WO2020087392A1 - 电路板系统、拍摄装置、云台组件及可移动平台 - Google Patents

电路板系统、拍摄装置、云台组件及可移动平台 Download PDF

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Publication number
WO2020087392A1
WO2020087392A1 PCT/CN2018/113176 CN2018113176W WO2020087392A1 WO 2020087392 A1 WO2020087392 A1 WO 2020087392A1 CN 2018113176 W CN2018113176 W CN 2018113176W WO 2020087392 A1 WO2020087392 A1 WO 2020087392A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
module
board system
circuit boards
input
Prior art date
Application number
PCT/CN2018/113176
Other languages
English (en)
French (fr)
Inventor
杜俊
刘煜程
张海宁
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to EP18939125.3A priority Critical patent/EP3876512A1/en
Priority to PCT/CN2018/113176 priority patent/WO2020087392A1/zh
Priority to CN201880042391.XA priority patent/CN110799900B/zh
Publication of WO2020087392A1 publication Critical patent/WO2020087392A1/zh
Priority to US17/243,567 priority patent/US20210251078A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/56—Accessories
    • G03B17/561—Support related camera accessories
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D3/00—Control of position or direction
    • G05D3/12—Control of position or direction using feedback
    • G05D3/20—Control of position or direction using feedback using a digital comparing device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/02—Rotary gyroscopes
    • G01C19/04—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • the invention relates to the field of circuit boards, and in particular, to a circuit board system, a shooting device, a pan-tilt assembly, and a movable platform.
  • the inertial measurement module is integrated on the circuit board to which the camera module is connected.
  • the ideal working temperature of the inertial measurement module is about 60 degrees Celsius, and the normal working temperature of the camera module is much lower than 60 degrees Celsius, this causes the working temperature of the inertial measurement module to make the camera module unable to work normally.
  • a part of the performance of the inertial measurement module is sacrificed, which makes it difficult for the current product performance to be optimized.
  • the inertial measurement module and The camera module also has a large mutual influence on the spatial layout, which restricts the installation position of the inertial measurement module and the camera module, which is not conducive to the rationality of the internal spatial layout of the product.
  • a circuit board system for fixing on an inner frame of a gimbal wherein the circuit board system includes: a plurality of first circuit boards, and each of the first circuit boards is used for connecting at least one Input and output module capable of receiving light-emitting signals; a second circuit board, which is independently provided with a plurality of the first circuit boards; the second circuit board is provided with an inertial measurement module, a first interface, and a number of A second interface, a plurality of the second interfaces are correspondingly electrically connected to a plurality of the first circuit boards, the second circuit board is used to supply power to the plurality of first circuit boards, the inertial measurement module and the first An interface is electrically connected, and the first interface is used to electrically connect with the main control circuit board of the gimbal.
  • a photographing device includes the circuit board system described in any one of the above technical solutions, and the input / output module connected to the first circuit board in the circuit board system includes at least an imaging module.
  • a pan / tilt component includes: a pan / tilt and the circuit board system described in any one of the above technical solutions of the first aspect.
  • a movable platform comprising: a fuselage; the gimbal assembly described in any one of the technical solutions of the third aspect above, the gimbal in the gimbal assembly is connected to the fuselage.
  • the second circuit board and the plurality of first circuit boards are independently provided, which can not only greatly reduce the mutual interference between the input / output module electrically connected to the first circuit board and the inertial measurement module.
  • the spatial position layout of the inertial measurement module and the input and output module is not limited to the same circuit board, so that the position layout between the inertial measurement module and the input and output module can be more flexible, and there can be more sufficient near the inertial measurement module.
  • the space to deal with the external interference and working environment requirements of the inertial measurement module is conducive to the performance of the inertial measurement module and the input and output modules, and promotes the comprehensive improvement of product performance.
  • the second circuit board with the inertial measurement module is separated from the first circuit boards used for electrical connection with the input and output modules, so that the maintenance and replacement of the inertial measurement module is more convenient, for example, when the inertial measurement module appears In case of damage, the second circuit board can be replaced in a targeted manner without replacing or disassembling the input and output modules at the same time.
  • the cost of maintenance is lower and it is more conducive to product maintenance.
  • FIG. 1 is a schematic structural diagram of a circuit board system according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a circuit board system according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a circuit board system according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a circuit board system according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a circuit board system according to an embodiment of the present invention.
  • FIG. 6 is a partial structural schematic diagram of a circuit board system according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a partial cross-sectional structure of a circuit board system according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of another partial cross-sectional structure of the circuit board system according to an embodiment of the invention.
  • FIG. 9 is an exploded schematic view of the circuit board system according to an embodiment of the present invention.
  • FIG. 10 is a schematic diagram of an exploded structure of a circuit board system according to an embodiment of the present invention.
  • FIG. 11 is a partial structural schematic diagram of the circuit board system according to an embodiment of the present invention.
  • FIG. 12 is a schematic structural view of a front shell according to an embodiment of the present invention.
  • FIG. 13 is a schematic diagram of a partial structure of a circuit board system according to an embodiment of the present invention.
  • FIG. 14 is a schematic structural diagram of a pan-tilt component according to an embodiment of the present invention.
  • FIG. 15 is a schematic structural view of the pan / tilt assembly shown in FIG. 14 from another perspective.
  • Circuit Board System 100 First circuit board 110 Mobile Industry Processor Interface MIPI 1102 Target board 112 Serial peripheral interface SPI 1122 Second circuit board 120 Inertial measurement module 130 First interface 140 Second interface 150 functional module 160 Power module 162 Clock module 164 Level conversion module 166 case 170 Front shell 172 Positioning column 1722 Fixing groove 1724 Screw hole 1726
  • circuit board system and the gimbal assembly according to some embodiments of the present invention are described below with reference to FIGS. 1 to 15.
  • the embodiment of the first aspect of the present invention provides a circuit board system 100, which is used to be fixed on the inner frame of the gimbal 300.
  • the gimbal 300 is a product used to carry and drive the movement of the load.
  • the inner frame of the gimbal 300 is a component on the gimbal 300 for connecting to the load.
  • the circuit board system 100 is used in this design
  • the circuit board system 100 can be used as a load and mounted on the gimbal 300 by being fixed on the inner frame of the gimbal 300.
  • the circuit board system 100 and the inner frame of the pan / tilt head 300 can be selectively designed to be detachably fixed or not detachably fixed.
  • the circuit board system 100 includes: a plurality of first circuit boards 110 and a second circuit board 120. Specifically, among the plurality of first circuit boards 110, each first circuit board 110 is used for Connect at least one input and output module 200 capable of receiving and emitting light signals; the second circuit board 120 and the plurality of first circuit boards 110 are independently provided; Interface 150, a number of second interfaces 150 are correspondingly electrically connected to a number of first circuit boards 110, the second circuit board 120 is used to supply power to the number of first circuit boards 110, the inertial measurement module 130 is electrically connected to the first interface 140 The interface 140 is used for electrical connection with the main control circuit board 310 of the gimbal.
  • the plurality of first circuit boards 110 may be one first circuit board 110, or may be more than one first circuit board 110.
  • each module on the second circuit board 120 shown in FIGS. 1 to 5 does not limit this solution.
  • the input-output module 200 can receive and emit light signals should be understood as: the input-output module 200 is a module capable of receiving optical signals and / or transmitting optical signals.
  • the second circuit board 120 and the plurality of first circuit boards 110 are independently disposed, which means that the second circuit board 120 and the plurality of first circuit boards 110 are independent in position, which may be disposed in the same device or different devices Inside.
  • the circuit board system 100 provided by the above embodiment of the present invention by independently setting the second circuit board 120 and the plurality of first circuit boards 110, can not only greatly reduce the input and output modules 200 and the electrical connection of the first circuit board 110 The mutual interference between the inertial measurement modules 130.
  • the spatial layout of the inertial measurement module 130 and the input / output module 200 is not limited to the same circuit board.
  • the position layout between the inertial measurement module 130 and the input / output module 200 can be more flexible, especially for the input / output module
  • the number of groups 200 is multiple, so that there is more space near the inertial measurement module 130 to deal with the external interference and working environment requirements of the inertial measurement module 130, which is conducive to the work of the inertial measurement module 130 and the input and output module 200
  • the performance of performance promotes the comprehensive improvement of product performance. At the same time, this can also help to reduce the workload of hardware development, and reduce the heat dissipation load on the input and output modules 200, and promote the compact and reasonable space layout between product components, which is conducive to the miniaturization and lightweight development of products.
  • the second circuit board 120 provided with the inertial measurement module 130 is separated from the plurality of first circuit boards 110 used for electrical connection with the input / output module 200. In this way, the maintenance and replacement of the inertial measurement module 130 is more convenient, such as When there is a problem of damage to the inertial measurement module 130, the second circuit board 120 can be replaced in a targeted manner without replacing or disassembling the input and output module 200 at the same time, and the maintenance cost is lower, which is more conducive to product maintenance.
  • the input / output module 200 may be a light emitting module or an imaging module, and each first circuit board 110 is used to connect at least one light emitting module and / or at least one imaging module.
  • this can reduce the heat influence of the light-emitting module from the surrounding environment of the inertial measurement module 130, and ensure the work of the light-emitting module Normal, and delay the light decay of the light-emitting module, extend the life of the light-emitting module.
