WO2020052075A1 - 绝缘皮膜、软排线及显示装置 - Google Patents

绝缘皮膜、软排线及显示装置 Download PDF

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Publication number
WO2020052075A1
WO2020052075A1 PCT/CN2018/116672 CN2018116672W WO2020052075A1 WO 2020052075 A1 WO2020052075 A1 WO 2020052075A1 CN 2018116672 W CN2018116672 W CN 2018116672W WO 2020052075 A1 WO2020052075 A1 WO 2020052075A1
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WIPO (PCT)
Prior art keywords
layer
insulating film
conductive powder
flexible cable
insulating
Prior art date
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Ceased
Application number
PCT/CN2018/116672
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English (en)
French (fr)
Inventor
农海燕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
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HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
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Publication date
Application filed by HKC Co Ltd, Chongqing HKC Optoelectronics Technology Co Ltd filed Critical HKC Co Ltd
Publication of WO2020052075A1 publication Critical patent/WO2020052075A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/60—Composite insulating bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present application relates to the technical field of display devices, and in particular, to an insulating film, a flexible cable, and a display device.
  • the flexible flexible cable includes a wire layer, and an insulating film provided on a side of the wire layer, and a layer of metal foil such as aluminum foil or copper foil is attached to a surface of the insulating film facing away from the wire layer.
  • a layer of metal foil such as aluminum foil or copper foil is attached to a surface of the insulating film facing away from the wire layer.
  • the main purpose of this application is to provide an insulating film, which aims to improve the structure of the insulating film, reduce the production process steps of the flexible cable, thereby improving the production efficiency of the flexible cable, and reducing the manufacturing cost of the flexible cable.
  • the present application proposes an insulating film provided as a flexible cable.
  • the insulating film includes an overlapping first insulating layer and a shielding layer, and the first insulating layer and the shielding layer are connected to each other.
  • the shielding layer includes a substrate, and the substrate is provided with a conductive powder.
  • the first insulating layer and the base are integrally formed.
  • the material of the first insulating layer is the same as the material of the base body, the density of the conductive powder is greater than the density of the base material, and the conductive powder sinks in the base material in a molten state.
  • the material of the first insulating layer is the same as the material of the base body, the density of the conductive powder is lower than the density of the base material, and the conductive powder floats in the base material of the molten state, so that A shield layer having the conductive powder and a first insulating layer not having the conductive powder are formed.
  • the conductive powder includes metal powder and / or carbon powder.
  • the metal powder includes one or more of iron powder, aluminum powder, copper powder, and silver powder.
  • the thickness h of the insulating film satisfies: 0.01 mm ⁇ h ⁇ 0.1 mm.
  • the thickness of the shielding layer is greater than or equal to 0.005 mm.
  • the substrate is made of a plastic material.
  • This application also proposes a flexible cable, which includes:
  • the insulating film includes an overlapped first insulating layer and a shielding layer, the first insulating layer and the shielding layer are connected to each other, the shielding layer includes a substrate, and the substrate is provided with In the conductive powder, the insulating film is connected to the side surface of the wire layer, and the first insulating layer of the insulating film is bonded to the wire layer.
  • the insulating film is provided on both sides of the wire layer.
  • one side of the wire layer is provided with the insulating film, and the other side of the wire layer is provided with a second insulating layer.
  • the present application also proposes a display device including the flexible cable as described above, the flexible cable includes:
  • the insulating film includes an overlapped first insulating layer and a shielding layer, the first insulating layer and the shielding layer are connected to each other, the shielding layer includes a substrate, and the substrate is provided with In the conductive powder, the insulating film is connected to the side surface of the wire layer, and the first insulating layer of the insulating film is bonded to the wire layer.
  • the flexible wiring of the insulating film includes a first insulating layer and a shielding layer connected to each other, the shielding layer includes a substrate, and a conductive powder is provided in the substrate so that the shielding layer has an effect of preventing electromagnetic interference. Therefore, the shielding layer can replace metal foils such as aluminum foil or copper foil, so that the flexible wiring does not need to be attached to the metal foil during the manufacturing process, which reduces the cost and thickness of the flexible wiring, and also reduces production costs.
  • the process of sticking a metal foil in the process of manufacturing a flexible cable improves the processing efficiency of the flexible cable and reduces the manufacturing cost of the flexible cable.
  • FIG. 1 is a schematic structural diagram of an embodiment of a display device in this application.
  • FIG. 2 is an enlarged view at A in FIG. 1;
  • Fig. 3 is a partial view of a cross-sectional view taken along the A-A direction in Fig. 2.
  • Label name Label name 11 Flexible cable 111 Wire layer 12 Insulation film 112 Second insulation layer 13 Display panel 121 First insulation layer 14 Circuit board 122 Shield 15 Connector
  • This application proposes an insulating film, which is mainly provided as a flexible cable.
