WO2020042395A1 - Dispositif de traitement - Google Patents

Dispositif de traitement Download PDF

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Publication number
WO2020042395A1
WO2020042395A1 PCT/CN2018/117212 CN2018117212W WO2020042395A1 WO 2020042395 A1 WO2020042395 A1 WO 2020042395A1 CN 2018117212 W CN2018117212 W CN 2018117212W WO 2020042395 A1 WO2020042395 A1 WO 2020042395A1
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WO
WIPO (PCT)
Prior art keywords
carrier
moving mechanism
bracket
processing device
product
Prior art date
Application number
PCT/CN2018/117212
Other languages
English (en)
Chinese (zh)
Inventor
邹金成
申兵兵
王敬苗
刘香廷
Original Assignee
深圳市永盛隆科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201810996915.0A external-priority patent/CN110875210B/zh
Priority claimed from CN201810997869.6A external-priority patent/CN110875211B/zh
Priority claimed from CN201810996908.0A external-priority patent/CN110875209B/zh
Application filed by 深圳市永盛隆科技有限公司 filed Critical 深圳市永盛隆科技有限公司
Publication of WO2020042395A1 publication Critical patent/WO2020042395A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • the present invention relates to the field of semiconductor technology, and in particular, to a processing device.
  • the film and the wafer are combined by surface tension. If the etching process is not effective, the film and the wafer cannot be completely separated. At this time, the film and the wafer are collectively called NG wafer. For incompletely separated films and wafers, sorting and separation are required. At present, the field only handles NG wafers manually. This method requires real-time monitoring and manual and timely processing. The manual processing efficiency is low. If the processing is not timely, the equipment can only be shut down, which limits the equipment's production capacity. In addition, the normally separated film can be recovered and reused, but the film is easily damaged by manual processing.
  • the invention provides a processing device to solve the problems of low efficiency and easy damage to the thin film when the thin film and wafer that are not completely separated after etching are processed in the prior art.
  • the present invention provides a processing device, including: a carrier for placing a product; an immersion mechanism, the immersion mechanism can store liquid, the immersion mechanism is used for immersing the product; a first moving mechanism, movably disposed, The first moving mechanism has a first working condition in which the carrier is at least partially placed in the immersion mechanism and a second working condition in which the carrier is taken out from the immersion mechanism; the second moving mechanism is movably disposed on the first moving mechanism,
  • the second moving mechanism includes a supporting mechanism or an adsorption mechanism, wherein the supporting mechanism is used to carry and move the product to place the product into the carrier, and the adsorption mechanism is used to adsorb and move the product to place the product into the carrier.
  • the processing device further includes a third moving mechanism movably disposed, the third moving mechanism having a third working condition for receiving a carrier on the first moving mechanism and a fourth working condition for conveying the carrier to the outside.
  • the supporting mechanism includes: a supporting fork for receiving and carrying the product; a first driving part, the supporting fork is arranged on the first driving part, and the first driving part has a first driving part for moving the supporting fork to the outside of the carrier; Five conditions and the sixth condition to move the fork to the inside of the vehicle.
  • the supporting mechanism further includes: a second driving portion, the first driving portion is disposed on the second driving portion, and the second driving portion is used for driving the supporting fork to move to separate the product on the supporting fork from the supporting fork.
  • the first driving portion is used to drive the fork to move vertically
  • the second driving portion is used to drive the fork to move horizontally.
  • the carrier includes an upper inlet, a first escape opening on the side, and a stopper.
  • the stopper is located at the first avoidance port, and the stopper is used to stop the product to separate the product from the fork; when the first moving mechanism is in the first working condition and the first driving portion is in the sixth working condition, the second driving The part can drive the fork to move to the outside of the vehicle at the first avoidance port, so as to leave the product inside the vehicle through the stopper.
  • the carrier further includes a bottom plate and a side plate surrounding the edge of the bottom plate.
  • the stopper is connected to the top surface of the bottom plate.
  • the suction mechanism includes: a suction cup for sucking and releasing a product; a third driving part, the suction cup is arranged on the third driving part, and the third driving part has a seventh working condition for moving the suction cup to the outside of the vehicle and a The suction cup moves to the eighth working condition inside the vehicle.
  • the suction cup has a plurality of suction holes therein, the air inlets of the plurality of suction holes are arranged at intervals on the lower surface of the suction cup, and the plurality of suction holes are used to form a negative pressure to adsorb the product.
