WO2020040559A1 - 분산판 및 이를 포함하는 코팅 장치 - Google Patents

분산판 및 이를 포함하는 코팅 장치 Download PDF

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Publication number
WO2020040559A1
WO2020040559A1 PCT/KR2019/010676 KR2019010676W WO2020040559A1 WO 2020040559 A1 WO2020040559 A1 WO 2020040559A1 KR 2019010676 W KR2019010676 W KR 2019010676W WO 2020040559 A1 WO2020040559 A1 WO 2020040559A1
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WO
WIPO (PCT)
Prior art keywords
region
dispersion plate
spout
opening ratio
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/010676
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English (en)
French (fr)
Korean (ko)
Inventor
신현진
장정기
임예훈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
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LG Chem Ltd
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Filing date
Publication date
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Priority to CN201980007640.6A priority Critical patent/CN111565856B/zh
Priority to JP2020537194A priority patent/JP7117384B2/ja
Priority to EP19851149.5A priority patent/EP3730218B1/en
Priority to US16/963,654 priority patent/US12042776B2/en
Publication of WO2020040559A1 publication Critical patent/WO2020040559A1/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/0053—Details of the reactor
    • B01J19/006—Baffles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/006—Coating of the granules without description of the process or the device by which the granules are obtained
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/16—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic by suspending the powder material in a gas, e.g. in fluidised beds or as a falling curtain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J8/00—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes
    • B01J8/18—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with fluidised particles
    • B01J8/24—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with fluidised particles according to "fluidised-bed" technique
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J8/00—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes
    • B01J8/18—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with fluidised particles
    • B01J8/24—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with fluidised particles according to "fluidised-bed" technique
    • B01J8/44—Fluidisation grids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00761—Details of the reactor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00761—Details of the reactor
    • B01J2219/00763—Baffles

Definitions

  • the present invention relates to a dispersion plate and a coating apparatus including the same, and more particularly, to a dispersion plate used in a fluidized bed coating apparatus and a fluidized bed coating apparatus including the same.
  • the fluidized bed coating device is a device that sprays gas from a dispersion plate to coat a fluidized particle with a polymer solution or the like to dry.
  • the dispersion plate is perforated with gas injection holes to prevent particle retention, and is composed of spout nozzles in which relatively large holes are clustered at certain portions.
  • the gas injection of the spout nozzle forms a spout area with a low particle proportion in the bed (meaning a particle layer), and the coating of the particles is performed by a polymer droplet injection nozzle located therein.
  • the coated particles are ejected to the top of the bed and then dried while descending.
  • the particle flow in the spout region should be smooth and there should be no interparticle coating interference.
  • An object of the present invention is to provide a dispersion plate and a coating apparatus including the same, which can ensure smooth particle coating performance even in a scale-up apparatus through an optimal arrangement of spout nozzles.
  • the present invention includes a plurality of gas injection holes, including a plurality of spout nozzles in which the gas injection holes are concentrated to form a cluster, wherein one spout nozzle is disposed at the center of the distribution plate.
  • a plurality of spout nozzles arranged along a plurality of virtual concentric circles from the center of the distribution plate to the edge of the distribution plate, with respect to two adjacent virtual concentric circles, along the outer concentric circles relative to the center of the distribution plate.
  • the number of spout nozzles is twice the number of spout nozzles arranged along the inner concentric circles, and the spacing of spout nozzles arranged along the outer concentric circles is equal to half the spacing of spout nozzles arranged along the inner concentric circles. to provide.
  • the spacing between each concentric circle may be the same, and the spacing between each spout nozzle disposed in the same concentric circle may be the same.
  • each spout nozzle may be 2 to 20% of the diameter of the dispersion plate
  • the spacing between each concentric circle may be 5 to 40% of the diameter of the dispersion plate and 50 to 400% of the diameter of the spout nozzle.
  • the opening ratio of the gas injection hole may be different for each region between the concentric circles except for the spout nozzle.
