WO2020000883A1 - 液晶显示器及其制备方法 - Google Patents

液晶显示器及其制备方法 Download PDF

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Publication number
WO2020000883A1
WO2020000883A1 PCT/CN2018/116855 CN2018116855W WO2020000883A1 WO 2020000883 A1 WO2020000883 A1 WO 2020000883A1 CN 2018116855 W CN2018116855 W CN 2018116855W WO 2020000883 A1 WO2020000883 A1 WO 2020000883A1
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WO
WIPO (PCT)
Prior art keywords
mother board
array substrate
liquid crystal
substrate mother
short
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PCT/CN2018/116855
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English (en)
French (fr)
Inventor
任维
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Publication of WO2020000883A1 publication Critical patent/WO2020000883A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136254—Checking; Testing

Definitions

  • the present application relates to the field of display technology, and in particular, to a liquid crystal display and a manufacturing method thereof.
  • Liquid crystal displays using ITO films as CF substrate electrodes have become hotspots for research due to their good electrical conductivity and high visible light transmittance.
  • one side of the CF substrate is used as the electrical signal input terminal, which makes the array substrate with line faults such as short circuits cause the CF substrate All areas on the site are abnormal and cannot be used as products, which not only causes serious waste, but also seriously affects the product yield.
  • the technical problem mainly solved by the present application is to provide a liquid crystal display and a preparation method thereof, which can avoid waste of resources and improve the yield of a product.
  • An embodiment of the present application provides a method for manufacturing a liquid crystal display, and the method includes:
  • the composite substrate is cured, and an electrical signal is input from the color filter substrate mother board and transmitted to the array substrate mother board through the conductive adhesive.
  • the array substrate mother board includes at least one array substrate unit, and the array substrate unit including the short-circuit region is not coated with a conductive adhesive.
  • the sizes of the array substrate units are the same or different.
  • the method further includes: dripping liquid crystal on the array substrate mother board and / or the substrate.
  • the color film substrate mother board is described.
  • the array substrate unit including the short-circuit region is not subjected to liquid crystal dripping.
  • the method further includes: cutting the composite substrate to obtain a composite substrate unit, and the size of the composite substrate unit is the same as that of the corresponding array substrate unit.
  • the composite substrate is cut by a laser cutting method.
  • the conductive paste is a conductive gold paste, a conductive silver paste, or a combination of the two.
  • the coating thickness of the conductive adhesive is 10-20 microns.
  • An embodiment of the present application provides a method for manufacturing a liquid crystal display, and the method includes:
  • the composite substrate is cured.
  • the array substrate mother board includes at least one array substrate unit, and the array substrate unit including the short-circuit region is not coated with a conductive adhesive.
  • the sizes of the array substrate units are the same or different.
  • the method further includes: dripping liquid crystal on the array substrate mother board and / or the substrate.
  • the color film substrate mother board is described.
  • the array substrate unit including the short-circuit region is not subjected to liquid crystal dripping.
  • the method further includes: cutting the composite substrate to obtain a composite substrate unit, and the size of the composite substrate unit is the same as that of the corresponding array substrate unit.
  • the composite substrate is cut by a laser cutting method.
  • the conductive paste is a conductive gold paste, a conductive silver paste, or a combination of the two.
  • the coating thickness of the conductive adhesive is 10-20 microns.
  • An embodiment of the present application provides a liquid crystal display.
  • the liquid crystal display is prepared by the method described above.
  • the beneficial effect of the present application is: different from the situation of the prior art, the present application marks the short-circuit area of the array substrate mother board and attaches the array substrate mother board to the color film substrate mother board.
  • the short-circuit area is not coated with conductive adhesive, which makes the short-circuit area of the array substrate mother board unable to be connected to the color filter substrate mother board during the curing process, and the short circuit cannot be short-circuited.
  • FIG. 1 is a schematic flowchart of an embodiment of a method for manufacturing a liquid crystal display provided by the present application.
  • FIG. 2 is a schematic structural diagram of a first embodiment of an array substrate mother board in a method for manufacturing a liquid crystal display provided by the present application.
  • FIG. 3 is a schematic structural diagram of a first embodiment of a composite substrate in a method for manufacturing a liquid crystal display provided by the present application.
  • FIG. 4 is a schematic structural diagram of a second embodiment of an array substrate mother board in a method for manufacturing a liquid crystal display provided by the present application.
