WO2020000903A1 - 导电层叠结构及其制备方法、显示面板 - Google Patents

导电层叠结构及其制备方法、显示面板 Download PDF

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Publication number
WO2020000903A1
WO2020000903A1 PCT/CN2018/119005 CN2018119005W WO2020000903A1 WO 2020000903 A1 WO2020000903 A1 WO 2020000903A1 CN 2018119005 W CN2018119005 W CN 2018119005W WO 2020000903 A1 WO2020000903 A1 WO 2020000903A1
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Prior art keywords
opening
layer
metal wire
nano metal
adhesion
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Ceased
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PCT/CN2018/119005
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English (en)
French (fr)
Inventor
张雨
李素华
王鹏
丁冬
刘海亮
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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Priority to KR1020207008648A priority Critical patent/KR102302705B1/ko
Priority to JP2020514493A priority patent/JP6868156B2/ja
Priority to US16/718,216 priority patent/US11510323B2/en
Publication of WO2020000903A1 publication Critical patent/WO2020000903A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires

Definitions

  • the present application relates to a nano metal wire material and an application field thereof, and particularly to a conductive laminated structure, a preparation method thereof, and a display panel.
  • transparent conductive materials are mainly indium tin oxide (ITO), which has excellent light transmittance and electrical conductivity.
  • ITO indium tin oxide
  • Such transparent conductive materials are usually deposited by a sputtering process, the preparation temperature is high, and the scarce metal contained in them makes the price expensive.
  • Such films are also easy to break when bent, so they are not suitable for preparing flexible devices.
  • nano metal wires such as nano silver wires (SNW for short) 10 (as shown in FIG. 2) to replace ITO as a transparent conductor made of a conductive material.
  • nano metal wires Compared with ITO, nano metal wires not only have good optical, electrical and mechanical properties, but also have the characteristics of large surface area and quantum size effect of metal nano wires. However, the adhesion of nano metal wires is currently poor and the frame formed by applying nano metal wires is relatively wide.
  • an object of the present application is to provide a conductive laminated structure and a preparation method thereof, so as to realize a narrow frame design.
  • Another object of the present application is to provide a conductive laminated structure and a preparation method thereof, so as to improve the adhesion of the nano metal wire.
  • an embodiment of the present application provides a conductive laminated structure, including:
  • An adhesion-promoting layer which is located on the substrate
  • a nano metal wire layer, the nano metal wire layer is located on the adhesion-promoting layer, and the nano metal wire layer has a first opening to expose the adhesion-promoting layer;
  • a wiring layer the wiring layer being located on the nano metal wire layer, the wiring layer having a second opening, the second opening at least partially overlapping the first opening, exposing the adhesion-promoting layer ;as well as
  • An optical adhesive layer is disposed on the wiring layer, and the optical adhesive layer fills the second opening and the first opening and is connected to the adhesion-promoting layer.
  • an area of the second opening is larger than an area of the first opening; the first opening falls within a range of the second opening.
  • an area of the second opening is smaller than an area of the first opening; the second opening falls within a range of the first opening.
  • the conductive laminated structure at least a part of the first opening and the second opening are staggered.
  • an area of the first opening is equal to an area of the second opening, and a boundary of the first opening is consistent with a boundary of the second opening.
  • a plurality of the nano metal wire layers are formed on the substrate, and each of the nano metal wire layers has a ring shape in plan view on the substrate, and the ring shape
  • the central opening is the first opening.
  • a width of a side of the ring is 0.5 ⁇ m to 1.2 ⁇ m.
  • the thickness of the adhesion-promoting layer is 10 nm-300 nm.
  • first openings and second openings there are multiple first openings and second openings.
  • the material of the adhesion-promoting layer is selected from at least one of a polymer, an insulating material, a resin, a transparent optical adhesive, an oxide, and a photoresist-like.
  • the thickness of the adhesion-promoting layer is 10 nm-300 nm.
  • An embodiment of the present application further provides a method for preparing a conductive laminated structure, including:
  • nano metal wire layer Forming a nano metal wire layer on the adhesion promoting layer, the nano metal wire layer having a first opening, exposing the adhesion promoting layer;
  • the wiring layer Forming a wiring layer on the nano metal wire layer, the wiring layer having a second opening, the second opening at least partially overlapping the first opening, exposing the adhesion-promoting layer;
  • An optical adhesive layer is formed on the wiring layer, and the optical adhesive layer fills the second opening and the first opening and is connected to the adhesion-promoting layer.
  • the step of forming a nano metal wire layer on the adhesion-promoting layer includes:
  • the nano metal wire material layer is etched to form a first opening, the adhesion-promoting layer is exposed, and the nano metal wire layer is formed.
  • nano metal wires there are several nano metal wires in the nano metal wire solution, and the nano metal wires are distributed in a solvent.
  • the concentration of the nano metal wire solution is 0.01 mg / mL to 10 mg / mL.
  • the solvent of the nano metal wire solution is any one of water, ionic solution, saline solution, supercritical fluid, or oil.
  • the solvent further contains at least one of a dispersant, a surfactant, a crosslinking agent, a wetting agent, or a thickener.
  • the drying is performed by vacuum decompression or infrared heating or hot air heating, and the drying time is 50s to 100s.
  • An embodiment of the present application further provides a display panel including the conductive laminated structure as described above.
  • the display panel includes a wiring area, and a plurality of the nano metal wire layers are disposed in the wiring area and arranged along an extending direction of the wiring area.
  • the conductive laminated structure provided in this application includes a substrate; a tackifier layer on the substrate; a nano metal wire layer on the tackifier layer, the nano metal wire layer having a first opening, exposing the A thickening layer; a wiring layer on the nano metal wire layer, the wiring layer having a second opening, the second opening at least partially overlapping the first opening, exposing the thickening layer; An optical adhesive layer is disposed on the wiring layer, fills the second opening and the first opening, and is connected to the adhesion-promoting layer.
