WO2020015440A1 - 阵列基板及其制造方法、显示装置 - Google Patents
阵列基板及其制造方法、显示装置 Download PDFInfo
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- WO2020015440A1 WO2020015440A1 PCT/CN2019/085973 CN2019085973W WO2020015440A1 WO 2020015440 A1 WO2020015440 A1 WO 2020015440A1 CN 2019085973 W CN2019085973 W CN 2019085973W WO 2020015440 A1 WO2020015440 A1 WO 2020015440A1
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- array substrate
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
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- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0233—Special features of optical sensors or probes classified in A61B5/00
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/117—Identification of persons
- A61B5/1171—Identification of persons based on the shapes or appearances of their bodies or parts thereof
- A61B5/1172—Identification of persons based on the shapes or appearances of their bodies or parts thereof using fingerprinting
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Definitions
- Embodiments of the present disclosure relate to an array substrate, a manufacturing method thereof, and a display device.
- Display devices such as a liquid crystal display or an electro-organic light emitting diode display usually have a fingerprint recognition function.
- Embodiments of the present disclosure provide an array substrate and a manufacturing method thereof, and a display device including the array substrate.
- the array substrate includes: a base substrate; a plurality of sensing elements disposed on a first side of the base substrate, each sensing element being configured to convert at least one of an optical signal and an acoustic wave signal into an electrical signal; and A plurality of switching devices are disposed on a second side opposite to the first side of the base substrate.
- the switching device includes a plurality of first switching elements, each of which is electrically connected to a sensing element to transmit the electrical signal.
- each sensing element includes a first electrode, a second electrode, and a sensing layer.
- the sensing layer is disposed between the first electrode and the second electrode, and the first electrode and the first electrode A switching element is electrically connected, and the second electrode is used to receive a reference potential.
- the sensing layer includes a photosensitive material or an acoustic material.
- the base substrate includes a plurality of vias, and the first electrode of each sensing element is electrically connected to a first switching element via a via, a diameter of each via and a distance between adjacent vias. The distance between them is not greater than the line distance of the fingerprint of the finger.
- the array substrate includes a display area
- the display area includes a first area and a second area located outside the first area
- the sensing element and the first switching element are located in the first area.
- the switching device further includes a second switching element located in the second region.
- Each of the first switching element and the second switching element includes a thin film transistor, and the first electrode of the sensing element is electrically connected to the first switch.
- the gate of each of the first switching element and the second switching element is used to receive a first control signal to drive a pixel in the display area for a first period of time, and the gate of the first switching element is also used for a second time
- the segment receives a second control signal to enable transmission of the electrical signal.
- the array substrate further includes a metal lead electrically connected to the first electrode of the sensing element, and the metal lead is used for electrical connection with an energy storage element independent of the array substrate.
- the array substrate further includes an electroluminescent element on the second side of the base substrate and electrically connected to the switching device.
- the orthographic projection of the sensing layer on the base substrate does not overlap with the orthographic projection of the non-transmissive area of the first switching element and the electroluminescent element on the base substrate.
- the orthographic projection of the sensing layer on the base substrate and the orthographic projection of the first switching element on the base substrate at least partially overlap.
- the sensing element includes a dielectric layer covering the first electrode, the second electrode, and the sensing layer of the sensing element.
- the array substrate further includes a metal lead electrically connected to the first electrode of the sensing element, and the sensing layer includes a photosensitive material and is configured in a state where the sensing element does not perform fingerprint recognition.
- the received light is converted into an electrical signal, and the metal lead is used to electrically connect with an energy storage element independent of the array substrate to transmit the electrical signal to the energy storage element.
- Another embodiment of the present disclosure provides a display device including the array substrate according to any one of the foregoing embodiments.
- the sensing element is an acoustic wave sensor for converting an acoustic wave signal into an electric signal
- the display device further includes an acoustic wave generator for generating an acoustic wave.
- the display device further includes a rechargeable battery, and the sensing element is also electrically connected to the rechargeable battery.
- the display device further includes a rechargeable battery
- the array substrate further includes a metal lead electrically connected to the first electrode of the sensing element
- the sensing layer includes a photosensitive material and is configured to The sensing element converts the received light into an electrical signal without fingerprint identification
- the metal lead is used to electrically connect with the rechargeable battery to transmit the electrical signal to the rechargeable battery.
- Yet another embodiment of the present disclosure provides a method for manufacturing an array substrate, including: providing a base substrate; and forming a plurality of sensing elements on a first side of the base substrate, each sensing element being configured to Converting at least one of an optical signal and an acoustic wave signal into an electrical signal; forming a plurality of switching devices on a second side opposite to the first side of the base substrate, the switching device including a plurality of first switching elements, each The first switching element is electrically connected to a sensing element to transmit the electrical signal.
- each sensing element includes a first electrode, a second electrode, and a sensing layer located between the first electrode and the second electrode.
- the method for manufacturing an array substrate further includes: forming a substrate in a base substrate; A plurality of vias, and the first electrode of each sensing element is electrically connected to the first switching element via one via.
- the method further includes: forming a dielectric layer on the first side of the base substrate, the dielectric layer covering the first electrode, the second electrode, and the sensing layer of the sensing element.
- the array substrate includes a display area
- the display area includes a first area and a second area located outside the first area
- the sensing element and the first switching element are located in the first within the area.
- the plurality of switching devices further include a second switching element located in a second region, and each of the first switching element and the second switching element includes a thin film transistor, wherein the first electrode of the sensing element is electrically Connected to a source or a drain of a first switching element whose gate is used to receive a first control signal for driving a pixel in a display area for a first period of time
- the gate of the first switching element is further configured to receive a second control signal in a second period of time to implement transmission of the electrical signal.
- FIG. 1 schematically illustrates a partial structural block diagram of an array substrate provided according to an embodiment of the present disclosure
- FIG. 2 is a schematic partial cross-sectional view of an array substrate provided by an embodiment of the present disclosure
- FIG. 3 is a schematic plan view of an array substrate according to an embodiment of the present disclosure.
- FIG. 4 is a schematic cross-sectional view taken along a line B-B 'in FIG. 3;
- FIG. 5 is a schematic partial cross-sectional view of an array substrate according to another embodiment of the present disclosure.
- FIG. 6 is a schematic structural diagram of a portion of a display device provided by an embodiment of the present disclosure.
- FIGS. 7A-7G are diagrams for schematically illustrating a process of an array substrate manufacturing method according to another embodiment of the present disclosure.
- fingerprint recognition can be achieved. For example, the user's fingerprint collected on-site can be compared with a fingerprint saved in advance to verify the user's true identity.
- Fingerprint recognition technology usually uses a light-sensitive sensing element, which can receive light reflected by a user's finger and convert the reflected light into an electrical signal. Due to the uniqueness of fingerprint characteristics of fingers of different users, the reflected light obtained by the fingers of different users will have different characteristics, and accordingly, the electrical signals obtained by the light-sensitive sensing elements are also different.
- the processor used for fingerprint recognition can receive and analyze these electrical signals to achieve fingerprint recognition.
- An array substrate provided according to an embodiment of the present disclosure includes a base substrate, a plurality of sensing elements, and a plurality of switching devices.
- a plurality of sensing elements are disposed on the first side of the base substrate, and each sensing element is configured to convert at least one of a light signal and an acoustic wave signal into an electric signal, and the switching device is disposed on the first side of the base substrate.
- the switching device On a second side opposite to one side, the switching device includes a plurality of first switching elements, and each first switching element is electrically connected to a sensing element to transmit an electrical signal.
- the above-mentioned sensing element includes, but is not limited to, a photoelectric conversion element (for example, a photosensitive sensor) or an acoustic-electric conversion element (for example, an acoustic wave sensor).
- the first switching element can transmit an electrical signal generated by the sensing element. These electrical signals can be provided to a processor or controller for calculation and analysis to achieve fingerprint recognition. Since the sensing element and the switching device are both attached to the base substrate as part of the structure of the array substrate, a display device implemented based on such an array substrate can integrate a fingerprint recognition function into the display device to realize fingerprint recognition. A true fusion of functionality and display equipment.
