Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/1075—Partially aromatic polyimides
  • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
  • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/18—Manufacture of films or sheets
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
  • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
  • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
  • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Definitions

• the present disclosure relates to novel polymeric compounds.
• the disclosure further relates to methods for preparing such polymeric compounds and electronic devices having at least one layer comprising these materials.
• Polyimides represent a class of polymeric compounds that has been widely used in a variety of electronics applications. They can serve as a flexible replacement for glass in electronic display devices provided that they have suitable properties. These materials can function as a component of Liquid Crystal Displays (“LCDs”), where their modest consumption of electrical power, light weight, and layer flatness are critical properties for effective utility.
• LCDs Liquid Crystal Displays
• Other uses in electronic display devices that place such parameters at a premium include device substrates, substrates for color filter sheets, cover films, touch screen panels, and others.
• OLEDs organic light emitting diode
• OLEDs are promising for many display applications because of their high power conversion efficiency and applicability to a wide range of end-uses. They are increasingly being used in cell phones, tablet devices, handheld / laptop computers, and other commercial products. These applications call for displays with high information content, full color, and fast video rate response time in addition to low power consumption.
• Polyimide films generally possess sufficient thermal stability, high glass transition temperature, and mechanical toughness to merit consideration for such uses. Also, polyimides generally do not develop haze when subject to repeated flexing, so they are often preferred over other transparent substrates like polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) in flexible display applications.
• PET polyethylene terephthalate
• PEN polyethylene naphthalate
• polyimides are generally stiff, highly aromatic materials; and the polymer chains tend to orient in the plane of the film / coating as the film / coating is being formed. This leads to differences in refractive index in the parallel vs. perpendicular directions of the film (birefringence) which produces optical retardation that can negatively impact display performance. If polyimides are to find additional applications in the displays market, a solution is needed to maintain their desirable properties, while at the same time improving their optical transparency and reducing the amber color and birefringence that leads to optical retardation.
• liquid composition having a solids content of at least 10 wt% and a viscosity of at least 3000 about cps, said composition comprising
• R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues
• R b is the same or different at each occurrence and represents one or more aromatic diamine residues
• R b wherein 30-100 mol% of R b has Formula II or Formula III
• R 1 and R 2 are the same or different and are selected from the group consisting of F, R f , and OR f ;
• R f is a C 1 -3 perfluoroalkyl
• R 1 and R 2 are adjacent to a point of attachment; and (b) a high-boiling aprotic solvent.
• polyimide film where the polyimide has a number average molecular weight of at least 100,000, and comprises a repeat unit structure of Formula V
• R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and R b is the same or different at each occurrence and represents one or more aromatic diamine residues;
• R b wherein 30-100 mol% of R b has Formula II or Formula III
• R 1 and R 2 are the same or different and are selected from the group consisting of F, R f , and OR f ;
• R f is a C1 -3 perfluoroalkyl
• polyimide film is prepared according to a method comprising the following steps in order and without repeating:
• tetracarboxylic acid components and one or more diamine components in a high-boiling, aprotic solvent onto a matrix; soft-baking the coated matrix;
• polyimide film where the polyimide has a weight average molecular weight of at least 100,000, and comprises a repeat unit structure of Formula V
• R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and R b is the same or different at each occurrence and represents one or more aromatic diamine residues;
• R b wherein 30-100 mol% of R b has Formula II or Formula III
• R 1 and R 2 are the same or different and are selected from the group consisting of F, R f , and OR f ;
• R f is a C 1 -3 perfluoroalkyl
• polyimide film is prepared according to a method comprising the following steps in order and without repeating:
• tetracarboxylic acid components and one or more diamine components in a high-boiling, aprotic solvent onto a matrix; soft-baking the coated matrix;
• an electronic device having at least one layer comprising the above-described polyimide film.
• an organic electronic device such as an OLED
• the organic electronic device contains a flexible replacement for glass as disclosed herein.
• FIG. 1 includes an illustration of one example of a polyimide film that can act as a flexible replacement for glass.
• FIG. 2 includes an illustration of one example of an electronic device that includes a flexible replacement for glass.
• composition comprising (a) the polyamic acid having Formula I and (b) a high-boiling, aprotic solvent.
• the flexible replacement for glass is a polyimide film having the repeat unit of Formula IV.
• an electronic device having at least one layer comprising a polyimide film having the repeat unit of Formula IV.
• an organic electronic device such as an OLED, wherein the organic electronic device contains a flexible
• R, R a , R b , R’, R are generic designations and may be the same as or different from those defined in the formulas.
• alignment layer is intended to mean a layer of organic polymer in a liquid-crystal device (LCD) that aligns the molecules closest to each plate as a result of its being rubbed onto the LCD glass in one preferential direction during the LCD manufacturing process.
• LCD liquid-crystal device
• alkyl includes branched and straight- chain saturated aliphatic hydrocarbon groups. Unless otherwise indicated, the term is also intended to include cyclic groups. Examples of alkyl groups include methyl, ethyl, propyl, isopropyl, isobutyl, secbutyl, tertbutyl, pentyl, isopentyl, neopentyl, cyclopentyl, hexyl, cyclohexyl, isohexyl and the like.
• the term“alkyl” further includes both substituted and
• the alkyl group may be mono-, di- and tri-substituted.
• One example of a substituted alkyl group is trifluoromethyl.
• Other substituted alkyl groups are formed from one or more of the substituents described herein.
• alkyl groups have 1 to 20 carbon atoms.
• the group has 1 to 6 carbon atoms.
• the term is intended to include heteroalkyl groups. Heteroalkyl groups may have from 1-20 carbon atoms.
• the term“aprotic” refers to a class of solvents that lack an acidic hydrogen atom and are therefore incapable of acting as hydrogen donors.
• Common aprotic solvents include alkanes, carbon tetrachloride (CCI4), benzene, dimethyl formamide (DMF), N-methyl-2-Pyrrolidone (NMP), dimethylacetamide (DMAc), and many others.
• aromatic compound is intended to mean an organic compound comprising at least one unsaturated cyclic group having 4n+2 delocalized pi electrons.
• the term is intended to encompass both aromatic compounds having only carbon and hydrogen atoms, and heteroaromatic compounds wherein one or more of the carbon atoms within the cyclic group has been replaced by another atom, such as nitrogen, oxygen, sulfur, or the like.
• aryl or“aryl group” a moiety formed by removal of one or more hydrogen (“H”) or deuterium (“D”) from an aromatic compound.
• the aryl group may be a single ring (monocyclic) or have multiple rings (bicyclic, or more) fused together or linked covalently.
• A“hydrocarbon aryl” has only carbon atoms in the aromatic ring(s).
• A“heteroaryl” has one or more heteroatoms in at least one aromatic ring.
• hydrocarbon aryl groups have 6 to 60 ring carbon atoms; in some embodiments, 6 to 30 ring carbon atoms.
• heteroaryl groups have from 4-50 ring carbon atoms; in some
• alkoxy is intended to mean the group -OR, where R is alkyl.
• aryloxy is intended to mean the group -OR, where R is aryl.
• R’ and R is independently an optionally substituted alkyl, cycloalkyl, or aryl group.
• R’ and R together with the nitrogen atom to which they are bound, can form a ring system in certain embodiments.
• Substituents may also be crosslinking groups.
• amine is intended to mean a compound that contains a basic nitrogen atom with a lone pair.
• amino refers to the functional group -NH 2 , -NHR, or -NR 2 , where R is the same or different at each occurrence and can be an alkyl group or an aryl group.
• diamine is intended to mean a compound that contains two basic nitrogen atoms with associated lone pairs.
• aromatic diamine is intended to mean an aromatic compound having two amino groups.
• pent diamine is intended to mean a diamine wherein the two basic nitrogen atoms and associated lone pairs are asymmetrically disposed about the center of symmetry of the corresponding compound or functional group, e.g. m-phenylenediamine:
• aromatic diamine residue is intended to mean the moiety bonded to the two amino groups in an aromatic diamine.
• aromatic diisocyanate residue is intended to mean the moiety bonded to the two isocyanate groups in an aromatic diisocyanate compound. This is further illustrated below.
• diamine residue and“diisocyanate residue” are intended to mean the moiety bonded to two amino groups or two isocyanate groups, respectively, where the moiety can be aromatic or aliphatic.
