WO2020025101A1

WO2020025101A1 - Apparatus with movable shield carrier

Info

Publication number: WO2020025101A1
Application number: PCT/EP2018/070601
Authority: WO
Inventors: Sebastian Gunther ZANG; Andreas Sauer; Matthias Krebs; Annabelle HOFMANN; Jerry SIGMUND
Original assignee: Applied Materials, Inc.
Priority date: 2018-07-30
Filing date: 2018-07-30
Publication date: 2020-02-06
Also published as: CN110972483A; JP2021502474A; KR20200014726A; TW202020192A

Abstract

A vacuum processing apparatus for processing a substrate is described. The processing apparatus system includes a vacuum chamber and a deposition source provided in the vacuum chamber. The apparatus further comprises a first track arrangement with a first transportation track adapted to transport a substrate and a second transportation track, adapted to transport a mask. Furthermore, the apparatus comprises a third transportation track, adapted to transport a mask shield between the deposition source and the mask to avoid contamination of the mask. The third transportation track is adapted to transport the mask shield outside the vacuum chamber so it is possible to disassemble and clean a mask shield, contaminated with material from the deposition source.

Description

APPARATUS WITH MOVABLE SHIELD CARRIER

FIELD

[0001] Embodiments of the present disclosure relate to an apparatus, a track arrangement a mask shield and a method for moving the mask shield. In particular, embodiments of the present disclosure relate to maintenance of mask shields of a vacuum processing apparatus. Methods and apparatuses described herein may be used in the manufacture of organic light-emitting diode (OLED) devices.

BACKGROUND

[0002] Techniques for layer deposition on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates may be used in several applications and in several technical fields. For instance, coated substrates may be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used for the manufacture of television screens, computer monitors, mobile phones, other hand-held devices and the like, for displaying information. An OLED device, such as an OLED display, may include one or more layers of an organic material situated between two electrodes that are deposited on a substrate.

[0003] During the deposition of a coating material on a substrate, the substrate may be held by a substrate carrier, and a mask may be held by a mask carrier in front of the substrate. Accordingly, a material pattern, e.g. a plurality of pixels corresponding to an opening pattern of the mask, can be deposited on the substrate.

[0004] The functionality of an OLED device typically depends on a coating thickness of the organic material, which has to be within a predetermined range. For obtaining high- resolution OLED devices, technical challenges with respect to the deposition of evaporated materials need to be mastered. In particular, an accurate and smooth transportation of the substrate carriers and the mask carriers through a vacuum system is challenging. Further, a precise alignment of the substrate with respect to the mask is crucial for achieving high quality deposition results, e.g. for producing high-resolution OLED devices. Further, to reduce the cost of ownership of a vacuum processing system, cleaning of components is beneficially provided in a short time to reduce downtime of the system. Further, it is beneficial to allow for maintenance at one portion of a vacuum processing system while other portions may still be operated.

[0005] In view of the above, it would be beneficial to not only provide apparatuses, systems and methods for accurately and reliably positioning and aligning substrates and masks relative to each other in a vacuum chamber but also apparatuses allowing for easy and cost efficient maintenance performance. Further, an efficient use of a vacuum deposition system with short idle times would be beneficial.

SUMMARY

[0006] In light of the above, an apparatus for processing a substrate, a system for processing a substrate, and a method of aligning a substrate carrier relative to a mask carrier in a vacuum chamber are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0007] According to an aspect of the present disclosure a vacuum processing apparatus is disclosed, including a vacuum chamber, a deposition source, which is provided in the vacuum chamber. A first track arrangement, including a first transportation track adapted to transport a substrate and a second transportation track, adapted to transport a mask, and a third transportation track, adapted to transport a mask shield between the deposition source and the mask to avoid contamination of the mask.

[0008] According to another aspect of the present application, a track arrangement in a vacuum processing apparatus is disclosed. The track arrangement includes a first transportation track, for transporting a substrate in a vacuum chamber of the vacuum processing apparatus, a second transportation track, for transporting a mask in the vacuum chamber of the vacuum processing apparatus and a third transportation track for transporting a mask shield in the vacuum chamber of the vacuum processing apparatus. [0009] In a further aspect of the present application, a mask shield is disclosed. The mask shield or shield-arrangement can be arranged on a transportation track of a vacuum processing apparatus and can include a shield frame. The shield frame can include of at least one sheet metal shield covering a side of the mask carrier and/or a mask frame and/or a side shield covering an edge of the mask carrier.

[0010] Embodiments of the present application include a method to exchange a mask shield for a vacuum processing apparatus.

The method can include bringing a deposition source, which is provided in the vacuum chamber to a back position and opening a valve 10 of the vacuum chamber. Further, the method can include sliding a first portion of a mask shield out of the vacuum chamber, disassembling first shields from the first portion of the mask shield, sliding a second portion of the mask shield out of the vacuum chamber, disassembling second shields from the second portion of the mask shield.

