WO2020215642A1 - 显示面板、显示屏及显示装置 - Google Patents

显示面板、显示屏及显示装置 Download PDF

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Publication number
WO2020215642A1
WO2020215642A1 PCT/CN2019/113689 CN2019113689W WO2020215642A1 WO 2020215642 A1 WO2020215642 A1 WO 2020215642A1 CN 2019113689 W CN2019113689 W CN 2019113689W WO 2020215642 A1 WO2020215642 A1 WO 2020215642A1
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WO
WIPO (PCT)
Prior art keywords
light
layer
visible light
display
conversion layer
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PCT/CN2019/113689
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English (en)
French (fr)
Inventor
孙建明
Original Assignee
云谷（固安）科技有限公司
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Publication of WO2020215642A1 publication Critical patent/WO2020215642A1/zh
Priority to US17/345,767 priority Critical patent/US11632891B2/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14678—Contact-type imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02322—Optical elements or arrangements associated with the device comprising luminescent members, e.g. fluorescent sheets upon the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer

Definitions

  • This application relates to the field of display technology, in particular to a display panel, a display screen and a display device.
  • a fingerprint is a unique feature of the human body. It consists of ridges and valleys on the surface of the fingertip skin. The patterns formed by these ridges and valleys determine the uniqueness of the fingerprint, and its uniqueness and complexity are sufficient to meet the identification requirements.
  • display panels with fingerprint recognition function have gradually spread throughout people's lives.
  • a display screen including:
  • a display panel the display panel includes a visible light conversion layer, and the display panel has a display surface;
  • a fingerprint identification module is arranged on the side of the display panel opposite to the display surface;
  • the visible light conversion layer is used to receive visible light and convert the visible light into invisible light that can be received by the fingerprint identification module.
  • a display device including the above-mentioned display screen.
  • a display panel including a visible light conversion layer, and the display panel has a display surface, wherein the visible light conversion layer is used to receive visible light and convert the visible light into The fingerprint recognition module on the side of the panel away from the display surface can receive invisible light.
  • a visible light conversion layer is arranged in the display panel, and a fingerprint recognition module is arranged on the bottom side of the display panel.
  • the visible light conversion layer converts the visible light emitted by the display panel into invisible light with good penetrability to the OLED display screen. Thus, it is received by the fingerprint recognition module and performs fingerprint recognition.
  • the fingerprint recognition module is configured to detect invisible light and is basically not affected by visible light. In this way, no matter what kind of image the display panel is displaying, it will not affect the detection of the fingerprint recognition module, thereby improving the accuracy of fingerprint recognition, and the invisible light emitted by the visible light conversion layer will not affect the visible light emitted by the display panel. Affect the display effect.
  • the display screen is not limited by visible light, which solves the problem of insufficient light intensity detected by the fingerprint recognition component due to the poor penetration of visible light to the PI of the flexible substrate, and since the penetration of non-visible light to PI is good,
  • the flexible substrate does not need to be punched or grooved, which reduces the manufacturing process difficulty and production cost, and at the same time avoids the impact on the strength of the PI.
  • FIG. 1 is a schematic structural diagram of a display screen in an embodiment of the application
  • FIG. 2 is a schematic diagram of the fingerprint recognition principle of the display screen shown in FIG. 1;
  • FIG. 3 is a schematic structural diagram of a display screen in another embodiment of the application.
  • FIG. 4 is a schematic diagram of the fingerprint recognition principle of the display screen shown in FIG. 3;
  • FIG. 5 is a schematic structural diagram of a display screen in another embodiment of the application.
  • FIG. 6 is a schematic diagram of the fingerprint recognition principle of the display screen shown in FIG. 5.
  • the fingerprint recognition component is attached to the bottom of the display screen.
  • the OLED device in the OLED display screen emits visible light.
  • the visible light is reflected by the user's fingerprint, and then passes through the display back panel and is detected by the fingerprint recognition component attached to the bottom of the display screen.
  • the material of the flexible substrate of the flexible display panel is generally polyimide (PI) and other polymers.
  • PI polyimide
  • the visible light has poor penetration of the PI of the flexible substrate, resulting in insufficient light intensity detected by the fingerprint recognition component. Therefore, it is necessary to perforate the PI, which greatly increases the process difficulty of the product and is not conducive to the realization of fingerprint recognition under the screen.
  • the present application provides a display screen, which can better solve the above-mentioned problems.
  • an embodiment of the present application provides a display panel and a display screen having the same.
  • a visible light conversion layer 82 is provided in the display panel 110.
  • the visible light conversion layer 82 is used to receive visible light and convert the visible light into invisible light that the fingerprint identification module 120 can receive.
  • the visible light emitted by the display panel 110 is converted by the visible light conversion layer 82 into invisible light with good penetrating power to the OLED display screen, so as to be received by the fingerprint recognition module 120 and perform fingerprint recognition.
  • the fingerprint identification module 120 is configured to detect invisible light and is basically not affected by other visible light. In this way, no matter what image is being displayed on the display panel of the display device, it will not affect the detection of the fingerprint identification module 120, thereby improving the accuracy of fingerprint identification, and the invisible light emitted by the visible light conversion layer 82 will not affect the display panel 110. The visible light emitted does not affect the display effect.
  • the visible light conversion layer 82 is provided in the packaging structure 70 or the display substrate 10.
  • the invisible light is infrared light
  • the fingerprint recognition module 120 includes an infrared sensor
  • the visible light conversion layer 82 may be an infrared quantum dot layer.
  • the visible light conversion layer 82 may be a perovskite infrared quantum dot layer.
  • the dots can also be PbS infrared quantum dots or Ag2S infrared quantum dots.
  • the infrared quantum dot layer can be formed by inkjet printing or other means.
  • the non-visible light may also be ultraviolet light.
  • the visible light conversion layer 82 used may be different, and the fingerprint identification module 120 uses an ultraviolet sensor accordingly.
  • the display screen provided by the embodiments of the present application is not limited by visible light, and solves the problem of insufficient light intensity detected by the fingerprint identification component due to the poor penetration of visible light to the PI of the flexible substrate, and because of the penetration of non-visible light to PI
  • the strength is good, so the flexible substrate does not need to be punched or grooved, which reduces the manufacturing process difficulty and production cost, and at the same time avoids the impact on the strength of the PI.
  • the display screen provided by the embodiment of the present application may be applicable to display panels of various modes, for example, an OLED display screen, a liquid crystal display screen, etc., which is not limited herein.
  • the display area refers to the active area defined by the display panel for forming light-emitting elements
  • the non-display area refers to the surrounding area that is not allowed to be cut off, such as wiring used to provide signal lines for the display panel.
  • a display panel may include a display area AA (Active Area, AA) for subsequently forming light-emitting elements, and may also include a non-display area (including an area where a driving circuit and a chip are provided) for the subsequent display panel.