  • the insulating film 12 includes an overlapping first insulating layer 121 and a shielding layer 122.
  • the first insulating layer 121 and the shielding layer 122 are connected to each other, and a conductive powder is provided in the shielding layer 122 to make the shielding layer 122. It has the effect of preventing electromagnetic interference.
  • the shielding layer 122 may include a base and conductive powder is provided in the base.
  • the shielding layer 122 is located on the side of the first insulating layer 121 facing away from the wire layer 111 to prevent the conductive powder in the shield layer 122 from contacting the wire layer 111 and to prevent electromagnetic interference from the wire layer 111 of the flexible cable 11.
  • the shielding layer 122 has an electromagnetic interference prevention effect by providing conductive powder in the substrate of the shielding layer 122, so that the flexible cable 11 does not need to be pasted with a metal foil during the manufacturing process, which reduces the flexible cable
  • the shielding layer 122 instead of the metal foil, the process of sticking the metal foil in the process of manufacturing the flexible wiring 11 is reduced, thereby simplifying the processing process of the flexible wiring 11 The purpose of improving the processing efficiency of the flexible wiring 11 and reducing the manufacturing cost of the flexible wiring 11.
  • the base body of the first insulating layer 121 and the shielding layer 122 may be integrally formed. Thereby, the processing of the insulating film 12 can be made more convenient, and the connection strength between the first insulating layer 121 and the shielding layer 122 is higher, thereby improving the stability of the insulating film 12.
  • the material of the first insulating layer 121 can be the same as the base material of the shielding layer 122.
  • the conductive powder is mixed into the molten base material during the processing of the insulating film 12 to form the shielding layer 122 having the conductive powder. And the first insulating layer 121 without conductive powder, so that the processing of the insulating film 12 is more convenient.
  • the density of the conductive powder may be greater than the density of the base material.
  • the conductive powder is sunk to the bottom of the base material during the mixing process to form a conductive powder.
  • the shielding layer 122, and the first insulating layer 121 having no conductive powder. It can be understood that after the conductive powder sinks to the bottom of the base material, a conductive powder layer is formed on the bottom of the base material, thereby forming a shielding layer 122 having an electromagnetic shielding effect; the upper portion of the base material does not contain conductive powder or contains only a trace amount Conductive powder, thereby forming a first insulating layer 121 having an insulating effect.
  • the method of forming the first insulating layer 121 and the shielding layer 122 by sinking the conductive powder in the base material in a molten state is not only convenient for processing, but also enables the thickness of the insulating film 12 to be thin.
  • the overall thickness of the flexible cable 11 is reduced, so that the product in which the flexible cable 11 is installed is thinner, and the competitiveness of the product is improved.
  • the thickness of the liquid crystal display device can be further reduced, and the competitive advantage of the liquid crystal display device can be improved.
  • the density of the conductive powder smaller than the density of the substrate.
  • the conductive powder By mixing the conductive powder into the molten base material, the conductive powder floats on the upper part of the base material during the mixing process to form a shielding layer with the conductive powder. 122, and a first insulating layer 121 having no conductive powder. It can be understood that after the conductive powder floats to the upper part of the base material, a conductive powder layer is formed on the upper part of the base material, thereby forming a shielding layer 122 having an electromagnetic shielding effect; the lower part of the base material does not contain conductive powder or contains only a small amount of The conductive powder forms a first insulating layer 121 having an insulating effect.
  • the conductive powder can be made magnetic.
  • the conductive powder By mixing the conductive powder into the molten base material and placing the molten base material in a magnetic field, the conductive powder floats on the upper part of the base material under the action of the magnetic field, or The conductive powder is caused to sink to the bottom of the base material under the action of a magnetic field to form a shielding layer 122 with a conductive powder and a first insulating layer 121 without a conductive powder, which will not be repeated here.
  • the conductive powder is magnetic
  • the density of the conductive powder is greater than the density of the base material, so that the conductive powder sinks rapidly to the bottom of the base material under the action of gravity and magnetic field; the conductive powder can also be made While having magnetic properties, the density of the conductive powder is made smaller than the density of the base material, so that the conductive powder quickly floats on the upper part of the base material.
  • first insulating layer 121 and the shielding layer 122 may be connected by any one of soldering, pasting, and overmolding.
  • first insulating layer 121 is overmolded on the side of the shielding layer 122 to form the insulating film 11; or the shielding layer 122 containing the conductive powder is overmolded on the side of the first insulating layer 121 side To form an insulating film 11.
  • the base material mixed with the conductive powder and formed with the first insulating layer 121 and the shielding layer 122 may be extruded to form a thinner insulating film 12.
  • the conductive powder may include metal powder and / or carbon powder, so that the shielding layer 122 has a better electromagnetic shielding effect and reduces the cost of the conductive powder.