  • the carrier includes: a bottom plate; a side plate, the side plate surrounds the periphery of the bottom plate to form a receiving cavity for placing products, and the upper portion of the receiving cavity has a feeding port.
  • first moving mechanism there are multiple second moving mechanisms, one first moving mechanism, and multiple second moving mechanisms are arranged side by side on the first moving mechanism; or, there are multiple second moving mechanisms and multiple first moving mechanisms A plurality of second moving mechanisms are provided in a one-to-one correspondence with a plurality of first moving mechanisms.
  • the first moving mechanism includes a bracket movably disposed, the second moving mechanism is disposed on the bracket, and the first bracket is disposed on the bracket, and the second moving mechanism is located at least partially above the first bracket, The first bracket is used to carry a carrier.
  • the first moving mechanism is located at least partially above the immersion mechanism.
  • the first moving mechanism further includes a fourth driving portion, and the bracket is disposed on the fourth driving portion.
  • the fourth driving portion is used for driving the bracket to move vertically.
  • first bracket includes two bracket arms arranged at intervals, and the two bracket arms are used to carry the carrier together, and the second moving mechanism can put the product into the carrier on the first bracket.
  • the carrier includes: a bottom plate; a side plate, which surrounds an edge of the bottom plate to form a receiving cavity for placing a product; a support plate, which is disposed on the side plate, and the support plate at least partially protrudes from the side plate
  • a bottom plate which surrounds an edge of the bottom plate to form a receiving cavity for placing a product
  • a support plate which is disposed on the side plate, and the support plate at least partially protrudes from the side plate
  • the bottom plate and / or the side plate has a liquid inlet hole communicating with the receiving cavity, one of the bracket arm and the bracket plate has a first positioning hole, and the other of the bracket arm and the bracket plate has a first positioning pin.
  • a positioning pin can be inserted into the first positioning hole to position the carrier.
  • the soaking mechanism includes: a box body, the cavity of the box body is used for storing liquid; a partition plate, which partitions the cavity of the box body into a first tank body and a second tank body, and the liquid in the first tank body It can overflow from the upper edge of the partition into the second tank.
  • the first tank is used to soak the product in the carrier.
  • the soaking mechanism further includes: a liquid inlet pipe, which can communicate with the first tank on and off;
  • the liquid pipe and the liquid outlet pipe can communicate with the second tank body on and off.
  • the immersion mechanism further includes a pump body.
  • the bottom of the first tank body communicates with the pump body through a pipeline, and the second tank body communicates with the pump body through a pipeline.
  • the third moving mechanism includes: a second bracket movably disposed, the second bracket is used to carry the carrier; and a fifth driving portion is used to drive the second bracket toward or away from the first moving mechanism. Move in the direction.
  • the third moving mechanism further includes a guiding mechanism, and the guiding mechanism is used for guiding the second bracket.
  • the fifth driving portion and the guide mechanism are both located below the second bracket.
  • the fifth driving portion is a rodless cylinder.
  • the guiding mechanism includes a guide rail, and the guide rail is disposed in parallel with the rodless cylinder.
  • the second bracket has a first limiter
  • the fifth driving portion has a second limiter.
  • the first limiter cooperates with the second limiter stop to limit the moving distance of the second bracket. .
  • one of the carrier and the second bracket has a second positioning hole
  • the other of the carrier and the second bracket has a second positioning pin
  • the second positioning pin can pass through the second positioning hole to Position the vehicle.
  • the processing device further includes: a rack, the rack having a bearing platform, the bearing platform having a second avoidance opening, a third moving mechanism is disposed on the upper surface of the bearing platform, the soaking mechanism is located below the second avoidance opening, and the first movement
  • the mechanism is located at least partially above the second avoidance port;
  • the protective cover is provided on the frame, and the first moving mechanism and the third moving mechanism are both located in the protective cover.
  • the protective cover has a feeding opening, the feeding opening and the third Corresponding setting of moving mechanism.
  • the present invention also provides another processing device, including: a carrier for placing a product; an immersion mechanism, the immersion mechanism can store liquid, and the immersion mechanism is used for immersing the product; a first moving mechanism, movably disposed, and a first movement
  • the mechanism has a first working condition in which the carrier is at least partially placed in the immersion mechanism and a second working condition in which the carrier is taken out from the immersion mechanism; a second moving mechanism is movably disposed, and the second moving mechanism is used for placing the product Into the carrier; a third moving mechanism is movably provided, and the third moving mechanism has a third operating condition for receiving the carrier on the first moving mechanism and a fourth operating condition for transporting the carrier to the outside.
