WO2020004175A1

WO2020004175A1 - X-ray device, x-ray image generation method, and production method for structure

Info

Publication number: WO2020004175A1
Application number: PCT/JP2019/024299
Authority: WO
Inventors: 和弘矢野
Original assignee: 株式会社ニコン
Priority date: 2018-06-27
Filing date: 2019-06-19
Publication date: 2020-01-02
Also published as: JP2021156578A

Abstract

An x-ray device that comprises an x-ray source, a shielding member, an alteration part, a detector, and a generation part. The x-ray source emits x-rays toward an object to be measured. The shielding member: has a passage part that allows x-rays to pass; but blocks x-rays other than at the passage part. The alteration part alters the relative position between the shielding member and the object to be measured in a direction that intersects the advancement direction of the x-rays. The detector outputs, as an output signal, an intensity distribution for x-rays that have passed through the passage part and the object to be measured as in a plurality of positions reached by means of alterations made by the alteration part. The generation part uses the output signal from the detector to generate information about the intensity distribution for the x-rays for a region that is smaller than the size of the passage part in the abovementioned direction.

Description

X-ray apparatus, X-ray image generation method, and structure manufacturing method

The present invention relates to an X-ray apparatus, an X-ray image generation method, and a structure manufacturing method.

Conventionally, an X-ray apparatus that generates an image of an internal structure of an object to be measured based on phase information of an X-ray deflected by the object to be measured has been known. In order to acquire X-ray phase information, there is an X-ray apparatus that arranges a mask between an X-ray source and an object to be measured and between an object to be measured and a detector and measures deflected X-rays ( For example, Patent Document 1). The resolution (resolution) of the image of the internal structure of the object to be measured generated by such an X-ray apparatus is determined by the size of the opening provided in the shielding member. Because of the difficulty, it is difficult to increase the resolution of an image.

Japanese Patent No. 5280361

According to the first aspect, the X-ray apparatus has an X-ray source that emits X-rays toward an object to be measured, and a passing unit that passes the X-rays, and shields the X-rays other than the passing unit. A shielding member to be changed, a changing unit that changes a relative position between the shielding member and the device under test in a direction intersecting with the traveling direction of the X-ray, and a plurality of positions changed by the changing unit. A detector that outputs, as an output signal, an intensity distribution of the X-rays that have passed through the passing portion and the object to be measured, and a magnitude along the direction of the passing portion using an output signal from the detector. A generation unit that generates information on the intensity distribution of the X-rays in a region having a size smaller than the size.
According to a second aspect, the X-ray image generation method includes: emitting X-rays toward an object to be measured; passing the X-rays through the passing portion by a shielding member having a passing portion; In a direction intersecting with the traveling direction of the X-ray, changing the relative position between the shielding member and the object to be measured, at the plurality of changed positions, the passing portion and the object to be measured Outputting the intensity distribution of the passed X-rays as an output signal; and using the output signal, regarding the intensity distribution of the X-rays in a region having a size smaller than the size of the passing portion along the direction. Generating information.

It is a figure which shows typically an example of the principal part structure of the X-ray apparatus by embodiment. It is a figure which shows an example of an optical unit typically. The figure which expands and shows typically the positional relationship of the X-ray source at the time of producing | generating image data, the opening of a 1st optical element, the opening of a 2nd optical element, a measured object, and the pixel of a detector. It is. The figure which expands and shows typically the positional relationship of the X-ray source at the time of producing | generating image data, the opening of a 1st optical element, the opening of a 2nd optical element, a measured object, and the pixel of a detector. It is. 5 is a flowchart illustrating an operation of the X-ray apparatus according to the embodiment. FIG. 9 is a diagram illustrating a simulation result when differential phase image data is generated. It is a block diagram showing typically composition of a structure manufacturing system by an embodiment. 5 is a flowchart illustrating a process executed by the structure manufacturing system according to the embodiment.

An X-ray apparatus according to an embodiment will be described with reference to the drawings. An X-ray apparatus irradiates an object to be measured with X-rays and detects X-rays transmitted through the object to destroy internal information (for example, an internal structure) of the object to be measured. Get without. The X-ray apparatus can be used for biochemistry, medical treatment, and the like, for example, using a living body as an object to be measured.

FIG. 1 is a diagram showing an example of the configuration of the X-ray apparatus 100 according to the present embodiment. For convenience of explanation, a coordinate system including the X axis, the Y axis, and the Z axis is set as illustrated.

The X-ray apparatus 100 includes a housing 1, an X-ray source 2, a receiver 3, a detector 4, a controller 5, and an optical unit 6. The housing 1 is arranged so that its lower surface is substantially parallel (horizontal) to the floor surface of a factory or the like. An X-ray source 2, a receiver 3, a detector 4, and an optical unit 6 are housed inside the housing 1. The housing 1 includes an X-ray shielding material to prevent X-rays from leaking out of the housing 1. Note that lead is included as an X-ray shielding material.