• b * is intended to mean the b * axis in the CIELab Color Space that represents the yellow / blue opponent colors. Yellow is represented by positive b * values, and blue is represented by negative b * values. Measured b * values may be affected by solvent, particularly since solvent choice may affect color measured on materials exposed to high- temperature processing conditions. This may arise as the result of inherent properties of the solvent and/or properties associated with low levels of impurities contained in various solvents. Particular solvents are often preselected to achieve desired b * values for a particular application.
• birefringence is intended to mean the difference in the refractive index in different directions in a polymer film or coating. This term usually refers to the difference between the x- or y-axis (in-plane) and the z-axis (out-of-plane) refractive indices.
• charge transport when referring to a layer, material, member, or structure is intended to mean such layer, material, member, or structure facilitates migration of such charge through the thickness of such layer, material, member, or structure with relative efficiency and small loss of charge.
• Hole transport materials facilitate positive charge; electron transport materials facilitate negative charge.
• light-emitting materials may also have some charge transport properties, the term “charge transport layer, material, member, or structure” is not intended to include a layer, material, member, or structure whose primary function is light emission.
• compound is intended to mean an electrically uncharged substance made up of molecules that further include atoms, wherein the atoms cannot be separated from their corresponding molecules by physical means without breaking chemical bonds.
• the term is intended to include oligomers and polymers.
• linear coefficient of thermal expansion (DI_ / Lo) / DT
• Measured CTE values disclosed herein are made via known methods during the first or second heating scan.
• the understanding of the relative expansion / contraction characteristics of materials can be an important consideration in the fabrication and/or reliability of electronic devices.
• dopant is intended to mean a material, within a layer including a host material, that changes the electronic characteristic(s) or the targeted wavelength(s) of radiation emission, reception, or filtering of the layer compared to the electronic characteristic(s) or the wavelength(s) of radiation emission, reception, or filtering of the layer in the absence of such material.
• electroactive refers to a layer or a material, is intended to indicate a layer or material which electronically facilitates the operation of the device.
• electroactive materials include, but are not limited to, materials which conduct, inject, transport, or block a charge, where the charge can be either an electron or a hole, or materials which emit radiation or exhibit a change in concentration of electron-hole pairs when receiving radiation.
• inactive materials include, but are not limited to, planarization materials, insulating materials, and environmental barrier materials.
• tensile elongation or“tensile strain” is intended to mean the percentage increase in length that occurs in a material before it breaks under an applied tensile stress. It can be measured, for example, by ASTM Method D882.
• the prefix“fluoro” is intended to indicate that one or more hydrogens in a group have been replaced with fluorine.
• glass transition temperature is intended to mean the temperature at which a reversible change occurs in an amorphous polymer or in amorphous regions of a semi crystalline polymer where the material changes suddenly from a hard, glassy, or brittle state to one that is flexible or elastomeric. Microscopically, the glass transition occurs when normally-coiled, motionless polymer chains become free to rotate and can move past each other. T g ’s may be measured using differential scanning calorimetry (DSC), thermo-mechanical analysis (TMA), or dynamic-mechanical analysis (DMA), or other methods.
• DSC differential scanning calorimetry
• TMA thermo-mechanical analysis
• DMA dynamic-mechanical analysis
• hetero indicates that one or more carbon atoms have been replaced with a different atom.
• the heteroatom is O, N, S, or combinations thereof.
• high-boiling is intended to indicate a boiling point greater than 130°C.
• the term“host material” is intended to mean a material to which a dopant is added.
• the host material may or may not have electronic characteristic(s) or the ability to emit, receive, or filter radiation. In some embodiments, the host material is present in higher concentration.
• isothermal weight loss is intended to mean a material’s property that is directly related to its thermal stability. It is generally measured at a constant temperature of interest via thermogravimetric analysis (TGA). Materials that have high thermal stability generally exhibit very low percentages of isothermal weight loss at the required use or processing temperature for the desired period of time and can therefore be used in applications at these temperatures without significant loss of strength, outgassing, and/or change in structure.
• liquid composition is intended to mean a liquid medium in which a material is dissolved to form a solution, a liquid medium in which a material is dispersed to form a dispersion, or a liquid medium in which a material is suspended to form a suspension or an emulsion.
• matrix is intended to mean a foundation on which one or more layers is deposited in the formation of, for example, an electronic device.
• Non-limiting examples include glass, silicon, and others.
• the term“1 % TGA Weight Loss” is intended to mean the temperature at which 1 % of the original polymer weight is lost due to decomposition (excluding absorbed water).
• optical retardation is intended to mean the difference between the average in-plane refractive index and the out-of- plane refractive index (i.e. , the birefringence), this difference then being multiplied by the thickness of the film or coating.
• Optical retardation is typically measured for a given frequency of light, and the units are reported in nanometers.
• organic electronic device or sometimes“electronic device” is herein intended to mean a device including one or more organic semiconductor layers or materials.
• particle content is intended to mean the number or count of insoluble particles that is present in a solution. Measurements of particle content can be made on the solutions themselves or on finished materials (pieces, films, etc.) prepared from those films. A variety of optical methods can be used to assess this property.
• photoactive refers to a material or layer that emits light when activated by an applied voltage (such as in a light emitting diode or chemical cell), that emits light after the absorption of photons (such as in down-converting phosphor devices), or that responds to radiant energy and generates a signal with or without an applied bias voltage (such as in a photodetector or a photovoltaic cell).
• an applied voltage such as in a light emitting diode or chemical cell
• photons such as in down-converting phosphor devices
• an applied bias voltage such as in a photodetector or a photovoltaic cell
• polyamic acid solution refers to a solution of a polymer containing amic acid units that have the capability of intramolecular cyclization to form imide groups.
• polyimide refers to condensation polymers resulting from the reaction of one or more bifunctional carboxylic acid components with one or more primary diamines or diisocyanates. They contain the imide structure -CO-NR-CO- as a linear or heterocyclic unit along the main chain of the polymer backbone.
• the term“satisfactory,” when regarding a materials property or characteristic, is intended to mean that the property or characteristic fulfills all requirements / demands for the material in-use.
• an isothermal weight loss of less than 1 % at 350 °C for 3 hours in nitrogen can be viewed as a non-limiting example of a“satisfactory” property in the context of the polyimide films disclosed herein.
• soft-baking is intended to mean a process commonly used in electronics manufacture wherein coated materials are heated to drive off solvents and solidify a film. Soft-baking is commonly performed on a hot plate or in exhausted oven at temperatures between 90 °C and 1 10 °C as a preparation step for subsequent thermal treatment of coated layers or films.
• substrate refers to a base material that can be either rigid or flexible and may include one or more layers of one or more materials, which can include, but are not limited to, glass, polymer, metal or ceramic materials or combinations thereof.
• the substrate may or may not include electronic components, circuits, or conductive members.
• siloxane refers to the group R 3 SiOR2Si-, where R is the same or different at each occurrence and is H, C1 -20 alkyl, fluoroalkyl, or aryl. In some embodiments, one or more carbons in an R alkyl group are replaced with Si.
• sioxy refers to the group RsSiO-, where R is the same or different at each occurrence and is H, C1-20 alkyl, fluoroalkyl, or aryl.
• sil refers to the group R 3 S1-, where R is the same or different at each occurrence and is H, C1 -20 alkyl, fluoroalkyl, or aryl. In some embodiments, one or more carbons in an R alkyl group are replaced with Si.
• spin coating is intended to mean a process used to deposit uniform thin films onto flat substrates. Generally, a small amount of coating material is applied on the center of the substrate, which is either spinning at low speed or not spinning at all. The substrate is then rotated at specified speeds in order to spread the coating material uniformly by centrifugal force.
• laser particle counter test refers to a method used to assess the particle content of polyamic acid and other polymeric solutions whereby a representative sample of a test solution is spin coated onto a 5” silicon wafer and soft baked / dried. The film thus prepared is evaluated for particle content by any number of standard measurement techniques. Such techniques include laser particle detection and others known in the art.
• tensile modulus is intended to mean the measure of the stiffness of a solid material that defines the initial relationship between the stress (force per unit area) and the strain (proportional deformation) in a material like a film. Commonly used units are giga pascals (GPa).
• tetracarboxylic acid component is intended to mean any one or more of the following: a tetracarboxylic acid, a tetracarboxylic acid monoanhydride, a tetracarboxylic acid dianhydride, a tetracarboxylic acid monoester, and a tetracarboxylic acid diester.
