WO2020063486A1 - 触控膜及其制作方法和触控模组 - Google Patents
触控膜及其制作方法和触控模组 Download PDFInfo
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- WO2020063486A1 WO2020063486A1 PCT/CN2019/107070 CN2019107070W WO2020063486A1 WO 2020063486 A1 WO2020063486 A1 WO 2020063486A1 CN 2019107070 W CN2019107070 W CN 2019107070W WO 2020063486 A1 WO2020063486 A1 WO 2020063486A1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- the present disclosure relates to the field of touch technology, and in particular, to a touch film, a manufacturing method thereof, and a touch module.
- a design in which a highly conductive material such as silver glue is in contact with the conductive layer is required.
- the contact between the lead such as silver glue and the conductive layer is achieved by overlapping the lead on the edge of the conductive layer, as shown in FIG. 1.
- the reliability of the contact between the lead in the lap area and the conductive layer will directly affect the touch performance of the product.
- a touch film includes a substrate, a first functional layer, a second functional layer, and a bonding layer; the first functional layer and the second functional layer are disposed on a side surface of the substrate, The first functional layer is partially overlapped with the second functional layer, and the overlapped portion forms an overlapped structure; the bonding layer is laminated on the first functional layer and the second functional layer.
- the bonding layer is not in direct contact with the overlapping structure
- a portion of the bonding layer corresponding to the overlapped structure is separated from a portion corresponding to the overlapped structure.
- the bonding layer corresponds to a partial hollow of the overlap structure
- a portion of the bonding layer corresponding to the overlapped structure is separated from a portion corresponding to the overlapped structure by a gap.
- the bonding layer is bonded to the first functional layer and the second functional layer.
- the first functional layer is a patterned conductive film sensing layer
- the second functional layer is a patterned electrode lead layer corresponding to the first functional layer.
- the second functional layer is located above the first functional layer in the structure.
- the second functional layer is a conductive adhesive layer.
- a method for manufacturing a touch film includes the following steps:
- the first functional layer and the second functional layer partially overlapping each other, and the overlapping portion forms an overlapped structure
- a portion of the bonding layer corresponding to the overlapped structure is separated from a portion corresponding to the overlapped structure.
- the method before setting a bonding layer on the first functional layer and the second functional layer, the method further includes the following steps:
- a spacer layer is provided on a bonding layer without a release protective layer to correspond to a predetermined area of the overlapping structure, or a bonding layer having a release protective layer is used to correspond to the overlapping
- the release protective layer of the part other than the structure is removed, the release protective layer corresponding to the overlapped structure is retained as a spacer layer, and a side of the adhesion layer having the spacer layer is adhered to the On the first functional layer and the second functional layer; or
- the portion of the film material corresponding to the overlap structure is bonded to the first functional layer and the second layer. Above the functional layer.
- a touch module includes the touch film according to any one of the above embodiments, wherein the first functional layer is a conductive film sensing layer, and the second functional layer is an electrode lead layer.
- the bonding layer provided on the first functional layer and the second functional layer is not in direct contact with the bonding structure, or a portion of the bonding layer corresponding to the bonding structure and corresponding to the bonding structure The other parts are separated. In this way, when the part of the bonding layer corresponding to the overlap structure is expanded or deformed, the overlap structure will not be pulled, and the effect of releasing the shrinkage stress or deformation stress is released, which is beneficial to Improve contact stability and reliability in the overlap structure area.
- the touch film can be used in a film layer bonding product with a lap structure, which can eliminate the influence of the lap layer on the connection stability of the lap structure, which is beneficial to ensuring the performance of the product and improving the yield of the product.
- the touch film can be specifically used in, but not limited to, the field of touch screens, especially in a touch module in which a conductive paste such as silver glue forms an electrode lead, especially in a touch module with a conductive film sensing layer of a nano-silver film, It can improve the resistance stability of the overlap area and avoid floating changes caused by external forces.
- the manufacturing method of the touch film only needs to adjust the structural design of the bonding layer, and does not need to change the manufacturing and molding processes of the first functional layer, the second functional layer and the substrate, and does not need to add extra materials such as ink, so the material cost can be basically Maintain the original level.
- the entire production method is simple and easy to implement and can be widely used.
