WO2020089728A1 - 表示装置、表示モジュール、及び電子機器 - Google Patents
表示装置、表示モジュール、及び電子機器 Download PDFInfo
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- WO2020089728A1 WO2020089728A1 PCT/IB2019/058965 IB2019058965W WO2020089728A1 WO 2020089728 A1 WO2020089728 A1 WO 2020089728A1 IB 2019058965 W IB2019058965 W IB 2019058965W WO 2020089728 A1 WO2020089728 A1 WO 2020089728A1
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- layer
- transistor
- conductive layer
- display device
- liquid crystal
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/44—Arrangements combining different electro-active layers, e.g. electrochromic, liquid crystal or electroluminescent layers
Definitions
- One embodiment of the present invention relates to a display device, a display module, and an electronic device.
- the technical field of one embodiment of the present invention includes a semiconductor device, a display device, a light-emitting device, a power storage device, a storage device, an electronic device, a lighting device, an input device (e.g., a touch sensor), and an input / output device (e.g., a touch panel). ), Their driving method, or those manufacturing methods can be mentioned as an example.
- a flat panel display represented by a liquid crystal display device and a light emitting display device is widely used.
- silicon is mainly used as a semiconductor material of a transistor forming these display devices, in recent years, a technique of using a transistor using a metal oxide for a pixel of the display device has been developed.
- Patent Documents 1 and 2 disclose a technique in which a transistor using a metal oxide as a semiconductor material is used for a switching element of a pixel of a display device or the like.
- Patent Document 3 discloses a memory device having a configuration in which a transistor having an extremely low off-state current is used for a memory cell.
- An object of one embodiment of the present invention is to provide a display device with high visible light transmittance. Another object of one embodiment of the present invention is to provide a display device with a high aperture ratio. Alternatively, it is an object of one embodiment of the present invention to provide a display device with low power consumption. Alternatively, it is an object of one embodiment of the present invention to provide a highly reliable display device. Another object is to provide a display device capable of stable operation in a wide temperature range. Another object of one embodiment of the present invention is to provide a highly convenient display device.
- a pixel includes a first transistor, a second transistor, a first insulating layer, a second insulating layer, a first conductive layer, a pixel electrode, a layer including a liquid crystal material, and a common electrode. And a display device.
- the first insulating layer is located on the channel formation region of the first transistor.
- the first conductive layer is located on the first insulating layer.
- the second insulating layer is located over the first transistor, the second transistor, the first insulating layer, and the first conductive layer.
- the pixel electrode is located on the second insulating layer.
- the layer including the liquid crystal material is located on the pixel electrode.
- the common electrode is located on the layer containing the liquid crystal material.
- the common electrode has a region overlapping with the first conductive layer with the layer including a liquid crystal material and the pixel electrode interposed therebetween.
- the pixel further has a first connection portion and a second connection portion. At the first connection portion, the first conductive layer is electrically connected to the first transistor.
- the pixel electrode is electrically connected to the second transistor in the second connection portion.
- the first conductive layer, the pixel electrode, and the common electrode each have a function of transmitting visible light.
- the pixel preferably further has a second conductive layer.
- the first conductive layer and the second conductive layer are preferably located on the same surface. It is preferable that the first conductive layer and the second conductive layer are electrically insulated from each other.
- the common electrode preferably has a region overlapping with the second conductive layer with the layer including a liquid crystal material and the pixel electrode interposed therebetween.
- Visible light transmission through the layer containing the liquid crystal material is higher when a voltage is not applied between the pixel electrode and the common electrode than when a voltage is applied between the pixel electrode and the common electrode. A high rate is preferred.
- the layer containing a liquid crystal material preferably contains a polymer material.
- the polymer material is preferably a copolymer of a polyfunctional monomer and a monofunctional monomer.
- the polyfunctional monomer preferably has a phenyl benzoate skeleton.
- the monofunctional monomer preferably has a cyclohexylbenzene skeleton.
- the first transistor preferably has a function of transmitting visible light.
- the second transistor preferably has a function of transmitting visible light.
- the pixel preferably further has a third conductive layer.
- the first conductive layer and the third conductive layer are preferably located on the same surface. It is preferable that the first conductive layer and the third conductive layer are electrically insulated from each other.
- the pixel electrode have a region in contact with the third conductive layer and the third conductive layer have a region in contact with the source or the drain of the second transistor.
- the source or the drain of the second transistor preferably has a function of transmitting visible light.
- the first insulating layer is preferably located on the first transistor.
- the first insulating layer preferably has a planarizing function.
- At least one of the gate, the source, and the drain of the first transistor and the gate, the source, and the drain of the second transistor has a first layer and a second layer on the first layer, It is preferable to have The second layer preferably has a smaller resistance value than the first layer.
- At least one of the gate, the source, and the drain of the first transistor and the gate, the source, and the drain of the second transistor is the first layer and the second layer over the first layer.
- a third layer on the second layer is the second layer.
- the second layer preferably has a smaller resistance value than the first layer, and the third layer preferably has lower visible light reflectance than the second layer. It is preferable that the second layer and the third layer contain at least one same metal element.
- the display device of one embodiment of the present invention preferably has a function of displaying by a field sequential driving method.
- One embodiment of the present invention is a display module including a display device having any of the above structures and a light-emitting device having a light-emitting element, which are stacked.
- the light emitting device has a function of displaying an image. The light emitted by the light emitting element is extracted through the display device.
- One embodiment of the present invention is a module having a display device having any of the above structures and having a connector such as a flexible printed circuit board (Flexible printed circuit, hereinafter referred to as FPC) or TCP (Tape Carrier Package) attached thereto, Alternatively, it is a module such as a module in which an integrated circuit (IC) is mounted by a COG (Chip On Glass) method or a COF (Chip On Film) method.
- FPC flexible printed circuit board
- TCP Tape Carrier Package
- One embodiment of the present invention is an electronic device including the above module and at least one of an antenna, a battery, a housing, a camera, a speaker, a microphone, and an operation button.
- a display device with high visible light transmittance can be provided.
- a display device with a high aperture ratio can be provided.
- a display device with low power consumption can be provided.
- a highly reliable display device can be provided.
- a display device capable of stable operation over a wide temperature range can be provided.
- a highly convenient display device can be provided.
- FIG. 1A and 1B are cross-sectional views showing an example of a display device.
- FIG. 2 is a circuit diagram showing an example of a pixel.
- FIG. 3A is a top view showing an example of the display module.
- FIG. 3B is a sectional view showing an example of the display module.
- FIG. 4 is a top view showing an example of a pixel.
- 5A, 5B, 5C, and 5D are cross-sectional views showing an example of the display module.
- FIG. 6 is a sectional view showing an example of the display module.
- FIG. 7 is a top view showing an example of a pixel.
- FIG. 8 is a sectional view showing an example of the display module.
- FIG. 9 is a sectional view showing an example of the display module.
- FIG. 10 is a sectional view showing an example of the display module.
- FIG. 11 is a sectional view showing an example of the display module.
- 12A, 12B, 12C, and 12D are diagrams illustrating examples of electronic devices.
- 13A, 13B, 13C, and 13D are diagrams illustrating examples of electronic devices.
- 14A, 14B, and 14C are diagrams illustrating examples of electronic devices.
- film and the term “layer” can be interchanged with each other depending on the case or circumstances.
- conductive layer can be changed to the term “conductive film”.
- insulating film can be changed to the term “insulating layer”.
- a display device of one embodiment of the present invention includes at least one liquid crystal element and two transistors in one pixel.
- the display device of one embodiment of the present invention has a function of adding a correction signal to an image signal.
- the correction signal is added to the image signal by capacitive coupling and supplied to the liquid crystal element. Therefore, the liquid crystal element can display a corrected image.
- the liquid crystal element can express more gradations than can be expressed using only the image signal.
- the liquid crystal element can be driven with a voltage higher than the output voltage of the source driver. Since the voltage supplied to the liquid crystal element can be changed to a desired value in the pixel, the existing source driver can be diverted and the cost for newly designing the source driver can be reduced. Further, it is possible to suppress the output voltage of the source driver from increasing, and it is possible to reduce the power consumption of the source driver.
- the display device By driving a liquid crystal element by applying a high voltage, the display device can be used in a wide temperature range and display can be performed with high reliability in both a low temperature environment and a high temperature environment.
- the display device of one embodiment of the present invention can be used as a display device for a vehicle or a camera.
- the liquid crystal element can be driven by applying a high voltage, it is possible to improve the response speed of the liquid crystal by overdrive driving that temporarily increases the voltage applied to the liquid crystal element to change the orientation of the liquid crystal quickly. it can.
- the correction signal is generated by an external device and written in each pixel, for example.
- the correction signal may be generated in real time using an external device, or the correction signal stored in the recording medium may be read and synchronized with the image signal.
- the supplied image signal is not changed, and a new image signal can be generated by the pixel to which the correction signal is supplied.
- the load on the external device can be reduced.
- the operation for generating a new image signal with pixels can be performed in a small number of steps, and a display device with a large number of pixels and a short horizontal period can be used.
- the liquid crystal element includes a pair of electrodes and a layer containing a liquid crystal material.
- the layer including a liquid crystal material shows a state where visible light is transmitted
- a mode also referred to as a reverse mode
- the layer containing a liquid crystal material preferably contains a liquid crystal material and a polymer material.
- the layer containing the liquid crystal material includes polymer liquid crystal, polymer dispersed liquid crystal (PDLC: Polymer Dispersed Liquid Crystal), polymer network liquid crystal (PNLC: Polymer Network Liquid Crystal), polymer stabilized liquid crystal. Etc. can be used.
- the display device of one embodiment of the present invention can drive a liquid crystal element by applying a high voltage, and thus has a structure suitable when a reverse mode is applied.
- the display device of one embodiment of the present invention preferably includes at least two capacitor elements in one pixel. Both of the two capacitive elements are formed of a material that transmits visible light. As a result, the pixel can have both a high aperture ratio and a large storage capacitance.
- the transmittance of visible light in the display device can be increased, and thus the display device can be preferably used as a see-through display. Further, the light extraction efficiency (or the pixel transmittance) can be increased by increasing the aperture ratio. As a result, the power consumption of the display device can be reduced.
- the gradation of the pixel can be held for a long time. Specifically, by increasing the storage capacity of the pixel, the image signal written in the previous period can be held without rewriting the image signal for each frame period. It is possible to maintain the gradation of the pixel over the frame period.
- a connecting portion between an electrode included in the transistor and an electrode included in the capacitor or the liquid crystal element preferably has a function of transmitting visible light. As a result, the aperture ratio of the pixel can be increased.
- the display device of one embodiment of the present invention does not need to include a polarizing plate. Thereby, the transmittance of visible light in the display device can be increased.
- a light-blocking layer such as a black matrix may not be provided. Thereby, the transmittance of the pixel can be improved.
- FIG. 1A shows a sectional view of the display device 10.
