WO2016006085A1 - X-ray device and structure manufacturing method - Google Patents

Abstract

In the present invention, an X-ray device is provided with: an X-ray source that emits X-rays as a result of an electron beam reaching a target; a detection unit that detects X-rays which have been emitted from the X-ray source and have passed through a measurement object; and an X-ray source control unit that controls the output of X-rays emitted from the X-ray source on the basis of the configuration information on the measurement object.

Description

X-ray apparatus and structure manufacturing method

The present invention relates to an X-ray apparatus and a method for manufacturing a structure.

2. Description of the Related Art Conventionally, an X-ray apparatus that detects transmitted X-rays that have passed through a measurement object and acquires information about a substance that constitutes the measurement object based on the detection result is known (for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2013-217775

However, in order to set the optimum X-ray output for measuring the measurement object, the user needs to empirically set the X-ray output based on the appearance of the measurement object and the operability is low. There is a problem.

According to the first aspect of the present invention, an X-ray apparatus includes an X-ray source that emits X-rays, a detection unit that detects the X-rays emitted from the X-ray source and passed through the object to be measured, An X-ray source control unit that controls the output of the X-rays emitted from the X-ray source based on the configuration information of the object to be measured.
According to a second aspect of the present invention, in the X-ray apparatus according to the first aspect, the X-ray source includes an electron beam generator that generates the electron beam, and the electron beam from the electron beam generator reaches the electron beam generator. A target for generating X-rays, and the X-ray source control unit is applied between the electron beam generation unit and the target to accelerate the electron beam, and It is preferable to control at least one of the amount of current to the electron beam generator.
According to a third aspect of the present invention, in the X-ray apparatus of the second aspect, the X-ray source further includes a voltage application unit for applying the acceleration voltage, and the X-ray source control unit includes: It is preferable to control the voltage application unit.
According to a fourth aspect of the present invention, in the X-ray apparatus according to any one of the first to third aspects, a mass detection unit that detects the mass of the object to be measured and shape information of the object to be measured are acquired. Based on the shape information acquisition unit, the mass of the measurement object detected by the mass detection unit, and the shape information of the measurement object acquired by the shape information acquisition unit, the configuration of the measurement object It is preferable to further include a configuration information acquisition unit that acquires information.
According to a fifth aspect of the present invention, in the X-ray apparatus according to the fourth aspect, the configuration information acquisition unit acquires the mass of the measurement object detected by the mass detection unit and the shape information acquisition unit. It is preferable that the ratio of the X-rays absorbed by the object to be measured is calculated based on the volume of the object to be calculated calculated based on the shape information thus obtained and obtained as the configuration information.
According to a sixth aspect of the present invention, in the X-ray apparatus according to the fifth aspect, the X-ray source control unit is configured to receive the X-ray based on the shape information acquired by the shape information acquisition unit. The X-ray radiated from the X-ray source is calculated based on the passing distance and the rate of absorption of the X-ray calculated by the configuration information acquisition unit. Is preferably controlled.
According to a seventh aspect of the present invention, in the X-ray apparatus according to the sixth aspect, the X-ray source control unit calculates a plurality of the passage distances at a plurality of locations of the object to be measured, and the plurality of passages. It is preferable to set the acceleration voltage at which the minimum transmission intensity of the X-ray is equal to or greater than a predetermined value based on the maximum passing distance among the distances.
According to an eighth aspect of the present invention, in the X-ray apparatus according to any one of the fifth to seventh aspects, the configuration information acquisition unit is configured to control the measurement object based on a mass and a volume of the measurement object. It is preferable to estimate a material and calculate a rate at which the X-ray corresponding to the material is absorbed.
According to a ninth aspect of the present invention, in the X-ray apparatus according to any one of the fourth to eighth aspects, a rotation drive unit that rotates the X-ray source and the detection unit relative to the object to be measured is provided. When the object to be measured is relatively rotated by the rotation driving unit, the X-rays radiated from the X-ray source and transmitted through the object to be measured and detected by the detecting unit at every predetermined relative rotation angle. Preferably, the shape information acquisition unit acquires the shape information of the object to be measured based on the detected information.
According to a tenth aspect of the present invention, in the X-ray apparatus according to any one of the fourth to eighth aspects, the imaging apparatus includes an imaging device that captures an appearance of the object to be measured and outputs an image signal. The unit preferably obtains the shape information using the image signal output from the imaging device.
According to an eleventh aspect of the present invention, in the X-ray apparatus according to any one of the first to third aspects, the configuration information is preferably configured by design information.
According to a twelfth aspect of the present invention, in the X-ray apparatus according to any one of the first to eleventh aspects, the X-ray source with respect to the object to be measured and the moving part that moves the detection part relatively are provided. A reconfiguration unit that generates internal structure information of the object to be measured based on a plurality of projection data detected by the detection unit in a state where the positions of the X-ray source and the detection unit are different with respect to the object to be measured; It is preferable to provide.
According to a thirteenth aspect of the present invention, a structure manufacturing method creates design information related to the shape of a structure, creates the structure based on the design information, and sets the shape of the created structure. The shape information is obtained by measurement using the X-ray apparatus according to claim 1, and the obtained shape information is compared with the design information.
According to a fourteenth aspect of the present invention, in the structure manufacturing method according to the thirteenth aspect, it is preferable that the structure is re-processed based on a comparison result between the shape information and the design information. .
According to the fifteenth aspect of the present invention, in the structure manufacturing method according to the fourteenth aspect, it is preferable that the reworking of the structure is performed again based on the design information.

According to the present invention, the operation setting by the user can be reduced by automating the output setting of the X-ray source.

The figure which shows the structure of the X-ray apparatus by embodiment of this invention The figure which shows the structure of the X-ray source by embodiment typically The figure explaining the acquisition method of the shape information of a measured object The figure which illustrates the table for estimating the material of the object to be measured and calculating the absorption coefficient The figure which illustrates the relationship between the X-ray intensity, the energy of the electron beam, and the acceleration voltage Flow chart for explaining the operation in the X-ray emission condition setting process The figure explaining the structure of the structure manufacturing system by embodiment Flowchart explaining processing of structure manufacturing system The figure explaining the mass detection of the to-be-measured object by a modification The figure which shows the structure of the X-ray apparatus by a modification.

An X-ray apparatus according to an embodiment of the present invention will be described with reference to the drawings. The X-ray apparatus irradiates the object to be measured with X-rays and detects transmitted X-rays transmitted through the object to be measured, thereby acquiring non-destructive internal information (for example, internal structure) of the object to be measured. When an object to be measured is an industrial part such as a mechanical part or an electronic part, the X-ray apparatus is called an industrial X-ray CT inspection apparatus for inspecting an industrial part.
Further, the present embodiment is for specifically describing the purpose of the invention, and does not limit the present invention unless otherwise specified.

