WO2020001331A1 - 壳体及其制备方法、电子产品 - Google Patents

壳体及其制备方法、电子产品 Download PDF

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Publication number
WO2020001331A1
WO2020001331A1 PCT/CN2019/091765 CN2019091765W WO2020001331A1 WO 2020001331 A1 WO2020001331 A1 WO 2020001331A1 CN 2019091765 W CN2019091765 W CN 2019091765W WO 2020001331 A1 WO2020001331 A1 WO 2020001331A1
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WIPO (PCT)
Prior art keywords
outer layer
inner layer
weight
frame
content
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Ceased
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PCT/CN2019/091765
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English (en)
French (fr)
Inventor
朱帅
梁旭东
孙剑
邓善全
陈梁
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BYD Co Ltd
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BYD Co Ltd
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Publication of WO2020001331A1 publication Critical patent/WO2020001331A1/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method

Definitions

  • the present application relates to a casing and a preparation method thereof, and the present application also relates to an electronic product.
  • Aluminum alloy has low density, light weight, easy forming and easy processing, but its strength is low, and its luster is dull after polishing.
  • stainless steel has the advantages of high strength, high hardness, and high brightness after polishing, it has a high density. It is used for electronic device housings such as mobile phones and is more difficult to form and process. Especially CNC machining takes a long time. High processing costs. Although the density of titanium and titanium alloy is smaller than that of stainless steel, it is difficult to form and process, and the processing cost is also high.
  • the composite material can be processed into a shell to make the outer surface of the shell polished and have a higher brightness, and to make the shell easier to CNC processing.
  • the bonding strength of stainless steel or titanium alloy is low, steel and aluminum are easy to delaminate during forming and processing, and the conductivity of the shell is poor due to the poor bonding force between steel and aluminum.
  • the present application provides a casing and a preparation method thereof.
  • the preparation method according to the present application is easy for CNC processing, and the entire processing process is shortened.
  • the present application provides a housing including a frame body and a back cover. At least a part of the frame body includes an outer layer and an inner layer combined with the outer layer.
  • the inner surface of the inner layer faces the inside of the frame, and the outer surface of the outer layer is far from the inner surface of the inner layer to form the outer surface of the frame.
  • the material of the outer layer is selected from stainless steel, titanium and titanium alloy. One or two or more of them, the material of the inner layer is one or two or more selected from the group consisting of aluminum and aluminum alloy, and the back cover is disposed on the bottom surface of the frame body, and communicates with the frame body On the underside.
  • the present application provides a method for preparing a shell, which includes the following steps:
  • the outer layer blank plate is one or two or more selected from stainless steel, titanium and titanium alloy.
  • the inner layer blank plate is selected from aluminum and aluminum alloy. One or more of them;
  • the composite plate is processed to form a shell having a frame body, the frame body including an inner layer formed by the inner layer blank plate, and an outer layer formed by the outer layer blank plate.
  • the inner surface of the inner layer faces the inside of the frame, and the outer surface of the outer layer is far from the inner surface of the inner layer to form the outer surface of the frame;
  • the present application provides an electronic product, wherein a casing of the electronic product is a casing described in the first aspect of the present application.
  • the inner layer and the outer layer of the frame are made of different materials, which not only has high strength and hardness, but also has high brightness after polishing, and is easy to be CNC processed.
  • FIG. 1 is a schematic diagram of a 3D glass back cover.
  • Figure 2 is a schematic diagram of a 2.5D ceramic back cover.
  • FIG. 3 is a schematic diagram of a 2D polymer back cover.
  • the present application provides a housing including a frame body and a back cover. At least a part of the frame body includes an outer layer and an inner layer combined with the outer layer. The inner surface of the inner layer faces the inside of the frame, and the outer surface of the outer layer is far from the inner surface of the inner layer to form the outer surface of the frame.
  • the material of the outer layer is one or two or more kinds selected from stainless steel, titanium, and titanium alloy.
  • the material of the inner layer is one or two or more kinds selected from aluminum and aluminum alloys.
  • the stainless steel contains chromium and nickel, and based on the total amount of stainless steel, the content of chromium is 15-20% by weight, for example, 16-19% by weight; The content is 5-16% by weight, for example, 6-14% by weight.
  • the content of the copper element in the stainless steel is not higher than 1% by weight. In some examples, the content of copper element in the stainless steel is 0.01-0.5% by weight; in other examples, the content of copper element in the stainless steel is not more than 0.25% by weight, for example, it may be 0.05-0.25% by weight.
  • the content of manganese element in the stainless steel is not higher than 2% by weight. In some examples, the content of the manganese element in the stainless steel is not higher than 1.8% by weight, for example, it may be 1.2-1.8% by weight.
  • the content of carbon element in the stainless steel is not higher than 0.1% by weight. In some examples, the content of the carbon element in the stainless steel is not higher than 0.08% by weight, and may be, for example, 0.01-0.08% by weight.
  • the content of sulfur element in the stainless steel is not higher than 0.04% by weight. In some examples, the content of sulfur element in the stainless steel is not higher than 0.03% by weight, for example, it may be 0.0003 to 0.004% by weight.
  • the content of molybdenum element in the stainless steel is not higher than 3% by weight, for example, it can be 0.0005-2.5% by weight.
  • the content of silicon element in the stainless steel is not higher than 1% by weight. In some examples, the content of the silicon element is not higher than 0.7% by weight, for example, it may be 0.5-0.7% by weight.
  • the stainless steel is one or more than one selected from the group consisting of SUS304, SUS316L, S30408, and S31603.
  • the content of iron in the titanium is not higher than 0.5% by weight. In some examples, the content of the iron element is not higher than 0.3% by weight. In other examples, the content of the iron element is not higher than 0.2% by weight, for example, it may be 0.04-0.1% by weight.
  • the content of the carbon element in the titanium is not higher than 0.08% by weight. In some examples, the content of the carbon element is not higher than 0.05% by weight, and may be, for example, 0.01-0.03% by weight.
  • the content of nitrogen in the titanium is not higher than 0.05% by weight. In some examples, the content of the nitrogen element is not higher than 0.04% by weight, and may be, for example, 0.003-0.009% by weight.
  • the content of the aluminum element in the titanium is not higher than 0.06% by weight, and in some examples, the content of the aluminum element is not higher than 0.04% by weight.
  • the content of the aluminum element in the titanium alloy is 0.005-8 wt%, and in some examples, the content of the aluminum element is 0.02-7 wt%.
  • the content of the vanadium element in the titanium alloy is 0.001-8% by weight, for example, 0.002-6% by weight.
  • the content of the molybdenum element in the titanium alloy is 0.001-1 wt%, for example, it may be 0.002-0.5 wt%.
  • the titanium or titanium alloy is one or two or more selected from TA1, TA2, TA3, TA4, TA18, TA10, and TC4. In some specific examples, the titanium or titanium alloy is one or two or more selected from TA2, TA4, TA18, and TC4.
  • the aluminum alloy is one or two or more selected from a 5 series aluminum alloy, a 6 series aluminum alloy, and a 7 series aluminum alloy.
  • the content of magnesium element is 2% by weight or more. In some examples, the content of the magnesium element is 2-6 wt%, for example, it may be 2-3 wt%.
  • the content of the silicon element is not higher than 1% by weight, and may be, for example, 0.05-0.2% by weight.
  • the content of the iron element is not higher than 1% by weight, and may be, for example, 0.1-0.5% by weight.
  • the content of the copper element is not higher than 0.5% by weight, and may be, for example, 0.005 to 0.1% by weight.
  • the content of the manganese element is not higher than 1% by weight, and may be, for example, 0.01-0.5% by weight.
  • the content of the chromium element is not higher than 0.8% by weight, and may be, for example, 0.1-0.5% by weight.
  • the content of zinc element is not higher than 0.2% by weight, and may be, for example, 0.005 to 0.05% by weight.
  • the content of the titanium element is not higher than 0.5% by weight, and may be, for example, 0.05-0.2% by weight.
  • the content of silicon element in the 6-series aluminum alloy, based on the total amount of the aluminum alloy, the content of silicon element is 0.2% by weight or more. In some examples, the content of silicon element is 0.25-1 weight%. It is 0.4-0.8% by weight. In the 6-series aluminum alloy, based on the total amount of the aluminum alloy, the content of magnesium element is 0.35% by weight or more. In some examples, the content of magnesium element is 0.4-1.2% by weight, for example, it can be 0.5-0.9% by weight. .
  • the 6-series aluminum alloy contains or does not contain a copper element. Generally, in the 6-series aluminum alloy, based on the total amount of the aluminum alloy, the content of the copper element is 0.005% by weight or more.
  • the copper element The content is 0.006-1.1% by weight, and may be 0.006-0.8% by weight, for example.
  • the content of the iron element is not higher than 0.5% by weight, and may be, for example, 0.04-0.3% by weight.
  • the content of the manganese element is not higher than 1% by weight, and may be, for example, 0.02-0.8% by weight.
  • the content of the chromium element is not higher than 0.5% by weight, and may be, for example, 0.05-0.2% by weight.
  • the content of zinc element is not higher than 0.1% by weight, and may be, for example, 0.001-0.05% by weight.
  • the content of the titanium element is not higher than 0.5% by weight, and may be, for example, 0.05-0.2% by weight.
  • the content of zinc element is 1-10% by weight.
  • the aluminum alloy is one or two or more selected from the group consisting of GM55, 5052, 5252, 5182, 5086, 6063, 6061, 6013, 7003, 7005, 7A03, 7A05, and 7075. In some examples, the aluminum alloy is one or two or more selected from 6063, 5052, and 6013.
  • the thickness of the inner layer and the thickness of the outer layer can be selected according to the specific use occasion of the shell, which can meet the requirements for use.
  • the thickness of at least part of the inner layer is 0.3-6 mm; in some embodiments, the thickness of at least part of the inner layer is 0.4-3 mm, for example, it can be 0.5-1 mm; in some implementations
  • a thickness of at least a part of the outer layer is 0.1 to 1 mm, and may be, for example, 0.2 to 0.6 mm.
  • the thickness ratio of the inner layer to the outer layer is 1-40: 1, and in some embodiments, the thickness ratio of the inner layer to the outer layer is 1.1-20: 1, In some embodiments, the thickness ratio of the inner layer to the outer layer is 1.2-10: 1, and in some embodiments, the thickness ratio of the inner layer to the outer layer is 1.2-5: 1, In some embodiments, the thickness ratio of the inner layer to the outer layer is 1.2-4: 1.
  • the casing of the above embodiment is particularly suitable as a mobile phone casing.
  • the frame has at least one functional groove, and the functional groove at least partially cuts off an inner layer and an outer layer of the frame.
  • the functional slot may be one or a combination of two or more of an antenna slot, a headphone slot, and a charging slot.
  • the functional slot can be filled according to the specific use requirements of the shell to meet the use requirements.
  • at least a part of the functional slot is filled with a non-conductive material, the non-conductive material contains a polymer material and an optional reinforcing material.
  • the functional slot filled with the non-conductive material is an antenna slot.
  • the non-conductive material contains a reinforcing material, and based on the total amount of the non-conductive material, the content of the reinforcing material may be 15-65% by weight. In some embodiments, the reinforcing material The content of the material is 25-60% by weight. In some embodiments, the content of the reinforcing material is 35-55% by weight.
  • the reinforcing material may be a fiber, such as glass fiber.
  • the non-conductive material may be one of polybutylene terephthalate, polyphenylene sulfide, polyamide, polyphthalamide, polypropylene, polycarbonate, polyphenylene sulfone, and polyetheretherketone. One or two or more. In some embodiments, the non-conductive material and the inner surface of the functional groove are seamlessly bonded.
  • an outer surface of the outer layer is formed with a decoration.
  • the decoration may be formed by a conventional method, for example, it may be formed by one or two or more methods of polishing, sandblasting, wire drawing, physical vapor deposition, laser laser engraving, spray ink, spray paint, and anti-fingerprint coating.
  • the decoration is formed by a combination of one or two or more selected from the group consisting of physical vapor deposition, anti-fingerprint coating, and laser radium carving.
  • the casing may further include a middle plate, and an outer edge of the middle plate is combined with an inner surface of the frame.
  • the middle plate and the frame body may be integrally formed, and the outer edge of the middle plate and the inner surface of the frame body may also be connected by a connection manner, which may be, for example, welding.
  • connection manner which may be, for example, welding.
  • integralally formed means that the inner layer is formed of at least a part of the material of the frame body, and is not formed by combining the inner layer and the frame body by a connection method such as welding.
  • the middle plate and the inner layer are integrally formed.
  • the thickness of the middle plate and the inner layer may be the same, the thickness of the middle plate may be smaller than the thickness of the inner layer, or the thickness of the middle plate may be greater than the thickness of the inner layer. The thickness of the inner layer.
  • the bottom surface of the middle plate may be flush with the bottom surface of the inner layer, and the upper surface of the middle plate is lower than the upper surface of the inner layer.
  • the orientations in the "bottom surface”, "upper surface”, and “lower surface” are determined by the orientation of the casing in the use state. For example, when the casing is used as the outer shell of an electronic product, the electronic product is in the used state. The direction is OK.
  • the middle plate and the frame are integrally formed.
  • the thickness of the middle plate may be the same as the thickness of the outer layer, the thickness of the middle plate may be smaller than the thickness of the outer layer, and the thickness of the middle plate may also be greater than The thickness of the outer layer.
  • the bottom surface of the middle plate may be flush with the bottom surface of the outer layer, and the upper surface of the middle plate is lower than the upper surface of the outer layer;
  • the upper surface of the middle plate may be flush with the upper surface of the outer layer, and the bottom surface of the middle plate may be lower than the bottom surface of the outer layer.
  • the upper surface and the bottom surface of the middle plate may also be low. On the upper surface and the bottom surface of the outer layer.
  • the middle plate is integrally formed with the outer layer and the inner layer.
  • the bottom surface and the upper surface of the middle plate may be flush with the bottom surface of the outer layer and the top surface of the inner layer, respectively, or the bottom surface and the outer layer of the middle plate may be the same.
  • the bottom surface of the middle plate is flush, and the upper surface of the middle plate is lower than the upper surface of the inner layer.
  • the bottom surface of the middle plate may be lower than the bottom surface of the outer layer.
  • the upper surface of the inner layer is flush; and the bottom surface and the upper surface of the middle plate may be lower than the bottom surface and the upper surface of the inner layer, respectively.
  • the material of the back cover is one or a combination of two or more of glass, ceramic and polymer.
  • the back cover may be 2D polymer, 2.5D ceramic, or 3D glass.
  • the specific heat capacity of the frame is 0.3-1.2 J / (g ⁇ K), for example, 0.55-0.95 J / (g ⁇ K).
