WO2020000182A1 - Dispositif de dissipation de chaleur et véhicule aérien sans pilote en disposant - Google Patents

Dispositif de dissipation de chaleur et véhicule aérien sans pilote en disposant Download PDF

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Publication number
WO2020000182A1
WO2020000182A1 PCT/CN2018/092867 CN2018092867W WO2020000182A1 WO 2020000182 A1 WO2020000182 A1 WO 2020000182A1 CN 2018092867 W CN2018092867 W CN 2018092867W WO 2020000182 A1 WO2020000182 A1 WO 2020000182A1
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WO
WIPO (PCT)
Prior art keywords
fan
heat
air
base
aerial vehicle
Prior art date
Application number
PCT/CN2018/092867
Other languages
English (en)
Chinese (zh)
Inventor
李阳
周震昊
陶冶
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201880017083.1A priority Critical patent/CN110506000A/zh
Priority to PCT/CN2018/092867 priority patent/WO2020000182A1/fr
Publication of WO2020000182A1 publication Critical patent/WO2020000182A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U20/00—Constructional aspects of UAVs
    • B64U20/90—Cooling
    • B64U20/96—Cooling using air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U20/00—Constructional aspects of UAVs
    • B64U20/90—Cooling
    • B64U20/92—Cooling of avionics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U10/00—Type of UAV
    • B64U10/10—Rotorcrafts
    • B64U10/13—Flying platforms
    • B64U10/14—Flying platforms with four distinct rotor axes, e.g. quadcopters

Definitions

  • the present disclosure belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation device and an unmanned aerial vehicle having the same.
  • a heat-conducting plate is generally used to introduce heat from electronic components such as chips into the air, and then a fan is used to promote air flow for heat dissipation.
  • the heat transfer plate is usually long and of high quality.
  • to remove all the heat from the heat transfer plate requires a complicated air path design, which causes the quality of the heat dissipation system to be bloated, or it may cause heat accumulation in some places, resulting in higher system temperature. Therefore, the cooling effect is not ideal.
  • An aspect of the present disclosure provides a heat dissipation device including a thermally conductive fan including a base, a housing, and a fan blade;
  • the shell is surrounded by a top surface and four sides, and is fixedly connected to the base to form a cavity.
  • the fan blade is rotatably installed in the cavity.
  • the shell is opposite to the base.
  • a fan inlet is formed on the top surface, a fan outlet is formed on one side, and the base is made of a thermally conductive material.
  • the base is made of copper, copper alloy or aluminum alloy.
  • the heat dissipation device further includes a plurality of heat sinks, and the heat sinks are formed on a substrate and disposed outside the air outlet of the fan.
  • the base is integrally formed with the substrate.
  • the height of the heat sink is equal to or greater than the height of the fan air outlet.
  • the heat sink is made of copper, copper alloy or aluminum alloy.
  • the heat radiating fins extend along the direction of the fan air outlet, and the heat radiating fins are parallel to each other or radial.
  • the heat dissipating device further includes one or more guide fins, the guide fins are formed on a substrate and disposed outside the fan air outlet, and the guide fins form one or more guide air ducts.
  • the heat dissipation device includes one or more drainage fins, and the drainage fins are formed on the substrate and form one or more drainage air ducts.
  • each of the drainage fins is connected to a heat sink, or each of the drainage fins is integrally formed with a heat sink.
  • the plurality of drainage pieces are arranged at intervals to form a plurality of drainage air ducts.
  • an unmanned aerial vehicle including:
  • a housing which includes an accommodation space inside;
  • An electronic device housed in the accommodation space;
  • a heat radiating device which is contained in the accommodating space and used for taking away the heat generated by the electronic device;
  • the heat dissipating device comprises a heat-conducting fan
  • the thermally conductive fan includes a base, a housing, and a fan blade
  • the shell is surrounded by a top surface and four sides, and is fixedly connected to the base to form a cavity.
  • the fan blade is rotatably installed in the cavity.
  • the shell is opposite to the base.
  • a fan inlet is formed on the top surface, a fan outlet is formed on one side, the base is made of a thermally conductive material, and at least a part of the base is attached to the electronic device;
  • An air inlet and an air outlet are formed on the casing, the air inlet is located upstream of the fan air inlet, and the air outlet is located downstream of the fan air outlet.
  • the base is made of copper, copper alloy or aluminum alloy.
  • the heat dissipation device further includes a plurality of heat sinks, and the heat sinks are formed on a substrate and disposed outside the air outlet of the fan.
