WO2020050167A1

WO2020050167A1 - Adhesive tape for dicing and method for manufacturing semiconductor chips

Info

Publication number: WO2020050167A1
Application number: PCT/JP2019/034126
Authority: WO
Inventors: 晃良増田; 敬之下田; 貴広酒井
Original assignee: マクセルホールディングス株式会社
Priority date: 2018-09-03
Filing date: 2019-08-30
Publication date: 2020-03-12
Also published as: KR20210056334A; TWI799618B; JPWO2020050167A1; TW202020094A; KR102632461B1; JP7374909B2; CN112602172A; JP2023138530A

Abstract

An adhesive tape for dicing, said adhesive tape comprising a substrate and a silicone adhesive layer laminated on the substrate, to be used in dividing a semiconductor material, which comprises multiple semiconductor elements coated with a coating material, into multiple semiconductor chips, wherein: the silicone adhesive layer comprises an addition reaction-type silicone adhesive as a main agent together with a photoresponsive platinum (Pt) catalyst and a crosslinking agent for the addition reaction-type silicone adhesive; the ratio by mass of a silicone gum to a silicone resin ranges from 35/65 to 50/50; and the content of a silicone gum having an alkenyl group ranges from 35 mass% to 50 mass% inclusive relative to the total mass of the silicone gum and the silicone resin.

Description

Pressure-sensitive adhesive tape for dicing and method for producing semiconductor chip

The present invention relates to an adhesive tape for dicing used for dicing a semiconductor material to be a material of a semiconductor chip, and a method for manufacturing a semiconductor chip using the adhesive tape for dicing.

2. Description of the Related Art Conventionally, an adhesive tape having an adhesive layer made of an acrylic resin is known as an adhesive tape for dicing used for manufacturing a semiconductor chip having an LED (Light Emitting Diode) or the like (see Patent Document 1). .
Further, as an adhesive tape for dicing used for manufacturing a semiconductor chip having an LED or the like, an adhesive tape having an adhesive layer made of a silicone resin is known (see Patent Documents 2 and 3).
Further, as a method of manufacturing a semiconductor chip using an adhesive tape for dicing, an adhesive tape is attached to a substrate side of a semiconductor element substrate having a plurality of semiconductor elements formed on a substrate, and the semiconductor element substrate is cut by a dicer. A known method is known (see Patent Document 4).

JP 2013-38408 A JP-A-2005-050216 JP 2016-122812 A JP 2005-93503 A

By the way, in recent years, as a method of manufacturing a semiconductor chip singulated by dicing, a plurality of semiconductor elements are diced by attaching an adhesive tape to a semiconductor material covered with a coating material such as a sealing resin or a phosphor. A technology corresponding to a so-called wafer level CSP (chip scale package) process has been proposed.
As described above, when an adhesive tape is attached to a semiconductor material in which a semiconductor element is covered with a coating material, the adhesive strength is insufficient depending on the configuration of the adhesive layer in the adhesive tape, the material of the coating material, and the like. A fragmented semiconductor chip may be scattered. In addition, if the ball tack and the adhesive strength of the pressure-sensitive adhesive layer are designed to be high in order to suppress the scattering of the semiconductor chip, when the obtained semiconductor chip is peeled from the pressure-sensitive adhesive tape, the pressure-sensitive adhesive remains attached to the semiconductor chip. So-called glue residue may occur.

The present invention has good adhesive strength and tackiness to a semiconductor material having a plurality of semiconductor elements covered with a coating material, and has an adhesive to a semiconductor chip when a semiconductor chip singulated by dicing is peeled off. An object of the present invention is to provide a dicing pressure-sensitive adhesive tape in which the remainder is suppressed, and a method for manufacturing a semiconductor chip using the same.

The present inventors have conducted intensive studies on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for dicing for this purpose. As a result, the pressure-sensitive adhesive layer was crosslinked at least with the addition-reaction-type silicone pressure-sensitive adhesive and the addition-reaction-type silicone pressure-sensitive adhesive. With a configuration in which a light-sensitive platinum (Pt) catalyst is added to a specific pressure-sensitive adhesive containing an agent, it has good adhesion to a semiconductor material having a plurality of semiconductor elements covered with a coating material, and has a dicing property. The present inventors have found that the adhesive residue on the semiconductor chip is suppressed when the singulated semiconductor chip is peeled off, and have accomplished the present invention.
That is, when the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape for dicing is configured as described above, a semiconductor material having a plurality of semiconductor elements covered with a coating material is divided into a plurality of semiconductor chips. It has been found that the adhesive force suppresses scattering of the singulated semiconductor chips during dicing. On the other hand, when the semiconductor chips singulated by dicing are peeled off from the adhesive tape for dicing, light such as ultraviolet rays is applied to the adhesive layer to irradiate the photosensitive platinum (Pt) in the adhesive. The catalyst is activated, and the cross-linking reaction between the addition-reaction-type silicone pressure-sensitive adhesive and a cross-linking agent for the addition-reaction-type silicone pressure-sensitive adhesive is promoted, so that the cohesive force of the pressure-sensitive adhesive increases as compared to before the light irradiation. As a result, the tack force of the pressure-sensitive adhesive layer is appropriately reduced, and the destruction mode in the holding force test is “interfacial peeling” or “does not fall” in the holding force test. As a result, it has been found that the pick-up property of the semiconductor chip from the dicing adhesive tape is improved, and the adhesive residue on the semiconductor chip is suppressed.

The dicing pressure-sensitive adhesive tape of the present invention includes a base material and a silicone-based pressure-sensitive adhesive layer laminated on the base material, and divides a semiconductor material having a plurality of semiconductor elements covered with a coating material into a plurality of semiconductor chips. A dicing pressure-sensitive adhesive tape, wherein the silicone-based pressure-sensitive adhesive layer comprises an addition-reaction-type silicone-based pressure-sensitive adhesive as a main component, and a photosensitive platinum (Pt) catalyst and an addition-reaction-type silicone-based pressure-sensitive adhesive. A mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the silicone-based pressure-sensitive adhesive layer, which contains a crosslinking agent, A silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) in a range of 35/65 to 50/50. An adhesive for dicing, wherein a content ratio is in a range of 35% by mass or more and 50% by mass or less, and all of the following conditions (a) to (c) are satisfied in adhesive properties in accordance with JIS Z 0237 (2009). It is a tape.
(A) The adhesive strength to the BA-SUS test plate before light irradiation is 2.4 N / 10 mm or more and 5.5 N / 10 mm or less.
(B) The ball number value in the tilting ball tack test (tilt angle 30 °, temperature 23 ° C., relative humidity 50% RH) is the ball number value before light irradiation BN0, and the ball number value after light irradiation. Is BN1, BN0> BN1.
(C) In a holding force test after light irradiation (temperature: 40 ° C., relative humidity: 33% RH, standing time: 5000 minutes), the destruction phenomenon upon falling was caused by the interface between the silicone-based pressure-sensitive adhesive layer and the BA-SUS test plate. Peeling or not falling in the holding force test.
Here, the pressure-sensitive adhesive tape for dicing is characterized in that a plurality of the semiconductor elements are used by being attached to the semiconductor material sealed with the coating material made of silicone resin from the coating material side. can do.

From another viewpoint, the pressure-sensitive adhesive tape for dicing of the present invention includes a base material and a silicone-based pressure-sensitive adhesive layer laminated on the base material, and includes a plurality of semiconductor elements covered with a coating material. A pressure-sensitive adhesive tape for dicing used when dividing a material into a plurality of semiconductor chips, wherein the silicone-based pressure-sensitive adhesive layer includes an addition-reaction-type silicone-based pressure-sensitive adhesive and a peroxide-curable silicone-based pressure-sensitive adhesive. A mixture comprising a photosensitive platinum (Pt) catalyst and a crosslinking agent for the addition-reaction type silicone pressure-sensitive adhesive, wherein the total mass (Gw) of the silicone gum (G) contained in the silicone pressure-sensitive adhesive layer and a silicone resin The mass ratio (Gw) / (Rw) of (R) to the total mass (Rw) is in the range of 40/60 to 56/44, and the silicone gum (G) and the silicone resin The content ratio of the silicone gum (G1) having an alkenyl group in the total mass with (R) is in the range of 14% by mass or more and 42% by mass or less, and the following conditions are satisfied in the adhesive properties according to JIS Z 0237 (2009). An adhesive tape for dicing, which satisfies all of (a) to (c).
(A) The adhesive strength to the BA-SUS test plate before light irradiation is 2.4 N / 10 mm or more and 5.5 N / 10 mm or less.
(B) The ball number value in the tilting ball tack test (tilt angle 30 °, temperature 23 ° C., relative humidity 50% RH) is the ball number value before light irradiation BN0, and the ball number value after light irradiation. Is BN1, BN0> BN1.
(C) In a holding force test after light irradiation (temperature: 40 ° C., relative humidity: 33% RH, standing time: 5000 minutes), the destruction phenomenon upon falling was caused by the interface between the silicone-based pressure-sensitive adhesive layer and the BA-SUS test plate. Peeling or not falling in the holding force test.
Here, the pressure-sensitive adhesive tape for dicing is characterized in that a plurality of the semiconductor elements are used by being attached to the semiconductor material sealed with the coating material made of silicone resin from the coating material side. can do.
In addition, the silicone-based pressure-sensitive adhesive layer may further include a peroxide-based initiator.

From another viewpoint, in the method for manufacturing a semiconductor chip of the present invention, a plurality of the semiconductor elements in which the dicing adhesive tape is sealed with a sealing resin made of a silicone resin are formed on a substrate. Bonding the semiconductor element substrate to the sealing resin side, cutting the semiconductor element substrate to which the dicing adhesive tape is bonded, into a plurality of semiconductor chips, A method of manufacturing a semiconductor chip, comprising: an irradiation step of irradiating the dicing adhesive tape on a substrate with light; and a peeling step of peeling the dicing adhesive tape from the plurality of semiconductor chips.

Advantageous Effects of Invention According to the present invention, a semiconductor material coated with a plurality of semiconductor elements on a coating material has good adhesive strength and tackiness at a stage before light irradiation, and is singulated by dicing after light irradiation. It is possible to provide a dicing pressure-sensitive adhesive tape having good pick-up properties of a semiconductor chip when peeling off a semiconductor chip and suppressing adhesive residue on the semiconductor chip, and a method of manufacturing a semiconductor chip using the same. it can.

It is a figure showing an example of composition of an adhesive tape for dicing to which this embodiment is applied. (A)-(e) is a figure which showed the manufacturing method of the semiconductor chip using the adhesive tape of this Embodiment. FIG. 3 is a schematic diagram showing a relationship between a crosslinking density of an addition-reaction type silicone pressure-sensitive adhesive in a pressure-sensitive adhesive layer and a result (fall time) of a holding force test of a pressure-sensitive adhesive tape.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[Structure of adhesive tape]
FIG. 1 is a diagram illustrating an example of a configuration of a dicing adhesive tape 1 (hereinafter, simply referred to as an adhesive tape 1) to which the present embodiment is applied. The pressure-sensitive adhesive tape 1 of the present embodiment is used for dicing a semiconductor material that is a source of a semiconductor chip, for example, in a process of manufacturing a semiconductor chip having a semiconductor element such as an LED (Light Emitting Diode) or a power semiconductor.

As shown in FIG. 1, the pressure-sensitive adhesive tape 1 has a configuration in which a pressure-sensitive adhesive layer 3 as an example of a silicone-based pressure-sensitive adhesive layer is laminated on a base material 2.
Although not shown, the pressure-sensitive adhesive tape 1 may be provided with an anchor coat layer between the base material 2 and the pressure-sensitive adhesive layer 3 as necessary, in order to enhance the adhesion between the base material 2 and the pressure-sensitive adhesive layer 3. You may have. Further, the surface of the substrate 2 (the surface opposite to the surface facing the pressure-sensitive adhesive layer 3) may be subjected to a surface treatment. Further, a release liner may be provided on the surface of the pressure-sensitive adhesive layer 3 (the surface opposite to the surface facing the substrate 2).

<Substrate>
The substrate 2 of the present embodiment is made of a material that transmits light such as ultraviolet light. The material of the base material 2 is not particularly limited as long as light such as ultraviolet light can be transmitted therethrough. For example, plastic or the like that can transmit light such as ultraviolet light can be used. Here, being capable of transmitting light such as ultraviolet light does not mean that the transmittance of light such as ultraviolet light is 100%. It is sufficient that light can be transmitted to such an extent that the addition reaction between the silicone-based pressure-sensitive adhesive and the crosslinking agent can be promoted.

Specific examples of the material of the base material 2 include resin films such as polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, biaxially oriented polypropylene, aliphatic polyimide (transparent polyimide), polycycloolefin, fluororesin, and polyolefin resin. Can be used. Depending on the application, the substrate 2 may be, for example, a composite film obtained by laminating a polyethylene terephthalate and a polyolefin resin film, a composite film obtained by further laminating the composite film with a resin film, or a resin formed by coextrusion into a multi-layer. A film or the like may be used.
Among them, as the base material 2, it is preferable to use a material containing polyethylene terephthalate as a main component.

<Adhesive layer>
The pressure-sensitive adhesive layer 3 of the present embodiment contains a curable silicone-based pressure-sensitive adhesive. Specifically, the pressure-sensitive adhesive layer 3 contains an addition-reaction-type silicone-based pressure-sensitive adhesive as a curable silicone-based pressure-sensitive adhesive. Further, the pressure-sensitive adhesive layer 3 may include a peroxide-curable silicone-based pressure-sensitive adhesive as a curable silicone-based pressure-sensitive adhesive in addition to the addition-reaction-type silicone-based pressure-sensitive adhesive. Normally, both the addition-reaction-type silicone pressure-sensitive adhesive and the peroxide-curable silicone-based pressure-sensitive adhesive include a silicone gum (G) composed of an organopolysiloxane and a silicone resin (R) composed of an organopolysiloxane. I have.
Hereinafter, the pressure-sensitive adhesive layer 3 containing an addition-reaction-type silicone-based pressure-sensitive adhesive as a curing-type silicone-based pressure-sensitive adhesive will be referred to as a first mode. The components constituting the pressure-sensitive adhesive layer 3 will be described in detail with the pressure-sensitive adhesive layer 3 containing a system pressure-sensitive adhesive as a second embodiment.

<Adhesive layer of first embodiment>
The first embodiment of the pressure-sensitive adhesive layer 3 includes an addition-reaction-type silicone pressure-sensitive adhesive and a cross-linking agent as an example of a curing agent that crosslinks the addition-reaction-type silicone pressure-sensitive adhesive. The pressure-sensitive adhesive layer 3 of the first embodiment contains a light-sensitive platinum (Pt) catalyst that promotes the reaction between the addition-reaction-type silicone pressure-sensitive adhesive and the crosslinking agent by irradiation with light such as ultraviolet light. The pressure-sensitive adhesive layer 3 of the first embodiment does not include a peroxide-curable silicone pressure-sensitive adhesive.
Further, the pressure-sensitive adhesive layer 3 of the first embodiment may contain other additives such as a reinforcing filler, a cohesive force improver, and a coloring agent, if necessary.

