WO2020000909A1 - 一种pcb"d"字型异型焊盘的加工方法 - Google Patents
一种pcb"d"字型异型焊盘的加工方法 Download PDFInfo
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- WO2020000909A1 WO2020000909A1 PCT/CN2018/119851 CN2018119851W WO2020000909A1 WO 2020000909 A1 WO2020000909 A1 WO 2020000909A1 CN 2018119851 W CN2018119851 W CN 2018119851W WO 2020000909 A1 WO2020000909 A1 WO 2020000909A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Definitions
- the invention belongs to the technical field of PCB processing, and particularly relates to a method for processing a PCB "D" shaped special-shaped pad.
- Radial inductors, capacitors, resistors, and other PCB surface mount components with miniaturization, high quality, high energy storage, and low resistance are widely used in modern communications, high-end optoelectronics, and smart devices.
- Larger pad designs such as the PCB pads and solder mask window size of such components can save more space. Because there is no solder mask window groove around the pad to block tin, the stencil and pad can be on the same horizontal plane, so that the component pins have more uniform tin loading performance, better electrical contact performance and heat dissipation performance.
- solder mask windows are 25-50 ⁇ m on one side of the pad to prevent the solder mask from being misaligned or the solder pad may be misaligned.
- the solder mask openings and pads of the "shaped" shaped pads are large and irregularly shaped as "D". Since such pads are basically as large as the solder resist opening window, the accuracy of solder resist alignment must be consistent with the size of the pads on the line.
- PCBs are affected by equipment accuracy, material characteristics, process capabilities, etc. during the manufacturing process.
- Conventional process technology and design cannot meet the production requirements of such products, which will lead to problems such as pad offset, size reduction, poor solderability, and test failure.
- the technical solution of the present invention is: a method for processing a PCB “D” shaped special-shaped pad, which is characterized by including the following processes:
- the lamination needs to make the first board to adjust the production after the expansion and contraction;
- the outer layer line is directly imaged and exposed by LDI laser to ensure the size of the line pad;
- the solder mask adopts the same LDI laser direct imaging exposure to ensure that the solder mask window and the circuit pad are large, and the deviation is controlled to a minimum.
- the flying probe test process is also included. Specifically, a high-precision flying probe tester with a screw movement system is selected before the test, and the system software is used to make a large correction of the screw precision of the flying probe machine to ensure the XY displacement accuracy of the equipment. Achieve the best state; use "D" shaped special-shaped pads as the alignment test.
- the test needles used include an upper needle base, a lower needle base, a fixed frame, and a test piece, and the upper needle base and the lower needle base are symmetrically disposed on one side of the fixed frame and used
- the fixed frame is connected, the test piece is disposed on the other side of the fixed frame, an arc-shaped opening is provided below the test piece, and a tip of the arc-shaped opening is provided with a needle tip.
- a groove is symmetrically provided on the lower needle seat.
- test needle of the present invention selects a test pin for tungsten steel, which has better contact performance and is more suitable for secondary finishing. It is designed for "D" shaped special-shaped pads, and the tip of the needle is specially opened.
- the design groove of the seat serves as a buffer, and the design and production of special test pins for special-shaped pads are as follows:
- Conventional flying probe test pins are made of hard manganese steel.
- the outer layer is usually protected by gold plating, so the width of the tip is usually more than 4.5mil.
- the special-shaped pad special test pin of the present invention is made of tungsten steel with better contact performance, and the texture of manganese steel is slightly softer, so the tip is easier to form.
- the manufactured tip can reach 2.5mil, which is smaller than the area of manganese steel.
- Gold plating protects the needle body, and then sharpens the needle tip with 1500-3000 # sandpaper to make the needle tip sharper than a conventional knife.
- the needle body In order to reduce the contact pressure between the needle tip and the plate, the needle body needs to be buffered, that is, a side-by-side groove is drilled at the connection position of the lower needle seat, so that the needle seat is more flexible as a whole.