  • the wiring layer can be relatively narrow to achieve a narrow frame design; at the same time, the nano metal wire layer can be improved with the help of an adhesion promoter layer.
  • the optical adhesive layer is disposed in the opening, it can also increase the fixing effect on the nano metal wire layer and improve the adhesion.
  • the first opening and the second opening can be stepped, thereby increasing the bonding area of the optical adhesive layer, the nano metal wire layer and the wiring layer, and increasing the bonding. Force to better improve the adhesion of the nano metal wire layer.
  • FIG. 1 is a schematic structural diagram of a conductive laminated structure according to an embodiment of the present application.
  • FIG. 2 is a micro-morphology of a nano metal wire
  • FIG. 3 is a schematic partial plan view of a nano metal wire layer according to an embodiment of the present application.
  • FIG. 4 is a schematic partial top plan view of a routing layer in an embodiment of the present application.
  • FIG. 5 is a schematic partial plan view of an optical adhesive layer in an embodiment of the present application.
  • FIG. 6 is a flowchart of a method for manufacturing a conductive laminated structure according to an embodiment of the present application
  • FIG. 7 is a schematic cross-sectional view of a substrate provided in an embodiment of the present application.
  • FIG. 8 is a schematic cross-sectional view of forming an adhesion-promoting layer in an embodiment of the present application.
  • FIG. 9 is a schematic cross-sectional view of forming a nano metal wire layer in an embodiment of the present application.
  • FIG. 10 is a schematic top view of forming a nano metal wire layer in an embodiment of the present application.
  • FIG. 11 is a schematic cross-sectional view of forming a routing layer in an embodiment of the present application.
  • FIG. 12 is a schematic top view of forming a routing layer in an embodiment of the present application.
  • FIG. 13 is a schematic cross-sectional view of forming an optical adhesive layer in an embodiment of the present application.
  • FIG. 14 is a schematic top view of forming an optical adhesive layer in an embodiment of the present application.
  • an embodiment of the present application provides a conductive laminated structure including:
  • An optical adhesive layer 7 is disposed on the wiring layer 5, fills the second opening 6 and the first opening 4, and is connected to the adhesion-promoting layer 2.
  • the number of the first openings 4 and the second openings 6 is not limited to one, and may be multiple. Those skilled in the art can adjust the first openings 4 and the second openings 6 as needed. quantity.
  • the first opening 4 and the second opening 6 coincide exactly, that is, the area of the first opening 4 is equal to the area of the second opening 6 and the boundary is the same (the shapes and sizes of the two are the same, and Consistent borders). This helps optimize the manufacturing process, saves the mask, and reduces costs.
  • first opening 4 and the second opening 6 may be stepped. Specifically, for example:
  • the area of the second opening 6 is larger than the area of the first opening 4; the first opening 4 falls within the range of the second opening 6.
  • the area of the second opening 6 is smaller than the area of the first opening 4; the second opening 6 falls within the range of the first opening 4.
  • first opening 4 and the second opening 6 are staggered at least partially.
  • the stepped design of the first opening 4 and the second opening 6 can increase the bonding area of the optical adhesive layer 7 with the nano metal wire layer 3 and the wiring layer 5 and increase the bonding force to better improve the nano metal wire layer. 3 adhesion.
  • a plurality of the nano metal wire layers 3 are formed on the substrate, and each of the nano metal wire layers 3 has a ring shape (including a square ring or a circular ring) in plan view on the substrate 1.
  • the central opening is the first opening.
  • a display panel (such as a touch panel) includes a wiring area, and a plurality of the nano metal wire layers 3 are disposed in the wiring area and arranged along an extending direction of the wiring area.
  • the wiring layer 5 forms a contact electrical connection to conduct the wiring layer 5 and other electrical communication structures; wherein the width of the side of the ring can be 0.5 ⁇ m to 1.2 ⁇ m, which is helpful to achieve a narrow frame design.
  • the thickness of the adhesion-promoting layer is between 10 nm and 300 nm.
  • an embodiment of the present application further provides a method for preparing a conductive laminated structure, including the following steps:
  • Step S11 providing a substrate
  • Step S12 forming an adhesion-promoting layer on the substrate
  • Step S13 forming a nano-metal wire layer on the adhesion-promoting layer, the nano-metal wire layer having a first opening, exposing the adhesion-promoting layer;
  • Step S14 forming a wiring layer on the nano-metal wire layer, the wiring layer having a second opening, the second opening at least partially overlapping the first opening to expose the adhesion-promoting layer;
  • step S15 an optical adhesive layer is formed on the wiring layer, and the optical adhesive layer fills the second opening and the first opening and is connected to the adhesion-promoting layer.
  • the nano metal wire layer and the wiring layer are in direct contact, the conduction ability is improved, and the contact area is reduced, so the wiring layer can be relatively narrow to achieve a narrow frame design.
  • the adhesion of the nano metal wire layer and the optical adhesive disposed in the opening can also increase the fixing effect on the nano metal wire layer and improve the adhesion.
  • a substrate 1 is provided.
  • the substrate 1 may be a substrate made of a rigid material, such as a glass substrate, a silicon substrate, a metal substrate, and the like.
  • the substrate 1 may also be a substrate made of a flexible material.
  • the material of the substrate 1 may be, but is not limited to, acrylic, polymethyl methacrylate (PMMA), polyacrylonitrile-butane Olefin-styrene (ABS), polyamide (PA), polyimide (PI), polybenzimidazole polybutene (PB), polybutylene terephthalate (PBT), polycarbonate ( PC), polyetheretherketone (PEEK), polyetherimide (PEI), polyethersulfone (PES), polyethylene (PE), polyethylene terephthalate (PET), polyethylenetetrafluoro Ethylene (ETFE), polyethylene oxide, polyglycolic acid (PGA), polymethylpentene (PMP), polyoxymethylene (POM), polyphenylene ether (PPE), polypropylene (PP), polystyrene ( PS), polytetrafluoroethylene (PTFE), polyurethane (PU), polyvinyl chloride (PVC), polyvinyl fluoride (PVF), polyvinyliden
  • the substrate 1 is pre-treated to remove impurities such as particles, organics, and metal ions thereon.