(Addition reaction type silicone adhesive)
As the addition-reaction-type silicone-based pressure-sensitive adhesive, a conventionally known one can be used, but usually, an organopolysiloxane such as polydimethylsiloxane containing on average at least two silicon-bonded alkenyl groups in one molecule. An adhesive containing a silicone gum (G1) composed of siloxane and a silicone resin (R1) composed of an organopolysiloxane such as polydimethylsiloxane. Here, the silicone resin (R1) made of an organopolysiloxane such as polydimethylsiloxane does not contain a silicon-bonded alkenyl group.

Hereinafter, a silicone gum (G1) composed of an organopolysiloxane such as polydimethylsiloxane containing at least two silicon-bonded alkenyl groups per molecule on average, contained in the addition-reaction type silicone adhesive, The silicone resin (R1) made of an organopolysiloxane such as dimethylsiloxane will be described in more detail.
In the following description, a silicone gum (G1) composed of an organopolysiloxane such as polydimethylsiloxane containing on average at least two silicon-bonded alkenyl groups in one molecule will be referred to as a silicone gum (G1) containing silicon-bonded alkenyl groups. Silicone gum (G1) composed of an organopolysiloxane such as polydimethylsiloxane, or simply silicone gum (G1) having an alkenyl group.

[Silicone gum (G1) comprising organopolysiloxane such as polydimethylsiloxane containing silicon-bonded alkenyl group]
The silicone gum (G1) composed of an organopolysiloxane such as polydimethylsiloxane containing a silicon-bonded alkenyl group in the present embodiment is used for an addition-reaction type silicone-based pressure-sensitive adhesive, that is, one molecule on average. There is no particular limitation as long as it contains at least two silicon-bonded alkenyl groups. Examples of the molecular structure of an organopolysiloxane such as polydimethylsiloxane containing a silicon-bonded alkenyl group include, for example, a linear structure in which the main chain portion is composed of repeating diorganosiloxane units, and a partial branch of the molecular structure. Examples include a chain-containing structure, a branched-chain structure, and a cyclic structure. Above all, organopolysiloxane having a linear structure is preferable from the viewpoint of physical properties such as mechanical strength of the pressure-sensitive adhesive after irradiation with light such as ultraviolet rays.

The silicone gum (G1) comprising an organopolysiloxane containing a silicon-bonded alkenyl group may be in the form of an oil or a raw rubber, but is preferably in the form of a raw rubber.
When it is oily, the viscosity of the silicone gum (G1) composed of an organopolysiloxane at 25 ° C. is preferably 1,000 mPa · s or more. When the viscosity is less than 1000 mPa · s, the pressure-sensitive adhesive before and after light irradiation may not be able to exhibit desired adhesive properties, or the adhesion between the pressure-sensitive adhesive layer 3 and the substrate 2 may be poor.
In the case of raw rubber, the viscosity when the silicone gum (G1) composed of an organopolysiloxane is dissolved in toluene so as to have a concentration of 30% by mass is preferably 100,000 mPa · s or less at 25 ° C. When the viscosity exceeds 100,000 mPa · s, stirring at the time of preparing the pressure-sensitive adhesive composition may be difficult.
In addition, the said viscosity can be measured using a BM type rotational viscometer.

Examples of the silicone gum (G1) comprising an organopolysiloxane containing a silicon-bonded alkenyl group include, but are not limited to, those represented by the following general formula (1) or (2). .

Here, in the general formulas (1) and (2), R ¹ is independently of each other a monovalent hydrocarbon group having no aliphatic unsaturated bond, and X is an alkenyl group-containing organic group. is there. a is an integer of 0 to 3, m is an integer of 0 or more, n is an integer of 100 or more, provided that a and m are not 0 at the same time. m + n is a value at which the viscosity at 25 ° C. of the organopolysiloxane becomes 1,000 mPa · s or more.

As R ¹ , a monovalent hydrocarbon group having 1 to 10, preferably 1 to 7 carbon atoms and having no aliphatic unsaturated bond is preferable. For example, an alkyl group such as a methyl group, an ethyl group, a propyl group, and a butyl group; a cycloalkyl group such as a cyclohexyl group; and an aryl group such as a phenyl group and a tolyl group; Is preferred.

X is preferably an alkenyl group-containing organic group having 2 to 10 carbon atoms. For example, vinyl group, allyl group, hexenyl group, octenyl group, acryloylpropyl group, acryloylmethyl group, methacryloylpropyl group, acryloxypropyl group, acryloxymethyl group, methacryloxypropyl group, methacryloxymethyl group, cyclohexenylethyl group And a vinyloxypropyl group. Among them, lower alkenyl groups such as a vinyl group and an allyl group are preferable, and a vinyl group is particularly preferable from an industrial viewpoint. The bonding position of the alkenyl group is not particularly limited, and may be a molecular chain terminal, a molecular chain side chain, or both a molecular chain terminal and a molecular chain side chain.

The number of the alkenyl groups depends on the content of the silicone resin (R1) composed of an organopolysiloxane such as polydimethylsiloxane contained in the addition-reaction-type silicone-based pressure-sensitive adhesive, the added amount of the crosslinking agent, and other added components. Since the appropriate range varies, it cannot be said unconditionally, but for example, it is usually preferably in the range of 0.1 to 3.0 per 100 organo groups of the organopolysiloxane. In this ratio range, the molecular weight is adjusted so as to be in the above-mentioned viscosity range, and the average number of the alkenyl groups in one molecule of the organopolysiloxane is adjusted to be at least two. preferable. When the number of the alkenyl groups is less than 0.1 based on 100 organo groups of the organopolysiloxane, the adhesive is hardly cured when the adhesive tape 1 is irradiated with light, and the cohesive force is hardly improved. Become. In this case, a desired reduction in tack force or a destructive mode in a holding force test cannot be obtained, and when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1 after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like. In addition, there is a possibility that the pickup property of the individualized semiconductor chip may be deteriorated, and that adhesive residue may be easily generated on the semiconductor chip or the like. On the other hand, when the number of the alkenyl groups exceeds 3.0 per 100 organo groups of the organopolysiloxane, the pressure-sensitive adhesive tape 1 has a pressure-sensitive adhesive when a release liner release-treated with a fluoroalkyl-modified silicone is provided. The release force of the release liner on the agent layer 3 may be increased.

[Silicone resin (R1) comprising organopolysiloxane such as polydimethylsiloxane]
Silicone resin consisting of organopolysiloxanes such as polydimethylsiloxane in the present embodiment (R1) is an organopolysiloxane having R ² ₃ SiO _0.5 unit (M unit) and SiO ₂ units (Q units), so-called MQ This is called a resin. The silicone resin (R1) made of an organopolysiloxane such as polydimethylsiloxane basically has no alkenyl group in the molecule, and a conventionally known silicone resin can be used. R ² is a monovalent hydrocarbon group having 1 to 10 carbon atoms, and examples thereof include those described above as R ¹ . The organopolysiloxane, R a ² ₃ SiO _0.5 units and SiO ₂ units, that contain such that R ² ₃ SiO _0.5 units / SiO ₂ ranging from 0.5 to 1.7 in a molar ratio of units preferable. When the molar ratio of R ² ₃ SiO _0.5 unit / SiO ₂ unit is less than 0.5, the resulting adhesive layer 3 may have reduced adhesive strength and tackiness. On the other hand, if the molar ratio of R ² ₃ SiO _0.5 unit / SiO ₂ unit exceeds 1.7, the adhesive strength and holding power of the obtained adhesive layer 3 may be reduced. Incidentally, the organopolysiloxane may have an OH group. In that case, the content of the OH group is preferably 4.0% by mass or less based on the total mass of the organopolysiloxane. If the OH group exceeds the above upper limit, the curability of the pressure-sensitive adhesive may decrease.

In the present embodiment, in order to make the adhesive force of the adhesive tape 1 2.4 N / 10 mm or more and 5.5 N / 10 mm or less, use of MQ resin as the silicone resin (R2) made of an organopolysiloxane such as polydimethylsiloxane. Is preferred. However, the silicone resin (R2) made of an organopolysiloxane such as polydimethylsiloxane contains R ² SiO _1.5 unit (T unit) and / or R ² SiO unit (D unit) as impurities when synthesizing the MQ resin. May be included.

The silicone gum (G1) composed of an organopolysiloxane such as polydimethylsiloxane containing a silicon-bonded alkenyl group and the silicone resin (R1) composed of an organopolysiloxane such as polydimethylsiloxane are simply mixed and used. You may. When the organopolysiloxane represented by the general formula (2) is contained as the silicone gum (G1) comprising an organopolysiloxane such as polydimethylsiloxane containing a silicon-bonded alkenyl group, the characteristics of the present invention are obtained. The silicone gum (G1) composed of an organopolysiloxane such as polydimethylsiloxane containing a silicon atom-bonded alkenyl group and the silicone resin (R1) composed of an organopolysiloxane such as polydimethylsiloxane, as long as the silicone resin (R1) does not deteriorate. It may be used as a (partial) condensation reaction product obtained by the above.

(Mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the pressure-sensitive adhesive layer of the first embodiment, and the silicone gum (Content ratio of silicone gum (G1) having an alkenyl group in the total mass of (G) and silicone resin (R))
In the silicone-based pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3 of the first embodiment, the total mass (Gw) of the silicone gum (G) is based on polydimethylsiloxane containing a silicon-bonded alkenyl group in the addition-reaction-type silicone-based pressure-sensitive adhesive. The mass (G1w) of the silicone gum (G1) composed of the organopolysiloxane of the formula (1). Similarly, in the silicone-based pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3 of the first embodiment, the total mass (Rw) of the silicone resin (R) is determined from the organopolysiloxane such as polydimethylsiloxane in the addition-reaction-type silicone-based pressure-sensitive adhesive. The mass (R1w) of the silicone resin (R1).

Mass ratio (Gw) / (Rw) (= (G1w)) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the pressure-sensitive adhesive layer 3 of the first embodiment. / (R1w)) is preferably in the range of 35/65 to 50/50.
In this case, the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) {(G1w) / ((Gw) + (Rw))} × As a matter of course, 100 is preferably in the range of 35% by mass or more and 50% by mass or less in the same manner as described above.

The mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the pressure-sensitive adhesive layer 3 of the first embodiment, and the silicone gum ( When the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of G) and the silicone resin (R) is less than the lower limit of the above range, when the pressure-sensitive adhesive tape 1 is irradiated with light, the pressure-sensitive adhesive Hardly hardens and the cohesive strength is hardly improved. In this case, a desired reduction in tack force or a destructive mode in a holding force test cannot be obtained, and when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1 after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like. In addition, there is a possibility that the pickup property of the individualized semiconductor chip may be deteriorated, and that adhesive residue may be easily generated on the semiconductor chip or the like.

On the other hand, the mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the pressure-sensitive adhesive layer 3 of the first embodiment, and When the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the gum (G) and the silicone resin (R) exceeds the upper limit of the above range, the pressure-sensitive adhesive before irradiation with light is cured. In the absence state, the pressure-sensitive adhesive layer 3 becomes too soft due to the silicone gum (G) component. In this case, when dicing the semiconductor element substrate or the like, the dicing vibration is easily transmitted to the adhesive layer 3 to increase the vibration width. For example, the semiconductor element substrate may be shifted from the reference position. Accordingly, chipping may occur in the individualized semiconductor chips, and the size of each semiconductor chip may be shifted.

On the other hand, the mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the pressure-sensitive adhesive layer 3 of the first embodiment, By setting the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) within the above range, the following effects can be realized. That is, in the stage before the irradiation of light such as ultraviolet rays, the adhesive layer 3 having an uncured state has an appropriate adhesive force and tackiness that does not cause scattering of a cut piece such as a semiconductor chip during dicing. It is possible to apply force. On the other hand, after light irradiation, the pressure-sensitive adhesive layer 3 is cured, so that the cohesive force is improved, so that a desired reduction in tack force and a breaking mode in a holding force test can be obtained. As a result, after using the pressure-sensitive adhesive tape 1 for dicing of a semiconductor element substrate or the like, good pick-up properties can be realized when the obtained semiconductor chip or the like is peeled off from the pressure-sensitive adhesive tape 1, and adhesive residue on the semiconductor chip or the like is suppressed. It is possible to do.

市販 Further, as the addition reaction type silicone pressure sensitive adhesive of the present invention, a commercially available addition reaction type silicone pressure sensitive adhesive can also be used. Specifically, for example, KR3700, KR3701, X-40-3237-1, X-40-3240, X-40-3291-1, X-40-3229, X-40- manufactured by Shin-Etsu Chemical Co., Ltd. 3270, X-40-3306 (all trade names), Momentive Performance Materials TSR1512, TSR1516, XR37-B9204 (all trade names), Toray Dow Corning SD4580, SD4584, SD4585 , SD4560, SD4564, SD4565, SD4570, SD4574, SD4575, SD4600 PFC, SD4593, DC7651ADHESIVE (all of which are trade names), and the like, to which a platinum (Pt) -based catalyst and a crosslinking agent described later are not added. Door can be.

(Crosslinking agent)
The cross-linking agent is used for cross-linking the alkenyl group contained in the addition-reaction type silicone pressure-sensitive adhesive. As a crosslinking agent, an organopolysiloxane (organohydrogenpolysiloxane) having at least two, preferably three or more silicon-bonded hydrogen atoms (SiH) in one molecule is used.
Examples of the molecular structure of the organohydrogenpolysiloxane used as the cross-linking agent include a straight chain, a partially branched straight chain, a branched chain, and a network. The organohydrogenpolysiloxane preferably has a viscosity at 25 ° C. of 1 to 5,000 mPa · s.
In addition, the said viscosity can be measured using a BM type rotational viscometer.

従来 As the organohydrogenpolysiloxane used as the crosslinking agent, a conventionally known organohydrogenpolysiloxane can be used. For example, examples of the organohydrogenpolysiloxane include those represented by the following general formula (3) or (4), but are not limited thereto.

Here, in the general formulas (3) and (4), R ³ is a monovalent hydrocarbon group having 1 to 10 carbon atoms, b is 0 or 1, p and q are integers, The value at which the viscosity at 25 ° C. of the organohydrogenpolysiloxane is 1 to 5,000 mPa · s. r is an integer of 2 or more, s is an integer of 0 or more, and r + s ≧ 3, preferably 8 ≧ r + s ≧ 3. The organohydrogenpolysiloxane may be a mixture of two or more.

R ³ is a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 7 carbon atoms. For example, alkyl groups such as methyl group, ethyl group, propyl group and butyl group; cycloalkyl groups such as cyclohexyl group; and aryl groups such as phenyl group and tolyl group, and alkenyl groups such as vinyl group and allyl group. Can be Particularly, a methyl group or a phenyl group is preferable.