  • the specific heat capacity of the frame is determined by the method specified in GB / T13464-2008.
  • the thermal conductivity of the frame from the inner layer to the outer layer is 10-80 W / (m ⁇ K); in some embodiments, the frame is from The thermal conductivity of the inner layer to the outer layer is 20-70W / (m ⁇ K); in some embodiments, the thermal conductivity of the frame from the inner layer to the outer layer is 25-65W / (m ⁇ K) K) ,; In some embodiments, the thermal conductivity of the frame from the inner layer to the outer layer is 30-60 W / (m ⁇ K). In this application, the thermal conductivity of the frame is measured by the method specified in ASTM E1461-2013.
  • the present application provides a method for preparing a shell, which includes the following steps:
  • the outer layer blank plate is one or two or more selected from stainless steel, titanium and titanium alloy.
  • the inner layer blank plate is selected from aluminum and aluminum alloy. One or more of them;
  • the composite plate is processed to form a shell having a frame body, the frame body including an inner layer formed by the inner layer blank plate, and an outer layer formed by the outer layer blank plate.
  • the inner surface of the inner layer faces the inside of the frame, and the outer surface of the outer layer is far from the inner surface of the inner layer to form the outer surface of the frame;
  • the outer layer blank plate is one or more selected from stainless steel, titanium and titanium alloy
  • the inner layer blank plate is one selected from aluminum and aluminum alloy. One or two or more.
  • the stainless steel contains chromium and nickel, and based on the total amount of stainless steel, the content of chromium is 15-20% by weight, for example, 16-19% by weight; The content is 5-16% by weight, for example, 6-14% by weight.
  • the content of copper element in the stainless steel is not higher than 1% by weight. In some examples, the content of copper element in the stainless steel is 0.01-0.5% by weight. In other examples, the content of the copper element in the stainless steel is not higher than 0.25% by weight, for example, it can be 0.05-0.25% by weight.
  • the content of manganese in the stainless steel is not higher than 2% by weight, in some examples, the content of manganese in the stainless steel is not higher than 1.8% by weight, For example, it may be 1.2 to 1.8% by weight.
  • the content of carbon element in the stainless steel is not higher than 0.1% by weight, in some examples, the content of carbon element in the stainless steel is not higher than 0.08% by weight, For example, it may be 0.01-0.08% by weight.
  • the content of sulfur element in the stainless steel is not higher than 0.04% by weight, in some examples, the content of sulfur element in the stainless steel is not higher than 0.03% by weight, For example, it may be 0.0003 to 0.004% by weight.
  • the content of molybdenum element in the stainless steel is not higher than 3% by weight, for example, it can be 0.0005-2.5% by weight.
  • the content of silicon element in the stainless steel is not higher than 1% by weight, in some examples, the content of silicon element in the stainless steel is not higher than 0.7% by weight, For example, it may be 0.5 to 0.7% by weight.
  • the stainless steel is one or more than one selected from the group consisting of SUS304, SUS316L, S30408, and S31603.
  • the content of iron in the titanium is not higher than 0.5% by weight; in some examples, the content of iron is not higher than 0.3% by weight; in other examples, the content of iron is It is not higher than 0.2% by weight, and may be, for example, 0.04-0.1% by weight.
  • the content of the carbon element in the titanium is not higher than 0.08% by weight; in some examples, the content of the carbon element is not higher than 0.05% by weight, for example, it may be 0.01-0.03% by weight.
  • the content of nitrogen in the titanium is not higher than 0.05% by weight; in some examples, the content of the nitrogen is not higher than 0.04% by weight, for example, it may be 0.003-0.009% by weight.
  • the content of the aluminum element in the titanium is not higher than 0.06% by weight; in some examples, the content of the aluminum element is not higher than 0.04% by weight.
  • the content of the aluminum element in the titanium alloy is 0.005-8 wt%, and in some examples, the content of the aluminum element is 0.02-7 wt%.
  • the content of the vanadium element in the titanium alloy is 0.001-8% by weight, for example, 0.002-6% by weight.
  • the content of the molybdenum element in the titanium alloy is 0.001-1 wt%, for example, it may be 0.002-0.5 wt%.
  • the titanium or titanium alloy is one or two or more selected from TA1, TA2, TA3, TA4, TA18, TA10, and TC4. In some specific examples, the titanium or titanium alloy is one or two or more selected from TA2, TA4, TA18, and TC4.
  • the aluminum alloy is one or two or more selected from a 5 series aluminum alloy, a 6 series aluminum alloy, and a 7 series aluminum alloy.
  • the content of magnesium element is 2% by weight or more. In some examples, the content of magnesium element is 2-6% by weight. It is 2-3% by weight.
  • the content of the silicon element is not higher than 1% by weight, and may be, for example, 0.05-0.2% by weight.
  • the content of the iron element is not higher than 1% by weight, and may be, for example, 0.1-0.5% by weight.
  • the content of the copper element is not higher than 0.5% by weight, and may be, for example, 0.005 to 0.1% by weight.
  • the content of the manganese element is not higher than 1% by weight, and may be, for example, 0.01-0.5% by weight.
  • the content of the chromium element is not higher than 0.8% by weight, and may be, for example, 0.1-0.5% by weight.
  • the content of zinc element is not higher than 0.2% by weight, and may be, for example, 0.005 to 0.05% by weight.
  • the content of the titanium element is not higher than 0.5% by weight, and may be, for example, 0.05-0.2% by weight.
  • the content of silicon element in the 6-series aluminum alloy, based on the total amount of the aluminum alloy, the content of silicon element is 0.2% by weight or more. In some examples, the content of silicon element is 0.25-1 weight%. It is 0.4-0.8% by weight. In the 6-series aluminum alloy, based on the total amount of the aluminum alloy, the content of magnesium element is 0.35% by weight or more. In some examples, the content of magnesium element is 0.4-1.2% by weight, for example, it can be 0.5-0.9% by weight. %.
  • the 6-series aluminum alloy contains or does not contain a copper element. Generally, in the 6-series aluminum alloy, based on the total amount of the aluminum alloy, the content of the copper element is 0.005% by weight or more.
  • the copper element The content is 0.006-1.1% by weight, and may be 0.006-0.8% by weight, for example.
  • the content of the iron element is not higher than 0.5% by weight, and may be, for example, 0.04-0.3% by weight.
  • the content of the manganese element is not higher than 1% by weight, and may be, for example, 0.02-0.8% by weight.
  • the content of the chromium element is not higher than 0.5% by weight, and may be, for example, 0.05-0.2% by weight.
  • the content of zinc element is not higher than 0.1% by weight, and may be, for example, 0.001-0.05% by weight.
  • the content of the titanium element is not higher than 0.5% by weight, and may be, for example, 0.05-0.2% by weight.
  • the content of zinc element is 1-10% by weight.
  • the aluminum alloy is one or two or more selected from the group consisting of GM55, 5052, 5252, 5182, 5086, 6063, 6061, 6013, 7003, 7005, 7A03, 7A05, and 7075. In some examples, the aluminum alloy is one or two or more selected from 6063, 5052, and 6013.
  • the thickness of the outer layer blank plate and the inner layer blank plate can be selected according to the specific requirements of the shell.
  • the thickness of the inner layer blank plate is such that at least a portion of the formed inner layer has a thickness of 0.3-6 mm.
  • the thickness of the inner layer blank plate is such that at least a portion of the inner layer is formed.
  • the thickness of the part is 0.4-3mm, for example, 0.5-1mm; in some embodiments, the thickness of the outer layer blank plate is such that at least part of the thickness of the formed outer layer is 0.1-1mm, for example, it may be 0.2-0.6 mm.
  • the thickness of the inner layer blank plate and the outer layer blank plate are such that the thickness ratio of the formed inner layer to the outer layer is 1-40: 1.
  • the inner layer The thickness of the blank layer board and the thickness of the outer layer board are such that the thickness ratio of the formed inner layer to the outer layer is 1.1-20: 1.
  • the thickness of the inner layer board and the outer layer The thickness of the layer blank board is such that the thickness ratio of the formed inner layer to the outer layer is 1.2-10: 1.
  • the thickness of the inner layer blank board and the thickness of the outer layer blank board are such that The thickness ratio of the layer to the outer layer is 1.2-5: 1.
  • the thickness of the inner layer blank plate and the outer layer blank plate are such that the thickness ratio of the formed inner layer to the outer layer is 1.2 -4: 1.
  • the roughening process is used to roughen the surface to be joined of the inner layer blank board and the surface to be joined of the outer layer blank board.
  • the roughening conditions are such that the roughness Ra of the to-be-joined surface of the inner layer blank plate and the to-be-joined surface of the outer layer blank plate are each 0.1-15 ⁇ m; in some embodiments In the roughening process, the roughness Ra of the to-be-joined surface of the inner layer blank board and the to-be-joined surface of the outer layer blank board are each 0.5-10 ⁇ m; in some embodiments, the roughness The conditions of the chemical treatment are such that the roughness Ra of the to-be-joined surface of the inner layer blank board and the to-be-joined surface of the outer layer blank board are each 1-5 ⁇ m.
  • the roughness of the surfaces to be joined of the inner layer blank board and the roughness of the surfaces to be joined of the outer layer blank board may be the same or different. In some embodiments, the roughness of the surfaces to be joined of the inner layer blank board is not less than the roughness of the surfaces to be joined of the outer layer blank board. In some embodiments, the roughness of the surfaces to be joined of the inner layer blank board is greater than the roughness of the surfaces to be joined of the outer layer blank board.
  • the roughness of the surfaces to be joined of the inner layer blank is greater than the roughness of the surfaces to be joined of the outer blank, and the roughness Ra of the surfaces to be joined of the inner blank is Ra It is 1-6 ⁇ m, in some examples 1.5-5 ⁇ m, and in some examples 1.8-4.6 ⁇ m; the roughness Ra of the surface to be bonded of the outer blank board is 0.8-4 ⁇ m, and in some examples 1- 3.5 ⁇ m, in some examples 1.2-2.6 ⁇ m.
  • the roughening treatment may be one or a combination of two or more selected from the group consisting of wire drawing, sand blasting, and chemical etching.
  • the chemical corrosion can be performed by applying an etchant separately on the inner surface to be bonded and the outer surface to be bonded, thereby forming a rough structure on the inner surface of the blank board to be bonded and the outer layer of the blank board to be bonded.
  • the type of the etchant may be selected according to the materials of the inner layer and the outer layer, so that the surface to be bonded of the inner layer and the surface to be bonded of the outer layer are corroded to form a rough surface, which may be an acid or an alkali .
  • the roughening treatment is drawing.
  • the roughening operation by wire drawing is simpler, and the required roughness is easier to achieve, which can make the inner layer blank plate and the outer layer blank plate have higher bonding strength after lamination.
  • the drawing uses one or two or more of a wire brush, an abrasive belt, and a nylon wheel for the to-be-joined surface of the outer-layer blank board and the to-be-joined inner-layer blank board, respectively.
  • the surface is polished to roughen it.
  • the degree of polishing is such that the roughness of the roughened surfaces to be bonded meets the requirements described above, respectively.
  • step S2 further includes a pre-roughening process performed before the roughening process, and in the pre-roughening process, the inner layer blank board and / or The outer blank plate is rolled.
  • the rolling uses a pair of rolling rotating rolls.
  • One of the pair of rolling rotating rolls is a smooth roll, and the other rolling rotating roll is a rough roll.
  • the rough roller is in contact with the surface to be bonded, the surface of the smooth roller is a smooth surface, and the surface of the rough roller has a texture.
  • Performing the pre-roughening treatment before the roughening treatment can further improve the effect of the roughening treatment and increase the bonding strength between the inner layer and the outer layer in the shell finally formed.
  • the rolling reduction amount in the pre-roughening process, may be 1-15%, and in some examples, the rolling reduction amount is 2-10%, for example Can be 3-8%.
  • the rolling in the pre-roughening treatment, may be performed at a temperature of 10-60 ° C. In some examples, the rolling may be performed at a temperature of 15-50 ° C. For example, it can be performed at a temperature of 25-45 ° C.
  • the pattern of the texture is one or more of a straight texture, a snow texture, a cross texture, and a shred texture, and the texture is perpendicular to the axial direction of the rolling rotary roll. In some embodiments, the distance between two adjacent stripes is 0.01-0.15 mm.
  • the conditions of the pre-roughening treatment are such that the surface roughness Ra of the surfaces to be bonded after the pre-roughening treatment is 0.05-5 ⁇ m, in some examples, 0.08-2 ⁇ m, and may be 0.1-1 ⁇ m, for example.
  • the roughness of the pre-roughened surface of the inner layer blank board to be joined is not less than the roughness of the pre-roughened surface of the outer layer blank board to be joined.
  • the roughness of the pre-roughened surface of the inner layer blank board to be bonded is greater than the roughness of the pre-roughened surface of the outer layer blank board to be bonded.
  • the roughness of the pre-roughened surface of the inner layer blank board to be bonded is greater than that of the pre-roughened surface of the outer layer blank board to be bonded, and the inner
  • the roughness Ra of the pre-roughened surface of the two-layer blank board to be bonded is 0.05-1 ⁇ m, 0.1-0.8 ⁇ m in some examples, and 0.15-0.4 ⁇ m in some examples;
  • the roughness Ra of the surface to be bonded by the pre-roughening treatment is 0.02-0.8 ⁇ m, in some examples 0.05-0.6 ⁇ m, and in some examples 0.1-0.3 ⁇ m.
  • step S2 further comprises cleaning the roughened surface to be bonded to remove oil stains and impurities adhering to the surface to be bonded.
  • the cleaning may be water washing, and the water washing may be washing the surfaces to be bonded with water.
  • a degreasing agent may be used to improve the cleaning effect.
  • the cleaning comprises a plasma cleaning.
  • the plasma cleaning may be performed in a plasma cleaner.
  • the cleaning includes sequential water washing and plasma cleaning. Plasma cleaning after water washing can further remove fine oil stains and impurities on the surfaces to be bonded, thereby improving the inner layer and the outer layer of the final prepared shell. Bonding strength between layers.
  • the plasma cleaning is performed in a vacuum environment, and the pressure of the vacuum environment is not higher than 8 ⁇ 10 -3 Pa. In some examples, the pressure of the vacuum environment is 1 ⁇ 10 -3 Pa to 7.5 ⁇ 10 -3 Pa, in some examples, the pressure of the vacuum environment is 5 ⁇ 10 -3 Pa to 7 ⁇ 10 -3 Pa, and the pressure is an absolute pressure.
  • the roughened surface to be joined of the inner layer blank plate and the roughened surface to be joined of the outer layer blank plate may be superposed, and then rolled to form Composite sheet.
  • the rolling conditions are such that the rolling reduction is greater than 5%, for example, it can be 6% or more.
  • the rolling conditions are such that the reduction is 8-70%.