- the sensing element and the switching device are fabricated on different sides of the base substrate, respectively, which can reduce or avoid mutual interference between the switching device manufacturing process and the sensing element manufacturing process.
- FIG. 1 is a partial schematic view (cross-sectional view) of an array substrate 100 according to an embodiment of the present disclosure.
- the array substrate 100 may be an array substrate of a liquid crystal display device with a backlight source, or an array substrate of an active light-emitting display device (for example, an organic organic light emitting diode display device) without a backlight source.
- the array substrate 100 includes a base substrate 101, a plurality of sensing elements 102 provided on a first side S1 of the base substrate, and a plurality of switching devices provided on a second side S2 of the base substrate.
- Each sensing element 102 is configured to convert at least one of a light signal and an acoustic signal into an electrical signal.
- the switching device includes a first switching element 104, and each first switching element 104 is electrically connected to one sensing element 102 for transmission. An electrical signal generated by the sensing element 102.
- FIG. 1 schematically illustrates the electrical connection between the first switching element 104 and the sensing element 102 in lines, however, this electrical connection may be implemented in any manner that can be implemented by those skilled in the art, and the present disclosure is directed to this. No restrictions.
- the base substrate 101 may be a glass substrate, a quartz substrate, a plastic substrate, or a substrate of any other suitable material, and the disclosure does not specifically limit the material of the base substrate 101.
- the base substrate 101 may be a transparent substrate.
- the base substrate 101 may also be a flexible base substrate.
- the switching device and the first switching element 104 include, but are not limited to, switching elements such as a thin film transistor, a field effect transistor, and the like, and the specific type of the switching device is not specifically limited in this disclosure.
- FIG. 2 schematically illustrates an example of a structure of a sensing element and a switching device in an array substrate 200 according to an embodiment of the present disclosure.
- the sensing element 102 is disposed on the first side S1 of the base substrate 101.
- the sensing element 102 includes a first electrode 1021, a second electrode 1022, and a sensing layer 1023.
- the sensing layer 1023 is disposed between the first electrode 1021 and the second electrode 1022.
- the first electrode 1021 is electrically connected to the first switching element 104, and the second electrode 1022 is used to receive a reference potential.
- the first electrode 1021 and the second electrode 1022 are made of a transparent conductive material, and examples of the transparent conductive material include, but are not limited to, indium tin oxide (ITO).
- ITO indium tin oxide
- each sensing element 102 is configured to convert at least one of a light signal and an acoustic wave signal into an electrical signal.
- the material of the sensing layer 1023 may include a light sensor capable of receiving the light signal and generating the electrical signal.
- Material, or the material of the sensing layer 1023 includes a sound-sensitive material such as indium zinc oxide (IZO) to convert an acoustic wave signal into an electrical signal.
- IZO indium zinc oxide
- the sensing element 102 is actually a photoelectric conversion element.
- the sensing element 102 In the fingerprint recognition stage, light reflected by a finger (for example, the light from a backlight source of a display device where the array substrate is located) enters the sensing element 102, and the sensing layer 1023 can receive the reflected light and generate electricity based on the reflected light. signal. Since each person's finger fingerprint has unique texture characteristics, the reflected light reflected by the finger of different users has different characteristics, so the sensing element 102 also generates different electrical signals in response to different reflected light. The electrical signal generated by the sensing element 102 can be transmitted to the processor or controller via the first switching element 104 to analyze and calculate the electrical signal to obtain fingerprint information.
- the sensing element 102 actually converts a sound signal into an electrical signal
- the sensing element 102 is an ultrasonic sensor.
- an ultrasonic generator may be provided in a display device to which the array substrate is applied, to emit an ultrasonic wave to a user's finger when the user's finger approaches or touches the display device.
- the ultrasonic wave forms a reflected sound wave when it encounters a user's finger.
- a sensing layer including a sound-sensitive material can receive the reflected sound wave and generate an electrical signal.
- the frequency of the reflected sound waves reflected from the fingers of different users is different, so that the sensing element can generate different electrical signals based on the sound waves reflected by the fingers of different users. .
- the user's fingerprint information can be analyzed and identified using this electrical signal.
- the sensing element 102 may further include structures such as a dielectric layer 1024 and a connection line 1025.
- the dielectric layer 1024 may cover the first electrode 1021, the sensing layer 1023, and the second electrode 1022 of the sensing element 102 to protect it.
- the second electrode 1022 may be connected to the reference potential through a connection line 1025, for example.
- the first electrode 1021 of the sensing element 102 is connected to the first switching element 104 via a via hole 106 in the base substrate.
- the first switching element 104 is a thin film transistor including a gate 1041, a gate insulating layer 1042, an active layer 1043, a source 1044, and a drain 1045.
- FIG. 2 shows only a single sensing element 102 and a first switching element 104 connected to it via a via 106.
- the array substrate may include a plurality of sensing elements 102 and a plurality of first switching elements 104.
- a plurality of vias 106 are formed in the array substrate.
- the first electrode is electrically connected to the first switching element via a via hole 106.
- the diameter of each via and the distance between adjacent vias are not greater than the line distance of the fingerprint of the finger.
- the fingerprint image includes a ridge line and a valley line, and the ridge distance refers to a distance between the ridge line and the valley line adjacent to the ridge line.
- the line distance of a normal person's finger print is usually about 100 ⁇ m-300 ⁇ m
- the diameter of each via 106 is about 10 ⁇ m-100 ⁇ m
- the distance between two adjacent vias is about 100 ⁇ m-200 ⁇ m. Conducive to achieving higher accuracy of fingerprint recognition.
- an array substrate includes a display area, the display area includes a first area and a second area located outside the first area, and a sensing element and a first switching element are located in the first area.
- FIG. 3 schematically illustrates a display area A, a first area A1, and a second area A2 located on the periphery of the first area A1 of the array substrate.
- the first area A1 can be used as a fingerprint recognition area. When the user's finger approaches or touches the first area A1, fingerprint recognition of the user's finger can be realized.
- Fig. 4 is a schematic cross-sectional structure view taken along a line B-B 'in Fig. 3.
- the switching device provided on the second side of the base substrate further includes a second switching element 105, and each of the first switching element 104 and the second switching element 105 may include a thin film transistor.
- the first switching element 104 includes a gate 1041, a gate insulating layer 1042, an active layer 1043, a source 1044, a drain 1045, and the like.
- the second switching element 105 includes a gate 1051, a gate insulating layer 1052, an active layer 1053, Source 1054, drain 1055 and other structures.
- the first electrode 1021 of the sensing element is electrically connected to the source 1044 or the drain 1045 of the first switching element 104.
- the sensing element 102 and the first switching element 104 are disposed in the first region A1, and the second switching element 105 is disposed in the second region A2. Since the sensing element 102 is attached to the base substrate 101 and is provided in the display area A of the array substrate 300, it is not necessary to separately provide other components (for example, a bezel or a housing) on a display device to which the array substrate is applied for use.
- the fingerprint recognition sensor is conducive to the narrow frame design or full screen display of the display device.
- the gate of each of the first switching element 104 and the second switching element 105 is used to receive a first control signal to drive a pixel in a display area for a first period of time.
- the gate is also used to receive a second control signal during a second period of time to achieve transmission of the electrical signal. That is, in the first period, the first switching element 104 and the second switching element 105 are turned on or off in response to the first control signal, and the pixels in the display area A are driven to realize image display.
- the first switching element 104 is turned on or off in response to the second control signal, and transmits an electrical signal generated by the sensing element to a controller or a processor (not shown in the figure), to The signals are calculated and analyzed to realize the function of fingerprint recognition.
- the second switching element in the second region A2 can be controlled to be in an off state, or the first control signal can be stopped from being applied to the second switching element to reduce the energy consumption of the display device.
- the above-mentioned first control signal is also referred to as an image display scanning signal for implementing image display, and the second control signal is also referred to as a fingerprint identification scanning signal for fingerprint identification.
- the first switching element 104 actually has a dual function.