  • a carrier, an immersion mechanism, a first moving mechanism, and a second moving mechanism are provided in the processing device.
  • the processing device can be used to process films and wafers that are not completely separated after etching, so that the The completely separated film and wafer are collectively received and processed, which can replace the existing manual processing method, improve processing efficiency, and avoid damaging the film.
  • the carrier can be immersed in the liquid of the immersion mechanism through the first moving mechanism, and the incompletely separated films and wafers can be collectively placed in the carrier through the supporting mechanism or the adsorption mechanism in the second moving mechanism. While receiving, the performance of the film and wafer is guaranteed to avoid damage to the film and wafer.
  • FIG. 1 is a schematic structural diagram of a processing apparatus according to a first embodiment of the present invention
  • Figure 2 shows a view of the processing device of Figure 1 without a protective cover
  • FIG. 3 shows a partially enlarged view of the processing device in FIG. 2;
  • FIG. 4 is a schematic structural diagram of a first moving mechanism and a supporting mechanism in FIG. 3;
  • FIG. 5 shows a schematic diagram of cooperation between the first moving mechanism and the carrier in FIG. 3;
  • FIG. 6 is a schematic structural diagram of the carrier in FIG. 3; FIG.
  • FIG. 7 is a schematic structural diagram of a processing apparatus according to a second embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a first moving mechanism and an adsorption mechanism in FIG. 7;
  • FIG. 9 is a schematic structural diagram of the adsorption mechanism in FIG. 7 when adsorbing a product
  • FIG. 10 is a schematic structural diagram of the vehicle in FIG. 7; FIG.
  • FIG. 11 is a schematic structural diagram of an immersion mechanism in FIG. 2; FIG.
  • FIG. 12 is a schematic structural diagram of a third moving mechanism in FIG. 2.
  • a first embodiment of the present invention provides a processing device, including: a carrier 10 for placing a product; an immersion mechanism 20, the immersion mechanism 20 can store liquid, and the immersion mechanism 20 is used for immersion Product; a first moving mechanism 30 that is movably disposed, the first moving mechanism 30 has a first working condition for at least partially placing the carrier 10 into the immersion mechanism 20 and a second operation for removing the carrier 10 from the immersion mechanism 20
  • the second moving mechanism is movably disposed on the first moving mechanism 30.
  • the second moving mechanism includes a supporting mechanism 40 for supporting and moving the product to place the product in the carrier 10.
  • the carrier 10, the immersion mechanism 20, the first moving mechanism 30, and the second moving mechanism are provided in the processing device.
  • the processing device can be used to process the films and wafers that are not completely separated after the etching. Incompletely separated films and wafers can be automatically received and processed centrally, which can replace the existing manual processing methods, improve processing efficiency, and avoid damaging the films.
  • the carrier 10 can be immersed in the liquid of the immersion mechanism 20 through the first moving mechanism 30, and the incompletely separated films and wafers can be collectively placed in the carrier 10 through the supporting mechanism 40 in the second moving mechanism. In this way, the performance of the film and the wafer can be guaranteed while receiving, and damage to the film and the wafer can be avoided.
  • the supporting mechanism 40 includes: a supporting fork 41 for receiving and carrying a product; a first driving part 42; the supporting fork 41 is disposed on the first driving part 42,
  • the first driving portion 42 has a fifth working condition in which the supporting fork 41 is moved to the outside of the vehicle 10 and a sixth working condition in which the supporting fork 41 is moved to the inside of the vehicle 10.
  • the fork 41 can be moved to the outside of the carrier 10 by the first driving portion 42 to receive the product
  • the fork 41 can be moved to the inside of the carrier 10 by the first driving portion 42 to put the product into the carrier 10.
  • the supporting mechanism 40 further includes a second driving portion 43.
  • the first driving portion 42 is disposed on the second driving portion 43.
  • the second driving portion 43 is used to drive the supporting fork 41 to move the supporting fork 41.
  • the upper product is separated from the fork 41. In this way, the product carried on the supporting fork 41 can be separated from the supporting fork 41 to put the product into the carrier 10.
  • the first driving portion 42 is used to drive the supporting fork 41 to move vertically
  • the second driving portion 43 is used to drive the supporting fork 41 to move horizontally.
  • the carrier 10 includes an upper inlet and a first avoidance opening on the side.
