感测面2110。
所述吸光层260将第一周边区210B的第一感测面2110覆盖。所述吸光层260用于吸收光准直器层230周围的朝向第一周边区210B的第一感测面2110入射的外界光线，进而阻挡外界光线入射至传感器透光基板211中再反射或散射至第一像素区210A的第一感测面，因此降低外界光线对第一像素区210A中感光器件2122的光学干扰，提高了光学指纹传感器的图形质量。
本实施例中，形成传感准直模组后，在所述第一周边区210B的第一感测面2110形成吸光层260。
本实施例中，将自发光显示面板200和光准直器层230粘结在一起之后，形成吸光层260。
在其它实施例中，形成吸光层后，将自发光显示面板和光准直器层粘结在一起。
本实施例中，所述吸光层260还覆盖第一粘结层240的整个侧壁。所述吸光层260将向第一粘结层240侧壁入射的光吸收，所述吸光层260不仅能阻挡光线直接从第一粘结层240侧壁向第一像素区210A入射，还能阻挡光线从第一粘结层240侧壁入射至传感器透光基板211中再反射或散射至第一像素区210A中，因此降低外界光线对第一像素区210A中感光器件2122造成光学干扰，提高了光学指纹传感器的图形质量。
在其它实施例中，所述吸光层覆盖第一粘结层部分厚度的侧壁。
本实施例中，所述吸光层260还覆盖所述光准直器层230的侧壁，具体的，所述吸光层260覆盖所述光准直器层光准直器层230的整个侧壁或部分侧壁。因此吸光层260可以更好地包围第一粘结层240，确保外界光不能从上方直接进入第一粘结层240进而入射到第一像素区210A中，避免产生不携带指纹信息的信号，降低外界光线对第一像素区210A中感光器件2122造成光学干扰。
在其它实施例中，所述吸光层不覆盖所述光准直器层的侧壁。
在其它实施例中，吸光层还覆盖所述光准直器层的整个侧壁和第二粘结层的整个侧壁，好处包括：可以阻挡外界光通过第二粘结层进入到光准直器，避免进入光学传感器的感光器件，避免产生不携带指纹信息的信号产生信号降低外界光线对第一像素区中感光器件造成光学干扰。
在其它实施例中，所述吸光层还覆盖传感器透光基板的侧壁和所述指纹感测电路层的侧壁。吸光层可以阻挡外界光线过光准直器层直接从传感器透光基板的侧壁和指纹感测电路层的侧壁入射到光学传感器的基板中，避免光线被反射和散射后进入光学传感器的感光器件2122，避免产生不携带指纹信息的信号产生信号，降低外界光线对第 一像素区中像素器件造成光学干扰。
所述吸光层260的材料为环氧树脂、硅胶或油墨。
所述吸光层260的颜色为黑色。
所述吸光层260对400纳米～900纳米波长的光的吸收率为90％以上。400纳米～900的光为指纹感测电路层较为敏感的光线。
本实施例中，所述吸光层260与第一周边区210B的第一感测面2110具有底部接触区域；所述底部接触区域呈环状结构；所述环状结构的宽度W为0.5mm以上。若所述环状结构的宽度W小于0.5mm，则导致吸光层260遮挡光的效果不佳。
需要说明的是，在其它实施例中，采用第一粘结层将光学指纹传感器和光准直器层粘结在一起之后，在所述第一周边区的第一感测面形成吸光层，之后，将自发光显示面板和光准直器层粘结在一起。在此情况下，所述吸光层位于所述第一周边区的第一感测面，且所述吸光层覆盖所述第一粘结层的侧壁，所述吸光层覆盖第一粘结层的整个侧壁，吸光层不覆盖第二粘结层。所述吸光层还可以覆盖所述光准直器层的整个侧壁或部分侧壁。所述吸光层还可以覆盖传感器透光基板的侧壁和所述指纹感测电路层的侧壁。
需要说明的是，在其它实施例中，所述传感准直模组包括光学指纹传感器和位于光学指纹传感器表面的光准直器层，所述光准直器层与所述第一像素区的第一感测面接触且与第一周边区不接触，所述光准直器层为柔性准直器。形成所述传感准直模组的方法包括：提供光学指纹传感器；在第一像素区的第一感测面形成光准直器层。相应的，光学指纹传感器和光准直器层之间没有第一粘结层，所述吸光层不覆盖第一粘结层。