  • the light emitting module may specifically include one or more of a fill light module, a searchlight module, and a laser module.
  • the fill light module may be a camera fill light, more specifically an LED lamp or a halogen lamp, etc.
  • the camera fill light By electrically connecting the camera fill light to the first circuit board 110, for example, the camera fill light and the first The circuit board 110 is soldered or connected through a terminal.
  • the camera fill light converts electrical energy into light energy to provide assistance when shooting in the absence of light conditions Light.
  • the searchlight module may include a searchlight, and of course, may also include a concave mirror for condensing light and other components, by electrically connecting the searchlight to the first circuit board 110, specifically, for example, soldering or passing the searchlight to the first circuit board 110 The terminals are connected.
  • the searchlight converts electrical energy into light energy and emits a strong beam for long-distance reconnaissance.
  • the laser module may include a laser, which is electrically connected to the first circuit board 110.
  • the laser is connected to the first circuit board 110 by soldering or through terminals.
  • the laser will Electric energy is converted into light energy and laser light is emitted for indication and other purposes.
  • an imaging module this is mainly for the case where the circuit board system 100 is applied to a camera, a video camera, or other shooting devices.
  • electrically connecting the imaging module to the first circuit board 110 that is independent of the second circuit board 120 it can reduce the thermal influence from the surrounding environment of the inertial measurement module 130, and ensure that the imaging module can function normally. Produce images with high quality, slow down the aging of imaging modules, and extend the life of imaging modules.
  • the imaging module may specifically include one or more of a visible light imaging module, a thermal imaging module, and an infrared light imaging module.
  • the visible light imaging module may specifically include a lens assembly and an image sensor optically corresponding to the lens assembly.
  • the image sensor is electrically connected to the first circuit board 110, for example, by soldering the image sensor to the first circuit board 110 or through terminals connection.
  • the lens assembly it may be mechanically connected to the first circuit board 110, of course, it may not be directly mechanically connected.
  • the image sensor is used to convert the visible light taken along the lens assembly into an electrical signal in a proportional relationship with the light image, and timely transmit the generated electrical signal to the pan / tilt 300 or the movable platform for processing through the circuit board system 100 To realize the visible light shooting function.
  • the sensor of the thermal imaging module may be an infrared detection sensor, and the infrared detection sensor is connected to the first circuit board 110, specifically, for example, soldering the infrared detection sensor to the first circuit board 110 Or connected through the terminal, the infrared detection sensor is used to convert the infrared light taken along the lens assembly into an electrical signal proportional to the light image, and the generated electrical signal is transmitted to the pan / tilt 300 in time through the circuit board system 100 or
  • the mobile platform performs processing to discover the target based on the temperature difference or thermal radiation between the target and the background or parts of the target, and realize infrared detection imaging, so that the product has convenient application functions such as fire prevention, night vision, and security reconnaissance.
  • the infrared light imaging module includes an infrared emitter and an infrared detection sensor.
  • the infrared emitter and the infrared detection sensor are connected to the first circuit board 110, for example, the infrared emitter and the infrared detection
  • the sensor is connected to the first circuit board 110 by soldering or through terminals.
  • the infrared transmitter is used to emit infrared light.
  • the infrared detection sensor is used to receive infrared light from the target reflection source and form an electrical signal in a proportional relationship with the light image.
  • the board system 100 timely transmits the generated electrical signal to the pan / tilt 300 or a movable platform for processing, so as to realize observation and detection by actively irradiating and using the infrared light reflected by the target's infrared source, so that the product has night vision and security Convenient application functions such as reconnaissance.
  • the inertial measurement module 130 may specifically include an inertial measurement sensor.
  • the inertial measurement sensor includes a gyroscope and an accelerometer.
  • the inertial measurement sensor is used to detect the state parameters of the circuit board system 100 and the input / output module 200 thereon. It is used to detect the state parameters of the equipment where the entire circuit board system 100 is located, such as detecting the angular velocity and / or acceleration of the circuit board system 100 and its input / output module 200 or the equipment where the entire circuit board system is located.
  • the parameters detected by the sensor are used to supply the main control circuit board 310 of the gimbal 300 for processing, so that the main control circuit board 310 of the gimbal 300 schedules the ESC system of the gimbal 300 according to the parameters provided by the inertial measurement sensor, so that the ESC system
  • the posture of the circuit board system 100 and its input / output module 200 or the above-mentioned entire device is adjusted accordingly to achieve stable shooting or light supply.
  • the circuit board system 100 includes a plurality of first circuit boards 110 and a second circuit board 120.
  • the second circuit board 120 and the plurality of first circuit boards 110 are independently arranged.
  • the first circuit board 110 may be specifically a printed circuit board, that is, a PCB board.
  • the second circuit board 120 may be specifically a printed circuit board, that is, a PCB board.
  • the second circuit board 120 is provided with an inertial measurement module 130, a first interface 140 and a plurality of second interfaces 150.
  • the plurality of second interfaces 150 are correspondingly electrically connected to the plurality of first circuit boards 110.
  • the second circuit board 120 is used for A circuit board 110 supplies power, and the inertial measurement module 130 is electrically connected to the first interface 140.
  • the first interface 140 is used to electrically connect to the main control circuit board of the gimbal.
  • the number of the first circuit boards 110 is plural, the number of the first circuit boards 110 is the same as the number of the input / output modules 200, and there is a one-to-one correspondence between the first circuit boards 110 and the input / output modules 200. In this way, the input and output modules 200 will not interfere with each other, and the spatial position layout of the multiple input and output modules 200 is not limited to the same circuit board, so that the position layout between the multiple input and output modules 200 can be It is more flexible and can realize the matching and combination between different types of input and output modules 200.
  • the product type design is more flexible, can meet different functional requirements, and the transformation cost is extremely low, directly replace the first A circuit board 110 and the input / output module 200 thereon are sufficient, which also makes the maintenance and replacement of each input / output module 200 easier and more convenient.
  • the difference from the first embodiment is that the number of first circuit boards 110 is smaller than the number of input / output modules 200, and at least one first circuit board 110 is used to connect two or more input / output modules 200.
  • the number of the first circuit boards 110 is a plurality.
  • each of the first circuit boards 110 in a part of the first circuit boards 110 is used to connect one input / output module 200
  • Each of the other first circuit boards 110 is used to connect two or more input / output modules 200.
  • the first circuit board 110 can be designed to be connected to the visible light imaging module alone.
  • a first circuit board 110 and multiple fill light module modules can be designed. connection.
  • first circuit board 110 to be electrically connected to any two or three of the fill light module, the searchlight module, and the laser module to reduce the material consumption of the circuit board and reduce the cost.
  • the visible light imaging module and the fill light module are integrated on the same first circuit board 110 to save circuit boards. At the same time of material consumption, it is also conducive to improving the work coordination and relative position accuracy between the visible light imaging module and the fill light module.
  • each of the plurality of first circuit boards 110 to connect two or more input / output modules 200 according to requirements.
  • the difference from the first embodiment is that when the number of input / output modules 200 is multiple, a plurality of first circuit boards 110 are used to connect a part of the multiple input / output modules 200, and the second circuit boards 120 It is used to connect another part of the multiple input / output modules 200.
  • the input / output module 200 which has a large mutual influence with the inertial measurement module 130 can be provided on the first circuit board 110,
  • the input and output modules 200 with less mutual influence between the inertial measurement modules 130 are provided on the second circuit board 120 to make full use of the space of the second circuit board 120, so that the total number of circuit boards can be reduced and the product cost can be reduced.
  • the second circuit board 120 is provided with a functional module 160. More specifically, the functional module 160 includes one of a power module 162, a level conversion module 166, and a clock module 164 or Multiple.
  • the power module 162 and the first circuit board 110 form a direct or indirect electrical connection relationship, so that the second circuit board 120 passes through the power module 162 to the corresponding power module 162
  • the first circuit board 110 supplies power.
  • the power module 162 is electrically connected to the second interface 150, and is electrically connected to the first circuit board 110 connected to the second interface 150 through the second interface 150.
  • the power module 162 is electrically connected to the second interface 150, and is electrically connected to the first circuit board 110 connected to the second interface 150 through the second interface 150.
  • the design is not limited to this.
  • Those skilled in the art can also design the power module 162 not to be electrically connected to the first circuit board 110 through the second interface 150, but to use the power module 162 and the first circuit board 110 Direct wiring electrical connection structure.
  • the power module 162 on the second circuit board 120 is electrically connected to the plurality of second interfaces 150, so as to achieve the corresponding multiple first interfaces through the plurality of second interfaces 150 at the same time.
  • the power supply of the circuit board 110 is beneficial to the integration and miniaturization of the second circuit board 120.
  • multiple power modules 162 can be provided on the second circuit board 120 according to requirements, and the multiple power modules 162 can form a one-to-one correspondence with the multiple second interfaces 150.
  • the connection relationship enables the power module 162 to supply power to the corresponding first circuit board 110 alone.
  • the functional module 160 includes a clock module 164
  • the input-output module 200 can be subdivided into two types: an input-output module having a clock function and an input-output module having no clock function.
  • a clock module 164 can be provided on the second circuit board 120, and the clock module 164 can transmit a time signal to the set first circuit board 110.
  • the first circuit board 100 is a first circuit board for connecting to an input / output module that does not have a clock function.
