JP2021156578A

JP2021156578A - X-ray apparatus, x-ray image generation method and structure manufacturing method

Info

Publication number: JP2021156578A
Application number: JP2018122387A
Authority: JP
Inventors: 和弘矢野; Kazuhiro Yano
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2018-06-27
Filing date: 2018-06-27
Publication date: 2021-10-07
Also published as: WO2020004175A1

Abstract

To provide an X-ray apparatus capable of improving the resolution of phase image data and scattered image data.SOLUTION: An X-ray apparatus 100 includes: an X-ray source 2 that emits X-rays toward an object S to be measured; a shielding member 611 that has an opening through which X-rays pass, and shields X-rays other than the opening; a change part 613 that changes relative positions of the shielding member and the object to be measured in a direction intersecting a traveling direction Zr of the X-ray; a detector 4 that outputs an intensity distribution of X-rays that have passed through the opening and the object to be measured as an output signal at multiple positions changed by the change part; and a generator 53 that uses the output signal from the detector to generate information about the X-ray intensity distribution in a region smaller than the size along a direction of the opening.SELECTED DRAWING: Figure 1

Description

本発明は、Ｘ線装置、Ｘ線画像生成方法および構造物の製造方法に関する。 The present invention relates to an X-ray apparatus, an X-ray image generation method, and a method for manufacturing a structure.

従来から、被測定物にて偏向したＸ線の位相情報に基づいて、被測定物の内部構造の画像を生成するＸ線装置が知られている。Ｘ線の位相情報を取得するために、Ｘ線源および被測定物の間と、被測定物および検出器の間とにマスクを配置し、偏向したＸ線を計測するＸ線装置がある（たとえば特許文献１）。このようなＸ線装置で生成される被測定物の内部構造の画像の解像度（分解能）は遮蔽部材に設けられた開口部の大きさによって決まるが、開口部が小さい遮蔽部材を作成することが困難であるため、画像の高解像度化が困難である。 Conventionally, an X-ray apparatus has been known that generates an image of the internal structure of an object to be measured based on the phase information of X-rays deflected by the object to be measured. In order to acquire the phase information of X-rays, there is an X-ray apparatus that measures deflected X-rays by placing masks between the X-ray source and the object to be measured and between the object to be measured and the detector ( For example, Patent Document 1). The resolution of the image of the internal structure of the object to be measured generated by such an X-ray apparatus is determined by the size of the opening provided in the shielding member, but it is possible to create a shielding member having a small opening. Since it is difficult, it is difficult to increase the resolution of the image.

特許第５２８０３６１号公報Japanese Patent No. 5280361

第１の態様によると、Ｘ線装置は、被測定物へ向けてＸ線を出射するＸ線源と、前記Ｘ線を通過させる開口部を有し、前記開口部以外で前記Ｘ線を遮蔽する遮蔽部材と、前記Ｘ線の進行方向と交差する方向において、前記遮蔽部材と前記被測定物との間の相対的な位置を変更する変更部と、前記変更部により変更された複数の位置において、前記開口部および前記被測定物を通過した前記Ｘ線の強度分布を出力信号として出力する検出器と、前記検出器からの出力信号を用いて、前記開口部の前記方向に沿った大きさよりも小さい大きさの領域における前記Ｘ線の前記強度分布に関する情報を生成する生成部と、を備える。
第２の態様によると、Ｘ線画像生成方法は、被測定物へ向けてＸ線を出射することと、開口部を有する遮蔽部材により前記開口部にて前記Ｘ線を通過させることと、前記Ｘ線の進行方向と交差する方向において、前記遮蔽部材と前記被測定物との間の相対的な位置を変更すること、変更された複数の前記位置において、前記開口部および前記被測定物を通過した前記Ｘ線の強度分布を出力信号として出力することと、前記出力信号を用いて、前記開口部の前記方向に沿った大きさよりも小さい大きさの領域における前記Ｘ線の前記強度分布に関する情報を生成することと、を備える。 According to the first aspect, the X-ray apparatus has an X-ray source that emits X-rays toward an object to be measured and an opening through which the X-rays pass, and shields the X-rays other than the opening. A changing portion that changes the relative position between the shielding member and the object to be measured in a direction intersecting the traveling direction of the X-ray, and a plurality of positions changed by the changing portion. In, a detector that outputs the intensity distribution of the X-rays that have passed through the opening and the object to be measured as an output signal, and an output signal from the detector are used to increase the size of the opening along the direction. It includes a generation unit that generates information about the intensity distribution of the X-ray in a region having a size smaller than that of the X-ray.
According to the second aspect, the X-ray image generation method includes emitting X-rays toward an object to be measured, passing the X-rays through the openings by a shielding member having an openings, and the above-mentioned. Changing the relative position between the shielding member and the object to be measured in a direction intersecting the traveling direction of X-rays, and making the opening and the object to be measured at a plurality of changed positions. Regarding the output of the intensity distribution of the passed X-rays as an output signal and the intensity distribution of the X-rays in a region having a size smaller than the size along the direction of the opening using the output signal. It comprises generating information.

実施の形態によるＸ線装置の要部構成の一例を模式的に示す図である。It is a figure which shows typically an example of the main part structure of the X-ray apparatus according to embodiment. 光学ユニットの一例を模式的に示す図である。It is a figure which shows an example of an optical unit schematically. 画像データを生成する際のＸ線源と、第１光学素子の開口と、第２光学素子の開口と、被測定物と、検出器の画素との位置関係を拡大して模式的に示す図である。A diagram schematically showing an enlarged positional relationship between an X-ray source for generating image data, an aperture of the first optical element, an aperture of the second optical element, an object to be measured, and a pixel of a detector. Is. 画像データを生成する際のＸ線源と、第１光学素子の開口と、第２光学素子の開口と、被測定物と、検出器の画素との位置関係を拡大して模式的に示す図である。A diagram schematically showing an enlarged positional relationship between an X-ray source for generating image data, an aperture of the first optical element, an aperture of the second optical element, an object to be measured, and a pixel of a detector. Is. 実施の形態によるＸ線装置の動作を説明するフローチャートである。It is a flowchart explaining the operation of the X-ray apparatus according to embodiment. 微分位相画像データを生成する場合のシミュレーション結果を示す図である。It is a figure which shows the simulation result at the time of generating the differential phase image data. 実施の形態による構造物製造システムの構成を模式的に示すブロック図である。It is a block diagram which shows typically the structure of the structure manufacturing system by embodiment. 実施の形態による構造物製造システムが実行する処理を説明するフローチャートである。It is a flowchart explaining the process executed by the structure manufacturing system by embodiment.

図面を参照しながら、一実施の形態によるＸ線装置について説明する。Ｘ線装置は、被測定物にＸ線を照射して、被測定物を透過したＸ線を検出することにより、被測定物の内部情報（たとえば内部構造）等を被測定物を破壊することなく取得する。Ｘ線装置は、例えば、生体を被測定物として、生化学や医療等にも用いることができる。 An X-ray apparatus according to an embodiment will be described with reference to the drawings. The X-ray apparatus irradiates the object to be measured with X-rays and detects the X-rays transmitted through the object to be measured to destroy the internal information (for example, internal structure) of the object to be measured. Get without. The X-ray apparatus can be used in biochemistry, medical treatment, etc., using a living body as an object to be measured, for example.

図１は本実施の形態によるＸ線装置１００の構成の一例を示す図である。なお、説明の都合上、Ｘ軸、Ｙ軸、Ｚ軸からなる座標系を図示の通りに設定する。 FIG. 1 is a diagram showing an example of the configuration of the X-ray apparatus 100 according to the present embodiment. For convenience of explanation, the coordinate system including the X-axis, the Y-axis, and the Z-axis is set as shown in the figure.

Ｘ線装置１００は、筐体１と、Ｘ線源２と、載置部３と、検出器４と、制御装置５と、光学ユニット６とを備える。筐体１は、その下面が工場等の床面に実質的に平行（水平）となるように配置されている。筐体１の内部には、Ｘ線源２と、載置部３と、検出器４と、光学ユニット６とが収容される。筐体１は、Ｘ線が筐体１の外部に漏洩しないようにするため、Ｘ線遮蔽材料を含む。なお、Ｘ線遮蔽材料として鉛を含む。 The X-ray apparatus 100 includes a housing 1, an X-ray source 2, a mounting portion 3, a detector 4, a control device 5, and an optical unit 6. The housing 1 is arranged so that its lower surface is substantially parallel (horizontal) to the floor surface of a factory or the like. The X-ray source 2, the mounting portion 3, the detector 4, and the optical unit 6 are housed inside the housing 1. The housing 1 contains an X-ray shielding material in order to prevent X-rays from leaking to the outside of the housing 1. Lead is contained as an X-ray shielding material.

Ｘ線源２は、制御装置５による制御に応じて、図１に示す出射点Ｐを頂点としてＺ軸に平行な光軸Ｚｒに沿って、Ｚ軸＋方向へ向けてＸ線を放射する。この出射点Ｐは後述するＸ線源２の内部で加速、集束された電子線の焦点位置と一致する。すなわち、光軸Ｚｒは、Ｘ線源２の電子線の焦点位置である出射点Ｐと、後述する検出器４の撮像領域の中心とを結ぶ軸である。なお、Ｘ線源２から放射するＸ線は、円錐状に拡がるＸ線（いわゆるコーンビーム）、扇状のＸ線（いわゆるファンビーム）、および直線状のＸ線（いあわゆるペンシルビーム）のいずれでもよい。なお、ファンビームおよびペンシルビームを用いる場合は、被測定物Ｓ全体を検査するために、ビームと被測定物Ｓとを相対的に移動させるスキャン動作を行う必要がある。Ｘ線源２は、たとえば約５０ｅＶの超軟Ｘ線、約０．１〜２ｋｅＶの軟Ｘ線、約２〜２０ｋｅＶのＸ線および約２０ｋｅＶ〜数ＭｅＶの硬Ｘ線の少なくとも１つを照射する。 The X-ray source 2 emits X-rays in the Z-axis + direction along the optical axis Zr parallel to the Z-axis with the emission point P shown in FIG. 1 as the apex according to the control by the control device 5. This emission point P coincides with the focal position of the electron beam accelerated and focused inside the X-ray source 2 described later. That is, the optical axis Zr is an axis connecting the emission point P, which is the focal position of the electron beam of the X-ray source 2, and the center of the imaging region of the detector 4, which will be described later. The X-rays emitted from the X-ray source 2 are any of a conical X-ray (so-called cone beam), a fan-shaped X-ray (so-called fan beam), and a linear X-ray (so-called pencil beam). But it may be. When a fan beam and a pencil beam are used, it is necessary to perform a scanning operation in which the beam and the object S to be measured are relatively moved in order to inspect the entire object S to be measured. The X-ray source 2 irradiates at least one of, for example, about 50 eV ultrasoft X-rays, about 0.1 to 2 keV soft X-rays, about 2 to 20 keV X-rays, and about 20 keV to several MeV hard X-rays. ..

