WO2016021031A1 - X-ray apparatus and structure production method - Google Patents

X-ray apparatus and structure production method Download PDF

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Publication number
WO2016021031A1
WO2016021031A1 PCT/JP2014/070942 JP2014070942W WO2016021031A1 WO 2016021031 A1 WO2016021031 A1 WO 2016021031A1 JP 2014070942 W JP2014070942 W JP 2014070942W WO 2016021031 A1 WO2016021031 A1 WO 2016021031A1
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WIPO (PCT)
Prior art keywords
mounting plate
ray
unit
ray apparatus
measured
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PCT/JP2014/070942
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French (fr)
Japanese (ja)
Inventor
田中　稔久
信介 武田
直史 坂口
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株式会社ニコン
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Priority to PCT/JP2014/070942 priority Critical patent/WO2016021031A1/en
Publication of WO2016021031A1 publication Critical patent/WO2016021031A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/044—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using laminography or tomosynthesis

Definitions

  • the present invention relates to an X-ray apparatus and a method for manufacturing a structure.
  • an X-ray apparatus in which an X-ray source is arranged so that the optical axis of X-rays is in the vertical direction, and a mounting plate on which an object to be measured is placed is provided horizontally (see Patent Document 1). ).
  • a ball mechanism that supports the mounting plate from below is provided in order to prevent the bending of the mounting plate due to the weight of the object to be measured.
  • Patent Document 1 cannot arbitrarily control the bending of the mounting plate when the object to be measured is mounted on the mounting plate.
  • the X-ray apparatus is configured to place the measurement object on the placement plate and the measurement object placed on the placement plate from above or below the placement plate.
  • An X-ray irradiation unit that irradiates X-rays an X-ray detection unit that acquires a transmission image of a measurement object irradiated by X-rays, and a deflection control unit for controlling the deflection of the mounting plate.
  • the bending control unit can control the bending of the mounting plate when the object to be measured is mounted on the mounting plate. preferable.
  • the placement plate moving mechanism that moves the placement plate relative to the X-ray irradiation unit or the X-ray detection unit is further provided. It is preferable to provide.
  • the deflection control unit is a surface on the opposite side of the surface on which the object to be measured of the mounting plate is placed, It is preferable to have a support part for supporting the mounting plate.
  • the bending control unit includes a support unit moving mechanism that moves the support unit in the vertical direction, and a support unit control unit that controls the support unit moving mechanism. It is preferable to have.
  • the support controller controls the bending state of the mounting plate to be in the same state as when there is no object to be measured on the mounting plate. Alternatively, it is preferable to set the position of the support portion so that the surface of the mounting plate on which the object to be measured is placed is convex.
  • the support control unit moves the support in the vertical direction in synchronization with the vertical movement of the mounting plate. It is preferable to control the support part moving mechanism.
  • the position of the support portion is set so that the bending state of the mounting plate is the same as the state where there is no object to be measured on the mounting plate. Is set, the magnification of the transmission image of the object to be measured acquired by the X-ray detection unit is acquired based on the vertical position of the mounting plate, and the bending state of the mounting plate is determined.
  • the magnification is set to the vertical position of the placement plate and the vertical position of the support portion. It is preferable to further include a magnification acquisition unit that acquires based on the above.
  • the X-ray irradiation unit is configured so that the object to be measured placed on the placement board An X-ray irradiation unit that irradiates X-rays from below, and the support unit control unit is in a range in which the mounting plate is movable and is moved to the farthest position in the vertical direction from the X-ray irradiation unit. It is preferable to set the position of the support portion so that the surface of the mounting plate on which the object to be measured is mounted is convex.
  • the support controller controls the magnification of the transmission image of the measurement object acquired by the X-ray detector when the magnification is larger than a predetermined value.
  • the support portion preferably has a plurality of contact portions that are in rolling contact with the mounting plate.
  • the plurality of projections detected by the X-ray detection unit in a state where the X-ray irradiation directions to the object to be measured are different. It is preferable to provide a reconstruction unit that generates internal structure information of the object to be measured based on the data.
  • the structure manufacturing method creates design information related to the shape of the structure, creates the structure based on the design information, and sets the shape of the created structure to the first. The shape information is acquired by measurement using the X-ray apparatus according to any one of aspects 1 to 12, and the acquired shape information is compared with the design information.
  • the structure is preferably reprocessed based on a comparison result between the shape information and the design information.
  • it is preferable that the reworking of the structure is performed again based on the design information.
  • the present invention it is possible to arbitrarily control the bending of the mounting plate when the object to be measured is mounted on the mounting plate.
  • the figure explaining the bending of a measurement object mounting board The figure which shows the relationship between the magnification which a magnification acquisition part acquires, and a relative position, and the relationship between the actual magnification and relative position when the bending has generate
  • Side view showing the positional relationship among an X-ray source, a mounting table, a mechanical configuration unit of a deflection control unit, and an X-ray detector
  • the perspective view which shows the structure of the machine structure unit of a bending control part.
  • the figure explaining control of the bending by the bending control part The block diagram which shows the structure of the structure manufacturing system by 2nd Embodiment. The flowchart explaining operation
  • the X-ray apparatus irradiates the object to be measured with X-rays and detects transmitted X-rays that have passed through the object to be measured, thereby obtaining non-destructive X information (for example, internal structure) of the object to be measured.
  • This is a line CT (Computed Tomography) inspection apparatus.
  • an object to be measured is an industrial part such as a mechanical part or an electronic part
  • the X-ray apparatus is called an industrial X-ray CT inspection apparatus for inspecting an industrial part.
  • the embodiments are specifically described for understanding the gist of the invention, and do not limit the invention unless otherwise specified.
  • FIG. 1 is an internal front view showing an example of the internal structure of the X-ray apparatus 100 according to the present embodiment.
  • the X-ray apparatus 100 includes a housing 1, a gantry 2, and a control device 3.
  • the housing 1 is disposed on the floor surface of a factory or the like so that the XY plane is substantially horizontal, and the gantry 2 and the control device 3 are accommodated therein.
  • the housing 1 contains lead as a material in order to prevent X-rays from leaking to the outside.
  • the gantry 2 is equipped with an X-ray source 5, a placement unit 6, an X-ray detector 7, an X-ray detector drive unit 8, and a mechanical component unit of a deflection control unit 9.
  • the gantry 2 is provided at each of the rectangular base bottom 22, four corners on the base bottom 22, four struts 23 extending along the Z-axis direction, and the top of the struts 23, and an X-ray detector And an attachment member 24 for attaching the drive unit 8.
  • a vibration isolation mount 25 is attached to the lower part (Z-axis-side) of the base bottom panel 22 in order to attenuate vibration applied to the gantry 2 from the outside of the housing 1.
  • the anti-vibration mount 25 is configured by, for example, a known air spring or coil spring alone or in combination.
  • the gantry 2 is not limited to the one that supports the X-ray detector drive unit 8 on the upper part of the four support columns 23, and a structure necessary for the X-ray detector drive unit 8 to be stably supported. Can have a shape.
  • the X-ray source 5 is attached in the vicinity of the center of the foundation bottom plate 22 of the gantry 2.
  • the X-ray source 5 is controlled by the control device 3 and emits wide-angle X-rays (so-called cone beams) that expand in a conical shape in the range of the visual field VV with the point P shown in FIG. This emission point coincides with the focal spot of the X-ray source 5.
  • an axis parallel to the Z axis passing through the point P is referred to as a reference axis L.
  • the X-ray source 5 is provided so that the reference axis L passes through the center of the gantry 2.
  • the X-ray source 5 may be constituted by a transmission type X-ray source or a reflection type X-ray source.
  • the Z-axis + side end face of the X-ray source 5 is made of a conductive metal (for example, brass, tungsten alloy, copper, etc.).
  • the Z-axis + side end surface is a target made of a material containing tungsten, for example, for generating X-rays when electrons from the filament arrive. is there.
  • the X-ray source 5 has a protective member made of a conductor such as beryllium in order to protect the target from the outside, this protective member becomes the Z-axis + side end surface of the X-ray source 5.
  • the X-ray source 5 generates at least one kind of X-ray, for example, an ultra-soft X-ray of about 50 eV, a soft X-ray of about 0.1 to 2 keV, an X-ray of about 2 to 20 keV, and a hard X-ray of about 20 to 100 keV.
  • an ultra-soft X-ray of about 50 eV a soft X-ray of about 0.1 to 2 keV
  • an X-ray of about 2 to 20 keV an X-ray of about 2 to 20 keV
  • a hard X-ray of about 20 to 100 keV.
  • the mounting unit 6 includes a mounting table 61 for mounting the object to be measured S, an X-axis moving mechanism 62 for moving the mounting table 61 in the X-axis, Y-axis, and Z-axis directions, and a Y-axis moving mechanism, respectively. 63 and a Z-axis moving mechanism 64.
  • the X-axis moving mechanism 62, the Y-axis moving mechanism 63, and the Z-axis moving mechanism 64 are each configured by a motor, a rail, a slider, and the like, and the mounting table 61 is moved in the X-axis direction, the Y-axis direction, and the Z-axis according to control by the control device 3 Move along the axial direction.
  • the Z position detector 641 detects the position of the mounting table 61 moved in the Z axis direction by the Z axis moving mechanism 64 and outputs a signal indicating the detected position (hereinafter referred to as a Z position signal) to the control device 3. Encoder. Details of the mounting table 61 will be described later.
  • the bending control unit 9 is for controlling the bending of the measurement object mounting plate 611 (see FIG. 2) that constitutes the mounting table 61, and the bending control support member 91 that is a mechanical component unit of the bending control unit 9. And a support member moving mechanism 92 (see FIG. 4) and a support member control unit 37 for controlling deflection. Details of the deflection control unit 9 will be described later.
  • the X-ray detector 7 includes a scintillator unit including a known scintillation substance, a photomultiplier tube, a light receiving unit, and the like.
  • the X-ray detector 7 emits an object to be measured S emitted from the X-ray source 5 and mounted on the mounting table 61. X-rays including the transmitted X-rays are received.
  • the X-ray detector 7 converts the received X-ray energy into light energy by the scintillator unit, converts the light energy into electric energy, and outputs it as an electric signal. Note that the X-ray detector 7 may convert the incident X-ray energy into an electrical signal without converting it into light energy, and output it.
  • the X-ray detector 7 has a plurality of pixels, and these pixels are two-dimensionally arranged. Thereby, the intensity distribution of the X-rays radiated from the X-ray source 5 and passed through the object to be measured S can be acquired collectively. Therefore, it is possible to acquire the entire projected image of the object S to be measured with one shooting.
  • the X-ray detector drive unit 8 moves the X-ray detector 7 on a rotation path centered on the reference axis L.
  • the X-ray detector drive unit 8 includes a rotation mechanism 81 attached to the attachment member 24 of the gantry 2 and an arcuate stage 82 rotated by the rotation mechanism 81.
  • the rotation mechanism 81 includes an attachment plate 811, a motor 812 attached to the attachment plate 811, a first gear 813 that is rotated by the motor 812, a second gear 814 that meshes with the first gear 813, and a hollow rotation shaft 815. have.
  • the arc-shaped stage 82 is a plate formed in a circular arc shape having a predetermined length around a point P that is an X-ray emission point.
  • the arcuate stage 82 is provided with a guide rail, a slider, and the like, and the X-ray detector 7 described above is attached to the arcuate stage 82 so as to be movable along the arcuate track M of the arcuate stage 82.
  • the desired height Z axis + side same
  • the desired height is set so that the trajectory of the X-ray detector 7 is along the side surface of the cone having the point P as the apex. It can be adjusted to make a circular motion on the surface.
  • the user can photograph the measurement object S at a desired photographing position and photographing angle.
  • the mounting table 61 in the Z-axis direction the measurement object S can be photographed at a desired magnification.
  • the control device 3 has a microprocessor, peripheral circuits, and the like, and reads and executes a control program stored in advance in a storage medium (not shown) (for example, a flash memory), thereby Control each part.
  • the control device 3 includes an X-ray control unit 31, a movement control unit 32, an image generation unit 33, an image reconstruction unit 34, a magnification acquisition unit 36, and a deflection control support member control unit 37.
  • the X-ray control unit 31 controls the output of the X-ray source 5.
  • the movement control unit 32 controls the movement operation of the placement unit 6.
  • the movement control unit 32 controls the movement operation of the X-ray detector 7 by the X-ray detector driving unit 8.
  • the image generation unit 33 generates X-ray projection image data of the object S to be measured based on the electrical signal output from the X-ray detector 7.
  • the image reconstruction unit 34 generates a reconstructed image by performing a known image reconstruction process based on the projection image data of the measurement object S having different projection directions. Three-dimensional data that is the internal structure (cross-sectional structure) of the measurement object S is generated from the reconstructed image.
  • a method for generating a reconstructed image includes a back projection method, a filtered back projection method, a successive approximation method, and the like.
  • the deflection control support member control unit 37 is connected so as to acquire a control signal of the Z-axis moving mechanism 64 from the movement control unit 32, and is input to the control device 3 from the Z position detection unit 641. It is connected so that a detection signal can also be acquired. Based on these signals, the deflection control support member controller 37 controls the position of a deflection control support member 91 (see FIG. 4), which will be described later.
  • the magnification acquisition unit 36 Based on the Z position signal output from the Z position detector 641, that is, the position of the mounting table 61 in the Z-axis direction, the magnification acquisition unit 36 receives the projection image data of the measurement object S placed on the mounting table 61 and Get the magnification of the component image. Furthermore, the magnification acquisition unit 36 is connected to the deflection control support member control unit 37 so as to acquire the control signal from the deflection control support member control unit 37, and also acquires this control signal, The magnification of the projection image data is calculated.
  • the magnification acquisition unit 36 has an interface for inputting an instruction from the user. The magnification acquisition unit 36 outputs a control signal to the movement control unit 32 and the deflection control support member control unit 37 based on the requested magnification information acquired through this interface. Details of the processing by the magnification acquisition unit 36 will be described later.
  • FIG. 2 is a side view showing the positional relationship in the Z-axis direction among the X-ray source 5, the placement unit 6, and the X-ray detector 7.
  • the deflection control support member 91 is not illustrated in order to explain a problem when the deflection control support member 91 is not provided.
  • the members related to the mounting table 61 among the members constituting the mounting unit 6 are shown as representatives, and the X-ray detector 7 is positioned on the reference axis L in order to simplify the description. Indicates when to do.
  • a coordinate system composed of the X axis, the Y axis, and the Z axis is set as shown in FIG.
  • the mounting table 61 includes a measurement object mounting plate 611 and a mounting plate holding unit 612.
  • the measurement object placing plate 611 is manufactured by, for example, CFRP (carbon fiber reinforced plastic) or the like, and the measurement object S is placed on the measurement object placing plate 611 (on the Z axis + side).
  • the X-ray source 5 irradiates the measurement object S placed on the measurement object placing plate 611 with X-rays from below the measurement object placing plate 611 (Z-axis side).
  • the measurement object placing plate 611 is designed to increase the maximum magnification of the projection image projected onto the X-ray detector 7 as much as possible and to reduce the absorption of X-rays emitted from the X-ray source 5 as much as possible. Is formed with a small thickness.
  • the mounting plate holding unit 612 has a frame shape that holds the measurement object mounting plate 611 along the outer periphery.
  • the mounting plate holding unit 612 is supported by the mounting plate holding unit 612 by moving in the X-axis, Y-axis, and Z-axis directions by the X-axis moving mechanism 62, the Y-axis moving mechanism 63, and the Z-axis moving mechanism 64.
  • the measured object placing plate 611 and the measured object S placed on the measured object placing plate 611 move together in the X-axis, Y-axis, and Z-axis directions. 2 shows an example in which the mounting plate holding unit 612 holds the workpiece mounting plate 611 from the Z axis + side, but the holding method by the mounting plate holding unit 612 is shown in FIG.
  • the mounting plate holding unit 612 is attached to the measured object mounting plate 611 from the Z axis ⁇ side, or the holding object holding plate 611 is held by being sandwiched from the Z axis + side and the ⁇ side. It is included in one embodiment of the present invention.
  • the surface on the Z axis + side of the measurement object placing plate 611 that is, the surface on which the object S to be measured is placed is the placement surface 611a, and the surface on the Z axis ⁇ side, that is, the placement surface.
  • a surface opposite to 611a is referred to as a back surface 611b.
  • the measured object placing plate 611 is thin, when the measured object S is placed on the placing surface 611a, the measured object placing plate 611 is placed in the Z-axis direction due to the weight of the measured object S— Deflection occurs on the side.
  • the magnification obtaining unit 36 between the magnification obtained based on the Z-axis direction position of the placing table 61 output from the Z position detecting unit 641 and the actual magnification. An error occurs.
  • FIG. 2A and 2B show a state in which the measured object placing plate 611 is not bent
  • FIG. 2C shows a state in which the measured object placing plate 611 is bent
  • 2 (a) and 2 (b) are diagrams schematically showing a hypothetical state that the measured object placing plate 611 is not bent even when the measured object S is placed
  • FIG. 2B is a diagram showing a state in which the measurement object placing plate 611 is in contact with the X-ray source 5.
  • the magnification of the transmission image of the measurement object S included in the projection image or the reconstructed image is the distance D1 between the emission point P of the X-ray source 5 and the light receiving surface of the X-ray detector 7, and the emission point P and the measurement object. It is determined by the distance D2 from S. That is, the magnification is represented by D1 / D2. Accordingly, the magnification of the transmission image of the object S to be measured increases as the distance D2 between the emission point P of the X-ray source 5 and the object S to be measured decreases. In FIG.
  • the distance D2 on the Z-axis-side end surface of the measured object S is the thickness of the measured object placing plate 611. Equivalent to. That is, the distance D2 is minimum, and at this time, the magnification of the transmission image of the object S to be measured is the maximum magnification.
  • the X-ray apparatus 100 has a configuration in which the mounting table 61 moves in the Z-axis direction. That is, the mounting plate holding unit 612 that supports the measurement object mounting plate 611 is moved by the Z-axis moving mechanism 64.
  • the Z position detector 641 detects the relative position of the measurement object placing plate 611 moved by the Z axis moving mechanism 64 with respect to the X-ray source 5. As shown in FIG. 2B, when the measurement object placing plate 611 is in contact with the X-ray source 5 in a state where the measurement object placing plate 611 is not bent, it is detected by the Z position detection unit 641.
  • the relative position to the X-ray source 5 is Z0.
  • the Z position detection unit 641 detects the measurement object mounting plate 611 at a predetermined position of the mounting table 61 where the measurement object mounting plate 611 is not in contact with the X-ray source 5.
  • the relative position is Z1 (FIG. 2A).
  • the magnification acquisition unit 36 obtains the magnification of the transmission image of the measurement object S based on the relative position Z0 or Z1 of the measurement object placing plate 611 detected by the Z position detection unit 641.
  • the relative position Z0 or Z1 and the magnification of the transmission image of the object S to be measured are associated with each other and stored in advance as a magnification data table in a predetermined storage area (not shown), and the magnification acquisition unit 36 detects the Z position.
  • the magnification is obtained by referring to the magnification data table. Note that, as described above, the magnification of the transmission image of the measurement object S is maximized at the relative position Z0 corresponding to the state where the measurement object placing plate 611 and the X-ray source 5 are in contact with each other.