[0011] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

Fig. 1 shows vacuum chambers according to a prior art;

Fig. 2 shows a vacuum chamber according to embodiments of the present application; Fig. 3A-3B shows a side view of embodiments of the present application;

Fig. 4 shows a schematic overview of a vacuum processing apparatus with a multitude of chambers according to embodiments of the present application;

Fig. 5A-5B shows a mask shield/shielding arrangement according to embodiments of the present application;

Figs. 6A-6D show several subsequent stages of a mask shield with respect to a vacuum chamber according to embodiments described herein.

Fig. 7 shows embodiments of methods described herein.

DETAILED DESCRIPTION OF EMBODIMENTS [0013] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure.

[0014] In an embodiment of the present application, a vacuum processing apparatus 40 is disclosed, see for example Fig. 2. The vacuum processing apparatus 40 includes a vacuum chamber 12. A deposition source 33 can be provided in the vacuum chamber 12. The vacuum chamber 12 can include a first track arrangement 13. [0015] The first track arrangement 13 can include a first transportation track 13-1 adapted to transport a substrate 16 into a vacuum chamber and a second transportation track 13-2, adapted to transport a mask into a vacuum chamber. Further, a third transportation track 13-3 is provided. The third track arrangement is adapted to transport a mask shield 14 between the deposition source 33 and the mask to reduce contamination of the mask.

[0016] The deposition source 33 in the vacuum chamber 12 may be a vapor source configured to direct evaporated material toward an essentially vertically arranged substrate 16. According to embodiments of the present disclosure, a mask shield is provided to protect masks and also mask carriers from being contaminated. Idle times of the system are to be kept as short as possible.

[0017] Embodiments of the present disclosure relate inter alia to vacuum processing systems for manufacturing OLED displays on large area substrates, particularly RBG (red green blue) OLED devices, for which organic and other layers may be deposited with a shadow mask. For large area deposition a vertical substrate orientation may be beneficial in order for the system to have a small footprint. Vertical substrate processing with shadow masks, having e.g. a pixel accuracy for masking deposition can be very challenging in light of gravity acting parallel to a mask plane.

[0018] An“essentially vertical orientation” as used herein may be understood as an orientation with a deviation of 10° or less, particularly 5° or less from a vertical orientation, i.e. from the gravity vector. For example, an angle between a main surface of a substrate 16 (or mask) and the gravity vector may be between +10° and -10°, particularly between 0° and -5°. In some embodiments, the orientation of the substrate 16 (or mask) may not be exactly vertical during transport and/or during deposition, but slightly inclined with respect to the vertical axis, e.g. by an inclination angle between 0° and -5°, particularly between -1° and -5°. A negative angle refers to an orientation of the substrate 16 (or mask) wherein the substrate 16 (or mask) is inclined downward. A deviation of the substrate 16 orientation from the gravity vector during deposition may be beneficial and might result in a more stable deposition process, or a facing down orientation might be suitable for reducing particles on the substrate 16 during deposition. However, an exactly vertical orientation (+/-l°) during transport and/or during deposition is also possible. In other embodiments, the substrates 16 and masks may be transported in a non- vertical orientation, and/or the substrates 16 may be coated in a non- vertical orientation, e.g. an essentially horizontal orientation.

[0019] During deposition on a large area substrate, particularly a masked deposition with a shadow mask (pixel mask), the substrate and the mask can be static. Static mask- substrate-arrangements allow for masking accuracy with the precision of a pixel size of a display. The deposition source 33 may be movable along a source transportation track which may be provided in the vacuum chamber 12. The deposition source 33 may be provided as a line source extending in an essentially vertical direction. The height of the deposition source 33 in the vertical direction may be adapted to a height of the vertically oriented substrate 16 such that the substrate 16 can be coated by moving the deposition source 33 past the substrate 16. [0020] The deposition source 33 may include a distribution pipe with a plurality of vapor openings or nozzles for directing the coating material toward the deposition area. Further, the deposition source 33 may include a crucible configured for heating and evaporating the coating material. The crucible may be connected to the distribution pipe such as to be in fluid communication with the distribution pipe. [0021] In some embodiments, the deposition source 33 may be rotatable. For example, the deposition source 33 may be rotatable from a first orientation in which the vapor openings of the deposition source 33 are directed toward a first deposition area to a second orientation in which the vapor openings are directed toward a second deposition area. The first deposition area and the second deposition area may be located on opposite sides of the deposition source 33, and the deposition source 33 may be rotatable by an angle of about 180° between the deposition area and the second deposition area

[0022] The vacuum processing apparatus 40 may further include a first track arrangement 13. The first track arrangement 13 can include a first transportation track 13-1 which can be adapted to transport the substrate 16 into a vacuum chamber 12. The first track arrangement 13 can include a second transportation track 13-2, which can be adapted to transport a mask into a vacuum chamber 12.