  • the conductive powder may be one of a metal powder and a carbon powder, or a mixture of a metal powder and a carbon powder, and may be specifically determined according to the material of the insulating film 12.
  • the metal powder may be a powder such as iron powder, aluminum powder, copper powder, or silver powder, or a mixture of at least two kinds of powders such as iron powder, aluminum powder, copper powder, and silver powder.
  • the metal powder can also be a variety of metals or alloy powders made of metals and non-metals, or metal oxide powders.
  • the conductive powder When the density of the conductive powder is smaller than the density of the substrate, the conductive powder may include a magnesium-lithium alloy. Therefore, the density of the conductive powder is low, and it can float on the upper portion of the base material in a molten state.
  • the conductive powder can also be other powders with lower density, which is not limited here.
  • the base of the insulating film 12 can be made of a plastic material, so that the conductive powder can be better mixed into the base material, and the cost of the insulating film 12 can be reduced.
  • the content of the conductive powder in the shielding layer 122 can be determined according to the environment in which the flexible cable 11 is used. When the flexible cable 11 is installed in a place with strong electromagnetic radiation, the conductive powder in the shielding layer 122 can be made The content is high. When the flexible cable 11 is installed in a place with weak electromagnetic radiation, the conductive powder content in the shielding layer 122 can be made lower.
  • the content of the conductive powder in the shielding layer 122 is a guide to the ratio of the total volume of the electric powder to the total volume of the shielding layer 122.
  • the shielding effect of the shielding layer is the best.
  • the ratio of the total volume of the conductive powder to the total volume of the shielding layer 122 may be greater than or equal to 70%, so that the electromagnetic shielding effect of the shielding layer 122 having the conductive powder is better.
  • the proportion of the total volume of the conductive powder to the total volume of the shielding layer 122 can be further increased to 80% or 90%, and the like is not limited herein.
  • the thickness of the shielding layer 122 can be greater than or equal to 0.005 mm to increase the strength of the shielding layer 122 and to make the shielding layer 122 provided with the conductive powder have a better electromagnetic shielding effect.
  • the thickness of the shielding layer 122 can also be made less than or equal to 0.02 mm to improve the utilization rate of the conductive powder and reduce the cost.
  • the specific thickness of the shielding layer 122 may be 0.008 mm, 0.01 mm, 0.012 mm, 0.015 mm, and the like, which is not limited in this embodiment.
  • the specific thickness of the shielding layer 122 can be determined according to the environment in which the flexible cable 11 is used. When the flexible cable 11 is installed in a place with strong electromagnetic radiation, the thickness of the shielding layer 122 can be increased to improve the resistance Electromagnetic interference ability; when the flexible cable 11 is installed in a place with weak electromagnetic radiation, the thickness of the shielding layer 122 can be appropriately reduced, and the shielding layer 122 provided with conductive powder can be reduced while reducing the thickness and cost of the insulating film 12 Has a certain shielding effect.
  • the ratio of the total volume of the conductive powder to the total volume of the shielding layer 122 can meet the above requirements at the same time as the thickness of the shielding layer 122, or one of them can meet the above requirements. Of course, when both meet the above requirements When required, the shielding effect of the insulating film 11 is better.
  • the thickness h of the insulating film 12 may be less than or equal to 0.12 mm, so that the insulating film 12 has better insulation and anti-electromagnetic interference effects, and reduces the cost of the insulating film 12.
  • the thickness h of the insulating film 12 can be made greater than or equal to 0.01 mm, so that the processing of the insulating film 12 is more convenient.
  • the thickness h of the insulating film 12 can be satisfied: 0.01 mm ⁇ h ⁇ 0.1 mm, so that the processing of the insulating film 12 is more convenient.
  • the present application also proposes a flexible cable 11 that includes a conductive wire layer 111 and the insulating film 12 in any one of the above embodiments.
  • the first insulating layer 121 of the insulating film 12 is connected to the side of the wire layer 111, and the first insulating layer 121 of the insulating film 12 is bonded to the wire layer 111.
  • the shielding layer 122 of the insulating film 12 is located away from the first insulating layer 121.
  • One side of the wire layer 111 so that the first insulating layer 121 separates the shield layer 122 from the wire layer 111, preventing the conductive powder in the shield layer 122 from being connected to a plurality of wires in the wire layer 111 and causing a short circuit.
  • the wire layer 111 and the first insulating layer 121 of the insulating film 12 may be connected together by means of adhesion, welding, and the like, which is not limited herein.
  • the flexible cable 11 can be set for signal transmission and board-to-board connection in a display device, or for signal transmission or board-to-board connection in electronic products such as printers and speakers.