  • the The rolling conditions are such that the reduction is 10-60%. In some examples, the rolling conditions are such that the reduction is 20-40%.
  • the reduction amount refers to a percentage value of the total thickness change amount of the inner layer blank plate and the outer layer blank plate after rolling and the total thickness before rolling.
  • the outer layer blank is stainless steel
  • the inner layer blank is aluminum alloy
  • the rolling conditions are such that the reduction amount is 10-40%, for example, 20-30%.
  • the outer blank plate is titanium and / or a titanium alloy
  • the inner blank plate is an aluminum alloy
  • the rolling conditions are such that the reduction amount is 10-40%, for example, it may be It is 30-40%.
  • the rolling may be performed at a temperature of 10-500 ° C, may also be performed at a temperature of 15-400 ° C, and may also be performed at a temperature of 25-300 ° C.
  • step S3 the rolling adopts a pair of rolling rotating rolls, the rolling rotating rolls are all smooth rolls, and the surface of the smooth rolls is a smooth surface.
  • the to-be-joined surface of the inner-layer blank board and the to-be-joined surface of the outer-layer blank board are laminated in a vacuum environment, and then rolled, which can improve the final preparation.
  • the pressure of the vacuum environment may be 1 ⁇ 10 -1 Pa to 1 ⁇ 10 -3 Pa, and the pressure is an absolute pressure.
  • the pressure of the vacuum environment may be 1 ⁇ 10 -3 Pa to 8 ⁇ 10 -3 Pa, and may also be 5 ⁇ 10 -3 Pa to 7 ⁇ 10 -3 Pa, and the pressure is an absolute pressure.
  • the processing method may be a conventional choice, for example, it may be punching and / or milling.
  • the machining is milling.
  • the machining is punching and milling, wherein the punching is performed before the milling.
  • step S4 the composite board is processed to form a frame.
  • the processing is punching and / or milling.
  • the machining is milling.
  • the machining is punching and milling, wherein the punching is performed before the milling.
  • an operation of setting a middle plate in the frame is further included, and an outer edge of the middle plate is combined with an inner surface of the frame.
  • the middle plate may be integrally formed with the frame, or after the frame is formed, the middle plate may be placed in the frame and the middle plate and the frame may be joined together by at least one connection method.
  • the connection may be For welding.
  • the middle plate and the frame are integrally formed, the middle plate is formed of at least part of the inner layer blank plate and / or at least part of the outer layer blank plate, so that the middle plate and the frame body are integrally formed.
  • the processing may be one of the following processing methods:
  • Processing method 1 punching the composite sheet into a prefabricated shell with a prefabricated middle plate and a prefabricated frame, milling and removing the inner blank plate and / or part of the outer blank plate of the prefabricated middle plate to form a middle plate, and milling to remove the prefabrication Part of the inner blank board and / or part of the outer blank board of the frame to form the frame;
  • Processing method 2 punching the composite plate into a prefabricated shell with a prefabricated midplane and a prefabricated frame, milling and removing the outer blank board and / or part of the inner blank board to form a midplane, and milling to remove the prefabrication Part of the inner blank board and / or part of the outer blank board of the frame to form the frame;
  • Processing method 3 punching the composite sheet into a prefabricated shell with a prefabricated middle plate and a prefabricated frame, milling and removing part of the inner blank board and part of the outer blank board to form a middle board, and milling to remove the precast frame Part of the inner layer blank board and / or part of the outer layer blank board of the body to form a frame.
  • step S61 and optional step S62 may be further included.
  • step S61 the frame is processed to form at least one functional groove that at least partially cuts off the inner layer and the outer layer on the frame;
  • step S62 a non-conductive material is filled in at least a part of the functional groove.
  • step S61 the processing method may be milling.
  • the functional slot may be one or a combination of two or more of an antenna slot, a headphone slot, and a charging slot.
  • the specific position of the function slot can be selected according to the function of the function slot and the specific design requirements of the product, which is not particularly limited in this application.
  • step S52 is performed for a functional slot used as an antenna slot.
  • the non-conductive material in step S62, includes a polymer material and an optional reinforcing material.
  • the non-conductive material contains a reinforcing material, and based on the total amount of the non-conductive material, the content of the reinforcing material may be 15-65% by weight. In some examples, the The content is 25-60% by weight, and in some examples, the content of the reinforcing material is 35-55% by weight.
  • the reinforcing material may be a fiber, such as glass fiber.
  • the non-conductive material is polybutylene terephthalate, polyphenylene sulfide, polyamide, polyphthalamide, polypropylene, polycarbonate, polyphenylene sulfone, and polyether One or more of ether ketones.
  • a non-conductive material may be injected into the functional groove by a conventional method so as to fill the functional groove and form a seamless combination with an inner wall of the functional groove.
  • one or two or more of holes, grooves and bosses can be formed on the inner surface of the functional groove, and the non-conductive material is injected into the functional groove.
  • a non-conductive material may be anchored in the hole and / or groove, or the boss may be anchored in a non-conductive material, thereby improving the bonding strength between the non-conductive material and the inner surface of the functional groove.
  • holes are formed on the inner surface of the functional groove, and the average pore diameter of the holes may be 10-60 nm.
  • step S7 may be further included.
  • the surface of the outer surface of the casing is decorated.
  • the decoration may be one or a combination of two or more of polishing, sandblasting, wire drawing, physical vapor deposition, laser laser carving, spray ink, spray paint, and anti-fingerprint coating.
  • the decoration is a combination of polishing and at least one selected from physical vapor deposition, anti-fingerprint coating, and laser radium carving.
  • step S8 may be further included.
  • a functional element is formed on the midplane, and a method of forming a functional element on the midplane includes milling, laser cutting, welding, pasting, and One or a combination of two or more in assembly.
  • the material of the back cover is one or a combination of two or more of glass, ceramics, and polymers.
  • the back cover may be 2D polymer, 2.5D ceramic, or 3D glass.
  • the back cover can be mounted on the frame body by a conventional method, for example, the back cover can be bonded to the frame body by using adhesive tape.
  • steps S61, S62, S7, and S8 are included, these steps are performed before step S5, that is, steps S61, S62, S7, and S8 are performed before step S5. .
  • the application provides a housing made by the method described in the second aspect of the application.
  • the present application provides an electronic product, wherein the electronic product has a casing as described in the first aspect of the present application.
  • the electronic product may be various terminal devices that require a housing, such as a mobile phone, a tablet computer, or a wearable electronic product.
  • the roughness test method is GB / T 2523-2008 "Method for Measuring Surface Roughness and Peak Number of Cold Rolled Metal Sheets (Belts)".
  • the binding force per unit width between the inner layer and the outer layer was measured by the following method:
  • the specific heat capacity of the frame is measured using the method specified in GB / T13464-2008; the thermal conductivity of the frame is measured using the method specified in ASTM E1461-2013.
  • compositions of the aluminum alloys used in the following examples and comparative examples are shown in Table 1 below.
  • composition of titanium or titanium alloys used in the following examples and comparative examples is shown in Table 3 below.
  • Table 3 (based on the total amount of titanium or titanium alloy, based on the weight percentage content, the balance is titanium)
  • the inner blank plate is an aluminum alloy plate with a grade of 5052
  • the outer blank plate is a stainless plate with a grade of S31603.
  • the to-be-joined surface of the inner layer blank board and the to-be-joined surface of the outer layer blank board are sequentially subjected to pre-roughening treatment and roughening treatment by the following methods.
  • the inner blank plate and the outer blank plate are rolled separately.
  • the rolling uses paired rolling rotary rolls.
  • One of the paired rolling rotary rolls is a smooth roll, and the other is rolled.
  • the rotating roller is a rough roller, the rough roller is in contact with the surface to be bonded, the surface of the smooth roller is a smooth surface, and the surface of the rough roller has a texture, the texture being perpendicular to the axis of the rolling rotating roller Direction, the pattern of the texture is straight, and the distance between two adjacent stripes is in the range of 0.03-0.10 mm.
  • the rolling reduction is 8%.
  • the rolling is carried out at a temperature of 30 ° C.
  • the roughness Ra of the surface to be joined after the pre-roughening treatment of the inner layer blank plate is 0.33 ⁇ m, and the outer layer blank plate is pre-roughened.
  • the roughness Ra of the surfaces to be bonded after the chemical treatment was 0.24 ⁇ m.
  • Wire brushes are used to grind the pre-roughened surface to be joined of the outer layer blank board and the pre-roughened surface to be joined to the inner layer blank board, respectively, so that the roughness of the inner layer blank board to be joined is polished.
  • Ra is 4.2 ⁇ m
  • the roughness Ra of the surface of the outer layer blank to be bonded is 2.6 ⁇ m.
  • the roughened surfaces to be joined of the outer layer blank board and the inner layer blank board are washed with water to remove surface oil stains. After the water-washed outer and inner blank boards are roughened, the surfaces to be bonded are dried, and then plasma cleaned.
  • the plasma cleaning is performed under a pressure of 5 ⁇ 10 -3 Pa (absolute pressure). get on.
  • the roughened surface of the inner layer blank plate and the roughened surface of the outer layer blank plate are superimposed, and then rolled to form a composite material plate, wherein the rolling is performed at a temperature of 25 ° C. under a pressure of It was performed in a vacuum of 7 ⁇ 10 -3 Pa, and the rolling reduction was 30%.
  • the thickness of the outer blank plate is 0.82mm
  • the thickness of the inner blank plate is 3.25mm.
  • the unit width binding force between the inner layer and the outer layer in the composite material plate is 56N / mm. .
  • the rolling uses a pair of rolling rotary rolls, and the pair of rolling rotary rolls are smooth rolls.
  • the composite material sheet is punched to form a shell blank with a frame body, and the shell blank is milled.
  • the outer blank plate is retained except for the portion forming the outer layer of the frame, and the remaining Part of the whole is removed by milling, and the upper and bottom surfaces of the inner layer are milled to form a shell with a frame and a middle plate.
  • the frame has an inner layer formed by an inner layer blank plate (the thickness of the inner layer is 0.82).
  • the middle plate is formed by the inner layer blank plate, and an upper surface of the middle plate is lower than the inner layer On the upper surface, the bottom surface of the middle plate is lower than the bottom surface of the inner layer.
  • the frame is milled laterally to form the inner and outer antenna slots that cut the frame laterally.
  • the antenna slot was filled with polybutylene terephthalate containing 40% by weight of glass fiber to fill the antenna slot.
  • the decoration is sequentially performing polishing treatment, physical vapor deposition, anti-fingerprint coating, and laser laser engraving, and assembling other components as required.
  • a back cover is installed on the bottom surface of the frame body, and the back cover and the frame body are bonded together by an adhesive tape, and the material of the back cover is 3D glass (as shown in FIG. 1) to make a mobile phone case finally required.
  • the mobile phone case is prepared by the same method as in Example 1, except that the pre-roughening process of step (1-1) is not performed, but the roughening process is directly performed.
  • the binding force per unit width between the inner layer and the outer layer in the composite material plate was determined to be 42 N / mm. It was determined that the specific heat capacity of the frame was 0.65 J / (g ⁇ K), and the thermal conductivity of the frame along the inner layer toward the outer layer was 25.1 W / (m ⁇ K).
  • the mobile phone case is prepared by the same method as in Example 1, except that the roughening process of step (1-2) is not performed, but the pre-roughening process is performed.
  • the binding force per unit width between the inner layer and the outer layer in the composite material plate was determined to be 19 N / mm. It was determined that the specific heat capacity of the frame was 0.66 J / (g ⁇ K), and the thermal conductivity of the frame along the inner layer toward the outer layer was 11.6 W / (m ⁇ K).
  • the mobile phone casing is prepared by the same method as in Example 1, except that step (1-3) does not perform plasma cleaning, but uses deionized water for rinsing.
  • the binding force per unit width between the inner layer and the outer layer in the composite material plate was determined to be 51 N / mm. It was determined that the specific heat capacity of the frame was 0.66 J / (g ⁇ K), and the thermal conductivity of the frame along the inner layer toward the outer layer was 28.5 W / (m ⁇ K).
  • the mobile phone case was prepared by the same method as in Example 1, except that the rolling described in step (2) was performed under normal pressure (that is, 1 standard atmospheric pressure).
  • the binding force per unit width between the inner layer and the outer layer in the composite material plate was determined to be 39 N / mm. It was determined that the specific heat capacity of the frame was 0.67 J / (g ⁇ K), and the thermal conductivity of the frame along the inner layer toward the outer layer was 22.8 W / (m ⁇ K).
  • a mobile phone case was prepared by the same method as in Example 1, except that in step (2), rolling was performed under the condition of a pressure of 9 ⁇ 10 -2 Pa (absolute pressure).
  • the binding force per unit width between the inner layer and the outer layer in the composite material plate was determined to be 48 N / mm. It was determined that the specific heat capacity of the frame was 0.65 J / (g ⁇ K), and the thermal conductivity of the frame along the inner layer toward the outer layer was 26.9 W / (m ⁇ K).
  • the mobile phone case was prepared by the same method as in Example 1, except that the rolling reduction in step (2) was 5%.
  • the binding force per unit width between the inner layer and the outer layer in the composite material plate was determined to be 17 N / mm. It was determined that the specific heat capacity of the frame was 0.66 J / (g ⁇ K), and the thermal conductivity of the frame along the inner layer toward the outer layer was 9.9 W / (m ⁇ K).
  • the mobile phone casing was prepared by the same method as in Example 1, except that step (1) was not performed, but the outer layer blank plate and the inner layer blank plate were directly rolled.
  • the binding force per unit width between the inner layer and the outer layer in the composite material plate was determined to be 9 N / mm. It was determined that the specific heat capacity of the frame was 0.66 J / (g ⁇ K), and the thermal conductivity of the frame along the inner layer toward the outer layer was 6.9 W / (m ⁇ K).
  • the inner blank plate is an aluminum alloy plate with a grade of 6063
  • the outer blank plate is a titanium material with a grade of TA4.
  • the to-be-joined surface of the inner layer blank board and the to-be-joined surface of the outer layer blank board are sequentially subjected to pre-roughening treatment and roughening treatment by the following methods.
  • the inner blank plate and the outer blank plate are rolled separately.
  • the rolling uses paired rolling rotary rolls.
  • One of the paired rolling rotary rolls is a smooth roll, and the other is rolled.
  • the rotating roller is a rough roller, the rough roller is in contact with the surface to be bonded, the surface of the smooth roller is a smooth surface, and the surface of the rough roller has a texture, and the pattern of the texture is a cross texture, and two adjacent stripes
  • the distance between the roads is in the range of 0.1-0.15mm.
  • the rolling reduction is 5%.
  • the rolling is carried out at a temperature of 45 ° C.