  • the opening ratio of the first region corresponding to the outer side of the outermost concentric circle may be smaller than the opening ratio of the second region adjacent to the first region, and the opening ratio of the first region may be the inside of the innermost concentric circle.
  • the opening ratio of the third region may be smaller than that of the third region, and the opening ratio of the second region may be larger than or equal to the opening ratio of the third region.
  • the opening ratio of the second region may be 2 to 5 times the opening ratio of the first region
  • the opening ratio of the third region may be 1.5 to 4 times the opening ratio of the first region
  • the opening of the second region The ratio may be 0.5 to 2 times the opening ratio of the third region.
  • the flow rate of the spout nozzle may be different for each concentric circle.
  • the present invention is a chamber; And it provides a coating apparatus comprising the above-described dispersion plate installed in the chamber.
  • the coating apparatus according to the invention may further comprise a structure arranged in the wind box formed at the bottom of the dispersion plate to guide the gas flow.
  • the structure is formed throughout the radial direction of the chamber having a hole in the center to direct the gas flow toward the center of the chamber; And a second structure disposed concentrically with the first structure on the first structure and partially formed except the chamber wall side with respect to the chamber radial direction to guide the gas flow toward the chamber wall.
  • the first structure may be disposed in a tapered region in which the diameter of the chamber decreases downwardly, and the diameter of the second structure may be 20 to 50% of the chamber diameter and 50 to 150% of the hole diameter of the first structure.
  • the distance between the first structure and the second structure may be 20 to 150% of the diameter of the second structure.
  • FIG. 1 is a block diagram of a coating apparatus according to the present invention.
  • FIG. 2 is a block diagram of a dispersion plate according to the present invention.
  • Figure 4 compares the effect of particle distribution according to the change in the opening ratio for each dispersion plate region.
  • Figure 5 compares the influence of the flow rate deviation according to the installation of the wind box structure.
  • the coating apparatus according to the present invention may be a fluidized bed coating apparatus for drying by coating the coating liquid on the fluidized particles by spraying gas from the dispersion plate.
  • the kind of particles is not particularly limited and may be, for example, fertilizer particles.
  • the particle size, the charged amount and the like are not particularly limited and can be appropriately set.
  • the type of coating liquid is not particularly limited and may be, for example, a polymer solution.
  • the spraying speed and coating amount of the coating liquid are not particularly limited and can be appropriately set.
  • the kind of gas is not specifically limited, For example, air, hot air air, etc. can be used.
  • the flow velocity of the gas is not particularly limited and can be appropriately set.
  • the dispersion plate according to the present invention is applicable to other fluidized bed reactors in addition to the coating apparatus.
  • the coating apparatus may be composed of a chamber 100, a dispersion plate 200, a spout nozzle 210, a wind box structure (300, 310) and the like.
  • the chamber 100 is a coating apparatus body, which may be configured in a cylindrical shape or the like, and may include a taper region having a diameter thereof downwardly.
  • the chamber 100 may include a particle inlet through which particles to be coated are introduced, a particle outlet through which coated particles are discharged, a gas inlet through which gas is introduced, and a gas outlet through which gas is discharged.
  • the size, material, etc. of the chamber 100 are not specifically limited, It can set suitably.
  • the dispersion plate 200 may be installed throughout the cross section of the chamber 100 in the horizontal direction, for example.
  • the dispersion plate 200 may be composed of a disc.
  • the diameter of the dispersion plate 200 may be the same as the inner diameter of the chamber 100.
  • the position and the number of the dispersion plate 200 in the chamber are not particularly limited, and for example, one or two or more may be disposed in the lower or middle region of the chamber 100.
  • the diameter, thickness, material, etc. of the dispersion plate 200 are not particularly limited and can be appropriately set.
  • the dispersion plate 200 may be mounted or fixed to the chamber 100 by a supporting member, screwing, welding, or the like.