  • the clock module 164 is electrically connected to the second interface 150, and is electrically connected to the first circuit board 110 connected to the second interface 150 through the second interface 150.
  • the clock module 164 it is beneficial to realize the integration of the interface between the first circuit board 110 and the second circuit board 120, the number of wiring between the first circuit board 110 and the second circuit board 120 is reduced, the number of wiring steps is reduced accordingly, and the assembly is easier and faster .
  • the design is not limited to this.
  • Those skilled in the art can also design the clock module 164 not to be electrically connected to the first circuit board 110 through the second interface 150, but to use the clock module 164 between the first circuit board 110 Direct wiring electrical connection structure.
  • the power module 162 on the second circuit board 120 is also electrically connected to the clock module 164 and the inertial measurement module 130 on the second circuit board 120, and is used to measure the clock module 164 and the inertia Module 130, etc. supplies power.
  • the functional module 160 includes a level conversion module 166, wherein at least one of the first circuit boards 110 is the target circuit board 112, and the level of the electrical signal corresponding to the target circuit board 112 is different from that of the first circuit boards
  • the level of the electrical signal corresponding to the first circuit board 110 other than the target circuit board 112 in 110, and the level conversion module 166 is used to electrically transmit the electrical signal transmitted between the second circuit board 120 and the target circuit board 112 Flat conversion processing. In this way, through the level conversion process, the level of the electrical signal transmitted via the second circuit board 120 can be adapted to the level of the electrical signal required by the input / output module 200 connected to the target circuit board 112.
  • the second circuit board 220 can be used for the replacement of different input and output modules 200 and the corresponding first circuit board 110, thereby facilitating the application of the circuit board system in different scenarios . It can be understood that, by setting the corresponding input / output module 200, the level of the corresponding electrical signal can be controlled. If the level of the corresponding electrical signal is controlled within a certain range, the level conversion module 166 may not be provided. .
  • this solution is not limited to this.
  • those skilled in the art may also set the level conversion module 166 On the first circuit board 110.
  • the target circuit board 112 is further provided with a serial peripheral interface SPI 1122, and the level conversion module 166 is electrically connected to the serial peripheral interface SPI 1122.
  • SPI Serial Peripheral Interface
  • MCU Microcontroller Unit; micro control unit
  • peripheral devices in a serial manner Communicate to exchange information.
  • serial peripheral interface SPI 1122 is connected to the second interface 150
  • level conversion module 166 is connected to the second interface 150 to realize electrical conductivity between the serial peripheral interface SPI 1122 and the level conversion module 166. through.
  • the level conversion module 166 is electrically connected to the first interface 140 for outputting the electrical signal output by the serial peripheral interface SPI 1122 to the main control circuit board 310 of the PTZ 300 through the first interface 140, so that The main control board 400 of the mobile platform can obtain the electrical signal output from the serial peripheral interface SPI 1122 from the main control circuit board 310 of the pan / tilt 300.
  • the communication signal flow between the input / output module 200 electrically connected to the target circuit board 112 and the main control board 400 of the movable platform is: the electrical signal formed by the input / output module 200 electrically connected to the target circuit board 112 After sequentially passing through the first circuit board 110, the second interface 150, the level conversion module 166, and the first interface 140, it reaches the main control circuit board 310 of the PTZ 300, and the main control circuit board 310 of the PTZ 300 further The main control board 400 of the mobile platform transmits. In this way, the interface of the main control board 400 of the movable platform will not be additionally occupied, which is advantageous for simplifying the volume and wiring assembly steps of the main control board 400 of the movable platform.
  • this solution is not limited to this.
  • Those skilled in the art can also design a direct electrical connection between the level conversion module 166 and the first circuit board 110 according to the requirements without transferring through the second interface 150.
  • the electrical signal formed by the input / output module 200 electrically connected to the target circuit board 112 can be directly transmitted from the serial peripheral interface SPI to the The main control board 400 of the mobile platform. It can be set according to actual needs, which is not specifically limited here.
  • At least one of the plurality of first circuit boards 110 is further provided with a mobile industry processor interface MIPI 1102 (English name: Mobile Industry Industry Processor Interface), and the mobile industry processor interface MIPI 1102 is used to communicate with a mobile platform
  • MIPI 1102 International name: Mobile Industry Processor Interface
  • the main control board 400 is electrically connected, and the gimbal 300 is mounted on a movable platform.
  • the formed input-output module 200 communicates directly with the main control board 400 of the movable platform through the first circuit board 110, which has the advantages of high accuracy and high transmission efficiency.
  • the mobile industry processor interface MIPI 1102 and the main control board 400 of the mobile platform can be wired, of course, the mobile industry processor interface MIPI 1102 and the mobile platform can also be designed.
  • a wireless communication connection is established between the main control board 400.
  • the input / output module 200 electrically connected to the first circuit board 110 provided with the mobile industry processor interface MIPI 1102 is an imaging module, specifically, for example, a visible light imaging module, a thermal imaging module, and an infrared light imaging module One or more of them.
  • the second interface 150 and the corresponding first circuit board 110 are electrically connected using a cable 190.
  • the second interface 150 may be specifically a wiring port for connecting to the flat cable 190, such as a terminal.
  • the second interface 150 when used for signal transmission between the first circuit board 110 and the second circuit board 120, the second interface 150 may also A wireless communication module designed to establish wireless communication with the first circuit board 110.
  • the circuit board system 100 is further defined to further include a housing 170.
  • the housing 170 is provided with a connecting portion for connecting to the inner frame of the pan / tilt head 300, and the connecting portion is used for supplying the housing
  • the body 170 and the pan / tilt head 300 can be detachably or non-removably directly connected and assembled, specifically, for example, a buckle, a lock, a clip, etc., provided on the housing 170, so that the housing 170 can be assembled on the pan / tilt head 300.
  • a bracket can be additionally designed according to requirements, and the housing 170 can be installed on the bracket, and a connection portion is provided on the bracket for the bracket to connect and assemble with the gimbal 300, so as to realize Indirect assembly between stations 300.
  • the housing 170 has an accommodating space, and the second circuit board 120 and the plurality of first circuit boards 110 are disposed in the accommodating space.
  • the second circuit board 120 and a number of first circuit boards 110 are installed in the accommodating space, and the housing 170 is directly or indirectly assembled with the pan / tilt 300. This structure is beneficial to protect the circuit board and prevent The circuit board is damaged.
  • the housing 170 is further defined to include a front housing 172, a rear housing 174 and a middle frame 176. Between 174, and connected to the front shell 172 and the rear shell 174. The space enclosed by the front case 172 and the middle frame 176 is provided with the first circuit board 110, and the space enclosed by the rear case 174 and the middle frame 176 is provided with the second circuit board 120.
  • the first circuit board 110 and the second circuit board 120 can have a relatively independent working environment, which can prevent the input and output module 200 on the first circuit board and the inertial measurement module 130 on the second circuit board 120 from interfering with each other. Improve product performance.
  • the first circuit board 110 is connected to the front case 172, and the second circuit board 120 is connected to the middle frame 176.
  • This design makes the second circuit board 120 at the middle position between the front and rear ends of the housing 170, which is more conducive to improving the accuracy of the posture detection of the entire circuit board system 100 assembly by the inertial measurement module 130.
  • the assembly process of the product can be adopted: after the first circuit board 110 is mounted on the front case 172, the middle frame 176 is mounted on the assembly of the first circuit board 110 and the front case 172, and then The step of mounting the second circuit board 120 on the middle frame 176 and connecting the second interface 150 of the second circuit board 120 to the first circuit board 110, such assembly steps can make the first circuit board 110 and the second circuit board
  • the cable 190 between 120 is the shortest, which can reduce the interference effect of the cable 190 on the inertial measurement module 130 and improve the working accuracy of the inertial measurement module 130.
  • the number of the first circuit boards 110 is two, and the two first circuit boards 110 are respectively connected to one input / output module 200 and two first circuits.
  • the board 110 one is used to connect the visible light imaging module 230, the other is used to connect the thermal imaging module 220, and the two first circuit boards 110 are arranged side by side and in parallel, so that the two input and output modules 200 have the same orientation and parallel.
  • This design can help ensure that the fields of view of the visible light imaging module 230 and the thermal imaging module 220 coincide as much as possible, realize dual-light shooting, and realize dual-light fusion.
  • one input and output module 200 is a visible light camera module 230 and the other input and output module 200 is a thermal imaging camera module 220.
  • a thermal imaging image needs to be taken with the thermal imaging camera module 220 and a visible light image with the visible light camera module 230.
  • the outline of the number or letter in the license plate is recognized based on the visible light image, and the color of the number or letter in the license plate is filled based on the thermal imaging image, thereby recognizing the license plate number.
  • the parallel arrangement of the two first circuit boards 110 corresponding to the visible light imaging module 230 and the thermal imaging module 220 can maximize the field of view between the thermal imaging camera module 220 and the visible light camera module 230 Overlap, otherwise there may be cases where the visible light camera module 230 captures all license plates, but the thermal imaging camera module 220 only captures some license plates or no license plates, resulting in the inability to match features between the visible light image and the thermal imaging image. Therefore, the license plate number cannot be recognized.
  • the rear end of the front case 172 is provided with positioning posts 1722 and screw holes 1726, and one of the two first circuit boards 110 is provided with through holes, wherein the positioning posts 1722 is penetrated through the through hole to achieve positioning between the first circuit board 110 and the front case 172.