  • the roughness Ra of the surfaces to be joined after the pre-roughening treatment of the inner layer blank plate is 0.27 ⁇ m, and the outer layer blank plate is pre-roughened.
  • the roughness Ra of the surfaces to be bonded after the chemical treatment was 0.22 ⁇ m.
  • Wire brushes are used to grind the pre-roughened surface to be joined of the outer layer blank board and the pre-roughened surface to be joined to the inner layer blank board, respectively, so that the roughness of the inner layer blank board to be joined is polished.
  • Ra is 4.6 ⁇ m
  • the roughness Ra of the surface of the outer layer blank plate to be bonded is 2.2 ⁇ m.
  • the roughened surfaces to be joined of the outer layer blank board and the inner layer blank board are washed with water to remove surface oil stains. After the water-washed outer and inner blank boards are roughened, the surfaces to be bonded are dried, and then plasma cleaned.
  • the plasma cleaning is performed under a pressure of 5 ⁇ 10 -3 Pa (absolute pressure). get on.
  • the roughened surface of the inner layer blank plate and the roughened surface of the outer layer blank plate are superimposed, and then rolled to form a composite material plate, wherein the rolling is performed at a temperature of 50 ° C. under a pressure of It was performed in a vacuum of 6 ⁇ 10 -3 Pa, and the rolling reduction was 40%.
  • the thickness of the outer layer blank plate is 0.76mm
  • the thickness of the inner layer blank plate is 3.62mm.
  • the unit width binding force between the inner layer and the outer layer in the composite material plate is measured to be 58N / mm .
  • the rolling uses a pair of rolling rotary rolls, and the pair of rolling rotary rolls are smooth rolls.
  • the composite material sheet is punched to form a shell blank with a frame body, and the shell blank is milled.
  • the inner blank plate is retained except for the part forming the inner layer of the frame, and the remaining Part of the whole is removed by milling, and the upper and lower surfaces of the outer layer are milled to form a shell with a frame and a middle plate.
  • the frame has an inner layer formed by an inner layer blank plate (the thickness of the inner layer is 0.93 mm).
  • an outer layer (the thickness of the outer layer is 0.26 mm) formed by an outer layer blank plate
  • the middle plate is formed by the outer layer blank plate
  • an upper surface of the middle plate is lower than that of the outer layer On the upper surface, the bottom surface of the middle plate is lower than the bottom surface of the outer layer.
  • the frame is milled laterally to form the inner and outer antenna slots that cut the frame laterally.
  • Polybutylene terephthalate containing 40% by weight of glass fiber is injection-molded into the antenna slot, and the antenna slot is filled to make a mobile phone case finally required.
  • the decoration is sequentially performing polishing treatment, physical vapor deposition, anti-fingerprint coating, and laser laser engraving, and assembling other components as required.
  • a back cover is installed on the bottom surface of the frame, and the back cover and the frame are bonded together with adhesive tape, and the material of the back cover is 2.5D ceramic (as shown in FIG. 2), which is made into a mobile phone case finally required .
  • a mobile phone case was prepared in the same manner as in Example 6, except that the rolling described in step (2) was performed under normal pressure (that is, 1 standard atmospheric pressure).
  • the binding force per unit width between the inner layer and the outer layer in the composite sheet was determined to be 41 N / mm. It was determined that the specific heat capacity of the frame was 0.79 J / (g ⁇ K), and the thermal conductivity of the frame along the inner layer toward the outer layer was 29.7 W / (m ⁇ K).
  • the mobile phone case is prepared by the same method as in Example 6, except that the pre-roughening process of step (1-1) is not performed, but the roughening process is directly performed.
  • the binding force per unit width between the inner layer and the outer layer in the composite material plate was determined to be 45 N / mm. It was determined that the specific heat capacity of the frame was 0.78 J / (g ⁇ K), and the thermal conductivity of the frame along the inner layer toward the outer layer was 30.1 W / (m ⁇ K).
  • the inner blank plate is an aluminum alloy plate with the grade of 6013
  • the outer blank plate is a stainless steel plate with the grade of SUS304.
  • the to-be-joined surface of the inner layer blank board and the to-be-joined surface of the outer layer blank board are sequentially subjected to pre-roughening treatment and roughening treatment by the following methods.
  • the inner blank plate and the outer blank plate are rolled separately.
  • the rolling uses paired rolling rotary rolls.
  • One of the paired rolling rotary rolls is a smooth roll, and the other is rolled.
  • the rotating roller is a rough roller, the rough roller is in contact with the surface to be bonded, the surface of the smooth roller is smooth, and the surface of the rough roller has a texture, and the pattern of the texture is a snow pattern, and two adjacent stripes
  • the distance between the roads is in the range of 0.05-0.10mm.
  • the rolling reduction is 3%.
  • the rolling is carried out at a temperature of 25 ° C.
  • the roughness Ra of the surfaces to be joined after the pre-roughening treatment of the inner layer blank plate is 0.18 ⁇ m, and the outer layer blank plate is pre-roughened.
  • the roughness Ra of the surfaces to be bonded after the chemical treatment is 0.11 ⁇ m.
  • Wire brushes are used to grind the pre-roughened surface to be joined of the outer layer blank board and the pre-roughened surface to be joined to the inner layer blank board, respectively, so that the roughness of the inner layer blank board to be joined is polished.
  • Ra is 1.8 ⁇ m
  • the roughness Ra of the surface of the outer layer blank plate to be bonded is 1.2 ⁇ m.
  • the roughened surfaces to be joined of the outer layer blank board and the inner layer blank board are washed with water to remove surface oil stains. After the water-washed outer and inner blank boards are roughened, the surfaces to be joined are dried and then plasma cleaned.
  • the plasma cleansing is performed in an environment with a vacuum of 7 ⁇ 10 -3 Pa (absolute pressure). Next.
  • the roughened surface of the inner layer blank plate and the roughened surface of the outer layer blank plate are superimposed, and then rolled to form a composite material plate, wherein the rolling is carried out at a temperature of 300 ° C under a pressure of It was performed in a vacuum of 5 ⁇ 10 -3 Pa, and the rolling reduction was 20%.
  • the thickness of the outer layer blank plate is 0.75 mm
  • the thickness of the inner layer blank plate is 2.86 mm.
  • the unit width binding force between the inner layer and the outer layer in the composite material plate is 51N / mm. .
  • the rolling uses a pair of rolling rotary rolls, and the pair of rolling rotary rolls are smooth rolls.
  • the composite material sheet is punched to form a shell blank with a frame body, and the shell blank is milled. During the milling, the surfaces of the inner layer blank plate and the outer layer blank plate are milled to remove part of the surface.
  • the frame has an inner layer (the thickness of the inner layer is 0.52 mm) formed by an inner layer blank plate, and an outer layer (the thickness of the outer layer is 0.45 mm) formed by an outer layer blank plate, and the middle plate is made of The outer layer blank plate and the inner layer blank plate are formed, and an upper surface of the middle plate is lower than an upper surface of the inner layer, and a bottom surface of the middle plate is lower than a bottom surface of the outer layer.
  • the frame is milled laterally to form the inner and outer antenna slots that cut the frame laterally.
  • the antenna slot was filled with polyphthalamide containing 55% by weight of glass fiber to fill the antenna slot.
  • the decoration is sequentially performing polishing treatment, physical vapor deposition, anti-fingerprint coating, and laser laser engraving, and assembling other components as required.
  • a back cover is installed on the bottom surface of the frame body, and the back cover and the frame body are bonded together by an adhesive tape, and the material of the back cover is a 2D polymer (as shown in FIG. 3), and is made into a mobile phone case finally required .
  • the inner blank plate is an aluminum alloy plate with the grade of 6063
  • the outer blank plate is a stainless steel plate with the grade of S31603.
  • the to-be-joined surface of the inner layer blank board and the to-be-joined surface of the outer layer blank board are sequentially subjected to pre-roughening treatment and roughening treatment by the following methods.
  • the inner blank plate and the outer blank plate are rolled separately.
  • the rolling uses paired rolling rotary rolls.
  • One of the paired rolling rotary rolls is a smooth roll, and the other is rolled.
  • the rotating roller is a rough roller, the rough roller is in contact with the surface to be bonded, the surface of the smooth roller is smooth, and the surface of the rough roller has a texture, and the pattern of the texture is a snow pattern, and two adjacent stripes
  • the distance between the roads is in the range of 0.05-0.10mm.
  • the rolling reduction is 3%.
  • the rolling is carried out at a temperature of 25 ° C.
  • the roughness Ra of the surface to be joined after the pre-roughening treatment of the inner layer blank plate is 0.21 ⁇ m, and the outer layer blank plate is pre-roughened.
  • the roughness Ra of the surfaces to be bonded after the chemical treatment is 0.13 ⁇ m.
  • Wire brushes are used to grind the pre-roughened surface to be joined of the outer layer blank board and the pre-roughened surface to be joined to the inner layer blank board, respectively, so that the roughness of the inner layer blank board to be joined is polished.
  • Ra is 2.1 ⁇ m
  • the roughness Ra of the surface of the outer layer blank plate to be bonded is 1.4 ⁇ m.
  • the roughened surfaces to be joined of the outer layer blank board and the inner layer blank board are washed with water to remove surface oil stains. After the water-washed outer and inner blank boards are roughened, the surfaces to be joined are dried and then plasma cleaned.
  • the plasma cleansing is performed in an environment with a vacuum of 7 ⁇ 10 -3 Pa (absolute pressure). Next.
  • the roughened surface of the inner layer blank plate and the roughened surface of the outer layer blank plate are superimposed, and then rolled to form a composite material plate, wherein the rolling is carried out at a temperature of 300 ° C under a pressure of It was performed in a vacuum of 5 ⁇ 10 -3 Pa, and the rolling reduction was 30%.
  • the thickness of the outer layer blank plate is 0.71mm
  • the thickness of the inner layer blank plate is 3.56mm.
  • the unit width binding force between the inner layer and the outer layer in the composite material plate was measured to be 63N / mm .
  • the rolling uses a pair of rolling rotary rolls, and the pair of rolling rotary rolls are smooth rolls.
  • the composite material sheet is punched to form a shell blank with a frame body, and the shell blank is milled. During the milling, the surfaces of the inner layer blank plate and the outer layer blank plate are milled to remove part of the surface.
  • the frame has an inner layer (the thickness of the inner layer is 0.82 mm) formed by an inner layer blank plate, and an outer layer (the thickness of the outer layer is 0.35 mm) formed by an outer layer blank plate, and the middle plate is made of The outer layer blank plate and the inner layer blank plate are formed, and an upper surface of the middle plate is lower than an upper surface of the inner layer, and a bottom surface of the middle plate is lower than a bottom surface of the outer layer.
  • the frame is milled laterally to form the inner and outer antenna slots that cut the frame laterally.
  • the antenna slot was filled with polyphthalamide containing 55% by weight of glass fiber to fill the antenna slot.
  • the decoration is sequentially performing polishing treatment, physical vapor deposition, anti-fingerprint coating, and laser laser engraving, and assembling other components as required.
  • a back cover is installed on the bottom surface of the frame body, the back cover and the frame body are bonded together with adhesive tape, and the material of the back cover is 3D glass (as shown in FIG. 1), and is made into a mobile phone case finally required.

