WO2019237271A1 - 显示屏组件、电子设备及电子设备的制作方法 - Google Patents

显示屏组件、电子设备及电子设备的制作方法 Download PDF

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Publication number
WO2019237271A1
WO2019237271A1 PCT/CN2018/091008 CN2018091008W WO2019237271A1 WO 2019237271 A1 WO2019237271 A1 WO 2019237271A1 CN 2018091008 W CN2018091008 W CN 2018091008W WO 2019237271 A1 WO2019237271 A1 WO 2019237271A1
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WO
WIPO (PCT)
Prior art keywords
camera
hole
transparent cover
black
electronic device
Prior art date
Application number
PCT/CN2018/091008
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English (en)
French (fr)
Inventor
唐义梅
成蛟
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to CN201880094497.4A priority Critical patent/CN112272939A/zh
Priority to PCT/CN2018/091008 priority patent/WO2019237271A1/zh
Publication of WO2019237271A1 publication Critical patent/WO2019237271A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the present application relates to the technical field of electronic devices, and in particular, to a display assembly, an electronic device, and a manufacturing method of an electronic device.
  • This application provides a display assembly including:
  • a display module the display module is disposed on one side of the transparent cover, and the display module is provided with a mounting hole;
  • a camera the camera being at least partially received in the mounting hole, the camera including a housing and optical components housed in the housing, the housing including a top surface facing the transparent cover plate, the top surface being provided An opening to expose the optical element;
  • a black glue layer is located on the top surface, the camera is attached to the transparent cover plate through the black glue layer, and the black glue layer is used to block the leakage of the display module Light interferes with the imaging of the optical element.
  • the present application also provides an electronic device including a display screen assembly.
  • This application also provides a method for manufacturing an electronic device, including:
  • the camera comprising a housing and an optical element housed in the housing, the housing including a top surface facing the transparent cover plate, the top surface is provided with an opening to expose the optical element;
  • the camera is inserted into the mounting hole, and the camera is adhered to the transparent cover through the black rubber layer.
  • a hole is placed in the lower part of the display assembly to place a camera, which reduces the space occupied by the camera in the display area of the display assembly, increases the screen ratio of the electronic device, and a black plastic layer is pasted on the transparent cover and the camera. In between, the propagation path of the light leaked from the display module at the mounting hole to the light incident surface of the camera is blocked, that is, the display module is prevented from channeling light to the camera, and the shooting effect of the camera is improved.
  • FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a front view of a display screen assembly provided in Embodiment 1 of the present application.
  • Fig. 3 is a schematic cross-sectional view taken along A-A in Fig. 2.
  • FIG. 4 is an enlarged schematic view of a position B in FIG. 3.
  • FIG. 5 is a schematic diagram of a working principle of a display screen component provided in Embodiment 1 of the present application.
  • FIG. 6 is a schematic diagram of an embodiment of a display assembly.
  • FIG. 7 is a schematic diagram of another embodiment of a display assembly.
  • FIG. 8 is a schematic diagram of another embodiment of a display assembly.
  • FIG. 9 is a schematic diagram of a display screen component provided in Embodiment 1 of the present application.
  • FIG. 10 is an enlarged schematic view of a position C in FIG. 9.
  • FIG. 11 is a schematic diagram of a display module provided in Embodiment 1 of the present application.
  • FIG. 12 is a schematic diagram of a display screen component provided in Embodiment 2 of the present application.
  • FIG. 13 is a schematic diagram of an electronic device according to an embodiment of the present application.
  • FIG. 14 is a schematic flowchart of a manufacturing method of an electronic device according to an embodiment of the present application.
  • a display screen assembly 100 provided in an embodiment of the present application is applied to an electronic device 200.
  • the electronic device 200 includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, and the like.
  • FIG. 2 is a front view of a display screen assembly 100 provided in Embodiment 1 of the present application
  • FIG. 3 is a schematic cross-sectional view taken along the direction A-A of FIG. 2.
  • the display module 100 provided in the first embodiment of the present application includes a transparent cover 10, a display module 20, a camera 30, and a vinyl layer 40.
  • the transparent cover plate 10 is a rigid plate with a certain strength and high light transmittance.
  • the transparent cover plate 10 is used to protect the display module 20 and other devices under the transparent cover plate 10.
  • the transparent cover plate 10 is a glass cover plate. The light transmittance of the glass cover plate is high and the cost is low.
  • the transparent cover plate 10 may also be a plastic cover plate.
  • the display module 20 is disposed on one side of the transparent cover plate 10.
  • the glass cover plate includes an outer surface 10 b and an inner surface 10 a opposite to each other.
  • the outer surface 10 b is a surface facing the outside of the electronic device 200.
  • the outer surface 10b of the glass cover is a surface facing the user
  • the inner surface 10a is the surface of the glass cover facing the inside of the electronic device 200.
  • the display module 20 is disposed on the inner surface 10a of the transparent cover plate 10.
  • the display module 20 is affixed to the transparent cover plate 10 by using an optically clear adhesive (OCA).
  • OCA optically clear adhesive
  • the adhesive has high bonding strength and high transparency, and has little influence on the display effect of the display module 20.
  • the display module 20 is provided with a mounting hole 201.
  • the mounting hole 201 is located in the display area of the display module 20, which is beneficial to reducing the effect of the mounting hole 201 on the screen ratio of the display module 100.
  • the mounting hole 201 is a through hole penetrating the display module 20.
  • the mounting hole 201 is a round hole.
  • FIG. 4 is a partially enlarged schematic diagram of FIG. 3.
  • the camera 30 is at least partially accommodated in the mounting hole 201.
  • the light incident surface 32 a of the camera 30 faces the transparent cover 10.
  • the external light passes through the transparent cover 10 and enters the light incident surface 32 a of the camera 30 for imaging.
  • the camera 30 is partially accommodated in the mounting hole 201, and the size of the mounting hole 201 can be reduced.
  • An opening is provided in the lower portion of the display screen assembly 100 to place the camera 30, which reduces the space occupied by the camera 30 in the display area of the display screen assembly 100 and increases the screen ratio of the electronic device 200.
  • the black rubber layer 40 is received in the mounting hole 201, and the black rubber layer 40 is at least partially located between the transparent cover plate 10 and the camera 30.
  • the black rubber layer 40 is used for blocking The light leaked from the display module 20 enters the light incident surface 32 a of the camera 30.