  • the dispersion plate 200 may include a plurality of gas injection holes over the entire area of the dispersion plate 200, and may include a plurality of spout nozzles 210 in which the gas injection holes are densely clustered. Since the gas injection holes are very fine in size and are very large in number, they are not separately shown or indicated in the drawings.
  • the gas injection hole is also formed in the inner region of the spout nozzle 210 (distribution plate region in which the spout nozzle is formed, the spout nozzle region), and also in the outer region of the spout nozzle 210 (other regions of the dispersion plate except the spout nozzle).
  • the gas injection holes formed in the inner region of the spout nozzle 210 are concentrated at a more dense interval than the gas injection holes formed in the outer region of the spout nozzle 210. That is, the spout nozzle 210 may refer to an area of the dispersion plate 200 that can be visually distinguished from other areas of the dispersion plate 200 except for the spout nozzle 210 due to the difference in the density of the gas injection holes. Specifically, the spout nozzle 210 may refer to an area of the dispersion plate 200 in which the density of gas injection holes is higher than other areas of the dispersion plate 200 except for the spout nozzle 210. The difference in density between two regions (inner region and outer region of spout nozzle) is not particularly limited and can be appropriately set.
  • the gas injection holes are formed through the dispersion plate 200 in the thickness direction of the dispersion plate 200, and the gas flows in from the bottom of the dispersion plate 200 and then passes through the plurality of gas injection holes, and the upper portion of the dispersion plate 200. It can be injected into.
  • the diameter, number, and spacing of the gas injection holes are not particularly limited and may be appropriately set. However, the diameter of the gas injection holes should be smaller than the particle diameter.
  • the diameter of the gas injection hole formed in the inner region of the spout nozzle 210 is preferably larger than the diameter of the gas injection hole formed in the outer region of the spout nozzle 210, but may be the same or smaller.
  • Figure 2 is a block diagram of the dispersion plate according to the present invention, illustrating the optimum arrangement of the spout nozzle.
  • the gas injection holes were increased in number by the size of the diffuser plate while maintaining its original size, in order to suppress the occurrence of flow dead zones.
  • the optimum arrangement of the spout nozzle was able to cover the increased area. As a result of the optimal spout nozzle placement, the concentric placement was found to be the best.
  • a concentric circle arrangement refers to a plurality of (at least two) imaginary circles, with the center of each imaginary circle being the same as the center of the dispersion plate, the diameter of each imaginary circle increasing from inside to outside, and the spout nozzle
  • the plurality of spout nozzles may be disposed along the circumference of the virtual circle, and the center of each spout nozzle may be positioned at the circumference of the virtual circle.
  • the optimal arrangement of the spout nozzles is a concentric arrangement, where one spout nozzle 212 is disposed at the center of the dispersion plate 200, and the dispersion plate is separated from the center of the dispersion plate 200.
  • a plurality of spout nozzles 214, 216 are disposed along the plurality of virtual concentric circles 201, 202 to the edge of 200, with respect to two adjacent virtual concentric circles 201, 202, the center of the distribution plate 200.
  • the number of spout nozzles 216 disposed along the outer concentric circles 202 is twice the number of spout nozzles 214 disposed along the inner concentric circles 201,
  • the spacing of the spout nozzles 216 disposed along is half of the spacing of the spout nozzles 214 disposed along the inner concentric circles 201 (that is, 1/2 or 0.5 times).
  • one spout nozzle 212 is disposed at the center of the distribution plate 200, and six spout nozzles 214 are disposed at 60-degree intervals in the first concentric circle 201 near the center of the distribution plate 200. Twelve spout nozzles 216 are disposed in the second concentric circles 202 disposed outside the first concentric circles 201 and larger in diameter than the first concentric circles 201 at intervals of 30 degrees.
  • one spout nozzle 212 is located at the center, six spout nozzles 214 are located at the next concentric circle 201 at 60 degree intervals, and then 30 degrees apart at the concentric circle 202. 12 spout nozzles 216 are located.
  • the spout nozzle arrangement begins at one center and extends to larger concentric circles.