• tetracarboxylic acid component residue is intended to mean the moiety bonded to the four carboxy groups in a tetracarboxylic acid component. This is further illustrated below.
• transmittance refers to the percentage of light of a given wavelength impinging on a film that passes through the film so as to be detectable on the other side.
• Light transmittance measurements in the visible region are particularly useful for characterizing film-color characteristics that are most important for understanding the properties-in-use of the polyimide films disclosed herein.
• yellowness index refers to the magnitude of yellowness relative to a standard.
• a positive value of Yl indicates the presence, and magnitude, of a yellow color. Materials with a negative Yl appear bluish.
• Yl can be solvent dependent.
• the magnitude of color introduced using DMAC as a solvent may be different than that introduced using NMP as a solvent. This may arise as the result of inherent properties of the solvent and/or properties associated with low levels of impurities contained in various solvents. Particular solvents are often preselected to achieve desired Yl values for a particular application.
• a substituent bond passes through one or more rings as shown below,
• substituent R may be bonded at any available position on the one or more rings.
• the phrase“adjacent to,” when used to refer to layers in a device, does not necessarily mean that one layer is immediately next to another layer.
• the phrase“adjacent R groups,” is used to refer to R groups that are next to each other in a chemical formula (i.e., R groups that are on atoms joined by a bond). Exemplary adjacent R groups are shown below:
• “or” refers to an inclusive or and not to an exclusive or.
• a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
• R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and R b is the same or different at each occurrence and represents one or more aromatic diamine residues;
• R b wherein 30-100 mol% of R b has Formula II or Formula III
• R 1 and R 2 are the same or different and are selected from the group consisting of F, R f , and OR f ;
• R f is a Ci perfluoroalkyl
• R 1 and R 2 are adjacent to a point of attachment; and (b) a high-boiling aprotic solvent.
• the liquid composition is also referred to herein as the“polyamic acid solution”.
• the solids content is at least 12 wt%; in some embodiments, at least 15 wt%. In some embodiments, the solids content is 10-20 wt%.
• the viscosity is at least 5000 about cps; in some embodiments at least about 10,000 cps.
• R a represents a single tetracarboxylic acid component residue. In some embodiments of Formula I, R a represents two
• R a represents three
• R a represents four
• R a represents one or more tetracarboxylic acid dianhydride residues.
• aromatic tetracarboxylic acid dianhydrides include, but are not limited to, pyromellitic dianhydride (PMDA), 3, 3', 4,4'- biphenyl tetracarboxylic dianhydride (BPDA), 4,4'-oxydiphthalic anhydride (ODPA), 4,4'-hexafluoroiso-propylidenebisphthalic dianhydride (6FDA), 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), 3, 3', 4,4'- diphenylsulfone tetracarboxylic dianhydride (DSDA), 4,4'-bisphenol-A dianhydride (BPADA), hydroquinone diphthalic anhydride (HQDEA), ethylene glycol bis (trimellitic anhydride) (TMEG-100), 4-(2,5- dioxotetrahydrofuran-3-yl)-1 ,2,3,4-tetrahydronapt
• R’ and R is independently an optionally substituted alkyl, cycloalkyl, or aryl group.
• R’ and R together with the nitrogen atom to which they are bound, can form a ring system in certain embodiments.
• Substituents may also be crosslinking groups.
• R a represents one or more residues from tetracarboxylic acid dianhydrides selected from the group consisting of PMDA, BPDA, 6FDA, and BTDA.
• R a represents a PMDA residue.
• R a represents a BPDA residue. In some embodiments of Formula I, R a represents a 6FDA residue.
• R a represents a BTDA residue.
• R a represents a PMDA residue and a BPDA residue.
• R a represents a PMDA residue and a 6FDA residue.
• R a represents a PMDA residue and a BTDA residue.
• R a represents a BPDA residue and a 6FDA residue.
• R a represents a BPDA residue and a BTDA residue.
• R a represents a 6FDA residue and a BTDA residue.
• 30-100 mol% of R b represents a diamine residue having Formula II or Formula III, as shown above.
• 40-100 mol% of R b has Formula II; in some embodiments, 50-100 mol%; in some embodiments, 60-100 mol%; in some
• 70-100 mol% in some embodiments, 80-100 mol%; in some embodiments, 90-100 mol%; in some embodiments, 100 mol%.
• R 1 is F.
• R 1 is a C1 -3 perfluoroalkyl; in some embodiments trifluoromethyl.
• R 1 is a C1 -3 perfluoroalkoxy; in some embodiments trifluoromethoxy.
• R 1 R 2 .
• R 1 1 R 2 In some embodiments of Formula II, R 1 1 R 2 .
• R b represents a residue from a diamine selected from the group consisting of Compound IV-A through IV-F, shown below.
• R b represents a diamine residue having Formula II or Formula III and at least one additional diamine residue. In some embodiments of Formula I, R b represents a diamine residue having Formula II or Formula III and one additional diamine residue.
• R b represents a diamine residue having Formula II or Formula III and two additional diamine residues.
• R b represents a diamine residue having Formula II or Formula III and three additional diamine residues.
• the additional aromatic diamine is selected from the group consisting of p-phenylene diamine (PPD), 2,2'-dimethyl- 4,4'-diaminobiphenyl (m-tolidine), 3,3'-dimethyl-4,4'-diaminobiphenyl (o- tolidine), 3,3'-dihydroxy-4,4'-diaminobiphenyl (HAB), 9,9'-bis(4- aminophenyl)fluorene (FDA), o-tolidine sulfone (TSN), 2,3,5,6-tetramethyl- 1 ,4-phenylenediamine (TMPD), 2, 4-diamino-1 , 3, 5-trimethyl benzene (DAM), 3,3',5,5'-tetramethylbenzidine (3355TMB), 2,2'-bis(trifluoromethyl) benzidine (22TFMB or TFMB), 2,2-bis[4-(4-aminophenoxy)phenyl]prop
• PPD
• R b represents a diamine residue having Formula II or Formula III and at least one additional diamine residue, where the additional aromatic diamine is selected from the group consisting of PPD, 4,4’-ODA, 3,4’-ODA, TFMB, Bis-A-AF, Bis- AT-AF, and Bis-P.
• moieties resulting from monoanhydride monomers are present as end-capping groups.
• the monoanhydride monomers are selected from the group consisting of phthalic anhydrides and the like and derivatives thereof.
• the monoanhydrides are present at an amount up to 5 mol% of the total tetracarboxylic acid composition.
• moieties resulting from monoamine monomers are present as end-capping groups.
• the monoamine monomers are selected from the group consisting of aniline and the like and derivatives thereof.
• the monoamines are present at an amount up to 5 mol% of the total amine composition.
• the polyamic acid has a weight average molecular weight (Mw) greater than 100,000 based on gel permeation chromatography with polystyrene standards.
• the polyamic acid has a weight average molecular weight (Mw) greater than 150,000 based on gel permeation chromatography with polystyrene standards.
• the polyamic acid has a molecular weight (Mw) greater than 200,000 based on gel permeation chromatography with polystyrene standards.
• the polyamic acid has a weight average molecular weight (Mw) greater than 250,000 based on gel permeation chromatography with polystyrene standards. In some embodiments, the polyamic acid has a weight average molecular weight (Mw) greater than 300,000 based on gel permeation chromatography with polystyrene standards.
• the polyamic acid has a weight average molecular weight (Mw) between 100,000 and 400,000 based on gel permeation chromatography with polystyrene standards.
• the polyamic acid has a weight average molecular weight (M w ) between 200,000 and 400,000 based on gel permeation chromatography with polystyrene standards.
• the polyamic acid has a weight average molecular weight (Mw) between 250,000 and 350,000 based on gel permeation chromatography with polystyrene standards.
• the polyamic acid has a weight average molecular weight (Mw) between 200,000 and 300,000 based on gel permeation chromatography with polystyrene standards.
• any of the above embodiments for the polyamic acid can be combined with one or more of the other embodiments, so long as they are not mutually exclusive.
• the embodiment in which R a represents a PMDA residue can be combined with the embodiments in which R b has Formula II.
• the high-boiling aprotic solvent has a boiling point of 150°C or higher.
