WO2020000904A1 - 触控面板及其制作方法、显示装置 - Google Patents

触控面板及其制作方法、显示装置 Download PDF

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Publication number
WO2020000904A1
WO2020000904A1 PCT/CN2018/119006 CN2018119006W WO2020000904A1 WO 2020000904 A1 WO2020000904 A1 WO 2020000904A1 CN 2018119006 W CN2018119006 W CN 2018119006W WO 2020000904 A1 WO2020000904 A1 WO 2020000904A1
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Prior art keywords
layer
touch panel
region
adhesion
manufacturing
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English (en)
French (fr)
Inventor
乔贵洲
胡江平
陈建平
张秀玉
李维国
朱盛祖
李素华
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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Priority to US16/702,588 priority Critical patent/US20200110480A1/en
Publication of WO2020000904A1 publication Critical patent/WO2020000904A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present application relates to the field of display technology, and in particular, to a touch panel, a method for manufacturing the touch panel, and a display device.
  • the material of the touch electrodes of a conventional touch panel is usually indium tin oxide (ITO).
  • ITO indium tin oxide
  • the traditional ITO film has limited its development towards flexibility due to its brittleness, conductivity, and light transmittance.
  • the industry has been working on the development of alternative materials for ITO films.
  • nano-metal wires have excellent mechanical properties and electrical conductivity.
  • due to their nano-scale size effects they have excellent light transmission and resistance to bending. It is flexible, so it can be used as the material of touch electrode instead of ITO film.
  • the existing touch panels using nano metal wires as touch electrodes have poor touch effects and it is difficult to achieve the design requirements of narrow frames.
  • the technical problem to be solved in the present application is that the existing touch panels using nano metal wires as touch electrodes have the disadvantages of poor touch effect and difficulty in achieving a narrow frame.
  • this application provides a touch panel, including:
  • a substrate having a first region and a second region located on the periphery of the first region
  • a nano metal layer on the first region and the second region of the substrate is
  • a tackifier layer on a side of the nanometal layer remote from the substrate including a tackifier layer on a first region and a tackifier layer on a second region;
  • the adhesion-promoting layer on the second region contains a conductive material.
  • the tackifier layer on the second region is a tackifier layer.
  • the tackifier layer is an optical layer.
  • the nano metal layer is a nano silver wire layer.
  • the adhesion-promoting layer on the second region contains a conductive material through an ion implantation process.
  • an implantation element of the ion implantation process is selected from at least one of a transition metal element, a third group element and a fifth group element.
  • the implanted element is selected from at least one of gold, silver, copper, boron, phosphorus, and arsenic.
  • the implanted element is arsenic.
  • the present application provides a display device including the touch panel described above.
  • the present application provides a method for manufacturing a touch panel, including:
  • the substrate having a first region and a second region located outside the first region;
  • the nano metal layer is located on a first region and a second region of the substrate;
  • adhesion-promoting layer Forming an adhesion-promoting layer on the side of the nano-metal layer remote from the substrate, the adhesion-promoting layer being formed of an insulating material;
  • routing layer Forming a routing layer, the routing layer being located on a side of the adhesion-promoting layer on the second region away from the substrate;
  • An ion implantation process is performed so that the adhesion-promoting layer on the second region contains a conductive material.
  • the adhesion-promoting layer located on the second region contains a conductive material by an ion implantation process.
  • the adhesion-promoting layer located on the second region contains a conductive material by an ion implantation process.
  • the tackifier layer on the second region is a tackifier layer.
  • the tackifying adhesive layer is an optical adhesive layer.
  • the nano metal layer is a nano silver wire layer.
  • the implantation element of the ion implantation process is selected from at least one of a transition metal element, a third group element, and a fifth group element.
  • the implanted element is selected from at least one of gold, silver, copper, boron, phosphorus, and arsenic.
  • the implanted element is arsenic.
  • control of the conductive material in the adhesion-promoting layer located on the second region is controlled by controllable energy adjustment of the doping source with the implanted element or by changing the dose of the doping source with the implanted element. Doping concentration.
  • the touch panel provided in the present application because the adhesion-promoting layer on the second region contains a conductive material, can reduce the contact resistance between the wiring layer and the nano-metal layer, and enhances the conductive ability of the touch panel, thereby improving the touch. Control panel touch effect.
  • the enhanced conductivity of the touch panel when the same conductivity is required, the contact area between the wiring layer and the adhesion-promoting layer can be appropriately reduced, and the size of the border area of the touch panel can be reduced accordingly. Therefore, the touch panel can also realize the design requirements of narrow bezels, thereby satisfying the market demand for narrow bezels of display devices.
  • the tackifier layer on the second region is preferably a tackifier layer, and the tackifier layer is a transparent insulating adhesive layer.
  • the tackifier layer can make the nano-metal layer better. Adhesion to the substrate makes the nano-metal layer difficult to move, and the overlap is stronger; on the other hand, the good light transmittance of the tackifier layer can meet the requirements of light extraction.
  • the nano metal layer is preferably a nano silver wire layer.
  • Silver is a silver-white metal in a general state, and has excellent electrical conductivity, which is suitable for improving the electrical conductivity of the touch panel.
  • the implanted element is preferably arsenic. Since arsenic is an element having a relatively large atomic mass, the effect of improving the conductivity of the adhesion-promoting layer on the second region after performing the ion implantation process is obvious.
  • an ion implantation process is performed so that the adhesion-promoting layer located on the second region contains a conductive material, and the adhesion can be reduced without affecting the adhesion between the substrate and the nano-metal layer.