  • the present application provides a display screen 100 including a display panel 110 and a fingerprint recognition module 120.
  • the display panel 110 includes a display substrate 10, a visible light conversion layer 82, a light-emitting layer 50 on the display substrate 10, and an encapsulation structure 70 on the light-emitting layer 50, and the encapsulation structure 70 is used to encapsulate the light-emitting layer 50.
  • the visible light conversion layer 82 is used to receive visible light and convert the visible light into invisible light that the fingerprint identification module 120 can receive.
  • the visible light conversion layer 82 is provided in the packaging structure 70.
  • the visible light conversion layer 82 is used to receive the visible light emitted by the light-emitting layer 50 and convert the visible light into invisible light that can be received by the fingerprint identification module 120, and then the fingerprint reflects the invisible light so that the invisible light can be recognized by the fingerprint.
  • the module 120 receives.
  • the visible light conversion layer 82 is used to receive the visible light reflected by the fingerprint and convert it into the invisible light that the fingerprint identification module 120 can receive.
  • the fingerprint identification module 120 is arranged on the side of the display substrate 10 away from the light emitting layer 50, and the fingerprint identification module 90 is used for receiving invisible light and performing fingerprint identification.
  • the finger 101 is located above the light-emitting layer 50 and presses the upper side of the display panel 110 (close to the packaging structure 70 side).
  • the visible light emitted by the light-emitting layer 50 is first converted into invisible light through the visible light conversion layer 82 located in the packaging structure 70, and then the invisible light is irradiated on the fingerprint pressed on the display panel 110, and is reflected by the ridges and valleys on the fingerprint.
  • the invisible light of 1 is received by the fingerprint identification module 120, and the fingerprint identification module 120 receives the invisible light and performs fingerprint identification.
  • the display substrate 10 further includes a substrate 11, a thin-film transistor (TFT) 20 disposed on the substrate 11, and a sub-pixel electrode 31 disposed on the thin-film transistor 20.
  • the display substrate 10 may also include a planarization layer 28, a passivation layer (not shown), a pixel defining layer 41 and other film layers.
  • the display substrate 10 may be prepared using a low temperature polysilicon (LTPS) process.
  • LTPS low temperature polysilicon
  • the substrate 11 may be made of a glass material, a metal material, or a plastic material including polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyimide (PI). Suitable materials are formed.
  • the substrate 11 is made of a flexible material, such as polyimide (PI) polymer, polycarbonate (PC) resin, also known as PC Plastics, polyethylene terephthalate (PET) plastics, etc.
  • another layer such as the buffer layer 12 may be formed on the substrate 11.
  • the buffer layer 12 may be formed on the entire surface of the substrate 11, or may be formed by being patterned.
  • the buffer layer 12 may have suitable materials including PET, PEN, polyacrylate, and/or polyimide, and form a layered structure in the form of a single layer or a multilayer stack.
  • the buffer layer 12 may also be formed of silicon oxide or silicon nitride, or may include a composite layer of organic materials and/or inorganic materials.
  • the thin film transistor 20 may include a semiconductor layer 21, a gate electrode 22, a source electrode 23 and a drain electrode 24.
  • a via hole may be formed in the gate insulating layer 25, the insulating dielectric layer 26, and the interlayer insulating layer 27, and then the source electrode 23 and the drain electrode 24 connected to the semiconductor layer 21 are formed in the via hole.
  • the source electrode 23 and the drain electrode 24 can be made of metal materials, which have a good reflection effect on visible light and invisible light. Therefore, the hole structure can be used to reflect the fingerprint and the invisible light converted by the visible light conversion layer 82.
  • the area between the two adjacent sources and drains reaches the fingerprint recognition module 120 on the back of the display substrate 10, which prevents the light emitted from the visible light conversion layer 82 from interfering with each other, which affects fingerprint imaging due to crosstalk of fingerprint recognition.
  • the semiconductor layer 21 may be formed of an amorphous silicon layer, a metal oxide, or a polysilicon layer, or may be formed of an organic semiconductor material. In one embodiment, the semiconductor layer 21 includes a channel region and a source region and a drain region doped with dopants.
  • the semiconductor layer 21 can be covered with the gate insulating layer 25.
  • the gate electrode 22 may be provided on the gate insulating layer 25.
  • the gate insulating layer 25 may cover the entire surface of the substrate 11.
  • the gate insulating layer 25 may be formed by patterning.
  • the gate insulating layer 25 may be formed of silicon oxide, silicon nitride, or other insulating organic or inorganic materials in consideration of adhesion with adjacent layers, formability of the stack target layer, and surface flatness.
  • the gate electrode 22 may be directly covered by the interlayer insulating layer 27.
  • the insulating dielectric layer 26 of the capacitor may be formed on the gate electrode 22 first, and then the interlayer insulating layer 27 is covered.
  • the thin film transistor (TFT) 20 Since the thin film transistor (TFT) 20 has a complicated layer structure, it is necessary to form a planarization layer 28 on the TFT 20 in order to form a sufficiently flat top surface. After the planarization layer 28 is formed, an electrode through hole may be formed in the planarization layer 28 to expose the drain electrode 24 of the TFT 20.
  • the sub-pixel electrode 31 may be formed on the planarization layer 28.
  • the sub-pixel electrode 31 may include a first sub-pixel electrode, a second sub-pixel electrode, and a third sub-pixel electrode.
  • the first sub-pixel electrode is formed in the first sub-pixel area.
  • the second sub-pixel electrode is formed in the second sub-pixel area.
  • the third sub-pixel electrode is formed in the third sub-pixel area.
  • the sub-pixel electrodes 31 correspond to the sub-pixel regions on the display substrate 10 in a one-to-one manner.
  • the first sub-pixel electrode, the second sub-pixel electrode and the third sub-pixel electrode may be formed simultaneously or simultaneously.
  • Each of the first sub-pixel electrode, the second sub-pixel electrode, and the third sub-pixel electrode may be electrically connected to the drain electrode 24 of the thin film transistor 20 through the electrode via hole.
  • the first sub-pixel electrode, the second sub-pixel electrode, and the third sub-pixel electrode are generally called anodes.
  • the first sub-pixel electrode, the second sub-pixel electrode and the third sub-pixel electrode form a transparent electrode
  • it can be made of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O). 3 ), indium gallium oxide (IGO) or aluminum oxide zinc (AZO) is formed.
  • the first sub-pixel electrode, the second sub-pixel electrode, and the third sub-pixel electrode form the reflective electrode, silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), and chromium (Cr), and a reflective layer formed of at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) and indium oxide (In 2 O 3 ) conductive layer composition.
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • ZnO zinc oxide
  • In 2 O 3 indium oxide
  • first sub-pixel electrode, the second sub-pixel electrode, and the third sub-pixel electrode are not limited to this, and may vary.
  • a pixel defining layer (PDL) 41 may be formed.
