WO2020073763A1

WO2020073763A1 - Imaging module and electronic device

Info

Publication number: WO2020073763A1
Application number: PCT/CN2019/104975
Authority: WO
Inventors: 李宗政; 林君翰; 陈冠宏; 周祥禾
Original assignee: 南昌欧菲生物识别技术有限公司
Priority date: 2018-10-11
Filing date: 2019-09-09
Publication date: 2020-04-16

Abstract

Disclosed are an imaging module (10) and an electronic device (100). The imaging module (10) comprises a receiving module (11), a transmission module (12), and a support (13). The support (13) comprises a first supporting portion (132) and a second supporting portion (134) which are in an integral structure; the first supporting portion (132) is provided with a first accommodating space (1321); the receiving module (11) is at least partially provided in the first accommodating space (1321), and the second supporting portion (134) is provided with a second accommodating space (1342); the transmission module (12) is at least partially provided in the second accommodating space (1342).

Description

Imaging module and electronic device

Priority information

This application requests the priority and rights and interests of the patent applications filed on October 11, 2018, filed with the State Intellectual Property Office of China, with application numbers 201811182840.9 and 201821652585.5, and the entire contents of which are hereby incorporated by reference.

Technical field

This application relates to the field of image acquisition technology, in particular to an imaging module and an electronic device.

Background technique

In the related art, the technique of using the imaging module to collect the three-dimensional contour information of the object has received more and more attention. Among them, the imaging module using Time of Flight (TOF) can determine the time-of-flight ranging module and the object by detecting the time it takes the signal sent from the transmitting module to reach the receiving module after being reflected by the object The distance between them to obtain the three-dimensional contour information of the object. However, when assembling the imaging module, first assemble the receiving module and the transmitting module separately, and then assemble the receiving module and the transmitting module together. The receiving module and the transmitting module need to maintain a certain relative position, which affects the imaging module Assembly efficiency and yield. Therefore, how to design the transmitting module and the receiving module of the imaging module has become a technical problem to be solved.

Summary of the invention

The embodiments of the present application provide an imaging module and an electronic device.

An imaging module according to an embodiment of the present application includes a receiving module, a transmitting module, and a bracket. The bracket includes a first support portion and a second support portion of an integrated structure. The first support portion is provided with a first receiving space The receiving module is at least partially disposed in the first receiving space, the second supporting portion is provided with a second receiving space, and the transmitting module is at least partially disposed in the second receiving space.

In the imaging module according to the embodiment of the present application, the receiving module and the transmitting module may be provided in the first receiving space and the second receiving space of the bracket, respectively. When the imaging module is assembled, the receiving module and the transmitting module are assembled together Compared to two separate transmitter modules and receiver modules, the integrated bracket can reduce the number of components, for example, the number of brackets and corresponding molds, which reduces the production cost; in addition, it can reduce the number of assembly steps, which is beneficial to reduce The cumulative error during the small assembly process improves the assembly efficiency and yield of the imaging module.

In some embodiments, the imaging module includes a printed circuit board, the emission module includes a light source, the bracket and the light source are disposed on the surface of the printed circuit board, and the light source is located in the second housing space. In this way, the printed circuit board can support the light source and realize the power supply and control of the light source, and the bracket can protect the light source and reduce environmental interference.

In some embodiments, the second support portion is provided with a light exit hole on a side opposite to the printed circuit board, and the light exit hole communicates with the second receiving space and is aligned with the light source. In this way, the light emitted by the light source in the bracket can be projected into the space through the light exit hole.

In some embodiments, the transmitting module includes a diffuser, and a receiving slot is opened inside the second support portion, the receiving slot communicates with the second receiving space and the light exit hole, the diffuser At least partially disposed in the receiving slot, the diffuser is located on the light exit side of the light source, and the light emitted by the light source exits the light exit hole through the diffuser. In this way, the diffuser can diffuse the light emitted by the light source to form a uniform light. After the uniform light is irradiated to the object, it is helpful for the receiving module to receive the light reflected by the object and improve the detection effect of the imaging module.