  • the spout nozzle 216 of the outer concentric circle 202 is characterized in that the angle is compared with the arrangement of the spout nozzle 214 of the inner concentric circle 201 is half, the number is doubled.
  • this concentric spout nozzle arrangement facilitates particle coating due to maintaining the independence of each spout area, and may be advantageous for suppressing agglomeration due to particle surface stickiness due to the development of a dry bed top dry area.
  • more concentric circles such as a third concentric circle and a fourth concentric circle may be formed according to the sizes of the chamber 100 and the dispersion plate 200.
  • 24 spout nozzles may be arranged at 15 degree intervals.
  • the number of spout nozzles 214 may start from two to five less than six, or more than six or more than six in the first concentric circle 201.
  • Each concentric circle 201, 202 is arranged concentrically sharing the center of the dispersion plate 202.
  • the interval between the concentric circles 201 and 202 that is, the difference in radius between the concentric circles 201 and 202, is preferably the same for each concentric circles 201 and 202, but may be different.
  • the spacing between the spout nozzles 214 and 216 disposed in the same concentric circles 201 and 202 is also preferably the same, but may be different.
  • each spout nozzle 212, 214, 216 is not particularly limited and may be, for example, 2 to 20%, 5 to 15%, or 8 to 12% of the diameter of the dispersion plate 200 independently.
  • the spacing between the concentric circles 201 and 202 is not particularly limited, and may be, for example, 5 to 40%, 10 to 30%, or 15 to 25% of the diameter of the dispersion plate 200 independently.
  • the spacing between the respective concentric circles 201 and 202 may be, for example, 50 to 400% (ie, 0.5 to 4 times), 100 to 300% (ie, independently of the diameter of the spout nozzles 212, 214, and 216, respectively). 1 to 3 times) or 150 to 250% (ie, 1.5 to 2.5 times).
  • the spout nozzles 212, 214, and 216 may be provided with atomizers in the form of holes or nozzles capable of spraying the coating liquid.
  • One atomizer may be formed in the center of the spout nozzle, and a plurality of atomizers may be formed in the center area.
  • the diameter of the atomizer is preferably larger than the diameter of the gas injection hole, but is not limited thereto.
  • one or more gas injection holes formed in the spout nozzle may be used as an atomizer.
  • the coating liquid may be moved and sprayed through a carrier gas (air, etc.).
  • FIG. 3 is a comparison of particle observations by spout nozzle arrangement, based on a particle volume ratio of 0.3.
  • 19 spout nozzles which are the same as in Example 1 are disposed, and one spout nozzle is disposed in the center of the dispersion plate, but the outermost spout nozzles are disposed on concentric circles. It is not.
  • the middle view of FIG. 3 shows the particle distribution from above, and the lower view of FIG. 3 shows the particle distribution from the side.
  • Example 1 it can be seen that the spout area is well developed due to the optimal arrangement of the spout nozzle, and the particle spouting area is smoothly flown, so that the particle coating efficiency is improved because there is no interparticle coating interference phenomenon. .
  • the opening ratio of the gas injection hole may be different for the regions 205, 206, and 207 between the concentric circles 201 and 202 except for the spout nozzles 212, 214, and 216.
  • the opening ratio may mean a ratio of the area (total area of the gas injection holes) occupied by a plurality of gas injection holes formed in the corresponding area based on the total area of the corresponding area including the gas injection holes. In this case, the areas of the spout nozzles 212, 214, and 216 may be excluded from the calculation.
  • the opening ratio of the first region 205 corresponding to the outer side of the outermost concentric circle 202 may be smaller than the opening ratio of the second region 206 adjacent to the first region 205.
  • the opening ratio of the 205 may be smaller than the opening ratio of the third region 207 corresponding to the inside of the innermost concentric circle 201. That is, the opening ratio of the first region 205 may be the smallest.
  • the opening ratio of the second region 206 may be greater than or equal to the opening ratio of the third region 207.
