WO2020103223A1 - 电路板以及电路板的制作方法 - Google Patents

电路板以及电路板的制作方法

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Publication number
WO2020103223A1
WO2020103223A1 PCT/CN2018/120490 CN2018120490W WO2020103223A1 WO 2020103223 A1 WO2020103223 A1 WO 2020103223A1 CN 2018120490 W CN2018120490 W CN 2018120490W WO 2020103223 A1 WO2020103223 A1 WO 2020103223A1
Authority
WO
WIPO (PCT)
Prior art keywords
fixed
circuit board
connector
pad
size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/120490
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English (en)
French (fr)
Inventor
何怀亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Original Assignee
HKC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HKC Co Ltd filed Critical HKC Co Ltd
Publication of WO2020103223A1 publication Critical patent/WO2020103223A1/zh
Priority to US17/035,802 priority Critical patent/US11490507B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of display technology, in particular to a circuit board and a method for manufacturing the circuit board.
  • Flat panel displays have become the mainstream products of the display due to the hot spots such as thin body, power saving and low radiation, which have been widely used.
  • Flat panel displays include thin film transistor liquid crystal displays (Thin Film Transistor-Liquid Crystal Display, TFT-LCD).
  • TFT-LCD Thi Film Transistor-Liquid Crystal Display
  • the thin film transistor liquid crystal display controls the rotation direction of the liquid crystal molecules to refract the light of the backlight module to generate a picture, which has many advantages such as thin body, power saving, no radiation and so on.
  • the application provides a circuit board and a method for manufacturing the circuit board, which improves the compatibility of the circuit board and can reduce the cost.
  • the present application provides a circuit board, including: a signal transmission pin pad, which is set to perform signal transmission with an external connector; a fixed pad, which is set to fix a fixed pin of the connector; The number, position and size of the fixed pads are compatible with similar connectors; the similar connectors are connectors with the same number of signal transmission pins and the same pin spacing.
  • the number of the fixed pads is greater than or equal to the maximum number of the fixed pins of the connectors of the same type.
  • the position of the fixed pad is compatible with all positions of the fixed pin of the connector of the same type.
  • the size of the fixed pad is larger than the maximum size of the fixed pin of the connector of the same type at the same position.
  • the size of the fixed pad is equal to the maximum size of the fixed pin of the same type of connector at the same position.
  • the fixed pad is disposed around the signal transmission pin.
  • the fixed pad includes a plurality of first fixed pads, and the first fixed pads are arranged in parallel with the signal transmission pins.
  • the line at the center of the first fixed pad is parallel to the signal transmission pin, and the spacing between two adjacent first fixed pads is equal.
  • the first fixed pads have the same size and the same shape.
  • the fixed pad includes a plurality of second fixed pads, and the second fixed pads are disposed at corresponding positions on both sides of the signal transmission pin.
  • the size of the second fixed pad is larger than the size of the first fixed pad of the same connector.
  • the size of the second fixed pad is equal to the size of the first fixed pad of the same connector.
  • the present application also discloses a circuit board including: a signal transmission pin pad and a fixed pad; the signal transmission pin pad is set to perform signal transmission with an external connector; the fixed pad is set to fix the connector Fixed pins; the number, position and size of the fixed pads are compatible with similar connectors; the similar connectors are connectors with the same number and spacing of signal transmission pins;
  • the number of the fixed pads is greater than or equal to the maximum number of the fixed pins of the connector of the same type, and the position of the fixed pad is compatible with all positions of the fixed pins of the connector of the same type, the fixed The size of the pad is greater than or equal to the maximum size of the fixed pin of the same type of connector at the same position.
  • the application also discloses a method for manufacturing a circuit board.
  • the circuit board includes: a signal transmission pin pad set to perform signal transmission with an external connector; a fixed pad set to fix the fixed pin of the connector ; The number, position and size of the fixed pads are compatible with similar connectors; the similar connectors are connectors with the same number of signal transmission pins and the same pin spacing;
  • the manufacturing method of the circuit board includes the following steps:
  • the steps of performing compatibility processing on fixed pads of similar connectors include:
  • the number of the fixed pads is greater than or equal to the maximum number of the fixed pins of the connectors of the same type.
  • the position of the fixed pad is compatible with all positions of the fixed pin of the connector of the same type.
  • this application realizes that multiple connectors can use the same circuit board by integrating the compatible connector fixing pads, which can achieve one-to-many and improve the product's Compatibility increases market competitiveness.
  • FIG. 1 is a schematic diagram of a circuit board according to an embodiment of the present application.
