WO2016056107A1 - Projection data generator, measuring device, and structure manufacturing method - Google Patents

Abstract

A projection data generator is provided with a radiation source, a detector that detects the radiation from the radiation source and outputs the detected data, a mount that is placed between the radiation source and the detector, and a generation unit that generates the projection data of an object to be measured. The generation unit generates the projection data of the object to be measured either based on first data that is output by the detector when the object to be measured is placed on the mount and second data that is output by the detector when the object to be measured is not placed on the mount, or based on the first data and estimated data which is the data estimated to be output by the detector when the mount on which the object to be measured is not placed is positioned between the radiation source and the detector.

Description

Projection data generation apparatus, measurement apparatus, and structure manufacturing method

The present invention relates to a projection data generation device, a measurement device, and a structure manufacturing method.

2. Description of the Related Art Conventionally, a method for reconstructing a three-dimensional CT image of an object by converting X-ray cone beam data that has passed through a measurement object is known (for example, Patent Document 1).

US Pat. No. 5,257,183

However, there is a problem in that an accurate reconstructed image cannot be obtained due to scattering, reflection, and the like caused by the structure of the measuring apparatus and the placement of a mounting table for mounting the object to be measured. .

According to the first aspect of the present invention, the projection data generating apparatus includes a radiation source that emits radiation to the object to be measured, a detector that detects radiation emitted from the radiation source, and outputs detection data; A generating member that is disposed between the source and the detector and that mounts the object to be measured; and a generation unit that generates projection data of the object to be measured based on the radiation detected by the detector. The unit includes first data output as detection data by the detector when the object to be measured is mounted on a mounting member positioned between the radiation source and the detector, and between the radiation source and the detector. Generating projection data of the object to be measured based on the second data output as detection data by the detector when the object to be measured is not placed on the placing member positioned at the position, or the first data, There is a mounting member on which the object to be measured is not mounted between the radiation source and the detector. Generating a projection data of the object based upon the estimated data detector is estimated to output if you location.
According to the second aspect of the present invention, in the projection data generation device according to the first aspect, the generation unit further generates a mounting member between the radiation source and the detector when generating the projection data of the measurement object. It is preferable to use the third data output as detection data by the detector when there is no data.
According to the third aspect of the present invention, it is preferable that the projection data generation apparatus according to the second aspect further includes a moving unit that moves the mounting member relative to the radiation source and the detector.
According to the fourth aspect of the present invention, in the projection data generation device according to the third aspect, the relative position of the mounting member with respect to the radiation source and the detector when the first data is output by the detector, and the detector It is preferable that the relative position of the mounting member with respect to the radiation source and the detector when the second data is output is the same.
According to the fifth aspect of the present invention, in the projection data generation device according to the fourth aspect, the storage unit that stores the plurality of second data output for each predetermined relative position in association with the relative position, and the radiation source And a position detection unit that detects a relative position of the mounting member with respect to the detector, and the generation unit is detected by the position detection unit when the first data and the first data are output by the detector. It is preferable to generate projection data of the object to be measured based on the second data stored in association with the same relative position as the relative position.
According to a sixth aspect of the present invention, in the projection data generation apparatus according to the fourth or fifth aspect, the output of the radiation emitted from the radiation source when the first data is output by the detector, and the detector The output of the radiation emitted from the radiation source when the second data is output is preferably the same.
According to the seventh aspect of the present invention, in the projection data generation device according to any one of the fourth to sixth aspects, the detector detects when a measurement object different from the measurement object is placed on the placement member. It is preferable to generate projection data of different objects to be measured based on the output detection data and the second data.
According to the eighth aspect of the present invention, in the projection data generation apparatus according to the third aspect, the relative position of the mounting member with respect to the radiation source and the detector when the first data is output by the detector, and the estimated data It is preferable that the relative position of the mounting member with respect to the radiation source and the detector at the time of estimation is the same.
According to a ninth aspect of the present invention, in the projection data generation apparatus according to the eighth aspect, a storage unit that stores a plurality of estimated data estimated for each predetermined relative position in association with the relative position, a radiation source, and A position detector that detects a relative position of the mounting member with respect to the detector, and the generator detects the first data, the third data, and the first data when the detector outputs the first data. Preferably, the projection data of the object to be measured is generated based on the estimated data stored in association with the same relative position as the relative position detected by.
According to a tenth aspect of the present invention, in the projection data generating apparatus according to the eighth or ninth aspect, the output of radiation emitted from the radiation source when the first data is output by the detector, and the detector It is preferable that the output of the radiation emitted from the radiation source when the third data is output is the same.
According to the eleventh aspect of the present invention, in the projection data generation apparatus according to any one of the eighth to tenth aspects, the detector detects when a measurement object different from the measurement object is placed on the placement member. It is preferable to generate projection data of different objects to be measured based on the output detection data, the third data, and the estimation data.
According to the twelfth aspect of the present invention, in any one of the eighth to eleventh aspect projection data generation apparatuses, the estimated data is preferably data generated using the structure information and the material of the mounting member. .
According to the thirteenth aspect of the present invention, in the projection data generation device according to any one of the fourth to twelfth aspects, it is preferable that the relative position includes a relative direction of the mounting member with respect to the radiation.
According to the fourteenth aspect of the present invention, in the projection data generating apparatus according to any one of the first to thirteenth aspects, the placing member preferably includes a jig for placing the object to be measured stably.
According to a fifteenth aspect of the present invention, in the projection data generation device according to any one of the first to fourteenth aspects, the generation unit uses one of the second data and the estimated data to load the first data. It is preferable to generate projection data of an object to be measured in which the scattered component of X-rays scattered by the mounting member is reduced.
According to the sixteenth aspect of the present invention, in the projection data generation device according to any one of the first to fourteenth aspects, the estimation data is simulation data obtained by calculating, by simulation, detection data relating to the placement unit output from the detector. Preferably there is.
According to the seventeenth aspect of the present invention, there is provided a measurement device that is different from the projection data generation device according to any one of the first to sixteenth aspects in a state in which the relative positions of the radiation source and the detector with respect to the measurement object are different. And a reconstruction unit that generates internal structure information of the measurement object based on the projection data of the plurality of measurement objects generated by the generation unit.
According to an eighteenth aspect of the present invention, in the structure manufacturing method, the design information relating to the shape of the structure is created, the structure is created based on the design information, and the shape of the created structure is changed to the seventeenth aspect. The shape information is obtained by measurement using the measurement device according to the aspect, and the obtained shape information is compared with the design information.
According to the nineteenth aspect of the present invention, in the structure manufacturing method according to the eighteenth aspect, it is preferable that the structure is reprocessed based on a comparison result between the shape information and the design information.
According to the twentieth aspect of the present invention, in the structure manufacturing method according to the nineteenth aspect, it is preferable that the rework of the structure is performed again based on the design information.

According to the present invention, it is possible to generate a reconstructed image in which the influence of X-ray scattering, reflection, and the like by a mounting table for mounting the object to be measured is suppressed.

The figure which shows the structure of the X-ray apparatus by embodiment of this invention The figure which shows typically the structure of the X-ray source by 1st, 2nd embodiment. The figure which shows typically the method of acquiring the data used for the production | generation of the projection image data of a to-be-measured object in 1st Embodiment. The figure which shows the pixel value in generated data typically Block diagram illustrating the function of the image generation unit in the embodiment The figure explaining the production | generation process of the projection image data of the to-be-measured object in 1st Embodiment A flowchart for explaining the operation of the X-ray apparatus according to the first embodiment. A flowchart for explaining the operation of the X-ray apparatus according to the first modification. The figure explaining the production | generation process of the projection image data of the to-be-measured object in a 4th modification The figure which shows typically the method of acquiring the data used for the production | generation of the projection image data of a to-be-measured object in 2nd Embodiment. The figure explaining the production | generation process of the projection image data of the to-be-measured object in 2nd Embodiment A flowchart for explaining the operation of the X-ray apparatus according to the second embodiment. The block diagram which shows the structure of the structure manufacturing system by 3rd Embodiment. The flowchart explaining operation | movement of the structure manufacturing system by 3rd Embodiment.

-First embodiment-
An X-ray apparatus according to a first embodiment of the present invention will be described with reference to the drawings. The X-ray apparatus irradiates the object to be measured with X-rays and detects transmitted X-rays transmitted through the object to be measured, thereby acquiring non-destructive internal information (for example, internal structure) of the object to be measured. When an object to be measured is an industrial part such as a machine part or an electronic part, the X-ray apparatus is called an industrial X-ray CT (Computed Tomography) inspection apparatus that inspects an industrial part.
The embodiments are specifically described for understanding the gist of the invention, and do not limit the invention unless otherwise specified.

