WO2019228592A1 - Dispositif d'aération et installation de production de vide - Google Patents

Dispositif d'aération et installation de production de vide Download PDF

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Publication number
WO2019228592A1
WO2019228592A1 PCT/DE2019/100467 DE2019100467W WO2019228592A1 WO 2019228592 A1 WO2019228592 A1 WO 2019228592A1 DE 2019100467 W DE2019100467 W DE 2019100467W WO 2019228592 A1 WO2019228592 A1 WO 2019228592A1
Authority
WO
WIPO (PCT)
Prior art keywords
ventilation
ventilation device
valve
buffer tank
lock chamber
Prior art date
Application number
PCT/DE2019/100467
Other languages
German (de)
English (en)
Inventor
Marco Fröhner
Alexander Böddicker
Original Assignee
Meyer Burger (Germany) Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meyer Burger (Germany) Gmbh filed Critical Meyer Burger (Germany) Gmbh
Priority to DE112019002724.7T priority Critical patent/DE112019002724A5/de
Publication of WO2019228592A1 publication Critical patent/WO2019228592A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Definitions

  • the present invention relates to a ventilation device having at least one inlet of a ventilation gas from a ventilation gas source in the ventilation device, and at least one valve, wherein the valve for venting is openable to flow the ventilation gas in a lock chamber of a vacuum system in an inflow direction. Furthermore, the invention relates to a vacuum production plant with high throughput requirements and at least one
  • Vacuum systems often have locks in order not to have to open the entire vacuum system for retraction and for extending objects in the vacuum system, but only a small part of the system, namely the lock chamber or more lock chambers.
  • the lock or the lock chamber either serves to
  • Vacuum production plants have been used for various purposes for decades. In recent years, photovoltaic has enjoyed great economic success. Solar cell-based solar power plants have become the least expensive and cleanest electrical energy sources on Earth, thanks to the fast and cost-effective production of semiconductor-based solar cells. Further cost savings in the production of future solar cells will require vacuum production equipment with high throughputs of more than 4000 solar wafers per hour. With the increasing demands for throughput, i. to the
  • Vacuum production systems for example on the coating chambers, are not sufficient alone to meet the increasing demands. All other parts of the vacuum production plants must be improved in accordance with the growing demands. The removal of solar wafers must be done quickly. When aerating the discharge chamber more quickly, breakage of solar wafers should be avoided as much as possible.
  • Continuous flow systems such as e.g. in DE 10 2016 107 830 Al, or corresponding arrangements of several lock chambers in one-end systems.
  • the installation of additional lock chambers is expensive and leads over a larger footprint of the vacuum production plant to correspondingly high follow-up costs.
  • the object is achieved by a ventilation device, which is characterized in that the ventilation device in the inflow direction in front of the valve has a compressed gas storage and after the valve has a buffer tank.
  • the ventilation device according to the invention is very simple, constructed from a few inexpensive standard components.
  • the compressed gas storage can in the cyclic operation of
  • the compressed gas storage for the next ventilation step can be filled up to the specified ventilation pre-pressure.
  • the valve need not be a special proportional or control valve, often a simple on-off valve is sufficient.
  • the buffer container is arranged in the inflow direction behind the valve and thus connected with the valve closed with the evacuated, downstream lock chamber. After opening the valve, the pressure in the buffer volume slowly rises. This avoids an initial pressure surge when opening the valve in the lock chamber.
  • the buffer volume of the buffer container prevents an initially higher flow velocity due to the maximum pressure difference between the venting upstream pressure and the lock internal pressure when opening the valve, because the inflow velocity of the venting gas into the lock chamber initially as a function of lower differential pressure between the buffer tank and the lock chamber adjusts. With the filling of the buffer tank, the differential pressure to be ventilated chamber increases.
  • the buffer tank can be used temporarily as a vacuum buffer tank for faster evacuation.
  • the aeration gas may be air, dried or purified air, nitrogen, oxygen, water vapor, or another venturi gas or gas mixture.
  • the ventilation device may have a ventilation piping. Through the pipes of the ventilation piping, the ventilation gas can be cheaply brought to the required locations. In other variants of the
  • Ventilation device can channels, for example within a
  • showerheads in the lock chamber used for gas distribution. It may also be a buffer tank attached directly to a ventilation inlet or at several
  • Ventilation entrances can be mounted in each case a small buffer tank.
  • a pressure equalization line can be installed, which, when opened, has a larger passage cross-section than the
  • Ventilation piping The pressure equalization line can be used to quickly equalize the pressure between the compressed gas storage tank and the buffer tank so that the goal of quickly aerating the lock is achieved.
  • the compressed gas storage, the valve and the buffer tank can alternatively be mounted directly to each other.
  • the ventilation piping may have at least one branch.
  • the venting of the lock should be done quickly, but strong currents in the lock are undesirable because they can lead to damage of substrates or to the stirring up of particles.
  • the aeration flows can be reduced by a divider 2 or greater, and overall, beneficial flows in the airlock can be adjusted. In this case, some simple openings can be used as a gas inlet within the ventilated chamber. If it is expedient, a distribution of the venting gas can also be realized within the lock via branched pipes or otherwise.