  • FIG. 2 is a flowchart of a circuit board manufacturing method according to another embodiment of the present application.
  • FIG. 3 is a flowchart of a circuit board manufacturing method according to another embodiment of the present application.
  • FIG. 4 is a schematic diagram of a circuit board with similar signal transmission pins according to an embodiment of the present application.
  • FIG. 5 is a schematic diagram of another circuit board of the same type of signal transmission pin according to an embodiment of the present application.
  • FIG. 6 is a schematic diagram of another kind of signal transmission pin circuit board of an embodiment of the present application.
  • FIG. 7 is a schematic diagram of another circuit board of the same type of signal transmission pin according to an embodiment of the present application.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more features.
  • the meaning of “plurality” is two or more.
  • the term “comprising” and any variations thereof are intended to cover non-exclusive inclusions.
  • connection should be understood in a broad sense, for example, it can be fixed connection or detachable Connected, or connected integrally; either mechanically or electrically; directly connected, or indirectly connected through an intermediary, or internally connected between two components.
  • installation should be understood in a broad sense, for example, it can be fixed connection or detachable Connected, or connected integrally; either mechanically or electrically; directly connected, or indirectly connected through an intermediary, or internally connected between two components.
  • an embodiment of the present application discloses a circuit board, including: a signal transmission pin pad 100 configured to perform signal transmission with an external connector; a fixed pad 200 configured to fix a fixed connector Pin 300; The number, position and size of the fixed pad 200 are compatible with similar connectors; similar connectors are connectors with the same number of signal transmission pins 300 and the same pitch between the pins.
  • the transmission pin pad 100 is set to perform signal transmission with an external connector.
  • the number of fixed pads 200 is greater than or equal to the maximum number of fixed pins 300 of the same type of connector.
  • each fixed pin 300 has a corresponding fixed pad 200, and the number of fixed pins 300 of similar connectors is also different. We count the number of fixed pins 300 of similar connectors and make these numbers compatible. The number of fixed pads 200 designed to be greater than or equal to the maximum number of fixed pins 300 of similar connectors. This design can cover most similar connectors.
  • the fixed pins 300 on different connectors have corresponding fixed pads 200 on the circuit board because they correspond to them.
  • the position of the fixed pad 200 is compatible with all positions of the fixed pin 300 of the same type of connector.
  • the position of the fixed pin 300 of the same type of connector is not fixed, and the position of the fixed pad 200 is compatible.
  • the position of the fixed pin 300 of different connectors is different.
  • the integration is achieved by adding the fixed pad 200 to achieve the fixed
  • the position of the pad 200 can cover the situation where the positions of the fixed pins 300 of the similar connectors are different.
  • the size of the fixed pad 200 is greater than or equal to the maximum size of the fixed pin 300 of the same connector in the same position.
  • the fixed pad 200 is disposed around the signal transmission pin 100.
  • the circuit board set as the display panel, the fixed pad 200 and the signal transmission pin 100 are distributed around the circuit board, wherein the signal transmission pin 100 is between the fixed pads, and the fixed pad 200 is in the direction of the wire Linearly distributed, there is only one fixed pad 200 at this position in the wire direction.
  • the fixed pad 200 includes a plurality of first fixed pads 220, the first fixed pads 220 are disposed in parallel with the signal transmission pin 100, and the wiring at the center of the first fixed pad 220 and the signal transmission lead The feet 100 are parallel, the spacing between two adjacent first fixed pads 220 is equal, and the shapes of two adjacent first fixed pads 220 are the same.
  • the first fixed pads 220 corresponding to the signal transmission pins 100 are evenly distributed on the circuit board, and the distance between the first fixed pads 220 is equal, so that the interaction between the circuit board and the connector can be made The force distribution is even, protecting the circuit board and increasing the service life of the circuit board.
  • the fixed pad 200 includes a plurality of second fixed pads 210, the second fixed pads 210 are disposed at corresponding positions on both sides of the signal transmission pin 100, and the shape and size of the second fixed pad 210 is greater than or equal to the A fixed pad 210 shape.
  • the signal transmission pin 100 is located in the middle part of the circuit board, and the two sides of the circuit board have more space than the middle part.
  • the size of the second fixed pad 210 is greater than or equal to the size of the first fixed pad 220, which can make full use of the space To deal with the increase in connection type.