  • the contact resistance between the wire layer and the nano-metal layer is beneficial to increase the conductivity of the touch panel, thereby improving the touch effect of the touch panel, and the contact area between the wiring layer and the adhesion-promoting layer can be appropriately reduced.
  • the size of the frame area of the touch panel can be correspondingly reduced to meet the market demand for narrow frames of display devices.
  • FIG. 1 is a flowchart of a method for manufacturing a touch panel according to the first embodiment of the present application
  • FIGS. 2 to 5 are schematic structural diagrams corresponding to corresponding steps in a method for manufacturing a touch panel described in Embodiment 1 of the present application;
  • FIG. 6 is a flowchart of a method for manufacturing a touch panel according to Embodiment 2 of the present application.
  • FIG. 7 and 8 are schematic structural diagrams corresponding to corresponding steps in a method for manufacturing a touch panel described in Embodiment 2 of the present application.
  • the touch effect of the existing touch panel is not ideal, and it is difficult to realize the design requirements of a narrow frame.
  • the nano silver wire solution is usually directly coated on the substrate to form the nano silver wire conductive layer, but the nano silver wire conductive layer is only weak.
  • the bonding strength between the nano-silver wire conductive layer and the substrate is poor, it is easy to slip during the bending process, and the resistance of the touch panel is high and the resistance is unstable.
  • a nano-silver wire conductive layer is further coated with a tackifier layer.
  • the tackifier layer is usually a tackifier layer (transparent insulating adhesive layer), such as an optical adhesive layer.
  • the tackifier layer covers the nano-silver wire conductive layer and adheres to it.
  • the adhesion between the nano-silver wire conductive layer and the substrate can be improved.
  • the coated adhesion-promoting layer will reduce the effective contact area between the nano-silver wire conductive layer and the wiring layer formed on the adhesion-promoting layer, increase the contact resistance between the two, and cause the touch effect of the touch panel to decrease.
  • the touch panel obtained in this way cannot meet the design requirements of narrow frames, and it is difficult to meet the market demand of display devices.
  • the present application provides a method for manufacturing a touch panel, which performs an ion implantation process so that the adhesion-promoting layer between the nano-silver wire conductive layer and the wiring layer contains a conductive material, so that The tackifier has electrical conductivity.
  • the conductive adhesion-enhancing layer can reduce the contact resistance between the wiring layer and the nano-metal layer, which is beneficial to increase the conductive capability of the touch panel, thereby improving the touch of the touch panel. effect.
  • the conductive layer of the touch panel enhances the conductive capability of the touch panel, the contact area between the wiring layer and the conductive layer can be appropriately reduced under the same conductive capability.
  • the size of the frame area of the touch panel can be correspondingly reduced. Therefore, the touch panel can also realize the design requirements of a narrow frame, thereby meeting the market demand of a narrow frame of a display device.
  • FIG. 1 shows a flowchart of a method for manufacturing a touch panel provided in the first embodiment
  • FIGS. 2 to 5 illustrate the manufacturing of the touch panel described in the first embodiment Schematic diagram of the corresponding steps in the method.
  • the method for manufacturing a touch panel in this embodiment includes:
  • Step S11 Provide a substrate, the substrate having a first region and a second region;
  • Step S12 forming a nano metal layer, the nano metal layer is located on the first region and the second region of the substrate;
  • Step S13 forming an adhesion-promoting layer, the adhesion-promoting layer is located on a side of the nano-metal layer away from the substrate, and the adhesion-promoting layer is formed of an insulating material;
  • Step S14 performing an ion implantation process so that the adhesion-promoting layer on the second region contains a conductive material
  • Step S15 A wiring layer is formed, and the wiring layer is located on a side of the adhesion-promoting layer containing a conductive material away from the substrate.
  • step S11 is performed to provide a substrate 10 having a first region A and a second region B located on the periphery of the first region A, as shown in FIG. 2. Show.
  • the second area B surrounds the first area A.
  • the first area A generally corresponds to a visible area in a display screen for light-transmissive display
  • the second area B generally corresponds to an opaque area in the display screen. Border area.
  • the substrate 10 is, for example, rectangular, and the second region B is located at an edge of the substrate A and has a "back" shape.
  • the substrate 10 is a flexible substrate, and the material of the flexible substrate may be, but is not limited to, acrylic, polymethyl methacrylate (PMMA), polyacrylonitrile-butadiene- Styrene (ABS), polyamide (PA), polyimide (PI), polybenzimidazole polybutene (PB), polybutylene terephthalate (PBT), polycarbonate (PC) , Polyetheretherketone (PEEK), polyetherimide (PEI), polyethersulfone (PES), polyethylene (PE), polyethylene terephthalate (PET), polyethylene tetrafluoroethylene ( ETFE), polyethylene oxide, polyglycolic acid (PGA), polymethylpentene (PMP), polyoxymethylene (POM), polyphenylene ether (PPE), polypropylene (PP), polystyrene (PS) , Polytetrafluoroethylene (PTFE), polyurethane (PU), polyvinyl chloride (PVC), poly
  • step S12 is performed to form a nano metal layer 11, and the nano metal layer 11 is located on the first region A and the second region B of the substrate 10, as shown in FIG. 2.
  • the material of the nano-metal layer 11 may be, but is not limited to, nano-gold wire or nano-silver wire.
  • the nano metal layer 11 is preferably a nano silver wire layer.
  • the nano-silver wire in the nano-silver wire layer may have a line length between 10 micrometers and 300 micrometers, a nano-silver wire with a wire diameter (or line width) of less than 500 nanometers, and its aspect ratio (line length and The ratio of wire diameters) can be greater than 10.
