WO2020098459A1 - 摄像头模组及终端 - Google Patents

摄像头模组及终端 Download PDF

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Publication number
WO2020098459A1
WO2020098459A1 PCT/CN2019/112681 CN2019112681W WO2020098459A1 WO 2020098459 A1 WO2020098459 A1 WO 2020098459A1 CN 2019112681 W CN2019112681 W CN 2019112681W WO 2020098459 A1 WO2020098459 A1 WO 2020098459A1
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WIPO (PCT)
Prior art keywords
circuit board
camera module
image sensor
filter
module according
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PCT/CN2019/112681
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English (en)
French (fr)
Inventor
刘宝军
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维沃移动通信（杭州）有限公司
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Publication of WO2020098459A1 publication Critical patent/WO2020098459A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present disclosure relates to the technical field of terminals, and in particular, to a camera module and a terminal.
  • the design of the camera module body generally adopts chip scale packaging (Chip Scale Package, CSP) and on-board chip packaging (Chip On Board, COB) solutions.
  • CSP Chip Scale Package
  • COB Chip On Board
  • the CSP process is to solder the electronic component 101 and the image sensor 102 to the printed circuit board 103 (Printed Circuit Board, PCB) through Surface Mount Technology (SMT), and then use glue 104 to assemble the assembly
  • the lens 105 and the bracket 107 of the filter 106 are attached to the PCB 103.
  • the height of the camera module in the Z direction is: the total length of the lens (Total Track, Length, TTL), that is, the distance from the front end of the lens barrel to the image surface of the image sensor A + image sensor thickness B + solder ball thickness C + PCB board thickness D.
  • the dimensions of the camera module in the X / Y direction are: image sensor size E + distance from the image sensor edge to the electronic component F + electronic component size G + electronic component to bracket distance H + bracket thickness J.
  • the size of the camera module in the X / Y direction is also relatively large.
  • FIG. 2 it is a schematic diagram of the COB packaging structure. Specifically, in the COB process, the image sensor 202 is first glued to the PCB board 203 with the electronic component 201 attached through the glue 204, and then the electrical performance of the image sensor 202 and the PCB board 203 is connected by wire bonding technology. Glue 204 is used to adhere the assembled lens 205 and the bracket 207 of the filter 206 to the PCB 203. As shown in Figure 2, the height of the camera module in the Z direction is: lens TTL A1 + image sensor thickness B1 + glue thickness C1 + PCB board thickness D1. Since the lens design TTL of this structure needs to consider the height of the electronic component 201 itself and the distance from the filter 206, the TTL is generally larger.
  • the dimensions of the camera module in the X / Y direction are: image sensor size E1 + wire connection space F1 + distance of electronic component G1 + distance from electronic component to bracket H1 + bracket thickness J1.
  • the size of the camera module in the X / Y direction is larger than the size of the camera module in the CSP scheme in the X / Y direction.
  • Some embodiments of the present disclosure provide a camera module and a terminal, to solve the problem that the camera module in the related art has a large size and a high space occupation rate in the terminal.
  • a camera module includes:
  • An image sensor which is disposed on the first surface of the first circuit board
  • An optical filter which is disposed on the image sensor or is spaced from the image sensor by a preset distance
  • a fixing bracket which surrounds the optical filter and is arranged on a second surface of the first circuit board, where the first surface and the second surface are two surfaces opposite to the first circuit board;
  • an opening is provided in the middle of the first circuit board; light sequentially passes through the lens, the filter, and the opening to the image sensor.
  • Some embodiments of the present disclosure also provide a terminal, including the camera module as described above, and a second circuit board that is connected to the first circuit board.
  • the distance between the filter and the image sensor is fully utilized to accommodate the first circuit board, and thus, the camera is realized
  • the miniaturization of the module reduces the space occupation rate of the camera module in the terminal, thereby making the terminal lighter and thinner, and at the same time increasing the screen ratio of the terminal.
  • FIG. 1 is a schematic diagram of the structure of a camera module adopting CSP packaging in the related art
  • Figure 2 is a schematic diagram of the structure of a camera module using COB packaging in the related art
  • FIG. 3 is a schematic structural diagram of a camera module according to some embodiments of the present disclosure.
  • FIG. 4 is a schematic diagram of the positional relationship between the first circuit board and the image sensor in the camera module of some embodiments of the present disclosure.
