WO2020077750A1 - 摄像模组及组装工艺 - Google Patents

摄像模组及组装工艺 Download PDF

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Publication number
WO2020077750A1
WO2020077750A1 PCT/CN2018/118110 CN2018118110W WO2020077750A1 WO 2020077750 A1 WO2020077750 A1 WO 2020077750A1 CN 2018118110 W CN2018118110 W CN 2018118110W WO 2020077750 A1 WO2020077750 A1 WO 2020077750A1
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WIPO (PCT)
Prior art keywords
lens
circuit board
camera module
connector
present
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PCT/CN2018/118110
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English (en)
French (fr)
Inventor
张宝忠
顾亦武
胡月
农开勋
柳高烽
Original Assignee
宁波为森智能传感技术有限公司
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Application filed by 宁波为森智能传感技术有限公司 filed Critical 宁波为森智能传感技术有限公司
Priority to EP18932972.5A priority Critical patent/EP3687153A4/en
Publication of WO2020077750A1 publication Critical patent/WO2020077750A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the invention belongs to the technical field of connection between an optical lens and a circuit board, and particularly relates to a camera module and an assembly process.
  • the assembly of the lens and the circuit board is mainly divided into the following categories: One: the lens and the lens holder lens, which are fixed with the circuit board (circuit board assembly) with glue.
  • the shrinkage and expansion of glue will change under the influence of glue quantity, glue thickness, material, temperature and humidity, especially for camera modules with high pixel requirements.
  • the thickness of glue is more sensitive to the resolution of the camera module . Since the mechanical back focus of each lens will not be exactly the same, even if the back focus of each lens is known during production, it is also necessary for the glue to perform proper defocus compensation under the conditions of different thickness and shrinkage rate of the glue amount to achieve The way is more difficult.
  • the glue is used to fix the circuit board to the lens, and the glue needs to be baked to make it fully cured.
  • the long baking and cooling time leads to low production efficiency, and the baking effect is difficult to control, and the problem of glue failure is prone to occur.
  • An object of the present invention is to provide a camera module capable of improving imaging quality and an assembly process.
  • the present invention provides a camera module, which includes a lens and a circuit board, and further includes a connecting member, the connecting member is located between the lens and the circuit board, and one end is detachably connected to the lens , The other end is soldered to the circuit board.
  • the lens is provided with a connector installation hole, and the connector is installed in the connector installation hole.
  • the connecting member includes a main body portion and a connecting pin connected to the main body portion;
  • the main body part is connected to the lens, and the connection pin is connected to the circuit board.
  • the main body portion and the connecting pin are integrally formed.
  • connection pin is detachably connected with the main body part.
  • the material of the connecting member is carbon steel.
  • the circuit board includes a thin plate and a steel sheet reinforcement plate located on the lower side of the thin plate in cooperation with the thin plate, and the circuit board is provided with an image sensor and electronic components;
  • Pads are also provided on the circuit board.
  • connection piece is fixed to the pad by solder.
  • the lens is an integrated lens.
  • the invention also provides an assembly process of the above camera module, including:
  • the connecting pin is installed on the main body part to form a connecting piece, and then connected to the lens or directly selecting the connecting piece to connect with the lens;
  • the connecting pin and the circuit board need to be plated.
  • a connecting member is provided between the lens and the circuit board, thereby making the assembly of the camera module of the present invention more convenient.
  • the connection between the lens and the circuit board is achieved by soldering the connector to the circuit board, which effectively avoids the defects caused by the connection between the lens and the circuit board through glue in the prior art, and is conducive to ensuring the imaging quality of the camera module.
  • the circuit board includes a thin board and a steel sheet reinforcement board.
  • the structural strength of the circuit board can be strengthened.
  • the steel sheet reinforcement board has the advantage of fast heat dissipation, which can quickly take away the heat generated by the photosensitive chip work and ensure the uniform heat of the whole circuit board. , So that the deformation of the circuit board is effectively controlled, which can greatly improve the imaging quality of the camera module in the working state.
  • the thermal conductivity of the steel sheet reinforcement plate is greater than the thermal conductivity of the connecting member.
  • the connector is made of carbon steel.
  • FIG. 1 is a structural diagram schematically showing a camera module according to an embodiment of the present invention
  • FIG. 2 is a structural diagram schematically showing a camera module according to a second embodiment of the present invention.