FIG. 1 is a diagram showing an example of the configuration of an X-ray apparatus 100 according to the present embodiment. For convenience of explanation, a coordinate system consisting of an X axis, a Y axis, and a Z axis is set as shown.
The X-ray apparatus 100 includes a housing 1, an X-ray source 2, a placement unit 3, a detector 4, a control device 5, a display monitor 6, and a frame 8. The housing 1 is disposed on a floor surface of a factory or the like so as to be substantially parallel (horizontal) to the XZ plane, and inside the X-ray source 2, the placement unit 3, the detector 4, and the frame 8. And is housed. The housing 1 contains lead as a material in order to prevent X-rays from leaking to the outside.

The X-ray source 2 is an X-ray that spreads in a conical shape along the optical axis Zr parallel to the Z-axis with the emission point Q shown in FIG. (A so-called cone beam) is emitted. The exit point Q corresponds to the focal spot of the X-ray source 2. That is, the optical axis Zr connects the exit point Q, which is the focus spot of the X-ray source 2, and the center of the imaging region of the detector 4 described later. It should be noted that the X-ray source 2 is not limited to one that emits X-rays in a conical shape, but one that emits fan-shaped X-rays (so-called fan beams) or linear X-rays (so-called pencil beams) is also one aspect of the present invention. Included in embodiments. The X-ray source 2 emits at least one of, for example, an ultra soft X-ray of about 50 eV, a soft X-ray of about 0.1 to 2 keV, an X-ray of about 2 to 20 keV, and a hard X-ray of about 20 to 100 keV Can do. The details of the X-ray source 2 will be described later.

The mounting unit 3 includes a mounting table 30 on which the object to be measured S is mounted, a mass detector 31 provided on the mounting table 30, a rotation driving unit 32, a Y-axis moving unit 33, an X-axis moving unit 34, and And a manipulator unit 36 including a Z-axis moving unit 35, and is provided closer to the Z-axis + side than the X-ray generation unit 2. The mounting table 30 is rotatably provided by the rotation drive unit 32, and moves together when the rotation axis Yr by the rotation drive unit 32 moves in the X-axis, Y-axis, and Z-axis directions. The mass detector 31 is configured by, for example, a load cell, detects the mass of the measurement object S placed on the mounting table 30, and outputs the detected mass to the control device 5.

The rotation drive unit 32 is constituted by, for example, an electric motor or the like, and is parallel to the Y axis and passes through the center of the mounting table 30 by a rotational force generated by an electric motor controlled and driven by the control device 5 described later. The mounting table 30 is rotated with the axis to be rotated as the rotation axis Yr. The Y-axis moving unit 33, the X-axis moving unit 34, and the Z-axis moving unit 35 are controlled by the control device 5 so that the measured object S is positioned within the irradiation range of the X-rays emitted from the X-ray source 2. Then, the mounting table 30 is moved in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. Further, the Z-axis drive unit 35 is controlled by the control device 5 so that the distance from the X-ray source 2 to the object S to be measured is a distance at which the object S in the captured image has a desired magnification. The mounting table 30 is moved in the Z-axis direction.

The detector 4 is provided on the Z axis + side from the X-ray source 2 and the mounting table 30. That is, the mounting table 30 is provided between the X-ray source 2 and the detector 4 in the Z-axis direction. The detector 4 has an incident surface 41 parallel to the XY plane, and X-rays including transmitted X-rays emitted from the X-ray source 2 and transmitted through the measurement object S placed on the mounting table 30 are incident. Incident on the surface 41. The detector 4 includes a scintillator portion containing a known scintillation substance, a photomultiplier tube, a light receiving portion, and the like. The detector 4 converts X-ray energy incident on the incident surface 41 of the scintillator portion into visible light, ultraviolet light, or the like. The light energy is converted into light energy, amplified by a photomultiplier tube, the amplified light energy is converted into electric energy by the light receiving unit, and is output to the control device 5 as an electric signal. The detector 4 may convert incident X-ray energy into electric energy without converting it into light energy, and output the electric energy as an electric signal. The detector 4 has a structure in which a scintillator section, a photomultiplier tube, and a light receiving section are each divided into a plurality of pixels, and these pixels are two-dimensionally arranged. Thereby, the intensity distribution of the X-rays radiated from the X-ray source 2 and passed through the object to be measured S can be acquired at once. The detector 4 may have a structure in which the scintillator portion is formed directly on the light receiving portion (photoelectric conversion portion) without providing a photomultiplier tube.

The frame 8 supports the X-ray source 2, the placement unit 3, and the detector 4. The frame 8 is manufactured with sufficient rigidity. Therefore, it is possible to stably support the X-ray source 2, the placement unit 3, and the detector 4 while acquiring the projection image of the measurement object S. Further, the frame 8 is supported by a vibration isolation mechanism 81 to prevent vibration generated outside from being transmitted to the frame 8 as it is.

The control device 5 includes a microprocessor, peripheral circuits, and the like. The control device 5 reads and executes a control program stored in advance in a storage medium (not shown) (for example, a flash memory), thereby executing the control of the X-ray device 100. Control each part. The control device 5 includes an X-ray control unit 51, a movement control unit 52, an image generation unit 53, an image reconstruction unit 54, and a configuration information acquisition unit 55. The X-ray control unit 51 controls the operation of the X-ray source 2, and the movement control unit 52 controls the movement operation of the manipulator unit 36. The image generation unit 53 generates X-ray projection image data of the object S to be measured based on the electrical signal output from the detector 4, and the image reconstruction unit 54 controls the manipulator unit 36 and has different projection directions. Based on the projection image data of the measurement object S, a known image reconstruction process is performed to generate a reconstructed image. By the image reconstruction process, three-dimensional data that is the internal structure (cross-sectional structure) of the DUT S is generated. In this case, the image reconstruction process includes a back projection method, a filtered back projection method, a successive approximation method, and the like.

The configuration information acquisition unit 55 acquires the configuration information of the measurement object S. As the configuration information, information that can specify the three-dimensional shape and internal structure of the object S to be measured, that is, the amount of X-rays that are radiated from the X-ray source 2 by the object to be measured is a ratio (absorption to the unit propagation length). Information necessary for calculation with the coefficient) and the approximate dimensions of the object S to be measured. The X-ray control unit 51 described above outputs the X-rays emitted from the X-ray source 2 within the range of electric power specific to the apparatus, based on the configuration information of the measurement object S acquired by the configuration information acquisition unit 55. Control. Details of the processes of the X-ray control unit 51 and the configuration information acquisition unit 55 will be described later. The display monitor 6 is constituted by a liquid crystal monitor, for example, and displays an image corresponding to the three-dimensional data of the internal structure (cross-sectional structure) of the object S to be measured generated by the image reconstruction process.