  • the black glue layer 40 is formed after the upper black soft glue coated on the camera 30 is compressed and cured.
  • one side of the black plastic layer 40 is located on the inner surface 10a of the transparent cover 10, and the other side abuts the camera 30, so that the black layer 40 is compressed between the transparent cover 10 and the camera 30, so that the black The sealing effect of the joint between the adhesive layer 40 and the camera 30 is better.
  • the camera 30 includes a top surface 34a facing the transparent cover plate 10, and a black adhesive layer 40 is located on the top surface 34a, so that the black adhesive layer 40 is compressed between the top surface 34a and the inner surface 10a.
  • the camera 30 is attached to the transparent cover 10 through a black adhesive layer 40.
  • the black adhesive layer 40 also plays a role of fixedly connecting the top surface 34a and the inner surface 10a, thereby fixing the camera 30 and the transparent cover. 10.
  • the camera 30 includes a housing 34 and an optical element 32 housed in the housing 34.
  • the housing 34 is provided with an opening 36 to expose the optical element 32.
  • the vinyl layer 40 is disposed on the housing 34 of the camera 30.
  • the black adhesive layer 40 is adhered between the transparent cover 10 and the camera 30.
  • the top end portion of the housing 34 is a cylindrical structure.
  • the optical element 32 is located inside the cylindrical shape and receives external light through the opening 36. In the first direction X, that is, the radial direction of the mounting hole 201, the housing 34 The optical element 32 is isolated from the display module 20.
  • the light incident surface 32a of the camera 30 is the surface where the optical element 32 receives external light
  • the top surface 34a is the surface of the casing 34 that contacts the vinyl layer 40.
  • the light incident surface 32a of the camera 30 is recessed in the camera 30, in other words In the second direction Y, that is, in the axial direction of the mounting hole 201, the height of the light incident surface 32a of the camera 30 is smaller than the height of the top surface 34a.
  • the display module 20 inevitably leaks light into the mounting hole 201, and the leaked light partially propagates toward the camera 30.
  • the casing 34 and the vinyl layer 40 of the camera 30 block the light from reaching the casing 34.
  • the propagation path of the internal optical element 32 prevents the display module 20 from channeling light to the camera 30, and prevents the light incident surface 32a of the camera 30 from receiving light leaked from the display module 20, thereby improving the shooting effect of the camera 30.
  • the vertical projection of the black rubber layer 40 on the transparent cover plate 10 is circular.
  • the black rubber layer 40 is a ring-shaped structure. After passing through the central hole and the opening 36 of the vinyl layer 40, it enters the light incident surface 32 a to form an image in the optical element 32.
  • the ring-shaped top surface 34 a of the housing 34 of the camera 30 abuts the ring-shaped black rubber layer 40 and makes the other side of the black rubber layer 40 abut on the transparent cover 10.
  • the optical element 32 is sealed on the transparent cover.
  • the top surface 34 a is provided with a receiving groove 34 b, and the black rubber layer 40 is at least partially located in the receiving groove 34 b.
  • the accommodating groove 34b corresponds to the vinyl layer 40.
  • the accommodating groove 34b is recessed in the top surface 34a, and the vinyl layer 40 is accommodated in the accommodating groove 34b.
  • the distance between the housing 34 of the camera 30 and the transparent cover plate 10 can be reduced.
  • the vinyl layer 40 can be directly applied into the receiving groove 34b, so as to avoid the application position of the vinyl layer 40 in the camera 30 being inaccurate, simplifying The process of coating the vinyl layer 40 is completed.
  • the cooperation of the accommodating groove 34b and the vinyl layer 40 is beneficial for blocking the light leaked from the display module 20 from passing through the connection between the vinyl layer 40 and the camera 30, which further improves the optical components 32 inside the camera 30.
  • the sealing effect avoids light channeling and improves the shooting effect of the camera 30.
  • the black rubber layer 40 covers the top surface 34 a, thereby increasing the contact area between the black rubber layer 40 and the top surface 34 a, and the black rubber layer 40 and the inner surface 10 a.
  • the inner surface 10 a of the transparent cover plate 10 includes a transition region 102 a, the transition region 102 a is opposite to the mounting hole 201, and the transition region 102 a is located in the housing 34 in a vertical projection and display mode of the inner surface 10 a.
  • the black layer 40 covers the transition area 102 a to block the light leaked from the display module 20 from entering the transparent cover 10 from the transition area 102 a.
  • the transition area 102 a corresponds to the area in the mounting hole 201 that does not contact the camera 30.
  • the black adhesive layer 40 covers the transition area 102 a.
  • the black adhesive layer 40 blocks the path for the light leaked from the display module 20 to enter the transparent cover 10 to avoid After the light enters the transparent cover 10, it is reflected in the transparent cover 10, thereby preventing the light from reflecting from the transparent cover 10 multiple times and exiting through the opening 36 of the housing 34 into the optical element 32, further avoiding the display mode.
  • the light leaked from the group 20 is transmitted to the camera 30, which improves the shooting effect of the camera 30.
  • FIG. 10 is a partially enlarged schematic diagram of FIG. 9.
  • the display module 20 includes a liquid crystal panel 22 and a backlight assembly 24 stacked on the transparent cover 10 in this order.
  • the liquid crystal panel 22 is provided with a first through-hole 221
  • the backlight assembly 24 is provided with a first through-hole facing the first through-hole.
  • the second through hole 241 of 221 is communicated with the second through hole 241 to form a mounting hole 201.
  • the first through hole 221 and the second through hole 241 are both circular holes.
  • the camera 30 passes through the second through hole 241 and the first through hole 221 in this order and abuts the vinyl layer 40.
  • the backlight assembly 24 is a direct-type backlight or an edge-type backlight, wherein the thickness of the edge-type backlight is smaller.
  • the backlight assembly 24 is used to provide a backlight source, and after the backlight source passes through the liquid crystal panel 22, the display module 20 displays an image.
  • the liquid crystal panel 22 may leak light from the inner wall surface of the first through hole 221, and the backlight assembly 24 may also leak light from the inner wall surface of the second through hole 241.
  • the liquid crystal panel 22 includes a first substrate 222, a second substrate 224, liquid crystal molecules 226, and a black matrix 228.
  • the first substrate 222 is disposed opposite to the second substrate 224, and the liquid crystal molecules 226 and the black matrix 228 are located on the first substrate. Between 222 and the second substrate 224.
