WO2020029357A1

WO2020029357A1 - Base material for led bracket, led bracket, led light source and fabrication method therefor

Info

Publication number: WO2020029357A1
Application number: PCT/CN2018/104144
Authority: WO
Inventors: 刘云; 李俊东
Original assignee: 深圳市斯迈得半导体有限公司
Priority date: 2018-08-06
Filing date: 2018-11-02
Publication date: 2020-02-13
Also published as: CN109148675A

Abstract

A base material (1) used for an LED bracket, an LED bracket, an LED light source and a fabrication method therefor. The base material (1) comprises a metal matrix (7), and one or more coating layers arranged on a side of the metal matrix (7) used for bonding LED chips (4, 8); and/or one or more second metal layers deposited on the other side of the metal matrix (7) opposite to the side used for bonding the LED chips (4, 8); or an anti-oxidation treatment is performed on the other side of the metal matrix (7) opposite to the side used for bonding the LED chips (4, 8). The present invention also relates to an LED bracket that has the base material (1), an LED light source obtained by packaging the LED chips (4, 8) in the LED bracket, and a method for performing a surface treatment on the base material (1) of the LED bracket or a semi-finished product of the LED light source. By means of the foregoing technical solution, the material of the base material (1) may be protected from being easily vulcanized, brominated, oxidized, etc., thus improving the reflectivity and gloss of the base material (1).

Description

Base material for LED bracket, LED bracket, LED light source and manufacturing method thereof

Technical field

The present application relates to the technical field of LED light sources, and in particular, to a substrate having improved stability and reliability, and an LED bracket and a novel LED light source manufactured thereby, and a manufacturing method thereof.

Background technique

Since its introduction, LED has been widely valued and developed rapidly, which is inseparable from its own advantages. These advantages are summarized as: high brightness, low operating voltage, small power consumption, miniaturization, long life, impact resistance and stable performance. The development prospects of TOP LEDs (ie, top-surface or flat-emitting LEDs) are extremely broad, and they are currently moving towards higher brightness, higher weather resistance, higher luminous density, and higher luminous uniformity. However, in the process of producing and using TOP LED products, problems such as product degradation and product failure are often encountered. Pollution reasons, such as halogenation, oxidation, etc.), these problems bring certain losses to customers and manufacturers. After the above-mentioned vulcanization phenomenon occurs, the functional area of the LED product will be blackened, which will greatly reduce the reflection of light, the luminous flux will gradually decrease, and the color temperature will appear to drift and the product performance will be deteriorated, which will greatly reduce the reliability and service life of the LED . In severe cases, it directly leads to LED failure, that is, dead lights.

One of the main reasons for the existence of such defects in the prior art is that the brackets of TOP LEDs are generally plated with silver on the substrate. The silver plating layer can not only improve the conductivity and oxidation resistance, but also mainly play a role The light reflected by the LED is used to significantly improve the light efficiency and the luminous flux of the LED. When the LED is soldered at high temperature, if it encounters sulfur or sulfur vapor, it will cause the silver layer on the bracket to chemically react with sulfur 2Ag + S = Ag ₂ S ↓, forming Ag ₂ S sulfide, the Ag ₂ S sulfide Depending on the amount of reaction, a dark yellow or black color will not only lead to a significant reduction in electrical conductivity and oxidation resistance, but also significantly reduce the reflected light from the LED, seriously reducing light efficiency and luminous flux. In severe cases, most or almost all of the silver in the silver-plated layer is depleted through the occurrence of a sulfurization reaction, which causes the gold wire to break, causing the LED to open circuit and causing the LED to die.

As we all know, due to the poor air tightness of the TOP LED bracket, especially in the high temperature environment of the LED working state, the above-mentioned vulcanization failure is more likely to occur, making the silver plating layer on the bottom of the bracket black, which significantly reduces the stability of the LED device , Reliability, color temperature performance, light attenuation performance and service life, and even led to the phenomenon of dead lights in LED devices soon after use.

The information included in this background section of the description of the invention, including any references cited herein and any descriptions or discussions thereof, is included for technical reference purposes only and is not considered to be Subject matter that limits the scope of the invention.

Therefore, there is an urgent need in the art to solve the above-mentioned and other technical problems and defects existing in the background technology, and to develop a new type of high-stability LED device and LED bracket capable of overcoming the above-mentioned and other defects.

Summary of the invention

In view of the above-mentioned technical defects and other technical problems in the prior art, this application proposes a highly stable LED bracket, an LED device, a manufacturing method thereof,

The present invention aims to solve the above technical defects and other technical problems, and can also provide more additional technical effects.