- FIG. 1 is a schematic diagram of a lap structure of a silver paste and a conductive film layer
- FIG. 2 is a cross-sectional view of the overlapping structure shown in FIG. 1 after the OCA optical glue is applied;
- FIG. 3 is a schematic structural diagram of a touch film according to an embodiment of the present disclosure.
- FIG. 4 is a schematic structural diagram of a touch film according to another embodiment of the present disclosure.
- FIG. 5 is a schematic structural diagram of a touch film according to another embodiment of the present disclosure.
- the present disclosure provides a touch film including a substrate, a first functional layer, a second functional layer, and a bonding layer.
- the first functional layer and the second functional layer are disposed on one surface of the substrate.
- the first functional layer and the second functional layer partially overlap each other, and the overlapped portion forms an overlapped structure.
- the bonding layer is bonded on the first functional layer and the second functional layer. The portion of the bonding layer corresponding to the overlapped structure does not pull on the overlapped structure during expansion and deformation.
- portions of the bonding layer corresponding to the structure other than the bonding structure will not be directly or indirectly (as shown by the bonding layer corresponding to the bonding structure shown in FIG. 2). Part) forms a traction effect on the overlap structure, so that the overlap extension and retraction force or extension stress of the portion of the overlap layer corresponding to the portion other than the overlap structure will not affect the overlap structure.
- the part of the bonding layer that does not correspond to the overlapped structure does not pull on the overlapped structure when it is stretched or deformed.
- the bonding layer can be indirectly contacted with the overlapped structure, such as release contact.
- the part corresponding to the overlapped structure of the bonding layer is separated from the part corresponding to the overlapped structure.
- the spacer layer is preferably a release layer, such as a release film, which does not have adhesive force with the bonding layer and the overlap structure on both sides.
- the touch film 300 includes a substrate 310, a first functional layer 320, a second functional layer 330, and a bonding layer 340.
- the substrate 310 may be, but is not limited to, a film substrate such as PET.
- the first functional layer 320 is a conductive film sensing layer, such as, but not limited to, an ITO layer and a nano-silver layer.
- the second functional layer 330 is an electrode lead layer, such as a conductive adhesive layer of various highly conductive materials such as but not limited to a silver adhesive layer.
- the first functional layer 320 and the second functional layer 330 are disposed on the substrate 310, and the first functional layer 320 and the second functional layer 330 partially overlap, and the overlapped portion forms an overlapped structure 350. In the overlapped structure 350, the second functional layer 330 is located above the first functional layer 320.
- the bonding layer 340 is disposed on the first functional layer 320 and the second functional layer 330 as a whole.
- the bonding layer 340 in this embodiment is a double-sided adhesive layer, such as, but not limited to, an OCA optical adhesive layer.
- the bonding layer 340 is directly bonded to portions of the first functional layer 320 and the second functional layer 330 other than the overlapping structure.
- a spacer layer 360 is provided between the bonding layer 340 and the overlapping structure 350.
- the spacer layer 360 may be a release film residue on the original double-sided adhesive layer, or may be a release layer covering the area as required.
- the spacer layer 360 separates the bonding layer 340 from the bonding structure 350, so that the bonding layer 340 is not directly or indirectly bonded to the bonding structure 350, so the bonding layers 340 of other parts will not affect the bonding structure 350.
- the direct or indirect adhesive force ensures that the portion of the bonding layer 340 corresponding to the portion other than the overlapped structure 350 does not pull on the overlapped structure 350 during expansion and deformation.
- the bonding layer 340 is not directly bonded to the second functional layer 330, so that the effect of releasing the stretching force can be achieved, and the overlapping structure 350 is protected from the influence of the bonding layer 340. Improve the stability and reliability of the overlap.
- the touch film 400 includes a substrate 410, a first functional layer 420, a second functional layer 430, and a bonding layer 440.
- the substrate 410 may be, but is not limited to, a film substrate such as PET.
- the first functional layer 420 is a conductive film sensing layer, such as, but not limited to, an ITO layer and a nano-silver layer.
- the second functional layer 430 is an electrode lead layer.
- the second functional layer 430 can be, but is not limited to, a conductive adhesive layer of various highly conductive materials such as a silver adhesive layer.
- the first functional layer 420 and the second functional layer 430 are disposed on the substrate 410, and the first functional layer 420 and the second functional layer 430 partially overlap, and the overlapped portion forms an overlapped structure 450. In the overlap structure 450, the second functional layer 430 is located above the first functional layer 420.