  • the two opposite sides of the liquid crystal panel 22 are further provided with a first polarizing plate 262 and a second polarizing plate 264 that have perpendicular polarization directions.
  • the first substrate 222 may be a color filter substrate
  • the second substrate 224 may be an array substrate.
  • the driving circuit controls the voltage difference between the first substrate 222 and the second substrate 224 to control the rotation of the liquid crystal molecules 226, thereby controlling the light passing through the liquid crystal panel 22, that is, controlling the image displayed by the display module 20.
  • at least part of the black matrix 228 forms an inner wall of the first through hole 221 to prevent the liquid crystal molecules 226 from leaking out.
  • the black matrix 228 is not only used to support the distance between the first substrate 222 and the second substrate 224, but also used to close the liquid crystal panel 22 at the first through hole 221, and the liquid crystal molecules 226 are placed to flow out from the first through hole 221.
  • the aperture of the second through hole 241 is smaller than the aperture of the first through hole 221, and the camera 30 contacts the inner wall surface of the second through hole 241, so that the camera 30 is restricted in the mounting hole 201. Degrees of freedom in a radial plane.
  • the camera 30 is engaged on the inner wall surface of the second through hole 241, and the backlight assembly 24 is further used for positioning the camera 30.
  • the backlight assembly 24 is provided with a plastic ring 240, the plastic ring 240 is located in the second through hole 241, and the camera 30 is fixed in the second through hole 241 through the plastic ring 240.
  • the plastic ring 240 has a certain elasticity, which prevents the backlight assembly 24 and the camera 30 from being scratched and damaged.
  • the transparent cover plate 10 and the liquid crystal panel 22, the liquid crystal panel 22 and the backlight assembly 24 are all pasted through the optical adhesive 290, the optical adhesive 290 is firmly adhered, and the transmittance is high without affecting the display
  • the module 20 displays an image.
  • the display unit 100 has a hole in the lower part to place the camera 30, which reduces the space occupied by the camera 30 in the display area of the display unit 100, and increases the screen ratio of the electronic device 200.
  • the vinyl layer 40 is attached to the transparent cover 10 and the camera. Between 30, the propagation path of the light leaked from the display module 20 at the mounting hole 201 to the light incident surface 32a of the camera 30 is blocked, that is, the display module 20 is prevented from channeling light to the camera 30, which improves the shooting of the camera 30 effect.
  • the display module 100 provided in the second embodiment of the present application is substantially the same as the first embodiment, except that the black adhesive layer 40 includes a first black adhesive layer 42 and a second black adhesive layer 44, and the first black adhesive layer.
  • the vertical projection of 42 on the transparent cover 10 is concentric with the vertical projection of the second vinyl layer 44 on the transparent cover 10, and the diameter of the vertical projection of the first vinyl layer 42 on the transparent cover 10 is smaller than the diameter of the second vinyl layer 44 on The diameter of the transparent cover 10 in the vertical projection, the first black rubber layer 42 and the second black rubber layer 44 jointly block the light leaked from the display module 20 from interfering with the imaging of the optical element 32.
  • the first black rubber layer 42 and the second black rubber layer 44 form two layers of barriers, which further improves the sealing effect of the optical element 32 inside the camera 30 and prevents light leaked from the display module 20 from leaking. This affects the shooting effect of the camera 30.
  • an embodiment of the present application further provides an electronic device 200.
  • the electronic device 200 includes a display assembly 100 provided in the embodiment of the present application.
  • the electronic device 200 further includes a front case 50 and a circuit board 60.
  • the display assembly 100 and the circuit board 60 are located on opposite sides of the front case 50, and the front case 50 is provided with a mounting hole 201 facing the front side.
  • the camera 30 is disposed on the circuit board 60, and the camera 30 passes through the third through hole 501 and is partially located in the mounting hole 201.
  • the front case 50 is a plate-like structure made of a metal or alloy material
  • the front case 50 is a main supporting structure of the electronic device 200.
  • the main board is fixed to the front case 50 by means of sticking or fixing
  • the display screen assembly 100 is also fixed on the front case 50 by means of sticking or fixing by means of fixing.
  • the camera 30 is connected to the circuit board 60 by welding or the like, and is electrically connected to the circuit board 60.
  • the circuit board 60 is used to control the camera 30 to capture images.
  • the camera 30 contacts the inner wall surface of the third through hole 501, thereby limiting the degree of freedom of the camera 30 on a radial plane of the mounting hole 201. Specifically, the camera 30 is engaged with the inner wall surface of the third through hole 501, so that the camera 30 is positioned by the front case 50, and the camera 30 has a good fixing effect. In one embodiment, both the front case 50 and the backlight assembly 24 can play a role of positioning the camera 30.
  • a hole is provided in the lower portion of the display screen assembly 100 to place the camera 30, which reduces the space occupied by the camera 30 in the display area of the display screen assembly 100 and increases the screen ratio of the electronic device 200.
  • an embodiment of the present application further provides a method for manufacturing an electronic device, which is used for manufacturing the electronic device provided by the embodiment of the present application. Specific steps include:
  • a camera is provided.
  • the camera includes a housing and optical components housed in the housing.
  • the housing includes a top surface facing the transparent cover, and the top surface is provided with an opening to expose the optical component.
  • the camera includes a casing and an optical element housed in the casing, and the casing is provided with an opening to expose the optical element.
  • the top part of the housing is a cylindrical structure, and the optical element is located inside the cylindrical shape and receives external light through the opening.
  • the housing connects the optical element and the display module. Group isolated.
  • the light incident surface of the camera is the surface where the optical element receives external light
  • the top surface is the surface of the housing that contacts the vinyl layer.
  • the light incident surface of the camera is recessed in the camera, in other words, in the second direction, that is, the installation In the axial direction of the hole, the height of the light incident surface of the camera is smaller than the height of the top surface.
  • the black rubber layer is disposed on the housing of the camera. Specifically, the black soft rubber is coated on the top surface of the housing. The black soft rubber is subsequently compressed on the top surface and the inner surface and cured to form the black rubber.
  • Floor is a predefined surface of the housing.
  • the top surface is provided with a receiving groove
  • the step of applying black soft glue on the top surface to form a black glue layer includes at least partially filling the black soft glue into the receiving groove.
  • the accommodating groove corresponds to the vinyl layer.
  • the accommodating groove is recessed on the top surface, and the black adhesive layer is accommodated in the accommodating groove.
  • the distance between the camera housing and the transparent cover can be reduced.