  • a stopper 11, which is located at the first avoidance port, the stopper 11 is used to stop the product to separate the product from the fork 41;
  • the first moving mechanism 30 is in a first working condition, and the first driving portion
  • the second driving portion 43 can drive the supporting fork 41 to move outside of the carrier 10 through the first avoidance port, so as to leave the product inside the carrier 10 through the stopper 11.
  • the product is put into the carrier 10 through the cooperation of the second driving portion 43, the first driving portion 42, and the stopper 11. Since the carrier 10 can be immersed in the immersion mechanism 20, after the product is placed in the carrier 10, it will be immersed in the liquid of the immersion mechanism 20 to maintain the performance of the product.
  • the carrier 10 further includes a bottom plate 12 and a side plate 13 surrounding the edge of the bottom plate 12.
  • the stopper 11 is connected to the top surface of the bottom plate 12.
  • the interval between the two supporting forks 41 is larger than the width of the stopper 11. In this way, the stability of the product can be improved by the two supporting forks 41, and the stopper 11 can extend between the two supporting forks 41 to stop the product, so that the product can be separated from the two supporting forks 41.
  • the second moving mechanism may be provided in a plurality, and the first moving mechanism 30 may be provided in one, and the plurality of second moving mechanisms are arranged side by side on the first moving mechanism 30.
  • a plurality of carriers 10 can be transported synchronously by using a first moving mechanism 30, and a plurality of second moving mechanisms can simultaneously load products on the plurality of carriers 10.
  • a plurality of second moving mechanisms may be provided, and a plurality of first moving mechanisms 30 may be provided.
  • the plurality of second moving mechanisms and the plurality of first moving mechanisms 30 may be provided in a one-to-one correspondence. In this way, the plurality of first moving mechanisms 30 can operate separately. For example, one first moving mechanism 30 immerses one carrier 10 in the soaking mechanism 20 to receive the product, and the other first moving mechanism 30 loads the carrier 10 filled with the product from Take out from the soaking mechanism 20 to output the product.
  • the first moving mechanism 30 includes: a bracket 31 that is movably disposed, and the second moving mechanism is provided on the bracket 31; the first bracket 32 is provided on the bracket 31 and the second moving mechanism Located at least partially above the first bracket 32, the first bracket 32 is used to carry the carrier 10. In this way, the entire movement of the second moving mechanism can be driven by the bracket 31, and the carrier 10 can be carried by the first bracket 32.
  • the first moving mechanism 30 is located at least partially above the immersion mechanism 20, and the first moving mechanism 30 further includes a fourth driving portion 33, and the bracket 31 is disposed on the fourth driving portion 33.
  • the fourth driving portion 33 is used for driving the bracket 31 to move vertically.
  • the second driving mechanism 33 can be used to move the second moving mechanism in the vertical direction through the fourth driving part 33 to place the carrier 10 on the second moving mechanism into the immersion mechanism 20 or take it out of the immersion mechanism 20.
  • the first bracket 32 includes two bracket arms 321 spaced apart.
  • the two bracket arms 321 are used to carry the carrier 10 together, and the second moving mechanism can put the product into the carrier 10 on the first bracket 32. in. In this way, a part of the carrier 10 can be supported by the two supporting arms 321, and the gap between the two supporting arms 321 can avoid other parts of the carrier 10.
  • the carrier 10 includes: a bottom plate 12; a side plate 13, which surrounds an edge of the bottom plate 12 to form a receiving cavity for placing a product; a supporting plate 14, which is disposed on the side plate 13, and a supporting plate 14 at least partially protrudes from the outer surface of the side plate 13, two supporting plates 14, two supporting plates 14 are respectively located on both sides of the receiving cavity, and two supporting arms 321 are used to carry the two supporting plates 14 one by one. Lower surface. In this way, the carrier 10 can be supported and moved by the cooperation of the two supporting arms 321 and the two supporting plates 14.
  • the bottom plate 12 and / or the side plate 13 are provided with a liquid inlet hole communicated with the receiving cavity, so that the liquid in the soaking mechanism 20 flows into the receiving cavity of the carrier 10.
  • One of the supporting arm 321 and the supporting plate 14 has a first positioning hole 141, and the other of the supporting arm 321 and the supporting plate 14 has a first positioning pin 322.
  • the first positioning pin 322 can pass through the first positioning hole 141.