• the high-boiling aprotic solvent has a boiling point of 175°C or higher.
• the high-boiling aprotic solvent has a boiling point of 200°C or higher.
• the high-boiling aprotic solvent is a polar solvent. In some embodiments, the solvent has a dielectric constant greater than 20.
• high-boiling aprotic solvents include, but are not limited to, N-methyl-2-pyrrolidone (NMP), dimethyl acetamide (DMAc), dimethyl sulfoxide (DMSO), dimethyl formamide (DMF), y-butyrolactone, dibutyl carbitol, butyl carbitol acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate and the like, and combinations thereof.
• NMP N-methyl-2-pyrrolidone
• DMAc dimethyl acetamide
• DMSO dimethyl sulfoxide
• DMF dimethyl formamide
• y-butyrolactone dibutyl carbitol, butyl carbitol acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate and the like, and combinations thereof.
• the solvent is selected from the group consisting of NMP, DMAc, and DMF.
• the solvent is NMP.
• the solvent is N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl
• the solvent is DMF.
• the solvent is y-butyrolactone.
• the solvent is dibutyl carbitol.
• the solvent is butyl carbitol acetate.
• the solvent is diethylene glycol monoethyl ether acetate.
• the solvent is propylene glycol monoethyl ether acetate.
• more than one of the high-boiling aprotic solvents identified above is used in the liquid composition.
• additional cosolvents are used in the liquid composition.
• the polyamic acid solutions can optionally further contain any one of a number of additives.
• additives can be: antioxidants, heat stabilizers, adhesion promoters, coupling agents (e.g. silanes), inorganic fillers or various reinforcing agents so long as they don’t adversely impact the desired polyimide properties.
• the polyamic acid solutions can be prepared using a variety of available methods with respect to the introduction of the components (i.e. , the monomers and solvents). Some methods of producing a polyamic acid solution include:
• a polyamic acid solution can be obtained from any one of the polyamic acid solution preparation methods disclosed above.
• the polyamic acid solution can then be filtered one or more times in order to reduce the particle content.
• the polyimide film generated from such a filtered solution can show a reduced number of defects and thereby lead to superior performance in the electronics applications disclosed herein.
• An assessment of the filtration efficiency can be made by the laser particle counter test wherein a representative sample of the polyamic acid solution is cast onto a 5” silicon wafer. After soft baking / drying, the film is evaluated for particle content by any number of laser particle counting techniques on instruments that are commercially available and known in the art.
• the polyamic acid solution is prepared and filtered to yield a particle content of less than 40 particles as measured by the laser particle counter test.
• the polyamic acid solution is prepared and filtered to yield a particle content of less than 30 particles as measured by the laser particle counter test.
• the polyamic acid solution is prepared and filtered to yield a particle content of less than 20 particles as measured by the laser particle counter test.
• the polyamic acid solution is prepared and filtered to yield a particle content of less than 10 particles as measured by the laser particle counter test.
• the polyamic acid solution is prepared and filtered to yield particle content of between 2 particles and 8 particles as measured by the laser particle counter test.
• the polyamic acid solution is prepared and filtered to yield particle content of between 4 particles and 6 particles as measured by the laser particle counter test.
• polyamic acid compositions can be designated via the notation commonly used in the art.
• a polyamic acid having a tetracarboxylic acid component that is 100% ODPA, and a diamine component that is 90 mol% Bis-P and 10 mol% TFMB would be represented as:
• Polyimide Film There is provided a polyimide film made from the above-described polyamic acid solution.
• the polyimide has a repeat unit structure of Formula V
• R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and R b is the same or different at each occurrence and represents one or more aromatic diamine residues;
• R b wherein 30-100 mol% of R b has Formula II or Formula III
• R 1 and R 2 are the same or different and are selected from the group consisting of F, R f , and OR f ;
• R f is a C 1 -3 perfluoroalkyl
• both R 1 and R 2 are adjacent to a point of attachment; and further wherein the polyimide film is prepared according to a method comprising the following steps in order and without repeating:
• tetracarboxylic acid components and one or more diamine components in a high-boiling, aprotic solvent onto a matrix; soft-baking the coated matrix;
• the polyimide films are made by coating the above-described polyamic acid solution onto a substrate and subsequently imidizing. This can be accomplished by a thermal conversion process or a chemical conversion process. Any known coating method can be used.
• Some fluorinated diamines are known to have low reactivity.
• multiple polymerization steps are used.
• a polyamic acid solution is prepared with the low reactivity diamine, the solution is coated and imidized, the imidized product dissolved, recoated and reimidized. The additional dissolving, recoating and reimidizing steps are repeated several times.
• Polyimide films having sufficient molecular weight and good mechanical properties with single polymerization and imidization steps. Forming an imidized product, dissolving, recoating and reimidizing multiple times is not required with the polyamic acid solutions described herein.
• the polyimide polymer has a weight average molecular weight (Mw) greater than 100,000 based on gel permeation chromatography with polystyrene standards.
• the polyimide polymer has a weight average molecular weight (Mw) greater than 150,000 based on gel permeation chromatography with polystyrene standards.
• the polyimide polymer has a molecular weight (M w ) greater than 200,000 based on gel permeation chromatography with polystyrene standards.
• the polyimide polymer has a weight average molecular weight (Mw) greater than 250,000 based on gel permeation chromatography with polystyrene standards. In some embodiments of the polyimide film, the polyimide polymer has a weight average molecular weight (Mw) greater than 300,000 based on gel permeation chromatography with polystyrene standards.
• the polyimide polymer has a weight average molecular weight (Mw) between 100,000 and 400,000 based on gel permeation chromatography with polystyrene standards.
• the polyimide polymer has a weight average molecular weight (Mw) between 200,000 and 400,000 based on gel permeation chromatography with polystyrene standards.
• the polyimide polymer has a weight average molecular weight (Mw) between 250,000 and 350,000 based on gel permeation chromatography with polystyrene standards.
• the polyimide polymer has a weight average molecular weight (M w ) between 200,000 and 300,000 based on gel permeation chromatography with polystyrene standards.
• the in-plane coefficient of thermal expansion is less than 45 ppm/°C between 50 °C and 200 °C; in some embodiments, less than 30 ppm/°C; in some
• the glass transition temperature (T g ) is greater than 250 °C for a polyimide film cured at a temperature above 300 °C; in some embodiments, greater than 300 °C; in some embodiments, greater than 350 °C.
• the 1 % TGA weight loss temperature is greater than 350 °C; in some embodiments, greater than 400 °C; in some embodiments, greater than 450 °C. In some embodiments of the polyimide film, the tensile modulus is between 1.5 GPa and 15.0 GPa; in some embodiments, between 1 .5 GPa and 12.0 GPa.
• the elongation to break is greater than 10%.
• the optical retardation is less than 500 at 550 nm; in some embodiments, less than 200.
• the birefringence at 633 nm is less than 0.15; in some embodiments, less than 0.10; in some embodiments, less than 0.05.
• the haze is less than 1.0%; in some embodiments less than 0.5%.
• the b * is less than 7.5; in some embodiments, less than 5.0; in some embodiments, less than 3.0. In some embodiments of the polyimide film, the Yl is less than 12; in some embodiments, less than 10; in some embodiments, less than 5.
• the transmittance at 400 nm is greater than 40%; in some embodiments, greater than 50%; in some embodiments, greater than 60%.
• the transmittance at 430 nm is greater than 60%; in some embodiments, greater than 70%.
• the transmittance at 450 nm is greater than 70%; in some embodiments, greater than 80%.
• the transmittance at 550 nm is greater than 70%; in some embodiments, greater than 80%.
• the transmittance at 750 nm is greater than 70%; in some embodiments, greater than 80%; in some embodiments, greater than 90%.
• any of the above embodiments for the polyimide film can be combined with one or more of the other embodiments, so long as they are not mutually exclusive.
• the polyimide films are prepared from the polyamic acid solutions by chemical or thermal conversion processes.
• the polyimide films disclosed herein, particularly when used as flexible replacements for glass in electronic devices, are prepared by thermal conversion or modified- thermal conversion processes, versus chemical conversion processes.
• the conversion chemicals found to be useful in the present invention include, but are not limited to, (i) one or more dehydrating agents, such as, aliphatic acid anhydrides (acetic anhydride, etc.) and acid anhydrides; and (ii) one or more catalysts, such as, aliphatic tertiary amines (triethylamine, etc.), tertiary amines (dimethylaniline, etc.) and heterocyclic tertiary amines (pyridine, picoline, isoquinoilne, etc.).
