Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32431—Constructional details of the reactor
  • H01J37/3244—Gas supply means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
  • H01J37/32082—Radio frequency generated discharge
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
  • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32431—Constructional details of the reactor
  • H01J37/32458—Vessel
  • H01J37/32522—Temperature
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32431—Constructional details of the reactor
  • H01J37/32715—Workpiece holder

Definitions

• aspects of the present disclosure generally relate to a system and apparatus for substrate processing. More specifically, aspects of the present disclosure relate to a heat conductive spacer for use within a lid assembly of a plasma processing chamber.
• Plasma processing such as plasma-enhanced chemical vapor deposition (PECVD) may be employed to deposit thin films on substrates to form electronic devices.
• PECVD plasma-enhanced chemical vapor deposition
• the present disclosure generally relates to an apparatus for plasma processing. More specifically, the present disclosure relates to an apparatus for providing plasma uniformity across the surface of a substrate during processing while facilitating low clean rates.
• a plasma processing chamber includes a chamber body, and a lid assembly coupled to the chamber body defining a processing volume.
• the lid assembly includes a backing plate coupled to the chamber body, and a diffuser having a plurality of gas openings formed therethrough.
• the lid assembly also includes a heat conductive spacer disposed between the backing plate and the diffuser to transfer heat from the diffuser to the backing plate.
• the plasma processing chamber includes a substrate support disposed within the processing volume.
• a lid assembly for a plasma processing chamber includes a backing plate and a diffuser having a plurality of gas openings formed therethrough.
• the lid assembly also includes a heat conductive spacer disposed between the backing plate and the diffuser to transfer heat from the diffuser to the backing plate.
• a backing plate apparatus for a plasma processing chamber includes a backing plate having a top surface and a bottom surface.
• the backing plate apparatus also includes a heat conductive spacer having one or more protrusions protruding from the bottom surface of the backing plate.
• the heat conductive spacer is integrally formed with the backing plate to form a body.
• Figure 1 is a schematic sectional view of a plasma processing chamber, according to one implementation.
• Figure 2 is a schematic exploded perspective view of a lid assembly, in accordance with one implementation.
• FIG. 3 is a schematic exploded perspective view of a lid assembly, in accordance with one implementation.
• Figure 4 is a schematic exploded perspective view of a lid assembly, in accordance with one implementation.
• Figure 5A is a schematic exploded perspective view of a lid assembly, in accordance with one implementation.
• Figure 5B is a perspective sectional view of the lid assembly illustrated in Figure 5A, according to one implementation.
• Figure 5C is a schematic cross-sectional view of the lid assembly illustrated In Figure 5A, according to one implementation.
• a plasma processing chamber that includes a chamber body and a lid assembly to define a processing volume within the piasma processing chamber.
• the lid assembly includes a backing plate, a diffuser, and a heat conductive spacer disposed between and coupled to the backing piate and the diffuser.
• a substrate support is aiso disposed within the processing volume.
• the heat conductive spacer is used to transfer heat from the diffuser and to the backing piate. As such, the heat conductive spacer is in direct contact with a top surface of the diffuser, and the heat conductive spacer is formed from or includes a heat conductive material.
• the heat conductive spacer has a rectangular cross-section, in which a width of the heat conductive spacer is equal to, larger than, or lesser than a thickness of the diffuser.
• the plasma processing chamber further includes an RF power source coupled to the lid assembly, and a gas source and a remote piasma source in fluid communication with the processing volume through the lid assembly.
• the aspects described herein may be used with any types of deposition processes and are not limited to use for substrate piasma processing chambers.
• the aspects described herein may be used with various types, shapes, and sizes of masks and substrates.
• the substrate is not limited to any particular size or shape.
• the term“substrate” refers to any polygonal, squared, rectangular, curved or otherwise circular or non-circular workpiece, such as a glass or polymer substrate used in the fabrication of flat panel displays, for example.
• gas and“gases” are used interchangeably, unless otherwise noted, and refer to one or more precursors, reactants, catalysts, carrier gases, purge gases, cleaning gases, effluent, combinations thereof, as well as any other fluid.
• PECVD a PECVD system configured to process large area substrates
• a PECVD system available from AKT, a division of Applied Materials, Inc., Santa Clara, California.
• AKT a division of Applied Materials, Inc.