- the display device 10 illustrated in FIG. 1A includes a substrate 131, a transistor SW11, a transistor SW12, an insulating layer 215, a conductive layer 115a, a conductive layer 115b, an insulating layer 121, a pixel electrode 111a, a layer 112 containing a liquid crystal material, a common electrode 113, and It has a substrate 132.
- the display device 10 includes, in a pixel, a liquid crystal element 110, two transistors (a transistor SW11 and a transistor SW12), and two capacitor elements (a capacitor element Cw and a capacitor element Cs).
- the transistors SW11 and SW12 are located on the substrate 131, respectively.
- the insulating layer 215 is located over the transistor SW11 and the transistor SW12.
- the conductive layer 115a and the conductive layer 115b are located over the insulating layer 215, respectively.
- the insulating layer 121 is located over the transistor SW11, the transistor SW12, the insulating layer 215, the conductive layer 115a, and the conductive layer 115b.
- the pixel electrode 111a is located on the insulating layer 121.
- the layer 112 including a liquid crystal material is located over the pixel electrode 111a.
- the common electrode 113 is located on the layer 112 containing a liquid crystal material.
- the substrate 132 is located on the common electrode 113.
- the common electrode 113 has a region overlapping with the conductive layer 115a with the layer 112 containing a liquid crystal material and the pixel electrode 111a interposed therebetween.
- the conductive layer 115a is electrically connected to the source or the drain of the transistor SW11.
- the pixel electrode 111a is electrically connected to the source or drain of the transistor SW12.
- the conductive layer 115a, the conductive layer 115b, the pixel electrode 111a, and the common electrode 113 each have a function of transmitting visible light.
- the pixel electrode 111 a, the layer 112 containing a liquid crystal material, and the common electrode 113 can function as the liquid crystal element 110.
- the pixel electrode 111a and the common electrode 113 are stacked on each other with a layer 112 containing a liquid crystal material interposed therebetween.
- the conductive layer 115a, the insulating layer 121, and the pixel electrode 111a can function as one capacitive element Cw. Further, the conductive layer 115b, the insulating layer 121, and the pixel electrode 111a can function as one capacitor Cs.
- the capacitance of the capacitive element Cw is preferably larger than the capacitance of the capacitive element Cs.
- the area of the region where the pixel electrode 111a and the conductive layer 115a overlap is preferably larger than the area of the region where the pixel electrode 111a and the conductive layer 115b overlap.
- the configuration of the display device 10 can also be applied to a touch panel.
- the touch panel 11 shown in FIG. 1B is an example in which the touch sensor TC is mounted on the display device 10 shown in FIG. 1A. By providing the touch sensor TC at a position close to the display surface of the display device 10, the sensitivity of the touch sensor TC can be increased.
- sensing element also referred to as a sensor element
- Various sensors that can detect the proximity or contact of a detection target such as a finger or a stylus can be applied as the detection element.
- a sensor system various systems such as a capacitance system, a resistance film system, a surface acoustic wave system, an infrared system, an optical system, and a pressure sensitive system can be used.
- the electrostatic capacity method there are a surface type electrostatic capacity method, a projection type electrostatic capacity method and the like. Further, as the projection type electrostatic capacity method, there are a self capacity method, a mutual capacity method and the like. The use of the mutual capacitance method is preferable because simultaneous multipoint detection is possible.
- the touch panel of one embodiment of the present invention has a structure in which a display device and a sensing element which are manufactured separately are attached to each other, a structure in which an electrode or the like forming the sensing element is provided on one or both of a substrate supporting the display element and a counter substrate, or the like. , Various configurations can be applied.
- the display device 10 has a plurality of pixels 15 arranged in a matrix of m rows and n columns (m and n are each an integer of 1 or more).
- FIG. 2 shows a circuit diagram of the pixel 15 (i, j) (i is an integer of 1 or more and m or less, j is an integer of 1 or more and n or less).
- the pixel 15 (i, j) includes a transistor SW11, a transistor SW12, a capacitor Cw, a capacitor Cs, and a liquid crystal element 110 (i, j). Note that in this specification and the like, the transistor SW11, the transistor SW12, the capacitor Cw, and the capacitor Cs are collectively referred to as a pixel circuit 120 (i, j).
- One of a source and a drain of the transistor SW11 is electrically connected to one electrode of the capacitor Cw.
- the other electrode of the capacitor Cw is electrically connected to one of a source and a drain of the transistor SW12, one electrode of the capacitor Cs, and one electrode of the liquid crystal element 110.
- a node to which one of the source and the drain of the transistor SW11 and one electrode of the capacitor Cw is connected is a node NS.
- a node to which the other electrode of the capacitor Cw, one of the source and the drain of the transistor SW12, one electrode of the capacitor Cs, and one electrode of the liquid crystal element 110 is connected is referred to as a node NA.
- the gate of the transistor SW11 is electrically connected to the wiring GL1 (i).
- the gate of the transistor SW12 is electrically connected to the wiring GL2 (i).
- the other of the source and the drain of the transistor SW11 is electrically connected to the wiring SL1 (j).
- the other of the source and the drain of the transistor SW12 is electrically connected to the wiring SL2 (j).
- the other electrode of the capacitor Cs is electrically connected to the wiring CSCOM.
- the other electrode of the liquid crystal element 110 is electrically connected to the wiring VCOM.
- An arbitrary potential can be supplied to each of the wiring CSCOM and the wiring VCOM.
- the wiring GL1 (i) and the wiring GL2 (i) can each be called a scan line and have a function of controlling operation of a transistor.
- the wiring SL1 (j) has a function as a signal line which supplies an image signal.
- the wiring SL2 (j) has a function as a signal line for writing data to the node NA.
- each transistor illustrated in FIG. 2 includes a back gate electrically connected to the gate, the back gate is not limited to this connection. In addition, the back gate may not be provided in the transistor.
- the potential of the node NS can be held.
- the potential of the node NA can be held by turning off the transistor SW12.
- capacitive coupling via the capacitive element Cw allows the node NA to respond to a change in the potential of the node NS. The potential of can be changed.
- the correction signal written to the node NA from the wiring SL2 (j) is capacitively coupled to the image signal supplied from the wiring SL1 (j) and supplied to the liquid crystal element 110. Therefore, the liquid crystal element 110 can display the corrected image.
- the transistor having extremely low off-state current include a transistor including a metal oxide in a channel formation region (hereinafter referred to as an OS transistor).
- a transistor including silicon in a channel formation region hereinafter referred to as a Si transistor
- Si transistor a transistor including amorphous silicon, a transistor including crystalline silicon (typically, low temperature polysilicon, single crystal silicon), or the like can be given.
- both the OS transistor and the Si transistor may be used.
- an OS transistor or a Si transistor may be used for the transistors SW11 and SW12.
- OS transistors it is preferable to use OS transistors as the transistors SW11 and SW12 rather than Si transistors.
- ⁇ Display module configuration example 1> 3A shows a top view of the display module 50
- FIG. 3B shows a cross-sectional view of the display module 50.
- the display module 50 shown in FIGS. 3A and 3B includes a display device, a flexible printed circuit board (FPC) connected to the display device, and a light unit 30 (omitted in FIG. 3A).
- FPC flexible printed circuit board
- the display device includes a display area 100, a gate driver GD_L, and a gate driver GD_R.
- the display region 100 has a plurality of pixels 15 and has a function of displaying an image.
- the pixel 15 (i, j) is electrically connected to the wiring GL1 (i), the wiring GL2 (i), the wiring SL1 (j), and the wiring SL2 (j).
- the pixel 15 (i, j) has a structure in which the pixel circuit 120 (i, j) shown in FIG. 2 and the liquid crystal element 110 (i, j) are stacked.
- the pixel circuit 120 (i, j) is electrically connected to the gate driver GD (corresponding to the gate driver GD_L and the gate driver GD_R shown in FIG. 3A).
- the display module 50 can display an image by controlling light scattering or transmission in the liquid crystal element 110 (i, j). Specifically, the liquid crystal element 110 (i, j) scatters the light 32 emitted from the light unit 30 and emits the scattered light 34 to the outside, whereby the display module 50 can display an image. it can.
- the light unit 30 has at least a light source.
- a light source an LED (Light Emitting Diode), an organic EL (Electroluminescence) element, or the like can be used.
- LEDs of three colors of red, green and blue can be used.
- the light unit 30 may have one or both of a structure having a light guiding function and a structure having a light diffusing function.
- the light unit 30 may include at least one of a light guide plate (also referred to as a light guide), a brightness enhancement film, a light diffusion film, and a light diffusion plate.
- a light guide plate also referred to as a light guide
- a brightness enhancement film for example, it is preferable that the light emitted from the light source enters the display device through the light guide plate and the light diffusion film.
- the display module 50 uses the edge light type light source as the light source, it is possible to widen the visible light transmitting region in the display device as compared with the case where the direct type backlight is used, and further, in the display device. Visibility of visible light can be increased. As a result, the scenery behind the display module 50 can be seen through the display module 50. For example, as shown in FIG. 3B, at least a part of the external light 35 incident on the pixel 15 (i, j) passes through the display module 50 and is emitted to the outside of the display module 50.
- the display device of one embodiment of the present invention preferably has a function of displaying by a field sequential driving method.
- the field sequential drive system is a drive system in which color display is performed by time division. Specifically, light-emitting elements of red, green, blue, and the like are sequentially turned on with a time shift, pixels are driven in synchronization with this, and color display is performed based on the successive additive color mixing method.
- the field sequential driving method When the field sequential driving method is applied, it is not necessary to configure one pixel with a plurality of sub-pixels of different colors, so that the aperture ratio of the pixel can be increased. Further, high definition of the display device is possible. In addition, since it is not necessary to provide a colored layer such as a color filter, light is not absorbed by the colored layer, and the transmittance of the pixel can be improved. As a result, the required brightness can be obtained with a small amount of power, and thus low power consumption can be realized. In addition, the manufacturing process of the display device can be simplified and the manufacturing cost can be reduced.
- the display device of one embodiment of the present invention When applying the field sequential driving method, a high frame frequency is required. Since the display device of one embodiment of the present invention has two capacitor elements in one pixel, the pixel has a large storage capacitance and can supply a high voltage to the liquid crystal element, so that the response speed of the liquid crystal element is improved. be able to. For example, the response speed of the liquid crystal element can be improved by overdrive driving in which the voltage applied to the liquid crystal element is temporarily increased to rapidly change the orientation of the liquid crystal. Therefore, it can be said that the display device of one embodiment of the present invention has a suitable structure when a field sequential driving method in which a high frame frequency is required is applied.