  • the black glue layer can be directly applied into the accommodating groove to avoid the inaccurate coating position of the black glue layer on the camera, which simplifies the process of coating the black glue layer.
  • the cooperation of the accommodating groove and the black plastic layer is beneficial to block the light leaked from the display module from passing through the connection between the black plastic layer and the camera, further improving the sealing effect of the optical components inside the camera and avoiding light leakage. To improve the shooting effect of the camera.
  • S103 Provide a transparent cover, and attach the display module to the transparent cover.
  • the display module is provided with a mounting hole.
  • the transparent cover plate is a rigid plate with a certain strength and high light transmittance.
  • the transparent cover plate is a glass cover plate.
  • the glass cover plate has high light transmittance and low cost.
  • the transparent cover can also be a plastic cover.
  • the display module is adhered to the inner surface of the transparent cover plate.
  • the display module is adhered to the transparent cover plate with optical adhesive (OCA), and the optical adhesive is bonded. It has high intensity and high transparency, and has little influence on the display effect of the display module.
  • OCA optical adhesive
  • the display module includes a liquid crystal panel and a backlight assembly.
  • the step of attaching the display module to the transparent cover includes: attaching the liquid crystal panel to the transparent cover, the liquid crystal panel is provided with a first through hole; installing a backlight assembly on a side of the liquid crystal panel facing away from the transparent cover, and backlighting.
  • the component is provided with a second through hole facing the first through hole, and the first through hole communicates with the second through hole to form a mounting hole.
  • the manufacturing process of the liquid crystal panel includes providing a first substrate, forming a black matrix layer on the first substrate, setting a second substrate on the black matrix, at least a part of the black matrix forming an inner wall of the first through hole, and filling the liquid crystal.
  • the molecules are between the first substrate and the second substrate to form a liquid crystal panel.
  • the first substrate may be a color filter substrate
  • the second substrate may be an array substrate.
  • the first polarizer and the second polarizer are attached to the two opposite sides of the liquid crystal panel, respectively, and the polarization directions of the first polarizer and the second polarizer are opposite.
  • the camera is inserted into the mounting hole, and the camera is attached to the transparent cover through a black layer.
  • the display module inevitably leaks light into the mounting hole, and the leaked light partially propagates toward the camera.
  • the housing of the camera and the vinyl layer block the propagation path of the light to the optical elements inside the housing. That is, the display module is prevented from channeling light to the camera, the light incident surface of the camera is prevented from receiving light leaked from the display module, and the shooting effect of the camera is improved.