- the bonding layer 440 is disposed on the first functional layer 420 and the second functional layer 430 as a whole.
- the bonding layer 440 in this embodiment is a double-sided adhesive layer, such as, but not limited to, an OCA optical adhesive layer.
- the bonding layer 440 is directly adhered to portions of the first functional layer 420 and the second functional layer 430 other than the overlapping structure.
- the bonding layer 440 corresponds to a part of the overlapped structure 450, that is, there is no corresponding bonding layer 440 on the overlapped structure 450, and the bonding layer 440 is only except for the overlapped structure 450.
- the part is bonded to the first functional layer 420 and the second functional layer 430.
- the bonding layer 440 corresponding to the portion other than the overlapping structure 450 will not form a pull on the bonding structure 450, and it is ensured that the portion of the bonding layer 440 corresponding to the portion other than the overlapping structure 450 is expanded or deformed There is no pull on the overlap structure 450.
- the bonding layer 440 is cut out to form a hollow structure. This can release the effect of the stretching force of the bonding, protect the overlapping structure 450 from the influence of the bonding layer 440, and improve the bonding performance. Stability and reliability.
- the touch film 500 includes a substrate 510, a first functional layer 520, a second functional layer 530, and a bonding layer 540.
- the substrate 510 may be, but is not limited to, a film substrate such as PET.
- the first functional layer 520 is a conductive film sensing layer, such as, but not limited to, an ITO layer and a nano-silver layer.
- the second functional layer 530 is an electrode lead layer, and may be, but is not limited to, a conductive adhesive layer of various highly conductive materials such as a silver adhesive layer.
- the first functional layer 520 and the second functional layer 530 are disposed on the substrate 510, and the first functional layer 520 and the second functional layer 530 partially overlap, and the overlapped portion forms an overlapped structure 550. In the overlapped structure 550, the second functional layer 530 is located above the first functional layer 520.
- the bonding layer 540 is disposed on the first functional layer 520 and the second functional layer 530 as a whole.
- the bonding layer 540 in this embodiment is a double-sided adhesive layer, such as, but not limited to, an OCA optical adhesive layer.
- the bonding layer 540 is directly bonded to portions of the first functional layer 520 and the second functional layer 530 except for the overlapping structure.
- a portion of the bonding layer 540 corresponding to the overlapped structure 550 is separated from a portion corresponding to the overlapped structure 550, such as being separated by a gap, but not separated by other materials.
- the gap may be a gap formed by a cutter or laser cutting.
- the bonding layer 540 other than the overlapping structure 550 does not pull on the overlapping structure 550, so as to ensure that the portion of the bonding layer 540 corresponding to the overlapping structure 550 does not overlap during expansion and deformation.
- the joining structure 550 is pulled to achieve the effect of releasing the influence of the elongation force of the joint, protect the joining structure 550 from the influence of the joining layer 540, and improve the stability and reliability of the joining.
- the touch film is not limited to that shown in FIG. 3, FIG. 4 and FIG. 5, as long as the portion of the bonding layer corresponding to the overlap structure does not overlap when it is expanded or deformed.
- the structure can be pulled.
- the first functional layer is not limited to the conductive film sensing layer
- the second functional layer is not limited to the electrode lead layer of the conductive adhesive layer or the electrode lead layer
- the bonding layer is not limited to the double-sided adhesive layer.
- the layer may be bonded to the first functional layer and the second functional layer or may be attached by electrostatic force or the like.
- the present disclosure also provides a method for manufacturing a touch film, which includes the following steps:
- Step 1 Provide or make a substrate with a first functional layer and a second functional layer on the surface, the first functional layer and the second functional layer partially overlap, and the overlapped portion forms an overlapping structure;
- Step 2 Setting a bonding layer on the first functional layer and the second functional layer.
- step two in the process of setting the bonding layer:
- the portion of the bonding layer corresponding to the overlapped structure is separated from the portion corresponding to the overlapped structure.
- step two before setting a bonding layer on the first functional layer and the second functional layer, the method further includes the following steps:
- a spacer layer is provided on a bonding layer without a release protective layer to correspond to a predetermined area of the overlap structure, or a bonding layer having a release protective layer is used to correspond to a layer other than the overlap structure. Part of the release protective layer is removed, and the release protective layer corresponding to the overlapped structure is reserved as the spacer layer, and the side of the adhesive layer with the spacer layer is laminated on the first functional layer and the second functional layer; or
- the part After separating the part corresponding to the overlapped structure from the part corresponding to the overlapped structure on the film material of the bonding layer, the part is bonded to the first functional layer and the second functional layer.