The X-ray source 2 emits X-rays in the + Z-axis direction along the optical axis Zr parallel to the Z-axis with the emission point P shown in FIG. This emission point P coincides with the focal position of the electron beam accelerated and focused inside the X-ray source 2 described later. That is, the optical axis Zr is an axis connecting the emission point P, which is the focal position of the electron beam of the X-ray source 2, and the center of an imaging area of the detector 4 described later. The X-rays radiated from the X-ray source 2 may be any of a cone-shaped X-ray (so-called cone beam), a fan-shaped X-ray (so-called fan beam), and a linear X-ray (so-called pencil beam). May be. When a fan beam and a pencil beam are used, it is necessary to perform a scanning operation for relatively moving the beam and the object S in order to inspect the entire object S. The X-ray source 2 emits at least one of ultra soft X-rays of about 50 eV, soft X-rays of about 0.1 to 2 keV, X-rays of about 2 to 20 keV, and hard X-rays of about 20 keV to several MeV. .

The mounting section 3 includes a mounting table 31 on which the device to be measured S is mounted, and a manipulator section 36 including a rotation driving section 32, an X-axis moving section 33, a Y-axis moving section 34, and a Z-axis moving section 35. , X-ray source 2 on the Z axis + side.

The mounting table 31 is rotatably provided by the rotation drive unit 32. As will be described later, when the rotation axis Yr by the rotation drive unit 32 moves in the X-axis, Y-axis, and Z-axis directions, the mounting table 31 moves together.

The rotation drive unit 32 is configured by, for example, an electric motor or the like, and rotates the mounting table 31 by the rotation force generated by the electric motor driven and controlled by the control device 5 described later. The rotation axis Yr of the mounting table 31 is parallel to the Y axis and passes through the center of the mounting table 31.

The X-axis moving unit 33, the Y-axis moving unit 34, and the Z-axis moving unit 35 are controlled by the control device 5 to move the mounting table 31 in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. The Z-axis moving unit 35 is controlled by the control device 5 so that the distance from the X-ray source 2 to the object S is a distance corresponding to the magnification of the object S in a captured image. The table 31 is moved in the Z-axis direction.

The detector 4 is provided on the Z axis + side of the mounting table 31. That is, the mounting table 31 is provided between the X-ray source 2 and the detector 4 in the Z-axis direction. The detector 4 includes a scintillator unit including a known scintillation substance, a photomultiplier tube, a light receiving unit such as a CCD, and the like. The detector 4 emits light from the X-ray source 2 and is mounted on the mounting table 31. X-rays including transmitted X-rays that have passed through are received. After converting the received X-ray energy into light energy, the detector 4 converts the light energy into electric energy and outputs the same as an electric signal.

The detector 4 may convert the energy of the incident X-rays into an electric signal without converting the energy into light energy and output the electric signal. The detector 4 has a plurality of pixels, and the pixels are two-dimensionally arranged. Thereby, two-dimensional intensity distribution data of X-rays radiated from the X-ray source 2 and passing through the object S can be collectively acquired. Therefore, it is possible to acquire the entire projected image of the DUT S by one photographing.

The optical unit 6 has a first optical unit 61 and a second optical unit 62 for generating at least one of phase image data and scattered image data of the measured object S. In the present embodiment, the optical unit 6 is described as having a structure for generating at least one of phase image data and scattered image data by a known coded aperture (CA) method.

The first optical unit 61 is arranged in the path of X-rays between the X-ray source 2 and the object S. The first optical unit 61 has a first optical element 611 and an adjusting unit 613 that adjusts the position of the first optical element 611. The first optical element 611 is a shielding member that has a plurality of openings formed in, for example, a metal plate-like member, allows X-rays to pass through the openings, and shields X-rays in other than the openings. The shape of the opening may be a slit shape, a polygon such as a triangle or a rectangle, or a circle including a perfect circle and an ellipse. Note that, in the present embodiment, a case where the first optical element 611 has an opening as a passage portion through which X-rays pass is described as an example. However, the present invention is not limited to this example. Further, it may have a passage portion formed of a material that transmits X-rays. The first optical element 611 is attached to the adjustment unit 613 via an attachment structure (not shown). The adjusting unit 613 adjusts the position of the first optical element 611 under the control of the control device 5 described below. The adjusting unit 613 includes an X-axis adjusting unit 614 that adjusts the position of the first optical element 611 in the X-axis direction, a Y-axis adjusting unit 615 that adjusts the position in the Y-axis direction, and a Z that adjusts the position in the Z-axis direction. And an axis adjusting unit 616.

The second optical unit 62 is arranged in the path of X-rays between the object S and the detector 4. The second optical unit 62 has a second optical element 621 and an adjusting unit 623, like the first optical unit 61. The second optical element 621 is a shielding member that has a plurality of openings formed in, for example, a metal plate-shaped member, allows X-rays to pass through the openings, and shields X-rays in other than the openings. The shape of the opening may be a slit shape, a polygon such as a triangle or a rectangle, or a circle including a perfect circle and an ellipse. Note that, in the present embodiment, a case where the second optical element 621 has an opening as a passage portion when X-rays pass therethrough is described as an example, but the present invention is not limited to this example. Instead, it may have a passage portion formed of a member that transmits X-rays. The second optical element 621 is attached to the adjustment unit 623 via an attachment structure (not shown). The adjustment unit 623 adjusts the position of the second optical element 621 according to the control of the control device 5 described later. The adjustment unit 623 includes an X-axis adjustment unit 624 for adjusting the position of the second optical element 621 in the X-axis direction, a Y-axis adjustment unit 625 for adjusting the position in the Y-axis direction, and a Z-axis for adjusting the position in the Z-axis direction. And an axis adjusting unit 626. Note that the shape of the opening of the second optical element 621 corresponds to the shape of the opening of the first optical element 611.