  • the nano metal solution is usually coated on the substrate 10, and the coating methods include, but are not limited to, inkjet, spreading, gravure printing, letterpress printing, flexo printing, nanoimprinting, screen printing, and doctor blade coating , Spin coating, stylus plotting, slot coating or flow coating; then, a desired nano metal layer 11 is formed by a patterning process, and the nano metal 11 includes a nano metal layer 110 on a first region And a nano metal layer 111 on the second region.
  • an insulating layer may be formed between the substrate 10 and the nano metal layer 110 on the first region (the diagram is omitted in the figure), which is not limited herein.
  • step S13 is performed to form an adhesion-promoting layer 12.
  • the adhesion-promoting layer 12 is located on a side of the nano-metal layer 11 away from the substrate 10.
  • the adhesion-promoting layer 12 is formed of an insulating material, as shown in FIG. 3.
  • the tackifier layer 12 is a tackifier adhesive layer, such as the tackifier adhesive layer is an optical adhesive layer, etc.
  • the adhesive layer 12 includes a tackifier layer 120 on a first region and a tackifier layer 121 on a second region.
  • the adhesion-promoting layer 12 can better adhere the nano-silver wires to the substrate 10, make it difficult for the nano-silver wires to move between them, and make the overlap stronger, thereby increasing the conductivity of the touch panel and Sensitivity.
  • step S14 is performed to perform an ion implantation process so that the adhesion-promoting layer located on the second region contains a conductive material, as shown in FIG. 4.
  • the ion implantation process is a technique for doping a region near the surface of a material, which can change the carrier concentration and conductivity type in the material, that is, change the electronic state in the material.
  • the ion implantation process is performed by an ion implanter.
  • the main component of the ion implanter is an ion source.
  • the ion implanter uses the hot electrons generated by the filament in the ion source to bombard gas molecules under the action of an electric field. Of ionization.
  • the doping source to be implanted is in a gaseous state (such as a semiconductor gas: phosphane PH 3 , phosphorus trifluoride PF 3 , phosphorus pentafluoride PH 5 , arsenic AsH 3 or boron trifluoride BH 3, etc., where As Is an element with a relatively large atomic mass, and has an obvious effect on improving the conductivity of the adhesion promoter layer 121 on the second region), it can be directly introduced into the electric field of the ion source; if it is a solid state (such as a transition metal: Gold, silver, or copper, etc.), it can be heated and evaporated into a gas phase before being introduced into the electric field of the ion source.
  • a gaseous state such as a semiconductor gas: phosphane PH 3 , phosphorus trifluoride PF 3 , phosphorus pentafluoride PH 5 , arsenic AsH 3 or boron triflu
  • the doped source in the gas phase is ionized in the electric field and becomes ions (that is, charged atoms or molecules). Then, the tackifier layer 121 on the second region is transformed into a tackifier layer 121 ′ containing a conductive material (having a conductive ability) through an ion implantation process.
  • the ion implantation process can be performed through a mask to perform doping in a predetermined region (that is, the adhesion promoter layer 121 on the second region).
  • the setting of the doping concentration can be performed by doping a dopant source with an implanted element Controllable energy regulation or controlling the doping concentration by changing the dose of the doping source with the implanted element, the specific doping concentration range is not limited here.
  • step S15 is performed to form a wiring layer 13, which is located on a side of the adhesion-promoting layer 121 ′ containing a conductive material (having a conductive ability) away from the substrate 10, as shown in FIG. 5.
  • the material of the wiring layer 13 may be gold wire or silver wire.
  • the specific method for forming the wiring layer 13 includes, but is not limited to, printing (for example, gravure printing, letterpress printing, flexographic printing, or transfer printing can be used). Etc.), sputtering or evaporation.
  • the wiring layer 13 is used as an interconnection line of the touch electrodes, and the area of the wiring layer 13 corresponds to the size of the frame area of the touch panel.
  • the adhesion-promoting layer 121 between the wiring layer 13 and the nano-metal layer 11 has been transformed into an adhesion-promoting layer 121 ′ having a conductive ability (containing a conductive material)
  • the adhesion-promoting layer 121 ′ having a conductive ability can Reducing the contact resistance between the two is beneficial to increase the conductivity of the touch panel, thereby improving the touch effect of the touch panel; moreover, the adhesion is enhanced by the adhesion-enhancing layer 121 ′ having a conductivity.
  • the conductive capacity of the control panel in the case of the same conductive capacity, can appropriately reduce the contact area of the wiring layer 13 and the conductive adhesion-promoting layer 121 ′, which can reduce the corresponding The size of the frame area of the touch panel, therefore, the touch panel can also realize the design requirements of a narrow frame, thereby meeting the market demand for a narrow frame of a display device.
  • the touch panel formed by the above manufacturing method includes: a substrate 10 having a first region A and a second region B located on the periphery of the first region A; a first region located on the substrate 10 Nano metal layer 11 on A and second region B; a tackifier layer 12 on a side of the nano metal layer 11 remote from the substrate, the tackifier layer 12 includes a tackifier layer 120 on a first region and a second region An adhesion-promoting layer 121 ′ on the second region, wherein the adhesion-promoting layer 121 ′ on the second region contains a conductive material (having a conductive capacity);
  • the routing layer 13 is shown in FIG. 5.
  • the adhesion-promoting layer 121 ′ having a conductive ability can reduce the contact resistance between the wiring layer 13 and the nano-metal layer 11, which is beneficial to increase the conductive ability of the touch panel, thereby improving the The touch effect of the touch panel;
  • the conductive capacity of the touch panel is enhanced by the conductive thickening layer 121 ′, the walking can be appropriately reduced under the same conductive capacity.