  • Some embodiments of the present disclosure disclose a camera module, as shown in FIG. 3, which includes: a first circuit board 1; an image sensor 2, which is provided on the first surface of the first circuit board 1; an optical filter 3, It is installed on the image sensor 2 or at a predetermined distance from the image sensor 2; a fixed bracket 4, which surrounds the filter 3 and is provided on the second surface of the first circuit board 1, the first and second surfaces are
  • a circuit board 1 has two opposite sides; a lens 5 fixed to a fixing bracket 4.
  • an opening 6 is provided in the middle of the first circuit board 1; light passes through the lens 5, the filter 3 and the opening 6 in order to reach the image sensor 2.
  • the first circuit board 1 is used to transmit the electrical signal of the image sensor 2 to the rear end.
  • the first circuit board 1 is a hard board, a soft board or a combination of soft and hard boards.
  • the filter 3 is used to filter out excess light bands, so that the image sensor 2 can capture the actual scene seen by the human eye.
  • the filter 3 may be attached to the side of the image sensor 2 away from the first side of the first circuit board 1.
  • the image sensor 2 receives external light passing through the lens 5, the filter 3, and the opening 6, and converts the light into an electrical signal, and then converts it into a digital signal through internal A / D.
  • the image sensor 2 integrates a digital signal processing chip.
  • the fixing bracket 4 is used to fix the lens 5.
  • the lens 5 is a device that images a photographic scene on the image sensor 2 and includes a lens.
  • the first circuit board 1 is disposed between the filter 3 and the image sensor 2, and the distance between the filter 3 and the image sensor 2 is fully utilized to accommodate the first circuit board 1, so that The size of the camera module in the Z direction is reduced.
  • an opening 6 is provided in the middle of the first circuit board 1, the purpose of which is to allow external light to irradiate the image sensor 2 through the lens 5, the filter 3, and the opening 6 in sequence, so that the scene generates light through the lens 5
  • the image can be projected onto the surface of the image sensor 2 without obstruction, and finally the image can be seen on the screen of the terminal (such as a mobile phone).
  • the camera module further includes: an electronic component 7 that is disposed inside the first circuit board 1.
  • the electronic component 7 is packaged inside the first circuit board 1. That is, the thickness of the electronic component 7 is less than or equal to the thickness of the first circuit board 1.
  • the electronic component 7 is disposed inside the first circuit board 1, one, there is no need to consider the height of the electronic component itself, reduce the lens TTL, and thereby reduce the size of the camera module in the Z direction; both, No longer need to consider the layout of electronic components and wiring space, reduce the size of the camera module in the X / Y direction. In this way, the purpose of further reducing the size of the camera module is achieved, and the miniaturization of the camera module is achieved.
  • the space occupation rate of the camera module in the terminal can also be reduced, making the terminal Thin and light, while increasing the screen ratio of the terminal.
  • the filter 3 is disposed on the second surface of the first circuit board 1.
  • the filter 3 is attached to the second surface of the first circuit board 1 through the adhesive 8.
  • the adhesive 8 is glue.
  • the filter 3 is disposed in the opening 6 of the first circuit board 1.
  • the filter 3 can be disposed in the opening 6 of the first circuit board 1 by a pasting method.
  • the filter 3 is disposed on the fixing bracket 4.
  • the filter 3 may be provided on the fixing bracket 4 by pasting.
  • the filter 3 is attached to the fixing bracket 4 with glue.
  • the above three filter arrangement methods can achieve that the first circuit board 1 is located between the filter 3 and the image sensor 2.
  • the Z-direction height of the filter 3 to the surface of the image sensor 2 can be adjusted by the thickness of the first circuit board 1.
  • the image sensor 2 is electrically connected to the first circuit board 1 by soldering.
  • a reliable electrical connection between the image sensor 2 and the first circuit board 1 can be achieved by soldering.
  • the image sensor 2 is soldered to the first surface of the first circuit board 1 by soldering balls.
  • the image sensor 2 is disposed in the opening 6 of the first circuit board 1.
  • the image sensor 2 when the image sensor 2 is disposed in the opening 6 of the first circuit board 1, it can be electrically connected to the first circuit board 1 through a metal wire. In this way, a reliable electrical connection between the image sensor 2 and the first circuit board 1 can be achieved.
  • the fixing bracket 4 is connected to the second surface of the first circuit board 1 through an adhesive 8.
  • the adhesive 8 is glue.