According to one aspect of the present application, the substrate body may be selected from metal materials such as aluminum, copper, iron, or silver (not limited to the above-mentioned metal materials), and may be subjected to, for example, vacuum sputtering technology, ion plating technology, electroplating, and physical deposition. Or chemical plating technology, which deposits (such as coating or plating) one or more metal layers, compounds and other material layers on the surface of the substrate to form a welding interface. By controlling the surface compound and the thickness of the silver layer and the material density, the surface of the material of the substrate can be protected from being easily vulcanized, brominated, and oxidized, thereby improving the stability, gloss, and reflectivity of the LED light. Moreover, it enables the welding process of the front and back surfaces of the LED holder substrate.

According to another aspect of the present application, the base material, the filling material and the LED bracket can be fixedly connected. The LED bracket can be embedded or sol-bonded. The chip of the bracket can be mounted with a chip, and the chip can be soldered on There are bonding wires, and the chip and the bonding wires can be encapsulated with a sealing glue or a mixture of the sealing glue and a phosphor to form a specific LED package lamp bead.

More specifically, according to the present application, there is provided a substrate (1) for an LED bracket, the substrate including a metal substrate, wherein the substrate includes: a substrate for a metal substrate arranged on the metal substrate; One or more coatings on one side of the LED chip; and / or one or more second metal layers deposited on the other side of the metal substrate opposite to the side used to bond the LED chip Or, an anti-oxidation treatment is performed on the other side of the metal substrate (7) opposite to the side used for bonding the LED chip.

According to an embodiment of the present application, the one or more coating layers include one or more first metal layers and one or more compound layers.

According to another embodiment of the present application, the first metal layer is a coating layer formed of silver or a silver alloy, aluminum or an aluminum alloy, iron or an iron alloy, or copper or a copper alloy; and the compound layer is formed by vacuum sputtering , Ion plating, electroplating, physical deposition or electroless deposition of a compound coating selected from one or more of alumina, silicon dioxide, titanium dioxide, silicon-containing compounds, such as silicone oil.

According to another embodiment of the present application, the one or more coatings are sequentially arranged from the inside to the outside starting from the side of the metal substrate used for bonding the LED chip: An aluminum oxide layer, a titanium dioxide layer, a pure silver layer, an aluminum oxide layer, and an outermost titanium dioxide layer.

According to another embodiment of the present application, the one or more coatings are sequentially arranged from the inside to the outside starting from the side of the metal substrate used for bonding the LED chip: An aluminum oxide layer, a titanium dioxide layer, a pure silver layer, a titanium dioxide layer, a silicon dioxide layer, and an outermost titanium dioxide layer.

According to another embodiment of the present application, the one or more coatings are sequentially arranged from the inside to the outside starting from the side of the metal substrate used for bonding the LED chip: A silver layer, an aluminum oxide layer, and an outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a pure silver layer and a silicon-containing compound layer directly adjacent to the copper substrate, such as A silicone oil layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a pure silver layer, a titanium dioxide layer, and a silicon dioxide directly adjacent to the copper substrate. Layer, and the outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a pure silver layer directly adjacent to the copper substrate, and an outermost trioxide. Two aluminum layers; or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a pure silver layer directly adjacent to the copper substrate, and an outermost dioxide Silicon layer.

According to another embodiment of the present application, the one or more coatings are sequentially arranged from the inside to the outside starting from the side of the metal substrate that is used to bond the LED chip: nickel directly adjacent to the copper substrate Layer, silver layer, alumina layer, and outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding the LED chip from the inside to the outside in order: a nickel layer, a silver layer, and a silicone oil layer (including Silicon compounds); or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a nickel layer, a silver layer, a titanium dioxide layer, A silicon oxide layer, and an outermost titanium dioxide layer.

The one or more coatings are arranged from the side of the metal substrate for bonding the LED chip from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate, a pure silver layer, and an outermost side Alumina layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding the LED chip from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate, a pure silver layer, and an outermost side Of silicon dioxide layer.

According to another embodiment of the present application, the one or more coatings are sequentially arranged from the inside to the outside starting from the side of the metal substrate used for bonding the LED chip: copper directly adjacent to the iron substrate Layer, pure silver layer, alumina layer, and outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a copper layer, a pure silver layer, and a silicone oil layer (directly adjacent to the iron substrate). Silicon-containing compounds); or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a copper layer directly adjacent to the iron substrate, a pure silver layer, a titanium dioxide layer, A silicon dioxide layer, and an outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding the LED chip from the inside to the outside in order: a copper layer directly adjacent to the iron substrate, a pure silver layer, and an outermost layer. Al2O3 layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding the LED chip from the inside to the outside in order: a copper layer directly adjacent to the iron substrate, a pure silver layer, and an outermost layer. Silicon dioxide layer.