  • step S12 an adhesion-promoting layer 2 is formed on the substrate 1.
  • the thickness of the adhesion-promoting layer 2 is 10 nm-300 nm.
  • the material of the tackifier layer 2 may be selected from high molecular polymers, insulating materials, resins, transparent optical adhesives, oxides, photoresists, and the like, including but not limited to: polyvinyl alcohol, polyvinyl butyral, polyacetylene, Polyaniline, polyarylene, polythiophene, graphene, pentacene, polyphenylene ether (PPE), polyparaphenylene acetylene (PPV), poly3,4-ethylenedioxyphene (PEDOT), poly Styrene sulfonic acid (PSS), poly 3-hexylthiophene (P3HT), poly 3-octylthiophene (P3OT), poly C-61-butyric acid-methyl ester (PCBM), poly [2-methoxy-5 -(2-ethyl-hexyloxy) -1,4-phenylene ethylene] (MEH-PPV), silicon nitride, silicon dioxide.
  • PPE polyphen
  • a nano-metal wire layer 3 is formed on the adhesion-promoting layer 2.
  • the nano-metal wire layer 3 has a first opening 4 to expose the adhesion-promoting layer 2. .
  • the number of the first openings 4 is not limited to one, and may be multiple. Those skilled in the art can adjust the number of the first openings 4 according to actual needs.
  • the adhesion between the adhesion-promoting layer 2 and the substrate 1 is greater than the adhesion between the substrate 1 and the nano-metal wire layer 3
  • the adhesion between the adhesion-promoting layer 2 and the nano-metal wire layer 3 is greater than that The adhesion between the substrate 1 and the nano metal wire layer 3, therefore, adding the adhesion promoting layer 2 can make the nano metal wire layer 3 better adhere to the substrate 1, and it is difficult for the nano metal wire layer 3 to migrate, The overlap is stronger.
  • the first opening 4 has a first opening boundary 41.
  • the first opening boundary 41 is a square, a circle, or the like; a plurality of the nano metal wire layers 3 are formed on the substrate 1, and each of the nano metal wire layers 3 is on the substrate 1.
  • the shape is ring-shaped in plan view (including square ring or ring).
  • a display panel (such as a touch panel) includes a wiring area, and a plurality of the nano metal wire layers 3 are disposed in the wiring area and arranged along an extending direction of the wiring area; wherein the width of the side of the ring may be 0.5 ⁇ m-1.2 ⁇ m, such as 0.8 ⁇ m, 0.9 ⁇ m, 1 ⁇ m, etc., to achieve narrow frame design.
  • This step (step S13) may specifically include:
  • the nano metal wire solution has a plurality of nano metal wires, and the nano metal wires are distributed in a solvent.
  • the concentration of the nano metal wire solution may be 0.01 mg / mL to 10 mg / mL, for example, 0.05 mg / mL, 0.1 mg / mL, 0.5 mg / mL, 1 mg / mL, 2 mg / mL, 3 mg / mL, 4 mg / mL. , 5 mg / mL, 6 mg / mL, 7 mg / mL, 8 mg / mL, 9 mg / mL, and the like. According to the actual process capability and product requirements, those skilled in the art can flexibly select the concentration of the nano metal wire solution.
  • the solvent may be water, an aqueous solution, an organic solvent, an inorganic solvent, an ionic solution, a saline solution, a supercritical fluid, an oil, or a mixture thereof.
  • the solvent also contains other additives, such as a dispersant, a surfactant, a cross-linking agent, a wetting agent, or a thickener, but is not limited thereto.
  • the nano metal wire in the nano metal wire solution may be a nano wire such as gold (Au), silver (Ag), platinum (Pt), copper (Cu), cobalt (Co), palladium (Pd), or the like. Because silver has the characteristics of good electrical conductivity and light transmission, the nano metal wires are preferably silver nano wires (that is, nano silver wires 10, as shown in FIG. 3); correspondingly, the nano metal wire solution is preferably nano silver. ⁇ ⁇ Line solution.
  • the coating of the nano metal wire solution can be completed by using an existing technology.
  • the coating method includes, but is not limited to, inkjet, spreading, gravure printing, letterpress printing, flexo printing, nanoimprinting, screen printing, doctor blade coating, spin coating, stylus plotting, Sandwich coating or flow coating.
  • the drying method can be natural drying, simple baking or heat curing.
  • the drying may be performed by vacuum decompression, infrared heating, or hot air heating, and the time is about 50s to 100s, for example, 55s, 60s, 70s, and the like.
  • the nano metal wire material layer is etched to form a first opening 4, and the adhesion promoting layer 2 is exposed to form the nano metal wire layer 3.
  • the etching may use a laser etching process, or other feasible operations, which are not described in detail here.
  • a wiring layer 5 is formed on the nano-metal wire layer 3.
  • the wiring layer 5 has a second opening 6, and the second opening 6 is in contact with the first opening 6.
  • the openings 4 overlap at least partially, exposing the adhesion-promoting layer 2.
  • the number of the second openings 6 is not limited to one, and may be multiple. Those skilled in the art can adjust the number of the second openings 6 according to actual needs.
  • the wiring layer 5 may be formed only on the nano-metal wire layer 3.
  • a mask layer may be used to prevent the wiring layer 5 from being formed in the first opening 4.
  • the wiring layer 5 may be exactly stacked with the nano metal wire layer 3.
  • the second opening 6 has a second opening boundary 61, and the second opening boundary 61 may be consistent with the first opening boundary 41.