  • the aperture of the second through hole is smaller than the aperture of the first through hole, and the camera contacts the inner wall surface of the second through hole, thereby limiting the degree of freedom of the camera on the radial plane of the mounting hole.
  • the camera is engaged on the inner wall surface of the second through hole, and the backlight assembly is further used for positioning the camera.
  • the backlight assembly is provided with a plastic ring, the plastic ring is located in the second through hole, and the camera is fixed in the second through hole through the plastic ring.
  • the plastic ring has a certain elasticity, which prevents the backlight assembly and the camera from being scratched and damaged.
  • the camera before the camera is sequentially inserted into the second through hole and the first through hole, the camera is mounted on a circuit board, and the circuit board is mounted on the front case.
  • the front case is provided with a third through hole, and the camera passes through Third through hole.
  • the front case is a plate-like structure made of a metal or alloy material, and the front case is a main supporting structure of an electronic device.
  • the main board is fixed to the front case by means of adhesive or fastener fixing, and the display screen component is also fixed on the front case by means of adhesive or fastener fixing.
  • the camera is connected to the circuit board by means of soldering or the like, and is electrically connected to the circuit board.
  • the circuit board is used to control the camera to capture images.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.
  • the terms “installation”, “connected”, and “connected” should be understood in a broad sense, unless explicitly stated and limited otherwise.
  • they may be fixed connections, or It is detachable or integrated; it can be mechanical, electrical, or can communicate with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two components or two components Interaction.
  • the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.
  • the "upper” or “lower” of the first feature may include the first and second features in direct contact, or may include the first and second features.
  • the second feature is not a direct contact but a contact through another feature between them.
  • the first feature is “above”, “above”, and “above” the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is less horizontal than the second feature.

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Abstract

一种显示屏组件（100）、电子设备（200）及电子设备（200）的制作方法。显示屏组件（100）包括：透明盖板（10）；显示模组（20），显示模组（20）设置于透明盖板（10）的一侧，显示模组（20）设有安装孔（201）；摄像头（30），摄像头（30）至少部分收容于安装孔（201）内，摄像头（30）包括外壳（34）与收容于外壳（34）内的光学元件（32），外壳（34）包括面向透明盖板（10）的顶端面（34a），顶端面（34a）设有开口（36）以露出光学元件（32）；黑胶层（40），黑胶层（40）位于顶端面（34a）上，摄像头（30）通过黑胶层（40）贴合于透明盖板（10）上，黑胶层（40）用于阻挡显示模组（20）漏出的光线干扰光学元件（32）成像。电子设备（200）的制作方法包括将黑胶层（40）粘贴于透明盖板（10）与摄像头（30）之间，避免了显示模组（20）向摄像头（30）窜光，提高了摄像头（30）的拍摄效果。

Description

显示屏组件、电子设备及电子设备的制作方法 技术领域
本申请涉及电子装置技术领域，尤其涉及一种显示屏组件、电子设备及电子设备的制作方法。
背景技术
随着科技的进步，手机、平板电脑等电子设备在人们的工作、生活中的重要性越来越大，消费者不仅关注电子设备的功能，还对电子设备的外观要求也越来越高。全面屏设计以极高的屏占比给用户带来了极大的冲击，深受用户的喜爱和追捧。现有技术中，前置摄像头等电子组件会占用电子设备的显示面的空间，从而影响了屏占比。
发明内容
本申请提供了一种显示屏组件，包括：
透明盖板；
显示模组，所述显示模组设置于所述透明盖板的一侧，所述显示模组设有安装孔；
摄像头，所述摄像头至少部分收容于所述安装孔内，所述摄像头包括外壳与收容于所述外壳内的光学元件，所述外壳包括面向所述透明盖板的顶端面，所述顶端面设有开口以露出所述光学元件；
黑胶层，所述黑胶层位于所述顶端面上，所述摄像头通过所述黑胶层贴合于所述透明盖板上，所述黑胶层用于阻挡所述显示模组漏出的光线干扰所述光学元件成像。
本申请还提供了一种电子设备，包括显示屏组件。
本申请还提供了一种电子设备的制作方法，包括：