  • the base is integrally formed with the substrate.
  • the substrate of the heat sink is in direct contact with the electronic device.
  • the height of the heat sink is equal to or greater than the height of the fan air outlet.
  • the heat sink is made of copper, copper alloy or aluminum alloy.
  • the heat radiating fins extend along the direction of the fan air outlet, and the heat radiating fins are parallel to each other or radial.
  • the heat dissipating device includes one or more guide fins, the guide fins are formed on a substrate and disposed outside the fan air outlet, and the guide fins form one or more guide air ducts, The airflow is directed to the air outlet of the casing.
  • the heat dissipation device includes one or more drainage fins, the drainage fins are formed on the substrate and form one or more drainage air ducts for guiding airflow to the air outlet of the casing.
  • the plurality of drainage pieces are arranged at intervals to form a plurality of drainage air ducts.
  • each of the drainage fins is connected to a heat sink, or each of the drainage fins is integrally formed with a heat sink.
  • the air inlet of the casing is disposed at a front portion and / or at least one side portion of the casing. Further, the air outlet of the casing is disposed at a rear portion and / or at least one side portion of the casing. Further, the air outlet of the casing is disposed downstream of the fan air outlet.
  • the disclosure directly introduces the heat generated by the heat source into the fan, and takes the heat away by the wind generated by the fan. Because the direct heat conduction is used, the volume of the heat sink can be reduced, so the structure of the heat sink is compact and the quality is small; Directly blowing the heat source, the air path is relatively simple, can avoid complicated air path design, can effectively avoid heat accumulation, and significantly reduce the temperature.
  • FIG. 1 is a side view of a heat sink in an embodiment of the present disclosure
  • FIG. 2 is a front view of a heat dissipation device in an embodiment of the present disclosure
  • FIG. 3 is a perspective view of a heat sink in an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a heat dissipation device in another embodiment of the present disclosure.
  • 5A and 5B are bottom views of an unmanned aerial vehicle in an embodiment of the present disclosure.
  • FIG. 6 is a perspective view of an unmanned aerial vehicle in the embodiment of the present disclosure.
  • references to “some embodiments”, “embodiments”, “an embodiment”, “an example”, or “examples” mean: described in conjunction with the embodiments or examples Particular features, structures, or characteristics of are included in at least one embodiment of the present disclosure. Therefore, the terms “in some embodiments”, “in an embodiment”, “an example”, or “example” appearing everywhere in this disclosure do not necessarily all refer to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and / or subcombination in one or more embodiments or examples. In addition, those skilled in the art will understand that the term “and / or” used in the present disclosure includes one or more related listed items and all combinations of items.
  • the present disclosure combines a traditional heat-conducting plate with a heat-dissipating fan.
  • the base of the fan is made of a heat-conducting material.
  • the base can conduct the heat generated by the heating components to the vicinity of the fan blades, and send the heat through the airflow generated by the fan blades. Achieve good heat dissipation in a small space.
  • an embodiment of the present disclosure provides a heat dissipation device 100 including a thermally conductive fan 10 including a base 11, a housing 12, and a fan blade 13;
  • the base 11 is made of a thermally conductive material, which can conduct heat generated by the electronic devices attached to the lower surface of the base 11 to the vicinity of the fan blade 13.
  • the thermally conductive material can be copper, copper alloy, or aluminum alloy.
  • the outer shell 12 is surrounded by a top surface and four sides to form a fixed connection with the base 11 to form a cavity.
  • a fan air inlet 14 is formed on the upper surface of the outer shell 12 opposite to the base, and cold air from the outside enters the cavity.
  • the fan blade 13 is rotatably installed in the cavity.
  • the fan blade 13 may be installed in the cavity through a mounting bracket.
  • a fan air outlet 15 is formed on one side of the casing 12. With the rotation of the fan blades 13, cold air can conduct the heat from the base 11 to the vicinity of the fan blades 13 out of the fan air outlets 15, so as to achieve the electronic components. Cooling effect.
  • the heat dissipation device 100 may further include a plurality of heat sinks 16, and a heat dissipation air passage is formed between the heat sinks 16 for airflow to pass through.
  • the heat sink 16 is formed on a substrate 17 and is disposed outside the fan air outlet 15. The heat sink 16 can increase the heat dissipation area, so that the gas flowing out of the heat-conducting fan 10 assists the heat-generating electronic components around the heat sink 16 to dissipate heat.
