WO2020103228A1 - 粘合组合物、电子产品及其制备方法 - Google Patents

粘合组合物、电子产品及其制备方法

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Publication number
WO2020103228A1
WO2020103228A1 PCT/CN2018/120784 CN2018120784W WO2020103228A1 WO 2020103228 A1 WO2020103228 A1 WO 2020103228A1 CN 2018120784 W CN2018120784 W CN 2018120784W WO 2020103228 A1 WO2020103228 A1 WO 2020103228A1
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WO
WIPO (PCT)
Prior art keywords
adhesive composition
parts
resin
electronic product
ultraviolet light
Prior art date
Application number
PCT/CN2018/120784
Other languages
English (en)
French (fr)
Inventor
吴敦煌
Original Assignee
惠科股份有限公司
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Filing date
Publication date
Application filed by 惠科股份有限公司 filed Critical 惠科股份有限公司
Publication of WO2020103228A1 publication Critical patent/WO2020103228A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers

Definitions

  • This application relates to the technical field of electronic packaging, in particular to an adhesive composition, an electronic product and a preparation method thereof.
  • Anisotropic conductive adhesive is an adhesive that can conduct electricity in one direction.
  • Anisotropic conductive film (Anisotropic Conductive Film, ACF) is a thin film made of anisotropic conductive adhesive. Because ACF has the function of unidirectional conduction and gluing, it is widely used in the packaging and bonding of various components such as display screens, piezoelectric crystals, crystal oscillators, resonators, solar cells, photovoltaic cells, buzzers, semiconductor discrete devices, etc. .
  • the main component of general ACF is thermosetting resin. This type of ACF needs to use high-temperature pressing during use, so that the ACF can react to improve the adhesion of the ACF and complete bonding (bonding). However, the higher temperature results in greater thermal expansion of the components to be bonded, which in turn affects the normal use of the components to be bonded.
  • An adhesive composition based on parts by weight, the raw materials of the adhesive composition include:
  • Thermosetting resin 20 to 40 parts;
  • thermosetting resin is selected from at least one of epoxy resin, unsaturated polyester resin, phenol resin and amino resin
  • photosensitive resin is selected from epoxy acrylic resin, polyurethane acrylic resin, polyester acrylic resin, polyacrylic resin At least one of ether acrylic resin, pure acrylic resin and vinyl resin
  • the photosensitizer is selected from 2,4,6-diphenylphosphine oxide, 2,4,6-trimethylbenzoylphosphonic acid ethyl Ester, 2-methyl-1- [4-methylthiophenyl] -2-morpholinyl-1-acetone, 2-isopropylthioxanthone, ethyl 4-dimethylamino-benzoate, 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-acetone, benzoin dimethyl ether, methyl phthaloyl benzoate, 4-chlorodiphenyl At least one of ketone and 4-phenyl dibenzyl ketone.
  • the raw materials of the adhesive composition include 20 parts to 40 parts of epoxy resin, 10 parts to 30 parts of epoxy acrylic resin, and 1 part to 4 parts of , 4,6-diphenylphosphine oxide and 1 to 4 parts of 4-dimethylamino-benzoic acid ethyl ester.
  • the raw material of the adhesive composition further includes 5 to 15 parts of the thermal curing agent.
  • the thermal curing agent is selected from the group consisting of vinyl triamine, diaminocyclohexane, methylene bicyclohexane amine, isophorone diamine, tetraethylene pentamine, and hexamethylene diamine addition Substance, at least one of trimethylhexylamine, m-xylylenediamine, diaminodiphenylmethane, xylylenediamine trimer, amidoamines and dicyandiamide.
  • the raw material of the adhesive composition further includes 5 parts to 10 parts of conductive particles.
  • the raw material of the adhesive composition further includes 5 parts to 10 parts of auxiliary components, and the auxiliary components are selected from at least one of a leveling agent and a plasticizer Species.
  • the auxiliary component in terms of parts by weight, includes 1 part to 10 parts of a leveling agent and 1 part to 10 parts of a plasticizer; and / or,
  • the leveling agent is selected from at least one of polydimethylsiloxane, polyether polyester modified organosiloxane, terminal modified organosilicon and alkyl modified organosiloxane; and / or ,
  • the plasticizer is selected from at least one of phthalates, benzene polyesters, benzoate esters and polyol esters.
  • FIG. 1 is an operation schematic diagram of heat and pressure treatment in the preparation process of an electronic product according to an embodiment
  • FIG. 2 is a schematic diagram of the operation of ultraviolet light irradiation in the preparation process of the electronic product shown in FIG. 1;
  • FIG. 3 is an operation schematic diagram of a manufacturing process of an electronic product according to another embodiment.
  • the adhesive composition includes 20 parts to 40 parts of thermosetting resin, 10 parts to 30 parts of photosensitive resin, and 1 part to 5 parts of photosensitizer in parts by weight.
  • the above-mentioned adhesive composition can achieve good adhesion through low-temperature pressure bonding and photo-curing, which is beneficial to reduce the thermal expansion effect of the elements to be bonded.
  • the component to be bonded includes at least one of glass plate, COF and FPC (Flexible Circuit Board, Flexible Printed Circuit).
  • the component to be bonded is not limited to the above-mentioned component, but may also be other components, such as COB (Chip On Board). Since the above-mentioned adhesive composition can be adhered to glass plates, COF, FPC (Flexible Circuit Board, Flexible Printed Circuit), etc., it can be applied to the preparation of electronic products. Among them, electronic products are display screens, piezoelectric crystals, crystal oscillators, resonators, solar cells, photovoltaic cells, buzzers, or semiconductor discrete devices.
  • Thermosetting resin refers to a resin that undergoes chemical changes after heating and gradually hardens and molds, and does not soften or dissolve when heated continuously.
  • the addition of the thermosetting resin allows the adhesive composition to be heated and pressed.
  • thermosetting resin is selected from at least one of epoxy resins, unsaturated polyester resins, phenolic resins, and amino resins.
  • the raw material of the adhesive composition includes 25 to 35 parts of thermosetting resin in parts by weight. Further, in terms of parts by weight, the raw material of the adhesive composition includes 28 parts to 32 parts of thermosetting resin. In some of these embodiments, the raw material of the adhesive composition includes 20 parts, 25 parts, 28 parts, 32 parts, 35 parts, or 40 parts of thermosetting resin in parts by weight.
  • Photosensitive resin is a material that can be rapidly shaped by light curing. The addition of photosensitive resin enables the adhesive composition to be cured and shaped by light.
  • the photosensitive resin is selected from at least one of epoxy acrylic resin, urethane acrylic resin, polyester acrylic resin, polyether acrylic resin, pure acrylic resin, and vinyl resin.
  • the urethane acrylic resin is the urethane acrylic resin of the German Bayer company with the article number Desmo D-100.
  • the polyester acrylic resin is the polyester acrylic resin with the item number HD-220 of China Houding Chemical Company.
  • the raw material of the adhesive composition includes 15 to 25 parts of photosensitive resin in parts by weight. Further, in terms of parts by weight, the raw material of the adhesive composition includes 18 to 22 parts of photosensitive resin. In some of these embodiments, the raw material of the adhesive composition includes 10 parts, 15 parts, 18 parts, 22 parts, 35 parts, or 30 parts of photosensitive resin in parts by weight.
  • the mass ratio of the thermosetting resin to the photosensitive resin in the adhesive composition is 2: 3 to 4: 1. Such an arrangement can further improve the adhesiveness of the adhesive composition. Further, the mass ratio of the thermosetting resin to the photosensitive resin in the adhesive composition is 4: 3 to 2: 1.
  • the photosensitizer can transfer light energy to some reactants that are not sensitive to visible light in the photochemical reaction to improve or expand the photosensitive performance of these reactants.
  • the addition of the photosensitizer facilitates the photocuring reaction of the adhesive composition and improves the adhesiveness of the adhesive composition.
  • the photosensitizer is selected from 2,4,6-diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphosphonate, 2-methyl-1- [4- Methylthiophenyl] -2-morpholinyl-1-acetone, 2-isopropylthioxanthone, 4-dimethylamino-benzoic acid ethyl ester, 1-hydroxy-cyclohexyl-phenyl ketone , 2-hydroxy-2-methyl-1-phenyl-1-acetone, benzoin dimethyl ether, methyl phthaloyl benzoate, 4-chlorobenzophenone and 4-phenyl benzophenone At least one.
  • the raw material of the adhesive composition includes 2 to 4 parts of the photosensitizer in terms of parts by weight. Further, in terms of parts by weight, the raw material of the adhesive composition includes 2.5 parts to 3.5 parts of the photosensitizer. In some of these embodiments, the raw materials of the adhesive composition include 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, or 5 parts of the photosensitizer in parts by weight.
  • the raw material of the adhesive composition includes 1 to 4 parts of 2,4,6-diphenylphosphine oxide and 1 to 4 parts of 4-dimethylamino- Ethyl benzoate.
  • the synergistic effect of the above two photosensitizers is helpful to reduce the pressing temperature of ACF and improve the adhesion of ACF.
  • the mass ratio of the photosensitive resin to the photosensitizer in the adhesive composition is 2-30. Such an arrangement can further improve the adhesiveness of the adhesive composition. Further, the mass ratio of the photosensitive resin to the photosensitizer in the adhesive composition is 10-20. Furthermore, the mass ratio of the photosensitive resin to the photosensitizer in the adhesive composition is 6-10.
  • the raw materials of the adhesive composition include 20 parts to 40 parts of epoxy resin, 10 parts to 30 parts of epoxy acrylic resin, and 1 part to 4 parts of 2,4 in parts by weight. , 6-diphenylphosphine oxide and 1 to 4 parts of 4-dimethylamino-benzoic acid ethyl ester. With this arrangement, the adhesive composition can be pressed at a lower temperature.
  • the raw material of the adhesive composition further includes 5 to 15 parts of the thermal curing agent.
  • the thermal curing agent can promote the thermal curing of the adhesive composition and has good adhesion.
  • the thermal curing agent is selected from vinyl triamine, diaminocyclohexane, methylene bicyclohexane amine, isophorone diamine, tetraethylene pentamine, hexamethylene diamine adduct, At least one of trimethylhexylamine, m-xylylenediamine, diaminodiphenylmethane, xylylenediamine trimer, amidoamines, and dicyandiamide.
  • the amido amines are EPIKUR 3046 amido amine curing agents of the American Hansen Maitu Company.
  • the raw material of the adhesive composition includes 8 to 12 parts of the thermal curing agent in parts by weight. Further, in terms of parts by weight, the raw material of the adhesive composition includes 9 parts to 11 parts of the thermal curing agent. In some of these embodiments, the raw material of the adhesive composition includes 5 parts, 8 parts, 9 parts, 11 parts, 12 parts, or 15 parts of the thermal curing agent in parts by weight.