  • screws are driven into the screw holes 1726 to securely connect the front case 172 to the first circuit board 110, restricting the first The circuit board 110 is disengaged from the positioning post 1722, and the first circuit board 110 is fixed to the front case 172.
  • the rear end of the front case 172 is further provided with a fixing groove 1724 and a screw hole 1726.
  • the outline of the other of the two first circuit boards 110 is adapted to the fixing groove 1724, wherein the first circuit board 110 is embedded in the fixing groove 1724
  • screws are screwed into the screw holes 1726 to securely connect the front case 172 and the first circuit board 110, restricting the first circuit board 110 from coming out of the fixing groove 1724, A circuit board 110 is fixed to the front case 172.
  • a seal ring 213 is provided between the front case 172 and the input / output module 200, and the seal ring 213 plays a role of sealing and buffering shock absorption to improve the shooting effect.
  • the front end of the front case 172 is provided with a lens frame 212.
  • the lens frame 212 is provided with two light-transmitting holes
  • the front case 172 is provided with two light-transmitting holes.
  • There is a one-to-one correspondence with the light holes wherein the two light-transmitting holes or the two light-through holes are respectively packaged with lenses 211, and the two lenses 211 are opposite to the two input-output modules 200.
  • the second circuit board 120 is located on the rear side of the two first circuit boards 110 and is opposite to the two first circuit boards 110, so that the second circuit board 120 and the two first circuit boards 110 divide the space in the housing 170 into three segment.
  • a damping material is provided at the position corresponding to the inertial measurement module 130 on the middle frame 176 to dampen the inertial measurement module 130, reduce the influence of high-frequency vibrations received by the inertial measurement module 130, and improve the measurement accuracy of the inertial measurement module 130 .
  • a positioning groove 1762 is provided on the middle frame 176, and the damping material is filled in the positioning groove 1762, which plays a role in positioning and limiting the damping material, ensuring that the damping material maintains accurate alignment with the inertial measurement module 130, and ensuring shock absorption Reliable.
  • the portion of the first circuit board 110 corresponding to the inertial measurement module 130 is provided with a heat sink 180.
  • the first circuit board 110 is provided with a functional module 160.
  • the functional module 160 includes one or more of a power module 162, a level conversion module 166, and a clock module 164, of which, as shown in FIG. 10 It is shown that the inertial measurement module 130 and the functional module 160 are far away from each other to reduce the influence of the working environment temperature of the inertial measurement module 130 on the functional module 160 and ensure that the functional module 160 operates normally.
  • the functional module 160 As the preferred technical solution of this design, as shown in FIG. 10 As shown, it is further preferred to design the functional module 160 to be located in the middle of the second circuit board 120, and the inertial measurement module 130 is adjacent to the edge of the second circuit board 120.
  • the case 170 includes a front case 172, a rear case 174, and a middle frame 176.
  • the middle frame 176 is located between the front case 172 and the rear case 174, and is different from the front case 172 and the rear case 174 is connected, wherein the space surrounded by the front case 172 and the middle frame 176 is provided with a part of the first circuit boards 110, and the space surrounded by the rear case 174 and the middle frame 176 is provided with a plurality of first circuit boards The other part of 110 and the second circuit board 120.
  • first circuit boards 110 is connected to the front case 172
  • another part of the first circuit boards 110 is connected to the rear case 174
  • the second circuit board 120 is connected to the middle frame 176.
  • the two first circuit boards 110 are oppositely arranged, and the input / output module 200 is located on the side opposite to the two first circuit boards 110, so that the two The orientation of the input / output module 200 connected to the first circuit board 110 is opposite.
  • the second circuit board 120 is located between the two first circuit boards 110.
  • the two facing the front side of the input / output module 200 is connected to the front case 172
  • the one facing the rear side of the input / output module 200 is connected to the rear case 174
  • the second circuit board 120 is connected to Middle box 176.
  • one of the two first circuit boards 110 is used to connect the visible light imaging module, and the other is used to connect the thermal imaging module.
  • the photographing device provided by the embodiment of the second aspect of the present invention includes the circuit board system 100 described in any one of the above embodiments of the first aspect, and the input and output module 200 connected to the first circuit board 110 in the circuit board system 100 At least includes the imaging module.
  • the photographing device provided in this embodiment has all the above beneficial effects by providing the circuit board system 100 described in any one of the above embodiments, which will not be repeated here.
  • the shooting device is a camera, a video camera, or the like.
  • the photographing device is a dual-light camera
  • the dual-light camera specifically includes, for example, a visible light camera and a thermal imaging dual-light camera, and may also include a visible light camera and a fill light.
  • the gimbal assembly provided by the embodiment of the third aspect of the present invention includes the gimbal 300 and the circuit board system 100 described in any of the foregoing embodiments.
  • the pan / tilt assembly provided in this embodiment has all the above beneficial effects by providing the circuit board system 100 described in any one of the above embodiments, which will not be repeated here.
  • the gimbal 300 of the gimbal assembly is a surface, air or land robot gimbal, or a handheld gimbal.
  • the movable platform provided by the embodiment of the fourth aspect of the present invention includes: a fuselage; the circuit board system 100 described in any of the above embodiments.
  • the movable platform provided by this embodiment is provided with the circuit board system 100 described in any of the above embodiments, thereby having all the above beneficial effects, which will not be repeated here.
  • the fuselage of the movable platform is a surface, air or land robot.
  • the air robot is, for example, a drone.
  • the circuit board system provided by the present invention independently sets the second circuit board and the plurality of first circuit boards, which can not only greatly reduce the electrical connection between the input / output module and the inertial measurement module electrically connected to the first circuit board Of mutual interference.
  • the spatial position layout of the inertial measurement module and the input and output module is not limited to the same circuit board, so that the position layout between the inertial measurement module and the input and output module can be more flexible, and there can be more sufficient near the inertial measurement module
  • the space to deal with the external interference and working environment requirements of the inertial measurement module is conducive to the performance of the inertial measurement module and the input and output modules, and promotes the comprehensive improvement of product performance.
  • this can also help to reduce the workload of hardware development, and promote the compact and reasonable space layout between product components, which is conducive to the miniaturization and lightweight development of products, and by using the second circuit board with an inertial measurement module
  • first circuit boards electrically connected to the input and output modules are independent, so that the maintenance and replacement of the inertial measurement module is more convenient. For example, when the inertial measurement module is damaged, the second The circuit board does not need to replace or disassemble the input and output modules at the same time, and the maintenance cost is lower, which is more conducive to product maintenance.
  • connection can be a fixed connection, a detachable connection, or an integral connection; “connection” can It is directly connected, or indirectly connected through an intermediary.