  • the second opening 6 may be consistent with the first opening 4, that is, the first opening 4 and the second opening 6 coincide exactly, and the shapes and sizes of the two openings are consistent, and the boundary is consistent, which helps Optimizing the preparation process can save masks and reduce costs.
  • the second opening boundary 61 and the first opening boundary 41 may not be completely consistent.
  • the second opening boundary 61 may fall on the nano metal wire layer 3.
  • first opening 4 and the second opening 6 may be stepped. Specifically, for example:
  • the area of the second opening 6 is larger than the area of the first opening 4; the first opening 4 falls within the range of the second opening 6.
  • the area of the second opening 6 is smaller than the area of the first opening 4; the second opening 6 falls within the range of the first opening 4.
  • first opening 4 and the second opening 6 are staggered at least partially.
  • the stepped design of the first opening 4 and the second opening 6 can increase the bonding area between the optical adhesive layer 7 (see FIG. 13) and the nano metal wire layer 3 and the wiring layer 5 formed later, and increase the bonding force. In order to better improve the adhesion of the nano metal wire layer 3.
  • the contact resistance can be reduced, and the conduction capability can be improved. Furthermore, the conduction can be achieved with a smaller contact area, which is beneficial to the narrow frame design.
  • step S15 an optical adhesive layer 7 is formed on the wiring layer 5, and the optical adhesive layer 7 fills the second opening and the first opening and is thickened with the thickening layer. Layers are connected.
  • FIG. 14 illustrates the second opening boundary 61 with a dashed frame in order to better understand the specific position structure of the optical adhesive layer 7 in the present application.
  • an embodiment of the present application further provides a display panel including the conductive laminated structure as described above.
  • the display panel can be applied to any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • An embodiment of the present application further provides a touch panel including the conductive laminated structure as described above.
  • the touch panel can be applied to any product or component having a touch operation function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • the display panel may include, for example, the touch panel.
  • an embodiment of the present application further provides a display device including the conductive laminated structure as described above.
