WO2020056866A1 - 一种oled显示面板及其制备方法、蒸镀用掩膜板 - Google Patents

一种oled显示面板及其制备方法、蒸镀用掩膜板 Download PDF

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Publication number
WO2020056866A1
WO2020056866A1 PCT/CN2018/113273 CN2018113273W WO2020056866A1 WO 2020056866 A1 WO2020056866 A1 WO 2020056866A1 CN 2018113273 W CN2018113273 W CN 2018113273W WO 2020056866 A1 WO2020056866 A1 WO 2020056866A1
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organic light
barrier film
transmittance
different
pixel
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French (fr)
Inventor
张涛
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present application relates to the field of display manufacturing technology, and in particular, to an OLED display panel, a method for manufacturing the same, and a mask for vapor deposition.
  • the present application provides an OLED display panel, a preparation method thereof, and a masking plate for evaporation, which can reduce the edge shadow effect and ensure the uniformity of the display.
  • the present application provides a mask for evaporation, including:
  • the opening corresponds to a plurality of coating areas
  • the shielding portion corresponds to a non-coated area other than the plurality of coated areas
  • the blocking film is correspondingly disposed at the position of the opening portion and is fixed on the blocking portion;
  • the barrier film is used to control the transmittance of the film material, and the transmittance is different in different regions of the barrier film.
  • the transmittance in the edge region of the barrier film is higher than the transmittance in the center region.
  • one of the openings corresponds to one of the barrier films, and an area of the barrier film is greater than or equal to an area of the openings.
  • the barrier film is attached to a first surface or a second surface of the shield portion, and the barrier film includes at least a plurality of barrier regions corresponding to the opening portion, And the transmittance of different blocking regions is different; or, the transmittance of different positions in each of the blocking regions is different.
  • the shielding portion is provided with a buckle for fixing the barrier film, and the buckle is used for fixing the barrier film having different transmittances.
  • the present application further provides a method for preparing an OLED display panel by using the above mask for evaporation, the method includes the following steps:
  • Step S10 providing an array substrate to be prepared with an organic light-emitting layer, the array substrate is formed with a pixel opening area, the mask plate is placed above the array substrate, and the opening portion corresponds to the pixel opening area , The blocking portion blocks a portion corresponding to between two adjacent pixel opening regions;
  • Step S20 using the mask plate as a mask to perform evaporation of an organic light emitting material
  • the organic light-emitting materials have different transmittances on the barrier films corresponding to the openings, so that the thickness of the organic light-emitting layer formed is uniform.
  • the transmittance of the organic light-emitting material in an edge region around the barrier film is higher than that in a central region.
  • a transmittance of the organic light emitting material at an edge portion of the barrier region of the barrier film is higher than a transmittance of a central portion.
  • step S30 the method further includes the following steps:
  • step S40 a cathode layer is prepared on the array substrate.
  • the present application further provides an OLED display panel prepared by using the above method, including:
  • a pixel definition layer prepared on the thin film transistor layer and defining a pixel area
  • An organic light emitting layer prepared in the pixel region defined by the pixel defining layer
  • the beneficial effects of the present application are: compared with the existing OLED display panel and the mask for vapor deposition, the OLED display panel provided by the present application, a preparation method thereof, and a mask for vapor deposition are provided by Blocking films with different transmittances are added to the openings. It is preferable that the transmittance of the edge region of the corresponding openings of the blocking film is higher than that of the central region, so that the organic light-emitting material is in the center of the corresponding pixel region during the evaporation It is consistent with the deposition rate at the edge portion, so that the film thickness of the formed organic light-emitting layer is kept uniform, thereby avoiding or weakening the edge shadow effect and ensuring the uniformity of the display.
  • FIG. 1 is a schematic structural diagram of a masking plate for evaporation provided by an embodiment of the present application
  • This application is directed to the prior art OLED display panel, because the deposition rate of the luminescent material at the center and edge positions of the corresponding pixel area during the evaporation process is not consistent, resulting in uneven film thickness, which causes a shadow effect on the edge of the display panel Problem, this embodiment can solve this defect.