FIG. 1 is a diagram showing an example of the configuration of an X-ray apparatus 100 according to the present embodiment. For convenience of explanation, a coordinate system consisting of an X axis, a Y axis, and a Z axis is set as shown.
The X-ray apparatus 100 includes a housing 1, an X-ray source 2, a placement unit 3, a detector 4, a control device 5, a display monitor 6, and a frame 8. The housing 1 is disposed on a floor surface of a factory or the like so as to be substantially parallel (horizontal) to the XZ plane, and inside the X-ray source 2, the placement unit 3, the detector 4, and the frame 8. And is housed. The housing 1 contains lead as a material in order to prevent X-rays from leaking to the outside.

The X-ray source 2 is an X-ray that spreads in a conical shape along the optical axis Zr parallel to the Z-axis with the emission point Q shown in FIG. (A so-called cone beam) is emitted. The exit point Q corresponds to the focal spot of the X-ray source 2. That is, the optical axis Zr connects the exit point Q, which is the focal spot of the X-ray source 2, and the center of the imaging region of the detector 4 described later. It should be noted that the X-ray source 2 is not limited to one that emits X-rays in a conical shape, but one that emits fan-shaped X-rays (so-called fan beams) or linear X-rays (so-called pencil beams) is also one aspect of the present invention. Included in embodiments. The X-ray source 2 emits at least one of, for example, an ultra soft X-ray of about 50 eV, a soft X-ray of about 0.1 to 2 keV, an X-ray of about 2 to 20 keV, and a hard X-ray of about 20 to 100 keV Can do.

FIG. 2 schematically shows the configuration of the X-ray source 2. The X-ray source 2 includes a Wehnelt power source 20, a filament 21, a target 22, a Wehnelt electrode 23, an electro-optic member 25, and a high voltage application unit 26. In the X-ray source 2, the filament 21, the electron optical member 25, and the target 22 are arranged in this order along the electron beam emission direction. The Wehnelt power source 20 is controlled to apply a negative bias voltage to the Wehnelt electrode 23 with respect to the filament 21. The filament 21 is formed so that, for example, a material containing tungsten has a conical shape sharpened toward the target 22. A filament heating power supply circuit 211 is provided at both ends of the filament 21. The filament heating power supply circuit 211 heats the filament 21 by passing a current through the filament 21. The filament 21 is heated by flowing current through the filament heating power supply circuit 211 in a state where a negative bias voltage is applied by the Wehnelt electrode 23, and an electron beam (thermoelectrons) is applied to the target 22 from the sharpened tip. Release towards. That is, the filament 21 functions as an electron beam generator for generating an electron beam.

The electron beam emitted from the filament 21 is converged by the electric field generated by the voltage applied to the Wehnelt electrode 23. The target 22 is made of, for example, a material containing tungsten, and generates X-rays by collision of an electron beam emitted from the filament 21 or a change in the traveling direction of the electron beam. 1 and 2 show an example in which the X-ray source 2 according to the present embodiment is configured by a reflection type X-ray generation unit, but the case is configured by a transmission type X-ray generation unit. Is also included in one embodiment of the present invention.

Electron optical member 25 is arranged between filament 21 and target 22. The electron optical member 25 is configured by a deflection coil or the like for focusing an electron beam on the target 22. The electron optical member 25 focuses the electron beam from the filament 21 using the action of a magnetic field, and collides the electron beam with a partial region (X-ray focal point) of the target 22. The high voltage application unit 26 is electrically connected to the filament 21 and the target 22, and applies a negative voltage to the filament 21 with respect to the target 22. The high voltage application unit 26 is controlled by the X-ray control unit 51 of the control device 5 and applies a predetermined high DC voltage between the filament 21 and the target 22.

The filament 21 functions as a cathode that emits an electron beam when a high voltage is applied by the high voltage application unit 26. In the present embodiment, as an example, thermoelectrons are generated while heating by passing an electric current through the filament 21 to function as a cathode. The present invention is not limited to this example, and may have a heater for heating the cathode separately in addition to the cathode. Alternatively, an electron beam may be emitted by forming a strong electric field around the cathode without heating the cathode. The electron beam emitted from the filament 21 toward the target 22 is focused by the Wehnelt electrode 23, accelerated by the high voltage applied by the high voltage application unit 26, and travels toward the target 22. That is, the potential difference between the filament 21 and the target 22 acts as an acceleration voltage for accelerating the electron beam. The electron beam is focused by the electron optical member 25, and the electron beam collides with the target 22 disposed at the convergence position (focal spot) of the electron beam to generate X-rays from the target 22.

The mounting unit 3 shown in FIG. 1 includes a mounting table 30 on which the object to be measured S is mounted, and a manipulator unit including a rotation driving unit 32, a Y-axis moving unit 33, an X-axis moving unit 34, and a Z-axis moving unit 35. 36 and provided on the Z axis + side of the X-ray generator 2. The mounting table 30 is rotatably provided by the rotation driving unit 32, and moves together when the manipulator unit 36 moves in the X-axis, Y-axis, and Z-axis directions.

The rotation drive unit 32 is configured to include, for example, an electric motor, and is parallel to the Y-axis and the center of the mounting table 30 by a rotational force generated by an electric motor controlled and driven by the control device 5 described later. The mounting table 30 is rotated with the axis passing through the rotation axis Yr. That is, the rotation drive unit 32 rotates the mounting table 30 to change the relative direction of the mounting table 30 and the object S to be measured on the mounting table 30 with respect to the X-rays radiated from the X-ray source 2. Change. The Y-axis moving unit 33, the X-axis moving unit 34, and the Z-axis moving unit 35 are controlled by the control device 5 so that the object S to be measured is positioned within the irradiation range of the X-rays emitted from the X-ray generation unit 2. In this way, the mounting table 30 is moved in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. Further, the Z-axis moving unit 35 is controlled by the control device 5 so that the distance from the X-ray source 2 to the object S to be measured is a distance at which the projected image of the object S has a desired magnification. Is moved in the Z-axis direction.

The Y position detector 331, the X position detector 341, and the Z position detector 351 are moved in the X axis direction, the Y axis direction, and the Z axis direction by the Y axis moving unit 33, the X axis moving unit 34, and the Z axis moving unit 35. It is an encoder that detects the position of the mounting table 30 and outputs a signal indicating the detected position (hereinafter referred to as a detected movement position) to the control device 5. The rotation position detector 321 detects the position of the mounting table 30 that is rotated about the rotation axis Yr by the rotation drive unit 32, and outputs a signal indicating the detected position (hereinafter referred to as a detected rotation position) to the control device 5. It is an encoder. That is, the detected rotation position represents the relative direction of the measurement object S on the mounting table 30 with respect to the X-rays emitted from the X-ray source 2.

The detector 4 is provided on the Z axis + side from the X-ray source 2 and the mounting table 30. That is, the mounting table 30 is provided between the X-ray source 2 and the detector 4 in the Z-axis direction. The detector 4 has an incident surface 41 parallel to the XY plane, and X-rays including transmitted X-rays emitted from the X-ray source 2 and transmitted through the measurement object S placed on the mounting table 30 are incident. Incident on the surface 41. The detector 4 includes a scintillator portion containing a known scintillation substance, a photomultiplier tube, a light receiving portion, and the like. The detector 4 converts X-ray energy incident on the incident surface 41 of the scintillator portion into visible light, ultraviolet light, or the like. The light energy is converted into light energy, amplified by a photomultiplier tube, the amplified light energy is converted into electric energy by the light receiving unit, and is output to the control device 5 as an electric signal. The detector 4 may convert incident X-ray energy into electric energy without converting it into light energy, and output the electric energy as an electric signal. The detector 4 has a structure in which a scintillator section, a photomultiplier tube, and a light receiving section are each divided into a plurality of pixels, and these pixels are two-dimensionally arranged. Thereby, the intensity distribution of the X-rays radiated from the X-ray source 2 and passed through the object to be measured S can be acquired at once. The detector 4 may have a structure in which the scintillator portion is formed directly on the light receiving portion (photoelectric conversion portion) without providing a photomultiplier tube.

The frame 8 supports the X-ray source 2, the placement unit 3, and the detector 4. The frame 8 is manufactured with sufficient rigidity. Therefore, it is possible to stably support the X-ray source 2, the placement unit 3, and the detector 4 while acquiring the projection image of the measurement object S. Further, the frame 8 is supported by a vibration isolation mechanism 81 to prevent vibration generated outside from being transmitted to the frame 8 as it is.