- Removal of the corresponding structural area can be performed using, but not limited to, laser and other processes.
- the bonding layer provided on the first functional layer and the second functional layer is not in direct contact with the bonding structure, or a portion of the bonding layer corresponding to the bonding structure and corresponding to the bonding structure The other parts are separated. In this way, when the part of the bonding layer corresponding to the overlap structure is expanded or deformed, the overlap structure will not be pulled, and the effect of releasing the shrinkage stress or deformation stress is released, which is beneficial to Improve contact stability and reliability in the overlap structure area.
- the touch film can be used in a film layer bonding product with a lap structure, which can eliminate the influence of the lap layer on the connection stability of the lap structure, which is beneficial to ensuring the performance of the product and improving the yield of the product.
- the touch film can be specifically used in, but not limited to, the field of touch screens, especially in a touch module in which a conductive paste such as silver glue forms an electrode lead, especially in a touch module with a conductive film sensing layer of a nano-silver film,
- a touch module includes the above-mentioned touch film, wherein the first functional layer is a conductive film sensing layer, and the second functional layer is an electrode lead layer.
- the touch module with the above structure can improve the resistance stability of the overlapped area and avoid floating changes due to external force.
- it since there is no need to change the original design such as the size and shape of the overlap structure, it can provide good technical support for touch screen products with narrow bezels, especially touch screen products with large size (such as not less than 15.6-inches) and narrow bezels.