Details of the X-ray source 2 and the X-ray control unit 51 of the control device 5 will be described with reference to FIG. FIG. 2 is a diagram schematically showing the configuration of the X-ray source 2. The X-ray source 2 includes a Wehnelt power source 20, a filament 21, a target 22, a Wehnelt electrode 23, an electro-optic member 25, and a high voltage application unit 26. In the X-ray source 2, the filament 21, the electron optical member 25, and the target 22 are arranged in this order along the electron beam emission direction.

The Wehnelt power supply 20 applies a negative bias voltage to the Wehnelt electrode 23 with respect to the filament 21. The filament 21 includes, for example, tungsten and has a conical shape sharpened toward the target 22. A filament heating power supply circuit 211 is provided at both ends of the filament 21. The filament heating power supply circuit 211 heats the filament 21 by passing a current through the filament 21. The filament 21 is heated by being energized by the filament heating power supply circuit 211 in a state where a negative charge is applied by the Wehnelt electrode 23, and an electron beam (thermoelectron) is directed toward the target 22 from the sharpened tip. And release. That is, the filament 21 functions as an electron beam generator for generating an electron beam.

The electron beam emitted from the filament 21 is converged by the electric field generated by the negative bias voltage applied to the Wehnelt electrode 23. The target 22 includes, for example, tungsten, and generates X-rays by collision of an electron beam emitted from the filament 21 or a change in the progress of the electron beam. 1 and 2 show an example in which the X-ray generator 2 according to the present embodiment is configured by a reflective X-ray generator, but it is configured by a transmissive X-ray generator. Cases are also included in one embodiment of the present invention.

Electron optical member 25 is arranged between filament 21 and target 22. The electron optical member 25 is constituted by a deflection coil or the like for focusing an electron beam. The electron optical member 25 focuses the electron beam from the filament 21 using the action of a magnetic field, and collides the electron beam with a partial region (X-ray focal point) of the target 22. The high voltage application unit 26 is electrically connected to the filament 21 and the target 22, and applies a negative voltage to the filament 21 with respect to the target 22. The high voltage application unit 26 is controlled by the X-ray control unit 51 of the control device 5 and applies a predetermined high DC voltage between the filament 21 and the target 22.

The filament 21 functions as a cathode that emits an electron beam as described above when a high voltage is applied by the high voltage application unit 26. In the present embodiment, as an example, the filament 21 is caused to function as a cathode while being directly heated. The present invention is not limited to this example, and may have a heater for heating the cathode separately in addition to the cathode. Further, an electron beam may be emitted by forming a strong electric field around the cathode without heating the cathode. The electron beam emitted from the filament 21 toward the target 22 is focused by the Wehnelt electrode 23, accelerated by the high voltage applied by the high voltage application unit 26, and travels toward the target 22. That is, the potential difference between the filament 21 and the target 22 acts as an acceleration voltage for accelerating the electron beam. The electron beam is focused by the electron optical member 25, and the electron beam collides with the target 22 disposed at the convergence position (focal spot) of the electron beam to generate X-rays from the target 22.

The X-ray apparatus 100 according to the present embodiment projects the measurement object S in accordance with the specification of the shape and material of the measurement object S before irradiating the measurement object S with X-rays and starting measurement. X-ray emission condition setting processing for automatically setting X-ray output suitable for acquisition of image data is performed. In the X-ray emission condition setting process, the configuration information acquisition unit 55 calculates the density of the measurement object S using the mass of the measurement object S placed on the mounting table 30 and the volume of the measurement object S. A configuration information acquisition process is performed for estimating the material of the object to be measured S based on the calculated density and estimating or acquiring the dimension information of the object to be measured S, in particular, the dimension information in the direction matching the X-ray propagation direction. The X-ray control unit 51 determines at least one of the acceleration voltage applied by the high voltage application unit 26 of the X-ray source 2 between the filament 21 and the target 22 and the amount of current to the filament 21 according to the result of the configuration information acquisition process. X-ray output setting processing to be set is performed. Hereinafter, the configuration information acquisition process by the configuration information acquisition unit 55 and the X-ray output setting process by the X-ray control unit 51 will be described separately. The following process is started when the user places the object to be measured S on the mounting table 30 and operates an operation member (not shown) to instruct the start of the X-ray emission condition setting process.

-Configuration information acquisition process-
The configuration information acquisition unit 55 uses the mass of the measurement object S detected by the mass detector 31 when the measurement object S is placed on the mounting table 30 in the configuration information acquisition process.
The configuration information acquisition unit 55 uses projection image data of the measurement object S obtained by irradiating the measurement object S with X-rays from the X-ray source 2, that is, shape information representing the shape of the measurement object S. The volume of the measurement object S is calculated. In this case, the shape information is obtained by emitting X-rays from the X-ray source 2 every time the measured object S rotates by a predetermined angle while rotating the measured object S around the rotation axis Yr by the rotation driving unit 32. It is calculated from a plurality of projection image data for each rotation of a predetermined angle generated by the image generation unit 53.

For example, as shown in FIG. 3A, a case where the shape information of the measurement object S having a rectangular parallelepiped shape is acquired is taken as an example. FIG. 3B shows the positional relationship between the object to be measured S, the X-ray source 2 and the detector 4 as viewed from the Y axis + side (ie, from above) at the start of rotation, and FIG. 3 shows the positional relationship between the measurement object S, the X-ray source 2 and the detector 4 as viewed from the Y axis + side (that is, from above) after being rotated 90 degrees from the state 3 (b). FIG. 3B and FIG. 3C show the positional relationship in the XZ plane. 3D schematically shows the projection image data I1 acquired in the state of FIG. 3B, and FIG. 3E schematically shows the projection image data I2 acquired in the state of FIG. Indicate. Using the projection image data I1 shown in FIG. 3D, that is, shape information, the configuration information acquisition unit 55 performs edge detection and the like on the projection image data I1 to thereby detect the length H and the length of the object S to be measured. D is calculated. Using the projection image data I2 shown in FIG. 3E, that is, the shape information, the configuration information acquisition unit 55 calculates the length W of the measurement object S by performing edge detection or the like on the projection image data I2. To do. The configuration information acquisition unit 55 calculates the volume of the measurement object S using the calculated lengths H, W, and D. In the above description, for the purpose of simple explanation, two representative projection image data are shown as representatives, and the volume and approximate dimensions of the measurement object S are calculated. By increasing the number of projection image data generated by setting the predetermined angle small and increasing the number of detected edges, that is, the number of external shapes of the measurement object S, the volume of the measurement object S can be calculated more accurately.