  • the contact area between the line layer 13 and the conductive adhesion-promoting layer 121 ′ can correspondingly reduce the size of the frame area of the touch panel. Therefore, the touch panel can also realize a narrow frame design Demand to meet the market demand for narrow bezels of display devices.
  • the touch panel is not limited to the above manufacturing method.
  • the touch panel can also be formed by the following manufacturing method.
  • FIG. 6 shows a flowchart of a method for manufacturing a touch panel provided in the second embodiment
  • FIG. 7 and FIG. 8 show a method of manufacturing the touch panel described in the second embodiment. Schematic diagram of the corresponding steps.
  • a method for manufacturing a touch panel in Embodiment 2 includes:
  • Step S21 Provide a substrate, the substrate including a first region and a second region located on the periphery of the first region;
  • Step S22 forming a nano metal layer, the nano metal layer is located on the first region and the second region of the substrate;
  • Step S23 forming an adhesion-promoting layer, the adhesion-promoting layer is located on a side of the nano-metal layer away from the substrate, and the adhesion-promoting layer is formed of an insulating material;
  • Step S24 forming a wiring layer, the wiring layer being located on a side of the adhesion-promoting layer on the second region away from the substrate;
  • step S25 an ion implantation process is performed so that the adhesion-promoting layer located on the second region contains a conductive material.
  • steps S21, S22, and S23 in the second embodiment are the same as the processes of steps S11, S12, and S13 in the first embodiment, that is, a nano metal layer and an additive layer are sequentially formed on the substrate 20.
  • the tackifier layer 221 is not repeated here.
  • step S24 is continuously performed to form a routing layer 23, which is located on a side of the adhesion-promoting layer 221 on the second region away from the substrate 20, as shown in FIG. 7.
  • the material of the wiring layer 23 may also be gold wire or silver wire, and the specific method for forming the wiring layer 23 includes, but is not limited to, printing (for example, gravure printing, letterpress printing, flexo printing or transfer printing can be used). Printing, etc.), sputtering or evaporation.
  • the routing layer 23 is used as an interconnection line of the touch electrodes, and a region of the routing layer 23 corresponds to a size of a frame region of the touch panel.
  • step S25 is performed to perform an ion implantation process so that the adhesion-promoting layer 221 located on the second region contains a conductive material, as shown in FIG. 8.
  • the ion implantation process can refer to the description of Embodiment 1.
  • the ion implantation process directly acts on the wiring layer 23 in Embodiment 2, it is being implemented.
  • the material (having a conductive ability) of the adhesion-promoting layer 221 ' is not described in detail here.
  • the adhesion-promoting layer 221 between the wiring layer 23 and the nano-metal layer 21 is converted into a conductivity-promoting adhesion layer 221 ′
  • the adhesion-promoting layer having conductivity 221 ′ can reduce the contact resistance between the two, which is beneficial to increase the conductive capability of the touch panel, thereby improving the touch effect of the touch panel; moreover, the adhesion-promoting layer 221 ′ having conductive capability
  • the conductive ability of the touch panel is enhanced, and the contact area between the wiring layer 23 and the conductive adhesion-promoting layer 221 ′ can be appropriately reduced under the same conductive ability, and the corresponding The size of the bezel area of the touch panel is reduced, so the touch panel can also realize the design requirements of narrow bezels, thereby meeting the market demand for narrow bezels of display devices.
  • an ion implantation process is performed so that the adhesion-promoting layer located on the second region contains a conductive material, and without affecting the adhesion between the substrate and the nano-metal layer, the Reducing the contact resistance between the wiring layer and the nano-metal layer is beneficial to increase the conductive capability of the touch panel, thereby improving the touch effect of the touch panel.
  • the adhesion-promoting layer on the second region contains a conductive material, the conductive ability of the touch panel is enhanced, and under the same conductive ability, the wiring layer and the adhesion-promoting can be appropriately reduced.
  • the contact area of the layer can correspondingly reduce the size of the frame area of the touch panel. Therefore, the touch panel can also realize the design requirements of a narrow frame, thereby meeting the market demand for a narrow frame of a display device.