• the embodiments have utility in other system configurations such as etch systems, other chemical vapor deposition systems and any other system in which distributing gas within a process chamber is desired, including those systems configured to process round substrates.
• FIG. 1 is a schematic sectional view of a plasma processing chamber 100, according to one implementation.
• the plasma processing chamber 100 is operable to perform a deposition process for an encapsulation layer by a PECVD process it is noted that the chamber 100 of Figure 1 is just an exemplary apparatus that may be used to form electronic devices on a substrate.
• One suitable chamber for a PECVD process is available from Applied Materials, Inc., located in Santa Clara, CA. It is contemplated that other deposition chambers, including those from other manufacturers, may be utilized to practice the embodiments.
• the plasma processing chamber 100 generally includes walls 102 and a bottom 104 that define a body 105 of the chamber 100.
• the body 105 and a lid assembly 130 are used to define a processing volume 108.
• the lid assembly 130 includes a backing plate 106 and a gas distribution plate or diffuser 1 10.
• the diffuser 1 10 includes gas openings 124 formed therethrough to introduce gases into the processing volume 108, and the diffuser 1 10 may also be referred to as a faceplate or a showerhead.
• the diffuser 1 10 is coupled to the backing plate 106 at a periphery thereof by a heat conductive spacer 114.
• the heat conductive spacer 1 14, which is discussed more below, is formed of or includes a heat conductive material, and is used to transfer heat from the diffuser 1 10 to the backing plate 106.
• the heat conductive spacer 1 14 is also used to define a plenum 1 17 between the backing plate 106 and the diffuser 1 10.
• the plenum 1 17 defines a gap between the backing plate 106 and the diffuser 1 10.
• the plasma processing chamber 100 includes a connection, such as one or more diffuser skirts 133 disposed outside of the heat conductive spacer 1 14.
• the diffuser skirts 133 are disposed between the backing plate 106 and the diffuser 1 10. in one example, the diffuser skirts 133 include one or more aluminum sheets.
• the heat conductive spacer 1 14 and/or the diffuser skirts 133 may be used to define the plenum 1 17.
• the diffuser skirts 133 and/or the heat conductive spacer 1 14 direct gases into and through the gas openings 124.
• the diffuser skirts 133 are included where the heat conductive spacer 1 14 partially surrounds an outer perimeter of the plurality of gas openings 124 (as described, for example, in reference to Figures 4 and 6A below) to facilitate directing gases into the gas openings 124.
• Precursor gases from a gas source 1 12 are provided to the plenum 1 17 by a conduit 1 16. Gases from the plenum 1 17 are flowed to the processing volume 108 via the gas openings 124 of the diffuser 1 10.
• a remote plasma source 1 18, such as an inductively coupled remote plasma source, is coupled to the conduit 1 16.
• a radio frequency (RF) power source 122 is coupled to the backing plate 106 and/or to the diffuser 1 10 to provide RF power to the diffuser 1 10.
• the RF power source 122 is used to generate an electric field between the diffuser 1 10 and a substrate support 120. The electric field is used to form a plasma from the gases present between the diffuser 1 10 and the substrate support 120 within the processing volume 108.
• Various RF frequencies may be used, such as a frequency between about 0.3 MHz and about 200 MHz.
• the RF power source 122 provides power to the diffuser 1 10 at a frequency of 13.56 MHz.
• the backing plate 106 rests on a lid plate 126, which rests on the walls 102 of the chamber 100.
• the lid plate 126, the backing plate 106, and components coupled thereto, such as the diffuser 1 10, the heat conductive spacer 1 14, and the conduit 1 16, may define the lid assembly 130.
• the lid assembly 130 may also include portions positioned thereon or attached thereto, such as the RF power source 122 and the remote plasma source 1 18.
• the lid assembly 130 may be removable from the body 105, and the lid assembly 130 may be aligned with the body 105 by indexing pins 131.
• the processing volume 108 is accessed through a sealable slit valve opening 132 formed through the walls 102.
• a substrate 134 may be transferred in and out of the processing volume 108 through the slit valve opening 132.
• the substrate support 120 includes a substrate receiving surface 136 for supporting the substrate 134, in which a stem 138 is coupled to a lift system 140 to raise and lower the substrate support 120.