- the manufacturing method of the touch film only needs to adjust the structural design of the bonding layer, and does not need to change the manufacturing and molding processes of the first functional layer, the second functional layer and the substrate, and does not need to add extra materials such as ink, so the material cost can be basically Maintain the original level.
- the entire production method is simple and easy to implement and can be widely used.
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Abstract
本公开涉及一种触控膜及其制作方法和触控模组。在该触控膜中，设于第一功能层及第二功能层之上的贴合层与搭接结构非直接接触，或者贴合层的对应于搭接结构的部分与对应于搭接结构之外的部分分离，，这样贴合层的对应于搭接结构之外的部分伸缩、形变时就不会对搭接结构形成拉扯，达到释放贴合回缩应力或形变应力影响的作用，有利于提高搭接结构区域的接触稳定性和可靠性。该触控膜可用于具有搭接结构的膜层贴合产品中，可以消除贴合层对搭接结构的连接稳定性的影响，有利于保证产品的性能，提高产品的良率。
Description
本公开以2018年9月29日递交的、申请号为201811152606.1且名称为“触控膜及其制作方法和触控模组”的专利文件为优先权文件，其全部内容通过引用结合在本公开中。
本公开涉及触控技术领域，尤其是涉及一种触控膜及其制作方法和触控模组。
目前在银浆工艺中，尤其是在薄膜导电层搭配银胶工艺中，需要用到银胶等高导电性材料与导电层接触导通的设计。银胶等引线与导电层接触导通是通过在导电层的边缘搭接引线实现的，如图1所示。搭接区域引线与导电层接触的可靠性会直接影响产品的触控性能。然而，如图2所示，对于OCA(Optically Clear Adhesive)光学胶贴合的方案设计，由于OCA光学胶粘力强、伸缩性大以及在贴合过程中的受热等温变条件影响，贴合时对搭接区域的引线会有应力的释放，产生拉拔作用，这样极易导致搭接区域引线与导电层的接触受损，导致产生较高的搭接阻抗，影响触控性能。
发明内容
基于此，有必要提供一种能够提高搭接区域连接稳定性和可靠性的触控膜及其制作方法和触控模组。
一种触控膜，包括基材、第一功能层、第二功能层和贴合层；所述第一功能层及所述第二功能层设于所述基材的一侧表面之上，所述第一功能层与所述第二功能层部分重叠，该重叠的部分形成搭接结构；所述贴合层贴合于所述第一功能层及所述第二功能层之上。
在其中一个实施例中，所述贴合层与所述搭接结构非直接接触；或者
所述贴合层的对应于所述搭接结构的部分与对应于所述搭接结构之外的部分分离。
在其中一个实施例中，所述贴合层与所述搭接结构之间具有间隔层；或者
所述贴合层对应于所述搭接结构的部分镂空；或者
所述贴合层对应于所述搭接结构的部分与对应于所述搭接结构之外的部分由空隙隔开。
在其中一个实施例中，所述贴合层与所述第一功能层及所述第二功能层粘接。
在其中一个实施例中，所述第一功能层为图案化的导电膜感应层，所述第二功能层为与所述第一功能层对应的图案化的电极引线层，在所述搭接结构中所述第二功能层位于所述第一功能层之上。
在其中一个实施例中，所述第二功能层为导电胶层。
一种触控膜的制作方法，包括如下步骤：
提供或制作表面设有第一功能层和第二功能层的基材，所述第一功能层与所述第二功能层部分重叠，该重叠的部分形成搭接结构；
在所述第一功能层和所述第二功能层之上设置贴合层
在其中一个实施例中，在设置所述贴合层的过程中：
将所述贴合层与所述搭接结构非直接接触；或者
将所述贴合层的对应于所述搭接结构的部分与对应于所述搭接结构之外的部分分离。
在其中一个实施例中，在所述第一功能层和所述第二功能层之上设置贴合层之前，还包括步骤：
在不具有离型保护层的贴合层上用于对应于所述搭接结构的预设区域覆上间隔层，或者将具有离型保护层的贴合层上用于对应于所述搭接结构之外的部分的离型保护层去除，保留用于对应于所述搭接结构的离型保护层作为间隔层，将所述贴合层的具有所述间隔层的一面贴合在所述第一功能层和所述第二功能层之上；或者
将贴合层的膜材上用于对应于所述搭接结构的预设区域去除以形成镂空结构，将形成的具有所述镂空结构的贴合层贴合在所述第一功能层和所述第二功能层之上；或者
将贴合层的膜材上用于对应于所述搭接结构的部分与用于对应于所述搭接结构之外的部分分离后，贴合在所述第一功能层和所述第二功能层之上。
一种触控模组，包括上述任一实施例所述的触控膜，其中，所述第一功能层为导电膜感应层，所述第二功能层为电极引线层。
在上述触控膜中，设于第一功能层及第二功能层之上的贴合层与搭接结构非直接接触，或者贴合层的对应于搭接结构的部分与对应于搭接结构之外的部分分离，这样贴合层的对应于搭接结构之外的部分伸缩、形变时就不会对搭接结构形成拉扯，达到释放贴合回缩应力或形变应力影响的作用，有利于提高搭接结构区域的接触稳定性和可靠性。