  • the mass ratio of the thermosetting resin to the thermosetting agent in the adhesive composition is 1.5-8. Such an arrangement can further improve the adhesiveness of the adhesive composition. Furthermore, the mass ratio of the thermosetting resin to the thermosetting agent in the adhesive composition is 2 to 4.
  • the raw material of the adhesive composition further includes 5 parts to 10 parts of conductive particles.
  • the conductive particles make the adhesive composition conductive, so that the adhesive composition can be used as an anisotropic conductive paste.
  • the adhesive composition can not only bond the elements to be bonded, but also electrically connect the elements to be bonded through conductive particles.
  • the raw material of the adhesive composition includes 7 parts to 8 parts of conductive particles. In some of these embodiments, the raw material of the adhesive composition includes 5 parts, 6 parts, 7 parts, 7.5 parts, 8 parts, 9 parts, or 10 parts of conductive particles in parts by weight.
  • the conductive particles can be omitted.
  • the raw material of the adhesive composition further includes 5 to 10 parts of auxiliary components.
  • the auxiliary component is selected from at least one of a leveling agent and a plasticizer.
  • the leveling agent can promote the adhesive composition to form a smooth, smooth and uniform coating film during the process of forming the adhesive composition into a film.
  • the addition of plasticizers can enhance the flexibility of the adhesive composition and be easy to process.
  • the auxiliary component in terms of parts by weight, includes 1 part to 10 parts of a leveling agent and 1 part to 10 parts of a plasticizer.
  • the leveling agent is selected from at least one of polydimethylsiloxane, polyether polyester modified organosiloxane, end-group modified silicone, and alkyl-modified organosiloxane Species.
  • the plasticizer is selected from at least one of phthalates, benzene polyesters, benzoates, and polyol esters.
  • the raw material of the adhesive composition includes 20% to 40% of thermosetting resin, 10% to 30% of photosensitive resin, 1% to 5% of photosensitizer, 5% by mass percentage -15% thermosetting agent, 5% -10% conductive particles, 1% -10% leveling agent and 1% -10% plasticizer
  • thermosetting resin is selected from epoxy resin, unsaturated polyester resin , Phenolic resin and amino resin at least one
  • photosensitive resin is selected from epoxy acrylic resin, polyester acrylic resin, polyether acrylic resin, pure acrylic resin and vinyl resin at least one
  • photosensitizer is selected from 2, 4,6-diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphosphonate, 2-methyl-1- [4-methylthiophenyl] -2-morpholinyl- 1-acetone, 2-isopropylthioxanthone, ethyl 4-dimethylamino-benzoate, 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2
  • the adhesive composition adopting this formula can be pressed at a lower temperature and photocured at a lower light energy to have good adhesion and achieve bonding, which is more conducive to reducing the thermal expansion effect of the components to be bonded. In turn, it is more conducive to improving the bonding yield.
  • the adhesive composition is in the form of a paste or a film.
  • the adhesive composition includes conductive particles
  • the conductive particles are evenly distributed in the adhesive composition.
  • thermosetting resin, photosensitive resin and photosensitizer in the above adhesive composition work synergistically, so that the adhesive composition can have good adhesion through low-temperature lamination and photo-curing, and realize bonding, while using low-temperature pressure
  • the combination is beneficial to reduce the thermal expansion effect of the components to be bonded. It has been verified by experiments that when the above-mentioned adhesive composition is used to bond COF (Chip On Film, also called flip-chip film) and glass substrate, it can be pressed under 130 °C, and the adhesion force after bonding is 800N / m ⁇ 1500N / m, the thermal expansion ratio of the glass substrate bonded by the above adhesive composition is 0.02% lower than that of the conventional ACF.
  • the above-mentioned adhesive composition can have good adhesion by low-temperature pressing and UV curing, can avoid the thermal expansion of the components to be bonded due to high temperature and reduce the bonding yield, and can also avoid the excessively high temperature thermal process
  • the residual stress causes thermal deformation such as curling of the components to be bonded, thereby ensuring the normal operation of the components to be bonded.
  • the above-mentioned adhesive composition includes conductive particles, so that the adhesive composition can conduct electricity in one direction, and the above-mentioned adhesive composition can be used as an anisotropic conductive adhesive for the bonding and electrical connection of components to be bonded .
  • the preparation method of the adhesive composition of the above embodiment includes the following operations S110-S130:
  • the temperature for heating and melting is 150 ° C to 200 ° C.
  • the operation of cooling the mixture is also included. Specifically, the mixture is cooled to below 80 ° C.
  • the adhesive composition further includes a thermal curing agent.
  • S120 is specifically: adding a photosensitizer and a thermal curing agent to the mixture and mixing them to obtain a uniform mixture.
  • the adhesive composition further includes conductive particles.
  • S120 is specifically: adding a photosensitizer and conductive particles to the mixture and mixing them to obtain a mixed product.
  • the adhesive composition further includes an auxiliary component.
  • S120 is specifically: adding the photosensitizer and the auxiliary component to the mixture and mixing to obtain a mixed product.
  • the adhesive composition further includes a thermal curing agent, conductive particles, and auxiliary components.
  • S120 is specifically: adding a photosensitizer, a thermal curing agent, conductive particles and an auxiliary component to the mixture and mixing them to obtain a mixed product.
  • S130 is specifically: applying the mixed material on the substrate and curing to form a film to obtain an adhesive composition.
  • the method of curing into a film is ultraviolet curing. Specifically, in the curing process, the ultraviolet light wavelength is 200 nm to 400 nm, the ultraviolet light energy is 500 mJ to 3000 mJ, and the curing time is 1 s to 6 s.
  • the thickness of the adhesive composition is 10 ⁇ m to 100 ⁇ m.
  • S130 may be omitted, and the homogenized product obtained in S120 is the paste-like adhesive composition.
  • the method for preparing the adhesive composition of the above embodiment is simple in operation, and the adhesive composition that can be obtained can have good adhesiveness at low-temperature pressing and photocuring.
  • a method for manufacturing an electronic product 100 includes the following operations S210-S230:
  • the adhesive composition 110 is sandwiched between the first element 120 and the second element 130 to obtain an object to be processed.
  • the adhesive composition 110 is in the form of a paste or a film.
  • S210 is specifically: disposing the adhesive composition 110 on one of the first element 120 and the second element 130, and placing the other of the first element 120 and the second element 130 One is disposed on one of the adhesive composition 110 away from the first element 120 and the second element 130, so that the adhesive composition 110 is sandwiched between the first element 120 and the second element 130 to obtain the object to be processed.
  • the above-mentioned adhesive composition 110 may be sandwiched between the first element 120 and the second element 130, and subjected to curing treatment to cure the adhesive composition 110 to obtain an object to be treated ; You can also clamp the adhesive composition 110 between the first element 120 and the second element 130; You can also apply the adhesive composition 110 on one of the first element 120 and the second element 130 and After curing, the other of the first component 120 and the second component 130 is disposed on the adhesive composition 110 so that the adhesive composition 110 is sandwiched between the first component 120 and the second component 130.
  • the adhesive composition 110 is a film.
  • the adhesive composition 110 contains conductive particles 112.
  • the conductive particles 112 are evenly distributed in the adhesive composition 110.
  • the first element 120 is a glass plate, COF or FPC. It should be noted that the first element 120 is not limited to the above-mentioned pointed element, and may be other elements, such as COB. In the illustrated embodiment, the first element 120 is a glass plate.
  • the first element 120 is provided with a first electrode 122. There are a plurality of first electrodes 122, and the plurality of first electrodes 122 are disposed on one surface of the first element 120 at intervals.
  • the second element 130 is a glass plate, COF or FPC. It should be noted that the second element 130 is not limited to the above-mentioned pointed element, and may be other elements, such as COB. In the illustrated embodiment, the second element 130 is a COF.
  • the second element 130 is provided with a second electrode 132. There are a plurality of second electrodes 132, and the plurality of second electrodes 132 are disposed on a surface of the second element 130 close to the first element 130 at intervals. The positions of the plurality of second electrodes 132 are respectively opposite to the positions of the plurality of first electrodes 122 so that one second electrode 132 corresponds to one first electrode 122.
  • the heating temperature is less than or equal to 130 ° C.
  • the pressure is from 2MPa to 8MPa.
  • the heat and pressure treatment time is 2s ⁇ 6s.
  • the heating temperature is 100 ° C to 130 ° C.
  • the pressure is 4MPa ⁇ 6MPa.
  • the heat and pressure treatment time is 3s ⁇ 5s.
  • S220 is specifically: applying pressure and providing heat from the side of the second element 130 away from the first element 120 to perform heat and pressure treatment on the object. This arrangement prevents the first element 120 from being deformed or broken by high temperature and high pressure.
  • the buffer layer 140 is covered on the side of the second element 130 away from the first element 120, and the buffer layer 140 is pressed by the pressing tool 150 while being provided from the side of the second element 130 away from the first element 120 Heat to apply heat and pressure to the object.
  • the direction indicated by the arrow (1-1) in FIG. 1 is the direction of heating and pressing.
  • the buffer layer 140 is a silicone buffer layer or a polytetrafluoroethylene buffer layer. The provision of the buffer layer 140 can prevent the second element 130 from being directly pressed to cause the second element 130 to be broken or damaged, so as to affect the normal use of the electronic product 100.
  • the conductive particles 112 can be sandwiched between the first electrode 122 and the second electrode 132 to electrically connect the first electrode 122 and the second electrode 132.
  • the ultraviolet light has a wavelength of 200 nm to 400 nm.
  • the cumulative energy of ultraviolet light is 500mJ ⁇ 3000mJ.
  • the ultraviolet irradiation time is 1s ⁇ 6s.
  • ultraviolet light is incident on the object to be treated from the side of the first element 120 away from the second element 130 to cure the adhesive composition 110.
  • the direction indicated by the arrow (1-2) in FIG. 1 is the direction in which ultraviolet light enters.
  • Such an arrangement is beneficial to increase the transmittance of ultraviolet light and accelerate the curing of the adhesive composition 110.
  • the ultraviolet light is not limited to be disposed from the above direction, and the ultraviolet light may also be incident from the side of the second element 130 away from the first element 120.
  • the first component 120 and the second component 130 are bonded through the adhesive composition 110, and the low temperature pressing and ultraviolet light curing are used to make the first component 120 and the second component 130 stable and reliable.
  • Reduce the thermal expansion effect of the first element 120 and the second element 130 can avoid the thermal deformation of the excessively high temperature thermal process caused by the first element 120 and the second element 130 curling and other thermal deformation, to ensure the normal operation of electronic product 100 .
  • the electronic product 100 obtained by the above preparation method has a strong tensile strength and a high bonding yield.
  • the treatment object is not limited to the heat and pressure treatment before the ultraviolet light irradiation treatment, and the treatment object may be first subjected to the ultraviolet light irradiation treatment and then the heat and pressure treatment.
  • the preparation method of the electronic product 200 includes the following steps S310-S320:
  • the above adhesive composition 210 is sandwiched between the first element 220 and the second element 230 to obtain an object to be processed.