- the invention designs special-purpose test pins for special-shaped pads to select tungsten steel with better contact performance, and performs special opening treatment on the tip of the needle, performs buffer design on the needle seat, and produces test pins according to the design requirements by using a calibration plate to test the test pins. Make small corrections to ensure the best alignment accuracy of the needle tip.
- a method for processing a large "D" shaped special-shaped PCB with a solder resist window and a pad is provided.
- the engineering data of the “D” shaped special-shaped pads are newly designed, so that the size of the pads and the size of the solder resist opening window are large, etc., and the deviation of the pads and the reduction in size due to engineering design and process processing are avoided. , Quality problems such as poor solderability and test failure.
- PCBs are affected by equipment accuracy, material characteristics, process capabilities, etc.
- the large "D" shaped special-shaped pads such as solder mask windows and pads will shrink to varying degrees.
- the invention realizes that the actual size of the special-shaped pads such as “D” and the like are highly consistent from the perspective of engineering design and process capability control of key process equipment, so as to ensure that the general use or flying for “D” -shaped pads can be performed in the future.
- Electrical testing Eliminates the problem of missing open and short circuit functional defects, improves test efficiency, and is suitable for the future automated mass production of special-shaped pads to meet customer delivery needs.
- Design of test data firstly measure the deviation and expansion of the "D" shaped special pads on the physical board in the product, and then modify the data of the work board to form new test data based on the measured average data.
- the use of the new data to make fixtures, test data, and board repair data can ensure that the center alignment of the tested "D" shaped special-shaped pad physical board and the data coordinates are more accurately aligned.
- FIG. 1 is a schematic structural diagram of a test needle of the present invention.
- a processing method of a PCB "D" shaped special-shaped pad is characterized in that it includes the following processes:
- the lamination needs to make the first board to adjust the production after the expansion and contraction;
- the outer layer line is directly imaged and exposed by LDI laser to ensure the size of the line pad;
- the solder mask adopts the same LDI laser direct imaging exposure to ensure that the solder mask window and the circuit pad are large, and the deviation is controlled to a minimum.
- the flying probe test process is also included. Specifically, a high-precision flying probe tester with a screw movement system is selected before the test, and the system software is used to make a large correction of the screw precision of the flying probe machine to ensure the XY displacement accuracy of the equipment. Achieve the best state; use "D" shaped special-shaped pads as the alignment test.
- the test needle 10 used includes an upper needle base 1, a lower needle base 2, a fixed frame 3, and a test piece 4, and the upper needle base and the lower needle base are symmetrically disposed on the fixed frame.
- One side of the arc-shaped opening is connected with a fixing frame, and the test piece is disposed on the other side of the fixing frame.
- An arc-shaped opening 41 is provided below the test piece, and a tip 42 is provided at the end of the arc-shaped opening.
- a groove 21 is provided on the lower needle base 2 symmetrically.
- test needle of the present invention selects a test pin for tungsten steel, which has better contact performance and is more suitable for secondary finishing. It is designed for "D" shaped special-shaped pads, and the tip of the needle is specially opened.
- the design groove of the seat serves as a buffer, and the design and production of special test pins for special-shaped pads are as follows:
- Conventional flying probe test pins are made of hard manganese steel.
- the outer layer is usually protected by gold plating, so the width of the tip is usually more than 4.5mil.
- the special-shaped pad special test pin of the present invention is made of tungsten steel with better contact performance, and the texture of manganese steel is slightly softer, so the tip is easier to form.
- the manufactured tip can reach 2.5mil, which is smaller than the area of manganese steel.
- Gold plating protects the needle body, and then sharpens the needle tip with 1500-3000 # sandpaper to make the needle tip sharper than a conventional knife.
- the needle body In order to reduce the contact pressure between the needle tip and the plate, the needle body needs to be buffered, that is, a side-by-side groove is drilled at the connection position of the lower needle seat, so that the needle seat is more flexible as a whole.