  • the number of gas injection holes may be set differently, or the number may be set the same, but the diameter of the gas injection holes may be set differently. That is, the opening ratio can be adjusted by adjusting the number and / or diameter of the gas injection holes.
  • the opening ratio of the second region 206 may be 2 to 5 times or 3 to 4 times the opening ratio of the first region 205, and the opening ratio of the third region 207 may be the first ratio. It may be 1.5 to 4 times or 2 to 3 times the opening ratio of the first region 205, and the opening ratio of the second region 206 may be 0.5 to 2 times or 1 to 1.5 times the opening ratio of the third region 207. May be, but is not limited thereto.
  • Example 2 the whole dispersion plate was comprised by one area
  • the outermost region is set as the first region, and all of the inside thereof is set as the second region, wherein the opening ratio of the first region is 2.8%, and the opening ratio of the second region is It was set at 9.6%, which is about 3.42 times.
  • the outermost region is set as the first region, and the inside thereof is sequentially set as the second region and the third region, with the opening ratio of the first region being 2.8%, and the opening ratio of the second region. Is 9.6%, which is about 3.42 times the first area, and the opening ratio of the third area is set to 7.7%, which is 2.75 times the first area.
  • the opening ratio of the second region was about 1.25 times that of the third region.
  • Example 3 Compared with Example 2, in Examples 3 and 4 there was no or reduced high density particle area.
  • the flow rate of the spout nozzle may be different for each concentric circle. As such, independence of the spout area may be further secured by adjusting the flow rate of the concentric inner and outer spout nozzles.
  • the coating apparatus according to the present invention is disposed in a wind box (distribution plate lower space) formed in the lower portion of the distribution plate 200 to guide the gas flow structure (300, 310) It may further include.
  • the structures 300 and 310 may include: a first structure 300 formed throughout the radial direction of the chamber 100 and having a hole 302 at the center to direct gas flow toward the center of the chamber 100; And concentrically with the first structure 300 on the first structure 300, and partially formed except for the wall side of the chamber 100 with respect to the radial direction of the chamber 100 to form a gas flow in the chamber 100. It may include a second structure 310 leading to the wall of the).
  • the structures 300 and 310 may be installed in the chamber 100 in, for example, a horizontal direction (cross-sectional direction).
  • the first structure 300 may be installed over the entire cross section of the chamber 100, and the second structure 310 may be partially installed to be spaced apart from the inner wall of the chamber 100.
  • the structures 300 and 310 may be formed of disks, respectively, and the diameter of the first structure 300 may be the same as the inner diameter of the chamber 100.
  • the structures 300 and 310 may be composed of three or more.
  • the thickness and the material of the structures 300 and 310 are not particularly limited and can be appropriately set.
  • the first structure 300 may be mounted or fixed to the chamber 100 by a supporting member, screwing, welding, or the like.
  • the second structure 310 may be mounted or fixed to be spaced apart from the inner wall of the chamber 100 by a supporting member, a connecting member, or the like.
  • the first structure 300 may be disposed in the tapered region in which the diameter of the chamber 100 decreases downward, but is not limited thereto.
  • the second structure 310 may be disposed in a boundary region between the uniform diameter region and the tapered region of the chamber 100, but is not limited thereto.
  • the diameter of the first structure 300 may be greater than or equal to the diameter of the second structure 310.
  • the diameter of the second structure 310 is not particularly limited, and may be, for example, 20 to 50%, 25 to 45%, or 30 to 40% of the diameter of the chamber 100.
  • the diameter of the second structure 310 may be 50 to 150%, 70 to 130%, or 90 to 110% of the diameter of the hole 302 of the first structure (300).
  • the distance between the first structure 300 and the second structure 310 is not particularly limited, and may be, for example, 20 to 150%, 50 to 120%, or 70 to 100% of the diameter of the second structure 310. .
  • the hole 302 of the first structure 300 may be formed by penetrating the first structure 300 in the thickness direction of the first structure 300 in the central region of the first structure 300.
