WO2020103406A1 - 一种引脚、引脚组合结构、封装体及其制作方法 - Google Patents

一种引脚、引脚组合结构、封装体及其制作方法

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Publication number
WO2020103406A1
WO2020103406A1 PCT/CN2019/086735 CN2019086735W WO2020103406A1 WO 2020103406 A1 WO2020103406 A1 WO 2020103406A1 CN 2019086735 W CN2019086735 W CN 2019086735W WO 2020103406 A1 WO2020103406 A1 WO 2020103406A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
pin
substrate
baffle structure
package
Prior art date
Application number
PCT/CN2019/086735
Other languages
English (en)
French (fr)
Inventor
吴虹
吕镇
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP23170184.8A priority Critical patent/EP4243057A3/en
Priority to EP19886596.6A priority patent/EP3783645B1/en
Publication of WO2020103406A1 publication Critical patent/WO2020103406A1/zh
Priority to US17/135,736 priority patent/US11539150B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members

Definitions

  • the present application relates to the field of electronic packaging, in particular to a pin, a pin combination structure, a package body and a manufacturing method thereof.
  • a plastic housing package may be a soldering of the bottom structure of a pin on a substrate, or insertion into a thermoplastic plastic part of a housing, after being inserted into a plastic housing, and encapsulating.
  • the top structure of the pin can be crimped to the connected printed circuit board (PCB) board or soldered to the connected PCB board.
  • PCB printed circuit board
  • a housing is mounted for the pin.
  • the interior of the housing is a cavity
  • the bottom structure of the pin is welded or crimped to the substrate
  • the top structure of the pin extends out of the housing through the gap in the housing.
  • silicone gel can be poured into the housing shell, and the silicone gel plays a role in insulating the pin and the substrate welding part and isolating dust.
  • an injection molding (molding) package may be used. After the bottom of the pin is welded to the substrate, it is placed in a mold having a cavity, and a plastic encapsulant is poured into the cavity, and the package can be obtained after the plastic encapsulant is cured.
  • the pins are connected to the housing or the mold by clamping, the connection is not tightly connected, and it is easy to cause the pouring of the molding compound, such as silicone gel, epoxy resin, etc. , It is easy to cause problems such as glue overflow and mold or pin contamination.
  • the application provides a pin, a pin combination structure, a package body and a manufacturing method thereof.
  • a cover plate or a skirt structure is sleeved on the pins to prevent the plastic encapsulant from overflowing from the cavity containing the plastic encapsulant in the mold that encapsulates the package when the plastic encapsulant is filled.
  • the first aspect of the present application provides a pin, characterized in that the pin is applied to a package body, the package body includes the pin, a substrate, and a plastic encapsulant, and the pin includes a body and a baffle structure;
  • the bottom of the body of the pin is welded to the substrate, the baffle structure is sleeved in the middle of the body, the plastic encapsulant covers the substrate, and wraps the bottom to the middle of the body; the baffle structure is used to When filling the cavity with the liquefied plastic compound, the plastic compound is blocked from overflowing from the cavity.
  • the cavity is a cavity for containing the plastic compound in a mold for packaging the package, and the cavity contains the body And the substrate from the bottom to the middle of the cavity, the substrate is located at the bottom of the cavity, the middle of the body is located at the top of the cavity, the side wall of the cavity top is against the baffle structure of the body, and the bottom of the cavity is The height of the top is lower than the height from the bottom of the body to the top.
  • the middle part of the pin is provided with a baffle structure, which can prevent the plastic encapsulant from overflowing from the cavity containing the plastic encapsulant in the mold for encapsulating the package when filling the plastic encapsulant, to avoid causing The mold and pins are contaminated.
  • the angle between the baffle structure and the body along the bottom direction of the body is greater than 0 degrees and less than or equal to 90 degrees.
  • the baffle structure may be a cover plate structure or a skirt structure.
  • the baffle structure is composed of a material resistant to high temperatures above 175 degrees Celsius. Since the plastic compound liquefies at a high temperature during the plastic packaging of the package body, when the plastic compound is filled, the plastic compound is in a high temperature state. In order to avoid damage to the baffle structure, the baffle structure can be made of high temperature resistant materials.
  • the baffle structure is composed of an elastic material.
  • the baffle structure is against the top of the cavity of the mold. Therefore, if the baffle structure uses an elastic material, the sealing between the baffle structure and the mold can be better.
  • the baffle structure is integrally formed with the middle of the body.
  • the baffle structure and the middle portion of the body may be integrally formed, which may make the baffle structure and the middle portion of the body more tightly combined to further avoid the overflow of the molding compound.
  • a platform structure is further provided between the middle and the bottom of the body, and the width of the end of the platform structure toward the middle of the body is greater than the width of the middle of the body.
  • a curved structure is further included between the middle and the bottom of the body, and a gap is provided in the middle of the curved structure.
  • the curved structure increases the contact area with the plastic encapsulant and increases the bonding force with the plastic encapsulant by bending the shape and the notch.
  • a flat connection structure is also provided between the middle of the body and the top of the body;
  • the thickness of the connecting structure is lower than the threshold; or, the connecting structure is a diamond-shaped structure, and a gap is provided in the middle of the connecting structure, one corner of the diamond-shaped structure is connected to the top of the body, and the diagonal is connected to the middle of the body.
  • connection structure may be a flat structure, and the thickness of the connection structure may be thin, which can absorb excessive pressure when crimping the pins to avoid damage to the pins.
  • the connection structure may also be a diamond-shaped structure, and a gap is provided in the middle of the connection structure. One corner of the diamond-shaped structure is connected to the top of the body and diagonally connected to the middle of the body to withstand the pressure when crimping the pins. Avoid pin damage.
  • the bottom of the body is a bottom plate of a plate-like structure, and the bottom plate is welded to the base plate.
  • the bottom of the pin is plate-shaped, which can increase the welding area with the substrate and improve the stability of the pin welding.
  • a second aspect of the present application provides a pin combination structure.
  • the pin combination structure is applied to a package body.
  • the package body includes the pin, a substrate, and a plastic encapsulant.
  • the pin combination structure includes: at least two pins and a barrier Plate structure; the bottom of each of the at least two pins is welded to the substrate, the plastic encapsulant covers the substrate, and wraps the bottom to middle portion of each pin; the baffle structure is provided with At least two notches, each of the at least two notches of the baffle structure is sleeved in the middle of each pin, and the at least two notches correspond to the at least two pins in one-to-one correspondence; the baffle The structure is used to prevent the plastic compound from overflowing from the cavity when the plastic compound is filled into the cavity.
  • the cavity is a cavity for accommodating the plastic compound in a mold for encapsulating the package, and the cavity contains A portion from the bottom to the middle of the at least two pins and the substrate, the substrate is located at the bottom of the cavity, the middle of the at least two pins is located at the top of the cavity, and the side wall at the top of the cavity is against the baffle structure
  • the height from the bottom to the top of the cavity is lower than the height from the bottom to the top of the substrate and the body.
  • a baffle structure is sleeved in the middle of the pin, and the baffle structure can be sleeved on a plurality of pins.
  • the plastic molding material can be blocked from being contained in the mold for packaging the package
  • the cavity of the molding compound overflows to avoid contamination of the mold and the leads.
  • a third aspect of the present application provides a package including: a substrate, a molding compound, a pin, and a baffle structure sleeved on the pin; the bottom of the body of the pin is welded to the substrate, the baffle structure Nested in the middle of the body, the molding compound covers the substrate and wraps the bottom to the middle of the body; the baffle structure is used to block the molding compound from the cavity when filling the cavity with the molding compound Overflow, the cavity is the cavity for containing the plastic encapsulant in the mold for encapsulating the package, the cavity contains the bottom to the middle of the body and the substrate, the substrate is located at the bottom of the cavity, the body The middle part is located at the top of the cavity, the side wall at the top of the cavity resists the baffle structure of the body, and the height from the bottom to the top of the cavity is lower than the height from the bottom to the top of the body.
