WO2020098108A1 - 一种保护膜及其离型层剥离方法 - Google Patents

一种保护膜及其离型层剥离方法 Download PDF

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Publication number
WO2020098108A1
WO2020098108A1 PCT/CN2018/124668 CN2018124668W WO2020098108A1 WO 2020098108 A1 WO2020098108 A1 WO 2020098108A1 CN 2018124668 W CN2018124668 W CN 2018124668W WO 2020098108 A1 WO2020098108 A1 WO 2020098108A1
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WO
WIPO (PCT)
Prior art keywords
protective film
release layer
peeling
layer
protective
Prior art date
Application number
PCT/CN2018/124668
Other languages
English (en)
French (fr)
Inventor
陈海鹰
Original Assignee
江门市艾加得电子有限公司
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Filing date
Publication date
Application filed by 江门市艾加得电子有限公司 filed Critical 江门市艾加得电子有限公司
Priority to US17/261,254 priority Critical patent/US11541632B2/en
Priority to AU2018449780A priority patent/AU2018449780B2/en
Priority to JP2020573459A priority patent/JP2021529710A/ja
Priority to EP18940443.7A priority patent/EP3800044B1/en
Publication of WO2020098108A1 publication Critical patent/WO2020098108A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C2063/0008—Registering, centering the lining material on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
    • B29C65/4825—Pressure sensitive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7808—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/836—Moving relative to and tangentially to the parts to be joined, e.g. transversely to the displacement of the parts to be joined, e.g. using a X-Y table
    • B29C66/8362—Rollers, cylinders or drums moving relative to and tangentially to the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/861—Hand-held tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2571/00—Protective equipment

Definitions

  • the invention relates to the technical field of film sticking of electronic equipment, in particular to a protective film and a method for peeling off a release layer.
  • the use of electronic devices in modern society is becoming more and more popular. These types of smart electronic devices usually have a screen.
  • the screen generally has a touch function. Through the conductive characteristics of the finger, touch keys on the screen to make a call or contact the menu to obtain information.
  • a protective film needs to be attached to the screen.
  • the protective films generally use hard protective films with higher strength, such as tempered glass films, etc.
  • the tempered film has a hard texture and strong adhesion.
  • the protective film generally includes a protective film attached with glue on one side for attaching to the surface of the screen, a release layer attached to the adhesive end of the protective film, and a protective layer attached to the other end of the protective film.
  • the protective film of this structure can not be positioned, and the release layer of the protective film is not easy to peel off, and the quality of the film cannot be guaranteed, so it is not suitable for use with the film laminator.
  • a protective film includes a protective film, a protective layer and a release layer, a lead is connected to the end of the release layer, and a positioning mechanism is provided on the protective layer to align the protective film with the screen of an electronic device Bit.
  • the tab includes a first layer and a second layer, one end of the release layer is sandwiched between the first layer and the second layer, the tab and the second layer One end of the release layer is offset from the boundary of the protective film.
  • the lead plate has a positioning mechanism.
  • the alignment mechanism is provided at an end of the lead piece away from the release layer.
  • the positioning mechanism includes a plurality of positioning holes for positioning the protective film spaced along the outer periphery of the protective film sheet.
  • a plurality of the positioning holes are arranged asymmetrically with each other.
  • the plurality of positioning holes include at least two diameter sizes and are arranged in an array with each other.
  • a method for peeling off the release layer of a protective film comprising:
  • a peeling device is provided, the peeling device peels off the lead sheet and the protective film;
  • the peeling device moves relative to the protective film to peel the release layer from the protective film.
  • the step of relatively moving the peeling device and the protective film to peel the release layer from the protective film sheet specifically includes: the peeling device and the protective film sheet are away from the lead sheet One end of the is relatively moved and the release layer is pressed down to peel the release layer from the protective film.
  • the step of relatively moving the peeling device and the protective film to peel the release layer from the protective film sheet specifically includes: the peeling device and the protective film sheet are away from the lead sheet One end of the is relatively moved and the release layer is rolled up to peel the release layer from the protective film.