  • FIG. 1 it is a schematic structural diagram of a masking plate for evaporation provided in an embodiment of the present application.
  • the vapor deposition mask includes: an opening portion 10 corresponding to a plurality of coating areas; a shielding portion 11 corresponding to a plurality of non-plating areas other than the coating areas; and a barrier film 12 corresponding to the opening portions. 10, and is fixed on the shielding portion 11; wherein the blocking film 12 is used to control the transmittance of the film material, and the transmittance is different in different regions of the blocking film 12.
  • one of the openings 10 corresponds to one of the blocking films 12, and an area of the blocking film 12 is greater than or equal to an area of the openings 10.
  • the barrier film 12 may be integrated with the shielding portion 11 during the preparation of the mask plate; or, the barrier film 12 is attached to a position of the prepared mask plate corresponding to the opening portion 10.
  • the blocking film 12 has a peripheral boundary corresponding to the blocking film 12.
  • the area of the barrier film 12 may also correspond to the entire mask plate, that is, the boundary of the barrier film 12 is located at an edge position of the mask plate; the barrier film 12 may be attached to the mask plate.
  • the first surface or the second surface of the shielding portion 11, and the blocking film 12 includes at least a plurality of blocking regions corresponding to the opening portion 10, and the transmittances of the blocking regions are different from each other; or The transmittance is different at different positions in the blocking area.
  • the mask plate and the barrier film 12 may also be a separate design, that is, the mask plate is designed with the shielding portion 11 and the opening portion 10, and a buckle located on the shielding portion 11,
  • the blocking film 12 is fixed on the blocking portion 11 through the buckle to form a mask assembly.
  • the barrier film 12 can be replaced at any time, and the buckle can fix the barrier film 12 with different transmittance to meet the needs of different processes and eliminate the need for different transmittances. And the cost of remaking the mask.
  • the blocking film 12 and the blocking portion 11 can also be fixed in other ways, which is not limited here.
  • the mask is applied to the evaporation of an organic light-emitting material of an OLED display panel, wherein the transmittance of the organic light-emitting material in the edge region of the barrier film 12 is higher than that in the center region 120 Transmittance; or, the transmittance of the organic light-emitting material at the edge portion of the barrier region of the barrier film 12 is higher than the transmittance of the central portion.
  • the center region 120 and the edge region around the center region 120 each correspond to the position of the opening portion 10.
  • the deposition rate in the central portion and the edge portion of the corresponding pixel area is kept consistent, so that the film thickness of the formed organic light-emitting layer is uniform, thereby avoiding or weakening the OLED display.
  • the edge shadow effect of the panel ensures the uniformity of the display.
  • the organic light-emitting material is not blocked from different positions or directions
  • the position corresponding to the pixel region is the central region 120 / the central portion
  • the opening portion corresponds to the central region 120 / the region outside the central portion is the edge region / edge portion .
  • the present application also provides a method for preparing an OLED display panel by using the above mask for vapor deposition. As shown in FIG. 2, the method includes the following steps:
  • Step S10 providing an array substrate to be prepared with an organic light-emitting layer, the array substrate is formed with a pixel opening area, the mask plate is placed above the array substrate, and the opening portion corresponds to the pixel opening area , The blocking portion blocks a portion corresponding to between two adjacent pixel opening regions;
  • Step S20 using the mask plate as a mask to perform evaporation of an organic light emitting material
  • the blocking film or the blocking region corresponds to the pixel opening region; preferably, the transmittance of the organic light-emitting material in an edge region around the blocking film is higher than that in a central region; or The transmittance of the organic light-emitting material at the edge portion of the barrier region of the barrier film is higher than the transmittance of the central portion.
  • step S30 the organic light-emitting material evaporated to the corresponding shielding portion is shielded by the shielding portion, and the organic light-emitting material evaporated to the corresponding opening portion is evaporated to the corresponding area through the barrier film.
  • the pixel opening area forms the organic light emitting layer
  • the thickness of different portions of the organic light-emitting layer formed is uniform.