  • the package body may include a substrate, a pin welded on the substrate, and a plastic encapsulant covering the substrate and the bottom to the middle of the pin, and a baffle structure is also sleeved on the pin. Therefore, when filling the molding compound, the baffle structure can prevent the molding compound from overflowing from the cavity containing the molding compound in the mold for encapsulating the package body, so as to avoid contamination of the mold and the leads.
  • the angle between the baffle structure and the pin along the bottom direction of the pin is greater than 0 degrees and less than or equal to 90 degrees.
  • the baffle structure is composed of a material resistant to high temperatures above 175 degrees Celsius.
  • the baffle structure is composed of an elastic material.
  • the baffle structure is integrally formed with the middle of the body.
  • the baffle structure and the middle part of the body can be integrally formed, which can make the baffle structure and the middle part of the body more tightly combined to further avoid the overflow of the molding compound.
  • a platform structure is further provided between the middle and the bottom of the pin, and the width of the end of the platform structure toward the middle of the body is greater than the width of the middle of the body.
  • a curved structure is further included between the middle and the bottom of the pin, and a gap is provided in the middle of the curved structure.
  • the curved structure increases the contact area with the plastic encapsulant and increases the bonding force with the plastic encapsulant by bending the shape and the notch.
  • a flat connection structure is also provided between the middle of the pin and the top of the pin;
  • the thickness of the connecting structure is lower than the threshold; or, the connecting structure is a diamond-shaped structure, and a gap is provided in the middle of the connecting structure, one corner of the diamond-shaped structure is connected to the top of the body, and the diagonal is connected to the middle of the pin .
  • connection structure may be a flat structure, and the thickness of the connection structure may be thin, which can absorb excessive pressure when crimping the pins to avoid damage to the pins.
  • the connection structure may also be a diamond-shaped structure, and a gap is provided in the middle of the connection structure. One corner of the diamond-shaped structure is connected to the top of the body and diagonally connected to the middle of the body to withstand the pressure when crimping the pins. Avoid pin damage.
  • the bottom of the pin is a bottom plate of a plate-like structure, and the bottom plate is welded to the base plate.
  • the bottom of the pin is plate-shaped, which can increase the welding area with the substrate and improve the stability of the pin welding.
  • a fourth aspect of the present application provides a method for manufacturing a package, comprising: welding the bottom of at least one pin to a substrate; placing the substrate to which the at least one pin is welded into a mold, the mold is provided with A cavity in the middle of the at least one pin, and each pin of the at least one pin is sleeved with a baffle structure, the side wall at the top of the cavity resists the baffle structure, and the baffle structure is used After blocking the encapsulant from overflowing from the cavity; pouring the liquefied encapsulant into the cavity, and after the liquefied encapsulant is cured, the package is obtained.
  • the substrate after welding the bottom of the pin to the substrate, the substrate is placed in the mold, and the cavity inside the mold can accommodate the bottom to the middle of the substrate and the pin, the substrate is located at the bottom of the cavity, The middle of the body is located at the top of the cavity, and the height from the bottom to the top of the cavity is lower than the height from the bottom to the top of the substrate and the body, and the middle of the pin is provided with a baffle structure.
  • the baffle structure can prevent the plastic encapsulant from overflowing from the cavity and avoid contamination of the mold and the pins.
  • the pin may be applied to a package body including a pin, a substrate, and a plastic encapsulant, the plastic encapsulant covers the bottom of the substrate and the pin to the middle, and the middle of the pin is covered
  • the baffle structure when filling the plastic encapsulant, can prevent the plastic encapsulant from overflowing from the cavity containing the plastic encapsulant in the mold that encapsulates the package, to avoid contamination of the mold and the leads.
  • FIG. 1 is a schematic structural diagram of a package body provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a pin provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another pin provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another pin provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a pin combination structure provided by an embodiment of the present application.
  • FIG. 6 is a schematic flowchart of a method for manufacturing a package provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a substrate structure after welding pins provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a substrate placed in a mold provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a filled plastic sealant provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of another package provided by an embodiment of the present application.
  • the application provides a pin, a pin combination structure, a package body and a manufacturing method thereof.
  • a cover plate or a skirt structure is sleeved on the pins to prevent the plastic encapsulant from overflowing from the cavity containing the plastic encapsulant in the mold that encapsulates the package when the plastic encapsulant is filled.
  • Common packaging methods include injection molding (molding) packaging and plastic housing (housing) packaging.
  • Injection molding generally affixes the components to the leadframe or / and the substrate, and then encapsulates the resin to cover the substrate and the frame.
  • the leads are part of the leadframe.
  • the pins are soldered to the printed circuit board (Printed Circuit Board, PCB) to realize the connection with the PCB circuit board.
  • PCB printed Circuit Board
  • this type of crimp-type injection-molded package can only crimp the pin only if it has the position of the frame.
  • the position of the output pin is affected by the frame, so the position of the pin cannot be flexibly determined, and the package body is connected to the pin
  • the reserved space is more complicated to manufacture, and production is not easy to achieve.
  • the housing package can be implemented by soldering the pins on the substrate into the plastic case, or after inserting the pins into the plastic case, encapsulating the plastic case and filling the silicone gel, so as to realize the pin out on the surface.
  • the pins can be crimped or soldered.
  • the reliability of silicone gel is poor, and it has little effect on the isolation of water vapor.
  • the pins and the substrate are welded, and then the welded pins and the substrate are placed in the mold.
  • the mold may include a cavity containing a plastic encapsulant, and the liquefied plastic encapsulant is injected into the cavity. After the plastic encapsulant is cured, the package can be obtained.
  • the pins and the mold or the plastic shell only resist each other, and the sealing of the molding compound cannot be achieved.
  • the shape of the molding compound is liquid, which may lead to plastic sealing. Material leakage. Therefore, in order to avoid the leakage of the molding compound, the present application adds a baffle structure on the pins to avoid the leakage of the molding compound when the molding compound is filled.
  • the pins provided in the embodiments of the present application may be applied to a package body, and the package body may be a module with pins such as a power module, a chip module, and the like.
  • FIG. 1 Exemplarily, for a schematic diagram of the package provided by the present application, reference may be made to FIG. 1.
  • the package body may include a pin 11, a molding compound 12 and a substrate 13, and further include a baffle structure (not shown in the figure) sleeved on the pin 11.
  • the bottom of the pin 11 is soldered to the substrate 13.
  • the molding compound 12 covers the substrate 13 and wraps the portion from the bottom to the middle of the pin 11.
  • the schematic diagram of the structure of the pin and the baffle provided in the embodiment of the present application may be as shown in FIG. 2, and may include: a body 21 of the pin and a baffle structure 22.
  • the baffle structure 22 is sleeved on the middle of the body 21. It can be understood that a gap is formed in the middle of the baffle structure 22, the body 21 passes through the gap, and the middle of the body 21 is opposed to the edge of the gap.
  • the baffle structure 22 may also be integrally formed with the body 21.
  • the middle portion of the body 21 referred to in the embodiments of the present application is the portion between the bottom and the top of the body 21. That is, the middle of the body 21 may be in the middle of the body 21, or may be a part below the top and above the bottom.
  • the mold When filling the molding compound, the mold is provided with a cavity for accommodating the substrate and pins from the bottom to the middle, the substrate is located at the bottom of the cavity, the middle of the body is located at the top of the cavity, and the height of the cavity from the bottom to the top Below the height of the substrate to the top of the body.
  • the baffle structure 22 can be held against the top side wall of the cavity in the mold, therefore, it can form a seal on the contact portion of the mold and the lead 21, and can be used to fill the mold compound from the cavity of the mold along the middle of the body overflow.