  • the adhesive composition 210 is in the form of a paste or a film.
  • S310 is specifically: disposing the adhesive composition 210 on one of the first element 220 and the second element 230, and placing the other of the first element 220 and the second element 230 One is disposed on one of the adhesive composition 210 away from the first component 220 and the second component 230, so that the adhesive composition 210 is sandwiched between the first component 220 and the second component 230 to obtain the object to be processed.
  • the above-mentioned adhesive composition 210 may be sandwiched between the first element 220 and the second element 230, and subjected to curing treatment to cure the adhesive composition 210 to obtain an object to be treated ; You can also clamp the adhesive composition 210 between the first element 220 and the second element 230; You can also apply the adhesive composition 210 on one of the first element 220 and the second element 230 and After curing, the other of the first component 220 and the second component 230 is disposed on the adhesive composition 210 so that the adhesive composition 210 is sandwiched between the first component 220 and the second component 230.
  • the adhesive composition 210 is a film.
  • the adhesive composition 210 contains conductive particles 212.
  • the conductive particles 212 are evenly distributed in the adhesive composition 210.
  • the first element 220 is a glass plate, COF or FPC. It should be noted that the first element 220 is not limited to the above-mentioned pointed element, and may be other elements, such as COB. In the illustrated embodiment, the first element 220 is a glass plate.
  • the first element 220 is provided with a first electrode 222. There are a plurality of first electrodes 222, and the plurality of first electrodes 222 are disposed on one surface of the first element 220 at intervals.
  • the second element 230 is a glass plate, COF or FPC. It should be noted that the second element 230 is not limited to the above-mentioned pointed element, and may be other elements, such as COB. In the illustrated embodiment, the second element 230 is a COF.
  • the second element 230 is provided with a second electrode 232. There are a plurality of second electrodes 232, and the plurality of second electrodes 232 are disposed on a surface of the second element 230 close to the first element 230 at intervals. The positions of the plurality of second electrodes 232 are opposite to the positions of the plurality of first electrodes 222 respectively, so that one second electrode 232 corresponds to one first electrode 222.
  • the heating temperature is less than or equal to 130 ° C.
  • the pressure is from 2MPa to 8MPa.
  • the heat and pressure treatment time is 2s ⁇ 6s.
  • the wavelength of ultraviolet light is 200nm-400nm.
  • the cumulative energy of ultraviolet light is 500mJ ⁇ 3000mJ.
  • the ultraviolet irradiation time is 2s ⁇ 6s.
  • the heating temperature is 100 ° C to 130 ° C.
  • the pressure is 4MPa ⁇ 6MPa.
  • the heat and pressure treatment time is 3s ⁇ 5s.
  • the wavelength of ultraviolet light is 230nm-380nm.
  • the cumulative energy of ultraviolet light is 1000mJ ⁇ 2000mJ.
  • the ultraviolet irradiation time is 3s ⁇ 5s.
  • S320 is specifically: applying pressure and providing heat from the side of the second element 230 away from the first element 220, and ultraviolet light is injected into the object to be treated from the side of the first element 220 away from the second element 230
  • the adhesive composition 210 is further heated and pressurized and irradiated with ultraviolet light to cure the adhesive composition 210.
  • the operation of applying pressure and providing heat from the side of the second element 230 away from the first element 220 specifically includes: covering the buffer layer 240 on the side of the second element 230 away from the first element 220, by adding The pressing tool 250 presses the buffer layer 240 while providing heat from the side of the second element 230 away from the first element 210 to heat and pressurize the object.
  • the direction indicated by the arrow (2-1) in FIG. 3 is the direction of heating and pressing, and the direction indicated by the arrow (2-2) is the direction of ultraviolet light incidence.
  • the provision of the buffer layer 140 can prevent the second element 130 from being directly pressed to cause the second element 130 to be broken or damaged, so as to affect the normal use of the electronic product 100.
  • the ultraviolet light is not limited to be disposed from the above direction, and the ultraviolet light may also be incident from the side of the second element 230 away from the first element 220.
  • the conductive particles 212 can be sandwiched between the first electrode 222 and the second electrode 232 to electrically connect the first electrode 222 and the second electrode 232.
  • the preparation method of the electronic product 200 described above has a simple operation.
  • the first component 220 and the second component 230 are bonded through the adhesive composition 210, and the low temperature pressing and ultraviolet curing are used to connect the first component 220 and the second component 230. It is stable and reliable, reduces the thermal expansion effect of the first element 220 and the second element 230, and can avoid the residual stress caused by the excessively high temperature in the thermal process from causing thermal deformation such as curling of the element to be bonded, so as to ensure the normal operation of the electronic product 200.
  • the electronic product 200 obtained by the above preparation method has a strong tensile strength and a high bonding yield.
  • the electronic product according to an embodiment is prepared by the above-mentioned preparation method of the electronic product.
  • the electronic product is a display screen, a piezoelectric crystal, a crystal oscillator, a resonator, a solar cell, a photovoltaic cell, a buzzer, or a semiconductor discrete device.
  • the above electronic products have strong tensile strength, high bonding yield, and long operating life.
  • the conductive particles are all conductive gold balls purchased from Sekisui Chemical Industry Co., Ltd.
  • the urethane acrylic resin is the urethane acrylic resin of German Bayer company with the article number Desmo D-100.
  • the polyester acrylic resin is the polyester acrylic resin of China Houding Chemical Co., Ltd. with the article number HD-220.
  • the raw material of the adhesive composition includes 20 parts of epoxy resin, 10 parts of epoxy acrylic resin, and 1 part of 2,4,6-diphenylphosphine oxide.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 100 ⁇ m.
  • the adhesive composition is sandwiched between the first element and the second element to obtain an object to be treated; wherein, the first element is a glass plate and the second element is a COF.
  • UV light is injected into the to-be-processed material from the side of the first element away from the second element to cure the adhesive composition to obtain an electronic product; wherein the wavelength of ultraviolet light is 200 nm, and the cumulative energy of ultraviolet light is 500 mJ The ultraviolet irradiation time is 1s.
  • the raw materials of the adhesive composition include 40 parts of epoxy resin, 30 parts of epoxy acrylic resin, and 5 parts of 2,4,6-trimethylbenzoylphosphonic acid in parts by weight. Ethyl ester.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 14 ⁇ m.
  • the adhesive composition is sandwiched between the first element and the second element to obtain an object to be treated; wherein, the first element is a glass plate and the second element is a COF.
  • UV light is injected into the to-be-processed material from the side of the first element away from the second element to cure the adhesive composition to obtain an electronic product; wherein the wavelength of ultraviolet light is 400 nm and the cumulative energy of ultraviolet light is 3000 mJ, The UV irradiation time is 6s.
  • the raw materials of the adhesive composition include 30 parts of epoxy resin, 20 parts of epoxy acrylic resin, and 3.5 parts of 4-dimethylamino-ethyl benzoate.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 50 ⁇ m.
  • the adhesive composition is sandwiched between the first element and the second element to obtain an object to be treated; wherein, the first element is a glass plate and the second element is a COF.
  • UV light is injected into the to-be-processed material from the side of the first element away from the second element to cure the adhesive composition to obtain an electronic product; wherein the wavelength of ultraviolet light is 300 nm and the cumulative energy of ultraviolet light is 1500 mJ, The ultraviolet irradiation time is 3s.
  • the raw materials of the adhesive composition include 30 parts of epoxy resin, 20 parts of epoxy acrylic resin, 1.5 parts of 2,4,6-diphenylphosphine oxide and 2 parts Ethyl 4-dimethylamino-benzoate.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 50 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as the preparation process of Example 3.
  • the raw materials of the adhesive composition include 30 parts of epoxy resin, 20 parts of epoxy acrylic resin, 1.5 parts of 2,4,6-diphenylphosphine oxide and 2 parts Ethyl 4-dimethylamino-benzoate.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 50 ⁇ m.
  • the adhesive composition is sandwiched between the first element and the second element to obtain an object to be treated; wherein, the first element is a glass plate and the second element is a COF.
  • Heating and pressurizing and ultraviolet light irradiation are performed to obtain electronic products.
  • the heating temperature is 115 ° C.
  • the pressure is 5 MPa
  • the wavelength of ultraviolet light is 300 nm
  • the cumulative energy of ultraviolet light is 1500 mJ
  • the processing time is 3 s.
  • the raw materials of the adhesive composition include 20 parts of epoxy resin, 10 parts of epoxy acrylic resin, 1 part of 2,4,6-diphenylphosphine oxide, and 5 parts by weight.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 100 ⁇ m.
  • the adhesive composition is sandwiched between the first element and the second element to obtain an object to be treated; wherein, the first element is a glass plate and the second element is a COF.
  • Heating and pressurizing and ultraviolet light irradiation are performed to obtain electronic products.
  • the heating temperature is 100 ° C.
  • the pressure is 2 MPa
  • the ultraviolet light wavelength is 200 nm
  • the cumulative energy of the ultraviolet light is 500 mJ
  • the processing time is 1 s.
  • the raw materials of the adhesive composition include 40 parts of epoxy resin, 30 parts of epoxy acrylic resin, and 5 parts of 2,4,6-trimethylbenzoylphosphonic acid in parts by weight.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 14 ⁇ m.
  • the adhesive composition is sandwiched between the first element and the second element to obtain an object to be treated; wherein, the first element is a glass plate and the second element is a COF.
  • the raw materials of the adhesive composition include 30 parts of epoxy resin, 20 parts of epoxy acrylic resin, 1.5 parts of 2,4,6-diphenylphosphine oxide, 2 parts 4-dimethylamino-ethyl benzoate, 10 parts of trimethyl hexamethylene diamine, 7.5 parts of conductive particles, 3 parts of alkyl-modified organosiloxane and 3.5 parts of benzene polyester plasticizer Agent.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 50 ⁇ m.
  • the adhesive composition is sandwiched between the first element and the second element to obtain an object to be treated; wherein, the first element is a glass plate and the second element is a COF.
  • the heating temperature is 115 ° C.
  • the pressure is 5 MPa
  • the wavelength of ultraviolet light is 300 nm
  • the cumulative energy of ultraviolet light is 1500 mJ
  • the processing time is 3 s.
  • the raw materials of the adhesive composition include 35% epoxy resin, 25% epoxy acrylic resin, 2% 2,4,6-diphenylphosphine oxide, 2 % 4-dimethylamino-benzoic acid ethyl ester, 9% trimethylhexanediamine, 9% conductive particles, 4% alkyl-modified organosiloxane, and 4% benzene polyester Plasticizer.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 50 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as that of Embodiment 8.
  • the raw materials of the adhesive composition include 30 parts of epoxy resin, 10 parts of epoxy acrylic resin, 1 part of 2,4,6-diphenylphosphine oxide, 5 parts Vinyl triamine, 5 parts of conductive particles, 2 parts of polyether polyester modified organosiloxane and 3 parts of phthalate plasticizer.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 100 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as the preparation process of the electronic product of Example 6.