  • FIG. 2C shows a state in which the measured object placing plate 611 that has been bent is in contact with the X-ray source 5.
  • the relative position of the measurement object placing plate 611 detected by the Z position detection unit 641 with respect to the X-ray source 5 is defined as Z1. That is, in the state of FIG. 2A, a case where the measurement object placing plate 611 is replaced with a heavier measurement object S so that the measurement object placing plate 611 just contacts the X-ray source 5 is shown.
  • the measured object placing plate 611 and the X-ray source 5 are in contact with each other, the actual magnification of the transmission image of the measured object S is maximized.
  • the relative position detected by the Z position detection unit 641 is Z1
  • the magnification of the transmission image of the measurement object S acquired by the magnification acquisition unit 36 with reference to the magnification data table as described above is not the maximum. That is, an error occurs between the magnification of the transmission image of the measurement object S acquired by the magnification acquisition unit 36 and the magnification of the actual transmission image of the measurement object S.
  • FIG. 3 the relationship between the magnification of the transmission image acquired by the magnification acquisition unit 36 and the relative position of the measurement object mounting plate 611 with respect to the X-ray source 5, and the actual measurement object S when the bending occurs.
  • the relationship between the magnification of a transmission image and the relative position with respect to the X-ray source 5 of the measurement object mounting plate 611 is shown.
  • the relationship between the acquisition magnification of the magnification acquisition unit 36 and the relative position is indicated as 660
  • the relationship between the actual magnification and the relative position when the bending occurs is indicated as 661.
  • the relationship 661 indicates that the relative position of the measurement object placing plate 611 with respect to the X-ray source 5 is constant at the maximum magnification between Z0 and Z1, and the measurement object placing plate 611 with respect to the X-ray source 5 is constant.
  • the relative position exceeds Z1, it decreases with the increase of the relative position.
  • the relationship 660 decreases as the relative position of the measurement object placing plate 611 with respect to the X-ray source 5 increases from Z0.
  • the measured object placing plate 611 when the measured object placing plate 611 is bent, the measured object placing plate 611 is detected by the Z position detecting unit 641 over the entire area of the relative position of the measured object placing plate 611 with respect to the X-ray source 5.
  • An error occurs in the magnification of the transmission image.
  • the X-ray source 5 and the measurement object placing plate 611 are close to each other, that is, in a high-magnification region, the influence of errors due to bending is large.
  • the relative position of the measured object placing plate 611 with respect to the X-ray source 5 detected by the Z position detector 641 is between Z0 and Z1, the measured object placing plate 611 is in contact with the X-ray source 5. Therefore, even if the mounting plate holding unit 612 is moved by the Z-axis moving mechanism 64, the magnification of the transmission image of the object to be measured S remains unchanged at the maximum magnification.
  • the X-ray apparatus 100 can accurately acquire the magnification of the transmission image of the measurement object S by controlling the measurement object placing plate 611 so as not to be bent by the deflection control unit 9.
  • the magnification error in the high magnification region can be reduced.
  • FIG. 4 is a side view showing the positional relationship among the X-ray source 5, the mounting table 61, the mechanical component unit of the deflection control unit 9, and the X-ray detector 7.
  • FIG. 5 is a perspective view illustrating the configuration of the machine configuration unit of the deflection control unit 9, and illustrates only the machine configuration unit of the deflection control unit 9. 4 shows a case where the X-ray detector 7 is positioned on the reference axis L for the sake of simplicity. 4 and 5, similarly to FIG. 1, a coordinate system including the X axis, the Y axis, and the Z axis is set as illustrated.
  • the mechanical component unit of the deflection control unit 9 is provided so as to surround the periphery of the X-ray source 5.
  • the mechanical configuration unit of the deflection control unit 9 includes a deflection control support member 91 that supports the measurement object placing plate 611 on the back surface 611b of the measurement object placing plate 611, and the deflection control support member 91 along the Z-axis direction. And a support member moving mechanism 92 to be moved.
  • the deflection control support member 91 includes a cylindrical base portion 91a and three support columns 91b provided at equal intervals on the upper surface of the base portion 91a and extending in the Z-axis direction. Contact portions 91c that are in rolling contact with the back surface 611b of the measurement object placing plate 611 are provided on the upper portions of the three columns 91b. As described above, since the deflection control support member 91 supports the back surface 611b of the measurement object placing plate 611 at three locations, the measurement object placing plate 611 can be stably supported.
  • the deflection control support member 91 is provided so as to be able to contact a position near the center of the measurement object placing plate 611 around the X-ray source 5 in order to suppress the downward deflection of the measurement object placing plate 611 to be small. It is done. Further, the contact portion 91c of the deflection control support member 91 is configured to be in rolling contact with the back surface 611b of the measurement object placing plate 611, for example, by a mechanism in which the ball is rotatably held.
  • the support member moving mechanism 92 includes a rack 92a that is attached to the base portion 91a of the deflection control support member 91 and extends in the Z-axis direction, a pinion gear 92b that meshes with the rack 92a, a motor 92c that rotates the pinion gear 92b, A motor fixing plate 92d for fixing the motor 92c.
  • the support member moving mechanism 92 includes two guide movement side members 92e attached to the X axis + side and the X axis ⁇ side of the base portion 91a of the deflection control support member 91 and extending in the Z axis direction, and two guides.
  • the support member moving mechanism 92 has a base 92h attached to the base bottom plate 22 of the gantry 2, and a motor fixing plate 92d and two guide fixing plates 92g are attached to the base 92h.
  • the rack 92a moves in the Z-axis direction
  • the deflection control support member 91 to which the rack 92a is attached moves in the Z-axis direction.
  • the support member 91 for deflection control is guided so as to move along the Z-axis direction by a guide moving side member 92e and a guide fixing side member 92f attached to the base portion 91a.
  • FIG. 6 is a diagram for explaining a state of bending of the measurement object placing plate 611 controlled by the bending control unit 9.
  • FIG. 6 also shows the case where the X-ray detector 7 is positioned on the reference axis L for the sake of simplicity. Also in FIG. 6, as in FIG. 1, a coordinate system including the X axis, the Y axis, and the Z axis is set as shown.
  • the deflection control support member 91 is used as the measurement object placing plate 611. By pushing up, it is possible to control so that the measured object placing plate 611 is not bent (that is, a state similar to the state where the measured object S is not placed). Further, as described above, since the measurement object placing plate 611 is thin, the measurement object placing plate 611 is pushed by the deflection control support member 91 pushing up the measurement object placing plate 611 as shown in FIG. It can also be controlled so that there is a state in which there is bending in the Z-axis + direction (that is, a state where the mounting surface 611a is convex).
  • the movement of the deflection control support member 91 by the support member moving mechanism 92 is controlled by the deflection control support member control unit 37 based on the control information of the movement control unit 32 of the control device 3.
  • the support member moving mechanism 92 includes an encoder (not shown). Based on an output from the encoder, the deflection control support member control unit 37 can acquire position information of the deflection control support member 91. Further, the position of the measurement object placing plate 611 detected by the Z position detection unit 641 is associated with the position of the deflection control support member 91 that can be supported so as not to cause the measurement object placement board 611 to bend.
  • the position data table is stored in advance in a predetermined storage area (not shown).
  • the deflection control support member control unit 37 refers to the position data table based on the output signal from the Z position detection unit 641, and the position information of the deflection control support member 91 obtained from the position data table. Based on the above, the support member moving mechanism 92 is controlled.
  • the deflection control support member control unit 37 sets the position of the deflection control support member 91 so as not to cause the measurement object placing plate 611 to bend based on the position data table before the operation of the X-ray apparatus 100 is started. Set. Therefore, even if the measurement object S is placed on the measurement object placement plate 611, the measurement object placement plate 611 is supported by the deflection control support member 91, so that the measurement object depends on the weight of the measurement object S. It is possible to prevent the downward bending of the mounting plate 611.
  • the movement control unit 32 drives the Z-axis movement mechanism 64 to move the measurement object mounting plate 611. Move to the target position.
  • the support member control unit 37 for bending control causes the support member moving mechanism 92 to move the support member 91 for bending control to the Z axis in synchronization with the movement of the measurement object placing plate 611 in the Z axis direction by the Z axis moving mechanism 64. By controlling the movement in the direction, the measurement object placing plate 611 is controlled not to bend.
  • the deflection control support member control unit 37 sets the position of the deflection control support member 91 so as not to cause the measurement object placing plate 611 to bend based on the position data table. Specifically, the deflection control support member control unit 37 moves the deflection control support member 91 in the Z-axis direction so as to have the same movement amount as the movement amount of the measurement object placing plate 611 in the Z-axis direction. As a result, the measured object placing plate 611 and the deflection control support member 91 are moved in the Z-axis direction while maintaining a state in which the measured object placing plate 611 is not bent.
  • the magnification acquisition unit 36 refers to the above-described magnification data table based on the relative position of the measurement object mounting plate 611 output from the Z position detection unit 641 and calculates the magnification of the transmission image of the measurement object S. get.
  • the magnification acquisition unit 36 can accurately acquire the magnification.
  • the measurement object placing plate 611 is in a range in which it can move in the Z axis + direction (upward) and is the farthest position from the X-ray source 5 in the Z axis direction (that is, the upper limit position of the height).
  • the relative position of the measurement object placing plate 611 detected by the Z position detection unit 641 at this time is Z2.
  • the position of the measurement object placing plate 611 is the upper limit position.
  • the position of the workpiece placing plate 611 cannot be further moved in the Z-axis + direction by the shaft moving mechanism 64. Therefore, in such a case, the deflection control support member control unit 37 moves only the deflection control support member 91 in the Z axis + direction while holding the movement of the measurement object placing plate 611 by the Z axis movement mechanism 64. By moving it, as shown in FIG. 6B, the measurement object placing plate 611 is bent in the Z-axis + direction.
  • the deflection control support member control unit 37 determines the position of the deflection control support member 91 in the Z-axis direction so that the placement surface 611a of the measurement object placement plate 611 is convex toward the X-ray detector 7 side. Set. Thereby, compared with the state which does not generate
  • the magnification acquisition unit 36 obtains the deflection amount T in the Z axis + direction of the measurement object placing plate 611 based on the position in the Z axis direction of the deflection control support member 91. Specifically, the magnification acquisition unit 36 determines whether the deflection control support member 91 is in a state in which no deflection occurs when the measurement object placing plate 611 is at the upper limit position from the position of the deflection control support member 91 in the Z-axis direction. The amount of deflection T is obtained by subtracting the position in the Z-axis direction.
  • the magnification acquisition unit 36 refers to the above-described magnification data table based on the value obtained by adding the deflection amount T to the relative position Z2 of the measurement object placing plate 611 output from the Z position detection unit 641.
  • the magnification of the transmission image of is acquired.
  • the magnification acquisition unit 36 may calculate the magnification based on the output value of the encoder provided in the support member moving mechanism 92 instead of the output value from the Z position detection unit 641. As a result, the magnification of the transmission image of the measurement object S in a state where the measurement object mounting plate 611 is bent upward by the deflection control support member 91 can be accurately acquired.
  • the measurement object S when the measurement object S is moved to the target position where the magnification of the transmission image of the measurement object S desired by the user is obtained as described above, the measurement object S is measured.
  • the movement control unit 32 of the control device 3 moves the X-ray detector 7 to an arbitrary place on the spherical surface centered on the X-ray emission point P via the X-ray detector drive unit 8.
  • the X-ray control unit 31 controls the output of the X-ray source 5 to irradiate the measurement object S with X-rays.
  • the X-ray detector 7 detects transmitted X-rays radiated from the X-ray source 5 and transmitted through the object to be measured S at predetermined positions on the spherical surface centered at the emission point P, and sends them to the control device 3 as electrical signals. Output.
  • Each of the X-ray detector driving unit 8 for transferring the X-axis moving mechanism 62, the Y-axis moving mechanism 63, the rotating mechanism 81, and the X-ray detector 7 on the arcuate stage 82 includes an encoder (not shown). . Based on the output from the encoder and the output from the Z position detection unit 641, the control device 3 can acquire the position information of the placement unit 6 and the X-ray detector 7. While acquiring the respective position information, the image generation unit 33 generates projection image data that is an X-ray transmission image captured by the X-ray detector 7, and the image reconstruction unit 34 measures the measurement target based on the projection image data.
  • the cross-sectional structure of the object S can be reconfigured.
  • the control device 3 cooperatively controls the rotation of the rotation shaft 815 by the X-ray detector drive unit 8 and the generation of projection image data from the X-ray detector 7 in the image generation unit 33
  • the image reconstruction unit 34 projects the projection image data of the measurement object S from a plurality of different directions imaged by the X-ray detector 7 via the image generation unit 33 (that is, the irradiation direction of the X-rays to the measurement object S is different). A plurality of projection image data) is acquired.
  • the image reconstruction unit 34 also obtains outputs from the encoders and the Z position detection unit 641 via the movement control unit 32, and based on these outputs and projection image data, a known Feldkamp backprojection method is used.
  • three-dimensional data that is the internal structure (cross-sectional structure) of the DUT S is generated. Note that a successive approximation method or the like may be used as the image reconstruction processing.
  • the generated three-dimensional data of the internal structure of the measured object S is displayed on a display monitor (not shown).
  • the X-ray apparatus 100 includes a Z-axis moving mechanism 64 that moves the measurement object placing plate 611 in the Z-axis direction, and a bending control unit 9 for controlling the bending of the measurement object placing plate 611.
  • the deflection control unit 9 supports the measurement object placing plate 611 on the surface (back surface 611b) opposite to the surface (placement surface 611a) on which the measurement object S is placed on the measurement object placing plate 611.
  • the deflection control support member control unit 37 controls the support member moving mechanism 92 so that the measurement object placing plate 611 bends in a state similar to the state in which the measurement object placing plate 611 does not have the object S to be measured.
  • the position of the deflection control support member 91 is set so that the surface on which the object to be measured S of the measurement object placing plate 611 is placed is convex. With such a configuration, the X-ray apparatus 100 can arbitrarily control the bending of the measurement object placing plate 611 when the measurement object S is placed on the measurement object placing plate 611.
  • the deflection control support member control unit 37 moves the deflection control support member 91 in the vertical direction in synchronization with the movement of the workpiece placing plate 611 in the vertical direction (Z-axis direction). With such a configuration, the X-ray apparatus 100 can maintain a state in which the measurement object placing plate 611 is not bent when the measurement object placing plate 611 is moved in the vertical direction.
  • the deflection control support member control unit 37 is within a range in which the measurement object placing plate 611 can be moved by the Z-axis moving mechanism 64 and is farthest from the X-ray source 5 in the vertical direction (that is, at a height).
  • the state in which the object to be measured S is placed on the surface to be measured S (the placement surface 611a) of the measurement object placing plate 611 is convex in the state of being moved to the upper limit position).
  • the position of the deflection control support member 91 is set so that With such a configuration, the magnification of the transmission image of the measurement object S can be reduced as compared with the case where the deflection of the measurement object placing plate 611 is not controlled. That is, the range in which the magnification of the transmission image of the measurement object S can be changed can be widened on the low magnification side as compared with the case where the deflection of the measurement object placing plate 611 is not controlled.
  • the magnification acquisition unit 36 positions the bending control support member 91 so that the measured object placing plate 611 is bent in a state similar to the state in which the measured object placing plate 611 does not have the measured object S. Is set, the magnification of the transmission image of the object to be measured S is acquired based on the vertical position of the measurement object placing plate 611. In addition, the magnification acquisition unit 36 causes the measurement object placing plate 611 to bend so that the surface of the measurement object placing plate 611 on which the object S to be measured (the placement surface 611a) is convex.
  • the magnification of the transmission image of the object to be measured S is set to the vertical position of the measurement object placing plate 611 and the vertical position of the deflection control support member 91. Get based on.
  • the X-ray apparatus 100 can accurately acquire the magnification of the transmission image of the object S to be measured.
  • the deflection control support member 91 includes a plurality of contact portions 91 c that are in rolling contact with the measurement object placing plate 611. With such a configuration, the X-ray apparatus 100 can stably support the measurement object placing plate 611 by the bending control support member 91 and can smoothly control the bending.
  • the X-ray apparatus 100 can be modified as follows. (First modification) One that does not include a magnification data table that associates the magnification of the transmission image of the measurement object S with the relative position with respect to the X-ray source 5 is also included in one aspect of the present invention.
  • the magnification acquisition unit 36 calculates the magnification of the transmission image of the measurement object S based on the above-described D1 / D2 relationship based on the relative position with respect to the X-ray source 5 detected by the Z position detection unit 641. do it.
  • the contact portion 91c of the deflection control support member 91 may be rod-shaped, and the cross-sectional shape of the rod may be circular or rectangular.
  • the deflection control unit 9 may control the deflection over the entire range in which the workpiece mounting plate 611 can be moved by the Z-axis moving mechanism 64, or the deflection control unit 9 controls the deflection only in a part of the range. You may make it do.
  • the X-ray source 5 and the workpiece mounting plate 611 are close to each other in the Z-axis direction, that is, when the magnification is high, the influence of errors due to bending is large, but the low magnification is low. In this case, for example, in the case of about 10 times, the influence of the error due to the bending is small.
  • the deflection control support member control unit 37 moves the deflection control support member 91 according to the movement of the measurement object placing plate 611 only when the magnification of the transmission image is larger than a predetermined value (for example, 10 times). Then, the position of the bending control support member 91 is set so that the measured object placing plate 611 is not bent. On the other hand, when the magnification of the transmission image is a predetermined value (for example, 10 times) or less, the bending control support member 91 is not moved even if the measurement object placing plate 611 moves.
  • a predetermined value for example, 10 times
  • the measurement object placing plate 611 since the deflection of the measurement object placing plate 611 is not controlled by the deflection control support member 91, the measurement object placing plate 611 is bent in the Z-axis direction due to the weight of the measurement object S. The error of the magnification due to bending is small and can be ignored.
  • the deflection control support member is based on the error in magnification caused by the deflection.
  • the movement of 91 may be limited. Since the amount of deflection of the measurement object placing plate 611 varies depending on the weight and shape of the measurement object S, in this case, the weight and shape of the measurement object S need to be known in advance. In this case, the measured object mounting with respect to the magnification obtained based on the relative position of the measured object mounting plate 611 detected by the Z position detector 641 (that is, the magnification when the measured object mounting plate 611 is not bent).
  • the magnification error when the mounting plate 611 is bent is calculated in advance. Then, a magnification at which the magnification error becomes a predetermined value (for example, 10% or less) is obtained and stored in advance in a storage area (not shown).
  • the deflection control support member control unit 37 moves the deflection control support member 91 according to the movement of the measurement object placing plate 611 only when the magnification of the transmission image is larger than the stored magnification, and performs measurement.
  • the position of the bending control support member 91 is set so that the object placing plate 611 does not bend.
  • the bending control support member 91 is not moved even when the workpiece placing plate 611 is moved.
  • the measurement object placing plate 611 since the deflection of the measurement object placing plate 611 is not controlled by the deflection control support member 91, the measurement object placing plate 611 is bent in the Z-axis direction due to the weight of the measurement object S. Since the error in magnification due to bending is small (for example, 10% or less), it can be considered negligible.