- a first period of time for example, a display phase
- the first switching element 104 and the second switching element 105 are operated in response to a first control signal to achieve normal image display.
- a second time period for example, a fingerprint recognition phase
- the first switching element is operated in response to the second control signal to transmit an electrical signal for fingerprint recognition generated by the sensing element. Therefore, the first switching element 104 functions as a pixel switch for image display in a first period of time, and functions as a signal transmission switch for transmitting an electrical signal of the sensing element in a second period of time.
- this embodiment avoids providing an array substrate or a display device with a fingerprint identification signal transmission switch dedicated to transmitting fingerprint identification signals, and greatly reduces the number of switching devices used by the array substrate and the display device with a fingerprint identification function.
- the circuit structure of the array substrate is simplified, and the thickness of the array substrate and the display device can be effectively reduced.
- the first electrode 1021 of the sensing element 102 is electrically connected to the source 1044 of the first switching element 104.
- the first electrode 1021 of the sensing element 102 may also be connected to the first switching element 104.
- the drain 1045 is electrically connected. The disclosure does not limit the specific electrical connection between the sensing element 102 and the first switching element 104, as long as the first switching element 104 can transmit the electrical signal of the sensing element 102.
- the inventors of the present application have recognized that, in a general display device, light emitted from a light source is not effectively utilized.
- a liquid crystal display device there is a structure that blocks the propagation of light from the backlight in the light path from the backlight to the light emitting surface of the display device; in an organic light emitting diode display device, the The emitted light on the back is also not effectively used.
- the array substrate further includes a metal lead electrically connected to the first electrode of the sensing element, and the metal lead is used for electrical connection with an energy storage element independent of the array substrate.
- the energy storage element includes, but is not limited to, a rechargeable battery in a display device to which the array substrate is applied.
- the sensing element can receive a part of the light that is not effectively utilized and convert it into electrical signals. These electrical signals can be transmitted to the energy storage element via metal leads for storage, thereby improving the light utilization efficiency of the display device.
- metal leads for storage thereby improving the light utilization efficiency of the display device.
- FIG. 5 shows a schematic partial cross-sectional structure of an array substrate 400 according to another embodiment of the present disclosure.
- the array substrate 400 includes the sensing element 102 described in the above embodiment.
- the sensing element 102 is specifically implemented in this embodiment.
- the array substrate 400 is an array substrate for an electro organic light emitting diode (eg, OLED) display device.
- OLED electro organic light emitting diode
- the array substrate 400 includes an electroluminescent element 108, which is disposed on the second side S2 of the base substrate 101 and is electrically connected to the first switching element 104.
- the electroluminescent device 108 includes a cathode 1081, an anode 1082, and an organic light emitting layer between the cathode 1081 and the anode 1082.
- the anode 1082 of the electroluminescent element 108 is electrically connected to the drain 1045 of the first switching element 104.
- the anode 1082 of the electroluminescent element 108 may be electrically connected to the source 1044 of the first switching element 104.
- the orthographic projection of the sensing layer 1023 on the base substrate 101 does not overlap with the orthographic projection of the non-transmissive areas of the first switching element 104 and the electro-organic light emitting element 108 on the base substrate 101.
- This enables the sensing layer 1023 to effectively receive light propagating downward or laterally from the electroluminescent element 108, thereby improving the utilization rate of the light emitted by the electroluminescent element 108. That is, the orthographic projection of the sensing layer 1023 on the base substrate 101 is outside the orthographic projection of the non-light-transmitting areas of the first switching element 104 and the electroluminescent element 108 on the base substrate 101.
- the “non-light-transmitting region of the first switching element 104 and the electroluminescent element 108” mentioned here refers to a structure in which the first switching element 104 and the electroluminescent element 108 have a light-shielding property, for example, the first switching element A gate 1041, a source 1044, a drain 1045, a cathode 1081 or an anode 1082 of the electroluminescent device 108, and the like.
- the array substrate 400 further includes a metal lead 107 electrically connected to the first electrode 1021 of the sensing element 102, and the metal lead 107 may be electrically connected to an energy storage element 50 (eg, rechargeable battery).
- an energy storage element 50 eg, rechargeable battery
- the array substrate 400 further includes a metal lead 107 electrically connected to the first electrode 1021 of the sensing element 102, and the sensing layer 1023 includes a photosensitive material and is configured to perform no fingerprint identification on the sensing element 102.
- the received light is converted into an electrical signal in the state, and the metal lead 107 is used to electrically connect with the energy storage element independent of the array substrate 400 to transmit the electrical signal to the energy storage element.
- the electrical signal is transmitted to a rechargeable battery to charge the rechargeable battery.
- the principle of improving light utilization ratio embodied above is not only applicable to electro-organic light emitting diode display devices, but also applicable to liquid crystal display devices including backlight sources.
- a backlight is usually disposed on a side of the substrate away from the thin film transistor.
- the light incident on the light-shielding metal layers such as the gate, source, and drain of the thin-film transistor cannot usually be effectively used, resulting in waste of energy.
- the array substrate 200 is an array substrate for a liquid crystal display device.
- the orthographic projections of 104 on the base substrate 101 at least partially overlap.
- a backlight source independent of the array substrate 200 usually emits light from below the array substrate 200. Since the orthographic projection of the sensing layer 1023 of the sensing element 102 on the base substrate 101 and the orthographic projection of the first switching element 104 on the base substrate 101 at least partially overlap, at least the original switching element 104 can be blocked Part of the backlight is incident on the sensing element and converted into electrical energy for storage and utilization.
- this can also reduce the influence of the sensing element 102 on the propagation of the backlight required for image display.
- the orthographic projection of the sensing layer 1023 of the sensing element 102 on the base substrate 101 is located within the orthographic projection of the first switching element 104 on the base substrate 101. In this way, the influence of the sensing element 102 on the propagation of the backlight required for image display can be minimized.
- the display device may be, for example, any product or component having a display function, such as a mobile phone, a tablet computer, a notebook computer, a video camera, and a navigator.
- the array substrate of the display device includes a sensing element.
- the sensing element is an acoustic wave sensor for converting an acoustic wave signal into an electrical signal.
- the display device further includes an acoustic wave generator for generating an acoustic wave.
- FIG. 6 schematically illustrates a partial structure of an exemplary display device 500.
- the display device 500 includes a sensing element 102 and an acoustic wave generator 501.
- the sensing element 102 is an acoustic wave sensor arranged on an array substrate.
- the acoustic wave generator 501 may be provided on other suitable structures of the display device.
- the sound wave generator 501 may be attached to a back plate, a frame, a housing, or any other suitable component of the display device.
- the acoustic wave generator 501 may be, for example, an ultrasonic generator.
- the acoustic wave generator 501 can send acoustic wave signals to the finger, and the acoustic wave generates a reflected acoustic wave when it meets the user's finger.
- the acoustic wave sensor 102 can receive the reflected acoustic wave and generate an electrical signal.
- the frequency of the reflected sound waves reflected from the fingers of different users is different, so that the sensing element can generate different electrical signals based on the sound waves reflected from the fingers of different users, so that Use this electrical signal to analyze and identify user fingerprint information.
- the display device further includes a rechargeable battery, and the sensing element 102 is electrically connected to the rechargeable battery.
- the sensing element can receive a part of the display device that is not effectively used to convert it into an electrical signal.
- the sensing element is electrically connected to a rechargeable battery. Therefore, when the display device is operating, the sensing element In a state where fingerprint identification is not performed, the above-mentioned electrical signal can be transmitted to a rechargeable battery, that is, the rechargeable battery is charged. In this way, the light utilization efficiency of the display device can be improved.
- another embodiment of the present disclosure provides a method for manufacturing an array substrate.
- the manufacturing method can be used to fabricate the array substrate described in the above embodiment, and includes the following steps: providing a base substrate; A plurality of sensing elements are formed on the first side, and each sensing element is configured to convert at least one of an optical signal and an acoustic wave signal into an electrical signal; formed on a second side opposite to the first side of the substrate Multiple switching devices.