The content of the organohydrogenpolysiloxane used as the crosslinking agent in the pressure-sensitive adhesive layer 3 of the first embodiment is determined in the silicone gum (G1) made of an organopolysiloxane such as polydimethylsiloxane containing a silicon-bonded alkenyl group. Preferably, the total amount of silicon-bonded hydrogen atoms (SiH) in the organohydrogenpolysiloxane relative to the total amount of alkenyl groups is in the range of 0.15 mol equivalent to 15.0 mol equivalent, more preferably 1.0 mol equivalent to 10.0 mol equivalent. An amount in the following range is more preferable.

(4) When the content of the organohydrogenpolysiloxane is less than the above lower limit, when the pressure-sensitive adhesive tape 1 is irradiated with light, the pressure-sensitive adhesive hardly hardens and the cohesive strength is hardly improved. In this case, a desired reduction in tack force or a destructive mode in a holding force test cannot be obtained, and when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1 after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like. In addition, there is a possibility that the pickup property of the individualized semiconductor chip may be deteriorated, and that adhesive residue may be easily generated on the semiconductor chip or the like.

On the other hand, when the content of the organohydrogenpolysiloxane exceeds the above upper limit, unreacted organohydrogenpolysiloxane may contaminate the semiconductor chip. Further, silicon-bonded hydrogen atoms (SiH) in the unreacted organohydrogenpolysiloxane react with oxygen and moisture in the air to change to SiOH, and the adhesive strength of the adhesive layer 3 to the adherend increases. Therefore, there is a possibility that the pickup property of the individualized semiconductor chip may be deteriorated.

As described above, the content of the crosslinking agent in the pressure-sensitive adhesive layer 3 of the first embodiment is determined by the total amount of alkenyl groups in the silicone gum (G1) composed of organopolysiloxane such as polydimethylsiloxane containing silicon-bonded alkenyl groups. May be adjusted so that the total amount of silicon-bonded hydrogen atoms (SiH) in the organohydrogenpolysiloxane is within the above-mentioned range.
The content of the cross-linking agent satisfying this range varies depending on the number of silicon-bonded hydrogen atoms (SiH) in the cross-linking agent. What is necessary is just to add a crosslinking agent so that it may be in the range of 0.2 to 20.0 parts by mass in solid content.

By setting the content of the crosslinking agent with respect to the addition-reaction-type silicone-based pressure-sensitive adhesive in the above-described range, by irradiating the pressure-sensitive adhesive layer 3 with light such as ultraviolet rays when the semiconductor chip is separated from the pressure-sensitive adhesive tape for dicing, The light-sensitive platinum (Pt) catalyst in the silicone-based pressure-sensitive adhesive is activated, and the crosslinking reaction between the addition-reaction-type silicone-based pressure-sensitive adhesive and the cross-linking agent for the addition-reaction-type silicone-based pressure-sensitive adhesive is promoted, whereby the pressure-sensitive adhesive coagulates The force is greater than before the light irradiation. As a result, the tacking force of the pressure-sensitive adhesive layer 3 is appropriately reduced, and a good pickup property when the semiconductor chip or the like is peeled off from the pressure-sensitive adhesive tape 1 can be realized, and the adhesive residue on the semiconductor chip or the like can be suppressed. Become.

As the cross-linking agent, one used as a cross-linking agent for an addition-reaction type silicone-based pressure-sensitive adhesive, that is, an organopolysiloxane having at least two silicon-bonded hydrogen atoms (SiH) in one molecule (organohydrogenpolysiloxane) ), And is not particularly limited. Specific examples include X-92-122 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd., and BY24-741 (trade name) manufactured by Dow Corning Toray Co., Ltd.

(Photosensitive platinum (Pt) catalyst)
The photosensitive platinum (Pt) catalyst is used to accelerate the curing by the addition reaction (hydrosilylation) between the addition-reaction type silicone pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3 and the crosslinking agent by irradiation with light such as ultraviolet rays. Can be The wavelength of light that can be used to accelerate the curing by the addition reaction between the addition-reaction-type silicone-based pressure-sensitive adhesive and the crosslinking agent is preferably in the range of 240 nm to 400 nm.
As the photosensitive platinum (Pt) catalyst, it is preferable to use a photoactive cyclopentadienyl platinum (IV) compound from the viewpoints of good photosensitivity and reaction rate.

Examples of the photoactive cyclopentadienyl platinum (IV) compound include, but are not particularly limited to, (cyclopentadienyl) dimethyltrimethylsilylmethylplatinum, (cyclopentadienyl) diethyltrimethylsilylmethylplatinum, (Pentadienyl) dipropyltrimethylsilylmethylplatinum, (cyclopentadienyl) diisopropyltrimethylsilylmethylplatinum, (cyclopentadienyl) diallyltrimethylsilylmethylplatinum, (cyclopentadienyl) dibenzyltrimethylsilylmethylplatinum, (cyclopentadienyl) Dimethyltriethylsilylmethylplatinum, (cyclopentadienyl) dimethyltripropylsilylmethylplatinum, (cyclopentadienyl) dimethyltriisopropylsilylmethylplatinum, (cyclope (Tadienyl) dimethyltriphenylsilylmethylplatinum, (cyclopentadienyl) dimethyldimethylphenylsilylmethylplatinum, (cyclopentadienyl) dimethylmethyldiphenylsilylmethylplatinum, (cyclopentadienyl) dimethyldimethyl (trimethylsiloxy) silylmethylplatinum, (Cyclopentadienyl) dimethyldimethyl (dimethylvinylsiloxy) silylmethylplatinum, [(1′-naphthyl) cyclopentadienyl] trimethylsilylmethylplatinum, [(2′-naphthyl) cyclopentadienyl] trimethylsilylmethylplatinum, [1 -Methyl-3- (1'-naphthyl) cyclopentadienyl] trimethylsilylmethylplatinum, [1-methyl-3- (2'-naphthyl) cyclopentadienyl] trimethylsilylmethylplatinum, [(4'-biph [Enyl] cyclopentadienyl] trimethylsilylmethylplatinum, [1- (4'-biphenyl) -3-methylcyclopentadienyl] trimethylsilylmethylplatinum, [(9'-phenanthryl) cyclopentadienyl] trimethylsilylmethylplatinum, [ 1-methyl-3- (9'-phenanthryl) cyclopentadienyl] trimethylsilylmethylplatinum, [1- (2'-anthracenyl) -3-methylcyclopentadienyl] trimethylsilylmethylplatinum, [(2'-anthracenyl) [Cyclopentadienyl] trimethylsilylmethylplatinum, [(1'-pyrenyl) cyclopentadienyl] trimethylsilylmethylplatinum, [1-methyl-3- (1'-pyrenyl) cyclopentadienyl] trimethylsilylmethylplatinum and the like. .

The cyclopentadienyl ring in the compound described above is methyl, chloro, fluoro, trimethylsilyl, triethylsilyl, dimethylphenylsilyl, methyldiphenylsilyl, triphenylsilyl, phenyl, fluorophenyl, chlorophenyl, methoxy, naphthyl, biphenyl, anthracenyl, Pyrenyl, 2-benzoylnaphthalene, thioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, anthraquinone, 1-chloroanthraquinone, acetophenone, benzophenone, 9,10-dimethylanthracene, 9,10-dichloroanthracene and selected from these. May be substituted with a cyclopentadienyl ring substituted with one or more groups.
In the compounds described above, the cyclopentadienyl ring may be substituted with an η5-fluorenyl group.

As the cyclopentadienyl ring in the above-mentioned compounds, those which are not substituted, those which are substituted with one or more aromatic organic groups, those which are substituted with one or more aliphatic organic groups, Those substituted with an aromatic organic group and one or more aliphatic organic groups are preferred. Further, as the organic group substituted on the cyclopentadienyl ring, naphthyl, biphenyl, anthracenyl, phenanthryl and pyrenyl are preferred.

The content of the light-sensitive platinum (Pt) catalyst in the pressure-sensitive adhesive layer 3 of the first embodiment is particularly determined if the addition reaction between the addition-reaction type silicone pressure-sensitive adhesive and the crosslinking agent can be promoted by irradiation with light such as ultraviolet light. It is not limited. The content of the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive layer 3 of the first embodiment is, for example, 0.1 parts by mass or more in terms of solids with respect to 100 parts by mass of the solids of the addition-reaction silicone pressure-sensitive adhesive. It is preferably in the range of not more than 0.0 parts by mass.

(Cohesive force improver)
The cohesive strength improver is used as needed to improve the cohesive strength of the pressure-sensitive adhesive layer 3. The cohesive strength improver is not particularly limited, but for example, a polyfunctional thiol is used. Examples of the cohesive strength improver composed of a polyfunctional thiol include Karenz (registered trademark) MT-PE1, Karenz MT-NR1 manufactured by Showa Denko KK.

However, since polyfunctional thiols are not compatible with the addition-reaction type silicone adhesive, in order to use the polyfunctional thiol as a cohesion enhancer, a compatibilizer between the addition reaction type silicone adhesive and the polyfunctional thiol is required. Must be used. The compatibilizer is not particularly limited. For example, a silane coupling agent having a mercapto group, KBM-802 and KBM-803 (all trade names) manufactured by Shin-Etsu Chemical Co., Ltd. SH6062 (trade name) manufactured by Corning Incorporated.
When a cohesive strength improver is used for the pressure-sensitive adhesive layer 3, the amount of the cohesive strength improver is preferably in the range of 6 parts by mass or less in terms of solids with respect to 100 parts by mass of the solids of the addition-reaction silicone adhesive. . When the addition amount of the cohesive force enhancer exceeds 6 parts by mass in solid content with respect to 100 parts by mass of the solid content of the addition-reaction-type silicone pressure-sensitive adhesive, the addition-reaction-type silicone pressure-sensitive adhesive is added even if a compatibilizer is added. There is a possibility that the polyfunctional thiol which is a cohesive force improver may undergo phase separation.

(Reinforcing filler)
The reinforcing filler is used as necessary to improve the strength of the pressure-sensitive adhesive layer 3. Examples of the reinforcing filler include, but are not particularly limited to, for example, Aerosil (registered trademark) 130, Aerosil 200, and Aerosil 300 manufactured by Nippon Aerosil Co., Ltd .; Leolosil QS-30, DSL. Carplex (registered trademark) 80 manufactured by Japan Co., Ltd .; and Hi-Sil (registered trademark) -233-D manufactured by PPG.

<Second embodiment pressure-sensitive adhesive layer>
The pressure-sensitive adhesive layer 3 of the second embodiment includes a peroxide-curable silicone-based pressure-sensitive adhesive in addition to the addition-reaction-type silicone-based pressure-sensitive adhesive, the crosslinking agent, and the photosensitive platinum (Pt) catalyst contained in the pressure-sensitive adhesive layer 3 of the first embodiment. Contains agents. Further, the pressure-sensitive adhesive layer 3 of the second embodiment may include an initiator for initiating a polymerization reaction of the peroxide-curable silicone-based pressure-sensitive adhesive. Further, the pressure-sensitive adhesive layer 3 of the second embodiment contains other additives such as a reinforcing filler, a cohesive force improver, and a coloring agent, if necessary, similarly to the pressure-sensitive adhesive layer 3 of the first embodiment. Is also good.

(Peroxide-curable silicone adhesive)
As the peroxide-curable silicone-based pressure-sensitive adhesive, conventionally known ones can be used. Usually, a silicone gum (G2) composed of an organopolysiloxane such as polydimethylsiloxane and an organopolysiloxane such as polydimethylsiloxane are used. And a silicone resin (R2) made of siloxane. The silicone gum (G2) composed of the organopolysiloxane contained in the peroxide-curable silicone-based pressure-sensitive adhesive is different from the silicone gum (G1) contained in the addition-reaction-type silicone-based pressure-sensitive adhesive, and usually has a silicon atom bond. Does not contain alkenyl groups.

Hereinafter, a silicone gum (G2) composed of an organopolysiloxane such as polydimethylsiloxane not containing a silicon atom-bonded alkenyl group, which is contained in a peroxide-curable silicone-based pressure-sensitive adhesive, and an organopolysiloxane such as polydimethylsiloxane The silicone resin (R2) made of is described in more detail.
In the following description, a silicone gum (G2) composed of an organopolysiloxane such as polydimethylsiloxane containing no silicon-bonded alkenyl group will be referred to as a silicone gum (G2) composed of an organopolysiloxane such as polydimethylsiloxane. May be written as

[Silicone gum (G2) comprising organopolysiloxane such as polydimethylsiloxane containing no silicon-bonded alkenyl group]
The silicone gum (G2) composed of an organopolysiloxane such as polydimethylsiloxane in the present embodiment is used for a peroxide-curable silicone-based pressure-sensitive adhesive, that is, one containing no silicon-bonded alkenyl group. It is not particularly limited as long as it is provided. Examples of the molecular structure of such an organopolysiloxane include a linear structure in which a main chain portion is composed of repeating diorganosiloxane units, a structure in which a part of the molecular structure includes a branched chain, and a branched chain structure. Or a cyclic structure.

The silicone gum (G2) comprising an organopolysiloxane such as polydimethylsiloxane containing no silicon-bonded alkenyl group may be in the form of an oil or a raw rubber, but is preferably in the form of a raw rubber.
When it is oily, the viscosity of the silicone gum (G2) composed of an organopolysiloxane at 25 ° C. is preferably 1,000 mPa · s or more. If the viscosity is less than 1,000 mPa · s, the pressure-sensitive adhesive before and after light irradiation may not exhibit desired adhesive properties, or the adhesiveness between the pressure-sensitive adhesive layer 3 and the substrate 2 may be poor.
In the case of raw rubber, the viscosity when the silicone gum (G2) composed of an organopolysiloxane is dissolved in toluene so as to have a concentration of 30% by mass is preferably 100,000 mPa · s or less at 25 ° C. When the viscosity exceeds 100,000 mPa · s, stirring at the time of preparing the pressure-sensitive adhesive composition may be difficult.
In addition, the said viscosity can be measured using a BM type rotational viscometer.

Examples of the silicone gum (G2) composed of an organopolysiloxane such as polydimethylsiloxane containing no silicon-bonded alkenyl group include those represented by the following general formula (5) or (6). It is not limited to.

Here, in the above general formulas (5) and (6), R ⁴ is independently a monovalent hydrocarbon group having no aliphatic unsaturated bond, and t is an integer of 100 or more. And the viscosity at 25 ° C. of the diorganopolysiloxane is 1,000 mPa · s or more.

As R ⁴ , a monovalent hydrocarbon group having 1 to 10, preferably 1 to 7 carbon atoms and having no aliphatic unsaturated bond is preferable. Examples thereof include an alkyl group such as a methyl group, an ethyl group, a propyl group, and a butyl group; a cycloalkyl group such as a cyclohexyl group; and an aryl group such as a phenyl group and a tolyl group. A methyl group is particularly preferable.