  • the display device may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • the conductive laminated structure includes a substrate; a tackifier layer on the substrate; a nano metal wire layer on the tackifier layer, and the nano metal wire layer has a first opening , The adhesion-promoting layer is exposed; the wiring layer on the nano-metal wire layer has a second opening, and the second opening at least partially overlaps with the first opening, exposing the The adhesion-promoting layer; and an optical adhesive layer disposed on the wiring layer, filling the second opening and the first opening, and being connected to the adhesion-promoting layer. Because the nano metal wire layer and the wiring layer are in direct contact, the conduction ability is improved, and the contact area only needs to be 0.1 mm 2 or less.
  • the contact area is larger than 0.25 mm 2 , which reduces the contact area.
  • the layer can be relatively narrow to achieve a narrow bezel design; at the same time, the adhesion of the nano metal wire layer can be improved by means of the tackifier layer, and the optical adhesive layer is arranged in the opening, which can also increase the fixing effect of the nano metal wire layer and improve Adhesion.
  • the first opening and the second opening can be stepped, thereby increasing the bonding area of the optical adhesive layer, the nano metal wire layer and the wiring layer, and increasing the bonding. Force to better improve the adhesion of the nano metal wire layer.

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Abstract

一种导电层叠结构及其制备方法、显示面板。该导电层叠结构，包括基底（1）；位于所述基底（1）上的增粘层（2）；位于所述增粘层（2）上的纳米金属线层（3），所述纳米金属线层（3）具有第一开口（4），暴露出所述增粘层（2）；位于所述纳米金属线层（3）上的走线层（5），所述走线层（5）具有第二开口（6），所述第二开口（6）与所述第一开口（4）至少部分重叠，暴露出所述增粘层（2）；以及光学胶层（7），设置在所述走线层（5）上，填充在所述第二开口（6）和所述第一开口（4）并与所述增粘层（2）相连接。由于纳米金属线层（3）和走线层（5）直接接触，提高了导通能力，减少了接触面积，因此走线层（5）可以比较窄，实现窄边框设计；同时，纳米金属线层（3）的附着力得以提高。

Description

导电层叠结构及其制备方法、显示面板 技术领域
本申请涉及纳米金属线材料及其应用领域，特别是涉及一种导电层叠结构及其制备方法、显示面板。
背景技术
目前，透明导电材料以氧化铟锡(indium tin oxide，简称为ITO)为主，其具有优异的透光率及导电性。但是，这类透明导电材料通常利用溅射工艺沉积而成，制备温度高，并且其中含有稀缺性金属使得价格昂贵，这类薄膜受弯折时还容易断裂，因而不适于制备柔性器件，这就导致ITO的性能以及产量存在诸多限制。因此，业界提出了纳米金属线如纳米银线(silver nano wires，简称为SNW)10(如图2所示)，以替代ITO作为导电材料制备的透明导体。与ITO相比，纳米金属线不仅具有良好的光学、电学以及力学性能，还具有金属纳米线表面积大和量子尺寸效应等特点。但是，目前纳米金属线的附着性较差且应用纳米金属线所形成的边框较宽。
发明内容
本申请的发明人发现，由于纳米金属线与走线是通过光学胶接触的，因此纳米金属线和走线的接触面积有一定的限制，导致边框较宽。从而本申请的一个目的在于，提供一种导电层叠结构及其制备方法，实现窄边框设计。
此外，本申请的发明人还发现，由于纳米金属线的材料性质，导致纳米金属线的附着性较差。从而本申请的另一个目的在于，提供一种导电层叠结构及其制备方法，提高纳米金属线的附着性。
为解决上述技术问题，本申请的实施例提供一种导电层叠结构，包括：
基底；
增粘层，所述增粘层位于所述基底上；
纳米金属线层，所述纳米金属线层位于所述增粘层上，所述纳米金属线层具有第一开口，暴露出所述增粘层；
走线层，所述走线层位于所述纳米金属线层上，所述走线层具有第二开口，所述第二开口与所述第一开口至少部分重叠，暴露出所述增粘层；以及
光学胶层，设置在所述走线层上，所述光学胶层填充在所述第二开口和所述第一开口并与所述增粘层相连接。
可选地，对于所述的导电层叠结构，所述第二开口的面积大于所述第一开口的面积；所述第一开口落入所述第二开口的范围内。
可选地，对于所述的导电层叠结构，所述第二开口的面积小于所述第一开口的面积；所述第二开口落入所述第一开口的范围内。
可选地，对于所述的导电层叠结构，所述第一开口和所述第二开口至少部分区域错开。
可选地，所述第一开口的面积与所述第二开口的面积相等，且所述第一开口的边界与所述第二开口的边界一致。
可选地，对于所述的导电层叠结构，在所述基底上形成有若干个所述纳米金属线层，每个所述纳米金属线层在所述基底上的俯视形状呈环形，所述环形的中心开口为所述第一开口。
可选地，对于所述的导电层叠结构，所述环形的边宽度为0.5μm-1.2μm。
可选地，对于所述的导电层叠结构，所述增粘层的厚度为10nm-300nm。
可选地，对于所述的导电层叠结构，所述第一开口和所述第二开口都为多个。