In some embodiments, the light source includes a vertical cavity surface emitting laser array, and the vertical cavity surface emitting laser array includes a plurality of vertical cavity surface emitting lasers distributed in an array. The emitting module can use a vertical cavity surface emitting laser array as a light source, which can meet the needs of a small volume of the light source. Forming an array distribution through multiple vertical cavity surface emitting lasers can ensure the continuity of light and the projection area.

In some embodiments, the receiving module includes a lens and an image sensor, the image sensor is located on the image side of the lens, the image sensor is disposed on the surface of the printed circuit board and is located in the first receiving space . In this way, the lens concentrates the light to the image sensor, which is beneficial to improve the imaging effect of the image sensor.

In some embodiments, the first support portion includes a mirror seat, the mirror seat is convexly disposed on a side of the first support portion opposite to the printed circuit board, and the mirror seat is provided with a receiving cavity The first support portion is provided with a through hole, the through hole communicates with the first receiving space and the receiving cavity, and the lens is disposed in the receiving cavity. In this way, the lens gathers light and projects it to the image sensor through the through hole, and the lens holder can provide support for the lens, and can limit the position of the lens, which is conducive to the assembly of the lens.

In some embodiments, the receiving module further includes an optical filter, and a device slot is opened inside the first support portion, and the device slot communicates with the first receiving space and the through hole, The filter is at least partially disposed in the device groove and between the lens and the image sensor. In this way, the light incident from the through hole is projected to the image sensor after passing through the filter, and the filter can pass the light of the corresponding wavelength and filter out other light, which is beneficial to improve the accuracy of the detection of the imaging module.

In some embodiments, the planar shape of the optical filter is square, the planar shape of the device groove is square, and four corners of the device groove are formed with semicircular grooves extending outward. The semi-circular groove can facilitate the installation and removal of the filter in the device groove, and can also be convenient for dispensing the filter to fix the filter.

In some embodiments, the imaging module includes a flexible circuit board, and the flexible circuit board is connected to the printed circuit board. In this way, the printed circuit board can be connected to the external circuit through the flexible circuit board, so that the imaging module can be controlled, and at the same time, the data signal collected by the imaging module can be transmitted to an external circuit for processing to obtain three-dimensional contour information of the object.

An electronic device according to an embodiment of the present application includes an imaging module. The imaging module includes a receiving module, a transmitting module, and a bracket. The bracket includes an integral structure of a first support portion and a second support portion. The first supporting portion is provided with a first receiving space, the receiving module is at least partially disposed in the first receiving space, the second supporting portion is provided with a second receiving space, and the transmitting module is at least partially disposed In the second accommodation space.

The electronic device according to the embodiment of the present application adopts the imaging module according to the embodiment of the present application, and the receiving module and the transmitting module can be respectively disposed in the first receiving space and the second receiving space of the bracket. When the imaging module is assembled, the receiving module The group and the launch module are assembled into an integrally formed bracket. Compared with two separate launch modules and receiver modules, the number of components can be reduced, such as the number of brackets and corresponding molds, which reduces production costs; in addition, it can Reducing the number of assembly steps is beneficial to reduce the cumulative error during the assembly process and improve the assembly efficiency and yield of the imaging module.

In some embodiments, the imaging module includes a flexible circuit board, and the flexible circuit board is connected to the printed circuit board. In this way, the printed circuit board can be connected to the external circuit through the flexible circuit board, so that the imaging module can be controlled to work, and at the same time, the data signal collected by the imaging module can be transmitted to an external circuit for processing to obtain three-dimensional contour information of the object.

Additional aspects and advantages of the present application will be partially given in the following description, and some will become apparent from the following description, or be learned through practice of the present application.