The control device 5 includes a microprocessor, peripheral circuits, and the like. The control device 5 reads and executes a control program stored in advance in a storage medium (not shown) (for example, a flash memory), thereby executing the control of the X-ray device 100. Control each part. The control device 5 includes an X-ray control unit 51, a movement control unit 52, an image generation unit 53, an image reconstruction unit 54, and a work memory 55. The X-ray control unit 51 controls the operation of the X-ray source 2, and the movement control unit 52 controls the movement operation of the manipulator unit 36. The image generation unit 53 generates X-ray projection image data of the object S to be measured based on the electrical signal output from the detector 4, and the image reconstruction unit 54 controls the manipulator unit 36 and has different projection directions. Based on the projection image data of the measurement object S, a known image reconstruction process is performed to generate a reconstructed image. By the image reconstruction process, three-dimensional data that is the internal structure (cross-sectional structure) of the DUT S is generated. In this case, the image reconstruction process includes a back projection method, a filtered back projection method, a successive approximation method, and the like. The work memory 55 is configured by, for example, a volatile storage medium, and temporarily stores the X-ray projection image data generated by the image generation unit 53.

Hereinafter, the generation principle of the projection image data of the measurement object S performed by the image generation unit 53 will be described in detail.
FIG. 3 schematically shows a data acquisition method used by the image generation unit 53 in the present embodiment to generate projection image data of the object S to be measured. FIG. 3A shows an X-ray emitted from the X-ray source 2 in a state where the object S to be measured is mounted on the mounting table 30 and based on the X-rays acquired (detected) by the detector 4. The case where the 1st data D1 (refer FIG.3 (b)) which is detection data is produced | generated is shown. FIG. 3C shows detection data based on the X-rays detected by the detector 4 by emitting X-rays from the X-ray source 2 in a state where the measurement object S is not placed on the mounting table 30. The case where the 2nd data D2 (refer FIG.3 (d)) is produced | generated is shown.

FIG. 3E shows that the mounting table 30 does not exist at least between the X-ray source 2 and the detector 4, that is, the X-ray from the X-ray source 2 is detected by the detector 4 with the mounting table 30 removed. 2 shows the positional relationship between the X-ray source 2 and the detector 4 of the X-ray apparatus 100 when detected by. A solid line connecting the X-ray source 2 and the detector 4 indicates an outline of the X-ray detected by the detector 4 among the X-rays generated from the X-ray source 2. The detection data detected by the detector 4 in the state of FIG. 3 (e) is shown in FIG. 3 (f). The detection data at this time is referred to as third data D3. The third data D3 is generated for each state in which the X-ray output emitted from the X-ray source 2, that is, the combination of the acceleration voltage and the current amount is different, and will be described later in association with the X-ray output at the time of generation. It is stored in the internal storage unit 531 (see FIG. 3). The plurality of third data D3 obtained when the X-ray outputs are different from each other is generated at a predetermined timing, for example, at the time of factory shipment, and thereafter, the same third data D3 may be continuously used. The third data D3 may be generated and updated every predetermined period in consideration of changes in the characteristics of the detector 4 over time. Note that the third data D3 is not limited to the measured value based on the X-ray detected by the detector 4. When the X-ray emitted from the X-ray source 2 has a difference in intensity for each radiation angle, the third data D3 is also distributed in the detection data signal output from the detector 4 based on the difference in intensity. Have. In addition, reflected X-rays and scattered X-rays from the casing surrounding the entire X-ray apparatus and each member arranged in the casing may reach the image data. A distribution of detected intensity appears. However, the X-rays emitted from the X-ray source 2 may not have an intensity distribution according to the radiation angle. In such a case, the third data D3 may be set as an arbitrary constant. The third data D3 shown in FIG. 3 (f) is shown as data when a constant X-ray intensity is obtained regardless of the X-ray emission angle.

The first data D1 and the second data D2 are generated under the same conditions. That is, the detection movement position and the detection rotation position of the mounting table 30 when the first data D1 is generated are the same as the detection movement position and the detection rotation position of the mounting table 30 when the second data D2 are generated. is there. Furthermore, when generating the first data D1, the X-ray output radiated from the X-ray source 2 (for example, the acceleration voltage between the filament 21 and the target 22) and the X-ray source 2 when generating the second data D2 are generated. The output of X-rays radiated from is the same. In the following description, the detection movement position and the detection rotation position of the mounting table 30 are collectively referred to as a relative position.

FIG. 3B schematically shows the first data D1. The first data D1 includes the distribution of the X-ray dose transmitted through the object to be measured, the distribution of the X-ray dose transmitted through the mounting table 30, the distribution of the X-ray dose scattered and reflected by the mounting unit 3 including the mounting table 30, and the X The line is composed of a combination with the distribution of the X-ray dose that has directly reached the detector 4 without propagating through the placement unit 3 or the object S to be measured. 3B, the region D101 corresponding to the region where X-rays transmitted through the object to be measured reach the detector 4 and the region where X-rays transmitted through the mounting table 30 reach the detector 4. Area D102, a region D103 corresponding to an area where X-rays scattered and reflected by the mounting unit 3 including the mounting table 30 reach, and the mounting unit 3 and the target by the time the X-ray source 2 reaches the detector 4. A region D104 corresponding to a region where X-rays directly reach the detector 4 without passing through the measurement object S is shown. A region D101 is an image data region that includes information on the internal structure of the measurement object S according to the intensity of the X-rays emitted from the X-ray source 2 and transmitted through the measurement object S. The region D102 is an image data region that includes information on the structure of the mounting table 30 corresponding to the intensity of X-rays emitted from the X-ray source 2 and transmitted through the mounting table 30. The region D103 includes information related to the intensity emitted from the X-ray source 2 and scattered or reflected by the mounting table 30. In FIG. 3, for the sake of illustration, the region D103 is shown with dots. A region D104 is information regarding the characteristics of the detector 4 and the intensity of X-rays scattered or reflected by the inner wall of the housing 1 or the like.
In the description here, the X-ray scattering reflection is shown only on the upper side of the mounting table 30, but the present invention is limited to only the mounting portion 3 from which such a scattering reflection distribution is obtained. It is not a thing. In particular, in the case of the positional relationship shown in FIG. 3A, the projected image of the manipulator unit 36 positioned below the mounting table 30 usually appears on the detection surface of the detector 4. Therefore, it is determined whether or not the influence of the scattered reflection of the manipulator unit 36 should be taken into consideration according to the magnitude of the scattered reflection amount. If the influence is large, the distribution of the scattered reflected X-rays by the manipulator unit 36 may be taken into consideration. . Similarly, you may consider the influence of the scattering reflection of the to-be-measured object S itself by the magnitude | size of the scattering reflection amount. The region D103 may be determined including the influence of these scattered reflections. In this specification, in order to simplify the description, the influence of the scattering reflection of the manipulator unit 36 and the scattering reflection of the object S itself is not discussed.

FIG. 4 schematically shows pixel values for each pixel for each of the first data D1, the second data D2, and the third data D3. In FIG. 4, the first data D1 includes a plurality of pixels Ds101 to 116, the second data D2 includes a plurality of pixels Ds201 to 216, and the third data D3 schematically includes a plurality of pixels Ds301 to 316. Shown in In FIG. 4, for the purpose of facilitating understanding of the invention, the region D101, the region D102, or the region D103 is shown superimposed on the pixel value in the first data D1 or the second data D2. FIG. 4 shows a partial area of each of the first data D1, the second data D2, and the third data D3. The pixel values shown in FIG. 4 are not limited to those indicating the pixel values of the individual pixels Ds101 to 116, 201 to 216, and 301 to 316, but are the sum of pixel values output from a plurality of pixels included in a predetermined area. What shows a value and what shows the average value of the pixel value from the some pixel of a predetermined area are also contained in 1 aspect of this invention.

As shown in FIG. 4A, among the pixels Ds101 to 116 of the first data D1, the X-rays do not pass through the object to be measured S or the mounting table 30, and the influence of scattering and reflection by the mounting table 30 is also affected. In the pixels Ds 101 to 104, 108, and 112 to 116 that have not been received, the pixel value is indicated as “100”. The pixels Ds 107 and 111 have a pixel value of “80” because X-rays are transmitted through the mounting table 30 or scattered or reflected by the mounting table 30 so that the intensity is reduced when entering the detector 4. The pixels Ds 105 and 109 have a pixel value of “70” because the intensity is weakened when the X-rays pass through the object S to be measured and enter the detector 4. In the pixels Ds 106 and 110, the intensity of X-rays transmitted through the measurement object S is weakened, and the X-rays are incident on the detector 4 due to the influence of scattering and reflection by the mounting table 30 and the like. ". That is, as compared with the pixels Ds 105 and 109, the pixel value is increased by the influence of scattering and reflection by the mounting table 30 and the like.

