WO2020034730A1 - 平板变压器 - Google Patents

平板变压器 Download PDF

Info

Publication number
WO2020034730A1
WO2020034730A1 PCT/CN2019/089827 CN2019089827W WO2020034730A1 WO 2020034730 A1 WO2020034730 A1 WO 2020034730A1 CN 2019089827 W CN2019089827 W CN 2019089827W WO 2020034730 A1 WO2020034730 A1 WO 2020034730A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil
primary
magnetic core
flat
secondary printed
Prior art date
Application number
PCT/CN2019/089827
Other languages
English (en)
French (fr)
Inventor
吴军辉
Original Assignee
深圳Tcl新技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳Tcl新技术有限公司 filed Critical 深圳Tcl新技术有限公司
Publication of WO2020034730A1 publication Critical patent/WO2020034730A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure

Definitions

  • the present application relates to the technical field of transformers, and in particular, to a flat-panel transformer.
  • the use of existing printed circuit board manufacturing technology to achieve the transformer planar winding and even the wire package assembly of the new process structure of the flat transformer has a greater advantage in improving the characteristics of the switching power supply.
  • it has the characteristics of good coupling performance between windings, high efficiency, and low magnetic leakage.
  • the flat-panel transformer is also an innovative trend to achieve thinner and higher-frequency transformers, and is widely used in various switching power supplies with its many advantages (such as high frequency, low profile, low core loss, etc.).
  • the existing flat-panel transformers use a PCB with printed copper foil coils to replace the traditional skeleton coils.
  • the second type is that the flat panel transformer is first installed on the base, and then the connection pins of the base are soldered and fixed on the main circuit PCB.
  • the disadvantages of these two assembly methods are: the existing flat-panel transformer requires secondary welding before it can be fixed on the main circuit PCB. The processing steps are complicated, the processing cost is increased, and the production efficiency is reduced.
  • the existing flat-panel transformer PCB area is small.
  • connection pins Due to space constraints, all of the connection pins are thinner, and the secondary welding on the main circuit PCB has the risk of loose needle breakage during bumps in long-distance transportation; and the assembly method of the flat transformer using the base will increase the cost. Reduce corporate profits and competitiveness.
  • the main purpose of this application is to provide a flat-panel transformer, which aims to solve the problems that the existing flat-panel transformers are complicated to be fixed on a PCB and the pins are easily loosened.
  • the flat-panel transformer includes:
  • a magnetic core which is fixed to the power PCB for forming a closed magnetic circuit
  • a secondary printed coil for electrically connecting with the output circuit is printed on the power supply PCB and is arranged around the magnetic core;
  • the primary flat coil is used to be electrically connected to the input circuit.
  • the primary flat coil is closely attached to the secondary printed coil and is arranged around the magnetic core.
  • the power PCB is at least two layers;
  • the secondary printed coil includes a top secondary printed coil and a bottom secondary printed coil; the top secondary printed coil is printed on a top layer of the power PCB and is arranged around the magnetic core; the bottom layer A secondary printed coil is printed on the bottom layer of the power PCB and is arranged around the magnetic core; the top secondary printed coil is electrically connected to the bottom secondary printed coil;
  • the primary flat coil includes a top primary flat coil and a bottom primary flat coil; the top primary flat coil is close to the top secondary printed coil and is arranged around the magnetic core; and the bottom primary flat coil is close to the core
  • the bottom secondary printed coil is arranged around the magnetic core; the top primary flat coil is electrically connected to the bottom primary flat coil.
  • the number of turns of the top primary flat coil is the same as the number of turns of the bottom primary flat coil
  • the top primary flat coil and the bottom primary flat coil are wound by a wire wrapped with an insulating material.
  • the top primary flat coil is glued to the top secondary printed coil
  • the bottom primary flat coil is glued to the bottom secondary printed coil.
  • top primary flat coil and the bottom primary flat coil are bonded by an adhesive.
  • the power PCB is provided with vias; the ends of the top-level secondary printed coils are electrically connected to the starting ends of the bottom-level secondary printed coils through the vias; The start end and the end of the bottom secondary printed coil are used for electrical connection with the output circuit.
  • the power PCB is provided with a first primary pad, and the first primary pad penetrates the power PCB; an end of the top primary flat coil and a start of the bottom primary flat coil are soldered to all The first primary pad is electrically connected; a start end of the top primary flat coil and an end of the bottom primary flat coil are used for electrical connection with an input circuit;
  • the power PCB is provided with a second primary pad, the number of the second primary pads is two, and the start end of the top primary flat coil and the end of the bottom primary flat coil are respectively two
  • the second primary pads are soldered for electrical connection with the input circuit.
  • the power PCB When a first primary pad is provided, the number of the first primary pads is two, and the two first primary pads are electrically connected; an end of the top primary flat coil is connected to one of the first primary pads. Pad welding, the starting end of the bottom primary flat coil is welded to another first primary pad.
  • the power PCB When a first primary pad is provided, when the number of the first primary pads is one, the end of the top primary flat coil and the start of the bottom primary flat coil are simultaneously soldered to the first primary pad.
  • the second primary pad runs through the power PCB.
  • the magnetic core includes a first magnetic core and a second magnetic core, and the first magnetic core and the second magnetic core sandwich the power supply PCB, and the two are bonded to each other for forming Closed magnetic circuit
  • the magnetic core includes a first magnetic core and a second magnetic core, and the first magnetic core and the second magnetic core sandwich the power supply PCB, and the two are bonded to each other to form a closed magnetic core.
  • a silicon pad is provided on the first magnetic core or the second magnetic core, and the first magnetic core or the second magnetic core is in contact with a metal member through the silicone pad.
  • the magnetic core is an EC-type magnetic core
  • the EC-type magnetic core includes a bottom plate, a winding post provided on the bottom plate, and a pair of side plates provided on the bottom plate.
  • the post is disposed between a pair of side plates, and the power PCB A winding post through hole is provided thereon, the secondary printed coil and the primary flat coil are arranged around the winding post through hole, and the winding posts of the first magnetic core and the second magnetic core pass through the winding.
  • Post through-hole bonding; the power PCB A side plate through hole is also provided on the side plate, and the side plate through hole is disposed adjacent to the secondary printed coil and the primary flat coil.
  • the side plates of the first magnetic core and the second magnetic core are adhered through the side plate through hole Knot.
  • the power PCB is printed with an input circuit and an output circuit; the input circuit is electrically connected to the primary flat coil, and the output circuit is electrically connected to the secondary printed coil.
  • the technical solution of the present application simplifies the manufacturing process and improves the production efficiency by printing a formed secondary printed coil on the power PCB; at the same time, it also reduces the risk of loose connection pins; because the secondary printed coil is built on the power PCB , Reduce the number of components of a separate transformer, and reduce costs.