提供摄像头，所述摄像头包括外壳与收容于所述外壳内的光学元件，所述外壳包括面向所述透明盖板的顶端面，所述顶端面设有开口以露出所述光学元 件；
在所述顶端面上涂覆黑色软胶形成黑胶层；
提供透明盖板，贴合显示模组于所述透明盖板上，所述显示模组设有安装孔；
将所述摄像头插入所述安装孔，所述摄像头通过所述黑胶层贴合于所述透明盖板上。
本申请的有益效果如下：显示屏组件下开孔以放置摄像头，降低了摄像头在显示屏组件的显示区域占用的空间，提高了电子设备的屏占比，黑胶层粘贴于透明盖板与摄像头之间，阻断了显示模组于安装孔处漏出的光线向摄像头的入光面的传播路径，即避免了显示模组向摄像头窜光，提高了摄像头的拍摄效果。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的示意图。
图2为本申请实施例一提供的显示屏组件的正视图。
图3为图2的A-A截面示意图。
图4为图3的B位置放大示意图。
图5为本申请实施例一提供的显示屏组件的工作原理示意图。
图6为显示屏组件的一种实施方式的示意图。
图7为显示屏组件的另一种实施方式的示意图。
图8为显示屏组件的另一种实施方式的示意图。
图9为本申请实施例一提供的显示屏组件的示意图。
图10为图9的C位置放大示意图。
图11为本申请实施例一提供的显示模组的示意图。
图12为本申请实施例二提供的显示屏组件的示意图。
图13为本申请实施例提供的电子设备的示意图。
图14为本申请实施例提供的电子设备的制作方法的流程示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图1，本申请实施例提供的显示屏组件100应用于电子设备200，具体的，电子设备200包括但不限于手机、平板电脑、笔记本电脑等。
请参阅图2和图3，图2为本申请实施例一提供的显示屏组件100的正视图，图3为图2的A-A方向的截面示意图。本申请实施例一提供的显示屏组件100包括透明盖板10、显示模组20、摄像头30及黑胶层40。具体的，透明盖板10为具有一定强度且透光率高的硬板，透明盖板10用于保护透明盖板10下的显示模组20等器件。一种实施方式中，透明盖板10为玻璃盖板，玻璃盖板的透光率高且成本较低，其他实施方式中，透明盖板10也可以为塑料盖板。具体到图2，显示模组20设置于透明盖板10的一侧，具体的，玻璃盖板包括相对设置的外表面10b与内表面10a，外表面10b为面向电子设备200外的表面，换言之，当用户使用电子设备200时，玻璃盖板的外表面10b为朝向用户的表面，相对的，内表面10a为玻璃盖板面向电子设备200内部的表面。本实施例中，显示模组20设置于透明盖板10的内表面10a上，一种实施方式中，显示模组20通过光学胶(Optically Clear Adhesive，OCA)粘贴在透明盖板10上，光学胶的粘结强度高，且具有较高的透明度，对显示模组20的显示效果的影响小。本实施例中，显示模组20设有安装孔201，结合图2，安装孔201位于显示模组20的显示区，有利于降低安装孔201对显示屏组件100的屏占比的影响效果。进一步的，安装孔201为贯穿显示模组20的通孔，一种实施方式中，安装孔201为圆孔。
请参阅图3和图4，图4为图3的部分放大示意图。摄像头30至少部分收容于安装孔201内，具体的，摄像头30的入光面32a面向透明盖板10，换言之，外界光线穿过透明盖板10后进入摄像头30的入光面32a而成像。本实施例中，摄像 头30部分收容于安装孔201内，可以减小安装孔201的尺寸。显示屏组件100下开孔以放置摄像头30，降低了摄像头30在显示屏组件100的显示区域占用的空间，提高了电子设备200的屏占比。
请继续参阅图3和图4，本实施例中，黑胶层40收容于安装孔201内，并且黑胶层40至少部分位于透明盖板10与摄像头30之间，黑胶层40用于阻挡显示模组20漏出的光线进入摄像头30的入光面32a。具体的，黑胶层40是涂覆于摄像头30的上黑色软胶被压缩并固化后形成。本实施例中，黑胶层40一侧位于透明盖板10的内表面10a上，另一侧抵接摄像头30，从而将黑胶层40压缩于透明盖板10与摄像头30之间，使黑胶层40与摄像头30的连接处的密封效果更好。进一步的，摄像头30包括面向透明盖板10的顶端面34a，黑胶层40位于顶端面34a上，使黑胶层40压缩于顶端面34a与内表面10a之间。与此同时，摄像头30通过黑胶层40贴合于透明盖板10上，换言之，黑胶层40还起到了固定连接顶端面34a与内表面10a的作用，从而固定了摄像头30与透明盖板10。
请参阅图5，摄像头30包括外壳34与收容于外壳34内的光学元件32，外壳34设有开口36以露出光学元件32，事实上，黑胶层40设置于摄像头30的外壳34上，而使黑胶层40贴合于透明盖板10与摄像头30之间。具体的，外壳34的顶端部分为圆筒状的结构，光学元件32位于圆筒状的内部，并通过开口36接收外界光线，在第一方向X上，即安装孔201的径向上，外壳34将光学元件32与显示模组20隔离。摄像头30的入光面32a为光学元件32接收外界光的表面，顶端面34a为外壳34接触黑胶层40的表面，本实施例中，摄像头30的入光面32a凹陷于摄像头30内，换言之，在第二方向Y上，即安装孔201的轴向上，摄像头30入光面32a的高度小于顶端面34a的高度。如图5所示，显示模组20不可避免的会向安装孔201内漏出光线，漏出的光线部分向摄像头30方向传播，摄像头30的外壳34及黑胶层40阻断了该光线向外壳34内部的光学元件32的传播路径，即避免了显示模组20向摄像头30窜光，避免了摄像头30的入光面32a接收显示模组20漏出的光线，提高了摄像头30的拍摄效果。
请参阅图3和图4，本实施例中，黑胶层40在透明盖板10的垂直投影为环形，换言之，黑胶层40为环状结构，外壳34接触黑胶层40，外部光线依次穿过黑胶层40的中心孔、开口36后进入入光面32a，从而于光学元件32内成像。具体的， 摄像头30外壳34的环形的顶端面34a抵接环形的黑胶层40，并使黑胶层40另一侧抵接在透明盖板10上，换言之，光学元件32密封于透明盖板10与摄像头30的外壳34之间，结合图5，只有穿过透明盖板10的外界光线可以依次穿过黑胶层40的中心孔、开口36后进入光学元件32成像，而显示模组20漏出的光线被外壳34及黑胶层40遮挡而无法进入光学元件32。
请参阅图6，一种实施方式中，顶端面34a设有容纳槽34b，黑胶层40至少部分位于容纳槽34b内。具体的，容纳槽34b与黑胶层40对应，容纳槽34b内陷于顶端面34a，黑胶层40收容于容纳槽34b，一方面可以减小摄像头30的外壳34与透明盖板10的间距，另一方面，在将黑胶层40涂覆到摄像头30的过程中，可以直接将黑胶层40涂覆到容纳槽34b内，避免黑胶层40在摄像头30的涂覆位置不准，简化了涂覆黑胶层40过程。本实施例中，容纳槽34b与黑胶层40的配合有利于阻挡显示模组20漏出的光线穿过黑胶层40与摄像头30的连接处，进一步提高了对摄像头30内部的光学元件32的密封效果，避免了窜光，提高了摄像头30的拍摄效果。
请参阅图7，一种实施方式中，黑胶层40覆盖顶端面34a，从而增大黑胶层40与顶端面34a、黑胶层40与内表面10a的接触面积，加大了摄像头30与透明盖板10的连接强度。
请参阅图8，一种实施方式中，透明盖板10的内表面10a包括过渡区域102a，过渡区域102a正对安装孔201，且过渡区域102a位于外壳34在内表面10a的垂直投影与显示模组20在内表面10a的垂直投影之间，黑胶层40覆盖过渡区域102a，以阻挡显示模组20漏出的光线自过渡区域102a进入透明盖板10。具体的，过渡区域102a对应安装孔201内未接触摄像头30的区域，黑胶层40覆盖过渡区域102a，黑胶层40阻断了显示模组20漏出的光线进入透明盖板10的路径，避免了该光线进入透明盖板10后在透明盖板10内反射，从而杜绝了该光线从透明盖板10多次反射后射出而穿过外壳34的开口36进入光学元件32，进一步避免了显示模组20漏出的光线向摄像头30窜光，提高了摄像头30的拍摄效果。
