WO2020020009A1 - 电路板组件及终端 - Google Patents

电路板组件及终端 Download PDF

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Publication number
WO2020020009A1
WO2020020009A1 PCT/CN2019/096084 CN2019096084W WO2020020009A1 WO 2020020009 A1 WO2020020009 A1 WO 2020020009A1 CN 2019096084 W CN2019096084 W CN 2019096084W WO 2020020009 A1 WO2020020009 A1 WO 2020020009A1
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WO
WIPO (PCT)
Prior art keywords
capacitor
circuit board
board assembly
out area
trace
Prior art date
Application number
PCT/CN2019/096084
Other languages
English (en)
French (fr)
Inventor
刘广辉
肖石文
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to EP19842040.8A priority Critical patent/EP3829270A4/en
Publication of WO2020020009A1 publication Critical patent/WO2020020009A1/zh
Priority to US17/152,638 priority patent/US11582863B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Definitions

  • the present disclosure relates to the field of communication technologies, and in particular, to a circuit board assembly and a terminal.
  • terminals have become an indispensable tool in people's lives, and have brought great convenience to all aspects of users' lives.
  • the terminal may be interfered by high-frequency noise, and the high-frequency noise passing through the line on the terminal may affect some components on the terminal, such as antennas, thus affecting these components.
  • Embodiments of the present disclosure provide a circuit board assembly and a terminal to solve a problem that high-frequency noise easily affects some components on the terminal through a line on the terminal.
  • an embodiment of the present disclosure provides a circuit board assembly including: a circuit board and a trace disposed on the circuit board; wherein the trace includes a first portion and a second portion; A line width of one portion is greater than or equal to a threshold line width, and a line width of the second portion is smaller than the threshold line width.
  • an embodiment of the present disclosure further provides a terminal, including the circuit board assembly described above.
  • a circuit board assembly includes: a circuit board and a trace disposed on the circuit board; wherein the trace includes a first portion and a second portion; and a line width of the first portion is large
  • the line width of the second portion is less than or equal to the threshold line width. In this way, the line width of some traces is smaller than the preset threshold line width, which increases the high-frequency impedance and reduces the influence of high-frequency signals on some other components.
  • FIG. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure.
  • FIG. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure.
  • the circuit board 1 includes a circuit board 1 and a trace 2 disposed on the circuit board 1. It includes a first part and a second part; a line width of the first part is greater than or equal to a threshold line width, and a line width of the second part is smaller than the threshold line width.
  • the above-mentioned wiring 2 may be a wiring between a charging interface and a charging conversion device, or may also be a wiring of some low-frequency signals, such as a wiring of a camera power network and a wiring of a display power network. , The routing of the touch screen power network or the routing of the fingerprint power network, and so on. Because the line width of the second part is smaller than the threshold line width, the equivalent coupling capacitance between trace 2 and ground becomes smaller, and even there is no equivalent coupling capacitance, and the high-frequency impedance is improved. Because the high-frequency impedance is improved, trace 2 can well suppress high-frequency noise, thereby reducing the impact of high-frequency signals on some other components.
  • the above-mentioned threshold line width can be adjusted differently according to the actual situation, and the specific value of the threshold line width is not limited in this embodiment of the present disclosure.
  • the second part may exist at any position of the entire trace 2, for example, at the middle of the entire trace 2, or at one end of the entire trace, or at the other end of the entire trace, etc. The embodiments of the present disclosure are not limited.
  • the circuit board assembly by reducing the line width of part of the trace 2 to a preset threshold line width, firstly, the influence of high-frequency signals on some components can be well reduced; secondly, the cost is also low, and Save the cost of the terminal.
  • the terminal may be a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), or a mobile Internet device (MID). Or wearable device (Wearable Device) and so on.
  • PDA personal digital assistant
  • MID mobile Internet device
  • MID wearable device
  • the trace 2 is a trace connected between the charging interface and the charging conversion device.