  • the above-mentioned insulating film 12 may be provided on one side of the wire layer 111, a second insulating layer 112 may be provided on the other side of the wire layer 111, and the wire layer of the flexible wiring 11 may be provided.
  • 111 will not receive electromagnetic interference, while reducing the cost of the flexible cable 11 and reducing the thickness of the flexible cable 11.
  • the insulating film 12 is located on the side of the wire layer 111 facing away from the circuit board 14 so that the insulating film 12 has a greater effect on the wire layer 111. Good electromagnetic shielding effect.
  • the insulating film 12 may also be provided on both sides of the wire layer 111 at the same time, so that the flexible cable 11 has a better anti-electromagnetic interference effect. It should be noted that when the insulating films 12 are provided on both sides of the wire layer 111, the first insulating layers 121 of the two insulating films 12 and the two sides of the wire layer 111 are respectively attached to face each other so as to insulate the wire layer 111 from the two sides. The shielding layer of the film 12 is separated.
  • the present application also proposes a display device including the flexible cable 11 in any one of the above embodiments.
  • the display device may include a display panel 13, and at least two circuit boards in the display device may be connected through a flexible cable 11.
  • the two circuit boards may be timing control circuit boards, Any two circuit boards, such as a system board, a backlight driver board, or a source driver circuit board, need to be connected to each other.
  • other components in the display device can also be connected through the flexible cable 11 described above, which is not limited here.
  • a connector 15 may be provided on a component connected to the flexible cable 11 in the display device, and an end of the flexible cable 11 is inserted into the connector 15 so that the flexible cable 11 is electrically connected to the component.
  • a connector 15 can be provided on the circuit board 14 in the display device. And make the flexible cable 11 electrically connected to the circuit board 14 through the connector 15, so that the connection between the circuit board 14 and the flexible cable 11 is more convenient.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Insulated Conductors (AREA)