As shown in FIG. 4B, among the pixels Ds201 to 216 of the second data D2, the X-rays are not transmitted through the mounting table 30 and are not affected by scattering or reflection by the mounting table 30 or the like. In Ds 201 to 205, 208, 209, and 212 to 216, the pixel value is indicated as “100” as in FIG. 4A. Since the pixels Ds 207 and 211 are weakened in intensity when entering the detector 4 due to the X-ray being transmitted through the mounting table 30 or scattered or reflected by the mounting table 30, as in FIG. The pixel value is shown as “80”. The pixels Ds 206 and 210 do not transmit X-rays through the mounting table 30 but enter the detector 4 due to the influence of scattering and reflection by the mounting table 30, so the pixel value is indicated as “101”. That is, as compared with the pixels Ds205 and 209, the pixel value is increased by the influence of scattering and reflection by the mounting table 30.
As shown in FIG. 4C, the pixels Ds301 to 316 of the third data D3 are not affected by the X-rays being transmitted through the object to be measured S or the mounting table 30, and by scattering or reflection by the mounting table 30. Therefore, the pixel value is indicated as “100”.

The image generation unit 53 generates the projection image data D200 of the measurement object S as follows using the first data D1, the second data D2, and the third data D3.
FIG. 5 is a functional block diagram included in the image generation unit 53, and FIG. 6 is a diagram schematically illustrating pixel values of data generated by processing by the image generation unit 53.
As illustrated in FIG. 5, the image generation unit 53 includes an internal storage unit 531, a subtraction processing unit 532, and a projection image data generation unit 533. The internal storage unit 531 is configured by a nonvolatile storage medium, and stores the above-described third data D3. The subtraction processing unit 532 subtracts the second data D2 from the first data D1 to generate intermediate data D150 (see FIG. 6).

FIG. 6A schematically shows generation of the intermediate data D150. By subtracting the second data D2 from the first data D1, intermediate data D150 including the pixels Ds151 to 166 is generated. That is, the pixel values of the respective pixels Ds201 to 216 of the corresponding second data D2 are subtracted from the pixel values of the respective pixels Ds101 to 116 of the first data D1. Accordingly, in the intermediate data D150, the pixel values of the pixels Ds151 to 154, 157, 158, 161 to 166 are “0”, and the pixel values of the pixels Ds155, 156, 159, and 160 are “−30”.

The projection image data generation unit 533 in FIG. 5 has the same output as the X-ray output when the first data D1 and the second data D2 are generated from the plurality of third data D3 stored in the internal storage unit 531. The third data D3 generated using the X-ray is read out. The projection image data generation unit 533 adds the third data D3 read from the internal storage unit 531 and the intermediate data D150 generated by the subtraction processing unit 532 to generate projection image data D200.

FIG. 6B schematically shows the generation of the projection image data D200. By adding the intermediate data D150 and the third data D3, the projection image data D200 including the pixels Ds201 to 216 is generated. That is, the pixel values of the respective pixels Ds301 to 316 of the corresponding third data D3 are added to the pixel values of the respective pixels Ds151 to 166 of the intermediate data D150. Therefore, in the projection image data D200, the pixel values of the pixels Ds201 to 204, 207, 208, and 211 to 216 are “100”, and the pixel values of the pixels Ds205, 206, 209, and 210 are “70”. As a result, in the projection image data D200, the data D102 based on mounting table transmission and the data D103 based on scattered reflection, which are included in common with the first data D1 and the second data D2, are removed from the first data D1. . In other words, the projection image data D200 corresponds to the measured object transmission data D101 which is information corresponding to the intensity of the X-ray transmitted through the measured object S.

Hereinafter, an operation performed by the X-ray apparatus 100 for the measurement process of the internal structure of the measurement object S will be described.
When the user operates an operation member (not shown) to set a desired shooting magnification and shooting position, the movement control unit 52 of the control device 5 includes the Y-axis moving unit 33, the X-axis moving unit 34, and the manipulator unit 36. The Z-axis moving unit 35 is controlled to move the mounting table 30 in the X direction, the Y direction, and the Z direction so that the target position corresponding to the set shooting magnification and shooting position is obtained.

When the mounting table 30 moves to the target position and the workpiece S is mounted on the mounting table 30, the X-ray control unit 51 of the control device 5 outputs an X-ray emitted from the X-ray source 2. Is set to be an X-ray output according to the setting operation by the user. That is, the X-ray control unit 51 sets the voltage value of the acceleration voltage applied by the high voltage application unit 26 between the filament 21 and the target 22 and the amount of current that the filament heating power supply circuit 211 passes through the filament 21. X-rays are emitted from the X-ray source 2. The movement control unit 52 of the control device 5 drives the rotation driving unit 32 to rotate the mounting table 30 and the measurement object S mounted on the mounting table 30 about the rotation axis Yr.

Each time the mounting table 30 and the object to be measured S rotate by a predetermined angle on the rotation axis Yr, the detector 4 detects X-rays emitted from the X-ray source 2 and incident on the incident surface 41 and outputs them as detection data. Thus, the first data D1 is generated. That is, the detector 4 generates a plurality of first data D1 corresponding to the rotation of a predetermined angle. The plurality of generated first data D1 is temporarily stored in the work memory 55 in association with a predetermined angle at the time of generation, that is, a detected rotational position detected by the rotational position detector 321.

After the first data D1 is generated as described above, the generation process of the second data D2 is performed in a state where the measurement object S is removed from the mounting table 30. In this case, the X-ray control unit 51 determines the voltage value of the acceleration voltage applied by the high voltage application unit 26 between the filament 21 and the target 22 and the amount of current that the filament heating power supply circuit 211 passes through the filament 21. X-rays are emitted from the X-ray source 2 by setting the same value as the voltage value and current amount of the acceleration voltage set when generating one data D1. The movement control unit 52 drives the rotation driving unit 32 to rotate the mounting table 30 about the rotation axis Yr while maintaining the same position as when the mounting table 30 generated the first data D1.

Each time the mounting table 30 rotates about the rotation axis Yr at the same predetermined angle as when the first data D1 is generated, the detector 4 detects the X-rays incident on the incident surface 41 and generates an electrical signal. The second data D2 is generated by outputting the detected data. That is, the detector 4 generates a plurality of second data D2 corresponding to the rotation at a predetermined angle, and temporarily stores it in the work memory 55 in association with the detected rotation position that is the predetermined angle at the time of generation.
In the above description, the second data D2 is generated after the first data D1 is generated. However, the first data D1 is generated after the second data D2 is generated. Included in embodiments.

As described above, the image generation unit 53 generates the projection image data D200 of the measurement object S using the first data D1, the second data D2, and the third data D3. In this case, the image generation unit 53 selects the second data D2 associated with the same predetermined angle as the predetermined angle associated with the first data D1. That is, the image generation unit 53 generates the intermediate data D150 using the first data D1 and the second data D2 that can be regarded as having substantially the same influence of scattering and reflection by the mounting table 30. The image generation unit 53 uses the generated intermediate data D150 and the third data D3 read from the internal storage unit 533 to project the measurement object S with reduced influence of X-ray scattering and reflection by the mounting table 30. Image data D200 is generated. When the projection image data D200 of the plurality of objects to be measured S is generated by performing the above processing on each of the plurality of first data D1, the image reconstruction unit 54 of the control device 5 causes the object to be measured S to be measured. A known image reconstruction process is performed using the plurality of projection image data D200 to generate three-dimensional data that is the internal structure (cross-sectional structure) of the object S to be measured. In this case, the image reconstruction process includes a back projection method, a filtered back projection method, a successive approximation method, and the like. The generated three-dimensional data of the internal structure of the measured object S is displayed on the display monitor 6.

With reference to the flowchart of FIG. 7, measurement processing of the internal structure of the measurement object S by the X-ray apparatus 100 will be described. Each process shown in the flowchart of FIG. 7 is performed by executing a program in the control device 5. This program is stored in a memory (not shown), and when the user places the workpiece S on the mounting table 30 and gives an instruction to start measuring the internal structure of the workpiece S, the control device 5 Get up and running.
In step S1, the movement control unit 52 moves the mounting table 30 in the X direction, the Y direction, and the Z direction, thereby moving the mounting table 30 and the object to be measured S to the target position, and proceeds to step S2. In step S2, the X-ray control unit 51 sets the output of X-rays emitted from the X-ray source 2, and the movement control unit 52 rotates the mounting table 30 about the rotation axis Yr and proceeds to step S3.

In step S3, the image generating unit 53 detects X-rays emitted from the X-ray source 2 every time the mounting table 30 rotates by a predetermined angle, and uses the detection data to detect a plurality of first rays. One data D1 is generated and stored in the work memory 55 of the image generation unit 53, and the process proceeds to step S4. At this time, the work memory 55 also stores the output value of the X-ray source 2 and relative position information. In step S4, it is determined whether or not the generation of the first data D1 for each predetermined angle has been completed. When the generation of all the first data D1 is completed, an affirmative determination is made in step S4 and the process proceeds to step S5. If all the first data D1 has not been generated, a negative determination is made in step S4 and the process returns to step S3.