FIG. 2 schematically shows an example of the first optical element 611 and the second optical element 621. FIG. 2A is a diagram schematically showing the shapes of the first optical element 611 and the second optical element 621 on the XY plane, and shows an example in which the opening has a slit shape. The first optical element 611 has a plurality of openings 619 (619a, 619b, 619c, 619d), and the second optical element 621 has a plurality of openings 629 (629a, 629b, 629c, 629d). The pitch of the openings 629 of the second optical element 621 is determined by the arrangement pitch of the pixels of the detector 4. The pitch of the opening 619 of the first optical element 611 is based on the arrangement pitch of the pixels of the detector 4, the distance from the X-ray source 2 to the device under test S, and the distance from the X-ray source 2 to the detector 4. Is determined. The number of

openings

619 and 629 shown in FIG. 2A is an example, and may be larger or smaller than the number shown in the figure.

ＸAs shown in FIG. 2B, the X-rays emitted from the X-ray source 2 pass through the opening 619 of the first optical element 611, and are absorbed in a region other than the opening 619. The X-ray that has passed through the opening 619 passes through the opening 629 of the second optical element 621, and is absorbed in a region other than the opening 629. As shown in FIG. 2B, the X-rays that have passed through the

openings

619a, 619b, 619c, and 619d pass through the

openings

629a, 629b, 629c, and 629d, respectively. That is, the

openings

619a, 619b, 619c, 619d of the first optical element 611 and the

openings

629a, 629b, 629c, 629d of the second optical element 621 are arranged so as to correspond one-to-one. The X-ray transmitted through the opening 629 enters the detector 4. In the example shown in the figure, the X-rays that have passed through the

openings

629a, 629b, 629c, and 629d enter the

pixels

411a, 411b, 411c, and 411d of the detector 4, respectively.

As shown in FIG. 2C, when the DUT exists between the first optical element 611 and the second optical element 621, the X-ray passes through the opening 619 and passes through the inside of the DUT. It is slightly deflected by refraction and scattering. In the example shown in FIG. 2C, since the phase of the X-ray that has passed through the

openings

619b and 619c of the first optical element 611 is modulated inside the object S, the X-ray when there is no object S shown by a solid line. Compared to the path of the line, it is deflected as shown by the dashed line. Due to this deflection, the X-ray dose passing through the

openings

629b and 629c of the second optical element 621 and entering the

pixels

411b and 411c of the detector 4 is compared with the case where the object S shown in FIG. Increase or decrease. The increased / decreased X-ray dose includes information on X-rays whose phase has been changed due to deflection and contrast has occurred. The image generation unit 53 described later generates at least one of the phase image data and the scattered image data based on the contrast generated by the change in the phase.

The control device 5 shown in FIG. 1 has a microprocessor, its peripheral circuits, and the like, and reads and executes a control program stored in advance in a storage medium (not shown) (for example, a flash memory or the like) to execute X control. Each part of the wire device 100 is controlled. The control device 5 is controlled based on an X-ray control unit 51 that controls the operation of the X-ray source 2, a mounting table control unit 52 that controls the driving operation of the manipulator unit 36, and an electric signal output from the detector 4. An image generation unit 53 that generates X-ray projection image data of the measurement object S, and an optical unit control unit 54 that controls driving operations of

adjustment units

613 and 623 that adjust the positions of the first optical element 611 and the second optical element 621. And

The image generation unit 53 generates at least one of phase image data and scattered image data based on information on a change in the intensity distribution of X-rays caused by at least one of X-ray scattering and phase modulation inside the object S. I do.

The image reconstructing unit 56 projects the X-ray irradiation direction relative to the measurement target S while relatively changing the X-ray irradiation direction, and based on at least one of the plurality of phase image data and the scattered image data obtained thereby, a known image. A reconstructed image of the device under test S is generated by using the reconstruction processing method. The image reconstruction processing generates cross-sectional image data and three-dimensional data that are the internal structure (cross-sectional structure) of the DUT S. Note that the cross-sectional image data includes structural data of the DUT S in a plane parallel to the XZ plane. The image reconstruction processing includes a back projection method, a filtered back projection method, a successive approximation method, and the like.

Hereinafter, a process of generating at least one of the phase image data and the scattered image data performed by the X-ray apparatus 100 of the present embodiment will be described.
FIGS. 3A and 3D show the X-ray source 2, the opening 619 of the first optical element 611, the opening 629 of the second optical element 621, the DUT S, and the pixel 411 of the detector 4. Is schematically shown in an enlarged manner. 3 (a) and 3 (d), the mounting table 31 is omitted.

As described above, a part of the X-ray emitted from the X-ray source 2 passes through the opening 619 of the first optical element 611, and the other is absorbed by the first optical element 611. The X-ray that has passed through the opening 619 transmits through some of the regions R1 and R2 of the measured object S. As shown in FIG. 3A, the length in the X direction (that is, the direction intersecting the direction in which the X-rays travel) in which the regions R1 and R2 of the DUT through which the X-rays pass is equal to the opening 619. In the X direction (opening width) d. The X-ray transmitted through the regions R1 and R2 of the device S passes through the opening 629 of the second optical element 621 and enters the pixel 411 of the detector 4.