  • a circuit board including:
  • the signal transmission pin pad 100 is set to perform signal transmission with an external connector; the fixed pad 200 is set to a fixed pin 300 of the fixed connector; the number, position and size of the fixed pad 200 are compatible with similar connectors; Similar connectors are connectors with the same number and spacing of signal transmission pins 100; the number of fixed pads 200 is greater than or equal to the maximum number of fixed pins of similar connectors, and the position of fixed pads 200 is compatible with the fixed pins of similar connectors In all positions of 300, the size of the fixed pad 200 is greater than or equal to the maximum size of the fixed pin 300 of the same type of connector in the same position.
  • each manufacturer's R & D capabilities and process capabilities are different, the connector structure manufactured by each manufacturer is slightly different.
  • a circuit board packaging diagram to achieve a one-to-many way, compatible with similar connectors, improve product market competitiveness.
  • Each fixed pin 300 has a corresponding fixed pad 200, and the number of fixed pins 300 of similar connectors is also different. We count the number of fixed pins 300 of similar connectors and make these numbers compatible to achieve the design.
  • the number of fixed pads 200 should be greater than or equal to the maximum number of fixed pins 300 of similar connectors. This design can cover most similar connectors.
  • the fixed pins 300 on different connectors have corresponding fixed pads 200 on the circuit board because they correspond to them.
  • the position of the fixed pin 300 of the same type of connector is not fixed, and the position of the fixed pad 200 is compatible.
  • the position of the fixed pin 300 of different connectors is different.
  • By adding the fixed pad 200 to integrate, the fixed pad 200 is fixed The position can cover the situation where the position of the fixed pin 300 of the similar connector is different.
  • the size of the fixed pad 200 is such that the size of the fixed pad 200 is greater than or equal to the maximum size of the fixed pin 300 of the same type of connector at that position.
  • a method for manufacturing a circuit board in which the circuit board includes: a signal transmission pin pad 100, which is configured to perform signals with an external connector Transmission; fixed pad 200, set as fixed pin 300 of fixed connector; the number, position and size of fixed pad 200 are compatible with similar connectors; similar connectors are connections with the same number of signal transmission pins 300 and the same pitch Device.
  • the transmission pin pad 100 is set to perform signal transmission with an external connector;
  • the manufacturing method of the circuit board includes steps:
  • the circuit board set as a connector is redesigned.
  • the number, position and size of the fixed pins of the same type of connector must be counted first.
  • the inventory of different designs of fixed pads of similar connectors is counted Afterwards, the compatibility processing is performed on the fixed pads according to the statistical results, so that the integrated processed fixed pads can be docked with connectors of different designs.
  • the produced circuit board can be set as the connection of similar connectors, which can achieve one-to-many and improve the compatibility of the product.
  • the steps of performing compatibility processing on fixed pads of similar connectors include:
  • S121 Determine the number of fixed pads according to the maximum number of fixed pins of similar connectors
  • S122 Determine the position of the fixed pad according to the position of the fixed pin of the similar connector
  • S123 Determine the size of the fixed pad according to the maximum size of the fixed pin of the similar connector.
  • the S121 / S122 / S123 methods have no sequence, and the three methods are also used together in practice to achieve the best design.
  • the number of fixed pins of similar connectors will also be different.
  • the fixed pads are integrated and compatible according to the number, size and position of the fixed pins.
  • the fixed pad space at the same position does not interfere with the maximum position of the fixed pad according to the position, that is Increase the size of the fixed pad. Spatial interference can increase the number of fixed pads for compatibility. Integration and compatibility of fixed pads can reduce design changes to meet the needs of various customers and improve market competitiveness.
  • the number of fixed pads 200 is greater than or equal to the maximum number of fixed pins 300 of the same type of connector.
  • each fixed pin 300 has a corresponding fixed pad 200, and the number of fixed pins 300 of similar connectors is also different. We count the number of fixed pins 300 of similar connectors and make these numbers compatible. The number of fixed pads 200 designed to be greater than or equal to the maximum number of fixed pins 300 of similar connectors. This design can cover most similar connectors.
  • the fixed pins 300 on different connectors have corresponding fixed pads 200 on the circuit board because they correspond to them.
  • the position of the fixed pad 200 is compatible with all positions of the fixed pin 300 of the same type of connector.
  • the position of the fixed pin 300 of the same type of connector is not fixed, and the position of the fixed pad 200 is compatible.
  • the position of the fixed pin 300 of different connectors is different.
  • the integration is achieved by adding the fixed pad 200 to achieve the fixed
  • the position of the pad 200 can cover the situation where the positions of the fixed pins 300 of the similar connectors are different.