  • the pixel defining layer 41 is usually formed of a single material layer or a composite material layer of suitable organic materials among materials such as polyacrylate and polyimide.
  • the aforementioned pixel defining layer 41 simultaneously covers the first sub-pixel electrode, the second sub-pixel electrode and the third sub-pixel electrode. Then, a plurality of openings distributed in an array are formed on the pixel defining layer 41, and the middle parts of the first, second, and third sub-pixel electrodes are respectively exposed (the exposed area of the sub-pixel electrode is the sub-pixel The effective area of the electrode).
  • Each light-emitting unit 51 can be formed by evaporating a light-emitting material in each opening in the pixel defining layer 41, that is, a plurality of light-emitting units 51 are isolated from each other by the pixel defining layer 41.
  • each light-emitting unit 51 is each sub-pixel, and may include a first sub-pixel, a second sub-pixel, and a third sub-pixel.
  • the first subpixel may be a subpixel emitting red light
  • the second subpixel may be a subpixel emitting green light
  • the third subpixel may be a subpixel emitting blue light.
  • the layer where each light-emitting unit 51 is located forms the light-emitting layer 50.
  • a cathode 61 covering the first sub-pixel, the second sub-pixel and the third sub-pixel is vapor-deposited on the pixel defining layer 41.
  • the cathode 61 may be integrally formed with respect to the plurality of light-emitting units 51 so as to cover the entire display area.
  • the cathode 61 is also commonly referred to as a counter electrode.
  • a packaging structure 70 for packaging the light-emitting unit 51 is formed on the cathode 61. It is easy to understand that since the light-emitting unit 51 is an organic light-emitting material layer, it is very sensitive to external environments such as water vapor and oxygen. If the organic light-emitting material layer in the display panel 110 is exposed to an environment with water vapor or oxygen, it will cause display The performance of the panel 110 drops sharply or is completely damaged.
  • the packaging structure 70 can block air and water vapor for the light emitting unit 51, thereby ensuring the reliability of the display panel 110.
  • the visible light conversion layer 82 is provided in the packaging structure 70. That is to say, the forming step of the visible light conversion layer 82 may be after the preparation step of the light-emitting unit 51, which can prevent the high-temperature preparation process of the light-emitting unit 51 from causing adverse effects on the visible light conversion layer 82.
  • the plurality of light-emitting units 51 includes a first light-emitting unit 511 for displaying and a second light-emitting unit 512 for providing reflected light for fingerprint reflection, that is, some of the light-emitting units 51 are
  • the first light-emitting unit 511 and the other light-emitting units 51 are second light-emitting units 512. These light emitting units 51 can be arranged at intervals.
  • the visible light conversion layer 82 is arranged corresponding to the area of the second light-emitting unit 512.
  • the visible light conversion layer 82 is used to receive the visible light emitted by the second light-emitting unit 512 and convert the visible light into non-visible light.
  • the fingerprint recognition module 120 is used to receive the non-visible light reflected by the fingerprint. Visible light and fingerprint recognition.
  • the color of the light emitting unit 51 is generally red, green, blue or white, and one pixel unit includes at least one red light emitting unit, at least one green light emitting unit, and at least one blue unit.
  • a light-emitting unit 51 is added as a second light-emitting unit 512 in the pixel unit to provide the visible light conversion layer 82
  • a light source is provided so that the visible light conversion layer 82 corresponding to the second light-emitting unit 512 receives more visible light and converts it into invisible light, so as to ensure that after the invisible light is reflected by the fingerprint, the fingerprint identification module 90 can obtain stronger light intensity. Thereby improving the accuracy of fingerprint recognition.
  • the visible light emitted by the second light-emitting unit 512 is red light, green light, blue light or white light, which is not limited here.
  • the visible light conversion layer 82 is required to be as close as possible to the second light-emitting unit 512.
  • the area of the visible light conversion layer 82 is preferably equivalent to the area of the corresponding second light-emitting unit 512.
  • the orthographic projection of the visible light conversion layer 82 on the display substrate 10 coincides with the orthographic projection of the second light-emitting unit 512 on the display substrate 10.
  • the light generated by the second light-emitting unit 512 can be converted as much as possible into invisible light such as infrared light.
  • the non-visible light reflected by the visible light conversion layer 82 to the second light-emitting unit 512 can be blocked by the second light-emitting unit 512 to avoid the The invisible light reflected by the two light-emitting units 512 crosstalks the invisible light reflected by the fingerprint, which affects the accuracy of fingerprint recognition.
  • part or all of the display area of the display panel 110 is provided with the above-mentioned second light-emitting unit 512, so that part or all of the display area of the display panel 110 can realize fingerprint recognition.
  • the second light-emitting unit 512 is provided in a part of the display area of the display panel 110, the part of the display area can be displayed normally, and can also be a fingerprint recognition area.
  • all the display areas of the display panel 110 are provided with the second light-emitting unit 512, all the display areas can be displayed normally and can be used as fingerprint identification areas.
  • the display panel 110 is a full screen
  • the display panel 110 is a full screen fingerprint recognition display panel.
  • the visible light conversion layer 82 is provided in the packaging structure 70. On the basis of not affecting the packaging performance, it can not only protect the visible light conversion layer 82, but also because the visible light conversion layer 82 is relatively far from the fingerprint recognition surface. Therefore, the light absorption efficiency of the visible light conversion layer 82 can be improved, the light intensity obtained by the fingerprint identification module 120 can be improved, and the accuracy of fingerprint identification can be improved.
  • the packaging structure 70 may be a one-layer or multi-layer structure, and may be an organic film layer or an inorganic film layer, or a laminated structure of an organic film layer and an inorganic film layer.
  • the package structure 70 may include two inorganic film layers and an organic film layer between the two inorganic film layers.
  • a layer of inorganic packaging film layer 71 may be formed first, and then the visible light conversion layer 82 may be formed on the inorganic packaging film layer 71, and then another inorganic layer may be formed.
  • another inorganic encapsulation film layer can also be formed on the organic encapsulation film layer. That is to say, the visible light conversion layer 82 is provided in the packaging structure 70, and the packaging structure 70 includes a multilayered packaging film layer, and the visible light conversion layer 82 is located between two adjacent packaging film layers.
  • the display panel 110 provided by the embodiment of the present application can meet the requirements of being applied to a full-screen or borderless display panel. Of course, it can also be applied to a normal display panel with a border or a narrow border.
  • the fingerprint identification module 120 includes a fingerprint sensor array layer 121.
  • the fingerprint sensor array layer 121 includes a plurality of fingerprint sensors distributed in an array.
  • Each fingerprint sensor in the fingerprint sensor array layer 121 includes a sensing plate and an integration circuit.
  • the fingerprint sensor and the fingerprint of the finger will form a fingerprint capacitance, and the fingerprint capacitance can generate an induced charge through the driving signal.