BRIEF DESCRIPTION

The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

FIG. 1 is a schematic perspective view of an imaging module according to an embodiment of the present application.

FIG. 2 is an exploded schematic diagram of the imaging module of the embodiment of the present application.

3 is a plan view of an imaging module according to an embodiment of the present application.

4 is a schematic cross-sectional view of the imaging module of FIG. 3 along the IV-IV direction.

FIG. 5 is a schematic perspective view of a stent according to an embodiment of the present application.

Fig. 6 is a plan view of a stent according to an embodiment of the present application.

FIG. 7 is a bottom view of the stand of the embodiment of the present application.

8 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Symbol description of main components:

Electronic device 100, imaging module 10, receiving module 11, lens 112, image sensor 114, filter 116, emitting module 12, light source 122, diffuser 124, bracket 13, first support portion 132, first housing Space 1321, lens holder 1322, receiving cavity 1323, through hole 1324, device groove 1325, second support portion 134, second receiving space 1342, light exit hole 1344, receiving groove 1346, semicircular groove 136, printed circuit board 14, flexible circuit Board 15.

detailed description

The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, in which the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary, and are only used to explain the present application, and cannot be construed as limiting the present application.

In the description of the present application, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise specifically limited.

In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connected", and "connection" should be understood in a broad sense, for example, it can be fixed or detachable Connect, or connect as one. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the connection between two elements or the interaction between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit this application. In addition, the present application may repeat reference numerals and / or reference letters in different examples. Such repetition is for simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

Please refer to FIGS. 1 to 4 together. The imaging module 10 of the embodiment of the present application includes a receiving module 11, a transmitting module 12 and a bracket 13. The bracket 13 includes an integrally formed first support portion 132 and a second support portion 134 The first supporting portion 132 defines a first receiving space 1321, the receiving module 11 is at least partially disposed in the first receiving space 1321, the second supporting portion 134 defines a second receiving space 1342, and the transmitting module 12 is at least partially disposed In the second storage space 1342.

In the imaging module 10 of the embodiment of the present application, the receiving module 11 and the transmitting module 12 may be provided in the first receiving space 1321 and the second receiving space 1342 of the bracket 13 respectively. When the imaging module 10 is assembled, the receiving module The group 11 and the transmitting module 12 are assembled into an integrally formed bracket 13. Compared with the assembly of two separate transmitting modules 12 and receiving modules 11, the number of components can be reduced, for example, the number of brackets 13 and corresponding molds To reduce the production cost; in addition, the assembly steps can be reduced, which is beneficial to reduce the cumulative error during the assembly process and improve the assembly efficiency and yield of the imaging module 10.

Further, the first support portion 132 and the second support portion 134 are of an integrated structure, and the structure of the bracket 13 is simple and stable, which can reduce the wall thickness of the two support portions, which is conducive to the compact design of the imaging module 10 and can be applied In thin and light electronic products. In one example, the bracket 13 may be integrally formed of plastic material. Of course, the bracket 13 can also be manufactured by integrally forming a metal material.

In some embodiments, the transmitting module 12 may be a laser transmitting module 12, and the receiving module 11 may be a photosensitive module. In this way, the imaging module 10 can use the time-of-flight ranging method to determine the distance between the imaging module 10 and the object by detecting the time it takes for the optical signal sent from the transmitting module 12 to be reflected by the object and reaching the receiving module 11, thereby The imaging module 10 can acquire the three-dimensional contour information of the object. The imaging module 10 may also be a structured light 3D imaging module. At this time, the transmitting module 12 is used to emit structured light with a predetermined pattern, generally infrared structured light, and the receiving module 11 is an infrared light sensitive module; of course, imaging The module 10 may also be a general 2D camera module. In this case, the transmitting module 12 may be used as a flash of the receiving module 11.