  • Figure 1 is a schematic diagram of the integrated secondary printed coil of the power PCB (top layer);
  • Figure 2 is a schematic diagram of the top primary flat coil
  • FIG. 3 is a schematic diagram of a bottom primary flat coil
  • Figure 4 is an exploded schematic diagram of the power PCB with the secondary printed coil and the primary flat coil (the secondary printed coil is printed on the power PCB, and the illustration is drawn for ease of understanding);
  • FIG. 5 is a schematic diagram of a magnetic core structure.
  • fixed may be a fixed connection, a detachable connection, or a whole; It is a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements, unless it is clearly defined otherwise.
  • fixed may be a fixed connection, a detachable connection, or a whole; It is a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements, unless it is clearly defined otherwise.
  • This application proposes a flat-panel transformer.
  • the flat-panel transformer includes:
  • a magnetic core 200 which is fixed to the power supply PCB 100 and is used to form a closed magnetic circuit
  • the secondary printed coil 300 is used to be electrically connected to the output circuit.
  • the secondary printed coil 300 is printed on the power PCB. 100, provided around the magnetic core 200;
  • the primary flat coil 400 is used to be electrically connected to the input circuit.
  • the primary flat coil 400 is closely attached to the secondary printed coil 300 and is disposed around the magnetic core 200.
  • the power PCB 100 is an important part of the power supply system.
  • the PCB is a printed circuit board, a support for electronic components, and a carrier for the electrical connection of electronic components.
  • Different power systems have different power PCBs.
  • the production of PCB generally passes the following process: material opening-drilling-sinking copper-pattern transfer-pattern plating-leg film-etching-green oil-character-gold-plated finger-molding-test-final inspection. According to different processes, the above manufacturing process is also slightly different.
  • the function of the magnetic core 200 is to strengthen the magnetic coupling between the primary flat coil 400 and the secondary printed coil 300.
  • the magnetic core 200 is generally a sintered magnetic metal oxide composed of various iron oxide mixtures.
  • manganese-zinc ferrite and nickel-zinc ferrite are typical magnetic core materials.
  • the types of the magnetic core 200 include, but are not limited to, RM-type magnetic cores, EC-type magnetic cores, PQ-type magnetic cores, E-type magnetics, I-type magnetic cores, and the like.
  • the magnetic core 200 of the present application is fixed to a power PCB 100. There are a variety of fixing methods, including but not limited to bonding (adhesive bonding), or opening a through hole in the power supply PCB, and embedding and fixing in the through hole.
  • the secondary printed coil 300 is directly on the power PCB Printed on 100, the printing of the secondary printed coil 300 can refer to the production of the circuit on the PCB, and the material can be copper, the same below. Since the secondary printed coil 300 is printed directly on the power PCB 100, so there is no need to solder the connection pins to print directly on the power PCB
  • the output circuit on the 100 is electrically connected.
  • the electrical connection between the secondary printed coil 300 and the output circuit can be realized through copper foil (made by printing), that is, the secondary printed coil 300, the output circuit, and the connection between the secondary printed coil 300 and the output circuit.
  • the copper foil is printed, which can reduce the risk of loosening the connection pins. And because the secondary printed coil 300 is directly printed on the power PCB 100, thus reducing the number of components of a separate transformer, reducing costs.
  • the primary flat coil 400 is wound by using a formed wire wrapped with an insulating material, and is closely attached to the secondary printed coil 300 to be insulated from each other. There are many ways to attach, including but not limited to bonding (through adhesive), or on the power PCB A fixing structure is provided on 100 to fix the primary flat coil 400.
  • the input circuit is printed on the power PCB just like the output circuit 100, so the primary flat coil 400 can be electrically connected to the input circuit by welding.
  • the technical solution of this application The printed secondary printed coil 300 is printed on 100, which simplifies the processing procedure and improves the production efficiency. At the same time, it also reduces the risk of loose connection pins. Because the secondary printed coil is built into the power PCB 300, reducing the number of components of a separate transformer, reducing costs.
  • the power PCB 100 is at least two layers;
  • the secondary printed coil 300 includes a top secondary printed coil 310 and a bottom secondary printed coil 320; the top secondary printed coil 310 is printed on the power PCB.
  • the top layer 100 is arranged around the magnetic core 200; the bottom secondary printed coil 320 is printed on the power PCB.
  • the bottom layer of 100 is arranged around the magnetic core 200; the top secondary printed coil 310 and the bottom secondary printed coil 320 are electrically connected;
  • the primary flat coil 400 includes a top primary flat coil 410 and a bottom primary flat coil 420; the top primary flat coil 410 is close to the top secondary printed coil 310 and is disposed around the magnetic core 200; the bottom primary The flat coil 420 is closely adjacent to the bottom secondary printed coil 320 and is arranged around the magnetic core 200; the top primary flat coil 410 and the bottom primary flat coil 420 are electrically connected.
  • the secondary printed coil 300 includes a top secondary printed coil 310 and a bottom secondary printed coil 320, which are printed on the power PCB respectively.
  • 100 is a top layer and a bottom layer
  • the primary flat coil 400 includes a top primary flat coil 410 and a bottom primary flat coil 420, which are respectively closely attached to the top secondary printed coil 310 and the bottom secondary printed coil 320 to form a kind of Symmetrical structure, the top primary flat coil 410 and the bottom primary flat coil 420 can be flipped at will to meet the design of the transformer phase.
  • the primary flat coil 400 is a flat structure and closely overlaps the secondary printed coil 300, making the primary flat coil 400 The coupling with the secondary printed coil 300 is increased, and the leakage inductance is reduced.
  • the primary flat coil 400 is a power PCB 100 is a plane symmetrical setting, which has the advantages of convenient assembly, high production efficiency, and low material cost and labor cost.
  • the number of turns of the top primary flat coil 410 is the same as the number of turns of the bottom primary flat coil 420.
  • the efficiency of the transformer is improved.
  • top primary flat coil 410 and the bottom primary flat coil 420 are wound from a wire wrapped with an insulating material.
  • top primary flat coil 410 is glued to the top secondary printed coil 310
  • bottom primary flat coil 420 is glued to the bottom secondary printed coil 320.
  • the adhesion of the top primary flat coil 410 and the bottom primary flat coil 420 is performed by using an adhesive.
  • Adhesive is used for bonding. Simply apply the adhesive to the top secondary printed coil 310 and the bottom secondary printed coil 320, and then press the top primary flat coil 410 and the bottom primary flat coil 420 together. After the adhesive is cured, the top primary flat coil 410 and the bottom primary flat coil 420 can be fixed. This type of fixing is convenient and fast, and is conducive to improving production speed.
  • the use of adhesive bonding is equivalent to forming a heat dissipation layer between the primary flat coil 400 and the secondary printed coil 300, which is beneficial to the heat dissipation of the transformer.
  • the adhesive can be selected from thermoplastic adhesives, such as cellulose esters, polyamides, etc .; or thermosetting adhesives, such as epoxy resins, phenolic resins, urea resins, etc .; or synthetic rubber-based adhesives.