The predetermined angle may be the same regardless of the external shape of the object S to be measured, or may be variable according to the external shape of the object S to be measured, for example, when the object S has a complicated external shape. May be set to a small value, and may be set to a large value in the case of a simple external shape. Further, the total rotation angle of the measurement object S for obtaining the shape information can be calculated as a dimension of the measurement object S corresponding to the maximum transmission distance when X-rays described later pass through the measurement object S. Thus, it can be determined as appropriate according to the structure of the object S to be measured, and the total rotation angle may be 180 degrees at the maximum. In addition, the configuration information acquisition unit 55 calculates the volume of the object S to be measured using the reconstructed image generated by the image reconstruction unit 54 instead of the projection image data. It is.

The configuration information acquisition unit 55 calculates the density of the measurement object S using the mass of the measurement object S detected by the mass detector 31 and the volume of the measurement object S calculated as described above. Based on the calculated density, the material of the object S to be measured is estimated. When the material of the device under test S is estimated, the configuration information acquisition unit 55 calculates the absorption coefficient of the device under test S. The relationship between the density of the object to be measured S and the material and the relationship between the density of the object to be measured S and the absorption coefficient are stored in advance in a predetermined storage area (not shown) in the form of a table or the like. The configuration information acquisition unit 55 estimates the material of the device under test S by referring to the table based on the calculated density of the device under test S. Then, the configuration information acquisition unit 55 calculates the absorption coefficient of the device under test S with reference to the table based on the estimated material of the device under test S.

FIG. 4 shows an example of the above table. FIG. 4A is an example of a table showing the relationship between the density of the object to be measured S, the material, and the absorption coefficient. As shown in FIG. 4A, in the present embodiment, density d1 (for example, 1.0 ≦ d1 <2.0 [g / cm ³ ]) and resin, density d2 (for example, 2.0 ≦ d2 < 2.5 [g / cm ³ ]) and glass, density d3 (for example, 2.5 ≦ d3 <5 [g / cm ³ ]) and mineral, and density d4 (for example, 2.0 ≦ d4 <5 [g / cm ^3]. ]) And light metal, density d5 (for example, d5 ≧ 5 [g / cm ³ ]) and heavy metal are associated with each other. As shown in FIG. 4A, in this embodiment, resin and absorption coefficient μ1, glass and absorption coefficient μ2, mineral and absorption coefficient μ3, light metal and absorption coefficient μ4, and heavy metal and absorption coefficient μ5 are associated with each other. ing.

When the calculated density of the measured object S is in the range of d1, the configuration information acquisition unit 55 estimates the material of the measured object S as resin, and the calculated density of the measured object S is in the range of d2. In this case, the material of the object to be measured S is estimated to be glass, and when the calculated density of the object to be measured S is in the range of d3, the material of the object to be measured S is estimated to be mineral and the calculated object to be measured is calculated. When the density of S is in the range of d4, the material of the object to be measured S is estimated as a light metal, and when the calculated density of the object to be measured S is in the range of d5, the material of the object to be measured S is estimated as a heavy metal. To do. The configuration information acquisition unit 55 refers to the estimated material of the measured object S and refers to the table of FIG. 4A to select the absorption coefficient, thereby obtaining the absorption coefficient of the measured object S.

The configuration information acquisition unit 55 calculates the absorption coefficient without estimating the material from the calculated density of the measured object S, instead of obtaining the absorption coefficient by estimating the material from the calculated density of the measured object S. What is determined is also included in one embodiment of the present invention. In this case, as shown in FIG. 4B, the configuration information acquisition unit 55 can obtain the absorption coefficient from the calculated density of the measurement object S using a table in which the density and the absorption coefficient are associated with each other. 4A, instead of associating a rough material with a density as shown in FIG. 4A, the density range may be finely classified, and the material may be associated with a compound name or a metal element name. When it is known in advance that S is not manufactured from a plurality of types of materials, the material can be estimated more accurately.

The design information of the object to be measured S, for example, information that can specify the three-dimensional shape of the object S to be measured, such as three-dimensional CAD (horizontal width, vertical width, depth, apex position, etc.), information such as material, mass distribution, etc. In the case of being configured, the configuration information acquisition unit 55 uses this design information as configuration information. In this case, the configuration information acquisition unit 55 can calculate the absorption coefficient of the object to be measured S with reference to the table shown in FIG. 4 based on the material information included in the design information. If the design information does not include a part of the information necessary for calculating the absorption coefficient of the measurement object S, the above method may be used to compensate for the missing information. it can. For example, when the information regarding the material and mass of the measurement object S is not included, the configuration information acquisition unit 55 identifies the mass detected by the mass detector 31 and the three-dimensional shape included in the design information. What is necessary is just to calculate a density using the volume of the to-be-measured object S calculated using information, and to calculate an absorption coefficient with reference to the table shown in FIG.

-X-ray output setting process-
The X-ray control unit 51 uses the shape information acquired during the above-described configuration information acquisition process to calculate a transmission distance that passes through the measurement object S when the X-rays enter the detector 4. The transmission intensity of the radiated X-ray is calculated using the transmission distance and the absorption coefficient calculated by the configuration information acquisition unit 55. The X-ray control unit 51 sets the acceleration voltage so that the calculated X-ray transmission intensity can be obtained. Details will be described below.

The X-ray control unit 51 acquires the dimensions of each part of the measurement object S using the shape information, that is, the projection image data for each predetermined angle acquired in the configuration information acquisition process. In particular, the longest length of the object to be measured S, that is, the maximum transmission distance (hereinafter referred to as the maximum transmission distance) among the transmission distances when X-rays emitted from the X-ray source 2 pass through the object to be measured S. ) To get. The X-ray control unit 51 extracts the maximum length as the maximum transmission distance among the lengths of the edges in the X direction detected from each of the plurality of projection image data generated for each predetermined angle. Alternatively, for example, when the object to be measured S has a rectangular parallelepiped shape as illustrated in FIG. 3A, the X-ray control unit 51 calculates the lengths W and D calculated by the configuration information acquisition unit 55. And the length of the diagonal line (= (D ² + W ² ) ^1/2 ) on the plane parallel to the XZ plane of the object to be measured S may be calculated as the maximum transmission distance.