- the invention designs special-purpose test pins for special-shaped pads to select tungsten steel with better contact performance, and performs special opening treatment on the tip of the needle, performs buffer design on the needle seat, and produces test pins according to the design requirements by using a calibration plate to test the test pins. Make small corrections to ensure the best alignment accuracy of the needle tip.
- a processing method of a PCB "D" shaped special-shaped pad is characterized in that it includes the following processes:
- the lamination needs to make the first board to adjust the production after the expansion and contraction;
- the outer layer line is directly imaged and exposed by LDI laser to ensure the size of the line pad;
- the solder mask adopts the same LDI laser direct imaging exposure to ensure that the solder mask window and the circuit pad are large, and the deviation is controlled to a minimum.
- the flying probe test process is also included. Specifically, a high-precision flying probe tester with a screw movement system is selected before the test, and the system software is used to make a large correction of the screw precision of the flying probe machine to ensure the XY displacement accuracy of the equipment. Achieve the best state; use "D" shaped special-shaped pads as the alignment test.
- the test needle 10 used includes an upper needle base 1, a lower needle base 2, a fixed frame 3, and a test piece 4, and the upper needle base and the lower needle base are symmetrically disposed on the fixed frame.
- One side of the arc-shaped opening is connected with a fixing frame, and the test piece is disposed on the other side of the fixing frame.
- An arc-shaped opening 41 is provided below the test piece, and a tip 42 is provided at the end of the arc-shaped opening.
- a groove 21 is provided on the lower needle base 2 symmetrically.
- test needle of the present invention selects a test pin for tungsten steel, which has better contact performance and is more suitable for secondary finishing. It is designed for "D" shaped special-shaped pads, and the tip of the needle is specially opened.
- the design groove of the seat serves as a buffer, and the design and production of special test pins for special-shaped pads are as follows:
- Conventional flying probe test pins are made of hard manganese steel.
- the outer layer is usually protected by gold plating, so the width of the tip is usually more than 4.5mil.
- the special-shaped pad special test pin of the present invention is made of tungsten steel with better contact performance, and the texture of manganese steel is slightly softer, so the tip is easier to form.
- the manufactured tip can reach 2.5 mil, which is smaller than the area of manganese steel.
- Gold plating protects the needle body, and then sharpens the needle tip with 1500-3000 # sandpaper to make the needle tip sharper than a conventional knife.
- the needle body In order to reduce the contact pressure between the needle tip and the plate, the needle body needs to be buffered, that is, a side-by-side groove is drilled at the connection position of the lower needle seat, so that the needle seat is more flexible as a whole.
- the invention designs special-purpose test pins for special-shaped pads to select tungsten steel with better contact performance, and performs special opening treatment on the tip of the needle, performs buffer design on the needle seat, and produces test pins according to the design requirements by using a calibration plate to test the test pins. Make small corrections to ensure the best alignment accuracy of the needle tip.
- a method for processing a large "D" shaped special-shaped PCB with a solder resist window and a pad is provided.
- the engineering data of the “D” shaped special-shaped pads are newly designed, so that the size of the pads and the size of the solder resist opening window are large, etc., and the deviation of the pads and the reduction in size due to engineering design and process processing are avoided. , Quality problems such as poor solderability and test failure.
- PCBs are affected by equipment accuracy, material characteristics, process capabilities, etc.
- the large "D" shaped special-shaped pads such as solder mask windows and pads will shrink to varying degrees.
- the invention realizes that the actual size of the special-shaped pads such as “D” and the like are highly consistent from the perspective of engineering design and process capability control of key process equipment, so as to ensure that the general use or flying for “D” -shaped pads can be performed in the future.
- Electrical testing Eliminates the problem of missing open and short circuit functional defects, improves test efficiency, and is suitable for the future automated mass production of special-shaped pads to meet customer delivery needs.
- Design of test data firstly measure the deviation and expansion of the "D" shaped special pads on the physical board in the product, and then modify the data of the work board to form new test data based on the measured average data.
