WO2020001276A1 - 一种扫描式x射线源及其成像系统 - Google Patents

一种扫描式x射线源及其成像系统 Download PDF

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Publication number
WO2020001276A1
WO2020001276A1 PCT/CN2019/090988 CN2019090988W WO2020001276A1 WO 2020001276 A1 WO2020001276 A1 WO 2020001276A1 CN 2019090988 W CN2019090988 W CN 2019090988W WO 2020001276 A1 WO2020001276 A1 WO 2020001276A1
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Prior art keywords
scanning
ray source
target
steel plate
anode target
Prior art date
Application number
PCT/CN2019/090988
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English (en)
French (fr)
Inventor
崔志立
高建
邢金辉
Original Assignee
北京纳米维景科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN201821016550.2U external-priority patent/CN208336145U/zh
Priority claimed from CN201810694166.6A external-priority patent/CN108777248B/zh
Application filed by 北京纳米维景科技有限公司 filed Critical 北京纳米维景科技有限公司
Priority to JP2020573347A priority Critical patent/JP7300745B2/ja
Priority to EP19825295.9A priority patent/EP3817027A4/en
Publication of WO2020001276A1 publication Critical patent/WO2020001276A1/zh
Priority to US17/137,064 priority patent/US11569055B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/24—Tubes wherein the point of impact of the cathode ray on the anode or anticathode is movable relative to the surface thereof
    • H01J35/30—Tubes wherein the point of impact of the cathode ray on the anode or anticathode is movable relative to the surface thereof by deflection of the cathode ray
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
    • H01J35/045—Electrodes for controlling the current of the cathode ray, e.g. control grids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
    • H01J35/08—Anodes; Anti cathodes
    • H01J35/112—Non-rotating anodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
    • H01J35/08—Anodes; Anti cathodes
    • H01J35/12—Cooling non-rotary anodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/14—Arrangements for concentrating, focusing, or directing the cathode ray
    • H01J35/147—Spot size control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/14—Arrangements for concentrating, focusing, or directing the cathode ray
    • H01J35/153—Spot position control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/16—Vessels; Containers; Shields associated therewith
    • H01J35/18—Windows
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2235/00—X-ray tubes
    • H01J2235/10—Drive means for anode (target) substrate
    • H01J2235/1026—Means (motors) for driving the target (anode)
    • H01J2235/1033—Means (motors) for driving the target (anode) mounted within the vacuum vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2235/00—X-ray tubes
    • H01J2235/18—Windows, e.g. for X-ray transmission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
    • H01J35/06—Cathodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
    • H01J35/08—Anodes; Anti cathodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
    • H01J35/08—Anodes; Anti cathodes
    • H01J35/12—Cooling non-rotary anodes
    • H01J35/13—Active cooling, e.g. fluid flow, heat pipes

Definitions

  • the invention relates to a scanning X-ray source, and also relates to an imaging system including the scanning X-ray source, and belongs to the field of radiation imaging technology.
  • TOMO Tomothynthesis, X-ray tomography
  • Inversion Geometry Inversion Geometry
  • CT Computed Tomography
  • Different imaging systems acquire images from multiple projection angles in their own way.
  • the TOMO imaging system rotates or translates the X-ray source and exposes it at different angles or displacements to obtain images of multiple projection angles.
  • Inverse geometry imaging systems use area array multifocal X-ray sources to obtain projected images at different angles.
  • the mainstream CT imaging system rotates the X-ray source and the detector at high speed to obtain projection images of multiple angles.
  • the new generation of static CT imaging systems uses a dual ring structure of a detector ring and a ray source ring. Multiple X-ray sources are evenly distributed on the ray source ring, and each X-ray source corresponds to an angled projection image.
  • the existing system designs are still mostly mobile X-ray sources. It is not difficult to find that the multi-focus X-ray source method has more obvious advantages; and when using a mobile X-ray source to obtain images at multiple projection angles, it is necessary to use a movement mechanism to realize the rotation or translation of the X-ray source, which is easy to produce Mechanical motion artifacts affect the quality of the reconstructed image.
  • the primary technical problem to be solved by the present invention is to provide a scanning X-ray source.
  • Another technical problem to be solved by the present invention is to provide an imaging system including the scanning X-ray source.
  • a scanning X-ray source including a vacuum chamber, wherein a cathode and a plurality of anode target structures are disposed in the vacuum chamber, and the vacuum chamber is located near the cathode.
  • a grid is provided, and a focusing electrode is provided at a position close to the grid in the vacuum cavity, and a deflection coil is provided at an outer periphery of the vacuum cavity and close to the grid;
  • the control grid sequentially focuses the electron beam generated by the cathode through the focus pole and the movement direction of the deflection coil, and then bombards the target surface of the corresponding anode target structure one by one according to a preset rule, and X-rays are generated from the bombardment side of the target surface to form a plurality of focal points arranged in a predetermined arrangement shape.
  • a heat dissipation block is provided on the upper surface of the integral reflection target.
  • a steel plate is provided on the upper surface of the heat dissipation block, and the steel plate is arranged with a plurality of collimation holes in a linear array. The collimation holes correspond to a beryllium window and form a plurality of X-ray exit openings.
  • the anode target structure adopts an independent individual reflection target, and the independent
  • the upper surface of the individual reflection target is provided with a heat dissipation block, and the upper surface of the heat dissipation block is provided with a steel plate.
  • the steel plate is provided with a collimation hole corresponding to the independent individual reflection target, and the collimation hole corresponds to one
  • the beryllium window forms multiple X-ray exits.
  • the alignment hole is embedded in the steel plate, and the beryllium window is embedded in the heat sink and the steel plate and penetrates the corresponding alignment hole.
  • a lower surface of the integral reflection target is provided with a heat dissipation block.
  • a steel plate is provided on the upper surface of the integral reflection target, and the steel plate is arranged with a plurality of collimation holes in a linear array form.
  • the collimation holes correspond to a beryllium window and form a plurality of X-ray exit holes.
  • the anode target structure when at least one anode target structure is used to generate and emit a wide beam of X-rays, and the anode target structure is arranged in an array, the anode target structure adopts an independent individual reflection target, and the independent A steel plate is provided on the upper surface of the individual reflection target, and a steel plate is provided on the lower surface of the independent reflection target.
  • the steel plate is provided with a collimation hole corresponding to the independent reflection target, and the collimation hole corresponds to A plurality of X-ray exit openings are formed in the beryllium window.
  • the alignment hole is embedded in the steel plate, and the beryllium window is embedded in the steel plate and penetrates the corresponding alignment hole.
  • the scanning X-ray source is provided with a grid control switch, the grid control switch is fixed to the vacuum cavity through a bracket, and an output end of the grid control switch is connected to the grid through a wire.
  • the grid-controlled switch is connected to a grid-controlled power source, and the grid-controlled power source is connected to an external high-voltage power source.
  • the deflection coil includes an X-direction deflection coil and a Y-direction deflection coil, and the X-direction deflection coil and the Y-direction deflection coil are respectively provided with a control interface, and the control interface is respectively connected to a main control circuit.
  • the main control circuit applies preset voltage waveforms to the control interfaces of the X-direction deflection coil and the Y-direction deflection coil, respectively, so as to control the movement direction of the electron beam generated by the cathode.
  • anode target structure when used to generate and emit X-rays, and the anode target structure is an integral reflection target, the electron beam emitted by the cathode is directly facing the target of the integral reflection target. surface;
  • the electron beam emitted by the cathode is positive.
  • the target surface of the independent individual reflection target is positive.
  • an imaging system including the above-mentioned scanning X-ray source.
  • the scanning X-ray source provided by the present invention generates an electron beam through the cathode, and controls the on-off of the electron beam through the grid, and the control of the direction of the electron beam movement by the deflection coil, so as to bombard the corresponding target surface one by one according to preset rules. To complete the switch between multi-focus.
  • This method not only improves the efficiency of the scanning X-ray source, but also meets the needs of the imaging system for the scanning X-ray source and acquiring images of multiple projection angles, and solves the problem of using the motion mechanism to realize the rotation of the X-ray source or The problem of mechanical motion artifacts during translation.
  • the scanning X-ray source also has greater power and heat capacity, and has the characteristics of small volume and high focus density.
  • FIG. 1 is a schematic structural diagram of a scanning X-ray source provided by the present invention.
  • FIG. 2 is a schematic structural diagram of an anode target structure in a scanning X-ray source provided by the present invention
  • FIG. 3 is a schematic diagram of another structure of an anode target structure in a scanning X-ray source provided by the present invention.