[0023] The substrate 16 can be carried by a substrate carrier 36 on the first transportation track 13-1 and the mask 17 can be carried by a mask carrier 37 on the second transportation track 13-2. The first and second transportation track 13-2 may at least partially, form a transport path in the vacuum chamber 12, for example from an adjacent vacuum chamber. As exemplarily shown in Figs. 3A and 3B, an alignment system can be provided so that a substrate 16, which is carried by the substrate carrier 36, may be aligned with respect to a mask that is carried by the mask carrier 37 via an alignment unit of the alignment system. [0024] The first transport tracks 13-1 and second transport tracks 13-2 are illustrated in Fig. 1. A substrate 16 is provided to the first transport track 13-1. The first transport track 13-1 can be adapted to carry a substrate or substrate carrier. The substrate or the substrate carrier may be levitated by the first transportation track, or the substrate 16 and first transport track 13-1 may be mechanically linked. A mask 17 is provided to the second transport track 13-2. The second transport track 13-2 can be adapted to carry a mask or mask carrier. The mask or the mask carrier may be levitated by the second transportation track, or the mask 17 and second transport track 13-2 may be mechanically linked.

[0025] As shown in Fig. 1, a first transport track 13-1 and a second transport track 13-2 may allow transportation of a substrate or mask into and out of the vacuum chamber 12, for example, in an adjacent vacuum chamber. The side of the vacuum chamber being adjacent to the further vacuum chamber can be a first side of the vacuum chamber. A maintenance chamber 5 may be provided at another, second side of the vacuum chamber. The second side may oppose the first side. The maintenance chamber allows for transfer of components, such as a source 33 into the maintenance chamber.

[0026] Embodiments of the present disclosure allow for reduced idle times of the processing chambers in a vacuum processing system, wherein substrates may be routed through the system on substrate carriers and masks may be routed through the system, for example, on mask carriers. [0027] The term“substrate carrier” as used herein may particularly relate to a carrier device configured to carry a substrate 16 along a substrate 16 transportation path in a vacuum system. The substrate carrier 36 may hold the substrate 16 during the deposition of a coating material on the substrate 16. In some embodiments, the substrate 16 may be held at the substrate carrier 36 in a non-horizontal orientation, particularly in an essentially vertical orientation, during transport and/or deposition.

[0028] For example, the substrate 16 may be held at a holding surface of the substrate carrier 36 during transport through the vacuum chamber, during positioning of the substrate 16 in the vacuum chamber 12, e.g. with respect to a mask, and/or during deposition of a material on the substrate 16. In particular, the substrate 16 may be held at the substrate carrier 36 by a chucking device, e.g. by an electrostatic chuck and/or by a magnetic chuck. The chucking device may be integrated in the substrate carrier 36.

[0029] A substrate carrier 36 may include a carrier body with a holding surface configured to hold the substrate 16, particularly in a non-horizontal orientation. In some embodiments, the carrier body may be moved along a substrate transport path by a substrate transportation system, e.g. including a linear motor. In some embodiments, the substrate carrier 36 may be contactlessly held at a guiding structure during the transport, e.g., by a magnetic levitation system.

[0030] For example, the substrate carrier 36 can include an electrode arrangement configured to provide an attracting force acting on the substrate 16. The substrate carrier 36 may include an electrode arrangement having a plurality of electrodes configured to provide an attracting force for holding the substrate 16 at a holding surface of the substrate carrier 36. A controller of the substrate carrier 36 can be configured to apply one or more voltages to the electrode arrangement to provide the attracting force (also referred to as“chucking force”).

[0031] The plurality of electrodes of the electrode arrangement can be embedded in the body, or can be provided, e.g., placed, on the body. The body may be a dielectric body, such as a dielectric plate. The dielectric body can be fabricated from a dielectric material, preferably a high thermal conductivity dielectric material such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina or an equivalent material, but may be made of such materials as polyimide. The plurality of electrodes, such as a grid of fine metal strips, can be placed on the dielectric plate and covered with a thin dielectric layer.

[0032] According to some embodiments, which can be combined with other embodiments described herein, the substrate carrier 36 may include one or more voltage sources configured to apply one or more voltages to the plurality of electrodes. In some implementations, the one or more voltage sources are configured to ground at least some electrodes of the plurality of electrodes. For example, the one or more voltage sources can be configured to apply a first voltage having a first polarity, a second voltage having a second polarity, and/or ground to the plurality of electrodes. The apparatus can be configured for a contactless levitation and/or a contactless transportation of the substrate carrier 36 and/or the mask carrier 37. For example, the apparatus may include a guiding structure configured for a contactless levitation of the substrate carrier 36 and/or the mask carrier 37. Likewise, the apparatus can include a drive structure configured for contactless transportation of the substrate carrier 36 and/or the mask carrier 37. In particular, the carrier can be held in a levitating or floating state using magnetic forces instead of mechanical forces. For example, in some implementations, there can be no mechanical contact between the carrier and the transportation track, particularly during levitation, movement and positioning of the substrate carrier 36 and/or mask carrier 37.

[0033] The contactless levitation and/or transportation of the carriers is beneficial in that no particles are generated during transportation, for example due to mechanical contact with guide rails. An improved purity and uniformity of the layers deposited on the substrate 16 can be provided, since particle generation is minimized when using the contactless levitation and/or transportation.