In step S5, the X-ray control unit 51 sets the output of the X-rays emitted from the X-ray source 2 to the same output as in step S2, and the movement control unit 52 is in a state where the object to be measured S is removed. The mounting table 30 is rotated about the rotation axis Yr, and the process proceeds to step S6. In step S6, the image generating unit 53 detects X-rays radiated from the X-ray source 2 every time the mounting table 30 rotates by a predetermined angle, and uses the detection data to detect a plurality of first rays. Two data D2 is generated and the process proceeds to step S7. In step S7, it is determined whether or not the generation of the second data D2 for each predetermined angle has been completed. When the generation of all the second data D2 is completed, an affirmative determination is made in step S7 and the process proceeds to step S8. If all the second data D2 has not been generated, a negative determination is made in step S7 and the process returns to step S6.
When the first data D1 is generated after the second data D2 is generated, the above steps S5 to S7 are executed, and then the steps S1 to S4 are performed.

In step S8, the image generation unit 53 generates the intermediate data D150 by subtracting the second data D from the first data D1, and adds the third data D3 to the intermediate data D150, thereby obtaining a plurality of data for each predetermined angle. The projection image data D200 of the object to be measured S is generated, and the process proceeds to step S9. Note that it is not necessary to generate the projection image data D200 in step S8 after acquiring the second data D2 at all predetermined angles. For example, as soon as the second data D2 is acquired at each predetermined angle, the first data D1 having the same predetermined angle stored in the work memory 55 is read, and projection image data of the predetermined angle is generated and stored in the work memory 55. After that, the second data D2 of the next predetermined angle may be acquired. In that case, step S8 may be executed after step S6, and then step S7 may be executed.

In step S9, it is determined whether or not all the projection image data D200 of the measurement object S for each predetermined angle has been generated. When all the projection image data D200 of the object S to be measured are generated, an affirmative determination is made in step S9 and the process proceeds to step S10. If there is projection image data D200 of the measurement object S that has not been generated, a negative determination is made in step S9, and the process returns to step S8. In step S10, the image reconstruction unit 54 generates and processes three-dimensional data of the measurement object S by performing image reconstruction processing on the generated projection image data D200 of the plurality of measurement objects S. Exit.

According to the X-ray apparatus according to the first embodiment described above, the following operational effects can be obtained.
(1) The image generation unit 53 includes the first data D1 output from the detector 4 when the measurement object S is placed on the placement table 30 located between the X-ray source 2 and the detector 4. The projection of the measurement object S based on the second data D2 output by the detector 4 when the measurement object S is not placed on the mounting table 30 positioned between the X-ray source 2 and the detector 4. Image data D200 is generated. Therefore, since the projection image data D200 of the measurement object S in which the influence of the X-rays scattered or reflected by the mounting table 30 is reduced can be generated, accurate data on the internal structure of the measurement object S is acquired, and the measurement accuracy is obtained. Can be improved.

(2) The relative position (that is, the detection movement position and the detection rotation position) of the mounting table 30 with respect to the X-ray source 2 and the detector 4 when the first data D1 is output by the detector 4, and the detector 4 The relative position of the mounting table 30 with respect to the X-ray source 2 and the detector 4 when the two data D2 is output is the same. That is, the image generating unit 53 associates the first data D1 with the second data D2 stored in the work memory 55 in association with the same relative position as the relative position when the first data D1 is output by the detector 4. Based on the above, the projection image data D200 of the measurement object S is generated. Therefore, since the first data D1 and the second data S2 are acquired in a state where the relative position of the mounting table 30 is set to the same condition, the influence of X-rays scattered or reflected by the mounting table 30 can be reduced with high accuracy. This contributes to the improvement of the measurement accuracy of the measurement object S.

(3) The X-ray output emitted from the X-ray source 2 when the first data D1 is output by the detector 4 and the X-ray source 2 when the second data D2 is output by the detector 4 The output of the emitted X-ray is the same. Therefore, since the first data D1 and the second data S2 are acquired under the condition that the X-ray output is the same, the influence of the X-rays scattered and reflected by the mounting table 30 depending on the X-ray output is highly accurate. This contributes to improving the measurement accuracy of the object S to be measured.

The X-ray apparatus 100 according to the first embodiment can be modified as follows.
(First modification)
A plurality of second data D2 generated at a plurality of relative positions and a plurality of X-ray outputs may be stored in advance. In this case, the second data D2, the relative position, and the X-ray output are stored in the internal storage unit 531 of the image generation unit 53 in association with each other. The image generation unit 53 acquires the relative position of the mounting table 30 from the Y position detector 331, the X position detector 341, the Z position detector 351, and the rotational position detector 321 when generating the first data D1. The first data D1, the relative position, and the X-ray output (acceleration voltage and current amount) set by the X-ray control unit 51 are associated with each other and temporarily stored in the work memory 55. The image generation unit 53 reads out from the internal storage unit 531 the second data D2 associated with the same relative position and X-ray output as the relative position and X-ray output associated with the first data D1. Thereafter, the image generation unit 53 generates the intermediate data D150 by subtracting the second data D2 read from the first data D1, and subtracts the third data D3 from the intermediate data D150 in the same manner as described above. Projection image data D200 of the device under test S is generated.

The flowchart of FIG. 8 shows the measurement process of the internal structure of the measurement object S performed by the X-ray apparatus 100 according to the first modification. Each process shown in the flowchart of FIG. 8 is performed by executing a program in the control device 5 as in the flowchart of FIG.
Each processing from step S11 (moving the mounting table to the target position) to step S14 (judgment of generation completion of the first data) is performed from step S1 (moving the mounting table to the target position) to step S4 (first data) in FIG. This is the same as the processing up to the generation end determination).

In step S15, the second data D2 associated with the same relative position and X-ray output as the relative position and X-ray output at the time when the first data D1 is generated is read from the internal storage unit 531 and the process proceeds to step S16. move on. Each processing from step S16 (projection image data generation of the object to be measured) to step S18 (three-dimensional data generation) is performed from step 8 (projection image data generation of the object to be measured) to step S10 (three-dimensional data generation). ). If a negative determination is made in step S17, the process returns to step S15.

According to the first modification described above, the second data D2 is stored in advance in the internal storage unit 531 in association with a plurality of relative positions and X-ray outputs, so that the device under test S measures each time. In addition, since it is not necessary to generate the second data D2, it contributes to improvement of work efficiency. Furthermore, the projection image data of the object to be measured can be generated without newly generating the second data D2 for various objects to be measured having different shapes and materials, so that convenience can be improved. In this way, by using the second data D2 as correction data for the X-ray transmission image data of the object S to be measured, an accurate X-ray absorption amount can be acquired. The correction data is not necessarily limited to the image data from the detector 4 that has acquired the X-ray transmission image data of the object to be measured, and is used for stably mounting the mounting table 30 and the object S to be described later. Any correction data may be used as long as the jig reduces the influence on the transmission image data caused by the X-ray from the X-ray source 2 reaching the position.

(Second modification)
A configuration in which the second data D2 is generated in a state where a jig for stably placing the measurement object S on the mounting table 30 is disposed is also included in one aspect of the present invention. That is, as the second data D2, in addition to the influence of the mounting table 30, the influence of X-ray scattering and reflection caused by the shape and material of the jig can be included. Therefore, it is possible to reduce the influence of X-ray scattering and reflection by the jig from the first data D1 by the processing by the image generation unit 53, so that the shape and material can be freely selected when manufacturing the jig. The degree can be improved. The jig is preferably made of a structural material having a small atomic weight such as carbon. Thereby, the amount of X-ray scattering and reflection by the jig can also be reduced. Furthermore, by using the present invention in combination, the influence on the X-ray transmission image and X-ray CT image due to the scattering and reflection of X-rays can be reduced as much as possible.

(Third Modification)
If the mounting table 30 is disk-shaped, the second data D2 corresponding to at least one of the predetermined angles may be generated. Depending on the shape of the mounting table 30, the number of second data D2 may be smaller than the number of first data D1 generated for each predetermined angle. That is, the second data D2 may be generated for each angle larger than a predetermined angle when the first data D1 is generated. Further, if the mounting table 30, the manipulator unit 36, and the like are almost ideal rotationally symmetric at an arbitrary rotation angle with respect to the rotation axis Yr, only the second data D2 with an angle in a certain direction may be generated.