相应的，本实施例还提供一种采用上述方法形成的光学指纹传感器模组，参考图11，包括：自发光显示面板200；光学指纹传感器210，所述光学指纹传感器包括传感器透光基板211和位于所述传感 器透光基板211表面的指纹感测电路层212，所述指纹感测电路层212包括第一像素区210A和位于第一像素区210A周围的第一周边区210B，所述指纹感测电路层212包括第一感测面2110，所述第一感测面2110背向传感器透光基板211；位于所述光学指纹传感器210和所述自发光显示面板200之间的光准直器层230，所述光准直器层230朝向第一像素区210A的第一感测面2110；吸光层260，所述吸光层260位于所述第一周边区210B的第一感测面2110。
本实施例中，光学指纹传感器模组还包括：位于光准直器层230和所述光学指纹传感器210之间的第一粘结层240，第一粘结层240与第一像素区210A的第一感测面2110接触且与第一周边区210B的第一感测面2110不接触。
本实施例中，所述吸光层260覆盖所述第一粘结层240的整个侧壁。
本实施例中，所述吸光层260还覆盖所述光准直器层230的侧壁。
所述光学指纹传感器模组还包括：位于所述自发光显示面板200和所述光准直器层230之间的第二粘结层250。
在其它实施例中，所述吸光层覆盖所述光准直器层230的整个侧壁和第二粘结层250的整个侧壁。
在其它实施例中，所述吸光层还覆盖传感器透光基板的侧壁和所述指纹感测电路层的侧壁。
所述吸光层260的材料为环氧树脂、硅胶或油墨。
所述吸光层260的颜色为黑色。
所述吸光层260对400纳米～900纳米波长的光的吸收率为90％以上。
所述吸光层260与第一周边区210B的第一感测面2110具有底部接触区域；所述底部接触区域呈环状结构；所述环状结构的宽度为 0.5mm以上。
所述指纹感测电路层212位于所述传感器透光基板211和所述光准直器层230之间。
所述传感器透光基板211的材料为玻璃或者PI基板。
需要说明的是，在其它实施例中，所述光准直器层与所述第一像素区的第一感测面接触且与第一周边区不接触，所述光准直器层为柔性准直器。相应的，光学指纹传感器和光准直器层之间没有第一粘结层，所述吸光层不覆盖第一粘结层。
本发明另一实施例还提供一种光学指纹传感器模组的形成方法，本实施例中与前一实施例的区别在于：所述第一粘结层包括第一粘结中心区和位于第一粘结中心区周围的第一粘结边缘区；所述第一像素区包括第一像素中心区和位于第一像素中心区周围的第一像素边缘区；第一粘结中心区与第一像素中心区的第一感测面接触且与第一像素边缘区的第一感测面不接触；所述吸光层还延伸至第一粘结边缘区和第一像素边缘区之间；所述吸光层包括第一吸光层；在将光学指纹传感器和光准直器层粘结在一起之前，在所述第一周边区的第一感测面形成第一吸光层，且第一吸光层延伸至第一像素边缘区的部分第一感测面；形成第一吸光层后，采用第一粘结层分别将所述第一像素中心区的第一感测面和光准直器层、以及部分第一吸光层和光准直器层粘结在一起。关于本实施例与前一实施例相同的内容，不再详述。
图12至图14是本发明另一实施例中光学指纹传感器模组形成过程的结构示意图。
本实施例中的步骤均在图2至图8的基础上进行。
参考图12，在所述第一周边区210B的第一感测面2110形成第一吸光层360，且第一吸光层360延伸至第一像素边缘区的第一感测面2110。
所述第一吸光层360的材料、颜色以及吸收率均参照前一实施 例。