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Abstract

一种触控面板及其制作方法、显示装置。触控面板中，第二区域（B）上的增粘层（12）含有导电材料，含有导电材料的增粘层（12）能够减小走线层（13）与纳米金属层（11）之间的接触电阻，有利于增加所述触控面板的导电能力，从而提高所述触控面板的触控效果。而且，因第二区域（B）上的增粘层（12）含有导电材料，增强了所述触控面板的导电能力，则在相同导电能力的情况下，可以适当的减小所述走线层（13）与所述增粘层（12）的接触面积，便可以相应的减小所述触控面板的边框区的尺寸。因此，所述触控面板还可以实现窄边框的设计需求，从而满足显示装置窄边框的市场需求。触控面板的制作方法中，执行离子注入工艺，使位于第二区域（B）上的增粘层（12）含有导电材料。

Description

触控面板及其制作方法、显示装置 技术领域
本申请涉及显示技术领域，特别涉及一种触控面板、触控面板的制作方法以及显示装置。
背景技术
传统的触控面板的触控电极的材料通常为氧化铟锡(ITO)，但是，传统的ITO薄膜由于自身的脆性、导电性及透光率等问题而限制了其向柔性化发展。目前，产业界一直在致力于开发ITO薄膜的替代材料，其中，纳米金属线具有较优异的力学特性和导电性，同时由于其纳米级别的尺寸效应，使得其具有优异的透光性与耐曲挠性，因此，可用其替代ITO薄膜作为触控电极的材料。然而，现有的采用纳米金属线作为触控电极的触控面板，其触控效果较差，且难以实现窄边框的设计要求。
发明内容
本申请所要解决的技术问题是现有采用纳米金属线作为触控电极的触控面板，存在触控效果较差，且难以实现窄边框的缺陷。
为解决上述技术问题，本申请提供了一种触控面板，包括：
基底，所述基底具有第一区域和位于所述第一区域外围的第二区域；
纳米金属层，位于所述基底的第一区域和第二区域上；
增粘层，位于所述纳米金属层远离所述基底的一侧上，所述增粘层包括第一区域上的增粘层和第二区域上的增粘层；以及
走线层，位于所述第二区域上的增粘层远离所述基底的一侧上；
其中，所述第二区域上的增粘层含有导电材料。
可选的，在所述的触控面板中，所述第二区域上的增粘层为增粘胶层。
较佳的，在所述的触控面板中，所述增粘胶层为光学胶层。
可选的，在所述的触控面板中，所述纳米金属层为纳米银线层。
进一步的，在所述的触控面板中，通过离子注入工艺使所述第二区域上的增粘层含有导电材料。
较佳的，在所述的触控面板中，所述离子注入工艺的注入元素选自过渡金属元素、第三族元素和第五族元素中的至少一种。
进一步的，在所述的触控面板中，所述注入元素选自金、银、铜、硼、磷和砷中的至少一种。
较佳的，在所述的触控面板中，所述注入元素为砷。
根据本申请的又一方面，本申请提供了一种显示装置，包括上述的触控面板。
根据本申请的另一方面，本申请提供了一种触控面板的制作方法，包括：
提供一基底，所述基底具有第一区域和位于所述第一区域外围的第二区域；
形成一纳米金属层，所述纳米金属层位于所述基底的第一区域和第二区域上；
形成一增粘层，所述增粘层位于所述纳米金属层远离所述基底的一侧上，所述增粘层采用绝缘材料形成；以及，
形成一走线层，所述走线层位于第二区域上的增粘层远离所述基底的一侧上；
其中，还包括：
执行离子注入工艺，使位于所述第二区域上的增粘层含有导电材料。
可选的，在所述的触控面板的制作方法中，在形成走线层之前，通过离子注入工艺使位于所述第二区域上的增粘层含有导电材料。
可选的，在所述的触控面板的制作方法中，在形成走线层之后，通过离子注入工艺使位于所述第二区域上的增粘层含有导电材料。
可选的，在所述的触控面板的制作方法中，位于所述第二区域上的增粘层为增粘胶层。
较佳的，所述增粘胶层为光学胶层。
可选的，在所述的触控面板的制作方法中，所述纳米金属层为纳米银线层。
进一步的，在所述的触控面板的制作方法中，所述离子注入工艺的注入元 素选自过渡金属元素、第三族元素和第五族元素中的至少一种。
进一步的，在所述的触控面板的制作方法中，所述注入元素选自金、银、铜、硼、磷和砷中的至少一种。
较佳的，在所述的触控面板的制作方法中，所述注入元素为砷。
可选的，通过对带有注入元素的掺杂源进行可控的能量调节或者通过改变带有注入元素的掺杂源的剂量来控制位于所述第二区域上的增粘层中导电材料的掺杂浓度。
与现有技术相比，本申请具有以下有益效果：
本申请提供的触控面板，因第二区域上的增粘层含有导电材料，能够减小走线层与纳米金属层之间的接触电阻，增强了触控面板的导电能力，从而提高了触控面板的触控效果。另一方面，因触控面板的导电能力增强，在需要相同导电能力的情况下，可以适当的减小走线层与增粘层的接触面积，相应的减小触控面板的边框区的尺寸，因此，触控面板还可以实现窄边框的设计需求，从而满足显示装置窄边框的市场需求。
本申请提供的触控面板，所述第二区域上的增粘层优选为增粘胶层，增粘胶层为透明的绝缘胶层，一方面增粘胶层可以使纳米金属层更好的附着在基底上，使纳米金属层不易发生移动，搭接更牢固；另一方面，增粘胶层的良好透光率，能够满足光取出的要求。
本申请提供的触控面板，纳米金属层优选为纳米银线层，银在一般状态下为银白色金属，导电性极佳，适于提高触控面板的导电能力。
本申请提供的触控面板，注入元素优选为砷，因砷是相对原子质量较大的元素，在执行离子注入工艺之后对提高位于第二区域上的增粘层的导电性能的效果较明显。