  • One aspect of the present invention also applies to a case in which the support member moving mechanism 92 does not move the deflection control support member 91 in the Z-axis direction in synchronization with the movement of the workpiece placing plate 611 in the Z-axis direction by the Z-axis moving mechanism 64.
  • the support member moving mechanism 92 does not move the deflection control support member 91 in the Z-axis direction in synchronization with the movement of the workpiece placing plate 611 in the Z-axis direction by the Z-axis moving mechanism 64.
  • the deflection control support member 91 is moved in the Z-axis direction by the support member moving mechanism 92, and the measured-material placing plate is moved. Control may be performed so as not to cause 611 bending.
  • the structure manufacturing system of the present embodiment creates a molded product such as an electronic component including, for example, an automobile door portion, an engine portion, a gear portion, and a circuit board.
  • FIG. 7 is a block diagram showing an example of the configuration of the structure manufacturing system 400 according to the present embodiment.
  • the structure manufacturing system 400 includes the X-ray apparatus 100, the design apparatus 410, the molding apparatus 420, the control system 430, and the repair apparatus 440 described in the first embodiments.
  • the design device 410 is a device used by a user when creating design information related to the shape of a structure, and performs a design process for creating and storing design information.
  • the design information is information indicating the coordinates of each position of the structure.
  • the design information is output to the molding apparatus 420 and a control system 430 described later.
  • the molding apparatus 420 performs a molding process for creating and molding a structure using the design information created by the design apparatus 410.
  • the molding apparatus 420 includes an apparatus that performs at least one of laminating, casting, forging, and cutting represented by 3D printer technology.
  • the X-ray apparatus 100 performs a measurement process for measuring the shape of the structure molded by the molding apparatus 420.
  • the X-ray apparatus 100 outputs information (hereinafter referred to as shape information) indicating the coordinates of the structure, which is a measurement result of the structure, to the control system 430.
  • the control system 430 includes a coordinate storage unit 431 and an inspection unit 432.
  • the coordinate storage unit 431 stores design information created by the design apparatus 410 described above.
  • the inspection unit 432 determines whether the structure molded by the molding device 420 is molded according to the design information created by the design device 410. In other words, the inspection unit 432 determines whether or not the molded structure is a good product. In this case, the inspection unit 432 reads the design information stored in the coordinate storage unit 431 and performs an inspection process for comparing the design information with the shape information input from the X-ray apparatus 100. The inspection unit 432 compares, for example, the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information as the inspection processing, and if the coordinates of the design information and the coordinates of the shape information match as a result of the inspection processing. It is determined that the product is a non-defective product molded according to the design information.
  • the inspection unit 432 determines whether or not the coordinate difference is within a predetermined range, and if it is within the predetermined range, it can be restored. Judged as a defective product.
  • the inspection unit 432 outputs repair information indicating the defective portion and the repair amount to the repair device 440.
  • the defective part is the coordinate of the shape information that does not match the coordinate of the design information
  • the repair amount is the difference between the coordinate of the design information and the coordinate of the shape information in the defective part.
  • the repair device 440 performs a repair process for reworking a defective portion of the structure based on the input repair information. The repair device 440 performs again the same process as the molding process performed by the molding apparatus 420 in the repair process.
  • step S11 the design device 410 is used when the structure is designed by the user.
  • the design apparatus 410 creates and stores design information related to the shape of the structure by the design process, and the process proceeds to step S12.
  • the present invention is not limited to only the design information created by the design apparatus 410, and when design information already exists, the design information is acquired by inputting the design information and is included in one aspect of the present invention. It is.
  • step S12 the forming apparatus 420 creates and forms a structure based on the design information by the forming process, and proceeds to step S13.
  • step S13 the X-ray apparatus 100 performs a measurement process, measures the shape of the structure, outputs shape information, and proceeds to step S14.
  • step S14 the inspection unit 432 performs an inspection process for comparing the design information created by the design apparatus 410 with the shape information measured and output by the X-ray apparatus 100, and the process proceeds to step S15.
  • step S15 based on the result of the inspection process, the inspection unit 432 determines whether the structure formed by the forming apparatus 420 is a non-defective product. If the structure is a non-defective product, that is, if the coordinates of the design information coincide with the coordinates of the shape information, an affirmative determination is made in step S15 and the process ends.
  • step S15 If the structure is not a non-defective product, that is, if the coordinates of the design information do not match the coordinates of the shape information, or if coordinates that are not in the design information are detected, a negative determination is made in step S15 and the process proceeds to step S16.
  • step S16 the inspection unit 432 determines whether or not the defective portion of the structure can be repaired. If the defective part is not repairable, that is, if the difference between the coordinates of the design information and the coordinates of the shape information in the defective part exceeds the predetermined range, a negative determination is made in step S16 and the process ends. If the defective part can be repaired, that is, if the difference between the coordinates of the design information and the shape information in the defective part is within a predetermined range, an affirmative determination is made in step S16 and the process proceeds to step S17. In this case, the inspection unit 432 outputs repair information to the repair device 440.
  • step S17 the repair device 440 performs a repair process on the structure based on the input repair information, and returns to step S13. As described above, the repair device 440 performs again the same processing as the molding processing performed by the molding device 420 in the repair processing.
  • the X-ray apparatus 100 of the structure manufacturing system 400 performs a measurement process for acquiring shape information of the structure created by the molding apparatus 420 based on the design process of the design apparatus 410, and performs an inspection unit of the control system 430.
  • Reference numeral 432 performs an inspection process for comparing the shape information acquired in the measurement process with the design information created in the design process. Therefore, it is possible to determine whether or not a structure is a non-defective product created according to design information by inspecting the defect of the structure and information inside the structure by nondestructive inspection. Contribute to.
  • the repair device 440 performs the repair process for performing the molding process again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same processing as the molding process can be performed again on the structure, which contributes to the manufacture of a high-quality structure close to design information.
  • the placement unit 6 is disposed on the Z axis ⁇ side with respect to the X-ray source 5, and the X-ray detector 7 is disposed on the Z axis ⁇ side with respect to the placement unit 6, and is loaded from the Z axis + side. What has the structure which irradiates X-ray to the to-be-measured object S mounted in the mounting part 6 is also contained in 1 aspect of this invention.
  • the mounting unit 6 is not limited to the one that moves in the Z-axis direction, and the X-ray source 5 and the X-ray detector 7 that are configured to move in the Z-axis direction are also included in one aspect of the present invention. It is.
  • the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .

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Abstract

An X-ray apparatus according to the present invention is provided with: a mounting plate for mounting an object to be measured; an X-ray irradiation unit for irradiating X-rays from above or below the mounting plate onto the object to be measured mounted on the mounting plate; an X-ray detection unit for acquiring a transmission image of the object to be measured irradiated by X-rays; and a bending control unit for controlling bending of the mounting plate.

Description

Ｘ線装置および構造物の製造方法X-ray apparatus and structure manufacturing method
　本発明は、Ｘ線装置および構造物の製造方法に関する。 The present invention relates to an X-ray apparatus and a method for manufacturing a structure.
　従来、Ｘ線の光軸が鉛直方向となるようにＸ線源が配置され、被測定物を載置する載置板が水平に設けられたＸ線装置が知られている（特許文献１参照）。特許文献１に記載のＸ線装置では、被測定物の重さにより載置板に発生する撓みを防止するために、載置板を下から支えるボール機構が設けられている。 2. Description of the Related Art Conventionally, an X-ray apparatus is known in which an X-ray source is arranged so that the optical axis of X-rays is in the vertical direction, and a mounting plate on which an object to be measured is placed is provided horizontally (see Patent Document 1). ). In the X-ray apparatus described in Patent Document 1, a ball mechanism that supports the mounting plate from below is provided in order to prevent the bending of the mounting plate due to the weight of the object to be measured.
日本国特開２００４－４５３３１号公報Japanese Unexamined Patent Publication No. 2004-45331
　しかしながら、特許文献１に記載のＸ線装置では、被測定物を載置板に載置したときの載置板の撓みを任意に制御することはできなかった。 However, the X-ray apparatus described in Patent Document 1 cannot arbitrarily control the bending of the mounting plate when the object to be measured is mounted on the mounting plate.
　本発明の第１の態様によると、Ｘ線装置は、被測定物を載置する載置板と、載置板に載置された被測定物に対して、載置板の上方または下方からＸ線を照射するＸ線照射部と、Ｘ線によって照射された被測定物の透過像を取得するＸ線検出部と、載置板の撓みを制御するための撓み制御部と、を備える。
　本発明の第２の態様によると、第１の態様のＸ線装置において、撓み制御部は、載置板に被測定物が載置されたときに、載置板の撓みを制御することが好ましい。
　本発明の第３の態様によると、第１または２の態様のＸ線装置において、載置板をＸ線照射部またはＸ線検出部に対して相対的に移動する載置板移動機構を更に備えることが好ましい。
　本発明の第４の態様によると、第１乃至３の何れか一態様のＸ線装置において、撓み制御部は、載置板の被測定物を載置する面とは反対側の面で、載置板を支持する支持部を有することが好ましい。
　本発明の第５の態様によると、第４の態様のＸ線装置において、撓み制御部は、上下方向に支持部を移動させる支持部移動機構と、支持部移動機構を制御する支持部制御部と、を有することが好ましい。
　本発明の第６の態様によると、第５の態様のＸ線装置において、支持部制御部は、載置板の撓みの状態を載置板に被測定物が無い状態と同様な状態にするかまたは載置板の被測定物が載置されている面が凸となる状態にするように、支持部の位置を設定することが好ましい。
　本発明の第７の態様によると、第５または６の態様のＸ線装置において、支持部制御部は、載置板の上下方向の移動に同期して、支持部を上下方向に移動させるように支持部移動機構を制御することが好ましい。
　本発明の第８の態様によると、第６の態様のＸ線装置において、載置板の撓みの状態を載置板に被測定物が無い状態と同様な状態にするように支持部の位置が設定される場合は、Ｘ線検出部によって取得される被測定物の透過像の倍率を載置板の上下方向の位置に基づいて取得し、載置板の撓みの状態を載置板の被測定物が載置されている面が凸となる状態にするように支持部の位置が設定される場合は、倍率を載置板の上下方向の位置と支持部の上下方向の位置とに基づいて取得する倍率取得部を更に備えることが好ましい。
　本発明の第９の態様によると、第５～８のいずれか一態様のＸ線装置において、Ｘ線照射部は、載置板に載置された被測定物に対して、載置板の下方からＸ線を照射するＸ線照射部であって、支持部制御部は、載置板が移動可能な範囲であって且つＸ線照射部から上下方向において最も遠い位置に移動された状態で、載置板の撓みの状態を載置板の被測定物が載置されている面が凸となる状態にするように支持部の位置を設定することが好ましい。
　本発明の第１０の態様によると、第６の態様のＸ線装置において、支持部制御部は、Ｘ線検出部によって取得される被測定物の透過像の倍率が所定値よりも大きい場合にのみ、載置板の撓みの状態を載置板に被測定物が無い状態と同様な状態にするように支持部の位置を設定することが好ましい。
　本発明の第１１の態様によると、第４乃至１０の何れか一態様のＸ線装置において、支持部は、載置板に対して転がり接触する接触部を複数有することが好ましい。
　本発明の第１２の態様によると、第１乃至１１の何れか一態様のＸ線装置において、被測定物に対するＸ線の照射方向が異なる状態で、Ｘ線検出部より検出された複数の投影データに基づいて、被測定物の内部構造情報を生成する再構成部を備えることが好ましい。
　本発明の第１３の態様によると、構造物の製造方法は、構造物の形状に関する設計情報を作成し、設計情報に基づいて構造物を作成し、作成された構造物の形状を、第１乃至１２の何れか一態様のＸ線装置を用いて計測して形状情報を取得し、取得された形状情報と設計情報とを比較する。
　本発明の第１４の態様によると、第１３の態様の構造物の製造方法において、形状情報と設計情報との比較結果に基づいて実行され、構造物の再加工を行うことが好ましい。
　本発明の第１５の態様によると、第１４の態様の構造物の製造方法において、構造物の再加工は、設計情報に基づいて構造物の作成を再度行うことが好ましい。 According to the first aspect of the present invention, the X-ray apparatus is configured to place the measurement object on the placement plate and the measurement object placed on the placement plate from above or below the placement plate. An X-ray irradiation unit that irradiates X-rays, an X-ray detection unit that acquires a transmission image of a measurement object irradiated by X-rays, and a deflection control unit for controlling the deflection of the mounting plate.
According to the second aspect of the present invention, in the X-ray apparatus of the first aspect, the bending control unit can control the bending of the mounting plate when the object to be measured is mounted on the mounting plate. preferable.
According to the third aspect of the present invention, in the X-ray apparatus according to the first or second aspect, the placement plate moving mechanism that moves the placement plate relative to the X-ray irradiation unit or the X-ray detection unit is further provided. It is preferable to provide.
According to the fourth aspect of the present invention, in the X-ray apparatus according to any one of the first to third aspects, the deflection control unit is a surface on the opposite side of the surface on which the object to be measured of the mounting plate is placed, It is preferable to have a support part for supporting the mounting plate.
According to the fifth aspect of the present invention, in the X-ray apparatus according to the fourth aspect, the bending control unit includes a support unit moving mechanism that moves the support unit in the vertical direction, and a support unit control unit that controls the support unit moving mechanism. It is preferable to have.
According to the sixth aspect of the present invention, in the X-ray apparatus according to the fifth aspect, the support controller controls the bending state of the mounting plate to be in the same state as when there is no object to be measured on the mounting plate. Alternatively, it is preferable to set the position of the support portion so that the surface of the mounting plate on which the object to be measured is placed is convex.
According to the seventh aspect of the present invention, in the X-ray apparatus according to the fifth or sixth aspect, the support control unit moves the support in the vertical direction in synchronization with the vertical movement of the mounting plate. It is preferable to control the support part moving mechanism.
According to the eighth aspect of the present invention, in the X-ray apparatus according to the sixth aspect, the position of the support portion is set so that the bending state of the mounting plate is the same as the state where there is no object to be measured on the mounting plate. Is set, the magnification of the transmission image of the object to be measured acquired by the X-ray detection unit is acquired based on the vertical position of the mounting plate, and the bending state of the mounting plate is determined. When the position of the support portion is set so that the surface on which the object to be measured is placed is convex, the magnification is set to the vertical position of the placement plate and the vertical position of the support portion. It is preferable to further include a magnification acquisition unit that acquires based on the above.
According to the ninth aspect of the present invention, in the X-ray apparatus according to any one of the fifth to eighth aspects, the X-ray irradiation unit is configured so that the object to be measured placed on the placement board An X-ray irradiation unit that irradiates X-rays from below, and the support unit control unit is in a range in which the mounting plate is movable and is moved to the farthest position in the vertical direction from the X-ray irradiation unit. It is preferable to set the position of the support portion so that the surface of the mounting plate on which the object to be measured is mounted is convex.
According to the tenth aspect of the present invention, in the X-ray apparatus according to the sixth aspect, the support controller controls the magnification of the transmission image of the measurement object acquired by the X-ray detector when the magnification is larger than a predetermined value. However, it is preferable to set the position of the support portion so that the state of bending of the mounting plate is the same as the state where there is no object to be measured on the mounting plate.
According to the eleventh aspect of the present invention, in the X-ray apparatus according to any one of the fourth to tenth aspects, the support portion preferably has a plurality of contact portions that are in rolling contact with the mounting plate.
According to the twelfth aspect of the present invention, in the X-ray apparatus according to any one of the first to eleventh aspects, the plurality of projections detected by the X-ray detection unit in a state where the X-ray irradiation directions to the object to be measured are different. It is preferable to provide a reconstruction unit that generates internal structure information of the object to be measured based on the data.
According to the thirteenth aspect of the present invention, the structure manufacturing method creates design information related to the shape of the structure, creates the structure based on the design information, and sets the shape of the created structure to the first. The shape information is acquired by measurement using the X-ray apparatus according to any one of aspects 1 to 12, and the acquired shape information is compared with the design information.
According to the fourteenth aspect of the present invention, in the structure manufacturing method according to the thirteenth aspect, the structure is preferably reprocessed based on a comparison result between the shape information and the design information.
According to the fifteenth aspect of the present invention, in the structure manufacturing method according to the fourteenth aspect, it is preferable that the reworking of the structure is performed again based on the design information.
　本発明によれば、被測定物を載置板に載置したときの載置板の撓みを任意に制御することができる。 According to the present invention, it is possible to arbitrarily control the bending of the mounting plate when the object to be measured is mounted on the mounting plate.
第１の実施の形態によるＸ線装置の内部正面図Internal front view of the X-ray apparatus according to the first embodiment 測定物載置板の撓みについて説明する図The figure explaining the bending of a measurement object mounting board 倍率取得部が取得する倍率と相対位置との関係、および撓みが発生している場合における実際の倍率と相対位置との関係を示す図The figure which shows the relationship between the magnification which a magnification acquisition part acquires, and a relative position, and the relationship between the actual magnification and relative position when the bending has generate | occur | produced Ｘ線源と載置台と撓み制御部の機械構成ユニットとＸ線検出器との位置関係を示す側面図Side view showing the positional relationship among an X-ray source, a mounting table, a mechanical configuration unit of a deflection control unit, and an X-ray detector 撓み制御部の機械構成ユニットの構成を示す斜視図The perspective view which shows the structure of the machine structure unit of a bending control part. 撓み制御部による撓みの制御を説明する図The figure explaining control of the bending by the bending control part 第２の実施の形態による構造物製造システムの構成を示すブロック図The block diagram which shows the structure of the structure manufacturing system by 2nd Embodiment. 第２の実施の形態による構造物製造システムの動作を説明するフローチャートThe flowchart explaining operation | movement of the structure manufacturing system by 2nd Embodiment.
－第１の実施の形態－
　図面を参照しながら、本発明の一実施の形態によるＸ線装置について説明する。Ｘ線装置は、被測定物にＸ線を照射して、被測定物を透過した透過Ｘ線を検出することにより、被測定物の内部情報（たとえば内部構造）等を非破壊で取得するＸ線ＣＴ（Ｃｏｍｐｕｔｅｄ　Ｔｏｍｏｇｒａｐｈｙ）検査装置である。被測定物が、たとえば機械部品や電子部品等の産業用部品が対象である場合には、Ｘ線装置は産業用部品を検査する産業用Ｘ線ＣＴ検査装置と呼ばれる。
　本実施の形態は、発明の趣旨の理解のために具体的に説明するためのものであり、特に指定の無い限り、本発明を限定するものではない。 -First embodiment-
An X-ray apparatus according to an embodiment of the present invention will be described with reference to the drawings. The X-ray apparatus irradiates the object to be measured with X-rays and detects transmitted X-rays that have passed through the object to be measured, thereby obtaining non-destructive X information (for example, internal structure) of the object to be measured. This is a line CT (Computed Tomography) inspection apparatus. When an object to be measured is an industrial part such as a mechanical part or an electronic part, the X-ray apparatus is called an industrial X-ray CT inspection apparatus for inspecting an industrial part.
The embodiments are specifically described for understanding the gist of the invention, and do not limit the invention unless otherwise specified.