  • TN panel Transmission Nematic, twisted nematic panel
  • IPS panel In-PaneSwitcing, plane conversion
  • VA panel Multi-domain Vertica Alignment, multi-quadrant vertical alignment technology

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路板以及电路板的制作方法，电路板包括信号传输引脚焊盘（100），设置为跟外接的连接器进行信号传输，以及设置为固定所述连接器的固定引脚（300）的固定焊盘（200），所述固定焊盘（200）的数量、位置和尺寸兼容同类连接器，所述同类连接器为信号传输引脚数量和间距相同的连接器；所述固定焊盘（200）的数量大于等于所述同类连接器的所述固定引脚（300）的最大数量。

Description

电路板以及电路板的制作方法
本申请要求于2018年11月21日提交中国专利局，申请号为CN201811389127.1，发明名称为“一种电路板以及电路板的制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种电路板以及电路板的制作方法。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术。
随着科技的发展和进步，平板显示器由于具备机身薄、省电和辐射低等热点而成为显示器的主流产品，得到了广泛应用。平板显示器包括薄膜晶体管液晶显示器(Thin Film Transistor-Liquid Crystal Display，TFT-LCD)。其中，薄膜晶体管液晶显示器通过控制液晶分子的旋转方向，以将背光模组的光线折射出来产生画面，具有机身薄、省电、无辐射等众多优点。
平板显示器产品越来越多样化，每种连接器都有对应的连接器接口电路板。因为每一家连接器厂商研发能力和制程能力都不相同，每家连接器外形结构都有差异。为了满足客户的需求要生产不同的电路板来匹配不同的连接器，造成产品成本增加，产品兼容性不高。
技术解决方案
本申请提供一种电路板以及电路板的制作方法，提高电路板的兼容性并且可以降低成本。
为实现上述目的，本申请提供了一种电路板，包括：信号传输引脚焊盘，设置为跟外接的连接器进行信号传输；固定焊盘，设置为固定所述连接器的固定引脚；所述固定焊盘的数量、位置和尺寸兼容同类连接器；所述同类连接器为信号传输引脚数量和引脚间距相同的连接器。
可选的，所述固定焊盘的数量大于等于所述同类连接器的所述固定引脚的最大数量。
可选的，所述固定焊盘的位置兼容所述同类连接器的所述固定引脚的所有位置。
可选的，所述固定焊盘的尺寸大于同一位置所述同类连接器的所述固定引脚的最大尺寸。
可选的，所述固定焊盘的尺寸等于同一位置所述同类连接器的所述固定引脚的最大尺寸。
可选的，所述固定焊盘环绕所述信号传输引脚设置。
可选的，所述固定焊盘包括多个第一固定焊盘，所述第一固定焊盘与所述信号传输引脚平行设置。
可选的，所述第一固定焊盘中心位置的连线与所述信号传输引脚平行，相邻两个所述第一固定焊盘之间的间距相等。
可选的，所述第一固定焊盘大小相等，形状相同。
可选的，所述固定焊盘包括多个第二固定焊盘，所述第二固定焊盘设置在所述信号传输引脚两侧对应位置。
可选的，所述第二固定焊盘的尺寸大于同一连接器的所述第一固定焊盘的尺寸。
可选的，所述第二固定焊盘的尺寸等于同一连接器的所述第一固定焊盘的尺寸。
本申请还公开了一种电路板，包括：信号传输引脚焊盘和固定焊盘；信号传输引脚焊盘设置为跟外接的连接器进行信号传输；固定焊盘设置为固定所述连接器的固定引脚；所述固定焊盘的数量、位置和尺寸兼容同类连接器；所述同类连接器为信号传输引脚数量和间距相同的连接器；
所述固定焊盘的数量大于等于所述同类连接器的所述固定引脚的最大数量，所述固定焊盘的位置兼容所述同类连接器的所述固定引脚的所有位置，所述固定焊盘的尺寸大于等于同一位置所述同类连接器的所述固定引脚的最大尺寸。
本申请还公布了一种电路板的制作方法，电路板包括：信号传输引脚焊盘，设置为跟外接的连接器进行信号传输；固定焊盘，设置为固定所述连接器的固定引脚；所述固定焊盘的数量、位置和尺寸兼容同类连接器；所述同类连接器为信号传输引脚数量和引脚间距相同的连接器；
所述电路板的制作方法包括步骤：
统计同类连接器固定引脚数量、位置和尺寸；
根据统计结果对同类连接器固定焊盘进行兼容性处理；
制作对应的电路板。
可选的，所述对同类连接器固定焊盘进行兼容性处理的步骤包括：
根据同类连接器固定引脚的最大数量确定固定焊盘的数量；