  • FIG. 5 is a schematic structural diagram of a second embodiment of a composite substrate in a method for manufacturing a liquid crystal display provided by the present application.
  • FIG. 6 is a schematic structural diagram of an embodiment of a liquid crystal display provided by the present application.
  • FIG. 1 is a schematic flowchart of an embodiment of a method for manufacturing a liquid crystal display provided by the present application.
  • the method includes:
  • Step S100 Provide an array substrate mother board 100 and a color film substrate mother board 200.
  • the array substrate mother board 100 and the color filter substrate mother board 200 may both be large-sized substrates that have not been cut during the production process of the liquid crystal display.
  • the area of the array substrate mother board 100 and the color filter substrate mother board 200 can reach 2 square meters or more.
  • the array substrate mother board 100 includes a plurality of scan lines and a plurality of data lines.
  • the plurality of scanning lines and the plurality of scanning lines cross each other to divide the array substrate mother board 100 into a plurality of pixels.
  • Each of the pixels may include a thin film transistor and a pixel electrode.
  • the thin film transistor is electrically connected to a corresponding scan line and a corresponding data line to control whether the pixel is turned on.
  • the pixel electrode is electrically connected to the thin film transistor.
  • Step S200 Detect the array substrate mother board 100 and mark a short-circuit area 110 of the array substrate mother board 100.
  • step S200 the multi-array substrate mother board 100 is detected, and the detected short-circuit area 110 is marked and fed back, which facilitates processing the short-circuit area 110 in a subsequent process.
  • FIG. 2 is a schematic structural diagram of a first embodiment of an array substrate mother board in a method for manufacturing a liquid crystal display provided by the present application.
  • the array substrate mother board 100 is detected to determine the short-circuit area 110.
  • the short-circuit area 110 is an electrostatic discharge short-circuit area.
  • the detection method of the array substrate mother board 100 is a short bar detection method.
  • Step S300 coating the array substrate mother board 100 and / or the color filter substrate mother board 200 with a conductive adhesive 120 and bonding the two together to obtain a composite substrate 300, wherein the short-circuit region 110 is not performed.
  • the conductive adhesive 120 is coated.
  • step S300 please refer to FIG. 1, FIG. 2 and FIG. 3 together.
  • the box forming process by applying a conductive adhesive between the array substrate mother board 100 and the color filter substrate mother board 200 120 is bonded together to obtain a composite substrate 300, and the conductive adhesive 120 is not coated in the short-circuit area 110, that is, no conductive adhesive is coated on the inside and outside of the short-circuit area 110. 120.
  • the conductive adhesive 120 not only conducts the array substrate mother board 100 and the color filter substrate mother board 200, but also serves as a current transmission medium between them to form an electric field that controls the rotation of the liquid crystal.
  • the conductive adhesive 120 may be coated on the array substrate mother board 100, or may be coated on the color filter substrate mother board 200, or both.
  • the conductive adhesive 120 may be coated on the color filter substrate mother board 200.
  • the conductive paste 120 is coated on the array substrate mother board 100, and the conductive paste 120 is not coated on the short-circuit region 110. .
  • Step S400 curing the composite substrate 300.
  • An electrical signal may be input from the color filter substrate mother board 200 and transmitted to the array substrate mother board 100 through the conductive adhesive 120 for curing.
  • step S400 in the process of curing the composite substrate 300, an electric signal is input from the color film substrate mother board 200 side, and the ITO electrode 210 on the color film substrate mother board 200 is a whole piece.
  • the connected signals from the array substrate mother board 100 side will have corresponding effects on different regions of the color filter substrate mother board 200.
  • the short-circuit area 110 of the array substrate mother board 100 is marked, and during the bonding process of the array substrate mother board 100 and the color filter substrate mother board 200, the short-circuit area is not marked.
  • 110 is coated with conductive adhesive 120, which makes it impossible for the short circuit region 110 of the array substrate mother board 100 to be connected to the color filter substrate mother board 200 during the curing process. Signals such as a short circuit are abnormally transmitted to the color filter substrate mother board 200. In this way, only the short circuit region 110 and the area corresponding to the short circuit region 110 on the color filter substrate mother board 100 cannot be processed further to obtain a product, which avoids The problem of scrapping the entire color film substrate mother board 100 can effectively reduce waste of resources and improve the yield of the product.