  • FIG. 4 is an enlarged schematic view of another structure of an anode target structure in a scanning X-ray source provided by the present invention.
  • FIG. 5 is a plan view of an anode target structure in a scanning X-ray source provided by the present invention.
  • FIG. 6 is a schematic structural diagram of a scanning X-ray source arranged in a 10 ⁇ 10 array in the scanning X-ray source according to an embodiment of the present invention
  • FIG. 7 is a schematic structural diagram of a scanning X-ray source arranged in a linear array in the scanning X-ray source according to an embodiment of the present invention
  • FIG. 8 is a schematic diagram of adjusting a voltage waveform applied to a deflection yoke to control a moving direction of an electron beam in a scanning X-ray source according to an embodiment of the present invention
  • FIG. 9 is a schematic diagram of a layout structure of an imaging system using an inverse geometric imaging system in the imaging system provided by the present invention.
  • FIGS. 10 and 11 are schematic diagrams of a layout structure of a digital TOMO system in an imaging system provided by the present invention.
  • FIGS. 12 and 13 are schematic diagrams of a layout structure of an imaging system using a static CT system in the imaging system provided by the present invention.
  • the scanning X-ray source provided by the present invention includes a vacuum chamber 1, and a cathode 2 and a plurality of anode target structures 3 are arranged in the vacuum chamber 1, and the vacuum chamber 1 is close to the cathode.
  • a grid 4 is provided at the position 2
  • a focusing electrode 5 is provided near the grid 4 in the vacuum chamber 1
  • a deflection coil 6 is provided at a position near the grid 4 on the outer periphery of the vacuum chamber 1.
  • the electron beam generated by the cathode passes through the focus of the focus pole 5 and the movement direction of the deflection coil 6 is controlled in order to scan and bombard the target surface of the corresponding anode target structure 3 one by one according to preset rules, and from the target surface X-rays are generated on the bombarding side, forming a plurality of focal points arranged in a predetermined arrangement shape.
  • the preset arrangement shape of the focus arrangement can be determined according to the requirements of the imaging system.
  • the vacuum chamber 1 is used to place the cathode 2 and a plurality of anode target structures 3 in a high vacuum environment.
  • the electron beam generated by the cathode 2 can smoothly reach the corresponding anode target structure 3 without being caused by the air The molecules collide and are lost; on the other hand, the vacuum insulation characteristic allows the anode target structure 3 to be in a high voltage state relative to the cathode 2 without easily causing breakdown and ignition.
  • the cathode 2 can be a cathode filament.
  • the cathode filament is connected to the filament power source, and the filament power source is connected to an external high voltage power source.
  • the external high voltage power source controls the current of the filament power source, and the cathode filament is heated to a preset temperature by the filament power source.
  • the surface of the cathode filament is generated to meet a preset number of electrons (enough enough active electrons) to form an electron beam (the size of the electron beam is related to the size of the electron beam current required to be emitted by the cathode filament).
  • the cathode filament may be made of a high melting point tungsten wire.
  • each anode target structure 3 includes a reflective target 301, a heat sink 302, a steel plate 303, a beryllium window 304, and a collimation hole 305; the anode target structure 3 can generate and emit a narrow beam X-ray or a wide beam. X-ray beam.
  • the anode target structure 3 can generate and emit a narrow beam X-ray or a wide beam.
  • X-ray beam As shown in FIG. 2, when at least one anode target structure 3 is used to generate and emit a narrow beam of X-rays (the X-ray exit angle is small), and each anode target structure 3 uses an integral reflection target 301, the integral reflection
  • the upper surface of the target 301 is provided with a heat dissipation block 302 to realize heat radiation to the integrated reflection target 301.
  • a steel plate 303 is provided on the upper surface of the heat dissipation block 302.
  • the steel plate 303 can be used not only as a carrier for the beryllium window 304 and the collimation hole 305, but also for shielding unwanted scattered rays, and at the same time, it can also play a certain role in heat dissipation.
  • multiple collimation holes 305 can be arranged on the steel plate 303 in a linear array form (the number of collimation holes 305 (the Y direction) is 1), each collimation hole 305 is embedded in the steel plate 303; each collimation hole 305 corresponds to a beryllium window 304, and each beryllium window 304 is embedded in the heat sink 302 and the steel plate 303 and penetrates the corresponding collimation hole 305, thereby achieving alignment
  • the hole 305 is sealed and forms a plurality of X-ray exit openings.
  • multiple collimation holes 305 arranged on two adjacent anode target structures may correspond one-to-one; or two adjacent anode targets
  • the multiple alignment holes 305 arranged in the structure may not correspond one-to-one, that is, all the alignment holes 305 can be arranged to form a round surface, a rectangular surface, and other special-shaped surfaces; each alignment hole 305 corresponds to a beryllium window 304
  • Each beryllium window 304 is embedded in the heat sink 302 and the steel plate 303 and penetrates the corresponding collimation hole 305, so as to achieve the sealing of the alignment hole 305 and form multiple X-ray exit openings; multiple exit opening pairs
  • the target surface of the quasi-integral reflective target 301 is electronically bombarded, so that after a large number of electrons generated by the cathode filament strike the target surface of the integrated reflective target 301, the target surface directly generates X-rays and exits from the exit corresponding to the
  • each anode target structure 3 may adopt independent individual reflection
  • the target 301 is provided with a heat sink 302 on the upper surface of the independent individual reflection target 301, and a steel plate 303 is provided on the upper surface of the heat sink 302.
  • the steel plate 303 is provided with a collimation hole 305 corresponding to the independent individual reflection target 301.
  • the collimation holes 305 are embedded in the steel plate 303.
  • Each collimation hole 305 corresponds to a beryllium window 304.
  • Each beryllium window 304 is embedded in the heat sink 302 and the steel plate 303 and penetrates the corresponding collimation hole 305. Sealing of the alignment hole 305 is achieved, and multiple X-ray exit openings are formed. Similarly, multiple exit openings are directed at the bombardment target surface of independent individual electrons, so that after a large number of electrons generated by the cathode filament strike the target surface of the independent individual reflection target 301, the target surface directly generates X-rays, and the target surface is separated from the target surface. The corresponding exit port emits X-rays.
  • the A heat dissipation block 302 is provided on the lower surface of the integrated reflection target 301, which can not only realize heat radiation to the reflection target 301, but also leave more space for the design of the collimation hole 305.
  • a steel plate 303 is provided on the upper surface of each integral reflection target 301. The steel plate 303 can be used as a carrier for the beryllium window 304 and the collimation hole 305, and can also be used to shield unwanted scattered rays, and also play a certain role.
  • multiple collimation holes 305 can be arranged on each steel plate 303 in a linear array form (the number of collimation holes 305 (the Y direction) is 1), each collimation Straight holes 305 are embedded in the steel plate 303; each collimation hole 305 corresponds to a beryllium window 304, and each beryllium window 304 is embedded in the steel plate 303 and penetrates the corresponding collimation hole 305, so as to achieve the alignment hole 305. It is sealed and forms multiple X-ray exits.
  • multiple collimation holes 305 arranged on two adjacent anode target structures 3 may correspond one-to-one; or two adjacent The multiple alignment holes 305 arranged on each anode target structure 3 may not correspond one-to-one.
  • All the alignment holes 305 may be arranged to form a round surface, a rectangular surface, and other special surfaces after being arranged; each alignment hole 305 corresponds to one Beryllium windows 304, each beryllium window 304 is embedded in a steel plate 303 and penetrates the corresponding collimation hole 305, so as to achieve sealing of the alignment hole 305 and form multiple X-ray exit ports; multiple exit ports are aligned
  • the target surface of the integral reflection target 301 is electronically bombarded, so that after a large number of electrons generated by the cathode filament strike the target surface of the integrated reflection target 301, the target surface directly generates X-rays, and X is emitted from the exit corresponding to the target surface. Rays.
  • each anode target structure 3 may adopt independent individual reflection
  • the target 301 is provided with a steel plate 303 on the upper surface of each independent individual reflective target 301, and a heat dissipation block 302 is provided on the lower surface of each independent individual reflective target 301.
  • Each steel plate 303 corresponds to an independent individual reflective target 301 is provided with a collimation hole 305, which is embedded in the steel plate 303; each collimation hole 305 corresponds to a beryllium window 304, each beryllium window 304 is embedded in the steel plate 303 and penetrates the corresponding collimation Straight holes 305, so as to achieve sealing of the alignment holes 305, and form multiple X-ray exit openings.