  • the charging interface may be a USB Type-C interface, or may be a micro USB interface.
  • the above-mentioned trace 2 is a trace connected between the charging interface and the charging conversion device. Since the line width of the second part is smaller than the threshold line width, the equivalent coupling capacitance between the trace 2 and the ground becomes smaller, or even Without equivalent coupling capacitance, high frequency impedance is improved. In addition, since the high-frequency impedance is improved, it is difficult for the high-frequency signal (ie, high-frequency noise) generated by the charging conversion device to reach the antenna through the trace 2, which reduces the influence of the high-frequency signal on the antenna, thereby improving the receiving sensitivity of the antenna.
  • the high-frequency signal ie, high-frequency noise
  • the antenna may be an upper antenna of the terminal, a lower antenna of the terminal, or an upper antenna and a lower antenna of the terminal.
  • the circuit board assembly further includes a first hollowed out area 21 and a second hollowed out area 22, and the first hollowed out area 21 and the second hollowed out area 22 are respectively located opposite to the second part. On both sides.
  • the shapes of the first hollowed-out area 21 and the second hollowed-out area 22 may be the same or different.
  • the shape of the first hollowed-out area 21 or the second hollowed-out area 22 may be rectangular, oval, or some other shape, etc., which is not limited in this embodiment.
  • the existence of the first hollowed-out area 21 and the second hollowed-out area 22 is equivalent to increasing the high-frequency impedance of trace 2. This can reduce the impact of high-frequency signals generated by the charging conversion device on the antenna and improve the receiving sensitivity of the antenna. .
  • the circuit board assembly further includes an auxiliary trace provided between the circuit board 1 and the second portion, and the auxiliary trace is electrically connected to the trace 2.
  • the line width of some of the traces 2 is smaller than a preset threshold line width, the width of the traces 2 becomes narrower, and the DC resistance becomes larger.
  • an auxiliary trace can be added between the circuit board 1 and the second part to compensate the DC resistance, so that the DC resistance does not increase. While reducing the DC resistance, the energy loss in the DC resistance is also reduced, which can save the energy consumption of the terminal.
  • the above-mentioned auxiliary wiring may be disposed on any layer of the circuit board, which is not limited in this embodiment.
  • first hollowed-out area 21 and the second hollowed-out area 22 are both rectangular areas; the length of the first hollowed-out area 21 along the extending direction of the line is equal to the auxiliary line The line width of the auxiliary trace is equal to the sum of the width of the first hollowed-out area 21 and the width of the second hollowed-out area 22.
  • the length of the first hollowed-out area 21 along the extension direction of the line may be equal to the length of the second hollowed-out area 22 along the extension direction of the line.
  • the length of the first hollowed-out area 21 along the extending direction of the trace is equal to the length of the auxiliary trace, and the line width of the auxiliary trace is equal to the width of the first hollowed-out region 21 and the second
  • the sum of the width of the hollowed-out area 22 compensates the DC resistance of the second part, thereby ensuring that the DC resistance of the second part is unchanged.
  • the first portion includes a first end portion and a second end portion
  • the second portion is located between the first end portion and the second end portion.
  • the first end portion may be an end close to the charging conversion device, or may be an end close to the charging interface.
  • the second end When the first end is close to the charging conversion device, the second end may be close to the charging interface; when the first end is close to the charging interface, the second end may be close to the charging conversion One end of the device.
  • the second portion is located between the first end portion and the second end portion, so that the second portion can have a good blocking effect on high-frequency signals and prevent the high-frequency signals generated by the charging conversion device from affecting the antenna. .
  • the circuit board assembly further includes a first capacitor 3 and a second capacitor 4 attached to the first end portion; an upper pin of the first capacitor 3 is grounded, and the first capacitor 3
  • the lower pin of the second capacitor 4 is electrically connected to the first end; the upper pin of the second capacitor 4 is electrically connected to the first end, and the lower pin of the second capacitor 4 is grounded.