• the anhydride dehydrating material is typically used in a slight molar excess of the amount of amide acid groups present in the polyamic acid solution.
• the amount of acetic anhydride used is typically about 2.0-3.0 moles per equivalent of the polyamic acid. Generally, a comparable amount of tertiary amine catalyst is used.
• Thermal conversion processes may or may not employ conversion chemicals (i.e. , catalysts) to convert a polyamic acid casting solution to a polyimide. If conversion chemicals are used, the process may be considered a modified-thermal conversion process. In both types of thermal conversion processes, only heat energy is used to heat the film to both dry the film of solvent and to perform the imidization reaction.
• conversion chemicals i.e. , catalysts
• Thermal conversion processes with or without conversion catalysts are generally used to prepare the polyimide films disclosed herein.
• the polyamic acids should be imidized at a temperature at, or higher than, the highest temperature of any subsequent processing steps (e.g. deposition of inorganic or other layer(s) necessary to produce a functioning display), but at a temperature which is lower than the temperature at which significant thermal degradation / discoloration of the polyimide occurs. It should also be noted that an inert atmosphere is generally preferred, particularly when higher processing temperatures are employed for imidization.
• temperatures of 300 °C to 320 °C are typically employed when subsequent processing temperatures in excess of 300 °C are required. Choosing the proper curing temperature allows a fully cured polyimide which achieves the best balance of thermal and mechanical properties. Because of this very high temperature, an inert atmosphere is required. Typically, oxygen levels in the oven of ⁇ 100 ppm should be employed. Very low oxygen levels enable the highest curing temperatures to be used without significant degradation / discoloration of the polymer. Catalysts that accelerate the imidization process are effective at achieving higher levels of imidization at cure temperatures between about 200 °C and 300 °C. This approach may be optionally employed if the flexible device is prepared with upper cure temperatures that are below the T g of the polyimide.
• the amount of time in each potential cure step is also an important process consideration. Generally, the time used for the highest- temperature curing should be kept to a minimum. For 320 °C cure, for example, cure time can be up to an hour or so under an inert atmosphere; but at higher cure temperatures, this time should be shortened to avoid thermal degradation. Generally speaking, higher temperature dictates shorter time. Those skilled in the art will recognize the balance between temperature and time in order to optimize the properties of the polyimide for a particular end use.
• the polyamic acid solution is converted into a polyimide film via a thermal conversion process.
• the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 50 pm.
• the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 40 pm. In some embodiments of the thermal conversion process, the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 30 pm.
• the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 20 pm.
• the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is between 10pm and 20 pm.
• the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is between 15pm and 20 pm.
• the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is 18 pm.
• the polyamic acid solution is coated onto the matrix such that the soft-baked thickness of the resulting film is less than 10 pm.
• the coated matrix is soft baked on a hot plate in proximity mode wherein nitrogen gas is used to hold the coated matrix just above the hot plate.
• the coated matrix is soft baked on a hot plate in full-contact mode wherein the coated matrix is in direct contact with the hot plate surface.
• the coated matrix is soft baked on a hot plate using a combination of proximity and full-contact modes.
• the coated matrix is soft-baked using a hot plate set at 80 °C.
• the coated matrix is soft-baked using a hot plate set at 90 °C.
• the coated matrix is soft-baked using a hot plate set at 100 °C. In some embodiments of the thermal conversion process, the coated matrix is soft-baked using a hot plate set at 1 10 °C.
• the coated matrix is soft-baked using a hot plate set at 120 °C.
• the coated matrix is soft-baked using a hot plate set at 130 °C.
• the coated matrix is soft-baked using a hot plate set at 140 °C.
• the coated matrix is soft-baked for a total time of more than 10 minutes.
• the coated matrix is soft-baked for a total time of less than 10 minutes.
• the coated matrix is soft-baked for a total time of less than 8 minutes.
• the coated matrix is soft-baked for a total time of less than 6 minutes.
• the coated matrix is soft-baked for a total time of 4 minutes.
• the coated matrix is soft-baked for a total time of less than 4 minutes.
• the coated matrix is soft-baked for a total time of less than 2 minutes.
• the soft- baked coated matrix is subsequently cured at 2 pre-selected temperatures for 2 pre-selected time intervals, the latter of which may be the same or different.
• the soft- baked coated matrix is subsequently cured at 3 pre-selected temperatures for 3 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft- baked coated matrix is subsequently cured at 4 pre-selected temperatures for 4 pre-selected time intervals, each of which of the latter of which may be the same or different. In some embodiments of the thermal conversion process, the soft- baked coated matrix is subsequently cured at 5 pre-selected temperatures for 5 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft- baked coated matrix is subsequently cured at 6 pre-selected temperatures for 6 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft- baked coated matrix is subsequently cured at 7 pre-selected temperatures for 7 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft- baked coated matrix is subsequently cured at 8 pre-selected temperatures for 8 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft- baked coated matrix is subsequently cured at 9 pre-selected temperatures for 9 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft- baked coated matrix is subsequently cured at 10 pre-selected
• temperatures for 10 pre-selected time intervals each of which of the latter of which may be the same or different.
• the pre- selected temperature is greater than 80 °C.
• the pre- selected temperature is equal to 100 °C.
• the pre- selected temperature is greater than 100 °C.
• the pre- selected temperature is equal to 150 °C.
• the pre- selected temperature is greater than 150 °C. In some embodiments of the thermal conversion process, the pre- selected temperature is equal to 200 °C.
• the pre- selected temperature is greater than 200 °C.
• the pre- selected temperature is equal to 250 °C.
• the pre- selected temperature is greater than 250 °C.
• the pre- selected temperature is equal to 300 °C.
• the pre- selected temperature is greater than 300 °C.
• the pre- selected temperature is equal to 350 °C.
• the pre- selected temperature is greater than 350 °C.
• the pre- selected temperature is equal to 400 °C.
• the pre- selected temperature is greater than 400 °C.
• the pre- selected temperature is equal to 450 °C.
• the pre- selected temperature is greater than 450 °C.
• one or more of the pre-selected time intervals is 2 minutes.
• one or more of the pre-selected time intervals is 5 minutes.
• one or more of the pre-selected time intervals is 10 minutes.
• one or more of the pre-selected time intervals is 15 minutes.
• one or more of the pre-selected time intervals is 20 minutes. In some embodiments of the thermal conversion process, one or more of the pre-selected time intervals is 25 minutes.
• one or more of the pre-selected time intervals is 30 minutes.
• one or more of the pre-selected time intervals is 35 minutes.
• one or more of the pre-selected time intervals is 40 minutes.
• one or more of the pre-selected time intervals is 45 minutes.
• one or more of the pre- selected time intervals is 50 minutes.
• one or more of the pre-selected time intervals is 55 minutes.
• one or more of the pre-selected time intervals is 60 minutes.
• one or more of the pre-selected time intervals is greater than 60 minutes.
• one or more of the pre-selected time intervals is between 2 minutes and 60 minutes.
• one or more of the pre-selected time intervals is between 2 minutes and 90 minutes.
• one or more of the pre-selected time intervals is between 2 minutes and 120 minutes.
• the method for preparing a polyimide film comprises the following steps in order: coating a polyamic acid solution onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre- selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
• the method for preparing a polyimide film consists of the following steps in order: coating a polyamic acid solution onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre- selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
• the method for preparing a polyimide film consists essentially of the following steps in order: coating a polyamic acid solution onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre-selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
• the polyamic acid solutions / polyimides disclosed herein are coated / cured onto a supporting glass substrate to facilitate the processing through the rest of the display making process.
• the polyimide coating is removed from the supporting glass substrate by a mechanical or laser lift off process.
• this polyimide film with deposition layers is then bonded to a thicker, but still flexible, plastic film to provide support for subsequent fabrication of the display.
• the polyamic acid solution is converted into a polyimide film via a modified-thermal conversion process.
• the polyamic acid solution further contains conversion catalysts. In some embodiments of the modified-thermal conversion process, the polyamic acid solution further contains conversion catalysts selected from the group consisting of tertiary amines.