  • the raw materials of the adhesive composition include 20 parts of epoxy resin, 30 parts of epoxy acrylic resin, and 5 parts of 2,4,6-trimethylbenzoylphosphonic acid Ethyl acetate, 15 parts of methylene bicyclohexaneamine, 10 parts of conductive particles, 5 parts of polydimethylsiloxane, and 5 parts of benzoate plasticizer.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 14 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as the preparation process of the electronic product of Example 7.
  • the raw materials of the adhesive composition include 20 parts of epoxy resin, 12 parts of epoxy acrylic resin, 1 part of 2,4,6-diphenylphosphine oxide, 5 parts Vinyl triamine, 5 parts of conductive particles, 2 parts of polyether polyester modified organosiloxane and 3 parts of phthalate plasticizer.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 100 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as the preparation process of the electronic product of Example 6.
  • the raw materials of the adhesive composition include 40 parts of epoxy resin, 25 parts of epoxy acrylic resin, and 5 parts of 2,4,6-trimethylbenzoylphosphonic acid in parts by weight.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 14 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as the preparation process of the electronic product of Example 7.
  • the raw materials of the adhesive composition include 20 parts of epoxy resin, 10 parts of epoxy acrylic resin, 1 part of 2,4,6-diphenylphosphine oxide, 4 parts Vinyl triamine, 5 parts of conductive particles, 2 parts of polyether polyester modified organosiloxane and 3 parts of phthalate plasticizer.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 100 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as the preparation process of the electronic product of Example 6.
  • the raw materials of the adhesive composition include 35 parts of epoxy resin, 30 parts of epoxy acrylic resin, and 5 parts of 2,4,6-trimethylbenzoylphosphonic acid Ethyl acetate, 15 parts of methylene bicyclohexaneamine, 10 parts of conductive particles, 5 parts of polydimethylsiloxane, and 5 parts of benzoate plasticizer.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 14 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as the preparation process of the electronic product of Example 7.
  • the raw materials of the adhesive composition include 30 parts of unsaturated polyester resin, 20 parts of epoxy acrylic resin, and 3.5 parts of 4-dimethylamino-ethyl benzoate.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 50 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as that of Embodiment 3.
  • the raw materials of the adhesive composition include 30 parts of epoxy resin, 20 parts of pure acrylic resin, and 3.5 parts of 4-dimethylamino-ethyl benzoate.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 50 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as that of Embodiment 3.
  • the raw materials of the adhesive composition include 30 parts of epoxy resin, 20 parts of epoxy acrylic resin, and 3.5 parts of 1-hydroxy-cyclohexyl-phenyl ketone.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 50 ⁇ m.
  • the preparation process of the electronic product of this embodiment is the same as that of Embodiment 3.
  • the raw materials of the adhesive composition include 30 parts of epoxy resin, 7.5 parts of conductive particles, 3 parts of alkyl-modified organosiloxane, and 3.5 parts of benzene polyester Plasticizers.
  • the adhesive composition of this example is a film, and the thickness of the adhesive composition is 50 ⁇ m.
  • the adhesive composition is sandwiched between the first element and the second element to obtain an object to be treated; wherein, the first element is a glass plate and the second element is a COF.
  • the adhesive composition in this example is the same as in Example 19.
  • the preparation process of the electronic product of this embodiment is substantially the same as that of Example 19, except that the heating temperature is 140 ° C.
  • the raw materials of the adhesive composition include 4.5% ethoxylated bisphenol A dimethacrylate, 23.5% tetraphenol ethane tetraglycidyl ether epoxy resin, 6% Polypropylene glycol glycidyl ether, 4% conductive gold spheres, 3% epoxy acetophenone, 16% dicyandiamide derivatives and 0.5% polydimethylsiloxane.
  • the adhesive composition in this example is 1800 series ACF glue of Hitachi Chemical Co., Ltd.
  • the preparation process of the electronic product of this embodiment is the same as that of Embodiment 19.
  • the tensile test machine is used to test the adhesion of electronic products
  • the thickness variation of the first component By measuring the thickness variation of the first component to reflect the thermal expansion ratio of the first component; specifically, measuring the thickness of the first component before the preparation of the electronic product and the thickness after the preparation of the electronic product, the difference between the two is divided by The thickness before the preparation of the electronic product is multiplied by 100% to obtain the thermal expansion ratio;
  • the flatness of the electronic product is tested by observing whether the first component and the second component of the electronic product have curling or other deformation problems; the criterion is: one of the first component and the second component is uneven (ie, no ), If the first element and the second element are not deformed, it is flat (that is, yes).