(Fourth modification)
The image reconstruction unit 54 is not limited to the one that generates the three-dimensional data that is the internal structure of the DUT using the projection image data D200 generated by the image generation unit 53, and is generated by the image generation unit 53. What generates three-dimensional data using the intermediate data D150 is also included in one aspect of the present invention.
Further, the image reconstructing unit 54 generates three-dimensional data of the object S to be measured according to the ratio of X-ray absorption, that is, based on the relationship of the following formula (1). Included in embodiments.
I = I ₀ e ^−μt (1)
In this case, the projection image data generation unit 533 of the image generation unit 53 divides the generated projection image data D200 by the third data D3 to generate second projection image data D300. FIG. 9 schematically shows the generation of the second projection image data D300. By dividing the projection image data D200 by the third data D3, second projection image data D300 including the pixels Ds301 to 316 is generated. That is, the pixel value of each pixel Ds201 to 216 of the projection image data D200 is divided by the pixel value of each pixel Ds301 to 316 of the corresponding third data D3. Accordingly, in the second projection image data D200, the values of the pixels Ds301 to 304, 307, 308, 311 to 316 are “1”, and the values of the pixels Ds305, 306, 309, and 310 are “0.7”. The object S can be represented by the ratio of X-ray absorption. The image reconstruction unit 54 can generate three-dimensional data of the object S to be measured based on the second projection image data D300.

-Second Embodiment-
A second embodiment of the X-ray apparatus according to the present invention will be described with reference to the drawings. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and different points will be mainly described. Points that are not particularly described are the same as those in the first embodiment. This embodiment is different from the first embodiment in that the projection image data of the object to be measured is generated using the result of simulating the influence of scattering / reflection by the mounting table.
In the X-ray apparatus 100 according to the second embodiment, the measurement object S is not placed between the X-ray source 2 and the detector 4 in the internal storage unit 531 of the image generation unit 53. Data estimated to be output from the detector 4 when the mounting table 30 is located, that is, simulation data obtained by calculating the estimated data by simulation is stored in advance.

Hereinafter, in the second embodiment, the generation principle of the projection image data of the measurement object S performed by the image generation unit 53 will be described in detail.
FIG. 10 schematically shows a data acquisition method used by the image generation unit 53 in the second embodiment to generate the projection image data of the object S to be measured. FIG. 10A shows a case where the first data D1 is generated, which is the same as FIG. 3A used in the description of the first embodiment. The first data D1 shown in FIG. 10B is also the same as that shown in FIG. FIG. 10C is the same as FIG. 3C used for the description of the first embodiment. The third data D3 shown in FIG. 10 (d) is the same as FIG. 3 (d). FIG. 10 (e) shows simulation data obtained by simulating estimated data estimated by the detector 4 to detect X-rays radiated from the X-ray source 2 when the measurement object S is not placed on the mounting table 30. A virtual relative position of the mounting table 30 with respect to the X-ray source 2 and the detector 4 when calculating as D4 (see FIG. 10F) is schematically shown. That is, FIG. 10E shows that the simulation data D4 of FIG. 10F is calculated assuming such a state.

The first data D1 schematically shown in FIG. 10B includes the measured object transmission data D101, the data D102 based on the mounting table transmission, and the scattered reflection, as in the case described with reference to FIG. Based data D103 and background-based data D104. The third data D3 schematically shown in FIG. 10 (d) includes data D104 based on the background, as in the case described with reference to FIG. 3 (d). The simulation data D4 schematically shown in FIG. 10 (f) is a mounting table transmission simulation data D102 ′, which is a simulation result corresponding to the data D102 based on the mounting table transmission, and a simulation result corresponding to the data D103 based on the scattered reflection. And some scattered reflection simulation data D103 ′.

In the present embodiment as well, as in the case of the first embodiment, the third data D3 is the X-ray output emitted from the X-ray source 2, that is, the combination of the acceleration voltage and the amount of current. It is generated for each different state and stored in the internal storage unit 531 in association with the output of the X-ray at the time of generation. The plurality of third data D3 is generated at a predetermined timing, for example, at the time of shipment from the factory, and thereafter, the same third data D3 may be continuously used, or the change of the characteristics of the detector 4 over time is considered. Then, the third data D3 may be generated and updated every predetermined period.

The simulation data D4 is generated using design information such as three-dimensional CAD that includes information such as structure information and materials that can specify the three-dimensional shape of the mounting table 30. The mounting table transmission simulation data D102 ′ of the simulation data D4 is based on the structure and material as design information of the mounting table 30 and the X-ray intensity information for each radiation direction from the X-ray source 2, and the transmission image of the mounting table 30. Is generated by calculating. The scattering / reflection simulation data D103 ′ of the simulation data D4 is based on the structure information and material of the mounting table 30, the incident direction and the intensity of the X-rays incident on the mounting table 30, and the three-dimensional shape of the mounting table 30. This is data showing the result of simulating the distribution of light incident on the detector 4 under the influence of the material. A plurality of simulation data D4 generated by simulating with a plurality of relative positions and a plurality of X-ray outputs are stored in the internal storage unit 531 in association with the relative positions and the X-ray outputs, respectively.

The processing by the image generation unit 53 according to the second embodiment will be described with reference to the schematic diagram of the generation processing of the projection image data D200 shown in FIG. In FIG. 11, as in FIGS. 4 and 6, the pixels and pixel values included in each data are also described. Simulation data D4 is generated by the pixels Ds401 to Ds416. The pixel values of the pixels Ds401 to 405, 408, 409, 412 to 416 are “0”, the pixel values of the pixels Ds403 and 411 corresponding to the mounting table transmission simulation data D102 ′ are “−20”, and the scattered reflection simulation data D103 ′. The pixel values of the corresponding pixels Ds405 and 410 are “1”.

The image generation unit 53 generates the projection image data D200 of the object to be measured S using the first data D1, the third data D3, and the simulation data D4 generated from the design information of the mounting table 30. . In this case, as shown in FIG. 11A, the subtraction processing unit 532 of the image generation unit 53 subtracts data generated by adding the third data D3 and the simulation data D4 from the first data D1. The simulation data D4 includes mounting table transmission simulation data D102 'and scattered reflection simulation data D103'. That is, the data generated by adding the third data D3 and the simulation data D4 includes the background-based data D104, the mounting table transmission simulation data D102 ′, and the scattered reflection simulation data D103 ′. In this embodiment, the data has information corresponding to the second data D2.

As described above, the mounting table transmission simulation data D102 ′ is a simulation result corresponding to the data D102 based on the mounting table transmission, and the scattered reflection simulation data D103 ′ is a simulation result corresponding to the data D103 based on the scattering reflection. . Both the mounting table transmission simulation data D102 'and the scattered reflection simulation data D103' simulate the intensity distribution of X-rays reaching the detector 4. Therefore, the data D102 based on the mounting table transmission and the mounting table transmission simulation data D102 ′ can be regarded as substantially the same data, and the data D103 based on the scattering reflection and the scattering reflection simulation data D103 ′ are Since they can be regarded as substantially the same data, they can be subtracted from each other.

The subtraction processing unit 532 subtracts data obtained by adding the third data D3 and the simulation data D4 from the first data D1. As described above, since the data obtained by adding the third data D3 and the simulation data D4 has data corresponding to the second data D2 in the first embodiment, the subtraction processing unit 532 performs the above subtraction. To generate intermediate data D150. As in the case of the first embodiment, the projection image data generation unit 533 generates the projection image data D200 by adding the third data D3 to the intermediate data D150. Thereby, as schematically shown in FIG. 11B, the mounting table transmission image data D102 and the scattered reflection data D103 are removed from the first data D1 from the first data D1, and the projected image data D200 is This corresponds to the measured object transmission image data D101 which is information corresponding to the intensity of the X-ray transmitted through the measured object S.

Hereinafter, an operation performed by the X-ray apparatus 100 for the measurement process of the internal structure of the measurement object S will be described.
As in the case of the first embodiment, the movement control unit 52 of the control device 5 sets the X direction, the Y direction, and the Z direction so that the target position corresponding to the shooting magnification and the shooting position set by the user is obtained. The mounting table 30 is moved. The X-ray control unit 51 sets the output of X-rays emitted from the X-ray source 2 in the same manner as in the first embodiment, and the movement control unit 52 drives the rotation driving unit 32 to The mounting table 30 and the object to be measured S mounted on the mounting table 30 are rotated about the rotation axis Yr.

Each time the mounting table 30 and the object to be measured S rotate by a predetermined angle on the rotation axis Yr, the detector 4 generates the first data D1, and outputs the set X-ray output and the relative position (that is, the detected movement position). And the detected rotational position) are temporarily stored in the work memory 55. When the first data D1 is generated as described above, the image generation unit 53 includes the third data D3 and the simulation data D4 associated with the same output as the X-ray output when the first data D1 is generated. Are read from the storage unit 56. Prior to the generation of the first data D1, the present invention also applies to reading out the third data D3 and the simulation data D4 from the internal storage unit 531 when the output of the X-rays emitted from the X-ray source 2 is set. It is included in one aspect.