该触控膜可用于具有搭接结构的膜层贴合产品中，可以消除贴合层对搭接结构的连接稳定性的影响，有利于保证产品的性能，提高产品的良率。 该触控膜可具体用于但不限于触摸屏领域，尤其是银胶等导电胶形成电极引线的触控模组中，特别是搭配纳米银膜材的导电膜感应层的触控模组中，可提高搭接区域的电阻稳定性，避免受外力作用产生浮动性变化。并且，由于不需要更改搭接结构的尺寸、形状等原有设计，可以为窄边框的触摸屏产品，尤其是大尺寸(如不小于15.6英寸)、窄边框的触摸屏产品提供良好的技术支持。
该触控膜的制作方法只需要调整贴合层的结构设计，无需更改第一功能层、第二功能层与基材的制作和成型工艺，无需增加多余的油墨等材料，因而物料成本可以基本维持原有水平。整个制作方法简单易行，可广泛推广使用。
构成本申请的一部分的说明书附图用来提供对本申请的进一步理解，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1为银胶与导电膜层的搭接结构示意图；
图2为图1所示搭接结构贴合上OCA光学胶后的剖视图；
图3为本公开一实施例的触控膜的结构示意图；
图4为本公开其他实施例的触控膜的结构示意图；
图5为本公开其他实施例的触控膜的结构示意图。
为了便于理解本公开，下面将参照相关附图对本公开进行更全面的描述。附图中给出了本公开的较佳实施例。但是，本公开可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本公开的公开内容的理解更加透彻全面。
需要说明的是，当元件被称为“设于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本公开的技术领域的技术人员通常理解的含义相同。本文中在本公开的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本公开。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
本公开提供了一种触控膜，包括基材、第一功能层、第二功能层和贴合层。第一功能层及第二功能层设于基材的一侧表面之上，第一功能层与第二功能层部分重叠，该重叠的部分形成搭接结构。贴合层贴合于第一功能层及第二功能层之上。贴合层的对应于搭接结构之外的部分在伸缩、形变时不会对搭接结构形成拉扯。
本公开的触控膜在贴合时或者贴合之后，贴合层的对应于搭接结构之外的部分不会直接或间接(如通过图2所示的对应于搭接结构的贴合层部分)对搭接结构形成牵拉作用，因而贴合层的对应于搭接结构之外的部分的贴合延展回缩力或延展应力不会影响到搭接结构。
在一个具体示例中，贴合层的对应于搭接结构之外的部分在伸缩、形变时不会对搭接结构形成拉扯可以通过将贴合层与搭接结构非直接接触，如离型接触，或者将贴合层的对应于搭接结构的部分与对应于搭接结构之外的部分分离来实现。
更具体的，贴合层与搭接结构之间具有间隔层，或者贴合层对应于搭接结构的部分镂空，或者贴合层对应于搭接结构的部分与对应于搭接结构之外的部分由空隙隔开。间隔层优选为离型层，如离型膜等，其与两侧的贴合层和搭接结构之间不具有粘接力。
以下结合图3、图4和图5对本公开的触控膜进行进一步详细的说明。
如图3所示，该触控膜300包括基材310、第一功能层320、第二功能层330以及贴合层340。
基材310可以是但不限于PET等薄膜基材。
第一功能层320为导电膜感应层，如可以是但不限于ITO层、纳米银层等。第二功能层330为电极引线层，如可以是但不限于银胶层等各类高导电材料的导电胶层。第一功能层320与第二功能层330设在基材310上，且第一功能层320与第二功能层330部分交叠，该交叠的部分形成搭接结构350。在搭接结构350中，第二功能层330位于第一功能层320之上。
贴合层340整体设在第一功能层320与第二功能层330之上。本实施例的贴合层340为双面胶层，如可以是但不限于OCA光学胶层。贴合层340与第一功能层320及第二功能层330的除搭接结构之外的部分直接粘接。
在本实施例中，贴合层340与搭接结构350之间具有间隔层360。间隔层360可以是原双面胶层上的离型膜残留，也可以是根据需要覆盖在该区域的离型层。间隔层360将贴合层340与搭接结构350间隔开，使贴合层340不直接或间接与搭接结构350粘接，因而其他部分的贴合层340也不会对搭接结构350有直接或间接的粘接力，保证贴合层340的对应于搭接结构350之外的部分在伸缩、形变时不会对搭接结构350形成拉扯。
在搭接结构350的区域，将贴合层340不与第二功能层330直接粘接，这样可以达到释放贴合延展力影响的作用，保护搭接结构350不受贴合层340的影响，提高搭接的稳定性和可靠性。
如图4所示，该触控膜400包括基材410、第一功能层420、第二功能层430以及贴合层440。