  • the carrier 10 further includes a handle 15, and the handle 15 is disposed on the supporting plate 14, so that a person can grasp the carrier 10 or use other equipment to transport the carrier 10.
  • the immersion mechanism 20 includes: a box body 21 whose cavity is used for storing liquid; a partition plate 22 which partitions the cavity of the box body 21 into a first tank body 23 and a second tank body; The liquid in the tank 24 and the first tank 23 can overflow from the upper edge of the partition plate 22 into the second tank 24.
  • the first tank 23 is used to soak the product in the carrier 10. In this way, the carrier 10 can be dipped into the first tank 23 to soak the product with the liquid in the first tank 23, and when the liquid in the first tank 23 is too much, it can overflow into the second tank 24 and be collected.
  • the height of the lowest point of the upper edge of the partition 22 is lower than the height of the lowest point of the upper edge of the box 21 so that excessive liquid overflows from the upper edge of the partition 22 to the second tank. twenty four.
  • the upper edge of the partition plate 22 may be set in a zigzag shape.
  • the immersion mechanism 20 further includes: a liquid inlet pipe 25, which can communicate with the first tank body 23 on and off; and a liquid outlet pipe 26, which can communicate with the second tank body 24 on and off.
  • the liquid inlet pipe 25 is used to convey liquid to the first tank body 23, and the liquid outlet pipe 26 is used to discharge excessive liquid in the second tank body 24.
  • the immersion mechanism 20 further includes a pump body 27.
  • the bottom of the first tank body 23 communicates with the pump body 27 through a pipeline, and the second tank body 24 communicates with the pump body 27 through a pipeline.
  • the liquid in the first tank body 23 can be transferred to the second tank body 24 through the pump body 27, and then discharged to the outside through the liquid outlet pipe 26 communicating with the second tank body 24.
  • a pipeline can also be provided to directly communicate the first tank 23 with the outside, and directly discharge the liquid when drainage is needed.
  • the processing device further includes a third moving mechanism 60 that is movably disposed.
  • the third moving mechanism 60 has a third working condition for receiving the carrier 10 on the first moving mechanism 30 and transporting the carrier 10. To the fourth working condition outside. In this way, after receiving a certain amount of films and wafers in the carrier 10, the carrier 10 can be transported to the outside through the third moving mechanism 60 to separate the films and wafers.
  • the third moving mechanism 60 includes a second bracket 61 movably provided, the second bracket 61 is used to carry the carrier 10, and the fifth driving portion 62 is used to drive the second bracket 61.
  • the second bracket 61 can be approached to the first moving mechanism 30 to transfer the carrier 10 to the first moving mechanism 30 or to transfer the carrier 10 from the first moving mechanism 30 to the second bracket 61.
  • the carrier 10 can be output or the first moving mechanism 30 can be avoided.
  • the second bracket 61 is located below the carrier 10 on the first moving mechanism 30 to receive Vehicle 10.
  • the third moving mechanism 60 further includes a guide mechanism 63, and the guide mechanism 63 is configured to guide the second bracket 61.
  • the guiding effect of the guiding mechanism 63 can ensure the stability of the operation of the second bracket 61.
  • the fifth driving portion 62 and the guide mechanism 63 are both located below the second bracket 61.
  • the fifth driving portion 62 is a rodless cylinder.
  • the guide mechanism 63 includes a guide rail, and the guide rail is disposed in parallel with the rodless cylinder. Setting the fifth driving part 62 as a rodless cylinder and providing a guide rail can make the operation of the second bracket 61 stable and reliable.
  • the fifth driving portion 62 may also be provided as a lead screw or other mechanism capable of achieving linear motion.
  • the third moving mechanism 60 further includes a connection plate 66 for connecting the second bracket 61 to the rodless cylinder and the guide rail.
  • the second bracket 61 has a first limiter 64
  • the fifth driving portion 62 has a second limiter 65
  • the first limiter 64 and the second limiter 65 stop and cooperate with each other. In order to limit the moving distance of the second bracket 61. In this way, the second bracket 61 can be prevented from interfering with other components, and the carrier 10 can be accurately transferred to a required position.
  • one of the carrier 10 and the second bracket 61 has a second positioning hole 121
  • the other of the carrier 10 and the second bracket 61 has a second positioning pin 611
  • the second positioning pin 611 can pass through Into the second positioning hole 121 to position the carrier 10. In this way, the carrier 10 and the second bracket 61 can be reliably connected through the cooperation of the second positioning hole 121 and the second positioning pin 611.