　図１は本実施の形態によるＸ線装置１００の内部構造の一例を示す内部正面図である。なお、説明の都合上、Ｘ軸、Ｙ軸および鉛直方向に沿ったＺ軸からなる座標系を図示の通りに設定する。
　Ｘ線装置１００は、筐体１と、架台２と、制御装置３とを備えている。筐体１は工場等の床面上にＸＹ平面が実質的に水平となるように配置され、内部に架台２と、制御装置３とが収容される。筐体１はＸ線が外部に漏洩しないようにするために、材料として鉛を含む。 FIG. 1 is an internal front view showing an example of the internal structure of the X-ray apparatus 100 according to the present embodiment. For convenience of explanation, a coordinate system including the X axis, the Y axis, and the Z axis along the vertical direction is set as illustrated.
The X-ray apparatus 100 includes a housing 1, a gantry 2, and a control device 3. The housing 1 is disposed on the floor surface of a factory or the like so that the XY plane is substantially horizontal, and the gantry 2 and the control device 3 are accommodated therein. The housing 1 contains lead as a material in order to prevent X-rays from leaking to the outside.
　架台２には、Ｘ線源５と、載置部６と、Ｘ線検出器７と、Ｘ線検出器駆動ユニット８と、撓み制御部９の機械構成ユニットとが搭載されている。架台２は、矩形形状の基礎底盤２２と、基礎底盤２２上の四隅にそれぞれに設けられ、Ｚ軸方向に沿って延伸する４つの支柱２３と、支柱２３の上部に設けられ、Ｘ線検出器駆動ユニット８を取り付けるための取付部材２４とによって構成される。基礎底盤２２の下部（Ｚ軸－側）には、筐体１の外部から架台２に加わる振動を減衰させるため除振マウント２５が取り付けられている。除振マウント２５は、たとえば公知の空気ばねやコイルスプリング等が単独または組み合わせて構成される。なお、架台２は、Ｘ線検出器駆動ユニット８を４つの支柱２３の上部にて支持するものに限定されず、Ｘ線検出器駆動ユニット８が安定して支持可能となるために必要な構造、形状を有することができる。 The gantry 2 is equipped with an X-ray source 5, a placement unit 6, an X-ray detector 7, an X-ray detector drive unit 8, and a mechanical component unit of a deflection control unit 9. The gantry 2 is provided at each of the rectangular base bottom 22, four corners on the base bottom 22, four struts 23 extending along the Z-axis direction, and the top of the struts 23, and an X-ray detector And an attachment member 24 for attaching the drive unit 8. A vibration isolation mount 25 is attached to the lower part (Z-axis-side) of the base bottom panel 22 in order to attenuate vibration applied to the gantry 2 from the outside of the housing 1. The anti-vibration mount 25 is configured by, for example, a known air spring or coil spring alone or in combination. The gantry 2 is not limited to the one that supports the X-ray detector drive unit 8 on the upper part of the four support columns 23, and a structure necessary for the X-ray detector drive unit 8 to be stably supported. Can have a shape.
　Ｘ線源５は、架台２の基礎底盤２２の中央部近傍に取り付けられる。Ｘ線源５は制御装置３により制御されて、図１に示す点Ｐを出射点として視野Ｖ－Ｖの範囲の円錐状に拡がる広角のＸ線（いわゆるコーンビーム）を出射する。この出射点はＸ線源５のフォーカルスポットと一致する。なお、以後の説明では、点Ｐを通るＺ軸に平行な軸を基準軸Ｌと呼ぶ。本実施の形態においては、基準軸Ｌが架台２の中心を通るようにＸ線源５が設けられている。なお、Ｘ線源５は、透過型Ｘ線源により構成されてもよいし、反射型Ｘ線源により構成されてもよい。 The X-ray source 5 is attached in the vicinity of the center of the foundation bottom plate 22 of the gantry 2. The X-ray source 5 is controlled by the control device 3 and emits wide-angle X-rays (so-called cone beams) that expand in a conical shape in the range of the visual field VV with the point P shown in FIG. This emission point coincides with the focal spot of the X-ray source 5. In the following description, an axis parallel to the Z axis passing through the point P is referred to as a reference axis L. In the present embodiment, the X-ray source 5 is provided so that the reference axis L passes through the center of the gantry 2. The X-ray source 5 may be constituted by a transmission type X-ray source or a reflection type X-ray source.
　Ｘ線源５のＺ軸＋側端面は導電性を有する金属（たとえば、真鍮、タングステン合金、銅など）を材料として構成される。Ｘ線源５が透過型Ｘ線源により構成される場合には、Ｚ軸＋側端面はフィラメントからの電子が到達することによってＸ線を発生するための、たとえばタングステンを含む材料からなるターゲットである。また、Ｘ線源５がターゲットを外部から保護するためにベリリウム等の導電体の保護部材を有する場合には、この保護部材がＸ線源５のＺ軸＋側端面となる。Ｘ線源５は、たとえば約５０ｅＶの超軟Ｘ線、約０．１～２ｋｅＶの軟Ｘ線、約２～２０ｋｅＶのＸ線および約２０～１００ｋｅＶの硬Ｘ線の少なくとも１種のＸ線を出射する。 The Z-axis + side end face of the X-ray source 5 is made of a conductive metal (for example, brass, tungsten alloy, copper, etc.). When the X-ray source 5 is composed of a transmission X-ray source, the Z-axis + side end surface is a target made of a material containing tungsten, for example, for generating X-rays when electrons from the filament arrive. is there. When the X-ray source 5 has a protective member made of a conductor such as beryllium in order to protect the target from the outside, this protective member becomes the Z-axis + side end surface of the X-ray source 5. The X-ray source 5 generates at least one kind of X-ray, for example, an ultra-soft X-ray of about 50 eV, a soft X-ray of about 0.1 to 2 keV, an X-ray of about 2 to 20 keV, and a hard X-ray of about 20 to 100 keV. Exit.
　載置部６は、被測定物Ｓを載置するための載置台６１と、載置台６１をＸ軸、Ｙ軸およびＺ軸方向にそれぞれ移動させるためのＸ軸移動機構６２、Ｙ軸移動機構６３およびＺ軸移動機構６４とを備えている。Ｘ軸移動機構６２、Ｙ軸移動機構６３およびＺ軸移動機構６４は、それぞれモータ、レール、スライダー等によって構成され、制御装置３による制御に従って、載置台６１をＸ軸方向、Ｙ軸方向およびＺ軸方向に沿って移動させる。Ｚ位置検出部６４１は、Ｚ軸移動機構６４によってＺ軸方向に移動した載置台６１の位置を検出して、検出した位置を示す信号（以下、Ｚ位置信号と呼ぶ）を制御装置３に出力するエンコーダである。載置台６１については詳細を後述する。 The mounting unit 6 includes a mounting table 61 for mounting the object to be measured S, an X-axis moving mechanism 62 for moving the mounting table 61 in the X-axis, Y-axis, and Z-axis directions, and a Y-axis moving mechanism, respectively. 63 and a Z-axis moving mechanism 64. The X-axis moving mechanism 62, the Y-axis moving mechanism 63, and the Z-axis moving mechanism 64 are each configured by a motor, a rail, a slider, and the like, and the mounting table 61 is moved in the X-axis direction, the Y-axis direction, and the Z-axis according to control by the control device 3 Move along the axial direction. The Z position detector 641 detects the position of the mounting table 61 moved in the Z axis direction by the Z axis moving mechanism 64 and outputs a signal indicating the detected position (hereinafter referred to as a Z position signal) to the control device 3. Encoder. Details of the mounting table 61 will be described later.
　撓み制御部９は、載置台６１を構成する測定物載置板６１１（図２参照）の撓みを制御するためのものであり、撓み制御部９の機械構成ユニットである撓み制御用支持部材９１および支持部材移動機構９２（図４参照）と撓み制御用支持部材制御部３７とからなる。この撓み制御部９については詳細を後述する。 The bending control unit 9 is for controlling the bending of the measurement object mounting plate 611 (see FIG. 2) that constitutes the mounting table 61, and the bending control support member 91 that is a mechanical component unit of the bending control unit 9. And a support member moving mechanism 92 (see FIG. 4) and a support member control unit 37 for controlling deflection. Details of the deflection control unit 9 will be described later.
　Ｘ線検出器７は、公知のシンチレーション物質を含むシンチレータ部、光電子増倍管、受光部等によって構成され、Ｘ線源５から出射され、載置台６１上に載置された被測定物Ｓを透過した透過Ｘ線を含むＸ線を受光する。Ｘ線検出器７は、受光したＸ線のエネルギーをシンチレータ部により光エネルギーに変換した後、当該光エネルギーを電気エネルギーに変換し、電気信号として出力する。なお、Ｘ線検出器７は、入射するＸ線のエネルギーを光エネルギーに変換することなく電気信号に変換して出力してもよい。また、Ｘ線検出器７は、複数の画素を有しており、それらの画素は２次元的に配列されている。これにより、Ｘ線源５から放射され、被測定物Ｓを通過したＸ線の強度分布を一括して取得できる。したがって、１回の撮影で被測定物Ｓの全体の投影像を取得することができる。 The X-ray detector 7 includes a scintillator unit including a known scintillation substance, a photomultiplier tube, a light receiving unit, and the like. The X-ray detector 7 emits an object to be measured S emitted from the X-ray source 5 and mounted on the mounting table 61. X-rays including the transmitted X-rays are received. The X-ray detector 7 converts the received X-ray energy into light energy by the scintillator unit, converts the light energy into electric energy, and outputs it as an electric signal. Note that the X-ray detector 7 may convert the incident X-ray energy into an electrical signal without converting it into light energy, and output it. The X-ray detector 7 has a plurality of pixels, and these pixels are two-dimensionally arranged. Thereby, the intensity distribution of the X-rays radiated from the X-ray source 5 and passed through the object to be measured S can be acquired collectively. Therefore, it is possible to acquire the entire projected image of the object S to be measured with one shooting.
　Ｘ線検出器駆動ユニット８は、Ｘ線検出器７を基準軸Ｌを中心とする回転軌道上を移動させる。Ｘ線検出器駆動ユニット８は、架台２の取付部材２４に取り付けられた回転機構８１と、回転機構８１により回転する円弧状ステージ８２とを備える。回転機構８１は、取付プレート８１１と、取付プレート８１１に取り付けられたモータ８１２と、モータ８１２により回転する第１ギア８１３と、第１ギア８１３と噛み合う第２ギア８１４と、中空の回転軸８１５とを有している。回転軸８１５が第２ギア８１４によって基準軸Ｌを中心として回転することにより、回転軸８１５の下部に固定された円弧状ステージ８２は回転し、円弧状ステージ８２上に移動可能に設けられたＸ線検出器７は基準軸Ｌを中心とした回転軌道ＭＭに沿って回転する。 The X-ray detector drive unit 8 moves the X-ray detector 7 on a rotation path centered on the reference axis L. The X-ray detector drive unit 8 includes a rotation mechanism 81 attached to the attachment member 24 of the gantry 2 and an arcuate stage 82 rotated by the rotation mechanism 81. The rotation mechanism 81 includes an attachment plate 811, a motor 812 attached to the attachment plate 811, a first gear 813 that is rotated by the motor 812, a second gear 814 that meshes with the first gear 813, and a hollow rotation shaft 815. have. When the rotation shaft 815 rotates around the reference axis L by the second gear 814, the arc-shaped stage 82 fixed to the lower portion of the rotation shaft 815 rotates, and the X is provided so as to be movable on the arc-shaped stage 82. The line detector 7 rotates along the rotation trajectory MM around the reference axis L.
　円弧状ステージ８２は、Ｘ線の出射点である点Ｐを中心とする円弧状に所定の長さを有して形成されたプレートである。円弧状ステージ８２には、ガイドレールやスライダー等が設けられ、上述したＸ線検出器７が円弧状ステージ８２の円弧状軌道Ｍに沿ってモータ等によって移動可能に取り付けられる。これにより、円弧状ステージ８２を回転機構８１により回転させることで、Ｘ線検出器７の軌道が点Ｐを頂点とする円錐の側面に沿うように、所望の同一高度（Ｚ軸＋側の同一面上）を円運動するように調整可能となる。上述した構成を備えることにより、ユーザは所望する撮影位置、撮影角度にて被測定物Ｓを撮影することができる。また、載置台６１をＺ軸方向に移動させることにより、所望の拡大率にて被測定物Ｓを撮影することができる。 The arc-shaped stage 82 is a plate formed in a circular arc shape having a predetermined length around a point P that is an X-ray emission point. The arcuate stage 82 is provided with a guide rail, a slider, and the like, and the X-ray detector 7 described above is attached to the arcuate stage 82 so as to be movable along the arcuate track M of the arcuate stage 82. Thus, by rotating the arcuate stage 82 by the rotation mechanism 81, the desired height (Z axis + side same) is set so that the trajectory of the X-ray detector 7 is along the side surface of the cone having the point P as the apex. It can be adjusted to make a circular motion on the surface. By providing the above-described configuration, the user can photograph the measurement object S at a desired photographing position and photographing angle. In addition, by moving the mounting table 61 in the Z-axis direction, the measurement object S can be photographed at a desired magnification.
　制御装置３は、マイクロプロセッサやその周辺回路等を有しており、不図示の記憶媒体（たとえばフラッシュメモリ等）に予め記憶されている制御プログラムを読み込んで実行することにより、Ｘ線装置１００の各部を制御する。制御装置３は、Ｘ線制御部３１と、移動制御部３２と、画像生成部３３と、画像再構成部３４と、倍率取得部３６と、撓み制御用支持部材制御部３７と、を備える。Ｘ線制御部３１は、Ｘ線源５の出力を制御する。移動制御部３２は、載置部６の移動動作を制御する。また、移動制御部３２は、Ｘ線検出器駆動ユニット８によるＸ線検出器７の移動動作を制御する。画像生成部３３は、Ｘ線検出器７から出力された電気信号に基づいて被測定物ＳのＸ線投影画像データを生成する。画像再構成部３４は、投影方向の異なる被測定物Ｓの投影画像データに基づいて、公知の画像再構成処理を施して再構成画像を生成する。再構成画像により、被測定物Ｓの内部構造（断面構造）である３次元データが生成される。この場合、再構成画像の生成方法としては、逆投影法、フィルタ補正逆投影法、逐次近似法等がある。撓み制御用支持部材制御部３７は、移動制御部３２からのＺ軸移動機構６４の制御信号を取得できるように接続されており、かつＺ位置検出部６４１から制御装置３に入力されるＺ位置検出信号も取得可能となるように接続されている。撓み制御用支持部材制御部３７は、これらの信号を基に、後述する撓み制御用支持部材９１（図４参照）の位置を制御している。 The control device 3 has a microprocessor, peripheral circuits, and the like, and reads and executes a control program stored in advance in a storage medium (not shown) (for example, a flash memory), thereby Control each part. The control device 3 includes an X-ray control unit 31, a movement control unit 32, an image generation unit 33, an image reconstruction unit 34, a magnification acquisition unit 36, and a deflection control support member control unit 37. The X-ray control unit 31 controls the output of the X-ray source 5. The movement control unit 32 controls the movement operation of the placement unit 6. The movement control unit 32 controls the movement operation of the X-ray detector 7 by the X-ray detector driving unit 8. The image generation unit 33 generates X-ray projection image data of the object S to be measured based on the electrical signal output from the X-ray detector 7. The image reconstruction unit 34 generates a reconstructed image by performing a known image reconstruction process based on the projection image data of the measurement object S having different projection directions. Three-dimensional data that is the internal structure (cross-sectional structure) of the measurement object S is generated from the reconstructed image. In this case, a method for generating a reconstructed image includes a back projection method, a filtered back projection method, a successive approximation method, and the like. The deflection control support member control unit 37 is connected so as to acquire a control signal of the Z-axis moving mechanism 64 from the movement control unit 32, and is input to the control device 3 from the Z position detection unit 641. It is connected so that a detection signal can also be acquired. Based on these signals, the deflection control support member controller 37 controls the position of a deflection control support member 91 (see FIG. 4), which will be described later.
　倍率取得部３６は、Ｚ位置検出部６４１から出力されたＺ位置信号、すなわち載置台６１のＺ軸方向の位置に基づいて、載置台６１に載置した被測定物Ｓの投影画像データや再構成画像の倍率を取得する。また、更に、倍率取得部３６は、撓み制御用支持部材制御部３７からの制御信号をも取得できるように撓み制御用支持部材制御部３７と接続されており、この制御信号も取得して、投影画像データの倍率を算出する。また、倍率取得部３６は、ユーザから指示を入力するインターフェースを有している。倍率取得部３６は、このインターフェースを通じて取得された要求倍率情報を基に、移動制御部３２と撓み制御用支持部材制御部３７に制御信号を出力する。なお、倍率取得部３６による処理の詳細については説明を後述する。 Based on the Z position signal output from the Z position detector 641, that is, the position of the mounting table 61 in the Z-axis direction, the magnification acquisition unit 36 receives the projection image data of the measurement object S placed on the mounting table 61 and Get the magnification of the component image. Furthermore, the magnification acquisition unit 36 is connected to the deflection control support member control unit 37 so as to acquire the control signal from the deflection control support member control unit 37, and also acquires this control signal, The magnification of the projection image data is calculated. The magnification acquisition unit 36 has an interface for inputting an instruction from the user. The magnification acquisition unit 36 outputs a control signal to the movement control unit 32 and the deflection control support member control unit 37 based on the requested magnification information acquired through this interface. Details of the processing by the magnification acquisition unit 36 will be described later.
　図２を参照しながら、載置部６について詳細に説明する。図２は、Ｘ線源５と載置部６とＸ線検出器７とのＺ軸方向の位置関係を示す側面図である。なお、図２においては、撓み制御用支持部材９１が設けられていない場合の問題点について説明するため、撓み制御用支持部材９１は図示されていない。また、図２においては、載置部６を構成する部材のうち載置台６１に関連する部材を代表して図示し、説明を簡単にするため、Ｘ線検出器７が基準軸Ｌ上に位置する場合を示す。図２においても、図１と同様にＸ軸、Ｙ軸およびＺ軸からなる座標系を図示の通りに設定する。 The placement unit 6 will be described in detail with reference to FIG. FIG. 2 is a side view showing the positional relationship in the Z-axis direction among the X-ray source 5, the placement unit 6, and the X-ray detector 7. In FIG. 2, the deflection control support member 91 is not illustrated in order to explain a problem when the deflection control support member 91 is not provided. Further, in FIG. 2, the members related to the mounting table 61 among the members constituting the mounting unit 6 are shown as representatives, and the X-ray detector 7 is positioned on the reference axis L in order to simplify the description. Indicates when to do. Also in FIG. 2, a coordinate system composed of the X axis, the Y axis, and the Z axis is set as shown in FIG.