The X-ray control unit 51 uses the absorption coefficient of the measurement object S obtained based on the density or material calculated by the configuration information acquisition unit 55 and the above-described maximum transmission distance, and X-rays are measured. X-ray intensity required to pass through and enter the detector 4 is calculated. That is, the X-ray control unit 51 calculates the X-ray intensity using a known relational expression shown in the following expression (1).
I = I ₀ e ^−μL (1)
Here, I is the X-ray intensity incident on the detector 4, I ₀ is the X-ray intensity before entering the object to be measured S (initial X-ray intensity), and L is the maximum transmission distance.

The X-ray control unit 51 can generate a reconstructed image representing the intensity at which the X-ray intensity I determined by the above equation (1) can be received by the detector 4, that is, the internal structure (cross-sectional structure) of the object S to be measured. The initial X-ray intensity I ₀ is calculated so as to exceed the minimum X-ray intensity th _I required for the above. That is, the X-ray control unit 51 uses the absorption coefficient μ and the maximum transmission distance L of the measurement object S calculated by the configuration information acquisition unit 55, and the initial X-ray intensity I ₀ that satisfies the following equation (2). Is calculated.
I ₀ e ^−μL > th _I (2)
The X-ray intensity th _I is calculated in advance through experiments or the like and set as a predetermined value.

The X-ray control unit 51 calculates the minimum value among the X-ray intensities I ₀ satisfying the above formula (2), that is, the minimum transmission intensity I _{0 min,} and the intensity of the X-rays when emitted from the X-ray source 2 is The acceleration voltage is set so that the minimum transmission intensity is 10 _min . It is known that the X-ray intensity and the electron beam energy, that is, the acceleration voltage have a relationship as shown in FIG. 5, for example. FIG. 5 shows a case where it is assumed that the X-ray intensity I ₀ satisfying the equation (2) calculated by the X-ray control unit 51 is included in the region R _I0 surrounded by the broken line. The X-ray control unit 51 determines, as the minimum transmission intensity I _{0 min} , the characteristic X-ray intensity that is minimum among the X-ray intensity I ₀ included in the region R _I0 . In the example shown in FIG. 5, the voltage for obtaining the minimum transmission intensity I _{0 min} is 150 [kV], so the X-ray controller 51 sets this voltage as the acceleration voltage. Data indicating the relationship between the X-ray intensity and the acceleration voltage is stored in a predetermined storage area in advance in a table format, for example, and the X-ray control unit 51 sets an acceleration voltage necessary for obtaining the calculated minimum transmission intensity I _{0 min.} calculate. When the X-ray control unit 51 calculates the acceleration voltage as described above, the X-ray control unit 51 calculates a current value corresponding to the acceleration voltage within the range of power inherent to the apparatus, and sets it as the amount of current to the filament heating power supply circuit 211. .

The X-ray emission condition setting process by the X-ray apparatus 100 will be described with reference to the flowchart of FIG. Each process shown in the flowchart of FIG. 6 is performed by executing a program in the control device 5. This program is stored in a memory (not shown), and is activated by the control device 5 when the measurement object S is placed on the mounting table 30 and the start of the X-ray emission condition setting process is instructed by the user. Executed.

In step S0, it is determined whether or not the design information of the device under test S exists. If design information exists, an affirmative determination is made in step S0 and the process proceeds to step S5 described later. If design information does not exist, a negative determination is made in step S0 and the process proceeds to step S1. In step S1, based on the output from the mass detector 31, the mass of the object S to be measured is acquired, and the process proceeds to step S2. In step S2, the object to be measured S is rotated about the rotation axis Yr by rotating the rotation drive unit 32, and X-rays are emitted from the X-ray source 2 at every predetermined angle. The shape information is acquired by generating data, and the process proceeds to step S3. In step S3, the volume of the measurement object S is calculated using the shape information, and the process proceeds to step S4. Note that the order of Step S1 and Steps S2 and S3 may be reversed, that is, after calculating the volume of the object S, the mass of the object S may be acquired. Or you may perform step S1 and step S2 and S3 simultaneously, ie, acquisition of the mass of to-be-measured object S, and calculation of the shape information containing volume information simultaneously.

In step S4, the density of the measurement object S is calculated using the mass and volume of the measurement object S, and the process proceeds to step S5. In step S5, the material of the object to be measured S is estimated based on the calculated density, and the process proceeds to step S6. In addition, when calculating the absorption coefficient of the to-be-measured object S directly from the density of the to-be-measured object S calculated as mentioned above, step S5 is skipped and it progresses to step S6. In step S6, the absorption coefficient of the measured object S is calculated based on the estimated material of the measured object S, and the process proceeds to step S7. In step S7, the maximum transmission distance of the object to be measured S is acquired using the shape information, and the process proceeds to step S8. In step S8, the minimum transmission intensity I ₀ of X-rays is calculated based on the absorption coefficient of the measurement object S calculated in step S6 and the maximum transmission distance calculated in step S7, and the calculated minimum transmission intensity of X-rays is calculated. The acceleration voltage is calculated from I _{0 min} and the process is terminated.

When the acceleration voltage of X-rays radiated from the X-ray source 2 is set as described above, the measurement object S is measured. In the present embodiment, the movement control unit 52 of the control device 5 controls the X-axis moving unit 33, the Y-axis moving unit 34, and the Z-axis moving unit 35, and moves the mounting table 30 to the X-ray source 2. Then, the object S is moved relative to the detector 4 to position the measured object S at a desired photographing position or magnification. Then, the movement control unit 52 controls the rotation driving unit 32 to rotate the mounting table 30 that supports the DUT S about the rotation center axis Yr. While rotating the mounting table 30, the X-ray control unit 51 of the control device 5 controls the X-ray source 2 to irradiate the measurement object S with X-rays.

The detector 4 detects the transmitted X-rays that the mounting table 30 has transmitted through the measurement object S at every predetermined rotation angle, and outputs the detected X-rays to the control device 5 as an electric signal. The image generation unit 53 of the control device 5 generates projection image data of the object to be measured S for each projection direction based on the electrical signal acquired for each rotation angle of the mounting table 30. That is, the image generation unit 53 generates projection image data of the measurement object S from a plurality of different directions. The image reconstruction unit 54 of the control device 5 performs a known image reconstruction process using a plurality of projection image data of the object S to be measured, and three-dimensional data that is an internal structure (cross-sectional structure) of the object S to be measured. Is generated. In this case, the image reconstruction process includes a back projection method, a filtered back projection method, a successive approximation method, and the like. The generated three-dimensional data of the internal structure of the measured object S is displayed on the display monitor 6.

Embodiments of the structure manufacturing system including the X-ray apparatus 100 according to the above-described embodiment of the present invention will be described. The structure manufacturing system creates a molded product such as an electronic component including, for example, an automobile door portion, an engine portion, a gear portion, and a circuit board.