  • Adhesives such as neoprene, styrene-butadiene rubber, etc .; or rubber resin agents, such as phenolic-butyl acrylic, phenolic-chloroprene, etc.
  • the power PCB 100 is provided with a via 130; an end 312 of the top-level secondary printed coil 310 is electrically connected to a start of the bottom-level secondary printed coil 320 through a via; 311 and the end of the bottom secondary printed coil 320 are used for electrical connection with the output circuit.
  • the via 130 is a through-power PCB 100 through holes, the top secondary printed coil 310 and the bottom secondary printed coil 320 are electrically connected through the via 130, thereby reducing the complexity of the power PCB.
  • the top end 312 of the top secondary printed coil 310 is electrically connected to the start end of the bottom secondary printed coil 320 through a via hole 130.
  • a copper layer or a gold nickel layer may be formed in the via hole 130 by a plating process.
  • top secondary printed coil 310 and the bottom secondary printed coil 320 are respectively connected to the via 130 (that is, when the top secondary printed coil 310 and the bottom secondary printed coil 320 are printed Has been electrically connected to the copper layer of the via 130).
  • solder paste can also be soldered in the vias 130, but this form increases the soldering process, increases the soldering, and increases the uncertainty (easiness such as loosening) .
  • the starting end 311 of the top-level secondary printed coil 310 and the end of the bottom-level secondary printed coil 320 are electrically connected to the output circuit when printed.
  • the power PCB 100 is provided with a first primary pad 110, and the first primary pad 110 runs through the power PCB. 100; the end 412 of the top primary flat coil 410 and the start 421 of the bottom primary flat coil 420 are soldered to the first primary pad 110 to achieve electrical connection; the start end of the top primary flat coil 410 and all The end of the bottom primary flat coil 420 is used to be electrically connected to the input circuit;
  • the power PCB 100 is provided with second primary pads 120.
  • the number of the second primary pads 120 is two.
  • the start end 411 of the top primary flat coil 410 and the end 422 of the bottom primary flat coil 420 are respectively two.
  • the second primary pad 120 is soldered to be electrically connected to the input circuit.
  • the pads are used for soldering electronic components on the PCB and conducting with the formed circuit on the PCB.
  • the primary flat coil 400 since the primary flat coil 400 is wound by a wire wrapped with an insulating material, it must be separately installed on the power PCB. 100, not on the power PCB. So in the power PCB A first primary pad 110 and a second primary pad 120 are formed on 100, and an end 412 of the top primary flat coil 410 and a start 421 of the bottom primary flat coil 420 are respectively soldered to the first primary pad 110, so as to achieve electrical connection, soldering is achieved using solder paste.
  • the start end 411 of the top primary flat coil 410 and the end 422 of the bottom primary flat coil 420 are electrically connected to the input circuit, so that the touch flat coil 400 is electrically connected to the input circuit. Since the input circuit is printed on the power PCB On 100, the start end 411 of the top primary flat coil 410 and the end 422 of the bottom primary flat coil 420 are respectively soldered to the second primary pad 120, and the second primary pad 120 is electrically connected to the input circuit, that is, The input circuit is printed on the power PCB At 100 hours, it can be electrically connected to the second pad 120, or it can be electrically connected through printed copper foil (copper foil conductive circuit).
  • the number of the first primary pads 110 is two, and the two first primary pads 110 are electrically connected; an end 412 of the top primary flat coil 410 is connected to one of the first primary pads. 110, the starting end 421 of the bottom primary flat coil 420 is soldered to another first primary pad 110.
  • the end 412 of the top primary flat coil 410 and the start 421 of the bottom primary flat coil 420 are soldered to the first Primary pad 110.
  • the diameter of the first primary pad 110 needs to be large, and the amount of solder paste used is also large, which is likely to cause false soldering and loosening.
  • the number of the first primary pads 110 is set to two, and the end 412 of the top primary flat coil 410 is soldered to one of the first primary pads 110, and the bottom primary flat is flat.
  • the start end 421 of the coil 420 is soldered to another first primary pad 110 to avoid the occurrence of false soldering. Can be printed on the power PCB between the two first primary pads 110
  • the copper foils (copper foil conductive lines) formed on 100 are electrically connected, or the two first primary pads 110 are electrically connected through solder paste.
  • the second primary pad 120 runs through the power PCB. 100.
  • the second primary pad 120 is penetrated through the power PCB. 100 setting, so that the input circuit and output circuit can be printed on the top or bottom layer of the power PCB according to actual needs, so as to facilitate the production of the PCB.
  • the magnetic core 200 includes a first magnetic core 210 and a second magnetic core 220, and the first magnetic core 210 and the second magnetic core 220 hold the power supply PCB. 100, and the two are bonded together to form a closed magnetic circuit; a silicon pad is provided on the first magnetic core 210 or the second magnetic core 220, and the first magnetic core 210 or the second magnetic core The magnetic core 220 is in contact with a metal member through the silicone pad.
  • the magnetic core 200 is two identical EC-type magnetic cores, but is not limited to the EC-type magnetic core.
  • the magnetic core may also be a combination of an E-type magnetic core and an I-type magnetic core. , Can also be any other type of magnetic core.
  • the first magnetic core 210 and the second magnetic core 220 are bonded to each other, thereby covering the top primary flat coil 410 and the bottom primary flat coil 420 to form a closed magnetic circuit.
  • the common adhesive can be used for bonding.
  • the EC-type magnetic core includes a base plate 201, a winding post 202 provided on the base plate 201, and a pair of side plates 203 provided on the base plate 201.
  • the winding post 202 Located between a pair of side plates 203, the power PCB 100 is provided with a winding post through hole 101, and the secondary printed coil 300 and the primary flat coil 400 are arranged around the winding post through hole 101, and the windings of the first magnetic core 210 and the second magnetic core 220 are provided.
  • the wire post 202 is bonded through the winding post through hole 101;
  • the power supply PCB 100 is also provided with a side plate through hole 102, which is disposed adjacent to the secondary printed coil 300 and the primary flat coil 400, and the side plates of the first magnetic core 210 and the second magnetic core 220 203 is bonded through the side plate through hole 102.
  • a silicone pad is provided on the first magnetic core 210 or the second magnetic core 220, and the secondary printed coil 300 and the primary flat coil 400 can be closely contacted with the metal member through the silicone pad.
  • the generated heat is transferred to the magnetic core 200, and the heat is transferred to the metal member through the magnetic core 200.
  • the metal member can be manufactured into a plate shape, so the heat dissipation area is large, so that the heat can be quickly dissipated, and the overall heat dissipation efficiency of the flat panel transformer is improved.
  • the first magnetic core or the second magnetic core is closely attached to the metal back plate through a silica gel pad, thereby facilitating heat dissipation.
  • the power PCB 100 is printed with an input circuit and an output circuit; the input circuit is electrically connected to the primary flat coil 400, and the output circuit is electrically connected to the secondary printed coil 300.
  • the input circuit is a high-frequency conversion circuit
  • the output circuit is an output rectification circuit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Of Transformers For General Uses (AREA)