基材410可以是但不限于PET等薄膜基材。
第一功能层420为导电膜感应层，如可以是但不限于ITO层、纳米银层等。第二功能层430为电极引线层，如可以是但不限于银胶层等各类高导电材料的导电胶层。第一功能层420与第二功能层430设在基材410上，且第一功能层420与第二功能层430部分交叠，该交叠的部分形成搭接结构450。在搭接结构450中，第二功能层430位于第一功能层420之上。
贴合层440整体设在第一功能层420与第二功能层430之上。本实施例的贴合层440为双面胶层，如可以是但不限于OCA光学胶层。贴合层440与第一功能层420及第二功能层430的除搭接结构之外的部分直接粘接。
在本实施例中，贴合层440对应于搭接结构450的部分镂空，也即在搭接结构450之上没有对应的贴合层440，贴合层440只在除搭接结构450之外的部分与第一功能层420与第二功能层430粘接。这样，对应于除搭接结构450之外的部分的贴合层440也不会对搭接结构450形成拉扯，保证贴合层440的对应于搭接结构450之外的部分在伸缩、形变时不会对搭接结构450形成拉扯。
在对应于搭接结构450的区域，将贴合层440切除形成镂空结构，这样可以达到释放贴合延展力影响的作用，保护搭接结构450不受贴合层440的影响，提高搭接的稳定性和可靠性。
如图5所示，该触控膜500包括基材510、第一功能层520、第二功能层530以及贴合层540。
基材510可以是但不限于PET等薄膜基材。
第一功能层520为导电膜感应层，如可以是但不限于ITO层、纳米银层等。第二功能层530为电极引线层，如可以是但不限于银胶层等各类高导电材料的导电胶层。第一功能层520与第二功能层530设在基材510上，且第一功能层520与第二功能层530部分交叠，该交叠的部分形成搭接结构550。在搭接结构550中，第二功能层530位于第一功能层520之上。
贴合层540整体设在第一功能层520与第二功能层530之上。本实施例的贴合层540为双面胶层，如可以是但不限于OCA光学胶层。贴合层540与第一功能层520及第二功能层530的除搭接结构之外的部分直接粘接。
在本实施例中，贴合层540对应于搭接结构550的部分与对应于搭接结构550之外的部分分离，如可以通过但不限于空隙隔开、或经由其他材料隔开。所述空隙可以是切刀或激光切割形成的空隙。通过将贴合层540对应于搭接结构550的部分与对应于搭接结构550之外的部分分开，即使贴合层540对应于搭接结构550的部分与搭接结构550粘接，对应于除搭接结构550之外的部分的贴合层540也不会对搭接结构550形成拉扯，保证贴合层540的对应于搭接结构550之外的部分在伸缩、形变时不会对搭接结构550形成拉扯，可以达到释放贴合延展力影响的作用，保护搭接结构550不受贴合层540的影响，提高搭接的稳定性和可靠性。
可理解，在其他具体示例中，该触控膜不限于图3、图4和图5所示，只要贴合层的对应于搭接结构之外的部分在伸缩、形变时不会对搭接结构形成拉扯即可。相应地，第一功能层也不限于导电膜感应层，第二功能层也不限于导电胶层的电极引线层或者也不限于电极引线层，贴合层也不限于双面胶层，贴合层与第一功能层和第二功能层可以粘接或者通过静电力等贴接。
本公开还提供了一种触控膜的制作方法，其包括如下步骤：
步骤一：提供或制作表面设有第一功能层和第二功能层的基材，第一功能层与第二功能层部分重叠，该重叠的部分形成搭接结构；
步骤二：在第一功能层和第二功能层之上设置贴合层。
在步骤二中，在设置贴合层的过程中：
将贴合层与搭接结构非直接接触；或者
将贴合层的对应于搭接结构的部分与对应于搭接结构之外的部分分离。
具体地，在步骤二中，在第一功能层和第二功能层之上设置贴合层之前，还包括步骤：
在不具有离型保护层的贴合层上用于对应于搭接结构的预设区域覆上间隔层，或者将具有离型保护层的贴合层上用于对应于搭接结构之外的部分的离型保护层去除，保留用于对应于搭接结构的离型保护层作为间隔层，将贴合层的具有间隔层的一面贴合在第一功能层和第二功能层之上；或者
将贴合层的膜材上用于对应于搭接结构的预设区域去除以形成镂空结构，将形成的具有镂空结构的贴合层贴合在第一功能层和第二功能层之上；或者
将贴合层的膜材上用于对应于搭接结构的部分与用于对应于搭接结构之外的部分分离后，贴合在第一功能层和第二功能层之上。
去除相应的结构区域可以使用但不限于激光镭射等工艺进行。
在上述触控膜中，设于第一功能层及第二功能层之上的贴合层与搭接结构非直接接触，或者贴合层的对应于搭接结构的部分与对应于搭接结构之外的部分分离，这样贴合层的对应于搭接结构之外的部分伸缩、形变时就不会对搭接结构形成拉扯，达到释放贴合回缩应力或形变应力影响的作用，有利于提高搭接结构区域的接触稳定性和可靠性。