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Abstract

一种壳体及其制备方法、电子产品。壳体包括框体和后盖，框体的至少部分包括外层以及与外层结合的内层，内层的内表面朝向框体的内部，外层的外表面远离内层的内表面构成框体的外表面，外层的材料为选自不锈钢、钛和钛合金中的一种或两种以上，内层的材料为选自铝和铝合金中的一种或两种以上，后盖设置在框体的底面上，并与框体的底面结合。

Description

壳体及其制备方法、电子产品
本申请基于申请号为201810700587.5，申请日为2018年6月29日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及一种壳体及其制备方法，本申请还涉及一种电子产品。
背景技术
现有终端设备壳体多采用一种金属加工而成，如铝合金、不锈钢或者钛合金。近年来，随着手机外观件高光亮外观效果的出现，以及前后双玻璃外观设计的发展趋势，更高强度、更高光亮效果以及轻量化的手机中框也成为发展热点。
铝合金密度低，质轻，易成形，易加工，但是强度较低，抛光后光亮度较哑。不锈钢虽然具有高强度、高硬度、抛光后高光亮度的优点，但密度大，用于手机等电子设备壳体上较重，且成形及加工较困难，特别是数控机床(CNC)加工耗时长，加工成本高。钛及钛合金虽然密度比不锈钢小，但成形及加工均较难，加工成本也较高。
尽管将铝合金和不锈钢或者钛合金复合形成复合材料，复合材料经加工成形为壳体后能够使得壳体外表面抛光后具有较高的光亮度，并使得壳体易于CNC加工，但是将铝合金与不锈钢或者钛合金的结合强度低，在成形和加工过程中钢铝容易分层，且因钢铝之间结合力不好，壳体的导电性较差。
因此，亟需开发能兼顾加工性能和使用性能的终端设备壳体。
发明内容
本申请提供一种壳体及其制备方法，根据本申请的制备方法易于CNC加工，整个加工制程缩短。
根据本申请的第一个方面，本申请提供了一种壳体，该壳体包括框体和后盖，所述框体的至少部分包括外层以及与所述外层结合的内层，所述内层的内表面朝向框体的内部，所述外层的外表面远离内层的内表面构成所述框体的外表面，所述外层的材料为选自不锈钢、钛和钛合金中的一种或两种以上，所述内层的材料为选自铝和铝合金中的一种或两种以上，所述后盖设置在所述框体的底面上，并与所述框体的底面结合。
根据本申请的第二个方面，本申请提供了一种壳体的制备方法，该方法包括以下步 骤：
S1、提供内层坯料板以及外层坯料板，所述外层坯料板为选自不锈钢、钛和钛合金中的一种或两种以上，所述内层坯料板为选自铝和铝合金中的一种或两种以上；
S2、将所述内层坯料板的待结合面以及所述外层坯料板的待结合面进行粗化处理；
S3、将所述内层坯料板的待结合面与所述外层坯料板的待结合面叠合后进行轧制，形成复合板材，所述轧制的条件使得压下量为大于5％；
S4、将所述复合板材进行加工，形成具有框体的壳体，所述框体包括由所述内层坯料板形成的内层、以及由所述外层坯料板形成的外层，所述内层的内表面朝向框体的内部，所述外层的外表面远离内层的内表面构成所述框体的外表面；
S5、在所述框体的底面安装后盖。
根据本申请的第三个方面，本申请提供了一种电子产品，其中，该电子产品的外壳为本申请第一个方面所述的壳体。
根据本申请的壳体，框体的内层和外层采用不同材料制成，不仅强度和硬度高，经抛光后具有较高的光亮度，而且易于进行CNC加工。
附图说明
图1为3D玻璃后盖的示意图。
图2为2.5D陶瓷后盖的示意图。
图3为2D聚合物后盖的示意图。
具体实施方式
在本文中所披露的范围的端点和任何值都不限于该精确的范围或值，这些范围或值应当理解为包含接近这些范围或值的值。对于数值范围来说，各个范围的端点值之间、各个范围的端点值和单独的点值之间，以及单独的点值之间可以彼此组合而得到一个或多个新的数值范围，这些数值范围应被视为在本文中具体公开。
根据本申请的第一个方面，本申请提供了一种壳体，该壳体包括框体和后盖，所述框体的至少部分包括外层以及与所述外层结合的内层，所述内层的内表面朝向框体的内部，所述外层的外表面远离内层的内表面构成所述框体的外表面。
根据本申请的壳体，所述外层的材料为选自不锈钢、钛和钛合金中的一种或两种以上。所述内层的材料为选自铝和铝合金中的一种或两种以上。
在一些示例中，所述不锈钢含有铬元素和镍元素，以不锈钢的总量为基准，铬元素的 含量为15-20重量％，例如可以为16-19重量％；所述不锈钢中镍元素的含量为5-16重量％，例如可以为6-14重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中铜元素的含量为不高于1重量％。在一些示例中，所述不锈钢中铜元素的含量为0.01-0.5重量％；在另一些示例中，所述不锈钢中铜元素的含量不高于0.25重量％，例如可以为0.05-0.25重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中锰元素的含量为不高于2重量％。在一些示例中，所述不锈钢中锰元素的含量为不高于1.8重量％，例如可以为1.2-1.8重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中碳元素的含量为不高于0.1重量％。在一些示例中，所述不锈钢中碳元素的含量为不高于0.08重量％，例如可以为0.01-0.08重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中硫元素的含量为不高于0.04重量％。在一些示例中，所述不锈钢中硫元素的含量为不高于0.03重量％，例如可以为0.0003-0.004重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中钼元素的含量为不高于3重量％，例如可以为0.0005-2.5重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中硅元素的含量为不高于1重量％。在一些示例中，硅元素的含量为不高于0.7重量％，例如可以为0.5-0.7重量％。
在一些实施例中，所述不锈钢为选自SUS304、SUS316L、S30408和S31603中的一种或两种以上。
在一些示例中，所述钛中，铁元素的含量为不高于0.5重量％。在一些示例中，铁元素的含量为不高于0.3重量％。在另一些示例中，铁元素的含量不高于0.2重量％，例如可以为0.04-0.1重量％。
在一些示例中，所述钛中，碳元素的含量为不高于0.08重量％。在一些示例中，碳元素的含量为不高于0.05重量％，例如可以为0.01-0.03重量％。
在一些示例中，所述钛中，氮元素的含量为不高于0.05重量％。在一些示例中，氮元素的含量为不高于0.04重量％，例如可以为0.003-0.009重量％。
在一些示例中，所述钛中，铝元素的含量为不高于0.06重量％，在一些示例中，铝元素的含量为不高于0.04重量％。
在一些示例中，以钛合金的总量为基准，所述钛合金中铝元素的含量为0.005-8重量％，在一些示例中，铝元素的含量为0.02-7重量％。
在一些示例中，以钛合金的总量为基准，所述钛合金中钒元素的含量为0.001-8重量％， 例如可以为0.002-6重量％。
在一些示例中，以钛合金的总量为基准，所述钛合金中钼元素的含量为0.001-1重量％，例如可以为0.002-0.5重量％。
在一些示例中，所述钛或钛合金为选自TA1、TA2、TA3、TA4、TA18、TA10和TC4中的一种或两种以上。在一些具体示例中，所述钛或钛合金为选自TA2、TA4、TA18和TC4中的一种或两种以上。
在本发明的一些示例中，所述铝合金为选自5系铝合金、6系铝合金和7系铝合金中的一种或两种以上。
在一些示例中，所述5系铝合金中，以铝合金的总量为基准，镁元素的含量为2重量％以上。在一些示例中，镁元素的含量为2-6重量％，例如可以为2-3重量％。所述5系铝合金中，以铝合金的总量为基准，硅元素的含量为不高于1重量％，例如可以为0.05-0.2重量％。所述5系铝合金中，以铝合金的总量为基准，铁元素的含量为不高于1重量％，例如可以为0.1-0.5重量％。所述5系铝合金中，以铝合金的总量为基准，铜元素的含量为不高于0.5重量％，例如可以为0.005-0.1重量％。所述5系铝合金中，以铝合金的总量为基准，锰元素的含量为不高于1重量％，例如可以为0.01-0.5重量％。所述5系铝合金中，以铝合金的总量为基准，铬元素的含量为不高于0.8重量％，例如可以为0.1-0.5重量％。所述5系铝合金中，以铝合金的总量为基准，锌元素的含量为不高于0.2重量％，例如可以为0.005-0.05重量％。所述5系铝合金中，以铝合金的总量为基准，钛元素的含量为不高于0.5重量％，例如可以为0.05-0.2重量％。
在一些示例中，所述6系铝合金中，以铝合金的总量为基准，硅元素的含量为0.2重量％以上，在一些示例中，硅元素的含量为0.25-1重量％，例如可以为0.4-0.8重量％。所述6系铝合金中，以铝合金的总量为基准，镁元素的含量为0.35重量％以上，在一些示例中镁元素的含量为0.4-1.2重量％，例如可以为0.5-0.9重量％。所述6系铝合金含或不含铜元素，一般地，所述6系铝合金中，以铝合金的总量为基准，铜元素的含量为0.005重量％以上，在一些示例中，铜元素的含量为0.006-1.1重量％，例如可以为0.006-0.8重量％。所述6系铝合金中，以铝合金的总量为基准，铁元素的含量为不高于0.5重量％，例如可以为0.04-0.3重量％。所述6系铝合金中，以铝合金的总量为基准，锰元素的含量为不高于1重量％，例如可以为0.02-0.8重量％。所述6系铝合金中，以铝合金的总量为基准，铬元素的含量为不高于0.5重量％，例如可以为0.05-0.2重量％。所述6系铝合金中，以铝合金的总量为基准，锌元素的含量为不高于0.1重量％，例如可以为0.001-0.05重量％。所述6系铝合金中，以铝合金的总量为基准，钛元素的含量为不高于0.5重量％，例如可以为0.05-0.2重量％。
在一些示例中，所述7系铝合金中，以铝合金的总量为基准，锌元素的含量为1-10重量％。
在一些示例中，所述铝合金为选自GM55、5052、5252、5182、5086、6063、6061、6013、7003、7005、7A03、7A05和7075中的一种或两种以上。在一些示例中，所述铝合金为选自6063、5052和6013中的一种或两种以上。
根据本申请的壳体，所述内层的厚度和所述外层的厚度可以根据壳体的具体使用场合进行选择，以能满足使用要求为准。在一些实施方式中，所述内层的至少部分的厚度为0.3-6mm；在一些实施方式中，所述内层的至少部分的厚度为0.4-3mm，例如可以为0.5-1mm；在一些实施方式中，所述外层的至少部分的厚度为0.1-1mm，例如可以为0.2-0.6mm。在一些实施方式中，所述内层与所述外层的厚度比为1-40：1，在一些实施方式中，所述内层与所述外层的厚度比为1.1-20：1，在一些实施方式中，所述内层与所述外层的厚度比为1.2-10：1，在一些实施方式中，所述内层与所述外层的厚度比为1.2-5：1，在一些实施方式中，所述内层与所述外层的厚度比为1.2-4：1。上述实施方式的壳体特别适于作为手机壳体。
根据本申请的壳体，在一些实施方式中，所述框体具有至少一个功能槽，所述功能槽至少部分切断所述框体的内层和外层。所述功能槽可以为天线槽、耳机槽和充电槽中的一种或两种以上的组合。所述功能槽根据壳体的具体使用要求可以进行填充，以满足使用要求。在一种实施方式中，至少部分功能槽中填充非导电材料，所述非导电材料含有高分子材料以及可选的增强材料，在一些实施方式中，填充非导电材料的功能槽为天线槽。在一些实施方式中，所述非导电材料含有增强材料，以所述非导电材料的总量为基准，所述增强材料的含量可以为15-65重量％，在一些实施方式中，所述增强材料的含量为25-60重量％，在一些实施方式中，所述增强材料的含量为35-55重量％。所述增强材料可以为纤维，例如玻璃纤维。所述非导电材料可以为聚对苯二甲酸丁二醇酯、聚苯硫醚、聚酰胺、聚邻苯二酰胺、聚丙烯、聚碳酸酯、聚亚苯基砜和聚醚醚酮中的一种或两种以上。在一些实施方式中，所述非导电材料与所述功能槽的内表面之间为无缝结合。
根据本申请的壳体，在一些实施方式中，所述外层的外表面形成有装饰。所述装饰可以采用常规方法形成，例如可以为由抛光、喷砂、拉丝、物理气相沉积、激光镭雕、喷涂油墨、喷涂油漆和防指纹镀膜中的一种或两种以上方法形成。在一些实施方式中，所述装饰采用抛光与选自物理气相沉积、防指纹镀膜和激光镭雕中的一种或两种以上的组合形成。
根据本申请的壳体，在一些实施方式中，所述壳体还可以包括中板，所述中板的外边缘与所述框体的内表面结合。所述中板与所述框体可以为一体形成，所述中板的外边缘与所述框体的内表面也可以通过连接方式结合，所述连接方式例如可以为焊接。本申请中，“一 体形成”是指内层由框体的至少部分材料形成，并非将内层与框体通过焊接等连接方式结合形成。
在中板与框体为一体形成的一种实施方式中，所述中板与所述内层为一体形成。在一些实施方式中，所述中板与所述内层的厚度可以为相同，所述中板的厚度也可以为小于所述内层的厚度，或者所述中板的厚度也可以为大于所述内层的厚度。在所述中板的厚度小于所述内层的厚度时，可以为所述中板的底面与所述内层的底面平齐，所述中板的上表面低于所述内层的上表面；也可以为所述中板的上表面与所述内层的上表面平齐，所述中板的底面低于所述内层的底面；还可以是所述中板的上表面和底面均低于所述内层的上表面和底面。本申请中，“底面”、“上表面”以及“下表面”中的方位是由壳体在使用状态下的方向确定，例如：壳体作为电子产品的外壳时，以电子产品在使用状态下方向确定。
在中板与框体为一体形成的另一种实施方式中，所述中板与所述外层为一体形成。在一些实施方式中，所述中板的厚度可以为与所述外层的厚度相同，所述中板的厚度也可以为小于所述外层的厚度，所述中板的厚度还可以为大于所述外层的厚度。在所述中板的厚度小于所述外层的厚度时，可以是所述中板的底面所述外层的底面平齐，所述中板的上表面低于所述外层的上表面；也可以是所述中板的上表面与所述外层的上表面平齐，所述中板的底面低于所述外层的底面；还可以是所述中板的上表面和底面均低于所述外层的上表面和底面。
在中板与框体为一体形成的又一种实施方式中，所述中板与所述外层和所述内层为一体形成。在一些实施方式中，可以是所述中板的底面和上表面分别与所述外层的底面和所述内层的上表面平齐，也可以是所述中板的底面与所述外层的底面平齐，所述中板的上表面低于所述内层的上表面，还可以是所述中板的底面低于所述外层的底面，所述中板的上表面与所述内层的上表面平齐；又可以是所述中板的底面和上表面分别低于所述外层的底面和所述内层的上表面。
根据本申请的壳体，在一些实施方式中，所述后盖的材料为玻璃、陶瓷和聚合物中的一种或两种以上的组合。在一些实施方式中，所述后盖可以为2D聚合物、2.5D陶瓷或者3D玻璃。
根据本申请的壳体，在一些实施方式中，所述框体的比热容为0.3-1.2J/(g·K)，例如可以为0.55-0.95J/(g·K)。本申请中，框体的比热容采用GB/T 13464-2008中规定的方法测定。