  • the hole 302 may be formed in a circular shape and may be formed concentrically with the center of the first structure 300.
  • One or more holes 302 may be formed in the central area.
  • the diameter of the hole 302 is not particularly limited, and may be, for example, 20 to 80%, 30 to 70%, or 40 to 60% of the diameter of the first structure 300.
  • Holes may also be formed in the second structure 310.
  • the gas flow may be induced not only toward the inner wall of the chamber 100 but also toward the center of the chamber 100.
  • the position, shape, number, diameter, etc. of the hole are not particularly limited and can be appropriately set.
  • FIG. 5 compares the influence of the flow rate variation on the installation of the wind box structure (maximum gas velocity 25 m / s).
  • the flow rate deviation (dispersion plate flow rate deviation) of the gas (air etc.) which flows into a plate can be reduced.
  • the flow rate deviation may be a deviation from the average flow rate obtained after measuring the flow rates of the plurality of localized regions over the entire distribution plate.
  • the flow rate can be measured directly using a sensor or by computer simulation.
  • Example 1 without the wind box structure, the gas flow was deflected toward one (left) inner wall of the chamber in the wind box region below the dispersion plate, so that the dispersion plate flow rate deviation was 0.90. As a result, the gas flow was uneven even on the top of the dispersion plate.
  • Example 5 with a wind box structure, the flow of gas in the first structure was directed towards the center of the chamber and then evenly distributed throughout the entire area of the chamber while striking the second structure, resulting in a remarkable flow rate deviation of 0.61. Shrunk. As a result, the gas flow was uniform even at the top of the dispersion plate.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Nozzles (AREA)
  • Devices And Processes Conducted In The Presence Of Fluids And Solid Particles (AREA)
  • Glanulating (AREA)
PCT/KR2019/010676 2018-08-24 2019-08-22 분산판 및 이를 포함하는 코팅 장치 Ceased WO2020040559A1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201980007640.6A CN111565856B (zh) 2018-08-24 2019-08-22 分散板和包括该分散板的涂布装置
JP2020537194A JP7117384B2 (ja) 2018-08-24 2019-08-22 分散板及びこれを含むコーティング装置
EP19851149.5A EP3730218B1 (en) 2018-08-24 2019-08-22 Dispersion plate and coating device including it
US16/963,654 US12042776B2 (en) 2018-08-24 2019-08-22 Dispersion plate and coating device including same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0099107 2018-08-24
KR1020180099107A KR102329735B1 (ko) 2018-08-24 2018-08-24 코팅기

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WO2020040559A1 true WO2020040559A1 (ko) 2020-02-27

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US (1) US12042776B2 (enExample)
EP (1) EP3730218B1 (enExample)
JP (1) JP7117384B2 (enExample)
KR (1) KR102329735B1 (enExample)
CN (1) CN111565856B (enExample)
WO (1) WO2020040559A1 (enExample)

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GB202016253D0 (en) * 2020-10-13 2020-11-25 Ucl Business Plc Particle processing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000040528A (ko) * 1998-12-18 2000-07-05 양인모 분산 노즐 및 이를 이용한 유동층 반응기