  • the upper pin of the first capacitor 3 is grounded, and the lower pin of the first capacitor 3 is electrically connected to the first end; the upper pin of the second capacitor 4 is connected to the first end.
  • the second capacitor 4 is electrically connected, and the lower pin of the second capacitor 4 is grounded. Therefore, the directions of the current loops generated by the first capacitor 3 and the second capacitor 4 are exactly opposite. When placed close to each other, the generated high-frequency magnetic field portions can cancel each other, increasing the high-frequency filtering effect, that is, increasing the high-frequency signal insertion loss.
  • the circuit board assembly further includes a first through hole on an upper pin of the first capacitor 3 and a second through hole on a lower pin of the second capacitor 4; An upper pin of a capacitor 3 is grounded through the first through hole; a lower pin of the second capacitor 4 is grounded through the second through hole.
  • the first pin of the first capacitor 3 is provided with a first through hole, thereby facilitating the upper pin of the first capacitor 3 to be grounded through the first through hole; the lower pin of the second capacitor 4 is provided There is a second through hole, so that the lower pin of the second capacitor 4 is easily grounded through the second through hole.
  • the ground here may be ground connected to other layers, which is not limited in this embodiment.
  • the circuit board assembly further includes a third capacitor 5 and a fourth capacitor 6 attached to the second end portion; an upper pin of the third capacitor 5 is grounded, and the third capacitor 5
  • the lower pin of the fourth capacitor 6 is electrically connected to the second end; the upper pin of the fourth capacitor 6 is electrically connected to the second end, and the lower pin of the fourth capacitor 6 is grounded.
  • the upper pin of the third capacitor 5 is grounded, and the lower pin of the third capacitor 5 is electrically connected to the second end; the upper pin of the fourth capacitor 6 is connected to the second end. And the lower pin of the fourth capacitor 6 is grounded. Therefore, the directions of the current loops generated by the third capacitor 5 and the fourth capacitor 6 are exactly opposite. When placed close to each other, the generated high-frequency magnetic field portions can cancel each other, increasing the high-frequency filtering effect, that is, increasing the high-frequency signal insertion loss.
  • the circuit board assembly further includes a third through hole located on an upper pin of the third capacitor 5 and a fourth through hole located on a lower pin of the fourth capacitor 6;
  • the upper pin of the three capacitors 5 is grounded through the third through hole; the lower pin of the fourth capacitor 6 is grounded through the fourth through hole.
  • a third through hole is provided on the upper pin of the third capacitor 5, so that the upper pin of the third capacitor 5 is grounded through the third through hole; the lower pin of the fourth capacitor 6 is provided.
  • the ground here may be ground connected to other layers, which is not limited in this embodiment.
  • a circuit board assembly includes a circuit board 1 and a trace 2 disposed on the circuit board 1, and the trace 2 is a trace connected between a charging interface and a charging conversion device; Wherein, the line width of some of the traces 2 is smaller than a preset threshold line width. In this way, because the line width of some traces 2 is smaller than a preset threshold line width, the high-frequency impedance is increased, and the influence of high-frequency signals on some other components is reduced.