- the display device of one embodiment of the present invention may be monochrome display. Even in a display device for monochromatic display, it is not necessary to configure one pixel with a plurality of sub-pixels of different colors, so that the aperture ratio of the pixel can be increased. Further, high definition of the display device is possible. In addition, since it is not necessary to provide a colored layer such as a color filter, light is not absorbed by the colored layer, and the transmittance of the pixel can be improved. As a result, the required brightness can be obtained with a small amount of power, and thus low power consumption can be realized. In addition, the manufacturing process of the display device can be simplified and the manufacturing cost can be reduced.
- one pixel may be formed using a plurality of subpixels of different colors. For example, by forming one pixel unit with a red subpixel, a green subpixel, and a blue subpixel, full-color display can be performed in the display region 100.
- the colors presented by the subpixels are not limited to red, green, and blue.
- sub-pixels exhibiting colors such as white, yellow, magenta, and cyan may be used.
- the display device may include one or more of a scan line driver circuit (gate driver), a signal line driver circuit (source driver), and a driver circuit for a touch sensor. Also, one or more of these may be externally attached.
- the display module 50 shown in FIGS. 3A and 3B has a structure in which a gate driver is incorporated and an integrated circuit (IC) having a source driver is externally attached.
- the gate driver GD_L and the gate driver GD_R are provided at positions facing each other with the display region 100 in between.
- the selection signal is simultaneously supplied to the wiring GL1 (i) from both the gate driver GD_L and the gate driver GD_R.
- the selection signal is supplied to the wiring GL2 (i) from both the gate driver GD_L and the gate driver GD_R at the same time.
- the source driver SD is electrically connected to a terminal included in the display device by using a COG (Chip on glass) method, a COF (Chip on Film) method, or the like.
- a signal such as an image signal or a correction signal is supplied from the source driver SD to each of the wiring SL1 (j) and the wiring SL2 (j).
- FIG. 4 shows a top view of the pixel 15 (i, j).
- FIG. 4 is a top view of the laminated structure from the wiring GL1 (i) to the pixel electrode 111a as viewed from the pixel electrode 111a side.
- the pixel has a connection portion 71 and a connection portion 72.
- the conductive layer 115a is electrically connected to the transistor SW11. Specifically, the conductive layer 115a and the conductive layer 222p are electrically connected.
- the pixel electrode 111a is electrically connected to the transistor SW12. Specifically, the pixel electrode 111a and the conductive layer 222f are electrically connected.
- each of the connection portion 71 and the connection portion 72 has a region that transmits visible light.
- a conductive material which transmits visible light is used for a conductive layer (a conductive layer 222p and a conductive layer 222f in FIG. 4) functioning as a source or a drain, so that the connection portion 71 and the connection are formed.
- a region that transmits visible light can be provided in the portion 72, so that the aperture ratio of the pixel 15 (i, j) can be increased. Thereby, the transmittance of visible light in the display device 10 can be improved.
- the region of the pixel 15 (i, j) that transmits visible light can be widened.
- the wiring SL1 (j) functioning as a signal line is electrically connected to the semiconductor layer 231b through the conductive layer 222q. Note that the wiring SL1 (j) and the semiconductor layer 231b may be in contact with each other without providing the conductive layer 222q.
- the wiring SL2 (j) functioning as a signal line is electrically connected to the semiconductor layer 231a through the conductive layer 222g.
- the wiring SL2 (j) and the semiconductor layer 231a may be in contact with each other without providing the conductive layer 222g.
- a conductive material that transmits visible light may have a higher resistivity than a conductive material that blocks visible light, such as copper or aluminum.
- Bus lines such as scanning lines and signal lines are preferably formed using a conductive material (metal material) having a low resistivity such as copper or aluminum in order to prevent signal delay.
- a conductive material that transmits visible light can be used for the bus line depending on the size of the pixel, the width of the bus line, the thickness of the bus line, and the like.
- the wiring SL1 (j) and the wiring SL2 (j) functioning as signal lines are preferably formed using a conductive material having a low resistivity.
- the wirings GL1 (i) and the wirings GL2 (i) functioning as gates and scan lines are preferably formed using a conductive material having a low resistivity. Examples of the conductive material having a low resistivity include metals and alloys.
- the gates 223a and 223b functioning as back gates may be formed using a conductive material which blocks visible light.
- a metal oxide may be used for the gates 223a and 223b.
- oxygen can be prevented from being extracted from the channel formation regions of the semiconductor layers 231a and 231b. This can increase the reliability of the transistor.
- FIG. 5A shows a sectional view of the display module 50.
- the pixel portion corresponds to a cross-sectional view taken along alternate long and short dash line G1-G2 and between G3-G4 shown in FIG.
- the display module 50 shown in FIG. 5A has a configuration in which an FPC is connected to the display device.
- the display module of one embodiment of the present invention does not have a polarizing plate, it has high visible light transmittance.
- the light source is not illustrated in the cross-sectional views illustrated in FIG. 5A and subsequent drawings, the display module of one embodiment of the present invention uses an edge light type light, and therefore, compared to a case where a direct-type backlight is used, It is possible to widen the area of the display module that transmits visible light. Therefore, the display module of one embodiment of the present invention has high visible light transmittance, and a landscape behind the display module can be viewed through the display module.
- the display module 50 illustrated in FIG. 5A includes a substrate 131, a substrate 132, a transistor SW11, a transistor SW12, an insulating layer 215, a conductive layer 115a, a conductive layer 115b, a conductive layer 115c, an insulating layer 121, a pixel electrode 111a, and a layer including a liquid crystal material.
- the display module 50 can display a color image using a field sequential driving method. Therefore, the display module 50 shown in FIG. 5A does not have a coloring layer such as a color filter. Furthermore, the display module 50 does not have a light shielding layer such as a black matrix. Therefore, the transmittance of the pixel can be improved.
- the transistors SW11 and SW12 are located on the substrate 131.
- the transistor SW11 includes a gate 221b, a gate insulating layer 211, a semiconductor layer 231b, a conductive layer 222p, a conductive layer 222q, an insulating layer 213, an insulating layer 214, and a gate 223b.
- One of the conductive layers 222p and 222q functions as a source and the other functions as a drain.
- the insulating layers 213 and 214 function as gate insulating layers.
- the conductive layer 222b may be a constituent element of the transistor SW11.
- the conductive layer 222b is connected to the conductive layer 222q.
- the gate 221b and the wiring GL1 (i) are formed using the same conductive layer. It can be said that one conductive layer has a portion functioning as the gate 221b and a portion functioning as the wiring GL1 (i).
- the conductive layer 222b corresponds to part of the wiring SL1 (j).
- the transistor SW12 includes a gate 221a, a gate insulating layer 211, a semiconductor layer 231a, a conductive layer 222f, a conductive layer 222g, an insulating layer 213, an insulating layer 214, and a gate 223a.
- One of the conductive layers 222f and 222g functions as a source and the other functions as a drain.
- the insulating layers 213 and 214 function as gate insulating layers.
- the conductive layer 222a may be a constituent element of the transistor SW12.
- the conductive layer 222a is connected to the conductive layer 222g.
- the gate 221a and the wiring GL2 (i) are formed using the same conductive layer. It can be said that one conductive layer has a portion functioning as the gate 221a and a portion functioning as the wiring GL2 (i).
- the conductive layer 222a corresponds to part of the wiring SL2 (j).
- the conductive layers 222f, 222g, 222p, 222q are formed of a material that transmits visible light. Therefore, at least part of the external light 35 shown in FIG. 5A is transmitted through the connection portion (corresponding to the connection portion 72 in FIG. 4) between the conductive layer 222f and the conductive layer 115c, and is emitted to the outside of the display module.
- the connecting portion between the conductive layer 222p and the conductive layer 115a (corresponding to the connecting portion 71 in FIG. 4) can also transmit visible light. As a result, the aperture ratio of the pixel can be increased and the transmittance of visible light in the display module can be increased.
- the source and drain of the transistor may be formed of a material that blocks visible light.
- the conductive layer 222e can be formed using the same material and the same step as the conductive layer 222a.
- the pixel electrode 111a may be directly connected to the source or drain of the transistor (here, the conductive layer 222e) without the conductive layer 115c.
- the gate of the transistor may have a stacked structure.
- the source and the drain of the transistor and the wirings such as the scan line and the signal line can each have a stacked structure.
- the electrodes of these transistors and the wirings electrically connected to the transistors each have a small resistance value.
- the adhesion is low depending on the material of the base (substrate, insulating layer, etc.), and therefore it is preferable to stack the copper film on the film having high adhesion to the base. Further, in order to prevent copper from diffusing into other layers, it is preferable to stack a film having a high barrier property and a copper film.
- the gate 221m, the conductive layer 222m, and the gate 223m illustrated in FIG. 5C preferably each include at least one of titanium, molybdenum, manganese, and aluminum.
- the gate 221n, the conductive layer 222n, and the gate 223n preferably each include one or both of copper and aluminum.
- the materials of the gates 221m and 221n, the conductive layers 222m and 222n, and the gates 223m and 223n are not limited to the above.
- the gate 221n preferably has a smaller resistance value than the gate 221m.
- the conductive layer 222n preferably has a smaller resistance value than the conductive layer 222m.
- the gate 223n preferably has a smaller resistance value than the gate 223m.
- the metal material may have a high reflectance. Therefore, it is preferable to suppress the reflectance by subjecting the surface of the metal film to oxidation treatment or the like. As a result, when viewed from the display surface side, it is possible to suppress a decrease in visibility due to reflection of external light.
- the gate 221s, the conductive layer 222s, and the gate 223s illustrated in FIG. 5D preferably each include at least one of titanium, molybdenum, manganese, and aluminum. Further, each of the gate 221t, the conductive layer 222t, and the gate 223t preferably contains copper. In addition, each of the gate 221u, the conductive layer 222u, and the gate 223u preferably contains copper oxide.
- the materials of the gates 221s, 221t, 221u, the conductive layers 222s, 222t, 222u, and the gates 223s, 223t, 223u are not limited to the above.
- the gate 221t preferably has a smaller resistance value than the gate 221s.
- the conductive layer 222t preferably has a smaller resistance value than the conductive layer 222s.
- the gate 223t preferably has a smaller resistance value than the gate 223s.
- the gate 221u preferably has a lower reflectance of visible light than the gate 221t.
- the conductive layer 222u preferably has lower visible light reflectance than the conductive layer 222t.
- the gate 223u preferably has a lower visible light reflectance than the gate 223t.
- the gate 221t and the gate 221u include at least one same metal element.
- the conductive layers 222t and 222u preferably include at least one of the same metal element. It is preferable that the gate 223t and the gate 223u include at least one same metal element.
- FIG. 5A shows an example in which the transistors SW11 and SW12 have back gates (gates 223a and 223b in FIG. 5A), the transistors SW11 and SW12 may not have back gates.
- the two gates of the transistor are preferably electrically connected.