Abstract

一种绝缘皮膜、软排线及显示装置，绝缘皮膜包括重叠的第一绝缘层（121）和屏蔽层（122），第一绝缘层（121）和屏蔽层（122）相互连接，该屏蔽层（122）包括基体，该基体内设置有导电粉末。其能减少软排线的生产工艺步骤，进而提高软排线的生产效率，降低软排线的生产制造成本。

Description

绝缘皮膜、软排线及显示装置
相关信息
本申请要求2018年09月13日申请的，申请号为201821503780.1，名称为“绝缘皮膜、软排线及显示装置”的中国专利申请的优先权，在此将其全文引入作为参考。
技术领域
本申请涉及显示设备技术领域，尤其涉及一种绝缘皮膜、软排线及显示装置。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术。液晶电视、电脑主机等电子设备中，普遍采用柔性软排线（FFC）将各连接器之间电连接。在一示例性技术中，柔性软排线包括导线层，以及，设于导线层侧面的绝缘皮膜，在绝缘皮膜背离导线层的一侧表面还贴附有一层铝箔或者铜箔等金属箔片，以防止柔性软排线受到电磁干扰而影响信号的传输。
但是，上述采用铝箔或者铜箔等金属箔片对电磁进行屏蔽的方式，会使得柔性软排线的加工工序较多，影响柔性软排线的生产加工效率，增加了柔性软排线的生产制造成本。
申请内容
本申请的主要目的在于提供一种绝缘皮膜，旨在改进绝缘皮膜的结构，减少软排线的生产工艺步骤，进而提高软排线的生产效率，降低软排线的生产制造成本。
为实现上述目的，本申请提出一种绝缘皮膜，设置为软排线，所述绝缘皮膜包括重叠的第一绝缘层和屏蔽层，所述第一绝缘层和所述屏蔽层相互连接，所述屏蔽层包括基体，所述基体内设置有导电粉末。
在一实施例中，所述第一绝缘层和所述基体一体成型设置。
在一实施例中，所述第一绝缘层的材质与所述基体的材质相同，所述导电粉末的密度大于所述基体材质的密度，所述导电粉末在熔融状态的基体材质中下沉，以形成具有所述导电粉末的屏蔽层，和不具有所述导电粉末的第一绝缘层。
在一实施例中，所述第一绝缘层的材质与所述基体的材质相同，所述导电粉末的密度小于所述基体材质的密度，所述导电粉末在熔融状态的基体材质中上浮，以形成具有所述导电粉末的屏蔽层，和不具有所述导电粉末的第一绝缘层。
在一实施例中，所述导电粉末包括金属粉和/或碳粉。
在一实施例中，所述金属粉包括铁粉、铝粉、铜粉和银粉中的一种或多种。
在一实施例中，所述绝缘皮膜的厚度h满足：0.01mm≤h≤0.1mm。
在一实施例中，所述屏蔽层的厚度大于或等于0.005mm。
在一实施例中，所述基体由塑胶材料制成。
本申请还提出一种软排线，该软排线包括：
导线层；
及如上所述的绝缘皮膜，所述绝缘皮膜包括重叠的第一绝缘层和屏蔽层，所述第一绝缘层和所述屏蔽层相互连接，所述屏蔽层包括基体，所述基体内设置有导电粉末，所述绝缘皮膜与所述导线层的侧面连接，所述绝缘皮膜的第一绝缘层与导线层贴合。
在一实施例中，所述导线层的两侧面设有所述绝缘皮膜。
在一实施例中，所述导线层的一侧设置有所述绝缘皮膜，所述导线层的另一侧设有第二绝缘层。
本申请还提出一种显示装置，该显示装置包括如上所述的软排线，所述软排线包括：
导线层；
及如上所述的绝缘皮膜，所述绝缘皮膜包括重叠的第一绝缘层和屏蔽层，所述第一绝缘层和所述屏蔽层相互连接，所述屏蔽层包括基体，所述基体内设置有导电粉末，所述绝缘皮膜与所述导线层的侧面连接，所述绝缘皮膜的第一绝缘层与导线层贴合。
本申请通过使绝缘皮膜的软排线包括相互连接的第一绝缘层和屏蔽层，使屏蔽层包括基体，并在基体内设置导电粉末，以使屏蔽层具有防电磁干扰的效果。由此，屏蔽层能够代替铝箔或者铜箔等金属箔片，使软排线在生产制造的过程中无需再粘贴金属箔片，降低了软排线的成本和厚度，而且，还减少了在生产制造软排线的过程中粘贴金属箔片的工序，提高了软排线的加工效率，并降低了软排线的生产制造成本。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请中显示装置一实施例的结构示意图；
图2为图1中A处的放大图；
图3为图2中沿A-A方向的剖视图的局部视图。
标号 名称 标号 名称
11 软排线 111 导线层
12 绝缘皮膜 112 第二绝缘层
13 显示面板 121 第一绝缘层
14 电路板 122 屏蔽层
15 连接器
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅设置为解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本申请中涉及“第一”、“第二”等的描述仅设置为描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中出现的“和/或”的含义为，包括三个并列的方案，以 “A和/或B”为例，包括A方案，或B方案，或A和B同时满足的方案。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种绝缘皮膜，该绝缘皮膜主要设置为软排线。