• the polyamic acid solution further contains conversion catalysts selected from the group consisting of tributylamine, dimethylethanolamine, isoquinoline, 1 ,2-dimethylimidazole, N-methylimidazole, 2- methylimidazole, 2-ethyl-4-imidazole, 3,5-dimethylpyridine, 3,4- dimethylpyridine, 2,5-dimethylpyridine, 5-methylbenzimidazole, and the like.
• conversion catalysts selected from the group consisting of tributylamine, dimethylethanolamine, isoquinoline, 1 ,2-dimethylimidazole, N-methylimidazole, 2- methylimidazole, 2-ethyl-4-imidazole, 3,5-dimethylpyridine, 3,4- dimethylpyridine, 2,5-dimethylpyridine, 5-methylbenzimidazole, and the like.
• the conversion catalyst is present at 5 weight percent or less of the polyamic acid solution.
• the conversion catalyst is present at 3 weight percent or less of the polyamic acid solution.
• the conversion catalyst is present at 1 weight percent or less of the polyamic acid solution.
• the conversion catalyst is present at 1 weight percent of the polyamic acid solution.
• the polyamic acid solution further contains tributylamine as a conversion catalyst.
• the polyamic acid solution further contains dimethylethanolamine as a conversion catalyst.
• the polyamic acid solution further contains isoquinoline as a conversion catalyst.
• the polyamic acid solution further contains 1 ,2-dimethylimidazole as a conversion catalyst. In some embodiments of the modified-thermal conversion process, the polyamic acid solution further contains 3,5-dimethylpyridine as a conversion catalyst.
• the polyamic acid solution further contains 5-methylbenzimidazole as a conversion catalyst.
• the polyamic acid solution further contains N-methylimidazole as a conversion catalyst.
• the polyamic acid solution further contains 2-methylimidazole as a conversion catalyst.
• the polyamic acid solution further contains 2-ethyl-4-imidazole as a conversion catalyst.
• the polyamic acid solution further contains 3,4-dimethylpyridine as a conversion catalyst.
• the polyamic acid solution further contains 2,5-dimethylpyridine as a conversion catalyst.
• the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 50 pm.
• the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 40 pm.
• the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 30 pm.
• the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 20 pm. In some embodiments of the modified-thermal conversion process, the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is between 10pm and 20 pm.
• the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is between 15pm and 20 pm.
• the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is 18 pm.
• the polyamic acid solution is coated onto the matrix such that the soft- baked thickness of the resulting film is less than 10 pm.
• the coated matrix is soft baked on a hot plate in proximity mode wherein nitrogen gas is used to hold the coated matrix just above the hot plate.
• the coated matrix is soft baked on a hot plate in full-contact mode wherein the coated matrix is in direct contact with the hot plate surface.
• the coated matrix is soft baked on a hot plate using a combination of proximity and full-contact modes.
• the coated matrix is soft-baked using a hot plate set at 80 °C.
• the coated matrix is soft-baked using a hot plate set at 90 °C.
• the coated matrix is soft-baked using a hot plate set at 100 °C.
• the coated matrix is soft-baked using a hot plate set at 1 10 °C.
• the coated matrix is soft-baked using a hot plate set at 120 °C.
• the coated matrix is soft-baked using a hot plate set at 130 °C. In some embodiments of the modified- thermal conversion process, the coated matrix is soft-baked using a hot plate set at 140 °C.
• the coated matrix is soft-baked for a total time of more than 10 minutes.
• the coated matrix is soft-baked for a total time of less than 10 minutes.
• the coated matrix is soft-baked for a total time of less than 8 minutes.
• the coated matrix is soft-baked for a total time of less than 6 minutes.
• the coated matrix is soft-baked for a total time of 4 minutes.
• the coated matrix is soft-baked for a total time of less than 4 minutes.
• the coated matrix is soft-baked for a total time of less than 2 minutes.
• the soft-baked coated matrix is subsequently cured at 2 pre-selected temperatures for 2 pre-selected time intervals, the latter of which may be the same or different.
• the soft-baked coated matrix is subsequently cured at 3 pre-selected temperatures for 3 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft-baked coated matrix is subsequently cured at 4 pre-selected temperatures for 4 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft-baked coated matrix is subsequently cured at 5 pre-selected temperatures for 5 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft-baked coated matrix is subsequently cured at 6 pre-selected temperatures for 6 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft-baked coated matrix is subsequently cured at 7 pre-selected temperatures for 7 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft-baked coated matrix is subsequently cured at 8 pre-selected temperatures for 8 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft-baked coated matrix is subsequently cured at 9 pre-selected temperatures for 9 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the soft-baked coated matrix is subsequently cured at 10 pre-selected temperatures for 10 pre-selected time intervals, each of which of the latter of which may be the same or different.
• the pre-selected temperature is greater than 80 °C.
• the pre-selected temperature is equal to 100 °C.
• the pre-selected temperature is greater than 100 °C.
• the pre-selected temperature is equal to 150 °C.
• the pre-selected temperature is greater than 150 °C.
• the pre-selected temperature is equal to 200 °C.
• the pre-selected temperature is greater than 200 °C.
• the pre-selected temperature is equal to 220 °C. In some embodiments of the modified-thermal conversion process, the pre-selected temperature is greater than 220 °C.
• the pre-selected temperature is equal to 230 °C.
• the pre-selected temperature is greater than 230 °C.
• the pre-selected temperature is equal to 240 °C.
• the pre-selected temperature is greater than 240 °C.
• the pre-selected temperature is equal to 250 °C.
• the pre-selected temperature is greater than 250 °C.
• the pre-selected temperature is equal to 260 °C.
• the pre-selected temperature is greater than 260 °C.
• the pre-selected temperature is equal to 270 °C.
• the pre-selected temperature is greater than 270 °C.
• the pre-selected temperature is equal to 280 °C.
• the pre-selected temperature is greater than 280 °C.
• the pre-selected temperature is equal to 290 °C.
• the pre-selected temperature is greater than 290 °C.
• the pre-selected temperature is equal to 300 °C.
• the pre-selected temperature is less than 300 °C. In some embodiments of the modified-thermal conversion process, the pre-selected temperature is less than 290 °C.
• the pre-selected temperature is less than 280 °C.
• the pre-selected temperature is less than 270 °C.
• the pre-selected temperature is less than 260 °C.
• the pre-selected temperature is less than 250 °C.
• one or more of the pre-selected time intervals is 2 minutes.
• one or more of the pre-selected time intervals is 5 minutes.
• one or more of the pre-selected time intervals is 10 minutes.
• one or more of the pre-selected time intervals is 15 minutes.
• one or more of the pre-selected time intervals is 20 minutes.
• one or more of the pre-selected time intervals is 25 minutes.
• one or more of the pre-selected time intervals is 30 minutes.
• one or more of the pre-selected time intervals is 35 minutes.
• one or more of the pre-selected time intervals is 40 minutes.
• one or more of the pre-selected time intervals is 45 minutes.
• one or more of the pre-selected time intervals is 50 minutes.
• one or more of the pre-selected time intervals is 55 minutes. In some embodiments of the modified-thermal conversion process, one or more of the pre-selected time intervals is 60 minutes.
• one or more of the pre-selected time intervals is greater than 60 minutes.
• one or more of the pre-selected time intervals is between 2 minutes and 60 minutes.
• one or more of the pre-selected time intervals is between 2 minutes and 90 minutes.
• one or more of the pre-selected time intervals is between 2 minutes and 120 minutes.
• the method for preparing a polyimide film comprises the following steps in order: coating a polyamic acid solution including a conversion chemical onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre-selected temperatures for a plurality of pre- selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
• the method for preparing a polyimide film consists of the following steps in order: coating a polyamic acid solution including a conversion chemical onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre-selected temperatures for a plurality of pre- selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
• the method for preparing a polyimide film consists essentially of the following steps in order: coating a polyamic acid solution including a conversion chemical onto a matrix; soft-baking the coated matrix; treating the soft-baked coated matrix at a plurality of pre-selected temperatures for a plurality of pre-selected time intervals whereby the polyimide film exhibits properties that are satisfactory for use in electronics applications like those disclosed herein.
• the polyimide films disclosed herein can be suitable for use in a number of layers in electronic display devices such as OLED and LCD Displays.
• Nonlimiting examples of such layers include device substrates, touch panels, substrates for color filter sheets, cover films, and others.