  • An embodiment of the present disclosure further provides a terminal including the circuit board assembly described above.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Telephone Set Structure (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本公开提供一种电路板组件及终端，该电路板组件包括：电路板和设置于所述电路板上的走线；其中，所述走线包括第一部和第二部；所述第一部的线宽大于或等于阈值线宽，所述第二部的线宽小于所述阈值线宽。

Description

电路板组件及终端
相关申请的交叉引用
本申请主张在2018年7月23日在中国提交的中国专利申请No.201810811369.9的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信技术领域，尤其涉及一种电路板组件及终端。
背景技术
随着终端技术的迅速发展，终端已经成为人们生活中必不可少的一种工具，并且为用户生活的各个方面带来了极大的便捷。终端在某些情况下可能会受到高频噪声的干扰，而高频噪声经过终端上的线路可能会影响到终端上的一些元器件，例如天线，从而对这些元器件造成影响。
可见，相关技术中高频噪声经过终端上的线路容易对终端上的一些元器件造成影响。
发明内容
本公开实施例提供一种电路板组件及终端，以解决高频噪声经过终端上的线路容易对终端上的一些元器件造成影响的问题。
为了解决上述技术问题，本公开是这样实现的：
第一方面，本公开实施例提供了一种电路板组件，包括：电路板和设置于所述电路板上的走线；其中，所述走线包括第一部和第二部；所述第一部的线宽大于或等于阈值线宽，所述第二部的线宽小于所述阈值线宽。
第二方面，本公开实施例还提供一种终端，包括上述电路板组件。
本公开实施例的一种电路板组件，包括：电路板和设置于所述电路板上的走线；其中，所述走线包括第一部和第二部；所述第一部的线宽大于或等于阈值线宽，所述第二部的线宽小于所述阈值线宽。这样，由于部分走线的线宽小于预先设定的阈值线宽，提高了高频阻抗，降低了高频信号对其他一 些元器件的影响。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本公开实施例提供的电路板组件的结构示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
参见图1，图1是本公开实施例提供的电路板组件的结构示意图，如图1所示，包括：电路板1和设置于所述电路板1上的走线2，所述走线2包括第一部和第二部；所述第一部的线宽大于或等于阈值线宽，所述第二部的线宽小于所述阈值线宽。
本公开实施例中，上述走线2可以是充电接口与充电转换器件之间的走线，或者也可以是一些低频信号的走线，如摄像头电源网络的走线、显示屏电源网络的走线、触摸屏电源网络的走线或者指纹电源网络的走线等等。由于上述第二部的线宽小于所述阈值线宽，这样走线2与地之间的等效耦合电容变小，甚至没有等效耦合电容，高频阻抗得以提高。又由于高频阻抗被提高，走线2可以很好的抑制高频噪声，从而降低了高频信号对其他一些元器件的影响。
需要说明的是，上述阈值线宽可以根据实际的情况作出不同的调整，对此本公开实施例并不限定阈值线宽的具体数值。并且，上述第二部，可以存在于整个走线2的任何位置，例如位于整个走线2的中间的位置，或者位于整个走线的一端，或者位于整个走线的另一端等等，对此本公开实施例不作 限定。
本公开实施例的电路板组件，通过将部分走线2的线宽小于预先设定的阈值线宽，首先可以很好的降低高频信号对一些元器件的影响；其次成本也很低，可以节省终端的成本。
本公开实施例中，上述终端可以是手机、平板电脑(Tablet Personal Computer)、膝上型电脑(Laptop Computer)、个人数字助理(personal digital assistant，PDA)、移动上网装置(Mobile Internet Device，MID)或可穿戴式设备(Wearable Device)等等。