　図２に示すように、載置台６１は、測定物載置板６１１と、載置板保持部６１２とを備える。測定物載置板６１１はたとえばＣＦＲＰ（炭素繊維強化プラスチック）等によって製造され、この測定物載置板６１１の上部（Ｚ軸＋側）に被測定物Ｓが載置される。Ｘ線源５は、測定物載置板６１１に載置される被測定物Ｓに対して、測定物載置板６１１の下方（Ｚ軸－側）からＸ線を照射する。測定物載置板６１１は、Ｘ線検出器７に投影される投影画像の最大倍率をできるだけ大きくするため、およびＸ線源５から放射されたＸ線の吸収をできるだけ小さくするため、Ｚ軸方向に沿った厚みが薄く形成される。 As shown in FIG. 2, the mounting table 61 includes a measurement object mounting plate 611 and a mounting plate holding unit 612. The measurement object placing plate 611 is manufactured by, for example, CFRP (carbon fiber reinforced plastic) or the like, and the measurement object S is placed on the measurement object placing plate 611 (on the Z axis + side). The X-ray source 5 irradiates the measurement object S placed on the measurement object placing plate 611 with X-rays from below the measurement object placing plate 611 (Z-axis side). The measurement object placing plate 611 is designed to increase the maximum magnification of the projection image projected onto the X-ray detector 7 as much as possible and to reduce the absorption of X-rays emitted from the X-ray source 5 as much as possible. Is formed with a small thickness.
　載置板保持部６１２は、測定物載置板６１１を外周部に沿って保持する枠状となっている。載置板保持部６１２は、Ｘ軸移動機構６２、Ｙ軸移動機構６３およびＺ軸移動機構６４によってＸ軸、Ｙ軸およびＺ軸方向に移動することにより、載置板保持部６１２に支持された測定物載置板６１１と、測定物載置板６１１上に載置された被測定物Ｓとが、Ｘ軸、Ｙ軸およびＺ軸方向に共に移動する。なお、図２においては、載置板保持部６１２は、Ｚ軸＋側から測定物載置板６１１を保持する例を示しているが、載置板保持部６１２による保持の方法は図２に示す例に限定されない。たとえば、載置板保持部６１２が測定物載置板６１１にＺ軸－側から取り付けられるものや、測定物載置板６１１をＺ軸＋側と－側とから挟み込むことによって保持するものについても本発明の一態様に含まれる。 The mounting plate holding unit 612 has a frame shape that holds the measurement object mounting plate 611 along the outer periphery. The mounting plate holding unit 612 is supported by the mounting plate holding unit 612 by moving in the X-axis, Y-axis, and Z-axis directions by the X-axis moving mechanism 62, the Y-axis moving mechanism 63, and the Z-axis moving mechanism 64. The measured object placing plate 611 and the measured object S placed on the measured object placing plate 611 move together in the X-axis, Y-axis, and Z-axis directions. 2 shows an example in which the mounting plate holding unit 612 holds the workpiece mounting plate 611 from the Z axis + side, but the holding method by the mounting plate holding unit 612 is shown in FIG. It is not limited to the example shown. For example, the mounting plate holding unit 612 is attached to the measured object mounting plate 611 from the Z axis − side, or the holding object holding plate 611 is held by being sandwiched from the Z axis + side and the − side. It is included in one embodiment of the present invention.
　以後の説明においては、測定物載置板６１１のＺ軸＋側の面、すなわち被測定物Ｓが載置される側の面を載置面６１１ａ、Ｚ軸－側の面、すなわち載置面６１１ａとは反対側の面を裏面６１１ｂと呼ぶ。 In the following description, the surface on the Z axis + side of the measurement object placing plate 611, that is, the surface on which the object S to be measured is placed is the placement surface 611a, and the surface on the Z axis − side, that is, the placement surface. A surface opposite to 611a is referred to as a back surface 611b.
　上述したように測定物載置板６１１は薄いので、載置面６１１ａに被測定物Ｓを載置した場合には、被測定物Ｓの重量により測定物載置板６１１にはＺ軸方向－側に撓みが発生する。測定物載置板６１１に撓みが発生すると、倍率取得部３６がＺ位置検出部６４１から出力された載置台６１のＺ軸方向の位置に基づいて取得した倍率と、実際の倍率との間に誤差が生じる。 As described above, since the measured object placing plate 611 is thin, when the measured object S is placed on the placing surface 611a, the measured object placing plate 611 is placed in the Z-axis direction due to the weight of the measured object S— Deflection occurs on the side. When the measurement object placing plate 611 is bent, the magnification obtaining unit 36 between the magnification obtained based on the Z-axis direction position of the placing table 61 output from the Z position detecting unit 641 and the actual magnification. An error occurs.
　ここで、撓みと倍率誤差との関係について説明する。図２（ａ）、（ｂ）は測定物載置板６１１に撓みが発生していない状態を示し、図２（ｃ）は測定物載置板６１１に撓みが発生した状態を示す。なお、図２（ａ）、（ｂ）は、被測定物Ｓを載置しても測定物載置板６１１に撓みが発生していないとする仮定の状態を模式的に示す図であり、図２（ｂ）は測定物載置板６１１がＸ線源５と接触している状態を示す図である。投影画像または再構成画像に含まれる被測定物Ｓの透過像の倍率は、Ｘ線源５の出射点ＰとＸ線検出器７の受光面との距離Ｄ１と、出射点Ｐと被測定物Ｓとの距離Ｄ２と、によって決まる。すなわち、倍率はＤ１／Ｄ２で表される。したがって、被測定物Ｓの透過像の倍率は、Ｘ線源５の出射点Ｐと被測定物Ｓとの距離Ｄ２の減少に応じて増加する。図２（ｂ）においては、測定物載置板６１１とＸ線源５とが接触しているため、被測定物ＳのＺ軸－側端面における距離Ｄ２が測定物載置板６１１の厚みに相当する。すなわち距離Ｄ２は最小となり、このとき被測定物Ｓの透過像の倍率は最大倍率となる。 Here, the relationship between the deflection and the magnification error will be described. 2A and 2B show a state in which the measured object placing plate 611 is not bent, and FIG. 2C shows a state in which the measured object placing plate 611 is bent. 2 (a) and 2 (b) are diagrams schematically showing a hypothetical state that the measured object placing plate 611 is not bent even when the measured object S is placed. FIG. 2B is a diagram showing a state in which the measurement object placing plate 611 is in contact with the X-ray source 5. The magnification of the transmission image of the measurement object S included in the projection image or the reconstructed image is the distance D1 between the emission point P of the X-ray source 5 and the light receiving surface of the X-ray detector 7, and the emission point P and the measurement object. It is determined by the distance D2 from S. That is, the magnification is represented by D1 / D2. Accordingly, the magnification of the transmission image of the object S to be measured increases as the distance D2 between the emission point P of the X-ray source 5 and the object S to be measured decreases. In FIG. 2B, since the measured object placing plate 611 and the X-ray source 5 are in contact with each other, the distance D2 on the Z-axis-side end surface of the measured object S is the thickness of the measured object placing plate 611. Equivalent to. That is, the distance D2 is minimum, and at this time, the magnification of the transmission image of the object S to be measured is the maximum magnification.
　上述した通り、Ｘ線装置１００は、載置台６１がＺ軸方向に移動する構成を有する。すなわち、測定物載置板６１１を支持する載置板保持部６１２がＺ軸移動機構６４によって移動される。Ｚ位置検出部６４１は、Ｚ軸移動機構６４によって移動された測定物載置板６１１のＸ線源５に対する相対位置を検出する。図２（ｂ）に示すように、測定物載置板６１１に撓みが発生していない状態において、測定物載置板６１１がＸ線源５と接触するときにＺ位置検出部６４１によって検出されるＸ線源５に対する相対位置をＺ０とする。また、測定物載置板６１１に撓みが発生していない状態において測定物載置板６１１がＸ線源５に接触していない所定の載置台６１の位置において、Ｚ位置検出部６４１によって検出される相対位置をＺ１とする（図２（ａ））。 As described above, the X-ray apparatus 100 has a configuration in which the mounting table 61 moves in the Z-axis direction. That is, the mounting plate holding unit 612 that supports the measurement object mounting plate 611 is moved by the Z-axis moving mechanism 64. The Z position detector 641 detects the relative position of the measurement object placing plate 611 moved by the Z axis moving mechanism 64 with respect to the X-ray source 5. As shown in FIG. 2B, when the measurement object placing plate 611 is in contact with the X-ray source 5 in a state where the measurement object placing plate 611 is not bent, it is detected by the Z position detection unit 641. The relative position to the X-ray source 5 is Z0. Further, in a state where the measurement object mounting plate 611 is not bent, the Z position detection unit 641 detects the measurement object mounting plate 611 at a predetermined position of the mounting table 61 where the measurement object mounting plate 611 is not in contact with the X-ray source 5. The relative position is Z1 (FIG. 2A).
　倍率取得部３６は、Ｚ位置検出部６４１によって検出された測定物載置板６１１の相対位置Ｚ０やＺ１に基づいて、被測定物Ｓの透過像の倍率を求める。この場合、相対位置Ｚ０やＺ１と被測定物Ｓの透過像の倍率とは対応付けされ、所定の記憶領域（不図示）に倍率データテーブルとして予め記憶され、倍率取得部３６は、Ｚ位置検出部６４１から出力されたＺ位置信号に対応する相対位置Ｚ０やＺ１に基づいて、上記の倍率データテーブルを参照して倍率を求める。なお、上述したように、測定物載置板６１１とＸ線源５とが接触している状態に相当する相対位置Ｚ０のときに、被測定物Ｓの透過像の倍率は最大となる。 The magnification acquisition unit 36 obtains the magnification of the transmission image of the measurement object S based on the relative position Z0 or Z1 of the measurement object placing plate 611 detected by the Z position detection unit 641. In this case, the relative position Z0 or Z1 and the magnification of the transmission image of the object S to be measured are associated with each other and stored in advance as a magnification data table in a predetermined storage area (not shown), and the magnification acquisition unit 36 detects the Z position. Based on the relative position Z0 or Z1 corresponding to the Z position signal output from the unit 641, the magnification is obtained by referring to the magnification data table. Note that, as described above, the magnification of the transmission image of the measurement object S is maximized at the relative position Z0 corresponding to the state where the measurement object placing plate 611 and the X-ray source 5 are in contact with each other.
　しかし、図２（ｃ）に示すように、被測定物Ｓの載置によって測定物載置板６１１にはＺ軸－方向に撓みが発生する。図２（ｃ）は、撓みが発生した測定物載置板６１１がＸ線源５と接触した状態を示す。このときＺ位置検出部６４１によって検出された測定物載置板６１１のＸ線源５に対する相対位置をＺ１とする。すなわち、図２（ａ）の状態において、測定物載置板６１１が丁度Ｘ線源５と接触するように、より重い被測定物Ｓに載せ代えた場合を示す。この場合、測定物載置板６１１とＸ線源５とは接触しているので、被測定物Ｓの透過像の実際の倍率は最大となる。しかし、Ｚ位置検出部６４１によって検出された相対位置はＺ１なので、倍率取得部３６が上記のように倍率データテーブルを参照して取得する被測定物Ｓの透過像の倍率は最大とはならない。すなわち、倍率取得部３６によって取得した被測定物Ｓの透過像の倍率と、実際の被測定物Ｓの透過像の倍率との間に誤差が発生する。 However, as shown in FIG. 2C, the measurement object placing plate 611 bends in the Z-axis direction due to the placement of the measurement object S. FIG. 2C shows a state in which the measured object placing plate 611 that has been bent is in contact with the X-ray source 5. At this time, the relative position of the measurement object placing plate 611 detected by the Z position detection unit 641 with respect to the X-ray source 5 is defined as Z1. That is, in the state of FIG. 2A, a case where the measurement object placing plate 611 is replaced with a heavier measurement object S so that the measurement object placing plate 611 just contacts the X-ray source 5 is shown. In this case, since the measured object placing plate 611 and the X-ray source 5 are in contact with each other, the actual magnification of the transmission image of the measured object S is maximized. However, since the relative position detected by the Z position detection unit 641 is Z1, the magnification of the transmission image of the measurement object S acquired by the magnification acquisition unit 36 with reference to the magnification data table as described above is not the maximum. That is, an error occurs between the magnification of the transmission image of the measurement object S acquired by the magnification acquisition unit 36 and the magnification of the actual transmission image of the measurement object S.
　図３に、倍率取得部３６が取得する透過像の倍率と測定物載置板６１１のＸ線源５に対する相対位置との関係、および撓みが発生している場合における実際の被測定物Ｓの透過像の倍率と測定物載置板６１１のＸ線源５に対する相対位置との関係を示す。図３において、倍率取得部３６の取得倍率と相対位置との関係は６６０、撓みが発生している場合における実際の倍率と相対位置との関係は６６１として示されている。図３に示すように、関係６６１は、測定物載置板６１１のＸ線源５に対する相対位置がＺ０～Ｚ１の間は最大倍率で一定となり、測定物載置板６１１のＸ線源５に対する相対位置がＺ１を超えると相対位置の増加に伴って減少する。一方、関係６６０は、測定物載置板６１１のＸ線源５に対する相対位置がＺ０から増加するに従って減少する。 In FIG. 3, the relationship between the magnification of the transmission image acquired by the magnification acquisition unit 36 and the relative position of the measurement object mounting plate 611 with respect to the X-ray source 5, and the actual measurement object S when the bending occurs. The relationship between the magnification of a transmission image and the relative position with respect to the X-ray source 5 of the measurement object mounting plate 611 is shown. In FIG. 3, the relationship between the acquisition magnification of the magnification acquisition unit 36 and the relative position is indicated as 660, and the relationship between the actual magnification and the relative position when the bending occurs is indicated as 661. As shown in FIG. 3, the relationship 661 indicates that the relative position of the measurement object placing plate 611 with respect to the X-ray source 5 is constant at the maximum magnification between Z0 and Z1, and the measurement object placing plate 611 with respect to the X-ray source 5 is constant. When the relative position exceeds Z1, it decreases with the increase of the relative position. On the other hand, the relationship 660 decreases as the relative position of the measurement object placing plate 611 with respect to the X-ray source 5 increases from Z0.
　図３に示すように、測定物載置板６１１に撓みが生じると、Ｚ位置検出部６４１により検出される測定物載置板６１１のＸ線源５に対する相対位置の全域にわたって被測定物Ｓの透過像の倍率に誤差が発生する。特に、Ｘ線源５と測定物載置板６１１とが近接している場合、すなわち高倍率の領域では、撓みに起因する誤差の影響が大きい。さらに、Ｚ位置検出部６４１により検出される測定物載置板６１１のＸ線源５に対する相対位置がＺ０～Ｚ１の間では、測定物載置板６１１はＸ線源５と接触した状態であるため、Ｚ軸移動機構６４により載置板保持部６１２を移動させても被測定物Ｓの透過像の倍率は最大倍率のままで変化しない。 As shown in FIG. 3, when the measured object placing plate 611 is bent, the measured object placing plate 611 is detected by the Z position detecting unit 641 over the entire area of the relative position of the measured object placing plate 611 with respect to the X-ray source 5. An error occurs in the magnification of the transmission image. In particular, when the X-ray source 5 and the measurement object placing plate 611 are close to each other, that is, in a high-magnification region, the influence of errors due to bending is large. Further, when the relative position of the measured object placing plate 611 with respect to the X-ray source 5 detected by the Z position detector 641 is between Z0 and Z1, the measured object placing plate 611 is in contact with the X-ray source 5. Therefore, even if the mounting plate holding unit 612 is moved by the Z-axis moving mechanism 64, the magnification of the transmission image of the object to be measured S remains unchanged at the maximum magnification.
　そこで本実施の形態のＸ線装置１００は、撓み制御部９によって測定物載置板６１１が撓まないように制御することで、被測定物Ｓの透過像の倍率を正確に取得でき、特に高倍率の領域での倍率誤差を小さくできるよう構成されている。 Therefore, the X-ray apparatus 100 according to the present embodiment can accurately acquire the magnification of the transmission image of the measurement object S by controlling the measurement object placing plate 611 so as not to be bent by the deflection control unit 9. The magnification error in the high magnification region can be reduced.
　図４および図５を参照しながら、撓み制御部９について詳細に説明する。図４は、Ｘ線源５と載置台６１と撓み制御部９の機械構成ユニットとＸ線検出器７との位置関係を示す側面図である。図５は、撓み制御部９の機械構成ユニットの構成を示す斜視図であり、撓み制御部９の機械構成ユニットのみを図示している。なお、図４においては、説明を簡単にするため、Ｘ線検出器７が基準軸Ｌ上に位置する場合を示す。図４および図５においても、図１と同様にＸ軸、Ｙ軸およびＺ軸からなる座標系を図示の通りに設定する。 The bending control unit 9 will be described in detail with reference to FIGS. FIG. 4 is a side view showing the positional relationship among the X-ray source 5, the mounting table 61, the mechanical component unit of the deflection control unit 9, and the X-ray detector 7. FIG. 5 is a perspective view illustrating the configuration of the machine configuration unit of the deflection control unit 9, and illustrates only the machine configuration unit of the deflection control unit 9. 4 shows a case where the X-ray detector 7 is positioned on the reference axis L for the sake of simplicity. 4 and 5, similarly to FIG. 1, a coordinate system including the X axis, the Y axis, and the Z axis is set as illustrated.
　撓み制御部９の機械構成ユニットは、Ｘ線源５の周囲を囲むように設けられる。撓み制御部９の機械構成ユニットは、測定物載置板６１１の裏面６１１ｂで測定物載置板６１１を支持する撓み制御用支持部材９１と、撓み制御用支持部材９１をＺ軸方向に沿って移動させる支持部材移動機構９２とを備える。 The mechanical component unit of the deflection control unit 9 is provided so as to surround the periphery of the X-ray source 5. The mechanical configuration unit of the deflection control unit 9 includes a deflection control support member 91 that supports the measurement object placing plate 611 on the back surface 611b of the measurement object placing plate 611, and the deflection control support member 91 along the Z-axis direction. And a support member moving mechanism 92 to be moved.
　撓み制御用支持部材９１は、円筒状の台部９１ａと、台部９１ａの上面に等間隔で設けられＺ軸方向に延在する３つの支柱９１ｂと、を有する。３つの支柱９１ｂの上部には、それぞれ、測定物載置板６１１の裏面６１１ｂに転がり接触する接触部９１ｃが設けられる。このように撓み制御用支持部材９１は、測定物載置板６１１の裏面６１１ｂを３箇所で支持するので、測定物載置板６１１を安定して支持することができる。また、撓み制御用支持部材９１は、測定物載置板６１１の下方向の撓みを小さく抑えるために、Ｘ線源５の周囲において測定物載置板６１１の中央近傍の位置に接触可能に設けられる。また、撓み制御用支持部材９１の接触部９１ｃは、たとえばボールが回転可能に保持された機構などにより、測定物載置板６１１の裏面６１１ｂに転がり接触するように構成されている。 The deflection control support member 91 includes a cylindrical base portion 91a and three support columns 91b provided at equal intervals on the upper surface of the base portion 91a and extending in the Z-axis direction. Contact portions 91c that are in rolling contact with the back surface 611b of the measurement object placing plate 611 are provided on the upper portions of the three columns 91b. As described above, since the deflection control support member 91 supports the back surface 611b of the measurement object placing plate 611 at three locations, the measurement object placing plate 611 can be stably supported. In addition, the deflection control support member 91 is provided so as to be able to contact a position near the center of the measurement object placing plate 611 around the X-ray source 5 in order to suppress the downward deflection of the measurement object placing plate 611 to be small. It is done. Further, the contact portion 91c of the deflection control support member 91 is configured to be in rolling contact with the back surface 611b of the measurement object placing plate 611, for example, by a mechanism in which the ball is rotatably held.