• a mask frame 142 is shown as included with the chamber 100, in which the mask frame 142 may be placed over a periphery of the substrate 134 during processing.
• the mask frame 142 includes a plurality of mask screens coupled thereto that include fine openings corresponding to devices or layers formed on the substrate 134.
• Substrate lift pins 144 are moveabiy disposed through the substrate support 120 to move the substrate 134 to and from the substrate receiving surface 136 to facilitate substrate transfer.
• the substrate support 120 may also include heating and/or cooling elements to maintain the substrate support 120 and substrate 134 positioned thereon at a desired temperature.
• Support members 148 are also shown as disposed at least partially in the processing volume 108.
• the support members 148 may also serve as alignment and/or positioning devices for the mask frame 142.
• the support members 148 are coupled to a motor 150 that is operable to move the support members 148 relative to the substrate support 120, and thus position the mask frame 142 relative to the substrate 134.
• a vacuum pump 152 is coupled to the chamber 100 to control the pressure within the processing volume 108.
• a cleaning gas from a clean gas source 1 19 may be provided to the remote plasma source 1 18.
• a remote plasma is formed from which dissociated cleaning gas species are generated.
• the plasma of the cleaning gases is provided to the processing volume 108 through the conduit 1 16 and through the gas openings 124 formed in the diffuser 1 10 to clean components of the plasma processing chamber 100.
• the cleaning gas may be further excited by the RF power source 122 provided to flow through the diffuser 1 10 to reduce recombination of the dissociated cleaning gas species.
• Suitable cleaning gases include but are not limited to NFs, F2, and SFe.
• Uniformity of plasma distribution is generally desired during processing, pre-treatment, and/or post-treatment of the substrate 134.
• the distribution of the plasma on the substrate 134 is determined by a variety of factors, such as distribution of the gases, geometry of the processing volume 108, the distance between the lid assembly 130 and the substrate support 120, variations between deposition processes on the same substrate or different substrates, differences in deposition processes and cleaning processes, and even the current temperature of components included within the plasma processing chamber 100.
• the diffuser 1 10 increases in temperature with each subsequent and consecutive or continuous use, particularly with a temperature difference between the edge or periphery of the diffuser 1 10 and a center of the diffuser 1 10.
• This increased and/or non-uniform temperature for the diffuser 1 10 affects the plasma within the processing volume 108 and the plasma distribution on the substrate 134, thereby leading to non-uniform thickness of layers formed on the substrate 134.
• the heat conductive spacer 1 14, which is used to transfer heat from the diffuser 1 10 to the backing plate 106 may be able to transfer heat away from the diffuser 1 10 to facilitate a more uniform plasma distribution on the substrate 134.
• the heat conductive spacer 1 14 facilitates maintaining the backing plate 106 at a temperature of less than 1 10 degrees Celsius during processing, such as within a range 80 degrees Celsius to 100 degrees Celsius.
• the heat conductive spacer 1 14 facilitates maintaining the diffuser 1 10 at a temperature of less than 1 10 degrees Celsius during processing, such as within a range 80 degrees Celsius to 100 degrees Celsius.
• the heat conductive spacer 1 14 facilitates maintaining the substrate 134 at a temperature of less than 1 10 degrees Celsius during processing, such as within a range 80 degrees Celsius to 105 degrees Celsius. In one example, the heat conductive spacer 1 14 facilitates maintaining the substrate 134 at a temperature of less than 95 degrees Celsius during processing.
• FIG. 2 is a schematic exploded perspective view of a lid assembly 230, in accordance with one implementation.
• the lid assembly 230 may be similar to the lid assembly 130 and may be used as at least part of the lid assembly 130, and may include one or more features, aspects, components, and/or properties similar to the lid assembly 130 discussed above.
• the lid assembly 230 includes a backing plate 206, a diffuser 210, and a beat conductive spacer 214.
• the backing plate 206 includes a conduit 216 coupled or formed therethrough that is coupled to one or more gas or plasma sources, as discussed above.
• the diffuser 210 includes gas openings 224 formed therethrough to distribute the contents (such as processing gases and/or cleaning gases) from the conduit into a processing volume of a plasma processing chamber.
• the lid assembly 230 is shown as having a rectangular shape defined by a pair of parallel long sides L and a pair of parallel short sides S that are shorter than the parallel long sides L.