  • the molding compound in the embodiments of the present application may include epoxy resin, which can achieve insulation, dust isolation, etc., and has high reliability, which may be higher than that of silicone gel.
  • the baffle structure 22 can prevent the molding compound from overflowing from the cavity of the mold along the body 21 to avoid contamination of the mold or pins caused by the molding compound.
  • the pins provided in this application will be described in more detail below with crimp-type pins.
  • the pins provided in the embodiments of the present application may be as shown in FIG. 3, wherein the body 21 may include a top 210, a connection structure 211, a middle portion 212, a platform structure 213, a curved structure 214, and a bottom 215.
  • the top 210, the connecting structure 211, the middle 212, the platform structure 213, the curved structure 214, and the bottom 215 are integrally formed, and the connecting structure 211, the platform structure 213, and the curved structure 214 are optional structures.
  • the top 210 is a flat crimped head with curved sides and a gap in the middle with a fisheye structure. Can make the crimping type achieve full contact with the PCB, can be used to release stress, and more stable access to the PCB.
  • connection structure 211 may be a flat square, and the thickness may be lower than a threshold, the threshold may be 1 mm, or 0.5 mm, etc., which may be adjusted according to actual application scenarios. It can be understood that the thickness of the connection structure 211 can be set to be low, which can be used when a large external force is received, for example, when the pressure is applied to the PCB with excessive force. The connection structure 211 can absorb this large external force, to avoid deformation of the portion below the connection structure 211 of the main body due to large external force, which in turn leads to the problem that the package cannot be used.
  • the middle portion 212 may be a flat square structure, and the baffle structure 22 is sleeved on the outside.
  • the angle between the baffle structure 22 and the middle portion 212 in the direction of the bottom 215 is 0-90 degrees, which may be 30 degrees, 45 degrees, 60 degrees, and so on.
  • the baffle structure 22 is a skirt structure, and the angle between the baffle structure and the middle portion 212 in the direction of the bottom 215 is 90 degrees
  • the baffle structure 22 is a cover plate structure.
  • the baffle structure 22 is composed of an elastic material, that is, the baffle structure 22 has elasticity.
  • the elastic material may be, for example, silica gel, plastic, polypropylene (Polypropylen, PP), or the like. Therefore, when filling the molding compound, when the baffle structure 22 abuts against the top side wall of the cavity in the mold, the elasticity of the baffle structure 22 can be used to more tightly resist the mold to avoid the molding compound from the cavity of the mold Overflow.
  • the baffle structure 22 is composed of a material with high temperature resistance, and the material may be a material with high temperature resistance above 175 degrees Celsius, such as PP material, polyvinyl chloride (PVC), and so on.
  • the baffle structure 22 is resistant to high temperature, which can avoid damage caused by the filled molding compound being a high-temperature material, and further Resistant to sealing, to avoid overflow of plastic compound.
  • the baffle structure 22 and the body 21 may be separate structures, or may be integrally formed.
  • the baffle structure 22 and the body 21 can be separate structures, the baffle structure 22 needs to be sleeved on the body 21, and the position of the baffle structure on the body can be adjusted in real time to adapt to different cavity height molds .
  • the baffle structure 22 and the body 21 are integrally formed, the baffle structure can be fixed to the middle of the body when the body 21 is obtained, the connection between the body and the baffle structure can be more sealed, and The steps for setting the baffle structure are reduced, and the process for manufacturing the package body is reduced.
  • the platform structure 213 is below the middle portion 212 and the width of the platform structure is larger than the width of the middle portion 212.
  • the edge of the platform structure 213 in the direction of the middle portion 212 resists the skirt edge of the baffle structure 22 to provide support for the baffle structure 22.
  • the coupling force with the middle structure 212 can be increased, and the middle structure 212 can bear the pressure during mold clamping.
  • Clamping is to place the substrate and pins in the cavity of the mold before filling the molding compound, so that the mold and the baffle structure encased in the middle of the body 21 resist, the cavity below the middle of the body 21 is in the cavity of the mold A sealed cavity is formed, and then the molding compound is filled.
  • the middle structure 212 further includes a curved structure 214, and a gap is formed in the middle of the curved structure 214, which can be used to increase the contact surface of the lead and the plastic encapsulant and increase the bonding force between the lead and the plastic encapsulant.
  • the bottom 215 may be a square or other flat structure with a certain thickness, and may be used for soldering to the substrate.
  • connection structure 211 may also be other structures, for example, a diamond-shaped structure, as shown in FIG. 4. One corner of the diamond-shaped structure is connected to the top structure 210 and the middle portion 212 is connected diagonally.
  • the connection structure 211 can be used to bear the stress during crimping, improve the overall strength of the pin, avoid deformation and damage of the pin due to a large external force, and thereby prevent the package from being unusable due to pin damage.
  • a baffle structure provided around the pin body can be used to make the encapsulated mold tightly combined with the lead when filling the plastic encapsulant, blocking the plastic encapsulant from containing the plastic encapsulant from the mold
  • the edge of the cavity is overflowed to avoid the leakage of the molding compound during the mold clamping, thereby avoiding the contamination of the mold or the middle of the pin, and thereby avoiding the unusable package caused by the contamination of the pin. Therefore, the sealing and reliability of the package are guaranteed.
  • the pin can be flexibly output on the top of the package body.
  • the pin is connected to the lead frame, the pin provided in the embodiment of the present application can realize the pin flexibly, and the pin is directly connected to The substrate has small parasitic parameters and improves the manufacturing efficiency of the package.
  • FIG. 5 is a schematic diagram of an embodiment of a pin combination structure provided by this application.
  • the pin combination structure may include at least two pins, that is, a body 51 and a body 53 shown in the figure, and a baffle structure 52 sleeved on the at least two pins.
  • the pin body 51 may be a different structure, in addition to the structure shown in FIGS. 3 and 4 described above, it may also be a pin structure, as shown in the body 53 in FIG. 5, this embodiment of the present application does not make limited.
  • the baffle structure 52 may be a cover plate structure or a skirt structure, that is, the angle between the baffle structure 52 and the body 51 or the body 53 in the direction of the bottom of the body may be 0-90 degrees.
  • a plurality of notches can be opened in the middle of the baffle structure, each notch corresponds to a pin body, each pin body passes through the corresponding notch, and the middle of each pin body is held against the corresponding notch edge.
  • the pin combination structure can also be applied to the package, similar to the way the pins provided in FIGS. 3 and 4 are applied to the package, the bottom of each pin is soldered or crimped to the substrate, and then placed Into the mold, and each pin is below the baffle structure, that is, the part from the bottom to the middle of each pin and the substrate is located in the cavity of the mold, the substrate is located at the bottom of the cavity, the at least two leads
  • the middle of the foot is at the top of the cavity, and the height from the bottom of the cavity to the top is lower than the height from the base plate to the top of the body, or the height from the bottom of the cavity to the top is lower than the height of the bottom of the body .
  • the cavity of the mold is filled with liquefied plastic sealant, and the package can be obtained after the plastic sealant is cured.
  • a baffle structure can be used for multiple pins, and the baffle structure can block the plastic molding material that overflows from the cavity containing the plastic molding material in the mold when the plastic molding material is filled, to avoid the overflow of the plastic molding material
  • the pins are contaminated with the mold. Therefore, the pin combination structure provided by the embodiment of the present application can avoid the leakage of the molding compound during the mold clamping, thereby avoiding the contamination of the mold or the middle of the lead, and thereby avoiding the unusable package body caused by the contamination of the lead, which improves Sealing and reliability of the package.
  • the foregoing pin and pin combination structure may be applied to the package shown in FIG. 1.