根据本申请的壳体，在一些实施方式中，所述框体从内层向外层方向的热导率为10-80W/(m·K)；在一些实施方式中，所述框体从内层向外层方向的热导率为20-70W/(m·K)；在一些实施方式中，所述框体从内层向外层方向的热导率为25-65W/(m·K)，；在一些实施方 式中，所述框体从内层向外层方向的热导率为30-60W/(m·K)。本申请中，框体的热导率采用ASTM E1461-2013中规定的方法测定。
根据本申请的第二个方面，本申请提供了一种壳体的制备方法，该方法包括以下步骤：
S1、提供内层坯料板以及外层坯料板，所述外层坯料板为选自不锈钢、钛和钛合金中的一种或两种以上，所述内层坯料板为选自铝和铝合金中的一种或两种以上；
S2、将所述内层坯料板的待结合面以及所述外层坯料板的待结合面进行粗化处理；
S3、将所述内层坯料板的待结合面与所述外层坯料板的待结合面叠合后进行轧制，形成复合板材，所述轧制的条件使得压下量为大于5％；
S4、将所述复合板材进行加工，形成具有框体的壳体，所述框体包括由所述内层坯料板形成的内层、以及由所述外层坯料板形成的外层，所述内层的内表面朝向框体的内部，所述外层的外表面远离内层的内表面构成所述框体的外表面；
S5、在所述框体的底面安装后盖。
根据本申请的方法，步骤S1中，所述外层坯料板为选自不锈钢、钛和钛合金中的一种或两种以上，所述内层坯料板为选自铝和铝合金中的一种或两种以上。
在一些示例中，所述不锈钢含有铬元素和镍元素，以不锈钢的总量为基准，铬元素的含量为15-20重量％，例如可以为16-19重量％；所述不锈钢中镍元素的含量为5-16重量％，例如可以为6-14重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中铜元素的含量为不高于1重量％，在一些示例中，所述不锈钢中铜元素的含量为0.01-0.5重量％，在另一些示例中，所述不锈钢中铜元素的含量为不高于0.25重量％，例如可以为0.05-0.25重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中锰元素的含量为不高于2重量％，在一些示例中，所述不锈钢中锰元素的含量为不高于1.8重量％，例如可以为1.2-1.8重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中碳元素的含量为不高于0.1重量％，在一些示例中，所述不锈钢中碳元素的含量为不高于0.08重量％，例如可以为0.01-0.08重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中硫元素的含量为不高于0.04重量％，在一些示例中，所述不锈钢中硫元素的含量为不高于0.03重量％，例如可以为0.0003-0.004重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中钼元素的含量为不高于3重量％，例如可以为0.0005-2.5重量％。
在一些示例中，以不锈钢的总量为基准，所述不锈钢中硅元素的含量为不高于1重量％， 在一些示例中，所述不锈钢中硅元素的含量为不高于0.7重量％，例如可以为0.5-0.7重量％。
在一些实施例中，所述不锈钢为选自SUS304、SUS316L、S30408和S31603中的一种或两种以上。
在一些示例中，所述钛中，铁元素的含量为不高于0.5重量％；在一些示例中，铁元素的含量为不高于0.3重量％；在另一些示例中，铁元素的含量为不高于0.2重量％，例如可以为0.04-0.1重量％。
在一些示例中，所述钛中，碳元素的含量为不高于0.08重量％；在一些示例中，碳元素的含量为不高于0.05重量％，例如可以为0.01-0.03重量％。
在一些示例中，所述钛中，氮元素的含量为不高于0.05重量％；在一些示例中，氮元素的含量为不高于0.04重量％，例如可以为0.003-0.009重量％。
在一些示例中，所述钛中，铝元素的含量为不高于0.06重量％；在一些示例中，铝元素的含量为不高于0.04重量％。
在一些示例中，以钛合金的总量为基准，所述钛合金中铝元素的含量为0.005-8重量％，在一些示例中，铝元素的含量为0.02-7重量％。
在一些示例中，以钛合金的总量为基准，所述钛合金中钒元素的含量为0.001-8重量％，例如可以为0.002-6重量％。
在一些示例中，以钛合金的总量为基准，所述钛合金中钼元素的含量为0.001-1重量％，例如可以为0.002-0.5重量％。
在本申请的一些实施例中，所述钛或钛合金为选自TA1、TA2、TA3、TA4、TA18、TA10和TC4中的一种或两种以上。在一些具体示例中，所述钛或钛合金为选自TA2、TA4、TA18和TC4中的一种或两种以上。
根据本申请的一些实施例，所述铝合金为选自5系铝合金、6系铝合金和7系铝合金中的一种或两种以上。
在一些示例中，所述5系铝合金中，以铝合金的总量为基准，镁元素的含量为2重量％以上，在一些示例中，镁元素的含量为2-6重量％，例如可以为2-3重量％。所述5系铝合金中，以铝合金的总量为基准，硅元素的含量为不高于1重量％，例如可以为0.05-0.2重量％。所述5系铝合金中，以铝合金的总量为基准，铁元素的含量为不高于1重量％，例如可以为0.1-0.5重量％。所述5系铝合金中，以铝合金的总量为基准，铜元素的含量为不高于0.5重量％，例如可以为0.005-0.1重量％。所述5系铝合金中，以铝合金的总量为基准，锰元素的含量为不高于1重量％，例如可以为0.01-0.5重量％。所述5系铝合金中，以铝合金的总量为基准，铬元素的含量为不高于0.8重量％，例如可以为0.1-0.5重量％。所述5系铝合金 中，以铝合金的总量为基准，锌元素的含量为不高于0.2重量％，例如可以为0.005-0.05重量％。所述5系铝合金中，以铝合金的总量为基准，钛元素的含量为不高于0.5重量％，例如可以为0.05-0.2重量％。
在一些示例中，所述6系铝合金中，以铝合金的总量为基准，硅元素的含量为0.2重量％以上，在一些示例中，硅元素的含量为0.25-1重量％，例如可以为0.4-0.8重量％。所述6系铝合金中，以铝合金的总量为基准，镁元素的含量为0.35重量％以上，在一些示例中，镁元素的含量为0.4-1.2重量％，例如可以为0.5-0.9重量％。所述6系铝合金含或不含铜元素，一般地，所述6系铝合金中，以铝合金的总量为基准，铜元素的含量为0.005重量％以上，在一些示例中，铜元素的含量为0.006-1.1重量％，例如可以为0.006-0.8重量％。所述6系铝合金中，以铝合金的总量为基准，铁元素的含量为不高于0.5重量％，例如可以为0.04-0.3重量％。所述6系铝合金中，以铝合金的总量为基准，锰元素的含量为不高于1重量％，例如可以为0.02-0.8重量％。所述6系铝合金中，以铝合金的总量为基准，铬元素的含量为不高于0.5重量％，例如可以为0.05-0.2重量％。所述6系铝合金中，以铝合金的总量为基准，锌元素的含量为不高于0.1重量％，例如可以为0.001-0.05重量％。所述6系铝合金中，以铝合金的总量为基准，钛元素的含量为不高于0.5重量％，例如可以为0.05-0.2重量％。
在一些示例中，所述7系铝合金中，以铝合金的总量为基准，锌元素的含量为1-10重量％。
在一些示例中，所述铝合金为选自GM55、5052、5252、5182、5086、6063、6061、6013、7003、7005、7A03、7A05和7075中的一种或两种以上。在一些示例中，所述铝合金为选自6063、5052和6013中的一种或两种以上。
所述外层坯料板和所述内层坯料板的厚度可以根据壳体的具体使用要求进行选择。在一些实施方式中，所述内层坯料板的厚度使得形成的内层的至少部分的厚度为0.3-6mm，在一些实施方式中，所述内层坯料板的厚度使得形成的内层的至少部分的厚度为0.4-3mm，例如可以为0.5-1mm；在一些实施方式中，所述外层坯料板的厚度使得形成的外层的至少部分的厚度为0.1-1mm，例如可以为0.2-0.6mm。在一些实施方式中，所述内层坯料板的厚度和所述外层坯料板的厚度使得形成的内层与外层的厚度比为1-40：1，在一些实施例中，所述内层坯料板的厚度和所述外层坯料板的厚度使得形成的内层与外层的厚度比为1.1-20：1，在一些实施例中，所述内层坯料板的厚度和所述外层坯料板的厚度使得形成的内层与外层的厚度比为1.2-10：1，在一些实施例中，所述内层坯料板的厚度和所述外层坯料板的厚度使得形成的内层与外层的厚度比为1.2-5：1，在一些实施例中，所述内层坯料板的厚度和所 述外层坯料板的厚度使得形成的内层与外层的厚度比为1.2-4：1。
根据本申请的方法，步骤S2中，所述粗化处理用于使得内层坯料板的待结合面和外层坯料板的待结合面粗糙化。根据本申请一些实施方式，所述粗化处理的条件使得所述内层坯料板的待结合面以及所述外层坯料板的待结合面的粗糙度Ra各自为0.1-15μm；在一些实施方式中，所述粗化处理的条件使得所述内层坯料板的待结合面以及所述外层坯料板的待结合面的粗糙度Ra各自为0.5-10μm；在一些实施方式中，所述粗化处理的条件使得所述内层坯料板的待结合面以及所述外层坯料板的待结合面的粗糙度Ra各自为1-5μm。
根据本申请的方法，所述内层坯料板的待结合面的粗糙度和所述外层坯料板的待结合面的粗糙度可以为相同，也可以为不同。在一些实施方式中，所述内层坯料板的待结合面的粗糙度为不小于所述外层坯料板的待结合面的粗糙度。在一些实施方式中，所述内层坯料板的待结合面的粗糙度为大于所述外层坯料板的待结合面的粗糙度。在一些实施方式中，所述内层坯料板的待结合面的粗糙度为大于所述外层坯料板的待结合面的粗糙度，且所述内层坯料板的待结合面的粗糙度Ra为1-6μm，在一些示例中为1.5-5μm，在一些示例中为1.8-4.6μm；所述外层坯料板的待结合面的粗糙度Ra为0.8-4μm，在一些示例中为1-3.5μm，在一些示例中为1.2-2.6μm。
根据本申请的一些实施方式，步骤S2中，所述粗化处理可以为选自拉丝、喷砂和化学腐蚀中的一种或两种以上的组合。所述化学腐蚀可以通过在内层的待结合面和外层的待结合面分别施用蚀刻剂，从而在内层坯料板的待结合面和外层坯料板的待结合面上形成粗糙结构。所述蚀刻剂的种类可以根据内层和外层的材料进行选择，以能使得内层的待结合面和外层的待结合面被腐蚀形成粗糙表面为准，可以为酸，也可以为碱。
根据本申请的方法，在一些实施方式中，所述粗化处理为拉丝。与喷砂和化学腐蚀相比，采用拉丝进行粗化处理操作简单，且更容易达到所需要的粗糙度，能使得内层坯料板和外层坯料板压合之后具有更高的结合强度。
根据本申请的一些实施方式，所述拉丝采用钢丝刷、砂带和尼龙轮中的一种或者两种以上分别对所述外层坯料板的待结合面和所述内层坯料板的待结合面进行打磨，从而进行粗糙化。所述打磨的程度使得经粗化处理的待结合面的粗糙度分别满足前文所述要求为准。
根据本申请的方法，在一些实施方式中，步骤S2还包括在所述粗化处理之前进行的预粗化处理，在所述预粗化处理中，将所述内层坯料板和/或所述外层坯料板进行轧制，所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊中的一个轧制旋转辊为光滑辊，另一个轧制旋转辊为粗糙辊，所述粗糙辊与所述待结合表面接触，所述光滑辊的表面为光滑表面，所述粗糙辊的表面具有纹路。在所述粗化处理之前进行预粗化处理，能进一步提高粗化处 理的效果，提高最终形成的壳体中内层和外层之间的结合强度。
根据本申请的一些实施方式，在预粗化处理中，所述轧制的压下量可以为1-15％，在一些示例中，所述轧制的压下量为2-10％，例如可以为3-8％。
根据本申请的一些实施方式，所述预粗化处理中，所述轧制可以在10-60℃的温度下进行，在一些示例中，所述轧制可以在15-50℃的温度下进行，例如可以在25-45℃的温度下进行。
在一些实施方式中，所述纹路的图案为直纹、雪花纹、交叉纹和碎丝纹中的一种或两种以上，所述纹路为垂直于该轧制旋转辊的轴向。在一些实施方式中，相邻两条纹路之间的距离为0.01-0.15mm。
在一些实施方式中，所述预粗化处理的条件使得经预粗化处理的待结合表面的表面粗糙度Ra为0.05-5μm，在一些示例中为0.08-2μm，例如可以为0.1-1μm。在一些示例中，所述内层坯料板的经预粗化处理的待结合面的粗糙度为不小于所述外层坯料板的经预粗化处理的待结合面的粗糙度。在一些示例中，所述内层坯料板的待结合面的经预粗化处理的粗糙度为大于所述外层坯料板的待结合面的经预粗化处理的粗糙度。在一些示例中，所述内层坯料板的待结合面的经预粗化处理的粗糙度为大于所述外层坯料板的待结合面的经预粗化处理的粗糙度，且所述内层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.05-1μm，在一些示例中为0.1-0.8μm，在一些示例中为0.15-0.4μm；所述外层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.02-0.8μm，在一些示例中为0.05-0.6μm，在一些示例中为0.1-0.3μm。
根据本申请的一些实施方式，步骤S2还包括将经粗化处理的待结合表面进行清洗，以除去油污和粘附在待结合表面的杂质。所述清洗可以为水洗，所述水洗可以为将待结合表面采用水进行冲洗，在进行冲洗时，根据待结合表面的油污种类，可以采用去油剂，以提高清洗效果。
在一些实施方式中，所述清洗包含等离子清洗。所述等离子体清洗可以在等离子体清洗机中进行。在一些实施方式中，所述清洗包括依次进行的水洗和等离子体清洗，在水洗之后进行等离子体清洗能进一步清除待结合表面的细微油污和杂质，从而提高最终制备的壳体中内层与外层之间的结合强度。在一些实施方式中，所述等离子清洗在真空环境下进行，所述真空环境的压力为不高于8×10 -3Pa，在一些示例中，所述真空环境的压力为1×10 -3Pa至7.5×10 -3Pa，在一些示例中，所述真空环境的压力为5×10 -3Pa至7×10 -3Pa，所述压力为绝对压力。
根据本申请的一些实施方式，步骤S3中，可以将内层坯料板的经粗化处理的待结合面 与外层坯料板的经粗化处理的待结合面叠合，然后进行轧制，形成复合板材。在一些实施方式中，步骤S3中，所述轧制的条件使得压下量为大于5％，例如可以为6％以上。在一些实施方式中，从提高内层坯料板和外层坯料板压合之后的结合强度的角度出发，所述轧制的条件使得压下量为8-70％，在一些示例中，所述轧制的条件使得压下量为10-60％，在一些示例中，所述轧制的条件使得压下量为20-40％。所述压下量是指内层坯料板和外层坯料板在轧制之后的厚度总变化量与轧制之前的总厚度的百分比值。在一种实施方式中，所述外层坯料板为不锈钢，所述内层坯料板为铝合金，所述轧制的条件使得压下量为10-40％，例如可以为20-30％。在另一种实施方式中，所述外层坯料板为钛和/或钛合金，所述内层坯料板为铝合金，所述轧制的条件使得压下量为10-40％，例如可以为30-40％。
在一些实施方式中，所述轧制可以在10-500℃的温度下进行，也可以在15-400℃的温度下进行，还可以在25-300℃的温度下进行。