In some embodiments, the imaging module 10 includes a printed circuit board 14, the emitting module 12 includes a light source 122, the bracket 13 and the light source 122 are disposed on the surface of the printed circuit board 14, and the light source 122 is located in the second receiving space 1342.

Specifically, the light source 122 may be installed on the surface of the printed circuit board 14. By designing the light source 122 at the position of the printed circuit board 14, the light source 122 is located in the second receiving space 1342 when the bracket 13 and the printed circuit board 14 are assembled. In this way, the printed circuit board 14 can support the light source 122 and realize power supply and control of the light source 122, and the bracket 13 can protect the light source 122 and reduce environmental interference.

In some embodiments, the second support portion 134 has a light exit hole 1344 on the side opposite to the printed circuit board 14. The light exit hole 1344 communicates with the second receiving space 1342 and is aligned with the light source 122.

In this way, the light emitted by the light source 122 in the bracket 13 can be projected into the space through the light exit hole 1344. After encountering the object, the light reflection can be received by the receiving module 11, and the imaging module 10 determines the imaging module 10 and the object according to the travel time of the light the distance.

Please refer to FIG. 4 to FIG. 7. In some embodiments, the transmitting module 12 includes a diffuser 124. A receiving slot 1346 is opened inside the second supporting portion 134. The receiving slot 1346 and the second receiving space 1342 and the light exit The holes 1344 communicate with each other. The diffuser 124 is at least partially disposed in the receiving slot 1346. The diffuser 124 is located on the light exit side of the light source 122. The light emitted by the light source 122 exits the light exit hole 1344 through the diffuser 124.

In this way, the diffuser 124 can diffuse the light emitted from the light source 122 to form a uniform light. The uniform light refers to light having a certain light distribution, density, and uniformity. That is to say, the diffuser 124 can diffuse light to form light with a certain light pattern distribution, density and uniformity. After the uniform light irradiates the object, it is beneficial for the receiving module 11 to receive the light reflected by the object and improve the detection effect of the imaging module 10. The light emitted by the light source 122 passes through the diffuser 124 and is projected from the light exit hole 1344 into the space.

Further, the receiving slot 1346 can define the position of the diffuser 124, which facilitates the fitting of the diffuser 124 to the bracket 13. In one example, the diffuser 124 is glued to the receiving groove 1346 by glue. When the imaging module 10 is assembled, the diffuser 124 is first adhered to the receiving slot 1346, and then the bracket 13 with the diffuser 124 is mounted to the printed circuit board 14.

Referring to FIG. 7, in some embodiments, the planar shape of the diffuser 124 is square, and the planar shape of the receiving slot 1346 is square. The four corners of the receiving groove 1346 are formed with semicircular grooves 136 extending outward.

In this way, the semi-circular groove 136 can facilitate installation and removal of the diffuser 124 in the receiving groove 1346, and can also facilitate dispensing of the diffuser 124 to fix the diffuser 124. Of course, in other embodiments, the planar shapes of the diffuser 124 and the receiving groove 1346 can be selected as circular, elliptical, or other shapes as needed, and are not specifically limited herein.

In some embodiments, the diffuser 124 may be made by adding a scattering material to the material layer, or by making scattering characteristics on the surface layer, or by designing a diffractive microstructure on the surface, or by designing a microstructure on the surface The lens array ((Micro Lens Array, MLA) refractive microstructure is made. Specifically, the diffuser 124 can select different designs according to different uses and optical requirements, which can meet more scene requirements.

In some embodiments, the diffuser 124 is kept at a distance from the light source 122. In this way, the transmitting module 12 can meet the corresponding optical requirements. Wherein, the diffuser 124 and the light source 122 can be set at an appropriate distance according to different optical requirements.

In some embodiments, the light source 122 includes a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL) array, and the vertical cavity surface emitting laser array includes a plurality of vertical cavity surface emitting lasers distributed in an array.