• the particular materials’ properties requirements for each application are unique and may be addressed by appropriate composition(s) and processing condition(s) for the polyimide films disclosed herein.
• the flexible replacement for glass in an electronic device is a polyimide film having the repeat unit of Formula IV, as described in detail above.
• Organic electronic devices that may benefit from having one or more layers including at least one compound as described herein include, but are not limited to, (1 ) devices that convert electrical energy into radiation (e.g., a light-emitting diode, light emitting diode display, lighting device, luminaire, or diode laser), (2) devices that detect signals through electronics processes (e.g., photodetectors, photoconductive cells, photoresistors, photoswitches, phototransistors, phototubes, IR detectors, biosensors), (3) devices that convert radiation into electrical energy, (e.g., a photovoltaic device or solar cell), (4) devices that convert light of one wavelength to light of a longer wavelength, (e.g., a down-converting phosphor device); and (5) devices that include one or more electronic components that include one or more organic semi-conductor layers (e.g., a transistor or diode).
• Other uses for the compositions according to the present invention include coating materials for memory storage devices, antistatic films, biosensors, electrochro
• FIG. 1 One illustration of a polyimide film that can act as a flexible replacement for glass as described herein is shown in FIG. 1.
• the flexible film 100 can have the properties as described in the embodiments of this disclosure.
• the polyimide film that can act as a flexible replacement for glass is included in an electronic device.
• FIG. 2 illustrates the case when the electronic device 200 is an organic electronic device.
• the device 200 has a substrate 100, an anode layer 1 10 and a second electrical contact layer, a cathode layer 130, and a photoactive layer 120 between them. Additional layers may optionally be present. Adjacent to the anode may be a hole injection layer (not shown), sometimes referred to as a buffer layer.
• Adjacent to the hole injection layer may be a hole transport layer (not shown), including hole transport material.
• Adjacent to the cathode may be an electron transport layer (not shown), including an electron transport material.
• devices may use one or more additional hole injection or hole transport layers (not shown) next to the anode 1 10 and/or one or more additional electron injection or electron transport layers (not shown) next to the cathode 130. Layers between 1 10 and 130 are individually and collectively referred to as the organic active layers. Additional layers that may or may not be present include color filters, touch panels, and / or cover sheets. One or more of these layers, in addition to the substrate 100, may also be made from the polyimide films disclosed herein.
• the different layers have the following range of thicknesses: substrate 100, 5-100 microns, anode 1 10, 500-5000 A, in some embodiments, 1000-2000 A; hole injection layer (not shown), 50- 2000 A, in some embodiments, 200-1000 A; hole transport layer (not shown), 50-3000 A, in some embodiments, 200-2000 A; photoactive layer 120, 10-2000 A, in some embodiments, 100-1000 A; electron transport layer (not shown), 50-2000 A, in some embodiments, 100-1000 A; cathode 130, 200-10000 A, in some embodiments, 300-5000 A.
• the desired ratio of layer thicknesses will depend on the exact nature of the materials used.
• the organic electronic device contains a flexible replacement for glass as disclosed herein.
• an organic electronic device includes a substrate, an anode, a cathode, and a photoactive layer therebetween, and further includes one or more additional organic active layers.
• the additional organic active layer is a hole transport layer.
• the additional organic active layer is an electron transport layer. In some embodiments, the additional organic layers are both hole transport and electron transport layers.
• the anode 1 10 is an electrode that is particularly efficient for injecting positive charge carriers. It can be made of, for example materials containing a metal, mixed metal, alloy, metal oxide or mixed-metal oxide, or it can be a conducting polymer, and mixtures thereof. Suitable metals include the Group 1 1 metals, the metals in Groups 4, 5, and 6, and the Group 8-10 transition metals. If the anode is to be light-transmitting, mixed-metal oxides of Groups 12, 13 and 14 metals, such as indium-tin- oxide, are generally used.
• the anode may also include an organic material such as polyaniline as described in“Flexible light-emitting diodes made from soluble conducting polymer,” Nature vol. 357, pp 477 479 (1 1 June 1992). At least one of the anode and cathode should be at least partially transparent to allow the generated light to be observed.
• Optional hole injection layers can include hole injection materials.
• the term“hole injection layer” or“hole injection material” is intended to mean electrically conductive or semiconductive materials and may have one or more functions in an organic electronic device, including but not limited to, planarization of the underlying layer, charge transport and/or charge injection properties, scavenging of impurities such as oxygen or metal ions, and other aspects to facilitate or to improve the performance of the organic electronic device.
• Hole injection materials may be polymers, oligomers, or small molecules, and may be in the form of solutions, dispersions, suspensions, emulsions, colloidal mixtures, or other compositions.
• the hole injection layer can be formed with polymeric materials, such as polyaniline (PANI) or polyethylenedioxythiophene (PEDOT), which are often doped with protonic acids.
• the protonic acids can be, for example, poly(styrenesulfonic acid), poly(2-acrylamido-2-methyl-1- propanesulfonic acid), and the like.
• the hole injection layer 120 can include charge transfer compounds, and the like, such as copper phthalocyanine and the tetrathiafulvalene-tetracyanoquinodimethane system (TTF-TCNQ).
• TTF-TCNQ tetrathiafulvalene-tetracyanoquinodimethane system
• the hole injection layer 120 is made from a dispersion of a conducting polymer and a colloid-forming polymeric acid. Such materials have been described in, for example, published U.S. patent applications 2004-0102577, 2004-0127637, and 2005-0205860.
• hole transport materials examples include hole transport materials. Examples of hole transport materials for the hole transport layer have been summarized for example, in Kirk-Othmer Encyclopedia of Chemical Technology, Fourth Edition, Vol. 18, p. 837-860, 1996, by Y. Wang. Both hole transporting small molecules and polymers can be used.
• hole transporting molecules include, but are not limited to: 4,4’,4”-tris(N,N- diphenyl-amino)-triphenylamine (TDATA); 4,4’,4”-tris(N-3-methylphenyl-N- phenyl-amino)-triphenylamine (MTDATA); N,N'-diphenyl-N,N'-bis(3- methylphenyl)-[1 ,T-biphenyl]-4,4'-diamine (TPD); 4, 4’-bis(carbazol-9- yl)biphenyl (CBP); 1 ,3-bis(carbazol-9-yl)benzene (mCP); 1 ,1 -bis[(di-4- tolylamino) phenyljcyclohexane (TAPC); N,N'-bis(4-methylphenyl)-N,N'- bis(4-ethylphenyl)-[1 , 1
• the hole transport layer is doped with a p-dopant, such as tetrafluorotetracyanoquinodimethane and perylene-3,4,9,10- tetracarboxylic-3, 4, 9, 10-dianhydride.
• a p-dopant such as tetrafluorotetracyanoquinodimethane and perylene-3,4,9,10- tetracarboxylic-3, 4, 9, 10-dianhydride.
• the photoactive layer 120 can be a light-emitting layer that is activated by an applied voltage (such as in a light-emitting diode or light-emitting electrochemical cell), a layer of material that absorbs light and emits light having a longer wavelength (such as in a down-converting phosphor device), or a layer of material that responds to radiant energy and generates a signal with or without an applied bias voltage (such as in a photodetector or photovoltaic device).
• an applied voltage such as in a light-emitting diode or light-emitting electrochemical cell
• a layer of material that absorbs light and emits light having a longer wavelength such as in a down-converting phosphor device
• a layer of material that responds to radiant energy and generates a signal with or without an applied bias voltage such as in a photodetector or photovoltaic device.
• the photoactive layer includes a compound comprising an emissive compound having as a photoactive material.
• the photoactive layer further comprises a host material.
• host materials include, but are not limited to, chrysenes, phenanthrenes, triphenylenes, phenanthrolines, naphthalenes, anthracenes, quinolines, isoquinolines, quinoxalines, phenylpyridines, carbazoles, indolocarbazoles, furans, benzofurans, dibenzofurans, benzodifurans, and metal quinolinate complexes.
• the host materials are deuterated.
• the photoactive layer comprises (a) a dopant capable of electroluminescence having an emission maximum between 380 and 750 nm, (b) a first host compound, and (c) a second host compound. Suitable second host compounds are described above.