[0034] Similarly, the term a“mask carrier” as used herein may relate to a carrier device configured to carry a mask for the transport of the mask along a mask transport path in the vacuum chamber 12. The mask carrier 37 may carry the mask 17 during transport, during an alignment with respect to a substrate 16 and/or during deposition on the substrate 16.

[0035] The mask may be held at the mask carrier 37 by a chucking device, e.g. a mechanic chuck such as a clamp, an electrostatic chuck and/or a magnetic chuck. Other types of chucking devices may be used which may be connected to or integrated in the mask carrier 37.

[0036] For instance, the mask may be an edge exclusion mask or a shadow mask. An edge exclusion mask is a mask which is configured for masking one or more edge regions of the substrate 16, such that no material is deposited on the one or more edge regions during the coating of the substrate 16. A shadow mask is a mask configured for masking a plurality of features which are to be deposited on the substrate 16. For instance, the shadow mask can include a plurality of small openings, e.g. a grid of small openings. For example, the openings may correspond to a pixel of a display or a color of a pixel of a display. [0037] The first track arrangement 13 of the vacuum processing apparatus 40 may further include a third transportation track 13-3, which can be adapted to transport a mask shield 14 between the deposition source 33 and the mask, to reduce contamination of the mask and/or particularly the mask carrier. [0038] The third transportation track 13-3 (see Fig. 2) can allow for simply removing the mask shield 14 from the vacuum chamber 12. The mask shield 14 can be moved essentially independent from the substrate 16 and the mask carrier 37. The substrate 16 and the mask carrier 37 can be moved along respective transportation paths, referred to as first transportation track 13-1 and second transportation track 13-2 (Fig. 2). Further, the mask or the mask carrier supporting the mask can be removed at the second side of the vacuum chamber, e.g. a side opposing a further vacuum chamber of the vacuum processing system. A valve 10 may be provided at the second side.

[0039] The mask shield 14 can be provided in the vacuum chamber 12, particularly between the deposition source 33 and an alignment system. The mask shield 14 can be located between the deposition source 33 and the mask carrier 37. Accordingly, the mask shield 14 at least partially shields the mask carrier 37, in order to reduce a contamination of the mask carrier 37 or of the vacuum chamber 12 with coating material. For example, the mask shield 14 may be shaped such that an outer portion of the mask carrier 37 is protected by a shielding plate of the mask shield 14. The mask shield 14 at least partially blocks coating material that is directed toward the outer portion of the mask carrier 37. The coating material that is directed toward the substrate 16 may propagate through the mask shield 14 in an unhindered way.

[0040] For example, the mask shield 14 may include a shielding frame, (see Figs. 6B- 6D) configured to cover and shield, at least partially, the mask carrier 37. The mask shield 14 may contain an opening 30, indicated as a dashed line in Figs. 3A and 3B and also in Figs. 5A and 5B, provided in the shielding frame, configured to allow the coating material to pass through the mask shield 14 toward the substrate 16. The opening of the mask shield may have a size of 0.5 m² or more, particularly 1 m² or more. The size of the opening may be larger than the area of the substrate 16 that is to be coated. [0041] “Transporting”,“moving”,“routing”,“rotating”,“positioning” or“aligning” a substrate 16 or a mask as used herein may refer to a respective movement of a substrate carrier 36 or a mask carrier 37 which holds the substrate 16 or the mask.

[0042] Transport of the masks or substrates 16 may be provided in a contactless manner, e.g. including a magnetic levitation system. The contactless transport can be provided by the first track arrangement 13.

[0043] Fig. 2 shows a first track arrangement 13 with three transportation tracks. A first transportation track 13-1, a second transportation track 13-2 and a third transportation track 13-3. The dotted line symbolizes the third transportation track 13-3. The third transportation track may reach out of the vacuum chamber 12, for example, through valve 10.

[0044] In another embodiment of the present application, the third transportation track 13-3 can be adapted to transport a mask shield 14 outside the vacuum chamber 12. A first part of the third transportation track 13-3 can be provided in the vacuum chamber 12. A second part of the third transportation track 13-3 can be provided outside the vacuum chamber 12.

[0045] Each of the inner and outer part of the third transportation track 13-3 track may include an upper and lower portion. The mask shield 14 can therefore be supported on an upper and a lower portion of the third transportation track, so that the mask shield can be supported in a mechanically stable position.

[0046] At least an outside lying upper part 60a of the third transportation track 13-3 can be arranged in a movable manner. The upper part can be arranged such, that the upper part is, for example, movable around a pivot axis 41 as shown in Fig. 6A. In such an arrangement, a person performing maintenance can be protected against injuries from potentially sharp edges on parts of the transportation track.

[0047] In another embodiment of the present application it is disclosed that the first transportation track 13-1 can be configured to transport substrate 16 and/or a mask into and out of vacuum chamber 12 from a further vacuum chamber 41 provided at a first side of the vacuum chamber. The third transportation track 13-3 can be adapted to transport the mask shield 14 to an outside of the vacuum chamber 12 at a second side of the vacuum chamber 12. The second side can be located opposite the first side. In this way, the tracks carrying/transporting masks and the substrate 16 move within a vacuum portion of the vacuum processing apparatus 40 (from one vacuum chamber 12 to another), whereas the track which carries the mask shield 14 or shielding arrangement can transport the mask shield 14 to an outside of the vacuum chamber 12.