  • the pins are soldered to the substrate, and the pins include a baffle structure sleeved in the middle. Therefore, when the package is fabricated and filled with plastic compound, the baffle structure can block the plastic compound from the mold The cavity in which the plastic encapsulant is contained overflows to prevent the plastic encapsulant from overflowing and causing contamination of the pins or the mold, and a more reliable package can be obtained.
  • the package body in the embodiment of the present application is a pin on the top.
  • the pin is directly connected to the substrate, which can reduce the package body Parasitic parameters, and can reduce the volume of the package, and improve the efficiency of making the package.
  • a schematic flowchart of a method for manufacturing a package provided by an embodiment of the present application may include:
  • the package body is preferably a pin at the top, that is, the bottom of the pin is welded to the substrate, and the body of the pin can be perpendicular to the substrate, which can reduce the parasitic parameters of the package body.
  • the body of the pin and the baffle structure can be formed separately or integrally.
  • the baffle structure needs to be sleeved on the pin body to obtain the complete pin, and then the complete pin is welded to the substrate.
  • the body of the pin and the baffle structure are integrally formed, at least one pin can be directly welded to the substrate.
  • the at least one pin may further include a pin combination structure, that is, a pin combination structure in which multiple pins share a baffle structure to form a pin combination structure, and each pin in the pin combination structure Soldered to the substrate.
  • the pins need to be generated first, including stamping and molding of the body structure, and injection molding of the baffle structure, or independently manufacturing the baffle structure and then sleeved in the middle of the body. Then carry on the soldering of the pin or chip and so on.
  • the bottom of the pin may be a square or other flat structure with a certain thickness, and the bottom of the pin may be soldered to the substrate.
  • the substrate after welding may be as shown in FIG. 7.
  • other electronic components such as chips, transistors, etc. can be soldered on the substrate.
  • the substrate to which the at least one pin is soldered is placed in the mold.
  • the mold and the substrate may be as shown in FIG. 8.
  • the mold has a first cavity and at least one second cavity.
  • the first cavity is the cavity for accommodating the substrate and the bottom to middle part of the pin as described above.
  • the bottom to middle portion of the pin and the substrate are located in the first cavity, and the middle to top portion of the pin is located in the second cavity.
  • the baffle structure on the pin is located at the junction of the first cavity and the second cavity, and the baffle structure abuts the side wall on the top of the first cavity to form a seal with the first cavity.
  • the mold may be divided into two parts, such as an upper mold 801 and a lower mold 802 shown in FIG. 8.
  • the welded substrate can be placed in the lower mold first, and then the mold is closed, that is, the upper mold is covered to form a first cavity and at least one second cavity.
  • the mold in FIG. 8 is only an exemplary illustration.
  • the second cavity may be sealed or open to the opposite side of the first cavity, which can be adjusted according to actual application scenarios. The location is not limited.
  • the shape of the first cavity can be adjusted according to the shape of the package that is actually required, and FIG. 8 is merely an exemplary description and is not limited.