Abstract

本申请公开了一种平板变压器。所述平板变压器包括：电源PCB；磁芯，所述磁芯固定于所述电源PCB，用于形成闭合磁路；次级印制线圈，用于与输出电路电气相连，所述次级印制线圈印制于所述电源PCB，环绕所述磁芯设置；初级扁平线圈，用于与输入电路电气相连，所述初级扁平线圈紧贴所述次级印制线圈，环绕所述磁芯设置。本申请技术方案通过在电源PCB上印制成型次级印制线圈，从而简化加工工序，提高生产效率；同时也减少了连接针脚松动的风险隐患；由于次级印制线圈是内置在电源PCB上，减少了单独变压器的元件数量，降低了成本。

Description

平板变压器
技术领域
本申请涉及变压器技术领域，特别涉及一种平板变压器。
背景技术
随着平板显示技术的不断提升，平板电视在研发和生产上越来越趋向于超薄、节能，而电视中的电源往往是电视超薄设计的一个难点，电源中的变压器更是电源超薄设计的一个瓶颈。传统高频变压器一直就是电源变换器中的庞然大物，同时，它又是导致高频电磁辐射干扰的主要发生源。如何缩小变压器的体积实现高频电源变换器的功率密度，一直是业界的重点研究课题。从电磁学的基本理论可以得知，提高变换器的工作频率即可大大提高同一变压器所能传递的功率。无疑，电源产品向高功率密度和高效率方向发展，这是高频电源变换器今后发展的必然方向。
相对于传统方式的骨架变压器，使用现有印刷电路板制作技术，实现变压器平面绕组甚至线包总成的新工艺构造的平板变压器在提高开关电源的特性方面有较大的优势，平板变压器与传统变压器相比具有绕组间耦合性能好、效率高、漏磁小的特点。同时，平板变压器也是实现变压器薄型化、高频化的创新走向，并以其自身的诸多优点（如高频，低造型，低磁芯损耗等）被广泛运用在各种开关电源中。
传统方式的变压器是利用骨架来绕制初次级线圈，用一副磁芯穿过骨架并用胶带缠绕固定，缺点是制作工艺复杂，产品一致性差，初次级线圈耦合差，漏感较大。
目前现有的平板变压器是用一块印制铜箔线圈的PCB来取代传统方式的骨架线圈，其主要的装配方式有两种，第一种是在PCB两端每一个绕组都需要焊接连接针脚，然后再用这些若干连接针脚焊接固定在主线路PCB上；第二种是平板变压器先安装在底座上，然后再把底座的若干连接针脚焊接固定在主线路PCB上。这两种装配方式的缺点是：现有的平板变压器需要二次焊接才可以固定在主线路PCB上，其加工工序复杂，加工成本增高，生产效率降低；现有的平板变压器PCB面积都较小，空间所限，所有若干连接针脚都较细，二次焊接在主线路PCB上，在长途运输的颠簸过程中有断针松动的风险隐患；而平板变压器使用底座的装配方式就会增加成本，降低企业的利润和竞争力。
申请内容
本申请的主要目的是提供一种平板变压器，旨在解决现有平板变压器固定在PCB上加工复杂且针脚容易松动的问题。
为实现上述目的，本申请公开了一种平板变压器，所述平板变压器包括：
电源PCB；
磁芯，所述磁芯固定于所述电源PCB，用于形成闭合磁路；
次级印制线圈，用于与输出电路电气相连，所述次级印制线圈印制于所述电源PCB，环绕所述磁芯设置；以及，
初级扁平线圈，用于与输入电路电气相连，所述初级扁平线圈紧贴所述次级印制线圈，环绕所述磁芯设置。
可选地，所述电源PCB至少为两层；
所述次级印制线圈包括顶层次级印制线圈和底层次级印制线圈；所述顶层次级印制线圈印制于所述电源PCB的顶层，环绕所述磁芯设置；所述底层次级印制线圈印制于所述电源PCB的底层，环绕所述磁芯设置；所述顶层次级印制线圈和所述底层次级印制线圈电气相连；
所述初级扁平线圈包括顶层初级扁平线圈和底层初级扁平线圈；所述顶层初级扁平线圈紧贴所述顶层次级印制线圈，环绕所述磁芯设置；所述底层初级扁平线圈紧贴所述底层次级印制线圈，环绕所述磁芯设置；所述顶层初级扁平线圈和所述底层初级扁平线圈电气相连。
可选地，所述顶层初级扁平线圈的匝数和所述底层初级扁平线圈的匝数相同；
和/或，所述顶层初级扁平线圈和所述底层初级扁平线圈由包裹绝缘材料的导线绕制而成。
可选地，所述顶层初级扁平线圈胶黏于所述顶层次级印制线圈；
和/或，所述底层初级扁平线圈胶黏于所述底层次级印制线圈。
可选地，所述顶层初级扁平线圈和所述底层初级扁平线圈通过胶黏剂进行粘结。
可选地，所述电源PCB设有过孔；所述顶层次级印制线圈的末端通过过孔与所述底层次级印制线圈的起始端电气相连；所述顶层次级印制线圈的起始端和所述底层次级印制线圈的末端用于与输出电路电气相连。
可选地，所述电源PCB设有第一初级焊盘，所述第一初级焊盘贯穿所述电源PCB；所述顶层初级扁平线圈的末端和所述底层初级扁平线圈的起始端焊接至所述第一初级焊盘实现电气相连；所述顶层初级扁平线圈的起始端和所述底层初级扁平线圈的末端用于与输入电路电气相连；
和/或，所述电源PCB设有第二初级焊盘，所述第二初级焊盘的数量为两个，所述顶层初级扁平线圈的起始端和所述底层初级扁平线圈的末端分别与两个所述第二初级焊盘焊接，用于与输入电路电气相连。
可选地，所述电源PCB 设有第一初级焊盘时，所述第一初级焊盘的数量为两个，两个所述第一初级焊盘电气相连；所述顶层初级扁平线圈的末端与其中一个所述第一初级焊盘焊接，所述底层初级扁平线圈的起始端与另外一个所述第一初级焊盘焊接。
可选地，所述电源PCB 设有第一初级焊盘时，所述第一初级焊盘的数量为一个时，所述顶层初级扁平线圈的末端和所述底层初级扁平线圈的起始端同时焊接至该第一初级焊盘。
可选地，所述电源PCB 设有第二初级焊盘时，所述第二初级焊盘贯穿所述电源PCB。
可选地，所述磁芯包括第一磁芯和第二磁芯，所述第一磁芯和所述第二磁芯夹持所述电源PCB，且两者之间粘结，用于形成闭合磁路；
或，所述磁芯包括第一磁芯和第二磁芯，所述第一磁芯和所述第二磁芯夹持所述电源PCB，且两者之间粘结，用于形成闭合磁路；所述第一磁芯或所述第二磁芯上设有硅胶垫，所述第一磁芯或所述第二磁芯通过该硅胶垫与金属构件接触。
可选地，所述磁芯为EC型磁芯，所述EC型磁芯包括底板，设于所述底板上的绕线柱，以及设于所述底板上的一对侧板，所述绕线柱设于一对侧板之间，所述电源PCB 上设有绕线柱通孔，所述次级印制线圈和初级扁平线圈环绕所述绕线柱通孔设置，所述第一磁芯和第二磁芯的绕线柱透过该绕线柱通孔粘结；所述电源PCB 上还设有侧板通孔，所述侧板通孔紧邻所述次级印制线圈和初级扁平线圈设置，所述第一磁芯和第二磁芯的侧板通过该侧板通孔粘结。
可选地，所述电源PCB印制有输入电路和输出电路；所述输入电路与初级扁平线圈电气相连，所述输出电路与次级印制线圈电气相连。
本申请技术方案通过在电源PCB上印制成型次级印制线圈，从而简化加工工序，提高生产效率；同时也减少了连接针脚松动的风险隐患；由于次级印制线圈是内置在电源PCB上，减少了单独变压器的元件数量，降低了成本。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为电源PCB集成次级印制线圈示意图（顶层）；