根据本申请的一些实施方式，步骤S3中，所述轧制采用成对的轧制旋转辊，所述轧制旋转辊均为光滑辊，所述光滑辊的表面为光滑表面。
根据本申请的一些实施方式，步骤S3中，在真空环境下将所述内层坯料板的待结合面与所述外层坯料板的待结合面叠合后进行轧制，这样能提高最终制备的壳体中内层与外层之间的结合力。所述真空环境的压力可以为1×10 -1Pa至1×10 -3Pa，所述压力为绝对压力。从提高最终制备的壳体中内层和外层之间的结合力的角度出发，所述真空环境的压力可以为1×10 -3Pa至8×10 -3Pa，还可以为5×10 -3Pa至7×10 -3Pa，所述压力为绝对压力。
根据本申请的一些实施方式，步骤S4中，所述加工的方法可以为常规选择，例如可以为冲压和/或铣削。在一些实施方式中，所述加工为铣削。在一些实施方式中，所述加工为冲压和铣削，其中，所述冲压在所述铣削之前进行。
根据本申请的一些实施方式，步骤S4中，通过对复合板材进行加工，以形成框体。步骤S4中，所述加工为冲压和/或铣削。在一些实施方式中，所述加工为铣削。在另一些实施方式中，所述加工为冲压和铣削，其中，所述冲压在所述铣削之前进行。
根据本申请的一些实施方式，还包括在所述框体中设置中板的操作，所述中板的外边缘与所述框体的内表面结合。所述中板可以与所述框体一体形成，也可以在形成框体后，将中板置于框体中通过至少一种连接方式将中板与框体结合在一起，所述连接例如可以为焊接。
在将中板与框体一体形成时，中板由内层坯料板的至少部分和/或外层坯料板的至少部分形成，使得中板与框体形成一体形成。具体地，在将中板与框体一体形成时，步骤S4中，所述加工可以为以下加工方式中的一种：
加工方式一：将所述复合板材冲压成具有预制中板以及预制框体的预制壳体，铣削除去预制中板的内层坯料板和/或部分外层坯料板以形成中板，铣削除去预制框体的部分内层坯料板和/或部分外层坯料板以形成框体；
加工方式二：将所述复合板材冲压成具有预制中板以及预制框体的预制壳体，铣削除去预制中板的外层坯料板和/或部分内层坯料板以形成中板，铣削除去预制框体的部分内层坯料板和/或部分外层坯料板以形成框体；
加工方式三：将所述复合板材冲压成具有预制中板以及预制框体的预制壳体，铣削除去预制中板的部分内层坯料板和部分外层坯料板以形成中板，铣削除去预制框体的部分内层坯料板和/或部分外层坯料板以形成框体。
根据本申请的一些实施方式，还可以包括步骤S61以及可选的步骤S62，
在步骤S61中，对框体进行加工，在框体上形成至少部分切断所述内层和所述外层的至少一个功能槽；
在步骤S62中，在至少部分功能槽中填充非导电材料。
步骤S61中，所述加工的方式可以为铣削。
根据本申请的一些实施方式，所述功能槽可以为天线槽、耳机槽和充电槽中的一种或两种以上的组合。功能槽的具体位置可以根据该功能槽的功能以及产品的具体设计要求进行选择，本申请对此没有特别限定。在一些实施方式中，作为天线槽使用的功能槽进行步骤S52。
根据本申请的一些实施方式，步骤S62中，所述非导电材料含有高分子材料以及可选的增强材料。在一些示例中，所述非导电材料含有增强材料，以所述非导电材料的总量为基准，所述增强材料的含量可以为15-65重量％，在一些示例中，所述增强材料的含量为25-60重量％，在一些示例中，所述增强材料的含量为35-55重量％。所述增强材料可以为纤维，例如玻璃纤维。在一些示例中，所述非导电材料为聚对苯二甲酸丁二醇酯、聚苯硫醚、聚酰胺、聚邻苯二酰胺、聚丙烯、聚碳酸酯、聚亚苯基砜和聚醚醚酮中的一种或两种以上。
根据本申请的一些实施方式，步骤S62中，可以采用常规方法将非导电材料注入所述功能槽，从而填充在所述功能槽中，并与所述功能槽的内壁形成无缝结合。从提高非导电材料与功能槽内表面的结合力的角度出发，可以在功能槽的内表面上形成孔洞、凹槽和凸台中的一种或两种以上，将非导电材料注入功能槽中，非导电材料可以被锚定在所述孔洞和/或凹槽中，或者所述凸台被锚定在非导电材料中，从而提高非导电材料和功能槽内表面之间的结合强度。在一些示例中，在功能槽的内表面上形成孔洞，所述孔洞的平均孔口直径可以为10-60nm。
根据本申请的一些实施方式，还可以包括步骤S7，在步骤S7中，对所述壳体的外表面的表面进行装饰。所述装饰可以为抛光、喷砂、拉丝、物理气相沉积、激光镭雕、喷涂油墨、喷涂油漆和防指纹镀膜中的一种或两种以上的组合。在一些示例中，所述装饰为抛光与选自物理气相沉积、防指纹镀膜和激光镭雕中的至少一种的组合。
根据本申请的一些实施方式，还可以包括步骤S8，在步骤S8中，在所述中板上形成功能元件，在所述中板上形成功能元件的方法包括铣削、激光切割、焊接、粘贴和组装中的一种或者两种以上的组合。
根据本申请的一些实施方式，所述后盖的材料为玻璃、陶瓷和聚合物中的一种或两种以上的组合。具体地，所述后盖可以为2D聚合物、2.5D陶瓷或者3D玻璃。根据本申请的一些实施方式，可以采用常规方法将后盖安装在框体上，例如：可以采用胶带将后盖粘结在框体上。根据本申请的一些实施方式，在包括步骤S61、S62、S7和S8中的一者或两者以上时，这些步骤先于步骤S5进行，即在步骤S5之前进行步骤S61、S62、S7和S8。
本申请提供由本申请第二个方面所述方法制备的壳体。
根据本申请的第三个方面，本申请提供了电子产品，其中，该电子产品具有本申请第一个方面所述的壳体。
所述电子产品可以为需要壳体的各种终端设备，如手机、平板电脑、或者可穿戴电子产品。
以下结合实施例详细说明本申请，但并不因此限制本申请的范围。
以下实施例和对比例中，粗糙度测试方法为GB/T 2523-2008《冷轧金属薄板(带)表面粗糙度和峰值数测量方法》。
以下实施例和对比例中，内层和外层之间的单位宽度结合力采用以下方法测定：
(1)截取复合板材长×宽尺寸为200×20mm，然后在离一端10mm处的内层面即铝合金层面切一条凹槽，凹槽切穿大部分内层，且未切至外层；
(2)用钳子夹住有凹槽的一端，向外层方向90度弯折样片，直至内层断裂；
(3)用钳子剥离外层，剥离长度在110mm；
(4)在内层的表面绑上200×20mm的金属样条作为支撑条，支撑条厚度为3.0mm，用胶带将上下位置固定，其中上方距剥离分界面10mm，下方距下端边缘10mm；
(5)将固定好的测试样条放入万能拉伸试验机中，拉伸机的一个夹头夹住剥离出的外层，另外一个夹头夹住剥离出的内层，内外两层呈180度剥离开，剥离速度为50mm/min，剥离长度为50mm；
(6)读取记录表中水平段强度最低的数值作为结合力数值。
以下实施例和对比例中，框体的比热容采用GB/T 13464-2008中规定的方法测定；框体的热导率采用ASTM E1461-2013中规定的方法测定。
以下实施例和对比例中，采用的铝合金的组成如下表1所示。
表1(以铝合金的总量为基准，以重量百分含量计，余量为铝)
铝合金牌号 Si Fe Cu Mn Mg Cr Zn Ti
6063 0.415 0.052 0.006 0.039 0.532 0.089 0.005 0.091
5052 0.102 0.199 0.007 0.032 2.235 0.195 0.007 0.085
6013 0.723 0.169 0.607 0.530 0.817 0.092 0.012 0.105
以下实施例和对比例中，采用的不锈钢的组成如下表2所示。
表2(以不锈钢的总量为基准，以重量百分含量计，余量为铁)
不锈钢牌号 Cu Mn Cr Ni C S Mo Si
SUS304 0.059 1.796 18.95 10.143 0.069 0.00039 0.0007 0.632
S31603 0.213 1.522 18.93 10.56 0.0278 0.0031 2.03 0.596
以下实施例和对比例中，采用的钛或钛合金的组成如下表3所示。
表3(以钛或钛合金的总量为基准，以重量百分含量计，余量为钛)
钛合金牌 Al Mo V N C Fe
TA4 0.036 0.005 0.007 0.0069 0.0103 0.256
实施例1-10用于说明本申请。
实施例1
(1)内层坯料板为牌号为5052的铝合金板材，外层坯料板为牌号为S31603的不锈钢板材。所述内层坯料板的待结合面和所述外层坯料板的待结合面采用以下方法依次进行预粗化处理和粗化处理。
(1-1)预粗化处理
分别将内层坯料板和外层坯料板进行轧制，所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊中的一个轧制旋转辊为光滑辊，另一个轧制旋转辊为粗糙辊，所述粗糙辊与所述待结合表面接触，所述光滑辊的表面为光滑表面，所述粗糙辊的表面具有纹路，所述纹路为垂直于该轧制旋转辊的轴向，所述纹路的图案为直纹，相邻两条纹路之间的距离在0.03-0.10mm的范围内。
轧制的压下量为8％，轧制在30℃的温度下进行，内层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.33μm，外层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.24μm。
(1-2)粗化处理
采用钢丝刷分别对外层坯料板的经预粗化处理的待结合面和内层坯料板的经预粗化处理的待结合面进行打磨，使得内层坯料板经打磨的待结合面的粗糙度Ra为4.2μm，外层坯料板经打磨的待结合面的粗糙度Ra为2.6μm。
(1-3)清洗
分别对外层坯料板和内层坯料板的经粗化处理的待结合面进行水洗，去除表面油污。将经水洗的外层坯料板和内层坯料板的经粗化处理的待结合面干燥后进行等离子体清洗，所述等离子体清洗在压力为5×10 -3Pa(绝对压力)的条件下进行。
(2)轧制
将内层坯料板的经粗化处理的表面以及外层坯料板的经粗化处理的表面叠合后，进行轧制，形成复合材料板材，其中，轧制在25℃的温度下于压力为7×10 -3Pa的真空中进行，轧制的压下量为30％。轧制后形成的复合材料中，外层坯料板的厚度为0.82mm，内层坯料板的厚度为3.25mm，测定复合材料板材中内层与外层之间的单位宽度结合力为56N/mm。所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊均为光滑辊。
(3)将复合材料板材进行冲压形成带有框体的壳体坯件，将壳体坯件进行铣削，其中，进行铣削时，将外层坯料板除形成框体外层的部分保留外，剩余部分全部铣削除去，并对内层的上表面和底面进行铣削加工，形成具有框体和中板的壳体，其中，框体具有由内层坯料板形成的内层(内层的厚度为0.82mm)、以及由外层坯料板形成的外层(外层的厚度为0.43mm)，所述中板由所述内层坯料板形成，且所述中板的上表面低于所述内层的上表面，所述中板的底面低于所述内层的底面。
同时，对框体进行横向铣削，形成横向切断框体的内层和外层天线槽。在天线槽中注塑含有40重量％玻璃纤维的聚对苯二甲酸丁二醇酯，填充天线槽。
经测定，框体的比热容为0.65J/(g·K)，框体沿内层向外层方向的热导率为31.9W/(m·K)。
(4)对框体外层的外表面进行装饰，所述装饰为依次进行抛光处理、物理气相沉积、防指纹镀膜和激光镭雕，并根据需要组装上其它零部件。
(5)在框体的底面安装后盖，后盖与框体通过胶带粘结在一起，所述后盖的材质为3D玻璃(如图1所示)，制成最终需要的手机壳体。
实施例2
采用与实施例1相同的方法制备手机壳体，不同的是，不进行步骤(1-1)的预粗化处理，而是直接进行粗化处理。测定复合材料板材中内层和外层之间的单位宽度结合力为42N/mm。经测定，框体的比热容为0.65J/(g·K)，框体沿内层向外层方向的热导率为25.1W/(m·K)。
对比例1
采用与实施例1相同的方法制备手机壳体，不同的是，不进行步骤(1-2)的粗化处理，而是进行预粗化处理。测定复合材料板材中内层和外层之间的单位宽度结合力为19N/mm。经测定，框体的比热容为0.66J/(g·K)，框体沿内层向外层方向的热导率为11.6W/(m·K)。
实施例3
采用与实施例1相同的方法制备手机壳体，不同的是，步骤(1-3)不进行等离子体清洗，而是采用去离子水进行冲洗。测定复合材料板材中内层和外层之间的单位宽度结合力为51N/mm。经测定，框体的比热容为0.66J/(g·K)，框体沿内层向外层方向的热导率为28.5W/(m·K)。
实施例4
采用与实施例1相同的方法制备手机壳体，不同的是，步骤(2)中所述轧制在常压(即，1标准大气压)下进行。测定复合材料板材中内层和外层之间的单位宽度结合力为39N/mm。经测定，框体的比热容为0.67J/(g·K)，框体沿内层向外层方向的热导率为22.8W/(m·K)。
实施例5
采用与实施例1相同的方法制备手机壳体，不同的是，步骤(2)中，轧制在压力为9×10 -2Pa(绝对压力)的条件下进行。测定复合材料板材中内层和外层之间的单位宽度结合力为48N/mm。经测定，框体的比热容为0.65J/(g·K)，框体沿内层向外层方向的热导率为26.9W/(m·K)。
对比例2
采用与实施例1相同的方法制备手机壳体，不同的是，步骤(2)中，轧制的压下量为5％。测定复合材料板材中内层和外层之间的单位宽度结合力为17N/mm。经测定，框体的比热容为0.66J/(g·K)，框体沿内层向外层方向的热导率为9.9W/(m·K)。
对比例3
采用与实施例1相同的方法制备手机壳体，不同的是，不进行步骤(1)，而是直接将外层坯料板和内层坯料板进行轧制。测定复合材料板材中内层和外层之间的单位宽度结合力为9N/mm。经测定，框体的比热容为0.66J/(g·K)，框体沿内层向外层方向的热导率为6.9W/(m·K)。
实施例6
(1)内层坯料板为牌号为6063的铝合金板材，外层坯料板为牌号为TA4的钛材。所述内层坯料板的待结合面和所述外层坯料板的待结合面采用以下方法依次进行预粗化处理和粗化处理。
(1-1)预粗化处理
分别将内层坯料板和外层坯料板进行轧制，所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊中的一个轧制旋转辊为光滑辊，另一个轧制旋转辊为粗糙辊，所述粗糙辊与所述待结合表面接触，所述光滑辊的表面为光滑表面，所述粗糙辊的表面具有纹路，所述纹路的图案为交叉纹，相邻两条纹路之间的距离在0.1-0.15mm的范围内。
轧制的压下量为5％，轧制在45℃的温度下进行，内层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.27μm，外层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.22μm。
(1-2)粗化处理
采用钢丝刷分别对外层坯料板的经预粗化处理的待结合面和内层坯料板的经预粗化处理的待结合面进行打磨，使得内层坯料板经打磨的待结合面的粗糙度Ra为4.6μm，外层坯料板经打磨的待结合面的粗糙度Ra为2.2μm。
(1-3)清洗
分别对外层坯料板和内层坯料板的经粗化处理的待结合面进行水洗，去除表面油污。将经水洗的外层坯料板和内层坯料板的经粗化处理的待结合面干燥后进行等离子体清洗，所述等离子体清洗在压力为5×10 -3Pa(绝对压力)的条件下进行。
(2)轧制