The X-axis adjusting unit 624 of the adjusting unit 623 is controlled by the optical unit control unit 54 to move the second optical element 621 in the X direction. Accordingly, the opening 629 of the second optical element 621 moves in the range of the pixel 411 along the X direction. For example, in FIG. 3A, the opening 629 moves from the left end to the right end of the pixel 411 at a constant speed in the negative direction in the X direction. As a result, a distribution of X-ray detection intensities in the pixel 411 along the X direction is obtained. That is, the X-rays whose phases are modulated inside the regions R1 and R2 of the device S are deflected, pass through the aperture 629, and enter the pixel 411. Along with the movement of the opening 629, the pixel 411 outputs an output signal corresponding to the intensity distribution of the incident X-ray, that is, the X-ray transmitted through some of the regions R1 and R2 of the device S. This output signal includes information on a change in the X-ray intensity distribution caused by at least one of X-ray scattering and phase modulation inside the regions R1 and R2 of the device S. FIG. 3B shows an intensity distribution I1 (x) of the X-rays that have passed through the apertures 619 of the first optical element 611 and transmitted through the regions R1 and R2 of the device under test S and entered the pixels 411 in this case. Is schematically shown. Note that x indicates a position in the X direction in the pixel 411.

Assuming that the position on the pixel 411 to which the X-ray that has passed through the boundary between the regions R1 and R2 reaches is x0, as shown in FIG. 3B, the X-ray intensity detected by the pixel 411 is near the position x0. And becomes smaller as the distance from the position x0 increases. Therefore, the intensity of the X-rays detected by the pixel 411 becomes maximum when the center of the opening 629 is near the position x0, and decreases as the center of the opening 629 moves away from the position x0.

When the positional relationship between the opening 619 of the first optical element 611 and the device under test S is as shown in FIG. 3A, the X-rays passing through the opening 619 pass through the region R1 of the device under test S as described above. And R2. Therefore, the X-ray intensity distribution I1 (x) shown in FIG. 3 (b) has intensity information r1 (x) of the X-ray transmitted through the region R1 of the measured object S as shown in FIG. 3 (c). And intensity information r2 of the X-ray transmitted through the region R2.

Next, the optical unit control unit 54 controls the adjustment unit 613 to move the first optical element 611 by a predetermined amount in the X direction to the negative side in the X direction, and controls the adjustment unit 623 to control the second optical element. The element 621 is moved along the X direction, and the opening 629 is moved within the range of the pixel 411 (dithering). Due to the movement of the first optical element 611, the relative position between the first optical element 611 and the device under test S is changed along the X direction. At this time, the adjustment unit 613 moves the first optical element 611 such that the movement amount of the device under test S is smaller than the opening width d of the opening 619 of the first optical element 611. FIG. 3D shows an example in which the amount of movement of the first optical element 611 from the state of FIG. 3A is １／ of the opening width d of the opening 619. Note that the amount of movement of the first optical element 611 is not limited to a half of the opening width d of the opening 619, but is a fraction of the opening width d, for example, 1/3 or 1/4 or less. May be. In this specification, for the sake of convenience, in the following description, movement of the second optical element 621 by a movement amount smaller than the opening width d along the X direction is referred to as dithering.

Since the relative position of the first optical element 611 and the device under test S in the X direction is changed to １／ in the X direction by の of the opening width d, the first optical element 611 has passed through the opening 619 of the first optical element 611. X-rays pass through the regions R2 and R3 of the object S. The X-ray transmitted through the regions R2 and R3 of the device S passes through the opening 629 of the second optical element 621 and enters the pixel 411 of the detector 4. Also in this case, similarly to the case described with reference to FIG. 3A, the X-axis adjustment unit 624 of the adjustment unit 623 is controlled by the optical unit control unit 54 to move the second optical element 621 along the X direction. To move the range of the pixel 411. The X-rays whose phases are modulated inside the regions R2 and R3 of the device under test S are deflected, pass through the aperture 629, and enter the pixel 411. As the aperture 629 moves, the pixel 411 An output signal is output in accordance with the intensity distribution of the X-rays transmitted, that is, the X-rays transmitted through some of the regions R2 and R3 of the object S.

In this case, the X-ray intensity detected by the pixel 411 increases near the position (x0-d / 2) shifted from the position on the pixel 411 by x / 2 on the negative side in the X direction, and the position (x0− d / 2), the distance decreases. Therefore, the X-ray intensity detected by the pixel 411 becomes maximum when the center of the opening 629 is near the position (x0-d / 2), and as the center of the opening 629 moves away from the position (x0-d / 2). Become smaller. Also in this case, since the X-rays that have passed through the opening 619 pass through the regions R2 and R3 of the measured object S, the X-ray intensity distribution I2 (x) shown in FIG. As shown in ()), it is configured to include the intensity information r2 (x) of the X-ray transmitted through the region R2 of the DUT and the intensity information r3 of the X-ray transmitted through the region R3.

Thereafter, similarly, each time dithering is performed to change the relative position between the first optical element 611 and the device under test S by の of the aperture width d along the X direction, the pixel of the detector 4 is changed. Reference numeral 411 outputs an output signal corresponding to the intensity distribution of the X-rays that have passed through the opening 619 and transmitted through a partial region of the device under test S.