It can be understood that the vertical cavity surface emitting laser is a small-volume semiconductor laser, which can form an array distribution with a higher output power and is used to establish an efficient laser light source. In this way, the emitting module 12 can use the vertical cavity surface emitting laser array as the light source 122, which can meet the small volume requirement of the light source 122, and the vertical cavity surface emitting laser has a small divergence angle, and the array distribution is formed by multiple vertical cavity surface emitting lasers Can ensure the continuity of light and the projected area.

In some embodiments, the receiving module 11 includes a lens 112 and an image sensor 114. The image sensor 114 is located on the image side of the lens 112. The image sensor 114 is disposed on the surface of the printed circuit board 14 and located in the first receiving space 1321.

In this way, the transmitting module 12 emits light, and the lens 112 focuses the light reflected by the object to the receiving module 11 to the image sensor 114 to improve the imaging effect of the image sensor 114 so as to obtain three-dimensional information of the object. The image sensor 114 is installed on the surface of the printed circuit board 14, that is, the image sensor 114 and the light source 122 are disposed on the same printed circuit board 14 and are located on the same side of the printed circuit board 14, and the relative position of the light source 122 and the image sensor 114 It is not affected by the assembly of the imaging module 10, which is beneficial to improve the yield and reliability of the imaging module 10.

Further, by designing the position of the light source 122 and the image sensor 114 on the printed circuit board 14 so that the bracket 13 and the printed circuit board 14 are assembled, the image sensor 114 is located in the first storage space 1321 and the light source 122 is located in the second storage space 1342. In this way, the printed circuit board 14 can support the image sensor 114 and the light source 122 and realize the power supply and control of the image sensor 114 and the light source 122, and the bracket 13 can protect the image sensor 114 and the light source 122 and reduce environmental interference.

When the imaging module 10 is assembled, the image sensor 114 and the light source 122 can be assembled by mounting the bracket 13 on the printed circuit board 14. The assembly steps are simple, which is beneficial to improve the assembly efficiency of the imaging module 10.

In some embodiments, the image sensor 114 includes a charge coupled device (Charge Coupled Device, CCD) sensor or a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor (CMOS) sensor).

In some embodiments, the first support portion 132 includes a mirror base 1322, and the mirror base 1322 is convexly disposed on a side of the first support portion 132 opposite to the printed circuit board 14, and the mirror base 1322 is provided with a receiving cavity 1323, the first The supporting portion 132 defines a through hole 1324, the through hole 1324 communicates with the first receiving space 1321 and the receiving cavity 1323, and the lens 112 is disposed in the receiving cavity 1323.

It can be understood that the lens 112 and the printed circuit board 14 can be assembled from two sides opposite to the bracket 13. The lens 112 condenses light and projects it to the image sensor 114 through the through hole 1324. Among them, the lens holder 1322 can provide support for the lens 112, and can define the position of the lens 112, which is beneficial to the assembly of the lens 112.

Specifically, in some embodiments, the lens 112 includes at least one optical lens. In one example, the lens 112 may be an optical lens. In another example, the lens 112 may be a combination of multiple optical lenses. In this way, the receiving module 11 can improve the imaging effect of the image sensor 114 through the lens 112.

In some embodiments, the receiving module 11 includes a filter 116, and a device slot 1325 is formed inside the first support portion 132. The device slot 1325 communicates with the first receiving space 1321 and the through hole 1324, and the filter 116 is at least partially Is disposed in the device groove 1325 and is located between the lens 112 and the image sensor 114.

In this way, the light incident from the through hole 1324 passes through the filter 116 and is projected to the image sensor 114. The filter 116 can pass the light of the corresponding wavelength and filter out other light, which is helpful to improve the detection accuracy of the imaging module 10 .

In one example, the filter 116 can filter other light than the light emitted by the emitting module 12 to avoid interference of other light, so that the image information formed by the image sensor 114 collecting light is more accurate. Specifically, the emitting module 12 may emit infrared rays, and the filter 116 may be an infrared filter 116. In this way, the infrared filter 116 may filter non-infrared light to avoid interference of the non-infrared light on the image sensor 114 collecting images.