- the use of the new data to make fixtures, test data, and board repair data can ensure that the center alignment of the tested "D" shaped special-shaped pad physical board and the data coordinates are more accurately aligned.
- a processing method of a PCB "D" shaped special-shaped pad is characterized in that it includes the following processes:
- the lamination needs to make the first board to adjust the production after the expansion and contraction;
- the outer layer line is directly imaged and exposed by LDI laser to ensure the size of the line pad;
- the solder mask adopts the same LDI laser direct imaging exposure to ensure that the solder mask window and the circuit pad are large, and the deviation is controlled to a minimum.
- the flying probe test process is also included. Specifically, a high-precision flying probe tester with a screw movement system is selected before the test, and the system software is used to make a large correction of the screw precision of the flying probe machine to ensure the XY displacement accuracy of the equipment Achieve the best state; use "D" shaped special-shaped pads as the alignment test.
- the test needle 10 used includes an upper needle base 1, a lower needle base 2, a fixed frame 3, and a test piece 4, and the upper needle base and the lower needle base are symmetrically disposed on the fixed frame.
- One side of the arc-shaped opening is connected with a fixing frame, and the test piece is disposed on the other side of the fixing frame.
- An arc-shaped opening 41 is provided below the test piece, and a tip 42 is provided at the end of the arc-shaped opening.
- a groove 21 is provided on the lower needle base 2 symmetrically.
- a processing method of a PCB "D" shaped special-shaped pad is characterized in that it includes the following processes:
- the lamination needs to make the first board to adjust the production after the expansion and contraction;
- the outer layer line is directly imaged and exposed by LDI laser to ensure the size of the line pad;
- the solder mask adopts the same LDI laser direct imaging exposure to ensure that the solder mask window and the circuit pad are large, and the deviation is controlled to a minimum.
- the flying probe test process is also included. Specifically, a high-precision flying probe tester with a screw movement system is selected before the test, and the system software is used to make a large correction of the screw precision of the flying probe machine to ensure the XY displacement accuracy of the equipment. Achieve the best state; use "D" shaped special-shaped pads as the alignment test.
- the test needle 10 used includes an upper needle base 1, a lower needle base 2, a fixed frame 3, and a test piece 4, and the upper needle base and the lower needle base are symmetrically disposed on the fixed frame.
- One side of the arc-shaped opening is connected with a fixing frame, and the test piece is disposed on the other side of the fixing frame.
- An arc-shaped opening 41 is provided below the test piece, and a tip 42 is provided at the end of the arc-shaped opening.
- a groove 21 is provided on the lower needle base 2 symmetrically.
- the present invention will newly design a new process and a precision control scheme for the processing of "D" shaped special pads, and develop a new process testing technology for electrical testing, so that the size and electrical performance of "D" shaped special pads can meet customer quality Need to provide technical support for large-scale automated rapid production of printed circuit boards with "D" shaped pads.