图2为顶层初级扁平线圈示意图；
图3为底层初级扁平线圈示意图；
图4为电源PCB与次级印制线圈和初级扁平线圈分解示意图（次级印制线圈是印制于电源PCB上，图示为画法为了便于理解）；
图5为磁芯结构示意图。
附图标号说明：
标号 名称 标号 名称
100 电源PCB 300 次级印制线圈
110 第一初级焊盘 310 顶层次级印制线圈
120 第二初级焊盘 311 起始端
130 过孔 312 末端
101 绕线柱通孔 320 底层次级印制线圈
102 侧板通孔 400 初级扁平线圈
200 磁芯 410 顶层初级扁平线圈
210 第一磁芯 411 起始端
220 第二磁芯 412 末端
201 底板 420 底层初级扁平线圈
202 绕线柱 421 起始端
203 侧板 422 末端
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
在本申请中，除非另有明确的规定和限定，术语“连接”、“固定”等应做广义理解，例如，“固定”可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
另外，在本申请中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种平板变压器。
如图1至图5所示，在本申请实施例中，该平板变压器包括：
电源PCB 100；
磁芯200，所述磁芯200固定于所述电源PCB 100，用于形成闭合磁路；
次级印制线圈300，用于与输出电路电气相连，所述次级印制线圈300印制于所述电源PCB 100，环绕所述磁芯200设置；
初级扁平线圈400，用于与输入电路电气相连，所述初级扁平线圈400紧贴所述次级印制线圈300，环绕所述磁芯200设置。
在本申请中，所述电源PCB 100为电源系统中的重要组成部分，PCB即为印制电路板，是电子元器件的支撑体，是电子元器件电气相连的载体，不同的电源系统，其电源PCB也不尽相同。PCB的制作一般通过如下流程：开料-钻孔-沉铜-图形转移-图形电镀-腿膜-蚀刻-绿油-字符-镀金手指-成型-测试-终检。根据工艺的不同，上述制作流程也略有不同。
所述磁芯200的作用是加强初级扁平线圈400和次级印制线圈300间的磁耦合，当变压器工作时，有磁力线穿过，在于磁力线垂直的平面上就会产生感应电流。磁芯200一般由各种氧化铁混合物组成的一种烧结磁性金属氧化物，例如锰-锌铁氧体和镍-锌铁氧体是典型的磁芯体材料。磁芯200的种类包括但不限于RM型磁芯，EC型磁芯，PQ型磁芯，E型磁性，I型磁芯等。本申请的磁芯200固定于电源PCB 100，固定的方式有多种，包括但不限于粘结（使用胶黏剂粘结）、或在电源PCB开设通孔，于该通孔嵌入固定。
所述次级印制线圈300是直接在电源PCB 100上印制而成，该次级印制线圈300的印制可参考PCB板上的线路的制作，其材料可为铜，下同。由于次级印制线圈300是直接印制在电源PCB 100上，因此无需焊接连接针脚便可直接通过印制在电源PCB 100上的输出电路电气连接。所述次级印制线圈300与输出电路的电气连接可通过铜箔（通过印制而成）实现，也即次级印制线圈300、输出电路和连接次级印制线圈300与输出电路的铜箔均采用印制而成，因此能减少连接针脚断针松动的风险隐患。而又由于次级印制线圈300是直接印制在电源PCB 100上，因此减少了单独变压器的元件数量，降低了成本。
所述初级扁平线圈400采用已经成型好的包裹绝缘材料的导线绕制而成，紧贴于所述次级印制线圈300，彼此绝缘。紧贴的方式有多种，包括但不限于粘结（通过胶黏剂），或在电源PCB 100上设置固定结构对初级扁平线圈400进行固定。输入电路如同输出电路一样，印制于电源PCB 100上，因此初级扁平线圈400可通过焊接的方式与输入电路电气相连。
本申请技术方案通过在电源PCB 100上印制成型次级印制线圈300，从而简化加工工序，提高生产效率；同时也减少了连接针脚松动的风险隐患；由于次级印制线圈是内置在电源PCB 300上，减少了单独变压器的元件数量，降低了成本。
进一步地，如图1至图4所示，所述电源PCB 100至少为两层；
所述次级印制线圈300包括顶层次级印制线圈310和底层次级印制线圈320；所述顶层次级印制线圈310印制于所述电源PCB 100的顶层，环绕所述磁芯200设置；所述底层次级印制线圈320印制于所述电源PCB 100的底层，环绕所述磁芯200设置；所述顶层次级印制线圈310和所述底层次级印制线圈320电气相连；
所述初级扁平线圈400包括顶层初级扁平线圈410和底层初级扁平线圈420；所述顶层初级扁平线圈410紧贴所述顶层次级印制线圈310，环绕所述磁芯200设置；所述底层初级扁平线圈420紧贴所述底层次级印制线圈320，环绕所述磁芯200设置；所述顶层初级扁平线圈410和所述底层初级扁平线圈420电气相连。
在本申请实施例中，所述次级印制线圈300包括顶层次级印制线圈310和底层次级印制线圈320，分别印制于电源PCB 100的顶层和底层，所述初级扁平线圈400包括顶层初级扁平线圈410和底层初级扁平线圈420，分别紧贴于所述顶层次级印制线圈310和底层次级印制线圈320，形成一种对称的结构，顶层初级扁平线圈410和底层初级扁平线圈420可随意翻转，满足变压器相位的设计；同时初级扁平线圈400是扁平结构，与次级印制线圈300紧密叠合，使得初级扁平线圈400和次级印制线圈300之间的耦合增加，漏感减小。此外，初级扁平线圈400以电源PCB 100为平面对称设置，具有组装方便，生产效率高，且同时具有材料成本和人力成本较低的优点。
进一步地，所述顶层初级扁平线圈410的匝数和所述底层初级扁平线圈420的匝数相同。通过将顶层初级扁平线圈410的匝数和底层初级扁平线圈420的匝数设置呈相同，提高变压器的效率。
进一步地，所述顶层初级扁平线圈410和所述底层初级扁平线圈420由包裹绝缘材料的导线绕制而成。
进一步地，所述顶层初级扁平线圈410胶黏于所述顶层次级印制线圈310，所述底层初级扁平线圈420胶黏于所述底层次级印制线圈320。
在本申请中，对于顶层初级扁平线圈410和所述底层初级扁平线圈420的胶黏，通过采用胶黏剂进行粘结。使用胶黏剂进行粘结，只需将胶黏剂涂布于顶层次级印制线圈310和底层次级印制线圈320，再将顶层初级扁平线圈410和底层初级扁平线圈420压合，待胶黏剂固化后即可固定顶层初级扁平线圈410和底层初级扁平线圈420，这种固定形式方便快捷，有利于提高生产速度。而且，使用胶黏剂粘结，相当于在初级扁平线圈400和次级印制线圈300之间形成一层散热层，有利于变压器的散热。所述胶黏剂可选用热塑型胶黏剂，如纤维素酯、聚酰胺等；或选用热固型胶黏剂，如环氧树脂、酚醛树脂、脲醛树脂等；或选用合成橡胶型胶黏剂，如氯丁橡胶、丁苯橡胶等；或选用橡胶树脂剂，如酚醛-丁晴胶、酚醛-氯丁胶等。