[0048] As shown in Fig. 6A, a vacuum seal (reference numeral 10 in Fig. 2) can be provided, e.g. at the second side of the vacuum chamber 12. The vacuum seal can include a portal or door 69. The door 69 can seal the vacuum chamber. The door can be provided in an open or closed position. Fig. 6A shows the door in an open position. According to some embodiments, which can be combined with other embodiments described herein, the door can be moved from an open position to a closed position and vice versa by a movement parallel to the wall of the vacuum chamber, for example, the wall of the second side of the vacuum chamber.

[0049] In a further embodiment, the present application discloses that the third transportation track 13-3 of the vacuum processing apparatus 40 can have a lower part and an upper part. In other embodiments, the third transportation track 13-3 can have a lower part and an upper part inside the vacuum chamber 12 and a lower part and an upper part outside the vacuum chamber 12.

[0050] Inner and outer portions of the third transportation track 13-3 can be arranged in such a manner that the inner and outer portions of the third transportation track 13-3 can form a preferably continuous, uninterrupted upper and lower track, leading from inside the vacuum chamber to outside of the vacuum chamber. In this way, the mask shield 14 can be moved in a smooth and comfortable way out of the vacuum chamber 12 for maintenance purpose.

[0051] In further embodiments of the vacuum processing apparatus 40, the mask shield 14 can have at least a first portion, separable from a second portion.

[0052] A not limiting example of a vacuum processing apparatus 40 is shown in Fig. 4. The apparatus can include a multitude of described vacuum chambers 12. The vacuum chambers 12 can be connected to vacuum chambers 41 which can be adapted to transport e.g. substrates on substrate carriers and masks on mask carriers. In general, if no service is conducted, the vacuum processing apparatus 40 contains a vacuum for a coating process of the substrates.

[0053] In case maintenance is provided, e.g. cleaning, a respective vacuum chamber 12 can be pressurized. The vacuum in the respective chamber can be replaced by air, so that the chamber may have environmental air pressure. The connection to any other chamber e.g. vacuum chamber 41, can be sealed with a seal or valve 10 so that the vacuum for the rest of the vacuum processing apparatus 40 is maintained. Processing is possible in the other portions of the vacuum processing system.

[0054] If a vacuum chamber 12 is in accordance with an embodiment of the present disclosure, see e.g. Fig. 2, it may be possible to perform e.g. service on a mask shield without affecting the running process. Since the mask shield can be transported on track (third transportation track 13-3) for the mask shield, the mask shield 14 can be handled independently from mask and substrate. A mask can remain in the process as the mask is not fixedly connected to the mask shield.

[0055] In general, a mask shield needs another cleaning cycle as a mask. Cleaning is to be understood that evaporated material which has contaminated the mask shield 14 or mask carrier 37 is removed. It is not always necessary to clean the mask if the mask shield is cleaned and vice versa. By the possibility to perform any service independently for a mask or a mask shield, downtimes or idle times of vacuum processing apparatus 40 can be improved.

[0056] A track arrangement in a vacuum processing apparatus 40 is disclosed in another embodiment of the present application. The track arrangement can include a first transportation track 13-1 for transporting a substrate 16 in a vacuum chamber 12 of the vacuum processing apparatus 40. The track arrangement can further include a second transportation track 13-2 for transporting a mask in the vacuum chamber 12 of the vacuum processing apparatus 40. The track arrangement can further include a third transportation track 13-3 for transporting a mask shield 14 in the vacuum chamber 12 of the vacuum processing apparatus 40. [0057] A second track arrangement, similar or equal to the first track arrangement 13, can be provided in the vacuum chamber 12 of the vacuum processing apparatus 40 in a mirror-inverted manner. The first and/or the second track arrangement can be provided to a multitude of vacuum chambers 12 as shown in Fig. 4. First and second transport tracks can be adapted to be provided only in the vacuum area of the vacuum processing apparatus 40.

[0058] The third transport track may be provided in a vacuum chamber 12. Further, the third transportation track may be extended or extendable outside of a vacuum chamber. The third transportation track 13-3 can be used for maintenance and cleaning operations on the mask shield 14. [0059] When the mask shield 14 is serviced/maintained or cleaned, substrate 16 and the mask on the first and second transportation track 13-2 may be transferred from vacuum chamber 12 to an adjacent vacuum chamber 41 through a second opening 11 or valve 10 (Fig. 1, 2, 4) in the vacuum chamber 12, which can be closed afterwards with a vacuum valve 10. E.g. a cleaning or unloading of the mask shield 14 from vacuum chamber 12 can be performed when a processing (coating etc.) in vacuum chamber 12 has finished.

[0060] Substrate and mask can remain in a running process. Treatment of the substrates can be performed in other vacuum chambers, where cleaning or service on the mask shields 14 is not conducted.