  • the area occupied by the image sensor 2 is smaller than the area occupied by the first circuit board 1, and the image sensor 2 is located directly under the opening 6 of the first circuit board 1.
  • the area of the opening of the first circuit board 1 is smaller than the area of the image sensor 3, and its purpose is to reserve a soldering space between the first circuit board 1 and the image sensor 2.
  • the periphery of the image sensor 2 is filled with a filling material.
  • the size of the camera module in the Z direction is: lens TTL A2 + image sensor thickness B2.
  • the size of the camera module in the X / Y direction is: image sensor size C2 + fill material width D.
  • the Z direction of the camera module is a direction parallel to the optical axis direction of the camera module.
  • the X / Y direction of the camera module is perpendicular to the Z direction.
  • Some embodiments of the present disclosure also provide a terminal, including the camera module as described in the above embodiment; and a second circuit board, which is electrically connected to the first circuit board in the camera module.
  • the first circuit board provided between the filter and the image sensor makes full use of the existence between the filter and the image sensor The distance is sufficient to accommodate the first circuit board. In this way, the miniaturization of the camera module is realized, the space occupation rate of the camera module in the terminal is reduced, the terminal is more thin and light, and the screen ratio of the terminal is improved.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Studio Devices (AREA)

Abstract

本公开提供一种摄像头模组及终端。该摄像头模组，包括：第一电路板；图像传感器，其设置于所述第一电路板的第一面；滤光片，其设置于所述图像传感器上，或者与所述图像传感器间隔预设距离；固定支架，其围绕所述滤光片且设置于所述第一电路板的第二面，所述第一面与所述第二面为所述第一电路板相背的两个面；固定于所述固定支架的镜头；其中，所述第一电路板的中部设有开口；光线依次通过所述镜头、所述滤光片以及所述开口到达至所述图像传感器。

Description

摄像头模组及终端
相关申请的交叉引用
本申请主张在2018年11月15日在中国提交的中国专利申请号No.201811358415.0的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及终端技术领域，尤其涉及一种摄像头模组及终端。
背景技术
随着科学技术的发展，消费者对手机的要求也越来越严苛，拍照清晰、智能、高屏占比、超薄机身等都是消费者追求的极致体验。
目前摄像头模组本体的设计一般采用芯片级封装(Chip Scale Package，CSP)和板上芯片封装(Chip On Board，COB)的方案。