  • a protective film provided by the present invention is connected with a lead piece at the end of the release layer, thereby facilitating the peeling of the release layer and the protective film, so that the peeling It is smoother and more efficient, and has a positioning mechanism on its protective layer to align the protective film with the screen of the electronic device, and is used in conjunction with a film sticking machine, which has high film sticking precision and good film sticking effect.
  • the present invention provides a method for peeling off a release layer of a protective film, which uses a positioning device to position the protective film, and the peeling device peels off the lead sheet and the protective film and then moves relative to the protective film to peel off the release layer and the protective film.
  • the peeling process of the release layer is smoother and more efficient, thereby further improving the efficiency and quality of the film.
  • FIG. 1 is a structural diagram of an embodiment of the protective film of the present invention.
  • FIG. 2 is a plan view of FIG. 1.
  • Fig. 3 is an exploded view of Fig. 1.
  • FIG. 4 is a flowchart of an embodiment of a method for peeling a release layer of a protective film of the present invention.
  • FIG. 5 is a schematic diagram of a state of positioning a protective film in an implementation manner of an embodiment of the present invention.
  • FIG. 6 is a schematic view of a state in which the peeling device presses down the tab in an embodiment of the present invention.
  • FIG. 7 is a front view of FIG. 6.
  • FIG. 8 is a schematic diagram of a state in which an end of a peeling device and a protective film away from a leader moves relatively and presses a release layer in an embodiment of the present invention.
  • FIG. 9 is a front view of FIG. 8.
  • FIG. 10 is a schematic diagram of a state in which the release layer and the protective film are completely peeled off in an implementation manner of the embodiment of the present invention.
  • Fig. 11 is a front view of Fig. 10.
  • FIG. 12 is a schematic diagram of the state of the alignment mechanism in an implementation manner of an embodiment of the present invention.
  • FIG. 13 is a flowchart of another embodiment of a method for peeling a release layer of a protective film of the present invention.
  • FIG. 14 is a schematic diagram of a state in which the peeling device winds the leader in another embodiment of the present invention.
  • Fig. 15 is a front view of Fig. 14.
  • FIG. 16 is a schematic diagram of a state in which the peeling device and the end of the protective film away from the lead sheet relatively move and wind the release layer in another embodiment of the present invention.
  • Fig. 17 is a front view of Fig. 16.
  • FIG. 18 is a schematic diagram of a state in which the release layer and the protective film are completely peeled off in another embodiment of the present invention.
  • Fig. 19 is a front view of Fig. 18.
  • a protective film according to an embodiment of the present invention includes a protective film 1, a protective layer 2 and a release layer 3.
  • the protective layer 2 has a positioning mechanism 21 to connect the protective film 1 and the electronic
  • the screen of the device is aligned and used in conjunction with the film laminator to ensure that the protective film 1 is accurately attached to the screen of the electronic device; as shown in FIG. 4, the positioning mechanism 21 includes a plurality of spaced apart along the outer periphery of the protective film 1
  • the positioning hole 210 is used for positioning the protective film 10, and the positioning hole 210 cooperates with the positioning device 20 to realize the positioning of the protective film 10, so that the positioning is accurate and stable.
  • four positioning holes 210 are provided, which meets the requirements for using a general mobile phone protective film.
  • the release layer 3 and the end of the protective film sheet 1 are connected with a lead sheet 4, which facilitates the peeling of the release layer 3 and the protective film sheet 1 during the filming process, making the peeling smoother and more efficient.
  • the plurality of positioning holes 210 include at least two diameter sizes, and the positioning holes 210 of the two diameter sizes are arranged in an array with each other, which is convenient for distinguishing the positioning direction of the protective film 10.
  • the plurality of positioning holes 210 are arranged asymmetrically with each other, or are distributed through misalignment to further ensure that the protective film 10 is in the correct positioning direction when in use.
  • the entire boundary of the protective layer 2 is larger than the boundary of the protective film 1, which is convenient for arranging positioning holes 210 in the protective layer 2 to position the protective film 10.
  • the protective layer 2 may also be provided with a positioning layer having positioning holes 210 to achieve the positioning of the protective film 10.