• the photoactive layer includes only (a) a dopant capable of electroluminescence having an emission maximum between 380 and 750 nm, (b) a first host compound, and (c) a second host compound, where additional materials that would materially alter the principle of operation or the distinguishing characteristics of the layer are not present.
• the first host is present in higher
• the weight ratio of first host to second host in the photoactive layer is in the range of 10:1 to 1 : 10. In some
• the weight ratio is in the range of 6:1 to 1 :6; in some embodiments, 5:1 to 1 :2; in some embodiments, 3:1 to 1 :1.
• the weight ratio of dopant to the total host is in the range of 1 :99 to 20:80; in some embodiments, 5:95 to 15:85.
• the photoactive layer comprises (a) a red light-emitting dopant, (b) a first host compound, and (c) a second host compound.
• the photoactive layer comprises (a) a green light-emitting dopant, (b) a first host compound, and (c) a second host compound.
• the photoactive layer comprises (a) a yellow light-emitting dopant, (b) a first host compound, and (c) a second host compound.
• Optional layers can function both to facilitate electron transport, and also serve as a confinement layer to prevent quenching of the exciton at layer interfaces.
• this layer promotes electron mobility and reduces exciton quenching.
• such layers include other electron transport materials.
• electron transport materials which can be used in the optional electron transport layer, include metal chelated oxinoid compounds, including metal quinolate derivatives such as tris(8- hydroxyquinolato)aluminum (AIQ), bis(2-methyl-8-quinolinolato)(p- phenylphenolato) aluminum (BAIq), tetrakis-(8-hydroxyquinolato)hafnium (HfQ) and tetrakis-(8-hydroxyquinolato)zirconium (ZrQ); and azole compounds such as 2- (4-biphenylyl)-5-(4-t-butylphenyl)-1 ,3,4-oxadiazole (PBD), 3-(4-biphenylyl)-4-phenyl-5-(4-t-butylphenyl)-1 ,2,4-triazole (TAZ), and 1 ,3,5-tri(phenyl-2-benzimidazole
• AIQ
• the electron transport material is selected from the group consisting of metal quinolates and phenanthroline derivatives.
• the electron transport layer further includes an n-dopant.
• N-dopant materials are well known.
• tetrathianaphthacene bis(ethylenedithio)tetrathiafulvalene
• heterocyclic radicals or diradicals and the dimers, oligomers, polymers, dispiro compounds and polycycles of heterocyclic radical or diradicals.
• An optional electron injection layer may be deposited over the electron transport layer.
• electron injection materials include, but are not limited to, Li-containing organometallic compounds, LiF, U2O,
• This layer may react with the underlying electron transport layer, the overlying cathode, or both.
• the amount of material deposited is generally in the range of 1- 100 A, in some embodiments 1-10 A.
• the cathode 130 is an electrode that is particularly efficient for injecting electrons or negative charge carriers.
• the cathode can be any metal or nonmetal having a lower work function than the anode.
• Materials for the cathode can be selected from alkali metals of Group 1 (e.g., Li, Cs), the Group 2 (alkaline earth) metals, the Group 12 metals, including the rare earth elements and lanthanides, and the actinides. Materials such as aluminum, indium, calcium, barium, samarium and magnesium, as well as combinations, can be used.
• anode 1 10 there can be layers (not shown) between the anode 1 10 and hole injection layer (not shown) to control the amount of positive charge injected and/or to provide band-gap matching of the layers, or to function as a protective layer.
• Layers that are known in the art can be used, such as copper phthalocyanine, silicon oxy-nitride, fluorocarbons, silanes, or an ultra-thin layer of a metal, such as Pt.
• some or all of anode layer 1 10, active layer 120, or cathode layer 130 can be surface-treated to increase charge carrier transport efficiency.
• the choice of materials for each of the component layers is preferably determined by balancing the positive and negative charges in the emitter layer to provide a device with high electroluminescence efficiency.
• each functional layer can be made up of more than one layer.
• the device layers can generally be formed by any deposition technique, or combinations of techniques, including vapor deposition, liquid deposition, and thermal transfer. Substrates such as glass, plastics, and metals can be used. Conventional vapor deposition techniques can be used, such as thermal evaporation, chemical vapor deposition, and the like.
• the organic layers can be applied from solutions or dispersions in suitable solvents, using conventional coating or printing techniques, including but not limited to coating, dip-coating, roll-to-roll techniques, ink- jet printing, continuous nozzle printing, screen-printing, gravure printing and the like.
• a suitable solvent for a particular compound or related class of compounds can be readily determined by one skilled in the art.
• non-aqueous solvents can be relatively polar, such as Ci to C20 alcohols, ethers, and acid esters, or can be relatively non-polar such as C1 to C12 alkanes or aromatics such as toluene, xylenes, trifluorotoluene and the like.
• suitable liquids for use in making the liquid composition includes, but not limited to, chlorinated hydrocarbons (such as methylene chloride, chloroform, chlorobenzene), aromatic hydrocarbons (such as substituted and non-substituted toluenes and xylenes), including triflurotoluene), polar solvents (such as tetrahydrofuran (THP), N-methyl pyrrolidone) esters (such as ethylacetate) alcohols (isopropanol), ketones (cyclopentatone) and mixtures thereof.
• chlorinated hydrocarbons such as methylene chloride, chloroform, chlorobenzene
• aromatic hydrocarbons such as substituted and non-substituted toluenes and xylenes
• triflurotoluene including triflurotoluene
• polar solvents such as tetrahydrofuran (THP), N-methyl pyrrolidone) esters (
• electroluminescent materials have been described in, for example, published PCT application WO 2007/145979.
• the device is fabricated by liquid deposition of the hole injection layer, the hole transport layer, and the photoactive layer, and by vapor deposition of the anode, the electron transport layer, an electron injection layer and the cathode onto the flexible substrate.
• the efficiency of devices can be improved by optimizing the other layers in the device.
• more efficient cathodes such as Ca, Ba or LiF can be used.
• Shaped substrates and novel hole transport materials that result in a reduction in operating voltage or increase quantum efficiency are also applicable.
• Additional layers can also be added to tailor the energy levels of the various layers and facilitate electroluminescence.
• the device has the following structure, in order: substrate, anode, hole injection layer, hole transport layer, photoactive layer, electron transport layer, electron injection layer, cathode.
• Synthesis Example 1 This example illustrates the synthesis of 2,5-difluoro-1 ,4- phenylenediamine, Compound IV-A.
• 2,4-Difluoro-5-nitro-benzenamine 25 g was added at once to a stirred solution of tin chloride dihydrate (200 g) and concentrated hydrochloric acid (30 ml) in methanol (500 ml) cooling the reaction mixture with ice bath. After that the mixture was heated at 70C for 30 min.
• Synthesis Example 3 This example illustrates the synthesis of 2,3-difluoro-1 ,4- phenylenediamine, Compound IV-C.
• reaction mixtures were washed with water (2 times), toluene layer separated, passed through a short plug of silica gel and celite washing with toluene.
• Toluene distilled off using rotary evaporator to volume approx. 200 ml, intermediate BOC-protected compound filtered by filtration ( 1 H-NMR: dmso-de, 500 MHz: 1 .44 (s, 18 H), 7.22-7.23 (m, 2H), 9.06 (s, 2H).), and heated with 300 ml of toluene and 30 ml of concentrated hydrochloric acid at 90C for 3 days. Toluene layer separated, aqueous layer diluted with 200 ml of water.
• This example illustrates the formation of a polyamic acid using
• This example illustrates the formation of a polyamic acid using
• the monomers were reacted as above to form a polymer solution, using DMAc as solvent.
• the Bis-P to Compound IV-E ratio was 90:10.
• This example illustrates the formation of a polyimide film having Formula V.
• the polyamic acid solution from Polymer Example 2 was filtered through a microfilter, spin coated onto clean silicon wafers, soft-baked at 90°C on hotplate, placed into a furnace. The furnace was purged with nitrogen and heated to a maximum cure
• the CTE was measure in the range of 50-250°C.
• fluorinated diamine compounds having Formulae (II) and (III) are sufficiently reactive at ambient conditions to generate polymers with molecular weight greater than 100,000. They can be used to form polyimide films with desirable properties. Note that not all of the activities described above in the general description or the examples are required, that a portion of a specific activity may not be required, and that one or more further activities may be performed in addition to those described. Still further, the order in which activities are listed are not necessarily the order in which they are performed.

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