  • the processing device further includes: a rack 70 having a supporting platform 71, the supporting platform 71 having a second escape opening, and a third moving mechanism 60 provided on the upper surface of the supporting platform 71 for immersion
  • the mechanism 20 is located below the second avoidance opening, and the first moving mechanism 30 is at least partially above the second escape opening;
  • the protective cover 80 is provided on the frame 70, and the first moving mechanism 30 and the third moving mechanism 60 are both
  • the protective cover 80 is located inside the protective cover 80, and the protective cover 80 has a feeding opening, and the feeding opening is disposed corresponding to the third moving mechanism 60.
  • the frame 70 can support other components, and the supporting platform 71 can set and support the third moving mechanism 60.
  • the protective cover 80 can protect the components such as the first moving mechanism 30 and the second moving mechanism, thereby ensuring safe operation.
  • the second bracket 61 of the third moving mechanism 60 has two stations. One is a manual carrier station near the material receiving port, and the other is a carrier station for the first bracket 32. Initial state: the second bracket 61 of the third moving mechanism 60 is located at the manual carrier position, and the bracket 31 is located at the lowest position.
  • Step 1 The carrier 10 is manually placed on the second bracket 61 of the third moving mechanism 60;
  • Step 2 The rodless cylinder (fifth driving part 62) of the third moving mechanism 60 moves to transport the carrier 10 from the manual carrier placement station to the first bracket 32 to take the carrier station;
  • Step 3 The bracket 31 rises, so that the first bracket 32 supports the supporting plate 14 of the carrier 10, and then continues to rise to a certain height so that the bottom plate 12 of the carrier 10 and the second positioning pin 611 on the second bracket 61 Break away
  • Step 4 The rodless cylinder of the third moving mechanism 60 moves to return the second bracket 61 to the initial position;
  • Step 5 The bracket 31 is lowered to the lowest position, and the carrier 10 is immersed in the water of the immersion mechanism 20.
  • the loading of the carrier 10 is completed, and the loading of the NG wafer can be performed.
  • Step 1 The bracket 31 rises so that the bottom plate 12 of the carrier 10 is higher than the second bracket 61 of the third moving mechanism 60;
  • Step 2 The rodless cylinder of the third moving mechanism 60 moves to move the second bracket 61 from the manual loading station to the loading station;
  • Step 3 The bracket 31 descends so that the bottom plate 12 of the carrier 10 falls on the second bracket 61;
  • Step 4 The bracket 31 continues to descend, so that the first bracket 32 is separated from the pallet 14 of the carrier 10;
  • Step 5 The rodless cylinder of the third moving mechanism 60 moves to move the carrier 10 to the manual loader station;
  • Step 6 A person manually removes the carrier 10 from the second bracket 61.
  • the unloading of the carrier 10 filled with NG wafer is completed, and the empty carrier 10 can be put in and the empty carrier 10 can be loaded.
  • the bracket 31 is at the lowest position; the first bracket 32 has supported the carrier 10; the guide rod of the horizontal cylinder with a guide rod (the second driving part 43) is in an extended state; the vertical cylinder with the guide rod (the first The guide rod of the driving portion 42) is not extended; the first groove body 23 is filled with water, the water surface is lower than the supporting fork 41, and the part of the carrier 10 located under the supporting fork 41 is immersed in water.
  • Step 1 The manipulator sends the NG wafer to the supporting fork 41 of the supporting mechanism 40;
  • Step 2 The bracket 31 rises, and after the fork 41 contacts the bottom of the wafer of the NG wafer, it continues to rise to release the NG wafer from the manipulator;
  • Step 3 The robot leaves the fork 41;
  • Step 4 The bracket 31 is lowered to the lowest position
  • Step 5 The guide rod of the cylinder with the guide rod extends vertically, and the supporting fork 41 moves downward. At this time, the NG wafer is in the carrier 10 and immersed in water;
  • Step 6 The guide rod of the horizontal cylinder with guide rod is retracted, which drives the fork 41 to move toward the stopper 11 of the carrier 10. During the movement, the NG wafer is blocked by the stopper 11 on one side, so it leaves the fork 41. Due to the resistance of gravity and water, the NG wafer will slowly move downward and fall on the bottom plate 12 of the carrier 10;
  • Step 7 The guide rod of the horizontal cylinder with guide rod is extended, and the guide rod of the vertical cylinder with guide rod is retracted and returned to the initial state.
  • the NG wafer will be stacked with the previous NG wafer.