  • the method further includes the following steps:
  • step S40 a cathode layer is prepared on the array substrate.
  • the present application also provides an OLED display panel prepared by using the above method, including: a substrate substrate; a thin film transistor layer prepared on the substrate substrate; a pixel definition layer prepared on the thin film transistor layer, and defining A pixel region; an organic light emitting layer prepared in the pixel region defined by the pixel defining layer; wherein the thickness of the film layer at different positions of the organic light emitting layer is kept uniform, including the organic corresponding to one pixel region The thickness of the edge portion and the center portion of the light emitting layer is uniform.
  • the OLED display panel also includes other conventional film layers, such as a flat layer, an anode layer, a cathode layer, and a thin film encapsulation layer, which are not limited herein.
  • the OLED display panel provided in the present application, a preparation method thereof, and a mask for vapor deposition are provided with barrier films having different transmittances at the openings of the masks, preferably the transmittances of the barrier films corresponding to the edge regions of the openings.
  • the transmittance is higher than the central region, so that the deposition rate of the organic light-emitting material at the center and edge portions of the corresponding pixel region during the evaporation process is kept consistent, so that the thickness of the formed organic light-emitting layer is uniform, thereby avoiding or weakening Edge shadow effect to ensure the uniformity of the display.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED显示面板及其制备方法、蒸镀用掩膜板，蒸镀用掩膜板包括：开口部（10），对应于多个镀膜区域；遮挡部（11），对应于多个镀膜区域之外的非镀膜区域；阻挡膜（12），对应设置于开口部位置，且固定于遮挡部上；其中，阻挡膜用以控制膜材的透过率，阻挡膜的不同区域的透过率不同。