根据同类连接器固定引脚的位置确定固定焊盘的位置；
根据同类连接器固定引脚的最大尺寸确定固定焊盘的尺寸。
可选的，所述固定焊盘的数量大于等于所述同类连接器的所述固定引脚的最大数量。
可选的，所述固定焊盘的位置兼容所述同类连接器的所述固定引脚的所有位置。
相对于针对不同连接器设计不同电路板的方案来说，本申请通过整合兼容连接器固定焊盘的方式实现多个连接器可以用同一电路板，这样可以做到一对多，提高了产品的兼容性，增加了市场竞争力。
附图说明
所包括的附图用来提供对本申请实施例的理解，其构成了说明书的一部分，进行例示本申请的实施方式，并与文字描述一起来阐释本申请的原理。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。在附图中：
图1是本申请实施例一种电路板的示意图；
图2是本申请另一实施例一种电路板制作方法的流程图；
图3是本申请另一实施例一种电路板制作方法的流程图；
图4是本申请实施例一种同类信号传输引脚电路板的示意图；
图5是本申请实施例另一种同类信号传输引脚电路板的示意图；
图6是本申请实施例另一种同类信号传输引脚电路板的示意图；
图7是本申请实施例另一种同类信号传输引脚电路板的示意图。
具体实施方式
这里所公开的具体结构和功能细节仅仅是代表性的，并且是进行描述本申请的示例性实施例的目的。但是本申请可以通过许多替换形式来具体实现，并且不应当被解释成 仅仅受限于这里所阐述的实施例。
在本申请的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。另外，术语“包括”及其任何变形，意图在于覆盖不排他的包含。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指，否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是，这里所使用的术语“包括”和/或“包含”规定所陈述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
参考图4至图7，公开了四种电路板，其中这四种电路板的信号传输引脚100相同，固定焊盘200的数量和位置都存在差异。我们在实际生产中，要针对每一种电路板进行设计对应连接器电路板，这样增加了设计成本，这样制作出的电路板兼容性较低。
下面结合附图和可选的实施例对本申请作说明。
如图1所示，本申请实施例公布了一种电路板，包括：信号传输引脚焊盘100，设置为跟外接的连接器进行信号传输；固定焊盘200，设置为固定连接器的固定引脚300； 固定焊盘200的数量、位置和尺寸兼容同类连接器；同类连接器为信号传输引脚300数量和引脚间距相同的连接器。其中，传输引脚焊盘100设置为跟外接的连接器进行信号传输。
本方案中，因为每个厂家的研发能力和制程能力不同，每个厂商制造的连接器外形结构都有些许差异。我们将信号传输引脚数量和间距相同的连接器划分为同类连接器，将同类连接器固定焊盘200的数量、位置和尺寸进行兼容，对固定焊盘200进行整合实现多个连接器通用同一个电路板封装图，实现一对多的方式，对同类连接器进行兼容，提高产品市场竞争力。
在一实施例中，固定焊盘200的数量大于等于同类连接器的固定引脚300的最大数量。
本方案中，每个固定引脚300都有对应的固定焊盘200，同类连接器的固定引脚300数量也不相同，我们统计同类连接器固定引脚300的数量，把这些数量进行兼容，做到设计的固定焊盘200的数量要大于等于同类连接器固定引脚300的最大数量。这样设计可以覆盖大多数同类连接器，不同的连接器上的固定引脚300在电路板上都有对应的固定焊盘200由于与之对应。
在一实施例中，固定焊盘200的位置兼容同类连接器的固定引脚300的所有位置。
本方案中，同类连接器固定引脚300的位置并不固定，对固定焊盘200的位置进行兼容，不同连接器固定引脚300位置存在差异，通过增加固定焊盘200进行整合，做到固定焊盘200的位置可以覆盖同类连接器固定引脚300位置不同的情况。
在一实施例中，固定焊盘200的尺寸大于等于同一位置同类连接器的固定引脚300的最大尺寸。
本方案中，同一位置不同的连接器固定引脚300数量可能存在差异，有的连接器可能在该位置没有固定引脚300，有的连接器可能存在一个或者多个固定引脚300，此时增加或增大固定焊盘200的尺寸，做到固定焊盘200尺寸大于等于同类连接器固定引脚300在该位置的最大尺寸。
在一实施例中，固定焊盘200环绕信号传输引脚100设置。
本方案中，设置为显示面板的电路板，固定焊盘200和信号传输引脚100分布在电路板周围，其中信号传输引脚100在固定焊盘之间，固定焊盘200在导线方向上呈线性分布，在导线方向上该位置仅存在一个固定焊盘200。