  • multiple exit openings are directed at the bombardment target surface of independent individual electrons, so that after a large number of electrons generated by the cathode filament strike the target surface of the independent individual reflection target 301, the target surface directly generates X-rays, and the target surface is separated from the target surface.
  • the corresponding exit port emits X-rays.
  • each collimation hole 305 and the corresponding beryllium window 304 depends on the X-ray emission position required by the imaging system used.
  • multiple anode target structures 3 can share the same integral steel plate 303, which is the scanning X-ray. All the collimation holes 305 of the source and the corresponding beryllium windows 304 are embedded in the same integral steel plate 303. For example, as shown in FIG.
  • a plurality of collimation holes 305 arranged in a 10x10 array and a corresponding beryllium window 304 are embedded in a steel plate 303, thereby forming A plurality of X-ray exit ports 306.
  • a predetermined number of heat dissipation pipes 3020 are uniformly distributed on the heat dissipation blocks 302 of the above-mentioned several types of anode target structures 3, and the heat dissipation pipes 3020 are filled with a coolant, so as to realize the heat dissipation of the reflection target 301.
  • the coolant can be a flowable high-voltage insulation material, such as transformer oil (high-voltage insulation oil);
  • the heat sink 302 can be made of a metal or metal alloy material with high thermal conductivity, such as copper, and the shape and size of the heat sink 302 can be based on reflection The shape of the target 301, the X-ray emission position, and the heat radiation effect are determined.
  • the imaging system used adjusts the shape and size of the exit surface of the above-mentioned anode target structures 3 collimation holes 305 (such as conical, Polyhedral cone) and exit angle.
  • collimation holes 305 such as conical, Polyhedral cone
  • the shape of the exit surface of the collimating hole 305 can be rectangular, and the collimating hole 305 can be a three-dimensional cone.
  • the beryllium window 304 of the above-mentioned several anode target structures 3 may use a light beryllium material with a small atomic number, which has substantially no attenuation to X-rays.
  • the shape and size of the beryllium window 304 are adjusted according to the actual needs of the imaging system used (such as the shape and size of the X-ray focus). For example, as shown in FIG. 5, when the imaging system to be used needs a rectangular X-ray focus from the scanning X-ray source, the shape of the exit surface of the beryllium window 304 may be rectangular.
  • the reflection target 301 may be made of a metal material or a metal alloy material having a high atomic number and a high melting point, such as metal tungsten, molybdenum, and thorium tungsten alloy.
  • the electron beam generated by the cathode filament scans the target surface of the independent individual reflection target 301 one by one (X direction) one by one, and only the electron beam reaches the independent individual. X-rays are generated only when the position of the target surface of the reflective target 301 is met, and emitted through the exit opening formed by the beryllium window 304 and the collimation hole 305.
  • the electron beam generated by the cathode filament scans the target surface of the integral target 301 one by one (X direction) one by one, and the target surface of the integral target 301 is always generated.
  • the characteristics of the emission state (on-off) of the electron beam can be controlled by using the grid 4.
  • the control state of the grid control switch can be synchronized with the electron beam scanning (X direction) one by one, that is, when the electron beam reaches the When the target surface corresponding to the X-ray exit port is turned off, the grid control switch is turned off, and the electron beam can be normally emitted and bombard the target surface, so that X-rays are emitted from the exit port; when the electron beam leaves the target plane corresponding to the X-ray exit port position When the grid control switch is turned on, the electron beam cannot be normally emitted by the grid switch and cannot bomb the target surface, so the X-rays stop emitting.
  • the scanning X-ray source is provided with a grid control switch (not shown in the figure).
  • the grid control switch is fixed to the vacuum cavity 1 through a bracket, and the output end of the grid control switch is connected to the scanning X-ray source through a wire.
  • the grid 4 of the scanning X-ray source controls the on-off (pass or switch) of the electron beam emitted by the cathode filament of the scanning X-ray source, and realizes the control of the line-feeding of the scanning X-ray source.
  • the gate-controlled switch is connected to a gate-controlled power source, and the gate-controlled power source is connected to an external high-voltage power source.
  • the gate-controlled power source 3 is used to control the gate-controlled switch to be on or off, thereby turning on and off the scanning X-ray source. Carry out control to realize the control of pay-off.
  • a negative high voltage (such as negative high voltage) can be applied to the gate 4 through the gate-controlled power source.
  • the absolute value of the negative high voltage applied to the grid 4 is greater than the absolute value of the negative high voltage of the cathode 2 of the scanning X-ray source (for example, the negative high voltage of the cathode is -120KV), so that the grid 4 and the cathode 2 are A negative electric field is formed between them, thereby suppressing a predetermined number of electrons generated on the surface of the cathode filament from flying to the target surface of the anode target structure 3, and blocking the emission of electrons from the cathode filament.
  • the focusing electrode 5 is used to focus the electron beam generated by the cathode filament, restrict the divergence of the electron beam, and constrain the electron beam, so as to obtain a focal spot of a proper size on the anode target structure 3.
  • the focusing electrode 5 is connected to an external main control circuit, and the electron beam emitted from the cathode filament is controlled by the main control circuit to focus the electron beam.
  • the effect of focusing will affect the size of the speckle surface where the electron beam strikes the target surface of the anode target structure 3.
  • the focusing of the focusing pole 5 is divided into electric field focusing and magnetic field focusing, which are commonly used in electronics, and will not be described in detail here.
  • the deflection coil 6 includes an X-direction deflection coil and a Y-direction deflection coil, and is used to realize the movement of the electron beam generated by the cathode filament on the X and Y planes.
  • the deflection coil 6 can further focus the electron beam generated by the cathode filament and control the moving direction of the electron beam.
  • a control interface is provided in the X-direction deflection yoke and the Y-direction deflection yoke. The control interfaces are respectively connected to the main control circuit.
  • the main control circuit is provided with a plurality of types corresponding to the X-direction yoke and the Y-direction yoke
  • the main control circuit can apply preset voltage waveforms to the control interfaces of the X-direction deflection coil and the Y-direction deflection coil, respectively, so as to control the movement direction of the electron beam.
  • the preset rule refers to the scanning control method of the electron beam, which can be scanning line by line, that is, by controlling the grid control switch and the voltage waveform applied to the X-direction deflection coil and the Y-direction deflection coil, the electron beam is made progressive.
  • (X direction) scans the target surface of the anode target structure 3 one by one to generate X-rays; it can also scan one by one (Y direction) one by one, that is, it is applied by controlling the grid control switch and the X-direction deflection coil and Y-direction deflection coil.
  • the voltage waveform enables the electron beam to scan the target surface of the anode target structure 3 row by row (Y direction) one by one to generate X-rays; it can also scan the positions of multiple focal points arranged in a preset arrangement shape, that is, through the control grid Control switch and the voltage waveform applied to the X-direction deflection coil and the Y-direction deflection coil, so that the electron beam scans and bombards the target surface of the corresponding anode target structure 3 one by one according to the preset arrangement shape, and generates X Ray; the scanning control method of the electron beam can be designed according to the actual application. Therefore, the deflection yoke 6 can be used to control the electron beam to perform arbitrary switching scanning between multiple target surfaces, thereby completing switching between multiple focal points (X-ray focal points), and improving the efficiency of the scanning X-ray source.
  • an anode target structure 3 when used to generate and emit X-rays (wide beam or narrow beam X-rays), and the anode target structure 3 uses an integral reflection target 301,
  • multiple collimation holes 305 are arranged on the steel plate 303 in a linear array form (the number of rows of collimation holes 305 (Y direction) is 1), or when multiple anode target structures 3 arranged in a linear array form are used and
  • X-rays are emitted (wide beam or narrow beam X-rays) and the anode target structure 3 uses an independent individual reflection target 301, only one row of the target surface of the anode target structure 3 is scanned and bombarded in the Y direction by the electron beam.
  • the directional deflection coil only needs to provide a fixed input level, which can ensure that the high-speed electron beam emitted by the cathode filament can bomb the target surface in the Y direction.
  • the electron beam emitted by the cathode filament of the scanning X-ray source can be directly opposite the position of the target surface, so that the Y-direction deflection coil can be eliminated, making this scanning
  • the X-ray source is more compact.
  • the square on the exit surface represents the exit port 306 of the ray
  • the arrow indicates the direction of movement of the electron beam scanning the target surface
  • the curve above the exit surface represents the voltage waveform applied to the deflection coil in the X direction.