- the plurality of switching devices include a plurality of first switching elements, and each first switching element is electrically connected to a sensing element to transmit the electrical signal.
- each sensing element includes a first electrode, a second electrode, and a sensing layer located between the first electrode and the second electrode.
- the method for manufacturing an array substrate further includes: forming a substrate in a base substrate; A plurality of vias, and the first electrode of each sensing element is electrically connected to a first switching element via one of the vias.
- An example of an array substrate manufacturing method is schematically described below with reference to FIGS. 7A to 7G.
- a base substrate 101 is first provided.
- the base substrate 101 may be, for example, a glass substrate, a quartz substrate, a plastic substrate, or a substrate of other suitable materials.
- the base substrate 101 may also be a flexible base substrate.
- a plurality of via holes are formed in the base substrate 101 (only one via hole 106 is shown in FIG. 7A), and the diameter of each via hole 106 and the distance between adjacent via holes are not greater than The line distance of the fingerprint of the finger.
- a diameter dimension of each via hole 106 is about 10 ⁇ m to 100 ⁇ m, and a distance between two adjacent via holes is about 100 ⁇ m to 200 ⁇ m.
- a metal thin film may be deposited on the first side S1 of the base substrate 101 on which the plurality of vias 106 are formed, for example, by chemical vapor deposition or physical vapor deposition, and the metal thin film may be patterned by a photolithography process to A first electrode 1021 is formed on the first side S1 of the base substrate 101.
- the via hole 106 may be filled with a material of the first electrode 1021.
- a sensing layer film is deposited on the base substrate 101 on which the first electrode 1021 is formed, and the sensing layer film is patterned to form a sensing layer 1023.
- the sensing layer 1023 includes a photosensitive material, for example, amorphous silicon with higher hydrogen.
- the sensing layer includes a sound-sensitive material.
- the switching device for transmitting the electrical signal generated by the sensing element since the switching device for transmitting the electrical signal generated by the sensing element has not been manufactured when the sensing layer is manufactured, the process involved in manufacturing the sensing layer 1023 will not cause a subsequent manufacturing process of the switching device. Adverse effects, thereby avoiding affecting the performance of the switching device.
- a second electrode 1022 is formed on the base substrate 101 on which the sensing layer 1023 is formed.
- the material forming the first electrode 1021 and the second electrode 1022 includes a transparent conductive material, such as any suitable material such as indium tin oxide (ITO), tin oxide (ZnO), and the like.
- a dielectric layer 1024 and a connection line 1025 are formed on the first side S1 of the base substrate 101.
- the dielectric layer 1024 substantially covers the first electrode, the second electrode, and the sensing electrode. Layer to isolate and protect the first electrode, the second electrode, and the sensing layer of the sensing element.
- the second electrode 1022 may be connected to a reference potential via a connection line 1025.
- the base substrate 101 on which the sensing element 102 is formed is turned over to A switching device for transmitting electrical signals is fabricated on the second side S2.
- a first switching element 104 is formed on the second side S2 of the base substrate 101, and the first switching element 104 may be, for example, a thin film transistor.
- the manufacturing process of the first switching element 104 can refer to the manufacturing process of a conventional thin film transistor, and is not repeated here.
- the formed first switching element 104 and the sensing element 102 may be located in a display area of an array substrate, for example.
- a sensing element 102 and a switching device for transmitting an electrical signal generated by the sensing element are fabricated on opposite sides of the substrate substrate 101 respectively.