  • the package body includes substrates, pins, and molding compound, and also includes other chips, electronic components, and the like.
  • the sealed first cavity formed by the mold and the cover plate structure is filled with liquefied plastic sealant.
  • the baffle structure can seal the first cavity, prevent the plastic encapsulant from overflowing from the cavity containing the plastic encapsulant in the mold, and prevent the plastic encapsulant from pouring into the second cavity to avoid contamination of the pins or the mold.
  • the plastic encapsulant can be liquefied by high temperature to form a liquefied plastic encapsulant, which is poured into the first cavity. After the plastic encapsulant is cooled, a solid can be formed. After the mold is removed, the package can be obtained, as shown in FIG. 10.
  • the first cavity in the mold is sealed by the baffle structure carried on the pin.
  • the plastic compound can be prevented from overflowing from the cavity containing the plastic compound in the mold, thereby avoiding contamination of the mold and the leads.
  • the overflow of plastic compound can be avoided.
  • the package provided in the embodiment of the present application can lead out from the top, and the parasitic parameters are small.
  • the pin can be flexibly determined at any position on the substrate, and the complex process steps of first packaging and then soldering are eliminated, which can avoid plastic packaging and welding.
  • the package body may be a commonly used high-power module. Compared with the traditional housing package, the manufacturing method of the package body provided in the embodiments of the present application can improve the reliability of the package body and have a high manufacturing efficiency.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

本申请提供一种引脚、引脚组合结构、封装体及其制作方法。在引脚上套设盖板或裙装结构，防止在填充塑封料时，塑封料从对封装体进行封装的模具中容纳塑封料的空腔中溢出。该引脚应用于封装体，该封装体包括该引脚、基板以及塑封料，该引脚包括本体和挡板结构；该本体的底部焊接在该基板上，该挡板结构套接在该本体的中部，该塑封料覆盖该基板，并包裹该本体的底部到中部的部分；该挡板结构用于在向空腔中填充该塑封料时阻挡该塑封料从空腔中溢出，该空腔为封装该封装体的模具中容纳该塑封料的腔体，该空腔容纳该本体的底部至中部的部分以及基板，该基板位于空腔的底部，该本体的中部位于空腔的顶部，该空腔顶部的侧壁与该本体的挡板结构抵持。

Description

一种引脚、引脚组合结构、封装体及其制作方法
本申请要求于2018年11月19日提交中国专利局、申请号为201811376365.9、申请名称为“一种引脚、引脚组合结构、封装体及其制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子封装领域，尤其涉及一种引脚、引脚组合结构、封装体及其制作方法。
背景技术
对于芯片、功率模块等集成度高的模块被广泛使用。根据模块类型、封装材料以及连接方式等的不同，对模块采用的封装方式也可以不同。例如，塑胶壳体封装(housing)封装可以是将引脚(pin)的底部结构焊接在基板上，或插入外壳热塑性塑料件内，装入塑胶壳体后，进行灌胶。pin的顶部结构可以是压接到连接的印刷电路板(printed circuit board，PCB)板上，也可以是焊接到连接的PCB板上的。
通常，在将pin的底部结构焊接到基板上后，为pin装上housing外壳。housing外壳的内部为空腔，pin的底部结构焊接或压接在基板上，pin的顶部结构通过housing外壳上的缺口伸出housing外壳。而后进行灌胶，可以对housing外壳内部灌入硅凝胶，硅凝胶起到使pin与基板焊接的部位绝缘、隔离灰尘等作用。还可以是使用注塑(molding)封装，将pin底部焊接到基板上后，置入具有空腔的模具中，并向空腔灌注塑封料，塑封料固化后即可得到封装体。
因此，在进行塑封料的填充时，引脚与housing外壳或模具之间通过卡接的方式连接，连接并不紧密结合，容易导致灌入的塑封料，例如硅凝胶、环氧树脂等溢出，容易导致溢胶以及模具或pin沾污等问题。
发明内容
本申请提供一种引脚、引脚组合结构、封装体及其制作方法。在引脚上套设盖板或裙装结构，防止在填充塑封料时，塑封料从对封装体进行封装的模具中容纳塑封料的空腔中溢出。
有鉴于此，本申请第一方面提供一种引脚，其特征在于，该引脚应用于封装体，该封装体包括该引脚、基板以及塑封料，该引脚包括本体和挡板结构；该引脚的本体的底部焊接在该基板上，该挡板结构套接在该本体的中部，该塑封料覆盖该基板，并包裹该本体的底部到中部的部分；该挡板结构用于在向空腔中填充液化后的塑封料时，阻挡该塑封料从该空腔中溢出，该空腔为用于封装该封装体的模具中容纳该塑封料的腔体，空腔容纳所述本体的底部至中部的部分以及基板，该基板位于空腔的底部，该本体的中部位于空腔的顶部，该空腔顶部的侧壁与该本体的挡板结构抵持，且该空腔底部至顶部的高度低于本体的底部至顶部的高度。
因此，在本申请实施例中，引脚中部套设有挡板结构，在进行塑封料填充时，可以阻 挡塑封料从对封装体进行封装的模具中容纳塑封料的空腔中溢出，避免引起模具以及引脚沾污。
在一种可选的实施方式中，该挡板结构与该本体沿该本体的底部方向之间的夹角大于0度，小于或等于90度。可以理解为，挡板结构可以是盖板结构，也可以是裙装结构。
在一种可选的实施方式中，该挡板结构为耐175摄氏度以上高温的材料组成。因在进行封装体的塑封时，塑封料在高温下液化，因此，填充塑封料时，塑封料处于高温状态，为避免挡板结构损坏，挡板结构可以采用耐高温材料。
在一种可选的实施方式中，该挡板结构为具有弹性的材料组成。挡板结构与模具空腔的顶部抵持，因此，若挡板结构采用弹性材料，可以使挡板结构与模具之间的密封性更好。
在一种可选的实施方式中，该挡板结构与该本体的中部一体成型。
在本申请实施例中，挡板结构与本体的中部可以是一体成型的，可以使挡板结构与本体中部的结合更紧密，进一步避免塑封料溢出。
在一种可选的实施方式中，该本体的中部与底部之间还设置有平台结构，该平台结构朝向该本体中部的一端的宽度大于该本体的中部的宽度。在进行模具的合模时，该平台结构可以承受模具对引脚的压力。