載置部３は、被測定物Ｓが載置される載置台３１と、回転駆動部３２、Ｘ軸移動部３３、Ｙ軸移動部３４およびＺ軸移動部３５からなるマニピュレータ部３６とを備え、Ｘ線源２よりもＺ軸＋側に設けられている。 The mounting unit 3 includes a mounting table 31 on which the object S to be measured is placed, and a manipulator unit 36 including a rotation driving unit 32, an X-ray moving unit 33, a Y-axis moving unit 34, and a Z-axis moving unit 35. , Is provided on the Z-axis + side of the X-ray source 2.

載置台３１は、回転駆動部３２により回転可能に設けられる。後述するように、回転駆動部３２による回転軸ＹｒがＸ軸、Ｙ軸、Ｚ軸方向に移動する際に、載置台３１はともに移動する。 The mounting table 31 is rotatably provided by the rotation driving unit 32. As will be described later, when the rotation axis Yr by the rotation drive unit 32 moves in the X-axis, Y-axis, and Z-axis directions, the mounting table 31 moves together.

回転駆動部３２は、たとえば電動モータ等によって構成され、後述する制御装置５により制御されて駆動した電動モータが発生する回転力によって、載置台３１を回転させる。載置台３１の回転軸Ｙｒは、Ｙ軸に平行、かつ、載置台３１の中心を通過する。 The rotation drive unit 32 is composed of, for example, an electric motor or the like, and rotates the mounting table 31 by the rotational force generated by the electric motor controlled and driven by the control device 5 described later. The rotation axis Yr of the mounting table 31 is parallel to the Y axis and passes through the center of the mounting table 31.

Ｘ軸移動部３３、Ｙ軸移動部３４およびＺ軸移動部３５は、制御装置５により制御されて、載置台３１をＸ軸方向、Ｙ軸方向およびＺ軸方向にそれぞれ移動させる。Ｚ軸移動部３５は、制御装置５により制御されて、Ｘ線源２から被測定物Ｓまでの距離が、撮影される画像における被測定物Ｓの拡大率に応じた距離となるように載置台３１をＺ軸方向に移動させる。 The X-axis moving unit 33, the Y-axis moving unit 34, and the Z-axis moving unit 35 are controlled by the control device 5 to move the mounting table 31 in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively. The Z-axis moving unit 35 is controlled by the control device 5 so that the distance from the X-ray source 2 to the object to be measured S is a distance corresponding to the enlargement ratio of the object to be measured S in the captured image. The pedestal 31 is moved in the Z-axis direction.

検出器４は、載置台３１よりもＺ軸＋側に設けられている。すなわち、載置台３１は、Ｚ軸方向において、Ｘ線源２と検出器４との間に設けられる。検出器４は、公知のシンチレーション物質を含むシンチレータ部、光電子増倍管、ＣＣＤ等の受光部等によって構成され、Ｘ線源２から出射され、載置台３１上に載置された被測定物Ｓを透過した透過Ｘ線を含むＸ線を受光する。検出器４は、受光したＸ線のエネルギーを光エネルギーに変換した後、当該光エネルギーを電気エネルギーに変換し、電気信号として出力する。 The detector 4 is provided on the Z-axis + side of the mounting table 31. That is, the mounting table 31 is provided between the X-ray source 2 and the detector 4 in the Z-axis direction. The detector 4 is composed of a scintillator unit containing a known scintillation substance, a photomultiplier tube, a light receiving unit such as a CCD, and the like, and is emitted from an X-ray source 2 and placed on a mounting table 31. Receives X-rays including transmitted X-rays that have passed through. The detector 4 converts the received X-ray energy into light energy, then converts the light energy into electric energy, and outputs the light energy as an electric signal.

なお、検出器４は、入射するＸ線のエネルギーを光エネルギーに変換することなく電気信号に変換して出力してもよい。また、検出器４は、複数の画素を有しており、それらの画素は２次元的に配列されている。これにより、Ｘ線源２から放射され、被測定物Ｓを通過したＸ線の２次元的な強度分布データを一括して取得できる。従って、１回の撮影で被測定物Ｓの全体の投影像を取得することができる。 The detector 4 may convert the energy of the incident X-ray into an electric signal and output it without converting it into light energy. Further, the detector 4 has a plurality of pixels, and these pixels are arranged two-dimensionally. As a result, the two-dimensional intensity distribution data of the X-rays emitted from the X-ray source 2 and passed through the object S to be measured can be collectively acquired. Therefore, the entire projected image of the object S to be measured can be obtained by one shooting.

光学ユニット６は、被測定物Ｓの位相画像データおよび散乱画像データの少なくとも一方を生成するための第１光学ユニット６１と第２光学ユニット６２とを有する。なお、本実施の形態においては、光学ユニット６は公知のコーデッドアパーチャ（ＣＡ）方式により位相画像データおよび散乱画像データの少なくとも一方を生成するための構造を有するものとして説明を行う。 The optical unit 6 has a first optical unit 61 and a second optical unit 62 for generating at least one of the phase image data and the scattered image data of the object S to be measured. In the present embodiment, the optical unit 6 will be described as having a structure for generating at least one of the phase image data and the scattered image data by a known coded aperture (CA) method.

第１光学ユニット６１は、Ｘ線源２と被測定物Ｓとの間のＸ線の経路中に配置される。第１光学ユニット６１は、第１光学素子６１１と、第１光学素子６１１の位置を調節する調節部６１３とを有する。第１光学素子６１１は、たとえば金属製の板状部材に形成された複数の開口を有し、開口にてＸ線を通過させ、開口以外でＸ線を遮蔽する遮蔽部材である。開口の形状はスリット状でもよいし、三角形や矩形等の多角形もしくは真円および楕円を含む円形でもよい。第１光学素子６１１は、取付構造（不図示）を介して調節部６１３に取り付けられる。調節部６１３は、後述する制御装置５の制御に応じて、第１光学素子６１１の位置を調節する。調節部６１３は、第１光学素子６１１のＸ軸方向の位置を調節するＸ軸調節部６１４と、Ｙ軸方向の位置を調節するＹ軸調節部６１５と、Ｚ軸方向の位置を調節するＺ軸調節部６１６とを有する。 The first optical unit 61 is arranged in the X-ray path between the X-ray source 2 and the object S to be measured. The first optical unit 61 includes a first optical element 611 and an adjusting unit 613 that adjusts the position of the first optical element 611. The first optical element 611 is a shielding member having a plurality of openings formed in, for example, a metal plate-shaped member, allowing X-rays to pass through the openings and shielding X-rays other than the openings. The shape of the opening may be a slit shape, a polygon such as a triangle or a rectangle, or a circle including a perfect circle and an ellipse. The first optical element 611 is attached to the adjusting portion 613 via an attachment structure (not shown). The adjusting unit 613 adjusts the position of the first optical element 611 according to the control of the control device 5 described later. The adjusting unit 613 includes an X-axis adjusting unit 614 that adjusts the position of the first optical element 611 in the X-axis direction, a Y-axis adjusting unit 615 that adjusts the position in the Y-axis direction, and a Z that adjusts the position in the Z-axis direction. It has a shaft adjusting unit 616.

第２光学ユニット６２は、被測定物Ｓと検出器４との間のＸ線の経路中に配置される。第２光学ユニット６２は、第１光学ユニット６１と同様に、第２光学素子６２１と、調節部６２３とを有する。第２光学素子６２１は、たとえば金属製の板状部材に形成された複数の開口を有、開口にてＸ線を通過させ、開口以外でＸ線を遮蔽する遮蔽部材である。開口の形状はスリット状でもよいし、三角形や矩形等の多角形もしくは真円および楕円を含む円形でもよい。第２光学素子６２１は、取付構造（不図示）を介して調節部６２３に取り付けられる。調節部６２３は、後述する制御装置５の制御に応じて、第２光学素子６２１の位置を調節する。調節部６２３は、第２光学素子６２１のＸ軸方向の位置を調節するＸ軸調節部６２４と、Ｙ軸方向の位置を調節するＹ軸調節部６２５と、Ｚ軸方向の位置を調節するＺ軸調節部６２６とを有する。なお、第２光学素子６２１が有する開口の形状は、第１光学素子６１１が有する開口の形状に対応した形状とする。 The second optical unit 62 is arranged in the X-ray path between the object S to be measured and the detector 4. The second optical unit 62 has a second optical element 621 and an adjusting unit 623, similarly to the first optical unit 61. The second optical element 621 is a shielding member having a plurality of openings formed in, for example, a metal plate-shaped member, allowing X-rays to pass through the openings and shielding X-rays other than the openings. The shape of the opening may be a slit shape, a polygon such as a triangle or a rectangle, or a circle including a perfect circle and an ellipse. The second optical element 621 is attached to the adjusting unit 623 via an attachment structure (not shown). The adjusting unit 623 adjusts the position of the second optical element 621 according to the control of the control device 5 described later. The adjustment unit 623 includes an X-axis adjustment unit 624 that adjusts the position of the second optical element 621 in the X-axis direction, a Y-axis adjustment unit 625 that adjusts the position in the Y-axis direction, and a Z that adjusts the position in the Z-axis direction. It has a shaft adjusting unit 626. The shape of the opening of the second optical element 621 is a shape corresponding to the shape of the opening of the first optical element 611.