[0061] The process can be continuously maintained since the third transport track allows for an unloading of a mask shield 14, independently from substrate or substrate carrier 36 and/or mask or mask carrier 37.

[0062] In another embodiment of the present application, the third transportation track 13-3 of the track arrangement can be adapted to transport the mask shield 14 from an inside of the vacuum chamber 12 to an outside of the vacuum chamber 12. This can be done, e.g. for reasons of cleaning or maintenance. The track arrangement can be such that the third transportation track 13-3 can be configured to move the mask shield 14 between a deposition source 33 inside the vacuum chamber 12 and the mask.

[0063] In another embodiment, the track arrangement can be such that the third transportation track 13-3 can be adapted to be capable to align the mask shield 14 relative to the mask in such a way that the mask shield 14 at least partially shields the mask to reduce a contamination of a mask carrier 37.

[0064] It may be possible that coating material enters a gap 31 (Fig. 3 A, 3B) between the mask shield 14 and the mask carrier 37 and contaminates the mask carrier 37. For example, in the first position that is depicted in Fig. 3 A, 3B, the gap 31 has a larger width in a first direction Z as compared to a second position. Accordingly, coating material from a deposition source 33 may impinge on the mask carrier 37 such that the mask carrier 37 may get contaminated by the coating material entering said gap 31. Further, coating material entering said gap 31 may contaminate an inner wall of the vacuum chamber 12 and/or other devices or objects in the vacuum chamber 12.

[0065] The deposition result may be negatively affected by coating material, which does not impinge on the substrate 16 through the coating window that is defined by the mask. Further, contaminated surfaces of the vacuum chamber 12 and of the mask carrier 37 may be frequently cleaned which may lead to additional costs and frequent downtimes of the deposition system.

[0066] Accordingly, an alignment system can e.g. be provided to move the mask and the substrate to the third transportation track 13-3 arrangement. Further, the mask shield 14 transported by the third transportation track 13-3 and the mask carrier 37, which carries a mask, may be aligned. Mask carrier 37 with mask and mask shield 14 can be movable relative to each other. The mask carrier may according to some embodiments, which can be combined with other embodiments described herein moved towards the mask shield. In another embodiment, the third transportation track 13-3 can be such that the transportation track for transporting a mask shield 14 can include an alignment system which can be adapted to move the mask shield 14 in an x- y- and z- direction.

[0067] A further embodiment discloses a mask shield 14. The mask shield 14 can be arranged on a transportation track of a vacuum processing apparatus 40. The shield frame l4can include of at least one sheet metal shield covering a side of the mask carrier and/or a mask frame and/or a side shield covering an edge of the mask carrier. The sheet metal shield and the side shield may form an angle of at least 70°. In other embodiments, the mask shield 14 can include a single shield. Disassembly of the mask shield 14 and cleaning may be facilitated. In other embodiments, the mask shield 14 may include a one-piece plate component including an opening 30, particularly an essentially rectangular opening 30 as shown in Figs. 3A and 3B. Such an arrangement allows for maintenance and service of the mask shield 14. [0068] A further embodiment discloses that the mask shield 14, according to any of the previous disclosed embodiments, can be configured to be aligned relative to a mask in a vacuum chamber 12 in the vacuum processing apparatus 40. For this purpose, an alignment system may be provided to the mask shield 14 of the third transportation track 13-3 which carries the mask shield 14. [0069] In yet another embodiment, it is disclosed that the mask shield 14, according to any of the embodiments disclosed before, can be configured such that the mask shield 14 and the transportation track are configured in a way that the mask shield 14 can be moved at least partially outside the vacuum chamber 12 (Figs 2 and 6).

[0070] The third transportation track 13-3 can be provided with a first part (Figs. 6A-6B) within the vacuum chamber 12 and with a second part (60a, 13-3, 60b) which can be provided outside the vacuum chamber 12. Both parts can be combined to form a transportation track with which a mask shield 14 can be moved out of vacuum chamber 12 to an outside of the vacuum chamber 12 through an opening in the vacuum chamber.

[0071] Each of inner and outer part of the third transportation track 13-3 can consist of or include an upper and a lower portion. The mask shield 14 can therefore be supported on an upper and lower portion of mask shield 14, so that the mask shield can be supported in a stable position. The outside upper part 60a of the third transportation track can be arranged in movable manner. The outside upper part can e.g. be arranged in a manner so that the outside upper part can be movable around a pivot axis 61 as shown in Fig. 6A. In such an arrangement, a person performing the maintenance can be better protected against injuries from potentially sharp edges on the parts of the transportation track.

[0072] The inner and outer parts of the third transportation track can be arranged in such a manner that inner and outer portions of the track form a preferably continuous and uninterrupted upper and lower track. In this way, the mask shield 14 can be moved in a smooth way out of the vacuum chamber 12.