  • FIG. 3 is a schematic diagram showing the structure of the circuit board according to the present invention.
  • FIG. 4 is a structural diagram schematically showing a connecting member of an embodiment in FIG. 2;
  • FIG. 5 is a structural diagram schematically showing the connector of the second embodiment in FIG. 2;
  • FIG. 6 is an exploded view schematically showing a camera module according to the present invention.
  • the camera module of the present invention includes a lens 1, a circuit board 2 and a connector 3.
  • the lens 1 includes a lens barrel portion and a flange portion, and the flange portion is located on the lower side of the lens barrel portion and is connected to the lens barrel portion.
  • the lens barrel portion of the lens 1 is made of a metal material, for example, copper or aluminum. This design solves the problem of poor consistency of the amount of thermal compensation caused by different thermal expansion coefficients when the split lens holder and lens are connected with threads and glue or with threads alone.
  • the flange portion of the lens 1 is connected to the connector 3.
  • the connector 3 is provided between the lens 1 and the circuit board 2, and the lens 1 is provided with a connector installation hole, and the connector 3 is installed in the connector installation hole , The other end of the connector 3 is soldered to the circuit board 2.
  • the connecting member 3 includes a main body portion 31 and a connecting pin 32.
  • the connection pin 32 is provided on the side of the main body portion 31 close to the circuit board 2.
  • the main body portion 31 is detachably connected to the lens 1, and the connecting pin 32 and the circuit board 2 are fixed by welding.
  • the camera module of the present invention is provided with a connecting member 3 between the lens 1 and the circuit board 2, thereby making the camera module of the present invention more convenient to assemble.
  • the connection between the lens 1 and the circuit board 2 is achieved by welding the connector 3 and the circuit board 2, which effectively avoids the defects caused by the connection between the lens and the circuit board through glue in the prior art, which is beneficial to ensure the camera module Image quality.
  • the circuit board 2 of the present invention includes a thin plate 21 and a steel sheet reinforcement plate 22.
  • the thin plate 21 is located on the upper side
  • the steel sheet reinforcement plate 22 is located on the lower side of the thin plate 21 and the thin plate 21 is cooperatively connected to each other.
  • the thin plate 21 of the circuit board 2 is provided with an image sensor, a photosensitive chip 23, an electronic component 24, and a flexible connection tape 25.
  • the circuit board 2 of the present invention is also provided with a pad 2a for carrying solder joints.
  • the connector 3 and the circuit board 2 of the present invention are fixedly connected by soldering. Specifically, the connecting pin 32 is soldered and fixed to the pad 2a on the circuit board 2 through the solder 4.
  • the pad 2a may be directly disposed on the thin plate 21.
  • a through hole may be provided in the thin plate 21 of the circuit board 2, and the pad 2a may be provided in the through hole to be fixed with the steel sheet reinforcing plate 22, that is, the pad 2a may be provided in Steel sheet reinforcement plate 22.
  • the circuit board 2 of the present invention includes a thin plate 21 and a steel sheet reinforcement plate 22.
  • the structural strength of the circuit board 2 can be strengthened
  • the steel sheet reinforcement plate 22 has the advantage of fast heat dissipation, and can quickly take away the heat generated by the photosensitive chip 23 during operation to ensure the overall circuit
  • the heat of the board 2 is uniform, so that the deformation of the circuit board 2 is effectively controlled, which can greatly improve the imaging quality of the camera module in the working state.
  • the thermal conductivity of the steel sheet reinforcement plate 22 is greater than the thermal conductivity of the connecting pin 32.
  • the connector 3 is made of carbon steel. In this way, during the welding process, the heat conduction along the connecting member 3 in the direction of the lens 2 is slower, and the heat conduction in the direction of the steel sheet reinforcing plate 22 is faster, so that the heat generated in the working state of the circuit board 2 from the steel sheet reinforcing plate Heat dissipation at 22 places, so that the temperature rise of the circuit board 2 will not affect the temperature drift of the lens, so that under the working conditions of -40-85 degrees Celsius, the stability of the resolution is improved, which is conducive to ensuring the stability of the imaging quality, making the camera The group can work under more severe environmental conditions and has a wider scope of application.
  • the connector 3 has an integrally formed structure, that is, the body portion 31 of the connector 3 and the connecting pin 32 are integrally formed, for example, can be made by die casting Inventive connector 3
  • the main body portion 31 of the connector 3 and the connecting pin 32 are detachably connected, that is, the connecting pin 32 as a separate component needs to be assembled to the main body portion 31 first.