所述第一吸光层360与第一周边区210B的第一感测面2110具有底部接触区域，所述底部接触区域的尺寸参照前一实施例中底部接触区域的尺寸。
第一像素边缘区的宽度大于等于0.5毫米且小于等于2毫米。
第一像素边缘区为第一像素区中与第一吸光层360粘结所在的区域。
若所述第一像素边缘区的宽度大于2毫米，则导致第一像素区中为与第一吸光层360粘结设计的区域过大，导致第一吸光层360对光准直器层中光阻挡，若所述第一像素边缘区的宽度小于0.5毫米，第一吸光层360延伸至第一像素区的尺寸较小，第一吸光层360对从第一粘结层侧壁入射的光的阻挡作用较差。
参考图13，形成第一吸光层360后，采用第一粘结层340将光学指纹传感器210和光准直器层230粘结在一起，具体的，采用第一粘结层340分别将所述第一像素中心区的第一感测面和光准直器层230、以及部分第一吸光层360和光准直器层粘结在一起。
所述第一吸光层360位于所述第一周边区210B的第一感测面2110，且所述第一吸光层360覆盖所述第一粘结层340的侧壁。
所述第一粘结层340包括第一粘结中心区和位于第一粘结中心区周围的第一粘结边缘区；所述第一像素区包括第一像素中心区和位于第一像素中心区周围的第一像素边缘区；第一粘结中心区与第一像素中心区的第一感测面接触且与第一像素边缘区的第一感测面不接触；所述第一吸光层360还延伸至第一粘结边缘区和第一像素边缘区之间。
参考图14，将自发光显示面板200和光准直器层230粘结在一起。
本实施例中，采用第二粘结层350将自发光显示面板200和光准直器层230粘结在一起。
本实施例中，采用第一粘结层340将光学指纹传感器210和光准直器层230粘结在一起后，采用第二粘结层350将自发光显示面板200和光准直器层230粘结在一起。
在其他实施例中，采用第二粘结层将自发光显示面板200和光准直器层230粘结在一起后，形成第一吸光层，之后，采用第一粘结层将光学指纹传感器210和光准直器层230粘结在一起；或者，形成第一吸光层后，采用第二粘结层将自发光显示面板200和光准直器层230粘结在一起，之后，采用第一粘结层将光学指纹传感器210和光准直器层230粘结在一起。
本实施例中，吸光层仅包括第一吸光层360。
在其它实施例中，采用第一粘结层340将光学指纹传感器210和光准直器层230粘结在一起之后，形成第二吸光层，第二吸光层覆盖光准直器层的侧壁和第一粘结层的部分侧壁，第一吸光层360和第二吸光层将第一粘结层的侧壁全部覆盖。第二吸光层和第一吸光层360构成总的吸光层。
在其它实施例中，采用第一粘结层340将光学指纹传感器210和光准直器层230粘结在一起之后，且采用第二粘结层将自发光显示面板200和光准直器层230粘结在一起之后，形成第二吸光层，第二吸光层覆盖光准直器层的侧壁和第一粘结层的部分侧壁，第一吸光层和第二吸光层将第一粘结层的侧壁全部覆盖。第二吸光层还可以覆盖第二粘结层的侧壁。第二吸光层和第一吸光层构成总的吸光层。
在其它实施例中，还可以包括：在传感器透光基板的侧壁和指纹感测电路层的侧壁形成第三吸光层。第一吸光层、第二吸光层和第三吸光层构成总的吸光层。
相应的，本实施例还提供一种采用上述方法形成的光学指纹传感 