  • the carrier 10 filled with NG wafers can be unloaded. This quantity can be set according to the actual needs of the equipment.
  • the second embodiment of the present invention provides another processing device.
  • the difference from the above-mentioned processing device is the setting manner of the second moving mechanism, and only the differences between the second embodiment and the first embodiment will be described below.
  • the second moving mechanism includes a suction mechanism 50.
  • the suction mechanism 50 is movably disposed on the first moving mechanism 30.
  • the suction mechanism 50 is used to suck and move a product to place the product in the carrier 10. This allows the product to be adsorbed and moved by adsorption.
  • the suction mechanism 50 includes: a suction cup 51, which is used to suck and release products; a third driving portion 52, which is disposed on the third driving portion 52, and the third driving portion 52 has a function of moving the suction cup 51 to a carrier The seventh working condition outside 10 and the eighth working condition moving the suction cup 51 to the inside of the vehicle 10. In this way, the product can be adsorbed by the suction cup 51 first, and then the product can be moved into the carrier 10 from the outside by the movement of the third driving portion 52.
  • the wafer 91 with the film 92 can be conveyed below the chuck 51 by the robot arm 93, and then the wafer 91 with the film 92 can be sucked by the chuck 51 and passed through the third driving portion 52.
  • the film 92 and the wafer 91 are put into the carrier 10 by the movement of the wafer. Due to the effect of gravity, the film and the wafer may be separated when the chuck 51 is adsorbed. Therefore, a weight sensor may be provided in the suction cup 51 to determine whether a thin film or a wafer with a thin film is adsorbed for easy operation and control.
  • the suction cup 51 has a plurality of suction holes therein.
  • the air inlets of the plurality of suction holes are arranged on the lower surface of the suction cup 51 at intervals.
  • the plurality of suction holes is used to form a negative pressure to adsorb products. Through the combined action of multiple suction holes, products can be reliably adsorbed.
  • the third driving portion 52 is used to drive the suction cup 51 to move vertically.
  • the carrier 10 includes: a bottom plate 12; a side plate 13, and the side plate 13 surrounds the periphery of the bottom plate 12 to form a receiving cavity for placing products.
  • the upper part of the accommodating cavity has a feeding port.
  • the third driving part 52 can drive the suction pad 51 with the product sucked down into the carrier 10, and then the sucker 51 releases the product, so that the product can be put into the carrier 10.
  • the operation process of the processing device is described below.
  • the order of steps in the operation process is not limited, and can be adjusted as needed in actual use. Due to the difference in structure, the process of loading NG wafer into the carrier 10 in this embodiment is different from the above embodiment. Only the process of loading NG wafer into the carrier 10 will be described below.
  • Step 1 The bracket 31 rises to the highest position
  • Step 2 The robot sends the NG wafer to the bottom of the suction cup 51 and the top of the carrier 10;
  • Step 3 The bracket 31 or the third driving part 52 is lowered, so that the suction cup 51 contacts and vacuum-adsorbs the film (the weight sensor in the suction cup 51 determines whether the film is a film or a wafer with a film. If the film is only a film, steps 4-15 are required; If it is a thin film plus a wafer, only steps 4-8 need to be performed, and the thin film in step 4-8 is replaced with a wafer with a thin film);
  • Step 4 The bracket 31 or the third driving portion 52 is raised, so that the film leaves the end of the manipulator;
  • Step 5 The manipulator moves backwards and leaves below the suction cup 51;
  • Step 6 The bracket 31 is lowered to the lowest position
  • Step 7 The guide rod of the vertical cylinder with guide rod is extended, and the film is immersed in water;
  • Step 8 The suction cup 51 releases the vacuum, and the film falls on the bottom plate 12 of the carrier 10;
  • Step 9 The robot sends the wafer below the suction cup 51 and above the carrier 10;
  • Step 10 The holder 31 is lowered, so that the sucker 51 contacts and vacuum-holds the wafer;
  • Step 11 the support 31 rises, so that the wafer leaves the end of the robot
  • Step 12 The manipulator moves backward and leaves below the suction cup 51;
  • Step 13 The bracket 31 is lowered to the lowest position
  • Step 14 The guide rod of the vertical cylinder with the guide rod is extended, and the wafer is immersed in water;
  • Step 15 The suction cup 51 releases the vacuum, and the wafer is dropped on the bottom plate of the carrier 10.
  • the NG wafer will be stacked with the previous NG wafer.