  • the distances between the ridges and valleys of the fingerprint and the sensing plate are different, the sizes of the fingerprint capacitances corresponding to the ridges and valleys are different, resulting in different amounts of corresponding induced charges.
  • one drive signal causes the sensing electrode to generate induced charges as one coding.
  • the integration circuit in the fingerprint sensor can perform integration processing on the charges obtained from multiple coding to obtain the capacitance value of the fingerprint capacitor.
  • the fingerprint identification module 120 or the processor in the display device converts each capacitance value corresponding to the fingerprint sensor array into a corresponding digital signal, and generates a fingerprint image based on the digital signal.
  • the display device can compare the fingerprint image with the fingerprint of the legal user. The template is matched and verified to realize fingerprint identification.
  • the fingerprint identification module 120 further includes a collimation layer 122, which is disposed between the fingerprint sensor array layer 121 and the display substrate 10, that is, the collimation layer 122 is disposed between the fingerprint sensor array layer 121 and the display panel 110. It is used to improve the light efficiency and light intensity received by the fingerprint sensor, and to prevent the crosstalk effect of the invisible light scattered by the visible light conversion layer 82 to the display substrate 10 on fingerprint detection to the greatest extent. It can be understood that the collimation layer 121 may include multiple collimators.
  • the fingerprint identification module 120 can be disposed in a part of the display area or the entire display area of the display panel 110. In some embodiments, the fingerprint recognition module 120 is provided at least in an area corresponding to the visible light conversion layer 82.
  • the light emitting unit 51 does not need to be provided with the second light emitting unit 512, and the visible light conversion layer 82 is provided in the packaging structure 70.
  • the visible light conversion layer 82 is arranged corresponding to the area of the pixel defining layer 41, so as to avoid blocking the light emitting unit 51 from affecting the normal display of the light emitting layer 50; the visible light conversion layer 82 is used to receive the visible light emitted by the light emitting unit 51 and reflected by the fingerprint and The visible light is converted into invisible light that the fingerprint identification module 120 can receive.
  • the finger 101 presses the upper part of the display panel 110 (the side close to the packaging structure 70).
  • the visible light emitted by the light-emitting layer 50 irradiates the fingerprint pressed on the display panel 110, and the visible light reflected by the ridges and valleys on the fingerprint irradiates the visible light conversion layer 82.
  • the visible light conversion layer 82 receives the visible light reflected by the fingerprint and converts it into invisible light, and emits the invisible light to the fingerprint identification module 120.
  • the fingerprint identification module 120 receives the invisible light and performs fingerprint identification.
  • the orthographic projection of the visible light conversion layer 82 on the display substrate 10 is located within the range of the orthographic projection of the top surface of the pixel defining layer 41 (the surface close to the packaging structure 70) on the display substrate 10. Correspondingly, a certain position of the display area or the entire layer of the display area realizes fingerprint recognition. In an embodiment, the orthographic projection of the visible light conversion layer 82 on the display substrate 10 coincides with the orthographic projection of the top surface of the pixel defining layer 41 (the surface close to the packaging structure 70) on the display substrate 10.
  • the visible light conversion layer 82 is located in the display substrate 10. Furthermore, the visible light conversion layer 82 is located below the pixel defining layer 41, that is, between the substrate 11 and the pixel defining layer 41.
  • the visible light conversion layer 82 is used to receive the visible light emitted by the light-emitting unit 51 and reflected by the fingerprint and convert the visible light into invisible light that the fingerprint identification module 120 can receive. And because the visible light conversion layer 82 is located below the pixel defining layer 41, it will not absorb the visible light emitted by the light emitting layer 50, so it will not affect the aperture ratio of the pixel defining layer 41, nor will it affect the display of the light emitting layer 50.
  • the blocking effect of the pixel defining layer 41 can also prevent the visible light of the light-emitting layer 50 from directly entering the visible light conversion layer 82 to affect fingerprint imaging. Therefore, the visible light conversion layer 82 can cover the entire display area of the display panel 110, and accordingly the fingerprint sensor The array layer 121 is arranged corresponding to the entire display area of the display panel 110 to realize full-screen fingerprint recognition. In other words, the orthographic projection of the visible light conversion layer 82 on the substrate 11 covers the entire orthographic projection of the light-emitting layer 50 on the substrate 11.
  • the finger 101 presses the upper part of the display panel 110 (close to the packaging structure 70 side).
  • the visible light emitted by the light-emitting layer 50 irradiates the fingerprint pressed on the display panel 110, and the visible light reflected by the ridges and valleys on the fingerprint irradiates the visible light conversion layer 82.
  • the visible light conversion layer 82 receives the visible light reflected by the fingerprint and converts it into invisible light, and emits the invisible light to the fingerprint identification module 90.
  • the fingerprint identification module 90 receives the invisible light and performs fingerprint identification.
  • the visible light conversion layer 82 is located between the pixel defining layer 41 and the planarizing layer 28.
  • the planarization layer 28 is beneficial to form a flat visible light conversion layer 82.
  • the display panel 110 further includes a protective layer 84 covering the visible light conversion layer 82, and the protective layer 84 is located between the visible light conversion layer 82 and the pixel defining layer 41 to protect the visible light conversion layer 82.
  • the protective layer 84 is silicon nitride. The protective layer 84 can be prepared by a low-temperature process, thereby protecting the visible light conversion layer 82 from damage to the greatest extent.
  • An embodiment of the present application also provides a display device, which includes the above-mentioned display screen.
  • the display device can be any product or component with fingerprint recognition function, such as a mobile phone, a tablet computer, a TV, a monitor, a notebook computer, a digital photo frame, a vehicle-mounted device, a wearable device, or an Internet of Things device.
  • fingerprint recognition function such as a mobile phone, a tablet computer, a TV, a monitor, a notebook computer, a digital photo frame, a vehicle-mounted device, a wearable device, or an Internet of Things device.