该触控膜可用于具有搭接结构的膜层贴合产品中，可以消除贴合层对搭接结构的连接稳定性的影响，有利于保证产品的性能，提高产品的良率。该触控膜可具体用于但不限于触摸屏领域，尤其是银胶等导电胶形成电极引线的触控模组中，特别是搭配纳米银膜材的导电膜感应层的触控模组中，如一种触控模组，其包括上述触控膜，其中，第一功能层为导电膜感应层，第二功能层为电极引线层。具有上述结构的触控模组可提高搭接区域的电阻稳定性，避免受外力作用产生浮动性变化。并且，由于不需要更改搭接结构的尺寸、形状等原有设计，可以为窄边框的触摸屏产品，尤其是大尺寸(如不小于15.6英寸)、窄边框的触摸屏产品提供良好的技术支持。
该触控膜的制作方法只需要调整贴合层的结构设计，无需更改第一功能层、第二功能层与基材的制作和成型工艺，无需增加多余的油墨等材料，因而物料成本可以基本维持原有水平。整个制作方法简单易行，可广泛推广使用。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本公开的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本公开构思的前提下，还可以做出若干变形和改进，这些都属于本公开的保护范围。因此，本公开专利的保护范围应以所附权利要求为准。
Claims (10)
- 一种触控膜，其特征在于，包括基材、第一功能层、第二功能层和贴合层；所述第一功能层及所述第二功能层设于所述基材的一侧表面之上，所述第一功能层与所述第二功能层部分重叠，该重叠的部分形成搭接结构；所述贴合层贴合于所述第一功能层及所述第二功能层之上。
- 如权利要求1所述的触控膜，其特征在于，所述贴合层与所述搭接结构非直接接触；或者所述贴合层的对应于所述搭接结构的部分与对应于所述搭接结构之外的部分分离。
- 如权利要求1所述的触控膜，其特征在于，所述贴合层与所述搭接结构之间具有间隔层；或者所述贴合层对应于所述搭接结构的部分镂空；或者所述贴合层对应于所述搭接结构的部分与对应于所述搭接结构之外的部分由空隙隔开。
- 如权利要求1～3中任一项所述的触控膜，其特征在于，所述贴合层与所述第一功能层及所述第二功能层粘接。
- 如权利要求1～3中任一项所述的触控膜，其特征在于，所述第一功能层为图案化的导电膜感应层，所述第二功能层为与所述第一功能层对应的图案化的电极引线层，在所述搭接结构中所述第二功能层位于所述第一功能层之上。
- 如权利要求5所述的触控膜，其特征在于，所述第二功能层为导电胶层。
- 一种触控膜的制作方法，其特征在于，包括如下步骤：提供或制作表面设有第一功能层和第二功能层的基材，所述第一功能层与所述第二功能层部分重叠，该重叠的部分形成搭接结构；在所述第一功能层和所述第二功能层之上设置贴合层。
- 如权利要求7所述的触控膜的制作方法，其特征在于，在设置所述贴合层的过程中：将所述贴合层与所述搭接结构非直接接触；或者将所述贴合层的对应于所述搭接结构的部分与对应于所述搭接结构之外的部分分离。
- 如权利要求7所述的触控膜的制作方法，其特征在于，在所述第一功能层和所述第二功能层之上设置贴合层之前，还包括步骤：在不具有离型保护层的贴合层上用于对应于所述搭接结构的预设区域覆上间隔层，或者将具有离型保护层的贴合层上用于对应于所述搭接结构之外的部分的离型保护层去除，保留用于对应于所述搭接结构的离型保 护层作为间隔层，将所述贴合层的具有所述间隔层的一面贴合在所述第一功能层和所述第二功能层之上；或者将贴合层的膜材上用于对应于所述搭接结构的预设区域去除以形成镂空结构，将形成的具有所述镂空结构的贴合层贴合在所述第一功能层和所述第二功能层之上；或者将贴合层的膜材上用于对应于所述搭接结构的部分与用于对应于所述搭接结构之外的部分分离后，贴合在所述第一功能层和所述第二功能层之上。
- 一种触控模组，其特征在于，包括如权利要求1～6中任一项所述的触控膜，其中，所述第一功能层为导电膜感应层，所述第二功能层为电极引线层。
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| CN109254690A (zh) * | 2018-09-29 | 2019-01-22 | 广州视睿电子科技有限公司 | 触控膜及其制作方法和触控模组 |
| CN208954065U (zh) * | 2018-09-29 | 2019-06-07 | 广州视睿电子科技有限公司 | 触控膜、触控模组和触控屏 |
| CN208954063U (zh) * | 2018-09-29 | 2019-06-07 | 广州视睿电子科技有限公司 | 触控膜、触控模组和触摸屏 |
| CN208954064U (zh) * | 2018-09-29 | 2019-06-07 | 广州视睿电子科技有限公司 | 触控膜、触控模组和触控显示装置 |
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| CN109254690B (zh) | 2020-11-03 |
| CN109254690A (zh) | 2019-01-22 |
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