可选地，对于所述的导电层叠结构，所述增粘层的材料选自高分子聚合物、绝缘材料、树脂、透明光学胶、氧化物和类光阻中的至少一种。
可选地，对于所述的导电层叠结构，所述增粘层的厚度为10nm-300nm。
本申请的实施例还提供一种导电层叠结构的制备方法，包括：
提供一基底；
在所述基底上形成增粘层；
在所述增粘层上形成纳米金属线层，所述纳米金属线层具有第一开口，暴露出所述增粘层；
在所述纳米金属线层上形成走线层，所述走线层具有第二开口，所述第二开口与所述第一开口至少部分重叠，暴露出所述增粘层；以及
在所述走线层上形成光学胶层，所述光学胶层填充所述第二开口和所述第一开口并与所述增粘层相连接。
可选地，对于所述的导电层叠结构的制备方法，所述在增粘层上形成纳米金属线层的步骤包括：
涂布纳米金属线溶液；
干燥以蒸发所述纳米金属线溶液的溶剂，获得纳米金属线材料层；
刻蚀所述纳米金属线材料层形成第一开口，暴露出所述增粘层，形成所述纳米金属线层。
可选地，所述纳米金属线溶液中具有若干纳米金属线，所述纳米金属线分布于溶剂中。
可选地，所述纳米金属线溶液的浓度为0.01mg/mL～10mg/mL。
可选地，所述纳米金属线溶液的溶剂为水、离子溶液、含盐溶液、超临界流体或油中的任一种。
可选地，所述溶剂里还含有分散剂、表面活性剂、交联剂、润湿剂或增稠剂中的至少一种。
可选地，所述干燥以蒸发所述纳米金属线溶液的溶剂的步骤中，所述干燥采用真空减压或红外加热或热风加热，所述干燥的时间为50s～100s。
本申请的实施例还提供一种显示面板，包括：如上所述的导电层叠结构。
可选地，所述显示面板包括布线区，若干个所述纳米金属线层设置在所述 布线区，且沿所述布线区的延伸方向排布。
本申请提供的导电层叠结构中，包括基底；位于所述基底上的增粘层；位于所述增粘层上的纳米金属线层，所述纳米金属线层具有第一开口，暴露出所述增粘层；位于所述纳米金属线层上的走线层，所述走线层具有第二开口，所述第二开口与所述第一开口至少部分重叠，暴露出所述增粘层；以及光学胶层，设置在所述走线层上，填充在所述第二开口和所述第一开口并与所述增粘层相连接。由于纳米金属线层和走线层直接接触，提高了导通能力，减少了接触面积，因此走线层可以比较窄，实现窄边框设计；同时，借助于增粘层，可以提高纳米金属线层的附着力，且光学胶层设置在开口中，也可以增加对纳米金属线层的固定作用，提高附着力。
进一步的，通过调整第一开口和第二开口的大小位置关系，使得第一开口与第二开口可以呈台阶状，从而增加光学胶层与纳米金属线层和走线层的结合面积，增加结合力以更好的提高纳米金属线层的附着力。
附图说明
图1为本申请一实施例中导电层叠结构的结构示意图；
图2为纳米金属线的显微形貌图；
图3为本申请一实施例中纳米金属线层的局部俯视示意图；
图4为本申请一实施例中走线层的局部俯视示意图；
图5为本申请一实施例中光学胶层的局部俯视示意图。
图6为本申请一实施例中导电层叠结构的制备方法的流程图；
图7为本申请一实施例中提供衬底的剖面示意图；
图8为本申请一实施例中形成增粘层的剖面示意图；
图9为本申请一实施例中形成纳米金属线层的剖面示意图；
图10为本申请一实施例中形成纳米金属线层的俯视示意图；
图11为本申请一实施例中形成走线层的剖面示意图；
图12为本申请一实施例中形成走线层的俯视示意图；
图13为本申请一实施例中形成光学胶层的剖面示意图；
图14为本申请一实施例中形成光学胶层的俯视示意图。
具体实施方式
下面将结合示意图对本申请的导电层叠结构及其制备方法进行更详细的描述，
在下面的描述中，应该理解，当层(或膜)、区域、图案或结构被称作在基底、层(或膜)、区域和/或图案“上”时，它可以直接位于另一个层或基底上，和/或还可以存在插入层。另外，应该理解，当层被称作在另一个层“下”时，它可以直接位于另一个层下，和/或还可以存在一个或多个插入层。另外，可以基于附图进行关于在各层“上”和“下”的指代。
如图1-图5所示，本申请实施例提出了一种导电层叠结构，包括：
基底1；
位于所述基底上的增粘层2；
位于所述增粘层2上的纳米金属线层3，所述纳米金属线层3具有第一开口4(如图3所示)，暴露出所述增粘层2；
位于所述纳米金属线层3上的走线层5，所述走线层5具有第二开口6(如图4所示)，所述第二开口6与所述第一开口4至少部分重叠，暴露出所述增粘层2；以及
光学胶层7，设置在所述走线层5上，填充在所述第二开口6和所述第一开口4并与所述增粘层2相连接。
在一个实施例中，所述第一开口4和所述第二开口6的数量并不限于一个，可以为多个，本领域技术人员可以以及实际需求，调整第一开口4和第二开口6的数量。
在一个实施例中，所述第一开口4和所述第二开口6恰好吻合，即所述第 一开口4的面积与第二开口6的面积相等且边界一致(二者形状大小一致，且边界一致)。这样有助于优化制备工艺，可节省掩膜版，降低成本。
在一个实施例中，所述第一开口4和所述第二开口6可以呈台阶状，具体的，例如：
所述第二开口6的面积大于所述第一开口4的面积；所述第一开口4落入所述第二开口6的范围内。
或者，所述第二开口6的面积小于所述第一开口4的面积；所述第二开口6落入所述第一开口4的范围内。
或者，所述第一开口4和所述第二开口6至少部分区域错开。
因此，通过第一开口4和第二开口6的台阶状设计，可以增加光学胶层7与纳米金属线层3和走线层5的结合面积，增加结合力以更好的提高纳米金属线层3的附着力。
在所述基底上形成有若干个所述纳米金属线层3，每个所述纳米金属线层3在所述基底1上的俯视形状呈环形(包括方形环或圆形环)，所述环形的中心开口为所述第一开口。显示面板(例如触控面板)包括布线区，若干个所述纳米金属线层3设置在所述布线区，且沿所述布线区的延伸方向排布，此时纳米金属线层3用于与走线层5形成接触电连接，以导通走线层5与其他电连通结构；其中所述环形的边宽度可以为0.5μm-1.2μm，有助于实现窄边框设计。
在一个实施例中，所述增粘层的厚度为10nm-300nm。
进一步，如图6所示，本申请的实施例还提出了一种导电层叠结构的制备方法，包括如下步骤：
步骤S11，提供一基底；
步骤S12，在所述基底上形成增粘层；
步骤S13，在所述增粘层上形成纳米金属线层，所述纳米金属线层具有第一开口，暴露出所述增粘层；
步骤S14，在所述纳米金属线层上形成走线层，所述走线层具有第二开口， 所述第二开口与所述第一开口至少部分重叠，暴露出所述增粘层；以及
步骤S15，在所述走线层上形成光学胶层，所述光学胶层填充所述第二开口和所述第一开口并与所述增粘层相连接。
采用上述方法，由于纳米金属线层和走线层直接接触，提高了导通能力，减少了接触面积，因此走线层可以比较窄，实现窄边框设计；同时，借助于增粘层，可以提高纳米金属线层的附着力，且光学胶设置在开口中，也可以增加对纳米金属线层的固定作用，提高附着力。