- a transistor having a structure in which two gates are electrically connected can have higher field-effect mobility and higher on-state current than other transistors. As a result, a circuit that can operate at high speed can be manufactured. Further, it becomes possible to reduce the area occupied by the circuit section. By applying a transistor with a large on-state current, even if a display device is enlarged or finer and the number of wirings is increased, signal delay in each wiring can be reduced and display unevenness can be suppressed. Is possible. Further, since the area occupied by the circuit portion can be reduced, the frame of the display device can be narrowed. Further, by applying such a structure, a highly reliable transistor can be realized.
- the gate insulating layer 211 and the insulating layer 213 which are in contact with the semiconductor layers 231a and 231b are preferably oxide insulating layers. Note that when the gate insulating layer 211 or the insulating layer 213 has a stacked-layer structure, it is preferable that at least a layer in contact with the semiconductor layers 231a and 231b be an oxide insulating layer. Accordingly, generation of oxygen vacancies in the semiconductor layers 231a and 231b can be suppressed and the reliability of the transistor can be improved.
- the insulating layer 214 is preferably a nitride insulating layer. Accordingly, impurities can be prevented from entering the semiconductor layers 231a and 231b, and the reliability of the transistor can be improved.
- the insulating layer 215 preferably has a planarizing function, and is preferably an organic insulating layer, for example. Note that the insulating layer 215 may not be formed and the conductive layer 115a or the like may be formed in contact with the insulating layer 214.
- the conductive layer 115c is located over the insulating layer 215, the insulating layer 121 is located over the conductive layer 115c, and the pixel electrode 111a is located over the insulating layer 121.
- the pixel electrode 111a is electrically connected to the conductive layer 222f. Specifically, the conductive layer 222f is in contact with the conductive layer 115c and the conductive layer 115c is in contact with the pixel electrode 111a.
- the conductive layer 115a is located over the insulating layer 215.
- the conductive layer 115a is in contact with and electrically connected to the conductive layer 222p.
- the conductive layer 115a and the pixel electrode 111a have a portion overlapping with each other with the insulating layer 121 interposed therebetween.
- the conductive layer 115a, the insulating layer 121, and the pixel electrode 111a can function as one capacitive element Cw.
- the conductive layer 115b is located over the insulating layer 215.
- the conductive layer 115b and the pixel electrode 111a have a portion overlapping with each other with the insulating layer 121 interposed therebetween.
- the conductive layer 115b, the insulating layer 121, and the pixel electrode 111a can function as one capacitor Cs.
- the display module 50 has two capacitive elements in one pixel. Therefore, the storage capacity of the pixel can be increased.
- each of the two capacitor elements is formed of a material that transmits visible light and has a region overlapping with each other.
- the pixel can have both a high aperture ratio and a large storage capacitance.
- the capacitance of the capacitive element Cw is preferably larger than the capacitance of the capacitive element Cs. Therefore, the area of the region where the pixel electrode 111a and the conductive layer 115a overlap is preferably larger than the area of the region where the pixel electrode 111a and the conductive layer 115b overlap.
- the pixel electrode 111a is provided over the insulating layer 121.
- An alignment film 114a is provided on the pixel electrode 111a.
- the substrate 132 is provided with the common electrode 113, and the spacer KB is provided in contact with the common electrode 113.
- An alignment film 114b is provided so as to cover the spacer KB and the common electrode 113.
- the layer 112 containing a liquid crystal material is provided between the alignment films 114a and 114b.
- the liquid crystal material includes a positive liquid crystal material having a positive dielectric anisotropy ( ⁇ ) and a negative liquid crystal material having a negative dielectric constant.
- ⁇ positive dielectric anisotropy
- negative liquid crystal material having a negative dielectric constant.
- either material can be used, and an optimal liquid crystal material can be used depending on a mode to be applied and a design.
- the absolute value of the dielectric anisotropy ( ⁇ ) of the liquid crystal material is large.
- a positive type liquid crystal material is preferable to use a positive type liquid crystal material because the positive type liquid crystal material can easily increase the absolute value of the anisotropy ( ⁇ ) of the dielectric constant, as compared with the negative type liquid crystal material.
- the anisotropy of the refractive index of the liquid crystal material is large, the effect of scattering light is enhanced and the layer 112 containing the liquid crystal material can be thinned. Thereby, the drive voltage can be reduced.
- a state where the layer 112 including a liquid crystal material transmits visible light when voltage is not applied between the pair of electrodes (the pixel electrode 111a and the common electrode 113) (OFF state) It is preferable to apply a mode (reverse mode) in which the layer 112 including a liquid crystal material scatters visible light when a voltage is applied between the pair of electrodes (ON state).
- a mode reverse mode in which the layer 112 including a liquid crystal material scatters visible light when a voltage is applied between the pair of electrodes
- the visible light transmittance of the display module 50 can be increased when the display module 50 is not displaying an image. Therefore, the display module 50 can be used as a see-through display.
- the layer 112 containing a liquid crystal material preferably contains a liquid crystal material and a polymer material.
- liquid crystal material it is preferable to use nematic liquid crystal as the liquid crystal material.
- the polymer material is preferably a copolymer of a polyfunctional monomer and a monofunctional monomer.
- Examples of monofunctional monomers include acrylate and methacrylate.
- Examples of the polyfunctional monomer include diacrylate, triacrylate, dimethacrylate, trimethacrylate and the like.
- the polyfunctional monomer preferably has a phenyl benzoate skeleton.
- Examples of the polyfunctional monomer include diacrylate having a phenyl benzoate skeleton.
- Examples of materials that can be used as the polyfunctional monomer include materials represented by structural formulas (1) to (3).
- the monofunctional monomer preferably has a cyclohexylbenzene skeleton.
- Examples of monofunctional monomers include acrylates having a cyclohexylbenzene skeleton.
- Examples of the material that can be used as the monofunctional monomer include materials represented by structural formulas (4) to (6).
- the layer 112 containing a liquid crystal material can be formed by irradiating light and curing a material layer containing a liquid crystal material, a monomer, and a photopolymerization initiator.
- liquid crystal element used in the display device of one embodiment of the present invention is not limited to the reverse mode and various modes can be applied.
- the display device of this embodiment is a transmissive liquid crystal display device
- a conductive material that transmits visible light is used for both the pair of electrodes (the pixel electrode 111a and the common electrode 113).
- the conductive layers 115a, 115b, and 115c are also formed using a conductive material which transmits visible light, whereby the aperture ratio of the pixel can be prevented from being lowered even when the capacitor Cw and the capacitor Cs are provided.
- a silicon nitride film is suitable for the insulating layer 121 which functions as a dielectric of the capacitor.
- the conductive material which transmits visible light for example, a material containing one or more selected from indium (In), zinc (Zn), and tin (Sn) may be used. Specifically, it includes indium oxide, indium tin oxide (ITO), indium zinc oxide, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, and titanium oxide. Indium tin oxide, indium tin oxide containing silicon oxide (ITSO), zinc oxide, zinc oxide containing gallium, and the like can be given. Note that a film containing graphene can also be used. The film containing graphene can be formed by reducing a film containing graphene oxide, for example.
- the conductive film that transmits visible light can be formed using an oxide semiconductor (hereinafter also referred to as an oxide conductive layer).
- the oxide conductive layer preferably contains, for example, indium, and further contains In-M-Zn oxide (M is Al, Ti, Ga, Y, Zr, La, Ce, Nd, Sn, or Hf). preferable.
- An oxide semiconductor is a semiconductor material whose resistance can be controlled by at least one of oxygen vacancies in a film and impurity concentrations such as hydrogen and water in a film. Therefore, the resistivity of the oxide conductive layer is controlled by selecting treatment for increasing at least one of oxygen vacancies and impurity concentration or treatment for reducing at least one of oxygen vacancies and impurity concentrations in the oxide semiconductor layer. be able to.
- an oxide conductive layer formed using an oxide semiconductor is an oxide semiconductor layer having high carrier density and low resistance, an oxide semiconductor layer having conductivity, or an oxide semiconductor having high conductivity. It can also be called a layer.
- the substrate 131 and the substrate 132 are attached to each other with an adhesive layer 141.
- the FPC is electrically connected to the conductive layer 221c. Specifically, the FPC is in contact with the connector 139, the connector 139 is in contact with the conductive layer 222c, and the conductive layer 222c is in contact with the conductive layer 221c.
- the conductive layer 221c is formed over the substrate 131 and the conductive layer 222c is formed over the gate insulating layer 211.
- the conductive layer 221c can be formed using the same process and the same material as the gates 221a and 221b.
- the conductive layer 222c can be formed using the same process and the same material as the conductive layers 222a and 222b.
- a display device or a display module (hereinafter also referred to as a touch panel) including a touch sensor can be manufactured.
- FIG. 6 shows a sectional view of the display module 51.
- the display module 51 has a configuration in which a touch sensor is added to the configuration of the display module 50.
- the substrate 180 and the substrate 132 are attached to each other with an adhesive layer 186.
- An electrode 181 and an electrode 182 are provided on the substrate 180 side of the substrate 180.
- the electrode 181 and the electrode 182 are electrically insulated from each other by the insulating layer 185.
- a connection portion is provided in a region near the edge of the substrate 180. In the connection portion, the wiring 187 is electrically connected to the FPC 2 via the conductive layer 188 and the connection body 189.
- the electrodes 181 and 182 can be made of a material having a low resistivity such as metal.
- metal is generally a material having a high reflectance, it can be made dark by performing an oxidation treatment or the like. Therefore, even when viewed from the display surface side, it is possible to suppress deterioration of visibility due to reflection of external light.
- the wiring and the electrode may be formed by stacking a metal layer and a layer having a low reflectance (hereinafter referred to as a dark color layer).
- the dark layer include a layer containing copper oxide, a layer containing copper chloride, or tellurium chloride.
- the dark layer is made of Ag particles, Ag fibers, metal particles such as Cu particles, carbon nanotubes (CNT), nanocarbon particles such as graphene, and polyethylene dioxythiophene (PEDOT), polyaniline, polypyrrole, and other highly conductive materials. It may be formed using a molecule or the like.
- the material of the substrate included in the display device includes various substrates.
- a glass substrate, a quartz substrate, a sapphire substrate, a semiconductor substrate, a ceramic substrate, a metal substrate, a plastic substrate, or the like can be used.
- the display device can be lightweight and thin. Further, a flexible display device can be realized by using a substrate having a thickness that is flexible.
- the transistor included in the display device of this embodiment may have either a top-gate structure or a bottom-gate structure.
- gate electrodes may be provided above and below the channel.
- the semiconductor material used for the transistor is not particularly limited, and examples thereof include metal oxides (also referred to as oxide semiconductors) having semiconductor characteristics, silicon, germanium, and the like.
- metal oxides also referred to as oxide semiconductors
- silicon include amorphous silicon and crystalline silicon (low temperature polysilicon, single crystal silicon, etc.).
- crystallinity of a semiconductor material used for a transistor there is no particular limitation on the crystallinity of a semiconductor material used for a transistor, either an amorphous semiconductor or a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially having a crystalline region). May be used. It is preferable to use a semiconductor having crystallinity because deterioration of transistor characteristics can be suppressed.