[0073] According to some aspects also a track for movement of a deposition source 33 (see e.g. deposition source 33 in Fig. 2) can have a second source track portion outside of the vacuum chamber. For example, the second source track portion outside of the vacuum chamber can be provided at a second side of the vacuum chamber, which is opposite to a first side of the vacuum chamber at which the vacuum chamber is connected to a further vacuum chamber. Accordingly, a deposition source can be moved out of the vacuum chamber for maintenance of the deposition source. This has the advantage that personal does not need to enter the vacuum chamber for maintenance of the deposition source and/or the mask shield. In light of the above, even though the vacuum in the vacuum chamber may not be maintained during maintenance, the degree of contamination is reduced.

[0074] According to embodiments or aspects of the present disclosure, a service port is provided. The service port includes at least one track extension to move a component of a vacuum processing system outside of a vacuum chamber, e.g. a vacuum processing chamber. For example, the vacuum chamber can be a vacuum chamber 12 as described with respect to Fig. 4. According to typical implementations, the track extension can be configured to move the component outside of the vacuum chamber 12 at a second side opposing the first side, wherein the first side is connected to a further vacuum chamber. According to some embodiments, which can be combined with other embodiments described herein, the component can be a deposition source and/or a fixed mask shield. The at least one track extension allows for maintenance outside of the vacuum chamber. This enables reduced maintenance times and/or reduces contamination of the vacuum chamber. According to yet further modifications, which can be combined with other embodiments described herein, the track extension can be provided outside of the vacuum chamber. The track extension can extend a track within vacuum chamber, such as a track for a mask shield or a track for a deposition source.

[0075] The embodiments described herein can be utilized for apparatuses capable of evaporation on large area substrates, e.g., for OLED display manufacturing. Specifically, the substrates for which the structures and methods according to embodiments described herein are provided are large area substrates, e.g. having a surface area of 0.5 m² or more, particularly 1 m² or more. For instance, a large area substrate or carrier can be GEN 4.5, which corresponds to a surface area of about 0.67 m² (0.73 x 0.92m), GEN 5, which corresponds to a surface area of about 1.4 m² (1.1 m x 1.3 m), GEN 7.5, which corresponds to a surface area of about 4.29 m² (1.95 m x 2.2 m), GEN 8.5, which corresponds to a surface area of about 5.7m² (2.2 m x 2.5 m), or even GEN 10, which corresponds to a surface area of about 8.7 m² (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented. Half sizes of the GEN generations may also be provided in OLED display manufacturing.

[0076] According to some embodiments, which can be combined with other embodiments described herein, substrate thickness can be from 0.1 to 1.8 mm. The substrate thickness can be about 0.9 mm or below, such as 0.5 mm. The term“substrate” as used herein may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. However, the present disclosure is not limited thereto and the term“substrate” may also embrace flexible substrates such as a web or a foil. The term“substantially inflexible” is understood to distinguish over“flexible”. Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.9 mm or below, such as 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[0077] According to embodiments described herein, the substrate may be made of any material suitable for material deposition. For instance, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass, and the like), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.

[0078] The term“masking” may include reducing and/or hindering a deposition of material on one or more regions of the substrate. The masking may be useful, for instance, in order to define the area to be coated. In some applications, parts of the substrate are coated and the parts not to be coated are covered by the mask. [0079] A method for exchanging or maintaining a mask shield 14 in a vacuum processing apparatus 40 is provided in a further embodiment of the present application. It is intended that a cleaning of the mask shield 14 can be performed in a comfortable way. In particular, a down-time of the vacuum processing apparatus 40 or an idle time may be reduced.

[0080] The mask shield 14 can be cleaned, e.g. by temporarily removing the mask shield 14 from the vacuum chamber 12. The mask shield 14 can advantageously be arranged on a third transportation track of the first track arrangement 13.

[0081] In the vacuum chamber 12 of the vacuum processing apparatus 40, a second track arrangement, similar or equal to the first track arrangement 13 can be provided in a mirror- inverted or inverse arrangement.

[0082] The second track arrangement can be adapted to perform the functions of the first track arrangement 13 as described in the following, in an analogue manner. This is, the vacuum chamber 12 can preferably be provided with two substrates/masks/mask shields on opposite positions of the vacuum chamber 12. The deposition source 33 can treat in this way two substrates 16 in the vacuum chamber 12.

[0083] It may be sufficient to clean the mask shield 14 at long time intervals. For example, the mask shield 14 may be unloaded from the vacuum chamber 12 after a deposition time of several days for cleaning. Downtimes of the deposition system can be reduced and cleaning can be facilitated.

[0084] To exchange the mask, e.g. for maintenance or cleaning procedures, the vacuum chamber 12 (see Figs 1, 2, 4 and 6) has to be opened. Prior to opening the vacuum chamber 12, substrates 16 and masks which can be still located in the vacuum chamber 12, can be transferred to an adjacent vacuum chamber 41 (Fig. 2, 4). The transfer can take place under vacuum conditions.

[0085] Transfer can be performed with the first track arrangement 13, preferably with the first transportation tracks 13-1 and second transportation tracks 13-2 of the first track arrangement 13, which are adapted to transfer substrates 16 or a mask in the vacuum chamber 12. When transfer to an adjacent vacuum chamber 41 has been finished, a connection between the two adjacent chambers (Fig. 4, 12, 41) can be sealed airtight with a valve 10, arranged between the two adjacent vacuum chambers, so that a vacuum condition in the vacuum process apparatus 40 is maintained.