According to another embodiment of the present application, the one or more coatings are sequentially arranged from the inside to the outside starting from the side of the metal substrate used for bonding the LED chip: copper directly adjacent to the iron substrate Layer, nickel layer, pure silver layer, alumina layer, and outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a copper layer, a nickel layer, a pure silver layer directly adjacent to the iron substrate, A silicone oil layer (containing silicon compounds); or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a copper layer, a nickel layer, a pure silver layer directly adjacent to the iron substrate, A titanium dioxide layer, a silicon dioxide layer, and an outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a copper layer, a nickel layer, a pure silver layer directly adjacent to the iron substrate, and The outermost alumina layer; or

The one or more coatings are arranged from the side of the metal substrate for bonding LED chips from the inside to the outside in order: a copper layer, a nickel layer, a pure silver layer directly adjacent to the iron substrate, and The outermost silicon dioxide layer.

According to another embodiment of the present application, the second metal layer is sequentially arranged from the inside to the outside starting from the other side of the metal substrate opposite to the side used for bonding the LED chip: a copper layer and a member selected from A metal layer of one or more of silver, tin, nickel, and copper; or, an anti-oxidation treatment is performed on the other side of the metal substrate (7) opposite to the side used to bond the LED chip.

According to another embodiment of the present application, the second metal layer is sequentially arranged from the inside to the outside starting from the other side of the metal substrate opposite to the side used for bonding the LED chip: a copper layer and a member selected from A metal layer of one or more of silver, tin, and nickel; or, an anti-oxidation treatment is performed on the other side of the metal substrate (7) opposite to the side used to bond the LED chip.

According to another embodiment of the present application, the second metal layer is formed of one or more metals of silver, tin, and nickel; or, the side of the metal substrate (7) and the side for bonding the LED chip On the other side, do an anti-oxidation treatment.

According to another embodiment of the present application, the second metal layer is formed of one or more metals of silver, tin, nickel, and copper; or, in the metal substrate (7) and for bonding the LED chip The opposite side is anti-oxidized.

The present application also provides an LED bracket including the above-mentioned substrate, and an LED bracket body with a bowl and a cup-shaped LED bracket body formed with, for example, injection molding together with the substrate. Glue material (2), wherein the reflective surface of the glue material (2) forms a bowl-cup structure with a divergence angle of 90-180 ° together with the substrate, and the glue material (2) is a thermoplastic material or Thermoset material.

The present application also provides a high-stability LED light source, including the LED bracket described above, an LED chip (4; 8) bound to the bottom of the cup, and an encapsulant (3) filled in the cup. ).

The present application also discloses a method for surface-treating an LED support substrate or a semi-finished product of an LED light source. The method includes: vacuum-sputtering on a side of a metal substrate of the substrate for bonding LED chips. , Ion plating, electroplating, physical deposition or electroless plating techniques to deposit one or more surface coatings; and / or, vacuum sputtering on the other side of the metal substrate opposite to the side used to bond the LED chip , Ion plating, electroplating, physical deposition or electroless plating technology to deposit one or more second metal layers; or, to prevent oxidation on the other side of the metal substrate (7) opposite to the side used to bond the LED chip deal with.

According to another embodiment of the present application, the one or more coating layers include one or more first metal layers and one or more compound layers, wherein the compound layers are formed by vacuum sputtering or ion plating. , Electroplating, physical deposition or electroless deposition of a compound coating selected from the group consisting of one or more of alumina, silicon dioxide, titanium dioxide, silicon-containing compounds, such as silicone oil.

According to another embodiment of the present application, the second metal layer is one or more metal coatings formed of one or more metals of silver, tin, nickel, and copper; or, on the metal substrate (7) The side opposite to the side used for bonding the LED chip is anti-oxidized.

According to another embodiment of the present application, the method is used to form a substrate or an LED light source semi-finished surface coating structure of an LED bracket specifically designed in the present application.

According to another embodiment of the present application, the base material and the bracket filling material can be formed into an LED bracket by a certain process, wherein the base material and the bracket filling material provide an LED bracket body structure through mutual embedding or sol-bonding design. There are bracket cups and positive and negative electrodes for LED chip bonding separated by insulating glue. Preferably, the bottom of the bottom of the LED support cup is designed to be embedded or sol-bonded, wherein the glue (2) and the substrate are embedded or sol-bonded to each other.

According to a preferred embodiment, the bottom of the bowl cup of the LED bracket can be mounted with a chip, the bonding LED chip (4) can be soldered with the bonding wire (5), and the flip chip (8) can be soldered with the bottom of the cup, The chip (4) (8) and the bonding wire (5) may be encapsulated with a sealing glue (3).

Preferably, the side of the metal substrate used to bond the LED chip is deposited with metallic silver and compounds by vacuum sputtering technology, ion plating technology, electroplating, physical deposition or electroless plating technology. The above substrate may be selected from metal materials such as aluminum, copper, iron, etc., and the substrate is not limited to the above metal materials, and the compound is one of aluminum oxide, silicon dioxide, titanium dioxide, silicon-containing compound, such as silicone oil, or Multiple.