以下列举所述导电层叠结构及其制备方法的较优实施例，以清楚的说明本申请的内容，应当明确的是，本申请的内容并不限制于以下实施例，其他通过本领域普通技术人员的常规技术手段的改进亦在本申请的思想范围之内。
请参考图7，对于步骤S11，提供一基底1。在一个实施例中，所述基底1可以是刚性材料形成的基底，例如玻璃基底、硅基底、金属基底等。在一个实施例中，所述基底1也可以是柔性材料形成的基底，所述基底1的材质可以但不限于为压克力、聚甲基丙烯酸甲酯(PMMA)、聚丙烯腈-丁二烯-苯乙烯(ABS)、聚酰胺(PA)、聚酰亚胺(PI)、聚苯并咪唑聚丁烯(PB)、聚对苯二甲酸丁二醇酯(PBT)、聚碳酸酯(PC)、聚醚醚酮(PEEK)、聚醚酰亚胺(PEI)、聚醚砜(PES)、聚乙烯(PE)、聚对苯二甲酸乙二醇酯(PET)、聚乙烯四氟乙烯(ETFE)、聚环氧乙烷、聚乙醇酸(PGA)、聚甲基戊烯(PMP)、聚甲醛(POM)、聚苯醚(PPE)、聚丙烯(PP)、聚苯乙烯(PS)、聚四氟乙烯(PTFE)、聚氨酯(PU)、聚氯乙烯(PVC)、聚氟乙烯(PVF)、聚偏二氯乙烯(PVDC)、聚偏二氟乙烯(PVDF)或苯乙烯-丙烯腈(SAN)等。本实施例中，所述基底1例如是聚酰亚胺基底等。本申请所述的基底1并不限于上述举例，亦可由其它材料制成。
可以理解的是，优选方案中，所述基底1经过预处理，以清除其上微粒、有机物及金属离子等杂质。
请参考图8，对于步骤S12，在所述基底1上形成增粘层2。
例如，所述增粘层2的厚度为10nm-300nm。
增粘层2的材料可以选自高分子聚合物、绝缘材料、树脂、透明光学胶、氧化物，类光阻等，包括但不限于：聚乙烯醇、聚乙烯醇缩丁醛、聚乙炔、聚苯胺、聚芳撑、聚噻吩、石墨烯、并五苯、聚苯撑醚(PPE)、聚对苯撑乙炔(PPV)、聚3，4-亚乙基二氧吩(PEDOT)、聚苯乙烯磺酸(PSS)、聚3-己基噻吩(P3HT)、聚3-辛基噻吩(P3OT)、聚C-61-丁酸-甲酯(PCBM)、聚[2-甲氧基-5-(2-乙基-己氧基)-1，4-苯撑乙烯](MEH-PPV)、氮化硅、二氧化硅。
之后，请参考图9和图10，对于步骤S13，在所述增粘层2上形成纳米金属线层3，所述纳米金属线层3具有第一开口4，暴露出所述增粘层2。
在一个实施例中，所述第一开口4的数量并不限于一个，可以为多个，本领域技术人员可以以及实际需求，调整第一开口4的数量。
由于所述增粘层2与所述基底1的附着力大于所述基底1和纳米金属线层3之间的附着力，所述增粘层2与纳米金属线层3的附着力大于所述基底1和纳米金属线层3之间的附着力，因此，增加增粘层2可使纳米金属线层3更好的附着于所述基底1上，纳米金属线层3之间不易发生游移，搭接更加牢固。
如图10所示，所述第一开口4具有第一开口边界41。例如，所述第一开口边界41呈方形、圆形等；在所述基底1上形成有若干个所述纳米金属线层3，每个所述纳米金属线层3在所述基底1上的俯视形状呈环形(包括方环或圆环)。显示面板(例如触控面板)包括布线区，若干个所述纳米金属线层3设置在所述布线区，且沿所述布线区的延伸方向排布；其中所述环形的边宽度可以是0.5μm-1.2μm，例如0.8μm、0.9μm、1μm等，以实现窄边框设计。
本步骤(步骤S13)具体可以包括：
首先，涂布纳米金属线溶液。
所述纳米金属线溶液中具有若干纳米金属线，这些纳米金属线分布于溶剂中。
所述纳米金属线溶液的浓度可以为0.01mg/mL～10mg/mL，例如0.05mg/mL、0.1mg/mL、0.5mg/mL、1mg/mL、2mg/mL、3mg/mL、4mg/mL、5mg/mL、 6mg/mL、7mg/mL、8mg/mL、9mg/mL等。依据实际工艺能力及产品需求，本领域技术人员可以灵活选择所述纳米金属线溶液的浓度。
该溶剂可以是水、水溶液、有机溶剂、无机溶剂、离子溶液、含盐溶液、超临界流体、油或其混合物等。该溶剂里还含有其它添加剂，如分散剂、表面活性剂、交联剂、润湿剂或增稠剂，但不以此为限。
所述纳米金属线溶液中的纳米金属线可以是金(Au)、银(Ag)、铂(Pt)、铜(Cu)、钴(Co)、钯(Pd)等的纳米线。由于银具有导电性和透光性好等特点，所述纳米金属线优选为银纳米线(即纳米银线10，如图3所示)；对应的，所述纳米金属线溶液优选为纳米银线溶液。
所述纳米金属线溶液的涂布可以采用现有技术完成。例如，所述涂布的方法包括但不限于：喷墨、撒播、凹版印刷、凸版印刷、柔印、纳米压印、丝网印刷、刮刀涂布、旋转涂布、针绘(stylus plotting)、夹缝式涂布或流涂。
接着，干燥以蒸发溶剂，获得纳米金属线材料层。
干燥的方法可以为自然晾干、简单烘烤或加热固化等。在一个实施例中，可以采用真空减压或红外加热或热风加热等形式进行干燥，时间约为50s～100s，例如55s，60s，70s等。
之后，刻蚀所述纳米金属线材料层形成第一开口4，暴露出所述增粘层2，形成所述纳米金属线层3。
所述刻蚀可以采用激光刻蚀工艺，或者其他可行操作，此处不进行详细说明。
请参考图11和图12，对于步骤S14，在所述纳米金属线层3上形成走线层5，所述走线层5具有第二开口6，所述第二开口6与所述第一开口4至少部分重叠，暴露出所述增粘层2。
在一个实施例中，所述第二开口6的数量并不限于一个，可以为多个，本领域技术人员可以以及实际需求，调整第二开口6的数量。
所述走线层5可以是仅形成于所述纳米金属线层3上，此处可以借助掩膜 层，避免走线层5形成至第一开口4中。
例如，所述走线层5可以是与所述纳米金属线层3恰好堆叠。
所述第二开口6具有第二开口边界61，所述第二开口边界61可以与所述第一开口边界41一致。相应的，所述第二开口6可以与所述第一开口4一致，即所述第一开口4和所述第二开口6恰好吻合，二者形状大小一致，且边界一致，这样有助于优化制备工艺，可节省掩膜版，降低成本。
可以理解的是，所述第二开口边界61与所述第一开口边界41可以不完全一致，例如所述第二开口边界61可以落在所述纳米金属线层3上。
在一个实施例中，所述第一开口4和所述第二开口6可以呈台阶状，具体的，例如：
所述第二开口6的面积大于所述第一开口4的面积；所述第一开口4落入所述第二开口6的范围内。
或者，所述第二开口6的面积小于所述第一开口4的面积；所述第二开口6落入所述第一开口4的范围内。
或者，所述第一开口4和所述第二开口6至少部分区域错开。
因此，通过第一开口4和第二开口6的台阶状设计，可以增加后续形成的光学胶层7(请参考图13)与纳米金属线层3和走线层5的结合面积，增加结合力以更好的提高纳米金属线层3的附着力。
由于所述走线层5与所述纳米金属线层3直接接触，因此可以降低接触电阻，提高导通能力，进而，可以采用较小的接触面积就可以实现导通，有利于窄边框设计。