[0086] A deposition source 33 may remain in the vacuum chamber 12 and can be transferred 702 to a safety position (back position). The deposition source 33 may be movable along a source transportation track which may be provided in the vacuum chamber 12.

[0087] The vacuum chamber 12 can be opened 704, particularly when the vacuum inside the vacuum chamber 12 is equalized to environmental air pressure. An upper part 60a of the third transportation track 13-3 arranged on the outside the vacuum chamber 12, can be moved and brought to an essentially horizontal position, so that an upper first part of the third transportation track 13-3 inside the vacuum chamber 12 and an upper second part outside the vacuum chamber 12 are flush.

[0088] A first portion of the mask shield 14 can now be slid out 706 of the vacuum chamber 12. First shields from the first portion of the mask shield 14 can be disassembled 708 for cleaning. A second portion of the mask shield 14 can be slid out of the vacuum chamber 12 and remaining second shields of the mask shield 14 can be disassembled 708 for service or cleaning purposes.

[0089] In other embodiments, the mask shield 14 can be provided as a single piece and can therefore be disassembled as a whole.

[0090] By this method, down or idle times can be kept low. Cleaning cycles of masks and mask shields 14 are different. A mask has to be cleaned more often compared to a mask shield 14. In previous systems, where mask and mask shields 14 were more or less fixedly connected, the mask shield 14 was also concerned, when the mask had to be cleaned.

[0091] The present application can enable that masks and mask shields 14 can be cleaned separately and independently from each other. It is therefore possible that a mask and a respective substrate can be processed in the vacuum processing apparatus, even if the mask shield 14 in a vacuum chamber 12 needs to be cleaned. [0092] Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0093] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A vacuum processing apparatus, comprising: a vacuum chamber; a deposition source provided in the vacuum chamber; a first track arrangement, comprising: a first transportation track adapted to transport a substrate into a vacuum chamber; a second transportation track, adapted to transport a mask into a vacuum chamber; and a third transportation track, adapted to transport a mask shield between the deposition source and the mask to reduce contamination of the mask.

2. The vacuum processing apparatus according to claim 1, wherein the third transportation track is adapted to transport the mask shield outside the vacuum chamber.

3. The vacuum processing apparatus according to claim 2, wherein the third transportation track has a lower part and an upper part.

4. The vacuum processing apparatus according to any of the preceding claims, wherein the third transportation track has a lower part and an upper part inside the vacuum chamber and a lower part and an upper part outside the vacuum chamber.

5. The vacuum processing apparatus according to any of the preceding claims, wherein the upper part of the third track outside the vacuum chamber is movable.

6. The vacuum processing apparatus according to any of the preceding claims, wherein the mask shield has at least a first portion, separable from a second portion.

7. The vacuum processing apparatus according to any of the preceding claims, wherein the third transportation track is configured to align the mask shield relative to the mask.

8. A track arrangement in a vacuum processing apparatus, comprising: a first transportation track, for transporting a substrate in a vacuum chamber of the vacuum processing apparatus, a second transportation track, for transporting a mask in the vacuum chamber of the vacuum processing apparatus; and a third transportation track for transporting a mask shield in the vacuum chamber of the vacuum processing apparatus.

9. The track arrangement according to claim 8, wherein the third transportation track is adapted to transport the mask shield from an inside of the vacuum chamber to an outside of the vacuum chamber.

10. The track arrangement according to any of the preceding claims 8 to 9, wherein the third transportation track is configured to move the mask shield between a deposition source inside the vacuum chamber and the mask.

11. The track arrangement according to any of claims 8 to 10, wherein the third transportation track is configured to align the mask shield relative to the mask such that the mask shield at least partially shields the mask to reduce a contamination of a mask carrier.

12. The track arrangement according to any of claims 8 to 11, wherein the third transportation track for transporting a mask shield comprises an alignment system adapted to move the mask shield in an x- y- and z- direction.

13. A mask shield arranged on a transportation track of a vacuum processing apparatus comprising a shield frame, wherein the shield frame comprises at least one sheet metal shield covering a side of the mask carrier and/or a mask frame and comprises a side shield covering an edge of the mask carrier.

14. The mask shield according to claim 13, wherein the mask shield is configured to be aligned relative to a mask in a vacuum chamber in the vacuum processing apparatus.

15. The mask shield according to claim 14, wherein the mask shield and the transportation track are configured such that the mask shield can be moved at least partially outside the vacuum chamber.

16. A method to exchange a mask shield for a vacuum processing apparatus, comprising bringing a deposition source, provided in the vacuum chamber, to a back position; opening a valve of the vacuum chamber; sliding a first portion of the mask shield out of the vacuum chamber; disassembling first shields from the first portion of the mask shield;

sliding a second portion of the mask shield out of the vacuum chamber; and disassembling second shields from the second portion of the mask shield.