在一种可选的实施方式中，该本体的中部与底部之间还包括弯曲状结构，且该弯曲状结构的中间设置有缺口。该弯曲结构通过弯曲形状以及缺口，增加与塑封料的接触面积，增加与塑封料的结合力。
在一种可选的实施方式中，该本体的中部与该本体的顶部之间还设置有扁平的连接结构；
其中，该连接结构的厚度低于阈值；或，该连接结构为菱形结构，且该连接结构的中间设置有缺口，该菱形结构的其中一角连接该本体的顶部，对角连接该本体的中部。
可以理解为，该连接结构可以为扁平状的结构，该连接结构的厚度可以较薄，可以吸收压接引脚时过大的压力，避免引脚损坏。也可以是该连接结构为菱形结构，且该连接结构的中间设置有缺口，该菱形结构的其中一角连接该本体的顶部，对角连接该本体的中部，可以承受压接引脚时的压力，避免引脚损坏。
在一种可选的实施方式中，该本体的底部为板状结构的底板，该底板焊接在该基板上。引脚的底部为板状，可以增加与基板的焊接面积，提高引脚焊接的稳定性。
本申请第二方面提供一种引脚组合结构，该引脚组合结构应用于封装体，该封装体包括该引脚、基板以及塑封料，该引脚组合结构包括：至少两个引脚与挡板结构；该至少两个引脚中每个引脚的底部焊接在该基板上，该塑封料覆盖该基板，并包裹该每个引脚的底部到中部的部分；该挡板结构上开设有至少两个缺口，该挡板结构的该至少两个缺口中每个缺口套接在该每个引脚的中部，且该至少两个缺口与该至少两个引脚一一对应；该挡板结构用于在向空腔中填充该塑封料时，阻挡该塑封料从该空腔中溢出，该空腔为用于封装该封装体的模具中容纳该塑封料的腔体，该空腔容纳该至少两个引脚的底部至中部的部分以及基板，该基板位于空腔的底部，该至少两个引脚的中部位于空腔的顶部，该空腔顶 部的侧壁与该挡板结构抵持，且该空腔底部至顶部的高度低于基板与本体的底部至顶部的高度。
在本申请实施例中，引脚中部套设有挡板结构，该挡板结构可以套接多个引脚，在进行塑封料填充时，可以阻挡塑封料从对封装体进行封装的模具中容纳塑封料的空腔中溢出，避免引起模具以及引脚沾污。
本申请第三方面提供一种封装体，包括：基板、塑封料、引脚与套设在该引脚上的挡板结构；该引脚的本体的底部焊接在该基板上，该挡板结构套接在该本体的中部，该塑封料覆盖该基板，并包裹该本体的底部到中部的部分；该挡板结构用于在向空腔中填充该塑封料时阻挡该塑封料从该空腔中溢出，该空腔为用于封装该封装体的模具中容纳该塑封料的腔体，空腔容纳所述本体的底部至中部的部分以及基板，该基板位于空腔的底部，该本体的中部位于空腔的顶部，该空腔顶部的侧壁与该本体的挡板结构抵持，且该空腔底部至顶部的高度低于本体的底部至顶部的高度。
在本申请实施例中，封装体可以包括基板、焊接在基板上的引脚以及覆盖基板与引脚底部至中部的塑封料，且该引脚上还套设有挡板结构。因此，在进行塑封料填充时，挡板结构可以阻挡塑封料从对封装体进行封装的模具中容纳塑封料的空腔中溢出，避免引起模具以及引脚沾污。
在一种可选的实施方式中，该挡板结构与该引脚沿该引脚的底部方向之间的夹角大于0度，小于或等于90度。
在一种可选的实施方式中，该挡板结构为耐175摄氏度以上高温的材料组成。
在一种可选的实施方式中，该挡板结构为具有弹性的材料组成。
在一种可选的实施方式中，该挡板结构与该本体的中部一体成型。挡板结构与本体的中部可以是一体成型的，可以使挡板结构与本体中部的结合更紧密，进一步避免塑封料溢出。
在一种可选的实施方式中，引脚的中部与底部之间还设置有平台结构，该平台结构朝向该本体中部的一端的宽度大于该本体的中部的宽度。在进行模具的合模时，该平台结构可以承受模具对引脚的压力。
在一种可选的实施方式中，该引脚的中部与底部之间还包括弯曲状结构，且该弯曲状结构的中间设置有缺口。该弯曲结构通过弯曲形状以及缺口，增加与塑封料的接触面积，增加与塑封料的结合力。
在一种可选的实施方式中，该引脚的中部与该引脚的顶部之间还设置有扁平的连接结构；
其中，该连接结构的厚度低于阈值；或，该连接结构为菱形结构，且该连接结构的中间设置有缺口，该菱形结构的其中一角连接该本体的顶部，对角连接该引脚的中部。
可以理解为，该连接结构可以为扁平状的结构，该连接结构的厚度可以较薄，可以吸收压接引脚时过大的压力，避免引脚损坏。也可以是该连接结构为菱形结构，且该连接结构的中间设置有缺口，该菱形结构的其中一角连接该本体的顶部，对角连接该本体的中部，可以承受压接引脚时的压力，避免引脚损坏。
在一种可选的实施方式中，该引脚的底部为板状结构的底板，该底板焊接在该基板上。引脚的底部为板状，可以增加与基板的焊接面积，提高引脚焊接的稳定性。
本申请第四方面提供一种封装体的制作方法，包括：将至少一个引脚的底部焊接在基板上；将焊接该至少一个引脚的基板置入模具，该模具内部设有容纳该基板至该至少一个引脚的中部的空腔，且该至少一个引脚中每个引脚上套设有挡板结构，该空腔顶部的侧壁与该挡板结构相抵持，该挡板结构用于阻挡塑封料从该空腔中溢出；向该空腔灌入液化后的该塑封料，并且在该液化后的塑封料固化后，得到封装体。因此，本申请实施例在将引脚的底部焊接基板上后，将基板置于模具内，模具内部的空腔可以容纳基板与引脚的底部至中部的部分，该基板位于空腔的底部，该本体的中部位于空腔的顶部，该空腔底部至顶部的高度低于基板与本体的底部至顶部的高度，且引脚的中部套设有挡板结构，在进行塑封料的填充时，该挡板结构可以阻挡塑封料从空腔中溢出，避免模具与引脚沾污。
在本申请实施例中，引脚可以应用与封装体，该封装体包括引脚、基板与塑封料，该塑封料覆盖基板与引脚的底部至中部的不封，且引脚中部套设有挡板结构，在进行塑封料填充时，可以阻挡塑封料从对封装体进行封装的模具中容纳塑封料的空腔中溢出，避免引起模具以及引脚沾污。
附图说明
图1为本申请实施例提供的一种封装体的结构示意图；
图2为本申请实施例提供的一种引脚的结构示意图；
图3为本申请实施例提供的另一种引脚的结构示意图；
图4为本申请实施例提供的另一种引脚的结构示意图；
图5为本申请实施例提供的一种引脚组合结构的结构示意图；
图6为本申请实施例提供的一种封装体的制作方法的流程示意图；
图7为本申请实施例提供的一种焊接引脚后的基板结构示意图；
图8为本申请实施例提供的一种基板置于模具内的结构示意图；
图9为本申请实施例提供的一种填充塑封料的结构示意图；
图10为本申请实施例提供的另一种封装体结构示意图。
具体实施方式
本申请提供一种引脚、引脚组合结构、封装体及其制作方法。在引脚上套设盖板或裙装结构，防止在填充塑封料时，塑封料从对封装体进行封装的模具中容纳塑封料的空腔中溢出。
常用的封装方式包括注塑(molding)封装和塑胶壳体(housing)封装等。注塑封装一般是将元器件贴于引线框架(leadframe)或/与基板上，然后进行灌胶，使塑封料覆盖基板与框架，引脚就是引线框架的一部分。应用时引脚焊接到印制电路板(Printed Circuit Board，PCB)，实现与PCB电路板的连接。这类引脚的位置一般在塑封体的四周，若想在塑封体正面或者背面出引脚，则需要在塑封体表面预留空间露出框架，并在引线框 架上预留孔洞，将特殊设计的引脚接入引线框架上，实现与内部的电气连接。因此，这类压接式的注塑封装体只有具有框架的位置才能压接引脚，出引脚的位置受框架影响，因此不能灵活地确定引脚的位置，且在封装体接入引脚处预留空间制造较复杂，生产不易实现。housing封装的方式可以是将引脚焊接在基板装入塑胶壳体后，或将引脚插入塑胶壳体内之后，对塑胶壳体内进行灌胶，填充硅凝胶，从而实现表面出引脚。其引脚可以是压接式的，也可以是焊接式的。但硅凝胶的可靠性较差，对水汽的隔离作用甚微。若以housing类似的方式进行塑封，即将引脚与基板进行焊接，然后将焊接后的引脚与基板置入模具中。模具内可以包括容纳塑封料的空腔，向空腔内注入液化后的塑封料，待塑封料固化后，即可得到封装体。而当进行塑封料的填充时，引脚与模具或塑胶壳体之间仅相抵持，并不能实现对塑封料的密封，而在进行塑封料填充时，塑封料的形态为液态，可能导致塑封料的泄露。因此，为避免塑封料的泄露，本申请通过在引脚上增加挡板结构，避免在填充塑封料时，而导致的塑封料泄露。
首先，本申请实施例提供的引脚可以应用于封装体，该封装体可以是功率模块、芯片模块等具有引脚的模块。
示例性地，本申请提供的封装体的示意图可以参考图1。
其中，封装体可以包括引脚11、塑封料12以及基板13，此外，还包括套设在引脚11上的挡板结构(图中未示出)。
引脚11的底部焊接在基板13上。塑封料12覆盖基板13，且包裹引脚11的底部至中部的部分。
具体地，本申请实施例提供的引脚与挡板结构的示意图可以如图2所示，可以包括：引脚的本体21与挡板结构22。
挡板结构22套设于本体21的中部。可以理解为，挡板结构22中间开设有缺口，本体21穿过缺口，且本体21的中部与缺口边缘相抵持。挡板结构22也可以是与本体21一体成型的。
应理解，本申请实施例中所指的本体21的中部，为本体21的底部与顶部之间的部位。即本体21的中部可以时本体21的中间，也可以是顶部之下，底部之上的部位。