　支持部材移動機構９２は、撓み制御用支持部材９１の台部９１ａに取り付けられＺ軸方向に延在するラック９２ａと、ラック９２ａと噛み合うピニオンギア９２ｂと、ピニオンギア９２ｂを回転させるモータ９２ｃと、モータ９２ｃを固定するモータ固定板９２ｄと、を有する。支持部材移動機構９２は、撓み制御用支持部材９１の台部９１ａのＸ軸＋側とＸ軸－側にそれぞれ取り付けられＺ軸方向に延在する２つのガイド移動側部材９２ｅと、２つのガイド移動側部材９２ｅにそれぞれ嵌合される２つのガイド固定側部材９２ｆと、２つのガイド固定側部材９２ｆをそれぞれ固定する２つのガイド固定板９２ｇと、を有する。支持部材移動機構９２は、架台２の基礎底盤２２に取り付けられるベース９２ｈを有し、モータ固定板９２ｄおよび２つのガイド固定板９２ｇがベース９２ｈに取り付けられる。モータ９２ｃによりピニオンギア９２ｂが回転することでラック９２ａがＺ軸方向に移動し、ラック９２ａが取り付けられた撓み制御用支持部材９１がＺ軸方向に移動する。また撓み制御用支持部材９１は、台部９１ａに取り付けられたガイド移動側部材９２ｅとガイド固定側部材９２ｆとによってＺ軸方向に沿って移動するようにガイドされる。 The support member moving mechanism 92 includes a rack 92a that is attached to the base portion 91a of the deflection control support member 91 and extends in the Z-axis direction, a pinion gear 92b that meshes with the rack 92a, a motor 92c that rotates the pinion gear 92b, A motor fixing plate 92d for fixing the motor 92c. The support member moving mechanism 92 includes two guide movement side members 92e attached to the X axis + side and the X axis − side of the base portion 91a of the deflection control support member 91 and extending in the Z axis direction, and two guides. There are two guide fixing side members 92f fitted to the moving side member 92e, and two guide fixing plates 92g for fixing the two guide fixing side members 92f, respectively. The support member moving mechanism 92 has a base 92h attached to the base bottom plate 22 of the gantry 2, and a motor fixing plate 92d and two guide fixing plates 92g are attached to the base 92h. When the pinion gear 92b is rotated by the motor 92c, the rack 92a moves in the Z-axis direction, and the deflection control support member 91 to which the rack 92a is attached moves in the Z-axis direction. The support member 91 for deflection control is guided so as to move along the Z-axis direction by a guide moving side member 92e and a guide fixing side member 92f attached to the base portion 91a.
　このようにして支持部材移動機構９２が撓み制御用支持部材９１をＺ軸方向に移動させ、撓み制御用支持部材９１が測定物載置板６１１の裏面６１１ｂを押し上げることで、測定物載置板６１１の撓みの状態が制御される。また、支持部材移動機構９２は、制御装置３内の撓み制御用支持部材制御部３７により移動制御が行われており、撓み制御用支持部材制御部３７は、次に説明するような状態になるように、支持部材移動機構９２を制御している。図６は、撓み制御部９により制御される測定物載置板６１１の撓みの状態を説明する図である。なお、図６においても、説明を簡単にするため、Ｘ線検出器７が基準軸Ｌ上に位置する場合を示す。また、図６においても、図１と同様にＸ軸、Ｙ軸およびＺ軸からなる座標系を図示の通りに設定する。 In this way, the support member moving mechanism 92 moves the deflection control support member 91 in the Z-axis direction, and the deflection control support member 91 pushes up the back surface 611b of the measurement object placement plate 611, whereby the measurement object placement plate is moved. The state of bending of 611 is controlled. The support member moving mechanism 92 is controlled to move by a bend control support member control unit 37 in the control device 3, and the bend control support member control unit 37 is in a state described below. Thus, the support member moving mechanism 92 is controlled. FIG. 6 is a diagram for explaining a state of bending of the measurement object placing plate 611 controlled by the bending control unit 9. 6 also shows the case where the X-ray detector 7 is positioned on the reference axis L for the sake of simplicity. Also in FIG. 6, as in FIG. 1, a coordinate system including the X axis, the Y axis, and the Z axis is set as shown.
　Ｘ線装置１００では、たとえば、図６（ａ）に示すように、測定物載置板６１１に被測定物Ｓが載置されていても、撓み制御用支持部材９１が測定物載置板６１１を押し上げることで、測定物載置板６１１に撓みがない状態（すなわち、被測定物Ｓが載置されていない状態と同様な状態）となるように制御することができる。また、上述したように測定物載置板６１１は薄いので、図６（ｂ）に示すように、撓み制御用支持部材９１が測定物載置板６１１を押し上げることで、測定物載置板６１１にＺ軸＋方向の撓みがある状態（すなわち、載置面６１１ａが凸となる状態）となるように制御することもできる。 In the X-ray apparatus 100, for example, as shown in FIG. 6A, even if the measurement object S is placed on the measurement object placing plate 611, the deflection control support member 91 is used as the measurement object placing plate 611. By pushing up, it is possible to control so that the measured object placing plate 611 is not bent (that is, a state similar to the state where the measured object S is not placed). Further, as described above, since the measurement object placing plate 611 is thin, the measurement object placing plate 611 is pushed by the deflection control support member 91 pushing up the measurement object placing plate 611 as shown in FIG. It can also be controlled so that there is a state in which there is bending in the Z-axis + direction (that is, a state where the mounting surface 611a is convex).
　支持部材移動機構９２による撓み制御用支持部材９１の移動は、制御装置３の移動制御部３２の制御情報を基に、撓み制御用支持部材制御部３７によって制御される。支持部材移動機構９２はエンコーダ（不図示）を備えており、このエンコーダからの出力に基づいて、撓み制御用支持部材制御部３７は、撓み制御用支持部材９１の位置情報を取得できる。また、Ｚ位置検出部６４１により検出される測定物載置板６１１の位置と、測定物載置板６１１に撓みを発生させないように支持可能な撓み制御用支持部材９１の位置とは対応付けされ、所定の記憶領域（不図示）に位置データテーブルとして予め記憶される。したがって、撓み制御用支持部材制御部３７は、Ｚ位置検出部６４１からの出力信号に基づいて、上記位置データテーブルを参照し、上記位置データテーブルから得られた撓み制御用支持部材９１の位置情報に基づき、支持部材移動機構９２を制御する。 The movement of the deflection control support member 91 by the support member moving mechanism 92 is controlled by the deflection control support member control unit 37 based on the control information of the movement control unit 32 of the control device 3. The support member moving mechanism 92 includes an encoder (not shown). Based on an output from the encoder, the deflection control support member control unit 37 can acquire position information of the deflection control support member 91. Further, the position of the measurement object placing plate 611 detected by the Z position detection unit 641 is associated with the position of the deflection control support member 91 that can be supported so as not to cause the measurement object placement board 611 to bend. The position data table is stored in advance in a predetermined storage area (not shown). Therefore, the deflection control support member control unit 37 refers to the position data table based on the output signal from the Z position detection unit 641, and the position information of the deflection control support member 91 obtained from the position data table. Based on the above, the support member moving mechanism 92 is controlled.
　撓み制御用支持部材制御部３７は、Ｘ線装置１００の動作開始前において、上記位置データテーブルに基づいて、測定物載置板６１１に撓みを発生させないように撓み制御用支持部材９１の位置を設定する。したがって、被測定物Ｓが測定物載置板６１１に載置されても、撓み制御用支持部材９１により測定物載置板６１１が支持されているので、被測定物Ｓの重さによって測定物載置板６１１に下方向の撓みが発生することを防止できる。 The deflection control support member control unit 37 sets the position of the deflection control support member 91 so as not to cause the measurement object placing plate 611 to bend based on the position data table before the operation of the X-ray apparatus 100 is started. Set. Therefore, even if the measurement object S is placed on the measurement object placement plate 611, the measurement object placement plate 611 is supported by the deflection control support member 91, so that the measurement object depends on the weight of the measurement object S. It is possible to prevent the downward bending of the mounting plate 611.
　ユーザによりＸ線装置１００に対して被測定物Ｓの透過像の倍率を変更する操作が行われると、移動制御部３２は、Ｚ軸移動機構６４を駆動させて、測定物載置板６１１を目標位置へ移動させる。また、撓み制御用支持部材制御部３７は、Ｚ軸移動機構６４による測定物載置板６１１のＺ軸方向の移動に同期して、支持部材移動機構９２により撓み制御用支持部材９１をＺ軸方向に移動させることで、測定物載置板６１１の撓みを発生させないように制御する。すなわち、撓み制御用支持部材制御部３７は、上記位置データテーブルに基づいて、測定物載置板６１１の撓みの状態を発生させないように撓み制御用支持部材９１の位置を設定する。具体的には、撓み制御用支持部材制御部３７は、測定物載置板６１１のＺ軸方向の移動量と同じ移動量となるように撓み制御用支持部材９１をＺ軸方向に移動させる。これにより、測定物載置板６１１に撓みを発生させない状態が維持されたまま、測定物載置板６１１および撓み制御用支持部材９１がＺ軸方向に移動される。 When the user performs an operation to change the magnification of the transmission image of the measurement object S on the X-ray apparatus 100, the movement control unit 32 drives the Z-axis movement mechanism 64 to move the measurement object mounting plate 611. Move to the target position. In addition, the support member control unit 37 for bending control causes the support member moving mechanism 92 to move the support member 91 for bending control to the Z axis in synchronization with the movement of the measurement object placing plate 611 in the Z axis direction by the Z axis moving mechanism 64. By controlling the movement in the direction, the measurement object placing plate 611 is controlled not to bend. In other words, the deflection control support member control unit 37 sets the position of the deflection control support member 91 so as not to cause the measurement object placing plate 611 to bend based on the position data table. Specifically, the deflection control support member control unit 37 moves the deflection control support member 91 in the Z-axis direction so as to have the same movement amount as the movement amount of the measurement object placing plate 611 in the Z-axis direction. As a result, the measured object placing plate 611 and the deflection control support member 91 are moved in the Z-axis direction while maintaining a state in which the measured object placing plate 611 is not bent.
　この場合、倍率取得部３６は、Ｚ位置検出部６４１から出力された測定物載置板６１１の相対位置に基づいて、上述した倍率データテーブルを参照して被測定物Ｓの透過像の倍率を取得する。ここでは測定物載置板６１１が撓みのない状態に維持されているため、倍率取得部３６で正確に倍率を取得することができる。 In this case, the magnification acquisition unit 36 refers to the above-described magnification data table based on the relative position of the measurement object mounting plate 611 output from the Z position detection unit 641 and calculates the magnification of the transmission image of the measurement object S. get. Here, since the measurement object placing plate 611 is maintained in a state without bending, the magnification acquisition unit 36 can accurately acquire the magnification.
　また、Ｘ線装置１００の構造上、Ｚ軸移動機構６４により測定物載置板６１１をＺ軸方向に移動可能な範囲には制限がある。図６（ａ）では、測定物載置板６１１がＺ軸＋方向（上方向）に移動可能な範囲であって且つＺ軸方向においてＸ線源５から最も遠い位置（すなわち高さの上限位置）に移動した場合を示し、そのときＺ位置検出部６４１により検出される測定物載置板６１１の相対位置をＺ２とする。この状態で、ユーザによりＸ線装置１００に対して、被測定物Ｓの透過像の倍率をさらに低くする操作が行われた場合、測定物載置板６１１の位置は上限位置であるため、Ｚ軸移動機構６４によって測定物載置板６１１の位置をさらにＺ軸＋方向に移動させることはできない。そこで、撓み制御用支持部材制御部３７は、このような場合、測定物載置板６１１のＺ軸移動機構６４による移動を保持した状態で、撓み制御用支持部材９１のみをＺ軸＋方向に移動させることで、図６（ｂ）に示すように、測定物載置板６１１にＺ軸＋方向の撓みを発生させる。すなわち、撓み制御用支持部材制御部３７は、測定物載置板６１１の載置面６１１ａがＸ線検出器７側に向けて凸となるように撓み制御用支持部材９１のＺ軸方向の位置を設定する。これにより、測定物載置板６１１の撓みを発生させない状態と比較して、出射点Ｐと被測定物Ｓとを遠ざける（すなわち出射点Ｐと被測定物Ｓとの距離Ｄ２を長くする）ことができるので、被測定物Ｓの透過像の倍率を低くすることができる。 Further, due to the structure of the X-ray apparatus 100, there is a limit to the range in which the measurement object placing plate 611 can be moved in the Z-axis direction by the Z-axis moving mechanism 64. In FIG. 6A, the measurement object placing plate 611 is in a range in which it can move in the Z axis + direction (upward) and is the farthest position from the X-ray source 5 in the Z axis direction (that is, the upper limit position of the height). ), And the relative position of the measurement object placing plate 611 detected by the Z position detection unit 641 at this time is Z2. In this state, when the user performs an operation for further reducing the magnification of the transmission image of the measurement object S on the X-ray apparatus 100, the position of the measurement object placing plate 611 is the upper limit position. The position of the workpiece placing plate 611 cannot be further moved in the Z-axis + direction by the shaft moving mechanism 64. Therefore, in such a case, the deflection control support member control unit 37 moves only the deflection control support member 91 in the Z axis + direction while holding the movement of the measurement object placing plate 611 by the Z axis movement mechanism 64. By moving it, as shown in FIG. 6B, the measurement object placing plate 611 is bent in the Z-axis + direction. That is, the deflection control support member control unit 37 determines the position of the deflection control support member 91 in the Z-axis direction so that the placement surface 611a of the measurement object placement plate 611 is convex toward the X-ray detector 7 side. Set. Thereby, compared with the state which does not generate | occur | produce the bending of the measured object mounting plate 611, the outgoing point P and the to-be-measured object S are kept away (namely, distance D2 of the outgoing point P and the to-be-measured object S is lengthened). Therefore, the magnification of the transmission image of the measurement object S can be reduced.
　この場合、倍率取得部３６は、撓み制御用支持部材９１のＺ軸方向の位置に基づいて、測定物載置板６１１のＺ軸＋方向の撓み量Ｔを求める。具体的には、倍率取得部３６は、撓み制御用支持部材９１のＺ軸方向の位置から、測定物載置板６１１が上限位置にある場合に撓みを発生させない状態における撓み制御用支持部材９１のＺ軸方向の位置を減算して、撓み量Ｔを求める。倍率取得部３６は、Ｚ位置検出部６４１から出力された測定物載置板６１１の相対位置Ｚ２に撓み量Ｔを加算した値に基づいて、上記の倍率データテーブルを参照して被測定物Ｓの透過像の倍率を取得する。なお、倍率取得部３６は、Ｚ位置検出部６４１からの出力値の代わりに、支持部材移動機構９２に設けられたエンコーダの出力値を基に、倍率を算出するようにしてもよい。これにより、撓み制御用支持部材９１によって測定物載置板６１１に上方向の撓みを発生させた状態での被測定物Ｓの透過像の倍率を正確に取得することができる。 In this case, the magnification acquisition unit 36 obtains the deflection amount T in the Z axis + direction of the measurement object placing plate 611 based on the position in the Z axis direction of the deflection control support member 91. Specifically, the magnification acquisition unit 36 determines whether the deflection control support member 91 is in a state in which no deflection occurs when the measurement object placing plate 611 is at the upper limit position from the position of the deflection control support member 91 in the Z-axis direction. The amount of deflection T is obtained by subtracting the position in the Z-axis direction. The magnification acquisition unit 36 refers to the above-described magnification data table based on the value obtained by adding the deflection amount T to the relative position Z2 of the measurement object placing plate 611 output from the Z position detection unit 641. The magnification of the transmission image of is acquired. Note that the magnification acquisition unit 36 may calculate the magnification based on the output value of the encoder provided in the support member moving mechanism 92 instead of the output value from the Z position detection unit 641. As a result, the magnification of the transmission image of the measurement object S in a state where the measurement object mounting plate 611 is bent upward by the deflection control support member 91 can be accurately acquired.
　本実施の形態において、上述のようにしてユーザが所望する被測定物Ｓの透過像の倍率が得られる目標位置に被測定物Ｓが移動されると、被測定物Ｓの計測が行われる。制御装置３の移動制御部３２がＸ線検出器駆動ユニット８を介してＸ線検出器７をＸ線の出射点Ｐを中心とする球面上の任意の場所に移動させながら、制御装置３のＸ線制御部３１がＸ線源５を出力制御して、被測定物ＳにＸ線を照射させる。Ｘ線検出器７は、出射点Ｐを中心とする球面上の所定位置ごとに、Ｘ線源５から放射され被測定物Ｓを透過した透過Ｘ線を検出し、電気信号として制御装置３へ出力する。 In the present embodiment, when the measurement object S is moved to the target position where the magnification of the transmission image of the measurement object S desired by the user is obtained as described above, the measurement object S is measured. The movement control unit 32 of the control device 3 moves the X-ray detector 7 to an arbitrary place on the spherical surface centered on the X-ray emission point P via the X-ray detector drive unit 8. The X-ray control unit 31 controls the output of the X-ray source 5 to irradiate the measurement object S with X-rays. The X-ray detector 7 detects transmitted X-rays radiated from the X-ray source 5 and transmitted through the object to be measured S at predetermined positions on the spherical surface centered at the emission point P, and sends them to the control device 3 as electrical signals. Output.
　Ｘ軸移動機構６２、Ｙ軸移動機構６３、回転機構８１およびＸ線検出器７を円弧状ステージ８２上にて移送させるＸ線検出器駆動ユニット８は、それぞれエンコーダ（不図示）を備えている。上記のエンコーダからの出力およびＺ位置検出部６４１からの出力に基づいて、制御装置３は載置部６やＸ線検出器７の位置情報を取得できる。それぞれの位置情報を取得しながら、画像生成部３３はＸ線検出器７で撮影されたＸ線透過像である投影画像データを生成し、画像再構成部３４は投影画像データに基づいて被測定物Ｓの断面構造を再構成することができる。この場合、制御装置３にて、Ｘ線検出器駆動ユニット８による回転軸８１５の回転と、画像生成部３３でのＸ線検出器７からの投影画像データの生成とを協調して制御し、画像再構成部３４は画像生成部３３を介してＸ線検出器７で撮像された複数の異なる方向からの被測定物Ｓの投影画像データ（すなわち被測定物Ｓに対するＸ線の照射方向が異なる複数の投影画像データ）を取得する。また、画像再構成部３４は移動制御部３２を介して各エンコーダ、Ｚ位置検出部６４１からの出力も取得し、これらの出力と投影画像データとに基づいて、公知のフェルドカンプ逆投影法により、被測定物Ｓの内部構造（断面構造）である３次元データを生成する。なお、画像再構成処理として逐次近似法等を用いても良い。生成された被測定物Ｓの内部構造の３次元データは、表示モニタ（不図示）に表示される。 Each of the X-ray detector driving unit 8 for transferring the X-axis moving mechanism 62, the Y-axis moving mechanism 63, the rotating mechanism 81, and the X-ray detector 7 on the arcuate stage 82 includes an encoder (not shown). . Based on the output from the encoder and the output from the Z position detection unit 641, the control device 3 can acquire the position information of the placement unit 6 and the X-ray detector 7. While acquiring the respective position information, the image generation unit 33 generates projection image data that is an X-ray transmission image captured by the X-ray detector 7, and the image reconstruction unit 34 measures the measurement target based on the projection image data. The cross-sectional structure of the object S can be reconfigured. In this case, the control device 3 cooperatively controls the rotation of the rotation shaft 815 by the X-ray detector drive unit 8 and the generation of projection image data from the X-ray detector 7 in the image generation unit 33, The image reconstruction unit 34 projects the projection image data of the measurement object S from a plurality of different directions imaged by the X-ray detector 7 via the image generation unit 33 (that is, the irradiation direction of the X-rays to the measurement object S is different). A plurality of projection image data) is acquired. The image reconstruction unit 34 also obtains outputs from the encoders and the Z position detection unit 641 via the movement control unit 32, and based on these outputs and projection image data, a known Feldkamp backprojection method is used. Then, three-dimensional data that is the internal structure (cross-sectional structure) of the DUT S is generated. Note that a successive approximation method or the like may be used as the image reconstruction processing. The generated three-dimensional data of the internal structure of the measured object S is displayed on a display monitor (not shown).