  • Example 1 A Adhesion (N / m) Thermal expansion ratio (%) Flatness (Yes / No)
  • Example 2 800 0.052 Yes
  • Example 3 900 0.046 Yes
  • Example 4 920 0.044 Yes
  • Example 5 930 0.046 Yes Example 6 950 0.049 Yes Example 7 980 0.052 Yes Example 8 1000 0.046 Yes Example 9 1200 0.046 Yes Example 10 900 0.04 Yes Example 11 920 0.052 Yes Example 12 880 0.04 Yes Example 13 940 0.052 Yes Example 14 935 0.04 Yes Example 15 950 0.052 Yes Example 16 870 0.046 Yes Example 17 850 0.046 Yes Example 18 845 0.046 Yes Example 19 950 0.046 Yes Example 20 1050 0.056 Yes Example 21 900 0.068 Yes Example 22 800 0.072 Yes
  • the adhesion of the electronic products of Examples 1-9 is 750N / m ⁇ 1200N / m, which is at least equivalent to the adhesion of the commercially available ACF adhesive of Example 22, and the electronic products of Examples 1-9
  • the thermal expansion ratio of the first element is 0.044% to 0.052%, which is at least 0.02% lower than the thermal expansion ratio of the commercial ACF adhesive of Example 22, indicating that the above adhesive composition has good adhesion, and the use of this adhesive combination
  • the bonding of objects can reduce the thermal expansion of the components to be bonded.
  • the thermal expansion ratio of the electronic product of Example 8 is equivalent to that of Example 19, but the adhesive force of the electronic product of Example 8 is higher than that of Example 19, indicating that the adhesive composition of Example 8 is more beneficial to increase the adhesive force of the electronic product.
  • the adhesive force of the electronic product of Example 20 is slightly better than that of Example 8, but the thermal expansion ratio of the electronic product of Example 20 is higher than that of Example 8, indicating that although providing stability can increase the adhesive force of the electronic product of Example 20, it also It will increase the thermal expansion of the electronic product, which further illustrates that the adhesive composition of Example 8 is more beneficial to increase the adhesion of the electronic product and reduce the thermal expansion ratio of the electronic product.

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Abstract

本申请涉及一种粘合组合物、电子产品及其制备方法。该粘合组合物的原料以重量份数计包括20份～40份的热固性树脂、10份～30份的光敏树脂及1份～5份的光敏剂。

Description

粘合组合物、电子产品及其制备方法
相关申请的交叉引用
本申请要求于2018年11月23日提交中国专利局、申请号为2018114079110、发明名称为“粘合组合物、电子产品及其制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子封装技术领域，特别涉及一种粘合组合物、电子产品及其制备方法。
背景技术
异方性导电胶是一种能够单向导电的粘合剂。异方性导电胶膜(Anisotropic Conductive Film，ACF)是由异方性导电胶制成的薄膜。由于ACF兼具单向导电和胶合固定的功能，广泛应用于显示屏、压电晶体、晶振、谐振器、太阳能电池、光伏电池、蜂鸣器、半导体分立器件等各种元件的封装及粘结。
一般的ACF的主要成分为热固性树脂。此类ACF在使用过程中需要采用高温压合，以使ACF发生反应而提高ACF的粘着性，完成bonding(邦定)。但是较高的温度导致待粘接元件的热膨胀较大，进而影响待粘接元件的正常使用。
需要说明的是，背景技术的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术。
发明内容
基于此，有必要提供一种粘合组合物，该粘合组合物具有较好的粘着性，且使用该粘合组合物进行粘接能够减少待粘接元件的热膨胀。
此外，提供一种电子产品及其制备方法。
一种粘合组合物，以重量份数计，所述粘合组合物的原料包括：
热固性树脂  20份～40份；
光敏树脂    10份～30份；及
光敏剂      1份～5份；
其中，所述热固性树脂选自环氧树脂、不饱和聚酯树脂、酚醛树脂及氨基树脂中的至少一种，所述光敏树脂选自环氧丙烯酸树脂、聚氨酯丙烯酸树脂、聚酯丙烯酸树脂、聚醚丙烯酸树脂、纯丙烯酸树脂及乙烯基树脂中的至 少一种，所述光敏剂选自2,4,6-二苯基氧化膦、2,4,6-三甲基苯甲酰基膦酸乙酯、2-甲基-1-[4-甲硫基苯基]-2-吗啉基-1-丙酮、2-异丙基硫杂蒽酮、4-二甲氨基-苯甲酸乙酯、1-羟基-环已基-苯基甲酮、2-羟基-2-甲基-1-苯基-1-丙酮、安息香双甲醚、邻苯甲酰苯甲酸甲酯、4-氯二苯甲酮及4-苯基二笨甲酮中的至少一种。
在其中一个实施例中，以重量份数计，所述粘合组合物的原料包括20份～40份的环氧树脂、10份～30份的环氧丙烯酸树脂、1份～4份的2,4,6-二苯基氧化膦及1份～4份的4-二甲氨基-苯甲酸乙酯。
在其中一个实施例中，以重量份数计，所述粘合组合物的原料还包括5份～15份的热固化剂。
在其中一个实施例中，所述热固化剂选自乙烯基三胺、二氨基环己烷、亚甲基双环己烷胺、异佛尔酮二胺、四乙烯五胺、已二胺加合物、三甲基已二胺、间苯二甲胺、二氨基二苯基甲烷、苯二甲胺三聚体、酰胺基胺类及双氰胺中的至少一种。
在其中一个实施例中，以重量份数计，所述粘合组合物的原料还包括5份～10份的导电粒子。
在其中一个实施例中，以重量份数计，所述粘合组合物的原料还包括5份～10份的辅助组分，所述辅助组分选自流平剂及增塑剂中的至少一种。
在其中一个实施例中，以重量份数计，所述辅助组分包括1份～10份的流平剂及1份～10份的增塑剂；及/或，
所述流平剂选自聚二甲基硅氧烷、聚醚聚酯改性有机硅氧烷、端基改性有机硅及烷基改性有机硅氧烷中的至少一种；及/或，
所述增塑剂选自苯二甲酸酯类、苯多酸酯类、苯甲酸酯类及多元醇酯类中的至少一种。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其它特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他实施例的附图。
图1为一实施方式的电子产品的制备过程中加热加压处理的操作示意图；
图2为图1所示的电子产品的制备过程中紫外光照射的操作示意图；
图3为另一实施方式的电子产品的制备过程的操作示意图。
具体实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳的实施例。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。
一实施方式的粘合组合物，以重量份数计，其原料包括20份～40份的热固性树脂、10份～30份的光敏树脂和1份～5份的光敏剂。
上述粘合组合物通过低温压合和光固化即能够具有良好的粘着性而实现bonding，有利于减小待粘接元件的热膨胀效应。其中，待粘接元件包括玻璃板、COF及FPC(柔性电路板，Flexible Printed Circuit)中的至少一种。需要说明的是，待粘接元件不限于上述指出元件，还可以为其他元件，例如可以是COB(板上芯片，Chip On Board)等。由于上述粘合组合物能够玻璃板、COF及FPC(柔性电路板，Flexible Printed Circuit)等的粘接，因而能够应用于制备电子产品。其中，电子产品为显示屏、压电晶体、晶振、谐振器、太阳能电池、光伏电池、蜂鸣器或半导体分立器件等。
热固性树脂是指加热后产生化学变化而逐渐硬化成型，继续受热不会软化或溶解的一种树脂。热固性树脂的加入，使得粘合组合物能够加热压合。
在其中一些实施例中，热固性树脂选自环氧树脂、不饱和聚酯树脂、酚醛树脂及氨基树脂中的至少一种。
在其中一个实施例中，以重量份数计，粘合组合物的原料包括25份～35份的热固性树脂。进一步地，以重量份数计，粘合组合物的原料包括28份～32份的热固性树脂。在其中一些实施例中，以重量份数计，粘合组合物的原料包括20份、25份、28份、32份、35份或40份的热固性树脂。
光敏树脂是一种能够通过光固化而快速成型的材料。光敏树脂的加入，使得粘合组合物能够通过光照而固化成型。
在其中一些实施例中，光敏树脂选自环氧丙烯酸树脂、聚氨酯丙烯酸树脂、聚酯丙烯酸树脂、聚醚丙烯酸树脂、纯丙烯酸树脂及乙烯基树脂中的至少一种。进一步地，聚氨酯丙烯酸树脂为德国拜耳公司的货号为德士模都D-100的聚氨酯丙烯酸树脂。聚酯丙烯酸树脂为中国厚鼎化工公司的货号为 HD-220的聚酯丙烯酸树脂。
在其中一个实施例中，以重量份数计，粘合组合物的原料包括15份～25份的光敏树脂。进一步地，以重量份数计，粘合组合物的原料包括18份～22份的光敏树脂。在其中一些实施例中，以重量份数计，粘合组合物的原料包括10份、15份、18份、22份、35份或30份的光敏树脂。
在其中一个实施例中，粘合组合物中热固化树脂与光敏树脂的质量比为2:3～4:1。此种设置，能够进一步提高粘合组合物的粘着性。进一步地，粘合组合物中热固化树脂与光敏树脂的质量比为4:3～2:1。
光敏剂能够在光化学反应中把光能转移到一些对可见光不敏感的反应物上以提高或扩大这些反应物的感光性能。光敏剂的加入有利于粘合组合物进行光固化反应而提高粘合组合物的粘着性。