  • the main body portion 31 is provided with a screw hole, and the connecting pin 32 is installed in the screw hole of the main body portion 31.
  • the present invention also provides a camera module assembly process. Including a, a connecting pin is installed on the main body part to form a connecting piece, and then the connecting piece is connected with the lens or a connecting piece is directly selected to connect with the lens. b. Perform focus adjustment on the image sensor of lens 1 and circuit board 2. c. Solder and fix the connector 3 to the circuit board 2 through the solder 4.
  • the lens 1, connector 3 and circuit board 2 that have passed the inspection. If the selected connector 3 is a separate component, the connector 3 is connected to the flange portion of the lens 1. If the selected connecting piece 3 is not a separate component, the connecting pin 32 is mounted on the main body portion 31 of the connecting piece 3 (if the integrated connecting piece 3 is used, there is no need to separately install the connecting pin 32). After that, the automatic spot soldering machine spots the solder 4 on the pad 2a of the circuit board 2 (which may be solder paste, solder ball, tin wire, etc.).
  • the relative positions of the lens 1 and the circuit board 2 are adjusted, and the image sensors on the lens 1 and the circuit board 2 are adjusted in focus to adjust the optical center, optical axis, and resolution.
  • the soldering machine equipment is automatically turned on, and the solder 4 at the pad 2a is heated and melted to be fixed.
  • the LED display shows the completion status of the test, and the assembly of the lens 1 and the circuit board 2 is completed. You can then assemble other components.
  • the lens 1, the connector 3 and the circuit board 2 that have passed the inspection are selected. If the selected connector 3 is a separate component, the connector 3 is connected to the flange portion of the lens 1. If the selected connecting piece 3 is not a separate component, the connecting pin 32 is mounted on the main body portion 31 of the connecting piece 3 (if the integrated connecting piece 3 is used, there is no need to separately install the connecting pin 32). Subsequently, the relative positions of the lens 1 and the circuit board 2 are adjusted, and the image sensors on the lens 1 and the circuit board 2 are adjusted in focus to adjust the optical center, optical axis, and resolution.