- the sensing element 102 is fabricated on the first side of the base substrate, and then the first switching element 104 is fabricated on the second side of the base substrate.
- the complex process conditions required for manufacturing the sensing element 102 will not affect the first switching element.
- the etching process involved in making the first switching element 104 on the second side of the base substrate will not adversely affect the sensing elements already formed on the first side of the base substrate.
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Abstract
一种阵列基板(100)及其制造方法、显示装置(500),该阵列基板(100)包括衬底基板(101);设置在所述衬底基板(101)的第一侧(S1)的多个感测元件(102),每个感测元件(102)被配置成至少将光信号和声波信号中的一个转换为电信号;多个开关器件,设置在与所述衬底基板(101)的第一侧(S1)相对的第二侧(S2)。所述多个开关器件包括多个第一开关元件(104),每个第一开关元件(104)与一个感测元件(102)电连接以传输所述电信号。
Description
相关申请的交叉引用
本申请要求于2018年7月20日递交中国专利局的、申请号为201810803078.5的中国专利申请的权益,该申请的全部公开内容以引用方式并入本文。
本公开的实施例涉及一种阵列基板及其制造方法、显示装置。
诸如液晶显示器或电致有机发光二极管显示器之类的显示设备通常具有指纹识别功能。
发明内容
本公开的实施例提供了一种阵列基板及其制作方法、以及包括该阵列基板的显示装置。阵列基板包括:衬底基板;设置在所述衬底基板的第一侧的多个感测元件,每个感测元件被配置成至少将光信号和声波信号中的一个转换为电信号;以及多个开关器件,设置在与所述衬底基板的第一侧相对的第二侧。开关器件包括多个第一开关元件,每个第一开关元件与一个感测元件电连接以传输所述电信号。
在一些实施例中,每个感测元件包括第一电极、第二电极和传感层,传感层设置在所述第一电极和所述第二电极之间,第一电极与所述第一开关元件电连接,第二电极用于接收参考电位。
在一些实施例中,传感层包括光敏材料或声敏材料。
在一些实施例中,衬底基板包括多个过孔,每个感测元件的第一电极经由一个过孔与一个第一开关元件电连接,每个过孔的直径以及相邻过孔之间的间距均不大于手指指纹的纹线距离。
在一些实施例中,阵列基板包括显示区域,显示区域包括第一区域和位于第一区域外围的第二区域,感测元件和第一开关元件位于第一区域内。
在一些实施例中,开关器件还包括位于第二区域内的第二开关 元件,第一开关元件和第二开关元件均包括薄膜晶体管,所述感测元件的第一电极电连接至第一开关元件的源极或漏极。第一开关元件和第二开关元件中的每个的栅极用于在第一时间段接收第一控制信号以驱动显示区域内的像素,第一开关元件的栅极还用于在第二时间段接收第二控制信号以实现所述电信号的传输。
在一些实施例中,阵列基板还包括与感测元件的第一电极电连接的金属引线,金属引线用于与独立于阵列基板的能量存储元件电连接。
在一些实施例中,阵列基板还包括位于衬底基板的第二侧、与开关器件电连接的电致有机发光元件。传感层在所述衬底基板上的正投影与第一开关元件和电致有机发光元件的非透光区域在所述衬底基板上的正投影不重叠。
在一些实施例中,传感层在所述衬底基板上的正投影与第一开关元件在衬底基板上的正投影至少部分重叠。
在一些实施例中,所述感测元件包括介质层,所述介质层覆盖感测元件的第一电极、第二电极和传感层。
在一些实施例中,所述阵列基板还包括与所述感测元件的第一电极电连接的金属引线,所述传感层包括光敏材料并构造成在感测元件不进行指纹识别的状态下将接收到的光转换成电信号,所述金属引线用于与独立于所述阵列基板的能量存储元件电连接,以将该电信号传输至能量存储元件。
本公开的另外的实施例提供了一种显示装置,包括如前述实施例中任一实施所述的阵列基板。
在一些实施例中,感测元件是用于将声波信号转换为电信号的声波传感器,显示装置还包括用于产生声波的声波发生器。
在一些实施例中,显示装置还包括可充电电池,感测元件还电连接至所述可充电电池。
在一些实施例中,所述显示装置还包括可充电电池,所述阵列基板还包括与所述感测元件的第一电极电连接的金属引线,所述传感层包括光敏材料并构造成在感测元件不进行指纹识别的状态下将接 收到的光转换成电信号,所述金属引线用于与所述可充电电池电连接,以将该电信号传输至所述可充电电池。
本公开的又一实施例提供了一种阵列基板的制造方法,包括:提供衬底基板;在所述衬底基板的第一侧上形成多个感测元件,每个感测元件被配置成至少将光信号和声波信号中的一个转换为电信号;在与所述衬底基板的第一侧相对的第二侧上形成多个开关器件,开关器件包括多个第一开关元件,每个第一开关元件与一个感测元件电连接以传输所述电信号。
在一些实施例中,每个感测元件包括第一电极、第二电极、和位于第一电极和第二电极之间的传感层,阵列基板的制造方法还包括:在衬底基板中形成多个过孔,每个感测元件的第一电极经由一个过孔与所述第一开关元件电连接。
在一些实施例中,所述的方法还包括:在衬底基板的第一侧上形成介质层,所述介质层覆盖感测元件的第一电极、第二电极和传感层。
在一些实施例中,所述阵列基板包括显示区域,所述显示区域包括第一区域和位于第一区域外围的第二区域,所述感测元件和所述第一开关元件位于所述第一区域内。
在一些实施例中,所述多个开关器件还包括位于第二区域内的第二开关元件,第一开关元件和第二开关元件均包括薄膜晶体管,其中所述感测元件的第一电极电连接至第一开关元件的源极或漏极,所述第一开关元件和第二开关元件中的每个的栅极用于在第一时间段接收第一控制信号以驱动显示区域内的像素,所述第一开关元件的栅极还用于在第二时间段接收第二控制信号以实现所述电信号的传输。
为了更清楚地说明本公开实施例的技术方案,下面将对描述这些实施例所需的附图作简单地介绍,下面描述中的附图仅仅涉及本公开的一些实施例,而非对本申请的保护范围构成限制。
图1示意性地示出了根据本公开实施例提供的阵列基板的部分结构框图;
图2为本公开一个实施例提供的阵列基板的局部剖面示意图;
图3为本公开一个实施例提供的阵列基板的平面示意图;
图4为沿着图3中的B-B’线得到的剖面示意图;
图5为本公开另一实施例提供的阵列基板的局部剖面示意图;
图6为本公开一个实施例提供的显示装置的部分结构示意图;
图7A-7G用于示意性地说明根据本公开又一实施例提供的阵列基板制造方法的过程。
为使本公开实施例的目的、技术方案和优点更加清楚,下面将结合附图对本公开实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本公开的一部分实施例,而不是全部的实施例。基于所描述的实施例,本领域普通技术人员在没有付出创造性劳动的前提下所获得的所有其他实施例,都属于本公开保护的范围。
除非另外定义,本公开使用的技术术语或者科学术语应当为本公开所属领域的普通技术人员所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。同样,“一个”、“一”或者“该”等类似词语也不表示数量限制,而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并不局限于物理的或者机械的连接,而是可以包括电连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。
依靠每个人的指纹特征的唯一性和稳定性,可以实现指纹识别。例如,可以通过将现场采集到的用户指纹和预先保存的指纹进行比较,从而可以验证用户的真实身份。指纹识别技术通常利用光 敏感测元件,光敏感测元件可以接收由用户手指所反射的光,并将反射光转换为电信号。由于不同用户手指指纹特征的唯一性,由不同用户的手指反射而得到的反射光将具有不同的特性,相应地,光敏感测元件所得到的电信号也不同。用于指纹识别的处理器可以接收并分析这些电信号,进而实现指纹识别。
根据本公开的实施例提供的阵列基板包括衬底基板、多个感测元件和多个开关器件。多个感测元件设置在衬底基板的第一侧,每个感测元件被配置成至少将光信号和声波信号中的一个转换为电信号,所述开关器件设置在与衬底基板的第一侧相对的第二侧,开关器件包括多个第一开关元件,每个第一开关元件与一个感测元件电连接以传输电信号。
能够理解到的是,上述的感测元件包括但不限于光电转换元件(例如,光敏传感器)或声电转换元件(例如,声波传感器),第一开关元件可以传输感测元件所产生的电信号,这些电信号可以被提供至处理器或控制器进行计算和分析,以实现指纹识别。由于感测元件和开关器件均附接至衬底基板,作为阵列基板的结构的一部分,所以,基于这样的阵列基板而实施的显示设备可以实现将指纹识别功能集成于显示设备内,实现指纹识别功能和显示设备的真正融合。此外,感测元件和开关器件分别制作在衬底基板的不同侧,这样可以降低或避免开关器件制作过程和感测元件制作过程的彼此干扰。