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Abstract
一种PCB"D"字型异型焊盘的加工方法，其特征在于，包括以下工艺：S1.依据工程设计的资料开料，层压需要制作首板调整涨缩后生产；S2.将"D"字型异型焊盘线路的菲林单边设置为50-100μm，阻焊开窗单边设置为50-75μm；S3.外层线路采用LDI镭射直接成像对位曝光，确保线路焊盘的大小；S4.阻焊采用同台LDI镭射直接成像曝光，保证阻焊开窗与线路焊盘等大，将偏位控制到最小。该方法将全新设计新的工艺加工流程和"D"字型异型焊盘的加工精度控制方案，开发电测新的工艺检测技术，让"D"字型异型焊盘尺寸及电性能满足客户品质需要，为企业大规模自动化快速生产"D"字型异型焊盘的印制电路板提供技术保障。
Description
本发明属于PCB加工技术领域，具体涉及一种PCB“D”字型异型焊盘的加工方法。
具有小型化、高品质、高能量储存和低电阻之特性的径向型电感、电容、电阻等PCB表面贴装元件在现代通讯、高端光电、智能设备领域的应用越来越广泛。此类元件的PCB焊盘与阻焊开窗尺寸基本等大的焊盘设计则可节省更多的空间。因焊盘四周无阻焊开窗沟槽挡锡，钢网与焊盘可处于同一水平面上让元件引脚具有更加均匀的上锡性能、更加优良的电接触性能和散热性能。
PCB常规焊盘为圆型或方型且焊盘四周单边有25-50μm的阻焊开窗，以预防阻焊偏位上焊盘导致焊盘偏位或阻焊上焊盘，而“D”字型异型焊盘的阻焊开窗与焊盘等大且呈不规则“D”字形状。由于此类焊盘与阻焊开窗基本等大，阻焊对位精度必须与线路的焊盘大小一致。
PCB在制造过程中受设备精度、材料特性、工艺能力等影响板子均存在不同程度的涨缩。常规的工艺技术与设计无法满足此类产品的制作要求，会导致焊盘偏位、尺寸缩小、可焊性变差、测试失效等问题。
本发明的技术方案为：一种PCB“D”字型异型焊盘的加工方法，其特征在于，包括以下工艺：
S1. 依据工程设计的资料开料，层压需要制作首板调整涨缩后生产；
S2.将“D”字型异型焊盘线路的菲林单边设置为50-100μm，阻焊开窗单边设置为50-75μm；
S3. 外层线路采用LDI镭射直接成像对位曝光，确保线路焊盘的大小；
S4. 阻焊采用同台LDI镭射直接成像曝光，保证阻焊开窗与线路焊盘等大，将偏位控制到最小。
进一步的，还包括飞针测试工艺，具体为：测试前选择带有丝杆运动系统的高精度飞针测试机，利用系统软件对飞针机的丝杆精度作大校正，确保设备XY位移精度达到最佳状态；以“D”字型异型焊盘为对位点进行对位测试。
进一步的，所述飞针测试工艺中，采用的测试针具包括上针座、下针座、固定架、测试片，所述上针座与下针座对称设置于固定架的一侧并以固定架连接，所述测试片设置于固定架的另一侧，所述测试片下方设有弧形开口，所述弧形开口的末端设有针尖。
更进一步的，所述下针座上对称设有凹槽。
特别的，本发明的测试针具选择接触性能更优更适合二次精加工的钨钢制作设计“D”字型异型焊盘专用测试针，并对针尖作特殊的开锋处理，对下针座设计凹槽作缓冲作用，异型焊盘专用测试针的设计与制作如下：
常规飞针测试针用材质硬的锰钢制作，为防止氧化外层通常采用镀金保护，因此针尖宽度通常在4.5mil以上。本发明的异型焊盘专用测试针由接触性能更优的钨钢制作，质地锰钢稍软，因此针尖更容易成型，制作出来的针尖可达到2.5mil，比锰钢的针尖面积更小，先镀金对针身进行保护，然后对针尖用1500-3000#砂纸进行打磨开锋，让针尖比常规刀更锋利。
为减缓针尖与板的接触压力，需对针体进行缓冲设计，即在下针座的连接位钻并排凹槽，让针座整体在更具有弹性。