• the short sides S and the long sides L are perpendicular to one another.
• the lid assembly 230 may be other shapes, such as square, circular, elliptical, or other useful shapes without departing from the scope of the present disclosure.
• the heat conductive spacer 214 is disposed between and coupled to the backing plate 206 and the diffuser 210.
• the heat conductive spacer 214 is disposed about a periphery of the diffuser 210 and defines a plenum 217 between the backing plate 206 and the diffuser 210.
• the heat conductive spacer 214 includes a pair of long sides 214A and a pair of short sides 214B corresponding to the long sides L and short sides S of the lid assembly 230 for the heat conductive spacer 214 to be disposed about the periphery of the diffuser 210.
• Each of the long sides 214A includes a long heat conductive spacer bar 215A.
• Each of the short sides 214B includes a short heat conductive spacer bar 215B that is shorter than the long heat conductive spacer bars 216A.
• the heat conductive spacer 214 is used to facilitate the transfer of heat from the diffuser 210 to the backing plate 206.
• the heat conductive spacer 214 is in direct contact with the backing plate 206 and the diffuser 210 to facilitate heat transfer.
• the heat conductive spacer 214 includes a bottom surface 262 and a top surface 264.
• the bottom surface 262 is in direct contact with a top surface 266 of the diffuser 210 and the top surface 264 is in direct contact with a bottom surface 268 of the backing plate 206.
• the backing plate 206 may also include a step 270 formed in the bottom surface 268 thereof to define an interior surface 272 and an exterior surface 274 on the bottom surface 268.
• the heat conductive spacer 214 is shown as in direct contact with the periphery of the interior surface 272 of the backing plate 206.
• the present disclosure is not so limited, as the bottom surface 268 may have no step 270 formed therein or may be substantially planar.
• the heat conductive spacer 214 is disposed about the periphery of the diffuser 210 to completely surround the gas openings 224.
• Each of the long heat conductive spacer bars 215A and the short heat conductive spacer bars 215B includes an inner face 215C that faces a center 290 of the diffuser 210 and a center 292 of the backing plate 206.
• the inner faces 215C define an inner perimeter of the heat conductive spacer 214 that completely surrounds an outer perimeter 21 1 of the gas openings 224 of the diffuser 1 10.
• the outer perimeter 21 1 is defined by outer edges of the gas openings 224 relative to the center 290 of the diffuser 1 10.
• the inner perimeter defined by the inner faces 215C is disposed outside of the outer perimeter 21 1 relative to the center 290 of the diffuser 210.
• FIG. 3 is a schematic exploded perspective view of a lid assembly 330, in accordance with one implementation.
• the lid assembly 330 may be similar to the lid assembly 130 and may be used as at least part of the lid assembly 130, and may include one or more features, aspects, components, and/or properties similar to the lid assembly 130 discussed above.
• the lid assembly 330 includes a heat conductive spacer 314 disposed about the periphery of the interior surface 272.
• the heat conductive spacer 314 is disposed about the periphery of the top surface 266 of the diffuser 210.
• the heat conductive spacer 314 includes two opposing long sides 314A that correspond to long sides L and two opposing short sides 314B that correspond to short sides S.
• the heat conductive spacer 314 includes two or more heat conductive spacer bars 318 disposed on each one of the long sides 314A and each one of the short sides 314B.
• Figure 3 illustrates two heat conductive spacer bars 318 disposed on each one of the long sides 314A and each one of the short sides 314B.
• the heat conductive spacer 314 also inciudes optional heat conductive spacer bars 320 disposed between the heat conductive spacer bars 318.
• the heat conductive spacer bars 318 and 320 are removably attached to the interior surface 272 of the bottom surface 268 of the backing plate 206.
• a pair of the long sides 314A and a pair of the short sides 314B correspond to a pair of long sides and a pair of short sides, respectively, of the periphery of the top surface 266 of the diffuser 210
• Each of the heat conductive spacer bars 318 and 320 disposed on the iong sides 314A inciudes a longitudinal length that is lesser than a length of the long sides of the periphery of the top surface 266 and a length of the long sides L.