[Silicone resin (R2) composed of organopolysiloxane such as polydimethylsiloxane]
The silicone resin (R2) made of an organopolysiloxane such as polydimethylsiloxane in the present embodiment is a silicone resin (R1) made of an organopolysiloxane such as polydimethylsiloxane used for the above-mentioned addition-reaction type silicone adhesive. The same as described above can be used. That is, the silicone resin (R2) consisting of organopolysiloxanes such as polydimethylsiloxane is an organopolysiloxane having R ² ₃ SiO _0.5 unit (M unit) and SiO ₂ units (Q units), referred as a so-called MQ resin Is what is done. The silicone resin (R1) made of an organopolysiloxane such as polydimethylsiloxane basically has no alkenyl group in the molecule, and a conventionally known silicone resin can be used. R ² is a monovalent hydrocarbon group having 1 to 10 carbon atoms, and examples thereof include those described above as R ¹ . The organopolysiloxane, R a ² ₃ SiO _0.5 units and SiO ₂ units, that contain such that R ² ₃ SiO _0.5 units / SiO ₂ ranging from 0.5 to 1.7 in a molar ratio of units preferable. When the molar ratio of R ² ₃ SiO _0.5 unit / SiO ₂ unit is less than 0.5, the resulting adhesive layer 3 may have reduced adhesive strength and tackiness. On the other hand, if the molar ratio of R ² ₃ SiO _0.5 unit / SiO ₂ unit exceeds 1.7, the adhesive strength and holding power of the obtained adhesive layer 3 may be reduced. Incidentally, the organopolysiloxane may have an OH group. In that case, the content of the OH group is preferably 4.0% by mass or less based on the total mass of the organopolysiloxane. If the OH group exceeds the above upper limit, the curability of the pressure-sensitive adhesive may decrease.

The silicone gum (G2) composed of an organopolysiloxane such as polydimethylsiloxane containing no silicon-bonded alkenyl group and the silicone resin (R2) composed of an organopolysiloxane such as polydimethylsiloxane are simply mixed. May be used. When the organopolysiloxane represented by the above general formula (6) is contained as the silicone gum (G2) composed of an organopolysiloxane such as polydimethylsiloxane containing no silicon-bonded alkenyl group, the present invention provides The silicone gum (G2) made of an organopolysiloxane such as polydimethylsiloxane containing no silicon-bonded alkenyl group and the silicone resin (R2) made of an organopolysiloxane such as polydimethylsiloxane as long as the characteristics of the above are not impaired. May be used as a (partial) condensation reaction product obtained by previously reacting

(The mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the pressure-sensitive adhesive layer of the second embodiment, and the silicone gum (Content ratio of silicone gum (G1) having an alkenyl group in the total mass of (G) and silicone resin (R))
As described above, the silicone-based pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3 of the second embodiment includes the addition-reaction-type silicone-based pressure-sensitive adhesive and the peroxide-curable silicone-based pressure-sensitive adhesive. Therefore, in the silicone-based pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3 of the second embodiment, the total mass (Gw) of the silicone gum (G) is the same as the polydimethyl silicone-bonded alkenyl group in the addition-reaction type silicone-based pressure-sensitive adhesive. The mass (G1w) of a silicone gum (G1) composed of an organopolysiloxane such as siloxane and an organopolysiloxane such as polydimethylsiloxane containing no silicon-bonded alkenyl group in a peroxide-curable silicone adhesive. It is the total mass with the mass (G2w) of the silicone gum (G2). In the silicone-based pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3 of the second embodiment, the total mass (Rw) of the silicone resin (R) is composed of an organopolysiloxane such as polydimethylsiloxane in the addition-reaction-type silicone-based pressure-sensitive adhesive. It is the total mass of the mass (R1w) of the silicone resin (R1) and the mass (R2w) of the silicone resin (R2) composed of an organopolysiloxane such as polydimethylsiloxane in the peroxide-curable silicone-based pressure-sensitive adhesive.

The mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the pressure-sensitive adhesive layer 3 of the second embodiment (= (G1w + G2w)) / (R1w + R2w)) is preferably in the range of 40/60 to 56/44.
In this case, the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) {(G1w) / ((Gw) + (Rw))} × 100 is preferably in the range of 14% by mass to 42% by mass.

The mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the pressure-sensitive adhesive layer 3 of the second embodiment is the lower limit of the above range. When it is less than the value, the adhesive strength and tackiness of the adhesive layer 3 may be reduced. In this case, when the adhesive tape 1 is used for dicing a semiconductor element substrate, a fluorescent substrate, or the like, which will be described later, a semiconductor chip or the like as a cut piece may be scattered.

On the other hand, the mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the pressure-sensitive adhesive layer 3 of the second embodiment is within the above range. When the weight of the silicone gum (G1) in the addition-reaction type silicone adhesive is particularly large, the silicone gum (G) component is added in a state where the adhesive before light irradiation is not cured. , The pressure-sensitive adhesive layer 3 becomes too soft. In this case, when dicing a semiconductor element substrate or the like, the dicing vibration is easily transmitted to the adhesive layer 3 to increase the vibration width, and, for example, the semiconductor element substrate may be shifted from a reference position. Accordingly, there is a possibility that chipping occurs in the individualized semiconductor chips, and a difference in size occurs between individual semiconductor chips.
In addition, when the mass of the silicone gum (G2) in the peroxide-curable silicone-based pressure-sensitive adhesive is particularly large, the curing of the peroxide-curable silicone-based pressure-sensitive adhesive by the initiator easily proceeds, and the pressure-sensitive adhesive layer 3 Adhesive strength and tack strength may be reduced. In this case, when the adhesive tape 1 is used for dicing a semiconductor element substrate, a fluorescent substrate, or the like, which will be described later, a semiconductor chip or the like as a cut piece may be scattered.

When the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) in the pressure-sensitive adhesive layer 3 of the second embodiment is less than the lower limit of the above range, the pressure-sensitive adhesive is used. When the tape 1 is irradiated with light, the pressure-sensitive adhesive hardly hardens, and the cohesive strength is hardly improved. In this case, a desired reduction in tack force or a destructive mode in a holding force test cannot be obtained, and when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1 after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like. In addition, there is a possibility that the pickup property of the individualized semiconductor chip may be deteriorated, and that adhesive residue may be easily generated on the semiconductor chip or the like.

On the other hand, when the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) in the pressure-sensitive adhesive layer 3 of the second embodiment exceeds the upper limit of the above range, In a state where the pressure-sensitive adhesive before light irradiation is not cured, the pressure-sensitive adhesive layer 3 becomes too soft due to the silicone gum (G) component. In this case, when dicing the semiconductor element substrate or the like, the dicing vibration is easily transmitted to the adhesive layer 3 to increase the vibration width. For example, the semiconductor element substrate may be shifted from the reference position. Accordingly, chipping may occur in the individualized semiconductor chips, and the size of each semiconductor chip may be shifted.

The content of the peroxide-curable silicone-based pressure-sensitive adhesive in the pressure-sensitive adhesive layer 3 of the second embodiment may be determined by adjusting the content of the silicone gum (G )) And the total weight (Gw) / (Rw) of the silicone resin (R) and the total weight of the silicone gum (G) and the silicone resin (R). Adjusted in consideration of the ratio of the silicone gum (G2) and the silicone resin (R2) of the peroxide-curable silicone-based pressure-sensitive adhesive so that the content ratio of the silicone gum (G1) having an alkenyl group is in the above-described range. do it.
When the content of the peroxide silicone-based pressure-sensitive adhesive in the pressure-sensitive adhesive layer 3 of the second embodiment is in the above-described range, when the pressure-sensitive adhesive tape 1 is used for dicing a semiconductor element substrate, a fluorescent substrate, or the like, it is a cut piece. It is possible to suppress scattering of semiconductor chips and the like and adhesive residue when the adhesive tape 1 is peeled off.

市販 As the peroxide-curable silicone-based pressure-sensitive adhesive of the present invention, a commercially available peroxide-curable silicone-based pressure-sensitive adhesive can also be used. Specifically, for example, KR100 and KR101-10 (all trade names) manufactured by Shin-Etsu Chemical Co., Ltd., YR3340, YR3286, PSA610-SM and XR37-B6722 manufactured by Momentive Performance Materials (all are commercial products) Name), SH4280, SH4282, SE4200, BY24-717, BY24-715, Q2-7735 (all trade names) manufactured by Dow Corning Toray Co., Ltd.

(Initiator)
As the initiator, a peroxide, more specifically, an organic peroxide is used. The organic peroxide used as the initiator is not particularly limited, but includes, for example, benzoyl peroxide, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, 1,1'-di-t-butylperoxy-3,3,5-trimethylenecyclohexane, 1,3-di- (t-butylperoxy) -diisopropylbenzene, and the like. Yuiper Co., Ltd. nippers K40 and the like.

含有 The content of the initiator in the pressure-sensitive adhesive layer 3 of the second embodiment is preferably 10 parts by mass or less in terms of solids with respect to 100 parts by mass of the solids of the peroxide-curable silicone-based pressure-sensitive adhesive. When the content of the initiator in the pressure-sensitive adhesive layer 3 of the second embodiment is more than 10 parts by mass in solid content with respect to 100 parts by mass of the solid content of the peroxide-curable silicone-based pressure-sensitive adhesive, the pressure-sensitive adhesive layer In 3, the curing reaction of the peroxide-curable silicone-based pressure-sensitive adhesive may proceed too much. In this case, the pressure-sensitive adhesive layer 3 becomes hard, and the pressure-sensitive adhesive force of the pressure-sensitive adhesive tape 1 tends to be low. When the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, when the semiconductor element substrate or the like is cut, a semiconductor chip or the like which is a cut piece may be peeled off from the adhesive tape 1 and easily scattered.

<Thickness>
The thickness of the pressure-sensitive adhesive layer 3 is preferably in the range of 10 μm or more and 100 μm or less, and more preferably in the range of 20 μm or more and 40 μm or less. When the thickness of the pressure-sensitive adhesive layer 3 is less than 10 μm, the thickness of the silicone-based pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer 3 is reduced, so that the pressure-sensitive adhesive force of the pressure-sensitive adhesive tape 1 tends to decrease. On the other hand, when the thickness of the pressure-sensitive adhesive layer 3 is greater than 100 μm, cohesive failure of the pressure-sensitive adhesive layer 3 may easily occur. Then, after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1, adhesive residue may easily be generated on the semiconductor chip or the like. In addition, when dicing a semiconductor element substrate or the like, the dicing vibration is easily transmitted to the adhesive layer 3 to increase the vibration width, and, for example, the semiconductor element substrate may be shifted from a reference position. Accordingly, there is a possibility that chipping occurs in the individualized semiconductor chips, and a difference in size occurs between individual semiconductor chips.

<Anchor coat layer>
As described above, in the pressure-sensitive adhesive tape 1 of the present embodiment, the base material 2 and the pressure-sensitive adhesive layer 3 An anchor coat layer according to the type of the material 2 may be provided, or a surface treatment such as a corona treatment may be performed. This makes it possible to improve the adhesion between the base material 2 and the pressure-sensitive adhesive layer 3.

<Surface treatment>
The surface of the substrate 2 (the surface opposite to the surface opposing the pressure-sensitive adhesive layer 3) may be subjected to a surface treatment such as a releasability improvement treatment. The treating agent used for the surface treatment of the base material 2 is not particularly limited, and examples thereof include a long-chain alkyl vinyl monomer polymer, a fluorinated alkyl vinyl monomer polymer, polyvinyl alcohol carbamate, and an amino alkyd resin. And the like can be used. Examples of such a non-silicone release treatment agent include Piroyl 1050 and Piroyl 1200 manufactured by YAS Co., Ltd.

<Release liner>
Further, a release liner may be provided on the surface of the pressure-sensitive adhesive layer 3 (the surface opposite to the surface facing the base material 2) as necessary. As the release liner, a liner obtained by subjecting a film of paper, polyethylene, polypropylene, polyethylene terephthalate, or the like to a release treatment for improving the releasability from the silicone-based pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer 3 can be used. The material used for the release treatment of the release liner is not particularly limited, and for example, a material such as a fluoroalkyl-modified silicone, a long-chain alkyl vinyl monomer polymer, and an aminoalkyd resin can be used.

<Thickness of adhesive tape>
The overall thickness of the pressure-sensitive adhesive tape 1 having the configuration described above is preferably in the range of 20 μm to 200 μm.
When the thickness of the adhesive tape 1 is less than 20 μm, when the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, it may be difficult to peel off the formed semiconductor chip or the like from the adhesive tape 1. .
On the other hand, when the thickness of the pressure-sensitive adhesive tape 1 exceeds 200 μm, it becomes difficult for the pressure-sensitive adhesive tape 1 to follow irregularities formed on the bonding surface of the semiconductor element substrate when the pressure-sensitive adhesive tape 1 is bonded to a semiconductor element substrate or the like. In this case, the adhesive area between the adhesive tape 1 and the semiconductor element substrate or the like becomes small, and the semiconductor chips or the like may be easily scattered during dicing.

[Production method of adhesive tape]
Next, a method for manufacturing the pressure-sensitive adhesive tape 1 of the present embodiment will be described. The method for manufacturing the adhesive tape 1 described below is an example, and the method for manufacturing the adhesive tape 1 is not limited to this.
Here, the first embodiment of the pressure-sensitive adhesive tape 1 in which the pressure-sensitive adhesive layer 3 contains an addition-reaction-type silicone pressure-sensitive adhesive as a curable silicone-based pressure-sensitive adhesive, The pressure-sensitive adhesive tape 1 of the second embodiment including a silicone-based pressure-sensitive adhesive and a peroxide-curable silicone-based pressure-sensitive adhesive can be manufactured by the same manufacturing method.

When manufacturing the pressure-sensitive adhesive tape 1, first, other components such as a curable silicone-based pressure-sensitive adhesive and a crosslinking agent are dissolved in a general-purpose organic solvent such as toluene or ethyl acetate to obtain a pressure-sensitive adhesive solution. Subsequently, this pressure-sensitive adhesive solution is applied to the surface of the base material 2 on which a surface treatment or an anchor coat layer has been formed as necessary so as to have a predetermined thickness using a comma coater or the like.
Next, the adhesive solution is dried and cured by heating the substrate 2 coated with the adhesive solution at a temperature of 60 ° C. to 160 ° C. for several minutes to several tens of minutes to form the adhesive layer 3. I do.
Through the above steps, as shown in FIG. 1, the pressure-sensitive adhesive tape 1 in which the pressure-sensitive adhesive layer 3 is laminated on the base material 2 is obtained.

[How to use adhesive tape]
The adhesive tape 1 of the present embodiment is used for dicing a semiconductor material that is a source of a semiconductor chip in a process of manufacturing a semiconductor chip having a semiconductor element such as an LED (Light Emitting Diode) or a power semiconductor.