Preferably, the lower surface of the metal substrate is deposited with a metal material such as copper or silver by vacuum sputtering technology, ion plating technology, electroplating, physical deposition or electroless plating technology, and the metal material deposited on the lower surface is one or more of copper and silver. And the deposited metal materials are not limited to the above.

Preferably, the bracket is filled with a specific rubber material, which can be selected from materials such as PPA, PCT, EMC, SMC or BT.

The beneficial effects of this application include, but are not limited to, the substrate main body can be selected from aluminum, copper, or iron materials, and metal, compounds, etc. are deposited on the surface of the substrate through vacuum sputtering technology, ion plating technology, electroplating, physical deposition, or chemical plating technology. Materials to form a welding interface. By controlling the thickness of the surface compound and the silver layer, the material density, and protecting the surface of the substrate material from being easily sulfided, brominated, oxidized, etc., the substrate's reflectivity and gloss are improved, and the front and back side soldering process of the LED bracket substrate is realized. In addition, the size, structure, molding, and processing technology of LED brackets and LED device products can be diversified and flexibly customized according to the application.

Further embodiments of the present invention can also achieve other advantageous technical effects that are not listed one by one. These other technical effects may be partially described below, and it is possible for those skilled in the art after reading the present invention. Anticipated and understood.

This summary is intended to introduce concepts and options in a simplified form that are further described below, to help readers understand the present invention more easily. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. All of the above features will be understood as merely exemplary, and more features and purposes regarding the structure and method may be gathered from the present disclosure.

In the following description of the drawings and the detailed description, details of one or more embodiments of the present application will be explained. Various aspects and advantages of the present application will be partially explained in the following description, or will be apparent from the description, or may be learned through implementation of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

This specification describes the complete and implementable disclosure of this application for those of ordinary skill in the art, including its preferred embodiments, in which drawings are cited, these drawings are merely for illustration and to assist in describing specific embodiments, Without any limitation, the dimensions in the drawings are not drawn strictly to scale.

The drawings incorporated in and forming a part of the specification illustrate embodiments of the present application, and together with the description, serve to explain the principles of the application and some specific implementations. These drawings include:

1A-1D are schematic diagrams of different perspectives of an LED bracket structure according to an embodiment of the present application;

2 is a schematic diagram of a substrate for an LED bracket according to an embodiment of the present application;

3A-3C are schematic diagrams of different perspectives of an LED bracket structure according to another embodiment of the present application;

4A-4C are schematic diagrams of different perspectives of an LED bracket structure according to another embodiment of the present application;

5A-5C are schematic structural diagrams of LED semi-finished products after welding according to an embodiment of the present application;

6A-6B are schematic diagrams of a specific coating structure of a substrate according to a preferred embodiment of the present application;

7A-7B are schematic diagrams of a specific coating structure of a substrate according to another preferred embodiment of the present application;

8A-8B are schematic diagrams of a specific coating structure of a substrate according to still another preferred embodiment of the present application;

9A-9B are schematic diagrams of a specific coating structure of a substrate according to still another preferred embodiment of the present application;

10A-10B are schematic diagrams of a specific coating structure of a substrate according to still another preferred embodiment of the present application;

11A-11B are schematic diagrams of a specific coating structure of a substrate according to still another preferred embodiment of the present application;

12A-12B are schematic diagrams of a specific coating structure of a substrate according to still another preferred embodiment of the present application;

13 is a schematic diagram of a specific coating structure of a substrate according to another preferred embodiment of the present application;

14 is a schematic diagram of a specific coating structure of a substrate according to still another preferred embodiment of the present application;

15 is a schematic diagram of a specific coating structure of a substrate according to still another preferred embodiment of the present application; and

FIG. 16 is a schematic diagram of a specific coating structure of a substrate according to still another preferred embodiment of the present application.

detailed description

A number of non-limiting embodiments of the present application will now be described in detail with reference to the drawings. The embodiments referred to in this specification are only intended to explain the principles of the application and not to limit the scope of the application. The patentable scope of this application is limited only by the claims.

Those skilled in the art will understand that the phrases and terms used herein are for the purpose of description and should not be considered limiting. For example, the use of "including," "including," or "having" and variations thereof herein is intended to openly include the items listed thereafter and their equivalents, as well as additional items.

Those skilled in the art can understand that some terms in this application, such as “stent filling material”, do not have a restrictive meaning, but those skilled in the art can think of and understand that it is convenient to mold with a metal substrate and have LEDs. Any material required for the insulation performance of the bracket, such as PPA, PCT, EMC, SMC, BT and other resin materials, etc.

Those skilled in the art can understand that in the present application, the "bracket" and "LED bracket" are used interchangeably.

Referring to Figures 1-16, there are illustrated several preferred embodiments of the present application, which are specifically stated as follows.