• Each of the heat conductive spacer bars 318 and 320 disposed on the short sides 314B includes a longitudinal length that is lesser than a length of the short sides of the periphery of the top surface 266 and a length of the short sides S
• the longitudinal length of each heat conductive spacer bar 318 and 320 disposed on the long sides 314A is parallel to the long sides of the periphery of the top surface 266.
• the longitudinal length of each heat conductive spacer bar 318 and 320 disposed on the short sides 314B is parallel to the short sides of the periphery of the top surface 266.
• each heat conductive spacer bar 318 and 320 disposed on each long side 314A and 314B is lesser than a length of the short sides of the periphery of the top surface 266.
• the heat conductive spacer bars 318 and 320 are disposed about the periphery of the inferior surface 272 and the periphery of the top surface 266 in a rectangular pattern.
• the optional heat conductive spacer bars 320 are not included, such that gaps are disposed between the heat conductive spacer bars 318 in place of the optional heat conductive spacer bars 320.
• the heat conductive spacer bars 318 are disposed to partially cover each one of the long sides and each one of the short sides of the periphery of the top surface 266, as illustrated in Figure 3.
• spacer bars 318 and 320 may be disposed to completely cover each one of the long sides and each one of the short sides of the periphery of the top surface 266
• the aspects of the heat conductive spacer 314 facilitate a modular design for the heat conductive spacer 314, the backing plate 206, and the diffuser 210.
• the modularity facilitates promoting deposition uniformity, deposition repeatability, and cleaning rates.
• the modularity facilitates increased yield, deposition quality, and operational efficiency for substrate processing chambers.
• the modularity also facilitates reduction or elimination of effects associated with thermal expansion of components, such as rubbing of components having differing thermal expansions.
• the modularity facilitates quickly altering heat transfer rates from the diffuser 210, such as by adding and/or removing one or more of heat conductive spacer bars 318 and/or 320
• FIG 4 is a schematic exploded perspective view of a lid assembly 430, in accordance with one implementation.
• the lid assembly 430 includes a heat conductive spacer 414
• the lid assembly 430 may be similar to the lid assembly 130 and may be used as at least part of the lid assembly 130, and may include one or more features, aspects, components, and/or properties similar to the lid assembly 130 discussed above.
• the heat conductive spacer 414 includes two sides 414A disposed on opposing long sides of the periphery of the top surface 266 Each of the two sides 414A includes one or more heat conductive spacer bars (a first set of one or more heat conductive spacer bars 418A and a second set of one or more heat conductive spacer bars 418B).
• Each set of heat conductive spacer bars 418A, 418B is illustrated with three heat conductive spacer bars in Figure 4.
• Each set of heat conductive spacer bars 418A, 418B corresponds to one of the long sides L and is parallel to one of the long sides L.
• Each set of heat conductive spacer bars 418A, 418B includes a longitudinal length that is less than a length of the long sides of the periphery of the top surface 266 and a length of the long sides L.
• a centerpoint of the first set of heat conductive spacer bars 418A is offset from a centerpoint of the second set of heat conductive spacer bars 418B
• the first set of heat conductive spacer bars 418A is offset to be disposed at a different distance from the center 292 of the backing plate 206 than the second set of heat conductive spacer bars 418B.
• the heat conductive spacer bars 418A, 418B each include an inner face 415C that faces the center 290 of the diffuser 210 and the center 292 of the backing plate 206
• the inner faces 415C are on opposing sides of the outer perimeter 21 1 of the gas openings 224
• the inner faces 415C of the heat conductive spacer 415 partially surround the outer perimeter 21 1 such that the heat conductive spacer does not completely surround the outer perimeter 21 1.
• the first and second sets of heat conductive spacer bars 418A, 418B are disposed outside of the outer perimeter 21 1 of the gas openings 224 relative to the center 290 of the diffuser 210 Gaps are disposed at the short sides of the periphery of the top surface 266 and between the first set of heat conductive spacer bars 418A and the second set of heat conductive spacer bars 418B.
• the first and second sets of heat conductive spacer bars 418A, 418B of opposing sides 414A are disposed to partially cover each one of the long sides of the periphery of the top surface 266, as illustrated in Figure 4
• FIG. 5A is a schematic exploded perspective view of a lid assembly 530, in accordance with one implementation.
• the lid assembly 530 includes a heat conductive spacer 514.