As described above, the image generation unit 53 generates the projection image data D200 of the measurement object S using the first data D1, the third data D3, and the simulation data D4. In this case, the image generation unit 53 selects simulation data D4 associated with the same relative position as the relative position associated with the first data D1 from among the plurality of read simulation data D4. That is, the image generation unit 53 uses the first data D1 and the simulation data D4 that can be regarded as having substantially the same influence of scattering and reflection by the mounting table 30. The image generation unit 53 adds the third data D3 indicating the intensity distribution in the X-ray propagation direction and the simulation data D4 to obtain information corresponding to the second data D2 described in the first embodiment. The data which has is generated. The image generation unit 53 subtracts the generated data from the first data D1 to generate intermediate data D150, and adds the third data D3 to the intermediate data D150, whereby a plurality of measured objects for each relative position are obtained. S projection image data D200 is generated. When the projection image data D200 of the plurality of objects to be measured S is generated, the image reconstruction unit 54 generates three-dimensional data that is the internal structure (cross-sectional structure) of the object to be measured S by image reconstruction processing. Since the third data and the simulation data D4 are stored in the internal storage unit 531 in advance, a new generation process of the third data and the simulation data D4 is also performed for various objects to be measured having different shapes and materials. Since the projection image data of the object to be measured can be generated without performing it, the convenience can be improved.
If it is known in advance that there is no X-ray transmitted through the mounting table 30 in the X-ray propagation path constituting the projection image of the measurement object S, the scattered reflection simulation data D103 is used as the simulation data D4. 'May be used. For example, the relative position of the object S to be measured is such that the placement surface of the object S to be measured matches the optical axis of the X-ray. In this case, since there is no X-ray that passes through both the measurement object S and the mounting table 30, the scattered reflection simulation data D103 ′ can be used as it is as the simulation data D4. In this specification, the X-ray optical axis is an axis that coincides with a line connecting the center of the X-ray detection range of the detector 4 and the focal point of the X-ray source 2.

The measurement process of the internal structure of the measurement object S by the X-ray apparatus 100 will be described with reference to the flowchart of FIG. Each process shown in the flowchart of FIG. 12 is performed by executing a program in the control device 5. This program is stored in a memory (not shown), and when the user places the workpiece S on the mounting table 30 and gives an instruction to start measuring the internal structure of the workpiece S, the control device 5 Get up and running.
Each processing from step S21 (moving the mounting table to the target position) to step S24 (first data generation end determination) is performed in step S1 (moving the mounting table to the target position) of FIG. 7 described in the first embodiment. This is the same as each process from (movement) to step S4 (first data generation end determination).

In step S25, the image generation unit 53 uses the third data D3 and the simulation data D4 stored in association with the same output as the X-ray output set in step S22 when generating the first data D1. Read and proceed to step S26. When the third data D3 and the simulation data D4 are read when the X-ray output is set, the process of step S25 can be performed in step S22. In step S26, the image generation unit 53 uses the first data D1, the third data D3, and the simulation data D4 associated with the same predetermined angle as the predetermined angle associated with the first data D1. The projection image data D200 of the object to be measured S is generated, and the process proceeds to step S27. Each processing from step S27 (projection image data generation end determination) to step S28 (three-dimensional data generation) is performed from step S9 (projection image data generation end determination) to step S10 (three-dimensional data generation) in FIG. This is the same as each process. If a negative determination is made in step S27, the process returns to step S26.

According to the X-ray apparatus according to the second embodiment described above, in addition to the functions and effects (1) to (3) obtained by the first embodiment, the following functions and effects can be obtained.
The image generation unit 53 detects the first data D1, the third data D3 output by the detector 4 when there is no mounting table 30 between the X-ray source 2 and the detector 4, the X-ray source 2 and the detection. Based on simulation data D4 calculated by simulation of detection data relating to the mounting table 30 output by the detector 4 when the mounting table 30 on which the object to be measured S is not mounted is positioned between the device 4 and the device 4. Projection image data D200 of the device under test S is generated. Therefore, by generating and storing the third data D3 and the simulation data D4 in advance, data indicating the influence of X-rays scattered or reflected by the mounting table 30 is obtained each time the measurement object S is measured. It is no longer necessary and contributes to the efficiency of the work process.

-Third embodiment-
A structure manufacturing system according to an embodiment of the present invention will be described with reference to the drawings. The structure manufacturing system of the present embodiment creates a molded product such as an electronic component including, for example, an automobile door portion, an engine portion, a gear portion, and a circuit board.

FIG. 13 is a block diagram showing an example of the configuration of the structure manufacturing system 400 according to the present embodiment. The structure manufacturing system 400 includes an X-ray apparatus 100, a design apparatus 410, a molding apparatus 420, a control system 430, which are described in the first to second embodiments or the first to third modifications. A repair device 440.

The design device 410 is a device used by a user when creating design information related to the shape of a structure, and performs a design process for creating and storing design information. The design information is information indicating the coordinates of each position of the structure. The design information is output to the molding apparatus 420 and a control system 430 described later. The molding apparatus 420 performs a molding process for creating and molding a structure using the design information created by the design apparatus 410. In this case, the molding apparatus 420 includes an apparatus that performs at least one of laminating, casting, forging, and cutting represented by 3D printer technology.

The X-ray apparatus 100 performs a measurement process for measuring the shape of the structure molded by the molding apparatus 420. The X-ray apparatus 100 outputs information (hereinafter referred to as shape information) indicating the coordinates of the structure, which is a measurement result of the structure, to the control system 430. The control system 430 includes a coordinate storage unit 431 and an inspection unit 432. The coordinate storage unit 431 stores design information created by the design apparatus 410 described above.

The inspection unit 432 determines whether the structure molded by the molding device 420 is molded according to the design information created by the design device 410. In other words, the inspection unit 432 determines whether or not the molded structure is a good product. In this case, the inspection unit 432 reads the design information stored in the coordinate storage unit 431 and performs an inspection process for comparing the design information with the shape information input from the X-ray apparatus 100. The inspection unit 432 compares, for example, the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information as the inspection processing, and if the coordinates of the design information and the coordinates of the shape information match as a result of the inspection processing. It is determined that the product is a non-defective product molded according to the design information. If the coordinates of the design information do not match the coordinates of the corresponding shape information, the inspection unit 432 determines whether or not the coordinate difference is within a predetermined range, and if it is within the predetermined range, it can be restored. Judged as a defective product.

If it is determined that the defective product can be repaired, the inspection unit 432 outputs repair information indicating the defective portion and the repair amount to the repair device 440. The defective part is the coordinate of the shape information that does not match the coordinate of the design information, and the repair amount is the difference between the coordinate of the design information and the coordinate of the shape information in the defective part. The repair device 440 performs a repair process for reworking a defective portion of the structure based on the input repair information. The repair device 440 performs again the same process as the molding process performed by the molding apparatus 420 in the repair process.

Processing performed by the structure manufacturing system 400 will be described with reference to the flowchart shown in FIG.
In step S31, the design device 410 is used when the structure is designed by the user. The design apparatus 410 creates and stores design information related to the shape of the structure by the design process, and the process proceeds to step S32. Note that the present invention is not limited to only the design information created by the design apparatus 410, and when design information already exists, the design information is acquired by inputting the design information and is included in one aspect of the present invention. It is. In step S32, the forming apparatus 420 creates and forms a structure based on the design information by the forming process, and proceeds to step S33. In step S33, the X-ray apparatus 100 performs measurement processing, measures the shape of the structure, outputs shape information, and proceeds to step S34.

In step S34, the inspection unit 432 performs an inspection process for comparing the design information created by the design apparatus 410 with the shape information measured and output by the X-ray apparatus 100, and the process proceeds to step S35. In step S35, based on the result of the inspection process, the inspection unit 432 determines whether or not the structure formed by the forming apparatus 420 is a non-defective product. If the structure is a non-defective product, that is, if the coordinates of the design information coincide with the coordinates of the shape information, an affirmative determination is made in step S35 and the process ends. If the structure is not a non-defective product, that is, if the coordinates of the design information do not match the coordinates of the shape information, or if coordinates that are not in the design information are detected, a negative determination is made in step S35 and the process proceeds to step S36.