- the semiconductor layer is, for example, indium and M (M is gallium, aluminum, silicon, boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, It is preferable to have zinc and one or more selected from hafnium, tantalum, tungsten, and magnesium).
- M is preferably one or more selected from aluminum, gallium, yttrium, and tin.
- an oxide containing indium (In), gallium (Ga), and zinc (Zn) (also referred to as IGZO) is preferably used for the semiconductor layer.
- the sputtering target used for forming the In-M-Zn oxide preferably has an In atomic ratio of M or higher.
- the atomic ratio of the deposited semiconductor layer includes a fluctuation of ⁇ 40% in the atomic ratio of the metal element contained in the sputtering target.
- the transistors included in the gate drivers GD_L and GD_R and the transistors included in the display region 100 may have the same structure or different structures.
- the transistors included in the gate driver may all have the same structure, or two or more types of structures may be used in combination.
- the transistors included in the display region 100 may all have the same structure, or two or more types of structures may be used in combination.
- Examples of the insulating material that can be used for the insulating layer included in the display device include an organic insulating material and an inorganic insulating material.
- Examples of the organic insulating material include acrylic resin, epoxy resin, polyimide resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, and phenol resin.
- As the inorganic insulating layer a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, a silicon nitride film, an aluminum oxide film, a hafnium oxide film, a yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film. Examples thereof include a film, a lanthanum oxide film, a cerium oxide film, and a neodymium oxide film.
- conductive layers such as various wirings and electrodes included in a display device include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten.
- metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten.
- one or more of the alloys containing at least one of the metals as a main component can be used to form a single-layer structure or a laminated structure.
- a two-layer structure in which a titanium film is stacked over an aluminum film a two-layer structure in which a titanium film is stacked over a tungsten film, a two-layer structure in which a copper film is stacked over a molybdenum film, and an alloy film containing molybdenum and tungsten are formed.
- a two-layer structure in which a copper film is laminated a two-layer structure in which a copper film is laminated on a copper-magnesium-aluminum alloy film, a titanium film or a titanium nitride film, and an aluminum film or copper overlaid on the titanium film or the titanium nitride film.
- the conductive layer has a three-layer structure
- titanium, titanium nitride, molybdenum, tungsten, an alloy containing molybdenum and tungsten, an alloy containing molybdenum and zirconium, or a film containing molybdenum nitride is used for the first and third layers. It is preferable to form a film made of a low resistance material such as copper, aluminum, gold or silver, or an alloy of copper and manganese on the second layer.
- ITO indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium zinc oxide, ITSO, or the like has a light-transmitting property.
- the oxide conductive layer may be formed by controlling the resistivity of the oxide semiconductor.
- thermosetting resin a thermosetting resin
- photo-curing resin a curable resin such as a two-liquid type curable resin
- a curable resin such as a two-liquid type curable resin
- an acrylic resin, a urethane resin, an epoxy resin, a siloxane resin, or the like can be used.
- connection body 139 for example, an anisotropic conductive film (ACF: Anisotropic Conductive Film), an anisotropic conductive paste (ACP: Anisotropic Conductive Paste), or the like can be used.
- ACF Anisotropic Conductive Film
- ACP Anisotropic Conductive Paste
- the thin films (insulating film, semiconductor film, conductive film, etc.) that compose the display device are respectively sputtering method, chemical vapor deposition (CVD) method, vacuum deposition method, pulsed laser deposition (PLD: Pulsed Laser Deposition) method. ) Method, an atomic layer deposition (ALD: Atomic Layer Deposition) method, etc. can be used.
- CVD method include a plasma enhanced chemical vapor deposition (PECVD: Plasma Enhanced Chemical Vapor Deposition) method and a thermal CVD method.
- An example of the thermal CVD method is a metal organic chemical vapor deposition (MOCVD) method.
- the thin films (insulating film, semiconductor film, conductive film, etc.) that compose the display device are spin coat, dip, spray coat, inkjet print, dispense, screen print, offset print, doctor knife, slit coat, roll coat, and curtain, respectively. It can be formed by a method such as coating or knife coating.
- the thin film included in the display device can be processed by a photolithography method or the like.
- the island-shaped thin film may be formed by a film forming method using a shielding mask.
- the thin film may be processed by a nanoimprint method, a sandblast method, a lift-off method, or the like.
- the photolithography method includes a method of forming a resist mask on a thin film to be processed, processing the thin film by etching or the like, and removing the resist mask, and a method of forming a thin film having photosensitivity, and then performing exposure and development. And a method of processing the thin film into a desired shape.
- examples of light used for exposure include i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), and light obtained by mixing these.
- ultraviolet rays, KrF laser light, ArF laser light, or the like can be used.
- the exposure may be performed by a liquid immersion exposure technique.
- examples of light used for exposure include extreme ultraviolet light (EUV) and X-rays.
- An electron beam may be used instead of the light used for exposure. The use of extreme ultraviolet light, X-rays or electron beams is preferable because it enables extremely fine processing. Note that a photomask is not necessary when exposure is performed by scanning a beam such as an electron beam.
- etching the thin film For etching the thin film, a dry etching method, a wet etching method, a sandblast method, or the like can be used.
- metal oxides containing nitrogen may be collectively referred to as metal oxides. Further, the metal oxide containing nitrogen may be referred to as a metal oxynitride. For example, a metal oxide containing nitrogen such as zinc oxynitride (ZnON) may be used for the semiconductor layer.
- ZnON zinc oxynitride
- CAAC c-axis aligned aligned crystal
- CAC Cloud-Aligned Composite
- CAC Cloud-Aligned Composite
- OS can be used for the semiconductor layer.
- the CAC-OS or the CAC-metal oxide has a conductive function in a part of the material and an insulating function in a part of the material, and the whole material has a function as a semiconductor.
- the conductive function is a function of flowing electrons (or holes) serving as carriers
- the insulating function is the function of electrons serving as carriers. It is a function that does not flow.
- a function of switching (a function of turning on / off) can be imparted to the CAC-OS or the CAC-metal oxide by causing the conductive function and the insulating function to act in a complementary manner.
- the CAC-OS or the CAC-metal oxide has a conductive region and an insulating region.
- the conductive region has the above-mentioned conductive function
- the insulating region has the above-mentioned insulating function.
- the conductive region and the insulating region may be separated at the nanoparticle level.
- the conductive region and the insulating region may be unevenly distributed in the material.
- the conductive region may be observed as a cloudy connection at the periphery and connected in a cloud shape.
- the conductive region and the insulating region are dispersed in the material in a size of 0.5 nm or more and 10 nm or less, preferably 0.5 nm or more and 3 nm or less. There is.
- CAC-OS or the CAC-metal oxide is composed of components having different band gaps.
- CAC-OS or CAC-metal oxide is composed of a component having a wide gap due to the insulating region and a component having a narrow gap due to the conductive region.
- a carrier when flowing a carrier, a carrier mainly flows in the component which has a narrow gap.
- the component having the narrow gap acts complementarily to the component having the wide gap, and the carrier also flows to the component having the wide gap in conjunction with the component having the narrow gap. Therefore, when the CAC-OS or CAC-metal oxide is used in the channel formation region of the transistor, a high current driving force, that is, a high on-current and a high field-effect mobility can be obtained in the on state of the transistor.
- the CAC-OS or the CAC-metal oxide can also be referred to as a matrix composite material or a metal matrix composite material.
- the oxide semiconductor (metal oxide) is divided into a single crystal oxide semiconductor and a non-single crystal oxide semiconductor other than the single crystal oxide semiconductor.
- the non-single-crystal oxide semiconductor include a CAAC-OS (c-axis aligned crystal line oxide semiconductor), a polycrystalline oxide semiconductor, an nc-OS (nanocrystal oxide semiconductor), and a pseudo-amorphous oxide semiconductor (a-like oxide).
- OS amorphous-like oxide semiconductor), and amorphous oxide semiconductor.
- the CAAC-OS has a crystal structure having c-axis orientation and a strain in which a plurality of nanocrystals are connected in the ab plane direction.
- the strain refers to a portion in which the orientation of the lattice arrangement is changed between a region where the lattice arrangement is uniform and another region where the lattice arrangement is uniform in the region where a plurality of nanocrystals are connected.
- the nanocrystal is basically a hexagon, but is not limited to a regular hexagon, and may be a non-regular hexagon.
- the strain may have a lattice arrangement such as a pentagon and a heptagon.
- a lattice arrangement such as a pentagon and a heptagon.
- the CAAC-OS is a layered crystal in which a layer containing indium and oxygen (hereinafter, an In layer) and a layer containing elements M, zinc, and oxygen (hereinafter, a (M, Zn) layer) are stacked. It tends to have a structure (also called a layered structure).
- indium and the element M can be replaced with each other, and when the element M of the (M, Zn) layer is replaced with indium, it can be expressed as an (In, M, Zn) layer.
- the indium of the In layer is replaced with the element M, it can be expressed as an (In, M) layer.
- CAAC-OS is a metal oxide with high crystallinity.
- CAAC-OS since it is difficult to confirm a clear crystal grain boundary, it can be said that the decrease in electron mobility due to the crystal grain boundary is unlikely to occur.
- CAAC-OS impurities and defects oxygen deficiency (V O:. Oxygen vacancy also referred) etc.) with less metal It can be said to be an oxide. Therefore, the metal oxide having CAAC-OS has stable physical properties. Therefore, the metal oxide including the CAAC-OS is highly heat resistant and highly reliable.
- the nc-OS has a periodic atomic arrangement in a minute region (for example, a region of 1 nm or more and 10 nm or less, particularly a region of 1 nm or more and 3 nm or less). Moreover, in the nc-OS, no regularity is found in the crystal orientation between different nanocrystals. Therefore, no orientation is seen in the entire film. Therefore, the nc-OS may be indistinguishable from the a-like OS or the amorphous oxide semiconductor depending on the analysis method.
- IGZO indium-gallium-zinc oxide
- IGZO indium-gallium-zinc oxide
- IGZO may have a stable structure by using the above-described nanocrystal.
- IGZO tends to have difficulty in crystal growth in the atmosphere, and thus a smaller crystal (for example, the above-mentioned nanocrystal) is used than a large crystal (here, a crystal of several mm or a crystal of several cm).
- a large crystal here, a crystal of several mm or a crystal of several cm.
- it may be structurally stable.
- the a-like OS is a metal oxide having a structure between the nc-OS and the amorphous oxide semiconductor.
- the a-like OS has a void or a low density region. That is, the crystallinity of the a-like OS is lower than that of the nc-OS and the CAAC-OS.
- Oxide semiconductors have various structures and have different characteristics.
- the oxide semiconductor of one embodiment of the present invention may include two or more of an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-like OS, an nc-OS, and a CAAC-OS.
- the metal oxide film functioning as a semiconductor layer can be formed using one or both of an inert gas and an oxygen gas.