本发明设计异型焊盘专用测试针选择接触性能更优的钨钢制作，并对针尖作特殊的开锋处理，对针座进行缓冲设计，并按设计要求制作测试针利用校正板对测试针的精度作小校正，确保针尖的对准精度达到最佳状态。
1、本发明中，提供一种阻焊开窗与焊盘等大的“D”字型异型焊盘PCB的流程加工方法。本发明方法通过全新设计“D”字型异型焊盘的工程资料，实现焊盘尺寸与阻焊开窗的尺寸等大，避免了因工程设计及流程加工原因导致的焊盘偏位、尺寸缩小、可焊性变差、测试失效等品质问题的发生。
2、PCB在制造过程中受设备精度、材料特性、工艺能力等影响板子阻焊开窗与焊盘等大的“D”字型异型焊盘均会存在不同程度的缩小。本发明从工程设计与关键流程设备工艺能力控制的角度去实现“D”字型等异型焊盘的实际尺寸与资料的高度一致，确保后续能采用通用或飞针对“D”字型焊盘进行电性检测。杜绝了开短路功能性缺陷漏失问题，提升了测试效率，适用于异型焊盘板未来自动化大批量快速生产，满足客户交付的需要。
3、测试资料的设计：需要先测量实物板“D”字型异型焊盘在产品中的偏位和涨缩情况，然后依据测量的平均数据去修改工作板的资料形成新的测试资料。利用形成的新资料制作治具、测试资料、修板资料，才能保证被测的“D”字型异型焊盘实物板的中心对位点与资料坐标更精确对位。
4、开发了“D”字型异型焊盘专用飞针测试针。此针采用钨钢制作后进行开锋处理，与焊盘更具有优良的接触性能。在针座的注塑薄片机构钻出5个孔以增加针座的柔忍性和弹性，即保证了测试针不扎伤测试焊盘又保护了针的安全，让异型焊盘测试针整体性能稳定、测试更加精准。
图1为本发明测试针具的结构示意图。
一种PCB“D”字型异型焊盘的加工方法，其特征在于，包括以下工艺：
S1. 依据工程设计的资料开料，层压需要制作首板调整涨缩后生产；
S2.将“D”字型异型焊盘线路的菲林单边设置为75μm，阻焊开窗单边设置为60μm；
S3. 外层线路采用LDI镭射直接成像对位曝光，确保线路焊盘的大小；
S4. 阻焊采用同台LDI镭射直接成像曝光，保证阻焊开窗与线路焊盘等大，将偏位控制到最小。
进一步的，还包括飞针测试工艺，具体为：测试前选择带有丝杆运动系统的高精度飞针测试机，利用系统软件对飞针机的丝杆精度作大校正，确保设备XY位移精度达到最佳状态；以“D”字型异型焊盘为对位点进行对位测试。
进一步的，所述飞针测试工艺中，采用的测试针具10包括上针座1、下针座2、固定架3、测试片4，所述上针座与下针座对称设置于固定架的一侧并以固定架连接，所述测试片设置于固定架的另一侧，所述测试片下方设有弧形开口41，所述弧形开口的末端设有针尖42。
更进一步的，所述下针座2上对称设有凹槽21。
特别的，本发明的测试针具选择接触性能更优更适合二次精加工的钨钢制作设计“D”字型异型焊盘专用测试针，并对针尖作特殊的开锋处理，对下针座设计凹槽作缓冲作用，异型焊盘专用测试针的设计与制作如下：
常规飞针测试针用材质硬的锰钢制作，为防止氧化外层通常采用镀金保护，因此针尖宽度通常在4.5mil以上。本发明的异型焊盘专用测试针由接触性能更优的钨钢制作，质地锰钢稍软，因此针尖更容易成型，制作出来的针尖可达到2.5mil，比锰钢的针尖面积更小，先镀金对针身进行保护，然后对针尖用1500-3000#砂纸进行打磨开锋，让针尖比常规刀更锋利。
为减缓针尖与板的接触压力，需对针体进行缓冲设计，即在下针座的连接位钻并排凹槽，让针座整体在更具有弹性。
本发明设计异型焊盘专用测试针选择接触性能更优的钨钢制作，并对针尖作特殊的开锋处理，对针座进行缓冲设计，并按设计要求制作测试针利用校正板对测试针的精度作小校正，确保针尖的对准精度达到最佳状态。