図２に、第１光学素子６１１と第２光学素子６２１の一例を模式的に示す。図２（ａ）は、第１光学素子６１１と第２光学素子６２１のＸＹ平面における形状を模式的に示す図であり、開口の形状をスリット状にした場合を例として示す。第１光学素子６１１は複数の開口６１９（６１９ａ、６１９ｂ、６１９ｃ、６１９ｄ）を有し、第２光学素子６２１は複数の開口６２９（６２９ａ、６２９ｂ、６２９ｃ、６２９ｄ）を有する。第２光学素子６２１の開口６２９のピッチは、検出器４の画素の配列ピッチにより決定される。第１光学素子６１１の開口６１９のピッチは、検出器４の画素の配列ピッチと、Ｘ線源２から被測定物Ｓまでの距離と、Ｘ線源２から検出器４までの距離とに基づいて決定される。なお、図２（ａ）に示す開口６１９、６２９の個数は一例であり、図に示す個数よりも多くてもよいし、少なくてもよい。 FIG. 2 schematically shows an example of the first optical element 611 and the second optical element 621. FIG. 2A is a diagram schematically showing the shapes of the first optical element 611 and the second optical element 621 in the XY plane, and shows a case where the shape of the opening is a slit shape as an example. The first optical element 611 has a plurality of openings 619 (619a, 619b, 619c, 619d) and the second optical element 621 has a plurality of openings 629 (629a, 629b, 629c, 629d). The pitch of the opening 629 of the second optical element 621 is determined by the arrangement pitch of the pixels of the detector 4. The pitch of the opening 619 of the first optical element 611 is based on the array pitch of the pixels of the detector 4, the distance from the X-ray source 2 to the object S to be measured, and the distance from the X-ray source 2 to the detector 4. Will be decided. The number of openings 619 and 629 shown in FIG. 2A is an example, and may be larger or smaller than the number shown in the figure.

図２（ｂ）に示すように、Ｘ線源２から出射したＸ線は、第１光学素子６１１の開口６１９を透過し、開口６１９以外の領域では吸収される。開口６１９を通過したＸ線は、第２光学素子６２１の開口６２９を通過し、開口６２９以外の領域では吸収される。図２（ｂ）に示すように開口６１９ａ、６１９ｂ、６１９ｃ、６１９ｄを通過したＸ線は、それぞれ開口６２９ａ、６２９ｂ、６２９ｃ、６２９ｄを通過する。すなわち、第１光学素子６１１の開口６１９ａ、６１９ｂ、６１９ｃ、６１９ｄと第２光学素子６２１の開口６２９ａ、６２９ｂ、６２９ｃ、６２９ｄとはそれぞれ一対一に対応するように配置される。開口６２９を透過したＸ線は検出器４に入射する。図に示す例では、開口６２９ａ、６２９ｂ、６２９ｃ、６２９ｄを通過したＸ線は、それぞれ検出器４の画素４１１ａ、４１１ｂ、４１１ｃ、４１１ｄに入射する。 As shown in FIG. 2B, the X-rays emitted from the X-ray source 2 pass through the opening 619 of the first optical element 611 and are absorbed in the region other than the opening 619. The X-rays that have passed through the opening 619 pass through the opening 629 of the second optical element 621 and are absorbed in the region other than the opening 629. As shown in FIG. 2B, the X-rays that have passed through the openings 619a, 619b, 619c, and 619d pass through the openings 629a, 629b, 629c, and 629d, respectively. That is, the openings 619a, 619b, 619c, 619d of the first optical element 611 and the openings 629a, 629b, 629c, 629d of the second optical element 621 are arranged so as to have a one-to-one correspondence with each other. The X-rays that have passed through the opening 629 enter the detector 4. In the example shown in the figure, the X-rays that have passed through the openings 629a, 629b, 629c, and 629d are incident on the pixels 411a, 411b, 411c, and 411d of the detector 4, respectively.

図２（ｃ）に示すように、第１光学素子６１１と第２光学素子６２１との間に被測定物Ｓが存在する場合、開口６１９を通過しＸ線は被測定物Ｓの内部にて屈折、散乱等をして、わずかに偏向する。図２（ｃ）に示す例では、第１光学素子６１１の開口６１９ｂ、６１９ｃを通過したＸ線は被測定物Ｓ内部で位相が変調するため、実線で示す被測定物Ｓが無い場合のＸ線の経路と比較して、破線で示すように偏向する。この偏向により、第２光学素子６２１の開口６２９ｂ、６２９ｃを通過して検出器４の画素４１１ｂ、４１１ｃへ入射するＸ線量は、図２（ｂ）に示す被測定物Ｓが存在しない場合と比較して増減する。この増減したＸ線量には、偏向により位相が変化しコントラストが生じたＸ線の情報が含まれる。後述する画像生成部５３は、この位相が変化して生じたコントラストに基づいて位相画像データおよび散乱画像データの少なくとも一方を生成する。
As shown in FIG. 2C, when the object to be measured S exists between the first optical element 611 and the second optical element 621, the X-ray passes through the opening 619 and X-rays are emitted inside the object S to be measured. It is slightly deflected by refraction, scattering, etc. In the example shown in FIG. 2C, the phase of the X-rays that have passed through the openings 619b and 619c of the first optical element 611 is modulated inside the object S to be measured. It is deflected as shown by the dashed line compared to the path of the line. Due to this deflection, the X-ray dose that passes through the openings 629b and 629c of the second optical element 621 and is incident on the pixels 411b and 411c of the detector 4 is compared with the case where the object S to be measured shown in FIG. 2B does not exist. And increase or decrease. The increased / decreased X-ray dose includes information on X-rays whose phase has changed due to deflection and contrast has occurred. The image generation unit 53, which will be described later, generates at least one of the phase image data and the scattered image data based on the contrast generated by changing the phase.

図１に示す制御装置５は、マイクロプロセッサやその周辺回路等を有しており、不図示の記憶媒体（たとえばフラッシュメモリ等）に予め記憶されている制御プログラムを読み込んで実行することにより、Ｘ線装置１００の各部を制御する。制御装置５は、Ｘ線源２の動作を制御するＸ線制御部５１と、マニピュレータ部３６の駆動動作を制御する載置台制御部５２と、検出器４から出力された電気信号に基づいて被測定物ＳのＸ線投影画像データを生成する画像生成部５３と、第１光学素子６１１および第２光学素子６２１の位置を調節する調節部６１３、６２３の駆動動作を制御する光学ユニット制御部５４と、を有する。 The control device 5 shown in FIG. 1 includes a microprocessor and its peripheral circuits, and is X by reading and executing a control program stored in advance in a storage medium (for example, a flash memory) (not shown). It controls each part of the wire device 100. The control device 5 receives an X-ray control unit 51 that controls the operation of the X-ray source 2, a mounting table control unit 52 that controls the drive operation of the manipulator unit 36, and an electric signal output from the detector 4. An image generation unit 53 that generates X-ray projection image data of the measurement object S, and an optical unit control unit 54 that controls the driving operations of the adjustment units 613 and 623 that adjust the positions of the first optical element 611 and the second optical element 621. And have.

画像生成部５３は、被測定物Ｓの内部でのＸ線の散乱および位相変調の少なくとも一方により生じるＸ線の強度分布の変化に関する情報に基づいて位相画像データおよび散乱画像データの少なくとも一方を生成する。 The image generation unit 53 generates at least one of the phase image data and the scattered image data based on the information regarding the change in the intensity distribution of the X-ray caused by at least one of the scattering and the phase modulation of the X-ray inside the object S to be measured. do.

画像再構成部５６は、被測定物Ｓに対するＸ線照射方向を相対的に変化させて投影し、それにより得られた複数の位相画像データおよび散乱画像データの少なくとも一方に基づいて、公知の画像再構成処理方法を用いることで、被測定物Ｓの再構成画像を生成する。画像再構成処理により、被測定物Ｓの内部構造（断面構造）である断面画像データや３次元データが生成される。なお、断面画像データとは、ＸＺ平面と平行な面内における被測定物Ｓの構造データを含む。画像再構成処理としては、逆投影法、フィルタ補正逆投影法、逐次近似法等がある。 The image reconstruction unit 56 projects the X-ray irradiation direction with respect to the object S to be measured by changing it relatively, and based on at least one of a plurality of phase image data and scattered image data obtained thereby, a known image. By using the reconstruction processing method, a reconstruction image of the object S to be measured is generated. By the image reconstruction process, cross-sectional image data and three-dimensional data which are the internal structure (cross-sectional structure) of the object S to be measured are generated. The cross-sectional image data includes structural data of the object S to be measured in a plane parallel to the XZ plane. The image reconstruction process includes a back projection method, a filter correction back projection method, a successive approximation method, and the like.

以下、本実施の形態のＸ線装置１００が行う位相画像データおよび散乱画像データの少なくとも一方を生成する処理について説明する。
図３（ａ）、（ｄ）は、Ｘ線源２と、第１光学素子６１１の開口６１９と、第２光学素子６２１の開口６２９と、被測定物Ｓと、検出器４の画素４１１との位置関係を拡大して模式的に示す。なお、図３（ａ）、（ｄ）においては、載置台３１を省略している。 Hereinafter, the process of generating at least one of the phase image data and the scattered image data performed by the X-ray apparatus 100 of the present embodiment will be described.
3A and 3D show the X-ray source 2, the opening 619 of the first optical element 611, the opening 629 of the second optical element 621, the object S to be measured, and the pixel 411 of the detector 4. The positional relationship of is enlarged and schematically shown. In addition, in FIGS. 3A and 3D, the mounting table 31 is omitted.

上述したように、Ｘ線源２から出射されたＸ線は、一部が第１光学素子６１１の開口６１９を通過し、他は第１光学素子６１１にて吸収される。開口６１９を通過したＸ線は、被測定物Ｓの一部の領域Ｒ１とＲ２とを透過する。図３（ａ）に示すように、Ｘ線が透過する被測定物Ｓの領域Ｒ１とＲ２とを合わせたＸ方向（すなわちＸ線が進行する方向と交差する方向）の長さは、開口６１９のＸ方向の長さ（開口幅）ｄに対応する。被測定物Ｓの領域Ｒ１とＲ２とを透過したＸ線は、第２光学素子６２１の開口６２９を通過して検出器４の画素４１１に入射する。 As described above, a part of the X-rays emitted from the X-ray source 2 passes through the opening 619 of the first optical element 611, and the other is absorbed by the first optical element 611. The X-rays that have passed through the opening 619 pass through the regions R1 and R2 of a part of the object S to be measured. As shown in FIG. 3A, the length in the X direction (that is, the direction intersecting the direction in which the X-rays travel), which is the sum of the regions R1 and R2 of the object S to be measured through which the X-rays pass, is the opening 619. Corresponds to the length (opening width) d in the X direction of. The X-rays that have passed through the regions R1 and R2 of the object S to be measured pass through the opening 629 of the second optical element 621 and enter the pixel 411 of the detector 4.