  • the array substrate mother board 100 includes at least one array substrate unit 101, and the array substrate unit 101 including the short-circuit region 110 is not coated with the conductive adhesive 120.
  • a large-sized array substrate mother board 100 may be divided into a plurality of array substrate units 101 of different sizes.
  • the sizes of the array substrate units 101 may be the same or different.
  • the sizes of the array substrate units 101 are different, and the array substrate units 101 of different sizes can make full use of the space of the array substrate mother 100 to reduce waste and improve production efficiency.
  • the color filter substrate mother board 200 is also divided into color filter substrate units corresponding to the size and position of the array substrate unit 101, and the ITO electrodes 210 of different color filter substrate units are connected to each other.
  • the corresponding arrangement facilitates cutting the composite substrate 300 into a plurality of composite substrate units 301.
  • the short-circuit area 110 may be all located in one of the array substrate units 101 or may be distributed in multiple array substrate units 101, and the array substrate including the short-circuit area 110 will be included in the array substrate unit 101.
  • the unit 101 is not coated with the conductive adhesive 120.
  • the short-circuit signal cannot be performed to the color film substrate mother board 200.
  • the propagation can prevent abnormal signals such as a short circuit in the short-circuit area 110 from being transmitted to the color filter substrate mother board 200 and the entire color filter substrate mother board 200 is discarded, which is beneficial to improving product yield and production efficiency.
  • the method before bonding the array substrate mother board 100 and the color filter substrate mother board 200, the method further includes: dripping liquid crystal onto the array substrate mother board 100 and / or the color filter substrate mother board 200. . Specifically, liquid crystal dripping is performed by using an ODF process, that is, liquid crystal dripping is performed in an atmospheric atmosphere, and bonding is performed in a vacuum state. In one embodiment, the array substrate unit 101 including the short-circuit region 110 does not perform liquid crystal dripping. That is, further operations are stopped in the area where it is determined that the product cannot be obtained, so that the waste of raw materials in subsequent processes can be effectively avoided, the production cost can be reduced, and the production efficiency can be improved.
  • the method further includes cutting the composite substrate 300 to obtain a composite substrate unit 301.
  • the cutting process may be performed in different ways. In one embodiment, laser cutting is used to cut the composite substrate 300, which can effectively improve cutting efficiency and cutting accuracy.
  • the size of the composite base unit 301 is the same as that of the corresponding array substrate unit 101, and the size of the composite substrate unit 301 is also the size of a liquid crystal display product.
  • the conductive paste 120 is a conductive gold paste, a conductive silver paste, or a combination of the two.
  • the conductive adhesive 120 is capable of both performing an adhesive function and transmitting current. It is generally prepared by a method of dispersing a conductive metal in a binder. In one embodiment, in order to obtain a better conductive effect, the conductive paste 120 is a conductive gold paste. Further, the coating thickness of the conductive adhesive 120 is 10-20 microns. In order to obtain better bonding and conductive effects without the problem of glue overflow, in one embodiment, the coating thickness of the conductive adhesive 120 is 10-20 microns, such as 10 microns, 15 microns, or 20 microns. Wait. Of course, according to the size of the substrate to be bonded and the type of the conductive adhesive 120, different coating thicknesses of the conductive adhesive 120 can be selected.
  • the present application also provides a liquid crystal display.
  • the liquid crystal display 10 is prepared by any one of the methods.
  • the liquid crystal display 10 is a large-size liquid crystal display, and the screen size of the liquid crystal display 10 is greater than 65 inches, such as 88 inches, 110 inches, and the like.
  • the present application discloses a liquid crystal display and a manufacturing method thereof.
  • the method includes: providing an array substrate mother board and a color film substrate mother board; detecting the array substrate mother board and marking the array substrate. A short circuit region of the mother board; coating the array substrate mother board and / or the color film substrate mother board with a conductive adhesive and bonding the two together to obtain a composite substrate, wherein the short circuit region is not provided with a conductive adhesive Coating; curing the composite substrate, and inputting an electrical signal from the color film substrate mother board and transmitting it to the array substrate mother board through the conductive adhesive.