US20030019580A1 (en) * 2000-03-30 2003-01-30 Strang Eric J. Method of and apparatus for tunable gas injection in a plasma processing system
JP2004097852A (ja) * 2002-09-04 2004-04-02 Pauretsuku:Kk 流動層装置
KR20130138126A (ko) * 2012-06-08 2013-12-18 폴 코포레이션 필터 장치
US20150258565A1 (en) * 2012-10-12 2015-09-17 Spraying Systems Co. Fluidized bed coating apparatus

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2595072Y2 (ja) * 1992-02-28 1999-05-24 株式会社大川原製作所 流動層処理装置における多孔板ユニット
US5328720A (en) * 1992-10-23 1994-07-12 Carbon Implants, Inc. Coating-fluidizing gas supply system and method for flat bottom coater
FI96867C (fi) * 1993-12-27 1996-09-10 Borealis Polymers Oy Leijupetireaktori
US5891401A (en) * 1997-02-05 1999-04-06 Kinetics Technology International Corporation Porous tuyere for fluid bed apparatus
US5904119A (en) * 1997-06-26 1999-05-18 Brifer International Ltd. Furnace apparatus for fluidized bed processes
CN2351188Y (zh) * 1997-10-15 1999-12-01 天津市远昌化工技术开发有限责任公司 新型流化造粒炉
US6126753A (en) * 1998-05-13 2000-10-03 Tokyo Electron Limited Single-substrate-processing CVD apparatus and method
US7429407B2 (en) * 1998-12-30 2008-09-30 Aeromatic Fielder Ag Process for coating small bodies, including tablets
US6247657B1 (en) * 1999-05-28 2001-06-19 Delphi Technologies, Inc. Power gun spray nozzle and method
EP1282470B1 (en) * 2000-05-16 2008-08-20 Regents Of The University Of Minnesota High mass throughput particle generation using multiple nozzle spraying
KR100431863B1 (ko) * 2000-11-16 2004-05-20 주식회사 포스코 유동층 환원로의 분산판 크리닝장치
KR100362684B1 (ko) * 2000-12-20 2002-11-29 주식회사 포스코 유동층반응로의 분산판 차압조절장치
CN2649171Y (zh) * 2003-02-26 2004-10-20 浙江大学 流化床反应装置
CN2708992Y (zh) * 2004-07-15 2005-07-13 云南驰宏锌锗股份有限公司 一种经济环保型沸腾炉空气分布板
KR101309334B1 (ko) 2004-08-02 2013-09-16 비코 인스트루먼츠 인코포레이티드 화학적 기상 증착 반응기용 멀티 가스 분배 인젝터
AT503349B1 (de) * 2005-12-23 2008-09-15 Siemens Vai Metals Tech Gmbh Verteilerboden
KR100847199B1 (ko) * 2006-01-31 2008-07-17 주식회사 엘지화학 열전달 성능이 향상된 반응기, 이 반응기를 이용한 산화물 제조방법, 및 평행류의 열매체 유속 증가 방법
CN101061988A (zh) * 2006-04-28 2007-10-31 邹龙贵 流化床包衣机
GB0616131D0 (en) 2006-08-14 2006-09-20 Oxford Instr Plasma Technology Surface processing apparatus
FI120661B (fi) * 2008-06-11 2010-01-15 Yit Teollisuus Ja Verkkopalvel Leijupetikattilan petimateriaalin ohjaussuppilo, leijupetikattila, menetelmä leijupetikattilassa, sisäsuppilo ja sen käyttö
KR101134001B1 (ko) 2008-12-31 2012-04-05 제일모직주식회사 사구역을 최소화하기 위한 유동층 반응기용 송풍구형 분산판
KR101149825B1 (ko) * 2011-03-11 2012-05-24 주식회사 영일이엔지 균일한 유동층 분포를 가지는 유동층코팅건조기용 다공판
CN204602474U (zh) * 2015-02-13 2015-09-02 北京京诚之星科技开发有限公司 用于静电粉末喷射装置的压缩空气装置
CN207012954U (zh) * 2017-07-19 2018-02-16 南通科恩化工技术有限公司 一种气体分布器及有机硅流化床

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000040528A (ko) * 1998-12-18 2000-07-05 양인모 분산 노즐 및 이를 이용한 유동층 반응기
US20030019580A1 (en) * 2000-03-30 2003-01-30 Strang Eric J. Method of and apparatus for tunable gas injection in a plasma processing system
JP2004097852A (ja) * 2002-09-04 2004-04-02 Pauretsuku:Kk 流動層装置
KR20130138126A (ko) * 2012-06-08 2013-12-18 폴 코포레이션 필터 장치
US20150258565A1 (en) * 2012-10-12 2015-09-17 Spraying Systems Co. Fluidized bed coating apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3730218A4 *

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