器模组，请参考图14，包括：自发光显示面板200；光学指纹传感器210，所述光学指纹传感器包括传感器透光基板和位于所述传感器透光基板表面的指纹感测电路层，所述光学指纹传感器210包括第一像素区210A和位于第一像素区210A周围的第一周边区210B，所述光学指纹传感器210包括第一感测面2110，所述第一感测面背向传感器透光基板；位于所述光学指纹传感器210和所述自发光显示面板200之间的光准直器层230，所述光准直器层230朝向第一像素区的第一感测面；位于所述光准直器层230和所述光学指纹传感器210之间的第一粘结层340，第一粘结层340与第一像素区210A的第一感测面接触且与第一周边区210B的第一感测面不接触；所述第一粘结层包括第一粘结中心区和位于第一粘结中心区周围的第一粘结边缘区；所述第一像素区包括第一像素中心区和位于第一像素中心区周围的第一像素边缘区；第一粘结中心区与第一像素中心区的第一感测面接触且与第一像素边缘区的第一感测面不接触；吸光层，所述吸光层位于所述第一周边区210B的第一感测面2110，所述吸光层还延伸至第一粘结边缘区和第一像素边缘区之间。所述吸光层的材料、颜色以及吸收率均参照前一实施例。
所述吸光层与第一周边区210B的第一感测面2110具有底部接触区域，所述底部接触区域的尺寸参照前一实施例。
本实施例中，吸光层仅包括第一吸光层360，所述第一吸光层360位于所述第一周边区210B的第一感测面2110，且所述第一吸光层360覆盖所述第一粘结层340的侧壁，第一吸光层360还延伸至第一粘结边缘区和第一像素边缘区之间。
第一像素边缘区的宽度大于等于0.5毫米且小于等于2毫米。
在其它实施例中，吸光层仅包括第一吸光层360和第二吸光层，第二吸光层覆盖光准直器层的侧壁和第一粘结层的部分侧壁，第一吸光层和第二吸光层将第一粘结层的侧壁全部覆盖。
所述光学指纹传感器模组还包括：位于自发光显示面板200和光 准直器层230之间的第二粘结层。
在其它实施例中，第二吸光层覆盖光准直器层的侧壁和第一粘结层的部分侧壁，第一吸光层和第二吸光层将第一粘结层的侧壁全部覆盖，第二吸光层还覆盖第二粘结层的侧壁。
在其它实施例中，吸光层仅包括第一吸光层360、第二吸光层和第三吸光层，第三吸光层位于传感器透光基板的侧壁和指纹感测电路层的侧壁。
虽然本发明披露如上，但本发明并非限定于此。任何本领域技术人员，在不脱离本发明的精神和范围内，均可作各种更动与修改，因此本发明的保护范围应当以权利要求所限定的范围为准。

Claims (19)

  1. 一种光学指纹传感器模组，其特征在于，包括：
    自发光显示面板；
    光学指纹传感器，所述光学指纹传感器包括传感器透光基板和位于所述传感器透光基板表面的指纹感测电路层，所述指纹感测电路层包括第一像素区和位于第一像素区周围的第一周边区，所述指纹感测电路层包括第一感测面，所述第一感测面背向传感器透光基板；
    位于所述光学指纹传感器和所述自发光显示面板之间的光准直器层，所述光准直器层朝向第一像素区的第一感测面；
    吸光层，所述吸光层位于所述第一周边区的第一感测面。
  2. 根据权利要求1所述的光学指纹传感器模组，其特征在于，还包括：位于所述光准直器层和所述光学指纹传感器之间的第一粘结层，第一粘结层与所述第一像素区的第一感测面接触且与第一周边区的第一感测面不接触。
  3. 根据权利要求2所述的光学指纹传感器模组，其特征在于，所述第一粘结层包括第一粘结中心区和位于第一粘结中心区周围的第一粘结边缘区；所述第一像素区包括第一像素中心区和位于第一像素中心区周围的第一像素边缘区；第一粘结中心区与第一像素中心区的第一感测面接触且与第一像素边缘区的第一感测面不接触；所述吸光层还延伸至第一粘结边缘区和第一像素边缘区之间。
  4. 根据权利要求3所述的光学指纹传感器模组，其特征在于，第一像素边缘区的宽度大于等于0.5毫米且小于等于2毫米。
  5. 根据权利要求2所述的光学指纹传感器模组，其特征在于，所述吸光层还覆盖第一粘结层的整个侧壁。
  6. 根据权利要求1所述的光学指纹传感器模组，其特征在于，所述光准直器层与所述第一像素区的第一感测面接触。
  7. 根据权利要求5或6所述的光学指纹传感器模组，其特征在于，所述吸光层还覆盖所述光准直器层的侧壁。