As shown in FIGS. 1 to 6A and 6B, according to various specific embodiments of the present application, the following technical solutions are adopted: it includes a substrate 1, a bracket filling adhesive material 2, an encapsulation adhesive 3, a

chip

4 or 8, a bonding wire 5. The LED bracket adopts an embedded or sol-bonded design 6. The substrate 1 and the glue 2 are formed by a certain process to form the LED bracket shown in FIGS. 1A-1D.

According to another embodiment of the present application, a

chip

4 or 8 is mounted on the bottom of the cup of FIGS. 5A-5C, a bonding wire 5 is soldered on the front-mounted LED chip 4, and the LED chip 8 and a bracket are flipped (FIGS. 5A-5C). The bottom of the cup is soldered, and an encapsulant 3 is packaged above the

chip

4 or 8 and the bonding wire 5.

According to a preferred embodiment, the upper surface of the metal substrate 7 shown in Figs. 6-16, that is, the side used for bonding the LED chip, is vacuum-sputtered, ion-plated, electroplated, physically deposited, or electroless-plated. Metal silver and compounds are deposited, and the metal substrate 7 can be selected from metal materials such as aluminum, copper, and iron, and is not limited to the above-mentioned metal materials. Some examples of the compound may be, for example, one or more of alumina, silicon dioxide, titanium dioxide, silicon-containing compounds, such as silicone oil.

Preferably, the lower surface of the metal substrate 7 as shown in FIG. 6-16 can be deposited by vacuum sputtering technology, ion plating technology, electroplating, physical deposition or electroless plating technology on metallic materials such as copper, silver, and the like. The deposited metal material is one or more of copper and silver, and the deposited metal material is not limited to the above.

According to a preferred embodiment of the present application, as shown in FIG. 6A, one or more coatings are arranged from the side of the metal substrate (7) for bonding the LED chip from the inside to the outside in order from the aluminum substrate: (7) The directly adjacent aluminum oxide layer, titanium oxide layer, pure silver layer, aluminum oxide layer, and outermost titanium oxide layer.

According to a preferred embodiment of the present application, as shown in FIG. 6B, one or more coatings are arranged from the side of the metal substrate (7) for bonding the LED chip from the inside to the outside in order from the aluminum substrate: (7) The directly adjacent aluminum oxide layer, titanium dioxide layer, pure silver layer, titanium dioxide layer, silicon dioxide layer, and outermost titanium dioxide layer.

According to a preferred embodiment of the present application, as shown in FIG. 7A, one or more coatings are arranged from the side of the metal substrate (7) for bonding the LED chip from the inside to the outside in order: and the copper substrate (7) directly adjacent pure silver layer, alumina layer, and outermost titanium dioxide layer; or

As shown in FIG. 15, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: pure silver directly adjacent to the copper substrate (7) Layers, silicon-containing compounds, such as silicone oil; or

According to a preferred embodiment of the present application, as shown in FIG. 7B, one or more coatings are arranged from the side of the metal substrate (7) used for bonding the LED chip from the inside to the outside in order: and the copper substrate (7) directly adjacent pure silver layer, titanium dioxide layer, silicon dioxide layer, and outermost titanium dioxide layer; or

As shown in FIG. 10A, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: pure silver directly adjacent to the copper substrate (7) Layer, alumina layer; or

As shown in FIG. 10B, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: pure silver directly adjacent to the copper substrate (7). Layer, silica.

According to a preferred embodiment of the present application, as shown in FIG. 12A, one or more coatings are arranged from the side of the metal substrate (7) for bonding the LED chip from the inside to the outside in order: and the copper substrate (7) a nickel layer, a pure silver layer, an aluminum oxide layer, and an outermost titanium dioxide layer adjacent to each other; or

As shown in FIG. 16, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate (7). , Pure silver layer, silicon-containing compounds, such as silicone oil; or

As shown in FIG. 12B, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate (7). , Pure silver layer, titanium dioxide layer, silicon dioxide layer, and outermost titanium dioxide layer; or

As shown in FIG. 11A, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate (7). , Pure silver layer, alumina layer; or

As shown in FIG. 11B, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate (7). , Pure silver layer, silicon dioxide.

According to a preferred embodiment of the present application, as shown in FIG. 8A, one or more coatings are arranged from the side of the metal substrate (7) for bonding the LED chip in order from the inside to the outside: (7) directly adjacent copper layer, pure silver layer, alumina layer, and outermost titanium dioxide layer; or

As shown in FIG. 8B, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer directly adjacent to the iron substrate (7) , Pure silver layer, titanium dioxide layer, silicon dioxide layer, and outermost titanium dioxide layer; or

As shown in FIG. 9A, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer directly adjacent to the iron substrate (7) , Pure silver layer, and outermost aluminum oxide; or

As shown in FIG. 13, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer directly adjacent to the iron substrate (7) , A pure silver layer, and an outermost silicon-containing compound, such as silicone oil; or

As shown in FIG. 9B, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer directly adjacent to the iron substrate (7) , Pure silver layer and outermost silicon dioxide.