  • the curve on the left represents the voltage waveform applied to the Y-direction deflection coil.
  • the voltage waveforms applied to the X-direction deflection coil and the Y-direction deflection coil are matched so that the electron beam is scanned and bombarded one by one from left to right and from top to bottom.
  • the target surface of the anode target structure 3 generates X-rays.
  • the electron beam scans the target of the anode target structure 3 one by one from left to right in the X direction as the triangular waveform voltage applied to the X-direction deflection coil increases.
  • Surface generating X-rays; when the triangular waveform voltage applied to the X-direction deflection coil changes from maximum to minimum, the electron beam returns to the leftmost starting point and starts a new round of scanning from left to right to bomb the anode target structure 3 Target process.
  • the electron beam scans the target surface of the anode target structure 3 one by one in the Y direction from the top to the bottom as the triangular waveform voltage applied to the Y-direction deflection coil increases.
  • the electron beam returns to the uppermost starting point and starts a new round of scanning from top to bottom to strike the anode target structure 3.
  • Target surface process when the triangular waveform voltage applied to the Y-direction deflection coil changes from the maximum to the minimum, the electron beam returns to the uppermost starting point and starts a new round of scanning from top to bottom to strike the anode target structure 3.
  • a step wave voltage can be applied to the Y-direction deflection coil and a triangular waveform voltage can be applied to the X-direction deflection coil; that is, the Y-direction deflection
  • the step voltage applied to the coil remains unchanged to ensure that the position of the electron beam in the Y direction does not change, and the electron beam can scan the target surface of the anode target structure 3 one by one from left to right in the X direction to generate X-rays; when Y When the step wave voltage applied to the directional deflection coil rises to a voltage corresponding to the scanning position of the next row of electron beams and maintains, the electron beam starts a new round in the X direction to scan the target surface of the anode target structure 3 from left to right.
  • each step of the step wave voltage applied to the Y-direction deflection coil moves the electron beam downward by one line, so that the entire surface of the electron beam is scanned line by line and column by column to scan the target surface of the anode target structure 3 one by one. .
  • a step wave voltage can be applied to the X direction deflection coil and a triangular waveform voltage can be applied to the Y direction deflection coil; that is, the X direction deflection
  • the step wave voltage applied on the coil remains unchanged to ensure that the position of the electron beam in the X direction does not change, and the electron beam can scan the target surface of the anode target structure 3 one by one from top to bottom in the Y direction to generate X-rays; when X When the step wave voltage applied to the directional deflection coil rises to a voltage corresponding to the scanning position of the next column of electron beams and maintains, the electron beam starts a new round of scanning in the Y direction from top to bottom to bombard the target surface of the anode target structure 3.
  • each step of the step wave voltage applied to the deflection yoke in the X direction moves the electron beam one column to the right, so that the entire surface of the electron beam is scanned line by line and row by row and row by row, and the target surface of the anode target structure 3 is bombarded. .
  • the scanning X-ray source can be applied not only to an anode grounded X-ray source, but also to a cathode grounded X-ray source or a neutral point grounded X-ray source.
  • a cathode-grounded X-ray source the cathode is grounded and a positive high voltage is applied to each anode target structure 3 using an external high-voltage power source.
  • a neutral-grounded X-ray source a negative high voltage is applied to the cathode, and a positive high voltage is applied to each anode target structure 3.