FIG. 4 schematically shows the positional relationship between the first optical element 611 and the device S after dithering has been performed (n-1) times. In FIG. 4A, the mounting table 31 is omitted for convenience of illustration. In the case of the positional relationship shown in FIG. 4A, the X-ray that has passed through the opening 619 of the first optical element 611 passes through the regions Rn and Rn + 1 of the device under test S and enters the pixel 411. The X-ray intensity detected by the pixel 411 increases near the position (x0-nd / 2) of the pixel 411 and decreases as the position moves away from the position (x0-nd / 2). Therefore, the intensity detected by the pixel 411 becomes maximum when the center of the opening 629 is near the position (x0-nd / 2), and decreases as the center of the opening 629 moves away from the position (x0-nd / 2). .

Every time dithering is repeated, the position at which the pixel 411 detects the maximum intensity is away from the position x0, so that the X-ray detection intensity at the position x0 of the pixel 411 decreases. For example, n = 3, that is, regarding the detection intensity of the X-ray transmitted through the regions R4 and R5 of the object S at the pixel 411, the intensity information r4 () of the X-ray transmitted through the regions R4 and R5 of the object S. x0) and r5 (x0) are both small, but r5 (x0) is smaller than X-ray intensity information r4 (x0).

As described above, the image generation unit 53 determines the phase image data and the scattering based on the output signal at the position x0 of the intensity information of the X-ray transmitted through the regions R1, R2,..., Rn, and Rn + 1 of the DUT S. At least one of the image data is generated.

強度 The intensity distribution of each X-ray obtained before and after the dithering includes the intensity information of the X-ray transmitted through at least a part of the same region of the object S. That is, the region R2 of the regions R1 and R2 of the DUT through which X-rays pass before dithering (in the case of FIG. 3 (a)) is X-shaped after dithering (in the case of FIG. 3 (d)). It is also a region R2 of the regions R2 and R3 of the DUT through which the line passes. This relationship also applies to the subsequent dithering, and the X-rays pass through some common regions of the device under test S.

Therefore, the intensity of the X-ray at the position x of the pixel 411 obtained for each dithering can be expressed in a form including the respective intensity information as follows.
I1 (x) = r1 (x) + r2 (x)
I2 (x) = r2 (x) + r3 (x)
...
In (x) = rn (x) + rn + 1 (x)

The image generation unit 53 solves the above simultaneous equations to obtain the regions R1, R2, R3,..., Rn, Rn + 1 of the measurement target S that are smaller than the opening width d of the opening 619 of the first optical element 611. The X-ray intensity distribution corresponding to each is calculated.

Since the above simultaneous equations have more unknowns than equations, they cannot be solved as they are. Regarding this point, a procedure for solving the simultaneous equations by reducing unknowns by performing the following processing will be described below.

As described above, the detection intensity of the X-ray at the position x0 of the pixel 411 decreases every time the dithering is repeated a plurality of times. For example, when the intensity of the X-ray transmitted through the regions R4 and R5 of the DUT at the position x0 is considerably small, the intensity information of the X-ray transmitted through the region R5 can be regarded as substantially zero. In such a case, r5 (x0) in the above simultaneous equations is regarded as 0, and the image generation unit 53 determines the X-ray intensities I1 (x0), I2 (x0), I3 (x0), and I4 (x0). Each of the X-ray intensity information r1 (x0), r2 (x0), r3 (x0), and r4 (x0) at the position x0 of the pixel 411 is calculated from the four equations. Further, the image generation unit 53 similarly calculates X-ray intensity information r1, r2, r3,..., Rn + 1 at a plurality of positions different from the position x0 on the pixel 411. From the X-ray intensity information for each of the plurality of positions, the image generation unit 53 generates X-ray intensity information r1 (x), r2 (x), r3 (x),..., Rn + 1 (x) for the pixel 411. calculate. The image generation unit 53 calculates the X-ray intensity information in the same manner even when the object S is not mounted on the mounting table 31, and calculates the X-ray intensity when the object S is not mounted. Of the phase image data and the scattering image data for each of the regions R1, R2, R3, R4,..., Rn + 1 based on the difference between the intensity information of Generate at least one. The image generation unit 53 connects (combines) the image data for each of these regions R1, R2, R3, R4,..., Rn + 1, and at least one of the phase image data and the scattered image data of the entire DUT. Generate

The operation of the X-ray apparatus 100 according to the present embodiment will be described with reference to the flowchart of FIG. Each process of the flowchart shown in FIG. 5 is performed by executing a program in the control device 5. This program is stored in a memory (not shown), and is started and executed by the control device 5.

In step S1, the mounting table control unit 52 controls the X-axis moving unit 33 of the manipulator unit 36 to move the mounting table 31 in the X direction, so that the opening 619 of the first optical element 611 and the DUT S Is set in the X direction, and the process proceeds to step S2. In step S2, the detector 4 outputs an output signal in accordance with the intensity distribution of the X-ray that has passed through the opening 619 of the first optical element 611 and has passed through a partial area of the object S, and proceeds to step S3. move on. Note that X-rays transmitted through the object S enter the detector 4 as the optical unit controller 54 moves the opening 629 of the second optical element 621 in the X direction.