参照图3，所述绝缘皮膜12包括重叠的第一绝缘层121和屏蔽层122，该第一绝缘层121和屏蔽层122相互连接，且在屏蔽层122内设置有导电粉末以使屏蔽层122具有防电磁干扰的效果。具体地，可以使屏蔽层122包括基体，并在基体内设置有导电粉末，当将绝缘皮膜12与软排线11的导线层111连接时，第一绝缘层121与导线层111的侧面连接，屏蔽层122位于第一绝缘层121背离导线层111的一侧，以防止屏蔽层122内的导电粉末与导线层111接触，并防止软排线11的导线层111受到电磁干扰。可以理解的是，通过在屏蔽层122的基体内设置导电粉末使屏蔽层122具有防电磁干扰效果，从而使软排线11在生产制造的过程中无需再粘贴金属箔片，降低了软排线11的厚度和物料成本；而且，通过用屏蔽层122代替金属箔片，还减少了在生产制造软排线11的过程中粘贴金属箔片的工序，从而达到简化软排线11的加工工艺，提高软排线11的加工效率，并降低软排线11的生产制造成本的目的。
在一实施例中，可以使第一绝缘层121和屏蔽层122的基体一体成型设置。由此，能够使绝缘皮膜12的加工更加方便，且第一绝缘层121和屏蔽层122之间的连接强度更高，提高了绝缘皮膜12的稳定性。
其中，可以使第一绝缘层121的材质与屏蔽层122的基体材质相同，通过在加工绝缘皮膜12的过程中，在熔融状态的基体材质内混入导电粉末，以形成具有导电粉末的屏蔽层122，和不具有导电粉末的第一绝缘层121，从而使绝缘皮膜12的加工更加方便。
具体地，可以使导电粉末的密度大于基体材质的密度，通过将导电粉末混入熔融状态的基体材质中，使导电粉末在混炼的过程中下沉于基体材质的底部，以形成具有导电粉末的屏蔽层122，和不具有导电粉末的第一绝缘层121。可以理解的是，导电粉末下沉至基体材质的底部后，会在基体材质的底部形成导电粉层，从而形成具有电磁屏蔽效果的屏蔽层122；基体材质的上部不包含导电粉末或只包含微量的导电粉末，从而形成具有绝缘效果的第一绝缘层121。
需要说明的是，通过使导电粉末在熔融状态中的基体材质内下沉，以形成第一绝缘层121和屏蔽层122的方法，不仅加工方便，而且能够使绝缘皮膜12的厚度较薄，以降低软排线11的整体厚度，使安装有该软排线11的产品更加薄型化，提高产品的竞争力。尤其是当该软排线11设置为液晶显示装置内时，能够进一步的降低液晶显示装置的厚度，提高该液晶显示装置的竞争优势。
当然，也可以使导电粉末的密度小于基体的密度，通过将导电粉末混入熔融状态的基体材质中，使导电粉末在混炼的过程中上浮于基体材质的上部，以形成具有导电粉末的屏蔽层122，和不具有导电粉末的第一绝缘层121。可以理解的是，导电粉末上浮至基体材质的上部后，会在基体材质的上部形成导电粉层，从而形成具有电磁屏蔽效果的屏蔽层122；基体材质的下部不包含导电粉末或只包含微量的导电粉末，从而形成具有绝缘效果的第一绝缘层121。
另外，还可以使导电粉末具有磁性，通过将导电粉末混入熔融状态的基体材质中，并将熔融状态的基体材质置于磁场中，使导电粉末在磁场的作用下上浮于基体材质的上部，或者，使导电粉末在磁场的作用下下沉于基体材质的底部，以形成具有导电粉末的屏蔽层122，和不具有导电粉末的第一绝缘层121，此处不再赘述。
需要说明的是，可以使导电粉末具有磁性的同时，使导电粉末的密度大于基体材质的密度，以使导电粉末在重力和磁场的作用下快速下沉于基体材质的底部；也可以使导电粉末具有磁性的同时，使导电粉末的密度小于基体材质的密度，以使导电粉末快速上浮于基体材质的上部。
此外，也可以通过焊接、粘贴、二次注塑等方式中的任意一种将第一绝缘层121和屏蔽层122连接。例如：将第一绝缘层121二次注塑成型于屏蔽层122的侧面上，以形成绝缘皮膜11；或者，将容纳有导电粉末的屏蔽层122二次注塑成型于第一绝缘层121侧侧面上，以形成绝缘皮膜11。
在一实施例中，可以将混合有导电粉末，并形成有第一绝缘层121和屏蔽层122的基体材质进行挤压加工，以形成厚度更薄的绝缘皮膜12。
在一实施例中，可以使导电粉末包括金属粉和/或碳粉，以使屏蔽层122具有较好的电磁屏蔽效果的同时，降低导电粉末的成本。其中，导电粉末可以为金属粉和碳粉中的一种，也可以为金属粉和碳粉的混合物，具体可根据绝缘皮膜12的材质而定。
需要说明的是，上述金属粉可以为铁粉、铝粉、铜粉、银粉等粉末，也可以为铁粉、铝粉、铜粉、银粉等粉末中的至少两种混合而成混合物。此外，金属粉还可以为多种金属或者金属与非金属制成的合金粉末，或者金属氧化物粉末等等。
当导电粉末的密度小于基体的密度时，可以使导电粉末包括镁锂合金，由此，导电粉末的密度较低，能够上浮于熔融状态的基体材质的上部。当然，导电粉末也可以为其它密度较低的粉末，此处不作限制。
在一实施例中，可以使绝缘皮膜12的基体由塑胶材料制成，以使导电粉末能够更好的混入到基体材质内，并降低绝缘皮膜12的成本。
本申请中，屏蔽层122内导电粉末的含量具体可根据软排线11所使用的环境而定，当软排线11安装于电磁辐射较强的地方时，可以使屏蔽层122中的导电粉末含量较高，当软排线11安装于电磁辐射较弱的地方时，可以使屏蔽层122中的导电粉末含量较低。