The device groove 1325 can define the position of the filter 116, which is advantageous for the assembly of the filter 116 to the bracket 13. In one example, the filter 116 is adhered to the device groove 1325 by glue. When the imaging module 10 is assembled, the filter 116 is adhered to the device groove 1325 first, and then the bracket 13 with the filter 116 is mounted to the printed circuit board 14.

Please refer to FIG. 7 again. In some embodiments, the planar shape of the filter 116 is square, and the planar shape of the device groove 1325 is square. The four corners of the device groove 1325 are formed with semicircular grooves 136 extending outward.

In this way, the semicircular groove 136 can facilitate installation and removal of the filter 116 in the device groove 1325, and can also facilitate dispensing of the filter 116 to fix the filter 116. Of course, in other embodiments, the planar shapes of the filter 116 and the device groove 1325 can be selected as circular, elliptical, or other shapes as needed, and are not specifically limited herein.

Please refer to FIG. 1. In some embodiments, the imaging module 10 includes a flexible circuit board 15, and the flexible circuit board 15 is connected to the printed circuit board 14.

In this way, the printed circuit board 14 can be connected to the external circuit through the flexible circuit board 15 so that the imaging module 10 can be controlled to work, and at the same time, the data signal collected by the imaging module 10 can be transmitted to an external circuit for processing to obtain a three-dimensional contour of the object information.

Referring to FIG. 8, an electronic device 100 according to an embodiment of the present application includes the imaging module 10 of any of the above embodiments.

The electronic device 100 of the embodiment of the present application adopts the imaging module 10 of the embodiment of the present application, and the receiving module 11 and the transmitting module 12 can be provided in the first receiving space 1321 and the second receiving space 1342 of the bracket 13 respectively. When the module 10 is assembled, the receiving module 11 and the transmitting module 12 are assembled into an integrally formed bracket 13. Compared with the separate transmitting module 12 and the receiving module 11, the number of components can be reduced, for example, the bracket 13 and the corresponding The number of molds reduces the production cost; in addition, the assembly steps can be reduced, which is beneficial to reduce the cumulative error during the assembly process and improve the assembly efficiency and yield of the imaging module 10.

In some embodiments, the electronic device 100 includes, but is not limited to, electronic devices such as mobile phones, tablet computers, notebook computers, smart wearable devices, door locks, car terminals, and drones. In the example shown in FIG. 8, the electronic device 100 is a mobile phone.

In the description of this specification, reference to the descriptions of the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means combined embodiments The specific features, structures, materials, or characteristics described in the examples are included in at least one embodiment or example of the present application. In this specification, the schematic expression of the above-mentioned terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, those of ordinary skill in the art may understand that various changes, modifications, replacements, and variations can be made to these embodiments without departing from the principle and purpose of the present application, The scope of the application is defined by the claims and their equivalents.