  • the lower surface of the base 11 is attached to the electronic device 18, and the lower surface of the substrate 17 may be attached to the electronic device 18, or when the area of the electronic device 18 is small, the lower surface of the substrate 17 It may not be bonded to the electronic device 18.
  • the electronic device 18 may include one or more heat-generating electronic devices.
  • the substrate 17 and the heat sink 16 may be integrally formed, or the heat sink 16 may be fixed to the substrate 17 by welding or the like.
  • the substrate 17 and the heat sink 16 may be made of the same or different thermally conductive materials.
  • the substrate 17 and the heat sink 16 can be made of a thermally conductive material such as copper, copper alloy, or aluminum alloy, respectively.
  • the width of the substrate 17 is greater than or equal to the width of the fan air outlet 15, and the number and interval of the heat sinks 16 are determined by the number and heat generation of the electronic devices.
  • the number of the electronic devices 18 is large and the heat generation is high.
  • the number of heat sinks 16 may be appropriately increased or the interval between the heat sinks 16 may be reduced.
  • the height of the heat sink 16 may be greater than or equal to the height of the fan air outlet 15, which may be beneficial to forming a fixed air duct and enhancing the heat dissipation effect.
  • the height of the heat sink 16 may be smaller than the height of the fan outlet 15.
  • the fins 16 extend in the same direction as the fan outlet 15, and the fins 16 are parallel to each other.
  • the heat sink 16 may be provided in other ways.
  • the heat sink 16 may be radial, and the heat sink 16 extends along the direction of the fan air outlet 15.
  • the heat dissipating device 100 includes one or more air guide fins 19 formed on the substrate 17, and the plurality of air guide fins 19 are disposed outside the fan air outlet 15 and form one or more air guide ducts for The airflow discharged from the fan outlet 15 is guided to an appropriate position.
  • the heat dissipating device 100 is provided with a plurality of heat sinks 16 and a plurality of air guide fins 19.
  • the air guide fins 19 form a plurality of air guide ducts for guiding the airflow from the heat radiating ducts to a proper position.
  • the relative positions of the drain fins 19 and the heat sink 16 can be arbitrarily adjusted as needed.
  • the drain fins 19 can be connected to one of the heat sinks 16 at this time. That is, the distal end of the heat sink 16 is extended in a specific direction to form a drain sheet 19.
  • the drain sheet 19 may be spaced a certain distance from the heat sink 16.
  • the number of the drainage pieces 19 is four, and the four drainage pieces are integrally formed with four heat sinks, wherein the drainage pieces 191 and 192 form an air duct, and the drainage pieces are formed integrally.
  • 193 and the deflector 194 form another air duct, and the deflector 192 and the deflector 193 are spaced a certain distance apart to form a third air duct, so that the airflow discharged from the fan outlet 5 is divided into 3 airflows, of which the left and right airflows are They are respectively guided to the left and right sides of the fan outlet 15, and the direction of the intermediate airflow remains unchanged, so as to further dissipate the electronic components in the outflow direction.
  • the deflector 192 and the deflector 193 are formed integrally with the same heat sink 16 respectively, so that two air ducts can be formed, so that the airflow discharged from the fan outlet 15 is divided into two left and right airflows, and two airflows. It is guided to the left and right sides of the fan outlet 15 respectively.
  • the heat dissipating device 100 includes four air diffusing fins 19, but does not include the heat radiating fins 16.
  • the four air deflecting fins 19 are provided on the outside of the fan air outlet 15 to form two air ducts, so that the fan air outlet 15 is discharged.
  • the airflow is divided into left and right airflows, and the two airflows are respectively guided to the left and right sides of the fan outlet 15.
  • the shape of the drainage sheet can be any suitable shape, and can be specifically determined according to the direction of the air outlet with respect to the heat sink, for example, it can be an arc shape, a linear shape, or the like.
  • the base 11 and the substrate 17 are integrally formed.
  • the housing 12 and the heat sink 16 are disposed on the same base 11 (the substrate 17), and the heat sink 16 is disposed on the housing 12
  • the fan outlet 15 on the side extends outside the fan outlet 15.
  • the base 11 (substrate 17) is bonded to the electronic device 18. It should be noted that the bonding in the present disclosure includes a case where the base 11 and the electronic device 18 are bonded through a thermally conductive medium (such as thermally conductive silicone).
  • a thermally conductive medium such as thermally conductive silicone
  • the base 11 and the base plate 17 are separated, the base 11 and the base plate 17 may be fixed together by a screw method, and the base 11 and the base plate 17 are bonded to the electronic device 18.