  • the soldering equipment sends a tin wire or solder ball near the gap between the pad 2a and the connector 3, the soldering device melts the solder 4 and drops on the gap between the pad 2a and the connector 3, and waits for cooling to test the camera optical performance , LED display screen shows the completion status of the test, and the assembly of the lens 1 and the circuit board 2 is completed. After that, other components are assembled.
  • the connecting member 3 and the circuit board 22 (pad 2a) need to be electroplated before welding, which is beneficial to ensure the firmness of welding. Welding the connector 3 and the pad 2a in the above two ways is beneficial to ensure the accuracy of focusing of the camera module of the present invention, thereby improving the image quality.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

本发明涉及一种摄像模组及组装工艺，其中摄像模组包括镜头(1)和线路板(2)，其特征在于，还包括连接件(3)，所述连接件(3)位于所述镜头(1)与所述线路板(2)之间，一端与所述镜头(1)可拆卸地连接，另一端与所述线路板(2)焊接。本发明的摄像模组能够解决现有技术中镜头与线路板通过胶水固定连接所导致的缺陷，能够有效提升成像品质。

Description

摄像模组及组装工艺
本申请要求于2018年10月17日提交中国专利局、申请号为201811209465.2、申请名称为“摄像模组及组装工艺”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明属于光学镜头与线路板的连接技术领域，尤其涉及一种摄像模组及组装工艺。
背景技术
现有技术中，镜头与线路板组装主要分为以下几类：一：镜头与镜座镜头，其与线路板(线路板组件)用胶水固定。二：非螺纹的分体式镜头一般是将镜头法兰面与镜座用胶水固定，镜座再与线路板有螺钉或者胶水固定。三：螺纹式镜头一般是将镜头与镜座用胶水填充螺纹后固定，镜座与线路板用螺钉锁附或者胶水固定。但实际上，使用胶水将线路板与镜头进行固定，存在以下缺陷：
1、胶水的收缩和膨胀会受到胶水量、胶厚度、材料、温度湿度等因素影响下发生变化，特别是对像素要求较高的摄像模组，胶水的厚度对摄像模组的解像力影响较为敏感。由于每一颗的机械后焦不会完全一致，因此生产时即使知道每一颗镜头的后焦，同样需要胶水在不同厚度和胶水量的收缩率的情况下才能进行合适的离焦补偿，实现方式较为困难。
2、使用胶水将线路板与镜头固定连接，在实际的生产过程中容易出现脱胶现象，返修难度大，会影响产品的生产良率和生产效率。
3、采用胶水将线路板与镜头固定连接，需要烘烤胶水使其完全固化。然而烘烤及冷却时间较长，导致生产效率不高，并且烘烤效果较难把控，容易出现胶水失效的问题。
发明内容
本发明的目的在于提供一种能够提高成像品质的摄像模组及组装工艺。
为实现上述目的，本发明提供一种摄像模组，包括镜头和线路板，还包括连接件，所述连接件位于所述镜头与所述线路板之间，一端与所述镜头可拆卸地连接，另一端与所述线路板焊接。
根据本发明的一个方面，所述镜头上设有连接件安装孔，所述连接件安装在所述连接件安装孔中。
根据本发的一个方面，所述连接件包括主体部分和与所述主体部分相连接的连接销钉；
所述主体部分与所述镜头连接，所述连接销钉与所述线路板连接。
根据本发明的一个方面，所述主体部分与所述连接销钉为一体成型构造。
根据本发明的一个方面，所述连接销钉与所述主体部分可拆卸地连接。
根据本发明的一个方面，所述连接件的材质为碳素钢。
根据本发明的一个方面，所述线路板包括薄板与位于所述薄板下侧与所述薄板相配合固定的钢片加强板，所述线路板上设有图像传感器及电子元器件；
所述线路板上还设有焊盘；
所述连接件通过焊料与所述焊盘焊接固定。
根据本发明的一个方面，所述镜头为一体式镜头。
本发明还提供一种上述摄像模组的组装工艺，包括：