在其中一些实施例中，光敏剂选自2,4,6-二苯基氧化膦、2,4,6-三甲基苯甲酰基膦酸乙酯、2-甲基-1-[4-甲硫基苯基]-2-吗啉基-1-丙酮、2-异丙基硫杂蒽酮、4-二甲氨基-苯甲酸乙酯、1-羟基-环已基-苯基甲酮、2-羟基-2-甲基-1-苯基-1-丙酮、安息香双甲醚、邻苯甲酰苯甲酸甲酯、4-氯二苯甲酮及4-苯基二笨甲酮中的至少一种。
在其中一个实施例中，以重量份数计，粘合组合物的原料包括2份～4份的光敏剂。进一步地，以重量份数计，粘合组合物的原料包括2.5份～3.5份的光敏剂。在其中一些实施例中，以重量份数计，粘合组合物的原料包括1份、1.5份、2份、2.5份、3份、3.5份、4份、4.5份或5份的光敏剂。
在其中一个实施例中，以重量份数计，粘合组合物的原料包括1份～4份的2,4,6-二苯基氧化膦及1份～4份的4-二甲氨基-苯甲酸乙酯。上述两种光敏剂的协同作用，有利于降低ACF的压合温度，提高ACF的粘着性。
在其中一个实施例中，粘合组合物中光敏树脂与光敏剂的质量比为2～30。此种设置，能够进一步提高粘合组合物的粘着性。进一步地，粘合组合物中光敏树脂与光敏剂的质量比为10～20。更进一步地，粘合组合物中光敏树脂与光敏剂的质量比为6～10。
在其中一个实施例中，以重量份数计，粘合组合物的原料包括20份～40份的环氧树脂、10份～30份的环氧丙烯酸树脂、1份～4份的2,4,6-二苯基氧化膦及1份～4份的4-二甲氨基-苯甲酸乙酯。此种设置，粘合组合物能够更低的温度下进行压合。
在其中一个实施例中，以重量份数计，粘合组合物的原料还包括5份～15份的热固化剂。热固化剂能够促进粘合组合物热固化而具有良好的粘着性。
在其中一些实施例中，热固化剂选自乙烯基三胺、二氨基环己烷、亚甲基双环己烷胺、异佛尔酮二胺、四乙烯五胺、已二胺加合物、三甲基已二胺、 间苯二甲胺、二氨基二苯基甲烷、苯二甲胺三聚体、酰胺基胺类及双氰胺中的至少一种。其中，酰胺基胺类为美国瀚森迈图公司的EPIKUR 3046酰胺基胺固化剂。
在其中一个实施例中，以重量份数计，粘合组合物的原料包括8份～12份的热固化剂。进一步地，以重量份数计，粘合组合物的原料包括9份～11份的热固化剂。在其中一些实施例中，以重量份数计，粘合组合物的原料包括5份、8份、9份、11份、12份或15份的热固化剂。
在其中一个实施例中，粘合组合物中热固化树脂与热固化剂的质量比为1.5～8。此种设置，能够进一步提高粘合组合物的粘着性。进一步地，粘合组合物中热固化树脂与热固化剂的质量比为2～4。
在其中一个实施例中，以重量份数计，粘合组合物的原料还包括5份～10份的导电粒子。导电粒子使得粘合组合物具有导电性，以使粘合组合物能够作为一种异方性导电胶。当至少两个待粘接元件需要电连接时，粘合组合物不仅能够粘接上述待粘接元件，还能够通过导电粒子实现待粘接元件的电连接。
进一步地，以重量份数计，粘合组合物的原料包括7份～8份的导电粒子。在其中一些实施例中，以重量份数计，粘合组合物的原料包括5份、6份、7份、7.5份、8份、9份或10份的导电粒子。
需要说明的是，若两个待粘接元件不需要电连接时，导电粒子可以省略。
在其中一个实施例中，以重量份数计，粘合组合物的原料还包括5份～10份的辅助组分。辅助组分选自流平剂及增塑剂中的至少一种。流平剂能够在将粘合组合物制作成膜的过程中促使粘合组合物形成平整、光滑、均匀的涂膜。增塑剂的加入能够使粘合组合物的柔韧性增强，易于加工。
在其中一个实施例中，以重量份数计，辅助组分包括1份～10份的流平剂及1份～10份的增塑剂。
在其中一些实施例中，流平剂选自聚二甲基硅氧烷、聚醚聚酯改性有机硅氧烷、端基改性有机硅及烷基改性有机硅氧烷中的至少一种。
在其中一些实施例中，增塑剂选自苯二甲酸酯类、苯多酸酯类、苯甲酸酯类及多元醇酯类中的至少一种。
在其中一个实施例中，以质量百分含量计，粘合组合物的原料包括20％～40％的热固性树脂、10％～30％的光敏树脂、1％～5％的光敏剂、5％～15％的热固化剂、5％～10％的导电粒子、1％～10％的流平剂及1％～10％的增塑剂，热固性树脂选自环氧树脂、不饱和聚酯树脂、酚醛树脂及氨基树脂中的至少一种，光敏树脂选自环氧丙烯酸树脂、聚酯丙烯酸树脂、聚醚丙烯酸树脂、纯丙烯酸树脂及乙烯基树脂中的至少一种，光敏剂选自2,4,6-二苯基氧化膦、 2,4,6-三甲基苯甲酰基膦酸乙酯、2-甲基-1-[4-甲硫基苯基]-2-吗啉基-1-丙酮、2-异丙基硫杂蒽酮、4-二甲氨基-苯甲酸乙酯、1-羟基-环已基-苯基甲酮、2-羟基-2-甲基-1-苯基-1-丙酮、安息香双甲醚、邻苯甲酰苯甲酸甲酯、4-氯二苯甲酮及4-苯基二笨甲酮中的至少一种，热固化剂选自乙烯基三胺、二氨基环己烷、亚甲基双环己烷胺、异佛尔酮二胺、四乙烯五胺、已二胺加合物、三甲基已二胺、间苯二甲胺、二氨基二苯基甲烷、苯二甲胺三聚体、酰胺基胺类及双氰胺中的至少一种，流平剂选自聚二甲基硅氧烷、聚醚聚酯改性有机硅氧烷、端基改性有机硅及烷基改性有机硅氧烷中的至少一种，增塑剂选自苯二甲酸酯类、苯多酸酯类、苯甲酸酯类及多元醇酯类中的至少一种。采用此配方的粘合组合物能够在更低的温度下压合和更低的光能量下光固化即可具有良好的粘着性而实现bonding，更有利于减小待粘接元件的热膨胀效应，进而更有利于提高bonding良率。
在其中一个实施例中，粘合组合物为膏状或薄膜状。
需要说明的是，当粘合组合物包括导电粒子时，导电粒子均匀分布于粘合组合物中。
上述粘合组合物至少具有如下优点：
(1)上述粘合组合物中热固性树脂、光敏树脂与光敏剂协同作用，使得粘合组合物能够通过低温压合和光固化而具有良好的粘着性，实现bonding，同时在使用过程中采用低温压合有利于减小待粘接元件的热膨胀效应。经试验验证，采用上述粘合组合物粘接COF(Chip On Film，又称覆晶薄膜)和玻璃基板时能够于130℃以下进行压合，粘合后的粘着力为800N/m～1500N/m，采用上述粘合组合物进行粘接的玻璃基板的热膨胀比例比对传统的ACF进行粘接降低了0.02％。
(2)上述粘合组合物通过低温压合加UV固化即可具有良好的粘着性，能够避免因高温导致待粘接元件热膨胀较大而降低bonding良率，还能够避免过高温度的热制程的应力残留引起待粘接元件发生卷曲等热变形，进而保证待粘接元件的正常运行。
(3)上述粘合组合物包括导电粒子，使得该粘合组合物能够单向导电，上述粘合组合物能够作为一种异方性导电胶，用于待粘接元件的粘接和电连接。
上述实施方式的粘合组合物的制备方法，包括如下操作S110～S130：
S110、将热固性树脂与光敏树脂加热熔化，得到混合物。
在其中一个实施例中，加热熔化的温度为150℃～200℃。
S120、向混合物中加入光敏剂并混匀，得到混匀物。
在其一个实施例中，S110之后，在S120之前，还包括冷却混合物的操 作。具体地，将混合物冷却至80℃以下。
在其中一个实施例中，粘合组合物还包括热固化剂。当粘合组合物包括热固化剂时，S120具体为：向混合物中加入光敏剂和热固化剂并混匀，得到混匀物。
在其中一个实施例中，粘合组合物还包括导电粒子。当粘合组合物包括导电粒子时，S120具体为：向混合物中加入光敏剂和导电粒子并混匀，得到混匀物。
在其中一个实施例中，粘合组合物还包括辅助组分。当粘合组合物包括辅助组分时，S120具体为：向混合物中加入光敏剂和辅助组分并混匀，得到混匀物。
在其中一个实施例中，粘合组合物还包括热固化剂、导电粒子和辅助组分。当粘合组合物包括辅助组分时，S120具体为：向混合物中加入光敏剂、热固化剂、导电粒子和辅助组分并混匀，得到混匀物。
S130、将混匀物进行成膜处理，得到粘合组合物。
在其中一个实施例中，S130具体为：将混匀物涂布于基材上，固化成膜，得到粘合组合物。进一步地，固化成膜的方式为紫外光固化。具体地，固化过程中，紫外光波长为200nm～400nm，紫外光能量为500mJ～3000mJ，固化时间为1s～6s。
在其中一个实施例中，粘合组合物的厚度为10μm～100μm。
需要说明的是，如果需要得到膏状的粘合组合物，则S130可以省略，S120得到的混匀物即为膏状的粘合组合物。
上述实施方式的粘合组合物的制备方法操作简单，能够得到的粘合组合物于低温压合和光固化即能够具有良好的粘着性。
如图1和图2所示，一实施方式的电子产品100的制备方法，包括如下操作S210～S230：
S210、将粘合组合物110夹持于第一元件120与第二元件130之间，得到待处理物。
在其中一个实施例中，粘合组合物110为膏状或薄膜状。
当粘合组合物110为薄膜状时，S210具体为：将粘合组合物110设置于第一元件120与第二元件130中的一个上，将第一元件120与第二元件130中的另一个设置于粘合组合物110远离第一元件120与第二元件130中的一个上，以使粘合组合物110夹持于第一元件120与第二元件130之间，得到待处理物。
当粘合组合物110为膏状时，可以将上述粘合组合物110夹持于第一元件120与第二元件130之间，经固化处理以使粘合组合物110固化，得到待 处理物；也可以将粘合组合物110再夹持于第一元件120与第二元件130之间；还可以将粘合组合物110涂覆于第一元件120与第二元件130中的一个上并固化后，再将第一元件120及第二元件130中的另一个设置于粘合组合物110上，以使粘合组合物110夹持于第一元件120与第二元件130之间。
在图示实施方式中，粘合组合物110为薄膜。粘合组合物110含有导电粒子112。导电粒子112均匀分布于粘合组合物110中。
在其中一个实施例中，第一元件120为玻璃板、COF或FPC。需要说明的是，第一元件120不限于上述指出元件，可以为其他元件，例如可以是COB。在图示实施方式中，第一元件120为玻璃板。第一元件120设有第一电极122。第一电极122为多个，多个第一电极122间隔设置于第一元件120的一个表面上。
在其中一个实施例中，第二元件130为玻璃板、COF或FPC。需要说明的是，第二元件130不限于上述指出元件，可以为其他元件，例如可以是COB。在图示实施方式中，第二元件130为COF。第二元件130设有第二电极132。第二电极132为多个，多个第二电极132间隔设置于第二元件130靠近第一元件130的一个表面上。多个第二电极132的位置分别与多个第一电极122的位置相对，以使一个第二电极132对应于一个第一电极122。
S220、对待处理物进行加热加压处理。
在其中一个实施例中，加热温度小于或等于130℃。压力为2MPa～8MPa。加热加压处理的时间为2s～6s。进一步地，加热温度100℃～130℃。压力为4MPa～6MPa。加热加压处理的时间为3s～5s。
进一步地，S220具体为：从第二元件130远离第一元件120的一侧施加压力和提供热量，以对待处理物进行加热加压处理。此种设置，以防止第一元件120受到高温和高压产生变形或破碎等。
在图示实施方式中，在第二元件130远离第一元件120的一侧覆盖缓冲层140，通过加压工具150按压缓冲层140，同时从第二元件130远离第一元件120的一侧提供热量，以对待处理物进行加热加压处理。其中，图1中的箭头(1-1)所指的方向即为加热加压的方向。其中，缓冲层140为硅胶缓冲层或聚四氟乙烯缓冲层。通过设置缓冲层140能够避免直接对第二元件130加压而导致第二元件130破碎或损伤，以影响电子产品100的正常使用。
进一步地，在加热加压处理的过程中，导电粒子112能够夹持于第一电极122与第二电极132之间，以电连接第一电极122和第二电极132。
S230、采用紫外光照射加热加压处理后的待处理物，得到电子产品100。
在其中一个实施例中，紫外光波长为200nm～400nm。紫外光的累计能量500mJ～3000mJ。紫外光照射的时间为1s～6s。
在图示实施例中，紫外光从第一元件120远离第二元件130的一侧射入待处理物中，以使粘合组合物110固化。其中，图1中的箭头(1-2)所指的方向即为紫外光射入的方向。此种设置，有利于增加紫外光的透过率，加速粘合组合物110固化。需要说明的是，紫外光不限于从上述方向设置，紫外光也可以从第二元件130远离第一元件120的一侧射入。
上述电子产品100的制备方法，通过粘合组合物110粘接第一元件120和第二元件130，于采用低温压合和紫外光固化，使得第一元件120与第二元件130连接稳定可靠，减小第一元件120与第二元件130的热膨胀效应，能够避免过高温度的热制程的应力残留引起第一元件120与第二元件130发生卷曲等热变形，以保证电子产品100的正常运行。上述制备方法得到的电子产品100具有较强的抗拉强度、bonding良率较高。
需要说明的是，不限于先对待处理物进行加热加压处理再进行紫外光照射处理，也可以先对待处理物进行紫外光照射处理再进行加热加压处理。