調節部６２３のＸ軸調節部６２４は、光学ユニット制御部５４に制御され、第２光学素子６２１をＸ方向に沿って移動させる。これにより、第２光学素子６２１の開口６２９は画素４１１の範囲をＸ方向に沿って移動する。例えば、開口６２９は、図３（ａ）において、画素４１１の左端から右端までＸ方向−側に等速で移動する。これにより、画素４１１におけるＸ方向に沿ったＸ線の検出強度の分布が得られる。すなわち、被測定物Ｓの領域Ｒ１とＲ２との内部で位相が変調されたＸ線は偏向し、開口６２９を通過して画素４１１に入射する。開口６２９の移動に伴って、画素４１１は、入射したＸ線、すなわち被測定物Ｓの一部の領域Ｒ１とＲ２とを透過したＸ線の強度分布に応じた出力信号を出力する。この出力信号には、被測定物Ｓの領域Ｒ１およびＲ２の内部でのＸ線の散乱および位相変調の少なくとも一方により生じるＸ線の強度分布の変化に関する情報が含まれる。図３（ｂ）は、この場合に第１光学素子６１１の開口６１９を通過して被測定物Ｓの領域Ｒ１とＲ２とを透過して画素４１１に入射したＸ線の強度分布Ｉ１（ｘ）を模式的に示す。なお、ｘは画素４１１におけるＸ方向の位置を示す。 The X-axis adjustment unit 624 of the adjustment unit 623 is controlled by the optical unit control unit 54 to move the second optical element 621 along the X direction. As a result, the opening 629 of the second optical element 621 moves in the range of the pixel 411 along the X direction. For example, in FIG. 3A, the opening 629 moves from the left end to the right end of the pixel 411 in the X direction − side at a constant velocity. As a result, the distribution of the detection intensity of X-rays along the X direction in the pixel 411 can be obtained. That is, the phase-modulated X-rays inside the regions R1 and R2 of the object S to be measured are deflected, pass through the opening 629, and enter the pixel 411. With the movement of the opening 629, the pixel 411 outputs an output signal according to the intensity distribution of the incident X-rays, that is, the X-rays transmitted through a part of the regions R1 and R2 of the object S to be measured. This output signal contains information about changes in the X-ray intensity distribution caused by at least one of X-ray scattering and phase modulation within regions R1 and R2 of the object S to be measured. In this case, FIG. 3B shows the intensity distribution I1 (x) of the X-rays that have passed through the opening 619 of the first optical element 611, passed through the regions R1 and R2 of the object S to be measured, and incident on the pixel 411. Is schematically shown. Note that x indicates the position of the pixel 411 in the X direction.

領域Ｒ１とＲ２との境界を通過したＸ線が到達する画素４１１上の位置をｘ０とすると、図３（ｂ）に示すように、画素４１１により検出されるＸ線強度は、位置ｘ０の近傍で大きく、位置ｘ０から離れるにつれて小さくなる。従って、画素４１１が検出するＸ線の強度は、開口６２９の中心が位置ｘ０の近傍にある時点で最大となり、開口６２９の中心が位置ｘ０から離れるに従って小さくなる。 Assuming that the position on the pixel 411 where the X-rays passing through the boundary between the regions R1 and R2 reach is x0, the X-ray intensity detected by the pixel 411 is in the vicinity of the position x0 as shown in FIG. 3 (b). Is large, and decreases as the distance from the position x0 increases. Therefore, the intensity of the X-rays detected by the pixel 411 becomes maximum when the center of the opening 629 is in the vicinity of the position x0, and decreases as the center of the opening 629 moves away from the position x0.

第１光学素子６１１の開口６１９と被測定物Ｓとの位置関係が図３（ａ）に示すような場合、上述したように、開口６１９を通過したＸ線は、被測定物Ｓの領域Ｒ１とＲ２とを透過する。このため、図３（ｂ）に示すＸ線の強度分布Ｉ１（ｘ）は、図３（ｃ）に示すように、被測定物Ｓの領域Ｒ１を透過したＸ線の強度情報ｒ１（ｘ）と、領域Ｒ２を透過したＸ線の強度情報ｒ２とを含んで構成される。 When the positional relationship between the opening 619 of the first optical element 611 and the object S to be measured is as shown in FIG. 3A, as described above, the X-rays passing through the opening 619 are the region R1 of the object S to be measured. And R2 are transmitted. Therefore, as shown in FIG. 3C, the X-ray intensity distribution I1 (x) shown in FIG. 3B is the intensity information r1 (x) of the X-rays transmitted through the region R1 of the object S to be measured. And the intensity information r2 of the X-ray transmitted through the region R2.

次に、光学ユニット制御部５４は、調節部６１３を制御して、第１光学素子６１１をＸ方向に沿ってＸ方向−側へ所定量移動させ、調節部６２３を制御して、第２光学素子６２１をＸ方向に沿って移動させ開口６２９を画素４１１の範囲で移動させる（ディザリング）。この第１光学素子６１１の移動により、第１光学素子６１１と被測定物Ｓとの相対的な位置がＸ方向に沿って変更される。このとき、調節部６１３は、被測定物Ｓの移動量が第１光学素子６１１の開口６１９の開口幅ｄよりも小さな移動量となるように、第１光学素子６１１を移動させる。図３（ｄ）は、図３（ａ）の状態からの第１光学素子６１１の移動量が開口６１９の開口幅ｄの１／２の場合を一例として示す。なお、第１光学素子６１１の移動量は、開口６１９の開口幅ｄの１／２であるものに限定されず、開口幅ｄの整数分の１、たとえば１／３や１／４やそれ以下でもよい。なお、本明細書においては、説明の便宜上、以下の説明において、第１光学素子６１１をＸ方向に沿った開口幅ｄよりも小さな移動量での移動をディザリングと呼ぶ。 Next, the optical unit control unit 54 controls the adjustment unit 613 to move the first optical element 611 along the X direction in the X direction − side by a predetermined amount, and controls the adjustment unit 623 to control the second optical. The element 621 is moved along the X direction and the opening 629 is moved within the range of the pixel 411 (dithering). The movement of the first optical element 611 changes the relative position of the first optical element 611 and the object S to be measured along the X direction. At this time, the adjusting unit 613 moves the first optical element 611 so that the amount of movement of the object S to be measured is smaller than the opening width d of the opening 619 of the first optical element 611. FIG. 3D shows, as an example, a case where the amount of movement of the first optical element 611 from the state of FIG. 3A is 1/2 of the opening width d of the opening 619. The amount of movement of the first optical element 611 is not limited to one that is 1/2 of the opening width d of the opening 619, and is an integral fraction of the opening width d, for example, 1/3, 1/4, or less. But it may be. In the present specification, for convenience of explanation, in the following description, the movement of the first optical element 611 with a movement amount smaller than the opening width d along the X direction is referred to as dithering.

第１光学素子６１１と被測定物ＳとのＸ方向の相対的な位置が開口幅ｄの１／２だけＸ方向−側に変更されたことにより、第１光学素子６１１の開口６１９を通過したＸ線は、被測定物Ｓの領域Ｒ２とＲ３とを透過する。被測定物Ｓの領域Ｒ２とＲ３とを透過したＸ線は、第２光学素子６２１の開口６２９を通過して検出器４の画素４１１に入射する。この場合も、図３（ａ）を参照して説明した場合と同様に、調節部６２３のＸ軸調節部６２４は、光学ユニット制御部５４に制御され、第２光学素子６２１をＸ方向に沿って画素４１１の範囲を移動させる。被測定物Ｓの領域Ｒ２とＲ３との内部で位相が変調されたＸ線が偏向し、開口６２９を通過して画素４１１に入射するので、開口６２９の移動に伴って、画素４１１は、入射したＸ線、すなわち被測定物Ｓの一部の領域Ｒ２とＲ３とを透過したＸ線の強度分布に応じた出力信号を出力する。 The relative position of the first optical element 611 and the object S to be measured in the X direction was changed to the X-direction-side by 1/2 of the opening width d, so that the first optical element 611 passed through the opening 619. X-rays pass through the regions R2 and R3 of the object S to be measured. The X-rays that have passed through the regions R2 and R3 of the object S to be measured pass through the opening 629 of the second optical element 621 and enter the pixel 411 of the detector 4. In this case as well, as in the case described with reference to FIG. 3A, the X-axis adjustment unit 624 of the adjustment unit 623 is controlled by the optical unit control unit 54, and the second optical element 621 is moved along the X direction. The range of the pixel 411 is moved. X-rays whose phase is modulated inside the regions R2 and R3 of the object S to be measured are deflected, pass through the opening 629, and enter the pixel 411. Therefore, as the opening 629 moves, the pixel 411 is incident. An output signal corresponding to the intensity distribution of the X-rays transmitted through the X-rays, that is, the X-rays transmitted through a part of the regions R2 and R3 of the object S to be measured is output.

この場合、画素４１１により検出されるＸ線強度は、画素４１１上の位置をｘ０からＸ方向−側にｄ／２ずれた位置（ｘ０−ｄ／２）の近傍で大きくなり、位置（ｘ０−ｄ／２）から離れるにつれて小さくなる。従って、画素４１１が検出するＸ線強度は、開口６２９の中心が位置（ｘ０−ｄ／２）の近傍にある時点で最大となり、開口６２９の中心が位置（ｘ０−ｄ／２）から離れるに従って小さくなる。この場合も、開口６１９を通過したＸ線は、被測定物Ｓの領域Ｒ２とＲ３とを透過すため、図３（ｅ）に示すＸ線の強度分布Ｉ２（ｘ）は、図３（ｆ）に示すように、被測定物Ｓの領域Ｒ２を透過したＸ線の強度情報ｒ２（ｘ）と、領域Ｒ３を透過したＸ線の強度情報ｒ３とを含んで構成される。 In this case, the X-ray intensity detected by the pixel 411 increases in the vicinity of the position (x0-d / 2) in which the position on the pixel 411 is deviated by d / 2 from x0 to the-side in the X direction, and the position (x0-). It becomes smaller as the distance from d / 2) increases. Therefore, the X-ray intensity detected by the pixel 411 becomes maximum when the center of the opening 629 is near the position (x0-d / 2), and as the center of the opening 629 moves away from the position (x0-d / 2). It becomes smaller. Also in this case, since the X-rays that have passed through the opening 619 pass through the regions R2 and R3 of the object S to be measured, the intensity distribution I2 (x) of the X-rays shown in FIG. 3 (e) is shown in FIG. 3 (f). ), The intensity information r2 (x) of the X-ray transmitted through the region R2 of the object S to be measured and the intensity information r3 of the X-ray transmitted through the region R3 are included.