  • the present application can avoid waste of resources and improve the yield of the product.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种液晶显示器(10)及其制备方法，所述方法包括：提供一阵列基板母板(100)和一彩膜基板母板(200)；检测阵列基板母板(100)并标记阵列基板母板(100)的短路区域(110)；在阵列基板母板(100)和/或彩膜基板母板(200)上涂覆导电胶(120)并将二者进行贴合，得到复合基板(300)，其中，短路区域(110)未进行导电胶(120)涂覆；对复合基板(300)进行固化。

Description

液晶显示器及其制备方法 技术领域
本申请涉及显示技术领域，特别是涉及一种液晶显示器及其制备方法。
 背景技术
随着显示技术的不断发展，人们对显示器的性能要求不断提高，采用ITO薄膜作为CF基板电极的液晶显示器因其导电效果好、可见光透过率高等特点成为研究的热点。
在大尺寸显示器的制备过程的LOC（芯片上引线）技术中，采用CF基板一侧作为电信号输入端，这就使得存在短路等线路故障的阵列基板会在与CF基板导通后使CF基板上的所有区域均发生异常，不能作为产品使用，不仅造成严重的浪费，而且严重影响产品良率。
 技术问题
本申请主要解决的技术问题是提供一种液晶显示器及其制备方法，能够避免资源浪费，同时提高产品的良率。
 技术解决方案
本申请实施例提供一种液晶显示器的制备方法，所述方法包括：
提供一阵列基板母板和一彩膜基板母板；
检测所述阵列基板母板并标记所述阵列基板母板的短路区域；
在所述阵列基板母板和/或所述彩膜基板母板上涂覆导电胶并将二者进行贴合，得到复合基板，其中，所述短路区域未进行导电胶涂覆；
对所述复合基板进行固化，电信号从所述彩膜基板母板输入，并通过所述导电胶传输到所述阵列基板母板。
在本申请实施例所提供的液晶显示器的制备方法中，所述阵列基板母板包括至少一个阵列基板单元，包含所述短路区域的所述阵列基板单元不涂覆导电胶。
在本申请实施例所提供的液晶显示器的制备方法中，所述阵列基板单元的尺寸相同或不同。
在本申请实施例所提供的液晶显示器的制备方法中，所述阵列基板母板与所述彩膜基板母板贴合前还包括：将液晶滴注在所述阵列基板母板和/或所述彩膜基板母板上。
在本申请实施例所提供的液晶显示器的制备方法中，包含所述短路区域的所述阵列基板单元不进行液晶滴注。
在本申请实施例所提供的液晶显示器的制备方法中，还包括：将所述复合基板进行切割，得到复合基板单元，所述复合基板单元的尺寸与相应的所述阵列基板单元的尺寸相同。
在本申请实施例所提供的液晶显示器的制备方法中，采用激光切割的方式对所述复合基板进行切割。
在本申请实施例所提供的液晶显示器的制备方法中，所述导电胶为导电金胶、导电银胶或二者的复合。
在本申请实施例所提供的液晶显示器的制备方法中，所述导电胶的涂覆厚度为10-20微米。
本申请实施例提供一种液晶显示器的制备方法，所述方法包括：
提供一阵列基板母板和一彩膜基板母板；
检测所述阵列基板母板并标记所述阵列基板母板的短路区域；
在所述阵列基板母板和/或所述彩膜基板母板上涂覆导电胶并将二者进行贴合，得到复合基板，其中，所述短路区域未进行导电胶涂覆；
对所述复合基板进行固化。
在本申请实施例所提供的液晶显示器的制备方法中，所述阵列基板母板包括至少一个阵列基板单元，包含所述短路区域的所述阵列基板单元不涂覆导电胶。
在本申请实施例所提供的液晶显示器的制备方法中，所述阵列基板单元的尺寸相同或不同。
在本申请实施例所提供的液晶显示器的制备方法中，所述阵列基板母板与所述彩膜基板母板贴合前还包括：将液晶滴注在所述阵列基板母板和/或所述彩膜基板母板上。
在本申请实施例所提供的液晶显示器的制备方法中，包含所述短路区域的所述阵列基板单元不进行液晶滴注。
在本申请实施例所提供的液晶显示器的制备方法中，还包括：将所述复合基板进行切割，得到复合基板单元，所述复合基板单元的尺寸与相应的所述阵列基板单元的尺寸相同。
在本申请实施例所提供的液晶显示器的制备方法中，采用激光切割的方式对所述复合基板进行切割。