Claims

An imaging module, characterized in that it includes a receiving module, a transmitting module and a bracket, the bracket includes a first support portion and a second support portion of an integrated structure, the first support portion is provided with a first receiving space The receiving module is at least partially disposed in the first receiving space, the second supporting portion is provided with a second receiving space, and the transmitting module is at least partially disposed in the second receiving space.
The imaging module according to claim 1, wherein the imaging module includes a printed circuit board, the emission module includes a light source, and the bracket and the light source are disposed on the surface of the printed circuit board. The light source is located in the second receiving space.
The imaging module according to claim 2, wherein the second support portion is provided with a light exit hole on a side opposite to the printed circuit board, the light exit hole communicating with the second receiving space and The light sources are aligned.
The imaging module according to claim 3, wherein the emitting module includes a diffuser, and a receiving slot is opened inside the second support portion, the receiving slot and the second receiving space and the The light exit holes are in communication, the diffuser is at least partially disposed in the receiving slot, the diffuser is located on the light exit side of the light source, and the light emitted by the light source exits the light exit hole through the diffuser.
The imaging module according to claim 2, wherein the light source includes a vertical cavity surface emitting laser array, and the vertical cavity surface emitting laser array includes a plurality of vertical cavity surface emitting lasers distributed in an array.
The imaging module according to claim 2, wherein the receiving module includes a lens and an image sensor, the image sensor is located on the image side of the lens, and the image sensor is disposed on the surface of the printed circuit board And located in the first receiving space.
The imaging module according to claim 6, wherein the first support portion includes a lens holder, and the lens holder is convexly disposed on a side of the first support portion opposite to the printed circuit board, The lens holder is provided with a receiving cavity, the first supporting portion is provided with a through hole, the through hole communicates with the first receiving space and the receiving cavity, and the lens is provided in the receiving cavity.
The imaging module according to claim 7, wherein the receiving module further includes an optical filter, and a device slot is opened inside the first support portion, and the device slot and the first receiving space and The through holes communicate with each other, and the filter is at least partially disposed in the device groove and is located between the lens and the image sensor.
The imaging module according to claim 8, wherein the planar shape of the filter is square, the planar shape of the device groove is square, and the four corners of the device groove are formed with outwardly extending Semicircular groove.
The imaging module according to claim 2, wherein the imaging module includes a flexible circuit board, and the flexible circuit board is connected to the printed circuit board.
An electronic device is characterized by comprising an imaging module. The imaging module includes a receiving module, a transmitting module and a bracket. The bracket includes an integrally structured first support portion and a second support portion. A supporting portion is provided with a first receiving space, the receiving module is at least partially disposed in the first receiving space, the second supporting portion is provided with a second receiving space, and the transmitting module is at least partially disposed in The second receiving space.
The electronic device according to claim 11, wherein the imaging module includes a printed circuit board, the emission module includes a light source, the bracket and the light source are disposed on the surface of the printed circuit board, the The light source is located in the second receiving space.
The electronic device according to claim 12, wherein a light exit hole is opened on a side of the second support portion opposite to the printed circuit board, the light exit hole communicates with the second receiving space and The light source is aligned.
The electronic device according to claim 13, wherein the emitting module includes a diffuser, and an accommodation slot is opened inside the second support portion, the accommodation slot and the second accommodation space and the light exit The holes communicate with each other, the diffuser is at least partially disposed in the receiving slot, the diffuser is located on the light exit side of the light source, and the light emitted by the light source exits the light exit hole through the diffuser.
The electronic device according to claim 12, wherein the light source includes a vertical cavity surface emitting laser array, and the vertical cavity surface emitting laser array includes a plurality of vertical cavity surface emitting lasers distributed in an array.
The electronic device according to claim 12, wherein the receiving module includes a lens and an image sensor, the image sensor is located on an image side of the lens, the image sensor is disposed on the surface of the printed circuit board and Located in the first receiving space.
The electronic device according to claim 16, wherein the first support portion includes a lens holder, and the lens holder is convexly disposed on a side of the first support portion opposite to the printed circuit board, so The lens holder is provided with a receiving cavity, the first support portion is provided with a through hole, the through hole communicates with the first receiving space and the receiving cavity, and the lens is provided in the receiving cavity.
The electronic device according to claim 17, wherein the receiving module further comprises an optical filter, and a device slot is opened inside the first support portion, and the device slot and the first receiving space and The through hole communicates, and the optical filter is at least partially disposed in the device groove and between the lens and the image sensor.
The electronic device according to claim 18, wherein the planar shape of the filter is square, the planar shape of the device groove is square, and four corners of the device groove are formed with semicircles extending outward groove.
The electronic device according to claim 12, wherein the imaging module includes a flexible circuit board, and the flexible circuit board is connected to the printed circuit board.