  • the scanning X-ray source provided by the present invention generates an electron beam by using a cathode, and controls the on-off of the electron beam through the grid, and the control of the direction of the electron beam movement by the deflection coil, thereby realizing the bombardment of the corresponding one by one according to preset rules.
  • the target surface to complete the switching between multiple focal points not only improves the efficiency of the scanning X-ray source, but also meets the needs of the imaging system for scanning X-ray sources and acquiring images at multiple projection angles, and solves the problem.
  • the scanning X-ray source also has greater power and heat capacity, and has the characteristics of small volume and high focal density.
  • the invention also provides an imaging system.
  • the imaging device includes the above-mentioned scanning X-ray source, which can not only meet the needs of the imaging system for the scanning X-ray source and acquire images of multiple projection angles, but also avoid the use of When the motion mechanism realizes the rotation or translation of the X-ray source, the phenomenon of mechanical motion artifacts easily occurs, which improves the imaging quality of the imaging system.
  • the other structures (structures other than the scanning X-ray source) and the working principle of the imaging system are the prior art, and are not repeated here.
  • the anode target structure 3 using the scanning X-ray source needs to be used to generate and emit narrow beam X-rays, and the scanning X-ray source is distributed to meet the reverse geometry.
  • the imaging system rack On the plane of the imaging system rack.
  • a digital TOMO system such as a breast TOMO function
  • the anode target structure 3 of the scanning X-ray source needs to be used to generate and emit a wide beam of X-rays, and the scanning X-ray source is distributed in a machine that satisfies the static CT system. Frame of ray rings.
  • a plurality of scanning X-ray sources can be distributed on the ray circle, and each scanning X-ray source is independently controlled; among them, the anode target structure of each scanning X-ray source 3 using one integral reflection target, a plurality of collimation holes are arranged in a linear array form (the number of collimation holes (the Y direction) is 1) on the steel plate of the integral reflection target; and each scanning X-ray The electron beam emitted from the cathode filament of the source is directly opposite the position of the target surface.

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Abstract

一种扫描式X射线源及其成像系统。该扫描式X射线源包括真空腔体(1)，真空腔体(1)内设置有一个阴极(2)与多个阳极靶结构(3)，真空腔体(1)内靠近阴极(2)的位置设置有栅极(4)，真空腔体(1)内靠近栅极(4)的位置设置有聚焦极(5)，真空腔体(1)的外周并靠近栅极(4)的位置设置有偏转线圈(6)。扫描式X射线源通过采用一个阴极(2)产生电子束，并通过栅极(4)控制电子束的通断，以及偏转线圈(6)对电子束运动方向的控制，从而实现按照预设规则逐个轰击对应的靶面，以完成多焦点之间的切换，不仅提高了扫描式X射线源的效率，还满足了成像系统对扫描式X射线源及获取多个投照角度的图像的需求，并解决了采用运动机构实现X射线源旋转或平移时产生机械运动伪影的问题。

Description

一种扫描式X射线源及其成像系统 技术领域
本发明涉及一种扫描式X射线源，同时也涉及包括该扫描式X射线源的成像系统，属于辐射成像技术领域。
背景技术
在辐射成像领域中，通常需要获取多个投照角度的图像，如TOMO(Tomothynthesis，X射线体层摄影)成像系统、反向几何成像系统(Inversion Geometry)、CT(Computed Tomography，计算机断层扫描)成像系统等。
不同的成像系统采用各自方式获取多个投照角度的图像。例如TOMO成像系统，将X射线源旋转或平移，在不同的角度或者位移上曝光以获得多个投照角度的图像。反向几何成像系统使用面阵多焦点X射线源来获得不同角度的投影图像。主流的CT成像系统将X射线源和探测器高速旋转以获得多个角度的投影图像。而新一代的静态CT成像系统使用探测器环和射线源环的双环结构，在射线源环上均匀分布多个X射线源，每个X射线源对应了一个角度的投影图像。
在获取多个投照角度的图像的应用场景中，现有的系统设计仍然以移动X射线源的方式居多。不难发现，多焦点X射线源的方式具备更明显的优势；并且，使用移动式X射线源获得多个投照角度的图像时，需要采用运动机构实现X射线源旋转或平移，从而容易产生机械运动伪影，影响重建图像的质量。
发明内容
本发明所要解决的首要技术问题在于提供一种扫描式X射线源。
本发明所要解决的另一技术问题在于提供一种包括上述扫描式X射线源的成像系统。
为了实现上述目的，本发明采用下述的技术方案：
根据本发明实施例的第一方面，提供一种扫描式X射线源，包括真空腔体，所述真空腔体内设置有阴极与多个阳极靶结构，所述真空腔体内靠近所述阴极的位置设置有栅极，所述真空腔体内靠近所述栅 极的位置设置有聚焦极，所述真空腔体的外周并靠近所述栅极的位置设置有偏转线圈；
所述控制栅极将所述阴极产生的电子束依次经过所述聚焦极的聚焦、所述偏转线圈的运动方向控制后，按照预设规则逐个轰击对应的所述阳极靶结构的靶面，并从所述靶面的轰击侧产生X射线，形成按照预设排列形状排布的多个焦点。
其中较优地，当采用至少一个所述阳极靶结构产生并出射窄束X射线，且所述阳极靶结构采用整体式反射靶时，所述整体式反射靶的上表面设置有散热块，所述散热块的上表面设置有钢板，所述钢板上按照线阵形式排布有多个准直孔，所述准直孔对应于一个铍窗，形成多个X射线的出射口。
其中较优地，当采用至少一个所述阳极靶结构产生并出射窄束X射线，且所述阳极靶结构以阵列形式排布时，所述阳极靶结构采用独立个体式反射靶，所述独立个体式反射靶的上表面设置有散热块，所述散热块的上表面设置有钢板，所述钢板上对应于所述独立个体式反射靶设置有准直孔，所述准直孔对应于一个铍窗，形成多个X射线的出射口。
其中较优地，所述准直孔内嵌于所述钢板，所述铍窗内嵌于所述散热块和所述钢板上并贯穿对应的所述准直孔。
其中较优地，当采用至少一个所述阳极靶结构产生并出射宽束X射线，且所述阳极靶结构采用整体式反射靶时，所述整体式反射靶的下表面设置有散热块，所述整体式反射靶的上表面设置有钢板，所述钢板上按照线阵形式排布有多个准直孔，所述准直孔对应于一个铍窗，形成多个X射线的出射口。
其中较优地，当采用至少一个所述阳极靶结构产生并出射宽束X射线，且所述阳极靶结构以阵列形式排布时，所述阳极靶结构采用独立个体式反射靶，所述独立个体式反射靶的上表面设置有钢板，所述独立个体式反射靶的下表面设置有钢板，所述钢板上对应于所述独立个体式反射靶设置有准直孔，所述准直孔对应于铍窗，形成多个X射线的出射口。