In step S3, the image generating unit 53 determines whether or not it is necessary to change (dither) the relative position between the DUT S and the opening 619 of the first optical element 611. When it is determined that the relative position needs to be changed, step S3 is affirmatively determined and the process returns to step S1. If it is determined that the relative position does not need to be changed, that is, it is determined that dithering has been completed, a negative determination is made in step S3, and the process proceeds to step S4. In step S4, the image generation unit 53 is smaller than the opening width d of the opening 619 of the first optical element 611 of the device under test S based on the plurality of output signals output before and after each dithering. The X-ray intensity distributions I1 (x), I2 (x), I3 (x),... Corresponding to the regions R1 and R2, the regions R2 and R3,.

In step S5, the image generation unit 53 determines the regions R1, R2, R3,... Of the object S based on the calculated X-ray intensity distributions I1 (x), I2 (x), I3 (x),. , The intensity information r1 (x), r2 (x), r3 (x),... Of the X-ray transmitted through. The image generation unit 53 generates at least one of phase image data and scattered image data corresponding to each of the regions R1, R2, R3,... Of the measured object S based on the calculated intensity information, and proceeds to step S6. . In step S6, at least one of phase image data and scattered image data of the object S is generated by combining image data for each of the regions R1, R2, R3,... Of the object S, and the process ends.

FIG. 6 shows a simulation result in the case where differential phase difference image data is generated by performing the above processing. In the simulation, the phase change of the X-ray passing through the aperture 619 of the first optical element 611 is a cosine function with a period of 45 [μm] corresponding to a Gaussian shape having a continuous standard deviation σ of 20 [μm] in the ZX cross section. The opening width d of the opening 619 of the first optical element 611 is set to 44.46 [μm], and the moving amount of the relative position between the opening 619 and the object S is set to 14.82 [μm]. .

In FIG. 6, the derivative of the phase modulation of the X-ray generated by the object S is indicated by L1, the differential phase calculated from the intensity distribution of the X-ray generated based on L1 is indicated by L2, and The differential phase obtained by the processing described in the above embodiment is indicated by L3. In FIG. 6, L1 is indicated by a dashed line, L2 is indicated by a solid line, and L3 is indicated by a broken line. As shown in FIG. 6, L2 cannot reproduce the differential phase distribution indicated by L1. That is, when the conventional method is used, the differential phase distribution indicated by L1 cannot be reproduced. On the other hand, since L3 forms a waveform having a shape similar to that of L1, it is understood that the differential phase distribution indicated by L1 can be reproduced with high accuracy. That is, it is understood that the change in the phase of the X-ray can be reproduced by the processing described in the above embodiment.

In the above-described embodiment, the case where the image generation unit 53 generates at least one of the phase image data and the scattered image data has been described as an example. However, the image generation unit 53 uses the X-ray intensity information r1. (X), r2 (x), r3 (x),... Rn (x) are calculated, and the absorption image for each of the regions R1, R2, R3,. Data may be generated. That is, the image generation unit 53 of the present embodiment can generate at least one of the absorption image data, the phase image data, and the scattered image data.

Next, a structure manufacturing system according to an embodiment of the present invention will be described with reference to the drawings. The structure manufacturing system according to the present embodiment creates a molded product such as an electronic component including a door portion, an engine portion, a gear portion, and a circuit board of an automobile, for example.

FIG. 7 is a block diagram showing an example of the configuration of the structure manufacturing system 400 according to the present embodiment. The structure manufacturing system 400 includes the X-ray device 100 described in the first embodiment, a design device 410, a molding device 420, a control system 430, and a repair device 440.

The design device 410 is a device used by a user when creating design information on the shape of a structure, and performs a design process of creating and storing design information. The design information is information indicating the coordinates of each position of the structure. The design information is output to the molding device 420 and a control system 430 described later. The molding device 420 performs a molding process of creating and molding a structure using the design information created by the design device 410. In this case, the forming apparatus 420 that performs at least one of lamination processing, casting processing, forging processing, and cutting processing represented by 3D printer technology is also included in one embodiment of the present invention.

The X-ray apparatus 100 performs a measurement process for measuring the shape of the structure formed by the forming apparatus 420. The X-ray apparatus 100 outputs information indicating the coordinates of the structure (hereinafter, referred to as shape information), which is a measurement result of the structure, to the control system 430. The control system 430 includes a coordinate storage unit 431 and an inspection unit 432. The coordinate storage unit 431 stores the design information created by the design device 410 described above.

The inspection unit 432 determines whether the structure formed by the forming device 420 has been formed according to the design information created by the design device 410. In other words, the inspection unit 432 determines whether the formed structure is a non-defective product. In this case, the inspection unit 432 performs an inspection process of reading out the design information stored in the coordinate storage unit 431 and comparing the design information with the shape information input from the X-ray apparatus 100. The inspection unit 432 compares, for example, the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information as the inspection process, and, if the coordinates of the design information match the coordinates of the shape information as a result of the inspection process, It is determined that it is a non-defective product molded according to the design information. If the coordinates of the design information and the coordinates of the corresponding shape information do not match, the inspection unit 432 determines whether the difference between the coordinates is within a predetermined range, and if the difference is within the predetermined range, restoration is possible. Is determined to be a defective product.

If it is determined that the defective product can be repaired, the inspection unit 432 outputs repair information indicating the defective portion and the repair amount to the repair device 440. The defective part is a part having the coordinates of the shape information that does not match the coordinates of the design information, and the repair amount is the difference between the coordinates of the design information and the coordinates of the shape information in the defective part. The repair device 440 performs a repair process for reworking a defective portion of the structure based on the input repair information. The repair device 440 performs the same process as the molding process performed by the molding device 420 in the repair process again.