According to a preferred embodiment of the present application, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order to be directly adjacent to the iron substrate (7). Copper layer, nickel layer, pure silver layer, alumina layer, and outermost titanium dioxide layer; or

According to a preferred embodiment of the present application, one or more coatings are sequentially arranged from the inside to the outside starting from the side of the metal substrate (7) that is used for bonding LED chips: directly adjacent to the iron substrate (7) Copper layer, nickel layer, pure silver layer, titanium dioxide layer, silicon dioxide layer, and outermost titanium dioxide layer; or

According to a preferred embodiment of the present application, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order to be directly adjacent to the iron substrate (7). Copper, nickel, pure silver, and outermost aluminum oxide; or

As shown in FIG. 14, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer directly adjacent to the iron substrate (7) , Nickel, pure silver, and outermost silicon-containing compounds, such as silicone oil; or

According to a preferred embodiment of the present application, one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order to be directly adjacent to the iron substrate (7). Copper layer, nickel layer, pure silver layer and outermost silicon dioxide.

According to a preferred embodiment of the present application, the second metal layer is sequentially arranged from the inside to the outside starting from the other side of the metal substrate (7) opposite to the side used for bonding the LED chip: a copper layer and an outermost Silver layer.

According to a preferred embodiment of the present application, the second metal layer is formed of one or more metals of silver, tin, and nickel. Alternatively, the second metal layer is formed of one or more metals of silver, tin, nickel, and copper.

Preferably, the bottom of the LED shown in FIGS. 3A-3C and 4A-4C may be an embedded or sol-bonded design, wherein the glue material 2 and the substrate 1 are embedded with each other or sol-bonded to form an integrated bracket body.

Preferably, the specific stent filler 2 can be selected from PPA, PCT, EMC, SMC, BT and other materials.

According to several typical embodiments of the present application, the manufacturing process of the LED bracket and the LED light source / lamp beads of the present application are described as follows.

Process scheme example (1)

The specific process is as follows:

Substrate processing: Select specific substrates through front and back vacuum sputtering technology, ion plating technology, electroplating, physical deposition or chemical plating technology to process metal, organic or inorganic related compound materials;

Stamping or etching: Select substrates that have been processed by front and back surface processing or stamping;

LED bracket production: Fill the corresponding structure LED bracket with thermoset or thermoplastic or pressed composite (Figure 3A-3C);

LED packaging process: LED semi-finished products are formed on the LED bracket (Figure 3A-3C) by mounting chips 4, soldering and other processes (Figure 5A-5C);

The encapsulating adhesive layer 3 is potted in the LED semi-finished product (FIGS. 5A-5C), and is baked and cured to form the required LED light source lamp beads.

The LED bracket is prepared through the above specific embodiments, and an LED light source is thus manufactured. As an example, the dimensions of the high-stability LED light source of the present application can be customized. The length and width are 0.5 mm to 100 mm and the thickness is 0.2 mm to 40 mm. The process is realized and surface-treated according to the present application as described above.

Process scheme example (b)

The specific process is as follows:

Substrate stamping or etching: Select substrate stamping or etching, select the stamped and etched metal substrate and vacuum-sputter, ion plating, electroplating, physical deposition or electroless plating surface treatment, the surface of the substrate is silver or the substrate is nickel , Silver is attached to the outer layer of nickel;

Surface treatment of the stent: Select steps (1) and (2) to process the stent vacuum sputtering technology, ion plating technology, electroplating, physical deposition or chemical plating technology to selectively surface-treat organic or inorganic related compound materials

Examples of process solutions (3)

The specific process is as follows:

LED packaging process: the LED light source semi-finished product is formed on the LED bracket (Figure 3A-3C) by mounting chips 4, soldering and other processes (Figure 5A-5C);

Surface treatment of LED light source semi-finished products: Select step (1), step (2), step (3) LED light source semi-finished product vacuum sputtering technology, ion plating technology, electroplating, physical deposition or chemical plating technology. Selective surface treatment of organic or inorganic related compounds material;

Comparative experiment of light attenuation performance

A substrate for an LED holder according to a preferred embodiment of the present application is provided, wherein an aluminum trioxide layer directly adjacent to the aluminum substrate 7 is coated on the side of the metal substrate 7 for bonding LED chips, The thickness of the titanium dioxide layer, the pure silver layer, the aluminum oxide layer, and the outermost titanium dioxide layer can be between 30nm and 5000nm. Therefore, the chemical structure of the coating structure provided on the aluminum substrate in this embodiment is stable, and can prevent harmful elements (such as oxygen, sulfur, bromine, halogen elements, etc.) from the outside from reacting with the pure silver layer. To the effect of anti-sulfurization, anti-oxidation, anti-halogenation, thereby greatly improving the stability, reliability, color temperature performance, light attenuation performance and service life of LED devices.