将内层坯料板的经粗化处理的表面以及外层坯料板的经粗化处理的表面叠合后，进行轧制，形成复合材料板材，其中，轧制在50℃的温度下于压力为6×10 -3Pa的真空中进行，轧制的压下量为40％。轧制后形成的复合材料中，外层坯料板的厚度为0.76mm，内层坯料板的厚度为3.62mm，测定复合材料板材中内层和外层之间的单位宽度结合力为58N/mm。 所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊均为光滑辊。
(3)将复合材料板材进行冲压形成带有框体的壳体坯件，将壳体坯件进行铣削，其中，进行铣削时，将内层坯料板除形成框体内层的部分保留外，剩余部分全部铣削除去，并对外层的上表面和底面进行铣削加工，形成具有框体和中板的壳体，其中，框体具有由内层坯料板形成的内层(内层的厚度为0.93mm)、以及由外层坯料板形成的外层(外层的厚度为0.26mm)，所述中板由所述外层坯料板形成，且所述中板的上表面低于所述外层的上表面，所述中板的底面低于所述外层的底面。
同时，对框体进行横向铣削，形成横向切断框体的内层和外层天线槽。在天线槽中注塑含有40重量％玻璃纤维的聚对苯二甲酸丁二醇酯，填充天线槽，制作成最终需要的手机壳体。
经测定，框体的比热容为0.78J/(g·K)，框体沿内层向外层方向的热导率为39.7W/(m·K)。
(4)对框体外层的外表面进行装饰，所述装饰为依次进行抛光处理、物理气相沉积、防指纹镀膜和激光镭雕，并根据需要组装上其它零部件。
(5)在框体的底面安装后盖，后盖与框体通过胶带粘结在一起，所述后盖的材质为2.5D陶瓷(如图2所示)，制作成最终需要的手机壳体。
实施例7
采用与实施例6相同的方法制备手机壳体，不同的是，步骤(2)中所述轧制在常压(即，1标准大气压)下进行。测定复合材料板材中内层和外层之间的单位宽度结合力为41N/mm。经测定，框体的比热容为0.79J/(g·K)，框体沿内层向外层方向的热导率为29.7W/(m·K)。
实施例8
采用与实施例6相同的方法制备手机壳体，不同的是，不进行步骤(1-1)的预粗化处理，而是直接进行粗化处理。测定复合材料板材中内层和外层之间的单位宽度结合力为45N/mm。经测定，框体的比热容为0.78J/(g·K)，框体沿内层向外层方向的热导率为30.1W/(m·K)。
实施例9
(1)内层坯料板为牌号为6013的铝合金板材，外层坯料板为牌号为SUS304的不锈钢材。所述内层坯料板的待结合面和所述外层坯料板的待结合面采用以下方法依次进行预粗化处理和粗化处理。
(1-1)预粗化处理
分别将内层坯料板和外层坯料板进行轧制，所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊中的一个轧制旋转辊为光滑辊，另一个轧制旋转辊为粗糙辊，所述粗糙辊与所述待结合表面接触，所述光滑辊的表面为光滑表面，所述粗糙辊的表面具有纹路，所述纹路的图案为雪花纹，相邻两条纹路之间的距离在0.05-0.10mm的范围内。
轧制的压下量为3％，轧制在25℃的温度下进行，内层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.18μm，外层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.11μm。
(1-2)粗化处理
采用钢丝刷分别对外层坯料板的经预粗化处理的待结合面和内层坯料板的经预粗化处理的待结合面进行打磨，使得内层坯料板经打磨的待结合面的粗糙度Ra为1.8μm，外层坯料板经打磨的待结合面的粗糙度Ra为1.2μm。
(1-3)清洗
分别对外层坯料板和内层坯料板的经粗化处理的待结合面进行水洗，除去表面油污。将经水洗的外层坯料板和内层坯料板的经粗化处理的待结合面干燥后进行等离子体清洗，所述等离子体清洗在真空度为7×10 -3Pa(绝对压力)的环境下进行。
(2)轧制
将内层坯料板的经粗化处理的表面以及外层坯料板的经粗化处理的表面叠合后，进行轧制，形成复合材料板材，其中，轧制在300℃的温度下于压力为5×10 -3Pa的真空中进行，轧制的压下量为20％。轧制后形成的复合材料中，外层坯料板的厚度为0.75mm，内层坯料板的厚度为2.86mm，测定复合材料板材中内层和外层之间的单位宽度结合力为51N/mm。所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊均为光滑辊。
(3)将复合材料板材进行冲压形成带有框体的壳体坯件，将壳体坯件进行铣削，其中，进行铣削时，对内层坯料板和外层坯料板的表面铣削除去部分表面，其中，框体具有由内层坯料板形成的内层(内层的厚度为0.52mm)、以及由外层坯料板形成的外层(外层的厚度为0.45mm)，所述中板由所述外层坯料板和内层坯料板形成，且所述中板的上表面低于所述内层的上表面，所述中板的底面低于所述外层的底面。
同时，对框体进行横向铣削，形成横向切断框体的内层和外层天线槽。在天线槽中注塑含有55重量％玻璃纤维的聚邻苯二酰胺，填充天线槽。
经测定，框体的比热容为0.62J/(g·K)，框体沿内层向外层方向的热导率为47.6W/(m·K)。
(4)对框体外层的外表面进行装饰，所述装饰为依次进行抛光处理、物理气相沉积、防指纹镀膜和激光镭雕，并根据需要组装上其它零部件。
(5)在框体的底面安装后盖，后盖与框体通过胶带粘结在一起，所述后盖的材质为2D聚合物(如图3所示)，制作成最终需要的手机壳体。
实施例10
(1)内层坯料板为牌号为6063的铝合金板材，外层坯料板为牌号为S31603的不锈钢材。所述内层坯料板的待结合面和所述外层坯料板的待结合面采用以下方法依次进行预粗化处理和粗化处理。
(1-1)预粗化处理
分别将内层坯料板和外层坯料板进行轧制，所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊中的一个轧制旋转辊为光滑辊，另一个轧制旋转辊为粗糙辊，所述粗糙辊与所述待结合表面接触，所述光滑辊的表面为光滑表面，所述粗糙辊的表面具有纹路，所述纹路的图案为雪花纹，相邻两条纹路之间的距离在0.05-0.10mm的范围内。
轧制的压下量为3％，轧制在25℃的温度下进行，内层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.21μm，外层坯料板的经预粗化处理的待结合面的粗糙度Ra为0.13μm。
(1-2)粗化处理
采用钢丝刷分别对外层坯料板的经预粗化处理的待结合面和内层坯料板的经预粗化处理的待结合面进行打磨，使得内层坯料板经打磨的待结合面的粗糙度Ra为2.1μm，外层坯料板经打磨的待结合面的粗糙度Ra为1.4μm。
(1-3)清洗
分别对外层坯料板和内层坯料板的经粗化处理的待结合面进行水洗，除去表面油污。将经水洗的外层坯料板和内层坯料板的经粗化处理的待结合面干燥后进行等离子体清洗，所述等离子体清洗在真空度为7×10 -3Pa(绝对压力)的环境下进行。
(2)轧制
将内层坯料板的经粗化处理的表面以及外层坯料板的经粗化处理的表面叠合后，进行轧制，形成复合材料板材，其中，轧制在300℃的温度下于压力为5×10 -3Pa的真空中进行，轧制的压下量为30％。轧制后形成的复合材料中，外层坯料板的厚度为0.71mm，内层坯料板的厚度为3.56mm，测定复合材料板材中内层和外层之间的单位宽度结合力为63N/mm。所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊均为光滑辊。
(3)将复合材料板材进行冲压形成带有框体的壳体坯件，将壳体坯件进行铣削，其中，进行铣削时，对内层坯料板和外层坯料板的表面铣削除去部分表面，其中，框体具有由内层坯料板形成的内层(内层的厚度为0.82mm)、以及由外层坯料板形成的外层(外层的厚 度为0.35mm)，所述中板由所述外层坯料板和内层坯料板形成，且所述中板的上表面低于所述内层的上表面，所述中板的底面低于所述外层的底面。
同时，对框体进行横向铣削，形成横向切断框体的内层和外层天线槽。在天线槽中注塑含有55重量％玻璃纤维的聚邻苯二酰胺，填充天线槽。
经测定，框体的比热容为0.68J/(g·K)，框体沿内层向外层方向的热导率为57.1W/(m·K)。
(4)对框体外层的外表面进行装饰，所述装饰为依次进行抛光处理、物理气相沉积、防指纹镀膜和激光镭雕，并根据需要组装上其他零部件。
(5)在框体的底面安装后盖，后盖与框体通过胶带粘结在一起，所述后盖的材质为3D玻璃(如图1所示)，制作成最终需要的手机壳体。
以上详细描述了本申请的优选实施方式，但是，本申请并不限于此。在本申请的技术构思范围内，可以对本申请的技术方案进行多种简单变型，包括各个技术特征以任何其它的合适方式进行组合，这些简单变型和组合同样应当视为本申请所公开的内容，均属于本申请的保护范围。

Claims (20)

  1. 一种壳体，其特征在于，包括框体和后盖，所述框体的至少部分包括外层以及与所述外层结合的内层，所述内层的内表面朝向框体的内部，所述外层的外表面远离内层的内表面构成所述框体的外表面，所述外层的材料为选自不锈钢、钛和钛合金中的一种或两种以上，所述内层的材料为选自铝和铝合金中的一种或两种以上，所述后盖设置在所述框体的底面上，并与所述框体的底面结合。
  2. 根据权利要求1所述的壳体，其特征在于，所述壳体还包括中板，所述中板的外边缘与所述框体的内表面结合。
  3. 根据权利要求2所述的壳体，其特征在于，所述中板与所述框体为一体形成，或者所述中板的外边缘与所述框体的内表面通过焊接结合。
  4. 根据权利要求1-3中任一项所述的壳体，其特征在于，所述框体具有至少一个功能槽，所述功能槽至少部分切断所述框体的内层和外层。
  5. 根据权利要求1-4中任一项所述的壳体，其特征在于，所述外层的外表面形成有装饰；
    所述装饰由抛光、喷砂、拉丝、物理气相沉积、激光镭雕、喷涂油墨、喷涂油漆和防指纹镀膜中的一种或两种以上方法形成。
  6. 根据权利要求1-5中任一项所述的壳体，其特征在于，所述内层的至少部分的厚度为0.3-6mm，所述外层的至少部分的厚度为0.1-1mm；
    所述内层与所述外层的厚度比为1-40：1。
  7. 根据权利要求1-6中任一项所述的壳体，其特征在于，所述铝合金为选自5系铝合金、6系铝合金和7系铝合金中的一种或两种以上；
    所述5系铝合金中，以铝合金的总量为基准，镁元素的含量为2重量％以上；
    所述6系铝合金中，以铝合金的总量为基准，硅元素的含量为0.2重量％以上；镁元素的含量为0.35重量％以上；铜元素的含量为0.005重量％以上；
    所述7系铝合金中，以铝合金的总量为基准，锌元素的含量为1-10重量％。
    所述不锈钢含有铬元素和镍元素，所述不锈钢中，以不锈钢的总量为基准，铬元素的含量为15-20重量％，镍元素的含量为5-16重量％；
    所述钛中，铁元素的含量为不高于0.5重量％；碳元素的含量为不高于0.08重量％；氮元素的含量为不高于0.05重量％；
    所述钛合金中，以钛合金的总量为基准，铝元素的含量为0.005-8重量％；钒元素的含 量为0.001-8重量％；钼元素的含量为0.001-1重量％。
  8. 根据权利要求1-7中任一项所述的壳体，其特征在于，所述后盖的材料为玻璃、陶瓷和聚合物中的一种或两种以上的组合。
  9. 根据权利要求1-8中任一项所述的壳体，其特征在于，所述框体沿内层向外层方向的热导率为10-80W/(m·K)；
    所述框体的比热容为0.3-1.2J/(g·K)。
  10. 一种壳体的制备方法，其特征在于，包括以下步骤：
    S1、提供内层坯料板以及外层坯料板，所述外层坯料板为选自不锈钢、钛和钛合金中的一种或两种以上，所述内层坯料板为选自铝和铝合金中的一种或两种以上；
    S2、将所述内层坯料板的待结合面以及所述外层坯料板的待结合面进行粗化处理；
    S3、将所述内层坯料板的待结合面与所述外层坯料板的待结合面叠合后进行轧制，形成复合板材，所述轧制的条件使得压下量为大于5％；
    S4、将所述复合板材进行加工，形成具有框体的壳体，所述框体包括由所述内层坯料板形成的内层、以及由所述外层坯料板形成的外层，所述内层的内表面朝向框体的内部，所述外层的外表面远离内层的内表面构成所述框体的外表面；
    S5、在所述框体的底面安装后盖。
  11. 根据权利要求10所述的方法，其特征在于，所述粗化处理为选自拉丝、喷砂和化学腐蚀中的一种或两种以上的组合。
  12. 根据权利要求10-11中任一项所述的方法，其特征在于，步骤S2还包括在所述粗化处理之前进行的预粗化处理，在所述预粗化处理中，将所述内层坯料板和/或所述外层坯料板进行轧制，所述轧制采用成对的轧制旋转辊，成对的轧制旋转辊中的一个轧制旋转辊为光滑辊，另一个轧制旋转辊为粗糙辊，所述粗糙辊与所述待结合表面接触，所述光滑辊的表面为光滑表面，所述粗糙辊的表面具有纹路。
  13. 根据权利要求12所述的方法，其特征在于，所述纹路的图案为直纹、雪花纹、交叉纹和碎丝纹中的一种或两种以上，相邻两条纹路之间的距离为0.01-0.15mm；
    所述预粗化处理的条件使得经预粗化处理的待结合表面的表面粗糙度Ra为0.05-5μm；
    所述粗化处理的条件使得经粗化处理的待结合表面的表面粗糙度Ra为0.1-15μm或者所述粗化处理的条件使得经粗化处理的待结合表面的表面粗糙度Ra为1-5μm。
  14. 根据权利要求10-13中任一项所述的方法，其特征在于，所述内层坯料板的待结合面的粗糙度为不小于所述外层坯料板的待结合面的粗糙度，
    或者所述内层坯料板的待结合面的粗糙度为大于所述外层坯料板的待结合面的粗糙 度，且所述内层坯料板的待结合面的粗糙度Ra为1-6μm；所述外层坯料板的待结合面的粗糙度Ra为0.8-4μm。
  15. 根据权利要求10-14中任一项所述的方法，其特征在于，步骤S3中，所述轧制的压下量为8-70％，所述轧制在10-500℃的温度下进行，或者所述轧制的压下量为20-40％，所述轧制在25-300℃的温度下进行。
  16. 根据权利要求10-15中任一项所述的方法，其特征在于，步骤S4中，所述加工为冲压和铣削中的至少一种。
  17. 根据权利要求10-16中任一项所述的方法，其特征在于，该方法还包括步骤S61，在步骤S61中，对框体进行加工，在框体上形成至少部分切断所述内层和所述外层的至少一个功能槽。
  18. 根据权利要求10-17中任一项所述的方法，其特征在于，该方法还包括步骤S7，在步骤S7中，对所述壳体的外表面进行装饰；
    所述装饰为抛光、喷砂、拉丝、物理气相沉积、激光镭雕、喷涂油墨、喷涂油漆和防指纹镀膜中的一种或两种以上的组合；
    所述步骤S7在步骤S5之前进行。
  19. 根据权利要求10-18中任一项所述的方法，其特征在于，该方法还包括在所述框体中设置中板的操作，所述中板的外边缘与所述框体的内表面结合。
  20. 一种电子产品，其特征在于，该电子产品的外壳为权利要求1-9中任一项所述的壳体。
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