以後、同様にして、第１光学素子６１１と被測定物Ｓとの相対的な位置をＸ方向に沿って開口幅ｄの１／２だけ変更するディザリングを行うごとに、検出器４の画素４１１は、開口６１９を通過し被測定物Ｓの一部の領域を透過したＸ線の強度分布に応じた出力信号を出力する。 After that, in the same manner, every time the dithering is performed to change the relative position of the first optical element 611 and the object to be measured S by 1/2 of the opening width d along the X direction, the pixel of the detector 4 is used. The 411 outputs an output signal according to the intensity distribution of X-rays that have passed through the opening 619 and passed through a part of the region of the object S to be measured.

図４は、ディザリングを（ｎ−１）回行った後の第１光学素子６１１と被測定物Ｓとの位置関係を模式的に示す。なお、図４（ａ）においても、図示の都合から載置台３１を省略している。図４（ａ）に示す位置関係の場合、第１光学素子６１１の開口６１９を通過したＸ線は、被測定物Ｓの領域ＲｎとＲｎ＋１とを透過して画素４１１に入射する。画素４１１により検出されるＸ線強度は、画素４１１の位置（ｘ０−ｎｄ／２）の近傍で大きく、位置（ｘ０−ｎｄ／２）から離れるにつれて小さくなる。従って、画素４１１が検出する強度は、開口６２９の中心が位置（ｘ０−ｎｄ／２）の近傍にある時点で最大となり、開口６２９の中心が位置（ｘ０−ｎｄ／２）から離れるに従って小さくなる。 FIG. 4 schematically shows the positional relationship between the first optical element 611 and the object S to be measured after the dithering is performed (n-1) times. Also in FIG. 4A, the mounting table 31 is omitted for convenience of illustration. In the case of the positional relationship shown in FIG. 4A, the X-rays that have passed through the opening 619 of the first optical element 611 pass through the regions Rn and Rn + 1 of the object S to be measured and enter the pixel 411. The X-ray intensity detected by the pixel 411 is large near the position (x0-nd / 2) of the pixel 411 and decreases as the distance from the position (x0-nd / 2) increases. Therefore, the intensity detected by the pixel 411 becomes maximum when the center of the opening 629 is near the position (x0-nd / 2), and decreases as the center of the opening 629 moves away from the position (x0-nd / 2). ..

ディザリングを繰り返すごとに、画素４１１が最大強度を検出する位置は、位置ｘ０から離れるので、画素４１１の位置ｘ０におけるＸ線の検出強度は小さくなる。例えば、ｎ＝３、すなわち被測定物Ｓの領域Ｒ４およびＲ５を透過したＸ線の画素４１１のおける検出強度については、被測定物Ｓの領域Ｒ４およびＲ５を透過したＸ線の強度情報ｒ４（ｘ０）、ｒ５（ｘ０）は共に小さいが、Ｘ線の強度情報ｒ４（ｘ０）に比べてｒ５（ｘ０）はより小さくなる。 Each time the dithering is repeated, the position where the pixel 411 detects the maximum intensity is separated from the position x0, so that the X-ray detection intensity at the position x0 of the pixel 411 becomes smaller. For example, regarding n = 3, that is, the detection intensity of the X-ray pixel 411 transmitted through the regions R4 and R5 of the object S to be measured, the intensity information r4 of the X-ray transmitted through the regions R4 and R5 of the object S to be measured ( Both x0) and r5 (x0) are small, but r5 (x0) is smaller than the X-ray intensity information r4 (x0).

画像生成部５３は、上述したようにして、被測定物Ｓの領域Ｒ１、Ｒ２、…、Ｒｎ、Ｒｎ＋１を透過したＸ線の強度情報の位置ｘ０における出力信号に基づいて、位相画像データおよび散乱画像データの少なくとも一方を生成する。 As described above, the image generation unit 53 scatters the phase image data and scatters based on the output signal at the position x0 of the intensity information of the X-rays transmitted through the regions R1, R2, ..., Rn, Rn + 1 of the object S to be measured. Generate at least one of the image data.

ディザリングされる前後で得られるそれぞれのＸ線の強度分布には、被測定物Ｓの少なくとも一部の同一の領域を透過したＸ線の強度情報が含まれる。すなわち、ディザリング前（図３（ａ）の場合）においてＸ線が透過する被測定物Ｓの領域Ｒ１およびＲ２のうちの領域Ｒ２は、ディザリング後（図３（ｄ）の場合）においてＸ線が透過する被測定物Ｓの領域Ｒ２およびＲ３のうちの領域Ｒ２でもある。この関係は、以後のディザリングにおいても同様に、Ｘ線は、被測定物Ｓの一部の共通の領域を透過する。 The intensity distribution of each X-ray obtained before and after dithering includes information on the intensity of X-rays transmitted through at least a part of the same region of the object S to be measured. That is, the region R2 of the regions R1 and R2 of the object to be measured S through which X-rays are transmitted before dithering (in the case of FIG. 3A) is X after dithering (in the case of FIG. 3D). It is also a region R2 of the regions R2 and R3 of the object S to be measured through which the line is transmitted. This relationship also applies to subsequent dithering, in which X-rays pass through a common region of a part of the object S to be measured.

このため、ディザリングごとに得られた、画素４１１の位置ｘにおけるＸ線の強度は、以下のように、それぞれの強度情報を含む形で表現することができる。
Ｉ１（ｘ）＝ｒ１（ｘ）＋ｒ２（ｘ）
Ｉ２（ｘ）＝ｒ２（ｘ）＋ｒ３（ｘ）
・・・
Ｉｎ（ｘ）＝ｒｎ（ｘ）＋ｒｎ＋１（ｘ） Therefore, the intensity of the X-ray at the position x of the pixel 411 obtained for each dithering can be expressed in a form including the respective intensity information as follows.
I1 (x) = r1 (x) + r2 (x)
I2 (x) = r2 (x) + r3 (x)
・・・
In (x) = rn (x) + rn + 1 (x)

画像生成部５３は、上記の連立方程式を解くことにより、被測定物Ｓのうち、第１光学素子６１１の開口６１９の開口幅ｄよりも小さい領域Ｒ１、Ｒ２、Ｒ３、…、Ｒｎ、Ｒｎ＋１のそれぞれに対応するＸ線の強度分布を算出する。 By solving the above simultaneous equations, the image generation unit 53 covers the regions R1, R2, R3, ..., Rn, Rn + 1 of the object S to be measured, which are smaller than the opening width d of the opening 619 of the first optical element 611. The intensity distribution of X-rays corresponding to each is calculated.

上記の連立方程式は、式の数より未知数の数が多いので、そのままでは解けない。この点について、次のような処理を行うことで、未知数を減らして連立方程式を解く手順について次に説明する。 The above simultaneous equations cannot be solved as they are because there are more unknowns than the number of equations. Regarding this point, the procedure for solving the simultaneous equations by reducing the unknowns by performing the following processing will be described below.

上記の通り、ディザリングを複数回繰り返すごとに、画素４１１の位置ｘ０におけるＸ線の検出強度は小さくなる。例えば、被測定物Ｓの領域Ｒ４およびＲ５を透過したＸ線の位置ｘ０における強度が相当小さい場合、領域Ｒ５を透過したＸ線の強度情報はほぼ０と見なすことができる。このような場合、上記の連立方程式のうちｒ５（ｘ０）を０と見なし、画像生成部５３は、Ｘ線の強度Ｉ１（ｘ０）、Ｉ２（ｘ０）、Ｉ３（ｘ０）、Ｉ４（ｘ０）についての４つの式から、画素４１１の位置ｘ０におけるＸ線の強度情報ｒ１（ｘ０）、ｒ２（ｘ０）、ｒ３（ｘ０）、ｒ４（ｘ０）のそれぞれを算出する。さらに、画像生成部５３は、同様にして、画素４１１上の位置ｘ０とは異なる複数の位置のそれぞれにおけるＸ線の強度情報ｒ１、ｒ２、ｒ３、…、ｒｎ＋１を算出する。画像生成部５３は、これらの複数の位置ごとのＸ線の強度情報から、画素４１１におけるＸ線の強度情報ｒ１（ｘ）、ｒ２（ｘ）、ｒ３（ｘ）、…、ｒｎ＋１（ｘ）を算出する。画像生成部５３は、被測定物Ｓが載置台３１に載置されていない状態においても、同様にしてＸ線の強度情報を算出し、被測定物Ｓが載置されていない状態におけるＸ線の強度情報と、被測定物Ｓが載置された状態におけるＸ線の強度情報との差に基づいて、領域Ｒ１、Ｒ２、Ｒ３、Ｒ４、…、Ｒｎ＋１ごとの位相画像データおよび散乱画像データの少なくとも一方を生成する。画像生成部５３は、これらの領域Ｒ１、Ｒ２、Ｒ３、Ｒ４、…Ｒｎ＋１ごとの画像データの繋ぎ合わせ（合成）をして、被測定物Ｓの全体の位相画像データおよび散乱画像データの少なくとも一方を生成する。 As described above, each time the dithering is repeated a plurality of times, the X-ray detection intensity at the position x0 of the pixel 411 becomes smaller. For example, when the intensity of the X-rays transmitted through the regions R4 and R5 of the object to be measured S at the position x0 is considerably small, the intensity information of the X-rays transmitted through the region R5 can be regarded as almost 0. In such a case, r5 (x0) in the above simultaneous equations is regarded as 0, and the image generation unit 53 considers the X-ray intensities I1 (x0), I2 (x0), I3 (x0), and I4 (x0). From the four equations of the above, each of the X-ray intensity information r1 (x0), r2 (x0), r3 (x0), and r4 (x0) at the position x0 of the pixel 411 is calculated. Further, the image generation unit 53 similarly calculates the X-ray intensity information r1, r2, r3, ..., Rn + 1 at each of the plurality of positions different from the position x0 on the pixel 411. The image generation unit 53 obtains the X-ray intensity information r1 (x), r2 (x), r3 (x), ..., Rn + 1 (x) in the pixel 411 from the X-ray intensity information for each of the plurality of positions. calculate. The image generation unit 53 calculates the X-ray intensity information in the same manner even when the object S to be measured is not mounted on the mounting table 31, and the X-ray is obtained when the object S to be measured is not mounted. Based on the difference between the intensity information of Generate at least one. The image generation unit 53 joins (synthesizes) the image data for each of these regions R1, R2, R3, R4, ... Rn + 1, and at least one of the entire phase image data and the scattered image data of the object S to be measured. To generate.