　上述した実施の形態によるＸ線装置によれば、次の作用効果が得られる。
（１）Ｘ線装置１００は、測定物載置板６１１をＺ軸方向に移動するＺ軸移動機構６４と、測定物載置板６１１の撓みを制御するための撓み制御部９とを有する。撓み制御部９は、測定物載置板６１１の被測定物Ｓを載置する面（載置面６１１ａ）とは反対側の面（裏面６１１ｂ）で測定物載置板６１１を支持する撓み制御用支持部材９１と、Ｚ軸方向に沿って撓み制御用支持部材９１を移動させる支持部材移動機構９２と、支持部材移動機構９２を制御する撓み制御用支持部材制御部３７を有する。撓み制御用支持部材制御部３７は、支持部材移動機構９２を制御して、測定物載置板６１１の撓みの状態を測定物載置板６１１に被測定物Ｓが無い状態と同様な状態にするかまたは測定物載置板６１１の被測定物Ｓが載置されている面が凸となる状態にするように、撓み制御用支持部材９１の位置を設定する。このような構成により、Ｘ線装置１００は、被測定物Ｓを測定物載置板６１１に載置したときの測定物載置板６１１の撓みを任意に制御することができる。 According to the X-ray apparatus according to the above-described embodiment, the following operational effects can be obtained.
(1) The X-ray apparatus 100 includes a Z-axis moving mechanism 64 that moves the measurement object placing plate 611 in the Z-axis direction, and a bending control unit 9 for controlling the bending of the measurement object placing plate 611. The deflection control unit 9 supports the measurement object placing plate 611 on the surface (back surface 611b) opposite to the surface (placement surface 611a) on which the measurement object S is placed on the measurement object placing plate 611. Support member 91, support member moving mechanism 92 that moves support member 91 for deflection control along the Z-axis direction, and support member control unit 37 for bending control that controls support member moving mechanism 92. The deflection control support member control unit 37 controls the support member moving mechanism 92 so that the measurement object placing plate 611 bends in a state similar to the state in which the measurement object placing plate 611 does not have the object S to be measured. Alternatively, the position of the deflection control support member 91 is set so that the surface on which the object to be measured S of the measurement object placing plate 611 is placed is convex. With such a configuration, the X-ray apparatus 100 can arbitrarily control the bending of the measurement object placing plate 611 when the measurement object S is placed on the measurement object placing plate 611.
（２）撓み制御用支持部材制御部３７は、測定物載置板６１１の上下方向（Ｚ軸方向）の移動に同期して、撓み制御用支持部材９１を上下方向に移動させる。このような構成により、Ｘ線装置１００は、測定物載置板６１１を上下方向に移動する際、測定物載置板６１１の撓みを発生させない状態を維持することができる。 (2) The deflection control support member control unit 37 moves the deflection control support member 91 in the vertical direction in synchronization with the movement of the workpiece placing plate 611 in the vertical direction (Z-axis direction). With such a configuration, the X-ray apparatus 100 can maintain a state in which the measurement object placing plate 611 is not bent when the measurement object placing plate 611 is moved in the vertical direction.
（３）撓み制御用支持部材制御部３７は、Ｚ軸移動機構６４により測定物載置板６１１が移動可能な範囲であって且つ上下方向においてＸ線源５から最も遠い位置（すなわち高さの上限位置）に移動された状態で、測定物載置板６１１の撓みの状態を測定物載置板６１１の被測定物Ｓが載置されている面（載置面６１１ａ）が凸となる状態にするように撓み制御用支持部材９１の位置を設定する。このような構成により、測定物載置板６１１の撓みを制御しない場合と比較して、被測定物Ｓの透過像の倍率を低くすることができる。すなわち、測定物載置板６１１の撓みを制御しない場合と比較して、被測定物Ｓの透過像の倍率変更が可能な範囲を、低倍率側において広げることができる。 (3) The deflection control support member control unit 37 is within a range in which the measurement object placing plate 611 can be moved by the Z-axis moving mechanism 64 and is farthest from the X-ray source 5 in the vertical direction (that is, at a height). The state in which the object to be measured S is placed on the surface to be measured S (the placement surface 611a) of the measurement object placing plate 611 is convex in the state of being moved to the upper limit position). The position of the deflection control support member 91 is set so that With such a configuration, the magnification of the transmission image of the measurement object S can be reduced as compared with the case where the deflection of the measurement object placing plate 611 is not controlled. That is, the range in which the magnification of the transmission image of the measurement object S can be changed can be widened on the low magnification side as compared with the case where the deflection of the measurement object placing plate 611 is not controlled.
（４）倍率取得部３６は、測定物載置板６１１の撓みの状態を測定物載置板６１１に被測定物Ｓが無い状態と同様な状態にするように撓み制御用支持部材９１の位置が設定される場合は、被測定物Ｓの透過像の倍率を測定物載置板６１１の上下方向の位置に基づいて取得する。また倍率取得部３６は、測定物載置板６１１の撓みの状態を測定物載置板６１１の被測定物Ｓが載置されている面（載置面６１１ａ）が凸となる状態にするように撓み制御用支持部材９１の位置が設定される場合は、被測定物Ｓの透過像の倍率を測定物載置板６１１の上下方向の位置と撓み制御用支持部材９１の上下方向の位置とに基づいて取得する。このような構成により、Ｘ線装置１００は、被測定物Ｓの透過像の倍率を精度よく取得することができる。 (4) The magnification acquisition unit 36 positions the bending control support member 91 so that the measured object placing plate 611 is bent in a state similar to the state in which the measured object placing plate 611 does not have the measured object S. Is set, the magnification of the transmission image of the object to be measured S is acquired based on the vertical position of the measurement object placing plate 611. In addition, the magnification acquisition unit 36 causes the measurement object placing plate 611 to bend so that the surface of the measurement object placing plate 611 on which the object S to be measured (the placement surface 611a) is convex. When the position of the deflection control support member 91 is set, the magnification of the transmission image of the object to be measured S is set to the vertical position of the measurement object placing plate 611 and the vertical position of the deflection control support member 91. Get based on. With such a configuration, the X-ray apparatus 100 can accurately acquire the magnification of the transmission image of the object S to be measured.
（５）撓み制御用支持部材９１は、測定物載置板６１１に対して転がり接触する接触部９１ｃを複数有する。このような構成により、Ｘ線装置１００は、撓み制御用支持部材９１により測定物載置板６１１を安定して支持すると共に、撓みの制御をスムーズに行うことができる。 (5) The deflection control support member 91 includes a plurality of contact portions 91 c that are in rolling contact with the measurement object placing plate 611. With such a configuration, the X-ray apparatus 100 can stably support the measurement object placing plate 611 by the bending control support member 91 and can smoothly control the bending.
　以上で説明した第１の実施の形態によるＸ線装置１００を以下のように変形できる。
（第１変形例）
　被測定物Ｓの透過像の倍率とＸ線源５に対する相対位置とを関連付けた倍率データテーブルを備えていないものについても本発明の一態様に含まれる。この場合、倍率取得部３６は、Ｚ位置検出部６４１により検出されたＸ線源５に対する相対位置に基づいて、上述したＤ１／Ｄ２の関係に基づいて被測定物Ｓの透過像の倍率を算出すればよい。 The X-ray apparatus 100 according to the first embodiment described above can be modified as follows.
(First modification)
One that does not include a magnification data table that associates the magnification of the transmission image of the measurement object S with the relative position with respect to the X-ray source 5 is also included in one aspect of the present invention. In this case, the magnification acquisition unit 36 calculates the magnification of the transmission image of the measurement object S based on the above-described D1 / D2 relationship based on the relative position with respect to the X-ray source 5 detected by the Z position detection unit 641. do it.
（第２変形例）
　撓み制御用支持部材９１の接触部９１ｃが測定物載置板６１１に転がり接触しないものについても本発明の一態様に含まれる。たとえば、撓み制御用支持部材９１の接触部９１ｃが棒状であってもよく、棒の断面形状は円形状であっても方形状であってもよい。 (Second modification)
A configuration in which the contact portion 91c of the deflection control support member 91 does not roll and contact the measurement object placing plate 611 is also included in one aspect of the present invention. For example, the contact portion 91c of the deflection control support member 91 may be rod-shaped, and the cross-sectional shape of the rod may be circular or rectangular.
（第３変形例）
　Ｚ軸移動機構６４により測定物載置板６１１を移動可能な範囲の全域にわたって撓み制御部９により撓みを制御するようにしてもよいし、その一部の範囲のみ撓み制御部９により撓みを制御するようにしてもよい。上述したように、Ｘ線源５と測定物載置板６１１とがＺ軸方向に近接している場合、すなわち高倍率の場合には、撓みに起因する誤差の影響が大きいが、低倍率の場合、たとえば１０倍程度の場合には、撓みに起因する誤差の影響は小さい。そこで、撓み制御用支持部材制御部３７は、透過像の倍率が所定値（たとえば１０倍）よりも大きい場合にのみ、測定物載置板６１１の移動に応じて撓み制御用支持部材９１を移動して、測定物載置板６１１に撓みが発生しないように撓み制御用支持部材９１の位置を設定する。一方、透過像の倍率が所定値（たとえば１０倍）以下の場合には、測定物載置板６１１が移動しても撓み制御用支持部材９１を移動させないようにする。この場合には、撓み制御用支持部材９１により測定物載置板６１１の撓みが制御されないので、被測定物Ｓの重さにより測定物載置板６１１にＺ軸－方向の撓みが発生するが、撓みに起因する倍率の誤差は小さいため、無視できると考えられる。 (Third Modification)
The deflection control unit 9 may control the deflection over the entire range in which the workpiece mounting plate 611 can be moved by the Z-axis moving mechanism 64, or the deflection control unit 9 controls the deflection only in a part of the range. You may make it do. As described above, when the X-ray source 5 and the workpiece mounting plate 611 are close to each other in the Z-axis direction, that is, when the magnification is high, the influence of errors due to bending is large, but the low magnification is low. In this case, for example, in the case of about 10 times, the influence of the error due to the bending is small. Therefore, the deflection control support member control unit 37 moves the deflection control support member 91 according to the movement of the measurement object placing plate 611 only when the magnification of the transmission image is larger than a predetermined value (for example, 10 times). Then, the position of the bending control support member 91 is set so that the measured object placing plate 611 is not bent. On the other hand, when the magnification of the transmission image is a predetermined value (for example, 10 times) or less, the bending control support member 91 is not moved even if the measurement object placing plate 611 moves. In this case, since the deflection of the measurement object placing plate 611 is not controlled by the deflection control support member 91, the measurement object placing plate 611 is bent in the Z-axis direction due to the weight of the measurement object S. The error of the magnification due to bending is small and can be ignored.
　また、被測定物Ｓを測定物載置板６１１に載置した場合のＺ軸－方向の撓み量が予めわかっている場合には、撓みに起因する倍率の誤差に基づいて撓み制御用支持部材９１の移動を制限するようにしてもよい。なお、測定物載置板６１１の撓み量は被測定物Ｓの重さと形状とにより変わるため、この場合は被測定物Ｓの重さと形状とが予めわかっている必要がある。この場合、Ｚ位置検出部６４１により検出された測定物載置板６１１の相対位置に基づいて求める倍率（すなわち測定物載置板６１１の撓みが発生していない場合の倍率）に対する、測定物載置板６１１の撓みが発生した場合の倍率の誤差を予め算出する。そして、倍率の誤差が所定値（たとえば１０％以下）となるような倍率を求め、不図示の記憶領域に予め記憶しておく。撓み制御用支持部材制御部３７は、透過像の倍率が当該記憶された倍率よりも大きい場合にのみ、測定物載置板６１１の移動に応じて撓み制御用支持部材９１を移動して、測定物載置板６１１に撓みが発生しないように撓み制御用支持部材９１の位置を設定する。一方、透過像の倍率が当該記憶された倍率以下の場合には、測定物載置板６１１が移動しても撓み制御用支持部材９１を移動させないようにする。この場合には、撓み制御用支持部材９１により測定物載置板６１１の撓みが制御されないので、被測定物Ｓの重さにより測定物載置板６１１にＺ軸－方向の撓みが発生するが、撓みに起因する倍率の誤差は小さい（たとえば１０％以下である）ため、無視できると考えられる。 In addition, when the amount of deflection in the Z-axis direction when the workpiece S is placed on the workpiece placing plate 611 is known in advance, the deflection control support member is based on the error in magnification caused by the deflection. The movement of 91 may be limited. Since the amount of deflection of the measurement object placing plate 611 varies depending on the weight and shape of the measurement object S, in this case, the weight and shape of the measurement object S need to be known in advance. In this case, the measured object mounting with respect to the magnification obtained based on the relative position of the measured object mounting plate 611 detected by the Z position detector 641 (that is, the magnification when the measured object mounting plate 611 is not bent). The magnification error when the mounting plate 611 is bent is calculated in advance. Then, a magnification at which the magnification error becomes a predetermined value (for example, 10% or less) is obtained and stored in advance in a storage area (not shown). The deflection control support member control unit 37 moves the deflection control support member 91 according to the movement of the measurement object placing plate 611 only when the magnification of the transmission image is larger than the stored magnification, and performs measurement. The position of the bending control support member 91 is set so that the object placing plate 611 does not bend. On the other hand, when the magnification of the transmission image is equal to or smaller than the stored magnification, the bending control support member 91 is not moved even when the workpiece placing plate 611 is moved. In this case, since the deflection of the measurement object placing plate 611 is not controlled by the deflection control support member 91, the measurement object placing plate 611 is bent in the Z-axis direction due to the weight of the measurement object S. Since the error in magnification due to bending is small (for example, 10% or less), it can be considered negligible.
（第４変形例）
　Ｚ軸移動機構６４による測定物載置板６１１のＺ軸方向の移動に同期して、支持部材移動機構９２により撓み制御用支持部材９１をＺ軸方向に移動させないものについても本発明の一態様に含まれる。たとえば、Ｚ軸移動機構６４により測定物載置板６１１をＺ軸方向に移動させた後に、支持部材移動機構９２により撓み制御用支持部材９１をＺ軸方向に移動させて、測定物載置板６１１の撓みを発生させないように制御してもよい。 (Fourth modification)
One aspect of the present invention also applies to a case in which the support member moving mechanism 92 does not move the deflection control support member 91 in the Z-axis direction in synchronization with the movement of the workpiece placing plate 611 in the Z-axis direction by the Z-axis moving mechanism 64. include. For example, after the workpiece placing plate 611 is moved in the Z-axis direction by the Z-axis moving mechanism 64, the deflection control support member 91 is moved in the Z-axis direction by the support member moving mechanism 92, and the measured-material placing plate is moved. Control may be performed so as not to cause 611 bending.
－第２の実施の形態－
　図面を参照して、本発明の実施の形態による構造物製造システムを説明する。本実施の形態の構造物製造システムは、たとえば自動車のドア部分、エンジン部分、ギア部分および回路基板を備える電子部品等の成型品を作成する。 -Second Embodiment-
A structure manufacturing system according to an embodiment of the present invention will be described with reference to the drawings. The structure manufacturing system of the present embodiment creates a molded product such as an electronic component including, for example, an automobile door portion, an engine portion, a gear portion, and a circuit board.
　図７は本実施の形態による構造物製造システム４００の構成の一例を示すブロック図である。構造物製造システム４００は、第１の各実施の形態にて説明したＸ線装置１００と、設計装置４１０と、成形装置４２０と、制御システム４３０と、リペア装置４４０とを備える。 FIG. 7 is a block diagram showing an example of the configuration of the structure manufacturing system 400 according to the present embodiment. The structure manufacturing system 400 includes the X-ray apparatus 100, the design apparatus 410, the molding apparatus 420, the control system 430, and the repair apparatus 440 described in the first embodiments.
　設計装置４１０は、構造物の形状に関する設計情報を作成する際にユーザが用いる装置であって、設計情報を作成して記憶する設計処理を行う。設計情報は、構造物の各位置の座標を示す情報である。設計情報は成形装置４２０および後述する制御システム４３０に出力される。成形装置４２０は設計装置４１０により作成された設計情報を用いて構造物を作成、成形する成形処理を行う。この場合、成形装置４２０は、３Ｄプリンター技術で代表される積層加工、鋳造加工、鍛造加工および切削加工のうち少なくとも１つを行うものについても本発明の一態様に含まれる。 The design device 410 is a device used by a user when creating design information related to the shape of a structure, and performs a design process for creating and storing design information. The design information is information indicating the coordinates of each position of the structure. The design information is output to the molding apparatus 420 and a control system 430 described later. The molding apparatus 420 performs a molding process for creating and molding a structure using the design information created by the design apparatus 410. In this case, the molding apparatus 420 includes an apparatus that performs at least one of laminating, casting, forging, and cutting represented by 3D printer technology.
　Ｘ線装置１００は、成形装置４２０により成形された構造物の形状を測定する測定処理を行う。Ｘ線装置１００は、構造物を測定した測定結果である構造物の座標を示す情報（以後、形状情報と呼ぶ）を制御システム４３０に出力する。制御システム４３０は、座標記憶部４３１と、検査部４３２とを備える。座標記憶部４３１は、上述した設計装置４１０により作成された設計情報を記憶する。 The X-ray apparatus 100 performs a measurement process for measuring the shape of the structure molded by the molding apparatus 420. The X-ray apparatus 100 outputs information (hereinafter referred to as shape information) indicating the coordinates of the structure, which is a measurement result of the structure, to the control system 430. The control system 430 includes a coordinate storage unit 431 and an inspection unit 432. The coordinate storage unit 431 stores design information created by the design apparatus 410 described above.
