WO2020050690A3 - Led 조명 모듈 - Google Patents
Led 조명 모듈 Download PDFInfo
- Publication number
- WO2020050690A3 WO2020050690A3 PCT/KR2019/011564 KR2019011564W WO2020050690A3 WO 2020050690 A3 WO2020050690 A3 WO 2020050690A3 KR 2019011564 W KR2019011564 W KR 2019011564W WO 2020050690 A3 WO2020050690 A3 WO 2020050690A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lighting module
- led lighting
- via hole
- backplane
- heat
- Prior art date
Links
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
본 발명은 LED 조명 모듈에 관한 것으로서, 상기 LED 조명 모듈은 LED 칩, 상기 LED 칩의 하부에 위치하는 백 플레인 보드, 상기 백 플레인 보드의 하부에 위치하며, 제1 방향으로 위치하고 상기 백 플레인 보드로부터 전달되는 열을 상기 제1 방향으로 전달하는 비아홀 및 상기 제1 방향과 교차하는 제2 방향으로 위치하고 상기 비아홀로부터 전달되는 상기 열을 상기 제2 방향으로 전달하는 내부 방열 패턴을 구비하는 제1 인쇄회로기판, 그리고 상기 제1 인쇄회로기판의 하부에 상기 비아홀과 대면하게 위치하고 금속으로 이루어져 있는 제1 방열부를 포함한다.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0106551 | 2018-09-06 | ||
KR20180106551 | 2018-09-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2020050690A2 WO2020050690A2 (ko) | 2020-03-12 |
WO2020050690A3 true WO2020050690A3 (ko) | 2020-04-30 |
Family
ID=69722940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2019/011564 WO2020050690A2 (ko) | 2018-09-06 | 2019-09-06 | Led 조명 모듈 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR102375356B1 (ko) |
WO (1) | WO2020050690A2 (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005038935A1 (ja) * | 2003-10-15 | 2005-04-28 | Nichia Corporation | 発光装置 |
KR20090001849A (ko) * | 2007-05-28 | 2009-01-09 | 한국광기술원 | 열전달 비아홀을 구비한 발광 다이오드 패키지 및 그의제조방법 |
KR20120034182A (ko) * | 2012-03-07 | 2012-04-10 | 안홍림 | 열 확산 기능을 가지는 복합방열기구 |
KR101516612B1 (ko) * | 2014-12-29 | 2015-05-15 | 영남엘이디 주식회사 | Pcb 그라운드를 이용하는 방열시스템을 구비한 led 조명등. |
KR20150112484A (ko) * | 2014-03-28 | 2015-10-07 | 인텔렉추얼디스커버리 주식회사 | 방열 구조체 및 이를 포함하는 발광 장치 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005001943A1 (en) * | 2003-06-30 | 2005-01-06 | Koninklijke Philips Electronics N.V. | Light-emitting diode thermal management system |
KR101163777B1 (ko) * | 2005-08-23 | 2012-07-11 | 엘지이노텍 주식회사 | Rf집적모듈 및 rf집적모듈의 열방출형 기판 제조 방법 |
JP2007088078A (ja) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | 発光装置 |
KR20080007961A (ko) | 2006-07-19 | 2008-01-23 | 알티전자 주식회사 | 엘이디 모듈의 냉각 장치 및 그 제조 방법 |
JP2011044612A (ja) * | 2009-08-21 | 2011-03-03 | Panasonic Electric Works Co Ltd | 発光装置 |
KR101281340B1 (ko) | 2011-12-26 | 2013-07-02 | 주식회사 포스코 | 방열구조를 가지는 인쇄회로기판 및 이를 포함하는 led 조명장치 |
KR101469665B1 (ko) * | 2013-02-04 | 2014-12-10 | 해동전설 주식회사 | Led 고효율 방열을 위한 pcb 기판 구조 |
JP2015170684A (ja) * | 2014-03-06 | 2015-09-28 | 三菱電機株式会社 | 半導体パッケージ |
JP6481575B2 (ja) * | 2015-09-18 | 2019-03-13 | 東芝ライテック株式会社 | 発光装置、投光器及び発光装置の製造方法 |
KR101824001B1 (ko) * | 2015-12-29 | 2018-03-22 | 주식회사디케이이 | 방열특성 내열 인쇄회로기판 제조방법 |
-
2019
- 2019-09-06 KR KR1020190110468A patent/KR102375356B1/ko active IP Right Grant
- 2019-09-06 WO PCT/KR2019/011564 patent/WO2020050690A2/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005038935A1 (ja) * | 2003-10-15 | 2005-04-28 | Nichia Corporation | 発光装置 |
KR20090001849A (ko) * | 2007-05-28 | 2009-01-09 | 한국광기술원 | 열전달 비아홀을 구비한 발광 다이오드 패키지 및 그의제조방법 |
KR20120034182A (ko) * | 2012-03-07 | 2012-04-10 | 안홍림 | 열 확산 기능을 가지는 복합방열기구 |
KR20150112484A (ko) * | 2014-03-28 | 2015-10-07 | 인텔렉추얼디스커버리 주식회사 | 방열 구조체 및 이를 포함하는 발광 장치 |
KR101516612B1 (ko) * | 2014-12-29 | 2015-05-15 | 영남엘이디 주식회사 | Pcb 그라운드를 이용하는 방열시스템을 구비한 led 조명등. |
Also Published As
Publication number | Publication date |
---|---|
WO2020050690A2 (ko) | 2020-03-12 |
KR102375356B1 (ko) | 2022-03-17 |
KR20200028319A (ko) | 2020-03-16 |
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