进一步地，如图1所示，所述电源PCB 100设有过孔130；所述顶层次级印制线圈310的末端312通过过孔与所述底层次级印制线圈320的起始端电气相连；所述顶层次级印制线圈310的起始端311和所述底层次级印制线圈320的末端用于与输出电路电气相连。
在本申请实施例中，所述的末端和起始端为相对而言，线圈的一端为起始端，另一端则为末端，反之亦是，下同。所述过孔130为贯穿电源PCB 100的通孔，顶层次级印制线圈310和底层次级印制线圈320通过过孔130进行电气相连，从而降低了电源PCB的复杂度。例如，所述顶层次级印制线圈310的末端312通过过孔130与所述底层次级印制线圈320的起始端电气相连可以为，通过电镀工艺在过孔130形成铜层或金镍层或锡层，然后顶层次级印制线圈310和底层次级印制线圈320分别连接至该过孔130（也即顶层次级印制线圈310和底层次级印制线圈320在印制的时候已与该过孔130的铜层电气相连）。如不采用在过孔镀层的方式，也可以在过孔130焊接锡膏的形式，但是这种形式就增加了焊接的工艺，增加了焊接也增加了不确定性（易松动等不确定性）。所述顶层次级印制线圈310的起始端311和所述底层次级印制线圈320的末端在印制成型的时候即与输出电路电气相连。
进一步地，如图1所示，所述电源PCB 100设有第一初级焊盘110，所述第一初级焊盘110贯穿所述电源PCB 100；所述顶层初级扁平线圈410的末端412和所述底层初级扁平线圈420的起始端421焊接至所述第一初级焊盘110实现电气相连；所述顶层初级扁平线圈410的起始端和所述底层初级扁平线圈420的末端用于与输入电路电气相连；
所述电源PCB 100设有第二初级焊盘120，所述第二初级焊盘120的数量为两个，所述顶层初级扁平线圈410的起始端411和所述底层初级扁平线圈420的末端422分别与两个所述第二初级焊盘120焊接，用于与输入电路电气相连。
焊盘用于将电子元器件焊接在PCB上，并与PCB上成型好的电路导通。在本申请实施例中，由于初级扁平线圈400是由包裹绝缘材料的导线绕制而成，要单独安装于电源PCB 100上，而非在电源PCB上成型而成。因此，在电源PCB 100上形成有第一初级焊盘110和第二初级焊盘120，所述顶层初级扁平线圈410的末端412和所述底层初级扁平线圈420的起始端421分别焊接至所述第一初级焊盘110，从而实现电气相连，焊接采用锡膏实现。
所述顶层初级扁平线圈410的起始端411和所述底层初级扁平线圈420的末端422与输入电路电气相连，实现了触及扁平线圈400电气连接至输入电路。由于输入电路为印制于电源PCB 100上，所述顶层初级扁平线圈410的起始端411和所述底层初级扁平线圈420的末端422分别焊接至第二初级焊盘120，通过该第二初级焊盘120与输入电路电气相连，即输入电路在印制于电源PCB 100时，即可与第二焊盘120电气相连，或通过印制的成型的铜箔（铜箔导电线路）电气相连。
进一步地，所述第一初级焊盘110的数量为两个，两个所述第一初级焊盘110电气相连；所述顶层初级扁平线圈410的末端412与其中一个所述第一初级焊盘110焊接，所述底层初级扁平线圈420的起始端421与另外一个所述第一初级焊盘110焊接。
在本申请中实施例中，当第一初级焊盘110的数量为一个时，所述顶层初级扁平线圈410的末端412和所述底层初级扁平线圈420的起始端421要同时焊接至该第一初级焊盘110。为了要同时焊接固定两个初级扁平线圈的端部，该第一初级焊盘110的孔径要做大，而且焊接的锡膏用量也较多，容易造成虚焊，易出现松动。为了避免这种情况，将所述第一初级焊盘110的数量设置为两个，所述顶层初级扁平线圈410的末端412与其中一个所述第一初级焊盘110焊接，所述底层初级扁平线圈420的起始端421与另外一个所述第一初级焊盘110焊接，避免虚焊的发生。两个第一初级焊盘110之间可通过印制在电源PCB 100上成型的铜箔（铜箔导电线路）电气相连，或两个第一初级焊盘110之间通过焊接的锡膏电气相连。
进一步地，所述第二初级焊盘120贯穿所述电源PCB 100。在本实施例中，将所述第二初级焊盘120贯穿所述电源PCB 100设置，使得所述输入电路和输出电路可根据实际需要印制于电源PCB的顶层或底层，以方便PCB的制作。
进一步地，如图5所示，所述磁芯200包括第一磁芯210和第二磁芯220，所述第一磁芯210和所述第二磁芯220夹持所述电源PCB 100，且两者之间粘结，用于形成闭合磁路；所述第一磁芯210或所述第二磁芯220上设有硅胶垫，所述第一磁芯210或所述第二磁芯220通过该硅胶垫与金属构件接触。
在本申请实施例中，所述磁芯200为两个相同的EC型磁芯，但是并不局限于EC型磁芯，所述磁芯也可为E型磁芯和I型磁芯的组合，还可为其他任何类型的磁芯。所述第一磁芯210和第二磁芯220之间粘结，从而包覆顶层初级扁平线圈410和底层初级扁平线圈420，形成闭合磁路。粘结采用常见的胶黏剂即可。具体地，在本申请实施例中，所述EC型磁芯包括底板201，设于底板201上的绕线柱202，以及设于底板201上的一对侧板203，所述绕线柱202设于一对侧板203之间，所述电源PCB 100上设有绕线柱通孔101，所述次级印制线圈300和初级扁平线圈400环绕所述绕线柱通孔101设置，所述第一磁芯210和第二磁芯220的绕线柱202透过该绕线柱通孔101粘结；所述电源PCB 100上还设有侧板通孔102，所述侧板通孔102紧邻所述次级印制线圈300和初级扁平线圈400设置，所述第一磁芯210和第二磁芯220的侧板203通过该侧板通孔102粘结。
在本申请实施例中，在所述第一磁芯210或第二磁芯220上设有硅胶垫，通过该硅胶垫与金属构件紧密接触，可以将次级印制线圈300和初级扁平线圈400产生的热量传递至磁芯200上，再通过磁芯200把热量传递至金属构件上。金属构件可制造成板状，因此散热面积大，从而能将热量快速散发出去，提高了平板变压器的整体散热效率。例如，电视机中的金属背板（其主要骨架作用），第一磁芯或第二磁芯通过硅胶垫紧贴金属背板，从而有利于散热。
进一步地，所述电源PCB 100印制有输入电路和输出电路；所述输入电路与初级扁平线圈400电气相连，所述输出电路与次级印制线圈300电气相连。在本申请实施例中，所述输入电路为高频变换电路，所述输出电路为输出整流电路
以上所述仅为本申请的优选实施例，并非因此限制本申请的专利范围，凡是在本申请的申请构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (14)