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Abstract

一种显示面板、显示屏及显示装置，该显示屏包括显示面板（110）及指纹识别模组（120）；所述指纹识别模组（120）设于所述显示面板（110）的底侧；所述显示面板（110）内设有可见光转化层（82）；其中，所述可见光转化层（82）用于接收可见光并将所述可见光转化成所述指纹识别模组（120）能够接收的非可见光。该显示屏的指纹识别精度高。

Description

显示面板、显示屏及显示装置
相关申请
本申请要求2019年04月25日申请的，申请号为201910339585.2，名称为“显示屏及显示装置”的中国专利申请的优先权，在此将其全文引入作为参考。
技术领域
本申请涉及显示技术领域，特别是涉及一种显示面板、显示屏及显示装置。
背景技术
指纹是人体独一无二的特征，它由指端皮肤表面上的纹脊和纹谷组成，这些纹脊和纹谷形成的图案决定了指纹的唯一性，其唯一性和复杂度足以满足鉴别要求。随着显示技术的飞速发展，具有指纹识别功能的显示面板已经逐渐遍及人们的生活中。
与此同时，随着显示装置的快速发展，用户对屏占比的要求越来越高，使得显示装置的全面屏显示受到业界越来越多的关注，为尽可能的提高屏占比，现有技术中出现了将指纹识别部件设于显示屏下方，从而减小非显示区域的方案。但针对目前的有机电致发光二极管(Organic Light-Emitting Diode，OLED)显示屏，用户指纹反射的光线对OLED显示屏的穿透性较差，从而影响指纹识别精度。
发明内容
基于此，有必要针对传统的用户指纹反射的光线对OLED显示屏的穿透性较差，从而影响指纹识别精度的问题，提供一种改善上述问题的显示面板、显示屏及显示装置。
根据本申请的一个方面，提供一种显示屏，包括：
显示面板，所述显示面板包括可见光转化层，且所述显示面板具有显示面；及
指纹识别模组，所述指纹识别模组设于所述显示面板与所述显示面相背的一侧；
其中，所述可见光转化层用于接收可见光并将所述可见光转化成所述指纹识别模组能够接收的非可见光。
根据本申请的另一个方面，提供一种显示装置，包括上述显示屏。
根据本申请的另一个方面，提供一种显示面板，包括可见光转化层，且所述显示面板具有显示面，其中，所述可见光转化层用于接收可见光并将所述可见光转化成位于所述显 示面板远离所述显示面的一侧的指纹识别模组能够接收的非可见光。
本申请实施例在显示面板内设置可见光转化层，并在显示面板的底侧设置指纹识别模组，可见光转化层将显示面板发射的可见光转化成对OLED显示屏的穿透性良好的非可见光，从而被指纹识别模组接收并进行指纹识别。如此指纹识别模组被设置成检测非可见光而基本不受可见光的影响。这样，无论显示面板正在显示何种图像都不会对指纹识别模组的检测产生影响，从而提高了指纹识别精度，并且可见光转化层发射的非可见光也不会影响显示面板发射的可见光，从而不影响显示效果。
因此该显示屏不受可见光的限制，解决了可见光对于柔性衬底的PI的穿透力差导致指纹识别部件检测到的光强度不够的问题，且由于非可见光对于PI的穿透力良好，因此柔性衬底无需打孔或挖凹槽，降低了制造工艺难度及生产成本，同时也避免了对PI的强度的影响。
附图说明
图1为本申请一实施例中的显示屏的结构示意图；
图2为图1所示的显示屏的指纹识别原理示意图；
图3为本申请又一实施例中的显示屏的结构示意图；
图4为图3所示的显示屏的指纹识别原理示意图；
图5为本申请另一实施例中的显示屏的结构示意图；
图6为图5所示的显示屏的指纹识别原理示意图。
具体实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳的实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。
针对OLED显示屏，通常的，指纹识别部件贴合在显示屏下方。工作时，OLED显示屏中的OLED器件发射可见光，该可见光经过用户指纹的反射，再经过显示背板后被贴合在显示屏下方的指纹识别部件检测到。而目前柔性显示面板的柔性衬底的材质一般采用聚酰亚胺(polyimide，PI)等聚合物，可见光对于柔性衬底的PI的穿透力差，导致指纹识别部件检测到的光强度不够，故而需要对PI打孔，如此大大提高了产品的工艺难度，不利于 屏下指纹识别的实现。本申请提供了一种显示屏，能够较佳地解决上述问题。
请参阅图1～6，本申请实施例提供显示面板和具有其的显示屏。在显示面板110内设置可见光转化层82。可见光转化层82用于接收可见光并将可见光转化成指纹识别模组120能够接收的非可见光。在显示面板110的底侧，即为显示面板110与显示面相背的背面，也即显示面板110的显示基板10背离发光层50的一侧，设置指纹识别模组120。通过可见光转化层82将显示面板110发射的可见光转化成对OLED显示屏的穿透力良好的非可见光，从而被指纹识别模组120接收并进行指纹识别。如此指纹识别模组120被设置成检测非可见光而基本不受其它可见光的影响。这样，无论显示装置的显示面板正在显示何种图像都不会对指纹识别模组120的检测产生影响，从而提高了指纹识别精度，并且可见光转化层82发射的非可见光也不会影响显示面板110发射的可见光，从而不影响显示效果。
在一些实施例中，可见光转化层82设于封装结构70内或显示基板10内。
在一具体实施例中，该非可见光是红外光，并且相应的，指纹识别模组120包含红外传感器，可见光转化层82可为红外量子点层，例如可见光转化层82可为钙钛矿红外量子点，也可以是PbS红外量子点，还可以为Ag2S红外量子点。红外量子点层可采用喷墨打印或其他手段形成。
本文以红外传感器为例来具体说明根据本公开实施例的指纹识别模组120。在其他一些实施例中，非可见光还可以是紫外光。当应用紫外光时，采用的可见光转化层82可能不同，指纹识别模组120相应的采用紫外传感器。
本申请实施例提供的显示屏不受可见光的限制，解决了可见光对于柔性衬底的PI的穿透力差导致指纹识别部件检测到的光强度不够的问题，且由于非可见光对于PI的穿透力良好，因此柔性衬底无需打孔或挖凹槽，降低了制造工艺难度及生产成本，同时也避免了对PI的强度的影响。
本申请实施例提供的显示屏，可以适用于各种模式的显示面板，例如，OLED显示屏、液晶显示屏等，在此不作限定。
在本文中，显示区域是指显示面板所限定的用于形成发光元件的有源区域，非显示区域是指用于为显示面板提供信号线路的走线等不允许被切掉的周围区域。一个显示面板可以包括后续用于形成发光元件的显示区域AA(Active Area，AA)，还可以包括后续用于显示面板的非显示区域(包括设置驱动电路、芯片的区域)。
参阅图1，本申请提供一种显示屏100，包括显示面板110及指纹识别模组120。