In step S36, the inspection unit 432 determines whether or not the defective portion of the structure can be repaired. If the defective part is not repairable, that is, if the difference between the coordinates of the design information and the shape information in the defective part exceeds the predetermined range, a negative determination is made in step S36 and the process ends. If the defective part can be repaired, that is, if the difference between the coordinates of the design information and the shape information in the defective part is within a predetermined range, an affirmative determination is made in step S36 and the process proceeds to step S37. In this case, the inspection unit 432 outputs repair information to the repair device 440. In step S37, the repair device 440 performs a repair process on the structure based on the input repair information, and returns to step S33. As described above, the repair device 440 performs again the same processing as the molding processing performed by the molding device 420 in the repair processing.

According to the structure manufacturing system of the fourth embodiment described above, the following functions and effects can be obtained.
(1) The X-ray apparatus 100 of the structure manufacturing system 400 performs a measurement process for acquiring shape information of the structure created by the molding apparatus 420 based on the design process of the design apparatus 410, and performs an inspection unit of the control system 430. Reference numeral 432 performs an inspection process for comparing the shape information acquired in the measurement process with the design information created in the design process. Therefore, it is possible to determine whether or not a structure is a non-defective product created according to design information by inspecting the defect of the structure and information inside the structure by nondestructive inspection. Contribute to.

(2) The repair device 440 performs the repair process for performing the molding process again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same processing as the molding process can be performed again on the structure, which contributes to the manufacture of a high-quality structure close to design information.

The following modifications are also within the scope of the present invention, and one or a plurality of modifications can be combined with the above-described embodiment.
The mounting table 30 on which the object to be measured S is mounted is limited to one that is moved in the X-axis, Y-axis, and Z-axis directions by the Y-axis moving unit 33, the X-axis moving unit 34, and the Z-axis moving unit 35. Not. The mounting table 30 does not move in the X-axis, Y-axis, and Z-axis directions, and the X-ray source 2 and the detector 4 are moved in the X-axis, Y-axis, and Z-axis directions, so that What relatively moves the radiation source 2 and the detector 4 is also included in one aspect of the present invention. Further, instead of the table 30 rotating about the rotation axis Yr, the table 30 does not rotate, and the X-ray source 2 and the detector 4 rotate about the rotation axis Yr. Included in embodiments.
Further, a radiation source that radiates radiation to the object S to be measured, a detector that detects radiation radiated from the radiation source, and outputs detection data; and a radiation source disposed between the radiation source and the detector. A mounting member that mounts the object S; and a generation unit that generates projection image data of the object S to be measured based on the radiation detected by the detector. The generation unit includes the object acquired from the detector. An apparatus having a correction unit that corrects the transmission image data of the measurement object S so as to reduce the detection error component of the transmission image data generated when the mounting member is exposed to radiation is also included in one aspect of the present invention. It is.
In the second embodiment, the simulation data calculated by the simulation is used as the second data D2. However, instead of the simulation data, the second data D2 is based on a transmission image of the mounting table 30 or the like based on the empirical rule so far. The X-ray intensity distribution may be estimated by the user or device manufacturer and used as the second data.

As long as the characteristics of the present invention are not impaired, the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .

2 ... X-ray source, 3 ... mounting part, 4 ... detector,
5 ... Control device, 30 ... Mounting table, 32 ... Rotation drive part,
33 ... Y-axis moving unit, 34 ... X-axis moving unit, 35 ... Z-axis moving unit,
36 ... Manipulator part, 51 ... X-ray control part, 52 ... Movement control part,
53 ... Image generation unit, 54 ... Image reconstruction unit, 55 ... Work memory,
100 ... X-ray apparatus, 331 ... Y position detector,
341 ... X position detector, 351 ... Z position detector, 321 ... Rotation position detector,
400 ... structure manufacturing system, 410 ... design device, 420 ... molding device,
430 ... Control system, 432 ... Inspection section, 440 ... Repair device,
531: Internal storage unit, 532: Subtraction processing unit, 533: Projection image data generation unit

Claims (20)

1. A radiation source that emits radiation to the object to be measured;
   A detector that detects the radiation emitted from the radiation source and outputs detection data;
   A mounting member disposed between the radiation source and the detector and mounting the object to be measured;
   A generator that generates projection data of the object to be measured based on the radiation detected by the detector;
   The generation unit, the first data output as the detection data by the detector when the object to be measured is placed on the mounting member located between the radiation source and the detector, The device under test based on the second data output as the detection data by the detector when the device under test is not placed on the mounting member located between the radiation source and the detector. The projection data is generated, or the detection is performed when the mounting member is placed between the first data and the radiation source and the detector. A projection data generation device that generates projection data of the object to be measured based on estimated data that is estimated to be output from a measuring device.
2. The projection data generation device according to claim 1,
   When the generation unit generates projection data of the measurement object, the generation unit outputs the detection data as the detection data by the detector when there is no placement member between the radiation source and the detector. Projection data generation apparatus using 3 data.
3. The projection data generation device according to claim 2,
   A projection data generating apparatus, further comprising a moving unit that moves the mounting member relative to the radiation source and the detector.
4. In the projection data generation device according to claim 3,
   The relative position of the mounting member with respect to the radiation source and the detector when the first data is output by the detector, and the radiation source and the radiation source when the second data is output by the detector. A projection data generating device in which the relative position of the mounting member with respect to the detector is the same.
5. The projection data generation device according to claim 4,
   A storage unit that stores a plurality of the second data output for each of the predetermined relative positions in association with the relative positions;
   A position detection unit that detects the relative position of the mounting member with respect to the radiation source and the detector;
   The generating unit stores the first data in association with the relative position that is the same as the relative position detected by the position detecting unit when the first data is output by the detector. A projection data generation device that generates projection data of the object to be measured based on two data.
6. In the projection data generation device according to claim 4 or 5,
   The radiation emitted from the radiation source when the first data is output by the detector and the radiation emitted from the radiation source when the second data is output by the detector. Projection data generation device that is the same as the output.
7. In the projection data generation device according to any one of claims 4 to 6,
   Projection data of the different object to be measured based on the detection data output by the detector when the object to be measured different from the object to be measured is placed on the mounting member, and the second data. Projection data generation device for generating
8. In the projection data generation device according to claim 3,
   The relative position of the mounting member with respect to the radiation source and the detector when the first data is output by the detector, and the mounting position with respect to the radiation source and the detector when estimating the estimated data. A projection data generation device having the same relative position of members.
9. The projection data generation apparatus according to claim 8, wherein
   A storage unit that stores a plurality of the estimated data estimated for each of the predetermined relative positions in association with the relative position;
   A position detection unit that detects the relative position of the mounting member with respect to the radiation source and the detector;
   The generation unit associates the first data, the third data, and the relative position that is the same as the relative position detected by the position detection unit when the first data is output by the detector. A projection data generation device that generates projection data of the object to be measured based on the estimated data stored in the above.
10. In the projection data generation device according to claim 8 or 9,
    The radiation emitted from the radiation source when the first data is output by the detector and the radiation emitted from the radiation source when the third data is output by the detector. Projection data generation device that is the same as the output.
11. In the projection data generation device according to any one of claims 8 to 10,
    Based on the detection data, the third data, and the estimated data output by the detector when an object to be measured different from the object to be measured is placed on the mounting member. A projection data generation device that generates projection data of a measurement object.
12. In the projection data generation device according to any one of claims 8 to 11,
    The projection data generation apparatus, wherein the estimation data is data generated using the structure information and material of the mounting member.
13. In the projection data generation device according to any one of claims 4 to 12,
    The relative position is a projection data generation device including a relative direction of the mounting member with respect to the radiation.
14. In the projection data generation device according to any one of claims 1 to 13,
    The mounting member is a projection data generation device including a jig for stably mounting the object to be measured.
15. In the projection data generation device according to any one of claims 1 to 14,
    The generation unit uses the one of the second data and the estimation data to generate projection data of the object to be measured in which the scattered component of the X-rays scattered by the mounting member in the first data is reduced. Projection data generation device to generate.
16. In the projection data generation device according to any one of claims 1 to 14,
    The projection data generation device, wherein the estimation data is simulation data in which detection data related to the mounting member output by the detector is calculated by simulation.
17. The projection data generation device according to any one of claims 1 to 16,
    Based on projection data of a plurality of the measurement objects acquired by the detector and generated by the generation unit in a state where the relative positions of the radiation source and the detector with respect to the measurement object are different. A measuring device comprising: a reconstruction unit that generates internal structure information of an object.
18. Create design information about the shape of the structure,
    Create the structure based on the design information,
    The shape of the created structure is measured using the measuring device according to claim 17 to obtain shape information,
    A structure manufacturing method for comparing the acquired shape information and the design information.
19. In the manufacturing method of the structure according to claim 18,
    A method of manufacturing a structure, which is executed based on a comparison result between the shape information and the design information, and reworks the structure.
20. In the manufacturing method of the structure according to claim 19,
    The reworking of the structure is a structure manufacturing method in which the structure is created again based on the design information.
    
    
    

Images