可选地，所述走线2为连接于充电接口与充电转换器件之间的走线。
本实施方式中，上述充电接口可以是USB Type-C接口，或者也可以是micro USB接口。上述走线2为连接于充电接口与充电转换器件之间的走线，由于第二部的线宽小于所述阈值线宽，这样走线2与地之间的等效耦合电容变小，甚至没有等效耦合电容，高频阻抗得以提高。又由于高频阻抗被提高，充电转换器件产生的高频信号(即高频噪声)很难通过走线2到达天线，降低了该高频信号对天线的影响，从而可以提升天线的接收灵敏度。
需要说明的是，上述天线可以是终端的上天线，可以是终端的下天线，或者也可以包括终端的上天线和下天线等等。
可选地，所述电路板组件还包括第一挖空区域21和第二挖空区域22，所述第一挖空区域21和所述第二挖空区域22分别位于所述第二部相对的两侧。
本实施方式中，上述第一挖空区域21和第二挖空区域22的形状可以相同，也可以不同。而第一挖空区域21或者第二挖空区域22的形状，可以是矩形、椭圆形或者一些其他的形状等等，对此本实施方式不作限定。由于第一挖空区域21和第二挖空区域22的存在，相当于提高了走线2的高频阻抗，从而可以降低充电转换器件产生的高频信号对天线的影响，提升天线的接收灵敏度。
可选地，所述电路板组件还包括设置于所述电路板1与所述第二部之间的辅助走线，所述辅助走线与所述走线2电连接。
本实施方式中，由于部分所述走线2的线宽小于预先设定的阈值线宽， 走线2的宽度变窄，直流电阻会变大。这样就可以在电路板1与所述第二部之间增加辅助走线，以补偿直流电阻，使直流电阻不会变大。在降低直流电阻的同时，也降低了在直流电阻上的能量损耗，可以节约终端的能耗。当然，上述辅助走线可以设置在电路板的任意一层，对此本实施方式不作限定。
可选地，所述第一挖空区域21和所述第二挖空区域22均为矩形区域；所述第一挖空区域21沿着所述走线延伸方向的长度等于所述辅助走线的长度；所述辅助走线的线宽等于所述第一挖空区域21的宽度和所述第二挖空区域22的宽度之和。
本实施方式中，上述第一挖空区域21沿着所述走线延伸方向的长度可以等于第二挖空区域22沿着所述走线延伸方向的长度。上述第一挖空区域21沿着所述走线延伸方向的长度等于所述辅助走线的长度，且上述辅助走线的线宽等于所述第一挖空区域21的宽度和所述第二挖空区域22的宽度之和，补偿了第二部的直流电阻，从而保证了第二部的直流电阻不变。
可选地，所述第一部包括第一端部和第二端部，所述第二部位于所述第一端部和所述第二端部之间。
本实施方式中，上述第一端部可以是靠近充电转换器件的一端，或者也可因是靠近充电接口的一端。当第一端部为靠近充电转换器件的一端时，第二端部就可以为靠近充电接口的一端；当第一端部为靠近充电接口的一端时，第二端部就可以为靠近充电转换器件的一端。上述第二部位于所述第一端部和所述第二端部之间，从而第二部可以对高频信号产生很好的阻挡作用，防止充电转换器件产生的高频信号对天线产生影响。
可选地，所述电路板组件还包括贴设于所述第一端部上的第一电容3和第二电容4；所述第一电容3的上管脚接地，所述第一电容3的下管脚与所述第一端部电连接；所述第二电容4的上管脚与所述第一端部电连接，所述第二电容4的下管脚接地。
本实施方式中，上述第一电容3的上管脚接地，上述第一电容3的下管脚与所述第一端部电连接；上述第二电容4的上管脚与所述第一端部电连接，上述第二电容4的下管脚接地。从而第一电容3和第二电容4产生的电流环路方向正好相反，当相互靠近放置时，所产生的高频磁场部分可以相互抵消， 增加高频滤波效果，即增加高频信号插损。
可选地，所述电路板组件还包括位于所述第一电容3的上管脚上的第一通孔和位于所述第二电容4的下管脚上的第二通孔；所述第一电容3的上管脚通过所述第一通孔接地；所述第二电容4的下管脚通过所述第二通孔接地。
本实施方式中，上述第一电容3的上管脚设置有第一通孔，从而便于第一电容3的上管脚通过所述第一通孔接地；上述第二电容4的下管脚设置有第二通孔，从而便于第二电容4的下管脚通过所述第二通孔接地。当然，这里的接地可以是接到其它层的地，对此本实施方式不作限定。
可选地，所述电路板组件还包括贴设于所述第二端部上的第三电容5和第四电容6；所述第三电容5的上管脚接地，所述第三电容5的下管脚与所述第二端部电连接；所述第四电容6的上管脚与所述第二端部电连接，所述第四电容6的下管脚接地。