在一实施例中，固定焊盘200包括多个第一固定焊盘220，第一固定焊盘220与信号传输引脚100平行设置，第一固定焊盘220中心位置的连线与信号传输引脚100平行，相邻两个第一固定焊盘220之间的间距相等，相邻两个第一固定焊盘220的形状相同。
本方案中，与信号传输引脚100对应的第一固定焊盘220，在电路板上均匀分布，第一固定焊盘220之间距离相等，这样可以使电路板与连接器之间的相互作用力分布均匀，保护电路板，增加电路板使用寿命。
在一实施例中，固定焊盘200包括多个第二固定焊盘210，第二固定焊盘210设置在信号传输引脚100两侧对应位置，第二固定焊盘210的形状尺寸大于等于第一固定焊盘210的形状。
本方案中，信号传输引脚100位于电路板中间部分，电路板两侧相较于中间部分空间更充分，将第二固定焊盘210尺寸大于等于第一固定焊盘尺寸220，可以充分利用空间，应对连接类型增加。
作为本申请的另一实施例，参考图1所示，公开了一种电路板，包括：
信号传输引脚焊盘100，设置为跟外接的连接器进行信号传输；固定焊盘200，设置为固定连接器的固定引脚300；固定焊盘200的数量、位置和尺寸兼容同类连接器；同类连接器为信号传输引脚100数量和间距相同的连接器；固定焊盘200的数量大于等于同类连接器的固定引脚的最大数量，固定焊盘200的位置兼容同类连接器的固定引脚300的所有位置，固定焊盘200的尺寸大于等于同一位置同类连接器的固定引脚300的最大尺寸。
本方案中，因为每个厂家的研发能力和制程能力不同，每个厂商制造的连接器外形结构都有些许差异。我们将信号传输引脚数量和间距相同的连接器划分为同类连接器，将同类连接器固定焊盘200的数量、位置和尺寸进行兼容，对固定焊盘200进行整合实现多个连接器通用同一个电路板封装图，实现一对多的方式，对同类连接器进行兼容， 提高产品市场竞争力。每个固定引脚300都有对应的固定焊盘200，同类连接器的固定引脚300数量也不相同，我们统计同类连接器固定引脚300的数量，把这些数量进行兼容，做到设计的固定焊盘200的数量要大于等于同类连接器固定引脚300的最大数量。这样设计可以覆盖大多数同类连接器，不同的连接器上的固定引脚300在电路板上都有对应的固定焊盘200由于与之对应。同类连接器固定引脚300的位置并不固定，对固定焊盘200的位置进行兼容，不同连接器固定引脚300位置存在差异，通过增加固定焊盘200进行整合，做到固定焊盘200的位置可以覆盖同类连接器固定引脚300位置不同的情况。同一位置不同的连接器固定引脚300数量可能存在差异，有的连接器可能在该位置没有固定引脚300，有的连接器可能存在一个或者多个固定引脚300，此时增加或增大固定焊盘200的尺寸，做到固定焊盘200尺寸大于等于同类连接器固定引脚300在该位置的最大尺寸。
作为本申请的另一实施例，参考图2至图3所示，公开了一种电路板的制作方法，其中电路板包括：信号传输引脚焊盘100，设置为跟外接的连接器进行信号传输；固定焊盘200，设置为固定连接器的固定引脚300；固定焊盘200的数量、位置和尺寸兼容同类连接器；同类连接器为信号传输引脚300数量和引脚间距相同的连接器。其中，传输引脚焊盘100设置为跟外接的连接器进行信号传输；
电路板的制作方法包括步骤：
S11:统计同类连接器固定引脚数量、位置和尺寸；
S12:根据统计结果对同类连接器固定焊盘进行兼容性处理；
S13:制作对应的电路板。
本方案中，设置为连接器的电路板进行重新设计，要先统计同类型连接器固定引脚的数量、位置和尺寸，这样做到对同类连接器出现的固定焊盘不同设计进行清点，统计后根据统计结果对固定焊盘做兼容性处理，使得整合处理过的固定焊盘可以对接不同设计的连接器。处理过后，根据封装图制作对应的电路板。制作出的电路板可以设置为同类连接器的连接，可以做到一对多，提高了产品的兼容性。
在一实施例中，对同类连接器固定焊盘进行兼容性处理的步骤包括：
S121:根据同类连接器固定引脚的最大数量确定固定焊盘的数量；
S122:根据同类连接器固定引脚的位置确定固定焊盘的位置；
S123:根据同类连接器固定引脚的最大尺寸确定固定焊盘的尺寸。
本方案中，S121/S122/S123方法无先后顺序，实际工作中三种方法也是一起使用达到最佳的设计。同类连接器固定引脚数量也会存在差异，根据固定引脚的数量、尺寸和位置对固定焊盘进行整合兼容，同一位置的固定焊盘空间不干涉按照该位置固定焊盘的最大位置，即增大固定焊盘的尺寸。空间干涉可以增加固定焊盘的数量来进行兼容。对固定焊盘进行整合兼容，可以减少设计变更满足各种客户的需求，提高市场竞争力。
在一实施例中，固定焊盘200的数量大于等于同类连接器的固定引脚300的最大数量。