一种PCB“D”字型异型焊盘的加工方法，其特征在于，包括以下工艺：
S1. 依据工程设计的资料开料，层压需要制作首板调整涨缩后生产；
S2.将“D”字型异型焊盘线路的菲林单边设置为75μm，阻焊开窗单边设置为60μm；
S3. 外层线路采用LDI镭射直接成像对位曝光，确保线路焊盘的大小；
S4. 阻焊采用同台LDI镭射直接成像曝光，保证阻焊开窗与线路焊盘等大，将偏位控制到最小。
进一步的，还包括飞针测试工艺，具体为：测试前选择带有丝杆运动系统的高精度飞针测试机，利用系统软件对飞针机的丝杆精度作大校正，确保设备XY位移精度达到最佳状态；以“D”字型异型焊盘为对位点进行对位测试。
进一步的，所述飞针测试工艺中，采用的测试针具10包括上针座1、下针座2、固定架3、测试片4，所述上针座与下针座对称设置于固定架的一侧并以固定架连接，所述测试片设置于固定架的另一侧，所述测试片下方设有弧形开口41，所述弧形开口的末端设有针尖42。
更进一步的，所述下针座2上对称设有凹槽21。
特别的，本发明的测试针具选择接触性能更优更适合二次精加工的钨钢制作设计“D”字型异型焊盘专用测试针，并对针尖作特殊的开锋处理，对下针座设计凹槽作缓冲作用，异型焊盘专用测试针的设计与制作如下：
常规飞针测试针用材质硬的锰钢制作，为防止氧化外层通常采用镀金保护，因此针尖宽度通常在4.5mil以上。本发明的异型焊盘专用测试针由接触性能更优的钨钢制作，质地锰钢稍软，因此针尖更容易成型，制作出来的针尖可达到2.5mil，比锰钢的针尖面积更小，先镀金对针身进行保护，然后对针尖用1500-3000#砂纸进行打磨开锋，让针尖比常规刀更锋利。
为减缓针尖与板的接触压力，需对针体进行缓冲设计，即在下针座的连接位钻并排凹槽，让针座整体在更具有弹性。
本发明设计异型焊盘专用测试针选择接触性能更优的钨钢制作，并对针尖作特殊的开锋处理，对针座进行缓冲设计，并按设计要求制作测试针利用校正板对测试针的精度作小校正，确保针尖的对准精度达到最佳状态。
本发明的有益效果在于：
1、本发明中，提供一种阻焊开窗与焊盘等大的“D”字型异型焊盘PCB的流程加工方法。本发明方法通过全新设计“D”字型异型焊盘的工程资料，实现焊盘尺寸与阻焊开窗的尺寸等大，避免了因工程设计及流程加工原因导致的焊盘偏位、尺寸缩小、可焊性变差、测试失效等品质问题的发生。
2、PCB在制造过程中受设备精度、材料特性、工艺能力等影响板子阻焊开窗与焊盘等大的“D”字型异型焊盘均会存在不同程度的缩小。本发明从工程设计与关键流程设备工艺能力控制的角度去实现“D”字型等异型焊盘的实际尺寸与资料的高度一致，确保后续能采用通用或飞针对“D”字型焊盘进行电性检测。杜绝了开短路功能性缺陷漏失问题，提升了测试效率，适用于异型焊盘板未来自动化大批量快速生产，满足客户交付的需要。
3、测试资料的设计：需要先测量实物板“D”字型异型焊盘在产品中的偏位和涨缩情况，然后依据测量的平均数据去修改工作板的资料形成新的测试资料。利用形成的新资料制作治具、测试资料、修板资料，才能保证被测的“D”字型异型焊盘实物板的中心对位点与资料坐标更精确对位。
4、开发了“D”字型异型焊盘专用飞针测试针。此针采用钨钢制作后进行开锋处理，与焊盘更具有优良的接触性能。在针座的注塑薄片机构钻出5个孔以增加针座的柔忍性和弹性，即保证了测试针不扎伤测试焊盘又保护了针的安全，让异型焊盘测试针整体性能稳定、测试更加精准。
实施例2
一种PCB“D”字型异型焊盘的加工方法，其特征在于，包括以下工艺：
S1. 依据工程设计的资料开料，层压需要制作首板调整涨缩后生产；
S2.将“D”字型异型焊盘线路的菲林单边设置为50μm，阻焊开窗单边设置为50μm；