其中较优地，所述准直孔内嵌于所述钢板，所述铍窗内嵌于所述 钢板上并贯穿对应的所述准直孔。
其中较优地，所述扫描式X射线源配设有栅控开关，所述栅控开关通过支架与所述真空腔体固定，所述栅控开关的输出端通过导线连接至所述栅极，所述栅控开关与栅控电源连接，所述栅控电源与外部高压电源连接。
其中较优地，所述偏转线圈包括X方向偏转线圈和Y方向偏转线圈，所述X方向偏转线圈和所述Y方向偏转线圈分别设置有控制接口，所述控制接口分别与主控电路连接，所述主控电路对所述X方向偏转线圈和所述Y方向偏转线圈的所述控制接口分别施加预设的电压波形，实现控制所述阴极产生的电子束的运动方向。
其中较优地，当采用一个所述阳极靶结构产生并出射X射线，且所述阳极靶结构采用整体式反射靶时，所述阴极发射出的电子束正对所述整体式反射靶的靶面；
其中较优地，当采用多个以线阵形式排布的所述阳极靶结构产生并出射X射线，且所述阳极靶结构采用独立个体式反射靶时，所述阴极发射出的电子束正对所述独立个体式反射靶的靶面。
根据本发明实施例的第二方面，提供一种成像系统，包括上述的扫描式X射线源。
本发明所提供的扫描式X射线源通过阴极产生电子束，并通过栅极控制电子束的通断，以及偏转线圈对电子束运动方向的控制，实现按照预设规则逐个轰击对应的靶面，以完成多焦点之间的切换。这种方式不仅提高了本扫描式X射线源的效率，还满足了成像系统对扫描式X射线源及获取多个投照角度的图像的需求，并解决了采用运动机构实现X射线源旋转或平移时产生机械运动伪影的问题。另外，本扫描式X射线源还具有更大的功率和热容量，并具有体积小、焦点密度高的特点。
附图说明
图1为本发明所提供的扫描式X射线源的结构示意图；
图2为本发明所提供的扫描式X射线源中，阳极靶结构的一种结构示意图；
图3为本发明所提供的扫描式X射线源中，阳极靶结构的另一种 结构示意图；
图4为本发明所提供的扫描式X射线源中，阳极靶结构的另一种结构的放大示意图；
图5为本发明所提供的扫描式X射线源中，阳极靶结构的俯视图；
图6为本发明实施例所提供的扫描式X射线源中，以一个10x10阵列排布的扫描式X射线源的结构示意图；
图7为本发明实施例所提供的扫描式X射线源中，以线阵排布的扫描式X射线源的一种结构示意图；
图8为本发明实施例所提供的扫描式X射线源中，调整施加给偏转线圈的电压波形以控制电子束运动方向的示意图；
图9为本发明所提供的成像系统中，成像系统采用反向几何成像系统的一种布局结构示意图；
图10和图11为本发明所提供的成像系统中，成像系统采用数字TOMO系统的一种布局结构示意图；
图12和图13为本发明所提供的成像系统中，成像系统采用静态CT系统的一种布局结构示意图。
具体实施方式
下面结合附图和具体实施例对本发明的技术内容做进一步的详细说明。
如图1所示，本发明所提供的扫描式X射线源包括真空腔体1，在真空腔体1内设置有1个阴极2与多个阳极靶结构3，在真空腔体1内靠近阴极2的位置设置有栅极4，在真空腔体1内靠近栅极4的位置设置有聚焦极5，在真空腔体1的外周并靠近栅极4的位置设置有偏转线圈6。通过控制栅极4，使得阴极产生的电子束依次经过聚焦极5的聚焦、偏转线圈6的运动方向控制，从而按照预设规则逐个扫描轰击对应的阳极靶结构3的靶面，并从靶面的轰击侧产生X射线，形成按照预设排列形状排布的多个焦点。其中，焦点排布的预设排列形状可以根据成像系统需求而定。
具体的，真空腔体1用于使阴极2与多个阳极靶结构3处于高真空环境下，一方面使得阴极2产生的电子束可以顺利到达对应的阳极靶结构3，而不会因为与空气分子碰撞而损失掉；另一方面真空的绝 缘特性使得阳极靶结构3可以处于相对阴极2的高电压状态，而不会轻易产生击穿打火。
阴极2可以采用阴极灯丝，将阴极灯丝与灯丝电源连接，而灯丝电源与外部高压电源连接，通过外部高压电源控制灯丝电源的电流大小，在灯丝电源的作用下，将阴极灯丝加热到预设温度(如2000℃～3000℃)，使得阴极灯丝表面产生满足预设数量的电子(足够多活跃的电子)，形成电子束(电子束的大小与需要阴极灯丝发射的电子束流大小有关)。其中，阴极灯丝可以由高熔点的钨丝制成。
如图2和图3所示，每个阳极靶结构3包括反射靶301、散热块302、钢板303、铍窗304及准直孔305；阳极靶结构3可以产生并出射窄束X射线或宽束X射线。如图2所示，当采用至少一个阳极靶结构3产生并出射窄束X射线(X射线的出射角较小)，且每个阳极靶结构3采用整体式反射靶301时，该整体式反射靶301的上表面设置有散热块302，实现对整体式反射靶301的散热。在散热块302的上表面设置有钢板303，该钢板303既可以作为铍窗304和准直孔305的载体，又可以用来屏蔽不需要的散射线，同时也起到一定的散热作用。根据所运用的成像系统需求的X射线出射位置，可以在钢板303上按照线阵形式(准直孔305的行数(Y方向)为1)排布多个准直孔305，各准直孔305内嵌于钢板303上；每个准直孔305对应于一个铍窗304，每个铍窗304内嵌于散热块302和钢板303上并贯穿对应的准直孔305，从而实现对准直孔305的密封，并形成多个X射线的出射口。
需要强调的是，当采用多个由整体式反射靶301组成阳极靶结构时，相邻两个阳极靶结构上排布的多个准直孔305可以一一对应；或者相邻两个阳极靶结构上排布的多个准直孔305也可以不一一对应，即所有准直孔305排布后可以组成圆面、矩形面等异形面；每个准直孔305对应于一个铍窗304，每个铍窗304内嵌于散热块302和钢板303上并贯穿对应的准直孔305，从而实现对准直孔305的密封，并形成多个X射线的出射口；多个出射口对准整体式反射靶301电子轰击的靶面，使得阴极灯丝产生的大量电子轰击整体式反射靶301的靶面后，该靶面直接产生X射线，并从与该靶面对应的出射口出射X射线。
当采用至少一个阳极靶结构3产生并出射窄束X射线，且阳极靶 结构3以阵列形式(包括面阵形式和线阵形式)排布时，每个阳极靶结构3可以采用独立个体式反射靶301，该独立个体式反射靶301的上表面设置有散热块302，在散热块302的上表面设置有钢板303，钢板303上对应于独立个体式反射靶301设置有1个准直孔305，准直孔305内嵌于钢板303上；每个准直孔305对应于一个铍窗304，每个铍窗304内嵌于散热块302和钢板303上并贯穿对应的准直孔305，从而实现对准直孔305的密封，并形成多个X射线的出射口。同样，多个出射口对准独立个体式电子的轰击靶面，使得阴极灯丝产生的大量电子轰击独立个体式反射靶301的靶面后，该靶面直接产生X射线，并从与该靶面对应的出射口出射X射线。
如图3和图4所示，当采用至少一个阳极靶结构3产生并出射宽束X射线(X射线的出射角较大)，且每个阳极靶结构3采用整体式反射靶301时，该整体式反射靶301的下表面设置有散热块302，不仅可以实现对反射靶301的散热，还可以给准直孔305的设计留出更多的空间。在每个整体式反射靶301的上表面设置有钢板303，该钢板303既可以作为铍窗304和准直孔305的载体，又可以用来屏蔽不需要的散射线，同时也起到一定的散热作用。根据所运用的成像系统需求的X射线出射位置，可以在每个钢板303上按照线阵形式(准直孔305的行数(Y方向)为1)排布多个准直孔305，各准直孔305内嵌于钢板303上；每个准直孔305对应于一个铍窗304，每个铍窗304内嵌于钢板303上并贯穿对应的准直孔305，从而实现对准直孔305的密封，并形成多个X射线的出射口。
需要强调的是，当采用多个由整体式反射靶301组成的阳极靶结构3时，相邻两个阳极靶结构3上排布的多个准直孔305可以一一对应；或者相邻两个阳极靶结构3上排布的多个准直孔305也可以不一一对应，所有准直孔305排布后可以组成圆面、矩形面等异形面；每个准直孔305对应于一个铍窗304，每个铍窗304内嵌于钢板303上并贯穿对应的准直孔305，从而实现对准直孔305的密封，并形成多个X射线的出射口；多个出射口对准整体式反射靶301电子轰击的靶面，使得阴极灯丝产生的大量电子轰击整体式反射靶301的靶面后，该靶面直接产生X射线，并从与该靶面对应的出射口出射X射线。
当采用至少一个阳极靶结构3产生并出射宽束X射线，且阳极靶结构3以阵列形式(包括面阵形式和线阵形式)排布时，每个阳极靶结构3可以采用独立个体式反射靶301，每个独立个体式反射靶301的上表面均设置有钢板303，在每个独立个体式反射靶301的下表面设置有散热块302，每个钢板303上对应于独立个体式反射靶301设置有1个准直孔305，准直孔305内嵌于钢板303上；每个准直孔305对应于一个铍窗304，每个铍窗304内嵌于钢板303上并贯穿对应的准直孔305，从而实现对准直孔305的密封，并形成多个X射线的出射口。同样，多个出射口对准独立个体式电子的轰击靶面，使得阴极灯丝产生的大量电子轰击独立个体式反射靶301的靶面后，该靶面直接产生X射线，并从与该靶面对应的出射口出射X射线。
其中，上述几种阳极靶结构3中，每个准直孔305及与其对应的铍窗304的位置根据所运用的成像系统需求的X射线出射位置而定。为了保证阳极靶结构3与真空腔体1之间能够更好的接合，并且保证真空腔体1的密封效果，多个阳极靶结构3可以共用同一张整体式钢板303，即本扫描式X射线源的所有准直孔305及与其对应的铍窗304内嵌于同一张整体式钢板303上。例如，如图6所示，以一个10x10阵列的扫描式X射线源为例，在钢板303上内嵌有以10x10阵列排布的多个准直孔305及与其对应的铍窗304，从而形成多个X射线的出射口306。
上述几种阳极靶结构3的散热块302上均匀分布有预设数量的散热管道3020，该散热管道3020内灌注有冷却剂，从而实现对反射靶301的散热。冷却剂可以是可流动的高压绝缘材料，例如变压器油(高压绝缘油)；散热块302可以采用铜等热传导系数高的金属或金属合金材料制成，并且散热块302的形状和尺寸可以根据反射靶301的形状、X射线出射位置及散热效果而定。根据所运用的成像系统的实际需求(如X射线焦点形状和尺寸、成像系统所需的出线角度)，调整上述几种阳极靶结构3准直孔305的出射面形状、尺寸(如圆锥形、多面锥形体)和出射角度。例如，如图5所示，当所运用的成像系统需要使本扫描式X射线源出射矩形X射线焦点时，准直孔305的出射面形状可以为矩形，准直孔305立体表现为四面锥形体。