如图1所示，为CSP封装结构示意图。具体的，CSP工艺是将电子元件101和图像传感器102通过表面贴装技术(Surface Mount Technology，SMT)焊接到印制电路板103(Printed Circuit Board，PCB)上，之后使用胶水104将组装好的镜头105和滤光片106的支架107贴合在PCB板103上。如图1所示，摄像头模组在Z方向上的高度为：镜头全长(Total Track Length，TTL)，即从镜筒前端面到图像传感器像面的距离A+图像传感器厚度B+锡球厚度C+PCB板厚度D。由于此种结构的镜头设计TTL需要考虑电子元件101本身高度及距离滤光片106的距离，一般TTL较大。摄像头模组在X/Y方向的尺寸为：图像传感器尺寸E+图像传感器边沿到电子元件的距离F+电子元件尺寸G+电子元件到支架距离H+支架厚度J。摄像头模组在X/Y方向的尺寸也偏大。
如图2所示，为COB封装结构示意图。具体的，COB工艺是先将图像传感器202通过胶水204与贴好电子元件201的PCB板203粘合在一起，再通过打线Wire bonding技术将图像传感器202与PCB板203实现电气性能连接，之后使用胶水204将组装好的镜头205和滤光片206的支架207粘合在 PCB板203上。如图2所示，摄像头模组在Z方向上的高度为：镜头TTL A1+图像传感器厚度B1+胶水厚度C1+PCB板厚度D1。由于此种结构的镜头设计TTL需要考虑电子元件201本身高度及距离滤光片206的距离，一般TTL较大。摄像头模组在X/Y方向的尺寸为：图像传感器尺寸E1+打线连接空间F1+电子元件的距离G1+电子元件到支架距离H1+支架厚度J1。摄像头模组在X/Y方向的尺寸相对于CSP方案的摄像头模组在X/Y方向的尺寸更大。
综上，当前主流的CSP和COB摄像头模组封装设计方案，其摄像头模组尺寸大，不利于模组小型化设计。
发明内容
本公开的一些实施例提供一种摄像头模组及终端，以解决相关技术中的摄像头模组尺寸大，在终端内的空间占用率高的问题。
为了解决上述技术问题，本公开的一些实施例采用如下技术方案，一种摄像头模组，包括：
第一电路板；
图像传感器，其设置于所述第一电路板的第一面；
滤光片，其设置于所述图像传感器上，或者与所述图像传感器间隔预设距离；
固定支架，其围绕所述滤光片且设置于所述第一电路板的第二面，所述第一面与所述第二面为所述第一电路板相背的两个面；
固定于所述固定支架的镜头；
其中，所述第一电路板的中部设有开口；光线依次通过所述镜头、所述滤光片以及所述开口到达至所述图像传感器。
本公开的一些实施例还提供了一种终端，包括：如上述所述的摄像头模组，以及第二电路板，所述第二电路板与第一电路板连接。
本公开的一些实施例中，通过设置于滤光片与图像传感器之间的第一电路板，充分利用滤光片与图像传感器之间本身存在的距离以容纳第一电路板，如此，实现摄像头模组的小型化，从而降低摄像头模组在终端内的空间占用 率，进而使得终端更加轻薄化，同时提高终端的屏占比。
附图说明
图1为相关技术中摄像头模组采用CSP封装的结构示意图；
图2为相关技术中摄像头模组采用COB封装的结构示意图；
图3为本公开的一些实施例的摄像头模组的结构示意图；
图4为本公开的一些实施例的摄像头模组中第一电路板与图像传感器之间的位置关系示意图。
具体实施方式
下面将结合本公开的一些实施例中的附图，对本公开的一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于发明保护的范围。
本公开的一些实施例公开了一种摄像头模组，如图3所示，包括：第一电路板1；图像传感器2，其设置于第一电路板1的第一面；滤光片3，其设置于图像传感器2上，或者与图像传感器2间隔预设距离；固定支架4，其围绕滤光片3且设置于第一电路板1的第二面，第一面与第二面为第一电路板1相背的两个面；固定于固定支架4的镜头5。
其中，第一电路板1的中部设有开口6；光线依次通过镜头5、滤光片3以及开口6到达图像传感器2。
需要说明的是，第一电路板1用于将图像传感器2的电信号传输至后端。其中，第一电路板1为硬板、软板或软硬结合板。
滤光片3用于将滤除多余的光波段，使图像传感器2能够拍摄出人眼所见到的实际景物。
这里，滤光片3可以贴附于图像传感器2远离第一电路板1的第一面的一面上。
图像传感器2接收通过镜头5、滤光片3以及开口6的外部光线，并将 光线转换为电信号，再通过内部的A/D转换为数字信号。这里，该图像传感器2集成数字信号处理芯片。
固定支架4用于固定镜头5。
这里，镜头5是将拍摄景物在图像传感器2上成像的器件，包括透镜。
需要说明的是，第一电路板1设置在滤光片3与图像传感器2之间，充分利用滤光片3与图像传感器2之间本身存在的距离以容纳第一电路板1，如此，减小了摄像头模组在Z方向上的尺寸。而且，在第一电路板1的中部设有开口6，其目的是为了使外部光线能够依次通过镜头5、滤光片3以及开口6照射到图像传感器2上，使得景物通过镜头5生成的光学图像能够无遮挡地投射到图像传感器2的表面，最终保证能够在终端(如手机)屏幕上能够看到图像。
可选地，摄像头模组还包括：电子元件7，电子元件7设置于第一电路板1的内部。