本实施方式中，上述第三电容5的上管脚接地，上述第三电容5的下管脚与所述第二端部电连接；上述第四电容6的上管脚与所述第二端部电连接，上述第四电容6的下管脚接地。从而第三电容5和第四电容6产生的电流环路方向正好相反，当相互靠近放置时，所产生的高频磁场部分可以相互抵消，增加高频滤波效果，即增加高频信号插损。
可选地，所述电路板组件还包括位于所述第三电容5的上管脚上的第三通孔和位于所述第四电容6的下管脚上的第四通孔；所述第三电容5的上管脚通过所述第三通孔接地；所述第四电容6的下管脚通过所述第四通孔接地。
本实施方式中，上述第三电容5的上管脚设置有第三通孔，从而便于第三电容5的上管脚通过所述第三通孔接地；上述第四电容6的下管脚设置有第四通孔，从而便于第四电容6的下管脚通过所述第四通孔接地。当然，这里的接地可以是接到其它层的地，对此本实施方式不作限定。
本公开实施例的一种电路板组件，包括：电路板1和设置于所述电路板1上的走线2，所述走线2为连接于充电接口与充电转换器件之间的走线；其中，部分所述走线2的线宽小于预先设定的阈值线宽。这样，由于部分走线2的线宽小于预先设定的阈值线宽，提高了高频阻抗，降低了高频信号对其他一些元器件的影响。
本公开实施例还提供一种终端，包括上述电路板组件。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上面结合附图对本公开的实施例进行了描述，但是本公开并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本公开的启示下，在不脱离本公开宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本公开的保护之内。

Claims (11)

  1. 一种电路板组件，包括：电路板和设置于所述电路板上的走线；其中，所述走线包括第一部和第二部；所述第一部的线宽大于或等于阈值线宽，所述第二部的线宽小于所述阈值线宽。
  2. 根据权利要求1所述的电路板组件，其中，所述走线为连接于充电接口与充电转换器件之间的走线。
  3. 根据权利要求2所述的电路板组件，其中，所述电路板组件还包括第一挖空区域和第二挖空区域，所述第一挖空区域和所述第二挖空区域分别位于所述第二部相对的两侧。
  4. 根据权利要求3所述的电路板组件，其中，所述电路板组件还包括设置于所述电路板与所述第二部之间的辅助走线，所述辅助走线与所述走线电连接。
  5. 根据权利要求4所述的电路板组件，其中，所述第一挖空区域和所述第二挖空区域均为矩形区域；所述第一挖空区域沿着所述走线延伸方向的长度等于所述辅助走线的长度；所述辅助走线的线宽等于所述第一挖空区域的宽度和所述第二挖空区域的宽度之和。
  6. 根据权利要求1至5中任一项权利要求所述的电路板组件，其中，所述第一部包括第一端部和第二端部，所述第二部位于所述第一端部和所述第二端部之间。
  7. 根据权利要求6所述的电路板组件，其中，所述电路板组件还包括贴设于所述第一端部上的第一电容和第二电容；所述第一电容的上管脚接地，所述第一电容的下管脚与所述第一端部电连接；所述第二电容的上管脚与所述第一端部电连接，所述第二电容的下管脚接地。
  8. 根据权利要求7所述的电路板组件，还包括位于所述第一电容的上管脚上的第一通孔和位于所述第二电容的下管脚上的第二通孔；所述第一电容的上管脚通过所述第一通孔接地；所述第二电容的下管脚通过所述第二通孔接地。
  9. 根据权利要求6所述的电路板组件，其中，所述电路板组件还包括贴 设于所述第二端部上的第三电容和第四电容；所述第三电容的上管脚接地，所述第三电容的下管脚与所述第二端部电连接；所述第四电容的上管脚与所述第二端部电连接，所述第四电容的下管脚接地。
  10. 根据权利要求9所述的电路板组件，还包括位于所述第三电容的上管脚上的第三通孔和位于所述第四电容的下管脚上的第四通孔；所述第三电容的上管脚通过所述第三通孔接地；所述第四电容的下管脚通过所述第四通孔接地。
  11. 一种终端，包括权利要求1至10中任一项所述的电路板组件。
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