本申请的触控面板的制作方法中，执行离子注入工艺使位于第二区域上的增粘层含有导电材料，则在不影响基底与纳米金属层之间的粘附情况下，能够减小走线层与纳米金属层之间的接触电阻，有利于增加触控面板的导电能力，从而提高触控面板的触控效果，并且可以适当的减小走线层与增粘层的接触面积，便可以相应的减小触控面板的边框区的尺寸，满足显示装置窄边框的市场需求。
附图说明
图1为本申请实施例一提供的触控面板的制作方法的流程图；
图2至图5为本申请实施例一中所述触控面板的制作方法中相应步骤对应的结构示意图；
图6为本申请实施例二提供的触控面板的制作方法的流程图；
图7和图8为本申请实施例二中所述触控面板的制作方法中相应步骤对应的结构示意图。
具体实施方式
如背景技术所述，现有的触控面板的触控效果不够理想，且难以实现窄边框的设计要求。研究发现，这是因为在纳米银线触控面板的制备工艺中，通常是将纳米银线溶液直接涂布在基底上以形成纳米银线导电层，但是，纳米银线导电层仅凭较弱的分子间作用力搭接在一起，则纳米银线导电层与基底的结合强度较差，很容易在弯折过程中发生滑移，出现触控面板的电阻较高和电阻不稳定的现象。在纳米银线导电层上再涂覆一增粘层，增粘层通常为增黏胶层(透明的绝缘胶层)，如光学胶层，增粘层覆盖纳米银线导电层后粘附于基底上，能够提高纳米银线导电层与基底之间的附着力。但是，涂覆的增粘层会降低纳米银线导电层与形成在增粘层之上的走线层的有效接触面积，增加两者间的接触电阻，导致触控面板的触控效果下降。所以，在上述结构的基础上，为了保证触控面板的触控效果，需要扩大所述纳米银线导电层与所述走线层的接触面积，而该接触面积决定了触控面板的边框区的尺寸大小。因此，这种方式获得的触控面板无法满足窄边框的设计需求，难以满足显示装置的市场需求。
基于上述发现，本申请提供一种触控面板的制作方法，执行离子注入工艺，使位于所述纳米银线导电层与所述走线层之间的增粘层含有导电材料，使两者间的增粘层具有导电能力。则具有导电能力的增粘层能够减小所述走线层与所述纳米金属层之间的接触电阻，有利于增加所述触控面板的导电能力，从而提高所述触控面板的触控效果。而且，因具有导电能力的增粘层增强了所述触控面板的导电能力，则在相同导电能力的情况下，可以适当的减小所述走线层与 所述导电层的接触面积，便可以相应的减小所述触控面板的边框区的尺寸，因此，所述触控面板还可以实现窄边框的设计需求，从而满足显示装置窄边框的市场需求。
以下结合图1至图8更详细的列举所述触控面板及其制作方法、显示装置的实施例，以清楚说明本申请的内容。
实施例一
请首先参阅图1至图5，其中，图1示出了实施例一提供的触控面板的制作方法的流程图，图2至图5示出了实施例一中所述触控面板的制作方法中相应步骤对应的结构示意图。
如图1所示，本实施例中所述触控面板的制作方法，包括：
步骤S11、提供一基底，所述基底具有第一区域和第二区域；
步骤S12、形成一纳米金属层，所述纳米金属层位于所述基底的第一区域和第二区域上；
步骤S13、形成一增粘层，所述增粘层位于所述纳米金属层远离所述基底的一侧上，所述增粘层采用绝缘材料形成；
步骤S14、执行离子注入工艺使位于第二区域上的增粘层含有导电材料；以及
步骤S15、形成一走线层，所述走线层位于含有导电材料的增粘层远离所述基底的一侧上。
详细的，请参阅图2至图5，首先，执行步骤S11，提供一基底10，所述基底10具有第一区域A和位于所述第一区域A外围的第二区域B，如图2所示。所述第二区域B围绕所述第一区域A，所述第一区域A通常对应显示屏中用于透光显示的可视区，所述第二区域B通常对应显示屏中不透光的边框区域。所述基底10例如呈矩形，所述第二区域B位于所述基底A的边缘，呈“回”字形。
较佳的，本实施例中，所述基底10为柔性基底，所述柔性基底的材质可以但不限于为压克力、聚甲基丙烯酸甲酯(PMMA)、聚丙烯腈-丁二烯-苯乙烯(ABS)、聚酰胺(PA)、聚酰亚胺(PI)、聚苯并咪唑聚丁烯(PB)、聚对苯二甲 酸丁二醇酯(PBT)、聚碳酸酯(PC)、聚醚醚酮(PEEK)、聚醚酰亚胺(PEI)、聚醚砜(PES)、聚乙烯(PE)、聚对苯二甲酸乙二醇酯(PET)、聚乙烯四氟乙烯(ETFE)、聚环氧乙烷、聚乙醇酸(PGA)、聚甲基戊烯(PMP)、聚甲醛(POM)、聚苯醚(PPE)、聚丙烯(PP)、聚苯乙烯(PS)、聚四氟乙烯(PTFE)、聚氨酯(PU)、聚氯乙烯(PVC)、聚氟乙烯(PVF)、聚偏二氯乙烯(PVDC)、聚偏二氟乙烯(PVDF)或苯乙烯-丙烯腈(SAN)等，优选的，本实施例中，所述柔性基底的材质为聚酰亚胺。
接着，执行步骤S12，形成一纳米金属层11，所述纳米金属层11位于所述基底10的第一区域A和第二区域B上，如图2所示。较佳的，所述纳米金属层11的材质可以但不限于为纳米金线或纳米银线，本实施例中，因银在一般状态下为银白色金属，且为不透明材料，导电性极佳，则所述纳米金属层11优选为纳米银线层。所述纳米银线层中的纳米银线的线长可以在为10微米至300微米之间，纳米银线的线径(或线宽)可以小于500纳米，且其长宽比(线长与线径之比)可以大于10。通常将纳米金属溶液涂布于所述基底10上，所述涂布的方式包括但不限于：喷墨、撒播、凹版印刷、凸版印刷、柔印、纳米压印、丝网印刷、刮刀涂布、旋转涂布、针绘(stylus plotting)、夹缝式涂布或流涂；然后，通过图案化工艺形成所需的纳米金属层11，所述纳米金属11包括第一区域上的纳米金属层110和第二区域上的纳米金属层111。另外，在所述基底10和第一区域上的纳米金属层110之间还可以形成一绝缘层(图中示意图省略)，在此不做限定。