显示面板110包括显示基板10、可见光转化层82、位于显示基板10上的发光层50 及位于发光层50上的封装结构70，封装结构70用于封装发光层50。可见光转化层82用于接收可见光，并将可见光转化成指纹识别模组120能够接收的非可见光。可见光转化层82设于封装结构70内。在一实施例中，可见光转化层82用于接收发光层50发出的可见光并将可见光转化成指纹识别模组120能够接收的非可见光，然后指纹反射该非可见光并以使该非可见光被指纹识别模组120接收。在另一实施例中，可见光转化层82用于接收指纹反射的可见光并转化成指纹识别模组120能够接收的非可见光。
指纹识别模组120设于显示基板10背离发光层50的一侧，指纹识别模组90用于接收非可见光并进行指纹识别。
在识别指纹时，请一并参阅图2，手指101位于发光层50的上方，并按压显示面板110上方(靠近封装结构70一侧)。发光层50发出的可见光先经过位于封装结构70内的可见光转化层82转化成非可见光，然后该非可见光照射到按压在显示面板110上的指纹上，经指纹上的纹脊和纹谷反射后的非可见光由指纹识别模组120接收，指纹识别模组120接收该非可见光并进行指纹识别。
在一些实施例中，显示基板10还包括衬底11、设置于衬底11的薄膜晶体管(Thin-film transistor，TFT)20，以及设置于薄膜晶体管20上的子像素电极31。当然，该显示基板10还可以包括平坦化层28、钝化层(图未示)、像素限定层41等膜层。在一些实施例中，显示基板10可采用低温多晶硅技术(Low Temperature Poly-silicon，LTPS)工艺制备。
衬底11可以由诸如玻璃材料、金属材料或包括聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)或聚酰亚胺(PI)等的塑胶材料中合适的材料形成。在一些实施例中，衬底11采用柔性材料制成柔性衬底，柔性材料例如为聚酰亚胺(Polyimide，简称PI)聚合物，聚碳酸酯(Polycarbonate，简称PC)树脂，也称为PC塑料，聚对苯二甲酸类(Polyethylene terephthalate，简称PET)塑料等。
在一个实施例中，在形成TFT之前，可以在衬底11上形成诸如缓冲层12的另外的层。缓冲层12可以形成在衬底11的整个表面上，也可以通过被图案化来形成。
缓冲层12可以具有包括PET、PEN、聚丙烯酸酯和/或聚酰亚胺等材料中合适的材料，以单层或多层堆叠的形式形成层状结构。缓冲层12还可以由氧化硅或氮化硅形成，或者可以包括有机材料和/或无机材料的复合层。
薄膜晶体管20可以包括半导体层21、栅电极22、源电极23和漏电极24。在一些实施例中，可在栅极绝缘层25、绝缘介质层26和层间绝缘层27形成过孔，然后在该过孔内形成与半导体层21连接的源电极23和漏电极24，如此形成套孔结构。源电极23和漏电 极24可以为金属材料，从而对可见光和非可见光均有较好的反射作用，因此可利用该套孔结构，将经指纹反射同时经可见光转化层82转化的非可见光从相邻两个源漏极之间的区域到达位于显示基板10的背面的指纹识别模组120，如此可防止可见光转化层82向四周发射的光相互干扰，对于指纹识别的串扰，影响指纹成像。
半导体层21可以由非晶硅层、金属氧化物或多晶硅层形成，或者可以由有机半导体材料形成。在一个实施例中，半导体层21包括沟道区和掺杂有掺杂剂的源区与漏区。
可以利用栅极绝缘层25覆盖半导体层21。栅电极22可以设置在栅极绝缘层25上。大体上，栅极绝缘层25可以覆盖衬底11的整个表面。在一个实施例中，可以通过图案化来形成栅极绝缘层25。考虑到与相邻层的粘合、堆叠目标层的可成形性和表面平整性，栅极绝缘层25可以由氧化硅、氮化硅或其他绝缘有机或无机材料形成。栅电极22可以被层间绝缘层27直接覆盖。在一些实施例中，也可在栅电极22上先形成电容的绝缘介质层26，再覆盖层间绝缘层27。
由于薄膜晶体管(thin film transistor，TFT)20具有复杂的层结构，因此有必要在TFT20上形成平坦化层28，以便形成足够平坦的顶表面。在形成平坦化层28后，可以在平坦化层28中形成电极通孔，以暴露TFT 20的漏电极24。
可以在平坦化层28上形成子像素电极31。子像素电极31可以包括第一子像素电极、第二子像素电极和第三子像素电极。第一子像素电极形成在第一子像素区域。第二子像素电极形成在第二子像素区域。第三子像素电极形成在第三子像素区域。也就是说，子像素电极31与显示基板10上的子像素区域一一对应。这里，第一子像素电极、第二子像素电极和第三子像素电极可以同时地或同步地形成。第一子像素电极、第二子像素电极和第三子像素电极中的每一个可以经过电极通孔电连接到薄膜晶体管20的漏电极24。这里的第一子像素电极、第二子像素电极、第三子像素电极通常被称为阳极。
第一子像素电极、第二子像素电极和第三子像素电极形成透明电极时，可以由氧化铟锡(ITO)、氧化铟锌(IZO)、氧化锌(ZnO)、氧化铟(In 2O 3)、氧化铟镓(IGO)或氧化铝锌(AZO)形成。
当第一子像素电极、第二子像素电极和第三子像素电极形成反射电极时，可由银(Ag)、镁(Mg)、铝(Al)、铂(Pt)、钯(Pd)、金(Au)、镍(Ni)、钕(Nd)、铱(Ir)和铬(Cr)中的至少一种形成的反射层和由氧化铟锡(ITO)、氧化铟锌(IZO)、氧化锌(ZnO)、氧化铟(In 2O 3)形成的导电层组成。
第一子像素电极、第二子像素电极和第三子像素电极的结构和材料不限于此，并且可 以变化。
在形成第一子像素电极、第二子像素电极和第三子像素电极之后，可以形成像素限定层(pixel defining layer，PDL)41。像素限定层41通常由诸如聚丙烯酸酯和聚酰亚胺等材料中合适的有机材料的单一材料层或复合材料层形成。
上述像素限定层41同时覆盖第一子像素电极、第二子像素电极和第三子像素电极。然后在像素限定层41上形成呈阵列分布的多个开口，且分别暴露第一子像素电极、第二子像素电极和第三子像素电极的中间部分(子像素电极暴露的区域即为子像素电极的有效区域)。
可以在像素限定层41内的各开口内蒸镀发光材料形成各发光单元51，也就是说多个发光单元51通过像素限定层41彼此隔离。相应地，各发光单元51即为各子像素，可包括第一子像素、第二子像素及第三子像素。第一子像素可以是发射红光的子像素，第二子像素可以是发射绿光的子像素，第三子像素可以是发射蓝光的子像素。各发光单元51所在的层形成发光层50。
然后，在像素限定层41上蒸镀形成覆盖第一子像素、第二子像素和第三子像素的阴极61。阴极61可以相对多个发光单元51一体形成，从而覆盖整个显示区域。阴极61也通常被称为对电极。
在阴极61上形成用于封装发光单元51的封装结构70。容易理解的是，由于发光单元51为有机发光材料层，其对水汽和氧气等外部环境十分敏感，如果将显示面板110中的有机发光材料层暴露在有水汽或氧气的环境中，会造成显示面板110的性能急剧下降或者完全损坏。封装结构70能够为发光单元51阻挡空气及水汽，从而保证显示面板110的可靠性。