Specifically, the adhesive tape 1 is formed by dicing a semiconductor element substrate in which a plurality of semiconductor elements such as an LED element and a power semiconductor element are formed on a substrate made of a resin, ceramic, or the like, so that a semiconductor chip divided into individual pieces is formed. Used to get. Here, in a semiconductor element substrate in which a plurality of semiconductor elements are formed on a substrate, usually, in order to protect the semiconductor element from an external environment such as temperature and humidity, a sealing material as an example of a covering material is provided so as to cover the semiconductor element. A stop resin may be provided.
The pressure-sensitive adhesive tape 1 of the present embodiment can be preferably used particularly for dicing a semiconductor element substrate provided with a sealing resin.

As a method for obtaining a plurality of semiconductor chips by cutting a semiconductor element substrate provided with a sealing resin, for example, the following methods are conventionally known.
First, an adhesive tape for dicing is attached from the substrate side of the semiconductor element substrate, and the semiconductor element substrate is cut from the side where the semiconductor element is formed by a dicer or the like. Then, a plurality of semiconductor chips are obtained by peeling each semiconductor chip formed by the cutting from the adhesive tape.

However, when the dicing adhesive tape is applied from the substrate side of the semiconductor element substrate to cut the semiconductor element substrate in this manner, so-called sagging in which the cut surface (the side surface of the substrate of the semiconductor chip) is cut off occurs. There is a problem that the cut surface becomes rough.
In recent years, in order to solve such a problem, in order to solve such a problem, not only a substrate side but also a side on which a semiconductor element is formed, that is, a dicing resin for sealing a semiconductor element is used. Has been proposed in which an adhesive tape is applied to cut a semiconductor element substrate.

Here, as a sealing resin for a semiconductor element such as an LED or a power semiconductor, an epoxy resin having excellent electrical characteristics and heat resistance has been conventionally used, but an epoxy resin is used for a high-output LED or a power semiconductor. In this case, there is a problem that the color is easily discolored when used for an LED having a short wavelength or depending on a usage environment of a semiconductor chip.

On the other hand, silicone resin is often used as a sealing resin for semiconductor elements such as LEDs and power semiconductors in recent years because discoloration due to heat and light is less likely to occur than epoxy resins. More specifically, a silicone resin containing both or one of a methyl group and a phenyl group as a functional group, that is, a silicone resin containing a methyl group, a silicone resin containing a phenyl group, and both a methyl group and a phenyl group In many cases, a silicone resin is used.

By using a silicone resin as a sealing resin for a semiconductor element, discoloration of the sealing resin due to heat or light can be suppressed.
Further, the silicone resin has a high light transmittance of 88% or more (wavelength 400 to 800 nm) and a high refractive index of 1.41 or more. For this reason, when the semiconductor element is an LED, the radiation light from the LED can be efficiently extracted to the outside of the package by using a silicone resin as the sealing resin. By using a silicone resin containing a phenyl group among the above-described silicone resins, it is possible to further improve the efficiency of emitted light as compared with a case where a silicone resin containing a methyl group is used.

The silicone resin containing a methyl group is not particularly limited. For example, KER-2300, KER-2460, KER-2500N, KER-2600, KER-2700, KER-2700, manufactured by Shin-Etsu Chemical Co., Ltd. 2900, X-32-2528, IVS4312, IVS4312, XE14-C2042, IVS4542, IVS4546, IVS4622, IVS4632, IVS4742, IVS4752, IVSG3445, IVSG0810, IVSG5778, XE13-C2500, IVSM4312 manufactured by Momentive Performance Materials, Inc. -OE-6351, OE-6336, OE-6301, etc. manufactured by Dow Corning Co., Ltd.
Examples of the silicone resin containing a methyl group and a phenyl group include, but are not particularly limited to, KER-6075, KER-6150, and KER-6020 manufactured by Shin-Etsu Chemical Co., Ltd.
The phenyl group-containing silicone resin is not particularly limited, and examples thereof include, for example, KER-6110, KER-6000, KER-6200, ASP-1111, ASP-1060, and ASP manufactured by Shin-Etsu Chemical Co., Ltd. -1120, ASP-1050P, XE14-C2508 manufactured by Momentive Performance Materials, OE-6520, OE-6550, OE-6363, OE-6636, OE-6635, OE-635 manufactured by Dow Corning Toray Co., Ltd. 6630 and the like.

Conventionally, as an adhesive tape for dicing used for cutting a semiconductor element, for example, an adhesive tape whose adhesive layer is made of an acrylic resin-based adhesive is used.
However, when such a conventional adhesive tape is attached from the side of the semiconductor element substrate on which the semiconductor element is formed (the sealing resin side) and the semiconductor element substrate is diced, for example, the sealing resin and the adhesive tape are removed. If the adhesive strength is insufficient, there is a possibility that problems such as scattering of the semiconductor chip during dicing may occur.

Particularly, the above-mentioned silicone resin has a property that the releasability is higher than that of, for example, an epoxy resin or the like conventionally used as a sealing resin. Therefore, for example, when an adhesive tape whose adhesive layer is made of an acrylic resin-based adhesive is applied to a semiconductor element substrate using a silicone resin as a sealing resin, the silicone resin as the sealing resin is adhered. Adhesive strength to the tape tends to be small. As a result, when dicing the semiconductor element substrate, problems such as scattering of semiconductor chips are more likely to occur.

On the other hand, in the pressure-sensitive adhesive tape 1 of the present embodiment, as described above, the pressure-sensitive adhesive layer 3 includes the silicone-based pressure-sensitive adhesive in which the silicone gum (G) and the silicone resin (R) are mixed at an appropriate ratio. When dicing the semiconductor element substrate, even when the semiconductor element substrate is attached from the sealing resin side made of silicone resin, the adhesive force and the tack force of the semiconductor element substrate to the sealing resin are used. Can be kept good. Then, as compared with the conventional adhesive tape, when dicing the semiconductor element substrate, the occurrence of scattering of the semiconductor chip and the like can be suppressed.
On the other hand, since the pressure-sensitive adhesive layer 3 contains a photosensitive platinum (Pt) catalyst and a cross-linking agent together with the above-mentioned silicone-based pressure-sensitive adhesive, the light-sensitive platinum ( The Pt) catalyst is activated, and the crosslinking reaction between the addition-reaction type silicone pressure-sensitive adhesive and the cross-linking agent for the addition-reaction type silicone pressure-sensitive adhesive is promoted. Become. As a result, the tacking force of the pressure-sensitive adhesive layer 3 is appropriately reduced, and the breaking mode in the holding force test is “interfacial peeling” or “does not fall” in the holding force test. This makes it possible to achieve good pick-up properties when the semiconductor chip or the like is peeled off from the adhesive tape 1 and to suppress adhesive residue on the semiconductor chip or the like.

Hereinafter, a method of using the adhesive tape 1 of the present embodiment and a method of manufacturing a semiconductor chip using the adhesive tape 1 of the present embodiment will be described in detail. FIGS. 2A to 2E are diagrams showing a method for manufacturing a semiconductor chip using the adhesive tape 1 of the present embodiment.
Here, a case where a semiconductor chip having an LED element as a semiconductor element is manufactured using the adhesive tape 1 will be described as an example. Further, the method described below is an example of a method of using the adhesive tape 1 and a method of manufacturing a semiconductor chip using the adhesive tape 1, and is not limited to the following method.

In this embodiment mode, first, a plurality of semiconductor elements 102 are stacked on a substrate 101 made of, for example, a resin material or ceramic to manufacture a semiconductor element substrate 100. Note that the semiconductor element 102 is, for example, an LED element, and is not illustrated, but is configured by stacking a plurality of semiconductor layers including a light-emitting layer that emits light when energized, for example, and has an electrode formed thereon. .
Next, a plurality of semiconductor elements formed on the substrate 101 of the semiconductor element substrate 100 are sealed with a sealing resin 103 made of a silicone resin (sealing step). In this example, the plurality of semiconductor elements 102 are collectively sealed with the sealing resin 103, but the individual semiconductor elements 102 may be individually sealed with the sealing resin 103.

Subsequently, as shown in FIG. 2A, the adhesive tape 1 and the semiconductor element substrate 100 are bonded together such that the adhesive layer 3 of the adhesive tape 1 faces the sealing resin 103 of the semiconductor element substrate 100 ( Pasting step).
Next, as shown in FIGS. 2B and 2C, the semiconductor element substrate 100 is cut by a dicer or the like along the cut line X in a state where the adhesive tape 1 and the semiconductor element substrate 100 are bonded to each other. (Cutting step). In this example, the semiconductor element substrate 100 to which the adhesive tape 1 is attached is cut from the substrate 101 side. Further, as shown in FIG. 2C, in this example, a so-called full cut in which the semiconductor element substrate 100 is entirely cut in the thickness direction is performed.

Subsequently, as shown in FIG. 2D, the adhesive tape 1 attached to the semiconductor element substrate 100 is irradiated with ultraviolet rays from the base material 2 side (ultraviolet irradiation step). As described above, the substrate 2 is made of a material that transmits ultraviolet light. Therefore, by irradiating the adhesive tape 1 with ultraviolet rays from the substrate 2 side, the ultraviolet rays are transmitted through the substrate 2 and the adhesive layer 3 is irradiated.
In the pressure-sensitive adhesive tape 1 of the present embodiment, since the pressure-sensitive adhesive layer 3 has a photosensitive platinum (Pt) catalyst, when the pressure-sensitive adhesive layer 3 is irradiated with ultraviolet rays, the addition reaction type silicone-based The addition reaction between the pressure-sensitive adhesive and the crosslinking agent is promoted. As a result, the crosslink density in the pressure-sensitive adhesive layer 3, that is, the cohesive force increases, and the tack force of the pressure-sensitive adhesive layer 3 decreases, as compared to before the irradiation with the ultraviolet light.

Subsequently, the semiconductor chip 200 formed by cutting the semiconductor element substrate 100 is peeled off (picked up) from the adhesive tape 1, and as shown in FIG. 200 can be obtained (peeling step).

As described above, the pressure-sensitive adhesive tape 1 of the present embodiment is configured such that the pressure-sensitive adhesive layer 3 includes a silicone-based pressure-sensitive adhesive in which silicone gum (G) and silicone resin (R) are mixed at an appropriate ratio. . Thereby, when the adhesive tape 1 is used for dicing, the adhesive force and the tack force of the adhesive tape 1 with respect to the semiconductor element substrate 100 can be kept good.
In particular, in recent years, a silicone resin having a high releasability is often used as the sealing resin 103 for sealing the semiconductor element 102. On the other hand, the pressure-sensitive adhesive tape 1 according to the present embodiment has the above-described configuration, and thus has a good pressure-sensitive adhesive strength and a good tackiness even with respect to the sealing resin 103 made of a silicone resin.
As a result, when the pressure-sensitive adhesive tape 1 of the present embodiment is used for dicing the semiconductor element substrate 100, the scattering of the semiconductor chips 200 can be suppressed.

Further, the silicone-based pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer 3 of the pressure-sensitive adhesive tape 1 according to the present embodiment has a good adhesive force with the sealing resin 103 as described above, but also has a property of high releasability. are doing.
Furthermore, the pressure-sensitive adhesive tape 1 of the present embodiment contains a light-sensitive platinum (Pt) catalyst that promotes an addition reaction between an addition-reaction-type silicone pressure-sensitive adhesive and a crosslinking agent by irradiation with light such as ultraviolet light. Then, by irradiating the pressure-sensitive adhesive layer 3 with light via the base material 2 after the cutting step and before the peeling step, the addition reaction between the addition-reaction type silicone pressure-sensitive adhesive and the crosslinking agent in the pressure-sensitive adhesive layer 3 is performed. By promoting this, the cohesive force can be improved and the tack force of the pressure-sensitive adhesive layer 3 can be reduced. Thereby, when the semiconductor chip 200 obtained by dicing the semiconductor element substrate 100 is peeled off (picked up) from the adhesive tape 1 in the peeling step, the generation of so-called adhesive residue that the adhesive is adhered to the semiconductor chip 200 is suppressed. can do. In addition, good pickup properties when the semiconductor chip 200 is peeled off from the adhesive tape 1 can be realized.

Note that, in the above description, a method in which an adhesive tape 1 is applied from a sealing resin side to a semiconductor element substrate on which a plurality of semiconductor elements are formed, and dicing is performed to obtain individual semiconductor chips. explained. However, the application of the adhesive tape 1 of the present embodiment is not limited to this.
For example, in the manufacture of a chip scale package LED, the adhesive tape 1 of the present embodiment is a chip scale in which a plurality of LED elements are diced into a semiconductor material coated with a phosphor as an example of a coating material to be singulated. It may be used to obtain packaged LEDs. Note that the phosphor is a member in which a fluorescent material is dispersed in a resin material, ceramic, or the like.

In recent years, with the miniaturization of chip-scale package LEDs, chip-scale package LEDs singulated during dicing tend to be scattered. On the other hand, by using the pressure-sensitive adhesive tape 1 of the present embodiment having the above-described configuration, it is possible to maintain good adhesion between the phosphor and the pressure-sensitive adhesive layer 3, and to obtain an individualized chip scale package. The scattering of the LED can be suppressed.
Further, after dicing, by irradiating the adhesive layer 3 with ultraviolet rays to reduce the tacking force, the chip scale package LED singulated from the adhesive tape 1 can be easily peeled off, and the chip scale package LED that has been peeled off can be removed. The generation of adhesive residue can be suppressed.

Next, the present invention will be described more specifically with reference to Examples and Comparative Examples. Note that the present invention is not limited to the following embodiments.

The present inventors have considered that a first mode in which the pressure-sensitive adhesive layer 3 includes an addition-reaction-type silicone pressure-sensitive adhesive as a curable silicone-based pressure-sensitive adhesive; Pressure-sensitive adhesive tape 1 was prepared by making the components of the pressure-sensitive adhesive layer 3 and the thickness of each layer different for each of the second forms including the pressure-sensitive adhesive and the peroxide-curable silicone pressure-sensitive adhesive. Tape 1 was evaluated. Of the following examples, Examples 1 to 8 correspond to the first mode, and Examples 9 to 15 correspond to the second mode.
Hereinafter, each example and each comparative example will be described in detail.

1. Production of adhesive tape 1 (Example 1)
Addition-reaction silicone adhesive composed of toluene and an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in the molecule (SD4584 (trade name) manufactured by Dow Corning Toray Co., Ltd., with no crosslinking agent added, solid (Part concentration: 60% by mass) 166.67 parts by mass and a crosslinking agent comprising an organopolysiloxane having a hydrosilyl group in the molecule (BY24-741 (trade name) manufactured by Dow Corning Toray Co., Ltd., solid content concentration: 20% by mass) 3.30 parts by mass were mixed and stirred. Next, 5.33 parts by mass of a solution of a photosensitive platinum (Pt) catalyst (trimethyl (methylcyclopentadienyl) platinum (IV) manufactured by Sigma-Aldrich Japan GK) diluted to a solid concentration of 15% by mass with toluene was added. , Mixed and stirred to prepare a first form of the adhesive solution.
Subsequently, after applying this pressure-sensitive adhesive solution on a substrate 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 μm, the solution is heated at a temperature of 120 ° C. for 3 minutes so that the thickness after drying is 20 μm. Pressure-sensitive adhesive layer 3 was formed. Thereby, the pressure-sensitive adhesive tape 1 having a total thickness of 58 μm after drying was obtained.