FIG. 7 is a block diagram showing an example of the configuration of the structure manufacturing system 400 according to the present embodiment. The structure manufacturing system 400 includes the X-ray apparatus 100 described in the embodiment, a design apparatus 410, a molding apparatus 420, a control system 430, and a repair apparatus 440.

The design device 410 is a device used by a user when creating design information related to the shape of a structure, and performs a design process for creating and storing design information. The design information is information indicating the coordinates of each position of the structure. The design information is output to the molding apparatus 420 and a control system 430 described later. The molding apparatus 420 performs a molding process for creating and molding a structure using the design information created by the design apparatus 410. In this case, the molding apparatus 420 includes an apparatus that performs at least one of laminating, casting, forging, and cutting represented by 3D printer technology.

The X-ray apparatus 100 performs a measurement process for measuring the shape of the structure molded by the molding apparatus 420. The X-ray apparatus 100 outputs information (hereinafter referred to as shape information) indicating the coordinates of the structure, which is a measurement result of the structure, to the control system 430. The control system 430 includes a coordinate storage unit 431 and an inspection unit 432. The coordinate storage unit 431 stores design information created by the design apparatus 410 described above.

The inspection unit 432 determines whether the structure molded by the molding device 420 is molded according to the design information created by the design device 410. In other words, the inspection unit 432 determines whether or not the molded structure is a good product. In this case, the inspection unit 432 reads the design information stored in the coordinate storage unit 431 and performs an inspection process for comparing the design information with the shape information input from the X-ray apparatus 100. The inspection unit 432 compares, for example, the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information as the inspection processing, and if the coordinates of the design information and the coordinates of the shape information match as a result of the inspection processing. It is determined that the product is a non-defective product molded according to the design information. If the coordinates of the design information do not match the coordinates of the corresponding shape information, the inspection unit 432 determines whether or not the coordinate difference is within a predetermined range, and if it is within the predetermined range, it can be restored. Judged as a defective product.

If it is determined that the defective product can be repaired, the inspection unit 432 outputs repair information indicating the defective portion and the repair amount to the repair device 440. The defective part is the coordinate of the shape information that does not match the coordinate of the design information, and the repair amount is the difference between the coordinate of the design information and the coordinate of the shape information in the defective part. The repair device 440 performs a repair process for reworking a defective portion of the structure based on the input repair information. The repair device 440 performs again the same process as the molding process performed by the molding apparatus 420 in the repair process.

The process performed by the structure manufacturing system 400 will be described with reference to the flowchart shown in FIG.
In step S11, the design device 410 is used when the structure is designed by the user. The design apparatus 410 creates and stores design information related to the shape of the structure by the design process, and the process proceeds to step S12. Note that the present invention is not limited to only the design information created by the design apparatus 410, and when design information already exists, the design information is acquired by inputting the design information and is included in one aspect of the present invention. It is. In step S12, the forming apparatus 420 creates and forms a structure based on the design information by the forming process, and proceeds to step S13. In step S13, the X-ray apparatus 100 performs a measurement process, measures the shape of the structure, outputs shape information, and proceeds to step S14.

In step S14, the inspection unit 432 performs an inspection process for comparing the design information created by the design apparatus 410 with the shape information measured and output by the X-ray apparatus 100, and the process proceeds to step S15. In step S15, based on the result of the inspection process, the inspection unit 432 determines whether the structure formed by the forming apparatus 420 is a non-defective product. If the structure is a non-defective product, that is, if the coordinates of the design information coincide with the coordinates of the shape information, an affirmative determination is made in step S15 and the process ends. If the structure is not a non-defective product, that is, if the coordinates of the design information do not match the coordinates of the shape information, or if coordinates that are not in the design information are detected, a negative determination is made in step S15 and the process proceeds to step S16.

In step S16, the inspection unit 432 determines whether or not the defective portion of the structure can be repaired. If the defective part is not repairable, that is, if the difference between the coordinates of the design information and the coordinates of the shape information in the defective part exceeds the predetermined range, a negative determination is made in step S16 and the process ends. If the defective part can be repaired, that is, if the difference between the coordinates of the design information and the shape information in the defective part is within a predetermined range, an affirmative determination is made in step S16 and the process proceeds to step S17. In this case, the inspection unit 432 outputs repair information to the repair device 440. In step S17, the repair device 440 performs a repair process on the structure based on the input repair information, and returns to step S3. As described above, the repair device 440 performs again the same processing as the molding processing performed by the molding device 420 in the repair processing.

According to the X-ray apparatus according to the above-described embodiment, the following operational effects can be obtained.
(1) In the X-ray apparatus 100, the X-ray control unit 51 of the control device 5 controls the output of X-rays radiated from the X-ray source 2 based on the configuration information of the device under test S. Therefore, it is not necessary for the user to set the X-ray output empirically depending on the appearance of the object S to be measured, for example, gloss or texture, and the optimum X-ray output is possible even for a user with little experience. Since the trial and error are not repeated to set the value, the operability is improved. Furthermore, since the X-ray output can be automatically set, the time required for measuring the object S to be measured is shortened, contributing to efficiency.

(2) The X-ray control unit 51 controls at least one of an acceleration voltage applied between the filament 21 and the target 22 to accelerate the electron beam and an amount of current to the filament 21. In particular, the X-ray control unit 51 controls the high voltage application unit 26 to apply the acceleration voltage between the filament 21 and the target 22. Therefore, it is possible to obtain an X-ray output necessary for acquiring an image of the internal structure of the device under test S within a range of power inherent to the apparatus.

(3) The configuration information acquisition unit 55 acquires the shape information of the measurement object S acquired using the mass of the measurement object S detected by the mass detector 31 and the projection image data generated by the image generation unit 53. Based on the above, the configuration information of the object S to be measured, that is, the absorption coefficient representing the ratio of X-rays absorbed by the object S to be measured is calculated. Therefore, it is possible to obtain an output necessary for the X-ray radiated from the X-ray source 2 to pass through the device under test S with various shapes.

(4) The X-ray control unit 51 calculates a transmission distance when the X-rays pass through the measurement object S based on the shape information, and is emitted from the X-ray source 2 based on the transmission distance and the absorption coefficient. Controls X-ray output. Specifically, the X-ray control unit 51 sets an acceleration voltage at which the minimum X-ray transmission intensity is equal to or greater than a predetermined value based on the maximum passing distance of the DUT. Therefore, even if the length of the measurement object S in the Z-axis direction changes due to the rotation of the measurement object S relative to the X-ray source 2 and the detector 4, the X-ray source 2 An output necessary for the emitted X-rays to pass through the object to be measured S can be obtained.