- an inert gas oxygen gas
- oxygen flow rate ratio oxygen partial pressure
- the flow rate ratio of oxygen (oxygen partial pressure) at the time of forming the metal oxide film is preferably 0% to 30% inclusive, and 5% to 30% inclusive. Is more preferable, and 7% or more and 15% or less is further preferable.
- the energy gap of the metal oxide is preferably 2 eV or more, more preferably 2.5 eV or more, and further preferably 3 eV or more.
- the metal oxide film can be formed by a sputtering method. Besides, a PLD method, a PECVD method, a thermal CVD method, an ALD method, a vacuum evaporation method, or the like may be used.
- FIG. 7 shows a top view of the pixel 16 (i, j).
- FIG. 7 is a top view of the laminated structure from the wiring GL1 (i) to the pixel electrode 111a as viewed from the pixel electrode 111a side.
- FIG. 8 shows a sectional view of the display module 52.
- the pixel portion corresponds to a cross-sectional view taken along alternate long and short dash line G1-G2 and between G3-G4 shown in FIG.
- FIGS. 7 and 8 The structure shown in FIGS. 7 and 8 is different from that shown in FIGS. 4 and 5A in the structure of the transistor. In the following, the description of the parts common to the above-described configuration example may be omitted.
- the transistor SW11 illustrated in FIGS. 7 and 8 includes a gate 221b, a gate insulating layer 211, a semiconductor layer 231b, a conductive layer 222p, a conductive layer 222q, a gate insulating layer 225, and a gate 223b.
- One of the conductive layers 222p and 222q functions as a source and the other functions as a drain.
- the transistor SW12 illustrated in FIGS. 7 and 8 includes a gate 221a, a gate insulating layer 211, a semiconductor layer 231a, a conductive layer 222f, a conductive layer 222g, a gate insulating layer 225, and a gate 223a.
- One of the conductive layers 222f and 222g functions as a source and the other functions as a drain.
- the semiconductor layers 231a and 231b each include a pair of low resistance regions 231n and a channel formation region 231i sandwiched between the pair of low resistance regions 231n.
- the channel formation region 231i overlaps with the gate 221a or the gate 221b through the gate insulating layer 211 and overlaps with the gate 223a or the gate 223b through the gate insulating layer 225.
- the conductive layers 222f, 222g, 222p, 222q are formed of a material that transmits visible light. Therefore, at least a part of the external light 35 shown in FIG. 8 is transmitted through the connection portion (corresponding to the connection portion 72 in FIG. 7) between the conductive layer 222f and the conductive layer 115c, and is emitted to the outside of the display module.
- the connecting portion between the conductive layer 222p and the conductive layer 115a (corresponding to the connecting portion 71 in FIG. 7) can also transmit visible light. As a result, the aperture ratio of the pixel can be increased and the transmittance of visible light in the display module can be increased.
- the gate insulating layer 211 and the gate insulating layer 225 which are in contact with the channel formation region 231i are preferably oxide insulating layers. Note that when the gate insulating layer 211 or the gate insulating layer 225 has a stacked-layer structure, at least a layer in contact with the channel formation region 231i is preferably an oxide insulating layer. Accordingly, generation of oxygen vacancies in the channel formation region 231i can be suppressed and reliability of the transistor can be improved.
- the insulating layer 214 is preferably a nitride insulating layer. Accordingly, impurities can be prevented from entering the semiconductor layers 231a and 231b, and the reliability of the transistor can be improved.
- the insulating layer 215 preferably has a planarizing function, and is preferably an organic insulating layer, for example.
- the gate insulating layer 225 may overlap with both the low resistance region 231n and the channel formation region 231i.
- the gate insulating layer 225 illustrated in FIG. 8 has advantages such as a reduction in the number of steps for processing the gate insulating layer 225 using the gates 223a and 223b as masks and a reduction in a step of the surface where the insulating layer 214 is formed. Note that, as shown in FIG. 9, the gate insulating layer 225 may be formed only over the channel formation region 231i and may not overlap with the low resistance region 231n.
- the low resistance region 231n has a lower resistivity than the channel formation region 231i.
- the low resistance region 231n may be formed by adding an impurity using the gates 223a and 223b as masks.
- the impurities include hydrogen, helium, neon, argon, fluorine, nitrogen, phosphorus, arsenic, antimony, boron, aluminum, magnesium, and silicon, and the impurities are formed by an ion implantation method or an ion doping method. Can be added.
- the low resistance region 231n may be formed by adding indium or the like which is one of the constituent elements of the semiconductor layers 231a and 231b. By adding indium, the low resistance region 231n may have a higher indium concentration than the channel formation region 231i.
- the gate insulating layer 225 is an oxide film having a function of releasing oxygen by heating
- oxygen is supplied to the low resistance region 231n by heating, which might lead to reduction in carrier density and increase in electrical resistance. Therefore, it is preferable that the low resistance region 231n be formed by adding an impurity to part of the semiconductor layer through the gate insulating layer 225. As a result, impurities are also added to the gate insulating layer 225.
- impurities are also added to the gate insulating layer 225.
- the amount of released oxygen can be reduced. Therefore, it is possible to suppress the supply of oxygen from the gate insulating layer 225 to the low resistance region 231n due to heating, and it is possible to maintain the low resistance region 231n in a low electric resistance state.
- a first layer is formed so as to be in contact with part of the semiconductor layers 231a and 231b, and heat treatment is performed to reduce the resistance of the regions.
- the low resistance region 231n can be formed.
- a film containing at least one of metal elements such as aluminum, titanium, tantalum, tungsten, chromium, and ruthenium can be used.
- metal elements such as aluminum, titanium, tantalum, tungsten, chromium, and ruthenium
- a nitride containing at least one of these metal elements or an oxide containing at least one of these metal elements can be preferably used.
- a metal film such as a tungsten film or a titanium film, a nitride film such as an aluminum titanium nitride film, a titanium nitride film, or an aluminum nitride film, or an oxide film such as an aluminum titanium oxide film can be preferably used.
- the thickness of the first layer can be, for example, 0.5 nm or more and 20 nm or less, preferably 0.5 nm or more and 15 nm or less, more preferably 0.5 nm or more and 10 nm or less, and further preferably 1 nm or more and 6 nm or less. Typically, it can be about 5 nm or about 2 nm. Even when the first layer is thin as described above, the resistance of the semiconductor layers 231a and 231b can be sufficiently reduced.
- the low resistance region 231n has a higher carrier density than the channel formation region 231i.
- the low-resistance region 231n can be a region containing more hydrogen than the channel formation region 231i or a region containing more oxygen vacancies than the channel formation region 231i.
- the combination of oxygen vacancies and hydrogen atoms in the oxide semiconductor serves as a carrier generation source.
- the low resistance region 231n can be an extremely low resistance region.
- the low resistance region 231n formed in this manner has a feature that it is difficult to increase the resistance in a later process. For example, even if heat treatment is performed in an atmosphere containing oxygen, film formation treatment is performed in an atmosphere containing oxygen, or the like, conductivity of the low-resistance region 231n is not impaired; In addition, a highly reliable transistor can be realized.
- the first layer after the heat treatment has conductivity, it is preferable to remove the first layer after the heat treatment.
- the first layer has an insulating property, the first layer can be made to function as a protective insulating film by leaving it.
- the FPC is electrically connected to the conductive layer 222c. Specifically, the FPC is in contact with the connector 139, the connector 139 is in contact with the conductive layer 111b, and the conductive layer 111b is in contact with the conductive layer 222c.
- the conductive layer 222c is formed over the insulating layer 214, and the conductive layer 111b is formed over the insulating layer 121.
- the conductive layer 222c can be formed using the same step and the same material as the conductive layer 222a and the conductive layer 222b.
- the conductive layer 111b can be formed using the same process and the same material as the pixel electrode 111a.
- the display device may not include the conductive layers 222f, 222g, 222p, 222q (see FIGS. 7 and 8) that transmit visible light. Accordingly, the manufacturing process of the display device can be simplified.
- the conductive layer 115c and the semiconductor layer 231a are in contact with each other, and the conductive layer 115a and the semiconductor layer 231b (the low resistance region 231n thereof) are in contact with each other.
- a material that transmits visible light such as a metal oxide
- the portion may be provided with a region that transmits visible light.
- the semiconductor layer 231a (the low resistance region 231n thereof) and the conductive layer 222a which blocks visible light are in contact with each other, and the semiconductor layer 231b (the low resistance region 231n thereof) and the conductive layer 222b which blocks visible light are mutually connected. Touching.
- the low resistance region 231n is a region of the semiconductor layers 231a and 231b that is in contact with the insulating layer 214.
- the insulating layer 214 preferably contains nitrogen or hydrogen. Thus, nitrogen or hydrogen in the insulating layer 214 can enter the low resistance region 231n and the carrier concentration in the low resistance region 231n can be increased.
- the display module 55 shown in FIG. 10 and the display module 57 shown in FIG. 11 each include a liquid crystal display device and a light emitting device which are stacked. Each of the display modules 55 and 57 is configured to emit the light 33 emitted from the light emitting device to the outside through the liquid crystal display device. Further, the liquid crystal display device is configured such that light is incident from an edge light type light, the light is scattered by a layer including a liquid crystal material, and scattered light 34 is emitted to the outside.
- FIGS. 10 and 11 The configuration of the liquid crystal display device shown in FIGS. 10 and 11 is similar to that of FIG. 5A, and thus detailed description thereof will be omitted.
- the display module 55 shown in FIG. 10 has a light emitting device 54.
- the light emitting device 54 is attached to the liquid crystal display device by the adhesive layer 169.
- the light emitting device 54 is a top emission structure light emitting device to which a color filter system is applied.
- the light emitting element 150 emits light to the liquid crystal display device side through the colored layer (see light 33).
- the light emitting device 54 includes a substrate 161, an adhesive layer 163, an insulating layer 165, a transistor SW13, a light emitting element 150, an adhesive layer 167, an insulating layer 168, a coloring layer CF1, a coloring layer CF2, and the like.
- the transistor SW13 a transistor which can be used for a liquid crystal display device can be applied.
- the transistor included in the liquid crystal display device and the transistor included in the light emitting device 54 may be the same or different.
- an EL element such as an OLED (Organic Light Emitting Diode) or a QLED (Quantum-dot Light Emitting Diode).
- a light-emitting substance included in an EL element a substance that emits fluorescence (a fluorescent material), a substance that emits phosphorescence (a phosphorescent material), an inorganic compound (a quantum dot material, or the like), or a substance that exhibits heat-activated delayed fluorescence (heat-activated delayed fluorescence) (Thermally activated delayed delayed Fluorescence (TADF) material) and the like.
- an LED such as a micro LED (Light Emitting Diode) can be used.
- the light emitting element 150 has a pixel electrode 151, an EL layer 152, and a common electrode 153.