The processing performed by the structure manufacturing system 400 will be described with reference to the flowchart shown in FIG.

In step S31, the design device 410 is used when a user designs a structure, creates and stores design information on the shape of the structure by a design process, and proceeds to step S32. Note that the present invention is not limited to only the design information created by the design apparatus 410, and the one in which the design information is acquired by inputting the design information when the design information already exists is included in one embodiment of the present invention. It is. In step S32, the molding device 420 creates and molds the structure based on the design information by the molding process, and proceeds to step S33. In step S33, the X-ray apparatus 100 performs a measurement process to measure the shape of the structure, outputs shape information, and proceeds to step S34.

In step S34, the inspection unit 432 performs an inspection process of comparing the design information created by the design device 410 with the shape information measured and output by the X-ray device 100, and proceeds to step S35. In step S35, based on the result of the inspection process, the inspection unit 432 determines whether the structure formed by the forming device 420 is a non-defective product. If the structure is non-defective, that is, if the difference between the coordinates of the design information and the coordinates of the shape information is within a predetermined range, the determination in step S35 is affirmative and the process ends. If the structure is not conforming, that is, if the coordinates of the design information do not match the coordinates of the shape information, or if coordinates that are not in the design information are detected, a negative determination is made in step S35 and the process proceeds to step S36.

In step S36, the inspection unit 432 determines whether the defective part of the structure can be repaired. If the defective part cannot be repaired, that is, if the difference between the coordinates of the design information and the coordinates of the shape information in the defective part exceeds a predetermined range, a negative determination is made in step S36 and the process ends. If the defective portion can be repaired, that is, if the difference between the coordinates of the design information and the coordinates of the shape information at the defective portion is within a predetermined range, the determination in step S36 is affirmative, and the process proceeds to step S37. In this case, the inspection unit 432 outputs the repair information to the repair device 440. In step S37, the repair device 440 performs a repair process on the structure based on the input repair information, and returns to step S33. As described above, the repair device 440 performs the same process as the molding process performed by the molding device 420 in the repair process again.

According to the above-described embodiment, the following operation and effect can be obtained.
(1) The first optical element 611 has an opening 619 through which X-rays from the X-ray source 2 pass. The mounting table control unit 52 controls the manipulator unit 36 to change the relative position between the first optical element 611 and the device under test S in the X direction that intersects the traveling direction of the X-ray. The detector 4 outputs, as output signals, the intensity distribution of X-rays that have passed through the opening 619 and transmitted through the object S at the plurality of changed positions. The image generation unit 53 uses the output signal from the detector 4 to obtain information on the X-ray intensity distribution in a region having a size smaller than the opening width d of the opening 619. Accordingly, it is possible to generate absorption image data, phase image data, and scattering image data having a resolution smaller than the opening width d of the opening 619 of the first optical element 611. Thus, the conventional coded aperture method in which the resolution (resolution) of the phase image or the scattering image is determined by the opening width of the opening of the optical element without forming the opening width d of the opening 619 of the first optical element 611 smaller. It is possible to generate a higher resolution image than that.

(2) The mounting table controller 52 changes the relative position between the first optical element 611 and the device under test S by a movement amount smaller than the opening width d of the opening 619. This makes it possible to acquire information inside the device under test S corresponding to a region smaller than the opening width d of the opening 619 of the first optical element 611.

(3) The image generation unit 53 changes the intensity distribution of the X-rays transmitted through the regions R1 and R2 of the DUT included in the output signal before the relative position is changed, and changes the relative position. The intensity distribution of the X-rays transmitted through the regions R2 and R3 of the DUT included in the output signal after the separation is separated into the intensity distributions of the X-rays transmitted through the regions R1, R2 and R3. Then, absorption image data, phase image data, and scattering image data of each region are generated. This makes it possible to generate absorption image data, phase image data, and scattering image data with a higher resolution than the resolution determined by the opening width d of the opening 619 of the first optical element 611.

(4) The X-ray apparatus 100 of the structure manufacturing system 400 performs a measurement process of acquiring shape information of the structure created by the molding device 420 based on the design process of the design device 410, and performs an inspection unit of the control system 430. Reference numeral 432 performs an inspection process of comparing the shape information acquired in the measurement process with the design information created in the design process. Therefore, inspection of structural defects and information inside the structure by non-destructive inspection can be performed to determine whether the structure is a non-defective product created according to the design information. To contribute.

(5) The repair device 440 performs a repair process for performing the molding process again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same process as the molding process can be performed on the structure again, which contributes to the manufacture of a high-quality structure close to the design information.

The following modifications are also within the scope of the present invention, and one or more of the modifications can be combined with the above-described embodiment.
(1) The present invention is not limited to the method in which the mounting table 31 is moved and the dithering is performed, and any mode in which the relative position between the first optical element 611 and the device under test S is changed along the X direction may be applied. . For example, the mounting table control unit 52 controls the manipulator unit 36 to move the mounting table 31 along the X direction, thereby moving and dithering the device under test S, or the first optical element 611. And the mounting table 31 may be moved along the X direction for dithering.