需要说明的是，上述屏蔽层122中导电粉末的含量是指导电粉末的总体积占屏蔽层122总体积的比例。导电粉末的总体积占屏蔽层122总体积的比例越高，屏蔽层的屏蔽效果越好，当导电粉末填充满整个屏蔽层122时，屏蔽层的屏蔽效果最佳。
在一实施例中，可以使导电粉末的总体积占屏蔽层122总体积的比例大于或等于70%，以使具有导电粉末的屏蔽层122的电磁屏蔽效果较好。其中，可以进一步使导电粉末的总体积占屏蔽层122总体积的比例达到80%或90%等等，此处不作限制。
在一实施例中，可以使屏蔽层122的厚度大于或等于0.005mm，以提高屏蔽层122的强度，并使设置有导电粉末的屏蔽层122具有较好的电磁屏蔽效果。另外，还可以使屏蔽层122的厚度小于或等于0.02mm，以提高导电粉末的利用率，降低成本。其中，屏蔽层122的具体厚度可以为0.008mm、0.01mm、0.012mm、0.015mm等等，本实施例不作限制。
需要说明的是，屏蔽层122的具体厚度可根据软排线11所使用的环境而定，当软排线11安装于电磁辐射较强的地方时，可以增大屏蔽层122的厚度，提高防电磁干扰能力；当软排线11安装于电磁辐射较弱的地方时，可以适当降低屏蔽层122中的厚度，在降低绝缘皮膜12的厚度和成本的同时，使设置有导电粉末的屏蔽层122具有一定的屏蔽效果。
需要说明的是，可以使导电粉末的总体积占屏蔽层122总体积的比例，与屏蔽层122的厚度同时满足上述要求，也可以使其中一者满足上述要求，当然，当二者同时满足上述要求时，绝缘皮膜11的屏蔽效果更好。
在一实施例中，可以使绝缘皮膜12的厚度h小于或等于0.12mm，以使绝缘皮膜12具有较好的绝缘和防电磁干扰效果的同时，降低绝缘皮膜12的成本。另外，还可以使绝缘皮膜12的厚度h大于或等于0.01mm，以使绝缘皮膜12的加工更加方便。可选地，可以使绝缘皮膜12的厚度h满足：0.01mm≤h≤0.1mm，以使绝缘皮膜12的加工更加方便。
本申请还提出一种软排线11，该软排线11包括导线层111及上述任意一实施例中的绝缘皮膜12。其中，绝缘皮膜12的第一绝缘层121与导线层111的侧面连接，且绝缘皮膜12的第一绝缘层121与导线层111贴合，绝缘皮膜12的屏蔽层122位于第一绝缘层121背离导线层111的一侧，以使第一绝缘层121将屏蔽层122与导线层111隔开，防止屏蔽层122内的导电粉末与导线层111中的多根导线连接而引起短路的问题。
需要说明的是，导线层111和绝缘皮膜12的第一绝缘层121之间可以通过粘贴、焊接等方式连接在一起，此处不作限制。另外，软排线11可以设置为显示装置中的信号传输及板板连接，也可以设置为打印机、音箱等电子产品中的信号传输或板板连接等。
在一实施例中，如图3所示，可以在导线层111的一侧设置上述绝缘皮膜12，在导线层111的另一侧设第二绝缘层112，在使软排线11的导线层111不会受到电磁干扰的同时，降低软排线11的成本，并降低软排线11的厚度。此时，可以使软排线11的端部与电路板上的连接器电连接时，使绝缘皮膜12位于导线层111背离电路板14的一侧，以使绝缘皮膜12对导线层111具有更好的电磁屏蔽效果。
当然，也可以在导线层111的两侧面同时设置绝缘皮膜12，以使软排线11具有更好的抗电磁干扰效果。需要说明的是，当在导线层111的两侧面设置绝缘皮膜12时，两个绝缘皮膜12的第一绝缘层121分别与导线层111的两侧面向贴合，以将导线层111与两绝缘皮膜12的屏蔽层隔开。
本申请还提出一种显示装置，该显示装置包括上述任意一实施例中的软排线11。
其中，显示装置内通过软排线11连接的具体部件不作限制。例如图1及图2所示，可以使显示装置包括显示面板13，并使该显示装置内的至少两个电路板之间通过软排线11连接，两个电路板可以为时序控制电路板、系统板、背光驱动板或源极驱动电路板等电路板中任意两个需要相互连接的电路板。当然，显示装置内的其它部件之间也可以通过上述软排线11进行连接，此处不作限制。
可选地，可以使显示装置内与软排线11连接的部件上设置连接器15，软排线11的端部插入该连接器15，以使软排线11与该部件电连接。以显示装置内的电路板14为例，如图1及图2所示，当软排线11与显示装置内的电路板14连接时，可以在显示装置内的电路板14上设置连接器15，并使软排线11通过连接器15与电路板14电连接，从而使电路板14和软排线11之间的连接更加方便。
以上所述仅为本申请的一些实施例，并非因此限制本申请的专利范围，凡是在本申请的构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (20)

  1. 一种绝缘皮膜，设置为软排线，其中，所述绝缘皮膜包括重叠的第一绝缘层和屏蔽层，所述第一绝缘层和所述屏蔽层相互连接，所述屏蔽层包括基体，所述基体内设置有导电粉末。
  2. 如权利要求1所述的绝缘皮膜，其中，所述第一绝缘层和所述基体一体成型设置。
  3. 如权利要求2所述的绝缘皮膜，其中，所述第一绝缘层的材质与所述基体的材质相同，所述导电粉末的密度大于所述基体材质的密度，所述导电粉末在熔融状态的基体材质中下沉，以形成具有所述导电粉末的屏蔽层，和不具有所述导电粉末的第一绝缘层。