- the pixel electrode 151 is electrically connected to the source or drain of the transistor SW13.
- the pixel electrode 151 preferably reflects visible light.
- An end portion of the pixel electrode 151 is covered with an insulating layer 155.
- the EL layer 152 is commonly used by a plurality of subpixels.
- the EL layer 152 includes at least a light emitting substance.
- the common electrode 153 transmits visible light.
- the light emitting device 54 has a plurality of pixels arranged in a matrix.
- One pixel has one or more sub-pixels.
- One subpixel has one light emitting element 150.
- a pixel has three sub-pixels (three colors of R, G, and B, or three colors of yellow (Y), cyan (C), and magenta (M)), or a sub-pixel.
- a configuration having four (R, G, B, four colors of white (W), or four colors of R, G, B, Y, etc.) can be applied.
- the definition of the light emitting device may be the same as or different from that of the liquid crystal display device.
- the light emitting device 54 and the liquid crystal display device have the same definition, one pixel (a plurality of subpixels) of the light emitting device 54 overlaps one pixel of the liquid crystal display device.
- the light emitted from the light emitting element 150 is emitted from the light emitting device 54 through the colored layer.
- the light of the first color is extracted through the colored layer CF1
- the light of the second color is extracted through the colored layer CF2.
- the FPC 3 is electrically connected to the conductive layer 222d via the connection body 139.
- an insulating layer having high waterproofness is preferably used. Thereby, impurities such as water can be prevented from entering the light emitting element 150, and the reliability of the light emitting element 150 can be improved.
- the insulating layers 165 and 168 preferably each include an inorganic insulating film.
- various curable adhesives such as an ultraviolet curable photocurable adhesive, a reaction curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used.
- these adhesives include epoxy resin, acrylic resin, silicone resin, phenol resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin and the like.
- a material having low moisture permeability such as epoxy resin is preferable.
- a two-liquid mixed type resin may be used.
- an adhesive sheet or the like may be used.
- the material of the substrate 161 there is no particular limitation on the material of the substrate 161, and various substrates can be used.
- a glass substrate, a quartz substrate, a sapphire substrate, a semiconductor substrate, a ceramic substrate, a metal substrate, a plastic substrate, or the like can be used.
- polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, acrylic resin, polyimide resin, polymethylmethacrylate resin, polycarbonate (PC) resin, polyether sulfone (PES).
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- PES polyether sulfone
- Resin polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene (PTFE) It is preferable to use a resin substrate made of resin, ABS resin, cellulose nanofiber, or the like. This makes it possible to reduce the thickness and weight of the light emitting device 54.
- the display module 57 shown in FIG. 11 has a light emitting device 56.
- the light-emitting device 56 mainly does not have the coloring layer CF1, the coloring layer CF2, the insulating layer 168, and the adhesive layer 169, but has the protective layer 154 and the EL layer 152 is formed for each subpixel. , Different from the light emitting device 54. The description of the configuration common to the light emitting device 54 is omitted.
- the protective layer 154 preferably has an inorganic film with high waterproofness.
- a liquid crystal element can be driven with a high voltage. Therefore, a liquid crystal element having a high driving voltage can be used for a display device. For example, even a display device using a liquid crystal element driven in a reverse mode, a liquid crystal element containing a liquid crystal material and a polymer material, or the like can display an image well.
- connection portion where the transistor and the pixel electrode are electrically connected has a function of transmitting visible light; therefore, the aperture ratio of the pixel can be further increased.
- the display device of one embodiment of the present invention has a function of displaying by a field sequential driving method, the aperture ratio of the pixel can be further increased, and a coloring layer such as a color filter can be eliminated, so that the pixel It is possible to increase the transmittance.
- the display device of one embodiment of the present invention has a structure suitable as a see-through display.
- the electronic device in this embodiment includes the display device of one embodiment of the present invention in the display portion.
- the display unit of the electronic device can display a high quality image.
- display can be performed with high reliability in a wide temperature range.
- an image having resolution of full high-definition, 2K, 4K, 8K, 16K, or higher can be displayed.
- Examples of electronic devices in which the display device of one embodiment of the present invention can be used include television devices, desktop or notebook personal computers, monitors for computers, digital signage (digital signage), and pachinko machines.
- electronic devices having a relatively large screen such as a large game machine such as a game machine, a digital camera, a digital video camera, a digital photo frame, a mobile phone, a portable game machine, a portable information terminal, a sound reproducing device, and the like can be given.
- the display device of one embodiment of the present invention can be preferably used for a portable electronic device, a wearable electronic device (wearable device), a VR (Virtual Reality) device, an AR (Augmented Reality) device, and the like. ..
- the electronic device of one embodiment of the present invention may include a secondary battery, and it is preferable that the secondary battery can be charged using contactless power transmission.
- a lithium ion secondary battery such as a lithium polymer battery (lithium ion polymer battery) using a gel electrolyte, a nickel hydrogen battery, a nicad battery, an organic radical battery, a lead storage battery, an air secondary battery, nickel A zinc battery, a silver zinc battery, etc. are mentioned.
- the electronic device of one embodiment of the present invention may include an antenna. By receiving the signal with the antenna, images, information, and the like can be displayed on the display portion.
- the antenna may be used for contactless power transmission.
- the electronic device includes a sensor (force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, voice, time, hardness, electric field, current, It has a function of measuring voltage, electric power, radiation, flow rate, humidity, gradient, vibration, odor or infrared light).
- the electronic device of one embodiment of the present invention can have various functions. For example, a function of displaying various information (still images, moving images, text images, etc.) on the display unit, a touch panel function, a function of displaying a calendar, date or time, a function of executing various software (programs), wireless communication It can have a function, a function of reading a program or data recorded in a recording medium, and the like.
- one display unit mainly displays image information
- another display unit mainly displays character information, or consideration is given to parallax in the plurality of display units.
- a function of displaying a stereoscopic image or the like can be provided.
- a function of capturing a still image or a moving image a function of automatically or manually correcting the captured image
- a function of saving the captured image in a recording medium it can have a function of displaying a photographed image on the display unit.
- the functions of the electronic device of one embodiment of the present invention are not limited to these and can have various functions.
- a television device 1810 is shown in FIG. 12A.
- the television device 1810 includes a display portion 1811, a housing 1812, a speaker 1813, and the like. Further, an LED lamp, an operation key (including a power switch or an operation switch), a connection terminal, various sensors, a microphone, and the like can be provided.
- the television device 1810 can be operated by a remote controller 1814.
- broadcast radio waves examples include ground waves and radio waves transmitted from satellites. Also, as broadcast waves, there are analog broadcasts, digital broadcasts, etc., and also video and audio, or audio only broadcasts. For example, it is possible to receive broadcast radio waves transmitted in a specific frequency band of the UHF band (about 300 MHz to 3 GHz) or the VHF band (30 MHz to 300 MHz). Further, for example, by using a plurality of data received in a plurality of frequency bands, the transfer rate can be increased and more information can be obtained. Accordingly, an image having a resolution exceeding full high-definition can be displayed on the display portion 1811. For example, an image having a resolution of 4K, 8K, 16K, or higher can be displayed.
- a configuration for generating an image to be displayed on the display unit 1811 by using broadcast data transmitted by a data transmission technology via a computer network such as the Internet, LAN (Local Area Network), and Wi-Fi (registered trademark) May be At this time, the television device 1810 may not have a tuner.
- FIG. 12B shows a digital signage 1820 attached to a cylindrical post 1822.
- the digital signage 1820 has a display portion 1821.
- the display portion 1821 As the display portion 1821 is wider, the amount of information that can be provided at one time can be increased. Further, the wider the display portion 1821 is, the more noticeable it is to a person, and, for example, the advertising effect of the advertisement can be enhanced.
- a touch panel By applying a touch panel to the display portion 1821, not only a still image or a moving image is displayed on the display portion 1821, but also a user can operate intuitively, which is preferable. In addition, when it is used for the purpose of providing information such as route information or traffic information, usability can be improved by an intuitive operation.
- FIG. 12C shows a laptop personal computer 1830.
- the personal computer 1830 has a display portion 1831, a housing 1832, a touch pad 1833, a connection port 1834, and the like.
- the touch pad 1833 functions as an input device such as a pointing device or a pen tablet, and can be operated with a finger, a stylus, or the like.
- a display element is incorporated in the touch pad 1833. As shown in FIG. 12C, by displaying the input keys 1835 on the surface of the touch pad 1833, the touch pad 1833 can be used as a keyboard. At this time, when the input key 1835 is touched, a vibration module may be incorporated in the touch pad 1833 in order to realize a tactile sensation by vibrating.
- the information terminal 1840 illustrated in FIG. 12D includes a display portion 1841, a housing 1842, a detection portion 1843, and the like.
- the information terminal 1840 can be operated with a finger, a stylus, or the like.
- At least one of an illuminance sensor, an imaging device, a posture detection device, a pressure sensor, a human sensor, and the like can be used.
- a mobile information terminal 800 is shown in FIGS. 13A and 13B.
- the portable information terminal 800 includes a housing 801, a housing 802, a display portion 803, a display portion 804, a hinge portion 805, and the like.
- the housing 801 and the housing 802 are connected by a hinge portion 805.
- the portable information terminal 800 can open the housing 801 and the housing 802 as shown in FIG. 13B from the folded state as shown in FIG. 13A.
- the document information can be displayed on the display portion 803 and the display portion 804, which can also be used as an electronic book terminal. Further, a still image or a moving image can be displayed on the display portion 803 and the display portion 804.
- the portable information terminal 800 can be folded when being carried, and thus has excellent versatility.
- housing 801 and the housing 802 may each include a power button, an operation button, an external connection port, a speaker, a microphone, and the like.
- FIG. 13C shows an example of a mobile information terminal.
- the portable information terminal 810 illustrated in FIG. 13C includes a housing 811, a display portion 812, operation buttons 813, an external connection port 814, a speaker 815, a microphone 816, a camera 817, and the like.
- the mobile information terminal 810 includes a touch sensor on the display unit 812. All operations such as making a call or inputting a character can be performed by touching the display portion 812 with a finger, a stylus, or the like.
- the power can be turned on and off, and the type of image displayed on the display portion 812 can be switched.
- the mail composition screen can be switched to the main menu screen.
- the orientation (vertical or horizontal) of the mobile information terminal 810 is determined and the orientation of the screen display of the display unit 812 is determined. It can be set to switch automatically. Further, switching of the screen display direction can be performed by touching the display portion 812, operating the operation button 813, inputting voice by using the microphone 816, or the like.
- the portable information terminal 810 has one or more functions selected from, for example, a telephone, a notebook, an information browsing device, and the like. Specifically, it can be used as a smartphone.
- the portable information terminal 810 can execute various applications such as mobile phone, electronic mail, text browsing and creation, music playback, video playback, Internet communication, and games.
- FIG. 13D shows an example of the camera.