在填充塑封料时，模具内设有容纳基板与引脚的底部至中部的空腔，该基板位于空腔的底部，该本体的中部位于空腔的顶部，且该空腔底部至顶部的高度低于基板至本体的顶部的高度。挡板结构22可以与模具内空腔的顶部侧壁相抵持，因此，可以对模具与引脚21的接触部位形成密封，可以用于填阻挡塑封料从模具的空腔中沿本体21的中部溢出。
可选地，本申请实施例中的塑封料可以包括环氧树脂，可以实现绝缘、隔离灰尘等作用，并且可靠性较高，可以高于硅凝胶等。
因此，在本申请实施例中，在进行塑封料的填充时，挡板结构22可以阻挡塑封料从模具的空腔中沿本体21溢出，避免塑封料造成模具或引脚沾污等。
更进一步地，下面以压接式引脚对本申请提供的引脚进行更详细的说明。本申请实施例提供的引脚可以如图3所示，其中，本体21可以包括顶部210、连接结构211、中部212、平台结构213、弯曲状结构214以及底部215。
其中，顶部210、连接结构211、中部212、平台结构213、弯曲状结构214以及底部215为一体成型，连接结构211、平台结构213与弯曲状结构214为可选结构。
顶部210为扁平的压接式头部，两侧为弧形，中间开设有鱼眼结构的缺口。可以使压接式实现与PCB的充分接触，可以用于释放应力，更稳定地接入PCB。
可选地，连接结构211可以是扁平的方形，且厚度可以低于阈值，该阈值可以是1mm，还可以是0.5mm等等，具体可以根据实际应用场景调整。可以理解为，连接结构211的厚度可以设置为较低，可以用于在收到较大外力时，例如，压接至PCB时用力过大。连接结构211可以吸收该较大外力，避免本体的连接结构211以下的部位收较大外力而导致变形，进而导致封装体无法使用的问题。
中部212可以为扁平的方形结构，且外部套设有挡板结构22。
可选地，挡板结构22与中部212沿底部215的方向的夹角为0-90度，可以是30度、45度、60度等等。当挡板结构与中部212沿底部215的方向的夹角小于90度时，可以理解为挡板结构22为裙装结构，挡板结构与中部212沿底部215的方向的夹角为90度时，可以理解为挡板结构22为盖板结构。
可选地，挡板结构22为具有弹性的材料组成，即挡板结构22具有弹性。具有弹性的材料可以例如硅胶、塑料、聚丙烯(Polypropylen，PP)等等。因此，在填充塑封料时，挡板结构22与模具内空腔的顶部侧壁抵持时，可以通过挡板结构22的弹性，与模具更密封的抵持，避免塑封料从模具的空腔中溢出。
可选地，挡板结构22为具有耐高温的材料组成，该材料可以为耐175摄氏度以上的高温材料，例如，PP材料、聚录乙烯(polyvinyl chlorid，PVC)等等。通常，在对塑封料进行液化时，是通过高温使塑封料融化为液体形态的，因此，挡板结构22耐高温，可以避免因填充的塑封料为高温材料而损伤，更进一步地与模具更密封的抵持，避免塑封料溢出。
可选地，挡板结构22与本体21可以是分别独立的结构，也可以是一体成型。当挡板结构22与本体21可以是分别独立的结构时，需要将挡板结构22套设于本体21上，可以实时调整挡板结构在本体上套设的位置，适应不同空腔高度的模具。当挡板结构22与本体21为一体成型时，可以在得到本体21时，即可将挡板结构固定于本体的中部，可以实现使本体与挡板结构之间的连接处更密封，并且可以减少套设挡板结构的步骤，减少了制作封装体的流程。
可选地，平台结构213在中部212之下，平台结构的宽度大于中部212的宽度。并且，当挡板结构22为裙装结构时，平台结构213沿中部212方向的边缘，与挡板结构22的裙边缘抵持，为挡板结构22提供支撑。并且可以增加与中部结构212的结合力，可以为中部结构212承担合模时的压力。合模即在进行塑封料填充之前，将基板与引脚置于模具的空腔之内，使模具与本体21的中部外套设的挡板结构相抵持，本体21的中部以下与模具的空腔形成密封的腔体，进而进行塑封料的填充。也可以理解为，在本体的中部与底部之间还设置有相对于本体横向凸起的凸台，当挡板结构与本体的沿所述本体的底部方向之间的夹角小于90度时，该凸台还可以与挡板结构的边缘相抵持，为挡板结构支撑，避免 挡板结构脱落。
可选地，中部结构212之下还包括弯曲状结构214，且弯曲状结构214中间开设有缺口，可以用于增加引脚与塑封料的接触面，增加引脚与塑封料的结合力。
可选地，底部215可以是具有一定厚度的方形或其他的扁平状结构，且可以用于焊接到基板上。
可选地，连接结构211还可以是其他的结构，例如，菱形结构，如图4所示。菱形结构的其中一角连接顶部结构210，对角连接中部212。该连接结构211可以用于承担压接时的应力，提高引脚的整体强度，避免引脚因承受较大外力导致变形损坏，进而避免引脚损坏而引起的封装体不可用。
因此，在本申请实施例中，可以通过在引脚本体外套设的挡板结构，用于在填充塑封料时，使封装的模具可以与引脚紧密结合，阻挡塑封料从模具中容纳塑封料的空腔中沿溢出，避免在进行合模时出现塑封料泄露，从而避免模具或引脚中部以上沾污，进而避免引脚沾污引起的封装体不可用。因此，保障了封装的密封性与可靠性。并且可以实现封装体顶部灵活出引脚，相对于使用表面开孔式的、引脚接入引线框架的封装，本申请实施例提供的引脚可以实现灵活出引脚，且引脚直接连接到基板，寄生参数小，提高的封装体的制造效率。
前述对本申请实施例提供的引脚进行了详细说明，除了前述图2-图4中所示的一个引脚对应一个挡板结构外，还可以是多个引脚对应一个挡板结构，该多个指两个或两个以上，可以理解为本申请提供的引脚组合结构，其中，该引脚组合结构中的引脚结构与前述图2-图4中的引脚结构类似，区别在于多个引脚共用一个挡板结构，此处对引脚的具体结构不再赘述。示例性的，请参阅图5，本申请提供的一种引脚组合结构的实施例示意图。
如图5所示，该引脚组合结构可以包括至少两个引脚，即图中所示的本体51与本体53以及套设在该至少两个引脚上的挡板结构52。
其中，引脚本体51可以是不同的结构，除了前述图3与图4中所示的结构外，还可以是针结构，如图5中的本体53所示，本申请实施例对次并不作限定。
如图5所示，挡板结构52可以是盖板结构，也可以是裙状结构，即挡板结构52与本体51或本体53沿本体底部的方向的夹角可以为0-90度。
挡板结构的中间可以开设多个缺口，每个缺口对应一个引脚本体，每个引脚本体穿过对应的缺口，每个引脚本体的中部与对应的缺口边缘相抵持。
此外，该引脚组合结构也可应用于封装体，与前述图3与图4中提供的引脚应用于封装体的方式类似，每个引脚的底部焊接或压接到基板上，然后置入模具内，且每个引脚在挡板结构以下的部位，即每个引脚的底部至中部的部分以及基板位于模具的空腔内，该基板位于空腔的底部，该至少两个引脚的中部位于空腔的顶部，且所述空腔底部至顶部的高度低于基板至本体的顶部的高度,或所述空腔底部至顶部的高度低于所述本体的底部至顶部的高度。向模具的空腔填充液化后的塑封料，待塑封料固化后，即可得到封装体。
在本申请实施例中，多个引脚可以使用一个挡板结构，通过挡板结构可以阻挡在填充塑封料时，从模具中容纳塑封料的空腔中溢出的塑封料，避免塑封料溢出引起引脚与模具 沾污。因此，本申请实施例提供的引脚组合结构可以避免在进行合模时出现塑封料泄露，从而避免模具或引脚中部以上沾污，进而避免引脚沾污引起的封装体不可用，提高了封装的密封性与可靠性。并且可以实现封装体顶部/表面灵活出引脚，相对于使用表面开孔式的、引脚接入框架的封装，本申请实施例提供的引脚可以实现灵活出引脚，且引脚直接连接到基板，寄生参数小，提高的封装体的制造效率。
前述对本申请实施例提供的引脚与引脚组合结构进行详细说明，在本申请实施例中，前述的引脚与引脚组合结构可以应用于如图1所示的封装体。在该封装体中，引脚焊接在基板上，且引脚上包括套设于中部的挡板结构，因此，在制作该封装体，填充塑封料时，该挡板结构可以阻挡塑封料从模具中容纳塑封料的空腔中溢出，避免塑封料溢出而导致引脚或模具沾污，可以得到更可靠的封装体。并且，本申请实施例中的封装体为顶部出引脚，相对于侧面出引脚或使用表面开孔式的、引脚接入框架的封装，引脚与基板直接连接，可以减小封装体的寄生参数，且可以降低封装体的体积，并且提高制作封装体的效率。
前述对本申请实施例提供的封装体与封装体内的引脚结构进行详细说明，基于前述的引脚、引脚组合结构以及封装体，本申请实施例还提供了一种封装体的制作方法，请参阅图6，本申请实施例提供封装体的制作方法的流程示意图，可以包括：
601、将至少一个引脚的底部焊接在基板上。
首先，在得到套设了挡板结构的至少一个引脚后，将引脚的底部焊接在基板上。
在本申请实施例中，封装体优选为顶部出引脚，即引脚的底部焊接在基板上，引脚的本体可以垂直于基板，可以减小封装体的寄生参数。