请一并参阅图3，另一实施方式的电子产品200的制备方法，包括如下步骤S310～S320：
S310、将上述粘合组合物210夹持于第一元件220与第二元件230之间，得到待处理物。
在其中一个实施例中，粘合组合物210为膏状或薄膜状。
当粘合组合物210为薄膜状时，S310具体为：将粘合组合物210设置于第一元件220与第二元件230中的一个上，将第一元件220与第二元件230中的另一个设置于粘合组合物210远离第一元件220与第二元件230中的一个上，以使粘合组合物210夹持于第一元件220与第二元件230之间，得到待处理物。
当粘合组合物210为膏状时，可以将上述粘合组合物210夹持于第一元件220与第二元件230之间，经固化处理以使粘合组合物210固化，得到待处理物；也可以将粘合组合物210再夹持于第一元件220与第二元件230之间；还可以将粘合组合物210涂覆于第一元件220与第二元件230中的一个上并固化后，再将第一元件220及第二元件230中的另一个设置于粘合组合物210上，以使粘合组合物210夹持于第一元件220与第二元件230之间。
在图示实施方式中，粘合组合物210为薄膜。粘合组合物210含有导电粒子212。导电粒子212均匀分布于粘合组合物210中。
在其中一个实施例中，第一元件220为玻璃板、COF或FPC。需要说明的是，第一元件220不限于上述指出元件，可以为其他元件，例如可以是COB。在图示实施方式中，第一元件220为玻璃板。第一元件220设有第一电极222。第一电极222为多个，多个第一电极222间隔设置于第一元件220的一个表 面上。
在其中一个实施例中，第二元件230为玻璃板、COF或FPC。需要说明的是，第二元件230不限于上述指出元件，可以为其他元件，例如可以是COB。在图示实施方式中，第二元件230为COF。第二元件230设有第二电极232。第二电极232为多个，多个第二电极232间隔设置于第二元件230靠近第一元件230的一个表面上。多个第二电极232的位置分别与多个第一电极222的位置相对，以使一个第二电极232对应一个第一电极222。
S320、采用紫外光照射待处理物，并且对待处理物进行加热加压处理，得到电子产品200。
在其中一个实施例中，加热温度小于或等于130℃。压力为2MPa～8MPa。加热加压处理的时间为2s～6s。紫外光波长为200nm～400nm。紫外光的累计能量500mJ～3000mJ。紫外光照射的时间为2s～6s。进一步地，加热温度100℃～130℃。压力为4MPa～6MPa。加热加压处理的时间为3s～5s。紫外光波长为230nm～380nm。紫外光的累计能量1000mJ～2000mJ。紫外光照射的时间为3s～5s。
进一步地，S320具体为：从第二元件230远离第一元件220的一侧施加压力和提供热量，紫外光从第一元件220远离第二元件230的一侧射入待处理物中，以对粘合组合物210进而加热加压处理和紫外光照射，以使粘合组合物210固化。
在图示实施例中，从第二元件230远离第一元件220的一侧施加压力和提供热量的操作具体为：在第二元件230远离第一元件220的一侧覆盖缓冲层240，通过加压工具250按压缓冲层240，同时从第二元件230远离第一元件210的一侧提供热量，以对待处理物进行加热加压处理。图3中的箭头(2-1)所指的方向即为加热加压的方向，箭头(2-2)所指的方向即为紫外光射入的方向。
通过设置缓冲层140能够避免直接对第二元件130加压而导致第二元件130破碎或损伤，以影响电子产品100的正常使用。需要说明的是，紫外光不限于从上述方向设置，紫外光也可以从第二元件230远离第一元件220的一侧射入。
进一步地，在加热加压处理的过程中，导电粒子212能够夹持于第一电极222、第二电极232之间，以电连接第一电极222和第二电极232。
上述电子产品200的制备方法，操作简单，通过粘合组合物210粘接第一元件220和第二元件230，于采用低温压合和紫外光固化，使得第一元件220与第二元件230连接稳定可靠，减小第一元件220与第二元件230的热膨胀效应，能够避免过高温度的热制程的应力残留引起待粘接元件发生卷曲 等热变形，以保证电子产品200的正常运行。上述制备方法得到的电子产品200具有较强的抗拉强度、bonding良率较高。
一实施方式的电子产品，由上述电子产品的制备方法制备得到。
在其中一个实施例中，电子产品为显示屏、压电晶体、晶振、谐振器、太阳能电池、光伏电池、蜂鸣器或半导体分立器件等。
上述电子产品具有较强的抗拉强度、bonding良率较高、运行寿命长。
以下为具体实施例部分。
以下实施例中，如未特别说明，“份”均指重量份数。
以下实施例中，如无特别说明，导电粒子均为购于积水化学工业株式会社公司的导电金球。聚氨酯丙烯酸树脂为德国拜耳公司的货号为德士模都D-100的聚氨酯丙烯酸树脂。聚酯丙烯酸树脂为中国厚鼎化工公司的货号为HD-220的聚酯丙烯酸树脂。
实施例1
本实施例中，以重量份数计，粘合组合物的原料包括20份的环氧树脂、10份的环氧丙烯酸树脂、1份的2,4,6-二苯基氧化膦。本实施例的粘合组合物为薄膜，粘合组合物的厚度为100μm。
本实施的电子产品的制备过程如下：
(1)将粘合组合物夹持于第一元件与第二元件之间，得到待处理物；其中，第一元件为玻璃板，第二元件为COF。
(2)从第二元件远离第一元件的一侧施加压力和提供热量，以对待处理物进行加热加压处理；其中，加热温度为100℃，压力为2MPa，加热加压处理的时间为2s。
(3)紫外光从第一元件远离第二元件的一侧射入待处理物中，以使粘合组合物固化，得到电子产品；其中，紫外光波长为200nm，紫外光的累计能量500mJ，紫外光照射的时间为1s。
实施例2
本实施例中，以重量份数计，粘合组合物的原料包括40份的环氧树脂、30份的环氧丙烯酸树脂、5份的2,4,6-三甲基苯甲酰基膦酸乙酯。本实施例的粘合组合物为薄膜，粘合组合物的厚度为14μm。
本实施的电子产品的制备过程如下：
(1)将粘合组合物夹持于第一元件与第二元件之间，得到待处理物；其中，第一元件为玻璃板，第二元件为COF。
(2)从第二元件远离第一元件的一侧施加压力和提供热量，以对待处理物进行加热加压处理；其中，加热温度为130℃，压力为8MPa，加热加压处 理的时间为6s。
(3)紫外光从第一元件远离第二元件的一侧射入待处理物中，以使粘合组合物固化，得到电子产品；其中，紫外光波长为400nm，紫外光的累计能量3000mJ，紫外光照射的时间为6s。
实施例3
本实施例中，以重量份数计，粘合组合物的原料包括30份的环氧树脂、20份的环氧丙烯酸树脂及3.5份的4-二甲氨基-苯甲酸乙酯。本实施例的粘合组合物为薄膜，粘合组合物的厚度为50μm。
本实施的电子产品的制备过程如下：
(1)将粘合组合物夹持于第一元件与第二元件之间，得到待处理物；其中，第一元件为玻璃板，第二元件为COF。
(2)从第二元件远离第一元件的一侧施加压力和提供热量，以对待处理物进行加热加压处理；其中，加热温度为115℃，压力为5MPa，加热加压处理的时间为3s。
(3)紫外光从第一元件远离第二元件的一侧射入待处理物中，以使粘合组合物固化，得到电子产品；其中，紫外光波长为300nm，紫外光的累计能量1500mJ，紫外光照射的时间为3s。
实施例4
本实施例中，以重量份数计，粘合组合物的原料包括30份的环氧树脂、20份的环氧丙烯酸树脂、1.5份的2,4,6-二苯基氧化膦及2份的4-二甲氨基-苯甲酸乙酯。本实施例的粘合组合物为薄膜，粘合组合物的厚度为50μm。
本实施的电子产品的制备过程与实施例3的制备过程相同。
实施例5
本实施例中，以重量份数计，粘合组合物的原料包括30份的环氧树脂、20份的环氧丙烯酸树脂、1.5份的2,4,6-二苯基氧化膦及2份的4-二甲氨基-苯甲酸乙酯。本实施例的粘合组合物为薄膜，粘合组合物的厚度为50μm。
本实施的电子产品的制备过程如下：
(1)将粘合组合物夹持于第一元件与第二元件之间，得到待处理物；其中，第一元件为玻璃板，第二元件为COF。
(2)从第二元件远离第一元件的一侧向待处理物施加压力和提供热量，同时紫外光从第一元件远离第二元件的一侧射入待处理物中，以对待处理物同时进行加热加压和紫外光照射，得到电子产品；其中，加热温度为115℃，压力为5MPa，紫外光波长为300nm，紫外光的累计能量1500mJ，处理的时间为3s。
实施例6
本实施例中，以重量份数计，粘合组合物的原料包括20份的环氧树脂、10份的环氧丙烯酸树脂、1份的2,4,6-二苯基氧化膦、5份的乙烯基三胺、5份的导电粒子、2份的聚醚聚酯改性有机硅氧烷及3份的苯二甲酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为100μm。
本实施的电子产品的制备过程如下：
(1)将粘合组合物夹持于第一元件与第二元件之间，得到待处理物；其中，第一元件为玻璃板，第二元件为COF。
(2)从第二元件远离第一元件的一侧向待处理物施加压力和提供热量，同时紫外光从第一元件远离第二元件的一侧射入待处理物中，以对待处理物同时进行加热加压和紫外光照射，得到电子产品；其中，加热温度为100℃，压力为2MPa，紫外光波长为200nm，紫外光的累计能量500mJ，处理的时间为1s。
实施例7
本实施例中，以重量份数计，粘合组合物的原料包括40份的环氧树脂、30份的环氧丙烯酸树脂、5份的2,4,6-三甲基苯甲酰基膦酸乙酯、15份的亚甲基双环己烷胺、10份的导电粒子、5份的聚二甲基硅氧烷及5份的苯甲酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为14μm。
本实施的电子产品的制备过程如下：
(1)将粘合组合物夹持于第一元件与第二元件之间，得到待处理物；其中，第一元件为玻璃板，第二元件为COF。
(2)从第二元件远离第一元件的一侧向待处理物施加压力和提供热量，同时紫外光从第一元件远离第二元件的一侧射入待处理物中，以对待处理物同时进行加热加压和紫外光照射，得到电子产品；其中，加热温度为130℃，压力为6MPa，紫外光波长为380nm，紫外光的累计能量2000mJ，处理的时间为5s。
实施例8
本实施例中，以重量份数计，粘合组合物的原料包括30份的环氧树脂、20份的环氧丙烯酸树脂、1.5份的2,4,6-二苯基氧化膦、2份的4-二甲氨基-苯甲酸乙酯、10份的三甲基已二胺、7.5份的导电粒子、3份的烷基改性有机硅氧烷及3.5份的苯多酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为50μm。
本实施的电子产品的制备过程如下：
(1)将粘合组合物夹持于第一元件与第二元件之间，得到待处理物；其中，第一元件为玻璃板，第二元件为COF。
(2)从第二元件远离第一元件的一侧向待处理物施加压力和提供热量， 同时紫外光从第一元件远离第二元件的一侧射入待处理物中，以对待处理物同时进行加热加压和紫外光照射，得到电子产品；其中，加热温度为115℃，压力为5MPa，紫外光波长为300nm，紫外光的累计能量1500mJ，处理的时间为3s。
实施例9
本实施例中，以质量百分含量计，粘合组合物的原料包括35％的环氧树脂、25％的环氧丙烯酸树脂、2％的2,4,6-二苯基氧化膦、2％的4-二甲氨基-苯甲酸乙酯、9％的三甲基已二胺、9％的导电粒子、4％的烷基改性有机硅氧烷及4％的苯多酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为50μm。本实施的电子产品的制备过程与实施例8相同。
实施例10
本实施例中，以重量份数计，粘合组合物的原料包括30份的环氧树脂、10份的环氧丙烯酸树脂、1份的2,4,6-二苯基氧化膦、5份的乙烯基三胺、5份的导电粒子、2份的聚醚聚酯改性有机硅氧烷及3份的苯二甲酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为100μm。
本实施的电子产品的制备过程与实施例6的电子产品的制备过程相同。
实施例11
本实施例中，以重量份数计，粘合组合物的原料包括20份的环氧树脂、30份的环氧丙烯酸树脂、5份的2,4,6-三甲基苯甲酰基膦酸乙酯、15份的亚甲基双环己烷胺、10份的导电粒子、5份的聚二甲基硅氧烷及5份的苯甲酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为14μm。
本实施的电子产品的制备过程与实施例7的电子产品的制备过程相同。
实施例12