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Abstract

一种电路板系统、拍摄装置、云台组件及可移动平台，其中，电路板系统(100)用于固定于云台(300)的内框架，电路板系统(100)包括若干第一电路板(110)和第二电路板(120)，每一第一电路板(110)用于连接至少一个能够收发光信号的输入输出模组(200)；第二电路板(120)与若干第一电路板(110)独立设置，且第二电路板(120)上设有惯性测量模块(130)、第一接口(140)及若干第二接口(150)，若干第二接口(150)与若干第一电路板(110)对应电连接，第二电路板(120)用于为若干第一电路板(110)供应电源，惯性测量模块(130)与第一接口(140)电连接，第一接口(140)用于与云台的主控电路板(310)电连接。

Description

电路板系统、拍摄装置、云台组件及可移动平台 技术领域
本发明涉及电路板领域，具体而言，涉及一种电路板系统、一种拍摄装置、一种云台组件及一种可移动平台。
背景技术
现有用于与云台搭载使用的相机中，惯性测量模块集成于连接有相机模组的电路板上。其中，由于惯性测量模块的理想工作温度在60摄氏度左右，而相机模组的正常工作温度要远低于60摄氏度，这就导致了惯性测量模块的工作温度会使得相机模组无法正常地工作。一般地，现有技术中为了确保相机模组的工作性能符合使用要求，会牺牲惯性测量模块的一部分性能，导致当下产品性能难以达到最佳，且现有的电路板结构中，惯性测量模块与相机模组在空间布局方面也存在较大的相互制约影响，对惯性测量模块及相机模组安装位置的限制较多，不利于产品内部空间布局的合理性。
发明内容
有鉴于此，有必要提供一种能解决上述技术问题至少之一的电路板系统。
一种电路板系统，所述电路板系统用于固定在云台的内框架上，其中，所述电路板系统包括：若干第一电路板，每一所述第一电路板用于连接至少一个能够收发光信号的输入输出模组；第二电路板，所述第二电路板与若干所述第一电路板独立设置；所述第二电路板上设有惯性测量模块、第一接口及若干第二接口，若干所述第二接口与若干所述第一电路板对应电连接，所述第二电路板用于为若干所述第一电路板供应电源，所述惯性测量模块与所述第一接口电连接，所述第一接口用于与所述云台的主控电路板电连接。
一种拍摄装置，包括上述第一方面的任一项技术方案中所述的电路板系 统，所述电路板系统中的第一电路板连接的输入输出模组至少包括成像模组。
一种云台组件，包括：云台以及上述第一方面的任一项技术方案中所述的电路板系统。
一种可移动平台，包括：机身；上述第三方面的任一项技术方案中所述的云台组件，所述云台组件中的云台与所述机身连接。
与现有技术相比，本申请具有以下有益的技术效果：
本发明通过将第二电路板与若干第一电路板独立设置，不仅可极大地降低第一电路板所电连接的输入输出模组与惯性测量模块之间的相互干扰。并且，惯性测量模块和输入输出模组的空间位置布局不受限于同一电路板，这样，惯性测量模块与输入输出模组之间的位置布局可更灵活，惯性测量模块附近可具有更充足的空间来处理惯性测量模块受到的外界干扰和工作环境需求，有利于惯性测量模块与输入输出模组各自工作性能的发挥，促进实现产品性能的综合提升。同时，这样也可利于减少硬件开发工作量，且降低输入输出模组上的散热负荷，并促进产品部件之间的空间布局紧凑、合理，利于产品的小型化和轻量化发展，且通过将设有惯性测量模块的第二电路板与用于和输入输出模组电连接的若干第一电路板独立开来，这样，对惯性测量模块的检修和更换更方便，具体如，当出现惯性测量模块损坏问题时，可针对性地替换第二电路板，而无需同时更换或拆装输入输出模组，检修成本更低，更利于产品的维护。
本发明的附加方面和优点将在下面的描述部分中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是本发明一个实施例所述电路板系统的结构示意图；
图2是本发明一个实施例所述电路板系统的结构示意图；
图3是本发明一个实施例所述电路板系统的结构示意图；
图4是本发明一个实施例所述电路板系统的结构示意图；
图5是本发明一个实施例所述电路板系统的结构示意图；
图6是本发明一个实施例所述电路板系统的局部结构示意图；
图7是本发明一个实施例所述电路板系统的局剖结构示意图；
图8是本发明一个实施例所述电路板系统的另一局剖结构示意图；
图9是本发明一个实施例所述电路板系统的分解结构示意图；
图10是本发明一个实施例所述电路板系统的分解结构示意图；
图11是本发明一个实施例所述电路板系统的局部结构示意图；
图12是本发明一个实施例所述前壳的结构示意图；
图13是本发明一个实施例所述电路板系统的局部结构示意图；
图14是本发明一个实施例所述云台组件的结构示意图；
图15是图14中所示云台组件在另一视角下的结构示意图。
其中，图1至图15中的附图标记与部件名称之间的对应关系为：
电路板系统 100
第一电路板 110
移动产业处理器接口MIPI 1102
目标电路板 112
串行外设接口SPI 1122
第二电路板 120
惯性测量模块 130
第一接口 140
第二接口 150
功能模块 160
电源模块 162
时钟模块 164
电平转换模块 166
壳体 170
前壳 172
定位柱 1722
固定槽 1724
螺钉孔 1726
后壳 174
中框 176
定位槽 1762
散热片 180
排线 190
输入输出模组 200
镜片 211
镜框 212
密封圈 213
热成像模组 220
可见光成像模组 230
云台 300
云台的主控电路板 310
可移动平台的主控板 400
具体实施方式
为了能够更清楚地理解本发明的上述目的、特征和优点，下面结合附图和具体实施方式对本发明进行进一步的详细描述。需要说明的是，在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。
在下面的描述中阐述了很多具体细节以便于充分理解本发明，但是，本发明还可以采用其他不同于在此描述的其他方式来实施，因此，本发明的保护范围并不受下面公开的具体实施例的限制。
下面参照图1至图15描述根据本发明一些实施例所述的电路板系统及云台组件。
如图1至图13所示，本发明第一方面的实施例提供了电路板系统100，该电路板系统100用于固定在云台300的内框架上。本领域技术人员可以理解的是，云台300是用于承载并驱动负载运动的产品，云台300的内框架是云台300上用于与负载连接的部件，本设计中电路板系统100用于固定在云台300的内框架上，使电路板系统100可作为负载与云台300搭载使用。其中，根据 具体使用需求，电路板系统100与云台300的内框架之间可选择性地设计为可拆卸地固定，或设计为不可拆卸地固定。
其中，如图1至图5所示，电路板系统100包括：若干第一电路板110和第二电路板120，具体地，若干第一电路板110中，每一第一电路板110用于连接至少一个能够收发光信号的输入输出模组200；第二电路板120与若干第一电路板110独立设置；第二电路板120上设有惯性测量模块130、第一接口140及若干第二接口150，若干第二接口150与若干第一电路板110对应电连接，第二电路板120用于为若干第一电路板110供应电源，惯性测量模块130与第一接口140电连接，第一接口140用于与云台的主控电路板310电连接。
其中，若干第一电路板110可以是一个第一电路板110，也可以是一个以上的第一电路板110。
值得说明的是，图1至图5中所示的第二电路板120上的各个模块的位置关系(如图1至图5中的第二接口、第一接口、电源模块、电平转换模块、惯性测量模块等之间的相对位置关系)并不对本方案造成限定。
可以理解的是，输入输出模组200能够收发光信号应当理解为：输入输出模组200为能够接收光信号和/或发射光信号的模组。第二电路板120与若干第一电路板110独立设置，是指第二电路板120与若干第一电路板110位置上的独立，其可以设于同一个设备内，也可以设于不同的设备内。
本发明上述实施例提供的电路板系统100，通过将第二电路板120与若干第一电路板110独立设置，不仅可极大地降低第一电路板110上所电连接的输入输出模组200与惯性测量模块130之间的相互干扰。并且，惯性测量模块130和输入输出模组200的空间位置布局不受限于同一电路板，这样，惯性测量模块130与输入输出模组200之间的位置布局可更灵活，尤其对于输入输出模组200的数量为多个情况，使得惯性测量模块130附近可具有更充足的空间来处理惯性测量模块130受到的外界干扰和工作环境需求，有利于惯性测量模块130与输入输出模组200各自工作性能的发挥，促进实现产品性能的综合提升。同时，这样也可利于减少硬件开发工作量，且降低输入输出模组200上的散热负荷，并促进产品部件之间的空间布局紧凑、合理，利于产品的小型化和 轻量化发展，且通过将设有惯性测量模块130的第二电路板120与用于和输入输出模组200电连接的若干第一电路板110独立开来，这样，对惯性测量模块130的检修和更换更方便，具体如，当出现惯性测量模块130损坏问题时，可针对性地替换第二电路板120，而无需同时更换或拆装输入输出模组200，检修成本更低，更利于产品的维护。
具体而言，输入输出模组200可具体为发光模组或成像模组，每一第一电路板110用于连接至少一个发光模组和/或至少一个成像模组。
其中，通过将发光模组电连接至独立于第二电路板120的第一电路板110，这样，可以减少发光模组受到的来自于惯性测量模块130周围环境的热影响，确保发光模组工作正常，并延缓发光模组的光衰，延长发光模组的寿命。
可选地，发光模组可具体包括补光灯模组、探照灯模组、激光模组中的一种或多种。具体地，补光灯模组可如摄像补光灯，更具体如LED灯或卤素灯等，通过将摄像补光灯电连接于第一电路板110，具体如将摄像补光灯与第一电路板110锡焊连接或通过端子连接，当第一电路板110向摄像补光灯给电时，摄像补光灯将电能转化为光能，以实现在缺乏光线条件的情况下拍摄时提供辅助光线。
探照灯模组可包括探照灯，当然，还可包括用于进行聚光的凹面镜等部件，通过将探照灯电连接于第一电路板110，具体如将探照灯与第一电路板110锡焊连接或通过端子连接，当第一电路板110向探照灯给电时，探照灯将电能转化为光能并发出强力光束以供远距离侦察。