(Example 2)
In the preparation of the pressure-sensitive adhesive solution of the first embodiment, an addition-reaction type silicone pressure-sensitive adhesive comprising an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in the molecule (SD4584 (trade name) manufactured by Dow Corning Toray Co., Ltd.) A cross-linking agent having a total thickness of 68 μm after drying in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer 3 after drying was 30 μm, using a cross-linking agent not internally added type and a solid content concentration of 60% by mass. Tape 1 was obtained.

(Example 3)
A pressure-sensitive adhesive tape 1 having a total thickness of 22 μm after drying was prepared in the same manner as in Example 2 except that a 12 μm-thick PET film was used as the base material 2 and the thickness of the pressure-sensitive adhesive layer 3 after drying was 10 μm. Obtained.

(Example 4)
In the preparation of the pressure-sensitive adhesive solution of the first embodiment, an addition reaction type silicone pressure-sensitive adhesive comprising an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in a molecule (SD4585 (trade name) manufactured by Dow Corning Toray Co., Ltd.) Example 1 except that a cross-linking agent was not added and a solid content concentration was 60% by mass), a 50 μm thick PET film was used as the base material 2, and the thickness of the pressure-sensitive adhesive layer 3 after drying was 40 μm. In the same manner as in the above, an adhesive tape 1 having a total thickness after drying of 90 μm was obtained.

(Example 5)
Example 1 was repeated except that the amount of the crosslinking agent (BY24-741 (trade name, manufactured by Toray Dow Corning Co., Ltd., solid content concentration: 20% by mass)) in the preparation of the pressure-sensitive adhesive solution of the first embodiment was 1.65 parts by mass. In the same manner as in Example 1, an adhesive tape 1 having a total thickness of 58 μm after drying was obtained.

(Example 6)
Example 1 was prepared except that the amount of the crosslinking agent (BY24-741 (trade name, manufactured by Toray Dow Corning Co., Ltd., solid content concentration: 20% by mass)) in the preparation of the pressure-sensitive adhesive solution of the first embodiment was 8.25 parts by mass. In the same manner as in Example 1, an adhesive tape 1 having a total thickness of 58 μm after drying was obtained.

(Example 7)
In the preparation of the pressure-sensitive adhesive solution of the first embodiment, a photosensitive platinum (Pt) catalyst (trimethyl (methylcyclopentadienyl) platinum (IV) manufactured by Sigma-Aldrich Japan GK) diluted with toluene to a solid concentration of 15% by mass was used. An adhesive tape 1 having a total thickness after drying of 58 μm was obtained in the same manner as in Example 1 except that the amount of the solution added was changed to 2.00 parts by mass.

(Example 8)
In the preparation of the pressure-sensitive adhesive solution of the first embodiment, a photosensitive platinum (Pt) catalyst (trimethyl (methylcyclopentadienyl) platinum (IV) manufactured by Sigma-Aldrich Japan G.K.) diluted with toluene to a solid concentration of 15% by mass was used. An adhesive tape 1 having a total thickness of 58 μm after drying was obtained in the same manner as in Example 1 except that the amount of the solution added was 20.00 parts by mass.

(Example 9)
Addition-reaction silicone adhesive composed of toluene and an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in the molecule (SD4584 (trade name) manufactured by Dow Corning Toray Co., Ltd., with no crosslinking agent added, solid (Part concentration: 60% by mass) 166.67 parts by mass and a crosslinking agent comprising an organopolysiloxane having a hydrosilyl group in the molecule (BY24-741 (trade name) manufactured by Dow Corning Toray Co., Ltd., solid content concentration: 20% by mass) 3.30 parts by mass were mixed and stirred. Next, 5.33 parts by mass of a solution of a photosensitive platinum (Pt) catalyst (trimethyl (methylcyclopentadienyl) platinum (IV) manufactured by Sigma-Aldrich Japan GK) diluted to a solid concentration of 15% by mass with toluene was added. After mixing and stirring, an addition reaction type silicone pressure-sensitive adhesive solution was prepared.

On the other hand, 166.67 parts by mass of a peroxide-curable silicone-based pressure-sensitive adhesive composed of toluene and organopolysiloxane (SH4280 (trade name, manufactured by Dow Corning Toray Co., Ltd., solid content concentration: 60% by mass)) and methyl peroxide 5.00 parts by mass of an initiator composed of benzoyl oxide (Nipper K40 (trade name, manufactured by NOF CORPORATION, solid content concentration: 40% by mass)) was mixed and stirred to prepare a peroxide-curable silicone-based pressure-sensitive adhesive solution. Prepared.

Subsequently, the obtained addition-reaction-type silicone-based pressure-sensitive adhesive solution and the peroxide-curable silicone-based pressure-sensitive adhesive solution were mixed and stirred to prepare a second-form pressure-sensitive adhesive solution. The mixing ratio of the addition-reaction-type silicone-based pressure-sensitive adhesive solution and the peroxide-curable-type silicone-based pressure-sensitive adhesive solution is 100 parts by mass (solid content) of the addition-reaction-type silicone-based pressure-sensitive adhesive. It adjusted so that 100 mass parts (solid content) of a system adhesive may be contained.
Subsequently, after applying this pressure-sensitive adhesive solution onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 μm, the solution is heated at a temperature of 160 ° C. for 3 minutes to have a thickness of 20 μm after drying. Pressure-sensitive adhesive layer 3 was formed. Thereby, the pressure-sensitive adhesive tape 1 having a total thickness of 58 μm after drying was obtained.

(Example 10)
In the preparation of the pressure-sensitive adhesive solution of the second embodiment, the mixing ratio of the addition-reaction-type silicone-based pressure-sensitive adhesive solution to the peroxide-curable silicone-based pressure-sensitive adhesive solution is adjusted to 100 parts by mass (solid content) of the addition-reaction-type silicone-based pressure-sensitive adhesive. Pressure-sensitive adhesive tape 1 having a total thickness of 58 μm after drying in the same manner as in Example 9 except that the amount of the peroxide-curable silicone-based pressure-sensitive adhesive was adjusted to 63.70 parts by mass (solid content). I got

(Example 11)
In the preparation of the pressure-sensitive adhesive solution of the second embodiment, the mixing ratio of the addition-reaction-type silicone-based pressure-sensitive adhesive solution to the peroxide-curable silicone-based pressure-sensitive adhesive solution is adjusted to 100 parts by mass (solid content) of the addition-reaction-type silicone pressure-sensitive adhesive. The adhesive tape 1 having a total thickness of 58 μm after drying was obtained in the same manner as in Example 9 except that the amount of the peroxide-curable silicone-based adhesive was adjusted to be 150 parts by mass (solid content). Was.

(Example 12)
In the preparation of the addition reaction type silicone pressure sensitive adhesive solution of the pressure sensitive adhesive solution of the second embodiment, Toray Dow as an addition reaction type silicone pressure sensitive adhesive comprising an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in the molecule. An adhesive tape 1 having a total thickness of 58 μm after drying was prepared in the same manner as in Example 9 except that a non-inner type of crosslinking agent (solid content concentration: 60% by mass) of Corning Co., Ltd. SD4580 (trade name) was used. Obtained.

(Example 13)
In the preparation of the addition reaction type silicone pressure sensitive adhesive solution of the pressure sensitive adhesive solution of the second embodiment, Toray Dow as an addition reaction type silicone pressure sensitive adhesive comprising an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in the molecule. An adhesive tape 1 having a total thickness of 58 μm after drying was prepared in the same manner as in Example 9 except that a non-internal type crosslinking agent (solid content: 60% by mass) of SD4586 (trade name) manufactured by Corning Co., Ltd. was used. Obtained.

(Example 14)
Addition-reaction silicone adhesive composed of toluene and an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in the molecule (SD4585 (trade name) manufactured by Dow Corning Toray Co., Ltd., with no crosslinking agent added, solid (Part concentration: 60% by mass) 166.67 parts by mass and a crosslinking agent comprising an organopolysiloxane having a hydrosilyl group in the molecule (BY24-741 (trade name) manufactured by Dow Corning Toray Co., Ltd., solid content concentration: 20% by mass) 3.30 parts by mass were mixed and stirred. Next, 5.33 parts by mass of a solution of a photosensitive platinum (Pt) catalyst (trimethyl (methylcyclopentadienyl) platinum (IV) manufactured by Sigma-Aldrich Japan GK) diluted to a solid concentration of 15% by mass with toluene was added. After mixing and stirring, an addition reaction type silicone pressure-sensitive adhesive solution was prepared.

On the other hand, 166.67 parts by mass of toluene and a peroxide-curable silicone-based pressure-sensitive adhesive composed of organopolysiloxane (BY24-717 (trade name, manufactured by Dow Corning Toray Co., Ltd., solid content concentration: 60% by mass)) were used. By mixing and stirring, a peroxide-curable silicone-based pressure-sensitive adhesive solution was prepared.

Subsequently, the obtained addition-reaction-type silicone-based pressure-sensitive adhesive solution and the peroxide-curable silicone-based pressure-sensitive adhesive solution were mixed and stirred to prepare a second-form pressure-sensitive adhesive solution. The mixing ratio of the addition-reaction-type silicone-based pressure-sensitive adhesive solution and the peroxide-curable-type silicone-based pressure-sensitive adhesive solution is 100 parts by mass (solid content) of the addition-reaction-type silicone-based pressure-sensitive adhesive. It adjusted so that 20 mass parts (solid content) of a system adhesive may be contained.
Subsequently, after applying this pressure-sensitive adhesive solution onto a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 μm, the solution is heated at a temperature of 160 ° C. for 3 minutes to have a thickness of 20 μm after drying. Pressure-sensitive adhesive layer 3 was formed. Thereby, the pressure-sensitive adhesive tape 1 having a total thickness of 58 μm after drying was obtained.

(Example 15)
First, an addition reaction type silicone-based pressure-sensitive adhesive solution was prepared in the same manner as in the pressure-sensitive adhesive solution of the first embodiment of Example 4.

On the other hand, 250.00 parts by mass of a peroxide-curable silicone-based pressure-sensitive adhesive composed of toluene and organopolysiloxane (SE4200 (trade name, manufactured by Dow Corning Toray Co., Ltd., solid content concentration: 40% by mass)) and methyl peroxide 5.00 parts by mass of an initiator composed of benzoyl oxide (Nipper K40 (trade name, manufactured by NOF CORPORATION, solid content concentration: 40% by mass)) was mixed and stirred to prepare a peroxide-curable silicone-based pressure-sensitive adhesive solution. Prepared.

Subsequently, the obtained addition-reaction-type silicone-based pressure-sensitive adhesive solution and the peroxide-curable silicone-based pressure-sensitive adhesive solution were mixed and stirred to prepare a second-form pressure-sensitive adhesive solution. The mixing ratio of the addition-reaction-type silicone-based pressure-sensitive adhesive solution and the peroxide-curable-type silicone-based pressure-sensitive adhesive solution is 100 parts by mass (solid content) of the addition-reaction-type silicone-based pressure-sensitive adhesive. It adjusted so that 150 mass parts (solid content) of a system adhesive may be contained.
Subsequently, this adhesive solution is applied on a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 125 μm, and then heated at a temperature of 160 ° C. for 3 minutes to have a thickness of 20 μm after drying. Pressure-sensitive adhesive layer 3 was formed. Thus, the adhesive tape 1 having a total thickness after drying of 145 μm was obtained.

(Comparative Example 1)
Instead of a solution of a light-sensitive platinum (Pt) catalyst (trimethyl (methylcyclopentadienyl) platinum (IV) manufactured by Sigma-Aldrich Japan GK), a platinum metal catalyst (NC-25 (trade name, manufactured by Dow Corning Toray)) , A solid content of 25% by mass), and the adhesive tape 1 having a total thickness of 73 μm after drying was prepared in the same manner as in Example 1 except that the thickness of the adhesive layer 3 after drying was 35 μm. Obtained.

(Comparative Example 2)
With respect to the pressure-sensitive adhesive solution of Example 1, as a silicone resin (R3) used for the addition-reaction type silicone pressure-sensitive adhesive, a linear polyorganosiloxane having silanol groups at both ends, manufactured by Momentive Performance Materials, Inc. 10.00 parts by mass of YF3897 (trade name, solid content: 100% by mass) was further added, and the pressure-sensitive adhesive layer 3 was dried in the same manner as in Example 1 except that the thickness after drying was 30 μm. An adhesive tape 1 having a total thickness of 68 μm was obtained.

(Comparative Example 3)
As an addition-reactive silicone adhesive comprising an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in the molecule, a cross-linking agent not added to Toray Dow Corning Co., Ltd. SD4586 (trade name) (solid content concentration) Adhesive tape 1 having a total thickness of 78 µm after drying was obtained in the same manner as in Example 1 except that the thickness of the adhesive layer 3 after drying was 40 µm.

(Comparative Example 4)
Addition-reaction silicone adhesive composed of toluene and an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in the molecule (SD4584 (trade name) manufactured by Dow Corning Toray Co., Ltd., with no crosslinking agent added, solid (Part concentration: 60% by mass) 166.67 parts by mass and a crosslinking agent comprising an organopolysiloxane having a hydrosilyl group in the molecule (BY24-741 (trade name) manufactured by Dow Corning Toray Co., Ltd., solid content concentration: 20% by mass) 3.30 parts by mass were mixed and stirred. Next, 6.00 parts by mass of a platinum metal catalyst (NC-25 (trade name, manufactured by Dow Corning Toray Co., Ltd., solid content: 25% by mass)) was added, mixed and stirred, and the addition-reaction type silicone pressure-sensitive adhesive solution was added. Prepared.

Meanwhile, a peroxide-curable silicone-based pressure-sensitive adhesive solution was prepared in the same manner as in Example 9.

Subsequently, the obtained addition-reaction-type silicone-based pressure-sensitive adhesive solution and a peroxide-curable silicone-based pressure-sensitive adhesive solution were mixed and stirred to prepare a pressure-sensitive adhesive mixed solution. The mixing ratio of the addition-reaction-type silicone-based pressure-sensitive adhesive solution and the peroxide-curable-type silicone-based pressure-sensitive adhesive solution is 100 parts by mass (solid content) of the addition-reaction-type silicone-based pressure-sensitive adhesive. It adjusted so that 50 mass parts (solid content) of a system adhesive may be contained.
Subsequently, this adhesive mixed solution is applied on a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 μm, and then heated at a temperature of 160 ° C. for 3 minutes so that the thickness after drying is reduced. An adhesive layer 3 of 30 μm was formed. Thereby, the adhesive tape 1 having a total thickness of 68 μm after drying was obtained.