在图1所示的示例中，可见光转化层82设于封装结构70内。也就是说可见光转化层82的形成步骤可在发光单元51的制备步骤之后，如此可避免发光单元51的高温制备工艺对可见光转化层82造成不良影响。
一些实施例中，多个发光单元51中包括用于显示的第一发光单元511和用于为指纹反射提供反射光的第二发光单元512，也就是多个发光单元51中一些发光单元51为第一发光单元511，另一些发光单元51为第二发光单元512。这些发光单元51之间可相互间隔设置。可见光转化层82对应第二发光单元512的区域设置，可见光转化层82用于接收第二发光单元512发出的可见光并将可见光转化成非可见光，指纹识别模组120用于接收经指纹反射的非可见光并进行指纹识别。
发光单元51的颜色一般为红色、绿色、蓝色或白色，而一个像素单元包括至少一个红色发光单元、至少一个绿色发光单元和至少一个蓝色单元。在本示例中，在正常用于显示的第一发光单元511以保证显示面板110的正常显示之外，在像素单元中还增加一个发光单元51作为第二发光单元512用于给可见光转化层82提供光源，以使与第二发光单元512对应的可见光转化层82接收更多的可见光转化为非可见光，从而保证该非可见光经指纹反射后，指纹识别模组90能够获得较强的光强度，从而提高指纹识别的精度。
进一步地，第二发光单元512发出的可见光为红光、绿光、蓝光或白光，在此不做限制。
可理解，为了避免可见光转化层82吸收第一发光单元511的可见光，从而对用于正常显示的第一发光单元511造成影响，要求该可见光转化层82的尽可能地靠近第二发光单元512，且可见光转化层82的面积优选与对应的第二发光单元512的面积相当。优选地，可见光转化层82在显示基板10上的正投影与第二发光单元512在显示基板10上的正投影重合。如此第二发光单元512产生的光可以尽可能多地转化为红外光等非可见光，同时可见光转化层82向第二发光单元512反射的非可见光又能够被第二发光单元512遮挡，避免向第二发光单元512反射的非可见光对指纹反射的非可见光进行串扰，影响指纹识别的精度。
可理解，显示面板110的部分或全部显示区域均设置有上述第二发光单元512，以使显示面板110的部分或全部显示区域实现指纹识别。例如，在显示面板110的部分显示区域设置有上述第二发光单元512时，该部分显示区域即可正常显示，又可为指纹识别区。又例如，在显示面板110的全部显示区域均设置有上述第二发光单元512时，全部显示区域均可正常显示，且均可用作指纹识别区。当该显示面板110为全面屏时，该显示面板110为全屏指纹识别的显示面板。
在一些实施例中，可见光转化层82设于封装结构70内，在不影响封装性能的基础上，不仅可起到保护可见光转化层82的作用，且由于可见光转化层82与指纹识别面距离较近，因此可提高可见光转化层82的吸光效率，提高指纹识别模组120获得的光强度，从而提高指纹识别的精度。可以理解的是，封装结构70可以是一层或多层结构，可以是有机膜层或无机膜层，亦可是有机膜层和无机膜层的叠层结构。例如，一些实施例中，封装结构70可包括两层无机膜层及一层位于两层无机膜层之间的有机膜层。例如在一示例中，可见光转化层82设于封装结构70内时，可先形成一层无机封装膜层71，然后在该无机封装膜层71上形成可见光转化层82，再形成另一层无机封装膜层72或有机封装膜层。进一步地， 还可在该有机封装膜层上再进行另一层无机封装膜层。也就是说，可见光转化层82设于封装结构70内，且封装结构70包括多层层叠设置的封装膜层，可见光转化层82位于相邻两层的封装膜层之间。
本申请实施例提供的显示面板110，能够满足应用于全面屏或无边框的显示面板的需求，当然也可以应用到普通有边框或者窄边框的显示面板中。
在一些实施例中，指纹识别模组120包括指纹传感器阵列层121。指纹传感器阵列层121包括呈阵列分布的多个指纹传感器。指纹传感器阵列层121中的每个指纹传感器包括一个感应极板和一个积分电路，当手指触摸指纹传感器时，指纹传感器跟手指的指纹会构成指纹电容，通过驱动信号可以使得指纹电容产生感应电荷，其中由于在指纹的纹脊和纹谷与感应极板之间的距离不同，因此纹脊和纹谷对应的指纹电容的大小不同，从而导致对应的感应电荷量不同。通常将一次驱动信号使得感应电极产生感应电荷称为一次打码。指纹传感器中的积分电路可以对多次打码得到的电荷做积分处理，以得到指纹电容的电容值。其次，指纹识别模组120或显示装置中的处理器将指纹传感器阵列对应的各个电容值转换成对应的数字信号，并根据数字信号生成指纹图像，显示装置可以将该指纹图像与合法用户的指纹模板进行匹配验证，从而实现指纹识别。
进一步地，指纹识别模组120还包括准直层122，准直层122设于指纹传感器阵列层121和显示基板10之间，即准直层122设于指纹传感器阵列层121和显示面板110之间，用于提高指纹传感器接收的光效率和光强度，最大限度地防止可见光转化层82向显示基板10散射的非可见光对指纹检测的串扰作用。可理解，准直层121可包含多个准直器。
可理解，指纹识别模组120可设置在显示面板110的部分显示区域或全部显示区域。在一些实施例中，指纹识别模组120至少在对应可见光转化层82的区域设置。
请参阅图3，在另一种显示屏200中，发光单元51无需设置上述第二发光单元512，可见光转化层82设于封装结构70内。相应地，可见光转化层82对应像素限定层41的区域设置，如此避免遮挡发光单元51影响发光层50的正常显示；可见光转化层82用于接收发光单元51发出的且经指纹反射的可见光并将可见光转化成指纹识别模组120能够接收的非可见光。
如此在识别指纹时，请一并参阅图4，手指101按压显示面板110上方(靠近封装结构70的一侧)。发光层50发出的可见光照射到按压在显示面板110上的指纹上，经指纹上的纹脊和纹谷反射后的可见光照射到可见光转化层82上。可见光转化层82接收指纹反射的可见光并转化成非可见光，并向指纹识别模组120发射该非可见光。指纹识别模组120 接收该非可见光并进行指纹识别。
进一步地，可见光转化层82在显示基板10上的正投影位于像素限定层41的顶侧表面(靠近封装结构70的表面)在显示基板10上的正投影的范围内。相应地，显示区域的某一位置或显示区域的整层实现指纹识别。在一实施例中，可见光转化层82在显示基板10上的正投影与像素限定层41的顶侧表面(靠近封装结构70的表面)在显示基板10上的正投影重合。
请参阅图5，在另一种显示屏300中，可见光转化层82位于显示基板10内。进一步地，可见光转化层82位于像素限定层41的下方，即位于衬底11与像素限定层41之间。可见光转化层82用于接收发光单元51发出的且经指纹反射的可见光并将可见光转化成指纹识别模组120能够接收的非可见光。且由于可见光转化层82位于像素限定层41的下方，其不会吸收发光层50发射的可见光，因此其不会影响像素限定层41的开口率，也不会对发光层50的显示造成影响，此外由于像素限定层41的阻挡作用还可避免发光层50的可见光直接进入可见光转化层82中影响指纹成像的问题，故而可将可见光转化层82覆盖显示面板110的整个显示区域，相应地指纹传感器阵列层121对应显示面板110的整个显示区域设置，实现全屏指纹识别。也就是说，可见光转化层82在衬底11上的正投影覆盖整个发光层50在衬底11上的正投影。