  • the tab 4 includes a first layer 41 and a second layer 42, and one end of the release layer 3 is sandwiched between the first layer 41 and the second layer 42 to make the connection more stable; preferably The end of the leading piece 4 and the release layer 3 is staggered from the boundary of the protective film 1, the leading piece 4 and the release layer 3 do not overlap each other and the gap is small, which can ensure that the protective film 10 is released from the unused state
  • the area where the layer 3 and the protective film sheet 1 are matched can be stably attached, and after the leader sheet 4 and the protective film sheet 1 are peeled off during the filming process, the release layer 3 and the protective film sheet 1 are easily peeled off.
  • the lead sheet 4 is a hard layer, which is not easily deformed relative to the release layer 3, and when the lead sheet 4 is peeled off from the protective film 10, the release layer 3 has a tendency to bend and deform , So that the release layer 3 and the protective film 1 are more easily peeled off.
  • the tab 4 has an alignment mechanism 43. As shown in FIG. 11, during the peeling process of the release layer 3, the tab can be aligned by the alignment device 40 that cooperates with the alignment mechanism 43 4 Locate the release layer 3 and collect the release layer 3.
  • the positioning mechanism 43 is disposed at the end of the lead sheet 4 away from the release layer 3, and the lead sheet 4 is positioned before the release layer 3 is peeled, so as to avoid the release layer 3 from being detached or bent and jumping during the peeling process , Affecting the peeling quality.
  • the size of the release layer 3 in the width direction is substantially the same as that of the protective film 1, and the size in the length direction is larger than that of the protective film 1, and the release layer 3 is attached to the protective film 1
  • a leading piece 4 is connected to the end of the film, which facilitates the peeling of the release layer 3 along the length direction of the protective film 1 during the film sticking process, making the peeling smoother and more efficient.
  • the lead sheet 4 may also be provided at one end in the width direction of the release layer 3 to facilitate the release of the release layer 3 along the width direction.
  • a method for peeling off the release layer of the protective film includes the following steps:
  • Step S101 providing a positioning device 20, the positioning device 20 cooperates with the positioning mechanism 21 to position the protective film 10, as shown in FIG. 4;
  • Step S102 a peeling device 30 is provided, and the peeling device 30 presses down the lead 4 to peel it from the protective film 10; as shown in FIGS. 5 and 6, when the lead 4 and the protective film 10 peel, the release layer 3 can be removed There is a tendency to bend and deform, so that the release layer 3 and the protective film 1 are more easily peeled off;
  • Step S103 the peeling device 30 and the end of the protective film 1 away from the lead 4 move relatively and press down the release layer 3 to peel the release layer 3 and the protective film 1; as shown in FIGS. 7 to 10, the peeling device During the relative movement and pressing down of the protective film 1, the release layer 3 is gradually peeled off from the protective film 1; preferably, as shown in FIG. 11, the alignment mechanism 43 is The bit device 40 keeps the matching state all the time, positioning the lead 4 and the release layer 3, so as to avoid the separation or bending of the release layer 3 during the peeling process, which affects the peeling quality.
  • a method for peeling off a release layer of a protective film includes the following steps:
  • Step S201 providing a positioning device 20, which cooperates with the positioning mechanism 21 to position the protective film 10;
  • Step S202 a peeling device 30 is provided, and the peeling device 30 winds the lead 4 to peel it from the protective film 10; as shown in FIGS. 13 and 14, the peeling device 30 is a roller, and the roller and / or the lead 4 has Sticky, the two stick to each other when they touch, the roller rewinds the lead 4;
  • Step S203 the peeling device 30 and the end of the protective film 1 away from the lead 4 move relatively and wind up the release layer 3 to peel the release layer 3 from the protective film 1; as shown in FIGS. 15-18, the roller edge The protective film 1 relatively moves and winds the release layer 3 so that the release layer 3 is gradually peeled off from the protective film 1.
  • the method for peeling the release layer of the protective film according to the embodiment of the present invention makes the peeling process of the release layer 3 smoother and more efficient, thereby further improving the efficiency and quality of the film.