(5) The configuration information acquisition unit 55 estimates the material of the device under test S based on the mass and volume of the device under test S, and calculates an absorption coefficient corresponding to the estimated material. The rate at which the X-rays are absorbed by the structure is different when the material is different even at the same transmission distance. Therefore, by controlling the X-ray output in consideration of the material of the object S to be measured, High-quality reconstructed images can be acquired.

(6) When the object to be measured S rotates relative to the X-ray source 2 and the detector 4 by the rotation driving unit 32, the object is radiated from the X-ray source and transmitted through the object to be measured S every rotation of a predetermined angle. Then, based on the X-rays detected by the detector 4, the image generation unit 53 generates projection image data that is shape information of the object S to be measured. Therefore, even when design information (for example, CAD data) of the device under test S cannot be obtained, an X-ray output suitable for generating a reconstructed image can be obtained based on the shape of the device under test S. it can.

(7) The X-ray apparatus 100 of the structure manufacturing system 400 performs a measurement process for acquiring shape information of the structure created by the molding apparatus 420 based on the design process of the design apparatus 410, and performs an inspection unit of the control system 430. Reference numeral 432 performs an inspection process for comparing the shape information acquired in the measurement process with the design information created in the design process. Therefore, it is possible to determine whether or not a structure is a non-defective product created according to design information by inspecting the defect of the structure and information inside the structure by nondestructive inspection. Contribute to.

(8) The repair device 440 performs the repair process for performing the molding process again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same processing as the molding process can be performed again on the structure, which contributes to the manufacture of a high-quality structure close to design information.

The following modifications are also within the scope of the present invention, and one or a plurality of modifications can be combined with the above-described embodiment.
(1) A plurality of mass detectors 31 may be provided on the mounting table 30 to detect the mass of each partial region of the measurement object S. FIG. 9 shows an example in which four mass detectors 311, 312, 313, and 314 are provided, and configuration information acquisition processing in this case will be described. As shown in FIG. 9A, the mass detector 311 detects the mass of the measurement object S that is applied to the region 301 in the mounting table 30. The mass detector 312 detects the mass of the measurement object S applied to the region 302 in the mounting table 30. The mass detector 313 detects the mass of the measurement object S applied to the region 303 in the mounting table 30. The mass detector 314 detects the mass of the measurement object S applied to the region 304 in the mounting table 30. That is, as shown in FIG. 9B, the mass distribution of the measurement object S placed on the placement table 30 can be estimated.

The configuration information acquisition unit 55 (see FIG. 1) has a bias in the density, material, and the like of the measurement object S based on the mass distribution of the measurement object S estimated from the outputs from the mass detectors 311 to 314. The bias can be estimated. For example, when the mass detected by the mass detector 311 is larger than those of the other mass detectors 312 to 314, the partial region Sp indicated by diagonal lines in the object S to be measured shown in FIG. It can be estimated that the material is different in density compared to the other partial regions of the measurement object S. In this case, as described in the case of the embodiment, the configuration information acquisition unit 55 cannot transmit X-rays through the partial region Sp with the acceleration voltage calculated based on the average average density of the object S to be measured. there is a possibility. The configuration information acquisition unit 55 has an average mass (that is, a mass detector 311) of the entire measurement object S so that X-rays can be transmitted even in such a partial region Sp where the mass is biased. Instead of the sum of the masses detected at ˜314, the mass detected by the mass detector 311 may be regarded as the total mass of the object to be measured S and used for calculating the absorption coefficient. Alternatively, the configuration information acquisition unit 55 calculates the absorption coefficient based on the overall average mass of the device under test S according to the ratio of the mass of the partial region Sp to the overall average mass of the device under test S. May be corrected. In this case, the measurement object S may be measured by emitting X-rays with the acceleration voltage calculated by the X-ray control unit 51 based on the corrected absorption coefficient, or the entire average of the measurement object S may be measured. Measurement is performed by emitting X-rays with an acceleration voltage calculated using an absorption coefficient based on a typical mass, and X-rays are emitted with an acceleration voltage calculated based on the corrected absorption coefficient. May be. Further, the shape information immediately above the region 301 of the object to be measured S is calculated from a plurality of projection image data, and the partial dimension information of the object to be measured S immediately above the region 301 and the mass detector 311 detect the shape information. From the mass, an estimated amount of X-ray absorption in the region 301 (a product of an absorption coefficient obtained from the material of the measurement object S estimated to be directly above the region 301 and the estimated X-ray propagation distance) is obtained. . Similarly, from the partial dimension information of the measurement object S immediately above the other regions 302, 303, and 304 and the mass information obtained by the mass detectors 312, 313, and 314, the respective regions 302, 303, and 304 are obtained. The estimated absorption amount of X-rays immediately above is obtained. By accumulating these absorption amounts along the direction in which X-rays propagate, the predicted total absorption amount may be obtained, and the acceleration voltage and current amount during X-ray measurement may be obtained.

(2) In the configuration information acquisition process, instead of acquiring the shape information of the object S to be measured using the projection image data or the reconstructed image, the configuration information is acquired using the imaging device. It is included in one aspect. As shown in FIG. 10, the X-ray apparatus 100 includes an imaging apparatus 500 including an imaging element configured by a CMOS, a CCD, or the like. The imaging device 500 is provided on the ceiling portion (Y-axis + side inner wall surface) of the housing 1 and is mounted on the mounting table 30 from the Y-axis direction substantially orthogonal to the X-ray projection direction (Z-axis). An image signal generated by imaging the outer shape of the measured object S is output to the control device 5. The configuration information acquisition unit 55 performs a known edge detection process or the like on the input image signal, and extracts the contour of the measurement object S on the image signal. The configuration information acquisition unit 55 calculates the volume of the measurement object S using the extracted outline of the measurement object S. Thereafter, similarly to the embodiment, the configuration information acquisition unit 55 calculates the density of the measurement object using the calculated volume and the mass of the measurement object S detected by the mass detector 31, and estimates the material. And the absorption coefficient is calculated. The imaging apparatus 500 can shoot a wide range so that the entire measured object S can be imaged regardless of the position of the measured object S that is changed by the Y-axis moving unit 33 and the X-axis moving unit 34. It is preferable that it is a thing. Alternatively, the imaging device 500 may be provided so as to be able to move in synchronization with the movement of the Y-axis moving unit 33 and the X-axis moving unit 34. Therefore, when the imaging apparatus 500 images the measurement object S from the Y-axis direction, the length of the measurement object S along the Z-axis direction that is the X-ray propagation direction can be accurately detected.