Description

一种OLED显示面板及其制备方法、蒸镀用掩膜板 技术领域
本申请涉及显示制造技术领域，尤其涉及一种OLED显示面板及其制备方法、蒸镀用掩膜板。
 背景技术
OLED工艺中，评价其性能的指标有很多，比如发光效率、响应时间、视角、制作工艺、柔性显示、器件寿命、显示不均匀性等等。其中，显示不均匀会导致色偏明显，整个发光区域的亮度不一致或者颜色有差别。
导致显示不均匀性的原因有很多，大致分为两类：一是OLED的问题；二是TFT问题。就OLED的问题而言，目前的EL材料蒸镀，采用精细金属掩模板（Fine Metal Mask，FMM）方式进行，那么就会出现上述所说的显示不均色偏问题，因为在像素的中心和边缘区域的材料厚度存在差异，导致这种差异的原因是，在对应像素的FMM开口区域，材料在中心和边缘的沉积速率不一致，造成膜厚不均，也就是通常所说的边缘阴影效应（shadow effect）。
因此，现有技术存在缺陷，急需改进。
 技术问题
本申请提供一种OLED显示面板及其制备方法、蒸镀用掩膜板，能够减弱边缘阴影效应，保证显示的均匀性。
 技术解决方案
为实现上述目的，本申请提供的技术方案如下：
本申请提供一种蒸镀用掩膜板，包括：
开口部，对应于多个镀膜区域；
遮挡部，对应于多个所述镀膜区域之外的非镀膜区域；
阻挡膜，对应设置于所述开口部位置，且固定于所述遮挡部上；
其中，所述阻挡膜用以控制膜材的透过率，所述阻挡膜的不同区域的所述透过率不同。
在本申请的蒸镀用掩膜板中，所述阻挡膜边缘区域的透过率高于中心区域的透过率。
在本申请的蒸镀用掩膜板中，一所述开口部对应一所述阻挡膜，且所述阻挡膜的面积大于等于所述开口部的面积。
在本申请的蒸镀用掩膜板中，所述阻挡膜贴附于所述遮挡部的第一表面或第二表面，且所述阻挡膜至少包括对应所述开口部的多个阻挡区域，且不同所述阻挡区域的透过率不同；或者，每个所述阻挡区域中的不同位置的透过率不同。
在本申请的蒸镀用掩膜板中，所述遮挡部上设置有用于固定所述阻挡膜的卡扣，所述卡扣用于固定具有不同透过率的所述阻挡膜。
为实现上述目的，本申请还提供一种采用上述蒸镀用掩膜板制备OLED显示面板的方法，所述方法包括以下步骤：
步骤S10，提供一待制备有机发光层的阵列基板，所述阵列基板形成有像素开口区域，将所述掩膜板置于所述阵列基板上方位置，且所述开口部对应所述像素开口区域，所述遮挡部遮挡对应相邻两所述像素开口区域之间的部分；
步骤S20，以所述掩膜板为掩膜进行有机发光材料的蒸镀；
步骤S30，蒸镀到对应所述遮挡部的所述有机发光材料由所述遮挡部遮挡，蒸镀到对应所述开口部的所述有机发光材料透过所述阻挡膜蒸镀至对应的所述像素开口区域，形成所述有机发光层；
其中，所述有机发光材料在对应所述开口部的所述阻挡膜上的透过率不同，使得形成的所述有机发光层的厚度均一。
在本申请的方法中，所述有机发光材料在所述阻挡膜四周边缘区域的透过率高于中心区域的透过率。
在本申请的方法中，所述有机发光材料在所述阻挡膜的所述阻挡区域的边缘部分的透过率高于中心部分的透过率。
在本申请的方法中，在所述步骤S30之后，所述方法还包括以下步骤：
步骤S40，在所述阵列基板上制备阴极层。
为实现上述目的，本申请还提供一种采用上述方法制备的OLED显示面板，包括：
衬底基板；
薄膜晶体管层，制备于所述衬底基板上；
像素定义层，制备于所述薄膜晶体管层上，且定义出像素区域；
有机发光层，制备于所述像素定义层定义出的所述像素区域；
其中，所述有机发光层的不同位置的膜层厚度均一。
 有益效果
本申请的有益效果为：相较于现有的OLED显示面板及其蒸镀用掩膜板，本申请提供的OLED显示面板及其制备方法、蒸镀用掩膜板，通过在掩膜板的开口部增设具有不同透过率的阻挡膜，优选为阻挡膜对应开口部边缘区域的透过率高于中心区域的透过率，使得有机发光材料在蒸镀的过程中在对应像素区域的中心和边缘部位的沉积速率保持一致，从而保持形成的有机发光层的膜厚均一，进而避免或减弱边缘阴影效应，保证显示的均匀性。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的蒸镀用掩膜板结构示意图；