Abstract

一种保护膜及其离型层剥离方法，涉及电子设备贴膜技术领域。一种保护膜（10），在其离型层（3）端部连接有引片（4），从而便于带动离型层（3）和保护膜片（1）剥离，使剥离更加顺畅、效率更高，且在其保护层（2）上具有定位机构（21）以将所述保护膜片（1）与电子设备的屏幕对位，与贴膜机配套使用，其贴膜精度高、贴膜效果好。一种保护膜的离型层剥离方法，采用定位装置（20）将保护膜（10）定位，剥离装置（30）将引片（4）与保护膜（10）剥离后与保护膜（10）相对移动以将离型层（3）与保护膜片（1）剥离，离型层（3）剥离过程更加顺畅、效率更高，从而进一步提高贴膜的效率和质量。

Description

一种保护膜及其离型层剥离方法
技术领域
本发明涉及电子设备贴膜技术领域，具体涉及一种保护膜及其离型层剥离方法。
背景技术
现代社会电子设备的使用越来越普及，这类智能电子设备通常具有屏幕，屏幕一般具有触摸功能，通过手指导电的特性，在屏幕上触摸按键进行通话联系或触摸菜单获取信息。为了防止屏幕表面经常触摸或受外力的摩擦或碰撞所造成的损伤，需要在屏幕上贴附保护膜。
现今的保护膜一般采用强度较高的硬质保护膜，如钢化玻璃膜等，钢化膜质地较硬、贴附性强。保护膜一般包括单面粘附有胶水用于贴附于屏幕表面的保护膜片、与保护膜片粘胶端贴合的离型层和与保护膜片另一端贴合的保护层。该种结构的保护膜无法定位，且保护膜的离型层不容易剥离，其贴膜质量不能保证，不适合与贴膜机配套使用。
发明内容
针对现有技术存在的问题，本发明目的在于提供一种保护膜，与贴膜机配套使用，其贴膜精度高、效果好；本发明另一个目的在于提供一种保护膜的离型层剥离方法，其剥离顺畅、效率高。
一种保护膜，包括保护膜片、保护层和离型层，所述离型层端部连接有引片，所述保护层上具有定位机构以将所述保护膜片与电子设备的屏幕对位。
作为上述技术方案的进一步改进，所述引片包括第一层和第二层，所述离型层的一端夹设于所述第一层和所述第二层之间，所述引片与所述离型层配合的一端与所述保护膜片的边界错开。
作为上述技术方案的进一步改进，所述引片上具有对位机构。
作为上述技术方案的进一步改进，所述对位机构设置在所述引片远离所述离型层的一端。
作为上述技术方案的进一步改进，所述定位机构包括沿所述保护膜片的外周间隔设置的多个用于定位保护膜的定位孔。
作为上述技术方案的进一步改进，多个所述定位孔之间相互不对称布置。
作为上述技术方案的进一步改进，多个所述定位孔包括至少两种直径尺寸且相互呈阵列布置。
一种保护膜的离型层剥离方法，该方法包括：
提供一定位装置，所述定位装置与所述定位机构配合以将保护膜定位；
提供一剥离装置，所述剥离装置将引片与所述保护膜剥离；
所述剥离装置与所述保护膜相对移动以将离型层与保护膜片剥离。
作为上述技术方案的进一步改进，所述剥离装置与所述保护膜相对移动以将离型层与保护膜片剥离的步骤，具体包括：所述剥离装置与所述保护膜片远离所述引片的一端相对移动并下压所述离型层以将离型层与保护膜片剥离。
作为上述技术方案的进一步改进，所述剥离装置与所述保护膜相对移动以将离型层与保护膜片剥离的步骤，具体包括：所述剥离装置与所述保护膜片远离所述引片的一端相对移动并收卷所述离型层以将离型层与保护膜片剥离。
本发明的有益效果是：与现有的技术相比，本发明提供的一种保护膜，在其离型层端部连接有引片，从而便于带动离型层和保护膜片剥离，使剥离更加顺畅、效率更高，且在其保护层上具有定位机构以将所述保护膜片与电子设备的屏幕对位，与贴膜机配套使用，其贴膜精度高、贴膜效果好。本发明提供的一种保护膜的离型层剥离方法，采用定位装置将保护膜定位，剥离装置将引片与保护膜剥离后与保护膜相对移动以将离型层与保护膜片剥离的方案，离型层剥离过程更加顺畅、效率更高，从而进一步提高贴膜的效率和质量。
附图说明
图1是本发明保护膜一种实施例的结构图。