  • the fan base as a thermally conductive sheet
  • the heat generated by the heating device is transmitted to the vicinity of the fan blade, and then the fan is used to send out the heat, which can reduce the quality of the heat dissipation system and avoid complicated air path design and heat accumulation.
  • the fan base By using a heat-conducting fan and a heat sink, the heat dissipation effect can be enhanced and the temperature of the electronic device can be effectively reduced.
  • the disclosure is particularly suitable for heat dissipation occasions where the heat source is concentrated, the heat dissipation space is small, and the temperature is strictly required.
  • the structure indicated by reference numeral 48 is used to fix the fan and the heat sink as a whole, and the structure indicated by reference numeral 49 locks the heat sink and the fan to the circuit board on which the electronic device is located.
  • an embodiment of the present disclosure provides an unmanned aerial vehicle 200.
  • the unmanned aerial vehicle 200 includes the heat dissipation device 100, and the heat dissipation device 100 includes a heat-conducting fan 10.
  • the aircraft includes a fuselage 01, a plurality of arms 02 extending outward from the fuselage, a plurality of rotors 03 mounted on the plurality of arms, a gimbal 04, a vision sensor 05, and electronic devices located in the fuselage.
  • the electronic device may include one or more heat-generating electronic components; the vision sensor includes a front-view sensor, a down-view sensor, and a rear-view sensor.
  • 33 denotes a front-view bracket
  • 34 denotes a GPS power module
  • 35 denotes GPS
  • 36 denotes a rear-view bracket.
  • the fuselage includes a casing 21, and a receiving space is formed inside the casing 21.
  • An electronic device is disposed in the receiving space.
  • the electronic device is mounted on a circuit board.
  • the heat dissipating device 100 is accommodated in the accommodating space for taking away the heat generated by the electronic device, and at least a part of the base of the heat-conducting fan is attached to the electronic device.
  • the housing 21 is formed with an air inlet 22 and an air outlet 23, and electronic components are concentratedly distributed between the air inlet 22 and the air outlet 23.
  • the air inlet 22 and the air outlet 23 may be independently provided on the top, bottom, front, side, or tail of the casing, respectively.
  • the air inlet 22 is located upstream of the fan air inlet 14, and the air outlet 23 is located downstream of the fan air outlet 15.
  • the air outside the casing 21 enters the casing through the air inlet 22 and then enters the fan inlet 14.
  • the air can conduct the heat from the base 11 to the vicinity of the fan blades 13 through the fan outlet 15 and pass through the outlet of the casing 21. 23
  • the casing is discharged, so that the heat generated by the electronic components in the casing is dissipated to the outside of the casing, and the purpose of cooling the electronic components inside the casing is achieved.
  • FIG. 6 04 denotes a pan / tilt head
  • a front-view binocular (front-view sensor) 51 is provided above
  • a bottom-view binocular (down-view sensor) 52 is provided on the abdomen of the fuselage 01.
  • TOF 54 is provided.
  • the air inlets 221 and 222 of the housing 21 are provided on both sides of the front of the housing, and the air outlet 23 of the housing is provided at the rear of the rear of the housing, and is provided at the fan outlet 5 Downstream.
  • the fan air outlet 5 is close to the air outlet 23 of the casing 21, so that the airflow from the fan air outlet 5 can be quickly discharged from the casing 21.
  • the heat sink 100 further includes a plurality of heat sinks 16 formed on a substrate 17 and disposed outside the fan air outlet 15.
  • a fixed cooling air duct is formed between the fins 16, which can increase the heat dissipation area, so that the airflow discharged from the fan outlet 5 can further dissipate the heat-generating electronic devices near the fins 16.
  • the air inlets 221 and 222 of the housing 21 are provided on both sides of the front portion of the housing, the air outlet 23 of the housing is provided at the rear portion of the rear portion of the housing, and the outlet of the heat dissipation air duct is close to The air outlet 23 of the casing 21 can guide airflow to the air outlet 23 of the casing 21.
  • the heat sink 100 includes a plurality of heat sinks 16 and one or more air guide fins 19 that form one or more air guide ducts for guiding airflow to the housing.
  • the air outlet 23 of 21 allows the airflow to flow regularly in the casing and improves heat dissipation efficiency.
  • the deflectors 9 of the heat dissipation device 100 form three diversion ducts, and the two left and right diversion ducts guide the airflow from the heat dissipation ducts to the air outlets 231 and 232.