然后，执行步骤S13，形成一增粘层12，所述增粘层12位于所述纳米金属层11远离所述基底10的一侧上，所述增粘层12采用绝缘材料形成，如图3所示。较佳的，为了增强所述纳米金属层11与所述基底10的粘附力，所述增粘层12为增黏胶层，如所述增黏胶层为光学胶层等，所述增粘层12包括第一区域上的增粘层120和第二区域上的增粘层121。所述增粘层12可以使纳米银线更好的附着在所述基底10上，使所述纳米银线之间不易发生移动，搭接更加牢固，进而增加所述触控面板的导电性和灵敏性。
接着，执行步骤S14，执行离子注入工艺使位于第二区域上的增粘层含有导电材料，如图4所示。离子注入工艺是对材料表面附近区域进行掺杂的技术， 其可改变材料中的载流子浓度和导电类型，即改变材料中电子状态的变化。较佳的，通过离子注入机进行离子注入工艺(掺杂)，离子注入机的主要组成部分为离子源，离子注入机利用离子源中灯丝产生的热电子在电场的作用下轰击气体分子，使之电离。待注入的掺杂源如果是气态(如半导体气体：磷烷PH 3、三氟化磷PF 3、五氟化磷PH 5、砷烷AsH 3或三氟化硼BH 3等，其中，因As是相对原子质量较大的元素，对提高所述第二区域上的增粘层121的导电性能的效果较明显)，便可以直接引入到离子源的电场中；如果是固态(如过渡金属：金、银或铜等)，则可先加热蒸发变为气相后再引入到离子源的电场中，气相的掺杂源在电场中被电离后变成为离子(即带电的原子或分子)。则所述第二区域上的增粘层121通过离子注入工艺便会转变为含有导电材料(具有导电能力)的增粘层121′。
离子注入工艺可通过掩膜版来达到在既定的区域内(即第二区域上的增粘层121)进行掺杂，关于掺杂浓度的设定可通过对带有注入元素的掺杂源进行可控的能量调节或者通过改变带有注入元素的掺杂源的剂量来控制掺杂浓度，具体的掺杂浓度范围在此不做限定。
然后，执行步骤S15，形成一走线层13，所述走线层13位于含有导电材料(具有导电能力)的增粘层121′远离基底10的一侧上，如图5所示。较佳的，所述走线层13的材质可以为金线或者银线，具体形成所述走线层13的方式包括但不限于印刷(如可以采用凹版印刷、凸版印刷、柔印或转印等)、溅射或者蒸镀等。所述走线层13用作触控电极的互连线，且所述走线层13的区域对应所述触控面板的边框区的尺寸。因所述走线层13与所述纳米金属层11之间的增粘层121已转变为具有导电能力(含有导电材料)的增粘层121′，则具有导电能力的增粘层121′能够减小两者间的接触电阻，有利于增加所述触控面板的导电能力，从而提高所述触控面板的触控效果；而且，因具有导电能力的增粘层121′增强了所述触控面板的导电能力，则在相同导电能力的情况下，可以适当的减小所述走线层13与所述具有导电能力的增粘层121′的接触面积，便可以相应的减小所述触控面板的边框区的尺寸，因此，所述触控面板还可以实现窄边框的设计需求，从而满足显示装置窄边框的市场需求。
相应的，通过上述制作方法形成的触控面板包括：基底10，所述基底10具 有第一区域A和位于所述第一区域A外围的第二区域B；位于所述基底10的第一区域A和第二区域B上的纳米金属层11；位于所述纳米金属层11远离基底的一侧上的增粘层12，增粘层12包括第一区域上的增粘层120和第二区域上的增粘层121′，其中，位于所述第二区域上的增粘层121′含有导电材料(具有导电能力)；位于具有导电能力的增粘层121′远离基底10的一侧上的走线层13，如图5所示。则所述具有导电能力的增粘层121′能够减小所述走线层13与所述纳米金属层11之间的接触电阻，有利于增加所述触控面板的导电能力，从而提高所述触控面板的触控效果；而且，因所述具有导电能力的增粘层121′增强了所述触控面板的导电能力，则在相同导电能力的情况下，可以适当的减小所述走线层13与所述具有导电能力的增粘层121′的接触面积，便可以相应的减小所述触控面板的边框区的尺寸，因此，所述触控面板还可以实现窄边框的设计需求，从而满足显示装置窄边框的市场需求。
显然，所述触控面板并不只限于上述制作方法得到，如还可以通过以下制作方法形成所述触控面板。
实施例二
请参阅图6至图8，其中图6示出了实施例二提供的触控面板的制作方法的流程图，图7和图8示出了实施例二中所述触控面板的制作方法中相应步骤对应的结构示意图。
如图6所示，实施例二中一种触控面板的制作方法包括：
步骤S21、提供一基底，所述基底包括第一区域和位于所述第一区域外围的第二区域；
步骤S22、形成一纳米金属层，所述纳米金属层位于所述基底的第一区域和第二区域上；
步骤S23、形成一增粘层，所述增粘层位于所述纳米金属层远离所述基底的一侧上，所述增粘层采用绝缘材料形成；
步骤S24、形成一走线层，所述走线层位于第二区域上的增粘层远离所述基底的一侧上；以及
步骤S25、执行离子注入工艺使位于所述第二区域上的增粘层含有导电材 料。
具体的，实施例二中的步骤S21、步骤S22和步骤S23与实施例一中的步骤S11、步骤S12和步骤S13的工艺是相同的，即在所述基底20上依次形成纳米金属层和增粘层，其中，所述纳米金属层包括位于第一区域上的纳米金属层210和第二区域上的纳米金属层211，增粘层包括第一区域上的增粘层220和第二区域上的增粘层221，如图7所示，在此不做重复介绍。