  1. 一种平板变压器，其中，所述平板变压器包括：
    电源PCB；
    磁芯，所述磁芯固定于所述电源PCB，用于形成闭合磁路；
    次级印制线圈，用于与输出电路电气相连，所述次级印制线圈印制于所述电源PCB，环绕所述磁芯设置；以及，
    初级扁平线圈，用于与输入电路电气相连，所述初级扁平线圈紧贴所述次级印制线圈，环绕所述磁芯设置。
  2. 如权利要求1所述的平板变压器，其中，所述电源PCB至少为两层；
    所述次级印制线圈包括顶层次级印制线圈和底层次级印制线圈；所述顶层次级印制线圈印制于所述电源PCB的顶层，环绕所述磁芯设置；所述底层次级印制线圈印制于所述电源PCB的底层，环绕所述磁芯设置；所述顶层次级印制线圈和所述底层次级印制线圈电气相连；
    所述初级扁平线圈包括顶层初级扁平线圈和底层初级扁平线圈；所述顶层初级扁平线圈紧贴所述顶层次级印制线圈，环绕所述磁芯设置；所述底层初级扁平线圈紧贴所述底层次级印制线圈，环绕所述磁芯设置；所述顶层初级扁平线圈和所述底层初级扁平线圈电气相连。
  3. 如权利要求2所述的平板变压器，其中，所述顶层初级扁平线圈的匝数和所述底层初级扁平线圈的匝数相同；
    和/或，所述顶层初级扁平线圈和所述底层初级扁平线圈由包裹绝缘材料的导线绕制而成。
  4. 如权利要求2所述的平板变压器，其中，所述顶层初级扁平线圈胶黏于所述顶层次级印制线圈；
    和/或，所述底层初级扁平线圈胶黏于所述底层次级印制线圈。
  5. 如权利要求2所述的平板变压器，其中，所述顶层初级扁平线圈和所述底层初级扁平线圈通过胶黏剂进行粘结。
  6. 如权利要求2所述的平板变压器，其中，所述电源PCB设有过孔；所述顶层次级印制线圈的末端通过过孔与所述底层次级印制线圈的起始端电气相连；所述顶层次级印制线圈的起始端和所述底层次级印制线圈的末端用于与输出电路电气相连。
  7. 如权利要求2至6中任一所述的平板变压器，其中，所述电源PCB设有第一初级焊盘，所述第一初级焊盘贯穿所述电源PCB；所述顶层初级扁平线圈的末端和所述底层初级扁平线圈的起始端焊接至所述第一初级焊盘实现电气相连；所述顶层初级扁平线圈的起始端和所述底层初级扁平线圈的末端用于与输入电路电气相连；
    和/或，所述电源PCB设有第二初级焊盘，所述第二初级焊盘的数量为两个，所述顶层初级扁平线圈的起始端和所述底层初级扁平线圈的末端分别与两个所述第二初级焊盘焊接，用于与输入电路电气相连。
  8. 如权利要求7所述的平板变压器，其中，所述电源PCB 设有第一初级焊盘时，所述第一初级焊盘的数量为两个，两个所述第一初级焊盘电气相连；所述顶层初级扁平线圈的末端与其中一个所述第一初级焊盘焊接，所述底层初级扁平线圈的起始端与另外一个所述第一初级焊盘焊接。
  9. 如权利要求7所述的平板变压器，其中，所述电源PCB 设有第一初级焊盘时，所述第一初级焊盘的数量为一个时，所述顶层初级扁平线圈的末端和所述底层初级扁平线圈的起始端同时焊接至该第一初级焊盘。
  10. 如权利要求7所述的平板变压器，其中，所述电源PCB 设有第二初级焊盘时，所述第二初级焊盘贯穿所述电源PCB。
  11. 如权利要求1至6中任一所述的平板变压器，其中，所述磁芯包括第一磁芯和第二磁芯，所述第一磁芯和所述第二磁芯夹持所述电源PCB，且两者之间粘结，用于形成闭合磁路。
  12. 如权利要求1至6中任一所述的平板变压器，其中，所述磁芯包括第一磁芯和第二磁芯，所述第一磁芯和所述第二磁芯夹持所述电源PCB，且两者之间粘结，用于形成闭合磁路；所述第一磁芯或所述第二磁芯上设有硅胶垫，所述第一磁芯或所述第二磁芯通过该硅胶垫与金属构件接触。
  13. 如权利要求12所述的平板变压器，所述磁芯为EC型磁芯，所述EC型磁芯包括底板，设于所述底板上的绕线柱，以及设于所述底板上的一对侧板，所述绕线柱设于一对侧板之间，所述电源PCB 上设有绕线柱通孔，所述次级印制线圈和初级扁平线圈环绕所述绕线柱通孔设置，所述第一磁芯和第二磁芯的绕线柱透过该绕线柱通孔粘结；所述电源PCB 上还设有侧板通孔，所述侧板通孔紧邻所述次级印制线圈和初级扁平线圈设置，所述第一磁芯和第二磁芯的侧板通过该侧板通孔粘结。
  14. 如权利要求1至6中任一所述的平板变压器，其中，所述电源PCB印制有输入电路和输出电路；所述输入电路与初级扁平线圈电气相连，所述输出电路与次级印制线圈电气相连。
PCT/CN2019/089827 2018-08-13 2019-06-03 平板变压器 WO2020034730A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201821301215.7U CN208444728U (zh) 2018-08-13 2018-08-13 平板变压器
CN201821301215.7 2018-08-13