  • the middle drainage air duct guides the airflow to the air outlets 233 and 234 at the rear of the casing 21, so that the airflow further dissipates the passing electronic devices during the flow to the outlet.
  • the drainage fins of the heat dissipation device 100 form two drainage air ducts, and the two drainage air ducts guide airflow from the radiation air ducts to the air outlets 231 and 232 on both sides of the casing 21.
  • the heat sink 100 includes a plurality of fins 19 but does not include a fin 16.
  • the plurality of fins 19 form a plurality of air ducts, and the plurality of air ducts direct the airflow from the fan outlet 15 to The air outlet 23 on the casing 21.
  • the heat radiating device 100 can directly introduce the heat generated by the electronic devices in the UAV 200 to the vicinity of the fan blade 13, and take out the heat through the airflow generated by the fan blade 13, and finally the airflow passes through the casing of the UAV The upper air outlet 23 is discharged.
  • a heat sink 16 is further provided at the outlet of the heat-conducting fan 10 to further dissipate the electronic components around the heat sink 16, and the airflow passing through the heat sink 16 is shunted by the flow guide 19 and exits from a plurality
  • the tuyere 23 is discharged from the unmanned aerial vehicle, and further dissipates heat from surrounding electronic devices during the process of flowing out from the deflector.
  • the heat dissipation device of the present disclosure has small mass, avoids complicated air path design and heat accumulation, thereby helping to reduce the overall quality of the unmanned aerial vehicle and effectively lowering the temperature of the unmanned aerial vehicle.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Remote Sensing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un dispositif de dissipation de chaleur qui comprend un ventilateur thermoconducteur. Le ventilateur thermoconducteur comprend une base, un boîtier et des pales de ventilateur. Le boîtier est enserré par une surface supérieure et quatre surfaces latérales et est relié de manière fixe à la base pour former une cavité. Les pales de ventilateur sont installées rotatives dans la cavité. Une entrée d'air de ventilateur est formée au niveau de la surface supérieure du boîtier faisant face à la base. Une sortie d'air de ventilateur est formée au niveau de l'une des deux surfaces latérales du boîtier. La base est constituée d'un matériau thermoconducteur. Selon l'invention, la chaleur générée par une source de chaleur est directement guidée vers un ventilateur, de sorte que l'air produit par le ventilateur transfère la chaleur. Étant donné que l'invention utilise une conduction thermique directe, une zone d'un élément de dissipation de chaleur peut être réduite, ce qui permet d'obtenir un dispositif de dissipation de chaleur ayant une structure compacte et une petite masse. De plus, étant donné que l'air est directement dirigé vers une source de chaleur, un trajet d'air est plus simple, ce qui permet d'empêcher une conception de trajet d'air complexe, d'empêcher efficacement l'accumulation de chaleur et d'abaisser significativement une température.
PCT/CN2018/092867 2018-06-26 2018-06-26 Dispositif de dissipation de chaleur et véhicule aérien sans pilote en disposant WO2020000182A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201880017083.1A CN110506000A (zh) 2018-06-26 2018-06-26 散热装置及具有该散热装置的无人机
PCT/CN2018/092867 WO2020000182A1 (fr) 2018-06-26 2018-06-26 Dispositif de dissipation de chaleur et véhicule aérien sans pilote en disposant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/092867 WO2020000182A1 (fr) 2018-06-26 2018-06-26 Dispositif de dissipation de chaleur et véhicule aérien sans pilote en disposant

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WO2020000182A1 true WO2020000182A1 (fr) 2020-01-02

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CN113093886A (zh) * 2020-01-08 2021-07-09 苏州溢博伦光电仪器有限公司 一种具有显示功能的计算机芯片散热装置

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WO2021189310A1 (fr) * 2020-03-25 2021-09-30 深圳市大疆创新科技有限公司 Dispositif électronique et ventilateur centrifuge
CN113543608B (zh) * 2021-08-18 2024-03-19 广东美的厨房电器制造有限公司 风扇座、风道组件及烹饪器具
CN113597233B (zh) * 2021-09-28 2022-01-04 北京远度互联科技有限公司 散热装置、控制装置及使用其控制的无人机

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US20100032136A1 (en) * 2008-08-06 2010-02-11 Kwo Ger Metal Technology, Inc Cooler module
CN103906410A (zh) * 2012-12-28 2014-07-02 鸿富锦精密工业（深圳）有限公司 散热模组
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