如此在识别指纹时，请一并参阅图6，手指101按压显示面板110上方(靠近封装结构70一侧)。发光层50发出的可见光照射到按压在显示面板110上的指纹上，经指纹上的纹脊和纹谷反射后的可见光照射到可见光转化层82上。可见光转化层82接收指纹反射的可见光并转化成非可见光，并向指纹识别模组90发射该非可见光。指纹识别模组90接收该非可见光并进行指纹识别。
在一些实施例中，显示面板110还包括位于像素限定层41下方的平坦化层28时，可见光转化层82位于像素限定层41与平坦化层28之间。平坦化层28上有利于形成平整的可见光转化层82。
在一些实施例中，显示面板110还包括覆盖可见光转化层82的保护层84，保护层84位于可见光转化层82与像素限定层41之间，以用于保护可见光转化层82。进一步地，保护层84为氮化硅。该保护层84可采用低温工艺制备，进而最大限度地保护可见光转化层82不受损伤。
本申请实施例还提供一种显示装置，该显示装置包括上述显示屏。
该显示装置可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、车载 设备、可穿戴设备或物联网设备等任何具有指纹识别功能的产品或部件。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种显示屏，包括：
    具有显示面的显示面板，所述显示面板包括可见光转化层；及
    指纹识别模组，所述指纹识别模组设于所述显示面板与所述显示面相背的一侧；
    其中，所述可见光转化层用于接收可见光并将所述可见光转化成所述指纹识别模组能够接收的非可见光。
  2. 根据权利要求1所述的显示屏，其中，所述显示面板包括：
    显示基板；
    发光层，设于所述显示基板上；及
    封装结构，用于封装所述发光层；
    其中，所述可见光转化层设于所述封装结构内。
  3. 根据权利要求2所述的显示屏，其中，所述发光层包括多个发光单元，所述多个发光单元中包括用于显示的第一发光单元和用于为指纹识别提供反射光的第二发光单元；
    所述可见光转化层用于接收所述第二发光单元发出的可见光并将所述可见光转化成所述指纹识别模组能够接收的非可见光。
  4. 根据权利要求3所述的显示屏，其中，所述可见光转化层在所述显示基板上的正投影，与所述第二发光单元在所述显示基板上的正投影重合。
  5. 根据权利要求3所述的显示屏，其中，所述显示面板的指纹识别区的每个像素单元均包括一个所述第二发光单元。
  6. 根据权利要求2所述的显示屏，其中，所述发光层包括多个发光单元，所述显示基板包括用于将所述多个发光单元彼此隔离的像素限定层；
    所述可见光转化层对应所述像素限定层的区域设置，所述可见光转化层用于接收所述发光单元发出的且经指纹反射的可见光并将所述可见光转化成所述指纹识别模组能够接收的非可见光。
  7. 根据权利要求6所述的显示屏，其中，所述可见光转化层在所述显示基板上的正投影位于所述像素限定层的顶侧表面在所述显示基板上的正投影的范围内。
  8. 根据权利要求2所述的显示屏，其中，所述封装结构包括多层层叠设置的封装膜层，所述可见光转化层位于相邻两层的封装膜层之间。
  9. 根据权利要求1所述的显示屏，其中，所述显示面板包括：
    显示基板，所述显示基板包括衬底、平坦化层及像素限定层，所述平坦化层设于所述衬底上，所述像素限定层设于所述平坦化层上，所述像素限定层用于将所述多个发光单元彼此隔离；及
    发光层，设于所述显示基板上，所述发光层包括多个发光单元；
    其中，所述可见光转化层位于所述像素限定层与所述平坦化层之间，所述可见光转化层用于接收所述发光单元发出的且经指纹反射的可见光并将所述可见光转化成所述指纹识别模组能够接收的非可见光。
  10. 根据权利要求9所述的显示屏，其中，所述可见光转化层在所述衬底上的正投影覆盖所述发光层在所述衬底上的正投影。
  11. 根据权利要求9所述的显示屏，其中，所述可见光转化层覆盖所述显示面板的整个显示区域。
  12. 根据权利要求9所述的显示屏，其中，所述显示面板还包括覆盖所述可见光转化层的保护层，所述保护层位于所述可见光转化层与所述像素限定层之间。
  13. 根据权利要求12所述的显示屏，所述保护层为氮化硅层。
  14. 根据权利要求1～13任一项所述的显示屏，其中，所述可见光转化层为红外量子点层。
  15. 一种显示装置，其中，包括如权利要求1～14任一项所述的显示屏。
  16. 一种显示面板，包括可见光转化层，且所述显示面板具有显示面，其中，所述可见光转化层用于接收可见光并将所述可见光转化成位于所述显示面板远离所述显示面的一侧的指纹识别模组能够接收的非可见光。
  17. 根据权利要求16所述的显示面板，还包括：
    显示基板；
    发光层，设于所述显示基板上，所述发光层包括多个发光单元；及
    封装结构，设于所述发光层上以封装所述发光层；
    其中，所述可见光转化层设置在所述封装结构内或者所述显示基板内；
    所述可见光转化层用于接收所述发光单元发出的可见光并将所述可见光转化成非可见光后从所述显示面板的所述显示面出光，或者用于接收所述发光单元发出的且经指纹反射的可见光并将所述可见光转化成非可见光后从所述显示面板背离所述显示面的一侧出光。
  18. 根据权利要求17所述的显示面板，其中，所述多个发光单元中包括用于显示的第一发光单元和用于为指纹识别提供反射光的第二发光单元；
    所述可见光转化层设置于所述封装结构内，用于接收所述第二发光单元发出的可见光并将所述可见光转化成非可见光后从所述显示面板的所述显示面出光。
  19. 根据权利要求17所述的显示面板，其中，所述显示基板包括用于将所述多个发光单元彼此隔离的像素限定层；
    所述可见光转化层设置于所述封装结构内并且对应所述像素限定层的区域设置，所述可见光转化层用于接收所述发光单元发出的且经指纹反射的可见光并将所述可见光转化成非可见光后从所述显示面板背离所述显示面的一侧出光。
  20. 根据权利要求17所述的显示面板，其中，所述显示基板包括衬底、平坦化层及像素限定层，所述平坦化层设于所述衬底上，所述像素限定层设于所述平坦化层上，所述像素限定层用于将所述多个发光单元彼此隔离；
    所述可见光转化层设置于所述像素限定层与所述平坦化层之间，所述可见光转化层用于接收所述发光单元发出的且经指纹反射的可见光并将所述可见光转化成非可见光后从所述显示面板背离其显示面的一侧出光。
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