上述几种阳极靶结构3的铍窗304可以采用原子序数小的轻质铍材料，其对X射线基本无衰减。同样，根据所运用的成像系统的实际需求(如X射线焦点形状和尺寸)，调整铍窗304的形状和尺寸。例如，如图5所示，当所运用的成像系统需要使本扫描式X射线源出射矩形X射线焦点时，铍窗304的出射面形状可以为矩形。并且，反射靶301可以采用金属钨、钼、铼钨合金等原子序数高、熔点高的金属材料或金属合金材料制成。
并且，当阳极靶结构3采用独立个体式反射靶301时，阴极灯丝产生的电子束逐行(X方向)逐个扫描轰击独立个体式反射靶301的靶面的过程中，只有电子束到达独立个体式反射靶301靶面的位置时，才会产生X射线，并通过铍窗304和准直孔305所形成的出射口射出。当阳极靶结构3采用整体式反射靶301时，阴极灯丝产生的电子束逐行(X方向)逐个扫描轰击整体式反射靶301的靶面的过程中，整体式反射靶301靶面始终会产生X射线，但是只有铍窗304和准直孔305所形成的出射口才会射出X射线。作为一种选择，使用栅极4可以控制电子束发射状态(通断)的特性，可以将栅控开关的控制状态与电子束逐行(X方向)逐个扫描同步，即：当电子束到达与X射线出射口位置对应的靶面时，将栅控开关关闭，电子束可以正常发射并轰击靶面，从而使得X射线从出射口射出；当电子束离开与X射线出射口位置对应的靶面时，将栅控开关开启，电子束受栅极开关控制不能正常发射而无法轰击靶面，从而X射线停止发射。
本扫描式X射线源配设有栅控开关(图中未示出)，栅控开关通过支架与真空腔体1固定，并且，栅控开关的输出端通过导线连接至本扫描式X射线源的栅极4，从而对本扫描式X射线源的阴极灯丝发射电子束的通断(通过或闸断)进行控制，实现对本扫描式X射线源放线的控制。具体的，将栅控开关与栅控电源连接，而栅控电源与外部高压电源连接，通过栅控电源3控制栅控开关处于导通或断开状态，从而对本扫描式X射线源的通断进行控制，实现对放线的控制。
以本扫描式X射线源的多个阳极靶结构3接地为例，当栅控电源控制栅控开关处于导通状态时，并且通过栅控电源可以给栅极4施加一个负高压(如负高压为-130KV)，栅极4被施加的负高压的绝对值大 于本扫描式X射线源的阴极2的负高压(如阴极的负高压为-120KV)的绝对值，使得栅极4与阴极2之间形成负电场，从而抑制阴极灯丝表面产生的满足预设数量的电子飞向阳极靶结构3的靶面，实现对阴极灯丝发射电子的闸断。当栅控开关被施加的负高压足够大时，阴极灯丝表面产生的电子会全部被抑制在阴极灯丝表面而不能飞向阳极靶结构3的靶面。当栅控电源控制栅控开关处于断开状态时，栅控开关被施加的负高压消失，使得阳极靶结构3与阴极2之间形成压差，此时阴极灯丝表面产生的大量电子会在较大的电势能作用下形成电子束飞向阳极靶结构3的靶面，产生X射线，并从对应的出射口出射X射线，从而形成一个焦点。
本扫描式X射线中，聚焦极5用于聚焦阴极灯丝产生的电子束，限制电子束的发散，从而约束电子束，以在阳极靶结构3上获得适度尺寸的焦斑。具体的，将聚焦极5与外部主控电路连接，从阴极灯丝发出的电子束，通过主控电路控制聚焦极5对电子束进行聚焦。聚焦的效果会影响电子束轰击阳极靶结构3的靶面的斑面的大小。聚焦极5的聚焦分为电场聚焦和磁场聚焦，是电子学常用手段，在此不在具体说明。
偏转线圈6包括X方向偏转线圈和Y方向偏转线圈，用于实现阴极灯丝产生的电子束在X、Y面上运动。通过偏转线圈6可以实现对阴极灯丝产生的电子束进一步聚焦，及控制电子束的运动方向。在X方向偏转线圈和Y方向偏转线圈设置有控制接口，该控制接口分别与主控电路连接，根据预设规则，主控电路中对应于X方向偏转线圈和Y方向偏转线圈预先设置有多种电压波形，通过主控电路可以对X方向偏转线圈和Y方向偏转线圈的控制接口分别施加预设的电压波形，即可控制电子束的运动方向。其中，预设规则指的是电子束的扫描控制方式，可以是逐行逐个扫描，即通过控制栅控开关及X方向偏转线圈和Y方向偏转线圈上被施加的电压波形，使得电子束逐行(X方向)逐个扫描轰击阳极靶结构3的靶面，产生X射线；还可以是逐列(Y方向)逐个扫描，即通过控制栅控开关及X方向偏转线圈和Y方向偏转线圈上被施加的电压波形，使得电子束逐列(Y方向)逐个扫描轰击阳极靶结构3的靶面，产生X射线；还可以按照预设排列形状排布 的多个焦点的位置逐个扫描，即通过控制栅控开关及X方向偏转线圈和Y方向偏转线圈上被施加的电压波形，使得电子束按照预设排列形状排布的多个焦点的位置逐个扫描轰击对应的阳极靶结构3的靶面，产生X射线；电子束的扫描控制方式可根据实际应用方式做不同的控制方式设计。因此，通过偏转线圈6可以实现控制电子束完成多靶面之间的任意切换扫描，从而完成多焦点(X射线焦点)之间的切换，提高了本扫描式X射线源的效率。
在本发明的一个实施例中，当采用一个阳极靶结构3产生并出射X射线(宽束或窄束X射线)，且阳极靶结构3采用整体式反射靶301，在整体式反射靶301的钢板303上按照线阵形式(准直孔305的行数(Y方向)为1)排布多个准直孔305时，或者当采用多个以线阵形式排布的阳极靶结构3产生并出射X射线(宽束或窄束X射线)，且阳极靶结构3采用独立个体式反射靶301时，由于在电子束在Y方向上只扫描轰击一行阳极靶结构3的靶面，因此对Y方向偏转线圈给出一个固定的输入电平即可，该电平能保证阴极灯丝发射出的高速电子束在Y方向上能够轰击靶面所在位置。考虑一种更简化的设计，如图7所示，可以将本扫描式X射线源的阴极灯丝发射出的电子束与靶面所在位置正对，从而可以不需要Y方向偏转线圈，使得本扫描式X射线源体积更小巧。
下面结合图8，并以下面的几种电子束的扫描控制方式为例，详细说明对X方向偏转线圈和Y方向偏转线圈施加电压波形，如何控制电子束的运动方向。
如图8所示，出射面上的方框代表射线的出射口306，箭头表示电子束扫描轰击靶面的运动方向，出射面上方的曲线代表在X方向偏转线圈上施加的电压波形，出射面左方的曲线代表在Y方向偏转线圈上施加的电压波形，X方向偏转线圈和Y方向偏转线圈被施加的电压波形配合以使得电子束按照从左到右、从上到下的顺序逐个扫描轰击阳极靶结构3的靶面，产生X射线。
具体的，可以在X方向偏转线圈上施加三角波形电压后，电子束随着X方向偏转线圈上施加的三角波形电压的增加，在X方向上从左到右逐个扫描轰击阳极靶结构3的靶面，产生X射线；当X方向偏转 线圈上施加的三角波形电压从最大变为最小时，电子束又重新回到最左边的起点开始新的一轮从左到右的扫描轰击阳极靶结构3的靶面过程。
同样，可以在Y方向偏转线圈上施加三角波形电压后，电子束随着Y方向偏转线圈上施加的三角波形电压的增加，在Y方向上从上到下逐个扫描轰击阳极靶结构3的靶面，产生X射线；当Y方向偏转线圈上施加的三角波形电压从最大变为最小时，电子束又重新回到最上边的起点开始新的一轮从上到下的扫描轰击阳极靶结构3的靶面过程。
当需要使电子束逐行(X方向)逐个扫描轰击阳极靶结构3的靶面时，可以在Y方向偏转线圈上施加台阶波电压，在X方向偏转线圈上施加三角波形电压；即Y方向偏转线圈上施加的台阶波电压保持不变保证电子束在Y方向上位置不变化，而电子束在X方向上能够从左到右逐个扫描轰击阳极靶结构3的靶面，产生X射线；当Y方向偏转线圈上施加的台阶波电压升高到与下一行电子束扫描位置对应的电压并保持时，电子束在X方向上开始新的一轮从左到右扫描轰击阳极靶结构3的靶面过程。以此类推，Y方向偏转线圈上施加的台阶波电压每升高一个台阶，电子束的就向下移动一行，从而实现电子束整个面的逐行逐列逐个扫描轰击阳极靶结构3的靶面。
当需要使电子束逐列(X方向)逐个扫描轰击阳极靶结构3的靶面时，可以在X方向偏转线圈上施加台阶波电压，在Y方向偏转线圈上施加三角波形电压；即X方向偏转线圈上施加的台阶波电压保持不变保证电子束在X方向上位置不变化，而电子束在Y方向上能够从上到下逐个扫描轰击阳极靶结构3的靶面，产生X射线；当X方向偏转线圈上施加的台阶波电压升高到与下一列电子束扫描位置对应的电压并保持时，电子束在Y方向上开始新的一轮从上到下扫描轰击阳极靶结构3的靶面过程。以此类推，X方向偏转线圈上施加的台阶波电压每升高一个台阶，电子束的就向右移动一列，从而实现电子束整个面的逐列逐行逐个扫描轰击阳极靶结构3的靶面。
本扫描式X射线源不仅可以适用于阳极接地型的X射线源，还可以适用于阴极接地型的X射线源或者中性点接地型的X射线源。在阴极接地型的X射线源的情况下，阴极被接地，且采用外部高压电源向 每个阳极靶结构3施加正高电压。在中性点接地型的X射线源的情况下，向阴极施加负高电压，向每个阳极靶结构3施加正高电压。
本发明所提供的扫描式X射线源通过采用一个阴极产生电子束，并通过栅极控制电子束的通断，以及偏转线圈对电子束运动方向的控制，从而实现按照预设规则逐个轰击对应的靶面，以完成多焦点之间的切换，不仅提高了本扫描式X射线源的效率，还满足了成像系统对扫描式X射线源及获取多个投照角度的图像的需求，并解决了采用运动机构实现X射线源旋转或平移时产生机械运动伪影的问题。另外，本扫描式X射线源还具有更大的功率和热容量，及具有体积小、焦点密度高的特点。
本发明还提供了一种成像系统，该成像设备包含有上述的扫描式X射线源，不仅可以满足成像系统对扫描式X射线源及获取多个投照角度的图像的需求，还避免了采用运动机构实现X射线源旋转或平移时容易产生机械运动伪影现象的发生，提高了成像系统的成像质量。成像系统的其它结构(除了本扫描式X射线源以外的结构)及工作原理为现有技术，在此不再赘述。
为了便于对本成像系统的理解，下面结合图9～13，简单说明本成像系统与本扫描式X射线源结合在一起的几种布局结构。
如图9所示，在反向几何成像系统中，需要采用采用本扫描式X射线源的阳极靶结构3产生并出射窄束X射线，并且本扫描式X射线源分布在满足该反向几何成像系统机架的平面上。
如图10和11所示，在数字TOMO系统(如，乳腺TOMO功能)中，需要采用采用本扫描式X射线源的阳极靶结构3产生并出射宽束X射线，并且本扫描式X射线源分布在满足该数字TOMO系统机架的弧面或直线面上。