接着，在完成上述步骤后，继续执行步骤S24，形成一走线层23，所述走线层23位于第二区域上的增粘层221远离基底20的一侧上，如图7所示。较佳的，所述走线层23的材质也可以为金线或者银线，具体形成所述走线层23的方式包括但不限于印刷(如可以采用凹版印刷、凸版印刷、柔印或转印等)、溅射或者蒸镀等。所述走线层23用作触控电极的互连线，且所述走线层23的区域对应所述触控面板的边框区的尺寸。
最后，执行步骤S25，执行离子注入工艺使位于所述第二区域上的增粘层221含有导电材料，如图8所示。具体的，所述离子注入工艺可参阅实施例一的描述，本领域技术人员可以理解的，因实施例二中，所述离子注入工艺是直接作用于所述走线层23上，则在实施例一的基础上需要加大离子注入机的注入能量或者增加注入掺杂源的剂量来达到更深入的掺杂，以实现位于所述走线层23下方的增粘层221能够转变为含有导电材料(具有导电能力)的增粘层221′，在此不做赘述。
同理，实施例二中因所述走线层23与所述纳米金属层21之间的增粘层221转变为具有导电能力的增粘层221′，则所述具有导电能力的增粘层221′能够减小两者间的接触电阻，有利于增加所述触控面板的导电能力，从而提高所述触控面板的触控效果；而且，因所述具有导电能力的增粘层221′增强了所述触控面板的导电能力，则在相同导电能力的情况下，可以适当的减小所述走线层23与所述具有导电能力的增粘层221′的接触面积，便可以相应的减小所述触控面板的边框区的尺寸，因此，所述触控面板还可以实现窄边框的设计需求，从而满足显示装置窄边框的市场需求。
综上，本申请的触控面板的制作方法中，执行离子注入工艺使位于第二区域上的增粘层含有导电材料，则在不影响基底与纳米金属层之间的粘附情况下， 能够减小走线层与纳米金属层之间的接触电阻，有利于增加所述触控面板的导电能力，从而提高所述触控面板的触控效果。而且，因第二区域上的增粘层含有导电材料，增强了所述触控面板的导电能力，则在相同导电能力的情况下，可以适当的减小所述走线层与所述增粘层的接触面积，便可以相应的减小所述触控面板的边框区的尺寸，因此，所述触控面板还可以实现窄边框的设计需求，从而满足显示装置窄边框的市场需求。

Claims (19)

  1. 一种触控面板，包括：
    基底，所述基底具有第一区域和位于所述第一区域外围的第二区域；
    纳米金属层，位于所述基底的第一区域和第二区域上；
    增粘层，位于所述纳米金属层远离所述基底的一侧上，所述增粘层包括第一区域上的增粘层和第二区域上的增粘层；以及
    走线层，位于所述第二区域上的增粘层远离所述基底的一侧上；
    其中，所述第二区域上的增粘层含有导电材料。
  2. 如权利要求1所述的触控面板，其中，所述第二区域上的增粘层为增粘胶层。
  3. 如权利要求2所述的触控面板，其中，所述增粘胶层为光学胶层。
  4. 如权利要求1所述的触控面板，其中，所述纳米金属层为纳米银线层。
  5. 如权利要求1所述的触控面板，其中，通过离子注入工艺使位于所述第二区域上的增粘层含有导电材料。
  6. 如权利要求5所述的触控面板，其中，所述离子注入工艺的注入元素选自过渡金属元素、第三族元素和第五族元素中的至少一种。
  7. 如权利要求6所述的触控面板，其中，所述注入元素选自金、银、铜、硼、磷和砷中的至少一种。
  8. 如权利要求7所述的触控面板，其中，所述注入元素为砷。
  9. 一种显示装置，包括如权利要求1所述的触控面板。
  10. 一种触控面板的制作方法，包括：
    提供一基底，所述基底具有第一区域和位于所述第一区域外围的第二区域；
    形成一纳米金属层，所述纳米金属层位于所述基底的第一区域和第二区域上；
    形成一增粘层，所述增粘层位于所述纳米金属层远离所述基底的一侧上，所述增粘层采用绝缘材料形成；以及，
    形成一走线层，所述走线层位于第二区域上的增粘层远离所述基底的一侧上；
    其中，还包括：
    执行离子注入工艺，使位于所述第二区域上的增粘层含有导电材料。
  11. 如权利要求10所述的触控面板的制作方法，其中，在形成走线层之前，执行离子注入工艺使位于所述第二区域上的增粘层含有导电材料。
  12. 如权利要求10所述的触控面板的制作方法，其中，在形成走线层之后，执行离子注入工艺使位于所述第二区域上的增粘层含有导电材料。
  13. 如权利要求10所述的触控面板的制作方法，其中，位于所述第二区域上的增粘层为增粘胶层。
  14. 如权利要求13所述的触控面板的制作方法，其中，所述增粘胶层为光学胶层。
  15. 如权利要求10所述的触控面板的制作方法，其中，所述纳米金属层为纳米银线层。
  16. 如权利要求10所述的触控面板的制作方法，其中，所述离子注入工艺的注入元素选自过渡金属元素、第三族元素和第五族元素中的至少一种。
  17. 如权利要求16所述的触控面板的制作方法，其中，所述注入元素选自金、银、铜、硼、磷和砷中的至少一种。
  18. 如权利要求17所述的触控面板的制作方法，其中，所述注入元素为砷。
  19. 如权利要求10所述的触控面板的制作方法，通过对带有注入元素的掺杂源进行可控的能量调节或者通过改变带有注入元素的掺杂源的剂量来控制位于所述第二区域上的增粘层中导电材料的掺杂浓度。
PCT/CN2018/119006 2018-06-30 2018-12-03 触控面板及其制作方法、显示装置 Ceased WO2020000904A1 (zh)

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