下面通过具体的示例对本公开提出的阵列基板进行说明。为了简洁起见,省略了对已知功能和部件的详细说明。当任一部件在多个附图中出现时,该部件在每个附图中由相同的参考标号表示。
图1为根据本公开实施例提供的阵列基板100的局部示意图(截面图)。阵列基板100可以是具有背光源的液晶显示设备的阵列基板,也可以是不具有背光源的主动发光显示设备(例如,电致有机发光二极管显示设备)的阵列基板,本实施例对阵列基板100的应用场合不做限制。如图1所示,该阵列基板100包括衬底基板101、设置在衬底基板的第一侧S1的多个感测元件102、以及设置 在衬底基板的第二侧S2的多个开关器件。每个感测元件102被配置成至少将光信号和声波信号中的一个转换为电信号,开关器件包括第一开关元件104,每个第一开关元件104与一个感测元件102电连接以传输感测元件102产生的电信号。图1以线条示意性地示出了第一开关元件104和感测元件102之间的电连接,但是,这种电连接可以以本领域技术人员能够实现的任何方式来实施,本公开对此不作限制。
衬底基板101可以是玻璃基板、石英基板、塑料基板或其它任何适合材料的基板,本公开对衬底基板101的材料不做具体限制。例如,衬底基板101可以是透明基板。在一个示例中,衬底基板101还可以是柔性衬底基板。开关器件和第一开关元件104包括但不限于诸如薄膜晶体管、场效应晶体管之类的开关元件,本公开对开关器件的具体类型不做具体限定。
图2示意性地示出了根据本公开的一个实施例的阵列基板200中的感测元件和开关器件的结构的示例。如图2所示,在阵列基板200中,感测元件102设置在衬底基板101的第一侧S1。感测元件102包括第一电极1021、第二电极1022和传感层1023,传感层1023设置在第一电极1021和第二电极1022之间。第一电极1021与第一开关元件104电连接,第二电极1022用于接收参考电位。在一个示例中,第一电极1021和第二电极1022由透明导电材料制成,透明导电材料的示例包括但不限于氧化铟锡(ITO)。如前所述,每个感测元件102被配置成至少将光信号和声波信号中的一个转换为电信号,相应地,传感层1023的材料可包括能够接收光信号并产生电信号的光敏材料,或者,传感层1023的材料包括诸如铟锌氧化物(IZO)之类的声敏材料,以将声波信号转换为电信号。
当传感层1023包括光敏材料时,感测元件102实际上是一个光电转换元件。在指纹识别阶段,由手指所反射的光(该光例如来自于阵列基板所在显示设备的背光源)入射到感测元件102,传感层1023可以接收该反射光并将基于该反射光产生电信号。由于每个人的手指指纹具有独特的纹路特征,不同用户的手指反射得到的反射 光具有不同的特性,所以感测元件102响应于不同的反射光也产生不同的电信号。感测元件102产生的电信号经由第一开关元件104可传输至处理器或控制器,以对电信号进行分析计算,从而获得指纹信息。替代性地,在传感层1023包括声敏材料的示例中,感测元件102实际上将声音信号转换为电信号,例如感测元件102是一个超声传感器。此时,在应用该阵列基板的显示设备中可设置超声发生器,以在用户手指接近或触摸显示设备时向用户手指发出超声波。超声波遇到用户手指时形成反射声波,包括声敏材料的传感层可接收反射声波而产生电信号。同样地,由于用户个体手指指纹特征的唯一性,从不同用户的手指反射得到的反射声波的频率是不同的,由此感测元件可以基于不同用户的手指所反射的声波而产生不同的电信号。类似地,可以利用该电信号实现用户指纹信息的分析和识别。
在图2的示例中,感测元件102还可以包括介质层1024和连接线1025等结构。介质层1024可以覆盖感测元件102的第一电极1021、传感层1023、第二电极1022以对其进行保护,第二电极1022例如可以通过连接线1025连接至参考电位。感测元件102的第一电极1021经由衬底基板中的过孔106连接至第一开关元件104。在该示例中,第一开关元件104是薄膜晶体管,其包括栅极1041、栅绝缘层1042、有源层1043、源极1044、漏极1045。
图2的示例仅示出了单个的感测元件102和经由过孔106与其连接的第一开关元件104。然而,能够理解的是,在实践中,阵列基板可包括多个感测元件102以及多个第一开关元件104,相应地,阵列基板中形成有多个过孔106,每个感测元件的第一电极经由一个过孔106与第一开关元件电连接。在一些实施例中,每个过孔的直径以及相邻过孔之间的间距均不大于手指指纹的纹线距离。指纹图像包括脊线和谷线,纹线距离指的是脊线和与该脊线相邻的谷线之间的间距。例如,普通人的手指指纹的纹线距离通常约为100μm-300μm,每个过孔106的直径尺寸约为10μm-100μm,相邻两个过孔之间的间距约为100μm-200μm,这样,有利于实现较 高的指纹识别精度。
根据本公开的一个实施例提供的阵列基板,其包括显示区域,显示区域包括第一区域和位于第一区域外围的第二区域,感测元件和第一开关元件位于所述第一区域内。图3示意性地示出了阵列基板的显示区域A、第一区域A1和位于第一区域A1外围的第二区域A2。在该示例中,第一区域A1可被用作指纹识别区域,当用户手指接近或触摸第一区域A1时,可以实现对用户手指的指纹识别。
图4是沿着图3中的B-B’线而得到的剖面结构示意图。如图4所示,设置在衬底基板的第二侧上的开关器件还包括第二开关元件105,第一开关元件104和第二开关元件105均可包括薄膜晶体管。第一开关元件104包括栅极1041、栅绝缘层1042、有源层1043、源极1044、漏极1045等结构,第二开关元件105包括栅极1051、栅绝缘层1052、有源层1053、源极1054、漏极1055等结构。感测元件的第一电极1021电连接至第一开关元件104的源极1044或漏极1045。参考图3和图4,感测元件102和第一开关元件104设置在第一区域A1内,第二开关元件105设置在第二区域A2内。由于感测元件102附接至衬底基板101,且设置在阵列基板300的显示区域A内,所以不必在应用该阵列基板的显示装置的其它部件(例如,边框或外壳)上另外设置用于指纹识别的传感器,有利于显示装置的窄边框设计或全屏显示。
在该实施例中,第一开关元件104和第二开关元件105中的每个的栅极用于在第一时间段接收第一控制信号以驱动显示区域内的像素,第一开关元件104的栅极还用于在第二时间段接收第二控制信号以实现所述电信号的传输。也就是说,在第一时间段,第一开关元件104和第二开关元件105响应于第一控制信号而导通或断开,驱动显示区域A内的像素实现图像显示。在第二时间段,第一开关元件104响应于第二控制信号而导通或断开,将感测元件产生的电信号传输至控制器或处理器(图中未示出),以对电信号进行计算和分析,从而实现指纹识别的功能。在一些实施例中,在第二时间段,可以控制第二区域A2的第二开关元件处于关断状态,或者停 止向第二开关元件施加第一控制信号,以降低显示装置的能量消耗。上述的第一控制信号也被称为用于实现图像显示的图像显示扫描信号,第二控制信号也被称为用于指纹识别的指纹识别扫描信号。
基于图4所示的实施例,第一开关元件104实际上具有双重功能。在第一时间段(例如,显示阶段)内,第一开关元件104和第二开关元件105响应于第一控制信号而动作,以实现正常的图像显示。在第二时间段(例如,指纹识别阶段),第一开关元件响应于第二控制信号而动作,以传输感测元件所产生的用于指纹识别的电信号。因此,第一开关元件104在第一时间段充当用于图像显示的像素开关,在第二时间段充当用于传输感测元件的电信号的信号传输开关。由此,该实施例避免了为阵列基板或显示装置提供专门用于传输指纹识别信号的指纹识别信号传输开关,大大减少了具备指纹识别功能的阵列基板和显示装置所使用的开关器件的数量,简化了阵列基板的电路结构,并可有效地降低阵列基板和显示装置的厚度。
在图4的示例中,感测元件102的第一电极1021与第一开关元件104的源极1044电连接,替代性地,感测元件102的第一电极1021也可以与第一开关元件104的漏极1045电连接。本公开并不限制感测元件102与第一开关元件104的具体电连接方式,只要第一开关元件104能够传输感测元件102的电信号即可。
本申请的发明人认识到,在通常的显示设备中,光源所发出的光并没有被有效地利用。例如,对于液晶显示设备,从背光源到显示设备的出光表面的光路中存在阻挡来自于背光源的光的传播的结构;在有机发光二极管显示设备中,朝显示设备的、与出光面相对的背面的发射的光也没有被有效地利用。因此,根据本公开的另一实施例,阵列基板还包括与感测元件的第一电极电连接的金属引线,金属引线用于与独立于阵列基板的能量存储元件电连接。能量存储元件包括但不限于应用该阵列基板的显示设备中的可充电电池。由此,感测元件可以接收到一部分没有被有效利用的光而将其 转换为电信号,这些电信号可以经由金属引线传输至能量存储元件而存储,从而提升显示设备的光利用率。下面通过一些示例对此作出进一步的说明。
图5示出了根据本公开的另一实施例提供的阵列基板400的局部剖面结构示意图,该阵列基板400包括上述实施例描述的感测元件102,该感测元件102在本实施例具体实现为光电传感器。在本实施例中,阵列基板400为用于电致有机发光二极管(例如,OLED)显示设备的阵列基板。
如图5所示,该阵列基板400包括电致有机发光元件108,该电致有机发光元件108设置在衬底基板101的第二侧S2且与第一开关元件104电连接。电致有机发光元件108包括阴极1081、阳极1082以及位于阴极1081和阳极1082之间的有机发光层等结构。在该示例中,电致有机发光元件108的阳极1082与第一开关元件104的漏极1045电连接。替代性地,电致有机发光元件108的阳极1082可以与第一开关元件104的源极1044电连接。