在本申请实施例所提供的液晶显示器的制备方法中，所述导电胶为导电金胶、导电银胶或二者的复合。
在本申请实施例所提供的液晶显示器的制备方法中，所述导电胶的涂覆厚度为10-20微米。
本申请实施例提供一种液晶显示器，所述液晶显示器采用如前所述方法制备。
 有益效果
本申请的有益效果是：区别于现有技术的情况，本申请通过对所述阵列基板母板的短路区域进行标记，并在所述阵列基板母板与所述彩膜基板母板贴合过程中，未对所述短路区域进行导电胶涂覆，这就使得固化过程中，所述阵列基板母板的短路区域不能与所述彩膜基板母板进行导通，也就不能将所述短路区域的短路等信号异常传输至所述彩膜基板母板，这样，只是所述短路区域及所述彩膜基板母板上与所述短路区域对应的区域不能继续加工得到产品，避免了所述彩膜基板母板整片报废的问题，能够有效减少资源浪费，提高产品的良率。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请所提供的液晶显示器的制备方法的一种实施方式的流程示意图。
图2是本申请所提供的液晶显示器的制备方法中的阵列基板母板的第一种实施方式的结构示意图。
图3是本申请所提供的液晶显示器的制备方法中的复合基板的第一种实施方式的结构示意图。
图4是本申请所提供的液晶显示器的制备方法中的阵列基板母板的第二种实施方式的结构示意图。
图5是本申请所提供的液晶显示器的制备方法中的复合基板的第二种实施方式的结构示意图。
图6是本申请所提供的液晶显示器的一种实施方式的结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图1，图1是本申请所提供的液晶显示器的制备方法的一种实施方式的流程示意图。所述方法包括：
步骤S100：提供一阵列基板母板100和一彩膜基板母板200。
在所述步骤S100中，所述阵列基板母板100和所述彩膜基板母板200均可以是液晶显示器生产过程未经切割的大尺寸基板。所述阵列基板母板100和所述彩膜基板母板200的面积均可达2平方米或2平方米以上。所述阵列基板母板100包括多条扫描线，多条数据线。所述多条扫描线与所述多条扫描线相互交叉以将所述阵列基板母板100划分为多个像素。每个所述像素可以包括薄膜晶体管和像素电极。所述薄膜晶体管电连接至一条对应的扫描线和一条对应的数据线，以控制所述像素是否导通。所述像素电极电连接至所述薄膜晶体管。
步骤S200：检测所述阵列基板母板100并标记所述阵列基板母板100的短路区域110。
在所述步骤S200中对多阵列基板母板100进行检测，并将所检测到短路区域110进行标记和反馈，便于在后续工艺过程中对所述短路区域110进行处理。在一种实施方式中，请参阅图2，图2是本申请所提供的液晶显示器的制备方法中的阵列基板母板的第一种实施方式的结构示意图。对所述阵列基板母板100进行检测确定所述短路区域110。所述短路区域110为静电放电短路区域。对所述阵列基板母板100的检测方法为短路棒检测法。
步骤S300：在所述阵列基板母板100和/或所述彩膜基板母板200上涂覆导电胶120并将二者进行贴合，得到复合基板300，其中，所述短路区域110未进行导电胶120涂覆。
在所述步骤S300中，请一并参阅图1、图2和图3，在成盒工艺中，通过在所述阵列基板母板100与所述彩膜基板母板200之间涂覆导电胶120将二者进行贴合，得到复合基板300，且在所述短路区域110内不进行导电胶120的涂覆，也即在所述短路区域110的面内与面外均不涂覆导电胶120。所述导电胶120除了将所述阵列基板母板100与所述彩膜基板母板200进行导通外，还作为二者之间电流的传递媒介，形成控制液晶旋转的电场。当然，所述导电胶120可以涂覆在所述阵列基板母板100上，也可以涂覆在所述彩膜基板母板200上，还可在二者上均涂覆。在一种实施方式中，所述导电胶120可以涂覆在所述彩膜基板母板200上。在一种实施方式中，请参阅图1和图2，所述导电胶120涂覆在所述阵列基板母板100上，且在所述短路区域110上未进行所述导电胶120的涂覆。
步骤S400：对所述复合基板300进行固化。