• the lid assembly 530 may be similar to the lid assembly 130 and may be used as at least part of the lid assembly 130, and may include one or more features, aspects, components, and/or properties similar to the lid assembly 130 discussed above.
• the heat conductive spacer 514 includes sides 514A disposed on opposing long sides of the periphery of the top surface 266. Each side 514A includes one or more heat conductive spacer bars (first heat conductive spacer bar 518A and second heat conductive spacer bar 518B).
• Each heat conductive spacer bar 518A, 518B corresponds to one of the long sides L and is parallel to one of the long sides L.
• Each heat conductive spacer bar 518A, 518B of the opposing sides 514A includes a longitudinal length that is greater than a length of the short sides of the periphery of the top surface 266 and a length of the short sides S.
• the first heat conductive spacer bar 518A of one side 514A is spaced from the second heat conductive spacer bar 518B of the other side 514A by a distance D.
• the longitudinal length of each heat conductive spacer bar 518A, 518B is greater than the distance D.
• a centerpoint of the first heat conductive spacer bar 518A is aligned with a centerpoint of the second heat conductive spacer bar 518B relative to the center 292 of the backing plate 206.
• the heat conductive spacer bars 518A, 518B each include an inner face 515C that faces the center 290 of the diffuser 210 and the center 292 of the backing plate 206.
• the inner faces 515C are on opposing sides of the outer perimeter 21 1 of the gas openings 224.
• the inner faces 515C of the heat conductive spacer 515 partially surround the outer perimeter 21 1 such that the heat conductive spacer 515 does not completely surround the outer perimeter 21 1.
• the first and second heat conductive spacer bars 518A, 518B are disposed outside of the outer perimeter 21 1 of the gas openings 224 relative to the center 290 of the diffuser 210. Gaps are disposed at the short sides of the periphery of the top surface 266 and between the first heat conductive spacer bar 518A and the second heat conductive spacer bar 518B
• FIG. 5B is a perspective sectional view of the lid assembly 530 illustrated in Figure 5A, according to one implementation.
• Figure 5C is a schematic cross-sectional view of the lid assembly 530 illustrated in Figure 5A, according to one implementation.
• the first heat conductive spacer bar 518A of the heat conductive spacer 514 is shown as having a rectangular cross-section, though the heat conductive spacer 514 is not so limited, and other shapes may be used for the cross-section of the heat conductive spacer 514.
• the heat conductive spacer 514 may have dimensions to facilitate heat transfer from the diffuser 210 to the backing plate 206.
• the first heat conductive spacer bar 518A of the heat conductive spacer 514 is shown as having a height H and a width W
• the diffuser 210 is shown as having a thickness T, though the thickness T of the diffuser 210 may vary.
• the diffuser 210 may have an increased thickness near the periphery or edge and a decreased thickness near the center.
• the heat conductive spacer 514 is shown as having the width W as equal to or larger than the thickness T of the diffuser 210, particularly at the periphery of the diffuser 210.
• the width W may be lesser than the thickness T
• the heat conductive spacer 514 may also have the height H as equal to or larger than the thickness T of the diffuser 210.
• the height H may be lesser than the thickness T.
• the increased width W and/or height H for the heat conductive spacer 514 can increase the thermal contact between the heat conductive spacer 514 and the diffuser 210 and facilitates the transfer of heat from the diffuser 210 to the heat conductive spacer 514.
• the width W is 1.0 inches or greater, such as from 1 0 inches to 1.5 inches in one example, the width W is 1.5 inches.
• the heat conductive spacer 514 is formed from or includes a heat conductive material, such as a metal.
• a heat conductive metal includes copper, nickel, steel, and aluminum.
• the backing plate 206 is formed from or includes metal, such as aluminum, and similarly the diffuser 210 is formed from or includes metal, such as aluminum.
• the heat conductive spacer 514, the backing plate 206, and the diffuser 210 may each be formed from aluminum.
• one or both of the heat conductive spacer bars 518A, 518B of the heat conductive spacer 514 are formed integrally with the backing plate 206 to form a body with the backing plate 206.
• the heat conductive spacer 514 and the backing plate 206 are part of a backing plate apparatus.
• the heat conductive spacer bars 518A, 518B are protrusions that protrude from the bottom surface 268 of the backing plate 206, such as from the interior surface 272 of the bottom surface 268.