In contrast, conventional TOP LED substrates including copper and its surface silver layer are provided,

The thickness of the silver layer is generally 0.5-3.0 microns.

According to the above-mentioned substrates of the present application and the conventional TOP LED support substrates, these two substrates are respectively made into LED devices.

10 LED devices made according to the above-mentioned substrate of the present application and 10 LED devices made of conventional TOP LED support substrate materials were selected respectively, and were subjected to high-temperature aging experiments. The experimental conditions are as follows: the ambient temperature is 120 degrees, the voltage is 9V, and the current is 100ma. After 1000 hours of lighting and aging, the average luminous flux of the LED device made by the present application and the traditional stent substrate after aging is measured.

The test results show that the average luminous flux attenuation of the LED device manufactured by using the above substrate of the present application is about 1% after 1000 hours of lighting and aging; while the LED device manufactured by using the conventional TOP LED support substrate material passes the 1000 hour point Bright aging luminous flux attenuation averages about 10%.

The above comparative test results show that the LED bracket substrate subjected to the coating treatment according to the present application can greatly improve the light attenuation performance of the LED device compared with the prior art.

The foregoing description of several embodiments of the invention has been presented for the purposes of illustration. Although only certain features of the preferred embodiments have been shown and described herein, those of ordinary skill in the art should understand that the foregoing description is not intended to be exhaustive or to limit the present invention to the disclosed Specific features and / or forms. Many modifications and variations can be conceived by those skilled in the art, which are all within the scope of the present invention. Therefore, it should be understood that the appended claims are intended to cover all such modifications and variations that fall within the substantive idea of the present application. The scope of protection of this application is limited only by the appended claims.

Claims

A substrate (1) for an LED bracket, the substrate (1) comprising a metal substrate (7), wherein the substrate (1) comprises:

One or more coatings arranged on the side of the metal substrate (7) for bonding LED chips;

One or more second metal layers deposited on the other side of the metal substrate (7) opposite to the side used for bonding the LED chip; or, the metal substrate (7) is used for bonding The opposite side of the LED chip is anti-oxidized.
The substrate (1) for an LED bracket according to claim 1, wherein the one or more coatings include one or more first metal layers, and one or more compound layers.
The substrate (1) for an LED holder according to claim 2, wherein:

The first metal layer is aluminum or an aluminum alloy, iron or an iron alloy, or copper or a copper alloy; and the compound layer is a compound coating deposited by vacuum sputtering, ion plating, electroplating, physical deposition, or electroless plating. The compound is selected from one or more of alumina, silicon dioxide, titanium dioxide, silicon-containing compounds, such as silicone oil.
The substrate (1) for an LED holder according to any one of claims 1-3, wherein the one or more coatings are from the metal substrate (7) for bonding LED chips. That side is arranged from the inside to the outside in order: an aluminum oxide layer, a titanium dioxide layer, a pure silver layer, an aluminum oxide layer, and an outermost titanium dioxide layer, which are directly adjacent to the aluminum substrate (7).
The substrate (1) for an LED holder according to any one of claims 1-3, wherein the one or more coatings are from the metal substrate (7) for bonding LED chips. That side is arranged from the inside to the outside in order: an alumina layer, a titania layer, a pure silver layer, a titania layer, a silica layer, and an outermost titania layer directly adjacent to the aluminum substrate (7).
The substrate (1) for an LED holder according to any one of claims 1-3, wherein:

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a pure silver layer directly adjacent to the copper substrate (7), An aluminum trioxide layer, and an outermost titanium dioxide layer; or

The one or more coatings are sequentially arranged from the inside to the outside from the side of the metal substrate (7) that is used to bond the LED chip: directly adjacent to the copper substrate (7) and the copper substrate ( 7) directly adjacent pure silver layer, titanium dioxide layer, silicon dioxide layer, and outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a pure silver layer directly adjacent to the copper substrate (7), An aluminum oxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a pure silver layer directly adjacent to the copper substrate (7), A silica layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a pure silver layer directly adjacent to the copper substrate (7), And the outermost silicon-containing compounds, such as silicone oil.
The substrate (1) for an LED holder according to any one of claims 1-3, wherein:

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate (7), A silver layer, an aluminum oxide layer, and an outermost titanium dioxide layer; or

The one or more coatings are sequentially arranged from the inside to the outside from the side of the metal substrate (7) that is used to bond the LED chip: directly adjacent to the copper substrate (7) and the copper substrate ( 7) directly adjacent nickel layer, pure silver layer, titanium dioxide layer, silicon dioxide layer, and outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate (7), Silver, alumina; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate (7), Silver layer, silicon dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a nickel layer directly adjacent to the copper substrate (7), A layer of silver, and an outermost silicon-containing compound, such as silicone oil.
The substrate (1) for an LED holder according to any one of claims 1-3, wherein:

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer directly adjacent to the iron substrate (7), A silver layer, an aluminum oxide layer, and an outermost titanium dioxide layer; or

The one or more coatings are sequentially arranged from the inside to the outside from the side of the metal substrate (7) that is used to bond the LED chips: A silver layer, a titanium dioxide layer, a silicon dioxide layer, and an outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer directly adjacent to the iron substrate (7), A silver layer and an outermost aluminum oxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer directly adjacent to the iron substrate (7), Silver layer and outermost silicon dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer, silver directly adjacent to the iron substrate (7), Layers, silicon-containing compounds, such as silicone oil.
The substrate (1) for an LED holder according to any one of claims 1-3, wherein:

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer, nickel directly adjacent to the iron substrate (7), and nickel. Layer, pure silver layer, alumina layer, and outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer, nickel directly adjacent to the iron substrate (7), and nickel. Layer, pure silver layer, titanium dioxide layer, silicon dioxide layer, and outermost titanium dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer, nickel directly adjacent to the iron substrate (7), and nickel. Layer, pure silver layer, and outermost alumina layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer, nickel directly adjacent to the iron substrate (7), and nickel. Layer, pure silver layer, and outermost silicon dioxide layer; or

The one or more coatings are arranged from the side of the metal substrate (7) for bonding LED chips from the inside to the outside in order: a copper layer, nickel directly adjacent to the iron substrate (7), and nickel. Layers, silver layers, silicon-containing compounds, such as silicone oil.
The substrate (1) for an LED holder according to claim 1, 2, 3, 4 or 5, wherein the second metal layer is from the metal substrate (7) and used for bonding LED chips. The other side of the opposite side is arranged from the inside to the outside in order: a copper layer and a metal layer selected from one or more of silver, tin, nickel, and copper; or, on the metal substrate (7), The side opposite to the side used to bond the LED chip is anti-oxidized.
The substrate (1) for an LED holder according to claim 1, 2, 3, 6 or 7, wherein the second metal layer is from the metal substrate (7) and used for bonding LED chips. The other side of the opposite side is arranged from the inside to the outside: a metal layer selected from one or more of silver, tin, and nickel; or, the metal substrate (7) is used for bonding LED chips. The other side is anti-oxidized.
The substrate (1) for an LED holder according to claim 1, 2, 3, 8 or 9, wherein the second metal layer is from the metal substrate (7) and used for bonding LED chips. The other side of the opposite side is arranged from the inside to the outside: a metal layer selected from one or more of copper, silver, tin, and nickel; or, used for bonding of the metal substrate (7) The opposite side of the LED chip is anti-oxidized.
An LED bracket comprising the substrate (1) according to any one of the preceding claims, and an adhesive material (2) formed with the substrate (1) into an LED bracket body with a bowl structure. ,

Wherein, the reflecting surface of the rubber material (2) forms a bowl structure with a divergence angle of 90-180 ° together with the substrate, and the rubber material (2) is a thermoplastic material or a thermosetting material.
The LED bracket according to claim 13, wherein the adhesive material (2) is selected from one or more of the following resin materials: PPA, PCT, EMC, SMC, BT, and any combination thereof.
The LED bracket according to claim 13 or 14, wherein the base material (1) and the glue material (2) form the LED bracket body by being embedded or sol-bonded to each other.
A high-stability LED light source, comprising the LED bracket according to any one of claims 13-15, an LED chip (4; 8) bound to the bottom of the cup, and poured into the bowl Sealant inside the cup (3).
A method for surface treating a substrate (1) for an LED bracket, the method comprising:

Depositing one or more surface coatings on the side of the metal substrate (7) of the base material (1) for bonding LED chips by vacuum sputtering, ion plating, electroplating, physical deposition or electroless plating; with

Depositing one or more second metal layers on the other side of the metal substrate (7) opposite to the side for bonding the LED chip by vacuum sputtering, ion plating, electroplating, material deposition or electroless plating technology Or, an anti-oxidation treatment is performed on the other side of the metal substrate (7) opposite to the side used for bonding the LED chip.
The method of claim 17, wherein the one or more coatings include one or more first metal layers and one or more compound layers, wherein the compound layers are formed by vacuum sputtering, A coating of a compound deposited by ion plating, electroplating, physical deposition or electroless plating, said compound being selected from one or more of alumina, silicon dioxide, titanium dioxide, silicon-containing compounds, such as silicone oil.
The method according to claim 17 or 18, wherein the second metal layer is one or more metal coatings formed of one or more metals of silver, tin, nickel, and copper; or The other side of the substrate (7) opposite to the side used for bonding the LED chip is subjected to anti-oxidation treatment.
The method according to claim 17, wherein the method is used to form a surface coating structure of a substrate (1) of an LED holder according to any one of claims 1-12.