  8. 根据权利要求1所述的光学指纹传感器模组，其特征在于，还包括：位于所述自发光显示面板和所述光准直器层之间的第二粘结层；所述吸光层覆盖所述光准直器层的整个侧壁和第二粘结层的整个侧壁。
  9. 根据权利要求1所述的光学指纹传感器模组，其特征在于，所述吸光层还覆盖所述传感器透光基板的侧壁和所述指纹感测电路层的侧壁。
  10. 根据权利要求1所述的光学指纹传感器模组，其特征在于，所述吸光层的材料为环氧树脂、硅胶或油墨。
  11. 根据权利要求1所述的光学指纹传感器模组，其特征在于，所述吸光层的颜色为黑色。
  12. 根据权利要求1所述的光学指纹传感器模组，其特征在于，所述吸光层对400纳米～900纳米波长的光的吸收率为90％以上。
  13. 根据权利要求1所述的光学指纹传感器模组，其特征在于，所述吸光层与第一周边区的第一感测面具有底部接触区域；所述底部接触区域呈环状结构；所述环状结构的宽度为0.5mm以上。
  14. 根据权利要求1所述的光学指纹传感器模组，其特征在于，所述传感器透光基板的材料为玻璃或者PI基板。
  15. 一种如权利要求1至14任意一项所述的光学指纹传感器模组的形成方法，其特征在于，包括：
    提供自发光显示面板；
    形成传感准直模组，所述传感准直模组包括光学指纹传感器和位于光学指纹传感器表面的光准直器层，所述光学指纹传感器包括传感器透光基板和位于所述传感器透光基板表面的指纹感测电路层，所述指纹感测电路层位于所述传感器透光基板和所述光准直器层之间，所述指纹感测电路层包括第一像素区和位于第一像素区周围的第一周边区，所述指纹感测电路层包括第一感测面，所述第一感测面背向传感器透光基板，且第一像素区的第一感测面朝向所述光准直器层；
    形成吸光层，所述吸光层位于所述第一周边区的第一感测面；
    将自发光显示面板和光准直器层粘结在一起。
  16. 根据权利要求15所述的光学指纹传感器模组的形成方法，其特征在于，所述传感准直模组还包括：位于所述光准直器层和所述光学指纹传感器之间的第一粘结层，第一粘结层与所述第一像素区的第一感测面接触且与第一周边区的第一感测面不接触；
    形成所述传感准直模组的方法包括：提供光学指纹传感器和光准直器层；采用第一粘结层将所述第一像素区的第一感测面和所述光准直器层粘结在一起。
  17. 根据权利要求16所述的光学指纹传感器模组的形成方法，其特征在于，所述第一粘结层包括第一粘结中心区和位于第一粘结中心区周围的第一粘结边缘区；所述第一像素区包括第一像素中心区和位于第一像素中心区周围的第一像素边缘区；第一粘结中心区与第一像素中心区的第一感测面接触且与第一像素边缘区的第一感测面不接触；所述吸光层还延伸至第一粘结边缘区和第一像素边缘区之间；所述吸光层包括第一吸光层；
    采用第一粘结层将所述第一像素区的第一感测面和所述光准直器层粘结在一起之前，在所述第一周边区的第一感测面形成第一吸光层，且第一吸光层延伸至第一像素边缘区的第一感测面；形成第一吸光层后，采用第一粘结层分别将所述第一像素中心区的第一感测面和光准直器层、以及部分第一吸光层和光准直器层粘结在一起。
  18. 根据权利要求15所述的光学指纹传感器模组的形成方法，其特征在于，形成传感准直模组后，在所述第一周边区的第一感测面形成吸光层。
  19. 根据权利要求15所述的光学指纹传感器模组的形成方法，其特征在于，在将自发光显示面板和光准直器层粘结在一起之后，形成所述吸光层；或者，形成所述吸光层后，将自发光显示面板和光准直器层粘结在一起。
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