• the heat conductive spacer bars 518A, 518B each include a bottom surface 562 that is in direct contact with the top surface 266 of the diffuser 210.
• the heat conductive spacer 514 being integrally formed with the backing plate 206 reduces the number of separate parts, facilitating lower costs and reduced probability of generating particles.
• the gas openings 224 extend from the top surface 266 to a bottom surface 265 of the diffuser 210.
• the second heat conductive spacer bar 518B of the heat conductive spacer 514 can include one or more of the aspects, components, features, and/or properties of the first heat conductive spacer 518A described above.
• the backing plate 206 may include one or more cooling flow channels 280 formed therein, such as to receive coolant.
• the cooling flow channel 280 is used to transfer heat away from the backing plate 206 through coolant flowing through the cooling flow channel 280.
• Figures 5B and 5C show the cooling flow channel 280 formed within a top surface 282 of the backing plate 206.
• heat transferred to the backing plate 206 from the diffuser 210 through the heat conductive spacer 514 is subsequently transferred away from the backing plate 206 through the cooling flow channel 280.
• An example of a coolant includes water, ethylene glycol, a coolant sold under the tradename GALDEN®, or any other suitable coolant.
• the heat conductive spacer 514 is in alignment, such as in vertical alignment, with at least a portion of the cooling flow channel 280.
• the heat conductive spacer 514 and the cooling flow channel 280 are in alignment with respect to each other along line A, which extends vertically through the cooling flow channel 280, the backing plate 206, the heat conductive spacer 514, and the diffuser 210.
• the vertical alignment of the heat conductive spacer 514 and the cooling flow channel 280 facilitates the transfer of heat from the heat conductive spacer 514 and away from the backing plate 206 through the cooling flow channel 280.
• One or more fasteners 276 are used to couple the heat conductive spacer 514 between the backing plate 206 and the diffuser 210.
• the fastener 276 extends from the diffuser 210, at least partially through the heat conductive spacer 514, and to the backing plate 206 to couple the heat conductive spacer 514 between the backing plate 206 and the diffuser 210.
• the one or more fasteners 276 couple the heat conductive spacer 514 and the backing plate 206 to the diffuser 210.
• the fastener 276 may include a screw as shown, a bolt and a nut, and/or any other fastener known in the art.
• the fastener 276 may be formed from or include a heat conductive material, such as metal, and particularly aluminum.
• the diffuser 210 includes a cap 293, such as an aluminum cap, disposed below each of the one or more fasteners.
• a seal 295 such as an O-ring seal, is disposed between the heat conductive spacer 514 and the diffuser 210. The seal 295 facilitates containment of particles that may arise as a result of, for example, thermal expansion of components.
• a heat conductive spacer in accordance with the present disclosure may be able to transfer heat away from a diffuser within a plasma processing chamber.
• the diffuser in a plasma processing chamber without the heat conductive spacer, the diffuser can rise in temperature from about 75°C to about 120°C after multiple continuous depositions and uses of the plasma processing chamber.
• the diffuser in a plasma processing chamber with a heat conductive spacer in accordance with the present disclosure, it is believed the diffuser will only rise in temperature from about 75°C to about 90°C or about 100°C after the same multiple continuous depositions and uses of the plasma processing chamber.
• the heat conductive spacer facilitates a transfer of about 20°C to about 30°C of heat away from the diffuser. This reduction in heat and temperature for the diffuser enables may increase the uniformity of distribution of plasma within the processing volume of the plasma processing chamber, thereby increasing uniformity of thickness of layers formed on a substrate with the plasma processing chamber.
• the temperature of the diffuser and temperature uniformity of the diffuser also facilitate relatively high clean rates while facilitating deposition uniformity, promoting yield and operational efficiency.
• aspects of the heat conductive spacers 214, 314, 414, and 514 can include the following benefits: increased plasma distribution uniformity in a processing chamber; increased deposition repeatability on a substrate; increased uniformity of deposition on a substrate; and increased clean rates while facilitating deposition uniformity.
• Such benefits can increase deposition quality, yield of a processing chamber, and/or operating efficiency of a processing chamber.
• each of the lid assemblies 130, 230, 330, 430, and/or 530 may include one or more of the aspects, properties, features, and/or components of the other lid assemblies 130, 230, 330, 430, and/or 530 described

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• 2019
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