在图5的示例中,传感层1023在衬底基板101上的正投影与第一开关元件104和电致有机发光元件108的非透光区域在衬底基板101上的正投影不重叠,这使得传感层1023有效地接收到从电致有机发光元件108朝下方或侧向传播的光,提高对电致有机发光元件108发出的光的利用率。即,传感层1023在衬底基板101上的正投影在第一开关元件104和电致有机发光元件108的非透光区域在衬底基板101上的正投影的外面。这里提到的“第一开关元件104和电致有机发光元件108的非透光区域”指的是第一开关元件104和电致有机发光元件108具有遮光性质的结构,例如,第一开关元件的栅极1041、源极1044、漏极1045,电致有机发光元件108的阴极1081或阳极1082等。如图5所示,该阵列基板400还包括与感测元件102的第一电极1021电连接的金属引线107,该金属引线107可电连接至独立于阵列基板400的能量存储元件50(例如,可充电电池)。根据本公开的一个示例,该阵列基板400还包括与感测元件102的第一电极1021电连接的金属引线107,传感层1023包 括光敏材料并构造成在感测元件102不进行指纹识别的状态下将接收到的光转换成电信号,金属引线107用于与独立于阵列基板400的能量存储元件电连接,以将该电信号传输至能量存储元件。例如,该电信号传输至可充电电池,以对可充电电池进行充电。
能够理解到的是,以上体现的提升光利用率的原理不仅仅适用于电致有机发光二极管显示设备,还可以适用于包括背光源的液晶显示设备。在液晶显示设备中,背光源通常设置在衬底基板远离薄膜晶体管的一侧。入射到薄膜晶体管的栅极、源极和漏极等遮光金属层的光通常无法得到有效的利用,从而导致能量的浪费。
再次参照图2,根据本公开的一个实施例,该阵列基板200为用于液晶显示设备的阵列基板,感测元件102的传感层1023在衬底基板101上的正投影与第一开关元件104在衬底基板101上的正投影至少部分重叠。在显示设备工作时,独立于阵列基板200的背光源通常从阵列基板200的下方发射光线。由于感测元件102的传感层1023在衬底基板101上的正投影与第一开关元件104在衬底基板101上的正投影至少部分重叠,所以至少可以让原本由第一开关元件104遮挡的一部分背光入射到感测元件,并将其转换为电能加以存储和利用,另一方面,这也可降低感测元件102对实现图像显示所需的背光的传播的影响。在一些实施例中,感测元件102的传感层1023在衬底基板101上的正投影位于第一开关元件104在衬底基板101上的正投影内。如此,可最大程度降低感测元件102对实现图像显示所需的背光的传播的影响。
本公开的另外的实施例提供一种显示装置,该显示装置包括上述任一实施例描述的阵列基板。该显示装置例如可以为手机、平板电脑、笔记本电脑、摄像机、导航仪等任何具有显示功能的产品或者部件。
显示装置的阵列基板包括感测元件,在一个实施例中,该感测元件是用于将声波信号转换为电信号的声波传感器,此时,显示装置还包括用于产生声波的声波发生器。图6示意性地示出了示例性的显示装置500的部分结构。如图6所示,显示装置500包括感测 元件102和声波发生器501,感测元件102是布置于阵列基板上的声波传感器,声波发生器501可以设置在显示装置的其它合适的结构上,例如,声波发生器501可以附着于显示装置的背板、框架、壳体等任何其它合适的部件。声波发生器501例如可以是超声波发生器。当用户手指触摸或接近显示装置的表面时,声波发生器501可以朝手指发送声波信号,声波遇到用户手指时产生反射声波,声波传感器102可接收反射声波而产生电信号。由于用户个体手指指纹特征的唯一性,从不同用户的手指反射得到的反射声波的频率是不同的,由此感测元件可以基于从不同用户的手指反射的声波而产生不同的电信号,从而可以利用该电信号实现用户指纹信息的分析和识别。
在另一实施例中,显示装置还包括可充电电池,感测元件102电连接至该可充电电池。如前所述,感测元件可以接收显示装置中一部分没有被有效利用的光而将其转换为电信号,感测元件电连接至可充电电池,所以,在显示装置运行时,在感测元件不进行指纹识别的状态下,上述电信号可以传输至可充电电池,即,对可充电电池进行充电。如此,可提升显示装置的光利用效率。
基于同一发明构思,本公开的另外的实施例提供一种阵列基板的制造方法,该制造方法可用于制作上述实施例描述的阵列基板,并包括如下步骤:提供衬底基板;在衬底基板的第一侧上形成多个感测元件,每个感测元件被配置成至少将光信号和声波信号中的一个转换为电信号;在与衬底基板的第一侧相对的第二侧上形成多个开关器件。所述多个开关器件包括多个第一开关元件,每个第一开关元件与一个感测元件电连接以传输所述电信号。
在一些实施例中,每个感测元件包括第一电极、第二电极、和位于第一电极和第二电极之间的传感层,阵列基板的制造方法还包括:在衬底基板中形成多个过孔,每个感测元件的第一电极经由一个所述过孔与一个第一开关元件电连接。下面结合图7A-图7G示意性地说明阵列基板制造方法的示例。
如图7A所示,首先提供衬底基板101,该衬底基板101例如可 以是玻璃基板、石英基板、塑料基板或其它适合材料的基板。在一个示例中,衬底基板101还可以是柔性衬底基板。如图7A所示,在衬底基板101中形成多个过孔(图7A中仅示出了一个过孔106),每个过孔106的直径以及相邻过孔之间的间距均不大于手指指纹的纹线距离。在一个示例中,每个过孔106的直径尺寸约为10μm-100μm,相邻两个过孔之间的间距约为100μm-200μm。此外,可以在形成有多个过孔106的衬底基板101的第一侧S1上例如可以通过化学气相沉积或者物理气相沉积等方法沉积金属薄膜,通过光刻工艺对该金属薄膜进行构图,以在衬底基板101的第一侧S1上形成第一电极1021。过孔106内可填充有第一电极1021的材料。
如图7B所示,在形成有第一电极1021的衬底基板101上沉积传感层薄膜并通过对该传感层薄膜进行构图以形成传感层1023。传感层1023包括光敏材料,例如,氢较高的非晶硅。替代性地,传感层包括声敏材料。在该实施例中,由于在制作传感层时尚未制作用于传输感测元件产生的电信号的开关器件,所以制造传感层1023所涉及的工艺不会对后续的开关器件的制作过程造成不利影响,由此可避免影响开关器件的性能。
接下来,如图7C所示,在形成有传感层1023的衬底基板101上形成第二电极1022。形成第一电极1021和第二电极1022的材料包括透明导电材料,例如氧化铟锡(ITO)、氧化锡(ZnO)等任意适合的材料。
在一些实施例中,如图7D和7E所示,在衬底基板101的第一侧S1上形成介质层1024和连接线1025,介质层1024基本上覆盖第一电极、第二电极和传感层,以起到隔离和保护感测元件的第一电极、第二电极和传感层的作用。第二电极1022可以经由连接线1025连接至参考电位。
在一些实施例中,如图7F所示,在衬底基板101的第一侧S1上形成感测元件102之后,将形成有感测元件102的衬底基板101翻转,以在衬底基板的第二侧S2上制作用于传输电信号的开关器件。
如图7G所示,在衬底基板101的第二侧S2上形成第一开关元件104,该第一开关元件104例如可以是薄膜晶体管。第一开关元件104的制造工艺可参照常规薄膜晶体管的制造工艺,在此不再赘述。形成的第一开关元件104和感测元件102例如可以位于阵列基板的显示区域内。
根据本实施例提供的阵列基板的制造方法,感测元件102和用于传输感测元件产生的电信号的开关器件分别制作在衬底基板101彼此相对的两侧。例如,在一些实施例中,先在衬底基板的第一侧制作感测元件102,然后在衬底基板的第二侧制作第一开关元件104。这样,一方面,由于在衬底基板的第一侧上制作感测元件时第一开关元件104还未形成,因此,制作感测元件102所需的复杂工艺条件不会影响到第一开关元件104。另一方面,在衬底基板的第二侧上制作第一开关元件104时所涉及的刻蚀工艺也不会对位于衬底基板的第一侧上已经形成的感测元件产生不利影响。
以上所述,仅为本公开提供的一些示例性实施例,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本公开揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。在不冲突的情况下,本公开的各个实施例及实施例中的特征可以相互组合以得到新的实施例。因此,本申请的保护范围应以所述权利要求的范围为准。
Claims (20)
- 一种阵列基板,包括:衬底基板;设置在所述衬底基板的第一侧的多个感测元件,每个感测元件被配置成至少将光信号和声波信号中的一个转换为电信号;多个开关器件,设置在与所述衬底基板的第一侧相对的第二侧,其中所述多个开关器件包括多个第一开关元件,每个第一开关元件与一个感测元件电连接以传输所述电信号。
- 如权利要求1所述的阵列基板,其中,每个感测元件包括第一电极、第二电极和传感层,所述传感层设置在所述第一电极和所述第二电极之间,所述第一电极与所述第一开关元件电连接,所述第二电极用于接收参考电位。
- 如权利要求2所述的阵列基板,其中,所述衬底基板包括多个过孔,每个感测元件的第一电极经由一个所述过孔与一个所述第一开关元件电连接,其中每个过孔的直径以及相邻过孔之间的间距均不大于手指指纹的纹线距离。
- 如权利要求2所述的阵列基板,其中所述阵列基板包括显示区域,所述显示区域包括第一区域和位于第一区域外围的第二区域,所述感测元件和所述第一开关元件位于所述第一区域内。
- 如权利要求4所述的阵列基板,其中,所述多个开关器件还包括位于第二区域内的第二开关元件,第一开关元件和第二开关元件均包括薄膜晶体管,其中所述感测元件的第一电极电连接至第一开关元件的源极或漏极,其中,所述第一开关元件和第二开关元件中的每个的栅极用于在第一时间段接收第一控制信号以驱动显示区域内的像素,所述第一开关元件的栅极还用于在第二时间段接收第二控制信号以实现所述电信号的传输。