请参阅图9和图10，图10为图9的部分放大示意图。本实施例中，显示模组20包括依次层叠设置于透明盖板10上的液晶面板22和背光组件24，液晶面板22设有第一通孔221，背光组件24设有正对第一通孔221的第二通孔241，第一通 孔221与第二通孔241连通形成安装孔201。具体的，第一通孔221和第二通孔241均为圆孔，摄像头30依次穿过第二通孔241及第一通孔221后抵接黑胶层40。本实施例中，背光组件24为直下式背光源或侧入式背光源，其中，侧入式背光源的厚度更小。背光组件24用于提供背光源，背光源穿过液晶面板22后使显示模组20显示图像。本实施例中，液晶面板22可能从第一通孔221的内壁面漏出光线，背光组件24也可能从第二通孔241的内壁面漏出光线。
请参阅图11，液晶面板22包括第一基板222、第二基板224、液晶分子226及黑色矩阵228，第一基板222与第二基板224相对设置，液晶分子226和黑色矩阵228位于第一基板222与第二基板224之间。本实施例中，液晶面板22相对的两侧还设有偏振方向垂直的第一偏振片262和第二偏振片264。具体的，第一基板222可以为彩膜基板，第二基板224可以为阵列基板。驱动电路控制第一基板222与第二基板224之间的电压差而控制液晶分子226旋转，从而控制穿过液晶面板22的光线，即控制显示模组20显示的图像。本实施例中，至少部分黑色矩阵228形成第一通孔221的内壁，以防止液晶分子226漏出。黑色矩阵228不仅用于支撑第一基板222与第二基板224之间的距离，还用于在第一通孔221处封闭液晶面板22，放置液晶分子226从第一通孔221流出。
请参阅图9和图10，本实施例中，第二通孔241的孔径小于第一通孔221的孔径，摄像头30接触第二通孔241的内壁面，从而限制摄像头30在安装孔201的径向平面上的自由度。具体的，摄像头30卡合在第二通孔241的内壁面上，背光组件24还用于定位摄像头30。一种实施方式中，背光组件24设有塑胶圈240，塑胶圈240位于第二通孔241内，摄像头30经塑胶圈240固定于第二通孔241内。塑胶圈240具有一定的弹性，避免背光组件24与摄像头30相互刮擦而损坏。
请参阅图11，一种实施方式中，透明盖板10与液晶面板22、液晶面板22与背光组件24均通过光学胶290粘贴，光学胶290的粘贴牢固，且透过率高，不影响显示模组20显示图像。
显示屏组件100下开孔以放置摄像头30，降低了摄像头30在显示屏组件100的显示区域占用的空间，提高了电子设备200的屏占比，黑胶层40粘贴于透明盖板10与摄像头30之间，阻断了显示模组20于安装孔201处漏出的光线向摄像头30的入光面32a的传播路径，即避免了显示模组20向摄像头30窜光，提高了 摄像头30的拍摄效果。
请参阅图12，本申请实施例二提供的显示屏组件100与实施例一大致相同，区别在于，黑胶层40包括第一黑胶层42与第二黑胶层44，第一黑胶层42在透明盖板10的垂直投影与第二黑胶层44在透明盖板10的垂直投影同心，第一黑胶层42在透明盖板10的垂直投影的直径小于第二黑胶层44在透明盖板10的垂直投影的直径，第一黑胶层42和第二黑胶层44共同阻挡显示模组20漏出的光线干扰光学元件32成像。本实施例中，第一黑胶层42与第二黑胶层44形成了两层阻隔，进一步的提高了对摄像头30内部的光学元件32的密封效果，避免显示模组20漏出的光线窜光而影响摄像头30的拍摄效果。
请参阅图1和图12，本申请实施例还提供一种电子设备200，电子设备200包括本申请实施例提供的显示屏组件100。具体到图12，本实施例中，电子设备200还包括前壳50和电路板60，显示屏组件100和电路板60位于前壳50相对的两侧，前壳50设有正对安装孔201的第三通孔501，摄像头30设置于电路板60上，摄像头30穿过第三通孔501而部分位于安装孔201内。具体的，前壳50为金属或合金材料制成的板状结构，前壳50为电子设备200的主要支撑结构。本实施例中，主板通过粘贴或紧固件固定等方式固定在前壳50上，显示屏组件100也以粘贴或紧固件固定等方式固定在前壳50上。摄像头30通过焊接等方式连接在电路板60上，并与电路板60电连接。一种实施方式中，电路板60用于控制摄像头30拍摄图像。
请参阅图13，本实施例中，摄像头30接触第三通孔501的内壁面，从而限制摄像头30在安装孔201的径向平面上的自由度。具体的，摄像头30卡合在第三通孔501的内壁面上，从而通过前壳50定位摄像头30，摄像头30的固定效果好。一种实施方式中，前壳50及背光组件24均可以起到定位摄像头30的作用。
本实施例中，显示屏组件100下开孔以放置摄像头30，降低了摄像头30在显示屏组件100的显示区域占用的空间，提高了电子设备200的屏占比。
请参阅图14，本申请实施例还提供一种电子设备的制作方法，用于制作本申请实施例提供的电子设备。具体的步骤包括：
S101、提供摄像头，摄像头包括外壳与收容于外壳内的光学元件，外壳包括面向透明盖板的顶端面，顶端面设有开口以露出光学元件。
本实施例中，摄像头包括外壳与收容于外壳内的光学元件，外壳设有开口以露出光学元件。具体的，外壳的顶端部分为圆筒状的结构，光学元件位于圆筒状的内部，并通过开口接收外界光线，在第一方向上，即安装孔的径向上，外壳将光学元件与显示模组隔离。摄像头的入光面为光学元件接收外界光的表面，顶端面为外壳接触黑胶层的表面，本实施例中，摄像头的入光面凹陷于摄像头内，换言之，在第二方向上，即安装孔的轴向上，摄像头入光面的高度小于顶端面的高度。
S102、在顶端面上涂覆黑色软胶形成黑胶层。
本实施例中，黑胶层设置于摄像头的外壳上，具体的，将黑色软胶涂覆于外壳的顶端面上，黑色软胶后续被压缩在顶端面与内表面上并固化后形成黑胶层。
一种实施方式中，顶端面设有容纳槽，在顶端面上涂覆黑色软胶形成黑胶层的步骤包括，将黑色软胶至少部分填充于容纳槽内。具体的，容纳槽与黑胶层对应，容纳槽内陷于顶端面，黑胶层收容于容纳槽，一方面可以减小摄像头的外壳与透明盖板的间距，另一方面，在将黑胶层涂覆到摄像头的过程中，可以直接将黑胶层涂覆到容纳槽内，避免黑胶层在摄像头的涂覆位置不准，简化了涂覆黑胶层过程。本实施例中，容纳槽与黑胶层的配合有利于阻挡显示模组漏出的光线穿过黑胶层与摄像头的连接处，进一步提高了对摄像头内部的光学元件的密封效果，避免了窜光，提高了摄像头的拍摄效果。
S103、提供透明盖板，贴合显示模组于透明盖板上，显示模组设有安装孔。
具体的，透明盖板为具有一定强度且透光率高的硬板，一种实施方式中，透明盖板为玻璃盖板，玻璃盖板的透光率高且成本较低，其他实施方式中，透明盖板也可以为塑料盖板。
本实施例中，显示模组贴合于透明盖板的内表面上，一种实施方式中，显示模组通过光学胶(Optically Clear Adhesive，OCA)粘贴在透明盖板上，光学胶的粘结强度高，且具有较高的透明度，对显示模组的显示效果的影响小。
本实施例中，显示模组包括液晶面板和背光组件。具体的，贴合显示模组于透明盖板的步骤包括：贴合液晶面板于透明盖板上，液晶面板设有第一通孔；安装背光组件于液晶面板背离透明盖板的一侧，背光组件设有正对第一通孔的 第二通孔，第一通孔与第二通孔连通形成安装孔。
本实施例中，液晶面板的制作过程包括，提供第一基板，在第一基板上形成黑色矩阵层，在黑色矩阵上设置第二基板，至少部分黑色矩阵形成第一通孔的内壁，填充液晶分子于第一基板与第二基板之间，形成液晶面板。具体的，第一基板可以为彩膜基板，第二基板可以为阵列基板。
本实施例中，完成液晶面板后，还在液晶面板的相对的两侧分别贴合第一偏振片与第二偏振片，第一偏振片与第二偏振片的偏振方向相反。
S104、将摄像头插入安装孔，摄像头通过黑胶层贴合于透明盖板上。
本实施例中，显示模组不可避免的会向安装孔内漏出光线，漏出的光线部分向摄像头方向传播，摄像头的外壳及黑胶层阻断了该光线向外壳内部的光学元件的传播路径，即避免了显示模组向摄像头窜光，避免了摄像头的入光面接收显示模组漏出的光线，提高了摄像头的拍摄效果。