a、连接销钉安装在所述主体部分上形成连接件后与所述镜头连接或者直接选择连接件与所述镜头进行连接；
b、对所述镜头与所述线路板上的图像传感器进行调焦处理；
c、将所述连接件通过焊料与所述线路板进行焊接固定。
根据本发明的一个方面，在所述步骤c之前，需要对所述连接销钉和所述线路板进行电镀处理。
根据本发明的一个方案，在镜头和线路板之间设置连接件，从而使得本发明的摄像模组组装更为方便。通过连接件与线路板焊接的方式实现镜 头与线路板之间的连接，有效规避了现有技术中通过胶水实现镜头与线路板连接所导致的缺陷，有利于保证摄像模组的成像品质。
根据本发明的一个方案，线路板包括薄板和钢片加强板。通过设置钢片加强板，一方面可以加强线路板的结构强度，另一方面，钢片加强板具有散热快的优点，可以将感光芯片工作产生的热量迅速带走，保证整体线路板的热量均匀，使得线路板的形变量得到有效控制，能够大幅度提升摄像模组在工作状态下的成像质量。
根据本发明的一个方案，钢片加强板的导热系数大于连接件的导热系数。此外，在本实施方式中，连接件采用碳素钢材质制成。如此设置，使得在焊接过程中沿着连接件向着镜头方向的热传导较慢，向着钢片加强板方向的热传导较快，从而使线路板工作状态下产生的热量从钢片加强板处散热，从而线路板温度的上升不会影响镜头温漂变化，使得在-40-85摄氏度工作条件下，解像力稳定性提升，有利于保证成像品质的稳定性，使得本发明的摄像模组可以在更为严苛的环境条件下工作，适用范围更广。
附图说明
图1是示意性表示根据本发明一种实施方式的摄像模组的结构图；
图2是示意性表示根据本发明第二种实施方式的摄像模组的结构图；
图3是示意性表示根据本发明的线路板的结构图；
图4是示意性表示图2中一种实施方式的连接件的结构图；
图5是示意性表示图2中第二种实施方式的连接件的结构图；
图6是示意性表示根据本发明的摄像模组的分解图。
附图中标号所代表的含义如下：
1、镜头；2、线路板；3、连接件；4、焊料；21、薄板；22、钢片加强板；23、感光芯片；24、电子元器件；25、软性连接带。31、主体部分；32、连接销钉。
具体实施方式
为了更清楚地说明本发明实施方式或现有技术中的技术方案，下面将对实 施方式中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本发明的一些实施方式，对于本领域普通技术人员而言，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
在针对本发明的实施方式进行描述时，术语“轴向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”所表达的方位或位置关系是基于相关附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
下面结合附图和具体实施方式对本发明作详细地描述，实施方式不能在此一一赘述，但本发明的实施方式并不因此限定于以下实施方式。
本发明的摄像模组包括镜头1、线路板2和连接件3。如图1、图2所示，在本发明的一种实施方式中镜头1包括镜筒部分和法兰部分，法兰部分位于镜筒部分的下侧与镜筒部分连接。在本实施方式中，镜头1的镜筒部分采用金属材料制成，例如可以采用铜或铝等材料。这种设计解决了分体式镜头镜座和镜头用螺纹和胶水或单独用螺纹连接时由于热膨胀系数不同而造成的热补偿量一致性不佳的问题。
在本发明中，镜头1的法兰部分与连接件3进行连接。如图1所示，根据本发明的一种实施方式，连接件3设置在镜头1和线路板2之间，在镜头1上设有连接件安装孔，连接件3安装在连接件安装孔中，连接件3的另一端焊接在线路板2上。
如图2、图5和图6所示，根据本发明的第二种实施方式，连接件3包括主体部分31和连接销钉32。连接销钉32设置在主体部分31靠近线路板2的一侧。主体部分31与镜头1可拆卸地连接，连接销钉32与线路板2通过焊接的方式进行固定。
本发明的摄像模组，在镜头1和线路板2之间设置连接件3，从而使得本发明的摄像模组组装更为方便。通过连接件3与线路板2焊接的方式实现镜头1与线路板2之间的连接，有效规避了现有技术中通过胶水实现镜头与线路板连接所导致的缺陷，有利于保证摄像模组的成像品质。
如图3所示，本发明的线路板2包括薄板21和钢片加强板22。在本 实施方式中，薄板21位于上侧，钢片加强板22位于薄板21下侧与薄板21相互配合连接。在本发明中，线路板2的薄板21上设有图像传感器、感光芯片23、电子元器件24和软性连接带25。本发明的线路板2还上设有焊盘2a，用于承载焊接点。本发明的连接件3与线路板2采用焊接的方式进行固定连接，具体来说，是将连接销钉32通过焊料4与线路板2上的焊盘2a进行焊接固定。
根据本发明的一种实施方式，焊盘2a可以直接设置在薄板21上。根据本发明的第二种实施，可以在线路板2的薄板21上设置通孔，将焊盘2a设置在通孔中与钢片加强板22固定，也就是说，可以将焊盘2a设置在钢片加强板22上。上述两种方式均可以实现连接件3或连接销钉32与焊盘2a的焊接。
本发明的线路板2包括薄板21和钢片加强板22。通过设置钢片加强板22，一方面可以加强线路板2的结构强度，另一方面，钢片加强板22具有散热快的优点，可以将感光芯片23工作产生的热量迅速带走，保证整体线路板2的热量均匀，使得线路板2的形变量得到有效控制，能够大幅度提升摄像模组在工作状态下的成像质量。