(Comparative Example 5)
First, an addition reaction type silicone-based pressure-sensitive adhesive solution was prepared in the same manner as in the pressure-sensitive adhesive solution of the first embodiment of Example 2.

On the other hand, 166.67 parts by mass of toluene and a peroxide-curable silicone-based pressure-sensitive adhesive composed of organopolysiloxane (BY241-717 (trade name, manufactured by Dow Corning Toray Co., Ltd., solid content concentration: 60% by mass)) 5.00 parts by mass of an initiator composed of methyl benzoyl peroxide (Nipper K40 (trade name, manufactured by NOF CORPORATION, solid content concentration: 40% by mass)) was mixed and stirred to obtain a peroxide-curable silicone-based pressure-sensitive adhesive solution. Was prepared.

Subsequently, the obtained addition-reaction-type silicone-based pressure-sensitive adhesive solution and a peroxide-curable silicone-based pressure-sensitive adhesive solution were mixed and stirred to prepare a pressure-sensitive adhesive mixed solution. The mixing ratio of the addition-reaction-type silicone-based pressure-sensitive adhesive solution and the peroxide-curable-type silicone-based pressure-sensitive adhesive solution is 100 parts by mass (solid content) of the addition-reaction-type silicone-based pressure-sensitive adhesive. It adjusted so that 100 mass parts (solid content) of a system adhesive may be contained.
Subsequently, this adhesive mixed solution is applied on a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 μm, and then heated at a temperature of 160 ° C. for 3 minutes so that the thickness after drying is reduced. An adhesive layer 3 of 20 μm was formed. Thereby, the pressure-sensitive adhesive tape 1 having a total thickness of 58 μm after drying was obtained.

(Comparative Example 6)
First, as an addition-reaction-type silicone-based pressure-sensitive adhesive composed of an organopolysiloxane having a vinylsilyl group as a silicon-bonded alkenyl group in the molecule, a non-crosslinking type (solid) of SD4587 (trade name) manufactured by Dow Corning Toray Co., Ltd. (Additional concentration: 60% by mass), and an addition reaction type silicone pressure-sensitive adhesive was prepared in the same manner as in Example 1.

Meanwhile, a peroxide-curable silicone-based pressure-sensitive adhesive solution was prepared in the same manner as in Example 15.

(Comparative Example 7)
First, an addition reaction type silicone-based pressure-sensitive adhesive solution was prepared in the same manner as in Comparative Example 2.
On the other hand, a peroxide-curable silicone-based pressure-sensitive adhesive solution was prepared in the same manner as in Comparative Example 5.

Subsequently, the obtained addition-reaction-type silicone-based pressure-sensitive adhesive solution and a peroxide-curable silicone-based pressure-sensitive adhesive solution were mixed and stirred to prepare a pressure-sensitive adhesive mixed solution. The mixing ratio of the addition-reaction-type silicone pressure-sensitive adhesive to the peroxide-curable silicone pressure-sensitive adhesive is 100 parts by mass (solid content) of the addition-reaction-type silicone pressure-sensitive adhesive. It was adjusted so that the agent was contained at 150 parts by mass (solid content).
Subsequently, this adhesive mixed solution is applied on a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 μm, and then heated at a temperature of 160 ° C. for 3 minutes so that the thickness after drying is reduced. An adhesive layer 3 of 20 μm was formed. Thereby, the pressure-sensitive adhesive tape 1 having a total thickness of 58 μm after drying was obtained.

(Comparative Example 8)
First, an addition reaction type silicone pressure-sensitive adhesive solution was prepared in the same manner as in Example 13.
On the other hand, a peroxide-curable silicone-based pressure-sensitive adhesive solution was prepared in the same manner as in Comparative Example 6.

Subsequently, the obtained addition-reaction-type silicone-based pressure-sensitive adhesive solution and a peroxide-curable silicone-based pressure-sensitive adhesive solution were mixed and stirred to prepare a pressure-sensitive adhesive mixed solution. The mixing ratio of the addition-reaction-type silicone pressure-sensitive adhesive to the peroxide-curable silicone pressure-sensitive adhesive is 100 parts by mass (solid content) of the addition-reaction-type silicone pressure-sensitive adhesive. It was adjusted so that the composition contained 30 parts by mass (solid content).
Subsequently, this adhesive mixed solution is applied on a base material 2 made of a polyethylene terephthalate (PET) film having a thickness of 38 μm, and then heated at a temperature of 160 ° C. for 3 minutes so that the thickness after drying is reduced. An adhesive layer 3 of 20 μm was formed. Thereby, the pressure-sensitive adhesive tape 1 having a total thickness of 58 μm after drying was obtained.

Tables 1 to 3 show the content of each component of the pressure-sensitive adhesive layer 3 and the thickness of each layer in Examples 1 to 15 and Comparative Examples 1 to 8. In Tables 1 to 3, the terms “silicone gum” and “silicone resin” are abbreviated to “gum” and “resin”, respectively.

2. Evaluation method Subsequently, an evaluation method of the adhesive tape 1 will be described.
(1) Adhesive strength test For the adhesive tapes 1 produced in Examples 1 to 15 and Comparative Examples 1 to 8, based on the method described in the adhesive tape / adhesive sheet test method (JIS Z 0237 (2009)), A BA-SUS adhesion test (peeling adhesion test) was performed.
Specifically, the pressure-sensitive adhesive tape 1 was affixed to a stainless plate (SUS304) having a surface roughness (Ra) of 50 ± 25 nm after a bright annealing (BA) treatment, and a roller having a mass of 2000 g was reciprocated once at a speed of 5 mm / s. And crimped. Then, after leaving it for 20 to 40 minutes, it was peeled off from the stainless steel plate in the direction of 180 ° at a speed of 5 mm / s using a tensile tester, and the adhesion to the polished SUS plate was measured.
In addition, the adhesive strength test was performed on the adhesive tape 1 before irradiation with ultraviolet rays. In addition, as a result of the adhesive strength test, it is preferable that the adhesive strength be 2.4 N / 10 mm or more and 5.5 N / 10 mm or less in consideration of the fixing force when the adhesive tape 1 is used for dicing a semiconductor material.

(2) Ball tack test (2-1) Measurement of initial ball tack The pressure-sensitive adhesive tape / pressure-sensitive adhesive sheet 1 prepared in Examples 1 to 15 and Comparative Examples 1 to 8 was tested (JIS Z 0237 (2009)). The ball tack test was performed according to the method described in (1).

(2-2) Measurement of ball tack after UV irradiation The pressure-sensitive adhesive layer 3 of each of the pressure-sensitive adhesive tapes 1 prepared in Examples 1 to 15 and Comparative Examples 1 to 8 was coated with a fluorine-based release film (SS1A manufactured by Nipa Co., (75 μm). Subsequently, ultraviolet rays are irradiated from the side of the base material 2 of the adhesive tape 1 and left at a temperature of 23 ° C. and a humidity of 50 ± 5% RH for 20 to 40 minutes, and then the adhesive tape / adhesive sheet test method (JIS Z 0237) (2009)), and a ball tack test was conducted in the same manner as in the initial ball tack.
Irradiation with ultraviolet rays was performed using a high-pressure mercury lamp, adjusting the wavelength of 365 nm to be 1200 mJ / cm ² in integrated light quantity. Although was similarly measured for the ball tack when the cumulative amount of light with 3000 mJ / cm ^2, the difference between the case where the cumulative amount of light with 1200 mJ / cm ² was observed, here, the integrated light quantity of 1200 mJ / The evaluation was performed as cm ² .

As a result of the ball tack test, the ball tack (ball No.) after UV irradiation is lower than the initial ball tack (ball No.) in consideration of the pick-up properties of the semiconductor chips and the like diced by dicing. preferable.

(3) Holding force test (3-1) Measurement of initial holding force The pressure-sensitive adhesive tape 1 prepared in Examples 1 to 15 and Comparative Examples 1 to 8 was tested for pressure-sensitive adhesive tape and pressure-sensitive adhesive sheet (JIS Z 0237 (2009)). A holding force test was performed in accordance with the method described in (1).
Specifically, the adhesive tape 1 is attached to a stainless steel plate (SUS304) polished with water-resistant abrasive paper, and held at a temperature of 40 ° C. and a humidity of 33% RH with a predetermined weight attached. The elapsed time (fall time (minutes)) from peeling to falling was measured. Further, a destruction mode when the pressure-sensitive adhesive tape 1 was peeled from the stainless steel plate (whether the destruction mode between the pressure-sensitive adhesive layer 3 and the stainless steel plate was interface peeling or cohesive failure) was observed. The measurement of the drop time in the holding force test was performed up to 5000 minutes. Further, as a result of a holding force test shown in Tables 4 to 6 described later, a drop time (minutes) and a destruction mode of the adhesive tape 1 are shown. When the adhesive tape 1 did not peel (fall) by 5000 minutes, it is indicated as "hold".

(3-2) Measurement of Holding Force After UV Irradiation The adhesive tape 1 was irradiated with ultraviolet rays under the same conditions as described in the above-mentioned measurement of ball tack after UV irradiation, and allowed to stand. Holding force test.

(3-3) Relationship between Holding Force and Break Mode Here, the relationship between the holding force of the adhesive tape 1 and the break mode will be described. FIG. 3 is a schematic diagram showing the relationship between the crosslink density of the addition-reaction type silicone-based pressure-sensitive adhesive in the pressure-sensitive adhesive layer 3 and the result (fall time) of the holding force test of the pressure-sensitive adhesive tape 1.
As shown in FIG. 3, in the pressure-sensitive adhesive tape 1, as the crosslinking density of the addition-reaction type silicone pressure-sensitive adhesive in the pressure-sensitive adhesive layer 3 increases, the breaking mode of the pressure-sensitive adhesive tape 1 on the stainless steel plate by the holding force test changes to [pressure-sensitive adhesive]. Cohesive failure (fall) of layer 3] → [holding (does not fall)] → [separation (fall) of interface between adhesive layer 3 and stainless steel plate].

As shown in FIG. 3, in a region where the destruction mode of the adhesive tape 1 is cohesive failure, the holding force (fall time) of the adhesive tape 1 depends on the cross-link density of the addition-reaction silicone adhesive in the adhesive layer 3. It rises as it rises.
On the other hand, as shown in FIG. 3, in a region where the destruction mode of the adhesive tape 1 is interfacial peeling, the holding force (fall time) of the adhesive tape 1 depends on the crosslinking density of the addition-reaction silicone adhesive in the adhesive layer 3. Falls as it rises. This is because the cohesive force of the pressure-sensitive adhesive layer 3 increases as the crosslinking density of the addition-reaction silicone pressure-sensitive adhesive increases, and the adhesive force of the pressure-sensitive adhesive tape 1 decreases. As a result, the pressure-sensitive adhesive tape 1 peels off from the stainless steel plate. It is presumed that it is easy to fall.

As a result of the holding force test, it is preferable that at least the destruction mode after UV irradiation is retention or interfacial delamination, and it is more preferable that at least the destruction mode after UV irradiation is interfacial delamination, and that the initial (before UV irradiation) and More preferably, the destruction modes after UV irradiation are both interface peeling. When both the initial (before UV irradiation) and the destruction modes after UV irradiation are interfacial peeling, it is preferable that the holding force (fall time) after UV irradiation is lower than the initial (before UV irradiation).
In this case, after the adhesive tape 1 is used for dicing a semiconductor element substrate or the like, when the obtained semiconductor chip or the like is peeled off from the adhesive tape 1, the adhesive tape 1 is irradiated with UV to leave adhesive residue on the semiconductor chip or the like. Less likely to occur.

(4) Resin Residue Test for Silicone Resin The adhesive tape 1 produced in Examples 1 to 15 and Comparative Examples 1 to 8 was subjected to an adhesive residue test for silicone resin.
First, a mixture of the agent A and the agent B of a silicone resin containing a methyl group (KER-2500N (trade name) manufactured by Shin-Etsu Chemical Co., Ltd.), which is a silicone resin for LED devices, is mixed at a mixing ratio of 1: 1. Was prepared. This mixed solution was applied to a stainless steel plate, and heated and cured under the conditions of 100 ° C. × 1 hour and 150 ° C. × 2 hours to prepare a silicone test piece A.
Similarly, the A agent and the B agent of a phenyl group-containing silicone resin (KER-6110 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd.), which is a silicone resin for LED devices, are mixed at a mixing ratio of 3: 7. A mixed solution was prepared. This mixed solution was applied to a stainless steel plate, and heated and cured under the conditions of 100 ° C. × 2 hours and 150 ° C. × 5 hours to prepare a silicone test piece B.

Subsequently, the pressure-sensitive adhesive layer 3 of the pressure-sensitive adhesive tape 1 was attached to each of the silicone test pieces A and B, and a roller having a mass of 2000 g was reciprocated once at a speed of 5 mm / s to be pressure-bonded. Then, after irradiating ultraviolet rays from the base material 2 side of the adhesive tape 1 under the same conditions as those described in the measurement of ball tack after UV irradiation, the adhesive tape 1 was left in an environment of 40 ° C. and 90% RH for 120 hours. did. Thereafter, the temperature was lowered to room temperature, and the pressure-sensitive adhesive tape 1 was peeled off from the silicone test pieces A and B in the direction of 90 ° at a speed of 800 mm / s to 1200 mm / s, and the adhesive residue on the silicone test pieces A and B was visually checked. .

(5) Adhesive Residue Test for Epoxy Resin The adhesive tapes 1 produced in Examples 1 to 15 and Comparative Examples 1 to 8 were subjected to an adhesive residue test for epoxy resin.
The adhesive layer 3 of the adhesive tape 1 is attached to an epoxy test piece composed of an epoxy resin plate (NL-EG-23 (trade name) manufactured by Nikko Kasei Co., Ltd.) in which a glass cloth base material is impregnated with an epoxy resin. Then, a roller having a mass of 2000 g was reciprocated once at a speed of 5 mm / s to perform pressure bonding. Then, after irradiating ultraviolet rays from the base material 2 side of the adhesive tape 1 under the same conditions as those described in the measurement of ball tack after UV irradiation, the adhesive tape 1 was left in an environment of 40 ° C. and 90% RH for 120 hours. did. Then, at room temperature, the adhesive tape 1 was peeled off from the epoxy test piece in the direction of 90 ° at a speed of 800 mm / s to 1200 mm / s, and the adhesive residue on the epoxy test piece was visually checked.