  • the carrier 10 filled with NG wafers can be unloaded. This quantity can be set according to the actual needs of the equipment.
  • the carrier 10, the immersion mechanism 20, the first moving mechanism 30, the second moving mechanism, and the third moving mechanism 60 are provided in the processing device, and the processing device can be used for processing incompletely separated after etching.
  • the film and the wafer can automatically receive and process the incompletely separated film and wafer in a centralized manner, thereby replacing the existing manual processing method, improving the processing efficiency, and avoiding damage to the film.
  • the third embodiment of the present invention also provides another processing device (not shown in the figure), including: a carrier for placing the product; a soaking mechanism, the soaking mechanism can store liquid, and the soaking mechanism is used for soaking the product; the first A moving mechanism is movably provided.
  • the first moving mechanism has a first working condition in which the carrier is at least partially placed in the immersion mechanism and a second working condition in which the carrier is taken out from the immersion mechanism; the second moving mechanism is movably Set, the second moving mechanism is used to put the product into the carrier; the third moving mechanism is movably arranged, and the third moving mechanism has a third working condition for receiving the carrier on the first moving mechanism and conveying the carrier To the fourth working condition outside.
  • a carrier, an immersion mechanism, a first moving mechanism, a second moving mechanism, and a third moving mechanism are provided in a processing device.
  • the processing device can be used to process films and wafers that are not completely separated after etching.
  • the incompletely separated films and wafers can be automatically received and processed centrally, which can replace the existing manual processing methods, improve processing efficiency, and avoid damaging the films.
  • the carrier can be immersed in the liquid of the immersion mechanism by the first moving mechanism, and the incompletely separated films and wafers can be collectively placed in the carrier by the second moving mechanism, so that the films and wafers can be guaranteed while receiving Performance to avoid damage to the film and wafer.
  • the carrier After receiving a certain amount of film and wafer in the carrier, the carrier can be transported to the outside by a third moving mechanism to separate the film and wafer.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif de traitement, comprenant : un support, conçu pour placer un produit ; un mécanisme de trempage, le mécanisme de trempage étant apte à stocker un liquide et étant conçu pour tremper le produit ; un premier mécanisme de déplacement, disposé de façon mobile et ayant une première condition de fonctionnement plaçant au moins partiellement le support dans le mécanisme de trempage et une seconde condition de fonctionnement retirant le support du mécanisme de trempage ; et un second mécanisme de déplacement, disposé de façon mobile sur le premier mécanisme de déplacement et comprenant un mécanisme de support ou un mécanisme d'adsorption, le mécanisme de support étant conçu pour transporter et déplacer le produit pour placer le produit dans le support, et le mécanisme d'adsorption étant conçu pour adsorber et déplacer le produit pour placer le produit dans le support. Au moyen de la solution technique décrite dans la présente invention, un film mince et une tranche qui ne sont pas complètement séparés peuvent être reçus et traités automatiquement de manière centralisée, ce qui permet de remplacer le mode de traitement manuel existant, d'améliorer l'efficacité de traitement et d'éviter un endommagement du film.
PCT/CN2018/117212 2018-08-29 2018-11-23 Dispositif de traitement WO2020042395A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201810996915.0A CN110875210B (zh) 2018-08-29 2018-08-29 处理装置
CN201810997869.6A CN110875211B (zh) 2018-08-29 2018-08-29 处理装置
CN201810996915.0 2018-08-29
CN201810996908.0 2018-08-29
CN201810997869.6 2018-08-29
CN201810996908.0A CN110875209B (zh) 2018-08-29 2018-08-29 处理装置

Publications (1)

Publication Number Publication Date
WO2020042395A1 true WO2020042395A1 (fr) 2020-03-05

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ID=69644883

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/117212 WO2020042395A1 (fr) 2018-08-29 2018-11-23 Dispositif de traitement

Country Status (1)

Country Link
WO (1) WO2020042395A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1947220A (zh) * 2004-03-12 2007-04-11 塞米图尔公司 单工件加工腔
CN107258011A (zh) * 2014-10-31 2017-10-17 维克精密表面处理有限责任公司 执行湿蚀刻工艺的系统和方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1947220A (zh) * 2004-03-12 2007-04-11 塞米图尔公司 单工件加工腔
CN107258011A (zh) * 2014-10-31 2017-10-17 维克精密表面处理有限责任公司 执行湿蚀刻工艺的系统和方法

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