图2为采用图1中的掩膜板制备OLED显示面板的方法流程图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有技术的OLED显示面板，由于发光材料在蒸镀的过程中在对应像素区域的中心和边缘位置的沉积速率不一致，而造成膜厚不均，从而引起显示面板边缘阴影效应的技术问题，本实施例能够解决该缺陷。
如图1所示，为本申请实施例提供的蒸镀用掩膜板结构示意图。该蒸镀用掩膜板包括：开口部10，对应于多个镀膜区域；遮挡部11，对应于多个所述镀膜区域之外的非镀膜区域；阻挡膜12，对应设置于所述开口部10的位置，且固定于所述遮挡部11上；其中，所述阻挡膜12用以控制膜材的透过率，所述阻挡膜12的不同区域的所述透过率不同。其中，一所述开口部10对应一所述阻挡膜12，且所述阻挡膜12的面积大于等于所述开口部10的面积。所述阻挡膜12在所述掩膜板制备的过程中可与所述遮挡部11呈一体式设计；或者，在制备好的所述掩膜板上对应所述开口部10的位置贴附所述阻挡膜12，所述阻挡膜12的四周边界对应位于所述遮挡部11上。
此外，所述阻挡膜12的面积还可以对应整张所述掩膜板，即所述阻挡膜12的边界对应位于所述掩膜板的边缘位置；所述阻挡膜12可以贴附于所述遮挡部11的第一表面或第二表面，且所述阻挡膜12至少包括对应所述开口部10的多个阻挡区域，且不同所述阻挡区域的透过率不同；或者，每个所述阻挡区域中的不同位置的透过率不同。
所述掩膜板与所述阻挡膜12还可以为分体式设计，即所述掩膜板设计有所述遮挡部11与所述开口部10，以及位于所述遮挡部11上的卡扣，所述阻挡膜12通过所述卡扣固定在所述遮挡部11上，组成掩模组件。并且根据实际制程要求，所述阻挡膜12可随时更换，所述卡扣可固定具有不同透过率的所述阻挡膜12，以满足不同制程需求，且省去了因不同透过率的需求而重新制作所述掩膜板的成本。当然，此处所述阻挡膜12与所述遮挡部11还可以采用其他方式进行固定，此处不做限定。
在一优选实施例中，所述掩膜板应用于OLED显示面板的有机发光材料的蒸镀，其中，所述有机发光材料在所述阻挡膜12边缘区域的透过率高于中心区域120的透过率；或者，所述有机发光材料在所述阻挡膜12的所述阻挡区域的边缘部分的透过率高于中心部分的透过率。其中，所述中心区域120以及所述中心区域120外围的所述边缘区域均对应所述开口部10的位置。通过此设计使得所述有机发光材料在蒸镀的过程中，在对应像素区域的中心部分和边缘部位的沉积速率保持一致，从而保持形成的有机发光层的膜厚均一，进而避免或减弱OLED显示面板的边缘阴影效应，保证显示的均匀性。
另外，对于所述阻挡膜12的所述中心区域120/所述中心部分以及所述边缘区域/边缘部分的范围的确定，优选的，以所述有机发光材料从不同位置或方向均不被遮挡而蒸镀到所述像素区域所对应位置为所述中心区域120/所述中心部分，所述开口部对应所述中心区域120/所述中心部分之外的区域为所述边缘区域/边缘部分。
本实施例对所述阻挡膜12的材料及厚度不做限定，只要能够使得蒸镀形成的膜层厚度均一即可。所述阻挡膜12的透过率可根据所述阻挡膜12的选材以及表面孔径大小等条件进行设定。
本申请还提供一种采用上述蒸镀用掩膜板制备OLED显示面板的方法，如图2所示，所述方法包括以下步骤：
步骤S10，提供一待制备有机发光层的阵列基板，所述阵列基板形成有像素开口区域，将所述掩膜板置于所述阵列基板上方位置，且所述开口部对应所述像素开口区域，所述遮挡部遮挡对应相邻两所述像素开口区域之间的部分；
可以理解的是，所述阵列基板包括在衬底基板上依次制备的薄膜晶体管层、阳极层、像素定义层等其他膜层。所述掩膜板的所述开口部对应所述像素开口区域，所述像素开口区域即对应镀膜区域，所述遮挡部即对应非镀膜区域。
步骤S20，以所述掩膜板为掩膜进行有机发光材料的蒸镀；
其中，所述阻挡膜或所述阻挡区域对应所述像素开口区域；优选的，所述有机发光材料在所述阻挡膜四周边缘区域的透过率高于中心区域的透过率；或者所述有机发光材料在所述阻挡膜的所述阻挡区域的边缘部分的透过率高于中心部分的透过率。
步骤S30，蒸镀到对应所述遮挡部的所述有机发光材料由所述遮挡部遮挡，蒸镀到对应所述开口部的所述有机发光材料透过所述阻挡膜蒸镀至对应的所述像素开口区域，形成所述有机发光层；