激光模组可包括激光器，将激光器电连接于第一电路板110，具体如将激光器与第一电路板110锡焊连接或通过端子连接，当第一电路板110向激光器给电时，激光器将电能转化为光能并发出激光光线供以指示等用途。
另外，通过设置成像模组，这主要面向于电路板系统100应用于相机或摄影机等拍摄装置的情况。其中，通过将成像模组电连接至独立于第二电路板120的第一电路板110，这样，可以减少其受到的来自于惯性测量模块130周围环境的热影响，确保成像模组能正常、高质量地出图，并减缓成像模组老化，延长成像模组的寿命。
可选地，成像模组可具体包括可见光成像模组、热成像模组、红外光成像 模组中的一种或多种。具体地，可见光成像模组可具体包括镜头组件和与镜头组件光学对应的图像传感器，图像传感器与第一电路板110电连接，具体如将图像传感器与第一电路板110锡焊连接或通过端子连接。至于镜头组件，其与第一电路板110之间可以机械连接，当然，也可不进行直接的机械连接。其中，图像传感器用于将沿镜头组件摄入的可见光转换为与光像成相应比例关系的电信号，并通过电路板系统100将生成的电信号及时传递给云台300或可移动平台进行处理，实现可见光拍摄功能。
与前述可见光成像模组的不同之处在于，热成像模组的传感器可为红外探测传感器，红外探测传感器连接于第一电路板110，具体如将红外探测传感器与第一电路板110锡焊连接或通过端子连接，红外探测传感器用于将沿镜头组件摄入的红外线转换为与光像成相应比例关系的电信号，并通过电路板系统100将生成的电信号及时传递给云台300或可移动平台进行处理，以实现根据目标与背景或目标各部分之间的温差或热辐射来发现目标，实现红外线探测成像，使产品具备在防火、夜视、安防侦察等方便的应用功能。
与前述可见光成像模组的不同之处在于，红外光成像模组包括红外发射器及红外探测传感器，红外发射器及红外探测传感器连接于第一电路板110，具体如将红外发射器及红外探测传感器与第一电路板110锡焊连接或通过端子连接，红外发射器用于发射红外光，红外探测传感器用于接收目标反射源的红外光并形成与光像成相应比例关系的电信号，通过电路板系统100将生成的电信号及时传递给云台300或可移动平台进行处理，以实现通过主动照射并利用目标反射红外源的红外光来实施观察、侦测，使产品具备在夜视、安防侦察等方便的应用功能。
更优选地，惯性测量模块130可具体包括惯性测量传感器，惯性测量传感器包括陀螺仪和加速度器，惯性测量传感器用于侦测电路板系统100及其上输入输出模组200的状态参数，也可以说用于侦测整个电路板系统100所在设备的状态参数，例如侦测电路板系统100及其上输入输出模组200或整个电路板系统所在设备的角速度和/或加速度等参数，该惯性测量传感器检测的参数用于供给云台300的主控电路板310进行处理，以使云台300的主控电路板310根据惯性测量传感器提供的参数调度云台300的电调系统，使电调系统相应对 电路板系统100及其上输入输出模组200或上述整个设备的姿态进行调整，以实现稳定拍摄或给光。
具体实施例一(如图1所示)
如图1所示，电路板系统100包括若干第一电路板110和一个第二电路板120，第二电路板120与若干第一电路板110独立设置。
第一电路板110可具体例如印刷电路板，也即PCB板。
第二电路板120可具体例如印刷电路板，也即PCB板。
第二电路板120上设有惯性测量模块130、第一接口140及若干第二接口150，若干第二接口150与若干第一电路板110对应电连接，第二电路板120用于为若干第一电路板110供应电源，惯性测量模块130与第一接口140电连接，第一接口140用于与云台的主控电路板电连接。
其中，若干第一电路板110的数量为多个，第一电路板110的数量与输入输出模组200的数量相同，且第一电路板110与输入输出模组200之间一一对应。这样，输入输出模组200之间不会相互干扰，并且，多个输入输出模组200的空间位置布局不受限于同一电路板，这样，多个输入输出模组200之间的位置布局可更灵活，且可实现不同类型输入输出模组200之间的搭配和组合。例如，根据需求将发光模组与成像模组进行搭配，或将补光灯模组与激光模组进行搭配，产品类型设计更灵活，可满足不同功能需求，且改造成本极低，直接更换第一电路板110及其上的输入输出模组200即可，这也使得对各个输入输出模组200的检修和更换更加简单、方便。
具体实施例二(如图2所示)
与前述具体实施例一的不同之处在于，第一电路板110的数量小于输入输出模组200的数量，且至少一个第一电路板110用于连接两个及以上的输入输出模组200。
更具体地，第一电路板110的数量为多个，多个第一电路板110中，一部分第一电路板110中的每个第一电路板110用于连接一个输入输出模组200，且另一部分第一电路板110中的每个第一电路板110用于连接两个及以上的输入输出模组200。这样，对于体积本身较大、零部件较多的如可见光成像模组，可设计第一电路板110单独与该可见光成像模组连接。而对于体积本身较小、 零部件较少，且结构相对简单的如补光灯模组、探照灯模组、激光模组等，可设计一个第一电路板110与多个补光灯模组电连接。或设计一个第一电路板110与补光灯模组、探照灯模组、激光模组中任意两种或三种进行电连接，实现减少电路板材料消耗，降低成本。又或者，对于通常搭配使用的两个模组，如可见光成像模组和补光灯模组，将该可见光成像模组及补光灯模组集成于同一第一电路板110，在节约电路板材料消耗的同时，也利于提升可见光成像模组和补光灯模组之间的工作协调性和相对位置精度。
当然，本设计并不局限于此，本领域技术人员根据需求也可设计多个第一电路板110中的每个用于连接两个及以上的输入输出模组200。
具体实施例三(如图3所示)
与前述具体实施例一的不同之处在于，当输入输出模组200的数量为多个时，若干第一电路板110用于连接多个输入输出模组200中的一部分，第二电路板120用于连接多个输入输出模组200中的另一部分。
这样，可将多个输入输出模组200中，与惯性测量模块130之间相互影响较大的输入输出模组200设于第一电路板110，可将多个输入输出模组200中，与惯性测量模块130之间相互影响较小的输入输出模组200设于第二电路板120，以更充分地利用第二电路板120空间，这样可以减少电路板总数量，实现降低产品成本。
具体实施例四(如图4所示)
与前述具体实施例一的不同之处在于，第二电路板120上设有功能模块160，更具体地，功能模块160包括电源模块162、电平转换模块166、时钟模块164中的一种或多种。
具体地，对于功能模块160包括电源模块162的情况，电源模块162与第一电路板110形成直接或间接地电连接关系，以使得第二电路板120通过电源模块162向与电源模块162对应的第一电路板110供电。
更具体而言，电源模块162电连接于第二接口150，并通过第二接口150与连接于该第二接口150的第一电路板110实现电连接。这样，有利于实现第一电路板110与第二电路板120之间接口集成化，第一电路板110与第二电路板120之间的接线数量减少，接线步骤相应减少，装配更加简便、快捷。
当然，本设计并不局限于此，本领域技术人员根据需求也可设计电源模块162不通过第二接口150与第一电路板110电连接，而采用电源模块162与第一电路板110之间直接接线电连接的结构。
另外，如图4所示，本实施例中，第二电路板120上的电源模块162与多个第二接口150电连接，以实现同时通过多个第二接口150向对应的多个第一电路板110供电，有利于第二电路板120的集成化和小型化。
当然，本方案也并不局限于此，根据需求也可在第二电路板120上设置多个电源模块162，且使多个电源模块162可以与多个第二接口150形成一一对应的电连接关系，实现电源模块162单独向与之对应的第一电路板110供电。
对于功能模块160包括时钟模块164的情况，优选设计功能模块160包括至少一个时钟模块164，时钟模块164用于向至少一个第一电路板110传输时间信号。
可以理解的是，输入输出模组200可细分为自身具备时钟功能的输入输出模组和自身不具备时钟功能的输入输出模组这两类。针对于自身不具备时钟功能的输入输出模组，可以通过在第二电路板120上设置时钟模块164，并使该时钟模块164向设定的第一电路板110传输时间信号，该设定的第一电路板100为用于与自身不具备时钟功能的输入输出模组连接的第一电路板。
更具体而言，时钟模块164电连接于第二接口150，并通过第二接口150与连接于该第二接口150的第一电路板110实现电连接。这样，有利于实现第一电路板110与第二电路板120之间接口集成化，第一电路板110与第二电路板120之间的接线数量减少，接线步骤相应减少，装配更加简便、快捷。
当然，本设计并不局限于此，本领域技术人员根据需求也可设计时钟模块164不通过第二接口150与第一电路板110电连接，而采用时钟模块164与第一电路板110之间直接接线电连接的结构。
更优选地，如图4所示，第二电路板120上的电源模块162还与第二电路板120上的时钟模块164、惯性测量模块130等电连接，并用于向时钟模块164、惯性测量模块130等供电。
对于功能模块160包括电平转换模块166的情况，其中，若干第一电路板110中的至少一个为目标电路板112，目标电路板112对应的电信号的电平大 小不同于若干第一电路板110中除目标电路板112以外的其它第一电路板110对应的电信号的电平大小，电平转换模块166用于将第二电路板120与目标电路板112之间传输的电信号进行电平转换处理。这样，可通过电平转换处理，可以使得经由第二电路板120传输的电信号的电平大小可以适配目标电路板112所连接的输入输出模组200所需要的电信号的电平大小。如此，通过电平转换模块166的设置，第二电路板220可以用于不同输入输出模组200及其对应的第一电路板110的替换，从而有利于实现电路板系统在不同场景下的应用。可以理解，通过设置相应的输入输出模组200，可以控制其对应的电信号的电平大小，若其对应的电信号的电平大小控制在一定范围内，也可以不设置电平转换模块166。
当然，本方案并不局限于此，出于将第二电路板120与目标电路板112之间传输的电信号进行电平转换处理的目的，本领域技术人员也可将电平转换模块166设于第一电路板110上。
具体实施例五(如图5所示)