(2) In the above-described embodiment, the control device 5 of the X-ray apparatus 100 has been described as including the image generation unit 53 and the image reconstruction unit 56. The component 56 may not be provided. The image generating unit 53 and the image reconstructing unit 56 are provided in a processing device or the like separate from the X-ray apparatus 100, and acquire a signal output from the detector 4 via, for example, a network or a storage medium. Thus, absorption image data, phase image data, scattered image data, and three-dimensional data may be generated.

The present invention is not limited to the above-described embodiments as long as the features of the present invention are not impaired, and other forms conceivable within the technical idea of the present invention are also included in the scope of the present invention. .

The disclosure of the following priority application is incorporated herein by reference.
Japanese Patent Application No. 2018223887 (filed on June 27, 2018)

2 X-ray source 3 Mounting unit 4 Detector 5 Control device 6 Optical unit 31 Mounting table 53 Image generating unit 54 Optical unit control unit 61 First optical unit 62 Second optical unit 400 ... structure manufacturing system 410 ... design apparatus 420 ... molding apparatus 430 ... control system 440 ... repair apparatus 611 ... first optical element 621 ... second

optical elements

613 and 623 ...

adjustment parts

619 and 629 ... opening

Claims

An X-ray source that emits X-rays toward an object to be measured;
A shielding member that has a passage portion that allows the X-ray to pass therethrough, and shields the X-ray except at the passage portion.
In a direction intersecting with the traveling direction of the X-ray, a changing unit that changes a relative position between the shielding member and the device under test,
At the plurality of positions changed by the change unit, a detector that outputs, as an output signal, an intensity distribution of the X-rays that have passed through the passing unit and the object to be measured,
A generator configured to generate information related to the intensity distribution of the X-rays in a region having a size smaller than the size of the passing portion along the direction, using an output signal from the detector. .
The X-ray apparatus according to claim 1,
The X-ray apparatus, wherein the changing unit changes the relative position in the direction by a movement amount smaller than a size of the passing unit.
The X-ray apparatus according to claim 2,
The X-ray apparatus, wherein the changing unit changes the relative position in the direction by a moving amount that is a fraction of the size of the passing unit.
The X-ray apparatus according to claim 3,
An output signal output from the detector before the relative position is changed by the changing unit and an output signal output from the detector after the relative position is changed are the same as the output signal. An X-ray apparatus including information on an intensity distribution of the X-ray that has passed through at least a part of a common area of the measurement object.
The X-ray apparatus according to claim 4,
The generation unit may be configured to change an intensity distribution of the X-rays through which the X-rays pass through the first area and the second area of the object to be measured before the relative position is changed, and change the relative position. And the intensity distribution of the X-rays after the X-rays have passed through the second and third regions of the object to be measured pass through the first, second, and third regions, respectively. An X-ray apparatus that generates information on the X-ray intensity distribution for each of the regions by separating the X-ray intensity distribution.
The X-ray apparatus according to any one of claims 1 to 5,
An image generation unit that generates at least one of the X-ray absorption image data, the X-ray phase image data, and the X-ray scattered image data based on the information on the X-ray intensity distribution, X-ray equipment further provided.
Emitting X-rays toward the object to be measured;
Passing the X-rays through the passing portion by a shielding member having a passing portion;
In a direction intersecting with the traveling direction of the X-ray, changing a relative position between the shielding member and the object to be measured,
At the plurality of changed positions, outputting an intensity distribution of the X-rays that have passed through the passing portion and the object to be measured as an output signal,
Using the output signal to generate information on the intensity distribution of the X-rays in a region having a size smaller than the size of the passing portion along the direction.
The X-ray image generation method according to claim 7,
An X-ray image generation method, wherein the relative position between the shielding member and the object to be measured is changed by a movement amount smaller than the size of the passage section in the direction.
The X-ray image generation method according to claim 8,
An X-ray image generation method, wherein the relative position is changed in the direction by an amount of movement that is a fraction of the size of the passing portion.
The X-ray image generation method according to claim 9,
An output signal output before the relative position is changed and an output signal output after the relative position is changed pass through at least a part of a common area of the device under test. An X-ray image generation method including information on the X-ray intensity distribution described above.
The X-ray image generation method according to claim 10,
Before the relative position is changed, the X-rays pass through the first area and the second area of the device under test, and the X-ray intensity distribution and the X-rays after the relative position is changed. The intensity distribution of the X-rays whose lines have passed through the second and third regions of the object to be measured is compared with the intensity distribution of the X-rays which pass through the first, second and third regions, respectively. An X-ray image generation method, wherein the X-ray image generation method generates information on the X-ray intensity distribution for each of the regions, separated into intensity distributions.
The X-ray image generation method according to any one of claims 7 to 11,
X-ray image generation, wherein at least one of the X-ray absorption image data, the X-ray phase image data, and the X-ray scatter image data is generated based on information on the X-ray intensity distribution. Method.
Create design information on the shape of the structure,
Creating the structure based on the design information,
The shape of the created structure is measured using the X-ray apparatus according to any one of claims 1 to 6 to obtain shape information,
A method for manufacturing a structure, wherein the acquired shape information is compared with the design information.
The method for manufacturing a structure according to claim 13,
A method for manufacturing a structure, the method being performed based on a comparison result between the shape information and the design information, wherein the structure is reworked.
The method for manufacturing a structure according to claim 14,
In the method of manufacturing a structure, the rework of the structure is performed again based on the design information.