  4. 如权利要求2所述的绝缘皮膜，其中，所述第一绝缘层的材质与所述基体的材质相同，所述导电粉末的密度小于所述基体材质的密度，所述导电粉末在熔融状态的基体材质中上浮，以形成具有所述导电粉末的屏蔽层，和不具有所述导电粉末的第一绝缘层。
  5. 如权利要求1所述的绝缘皮膜，其中，所述导电粉末包括金属粉和/或碳粉。
  6. 如权利要求5所述的绝缘皮膜，其中，所述金属粉包括铁粉、铝粉、铜粉和银粉中的一种或多种。
  7. 如权利要求1所述的绝缘皮膜，其中，所述绝缘皮膜的厚度h满足：0.01mm≤h≤0.1mm。
  8. 如权利要求7所述的绝缘皮膜，其中，所述屏蔽层的厚度大于或等于0.005mm。
  9. 如权利要求1所述的绝缘皮膜，其中，所述基体由塑胶材料制成。
  10. 一种软排线，其中，所述软排线包括：
    导线层；
    及绝缘皮膜，所述绝缘皮膜包括重叠的第一绝缘层和屏蔽层，所述第一绝缘层和所述屏蔽层相互连接，所述屏蔽层包括基体，所述基体内设置有导电粉末，所述绝缘皮膜与所述导线层的侧面连接，所述绝缘皮膜的第一绝缘层与导线层贴合。
  11. 如权利要求10所述的软排线，其中，所述第一绝缘层和所述基体一体成型设置。
  12. 如权利要求11所述的软排线，其中，所述第一绝缘层的材质与所述基体的材质相同，所述导电粉末的密度大于所述基体材质的密度，所述导电粉末在熔融状态的基体材质中下沉，以形成具有所述导电粉末的屏蔽层，和不具有所述导电粉末的第一绝缘层。
  13. 如权利要求11所述的软排线，其中，所述第一绝缘层的材质与所述基体的材质相同，所述导电粉末的密度小于所述基体材质的密度，所述导电粉末在熔融状态的基体材质中上浮，以形成具有所述导电粉末的屏蔽层，和不具有所述导电粉末的第一绝缘层。
  14. 如权利要求10所述的软排线，其中，所述导电粉末包括金属粉和/或碳粉。
  15. 如权利要求10所述的软排线，其中，所述绝缘皮膜的厚度h满足：0.01mm≤h≤0.1mm。
  16. 如权利要求15所述的软排线，其中，所述屏蔽层的厚度大于或等于0.005mm。
  17. 如权利要求10所述的软排线，其中，所述基体由塑胶材料制成。
  18. 如权利要求10所述的软排线，其中，所述导线层的两侧面设有所述绝缘皮膜。
  19. 如权利要求10所述的软排线，其中，所述导线层的一侧设置有所述绝缘皮膜，所述导线层的另一侧设有第二绝缘层。
  20. 一种显示装置，其中，所述显示装置包括软排线，所述软排线包括：
    导线层；
    及绝缘皮膜，所述绝缘皮膜包括重叠的第一绝缘层和屏蔽层，所述第一绝缘层和所述屏蔽层相互连接，所述屏蔽层包括基体，所述基体内设置有导电粉末，所述绝缘皮膜与所述导线层的侧面连接，所述绝缘皮膜的第一绝缘层与导线层贴合。
PCT/CN2018/116672 2018-09-13 2018-11-21 绝缘皮膜、软排线及显示装置 Ceased WO2020052075A1 (zh)

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CN112133476B (zh) * 2020-08-12 2022-03-22 番禺得意精密电子工业有限公司 导电基材及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2377798Y (zh) * 1999-05-19 2000-05-10 伽太实业有限公司 防止电磁波干扰的软排线
CN102867577A (zh) * 2012-09-05 2013-01-09 江苏讯为电子器材有限公司 一种抗电磁干扰的软性排线
JP2013105888A (ja) * 2011-11-14 2013-05-30 Fujimori Kogyo Co Ltd Ｆｐｃ用電磁波シールド材
CN203366793U (zh) * 2013-05-23 2013-12-25 天瑞电子科技发展(昆山)有限公司 一种排线结构
CN107241855A (zh) * 2015-08-24 2017-10-10 浙江展邦电子科技有限公司 一种具有屏蔽结构的线路板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2377798Y (zh) * 1999-05-19 2000-05-10 伽太实业有限公司 防止电磁波干扰的软排线
JP2013105888A (ja) * 2011-11-14 2013-05-30 Fujimori Kogyo Co Ltd Ｆｐｃ用電磁波シールド材
CN102867577A (zh) * 2012-09-05 2013-01-09 江苏讯为电子器材有限公司 一种抗电磁干扰的软性排线
CN203366793U (zh) * 2013-05-23 2013-12-25 天瑞电子科技发展(昆山)有限公司 一种排线结构
CN107241855A (zh) * 2015-08-24 2017-10-10 浙江展邦电子科技有限公司 一种具有屏蔽结构的线路板

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