除上述具体实施例四的特征以外，进一步限定了目标电路板112上设有串行外设接口SPI 1122，电平转换模块166与串行外设接口SPI 1122电连接。
可以理解的是，SPI(英文名：Serial Peripheral Interface)总线系统是一种同步串行外设接口，它可以使MCU(英文名：Microcontroller Unit；微控制单元)与各种外围设备以串行方式进行通信以交换信息。
更具体地，串行外设接口SPI 1122与第二接口150连接，电平转换模块166与第二接口150连接，实现串行外设接口SPI 1122与电平转换模块166之间的电性导通。
进一步地，电平转换模块166与第一接口140电连接，用于将串行外设接口SPI 1122输出的电信号通过第一接口140输出至云台300的主控电路板310，以使得可移动平台的主控板400能够从云台300的主控电路板310获取串行外设接口SPI 1122输出的电信号。
这样，与目标电路板112电连接的输入输出模组200与可移动平台的主控板400之间的通讯信号流为：与目标电路板112电连接的输入输出模组200所形成的电信号依次经过第一电路板110、第二接口150、电平转换模块166、 第一接口140后，到达云台300的主控电路板310，并由云台300的主控电路板310进一步向可移动平台的主控板400传输。这样不会额外占用可移动平台的主控板400的接口，利于精简可移动平台的主控板400的体积和接线组装步骤。
当然，本方案也并不局限于此，本领域技术人员根据需求也可设计电平转换模块166与第一电路板110之间直接电连接而不用通过第二接口150中转。或者，若可移动平台的主控板400上可以设置较多的接口时，与目标电路板112电连接的输入输出模组200所形成的电信号可以直接由串行外设接口SPI传输至可移动平台的主控板400。具体可以根据实际需要进行设置，此处不做具体限定。
另外，本实施例中进一步设置若干第一电路板110中的至少一个设有移动产业处理器接口MIPI 1102(英文名：Mobile Industry Processor Interface)，移动产业处理器接口MIPI 1102用于与可移动平台的主控板400电连接，云台300搭载在可移动平台上。形成输入输出模组200通过第一电路板110与可移动平台的主控板400直接通讯，具有精准度高、传输效率高的优点。
更具体地，如图5所示，移动产业处理器接口MIPI 1102与可移动平台的主控板400之间可为有线连接，当然，也可设计移动产业处理器接口MIPI 1102与可移动平台的主控板400之间建立无线通讯连接。
优选地，与该设有移动产业处理器接口MIPI 1102的第一电路板110电连接的输入输出模组200为成像模组，具体例如可见光成像模组、热成像模组、红外光成像模组中的一种或多种。
具体实施例六(如图6所示)
除上述具体实施例一的特征以外，进一步限定第二接口150和与之对应的第一电路板110之间采用排线190进行电连接。这时，第二接口150可具体为用于与排线190连接的接线端口，如端子等。
当然，本方案也并不局限于此，本领域技术人员可以理解，第二接口150用作第一电路板110与第二电路板120之间进行信号传输的目的时，第二接口150也可设计为用于与第一电路板110建立无线通讯的无线通讯模块。
具体实施例七(如图7所示)
除上述具体实施例一的特征以外，进一步限定电路板系统100还包括壳体170，优选地，壳体170设有用于与云台300的内框架连接的连接部，该连接部用于供壳体170与云台300实现可拆卸或不可拆卸地直接连接装配，具体例如为设于壳体170上的卡扣、锁扣、卡箍等，实现供壳体170装配于云台300即可。
当然，本方案并不局限于此，根据需求也可额外设计支架，将壳体170安装在支架上，支架上设置连接部用于供支架与云台300连接装配，从而实现壳体170与云台300之间的间接装配。
且壳体170具有容纳空间，第二电路板120及若干第一电路板110设于容纳空间中。本方案中，通过将第二电路板120及若干第一电路板110设于容纳空间中，并利用壳体170与云台300直接或间接装配，这样的结构有利于对电路板进行防护，防止电路板受损。
具体实施例八(如图8至图13所示)
除上述具体实施例一的特征以外，如图8、图9及图10所示，进一步限定壳体170包括前壳172、后壳174和中框176，中框176位于前壳172和后壳174之间，并与前壳172及后壳174相连。前壳172与中框176围设出的空间中设有第一电路板110，后壳174与中框176围设出的空间中设有第二电路板120。这样，第一电路板110与第二电路板120可具有相对独立的工作环境，可以避免第一路板上的输入输出模组200与第二电路板120上的惯性测量模块130相互干扰，综合提升产品性能。
更优选地，第一电路板110连接于前壳172，第二电路板120连接于中框176。这样设计使得第二电路板120处于壳体170前后两端之间的中段位置，更利于提升惯性测量模块130对整个电路板系统100组件姿态检测的精准性。此外，通过本设计的结构，产品的组装过程可采用：将第一电路板110装于前壳172后，将中框176装于第一电路板110与前壳172组装成的构件上，再将第二电路板120装于中框176上且使第二电路板120的第二接口150与第一电路板110连接的步骤，这样的装配步骤可使得第一电路板110与第二电路板120之间的排线190最短，可以降低排线190对惯性测量模块130带来的干扰影响，提升惯性测量模块130工作精度。
更进一步地，如图8、图9、图10所示，第一电路板110的数量为两个，且两个第一电路板110分别连接有一个输入输出模组200，两个第一电路板110中，一个用于连接可见光成像模组230，另一个用于连接热成像模组220，两个第一电路板110并排且平行设置，以使得两个输入输出模组200的朝向相同且平行。这样设计可利于保证可见光成像模组230与热成像模组220的视野尽可能地重合，实现双光拍摄，并实现双光融合。
例如，以两个输入输出模组200为例，假设一个输入输出模组200为可见光相机模组230，另一个输入输出模组200为热成像相机模组220。在夜间追车过程中，由于夜间环境的亮度过暗，为辨别出前车的车牌号，需要借助热成像相机模组220拍摄一幅热成像图像，借助可见光相机模组230拍摄一幅可见光图像。随后，基于可见光图像来识别车牌中的数字或字母的轮廓，基于热成像图像来填充车牌中的数字或字母的颜色，从而识别出车牌号。其中，通过可见光成像模组230与热成像模组220对应的两个第一电路板110的平行设置，可以使得热成像相机模组220与可见光相机模组230之间的视场尽可能地最大化重叠，否则可能出现可见光相机模组230拍摄到全部车牌，但热成像相机模组220只拍到部分车牌或没有拍到车牌的情况，导致可见光图像和热成像图像之间无法进行特征匹配，也就无法识别出车牌号。
更具体而言，如图11和图12所示，前壳172的后端设有定位柱1722和螺钉孔1726，两个第一电路板110中的一个上设有通孔，其中，定位柱1722穿接于该通孔实现该第一电路板110与前壳172之间定位，另外，螺钉打入螺钉孔1726内以将前壳172与该第一电路板110紧固连接，限制第一电路板110脱离定位柱1722，实现第一电路板110与前壳172固定。
前壳172的后端还设有固定槽1724和螺钉孔1726，两个第一电路板110中的另一个的轮廓与固定槽1724适配，其中，该第一电路板110嵌入固定槽1724内实现第一电路板110与前壳172之间定位，另外，螺钉打入螺钉孔1726内将前壳172与第一电路板110紧固连接，限制第一电路板110脱出固定槽1724，实现第一电路板110与前壳172固定。
进一步地，如图10所示，前壳172与输入输出模组200之间设有密封圈213，该密封圈213起到密封和缓冲减震的作用，提升拍摄效果。
另外，前壳172的前端设有镜框212，如图13所示，镜框212上设有两个透光孔，前壳172上设有两个过光孔，两个透光孔与两个过光孔一一对应，其中，两个透光孔内或者两个过光孔内分别封装有镜片211，两个镜片211与两个输入输出模组200相对。
第二电路板120位于两个第一电路板110的后侧并与两个第一电路板110相对，实现第二电路板120及两个第一电路板110将壳体170内的空间分成三段。其中，中框176上对应惯性测量模块130的部位设有阻尼材料，以对惯性测量模块130起到减震作用，降低惯性测量模块130受到的高频振动影响，提升惯性测量模块130的测量精度。
优选地，中框176上设有定位槽1762，阻尼材料填充于定位槽1762中，起到对阻尼材料定位和限位的作用，确保阻尼材料维持与惯性测量模块130准确对位，保证减震作用可靠。
优选地，如图10所示，第一电路板110对应惯性测量模块130的部位设有散热片180。
优选地，第一电路板110上设有功能模块160，更具体地，功能模块160包括电源模块162、电平转换模块166、时钟模块164中的一种或多种，其中，如图10所示，惯性测量模块130与功能模块160之间相互远离设置，以降低惯性测量模块130工作环境温度对功能模块160的影响，确保功能模块160运行正常，作为本设计的优选技术方案，如图10所示，进一步优选设计功能模块160的位置位于第二电路板120的中部，惯性测量模块130邻近第二电路板120的边缘。
具体实施例九
与前述具体实施例八的不同之处在于，壳体170包括前壳172、后壳174和中框176，中框176位于前壳172和后壳174之间，并与前壳172及后壳174相连，其中，前壳172与中框176围设出的空间中设有若干第一电路板110中的一部分，后壳174与中框176围设出的空间中设有若干第一电路板110中的另一部分以及第二电路板120。
更进一步地，若干第一电路板110中的一部分连接于前壳172，若干第一电路板110中的另一部分连接于后壳174，第二电路板120连接于中框176。
具体例如，以第一电路板110的数量为两个为例说明，两个第一电路板110相对设置，输入输出模组200位于两个第一电路板110相背的一侧，使得两个第一电路板110连接的输入输出模组200的朝向相反。第二电路板120位于两个第一电路板110之间。