The shape information is not limited to that obtained by the imaging apparatus 500. For example, measurement is performed using a projector that projects an optical image of the object S to be measured on a screen, a contact or scanning laser probe using a touch probe, or a shape measuring device that is an optical non-contact three-dimensional measuring device. Information obtained by measuring the object S is also included in one embodiment of the present invention.

(3) The mounting table 30 on which the measurement object S is mounted is moved in the X-axis, Y-axis, and Z-axis directions by the Y-axis moving unit 33, the X-axis moving unit 34, and the Z-axis moving unit 35. It is not limited to things. The mounting table 30 does not move in the X-axis, Y-axis, and Z-axis directions, and the X-ray source 2 and the detector 4 are moved in the X-axis, Y-axis, and Z-axis directions, so that What relatively moves the radiation source 2 and the detector 4 is also included in one aspect of the present invention.
(4) Instead of controlling the acceleration voltage applied by the high voltage application unit 26 of the X-ray source 2 and the amount of current to the filament heating power supply circuit 211, the emission end (Z axis + side) of the X-ray source 2 In the present invention, the X-ray detection output detected by the detector 4 is controlled so as not to be saturated by changing the spectral distribution of the X-rays incident on the measurement object S using a filter or the like. It is included in one aspect. In particular, the material and thickness of the filter should be selectable so as to change the X-ray spectrum so that the maximum X-ray dose and the minimum X-ray dose reaching the detector 4 are within the dynamic range of the detector 4. Is preferred.

As long as the characteristics of the present invention are not impaired, the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .

2 ... X-ray source, 3 ... mounting part, 4 ... detector, 5 ... control device,
21 ... Filament, 22 ... Target, 26 ... High voltage application part,
30 ... Placing table, 31 ... Mass detector, 32 ... Rotation drive unit,
33 ... Y-axis moving part, 34 ... X-axis moving part, 35 ... Z-axis moving part, 36 ... Manipulator part,
51 ... X-ray control unit, 52 ... Movement control unit, 53 ... Image generation unit,
54 ... Image reconstruction unit, 55 ... Configuration information acquisition unit,
211 ... Power supply circuit for heating filament,
100 ... X-ray apparatus, 400 ... Structure manufacturing system,
410 ... design device, 420 ... molding device, 430 ... control system,
432 ... Inspection unit, 440 ... Repair device, 500 ... Imaging device

Claims (15)

1. An X-ray source emitting X-rays;
   A detector that detects the X-rays emitted from the X-ray source and passed through the object to be measured;
   An X-ray apparatus comprising: an X-ray source control unit that controls an output of the X-ray emitted from the X-ray source based on configuration information of the object to be measured.
2. The X-ray apparatus according to claim 1,
   The X-ray source has an electron beam generating unit that generates the electron beam, and a target that generates X-rays when the electron beam from the electron beam generating unit reaches,
   The X-ray source control unit controls at least one of an acceleration voltage applied between the electron beam generation unit and the target to accelerate the electron beam and a current amount to the electron beam generation unit. X-ray equipment.
3. The X-ray apparatus according to claim 2,
   The X-ray source further includes a voltage application unit for applying the acceleration voltage,
   The X-ray source control unit is an X-ray apparatus that controls the voltage application unit.
4. The X-ray apparatus according to any one of claims 1 to 3,
   A mass detector for detecting the mass of the object to be measured;
   A shape information acquisition unit for acquiring shape information of the object to be measured;
   Configuration information for acquiring the configuration information of the measurement object based on the mass of the measurement object detected by the mass detection unit and the shape information of the measurement object acquired by the shape information acquisition unit An X-ray apparatus further comprising an acquisition unit.
5. The X-ray apparatus according to claim 4,
   The configuration information acquisition unit is based on the mass of the measurement object detected by the mass detection unit and the volume of the measurement object calculated based on the shape information acquired by the shape information acquisition unit. An X-ray apparatus that calculates a ratio at which the X-ray is absorbed by the object to be measured, and obtains the configuration information.
6. The X-ray apparatus according to claim 5,
   The X-ray source control unit calculates a passing distance when the X-ray passes through the object to be measured based on the shape information acquired by the shape information acquiring unit, and the passing distance and the configuration information An X-ray apparatus that controls the output of the X-rays radiated from the X-ray source based on the ratio of the X-rays calculated by the acquisition unit.
7. The X-ray apparatus according to claim 6,
   The X-ray source control unit calculates a plurality of the passing distances at a plurality of locations of the object to be measured, and a minimum transmission intensity of the X-ray is a predetermined value based on a maximum passing distance among the plurality of passing distances. An X-ray apparatus for setting the acceleration voltage as described above.
8. The X-ray apparatus according to any one of claims 5 to 7,
   The configuration information acquisition unit is an X-ray apparatus that estimates a material of the object to be measured based on a mass and a volume of the object to be measured, and calculates a ratio at which the X-ray corresponding to the material is absorbed.
9. The X-ray apparatus according to any one of claims 4 to 8,
   A rotation drive unit for rotating the X-ray source and the detection unit relative to the object to be measured;
   When the object to be measured undergoes relative rotation by the rotation driving unit, the X-rays emitted by the X-ray source and transmitted through the object to be measured and detected by the detecting unit at every predetermined relative rotation angle. The shape information acquisition unit is an X-ray apparatus that acquires the shape information of the object to be measured based on detection information.
10. The X-ray apparatus according to any one of claims 4 to 8,
    An imaging device that captures an appearance of the object to be measured and outputs an image signal;
    The shape information acquisition unit is an X-ray apparatus that acquires the shape information using the image signal output from the imaging device.
11. The X-ray apparatus according to any one of claims 1 to 3,
    The configuration information is an X-ray apparatus configured by design information.
12. The X-ray apparatus according to any one of claims 1 to 11,
    A moving unit that moves the X-ray source and the detection unit relative to the object to be measured;
    A reconfiguration unit that generates internal structure information of the object to be measured based on a plurality of projection data detected by the detection unit in a state where the positions of the X-ray source and the detection unit are different with respect to the object to be measured; An X-ray apparatus provided.
13. Create design information about the shape of the structure,
    Create the structure based on the design information,
    The shape of the created structure is measured using the X-ray apparatus according to claim 1 to obtain shape information,
    A structure manufacturing method for comparing the acquired shape information and the design information.
14. In the manufacturing method of the structure according to claim 13,
    A method of manufacturing a structure, which is executed based on a comparison result between the shape information and the design information, and reworks the structure.
15. In the manufacturing method of the structure according to claim 14,
    The reworking of the structure is a structure manufacturing method in which the structure is created again based on the design information.
    

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