本实施例中，第二通孔的孔径小于第一通孔的孔径，摄像头接触第二通孔的内壁面，从而限制摄像头在安装孔的径向平面上的自由度。具体的，摄像头卡合在第二通孔的内壁面上，背光组件还用于定位摄像头。一种实施方式中，背光组件设有塑胶圈，塑胶圈位于第二通孔内，摄像头经塑胶圈固定于第二通孔内。塑胶圈具有一定的弹性，避免背光组件与摄像头相互刮擦而损坏。
本实施例中，将摄像头依次插入第二通孔和第一通孔之前，将摄像头安装于电路板上，并将电路板安装于前壳上，前壳设有第三通孔，摄像头穿过第三通孔。具体的，前壳为金属或合金材料制成的板状结构，前壳为电子设备的主要支撑结构。本实施例中，主板通过粘贴或紧固件固定等方式固定在前壳上，显示屏组件也以粘贴或紧固件固定等方式固定在前壳上。摄像头通过焊接等方式连接在电路板上，并与电路板电连接。一种实施方式中，电路板用于控制摄像头拍摄图像。
需要理解的是，在本申请的实施方式的描述中，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请的实施方式和简化描述，而不是指示或暗示所指的装置或元件必须具有特定 的方位、以特定的方位构造和操作，因此不能理解为对本申请的实施方式的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的实施方式的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的实施方式的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请的实施方式中的具体含义。
在本申请的实施方式中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的实施方式的不同结构。为了简化本申请的实施方式的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请的实施方式可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请的实施方式提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一 个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易的想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (20)

  1. 一种显示屏组件，其特征在于，包括：
    透明盖板；
    显示模组，所述显示模组设置于所述透明盖板的一侧，所述显示模组设有安装孔；
    摄像头，所述摄像头至少部分收容于所述安装孔内，所述摄像头包括外壳与收容于所述外壳内的光学元件，所述外壳包括面向所述透明盖板的顶端面，所述顶端面设有开口以露出所述光学元件；
    黑胶层，所述黑胶层位于所述顶端面上，所述摄像头通过所述黑胶层贴合于所述透明盖板上，所述黑胶层用于阻挡所述显示模组漏出的光线干扰所述光学元件成像。
  2. 根据权利要求1所述的显示屏组件，其特征在于，所述黑胶层在所述透明盖板的垂直投影为环形。
  3. 根据权利要求2所述的显示屏组件，其特征在于，所述顶端面设有容纳槽，所述黑胶层至少部分位于所述容纳槽内。
  4. 根据权利要求2所述的显示屏组件，其特征在于，所述黑胶层覆盖所述顶端面。
  5. 根据权利要求2所述的显示屏组件，其特征在于，所述黑胶层包括第一黑胶层与第二黑胶层，所述第一黑胶层在所述透明盖板的垂直投影与所述第二黑胶层在所述透明盖板的垂直投影同心，所述第一黑胶层在所述透明盖板的垂直投影的直径小于所述第二黑胶层在所述透明盖板的垂直投影的直径，所述第一黑胶层和所述第二黑胶层共同阻挡所述显示模组漏出的光线干扰所述光学元件成像。
  6. 根据权利要求1所述的显示屏组件，其特征在于，所述透明盖板包括面向所述摄像头的内表面，所述内表面包括过渡区域，所述过渡区域正对所述安装孔，且所述过渡区域位于所述壳体在所述内表面的垂直投影与所述显示模组在所述内表面的垂直投影之间，所述过渡区域上设有遮挡层，所述遮挡层用于阻挡所述显示模组漏出的光线自所述过渡区域进入所述透明盖板。
  7. 根据权利要求1至6任意一项所述的显示屏组件，其特征在于，所述显示模组包括依次层叠设置于所述盖板上的液晶面板和背光组件，所述液晶面板设有第一通孔，所述背光组件设有正对所述第一通孔的第二通孔，所述第一通孔与所述第二通孔连通形成所述安装孔。
  8. 根据权利要求7所述的显示屏组件，其特征在于，所述液晶面板包括第一基板、第二基板、液晶分子及黑色矩阵，所述第一基板与所述第二基板相对设置，所述液晶分子和所述黑色矩阵位于所述第一基板与所述第二基板之间，至少部分所述黑色矩阵形成所述第一通孔的内壁，以防止所述液晶分子漏出。
  9. 根据权利要求7所述的显示屏组件，其特征在于，所述第二通孔的孔径小于所述第一通孔的孔径，所述摄像头接触所述第二通孔的内壁面，从而限制所述摄像头在所述安装孔的径向平面上的自由度。
  10. 根据权利要求7所述的显示屏组件，其特征在于，所述背光组件设有塑胶圈，所述塑胶圈位于所述第二通孔内，所述摄像头经所述塑胶圈固定于所述第二通孔内。
  11. 根据权利要求7所述的显示屏组件，其特征在于，所述透明盖板与所述液晶面板、所述液晶面板与所述背光组件均通过光学胶粘贴。
  12. 一种电子设备，其特征在于，所述电子设备包括权利要求1至11任意一项所述的显示屏组件。
  13. 根据权利要求12所述的电子设备，其特征在于，所述电子设备还包括前壳和电路板，所述显示屏组件和所述电路板位于所述前壳相对的两侧，所述前壳设有正对所述安装孔的第三通孔，所述摄像头设置于所述电路板上，所述摄像头穿过所述第三通孔而部分位于所述安装孔内。
  14. 根据权利要求13所述的电子设备，其特征在于，所述摄像头接触所述第三通孔的内壁面，从而限制所述摄像头在所述安装孔的径向平面上的自由度。
  15. 一种电子设备的制作方法，其特征在于，包括：
    提供摄像头，所述摄像头包括外壳与收容于所述外壳内的光学元件，所述外壳包括面向所述透明盖板的顶端面，所述顶端面设有开口以露出所述光学元件；
    在所述顶端面上涂覆黑色软胶形成黑胶层；
    提供透明盖板，贴合显示模组于所述透明盖板上，所述显示模组设有安装孔；
    将所述摄像头插入所述安装孔，所述摄像头通过所述黑胶层贴合于所述透明盖板上。
  16. 根据权利要求15所述的电子设备的制作方法，其特征在于，所述顶端面设有容纳槽，在所述顶端面上涂覆所述黑色软胶形成黑胶层的步骤包括，将所述黑色软胶至少部分填充于所述容纳槽内。
  17. 根据权利要求15所述的电子设备的制作方法，其特征在于，贴合所述显示模组于所述透明盖板上的步骤包括，
    贴合液晶面板于所述透明盖板上，所述液晶面板设有第一通孔；
    安装背光组件于所述液晶面板背离所述透明盖板的一侧，所述背光组件设有正对所述第一通孔的第二通孔，所述第一通孔与所述第二通孔连通形成所述安装孔。
  18. 根据权利要求17所述的电子设备的制作方法，其特征在于，贴合所述液晶面板于所述透明盖板上的步骤之前，所述电子设备的制作方法还包括，提供第一基板，在所述第一基板上形成黑色矩阵层，在所述黑色矩阵上设置第二基板，至少部分所述黑色矩阵形成所述第一通孔的内壁，填充液晶分子于所述第一基板与所述第二基板之间，形成所述液晶面板。
  19. 根据权利要求18所述的电子设备的制作方法，其特征在于，安装所述背光组件于所述液晶面板背离所述透明盖板的一侧的步骤之前，所述电子设备的制作方法还包括，将塑胶圈固定于所述第二通孔内，所述摄像头经所述塑胶圈固定于所述第二通孔内。
  20. 根据权利要求15所述的电子设备的制作方法，其特征在于，将所述摄像头插入所述安装孔的步骤之前，所述电子设备的制作方法还包括，将所述摄像头安装于电路板上，并将所述电路板安装于前壳上，所述前壳设有第三通孔，所述摄像头穿过所述第三通孔。
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