可以采用电信号从所述彩膜基板母板200输入，并通过所述导电胶120传输到所述阵列基板母板100进行固化。
在所述步骤S400中，对所述复合基板300进行固化过程中，采用电信号从彩膜基板母板200一侧输入的工艺中，所述彩膜基板母板200上ITO电极210是整块相连的，从所述阵列基板母板100一侧传入的信号将会对所述彩膜基板母板200的不同区域均产生相应的影响。
在本申请中，通过对所述阵列基板母板100的短路区域110进行标记，并在所述阵列基板母板100与所述彩膜基板母板200贴合过程中，未对所述短路区域110进行导电胶120涂覆，这就使得固化过程中，所述阵列基板母板100的短路区域110不能与所述彩膜基板母板200进行导通，也就不能将所述短路区域110的短路等信号异常传输至所述彩膜基板母板200，这样，只是所述短路区域110及所述彩膜基板母板100上与所述短路区域110对应的区域不能继续加工得到产品，避免了所述彩膜基板母板100整片报废的问题，能够有效减少资源浪费，提高产品的良率。
在一种实施方式中，请参阅图4和图5，所述阵列基板母板100包括至少一个阵列基板单元101，包含所述短路区域110的所述阵列基板单元101不涂覆导电胶120。根据产品需求，将大尺寸的阵列基板母板100可以被划分成多个不同尺寸的阵列基板单元101。在一种实施方式中，所述阵列基板单元101的尺寸可以相同，也可以不同。在一个实施方式中，所述阵列基板单元101的尺寸不同，不同尺寸的阵列基板单元101能充分利用阵列基板母100的空间，减少浪费，提高生产效率。相应的，所述彩膜基板母板200也被分成与所述阵列基板单元101尺寸和位置均对应的彩膜基板单元，且不同的所述彩膜基板单元的ITO电极210相互连接，这种对应设置方式便于将所述复合基板300切割成多个复合基板单元301。
具体的，所述短路区域110可能全部位于某一所述阵列基板单元101内，也可能在多个所述阵列基板单元101内都有分布，则将包含所述短路区域110的所述阵列基板单元101都不进行导电胶120涂覆，在将所述阵列基板母板100与所述彩膜基板母板200进行导通过程中，所述短路信号不能向所述彩膜基板母板200进行传播，能够避免所述短路区域110的短路等信号异常传输至所述彩膜基板母板200使整个彩膜基板母板200整片报废，有利于提高产品良率和生产效率。
在一个实施方式中，所述阵列基板母板100与所述彩膜基板母板200贴合前还包括：将液晶滴注到所述阵列基板母板100和/或彩膜基板母板200上。具体的，采用ODF工艺进行液晶滴注，即在大气氛围下进行液晶滴注，在真空状态下进行贴合。在一个实施方式中，包含所述短路区域110的所述阵列基板单元101不进行液晶滴注。也即在确定不能得到产品的区域停止进一步操作，这样能够有效避免后续工艺原料的浪费，能够降低生产成本，提高生产效率。
进一步的，所述方法还包括将所述复合基板300进行切割，得到复合基板单元301。所述切割过程可以采用不同的方式进行，在一种实施方式中，采用激光切割的方式对所述复合基板300进行切割，能够有效提高切割效率和切割精确度。进一步的，所述复合基本单元301的尺寸与相应的所述阵列基板单元101的尺寸相同，所述复合基板单元301的尺寸也即液晶显示器产品的尺寸。
在一个实施方式中，所述导电胶120为导电金胶、导电银胶或二者的复合。所述导电胶120即为既能发挥粘接作用，又能进行电流传输。通常是通过在粘结剂中分散导电金属的方法制备，在一个实施方式中，为获得较好的导电效果，所述导电胶120为导电金胶。进一步的，所述导电胶120的涂覆厚度为10-20微米。为能够获得较好的粘接和导电效果，又不发生溢胶问题，在一个实施方式中，所述导电胶120的涂覆厚度为10-20微米，如，10微米、15微米或20微米等。当然，根据待粘接的基板的尺寸及导电胶120的种类，可以选择不同的导电胶120涂覆厚度。
为解决上述技术问题，本申请还提供一种液晶显示器。请参阅图6，所述液晶显示器10采用任一所述方法制备。在本实施方式中，所述液晶显示器10为大尺寸液晶显示器，所述液晶显示器10的屏幕次尺寸大于65英寸，如88英寸、110英寸等。