図５のフローチャートを参照して、本実施の形態のＸ線装置１００の動作を説明する。図５に示すフローチャートの各処理は、制御装置５でプログラムを実行して行われる。このプログラムは、メモリ（不図示）に格納されており、制御装置５により起動され、実行される。 The operation of the X-ray apparatus 100 of the present embodiment will be described with reference to the flowchart of FIG. Each process of the flowchart shown in FIG. 5 is performed by executing a program on the control device 5. This program is stored in a memory (not shown), and is started and executed by the control device 5.

ステップＳ１では、載置台制御部５２は、マニピュレータ部３６のＸ軸移動部３３を制御して載置台３１をＸ方向に移動させることにより、第１光学素子６１１の開口６１９と被測定物ＳとのＸ方向における相対的な位置を設定してステップＳ２へ進む。ステップＳ２では、検出器４は、第１光学素子６１１の開口６１９を通過し、被測定物Ｓの一部の領域を透過したＸ線の強度分布に応じた出力信号を出力してステップＳ３へ進む。なお、検出器４には、光学ユニット制御部５４による第２光学素子６２１の開口６２９のＸ方向に沿った移動に伴って、被測定物Ｓを透過したＸ線が入射する。 In step S1, the mounting table control unit 52 controls the X-axis moving unit 33 of the manipulator unit 36 to move the mounting table 31 in the X direction, thereby causing the opening 619 of the first optical element 611 and the object S to be measured. The relative position of the above in the X direction is set, and the process proceeds to step S2. In step S2, the detector 4 outputs an output signal corresponding to the intensity distribution of X-rays that has passed through the opening 619 of the first optical element 611 and has passed through a part of the region of the object S to be measured, and proceeds to step S3. move on. As the optical unit control unit 54 moves the opening 629 of the second optical element 621 along the X direction, X-rays transmitted through the object S to be measured are incident on the detector 4.

ステップＳ３においては、画像生成部５３は、被測定物Ｓと第１光学素子６１１の開口６１９との相対的な位置の変更（ディザリング）の要否を判定する。相対的な位置の変更が必要と判定された場合は、ステップＳ３が肯定判定されてステップＳ１へ戻る。相対的な位置の変更が不要、すなわちディザリングが完了したと判定された場合は、ステップＳ３が否定判定されてステップＳ４へ進む。ステップＳ４では、画像生成部５３は、ディザリング前と各ディザリング後に出力された複数の出力信号に基づいて、被測定物Ｓのうち第１光学素子６１１の開口６１９の開口幅ｄよりも小さい領域Ｒ１とＲ２、領域Ｒ２とＲ３、…のそれぞれに対応するＸ線の強度分布Ｉ１（ｘ）、Ｉ２（ｘ）、Ｉ３（ｘ）、…を算出して、ステップＳ５へ進む。 In step S3, the image generation unit 53 determines whether or not it is necessary to change the relative position (dithering) between the object S to be measured and the opening 619 of the first optical element 611. If it is determined that the relative position needs to be changed, step S3 is determined to be affirmative and the process returns to step S1. When it is determined that the relative position change is unnecessary, that is, the dithering is completed, step S3 is negatively determined and the process proceeds to step S4. In step S4, the image generation unit 53 is smaller than the opening width d of the opening 619 of the first optical element 611 of the object S to be measured, based on the plurality of output signals output before and after each dithering. The X-ray intensity distributions I1 (x), I2 (x), I3 (x), ... Corresponding to the regions R1 and R2, the regions R2 and R3, ... Are calculated, and the process proceeds to step S5.

ステップＳ５では、画像生成部５３は、算出したＸ線の強度分布Ｉ１（ｘ）、Ｉ２（ｘ）、Ｉ３（ｘ）、…に基づいて、被測定物Ｓの領域Ｒ１、Ｒ２、Ｒ３、…を透過したＸ線の強度情報ｒ１（ｘ）、ｒ２（ｘ）、ｒ３（ｘ）、…を算出する。画像生成部５３は、算出した強度情報に基づいて、被測定物Ｓの領域Ｒ１、Ｒ２、Ｒ３、…のそれぞれに対応する位相画像データおよび散乱画像データの少なくとも一方を生成してステップＳ６へ進む。ステップＳ６では、被測定物Ｓの領域Ｒ１、Ｒ２、Ｒ３、…ごとの画像データを合成した、被測定物Ｓの位相画像データおよび散乱画像データの少なくとも一方を生成して処理を終了する。 In step S5, the image generation unit 53 uses the calculated X-ray intensity distributions I1 (x), I2 (x), I3 (x), ... The intensity information r1 (x), r2 (x), r3 (x), ... Of the X-ray transmitted through the above is calculated. The image generation unit 53 generates at least one of the phase image data and the scattered image data corresponding to each of the regions R1, R2, R3, ... Of the object S to be measured based on the calculated intensity information, and proceeds to step S6. .. In step S6, at least one of the phase image data and the scattered image data of the object S to be measured is generated by synthesizing the image data for each of the regions R1, R2, R3, ... Of the object S to be measured, and the process is completed.

図６に、上記の処理を行って微分位相差画像データを生成する場合のシミュレーション結果を示す。シミュレーションは、第１光学素子６１１の開口６１９を通過するＸ線の位相変化が、ＺＸ断面において標準偏差σが２０［μｍ］で複数連続するガウシアン形状に相当する周期４５［μｍ］の余弦関数とし、第１光学素子６１１の開口６１９の開口幅ｄを４４．４６［μｍ］とし、開口６１９と被測定物Ｓとの相対的な位置の移動量を１４．８２［μｍ］としたものである。 FIG. 6 shows a simulation result when the above processing is performed to generate differential phase difference image data. In the simulation, the phase change of the X-ray passing through the opening 619 of the first optical element 611 is a cosine function having a period of 45 [μm] corresponding to a plurality of continuous Gaussian shapes with a standard deviation σ of 20 [μm] in the ZX cross section. The opening width d of the opening 619 of the first optical element 611 is 44.46 [μm], and the amount of movement of the relative position between the opening 619 and the object S to be measured is 14.82 [μm]. ..

図６においては、被測定物Ｓにより生じるＸ線の位相変調の微分をＬ１で示し、Ｌ１に基づいて生成されたＸ線の強度分布から算出された微分位相をＬ２で示し、Ｌ１に対して上述した実施の形態にて説明した処理により得られた微分位相をＬ３で示す。なお、図６においては、Ｌ１を一点鎖線、Ｌ２を実線、Ｌ３を破線で示す。図６に示すように、Ｌ２は、Ｌ１で示す微分位相分布を再現できていない。すなわち、従来の方法を用いた場合には、Ｌ１に示す微分位相分布が再現できない。これに対して、Ｌ３はＬ１と類似する形状の波形を形成することから、Ｌ１で示す微分位相分布を高い精度で再現できていることがわかる。すなわち、上述した実施の形態にて説明した処理によりＸ線の位相変化を再現できることが分かる。 In FIG. 6, the derivative of the phase modulation of X-rays generated by the object S to be measured is shown by L1, and the differential phase calculated from the intensity distribution of X-rays generated based on L1 is shown by L2 with respect to L1. The differential phase obtained by the process described in the above-described embodiment is indicated by L3. In FIG. 6, L1 is indicated by a alternate long and short dash line, L2 is indicated by a solid line, and L3 is indicated by a broken line. As shown in FIG. 6, L2 cannot reproduce the differential phase distribution shown by L1. That is, when the conventional method is used, the differential phase distribution shown in L1 cannot be reproduced. On the other hand, since L3 forms a waveform having a shape similar to that of L1, it can be seen that the differential phase distribution shown by L1 can be reproduced with high accuracy. That is, it can be seen that the phase change of X-rays can be reproduced by the process described in the above-described embodiment.

なお、上述した実施の形態においては、画像生成部５３は位相画像データおよび散乱画像データの少なくとも一方を生成する場合を例に挙げて説明したが、画像生成部５３は、Ｘ線の強度情報ｒ１（ｘ）、ｒ２（ｘ）、ｒ３（ｘ）、…ｒｎ（ｘ）のそれぞれを算出し、それぞれのＸ線の強度情報に基づいて、領域Ｒ１、Ｒ２、Ｒ３、…、Ｒｎごとの吸収画像データを生成してもよい。すなわち、本実施の形態の画像生成部５３は、吸収画像データ、位相画像データおよび散乱画像データのうちの少なくとも１つを生成することができる。 In the above-described embodiment, the case where the image generation unit 53 generates at least one of the phase image data and the scattered image data has been described as an example, but the image generation unit 53 has the X-ray intensity information r1. Each of (x), r2 (x), r3 (x), ... rn (x) is calculated, and based on the intensity information of each X-ray, the absorption image for each region R1, R2, R3, ..., Rn Data may be generated. That is, the image generation unit 53 of the present embodiment can generate at least one of absorption image data, phase image data, and scattered image data.

次に、図面を参照して、本発明の実施の形態による構造物製造システムを説明する。本実施の形態の構造物製造システムは、たとえば自動車のドア部分、エンジン部分、ギア部分および回路基板を備える電子部品等の成型品を作成する。 Next, the structure manufacturing system according to the embodiment of the present invention will be described with reference to the drawings. The structure manufacturing system of the present embodiment creates a molded product such as an electronic component including a door portion, an engine portion, a gear portion, and a circuit board of an automobile, for example.

図７は本実施の形態による構造物製造システム４００の構成の一例を示すブロック図である。構造物製造システム４００は、第１の実施の形態にて説明したＸ線装置１００と、設計装置４１０と、成形装置４２０と、制御システム４３０と、リペア装置４４０とを備える。 FIG. 7 is a block diagram showing an example of the configuration of the structure manufacturing system 400 according to the present embodiment. The structure manufacturing system 400 includes an X-ray apparatus 100 described in the first embodiment, a design apparatus 410, a molding apparatus 420, a control system 430, and a repair apparatus 440.

設計装置４１０は、構造物の形状に関する設計情報を作成する際にユーザが用いる装置であって、設計情報を作成して記憶する設計処理を行う。設計情報は、構造物の各位置の座標を示す情報である。設計情報は成形装置４２０および後述する制御システム４３０に出力される。成形装置４２０は設計装置４１０により作成された設計情報を用いて構造物を作成、成形する成形処理を行う。この場合、成形装置４２０は、３Ｄプリンター技術で代表される積層加工、鋳造加工、鍛造加工および切削加工のうち少なくとも１つを行うものについても本発明の一態様に含まれる。 The design device 410 is a device used by a user when creating design information regarding the shape of a structure, and performs a design process of creating and storing the design information. The design information is information indicating the coordinates of each position of the structure. The design information is output to the molding apparatus 420 and the control system 430 described later. The molding apparatus 420 performs a molding process of creating and molding a structure using the design information created by the design apparatus 410. In this case, one aspect of the present invention also includes a molding apparatus 420 that performs at least one of laminating processing, casting processing, forging processing, and cutting processing represented by 3D printer technology.