其中，两个第一电路板110中，输入输出模组200朝向前侧的一个连接于前壳172，输入输出模组200朝向后侧的一个连接于后壳174，第二电路板120连接于中框176。本方案可实现两个输入输出模组200在朝向相反的两个视野工作，这样可增加拍摄或侦察视野角度，采集范围更广，且也可相对减少云台300的动作频率，提升产品续航能力。
优选地，两个第一电路板110中，一个用于连接可见光成像模组，另一个用于连接热成像模组。
本发明第二方面的实施例提供的拍摄装置，包括上述第一方面实施例中任一项所述的电路板系统100，电路板系统100中的第一电路板110连接的输入输出模组200至少包括成像模组。
本实施例提供的拍摄装置，通过设置有上述任一实施例中所述的电路板系统100，从而具有以上全部有益效果，在此不再赘述。
可选地，拍摄装置为相机、摄影机等。
更具体地，拍摄装置为双光相机，双光相机具体例如包括可见光相机、热成像双光相机，也可包括可见光相机、补光灯。
如图14和图15所示，本发明第三方面的实施例提供的云台组件，包括云台300以及上述任一实施例中所述的电路板系统100。
本实施例提供的云台组件，通过设置有上述任一实施例中所述的电路板系统100，从而具有以上全部有益效果，在此不再赘述。
可选地，云台组件的云台300为水面、空中或陆地机器人云台，或为手持云台。
本发明第四方面的实施例提供的可移动平台，包括：机身；上述任一实施例中所述的电路板系统100。
本实施例提供的可移动平台，通过设置有上述任一实施例中所述的电路板系统100，从而具有以上全部有益效果，在此不再赘述。
可选地，所述可移动平台的机身为水面、空中或陆地机器人，具体地，空中机器人例如为无人机。
综上所述，本发明提供的电路板系统，将第二电路板与若干第一电路板独立设置，不仅可极大地降低第一电路板所电连接的输入输出模组与惯性测量模块之间的相互干扰。并且，惯性测量模块和输入输出模组的空间位置布局不受限于同一电路板，这样，惯性测量模块与输入输出模组之间的位置布局可更灵活，惯性测量模块附近可具有更充足的空间来处理惯性测量模块受到的外界干扰和工作环境需求，有利于惯性测量模块与输入输出模组各自工作性能的发挥，促进实现产品性能的综合提升。同时，这样也可利于减少硬件开发工作量，并促进产品部件之间的空间布局紧凑、合理，利于产品的小型化和轻量化发展，且通过将设有惯性测量模块的第二电路板与用于和输入输出模组电连接的若干第一电路板独立开来，这样，对惯性测量模块的检修和更换更方便，具体如，当出现惯性测量模块损坏问题时，可针对性地替换第二电路板，而无需同时更换或拆装输入输出模组，检修成本更低，更利于产品的维护。
在本发明中，术语“第一”、“第二”、“第三”仅用于描述的目的，而不能理解为指示或暗示相对重要性；术语“多个”则指两个或两个以上，除非另有明确的限定。术语“安装”、“相连”、“连接”、“固定”等术语均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接；“相连”可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
本发明的描述中，需要理解的是，术语“前”、“后”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或单元必须具有特定的方向、以特定的方位构造和操作，因此，不能理解为对本发明的限制。
在本说明书的描述中，术语“一个实施例”、“一些实施例”、“具体实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或实例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (28)

  1. 一种电路板系统，其特征在于，所述电路板系统用于固定在云台的内框架上，所述电路板系统包括：
    若干第一电路板，每一所述第一电路板用于连接至少一个能够收发光信号的输入输出模组；
    第二电路板，所述第二电路板与若干所述第一电路板独立设置；
    所述第二电路板上设有惯性测量模块、第一接口及若干第二接口，若干所述第二接口与若干所述第一电路板对应电连接，所述第二电路板用于为若干所述第一电路板供应电源，所述惯性测量模块与所述第一接口电连接，所述第一接口用于与所述云台的主控电路板电连接。
  2. 根据权利要求1所述的电路板系统，其特征在于，
    每一所述第一电路板用于连接至少一个发光模组，和/或至少一个成像模组。
  3. 根据权利要求2所述的电路板系统，其特征在于，
    所述发光模组包括补光灯模组、探照灯模组、激光模组中的一种或多种；和/或
    所述成像模组包括可见光成像模组、热成像模组、红外光成像模组中的一种或多种。
  4. 根据权利要求1所述的电路板系统，其特征在于，
    所述第一电路板的数量与所述输入输出模组的数量相同，且所述第一电路板与所述输入输出模组之间一一对应。
  5. 根据权利要求1所述的电路板系统，其特征在于，
    所述第一电路板的数量小于所述输入输出模组的数量，且至少一个所述第一电路板用于连接两个及以上的所述输入输出模组。
  6. 根据权利要求1所述的电路板系统，其特征在于，
    当所述输入输出模组的数量为多个时，若干所述第一电路板用于连接多个所述输入输出模组中的一部分，所述第二电路板用于连接多个所述输入输出模 组中的另一部分。
  7. 根据权利要求1所述的电路板系统，其特征在于，
    所述第一电路板的数量为两个，且两个所述第一电路板分别连接有一个所述输入输出模组；
    两个所述第一电路板平行设置，以使得两个所述输入输出模组的朝向相同且平行。
  8. 根据权利要求7所述的电路板系统，其特征在于，
    两个所述第一电路板中，一个用于连接可见光成像模组，另一个用于连接热成像模组。
  9. 根据权利要求1所述的电路板系统，其特征在于，
    所述第一电路板的数量为两个，且两个所述第一电路板相对设置，以使得两个所述第一电路板连接的所述输入输出模组的朝向相反。
  10. 根据权利要求9所述的电路板系统，其特征在于，
    所述第二电路板位于两个所述第一电路板之间。
  11. 根据权利要求1所述的电路板系统，其特征在于，
    所述第二电路板设有功能模块，所述惯性测量模块与所述功能模块之间相互远离设置。
  12. 根据权利要求11所述的电路板系统，其特征在于，
    所述功能模块位于所述第二电路板的中部，所述惯性测量模块邻近所述第二电路板的边缘。
  13. 根据权利要求11所述的电路板系统，其特征在于，
    所述功能模块包括电源模块，所述第二电路板通过所述电源模块向所述第一电路板供电。
  14. 根据权利要求11所述的电路板系统，其特征在于，
    所述功能模块包括至少一个时钟模块，所述时钟模块用于向至少一个所述第一电路板传输时间信号。
  15. 根据权利要求11所述的电路板系统，其特征在于，
    所述功能模块包括电平转换模块，所述电平转换模块用于将所述第二电路板与目标电路板之间传输的电信号进行电平转换处理；
    其中，若干所述第一电路板中的至少一个为所述目标电路板，所述目标电路板对应的电信号的电平大小不同于若干所述第一电路板中除所述目标电路板以外的其它所述第一电路板对应的电信号的电平大小。
  16. 根据权利要求15所述的电路板系统，其特征在于，
    所述目标电路板上设有串行外设接口SPI，所述电平转换模块与所述串行外设接口SPI电连接。
  17. 根据权利要求15所述的电路板系统，其特征在于，
    若干所述第一电路板中的至少一个设有移动产业处理器接口MIPI，所述移动产业处理器接口MIPI用于与可移动平台的主控板电连接，所述云台搭载在所述可移动平台上。
  18. 根据权利要求16所述的电路板系统，其特征在于，所述电平转换模块与所述第一接口电连接，用于将所述串行外设接口SPI输出的电信号通过所述第一接口输出至所述云台的主控电路板，以使得可移动平台的主控板能够从所述云台的主控电路板获取所述串行外设接口SPI输出的电信号。
  19. 根据权利要求1所述的电路板系统，其特征在于，还包括：
    壳体，所述壳体具有容纳空间，所述第二电路板及若干所述第一电路板设于所述容纳空间中。
  20. 根据权利要求19所述的电路板系统，其特征在于，
    所述壳体包括前壳、后壳和中框，所述中框位于所述前壳和所述后壳之间，并与所述前壳及所述后壳相连，所述前壳与所述中框围设出的空间中设有所述第一电路板，所述后壳与所述中框围设出的空间中设有所述第二电路板。
  21. 根据权利要求20所述的电路板系统，其特征在于，
    所述第一电路板连接于所述前壳，所述第二电路板连接于所述中框。
  22. 根据权利要求19所述的电路板系统，其特征在于，
    所述壳体包括前壳、后壳和中框，所述中框位于所述前壳和所述后壳之间，并与所述前壳及所述后壳相连，所述前壳与所述中框围设出的空间中设有若干所述第一电路板中的一部分，所述后壳与所述中框围设出的空间中设有若干所述第一电路板中的另一部分以及所述第二电路板。
  23. 根据权利要求22所述的电路板系统，其特征在于，
    若干所述第一电路板中的一部分连接于所述前壳，若干所述第一电路板中的另一部分连接于所述后壳，所述第二电路板连接于所述中框。
  24. 根据权利要求20或23所述的电路板系统，其特征在于，还包括：
    阻尼材料，所述中框上对应所述惯性测量模块的部位设有所述阻尼材料。
  25. 根据权利要求24所述的电路板系统，其特征在于，
    所述中框上设有定位槽，所述阻尼材料填充于所述定位槽中。
  26. 一种拍摄装置，其特征在于，包括如权利要求1至25中任一项所述的电路板系统，所述电路板系统中的第一电路板连接的输入输出模组至少包括成像模组。
  27. 一种云台组件，其特征在于，包括：
    云台以及如权利要求1至25中任一项所述的电路板系统。
  28. 一种可移动平台，其特征在于，包括：
    机身；
    如权利要求27所述的云台组件，所述云台组件中的云台与所述机身连接。
PCT/CN2018/113176 2018-10-31 2018-10-31 电路板系统、拍摄装置、云台组件及可移动平台 WO2020087392A1 (zh)

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