本实施例中，以重量份数计，粘合组合物的原料包括20份的环氧树脂、12份的环氧丙烯酸树脂、1份的2,4,6-二苯基氧化膦、5份的乙烯基三胺、5份的导电粒子、2份的聚醚聚酯改性有机硅氧烷及3份的苯二甲酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为100μm。
本实施的电子产品的制备过程与实施例6的电子产品的制备过程相同。
实施例13
本实施例中，以重量份数计，粘合组合物的原料包括40份的环氧树脂、25份的环氧丙烯酸树脂、5份的2,4,6-三甲基苯甲酰基膦酸乙酯、15份的亚甲基双环己烷胺、10份的导电粒子、5份的聚二甲基硅氧烷及5份的苯甲酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为14μm。
本实施的电子产品的制备过程与实施例7的电子产品的制备过程相同。
实施例14
本实施例中，以重量份数计，粘合组合物的原料包括20份的环氧树脂、10份的环氧丙烯酸树脂、1份的2,4,6-二苯基氧化膦、4份的乙烯基三胺、5份的导电粒子、2份的聚醚聚酯改性有机硅氧烷及3份的苯二甲酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为100μm。
本实施的电子产品的制备过程与实施例6的电子产品的制备过程相同。
实施例15
本实施例中，以重量份数计，粘合组合物的原料包括35份的环氧树脂、30份的环氧丙烯酸树脂、5份的2,4,6-三甲基苯甲酰基膦酸乙酯、15份的亚甲基双环己烷胺、10份的导电粒子、5份的聚二甲基硅氧烷及5份的苯甲酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为14μm。
本实施的电子产品的制备过程与实施例7的电子产品的制备过程相同。
实施例16
本实施例中，以重量份数计，粘合组合物的原料包括30份的不饱和聚酯树脂、20份的环氧丙烯酸树脂及3.5份的4-二甲氨基-苯甲酸乙酯。本实施例的粘合组合物为薄膜，粘合组合物的厚度为50μm。本实施的电子产品的制备过程与实施例3的相同。
实施例17
本实施例中，以重量份数计，粘合组合物的原料包括30份的环氧树脂、20份的纯丙烯酸树脂及3.5份的4-二甲氨基-苯甲酸乙酯。本实施例的粘合组合物为薄膜，粘合组合物的厚度为50μm。本实施的电子产品的制备过程与实施例3的相同。
实施例18
本实施例中，以重量份数计，粘合组合物的原料包括30份的环氧树脂、20份的环氧丙烯酸树脂及3.5份的1-羟基-环已基-苯基甲酮。本实施例的粘合组合物为薄膜，粘合组合物的厚度为50μm。本实施的电子产品的制备过程与实施例3的相同。
实施例19
本实施例中，以重量份数计，粘合组合物的原料包括30份的环氧树脂、7.5份的导电粒子、3份的烷基改性有机硅氧烷及3.5份的苯多酸酯类增塑剂。本实施例的粘合组合物为薄膜，粘合组合物的厚度为50μm。
本实施的电子产品的制备过程如下：
(1)将粘合组合物夹持于第一元件与第二元件之间，得到待处理物；其中，第一元件为玻璃板，第二元件为COF。
(2)从第二元件远离第一元件的一侧向待处理物施加压力和提供热量，同时紫外光从第一元件远离第二元件的一侧射入待处理物中，以对待处理物 同时进行加热加压和紫外光照射，得到电子产品；其中，加热温度为115℃，压力为5MPa，处理的时间为3s。
实施例20
本实施例中的粘合组合物与实施例19的相同。
本实施的电子产品的制备过程与实施例19的大致相同，不同之处在于，加热温度为140℃。
实施例21
本实施例中，以质量百分含量计，粘合组合物的原料包括4.5％乙氧化双酚A二甲基丙烯酸酯、23.5％的四酚基乙烷四缩水甘油醚环氧树脂、6％的聚丙二醇缩水甘油醚、4％的导电金球、3％的环氧基苯乙酮、16％的双氰胺衍生物及0.5％的聚二甲基硅氧烷。
本实施的电子产品的制备过程与实施例8相同。
实施例22
本实施例中的粘合组合物为日立化成(Hitachi)公司的1800系列的ACF胶。
本实施的电子产品的制备过程与实施例19相同。
测试：
测定实施例1～22的电子产品的粘着力、电子产品的第一元件的热膨胀比例及电子产品的平整度。测定结果详见表1。表1表示的是实施例1～22的电子产品的粘着力、电子产品的第一元件的热膨胀比例及电子产品的平整度。
其中，采用拉力试验机测试电子产品的黏着力；
通过测定第一元件的厚度变化，以体现第一元件的热膨胀比例；具体地，测定第一元件在制备电子产品之前的厚度与制备成电子产品后的厚度，采用两者的差值除以在制备电子产品之前的厚度并乘以100％，得到热膨胀比例；
通过观察电子产品的第一元件与第二元件是否出现卷曲等变形问题，以测试电子产品的平整度；判断标准为：第一元件与第二元件中的一个变形即为不平整(即为否)，第一元件与第二元件均未变形则为平整(即为是)。
表1
  粘着力(N/m) 热膨胀比例(％) 平整度(是/否)
实施例1 750 0.049 是
实施例2 800 0.052 是
实施例3 900 0.046 是
实施例4 920 0.044 是
实施例5 930 0.046 是
实施例6 950 0.049 是
实施例7 980 0.052 是
实施例8 1000 0.046 是
实施例9 1200 0.046 是
实施例10 900 0.04 是
实施例11 920 0.052 是
实施例12 880 0.04 是
实施例13 940 0.052 是
实施例14 935 0.04 是
实施例15 950 0.052 是
实施例16 870 0.046 是
实施例17 850 0.046 是
实施例18 845 0.046 是
实施例19 950 0.046 是
实施例20 1050 0.056 是
实施例21 900 0.068 是
实施例22 800 0.072 是
从表1可以看出，实施例1～9的电子产品的粘着力为750N/m～1200N/m，至少与实施例22的市售ACF胶的粘着力相当，实施例1～9的电子产品的第一元件的热膨胀比例为0.044％～0.052％，比实施例22的市售ACF胶的热膨胀比例降低至少0.02％，说明上述粘合组合物具有较好的粘着性，且使用该粘合组合物进行粘接能够减少待粘接元件的热膨胀。实施例8的电子产品的热膨胀比例与实施例19相当，但实施例8的电子产品的粘着力高于实施例19，说明实施例8的粘合组合物更有利于增加电子产品的粘着力。实施例20的电子产品的粘着力略优于实施例8，但实施例20的电子产品的热膨胀比例高于实施例8，说明虽然提供稳定能够增加实施例20的电子产品的粘着力， 但是也会增加电子产品的热膨胀，进而说明实施例8的粘合组合物更有利于增加电子产品的粘着力且降低电子产品的热膨胀比例。
需要说明的是，本方案中涉及到的各步骤的限定，在不影响具体方案实施的前提下，并不认定为对步骤先后顺序做出限定，写在前面的步骤可以是在先执行的，也可以是在后执行的，甚至也可以是同时执行的，只要能实施本方案，都应当视为属于本申请的保护范围。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种粘合组合物，以重量份数计，所述粘合组合物的原料包括：
    热固性树脂  20份～40份；
    光敏树脂    10份～30份；及
    光敏剂      1份～5份；
    其中，所述热固性树脂选自环氧树脂、不饱和聚酯树脂、酚醛树脂及氨基树脂中的至少一种，所述光敏树脂选自环氧丙烯酸树脂、聚氨酯丙烯酸树脂、聚酯丙烯酸树脂、聚醚丙烯酸树脂、纯丙烯酸树脂及乙烯基树脂中的至少一种，所述光敏剂选自2,4,6-二苯基氧化膦、2,4,6-三甲基苯甲酰基膦酸乙酯、2-甲基-1-[4-甲硫基苯基]-2-吗啉基-1-丙酮、2-异丙基硫杂蒽酮、4-二甲氨基-苯甲酸乙酯、1-羟基-环已基-苯基甲酮、2-羟基-2-甲基-1-苯基-1-丙酮、安息香双甲醚、邻苯甲酰苯甲酸甲酯、4-氯二苯甲酮及4-苯基二笨甲酮中的至少一种。
  2. 根据权利要求1所述的粘合组合物，其中，以重量份数计，所述粘合组合物的原料包括20份～40份的环氧树脂、10份～30份的环氧丙烯酸树脂、1份～4份的2,4,6-二苯基氧化膦及1份～4份的4-二甲氨基-苯甲酸乙酯。
  3. 根据权利要求1所述的粘合组合物，其中，所述热固化树脂与所述光敏树脂的质量比为2:3～4:1。
  4. 根据权利要求1所述的粘合组合物，其中，所述光敏树脂与所述光敏剂的质量比为2～30。
  5. 根据权利要求1所述的粘合组合物，其中，以重量份数计，所述粘合组合物的原料还包括5份～15份的热固化剂。
  6. 根据权利要求5所述的粘合组合物，其中，所述热固化剂选自乙烯基三胺、二氨基环己烷、亚甲基双环己烷胺、异佛尔酮二胺、四乙烯五胺、已二胺加合物、三甲基已二胺、间苯二甲胺、二氨基二苯基甲烷、苯二甲胺三聚体、酰胺基胺类及双氰胺中的至少一种。
  7. 根据权利要求5所述的粘合组合物，其中，所述热固化树脂与所述热固化剂的质量比为1.5～8。
  8. 根据权利要求1所述的粘合组合物，其中，以重量份数计，所述粘合组合物的原料还包括5份～10份的导电粒子。
  9. 根据权利要求8所述的粘合组合物，其中，所述导电粒子为导电金球。
  10. 根据权利要求1所述的粘合组合物，其中，以重量份数计，所述粘合组合物的原料还包括5份～10份的辅助组分，所述辅助组分选自流平剂及增塑剂中的至少一种。
  11. 根据权利要求10所述的粘合组合物，其中，以重量份数计，所述辅 助组分包括1份～10份的流平剂及1份～10份的增塑剂。
  12. 根据权利要求10所述的粘合组合物，其中，所述流平剂选自聚二甲基硅氧烷、聚醚聚酯改性有机硅氧烷、端基改性有机硅及烷基改性有机硅氧烷中的至少一种。
  13. 根据权利要求10所述的粘合组合物，其中，所述增塑剂选自苯二甲酸酯类、苯多酸酯类、苯甲酸酯类及多元醇酯类中的至少一种。
  14. 根据权利要求1所述的粘合组合物，其中，以质量百分含量计，所述粘合组合物的原料包括20％～40％的热固性树脂、10％～30％的光敏树脂、1％～5％的光敏剂、5％～15％的热固化剂、5％～10％的导电粒子、1％～10％的流平剂及1％～10％的增塑剂，所述热固性树脂选自环氧树脂、不饱和聚酯树脂、酚醛树脂及氨基树脂中的至少一种，所述光敏树脂选自环氧丙烯酸树脂、聚酯丙烯酸树脂、聚醚丙烯酸树脂、纯丙烯酸树脂及乙烯基树脂中的至少一种，所述光敏剂选自2,4,6-二苯基氧化膦、2,4,6-三甲基苯甲酰基膦酸乙酯、2-甲基-1-[4-甲硫基苯基]-2-吗啉基-1-丙酮、2-异丙基硫杂蒽酮、4-二甲氨基-苯甲酸乙酯、1-羟基-环已基-苯基甲酮、2-羟基-2-甲基-1-苯基-1-丙酮、安息香双甲醚、邻苯甲酰苯甲酸甲酯、4-氯二苯甲酮及4-苯基二笨甲酮中的至少一种，所述热固化剂选自乙烯基三胺、二氨基环己烷、亚甲基双环己烷胺、异佛尔酮二胺、四乙烯五胺、已二胺加合物、三甲基已二胺、间苯二甲胺、二氨基二苯基甲烷、苯二甲胺三聚体、酰胺基胺类及双氰胺中的至少一种，所述流平剂选自聚二甲基硅氧烷、聚醚聚酯改性有机硅氧烷、端基改性有机硅及烷基改性有机硅氧烷中的至少一种，所述增塑剂选自苯二甲酸酯类、苯多酸酯类、苯甲酸酯类及多元醇酯类中的至少一种。
  15. 一种电子产品的制备方法，包括如下步骤：
    将权利要求1所述的粘合组合物夹持于第一元件与第二元件之间，得到待处理物；
    对所述待处理物进行加热加压和紫外光照射处理，得到电子产品。
  16. 根据权利要求15所述的电子产品的制备方法，其中，所述对所述待处理物进行加热加压和紫外光照射处理，得到电子产品的步骤具体为：
    对所述待处理物进行加热加压处理；及
    采用紫外光照射加热加压处理后的所述待处理物，得到电子产品。
  17. 根据权利要求15所述的电子产品的制备方法，其中，所述对所述待处理物进行加热加压和紫外光照射处理，得到电子产品的步骤具体为：
    采用紫外光照射所述待处理物，并且对所述待处理物进行加热加压处理，得到电子产品。
  18. 根据权利要求15所述的电子产品的制备方法，其中，所述紫外光的 波长为200nm～400nm，所述紫外光的能量为500mJ～3000mJ。
  19. 根据权利要求15所述的电子产品的制备方法，其中，加热温度小于或等于130℃，压力为2MPa～8MPa。
  20. 一种电子产品，由权利要求1所述的电子产品的制备方法制备得到。
PCT/CN2018/120784 2018-11-23 2018-12-13 粘合组合物、电子产品及其制备方法 WO2020103228A1 (zh)

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