- 如权利要求2所述的阵列基板,其中所述阵列基板还包括与 所述感测元件的第一电极电连接的金属引线,所述金属引线用于与独立于所述阵列基板的能量存储元件电连接。
- 如权利要求6所述的阵列基板,其中所述阵列基板还包括位于所述衬底基板的第二侧、与所述开关器件电连接的电致有机发光元件,其中所述传感层在所述衬底基板上的正投影与所述第一开关元件和所述电致有机发光元件的非透光区域在所述衬底基板上的正投影不重叠。
- 如权利要求6所述的阵列基板,其中所述传感层在所述衬底基板上的正投影与所述第一开关元件在所述衬底基板上的正投影至少部分重叠。
- 如权利要求2所述的阵列基板,其中,所述传感层包括光敏材料或声敏材料。
- 如权利要求2所述的阵列基板,其中,所述感测元件包括介质层,所述介质层覆盖感测元件的第一电极、第二电极和传感层。
- 如权利要求2所述的阵列基板,其中所述阵列基板还包括与所述感测元件的第一电极电连接的金属引线,所述传感层包括光敏材料并构造成在感测元件不进行指纹识别的状态下将接收到的光转换成电信号,所述金属引线用于与独立于所述阵列基板的能量存储元件电连接,以将该电信号传输至能量存储元件。
- 一种显示装置,包括如权利要求1-8任一所述的阵列基板。
- 如权利要求12所述的显示装置,其中所述感测元件是用于将声波信号转换为电信号的声波传感器,其中所述显示装置还包括用于产生声波的声波发生器。
- 如权利要求12所述的显示装置,其中所述显示装置还包括可充电电池,其中所述感测元件还电连接至所述可充电电池。
- 如权利要求12所述的显示装置,其中所述显示装置还包括可充电电池,所述阵列基板还包括与所述感测元件的第一电极电连接 的金属引线,所述传感层包括光敏材料并构造成在感测元件不进行指纹识别的状态下将接收到的光转换成电信号,所述金属引线用于与所述可充电电池电连接,以将该电信号传输至所述可充电电池。
- 一种阵列基板的制造方法,包括:提供衬底基板;在所述衬底基板的第一侧上形成多个感测元件,每个感测元件被配置成至少将光信号和声波信号中的一个转换为电信号;在与所述衬底基板的第一侧相对的第二侧上形成多个开关器件;其中所述多个开关器件包括多个第一开关元件,每个第一开关元件与一个感测元件电连接以传输所述电信号。
- 如权利要求16所述的方法,其中每个感测元件包括第一电极、第二电极、和位于第一电极和第二电极之间的传感层,其中所述方法还包括:在所述衬底基板中形成多个过孔,每个感测元件的第一电极经由一个所述过孔与所述第一开关元件电连接。
- 如权利要求17所述的方法,还包括:在衬底基板的第一侧上形成介质层,所述介质层覆盖感测元件的第一电极、第二电极和传感层。
- 如权利要求17所述的方法,其中所述阵列基板包括显示区域,所述显示区域包括第一区域和位于第一区域外围的第二区域,所述感测元件和所述第一开关元件位于所述第一区域内。
- 如权利要求19所述的方法,其中,所述多个开关器件还包括位于第二区域内的第二开关元件,第一开关元件和第二开关元件均包括薄膜晶体管,其中所述感测元件的第一电极电连接至第一开关元件的源极或漏极,其中,所述第一开关元件和第二开关元件中的每个的栅极用于在第一时间段接收第一控制信号以驱动显示区域内的像素,所述第一开关元件的栅极还用于在第二时间段接收第二控制信号以实现所述电信号的传输。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104808861A (zh) * | 2015-05-08 | 2015-07-29 | 上海中航光电子有限公司 | 阵列基板、显示面板及显示装置 |
KR20160032754A (ko) * | 2014-09-16 | 2016-03-25 | 엘지디스플레이 주식회사 | 지문 인식 소자를 포함한 액정 표시 장치 |
US20170177922A1 (en) * | 2015-12-18 | 2017-06-22 | Electronics And Telecommunications Research Institute | Fingerprint sensor and electronic device having the same |
CN107545230A (zh) * | 2016-06-29 | 2018-01-05 | 致伸科技股份有限公司 | 超声波式指纹识别模块及其制造方法 |
CN107946324A (zh) * | 2016-10-12 | 2018-04-20 | 群创光电股份有限公司 | 光感测装置 |
CN108229241A (zh) * | 2016-12-09 | 2018-06-29 | 上海箩箕技术有限公司 | 显示模组及其使用方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6636053B1 (en) | 2001-11-02 | 2003-10-21 | Stmicroelectronics, Inc. | Capacitive pixel for fingerprint sensor |
JP2008293136A (ja) | 2007-05-22 | 2008-12-04 | Glory Ltd | 指紋検出装置、指紋検出装置製造方法 |
JP5413371B2 (ja) | 2008-10-21 | 2014-02-12 | 日本電気株式会社 | 半導体装置及びその製造方法 |
CN104035253A (zh) | 2014-05-26 | 2014-09-10 | 京东方科技集团股份有限公司 | 阵列基板及其制备方法、显示面板 |
CN104102902B (zh) * | 2014-07-04 | 2017-07-04 | 京东方科技集团股份有限公司 | 一种半导体指纹识别传感器及其制造方法 |
US9679182B2 (en) * | 2014-11-12 | 2017-06-13 | Crucialtec Co., Ltd. | Display apparatus capable of image scanning and driving method thereof |
KR20160056759A (ko) * | 2014-11-12 | 2016-05-20 | 크루셜텍 (주) | 이미지 스캔이 가능한 플렉서블 디스플레이 장치 및 이의 구동 방법 |
KR102542983B1 (ko) | 2016-06-27 | 2023-06-15 | 삼성디스플레이 주식회사 | 터치 센서 및 이를 포함하는 표시 장치 |
CN106129069B (zh) | 2016-07-26 | 2019-11-05 | 京东方科技集团股份有限公司 | 一种指纹识别器、其制作方法及显示装置 |
US10741621B2 (en) * | 2016-11-25 | 2020-08-11 | Lg Display Co., Ltd. | Display device with a fingerprint sensor |
KR102530926B1 (ko) * | 2017-12-27 | 2023-05-09 | 엘지디스플레이 주식회사 | 지문 인식이 가능한 표시 장치 |
-
2018
- 2018-07-20 CN CN201810803078.5A patent/CN110739327B/zh active Active
-
2019
- 2019-05-08 WO PCT/CN2019/085973 patent/WO2020015440A1/zh unknown
- 2019-05-08 JP JP2020526494A patent/JP7323521B2/ja active Active
- 2019-05-08 US US16/607,192 patent/US11256891B2/en active Active
- 2019-05-08 EP EP19838837.3A patent/EP3826069A4/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160032754A (ko) * | 2014-09-16 | 2016-03-25 | 엘지디스플레이 주식회사 | 지문 인식 소자를 포함한 액정 표시 장치 |
CN104808861A (zh) * | 2015-05-08 | 2015-07-29 | 上海中航光电子有限公司 | 阵列基板、显示面板及显示装置 |
US20170177922A1 (en) * | 2015-12-18 | 2017-06-22 | Electronics And Telecommunications Research Institute | Fingerprint sensor and electronic device having the same |
CN107545230A (zh) * | 2016-06-29 | 2018-01-05 | 致伸科技股份有限公司 | 超声波式指纹识别模块及其制造方法 |
CN107946324A (zh) * | 2016-10-12 | 2018-04-20 | 群创光电股份有限公司 | 光感测装置 |
CN108229241A (zh) * | 2016-12-09 | 2018-06-29 | 上海箩箕技术有限公司 | 显示模组及其使用方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3826069A4 * |
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