需要说明的是，电子元件7封装于第一电路板1的内部。也就是说，电子元件7的厚度小于或者等于第一电路板1的厚度。
这里，由于电子元件7设置于第一电路板1的内部，一者，不再需要考虑电子元件本身的高度，减小镜头TTL，进而减小摄像头模组在Z方向上的尺寸；二者，不再需要考虑电子元件布局和打线空间，减小摄像头模组在X/Y方向上的尺寸。如此，达到了进一步减小摄像头模组的尺寸的目的，实现摄像头模组的小型化，在该摄像头模组应用于终端时，还能够降低摄像头模组在终端内的空间占用率，使得终端更加轻薄化，同时提高终端的屏占比。
可选地，滤光片3设置于第一电路板1的第二面。
可选地，滤光片3通过粘接剂8贴附于第一电路板1的第二面。可选的，粘接剂8为胶水。
可选地，滤光片3设置于第一电路板1的开口6内。
这里，具体的，可通过粘贴方式，将滤光片3设置于第一电路板1的开口6内。
可选地，滤光片3设置于固定支架4上。
这里，具体的，可通过粘贴方式，将滤光片3设置于固定支架4上。比 如，通过胶水将滤光片3粘贴在固定支架4上。
这里，上述三种滤光片的设置方式，均能够实现使第一电路板1位于滤光片3与图像传感器2之间。
需要说明的是，滤光片3到图像传感器2表面的Z向高度可通过第一电路板1的厚度调整。
可选地，图像传感器2通过焊接方式与第一电路板1电连接。这里，通过焊接方式能够实现图像传感器2与第一电路板1之间的可靠电气连接。
可选的，图像传感器2通过植锡球焊接于第一电路板1的第一面上。
可选地，图像传感器2设置于第一电路板1的开口6内。
可选的，图像传感器2设置于第一电路板1的开口6内时，可通过金属线与第一电路板1电连接。如此，能够实现图像传感器2与第一电路板1之间的可靠电气连接。
可选地，固定支架4通过粘接剂8与第一电路板1的第二面连接。可选的，粘接剂8为胶水。
如图4所示，图像传感器2所占面积小于第一电路板1所占面积，且图像传感器2位于第一电路板1的开口6的正下方。第一电路板1的开口的面积小于图像传感器3的面积，其目的是为了预留出第一电路板1与图像传感器2之间的焊接空间。
为了保护图像传感器2，可选地，图像传感器2的周缘填充有填充材料。
这里，具体的，如图3所示，本实施例中，摄像头模组在Z方向上的尺寸为：镜头TTL A2+图像传感器厚度B2。
摄像头模组在X/Y方向上的尺寸为：图像传感器尺寸C2+填充材料宽度D。
需要说明的是，本公开的一些实施例中摄像头模组的Z方向为与摄像头模组的光轴方向平行的方向。摄像头模组的X/Y方向为与Z方向垂直的方向。
本公开的一些实施例还提供了一种终端，包括如上述实施例所述的摄像头模组；以及第二电路板，第二电路板与摄像头模组中的第一电路板电连接。
本公开的一些实施例的终端，由于采用了上述实施例中的摄像头模组，通过设置于滤光片与图像传感器之间的第一电路板，充分利用滤光片与图像 传感器之间本身存在的距离以容纳第一电路板，如此，实现摄像头模组的小型化，降低摄像头模组在终端内的空间占用率，使得终端更加轻薄化，同时提高终端的屏占比。
以上所述是本公开的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (11)

  1. 一种摄像头模组，包括：
    第一电路板；
    图像传感器，其设置于所述第一电路板的第一面；
    滤光片，其设置于所述图像传感器上，或者与所述图像传感器间隔预设距离；
    固定支架，其围绕所述滤光片且设置于所述第一电路板的第二面，所述第一面与所述第二面为所述第一电路板相背的两个面；
    固定于所述固定支架的镜头；
    其中，所述第一电路板的中部设有开口；光线依次通过所述镜头、所述滤光片以及所述开口到达至所述图像传感器。
  2. 根据权利要求1所述的摄像头模组，还包括：
    电子元件，所述电子元件设置于所述第一电路板的内部。
  3. 根据权利要求1所述的摄像头模组，其中，所述滤光片设置于所述第一电路板的第二面。
  4. 根据权利要求3所述的摄像头模组，其中，所述滤光片通过粘接剂贴附于所述第一电路板的第二面。
  5. 根据权利要求1所述的摄像头模组，其中，所述滤光片设置于所述第一电路板的所述开口内。
  6. 根据权利要求1所述的摄像头模组，其中，所述滤光片设置于所述固定支架上。
  7. 根据权利要求1所述的摄像头模组，其中，所述图像传感器通过焊接方式与所述第一电路板电连接。
  8. 根据权利要求1所述的摄像头模组，其中，所述图像传感器设置于所述第一电路板的所述开口内。
  9. 根据权利要求1所述的摄像头模组，其中，所述固定支架通过粘接剂与所述第一电路板的第二面连接。
  10. 根据权利要求1所述的摄像头模组，其中，所述图像传感器的周缘 填充有填充材料。
  11. 一种终端，包括：
    如权利要求1～10任一项所述的摄像头模组；以及
    第二电路板，所述第二电路板与第一电路板电连接。
PCT/CN2019/112681 2018-11-15 2019-10-23 摄像头模组及终端 WO2020098459A1 (zh)

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