请参考图13和图14，对于步骤S15，在所述走线层5上形成光学胶层7，所述光学胶层7填充所述第二开口和所述第一开口并与所述增粘层相连接。其中图14以虚线框示出了第二开口边界61，以便更好的理解本申请中光学胶层7的具体位置结构。
此外，本申请的实施例还提供了一种显示面板，所述显示面板包括如上所 述的导电层叠结构。
所述显示面板可以应用在手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件中。
本申请的实施例还提供了一种触控面板，包括如上所述的导电层叠结构。
所述触控面板可以应用在手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有触控操作功能的产品或部件中。
所述显示面板例如可以包括所述触控面板。
本申请的实施例还提供一种显示装置，包括如上所述的导电层叠结构。例如，所述显示装置可以是手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
综上所述，本申请提供的导电层叠结构中，包括基底；位于所述基底上的增粘层；位于所述增粘层上的纳米金属线层，所述纳米金属线层具有第一开口，暴露出所述增粘层；位于所述纳米金属线层上的走线层，所述走线层具有第二开口，所述第二开口与所述第一开口至少部分重叠，暴露出所述增粘层；以及光学胶层，设置在所述走线层上，填充在所述第二开口和所述第一开口并与所述增粘层相连接。由于纳米金属线层和走线层直接接触，提高了导通能力，接触面积只需0.1mm 2或者更小，相比现有技术中接触面积大于0.25mm 2，减少了接触面积，因此走线层可以比较窄，实现窄边框设计；同时，借助于增粘层，可以提高纳米金属线层的附着力，且光学胶层设置在开口中，也可以增加对纳米金属线层的固定作用，提高附着力。
进一步的，通过调整第一开口和第二开口的大小位置关系，使得第一开口与第二开口可以呈台阶状，从而增加光学胶层与纳米金属线层和走线层的结合面积，增加结合力以更好的提高纳米金属线层的附着力。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及 其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (20)

  1. 一种导电层叠结构，包括：
    基底；
    增粘层，所述增粘层位于所述基底上；
    纳米金属线层，所述纳米金属线层位于所述增粘层上，所述纳米金属线层具有第一开口，暴露出所述增粘层；
    走线层，所述走线层位于所述纳米金属线层上，所述走线层具有第二开口，所述第二开口与所述第一开口至少部分重叠，暴露出所述增粘层；以及
    光学胶层，设置在所述走线层上，所述光学胶层填充在所述第二开口和所述第一开口并与所述增粘层相连接。
  2. 如权利要求1所述的导电层叠结构，其中，所述第二开口的面积大于所述第一开口的面积；所述第一开口落入所述第二开口的范围内。
  3. 如权利要求1所述的导电层叠结构，其中，所述第二开口的面积小于所述第一开口的面积；所述第二开口落入所述第一开口的范围内。
  4. 如权利要求1所述的导电层叠结构，其中，所述第一开口和所述第二开口至少部分区域错开。
  5. 如权利要求1所述的导电层叠结构，其中，所述第一开口的面积与所述第二开口的面积相等，且所述第一开口的边界与所述第二开口的边界一致。
  6. 如权利要求1所述的导电层叠结构，其中，在所述基底上形成有若干个所述纳米金属线层，每个所述纳米金属线层在所述基底上的俯视形状呈环形，所述环形的中心开口为所述第一开口。
  7. 如权利要求6所述的导电层叠结构，其中，所述环形的边宽度为0.5μm-1.2μm。
  8. 如权利要求1所述的导电层叠结构，其中，所述增粘层的厚度为10nm-300nm。
  9. 根据权利要求1所述的导电层叠结构，其中，所述第一开口和所述第二 开口都为多个。
  10. 根据权利要求1所述的导电层叠结构，其中，所述增粘层的材料选自高分子聚合物、绝缘材料、树脂、透明光学胶、氧化物和类光阻中的至少一种。
  11. 如权利要求10所述的导电层叠结构，其中，所述增粘层的厚度为10nm-300nm。
  12. 一种导电层叠结构的制备方法，包括：
    提供一基底；
    在所述基底上形成增粘层；
    在所述增粘层上形成纳米金属线层，所述纳米金属线层具有第一开口，暴露出所述增粘层；
    在所述纳米金属线层上形成走线层，所述走线层具有第二开口，所述第二开口与所述第一开口至少部分重叠，暴露出所述增粘层；以及
    在所述走线层上形成光学胶层，所述光学胶层填充所述第二开口和所述第一开口并与所述增粘层相连接。
  13. 如权利要求12所述的导电层叠结构的制备方法，其中，所述在增粘层上形成纳米金属线层的步骤包括：
    涂布纳米金属线溶液；
    干燥以蒸发所述纳米金属线溶液的溶剂，获得纳米金属线材料层；
    刻蚀所述纳米金属线材料层形成第一开口，暴露出所述增粘层，形成所述纳米金属线层。
  14. 如权利要求13所述的导电层叠结构的制备方法，其中，所述纳米金属线溶液中具有若干纳米金属线，所述纳米金属线分布于溶剂中。
  15. 如权利要求13所述的导电层叠结构的制备方法，其中，所述纳米金属线溶液的浓度为0.01mg/mL～10mg/mL。
  16. 如权利要求14所述的导电层叠结构的制备方法，其中，所述溶剂为水、离子溶液、含盐溶液、超临界流体和油中的任一种。
  17. 如权利要求16所述的导电层叠结构的制备方法，其中，所述溶剂里含有分散剂、表面活性剂、交联剂、润湿剂和增稠剂中的至少一种。
  18. 如权利要求13所述的导电层叠结构的制备方法，其中，所述干燥以蒸发所述纳米金属线溶液的溶剂的步骤中，所述干燥采用真空减压或红外加热或热风加热，所述干燥的时间为50s～100s。
  19. 一种显示面板，包括：如权利要求1所述的导电层叠结构。
  20. 如权利要求19所述的显示面板，其中，所述显示面板包括布线区，若干个所述纳米金属线层设置在所述布线区，且沿所述布线区的延伸方向排布。
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CN105224150A (zh) * 2014-06-12 2016-01-06 宸鸿科技(厦门)有限公司 触控面板
CN207397244U (zh) * 2017-09-22 2018-05-22 昆山国显光电有限公司 电连接结构及应用其的触控屏、显示装置
CN108899110A (zh) * 2018-06-30 2018-11-27 云谷（固安）科技有限公司 导电层叠结构及其制备方法、显示面板

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