S3. 外层线路采用LDI镭射直接成像对位曝光，确保线路焊盘的大小；
S4. 阻焊采用同台LDI镭射直接成像曝光，保证阻焊开窗与线路焊盘等大，将偏位控制到最小。
进一步的，还包括飞针测试工艺，具体为：测试前选择带有丝杆运动系统的高精度飞针测试机，利用系统软件对飞针机的丝杆精度作大校正，确保设备XY位移精度达到最佳状态；以“D”字型异型焊盘为对位点进行对位测试。
进一步的，所述飞针测试工艺中，采用的测试针具10包括上针座1、下针座2、固定架3、测试片4，所述上针座与下针座对称设置于固定架的一侧并以固定架连接，所述测试片设置于固定架的另一侧，所述测试片下方设有弧形开口41，所述弧形开口的末端设有针尖42。
更进一步的，所述下针座2上对称设有凹槽21。
实施例3
一种PCB“D”字型异型焊盘的加工方法，其特征在于，包括以下工艺：
S1. 依据工程设计的资料开料，层压需要制作首板调整涨缩后生产；
S2.将“D”字型异型焊盘线路的菲林单边设置为100μm，阻焊开窗单边设置为75μm；
S3. 外层线路采用LDI镭射直接成像对位曝光，确保线路焊盘的大小；
S4. 阻焊采用同台LDI镭射直接成像曝光，保证阻焊开窗与线路焊盘等大，将偏位控制到最小。
进一步的，还包括飞针测试工艺，具体为：测试前选择带有丝杆运动系统的高精度飞针测试机，利用系统软件对飞针机的丝杆精度作大校正，确保设备XY位移精度达到最佳状态；以“D”字型异型焊盘为对位点进行对位测试。
进一步的，所述飞针测试工艺中，采用的测试针具10包括上针座1、下针座2、固定架3、测试片4，所述上针座与下针座对称设置于固定架的一侧并以固定架连接，所述测试片设置于固定架的另一侧，所述测试片下方设有弧形开口41，所述弧形开口的末端设有针尖42。
更进一步的，所述下针座2上对称设有凹槽21。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。需注意的是，本发明中所未详细描述的技术特征，均可以通过任一现有技术实现。
本发明将全新设计新的工艺加工流程和“D”字型异型焊盘的加工精度控制方案，开发电测新的工艺检测技术，让“D”字型异型焊盘尺寸及电性能满足客户品质需要，为企业大规模自动化快速生产“D”字型异型焊盘的印制电路板提供技术保障。
Claims (4)
- 一种PCB“D”字型异型焊盘的加工方法，其特征在于，包括以下工艺：S1. 依据工程设计的资料开料，层压需要制作首板调整涨缩后生产；S2.将“D”字型异型焊盘线路的菲林单边设置为50-100μm，阻焊开窗单边设置为50-75μm；S3. 外层线路采用LDI镭射直接成像对位曝光，确保线路焊盘的大小；S4. 阻焊采用同台LDI镭射直接成像曝光，保证阻焊开窗与线路焊盘等大，将偏位控制到最小。
- 根据权利要求1所述的一种PCB“D”字型异型焊盘的加工方法，其特征在于，还包括飞针测试工艺，具体为：测试前选择带有丝杆运动系统的高精度飞针测试机，利用系统软件对飞针机的丝杆精度作大校正，确保设备XY位移精度达到最佳状态；以“D”字型异型焊盘为对位点进行对位测试。
- 根据权利要求2所述的一种PCB“D”字型异型焊盘的加工方法，其特征在于，所述飞针测试工艺中，采用的测试针具包括上针座、下针座、固定架、测试片，所述上针座与下针座对称设置于固定架的一侧并以固定架连接，所述测试片设置于固定架的另一侧，所述测试片下方设有弧形开口，所述弧形开口的末端设有针尖。
- 根据权利要求3所述的一种PCB“D”字型异型焊盘的加工方法，其特征在于，所述下针座上对称设有凹槽。
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