本方案中，每个固定引脚300都有对应的固定焊盘200，同类连接器的固定引脚300数量也不相同，我们统计同类连接器固定引脚300的数量，把这些数量进行兼容，做到设计的固定焊盘200的数量要大于等于同类连接器固定引脚300的最大数量。这样设计可以覆盖大多数同类连接器，不同的连接器上的固定引脚300在电路板上都有对应的固定焊盘200由于与之对应。
在一实施例中，固定焊盘200的位置兼容同类连接器的固定引脚300的所有位置。
本方案中，同类连接器固定引脚300的位置并不固定，对固定焊盘200的位置进行兼容，不同连接器固定引脚300位置存在差异，通过增加固定焊盘200进行整合，做到固定焊盘200的位置可以覆盖同类连接器固定引脚300位置不同的情况。
需要说明的是，本方案中涉及到的各步骤的限定，在不影响具体方案实施的前提下，并不认定为对步骤先后顺序做出限定，写在前面的步骤可以是在先执行的，也可以是在后执行的，甚至也可以是同时执行的，只要能实施本方案，都应当视为属于本申请的保护范围。
本申请的技术方案可以广泛使用在TN面板(Twisted Nematic，即扭曲向列型面板)、IPS面板(In-PaneSwitcing，平面转换)、VA面板(Multi-domain Vertica Alignment，多象限垂直配向技术)，当然，也可以是其他类型的面板，适用即可。
以上内容是结合具体的可选实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本申请的保护范围。

Claims (18)

  1. 一种电路板，包括：
    信号传输引脚焊盘，设置为跟外接的连接器进行信号传输；以及
    固定焊盘，设置为固定所述连接器的固定引脚；
    其中，所述固定焊盘的数量、位置和尺寸兼容同类连接器；
    所述同类连接器为信号传输引脚数量和引脚间距相同的连接器。
  2. 如权利要求1所述的一种电路板，其中，所述固定焊盘的数量等于所述同类连接器的所述固定引脚的最大数量。
  3. 如权利要求1所述的一种电路板，其中，所述固定焊盘的数量大于所述同类连接器的所述固定引脚的最大数量。
  4. 如权利要求1所述的一种电路板，其中，所述固定焊盘的位置兼容所述同类连接器的所述固定引脚的所有位置。
  5. 如权利要求1所述的一种电路板，其中，所述固定焊盘的尺寸大于同一位置所述同类连接器的所述固定引脚的最大尺寸。
  6. 如权利要求1所述的一种电路板，其中，所述固定焊盘的尺寸等于同一位置所述同类连接器的所述固定引脚的最大尺寸。
  7. 如权利要求1所述的一种电路板，其中，所述固定焊盘环绕所述信号传输引脚设置。
  8. 如权利要求1所述的一种电路板，其中，所述固定焊盘包括多个第一固定焊盘，所述第一固定焊盘与所述信号传输引脚平行设置。
  9. 如权利要求8所述的一种电路板，其中，所述第一固定焊盘中心位置的连线与所述信号传输引脚平行，相邻两个所述第一固定焊盘之间的间距相等。
  10. 如权利要求8所述的一种电路板，其中，所述第一固定焊盘大小相等，形状相同。
  11. 如权利要求8所述的一种电路板，其中，所述固定焊盘包括多个第二固定焊盘，所述第二固定焊盘设置在所述信号传输引脚两侧对应位置。
  12. 如权利要求11所述的一种电路板，其中，所述第二固定焊盘的尺寸大于同一连接器的所述第一固定焊盘的尺寸。
  13. 如权利要求11所述的一种电路板，其中，所述第二固定焊盘的尺寸等于同一连接器的所述第一固定焊盘的尺寸。
  14. 一种电路板，包括：
    信号传输引脚焊盘，设置为跟外接的连接器进行信号传输；以及
    固定焊盘，设置为固定所述连接器的固定引脚；
    其中，所述固定焊盘的数量、位置和尺寸兼容同类连接器；
    所述同类连接器为信号传输引脚数量和间距相同的连接器；
    所述固定焊盘的数量大于等于所述同类连接器的所述固定引脚的最大数量，所述固定焊盘的位置兼容所述同类连接器的所述固定引脚的所有位置，所述固定焊盘的尺寸大于等于同一位置所述同类连接器的所述固定引脚的最大尺寸。
  15. 一种电路板的制作方法，所述电路板包括：
    信号传输引脚焊盘，设置为跟外接的连接器进行信号传输；
    固定焊盘，设置为固定所述连接器的固定引脚；
    所述固定焊盘的数量、位置和尺寸兼容同类连接器；
    所述同类连接器为信号传输引脚数量和引脚间距相同的连接器；
    所述电路板的制作方法包括步骤：
    统计同类连接器固定引脚数量、位置和尺寸；
    根据统计结果对同类连接器固定焊盘进行兼容性处理；以及
    制作对应的电路板。
  16. 如权利要求15所述的一种电路板的制作方法，其中，所述对同类连接器固定焊盘进行兼容性处理的步骤包括：