- the camera 820 has a housing 821, a display portion 822, operation buttons 823, a shutter button 824, and the like.
- a detachable lens 826 is attached to the camera 820.
- the lens 826 is detachable from the housing 821 and can be replaced as the camera 820 here, the lens 826 and the housing may be integrated.
- the camera 820 can capture a still image or a moving image by pressing the shutter button 824.
- the display portion 822 has a function as a touch panel, and an image can be taken by touching the display portion 822.
- the camera 820 can be equipped with a strobe device, a viewfinder, or the like separately. Alternatively, these may be incorporated in the housing 821.
- FIG. 14A illustrates an example in which the display device of one embodiment of the present invention is mounted as a vehicle-mounted display.
- the display unit 1100 and the display unit 1110 can provide various information by displaying navigation information, a speedometer, a tachometer, a mileage, a fuel gauge, a gear state, an air conditioning setting, and the like. With respect to the display, its display items and layout can be changed appropriately according to the preference of the user.
- the display device of one embodiment of the present invention can be used in a wide temperature range and can perform display with high reliability in both a low temperature environment and a high temperature environment. Therefore, by using the display device of one embodiment of the present invention as a vehicle-mounted display, driving safety can be improved.
- the display device of one embodiment of the present invention has a high pixel aperture ratio and a small light-blocking region, a landscape behind the display device can be seen through the display device. Therefore, the display device of one embodiment of the present invention can be used for a windshield of a vehicle, a window of a building, a show window, a device for AR (Augmented Reality), or the like.
- FIG. 14B illustrates an example in which the display device of one embodiment of the present invention is used for a window of a building.
- the display device 1200 may be provided over the entire window, the display device 1200 may be provided in part of the window, and glass may be used in the other parts.
- the display device 1200 can display the image 1210 indoors or outdoors.
- the display device 1200 transmits light, so that one of the room and the outdoors can be seen through the display device 1200. That is, the display device 1200 can be treated like a conventional window glass.
- FIG. 14C illustrates an example in which the display device of one embodiment of the present invention is used for a show window case.
- the display device 1300 may be provided over the entire one surface of the case, the display device 1300 may be provided in a part thereof, and glass may be used in the other part.
- the display device 1300 can display the image 1310 toward the outside of the case.
- An example of the image 1310 is an image (ribbon in FIG. 14C) that decorates an object to be decorated 1320 (a bag in FIG. 14C) inside the case. Further, the image 1310 may include a description of a product or a text of advertisement.
- an electronic device can be obtained by applying the display device of one embodiment of the present invention.
- the display device has a very wide range of application and can be applied to electronic devices in all fields.
- CF1 colored layer
- CF2 colored layer
- CSCOM wiring, GL1: wiring, GL2: wiring
- SW11: transistor, SW12: transistor, SW13: transistor, VCOM wiring
- 111a pixel electrode
- 111b conductive layer.
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Abstract
Description
図2は画素の一例を示す回路図である。
図3Aは表示モジュールの一例を示す上面図である。図3Bは表示モジュールの一例を示す断面図である。
図4は画素の一例を示す上面図である。
図5A、図5B、図5C、図5Dは表示モジュールの一例を示す断面図である。
図6は表示モジュールの一例を示す断面図である。
図7は画素の一例を示す上面図である。
図8は表示モジュールの一例を示す断面図である。
図9は表示モジュールの一例を示す断面図である。
図10は表示モジュールの一例を示す断面図である。
図11は表示モジュールの一例を示す断面図である。
図12A、図12B、図12C、図12Dは電子機器の一例を示す図である。
図13A、図13B、図13C、図13Dは電子機器の一例を示す図である。
図14A、図14B、図14Cは電子機器の一例を示す図である。
本実施の形態では、本発明の一態様の表示装置及び表示モジュールについて、図1~図11を用いて説明する。
図1Aに、表示装置10の断面図を示す。図1Aに示す表示装置10は、基板131、トランジスタSW11、トランジスタSW12、絶縁層215、導電層115a、導電層115b、絶縁層121、画素電極111a、液晶材料を含む層112、共通電極113、及び基板132を有する。
表示装置10は、m行n列(m、nはそれぞれ1以上の整数)のマトリクス状に配置された複数の画素15を有する。図2に、画素15(i,j)(iは1以上m以下の整数、jは1以上n以下の整数)の回路図を示す。
図3Aに、表示モジュール50の上面図を示し、図3Bに、表示モジュール50の断面図を示す。
図4に、画素15(i,j)の上面図を示す。図4は、配線GL1(i)から画素電極111aまでの積層構造を画素電極111a側から見た上面図である。
図5Aに、表示モジュール50の断面図を示す。なお、画素の部分は、図4に示す一点鎖線G1−G2間及びG3−G4間の断面図に相当する。
本発明の一態様では、タッチセンサが搭載された表示装置または表示モジュール(以下、タッチパネルとも記す)を作製することができる。
次に、本実施の形態の表示装置及び表示モジュールの各構成要素に用いることができる材料等の詳細について、説明を行う。
以下では、半導体層に適用可能な金属酸化物について説明する。
図7に、画素16(i,j)の上面図を示す。図7は、配線GL1(i)から画素電極111aまでの積層構造を画素電極111a側から見た上面図である。
図10に示す表示モジュール55及び図11に示す表示モジュール57は、それぞれ、液晶表示装置と発光装置とを積層して有する。表示モジュール55、57は、それぞれ、発光装置が発する光33を、液晶表示装置を介して、外部に射出する構成である。また、液晶表示装置は、エッジライト型のライトから光が入射し、液晶材料を含む層で当該光を散乱させ、散乱光34を外部に射出する構成である。
本実施の形態では、本発明の一態様の電子機器について図12~図14を用いて説明する。
Claims (16)
- 画素を有し、
前記画素は、第1のトランジスタ、第2のトランジスタ、第1の絶縁層、第2の絶縁層、第1の導電層、画素電極、液晶材料を含む層、及び共通電極を有し、
前記第1の絶縁層は、前記第1のトランジスタのチャネル形成領域上に位置し、
前記第1の導電層は、前記第1の絶縁層上に位置し、
前記第2の絶縁層は、前記第1のトランジスタ、前記第2のトランジスタ、前記第1の絶縁層、及び前記第1の導電層上に位置し、
前記画素電極は、前記第2の絶縁層上に位置し、
前記液晶材料を含む層は、前記画素電極上に位置し、
前記共通電極は、前記液晶材料を含む層上に位置し、
前記共通電極は、前記液晶材料を含む層及び前記画素電極を介して、前記第1の導電層と重なる領域を有し、
前記画素は、さらに、第1の接続部と、第2の接続部と、を有し、
前記第1の接続部では、前記第1の導電層が前記第1のトランジスタと電気的に接続され、
前記第2の接続部では、前記画素電極が前記第2のトランジスタと電気的に接続され、
前記第1の導電層、前記画素電極、及び前記共通電極は、それぞれ、可視光を透過する機能を有する、表示装置。 - 請求項1において、
前記画素は、さらに、第2の導電層を有し、
前記第1の導電層と前記第2の導電層とは、同一表面上に位置し、
前記第1の導電層と前記第2の導電層とは、互いに電気的に絶縁されており、
前記共通電極は、前記液晶材料を含む層及び前記画素電極を介して、前記第2の導電層と重なる領域を有する、表示装置。 - 請求項1または2において、
前記画素電極と前記共通電極との間に電圧を印加している状態に比べて、前記画素電極と前記共通電極との間に電圧を印加していない状態の方が、前記液晶材料を含む層における可視光の透過率が高い、表示装置。 - 請求項1乃至3のいずれか一において、
前記液晶材料を含む層は、高分子材料を有し、
前記高分子材料は、多官能モノマーと単官能モノマーとの共重合体であり、
前記多官能モノマーは、安息香酸フェニル骨格を有し、
前記単官能モノマーは、シクロヘキシルベンゼン骨格を有する、表示装置。 - 請求項1乃至4のいずれか一において、
前記第1の接続部では、前記第1のトランジスタは、可視光を透過する機能を有する、表示装置。 - 請求項1乃至5のいずれか一において、
前記第2の接続部では、前記第2のトランジスタは、可視光を透過する機能を有する、表示装置。 - 請求項1乃至6のいずれか一において、
前記画素は、さらに、第3の導電層を有し、
前記第1の導電層と前記第3の導電層とは、同一表面上に位置し、
前記第1の導電層と前記第3の導電層とは、互いに電気的に絶縁されており、
前記第2の接続部では、前記画素電極が前記第3の導電層と接する領域を有し、前記第3の導電層が前記第2のトランジスタのソースまたはドレインと接する領域を有する、表示装置。 - 請求項7において、
前記第2のトランジスタのソースまたはドレインは、可視光を透過する機能を有する、表示装置。 - 請求項1乃至8のいずれか一において、
前記第1の絶縁層は、前記第1のトランジスタ上に位置する、表示装置。 - 請求項1乃至9のいずれか一において、
前記第1の絶縁層は、平坦化機能を有する、表示装置。 - 請求項1乃至3のいずれか一において、
前記第1のトランジスタのゲート、ソース、及びドレイン、並びに、前記第2のトランジスタのゲート、ソース、及びドレインのうち少なくとも一つは、第1の層と、前記第1の層上の第2の層と、を有し、
前記第2の層は、前記第1の層よりも抵抗値が小さい、表示装置。 - 請求項1乃至3のいずれか一において、
前記第1のトランジスタのゲート、ソース、及びドレイン、並びに、前記第2のトランジスタのゲート、ソース、及びドレインのうち少なくとも一つは、第1の層と、前記第1の層上の第2の層と、前記第2の層上の第3の層と、を有し、
前記第2の層は、前記第1の層よりも抵抗値が小さく、
前記第3の層は、前記第2の層よりも可視光の反射率が低く、
前記第2の層と前記第3の層とは、同じ金属元素を少なくとも一つ含む、表示装置。 - 請求項1乃至12のいずれか一において、
フィールドシーケンシャル駆動方式により表示する機能を有する、表示装置。 - 請求項1乃至13のいずれか一に記載の表示装置と、コネクタ及び集積回路のうち少なくとも一方と、を有する、表示モジュール。
- 請求項1乃至13のいずれか一に記載の表示装置と、発光素子を有する発光装置と、を積層して有し、
前記発光装置は、画像を表示する機能を有し、
前記発光素子が発する光は、前記表示装置を介して取り出される、表示モジュール。 - 請求項14または15に記載の表示モジュールと、
アンテナ、バッテリ、筐体、カメラ、スピーカ、マイク、及び操作ボタンのうち少なくとも一つと、を有する、電子機器。
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CN201980072306.9A CN112970053A (zh) | 2018-11-02 | 2019-10-22 | 显示装置、显示模块及电子设备 |
US18/233,953 US12111545B2 (en) | 2018-11-02 | 2023-08-15 | Display device, display module, and electronic device |
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