图2是图1的俯视图。
图3是图1的爆炸图。
图4是本发明保护膜的离型层剥离方法一种实施例的流程图。
图5是本发明实施例的一种实施方式中将保护膜定位的状态示意图。
图6是本发明实施例的一种实施方式中剥离装置将引片下压的状态示意图。
图7是图6的正视图。
图8是本发明实施例的一种实施方式中剥离装置与保护膜片远离引片的一端相对移动并下压离型层的状态示意图。
图9是图8的正视图。
图10是本发明实施例的一种实施方式中离型层与保护膜片完全剥离的状态示意图。
图11是图10的正视图。
图12是本发明实施例的一种实施方式中对位机构的状态示意图。
图13是本发明保护膜的离型层剥离方法另一种实施例的流程图。
图14是本发明实施例的另一种实施方式中剥离装置将引片收卷的状态示意图。
图15是图14的正视图。
图16是本发明实施例的另一种实施方式中剥离装置与保护膜片远离引片的一端相对移动并收卷离型层的状态示意图。
图17是图16的正视图。
图18是本发明实施例的另一种实施方式中离型层与保护膜片完全剥离的状态示意图。
图19是图18的正视图。
具体实施方式
参考图1和图2所示，本发明实施例的一种保护膜，包括保护膜片1、保护层2和离型层3，保护层2上具有定位机构21以将保护膜片1与电子设备的屏幕对位，与贴膜机配合使用，以保证保护膜片1准确贴附在电子设备的屏幕上；如图4所示，定位机构21包括沿保护膜片1的外周间隔设置的多个用于定位保护膜10的定位孔210，定位孔210与定位装置20配合实现保护膜10的定位，使定位精准稳定。本实施例中定位孔210设置有4个，满足一般手机保护膜的使用要求。另外，离型层3与保护膜片1部贴附的端部连接有引片4，在贴膜过程中便于驱使离型层3和保护膜片1剥离，使剥离更加顺畅、效率更高。
在本发明的一些实施例中，多个所述定位孔210包括至少两种直径尺寸，两种直径尺寸的定位孔210相互呈阵列布置，便于区分保护膜10的定位方向。优选的，多个定位孔210之间相互不对称布置，或通过错位分布，进一步确保保护膜10在使用时处于正确的定位方向。
在本发明的一些实施例中，保护层2的边界整体大于保护膜片1的边界，便于在保护层2布置定位孔210，对保护膜10进行定位。作为另一种实施例，保护层2也可以贴设具有定位孔210的定位层实现保护膜10的定位。
在本发明的一些实施例中，引片4包括第一层41和第二层42，离型层3的一端夹设于第一层41和第二层42之间，使连接更加稳定；优选的，引片4与离型层3配合的一端与保护膜片1的边界错开，引片4和离型层3相互不重合且间隙很小，能保证保护膜10在未使用状态下离型层3与保护膜片1配合的区域能稳定贴附，且贴膜过程中引片4与保护膜片1剥离后，离型层3与保护膜片1容易剥离。
在本发明的一些实施例中，引片4为硬质层，相对于离型层3而言不容易发生变形，引片4与保护膜10剥离时能使离型层3具有弯曲变型的趋势，从而使离型层3与保护膜片1更容易剥离。
在本发明的一些实施例中，引片4上具有对位机构43，如图11所示，离型层3在剥离过程中，可通过与对位机构43配合的对位装置40对引片4和离型层3进行定位，对离型层3进行收集。优选的，对位机构43设置在引片4远离离型层3的一端，在离型层3剥离前对引片4进行定位，以避免在剥离过程中离型层3发生脱离或弯折跳动，影响剥离质量。
本发明的一些实施例中，离型层3在宽度方向上的尺寸与保护膜片1基本相同，在长度方向上的尺寸大于保护膜片1，离型层3与保护膜片1部贴附的端部连接有引片4，在贴膜过程中便于驱使离型层3沿保护膜片1的长度方向剥离，使剥离更加顺畅、效率更高。另外，引片4也可以设置在离型层3宽度方向的一端，便于离型层3沿其宽度方向剥离。
参考图3所示为本发明一种实施例的保护膜的离型层剥离方法，包括以下步骤：
步骤S101：提供一定位装置20，定位装置20与定位机构21配合以将保护膜10定位，如图4所示；