Ｘ線装置１００は、成形装置４２０により成形された構造物の形状を測定する測定処理を行う。Ｘ線装置１００は、構造物を測定した測定結果である構造物の座標を示す情報（以後、形状情報と呼ぶ）を制御システム４３０に出力する。制御システム４３０は、座標記憶部４３１と、検査部４３２とを備える。座標記憶部４３１は、上述した設計装置４１０により作成された設計情報を記憶する。 The X-ray apparatus 100 performs a measurement process for measuring the shape of the structure formed by the forming apparatus 420. The X-ray apparatus 100 outputs information (hereinafter, referred to as shape information) indicating the coordinates of the structure, which is the measurement result of measuring the structure, to the control system 430. The control system 430 includes a coordinate storage unit 431 and an inspection unit 432. The coordinate storage unit 431 stores the design information created by the design device 410 described above.

検査部４３２は、成形装置４２０により成形された構造物が設計装置４１０により作成された設計情報に従って成形されたか否かを判定する。換言すると、検査部４３２は、成形された構造物が良品か否かを判定する。この場合、検査部４３２は、座標記憶部４３１に記憶された設計情報を読み出して、設計情報とＸ線装置１００から入力した形状情報とを比較する検査処理を行う。検査部４３２は、検査処理としてたとえば設計情報が示す座標と対応する形状情報が示す座標とを比較し、検査処理の結果、設計情報の座標と形状情報の座標とが一致している場合には設計情報に従って成形された良品であると判定する。設計情報の座標と対応する形状情報の座標とが一致していない場合には、検査部４３２は、座標の差分が所定範囲内であるか否かを判定し、所定範囲内であれば修復可能な不良品と判定する。 The inspection unit 432 determines whether or not the structure formed by the forming apparatus 420 is formed according to the design information created by the design apparatus 410. In other words, the inspection unit 432 determines whether or not the molded structure is a non-defective product. In this case, the inspection unit 432 reads out the design information stored in the coordinate storage unit 431 and performs an inspection process for comparing the design information with the shape information input from the X-ray apparatus 100. As an inspection process, the inspection unit 432 compares, for example, the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information, and when the coordinates of the design information and the coordinates of the shape information match as a result of the inspection process, Judge that it is a good product molded according to the design information. If the coordinates of the design information and the coordinates of the corresponding shape information do not match, the inspection unit 432 determines whether or not the difference in the coordinates is within the predetermined range, and if it is within the predetermined range, it can be repaired. Judged as a defective product.

修復可能な不良品と判定した場合には、検査部４３２は、不良部位と修復量とを示すリペア情報をリペア装置４４０へ出力する。不良部位は設計情報の座標と一致していない形状情報の座標を有する部位であり、修復量は不良部位における設計情報の座標と形状情報の座標との差分である。リペア装置４４０は、入力したリペア情報に基づいて、構造物の不良部位を再加工するリペア処理を行う。リペア装置４４０は、リペア処理にて成形装置４２０が行う成形処理と同様の処理を再度行う。 When it is determined that the defective product can be repaired, the inspection unit 432 outputs repair information indicating the defective portion and the repair amount to the repair device 440. The defective part is a part having the coordinates of the shape information that does not match the coordinates of the design information, and the repair amount is the difference between the coordinates of the design information and the coordinates of the shape information in the defective part. The repair device 440 performs a repair process for reworking a defective portion of the structure based on the input repair information. The repair device 440 repeats the same processing as the molding process performed by the molding device 420 in the repair process.

図８に示すフローチャートを参照しながら、構造物製造システム４００が行う処理について説明する。 The process performed by the structure manufacturing system 400 will be described with reference to the flowchart shown in FIG.

ステップＳ３１では、設計装置４１０はユーザによって構造物の設計を行う際に用いられ、設計処理により構造物の形状に関する設計情報を作成し記憶してステップＳ３２へ進む。なお、設計装置４１０で作成された設計情報のみに限定されず、既に設計情報がある場合には、その設計情報を入力することで、設計情報を取得するものについても本発明の一態様に含まれる。ステップＳ３２では、成形装置４２０は成形処理により、設計情報に基づいて構造物を作成、成形してステップＳ３３へ進む。ステップＳ３３においては、Ｘ線装置１００は測定処理を行って、構造物の形状を計測し、形状情報を出力してステップＳ３４へ進む。 In step S31, the design device 410 is used when the user designs the structure, and the design process creates and stores design information regarding the shape of the structure, and proceeds to step S32. It should be noted that the present invention is not limited to the design information created by the design device 410, and if the design information already exists, the one that acquires the design information by inputting the design information is also included in one aspect of the present invention. Is done. In step S32, the molding apparatus 420 creates and forms a structure based on the design information by the molding process, and proceeds to step S33. In step S33, the X-ray apparatus 100 performs a measurement process, measures the shape of the structure, outputs shape information, and proceeds to step S34.

ステップＳ３４では、検査部４３２は、設計装置４１０により作成された設計情報とＸ線装置１００により測定され、出力された形状情報とを比較する検査処理を行って、ステップＳ３５へ進む。ステップＳ３５では、検査処理の結果に基づいて、検査部４３２は成形装置４２０により成形された構造物が良品か否かを判定する。構造物が良品である場合、すなわち設計情報の座標と形状情報の座標との差が所定の範囲内の場合には、ステップＳ３５が肯定判定されて処理を終了する。構造物が良品ではない場合、すなわち設計情報の座標と形状情報の座標とが一致しない場合や設計情報には無い座標が検出された場合には、ステップＳ３５が否定判定されてステップＳ３６へ進む。 In step S34, the inspection unit 432 performs an inspection process for comparing the design information created by the design device 410 with the shape information measured and output by the X-ray device 100, and proceeds to step S35. In step S35, the inspection unit 432 determines whether or not the structure molded by the molding apparatus 420 is a non-defective product based on the result of the inspection process. When the structure is a non-defective product, that is, when the difference between the coordinates of the design information and the coordinates of the shape information is within a predetermined range, step S35 is affirmatively determined and the process ends. If the structure is not a non-defective product, that is, if the coordinates of the design information and the coordinates of the shape information do not match, or if coordinates that are not in the design information are detected, step S35 is negatively determined and the process proceeds to step S36.

ステップＳ３６では、検査部４３２は構造物の不良部位が修復可能か否かを判定する。不良部位が修復可能ではない場合、すなわち不良部位における設計情報の座標と形状情報の座標との差分が所定範囲を超えている場合には、ステップＳ３６が否定判定されて処理を終了する。不良部位が修復可能な場合、すなわち不良部位における設計情報の座標と形状情報の座標との差分が所定範囲内の場合には、ステップＳ３６が肯定判定されてステップＳ３７へ進む。この場合、検査部４３２はリペア装置４４０にリペア情報を出力する。ステップＳ３７においては、リペア装置４４０は、入力したリペア情報に基づいて、構造物に対してリペア処理を行ってステップＳ３３へ戻る。なお、上述したように、リペア装置４４０は、リペア処理にて成形装置４２０が行う成形処理と同様の処理を再度行う。 In step S36, the inspection unit 432 determines whether or not the defective portion of the structure can be repaired. If the defective portion is not repairable, that is, if the difference between the coordinates of the design information and the coordinates of the shape information in the defective portion exceeds a predetermined range, step S36 is determined to be negative and the process ends. When the defective portion can be repaired, that is, when the difference between the coordinates of the design information and the coordinates of the shape information in the defective portion is within a predetermined range, step S36 is positively determined and the process proceeds to step S37. In this case, the inspection unit 432 outputs the repair information to the repair device 440. In step S37, the repair device 440 performs repair processing on the structure based on the input repair information, and returns to step S33. As described above, the repair device 440 repeats the same processing as the molding process performed by the molding device 420 in the repair process.

上述した実施の形態によれば、次の作用効果が得られる。
（１）第１光学素子６１１は、Ｘ線源２からのＸ線を通過させる開口６１９を有する。載置台制御部５２は、マニピュレータ部３６を制御して、Ｘ線の進行方向と交差するＸ方向において、第１光学素子６１１と被測定物Ｓとの間の相対的な位置を変更する。検出器４は、変更された複数の位置において、開口６１９を通過し被測定物Ｓを透過したＸ線の強度分布を出力信号として出力する。画像生成部５３は、検出器４からの出力信号を用いて、開口６１９の開口幅ｄよりも小さい大きさの領域におけるＸ線の強度分布に関する情報を取得する。これにより、第１光学素子６１１の開口６１９の開口幅ｄより細かい解像度を有する吸収画像データや位相画像データや散乱画像データを生成することができる。これにより、第１光学素子６１１の開口６１９の開口幅ｄをより小さく形成することなく、光学素子の開口の開口幅で位相画像や散乱画像の分解能（解像度）が決定する従来からのコーデッドアパーチャ方式よりも高分解能の画像を生成できる。 According to the above-described embodiment, the following effects can be obtained.
(1) The first optical element 611 has an opening 619 through which X-rays from the X-ray source 2 pass. The mounting table control unit 52 controls the manipulator unit 36 to change the relative position between the first optical element 611 and the object to be measured S in the X direction intersecting the traveling direction of the X-rays. The detector 4 outputs the intensity distribution of X-rays that have passed through the opening 619 and passed through the object S to be measured as an output signal at a plurality of changed positions. The image generation unit 53 uses the output signal from the detector 4 to acquire information on the intensity distribution of X-rays in a region having a size smaller than the opening width d of the opening 619. As a result, it is possible to generate absorption image data, phase image data, and scattered image data having a resolution finer than the opening width d of the opening 619 of the first optical element 611. As a result, the conventional coded aperture method in which the resolution of the phase image or the scattered image is determined by the opening width of the opening of the optical element without forming the opening width d of the opening 619 of the first optical element 611 to be smaller. Higher resolution images can be generated.

（２）載置台制御部５２は、開口６１９の開口幅ｄよりも小さな移動量にて第１光学素子６１１と被測定物Ｓとの間の相対的な位置を変更する。これにより、第１光学素子６１１の開口６１９の開口幅ｄよりも小さい領域に対応する被測定物Ｓの内部の情報を取得することが可能になる。 (2) The mounting table control unit 52 changes the relative position between the first optical element 611 and the object to be measured S with a movement amount smaller than the opening width d of the opening 619. This makes it possible to acquire information on the inside of the object S to be measured corresponding to a region smaller than the opening width d of the opening 619 of the first optical element 611.