Publications (1)

Publication Number Publication Date
WO2020034730A1 true WO2020034730A1 (zh) 2020-02-20

Family

ID=65086016

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/089827 WO2020034730A1 (zh) 2018-08-13 2019-06-03 平板变压器

Country Status (2)

Country Link
CN (1) CN208444728U (zh)
WO (1) WO2020034730A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208444728U (zh) * 2018-08-13 2019-01-29 深圳Tcl新技术有限公司 平板变压器
CN110706899A (zh) * 2019-09-26 2020-01-17 青岛鼎信通讯股份有限公司 应用于终端及电表方案的高速磁耦合pcb变压器
CN115714062B (zh) * 2022-11-28 2023-07-04 超聚变数字技术有限公司 开关电源及计算设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101017730A (zh) * 2006-02-08 2007-08-15 台达电子工业股份有限公司 变压器结构
CN203134536U (zh) * 2012-09-17 2013-08-14 深圳Tcl新技术有限公司 平板变压器、平板电感及谐振电路
CN106449042A (zh) * 2016-10-24 2017-02-22 广安鑫宇电子有限公司 一种高效率平面变压器
CN108335879A (zh) * 2018-04-19 2018-07-27 优尔特电子（深圳）有限公司 一种平面变压器、电子设备及平面变压器制作方法
CN208444728U (zh) * 2018-08-13 2019-01-29 深圳Tcl新技术有限公司 平板变压器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101017730A (zh) * 2006-02-08 2007-08-15 台达电子工业股份有限公司 变压器结构
CN203134536U (zh) * 2012-09-17 2013-08-14 深圳Tcl新技术有限公司 平板变压器、平板电感及谐振电路
CN106449042A (zh) * 2016-10-24 2017-02-22 广安鑫宇电子有限公司 一种高效率平面变压器
CN108335879A (zh) * 2018-04-19 2018-07-27 优尔特电子（深圳）有限公司 一种平面变压器、电子设备及平面变压器制作方法
CN208444728U (zh) * 2018-08-13 2019-01-29 深圳Tcl新技术有限公司 平板变压器

Also Published As

Publication number Publication date
CN208444728U (zh) 2019-01-29

Similar Documents

Publication Publication Date Title
WO2020034730A1 (zh) 平板变压器
TWI420286B (zh) 電源模組及其電路板組合
WO2018010404A1 (zh) 电源及电气设备
CN208444729U (zh) 一种变比及过电流能力可调的平面变压器
WO2019091353A1 (zh) 一种平板变压器及开关电源适配器
CN212113411U (zh) 一种多层板多路输出的平面变压器
WO2024012004A1 (zh) 平面变压组件及平面变压装置
JPH08236365A (ja) 平板状トランス
WO2023087842A1 (zh) 宇航电源产品的大功率模块集成电路装置及其安装方法
WO2022045686A1 (ko) 전자 부품 및 이의 제조 방법
WO2024106920A1 (ko) 트랜스포머 및 디스플레이 장치
CN209731706U (zh) 一种多层金手指印制电路板
CN116525272A (zh) 磁性元件
CN209216714U (zh) 一种平面变压器和电源
WO2023018067A1 (ko) 코일 부품
CN208016188U (zh) 一种高频变换器
CN204497036U (zh) 一种简易结构的变压器
CN217444203U (zh) 一种多块pcb平板叠加线圈的平板变压器
JP2010199484A (ja) 電子回路装置
CN217982990U (zh) 一种应用于电力设备组合电感器
CN210489379U (zh) 超薄可粘电感器
CN210778186U (zh) 一种平板变压器
WO2022039556A1 (ko) 자성 소자 및 이를 포함하는 회로 기판
CN216054211U (zh) 一种并联变压器
WO2022059823A1 (ko) 고조파 저감용 리액터

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19849112

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19849112

Country of ref document: EP

Kind code of ref document: A1