其中，由于所述有机发光材料在对应所述开口部的所述阻挡膜上的透过率的差异，使得形成的所述有机发光层的不同部位的厚度均一。
在所述步骤S30之后，所述方法还包括以下步骤：
步骤S40，在所述阵列基板上制备阴极层。
当然，还包括在所述阴极层上制备封装层等工艺，此处不做赘述。
本申请还提供一种采用上述方法制备的OLED显示面板，包括：衬底基板；薄膜晶体管层，制备于所述衬底基板上；像素定义层，制备于所述薄膜晶体管层上，且定义出像素区域；有机发光层，制备于所述像素定义层定义出的所述像素区域；其中，所述有机发光层的不同位置的膜层厚度保持均一，包括对应一所述像素区域的所述有机发光层的边缘部分与中心部分的厚度均一。另外，所述OLED显示面板还包括其他常规的膜层，比如平坦层、阳极层、阴极层、薄膜封装层等，此处不做限定。
本申请提供的OLED显示面板及其制备方法、蒸镀用掩膜板，通过在掩膜板的开口部增设具有不同透过率的阻挡膜，优选为阻挡膜对应开口部边缘区域的透过率高于中心区域的透过率，使得有机发光材料在蒸镀的过程中在对应像素区域的中心和边缘部位的沉积速率保持一致，从而保持形成的有机发光层的膜厚均一，进而避免或减弱边缘阴影效应，保证显示的均匀性。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (10)

  1. 一种蒸镀用掩膜板，其包括：
    开口部，对应于多个镀膜区域；
    遮挡部，对应于多个所述镀膜区域之外的非镀膜区域；
    阻挡膜，对应设置于所述开口部位置，且固定于所述遮挡部上；
    其中，所述阻挡膜用以控制膜材的透过率，所述阻挡膜的不同区域的所述透过率不同。
  2. 根据权利要求1所述的蒸镀用掩膜板，其中，所述阻挡膜边缘区域的透过率高于中心区域的透过率。
  3. 根据权利要求1所述的蒸镀用掩膜板，其中，一所述开口部对应一所述阻挡膜，且所述阻挡膜的面积大于等于所述开口部的面积。
  4. 根据权利要求1所述的蒸镀用掩膜板，其中，所述阻挡膜贴附于所述遮挡部的第一表面或第二表面，且所述阻挡膜至少包括对应所述开口部的多个阻挡区域，且不同所述阻挡区域的透过率不同；或者，每个所述阻挡区域中的不同位置的透过率不同。
  5. 根据权利要求1所述的蒸镀用掩膜板，其中，所述遮挡部上设置有用于固定所述阻挡膜的卡扣，所述卡扣用于固定具有不同透过率的所述阻挡膜。
  6. 一种采用权利要求1所述的蒸镀用掩膜板制备OLED显示面板的方法，其中，所述方法包括以下步骤：
    步骤S10，提供一待制备有机发光层的阵列基板，所述阵列基板形成有像素开口区域，将所述掩膜板置于所述阵列基板上方位置，且所述开口部对应所述像素开口区域，所述遮挡部遮挡对应相邻两所述像素开口区域之间的部分；
    步骤S20，以所述掩膜板为掩膜进行有机发光材料的蒸镀；
    步骤S30，蒸镀到对应所述遮挡部的所述有机发光材料由所述遮挡部遮挡，蒸镀到对应所述开口部的所述有机发光材料透过所述阻挡膜蒸镀至对应的所述像素开口区域，形成所述有机发光层；
    其中，所述有机发光材料在对应所述开口部的所述阻挡膜上的透过率不同，使得形成的所述有机发光层的厚度均一。
  7. 根据权利要求6所述的方法，其中，所述有机发光材料在所述阻挡膜四周边缘区域的透过率高于中心区域的透过率。
  8. 根据权利要求6所述的方法，其中，所述有机发光材料在所述阻挡膜的所述阻挡区域的边缘部分的透过率高于中心部分的透过率。
  9. 根据权利要求6所述的方法，其中，在所述步骤S30之后，所述方法还包括以下步骤：
    步骤S40，在所述阵列基板上制备阴极层。
  10. 一种采用权利要求6所述的方法制备的OLED显示面板，其包括：
    衬底基板；
    薄膜晶体管层，制备于所述衬底基板上；
    像素定义层，制备于所述薄膜晶体管层上，且定义出像素区域；
    有机发光层，制备于所述像素定义层定义出的所述像素区域；
    其中，所述有机发光层的不同位置的膜层厚度均一。
PCT/CN2018/113273 2018-09-20 2018-11-01 一种oled显示面板及其制备方法、蒸镀用掩膜板 Ceased WO2020056866A1 (zh)

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