（３）画像生成部５３は、相対的な位置が変更される前の出力信号に含まれる被測定物Ｓの領域Ｒ１および領域Ｒ２を透過したＸ線の強度分布と、相対的な位置が変更された後の出力信号に含まれる被測定物Ｓの領域Ｒ２および領域Ｒ３を透過したＸ線の強度分布とを、領域Ｒ１、領域Ｒ２および領域Ｒ３のそれぞれを透過したＸ線の強度分布に分離して、それぞれの領域の吸収画像データや位相画像データや散乱画像データを生成する。これにより、第１光学素子６１１の開口６１９の開口幅ｄで決まる分解能よりも高分解能の吸収画像データや位相画像データや散乱画像データを生成することが可能となる。 (3) The image generation unit 53 changes the relative position and the intensity distribution of the X-rays transmitted through the region R1 and the region R2 of the object S included in the output signal before the relative position is changed. The intensity distribution of the X-rays transmitted through the region R2 and the region R3 of the object S included in the output signal after the data is separated into the intensity distribution of the X-rays transmitted through the regions R1, the region R2 and the region R3, respectively. Then, absorption image data, phase image data, and scattered image data of each region are generated. This makes it possible to generate absorption image data, phase image data, and scattered image data having a resolution higher than the resolution determined by the opening width d of the opening 619 of the first optical element 611.

（４）構造物製造システム４００のＸ線装置１００は、設計装置４１０の設計処理に基づいて成形装置４２０により作成された構造物の形状情報を取得する測定処理を行い、制御システム４３０の検査部４３２は、測定処理にて取得された形状情報と設計処理にて作成された設計情報とを比較する検査処理を行う。したがって、構造物の欠陥の検査や構造物の内部の情報を非破壊検査によって取得し、構造物が設計情報の通りに作成された良品であるか否かを判定できるので、構造物の品質管理に寄与する。 (4) The X-ray apparatus 100 of the structure manufacturing system 400 performs a measurement process of acquiring shape information of the structure created by the forming apparatus 420 based on the design process of the design apparatus 410, and performs an inspection unit of the control system 430. The 432 performs an inspection process for comparing the shape information acquired in the measurement process with the design information created in the design process. Therefore, it is possible to obtain the inspection of defects in the structure and the information inside the structure by non-destructive inspection, and to judge whether the structure is a non-defective product created according to the design information, so that the quality control of the structure can be performed. Contribute to.

（５）リペア装置４４０は、検査処理の比較結果に基づいて、構造物に対して成形処理を再度行うリペア処理を行うようにした。したがって、構造物の不良部分が修復可能な場合には、再度成形処理と同様の処理を構造物に対して施すことができるので、設計情報に近い高品質の構造物の製造に寄与する。 (5) The repair device 440 is configured to perform a repair process in which the molding process is performed again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same treatment as the molding treatment can be applied to the structure again, which contributes to the production of a high-quality structure close to the design information.

次のような変形も本発明の範囲内であり、変形例の一つ、もしくは複数を上述の実施形態と組み合わせることも可能である。
（１）載置台３１を移動させてディザリングするものに限定されず、第１光学素子６１１と被測定物Ｓとの相対的な位置をＸ方向に沿って変更するあらゆる形態を適用してよい。たとえば、載置台制御部５２がマニピュレータ部３６を制御して、載置台３１をＸ方向に沿って移動させることにより、被測定物Ｓを移動させてディザリングしてよいし、第１光学素子６１１と載置台３１とをＸ方向に沿って移動させてディザリングしてもよい。 The following modifications are also within the scope of the present invention, and one or more of the modifications can be combined with the above-described embodiment.
(1) The mounting table 31 is not limited to moving and dithering, and any form in which the relative position of the first optical element 611 and the object to be measured S is changed along the X direction may be applied. .. For example, the mounting table control unit 52 may control the manipulator unit 36 to move the mounting table 31 along the X direction to move the object S to be measured for dithering, or the first optical element 611. And the mounting table 31 may be moved along the X direction for dithering.

（２）上述した実施の形態においては、Ｘ線装置１００の制御装置５は、画像生成部５３および画像再構成部５６を有するものとして説明したが、制御装置５が画像生成部５３と画像再構成部５６とを有していなくてもよい。画像生成部５３と画像再構成部５６とが、Ｘ線装置１００とは別体の処理装置等に設けられ、検出器４から出力された信号を、たとえばネットワークや記憶媒体等を介して取得して、吸収画像データや位相画像データや散乱画像データや３次元データを生成してもよい。 (2) In the above-described embodiment, the control device 5 of the X-ray apparatus 100 has been described as having the image generation unit 53 and the image reconstruction unit 56, but the control device 5 has the image generation unit 53 and the image regeneration unit 53. It does not have to have the component 56. The image generation unit 53 and the image reconstruction unit 56 are provided in a processing device or the like separate from the X-ray device 100, and acquire the signal output from the detector 4 via, for example, a network or a storage medium. Therefore, absorption image data, phase image data, scattered image data, and three-dimensional data may be generated.

本発明の特徴を損なわない限り、本発明は上記実施の形態に限定されるものではなく、本発明の技術的思想の範囲内で考えられるその他の形態についても、本発明の範囲内に含まれる。 The present invention is not limited to the above-described embodiment as long as the features of the present invention are not impaired, and other embodiments considered within the scope of the technical idea of the present invention are also included within the scope of the present invention. ..

２…Ｘ線源
３…載置部
４…検出器
５…制御装置
６…光学ユニット
３１…載置台
５３…画像生成部
５４…光学ユニット制御部
６１…第１光学ユニット
６２…第２光学ユニット
４００…構造物製造システム
４１０…設計装置
４２０…成形装置
４３０…制御システム
４４０…リペア装置
６１１…第１光学素子
６２１…第２光学素子
６１３、６２３…調節部
６１９、６２９…開口
2 ... X-ray source 3 ... Mounting unit 4 ... Detector 5 ... Control device 6 ... Optical unit 31 ... Mounting table 53 ... Image generation unit 54 ... Optical unit control unit 61 ... First optical unit 62 ... Second optical unit 400 ... Structure manufacturing system 410 ... Design device 420 ... Molding device 430 ... Control system 440 ... Repair device 611 ... First optical element 621 ... Second optical element 613, 623 ... Adjusting unit 619, 629 ... Opening

Claims

An X-ray source that emits X-rays toward the object to be measured,
A shielding member having an opening through which the X-ray passes and shielding the X-ray other than the opening,
A changing portion that changes the relative position between the shielding member and the object to be measured in a direction intersecting the traveling direction of the X-ray, and a changing portion.
A detector that outputs the intensity distribution of the X-rays that have passed through the opening and the object to be measured as an output signal at a plurality of positions changed by the changing unit.
An X-ray apparatus including a generator that uses an output signal from the detector to generate information about the intensity distribution of the X-ray in a region of the opening smaller than the size along the direction. ..

In the X-ray apparatus according to claim 1,
The changing portion is an X-ray apparatus that changes the relative position in the direction with a movement amount smaller than the size of the opening.

In the X-ray apparatus according to claim 2,
The changing portion is an X-ray apparatus that changes the relative position in the direction by an amount of movement that is an integral fraction of the size of the opening.

In the X-ray apparatus according to claim 3,
The output signal output from the detector before the relative position is changed by the change unit and the output signal output from the detector after the relative position is changed are the subject. An X-ray apparatus that includes information about the intensity distribution of the X-rays that have passed through at least a portion of the common area of the object to be measured.

In the X-ray apparatus according to claim 4,
The generation unit changes the intensity distribution of the X-rays that the X-rays have passed through the first region and the second region of the object to be measured before the relative positions are changed, and the relative positions. After that, the X-ray passes through the second region and the third region of the object to be measured, and the intensity distribution of the X-ray passes through the first region, the second region, and the third region, respectively. An X-ray apparatus that separates into the intensity distribution of the X-ray to be generated and generates information on the intensity distribution of the X-ray for each region.

In the X-ray apparatus according to any one of claims 1 to 5.
An image generation unit that generates at least one of the X-ray absorption image data, the X-ray phase image data, and the X-ray scattered image data based on the information on the X-ray intensity distribution. Further equipped with an X-ray device.

Emitting X-rays toward the object to be measured and
Passing the X-ray through the opening by a shielding member having an opening,
To change the relative position between the shielding member and the object to be measured in a direction intersecting the traveling direction of the X-ray.
To output the intensity distribution of the X-rays that have passed through the opening and the object to be measured at the changed positions, as an output signal, and
An X-ray image generation method comprising using the output signal to generate information about the intensity distribution of the X-ray in a region of a size smaller than the size of the opening along the direction.

In the X-ray image generation method according to claim 7,
An X-ray image generation method for changing the relative position between the shielding member and the object to be measured with a movement amount smaller than the size of the opening in the direction.

In the X-ray image generation method according to claim 8,
An X-ray image generation method in which the relative position is changed by a movement amount of 1 / integer of the size of the opening in the direction.

In the X-ray image generation method according to claim 9,
The output signal output before the relative position is changed and the output signal output after the relative position is changed pass through at least a part of the common area of the object to be measured. An X-ray image generation method including information on the intensity distribution of the X-ray.

In the X-ray image generation method according to claim 10,
The intensity distribution of the X-rays that the X-rays passed through the first and second regions of the object to be measured before the relative position was changed, and the X-rays after the relative position was changed. The intensity distribution of the X-rays whose lines have passed through the second region and the third region of the object to be measured, and the intensity distribution of the X-rays passing through the first region, the second region and the third region, respectively. An X-ray image generation method that separates into intensity distributions and generates information on the X-ray intensity distribution for each region.

In the X-ray image generation method according to any one of claims 7 to 11.
X-ray image generation that generates at least one of the X-ray absorption image data, the X-ray phase image data, and the X-ray scattered image data based on the information on the X-ray intensity distribution. Method.

Create design information about the shape of the structure
Create the structure based on the design information
The shape of the created structure is measured by using the X-ray apparatus according to any one of claims 1 to 6, and shape information is acquired.
A method for manufacturing a structure that compares the acquired shape information with the design information.

In the method for manufacturing a structure according to claim 13.
A method for manufacturing a structure, which is executed based on a comparison result between the shape information and the design information and reworks the structure.

In the method for manufacturing a structure according to claim 14.
The reworking of the structure is a method for manufacturing a structure, in which the structure is recreated based on the design information.