如图12和图13所示，在静态CT系统中需要采用本扫描式X射线源的阳极靶结构3产生并出射宽束X射线，并且本扫描式X射线源分布在满足该静态CT系统机架的射线圆环上。例如，可以根据该静态CT系统的设计需求将多个本扫描式X射线源分布在射线圆环上，每个扫描式X射线源独立控制；其中，每个扫描式X射线源的阳极靶结构3采用一个整体式反射靶，在整体式反射靶的钢板上按照线阵形式(准 直孔的行数(Y方向)为1)排布多个准直孔；并且，每个扫描式X射线源的阴极灯丝发射出的电子束与靶面所在位置正对。
以上对本发明所提供的扫描式X射线源及其成像系统进行了详细的说明。对本领域的一般技术人员而言，在不背离本发明实质内容的前提下对它所做的任何显而易见的改动，都将构成对本发明专利权的侵犯，将承担相应的法律责任。

Claims (12)

  1. 一种扫描式X射线源，其特征在于包括真空腔体，所述真空腔体内设置有阴极与多个阳极靶结构，所述真空腔体内靠近所述阴极的位置设置有栅极，所述真空腔体内靠近所述栅极的位置设置有聚焦极，所述真空腔体的外周并靠近所述栅极的位置设置有偏转线圈；
    所述控制栅极将所述阴极产生的电子束依次经过所述聚焦极的聚焦、所述偏转线圈的运动方向控制后，按照预设规则逐个轰击对应的所述阳极靶结构的靶面，并从所述靶面的轰击侧产生X射线，形成按照预设排列形状排布的多个焦点。
  2. 如权利要求1所述的扫描式X射线源，其特征在于：
    当采用至少一个所述阳极靶结构产生并出射窄束X射线，且所述阳极靶结构采用整体式反射靶时，所述整体式反射靶的上表面设置有散热块，所述散热块的上表面设置有钢板，所述钢板上按照线阵形式排布有多个准直孔，所述准直孔对应于一个铍窗，形成多个X射线的出射口。
  3. 如权利要求1所述的扫描式X射线源，其特征在于：
    当采用至少一个所述阳极靶结构产生并出射窄束X射线，且所述阳极靶结构以阵列形式排布时，所述阳极靶结构采用独立个体式反射靶，所述独立个体式反射靶的上表面设置有散热块，所述散热块的上表面设置有钢板，所述钢板上对应于所述独立个体式反射靶设置有准直孔，所述准直孔对应于一个铍窗，形成多个X射线的出射口。
  4. 如权利要求2或3所述的扫描式X射线源，其特征在于：
    所述准直孔内嵌于所述钢板，所述铍窗内嵌于所述散热块和所述钢板上并贯穿对应的所述准直孔。
  5. 如权利要求1所述的扫描式X射线源，其特征在于：
    当采用至少一个所述阳极靶结构产生并出射宽束X射线，且所述阳极靶结构采用整体式反射靶时，所述整体式反射靶的下表面设置有散热块，所述整体式反射靶的上表面设置有钢板，所述钢板上按照线阵形式排布有多个准直孔，所述准直孔对应于铍窗，形成多个X射线的出射口。
  6. 如权利要求1所述的扫描式X射线源，其特征在于：
    当采用至少一个所述阳极靶结构产生并出射宽束X射线，且所述阳极靶结构以阵列形式排布时，所述阳极靶结构采用独立个体式反射靶，所述独立个体式反射靶的上表面设置有钢板，所述独立个体式反射靶的下表面设置有钢板，所述钢板上对应于所述独立个体式反射靶设置有准直孔；所述准直孔对应于铍窗，形成多个X射线的出射口。
  7. 如权利要求5或6所述的扫描式X射线源，其特征在于：
    所述准直孔内嵌于所述钢板，所述铍窗内嵌于所述钢板上并贯穿对应的所述准直孔。
  8. 如权利要求1所述的扫描式X射线源，其特征在于：
    所述扫描式X射线源配设有栅控开关，所述栅控开关通过支架与所述真空腔体固定，所述栅控开关的输出端通过导线连接至所述栅极，所述栅控开关与栅控电源连接，所述栅控电源与外部高压电源连接。
  9. 如权利要求1所述的扫描式X射线源，其特征在于：
    所述偏转线圈包括X方向偏转线圈和Y方向偏转线圈，所述X方向偏转线圈和所述Y方向偏转线圈分别设置有控制接口，所述控制接口分别与主控电路连接，所述主控电路对所述X方向偏转线圈和所述Y方向偏转线圈的所述控制接口分别施加预设的电压波形，实现控制所述阴极产生的电子束的运动方向。
  10. 如权利要求1所述的扫描式X射线源，其特征在于：
    当采用一个所述阳极靶结构产生并出射X射线，且所述阳极靶结构采用整体式反射靶时，所述阴极发射出的电子束正对所述整体式反射靶的靶面。
  11. 如权利要求1所述的扫描式X射线源，其特征在于：
    当采用多个以线阵形式排布的所述阳极靶结构产生并出射X射线，且所述阳极靶结构采用独立个体式反射靶时，所述阴极发射出的电子束正对所述独立个体式反射靶的靶面。
  12. 一种成像系统，其特征在于包括权利要求1～11中任意一项所述的扫描式X射线源。
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102645442A (zh) * 2012-05-04 2012-08-22 上海英迈吉东影图像设备有限公司 一种利用电子偏转形成飞点的系统和方法
CN103227082A (zh) * 2012-12-22 2013-07-31 深圳先进技术研究院 X射线发射装置及x射线产生方法
CN104411081A (zh) * 2014-11-13 2015-03-11 重庆大学 用于微纳ct系统的线阵列微纳焦点x射线源
CN205508764U (zh) * 2016-03-29 2016-08-24 孙云峰 多阳极x射线源
JP2017027832A (ja) * 2015-07-24 2017-02-02 株式会社日立製作所 Ｘ線発生装置
CN206685345U (zh) * 2017-02-28 2017-11-28 公安部第一研究所 一种钛窗结构x射线管
CN108777248A (zh) * 2018-06-29 2018-11-09 北京纳米维景科技有限公司 一种扫描式x射线源及其成像系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1802704B2 (de) * 1968-10-11 1972-03-02 Rigaku Denki Co Ltd , Tokio Kuehleinrichtung fuer die antikathode einer roentgenroehre
GB1597841A (en) * 1977-01-19 1981-09-09 Nicolet Xrd Corp Electron beam focussing
DE2811464A1 (de) * 1977-03-17 1978-09-21 Jacob Haimson Verfahren und vorrichtung zum erzeugen von roentgenstrahlen aus verschiedenen richtungen ohne sich bewegende teile
US4130759A (en) * 1977-03-17 1978-12-19 Haimson Research Corporation Method and apparatus incorporating no moving parts, for producing and selectively directing x-rays to different points on an object
JPS5546408A (en) * 1978-09-29 1980-04-01 Toshiba Corp X-ray device
US6263046B1 (en) * 1999-08-04 2001-07-17 General Electric Company Heat pipe assisted cooling of x-ray windows in x-ray tubes
JP3930770B2 (ja) * 2002-06-14 2007-06-13 浜松ホトニクス株式会社 Ｘ線照射装置
US6819739B2 (en) * 2002-11-27 2004-11-16 Agilent Technologies, Inc. Method and apparatus for calibrating an x-ray laminography imaging system
JP2005276760A (ja) * 2004-03-26 2005-10-06 Shimadzu Corp Ｘ線発生装置
JP2010146902A (ja) 2008-12-19 2010-07-01 Toshiba Lighting & Technology Corp 照明装置
CN103903940B (zh) 2012-12-27 2017-09-26 清华大学 一种产生分布式x射线的设备和方法
CN104470177B (zh) * 2013-09-18 2017-08-25 同方威视技术股份有限公司 X射线装置及具有该x射线装置的ct设备
US11058893B2 (en) * 2017-06-02 2021-07-13 Precision Rt Inc. Kilovoltage radiation therapy

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102645442A (zh) * 2012-05-04 2012-08-22 上海英迈吉东影图像设备有限公司 一种利用电子偏转形成飞点的系统和方法
CN103227082A (zh) * 2012-12-22 2013-07-31 深圳先进技术研究院 X射线发射装置及x射线产生方法
CN104411081A (zh) * 2014-11-13 2015-03-11 重庆大学 用于微纳ct系统的线阵列微纳焦点x射线源
JP2017027832A (ja) * 2015-07-24 2017-02-02 株式会社日立製作所 Ｘ線発生装置
CN205508764U (zh) * 2016-03-29 2016-08-24 孙云峰 多阳极x射线源
CN206685345U (zh) * 2017-02-28 2017-11-28 公安部第一研究所 一种钛窗结构x射线管
CN108777248A (zh) * 2018-06-29 2018-11-09 北京纳米维景科技有限公司 一种扫描式x射线源及其成像系统

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3817027A4 *

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