　検査部４３２は、成形装置４２０により成形された構造物が設計装置４１０により作成された設計情報に従って成形されたか否かを判定する。換言すると、検査部４３２は、成形された構造物が良品か否かを判定する。この場合、検査部４３２は、座標記憶部４３１に記憶された設計情報を読み出して、設計情報とＸ線装置１００から入力した形状情報とを比較する検査処理を行う。検査部４３２は、検査処理としてたとえば設計情報が示す座標と対応する形状情報が示す座標とを比較し、検査処理の結果、設計情報の座標と形状情報の座標とが一致している場合には設計情報に従って成形された良品であると判定する。設計情報の座標と対応する形状情報の座標とが一致していない場合には、検査部４３２は、座標の差分が所定範囲内であるか否かを判定し、所定範囲内であれば修復可能な不良品と判定する。 The inspection unit 432 determines whether the structure molded by the molding device 420 is molded according to the design information created by the design device 410. In other words, the inspection unit 432 determines whether or not the molded structure is a good product. In this case, the inspection unit 432 reads the design information stored in the coordinate storage unit 431 and performs an inspection process for comparing the design information with the shape information input from the X-ray apparatus 100. The inspection unit 432 compares, for example, the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information as the inspection processing, and if the coordinates of the design information and the coordinates of the shape information match as a result of the inspection processing. It is determined that the product is a non-defective product molded according to the design information. If the coordinates of the design information do not match the coordinates of the corresponding shape information, the inspection unit 432 determines whether or not the coordinate difference is within a predetermined range, and if it is within the predetermined range, it can be restored. Judged as a defective product.
　修復可能な不良品と判定した場合には、検査部４３２は、不良部位と修復量とを示すリペア情報をリペア装置４４０へ出力する。不良部位は設計情報の座標と一致していない形状情報の座標であり、修復量は不良部位における設計情報の座標と形状情報の座標との差分である。リペア装置４４０は、入力したリペア情報に基づいて、構造物の不良部位を再加工するリペア処理を行う。リペア装置４４０は、リペア処理にて成形装置４２０が行う成形処理と同様の処理を再度行う。 If it is determined that the defective product can be repaired, the inspection unit 432 outputs repair information indicating the defective portion and the repair amount to the repair device 440. The defective part is the coordinate of the shape information that does not match the coordinate of the design information, and the repair amount is the difference between the coordinate of the design information and the coordinate of the shape information in the defective part. The repair device 440 performs a repair process for reworking a defective portion of the structure based on the input repair information. The repair device 440 performs again the same process as the molding process performed by the molding apparatus 420 in the repair process.
　図８に示すフローチャートを参照しながら、構造物製造システム４００が行う処理について説明する。
　ステップＳ１１では、設計装置４１０はユーザによって構造物の設計を行う際に用いられ、設計処理により構造物の形状に関する設計情報を作成し記憶してステップＳ１２へ進む。なお、設計装置４１０で作成された設計情報のみに限定されず、既に設計情報がある場合には、その設計情報を入力することで、設計情報を取得するものについても本発明の一態様に含まれる。ステップＳ１２では、成形装置４２０は成形処理により、設計情報に基づいて構造物を作成、成形してステップＳ１３へ進む。ステップＳ１３においては、Ｘ線装置１００は測定処理を行って、構造物の形状を計測し、形状情報を出力してステップＳ１４へ進む。 The process performed by the structure manufacturing system 400 will be described with reference to the flowchart shown in FIG.
In step S11, the design device 410 is used when the structure is designed by the user. The design apparatus 410 creates and stores design information related to the shape of the structure by the design process, and the process proceeds to step S12. Note that the present invention is not limited to only the design information created by the design apparatus 410, and when design information already exists, the design information is acquired by inputting the design information and is included in one aspect of the present invention. It is. In step S12, the forming apparatus 420 creates and forms a structure based on the design information by the forming process, and proceeds to step S13. In step S13, the X-ray apparatus 100 performs a measurement process, measures the shape of the structure, outputs shape information, and proceeds to step S14.
　ステップＳ１４では、検査部４３２は、設計装置４１０により作成された設計情報とＸ線装置１００により測定され、出力された形状情報とを比較する検査処理を行って、ステップＳ１５へ進む。ステップＳ１５では、検査処理の結果に基づいて、検査部４３２は成形装置４２０により成形された構造物が良品か否かを判定する。構造物が良品である場合、すなわち設計情報の座標と形状情報の座標とが一致する場合には、ステップＳ１５が肯定判定されて処理を終了する。構造物が良品ではない場合、すなわち設計情報の座標と形状情報の座標とが一致しない場合や設計情報には無い座標が検出された場合には、ステップＳ１５が否定判定されてステップＳ１６へ進む。 In step S14, the inspection unit 432 performs an inspection process for comparing the design information created by the design apparatus 410 with the shape information measured and output by the X-ray apparatus 100, and the process proceeds to step S15. In step S15, based on the result of the inspection process, the inspection unit 432 determines whether the structure formed by the forming apparatus 420 is a non-defective product. If the structure is a non-defective product, that is, if the coordinates of the design information coincide with the coordinates of the shape information, an affirmative determination is made in step S15 and the process ends. If the structure is not a non-defective product, that is, if the coordinates of the design information do not match the coordinates of the shape information, or if coordinates that are not in the design information are detected, a negative determination is made in step S15 and the process proceeds to step S16.
　ステップＳ１６では、検査部４３２は構造物の不良部位が修復可能か否かを判定する。不良部位が修復可能ではない場合、すなわち不良部位における設計情報の座標と形状情報の座標との差分が所定範囲を超えている場合には、ステップＳ１６が否定判定されて処理を終了する。不良部位が修復可能な場合、すなわち不良部位における設計情報の座標と形状情報の座標との差分が所定範囲内の場合には、ステップＳ１６が肯定判定されてステップＳ１７へ進む。この場合、検査部４３２はリペア装置４４０にリペア情報を出力する。ステップＳ１７においては、リペア装置４４０は、入力したリペア情報に基づいて、構造物に対してリペア処理を行ってステップＳ１３へ戻る。なお、上述したように、リペア装置４４０は、リペア処理にて成形装置４２０が行う成形処理と同様の処理を再度行う。 In step S16, the inspection unit 432 determines whether or not the defective portion of the structure can be repaired. If the defective part is not repairable, that is, if the difference between the coordinates of the design information and the coordinates of the shape information in the defective part exceeds the predetermined range, a negative determination is made in step S16 and the process ends. If the defective part can be repaired, that is, if the difference between the coordinates of the design information and the shape information in the defective part is within a predetermined range, an affirmative determination is made in step S16 and the process proceeds to step S17. In this case, the inspection unit 432 outputs repair information to the repair device 440. In step S17, the repair device 440 performs a repair process on the structure based on the input repair information, and returns to step S13. As described above, the repair device 440 performs again the same processing as the molding processing performed by the molding device 420 in the repair processing.
　上述した第２の実施の形態による構造物製造システムによれば、以下の作用効果が得られる。
（１）構造物製造システム４００のＸ線装置１００は、設計装置４１０の設計処理に基づいて成形装置４２０により作成された構造物の形状情報を取得する測定処理を行い、制御システム４３０の検査部４３２は、測定処理にて取得された形状情報と設計処理にて作成された設計情報とを比較する検査処理を行う。したがって、構造物の欠陥の検査や構造物の内部の情報を非破壊検査によって取得し、構造物が設計情報の通りに作成された良品であるか否かを判定できるので、構造物の品質管理に寄与する。 According to the structure manufacturing system of the second embodiment described above, the following operational effects can be obtained.
(1) The X-ray apparatus 100 of the structure manufacturing system 400 performs a measurement process for acquiring shape information of the structure created by the molding apparatus 420 based on the design process of the design apparatus 410, and performs an inspection unit of the control system 430. Reference numeral 432 performs an inspection process for comparing the shape information acquired in the measurement process with the design information created in the design process. Therefore, it is possible to determine whether or not a structure is a non-defective product created according to design information by inspecting the defect of the structure and information inside the structure by nondestructive inspection. Contribute to.
（２）リペア装置４４０は、検査処理の比較結果に基づいて、構造物に対して成形処理を再度行うリペア処理を行うようにした。したがって、構造物の不良部分が修復可能な場合には、再度成形処理と同様の処理を構造物に対して施すことができるので、設計情報に近い高品質の構造物の製造に寄与する。 (2) The repair device 440 performs the repair process for performing the molding process again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same processing as the molding process can be performed again on the structure, which contributes to the manufacture of a high-quality structure close to design information.
　次のような変形も本発明の範囲内であり、変形例の一つ、もしくは複数を上述の実施形態と組み合わせることも可能である。
（１）載置部６をＸ線源５に対してＺ軸－側に配置し、Ｘ線検出器７を載置部６に対してＺ軸－側に配置し、Ｚ軸＋側から載置部６に載置された被測定物ＳにＸ線を照射する構造を有するものも本発明の一態様に含まれる。
（２）載置部６がＺ軸方向に移動するものに限定されず、Ｘ線源５やＸ線検出器７がＺ軸方向に移動する構成とするものについても本発明の一態様に含まれる。 The following modifications are also within the scope of the present invention, and one or a plurality of modifications can be combined with the above-described embodiment.
(1) The placement unit 6 is disposed on the Z axis − side with respect to the X-ray source 5, and the X-ray detector 7 is disposed on the Z axis − side with respect to the placement unit 6, and is loaded from the Z axis + side. What has the structure which irradiates X-ray to the to-be-measured object S mounted in the mounting part 6 is also contained in 1 aspect of this invention.
(2) The mounting unit 6 is not limited to the one that moves in the Z-axis direction, and the X-ray source 5 and the X-ray detector 7 that are configured to move in the Z-axis direction are also included in one aspect of the present invention. It is.
　本発明の特徴を損なわない限り、本発明は上記実施の形態に限定されるものではなく、本発明の技術的思想の範囲内で考えられるその他の形態についても、本発明の範囲内に含まれる。 As long as the characteristics of the present invention are not impaired, the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .
３…制御装置、５…Ｘ線源、６…載置部、７…Ｘ線検出器、９…撓み制御部、３１…Ｘ線制御部、３２…移動制御部、３３…画像生成部、３４…画像再構成部、３６…倍率取得部、３７…撓み制御用支持部材制御部、６１…載置台、６２…Ｘ軸移動機構、６３…Ｙ軸移動機構、６４…Ｚ軸移動機構、９１…撓み制御用支持部材、９２…支持部材移動機構、１００…Ｘ線装置、４００…構造物製造システム、４１０…設計装置、４２０…成形装置、４３０…制御システム、４３２…検査部、４４０…リペア装置、６１１…測定物載置板、６１２…載置板保持部 DESCRIPTION OF SYMBOLS 3 ... Control apparatus, 5 ... X-ray source, 6 ... Mounting part, 7 ... X-ray detector, 9 ... Deflection control part, 31 ... X-ray control part, 32 ... Movement control part, 33 ... Image generation part, 34 ... Image reconstruction unit, 36 ... Magnification acquisition unit, 37 ... Deflection control support member control unit, 61 ... Mounting table, 62 ... X-axis movement mechanism, 63 ... Y-axis movement mechanism, 64 ... Z-axis movement mechanism, 91 ... Support member for deflection control, 92 ... Support member moving mechanism, 100 ... X-ray device, 400 ... Structure manufacturing system, 410 ... Design device, 420 ... Molding device, 430 ... Control system, 432 ... Inspection unit, 440 ... Repair device 611 ... measurement object placing plate, 612 ... placing plate holding part

Claims (15)

  1. 　被測定物を載置する載置板と、
    　前記載置板に載置された前記被測定物に対して、前記載置板の上方または下方からＸ線を照射するＸ線照射部と、
    　前記Ｘ線によって照射された前記被測定物の透過像を取得するＸ線検出部と、
    　前記載置板の撓みを制御するための撓み制御部と、
    　を備えるＸ線装置。     A mounting plate for mounting the object to be measured;
    An X-ray irradiation unit that irradiates X-rays from above or below the mounting plate with respect to the measurement object placed on the mounting plate;
    An X-ray detector that acquires a transmission image of the object irradiated by the X-ray;
    A deflection control unit for controlling the deflection of the mounting plate;
    An X-ray apparatus comprising:
  2. 　請求項１に記載のＸ線装置において、
    　前記撓み制御部は、前記載置板に前記被測定物が載置されたときに、前記載置板の撓みを制御するＸ線装置。     The X-ray apparatus according to claim 1,
    The bending control unit is an X-ray apparatus that controls the bending of the mounting plate when the object to be measured is placed on the mounting plate.
  3. 　請求項１または２に記載のＸ線装置において、
    　前記載置板を前記Ｘ線照射部または前記Ｘ線検出部に対して相対的に移動する載置板移動機構を更に備えるＸ線装置。     The X-ray apparatus according to claim 1 or 2,
    An X-ray apparatus further comprising a mounting plate moving mechanism that moves the mounting plate relative to the X-ray irradiation unit or the X-ray detection unit.
  4. 　請求項１乃至３の何れか一項に記載のＸ線装置において、
    　前記撓み制御部は、前記載置板の前記被測定物を載置する面とは反対側の面で、前記載置板を支持する支持部を有するＸ線装置。     The X-ray apparatus according to any one of claims 1 to 3,
    The bending control unit is an X-ray apparatus having a support unit that supports the mounting plate on a surface opposite to a surface on which the measurement target of the mounting plate is placed.
  5. 　請求項４に記載のＸ線装置において、
    　前記撓み制御部は、上下方向に前記支持部を移動させる支持部移動機構と、前記支持部移動機構を制御する支持部制御部と、を有するＸ線装置。     The X-ray apparatus according to claim 4,
    The said bending control part is an X-ray apparatus which has a support part moving mechanism which moves the said support part to an up-down direction, and a support part control part which controls the said support part movement mechanism.
  6. 　請求項５に記載のＸ線装置において、
    　前記支持部制御部は、前記載置板の撓みの状態を前記載置板に前記被測定物が無い状態と同様な状態にするかまたは前記載置板の前記被測定物が載置されている面が凸となる状態にするように、前記支持部の位置を設定するＸ線装置。     The X-ray apparatus according to claim 5,
    The support part control unit makes the state of bending of the mounting plate the same as the state where the measuring object is not on the mounting plate, or the measuring object of the mounting plate is placed. An X-ray apparatus that sets the position of the support portion so that the surface on which the surface is located is convex.
  7. 　請求項５または６に記載のＸ線装置において、
    　前記支持部制御部は、前記載置板の上下方向の移動に同期して、前記支持部を上下方向に移動させるように前記支持部移動機構を制御するＸ線装置。     The X-ray apparatus according to claim 5 or 6,
    The support unit control unit is an X-ray apparatus that controls the support unit moving mechanism to move the support unit in the vertical direction in synchronization with the vertical movement of the mounting plate.
  8. 　請求項６に記載のＸ線装置において、
    　前記載置板の撓みの状態を前記載置板に前記被測定物が無い状態と同様な状態にするように前記支持部の位置が設定される場合は、前記Ｘ線検出部によって取得される前記被測定物の透過像の倍率を前記載置板の上下方向の位置に基づいて取得し、前記載置板の撓みの状態を前記載置板の前記被測定物が載置されている面が凸となる状態にするように前記支持部の位置が設定される場合は、前記倍率を前記載置板の上下方向の位置と前記支持部の上下方向の位置とに基づいて取得する倍率取得部を更に備えるＸ線装置。     The X-ray apparatus according to claim 6,
    When the position of the support portion is set so that the state of bending of the mounting plate is the same as the state in which the object to be measured is not present on the mounting plate, it is acquired by the X-ray detection unit. The magnification of the transmission image of the object to be measured is acquired based on the vertical position of the mounting plate, and the bending state of the mounting plate is the surface of the mounting plate on which the object to be measured is mounted. When the position of the support portion is set so that the projection becomes convex, the magnification is obtained based on the vertical position of the mounting plate and the vertical position of the support portion. An X-ray apparatus further comprising a unit.
  9. 　請求項５～８のいずれか一項に記載のＸ線装置において、
    　前記Ｘ線照射部は、前記載置板に載置された前記被測定物に対して、前記載置板の下方からＸ線を照射するＸ線照射部であって、
    　前記支持部制御部は、前記載置板が移動可能な範囲であって且つ前記Ｘ線照射部から上下方向において最も遠い位置に移動された状態で、前記載置板の撓みの状態を前記載置板の前記被測定物が載置されている面が凸となる状態にするように前記支持部の位置を設定するＸ線装置。     The X-ray apparatus according to any one of claims 5 to 8,
    The X-ray irradiation unit is an X-ray irradiation unit that irradiates X-rays from below the mounting plate with respect to the measurement object placed on the mounting plate.
    The support unit control unit is a range in which the mounting plate is movable and is moved to a position farthest in the vertical direction from the X-ray irradiation unit, and the bending state of the mounting plate is described above. An X-ray apparatus that sets the position of the support portion so that a surface of the mounting plate on which the object to be measured is placed is convex.
  10. 　請求項６に記載のＸ線装置において、
    　前記支持部制御部は、前記Ｘ線検出部によって取得される前記被測定物の透過像の倍率が所定値よりも大きい場合にのみ、前記載置板の撓みの状態を前記載置板に前記被測定物が無い状態と同様な状態にするように前記支持部の位置を設定するＸ線装置。     The X-ray apparatus according to claim 6,
    The support unit control unit changes the state of bending of the mounting plate to the mounting plate only when the magnification of the transmission image of the measurement object acquired by the X-ray detection unit is larger than a predetermined value. An X-ray apparatus that sets the position of the support portion so as to be in a state similar to a state in which there is no object to be measured.
  11. 　請求項４乃至１０の何れか一項に記載のＸ線装置において、
    　前記支持部は、前記載置板に対して転がり接触する接触部を複数有するＸ線装置。     The X-ray apparatus according to any one of claims 4 to 10,
    The said support part is an X-ray apparatus which has multiple contact parts which roll-contact with the said mounting plate.
  12. 　請求項１乃至１１の何れか一項に記載のＸ線装置において、
    　前記被測定物に対する前記Ｘ線の照射方向が異なる状態で、前記Ｘ線検出部より検出された複数の投影データに基づいて、前記被測定物の内部構造情報を生成する再構成部を備えるＸ線装置。     The X-ray apparatus according to any one of claims 1 to 11,
    X having a reconfiguration unit that generates internal structure information of the object to be measured based on a plurality of projection data detected by the X-ray detection unit in a state where the irradiation direction of the X-ray to the object to be measured is different. Wire device.
  13. 　構造物の形状に関する設計情報を作成し、
    　前記設計情報に基づいて前記構造物を作成し、
    　作成された前記構造物の形状を、請求項１乃至１２の何れか一項に記載のＸ線装置を用いて計測して形状情報を取得し、
    　前記取得された前記形状情報と前記設計情報とを比較する構造物の製造方法。     Create design information about the shape of the structure,
    Create the structure based on the design information,
    The shape of the created structure is measured using the X-ray apparatus according to any one of claims 1 to 12 to acquire shape information,
    A structure manufacturing method for comparing the acquired shape information and the design information.
  14. 　請求項１３に記載の構造物の製造方法において、
    　前記形状情報と前記設計情報との比較結果に基づいて実行され、前記構造物の再加工を行う構造物の製造方法。     In the manufacturing method of the structure according to claim 13,
    A method of manufacturing a structure, which is executed based on a comparison result between the shape information and the design information, and reworks the structure.
  15. 　請求項１４に記載の構造物の製造方法において、
    　前記構造物の再加工は、前記設計情報に基づいて前記構造物の作成を再度行う構造物の製造方法。     In the manufacturing method of the structure according to claim 14,
    The reworking of the structure is a structure manufacturing method in which the structure is created again based on the design information.
PCT/JP2014/070942 2014-08-07 2014-08-07 X-ray apparatus and structure production method WO2016021031A1 (en)

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