综上所述，本申请公开了一种液晶显示器及其制备方法，所述方法包括：提供一阵列基板母板和一彩膜基板母板；检测所述阵列基板母板并标记所述阵列基板母板的短路区域；在所述阵列基板母板和/或所述彩膜基板母板上涂覆导电胶并将二者进行贴合，得到复合基板，其中，所述短路区域未进行导电胶涂覆；对所述复合基板进行固化，电信号从所述彩膜基板母板输入，并通过所述导电胶传输到所述阵列基板母板。通过上述方式，本申请能够避免资源浪费，同时提高产品的良率。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (19)

  1. 一种液晶显示器的制备方法，其中，所述方法包括：
    提供一阵列基板母板和一彩膜基板母板；
    检测所述阵列基板母板并标记所述阵列基板母板的短路区域；
    在所述阵列基板母板和/或所述彩膜基板母板上涂覆导电胶并将二者进行贴合，得到复合基板，其中，所述短路区域未进行导电胶涂覆；
    对所述复合基板进行固化，电信号从所述彩膜基板母板输入，并通过所述导电胶传输到所述阵列基板母板。
  2. 根据权利要求1所述的方法，其中，所述阵列基板母板包括至少一个阵列基板单元，包含所述短路区域的所述阵列基板单元不涂覆导电胶。
  3. 根据权利要求2所述的方法，其中，所述阵列基板单元的尺寸相同或不同。
  4. 根据权利要求1所述的方法，其中，所述阵列基板母板与所述彩膜基板母板贴合前还包括：将液晶滴注在所述阵列基板母板和/或所述彩膜基板母板上。
  5. 根据权利要求4所述的方法，其中，包含所述短路区域的所述阵列基板单元不进行液晶滴注。
  6. 根据权利要求2所述的方法，其中，所述方法还包括：将所述复合基板进行切割，得到复合基板单元，所述复合基板单元的尺寸与相应的所述阵列基板单元的尺寸相同。
  7. 根据权利要求1所述的方法，其中，采用激光切割的方式对所述复合基板进行切割。
  8. 根据权利要求1所述的方法，其中，所述导电胶为导电金胶、导电银胶或二者的复合。
  9. 根据权利要求1所述的方法，其中，所述导电胶的涂覆厚度为10-20微米。
  10. 一种液晶显示器的制备方法，其中，所述方法包括：
    提供一阵列基板母板和一彩膜基板母板；
    检测所述阵列基板母板并标记所述阵列基板母板的短路区域；
    在所述阵列基板母板和/或所述彩膜基板母板上涂覆导电胶并将二者进行贴合，得到复合基板，其中，所述短路区域未进行导电胶涂覆；
    对所述复合基板进行固化。
  11. 根据权利要求10所述的方法，其中，所述阵列基板母板包括至少一个阵列基板单元，包含所述短路区域的所述阵列基板单元不涂覆导电胶。
  12. 根据权利要求11所述的方法，其中，所述阵列基板单元的尺寸相同或不同。
  13. 根据权利要求10所述的方法，其中，所述阵列基板母板与所述彩膜基板母板贴合前还包括：将液晶滴注在所述阵列基板母板和/或所述彩膜基板母板上。
  14. 根据权利要求13所述的方法，其中，包含所述短路区域的所述阵列基板单元不进行液晶滴注。
  15. 根据权利要求11所述的方法，其中，所述方法还包括：将所述复合基板进行切割，得到复合基板单元，所述复合基板单元的尺寸与相应的所述阵列基板单元的尺寸相同。
  16. 根据权利要求10所述的方法，其中，采用激光切割的方式对所述复合基板进行切割。
  17. 根据权利要求10所述的方法，其中，所述导电胶为导电金胶、导电银胶或二者的复合。
  18. 根据权利要求10所述的方法，其中，所述导电胶的涂覆厚度为10-20微米。
  19. 一种液晶显示器，其中，所述液晶显示器采用权利要求1-18任一所述方法制备。
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CN107884977A (zh) * 2017-12-26 2018-04-06 深圳市华星光电技术有限公司 一种液晶显示器及其制备方法
CN108628022A (zh) * 2018-06-26 2018-10-09 深圳市华星光电半导体显示技术有限公司 一种液晶显示器及其制备方法

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