步骤S102：提供一剥离装置30，剥离装置30将引片4下压使其与保护膜10剥离；如图5和图6所示，引片4与保护膜10剥离时能使离型层3具有弯曲变型的趋势，从而使离型层3与保护膜片1更容易剥离；
步骤S103：剥离装置30与保护膜片1远离引片4的一端相对移动并下压离型层3以将离型层3与保护膜片1剥离；如图7至图10所示，剥离装置30沿保护膜片1相对移动并下压的过程中，带动离型层3逐渐与保护膜片1剥离；优选的，如图11所示，对位机构43在剥离装置30移动过程中与对位装置40一直保持配合状态，对引片4和离型层3进行定位，以避免在剥离过程中离型层3发生脱离或弯折跳动，影响剥离质量。
参考图12所示为本发明另一种实施例的保护膜的离型层剥离方法，包括以下步骤：
步骤S201：提供一定位装置20，定位装置20与定位机构21配合以将保护膜10定位；
步骤S202：提供一剥离装置30，剥离装置30将引片4收卷使其与保护膜10剥离；如图13和图14所示，剥离装置30为一滚轮，滚轮和/或引片4具有粘性，两者接触时相互粘合，滚轮对引片4进行收卷；
步骤S203：剥离装置30与保护膜片1远离引片4的一端相对移动并收卷离型层3以将离型层3与保护膜片1剥离；如图15至图18所示，滚轮沿保护膜片1相对移动并对离型层3进行收卷，使离型层3逐渐与保护膜片1剥离。
本发明实施例的保护膜的离型层剥离方法，该方法使离型层3剥离过程更加顺畅、效率更高，从而进一步提高贴膜的效率和质量。
以上具体结构是对本发明的较佳实施例进行了具体的说明，但并非因此限制本发明的实施方式及保护范围，熟悉本领域的技术人员在不违背本发明精神的前提下还可以做出种种的等同变形或者替换，这些等同的变形或者替换均包含在本申请权利要求所限定的范围内。

Claims (10)

  1. 一种保护膜，其特征在于：包括保护膜片、保护层和离型层，所述离型层端部连接有引片，所述保护层上具有定位机构以将所述保护膜片与电子设备的屏幕对位。
  2. 根据权利要求1所述的一种保护膜，其特征在于：所述引片包括第一层和第二层，所述离型层的一端夹设于所述第一层和所述第二层之间，所述引片与所述离型层配合的一端与所述保护膜片的边界错开。
  3. 根据权利要求1或2所述的一种保护膜，其特征在于：所述引片上具有对位机构。
  4. 根据权利要求3所述的一种保护膜，其特征在于：所述对位机构设置在所述引片远离所述离型层的一端。
  5. 根据权利要求1所述的一种保护膜，其特征在于：所述定位机构包括沿所述保护膜片的外周间隔设置的多个用于定位保护膜的定位孔。
  6. 根据权利要求5所述的一种保护膜，其特征在于：多个所述定位孔之间相互不对称布置。
  7. 根据权利要求5所述的一种保护膜，其特征在于：多个所述定位孔包括至少两种直径尺寸且相互呈阵列布置。
  8. 一种保护膜的离型层剥离方法，其特征在于，该方法包括：
    提供一定位装置，所述定位装置与所述定位机构配合以将保护膜定位；
    提供一剥离装置，所述剥离装置将引片与所述保护膜剥离；
    所述剥离装置与所述保护膜相对移动以将离型层与保护膜片剥离。
  9. 根据权利要求8所述的一种保护膜的离型层剥离方法，其特征在于：所述剥离装置与所述保护膜相对移动以将离型层与保护膜片剥离的步骤，具体包括：所述剥离装置与所述保护膜片远离所述引片的一端相对移动并下压所述离型层以将离型层与保护膜片剥离。
  10. 根据权利要求8所述的一种保护膜的离型层剥离方法，其特征在于：所述剥离装置与所述保护膜相对移动以将离型层与保护膜片剥离的步骤，具体包括：所述剥离装置与所述保护膜片远离所述引片的一端相对移动并收卷所述离型层以将离型层与保护膜片剥离。
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