其中，引脚的本体与挡板结构可以是分别成型的，也可以是一体成型。当引脚的本体与挡板结构为分别成型的，还需要将挡板结构套设于引脚本体上，得到完整的引脚后，再将完整的引脚焊接到基板上。若引脚的本体与挡板结构为一体成型，则可以直接将至少一个引脚焊接到基板上。其中，该至少一个引脚中，还可以包括引脚组合结构，引脚组合结构即多个引脚共用一个挡板结构，形成引脚组合结构，并将该引脚组合结构中每个引脚的底部焊接至基板上。
通常，在实际应用中，首先需要对引脚进行生成，包括对本体结构的冲压成型，以及对挡板结构的注塑成型，或独立制作挡板结构后套设于本体中部。然后进行引脚的焊接或芯片焊接等等。如前述图3与图4所示，引脚底部可以是具有一定厚度的方形或其他的扁平状结构，可以将引脚的底部焊接至基板上。示例性地，焊接完成后的基板可以如图7所示。基板上除了焊接引脚外，还可以焊接其他的电子元件，例如，芯片、晶体管等等。
602、将焊接至少一个引脚的基板置入模具。
在将至少一个引脚焊接到基板上后，将焊接了至少一个引脚的基板置入模具内。
示例性的，模具与基板可以如图8所示。模具内具有第一空腔与至少一个第二空腔，该第一空腔即为本申请前述的容纳基板与引脚底部至中部部分的空腔。基板置入模具内后，引脚的底部至中部的部分与基板位于第一空腔内，引脚的中部至顶部位于第二空腔内。引脚上的挡板结构位于第一空腔与第二空腔的连接处，且挡板结构与第一空腔顶部的 侧壁相抵持，使对第一空腔形成密封。可以理解为，当一个或多个引脚的中部至顶部位于其中一个第二空腔内时，该一个或多个引脚对应的挡板结构，铺设于第一空腔与第二空腔的连接处，使第一空腔形成密封。其中，具体地，模具可以分为两部分，如图8中所示的上模具801与下模具802。可以先将焊接后的基板置于下模具内，然后合模，即盖上上模具，形成第一腔体与至少一个第二腔体。需要说明的是，图8中的模具仅仅是其中一种示例性说明，第二腔体可以是密封的，也可以是向第一腔体对侧开口的，具体可以根据实际应用场景调整，此处并不作限定。并且，第一腔体的形状可以根据实际需求的封装体的形状调整，图8中仅仅是示例性说明，并不作限定。
603、向模具灌入液化后的塑封料。
在将焊接至少一个引脚的基板置入模具后，向第一腔体灌入液化后的塑封料，待塑封料固化后，即可得到封装体。该封装体内包括基板、引脚以及塑封料，还包括其他的芯片、电子元件等等。
示例性的，如图9所示，向模具与盖板结构形成的密封的第一空腔灌入液化后的塑封料。挡板结构可以对第一腔体进行密封，阻挡塑封料从模具中容纳塑封料的空腔中溢出，可以避免塑封料涌入第二腔体，避免引起引脚或模具沾污。通常，可以通过高温，使塑封料液化，形成液化后的塑封料，灌入第一腔体内，塑封料冷却后即可形成固体，拆除模具后，即可得到封装体，如图10所示。
在本申请实施例中，可以合模后，通过引脚上携带的挡板结构，对模具内的第一腔体形成密封。在填充液化后的塑封料时，可以避免塑封料从模具中容纳塑封料的空腔中溢出，从而避免引起模具以及引脚沾污。相对于housing封装与molding封装，可以避免塑封料的溢出。并且，本申请实施例提供的封装体可以从顶部出引脚，寄生参数小。相对于使用表面开孔式的、引脚接入框架的封装，可以灵活地确定引脚焊接在基板上的任意位置，且免除了先封装再焊接的复杂工艺步骤，可以避免先塑封再焊接引起的灌入的塑封料与原固体塑封料等适配问题。引脚直接焊接在基板上，也可以减小封装体的体积。因此，本申请实施例可以避免封装体的引脚以及模具沾污，减小封装体的寄生参数以及体积。
封装体可以是常用的大功率模块，相对于传统的housing封装，本申请实施例提供的封装体的制作方法，可以提高封装体的可靠性，并且制作效率高。
以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (16)

  1. 一种引脚，其特征在于，所述引脚应用于封装体，所述封装体包括所述引脚、基板以及塑封料，所述引脚包括本体和挡板结构；
    所述本体的底部焊接在所述基板上，所述挡板结构套接在所述本体的中部，所述塑封料覆盖所述基板，并包裹所述本体的底部到中部的部分；
    所述挡板结构用于在向空腔中填充所述塑封料时，阻挡所述塑封料从所述空腔中溢出，所述空腔为用于封装所述封装体的模具中的腔体，所述空腔容纳所述本体的底部至中部的部分以及所述基板，所述基板位于所述空腔的底部，所述本体的中部位于所述空腔的顶部，所述空腔顶部的侧壁与所述本体的挡板结构抵持，且所述空腔底部至顶部的高度低于所述本体的底部至顶部的高度。
  2. 根据权利要求1所述的引脚，其特征在于，所述挡板结构与所述本体沿所述本体的底部方向之间的夹角大于0度，小于或等于90度。
  3. 根据权利要求1或2所述的引脚，其特征在于，所述挡板结构为耐175摄氏度以上高温的材料组成。
  4. 根据权利要求1-3中任一项所述的引脚，其特征在于，所述挡板结构为具有弹性的材料组成。
  5. 根据权利要求1-4中任一项所述的引脚，其特征在于，所述挡板结构与所述本体的中部一体成型。
  6. 根据权利要求1-5中任一项所述的引脚，其特征在于，所述本体的中部与底部之间还设置有平台结构，所述平台结构朝向所述本体中部的一端的宽度大于所述本体的中部的宽度。
  7. 根据权利要求1-6中任一项所述的引脚，其特征在于，所述本体的中部与底部之间还包括弯曲状结构，且所述弯曲状结构的中间设置有缺口。
  8. 根据权利要求1-7中任一项所述的引脚，其特征在于，所述本体的中部与所述本体的顶部之间还设置有扁平的连接结构；
    其中，所述连接结构的厚度低于阈值；
    或，
    所述连接结构为菱形结构，且所述连接结构的中间设置有缺口，所述菱形结构的其中一角连接所述本体的顶部，对角连接所述本体的中部。
  9. 根据权利要求1-8任一项所述的引脚，其特征在于，所述本体的底部为板状结构的底板，所述底板焊接在所述基板上。
  10. 一种引脚组合结构，其特征在于，所述引脚组合结构应用于封装体，所述封装体包括所述引脚、基板以及塑封料，所述引脚组合结构包括：至少两个引脚与挡板结构；
    所述至少两个引脚中每个引脚的底部焊接在所述基板上，所述塑封料覆盖所述基板，并包裹所述每个引脚的底部到中部的部分；
    所述挡板结构上开设有至少两个缺口，所述挡板结构的所述至少两个缺口中每个缺口 套接在所述每个引脚的中部，且所述至少两个缺口与所述至少两个引脚一一对应；
    所述挡板结构用于在向空腔中填充所述塑封料时，阻挡所述塑封料从所述空腔中溢出，所述空腔为用于封装所述封装体的模具中的腔体，所述空腔容纳所述至少两个引脚的底部至中部的部分以及所述基板，所述基板位于所述空腔的底部，所述本体的中部位于所述空腔的顶部，所述空腔顶部的侧壁与所述挡板结构抵持，且所述空腔底部至顶部的高度低于所述本体的底部至顶部的高度。
  11. 一种封装体，其特征在于，包括：基板、塑封料、引脚与套设在所述引脚上的挡板结构；
    所述引脚的本体的底部焊接在所述基板上，所述挡板结构套接在所述本体的中部，所述塑封料覆盖所述基板，并包裹所述本体的底部到中部的部分；
    所述挡板结构用于在向空腔中填充所述塑封料时，阻挡所述塑封料从所述空腔中溢出，所述空腔为用于封装所述封装体的模具中的腔体，所述空腔容纳所述本体的底部至中部的部分以及所述基板，所述基板位于所述空腔的底部，所述本体的中部位于所述空腔的顶部，所述空腔顶部的侧壁与所述本体的挡板结构抵持，且所述空腔底部至顶部的高度低于所述本体的底部至顶部的高度。
  12. 根据权利要求11所述的封装体，其特征在于，所述挡板结构与所述引脚沿所述引脚的底部方向之间的夹角大于0度，小于或等于90度。
  13. 根据权利要求11或12所述的封装体，其特征在于，所述挡板结构为耐175摄氏度以上高温的材料组成。
  14. 根据权利要求11-13中任一项所述的封装体，其特征在于，所述挡板结构为具有弹性的材料组成。
  15. 根据权利要求11-14中任一项所述的封装体，其特征在于，所述挡板结构与所述本体的中部一体成型。
  16. 一种封装体的制作方法，其特征在于，包括：
    将至少一个引脚的底部焊接在基板上；
    将焊接所述至少一个引脚的基板置入模具，所述模具内部设有容纳所述至少一个引脚的底部至中部的部分以及所述基板的空腔，所述基板位于所述空腔的底部，所述本体的中部位于所述空腔的顶部，所述空腔底部至顶部的高度低于所述本体的底部至顶部的高度，且所述至少一个引脚中每个引脚上套设有挡板结构，所述空腔顶部的侧壁与所述挡板结构相抵持，所述挡板结构用于阻挡塑封料从所述空腔中溢出；
    向所述空腔灌入液化后的所述塑封料，并且在所述液化后的塑封料固化后，得到封装体。
PCT/CN2019/086735 2018-11-19 2019-05-14 一种引脚、引脚组合结构、封装体及其制作方法 WO2020103406A1 (zh)

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