The silicone resin adhesive residue test and the epoxy resin adhesive residue test were evaluated according to the following criteria. In addition, the evaluation of A or B was set to pass.
A: No adhesive residue in the range of 100% per unit area of the test specimen B: Glue residue is observed in the range of less than 2% per unit area of the test specimen C: 2% or more and less than 5% per unit area of the test specimen Adhesive residue is observed in the range D: Adhesive residue is observed in a range of 5% or more per unit area of the test piece, or adhesive residue is observed at the edge portion of the test piece

(6) Dicing Test A dicing test was performed on the pressure-sensitive adhesive tapes 1 produced in Examples 1 to 15 and Comparative Examples 1 to 8.
Specifically, first, an epoxy resin for molding (CEL-400ZHF40-W75G (trade name) manufactured by Hitachi Chemical Co., Ltd.) is placed in a mold, and a sealing pressure of 50 kgf / cm ² (491 N / cm ² ) is set. Was heat-cured under the conditions of a thickness of 0.3 mm and a heating temperature of 150 ° C. × 300 seconds to produce a disc-shaped (200 mm (8 inch) diameter) dicing test piece.
Further, the adhesive layer 3 of the adhesive tape 1 was attached to a dicing ring, a portion protruding from the ring was cut out, and further attached to a fluorine-based release film (SS1A (trade name) manufactured by Nipa Corporation, thickness: 75 μm). I matched. Subsequently, a roller having a mass of 2000 g was reciprocated to pressure-bond the adhesive tape 1 and the ring portion. Subsequently, the fluorine-based release film was peeled off, and a dicing test piece was attached to the pressure-sensitive adhesive layer at the center of the ring, followed by pressure bonding.

Further, using a dicing apparatus (A-WD-100A (trade name)) manufactured by Tokyo Seimitsu Co., Ltd., the dicing test piece was cut into 10 mm × 10 mm chips together with the adhesive tape 1 by a dicing blade manufactured by Disco Corporation. . At this time, the number of scattered chips was measured, and the fixing force in the dicing test was evaluated.
Subsequently, the adhesive tape 1 affixed to the chip diced into 10 mm × 10 mm was irradiated with ultraviolet rays after UV irradiation under the same conditions as described in the measurement of ball tack. Thereafter, chips separated into individual pieces were picked up from the adhesive tape 1, the presence or absence of adhesive residue on the chips was visually checked, and evaluation of the adhesive residue in a dicing test was performed. Further, when the chips were picked up, the number of chips that failed to be picked up was measured to evaluate the pick-up properties in a dicing test.

The fixing force in the dicing test was evaluated according to the following criteria. In addition, the evaluation of A or B was set to pass.
A: The number of scattered chips is 0 out of 100 B: The number of scattered chips is 1 out of 100 C: The number of scattered chips is 2 out of 100 D: The number of scattered chips is 100 3 or more

The adhesive residue in the dicing test was evaluated according to the following criteria. In addition, the evaluation of A was set to pass.
A: No adhesive residue is observed on the chip D: Adhesive residue is observed on the chip, or stringing of the adhesive is observed on the side surface of the chip

The pick-up property in the dicing test was evaluated according to the following criteria. In addition, the evaluation of A or B was set to pass.
A: The number of chips that failed to be picked up is 0 out of 100 B: The number of chips that failed to be picked up is 1 out of 100 C: The number of chips that failed to be picked up is 2 out of 100 D: The pickup failed 3 or more chips out of 100

3. Test Results Tables 4 to 6 show the evaluation results for the pressure-sensitive adhesive tapes 1 of Examples 1 to 15 and Comparative Examples 1 to 8.

As shown in Tables 4 to 6, the first embodiment in which the pressure-sensitive adhesive layer 3 is mainly composed of an addition-reaction-type silicone pressure-sensitive adhesive and contains a photosensitive platinum (Pt) catalyst and a crosslinking agent for the addition-reaction-type silicone pressure-sensitive adhesive. The corresponding pressure-sensitive adhesive tape 1 of Examples 1 to 8 and the pressure-sensitive adhesive layer 3 are mainly composed of a mixture of an addition-reaction-type silicone pressure-sensitive adhesive and a peroxide-curable silicone pressure-sensitive adhesive, and a photosensitive platinum (Pt) catalyst and In the pressure-sensitive adhesive tapes 1 of Examples 9 to 15, which correspond to the second embodiment including the crosslinking agent for the addition-reaction type silicone pressure-sensitive adhesive, the pressure-sensitive adhesive test, the ball tack test, the holding power test, the silicone resin adhesive residue test, and the It was confirmed that favorable results were obtained in both the epoxy resin adhesive residue test and the dicing test (fixing force, adhesive residue, and pickup property).

As a result, the pressure-sensitive adhesive layer 3 corresponds to the first embodiment corresponding to the first embodiment in which the addition-reaction-type silicone-based pressure-sensitive adhesive is the main component and the photosensitive platinum (Pt) catalyst and the crosslinking agent for the addition-reaction-type silicone-based pressure-sensitive adhesive are included. The adhesive tape 1 and the adhesive layer 3 are mainly composed of a mixture of an addition-reaction-type silicone adhesive and a peroxide-curable silicone-based adhesive, and a photosensitive platinum (Pt) catalyst and the addition-reaction silicone-based adhesive The pressure-sensitive adhesive tapes 1 of Examples 9 to 15, which correspond to the second mode including a cross-linking agent for the pressure-sensitive adhesive, are applied from a dicing pressure-sensitive adhesive tape of a semiconductor material, more specifically, from a sealing resin side of a semiconductor element substrate. It was confirmed that it was useful as an adhesive tape for dicing used in dicing.

On the other hand, Comparative Examples 1 to 3 in which the pressure-sensitive adhesive layer 3 does not satisfy the conditions of the first-type pressure-sensitive adhesive layer 3 and Comparative Example 4 in which the pressure-sensitive adhesive layer 3 does not satisfy the conditions of the second-type pressure-sensitive adhesive layer 3 For Nos. To 8, any of the test results is inferior to those of Examples 1 to 15 in the silicone resin adhesive residue test, the epoxy resin adhesive residue test, and the dicing test (fixing force, adhesive residue and pickup property). Was confirmed.

Specifically, in the pressure-sensitive adhesive tape 1 of Comparative Example 1 which does not include the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive layer 3 of the first embodiment, although the normal platinum (Pt) catalyst is included, before and after UV irradiation, There was no change in the results of the tack test and the holding force test, and the cohesive strength was insufficiently improved. Therefore, a large amount of adhesive residue was observed in the silicone resin adhesive residue test and the epoxy resin adhesive residue test. Also in the dicing test, the chip pick-up property of the dicing test specimen was inferior, and glue residue was observed on the chip.

粘着 In addition, the same results as in Comparative Example 1 were obtained with the pressure-sensitive adhesive tape 1 of Comparative Example 4 that did not include the photosensitive platinum (Pt) catalyst in the pressure-sensitive adhesive layer 3 of the second embodiment.

Further, the mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) to the total mass (Rw) of the silicone resin (R) and the mass ratio (Gw) of the silicone gum (G) and the silicone resin (R). In the pressure-sensitive adhesive tape 1 of Comparative Example 2 in which the content ratio of the silicone gum having an alkenyl group (G1) in the total mass is less than the lower limit of the pressure-sensitive adhesive layer 3 of the first embodiment, the pressure-sensitive adhesive force is high, and before and after UV irradiation. The results of the ball tack test and the holding force test showed little change, and the improvement in cohesive strength was somewhat insufficient. For this reason, a large amount of adhesive residue was observed in the silicone resin adhesive residue test and the epoxy resin adhesive residue test. Also, in the dicing test, the chip pick-up of the dicing test piece was inferior, and glue residue was observed on the chip surface.

Furthermore, the mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R), and the silicone gum (G) and the silicone resin (R) In the pressure-sensitive adhesive tape 1 of Comparative Example 3, in which the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the adhesive tapes 1 exceeds the upper limit of the pressure-sensitive adhesive layer 3 of the first embodiment, the ball tack test was performed before and after UV irradiation. In addition, the cohesive force was improved, but the cohesive force was improved, but the adhesive force was low. Therefore, in the dicing test, the fixing force of the dicing test piece was low, and chips were frequently scattered. No adhesive residue was found in the silicone resin adhesive residue test or the epoxy resin adhesive residue test. Also, in the dicing test, no adhesive residue was observed for chips that did not scatter.

Furthermore, the mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) to the total mass (Rw) of the silicone resin (R) is less than the lower limit of the pressure-sensitive adhesive layer 3 of the second embodiment. In the pressure-sensitive adhesive tape 1 of Comparative Example 5, the results of the ball tack test and the holding force test slightly changed before and after the UV irradiation, and although the cohesive force was improved, it was still not sufficient. It turned out that the pick-up property of one chip was slightly inferior. In the silicone resin adhesive residue test and the epoxy resin adhesive residue test, a slight amount of adhesive residue was observed, and in the dicing test, no adhesive residue was observed for chips that could be picked up.

Furthermore, the mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) to the total mass (Rw) of the silicone resin (R) is an upper limit value in the pressure-sensitive adhesive layer 3 of the second embodiment. In the adhesive tape 1 of Comparative Example 6, the results of the ball tack test and the holding force test changed before and after the UV irradiation, and the cohesive force was improved, but the adhesive force was low. The power was low and chips were scattered a lot. No adhesive residue was found in the silicone resin adhesive residue test or the epoxy resin adhesive residue test. Also, in the dicing test, no adhesive residue was observed for chips that did not scatter.

Furthermore, the mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) to the total mass (Rw) of the silicone resin (R) is an upper limit value in the pressure-sensitive adhesive layer 3 of the second embodiment. Comparative Example 7 in which the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) is less than the lower limit in the pressure-sensitive adhesive layer 3 of the second embodiment. In the pressure-sensitive adhesive tape 1 described above, the adhesive strength is high due to the effect of the curing of the peroxide-curable silicone pressure-sensitive adhesive, and the results of the ball tack test and the holding force test before and after UV irradiation are small, and the cohesive force is further improved. It was somewhat inadequate. For this reason, a large amount of adhesive residue was observed in the silicone resin adhesive residue test and the epoxy resin adhesive residue test. Also, in the dicing test, the chip pick-up of the dicing test piece was inferior, and glue residue was observed on the chip surface.

Furthermore, the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) exceeds the upper limit in the pressure-sensitive adhesive layer 3 of the second embodiment. In the adhesive tape 1, before and after UV irradiation, the results of the ball tack test and the holding force test changed, and although the cohesive force was improved, the adhesive force was low. A lot of scattering was seen. No adhesive residue was found in the silicone resin adhesive residue test or the epoxy resin adhesive residue test. Also, in the dicing test, no adhesive residue was observed for chips that did not scatter.

DESCRIPTION OF SYMBOLS 1 ... adhesive tape, 2 ... base material, 3 ... adhesive layer, 100 ... semiconductor element substrate, 101 ... substrate, 102 ... semiconductor element, 103 ... sealing resin, 200 ... semiconductor chip

Claims

A dicing adhesive used when dividing a semiconductor material having a plurality of semiconductor elements covered with a covering material into a plurality of semiconductor chips, comprising a base material and a silicone-based pressure-sensitive adhesive layer laminated on the base material. Tape
The silicone-based pressure-sensitive adhesive layer mainly includes an addition-reaction-type silicone-based pressure-sensitive adhesive, and includes a photosensitive platinum (Pt) catalyst and a crosslinking agent for the addition-reaction-type silicone-based pressure-sensitive adhesive,
The mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the silicone-based pressure-sensitive adhesive layer is 35 / 65-50. / 50, wherein the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) is 35% by mass or more and 50% by mass or less. Range,
An adhesive tape for dicing, characterized by satisfying all of the following conditions (a) to (c) in adhesive properties according to JIS Z 0237 (2009).
(A) The adhesive strength to the BA-SUS test plate before light irradiation is 2.4 N / 10 mm or more and 5.5 N / 10 mm or less.
(B) The ball number value in the tilting ball tack test (tilt angle 30 °, temperature 23 ° C., relative humidity 50% RH) is the ball number value before light irradiation BN0, and the ball number value after light irradiation. Is BN1, BN0> BN1.
(C) In a holding force test after light irradiation (temperature: 40 ° C., relative humidity: 33% RH, standing time: 5000 minutes), the destruction phenomenon upon falling was caused by the interface between the silicone-based pressure-sensitive adhesive layer and the BA-SUS test plate. Peeling or not falling in the holding force test.
2. The dicing device according to claim 1, wherein a plurality of the semiconductor elements are used by being attached to the semiconductor material sealed with the coating material made of a silicone resin from the coating material side. 3. Adhesive tape.
A dicing adhesive used when dividing a semiconductor material having a plurality of semiconductor elements covered with a covering material into a plurality of semiconductor chips, comprising a base material and a silicone-based pressure-sensitive adhesive layer laminated on the base material. Tape
The silicone-based pressure-sensitive adhesive layer is mainly composed of a mixture of an addition-reaction-type silicone-based pressure-sensitive adhesive and a peroxide-curable silicone-based pressure-sensitive adhesive, and is cross-linked to a photosensitive platinum (Pt) catalyst and the addition-reaction-type silicone-based pressure-sensitive adhesive. Agent
The mass ratio (Gw) / (Rw) of the total mass (Gw) of the silicone gum (G) and the total mass (Rw) of the silicone resin (R) contained in the silicone-based pressure-sensitive adhesive layer is 40/60 to 56. / 44, wherein the content ratio of the silicone gum (G1) having an alkenyl group in the total mass of the silicone gum (G) and the silicone resin (R) is from 14% by mass to 42% by mass. Range,
An adhesive tape for dicing, characterized by satisfying all of the following conditions (a) to (c) in adhesive properties according to JIS Z 0237 (2009).
(A) The adhesive strength to the BA-SUS test plate before light irradiation is 2.4 N / 10 mm or more and 5.5 N / 10 mm or less.
(B) The ball number value in the tilting ball tack test (tilt angle 30 °, temperature 23 ° C., relative humidity 50% RH) is the ball number value before light irradiation BN0, and the ball number value after light irradiation. Is BN1, BN0> BN1.
(C) In a holding force test after light irradiation (temperature: 40 ° C., relative humidity: 33% RH, standing time: 5000 minutes), the destruction phenomenon upon falling was caused by the interface between the silicone-based pressure-sensitive adhesive layer and the BA-SUS test plate. Peeling or not falling in the holding force test.
4. The dicing device according to claim 3, wherein a plurality of the semiconductor elements are attached to the semiconductor material sealed with the coating material made of a silicone resin from the coating material side and used. 5. Adhesive tape.
The dicing pressure-sensitive adhesive tape according to claim 3, wherein the silicone-based pressure-sensitive adhesive layer further includes an initiator composed of a peroxide.
A dicing pressure-sensitive adhesive tape according to claim 1, wherein a plurality of the semiconductor elements sealed with a sealing resin made of a silicone resin are formed on a substrate of a semiconductor element substrate. An attaching step of attaching from the sealing resin side,
A cutting step of cutting the semiconductor element substrate to which the dicing adhesive tape has been attached, into a plurality of semiconductor chips,
An irradiation step of irradiating the dicing adhesive tape of the semiconductor element substrate with light,
A step of peeling off the dicing adhesive tape from the plurality of semiconductor chips.