在本发明中，钢片加强板22的导热系数大于连接销钉32的导热系数。此外，在本实施方式中，连接件3采用碳素钢材质制成。如此设置，使得在焊接过程中沿着连接件3向着镜头2方向的热传导较慢，向着钢片加强板22方向的热传导较快，从而使线路板2工作状态下产生的热量从钢片加强板22处散热，从而线路板2温度的上升不会影响镜头温漂变化，使得在-40-85摄氏度工作条件下，解像力稳定性提升，有利于保证成像品质的稳定性，使得本发明的摄像模组可以在更为严苛的环境条件下工作，适用范围更广。
如图4所示，根据本发明的第一种实施方式，连接件3为一体成型构造，即连接件3的主体部分31和连接销钉32时一体成型的，例如，可以通过压铸的方式制成本发明的连接件3。
如图5所示，本发明的第二中实施方式，连接件3的主体部分31和连接销钉32为可拆卸连接，即连接销钉32作为一个单独的组件，首先需要 组装到主体部分31上。在本实施方式中，在主体部分31上设有螺纹孔，连接销钉32安装在主体部分31的螺纹孔中。
如图6所示，本发明还提供一种摄像模组的组装工艺。包括a、连接销钉安装在所述主体部分上形成连接件后与所述镜头连接或者直接选择连接件与所述镜头进行连接。b、对镜头1和线路板2的图像传感器进行调焦处理。c、将连接件3通过焊料4与线路板2进行焊接固定。
具体来说，首先选择经检验合格的镜头1、连接件3和线路板2。若选择的连接件3为单独的组件，则将连接件3连接到镜头1的法兰部分上。若选择的连接件3不是单独的组件，则将连接销32安装到连接件3的主体部分31上(若采用的是一体成型的连接件3则不需要单独安装连接销钉32)。之后自动点焊料机在线路板2的焊盘2a处点焊料4(可以为锡膏、锡球、锡丝等材料)。随后调整镜头1与线路板2的相对位置，对镜头1与线路板2上的图像传感器进行调焦处理，调节光心、光轴、解像力。完成后焊机设备自动开启，对焊盘2a处焊料4加热溶化后实现固定。等待冷却后测试摄像头光学性能，LED显示屏显示测试完成状态，完成镜头1与线路板2组装。之后可以再进行其他组件的组装。
根据本发明的第二种实施方式，首先选择经检验合格的镜头1、连接件3和线路板2。若选择的连接件3为单独的组件，则将连接件3连接到镜头1的法兰部分上。若选择的连接件3不是单独的组件，则将连接销32安装到连接件3的主体部分31上(若采用的是一体成型的连接件3则不需要单独安装连接销钉32)。随后调整镜头1与线路板2的相对位置，对镜头1与线路板2上的图像传感器进行调焦处理，调节光心、光轴、解像力。调节完成后，送焊料设备在焊盘2a与连接件3间隙附近送锡丝或锡球，焊接设备熔化焊料4后滴落在焊盘2a与连接件3间隙处，等待冷却后测试摄像头光学性能，LED显示屏显示测试完成状态，完成镜头1与线路板2组装。之后再进行其他组件的组装。
以上两种方式，在焊接之前均需要对连接件3和线路板22(焊盘2a)进行电镀处理，有利于保证焊接的牢固性。按照上述两种方式将连接件3和焊盘2a进行焊接，有利于保证本发明摄像模组调焦的精度，从而提高成 像品质。
上述内容仅为本发明的具体方案的例子，对于其中未详尽描述的设备和结构，应当理解为采取本领域已有的通用设备及通用方法来予以实施。
以上所述仅为本发明的一个实施方式而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种摄像模组，包括镜头(1)和线路板(2)，其特征在于，还包括连接件(3)，所述连接件(3)位于所述镜头(1)与所述线路板(2)之间，一端与所述镜头(1)可拆卸地连接，另一端与所述线路板(2)焊接。
  2. 根据权利要求1所述的摄像模组，其特征在于，所述镜头(1)上设有连接件安装孔，所述连接件(3)安装在所述连接件安装孔中。
  3. 根据权利要求1所述的摄像模组，其特征在于，所述连接件(3)包括主体部分(31)和与所述主体部分(31)相连接的连接销钉(32)；
    所述主体部分(31)与所述镜头(1)连接，所述连接销钉(32)与所述线路板(2)连接。
  4. 根据权利要求3所述的摄像模组，其特征在于，所述主体部分(31)与所述连接销钉(32)为一体成型构造。
  5. 根据权利要求3所述的摄像模组，其特征在于，所述连接销钉(32)与所述主体部分(31)可拆卸地连接。
  6. 根据权利要求1所述的摄像模组，其特征在于，所述连接件(3)的材质为碳素钢。
  7. 根据权利要求1所述的摄像模组，其特征在于，所述线路板(2)包括薄板(21)与位于所述薄板(21)下侧与所述薄板(21)相配合固定的钢片加强板(22)，所述线路板(2)上设有图像传感器及电子元器件；
    所述线路板(2)还上设有焊盘(2a)；
    所述连接件(3)通过焊料(4)与所述焊盘(2a)焊接固定。
  8. 根据权利要求1所述的摄像模组，其特征在于，所述镜头(1)为一体式镜头。
  9. 一种用于权利要求1-8所述的摄像模组的组装工艺，包括：
    a、将连接销钉安装在所述主体部分上形成连接件后与所述镜头连接或者直接选择连接件与所述镜头进行连接；
    b、对所述镜头与所述线路板的图像传感器进行调焦处理；
    c、将所述连接件通过焊料与所述线路板进行焊接固定。
  10. 根据权利要求9所述的组装工艺，其特征在于，在所述步骤c之前，需要对所述连接销钉和所述线路板进行电镀处理。
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