    根据同类连接器固定引脚的最大数量确定固定焊盘的数量；
    根据同类连接器固定引脚的位置确定固定焊盘的位置；以及
    根据同类连接器固定引脚的最大尺寸确定固定焊盘的尺寸。
  17. 如权利要求15所述的一种电路板的制作方法，其中，所述固定焊盘的数量大于等于所述同类连接器的所述固定引脚的最大数量。
  18. 如权利要求15所述的一种电路板的制作方法，其中，所述固定焊盘的位置兼容所述同类连接器的所述固定引脚的所有位置。
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Publication number Priority date Publication date Assignee Title
CN111315123A (zh) * 2020-02-26 2020-06-19 歌尔股份有限公司 Pcb板及pcb板与连接器的连接结构
CN114911012B (zh) * 2021-02-09 2024-11-22 宁波环球广电科技有限公司 光通讯模组及光收发器
CN114446240B (zh) * 2022-02-21 2023-07-14 京东方科技集团股份有限公司 显示面板供电电路、显示面板及显示装置
CN115171531B (zh) * 2022-06-30 2023-10-20 广州国显科技有限公司 邦定装置以及邦定方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101083873A (zh) * 2007-07-13 2007-12-05 华为技术有限公司 电路板产品与印刷电路板
CN201181750Y (zh) * 2007-09-29 2009-01-14 中兴通讯股份有限公司 一种具有两种标准类型连接器的模块
CN101674706A (zh) * 2008-09-09 2010-03-17 三星电子株式会社 电路板、连接器、壳体及其装配件、装置及其制造方法
CN106714450A (zh) * 2016-11-24 2017-05-24 青岛海信宽带多媒体技术有限公司 一种射频连接器的兼容pcb结构
US20170330827A1 (en) * 2016-05-12 2017-11-16 Digi International Inc. Hybrid embedded surface mount module form factor with same signal source subset mapping

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10227342B4 (de) * 2002-06-19 2008-06-05 Qimonda Ag Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung
JP2006041141A (ja) * 2004-07-27 2006-02-09 Funai Electric Co Ltd コネクタ固定パッド付き配線基板
CN201957337U (zh) * 2010-12-08 2011-08-31 深圳富泰宏精密工业有限公司 电路板
CN103533754A (zh) * 2013-10-31 2014-01-22 中环高科（天津）股份有限公司 一种通用zif连接器焊盘

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101083873A (zh) * 2007-07-13 2007-12-05 华为技术有限公司 电路板产品与印刷电路板
CN201181750Y (zh) * 2007-09-29 2009-01-14 中兴通讯股份有限公司 一种具有两种标准类型连接器的模块
CN101674706A (zh) * 2008-09-09 2010-03-17 三星电子株式会社 电路板、连接器、壳体及其装配件、装置及其制造方法
US20170330827A1 (en) * 2016-05-12 2017-11-16 Digi International Inc. Hybrid embedded surface mount module form factor with same signal source subset mapping
CN106714450A (zh) * 2016-11-24 2017-05-24 青岛海信宽带多媒体技术有限公司 一种射频连接器的兼容pcb结构

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