  • the ventilation piping may terminate at least two flanges, the
  • Connecting flanges can be connected to ventilation entrances of a lock chamber. Flanges can be easily and quickly opened during maintenance. If maintenance is not or only rarely required, the ventilation piping can also be permanently, without
  • the buffer tank may be smaller than the accumulator.
  • the lock may have a volume of 401.
  • the compressed gas storage can have a volume of 101 and the
  • Buffer tank has a volume of 21. A small buffer tank delays the venting and evacuation little. However, the buffer tank must be large enough to achieve the desired buffering effect after valve opening, i. the damage of
  • the optimum size of the buffer container will depend on a number of factors and may be determined by one skilled in the art to an individual case.
  • the size of the buffer tank may be approximately 1/5 the size of the accumulator.
  • the aeration gas can be available in the compressed gas storage at a high pressure, in particular at a pressure above 5 bar.
  • a template pressure of 5.8 bar can be set so that more gas is stored in the compressed gas storage than is required for aeration.
  • the flea of the template pressure depends on which aeration gas is used, for example, whether air from a compressor must be compressed, or whether the compressed gas is already available in compressed form from a flop pressure bottle. At a higher form a smaller accumulator is sufficient and at a lower form a larger pressure accumulator is needed.
  • the available space is therefore also a criterion for determinations of the form and the size of the compressed gas storage.
  • the buffer tank is in variants of the ventilation device according to the invention an integral part of the airlock chamber to be ventilated.
  • a lock chamber is made by milling from a solid aluminum block, walls of the later buffer tank can be left standing during milling.
  • the buffer container can then be completed by inflating a lid.
  • Such an integrated buffer container can be provided material and space economically.
  • the valve can be a flood valve.
  • a flood valve is a valve that quickly releases a large flood cross section.
  • the flood valve is simple, correspondingly inexpensive and durable.
  • Sliding valves or control valves may be used, depending on the concrete to be met
  • the object of the invention is achieved in one aspect by a vacuum production plant with high throughput requirements and at least one lock chamber, which has at least one ventilation device according to the invention on at least one chamber.
  • Vacuum production systems have different structures. For example, single-end configurations are used in which the substrates to be processed at one end of the plant, i. in a lock, both retracted and
  • the lock is an in- and outfeed chamber.
  • Other vacuum production plants are conceived as so - called in - line or continuous plants, in which the substrates are retracted in one direction into a Einschleushunt and from a
  • Lock chambers must be periodically ventilated and evacuated.
  • the gentle and rapid venting with the ventilation device according to the invention is particularly needed in simple Ausschleushuntn and combined infeed and Ausschleushuntn because in the venting the damage of sensitive substrates, such as solar wafers, is to be avoided.
  • ventilation may also be required on a chamber other than a lock chamber and may be realized by at least one ventilation device according to the invention.
  • Two or more than two ventilation devices according to the invention may also be installed on a lock chamber of the vacuum production system according to the invention in order to provide the ventilation gas in the lock chamber as needed.
  • the vacuum production plant according to the invention may be a plant for the production of solar wafers with a throughput of more than 4000 solar wafers per hour.
  • the production volumes of solar cells are currently increasing at an annual rate of approximately 30%, based on 100 GW of solar cell output produced annually in 2017 worldwide.
  • sink the production volumes of solar cells are currently increasing at an annual rate of approximately 30%, based on 100 GW of solar cell output produced annually in 2017 worldwide.
  • Vacuum production plant Randomly described options or features of the invention may not be misinterpreted as a compelling combination of features.
  • Fig. 1 shows two ventilation devices according to the invention.
  • FIG. 1 shows two ventilation devices 1 according to the invention in a perspective view
  • Each ventilation device 1 has a valve 2 between a
  • Embodiment is integrated into a pressure equalization line 8.
  • the valve 2 is mounted directly at the outlet of the compressed gas reservoir 3 or at the inlet of the buffer tank 4.
  • the ventilation gas is passed from a ventilation piping 5 to the connection flanges 7, which are detachably connected to the lock chamber, not shown.
  • the ventilation piping 5 3 branches 6a, 6b, 6c are involved in the illustrated embodiment, so that from the one outlet of the buffer tank 4, the ventilation gas is distributed to four flanges.
  • the connected discharge chamber has not only four but eight inputs for the ventilation gas. In the illustrated embodiment, a second to the other four inputs for the ventilation gas to the discharge chamber
  • Ventilation device 1 connected, which is largely the same as the first ventilation device 1, but mirrored constructed.
  • the two ventilation devices 1 are each supplied via a ventilation gas inlet 9 via a ventilation gas supply, not shown, with the ventilation gas.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif d'aération présentant au moins une conduite d'alimentation d'un gaz d'aération à partir d'une source de gaz d'aération dans le dispositif d'aération et au moins une vanne, la vanne pouvant être ouverte pour l'aération pour l'écoulement du gaz d'aération dans un sas d'une installation de vide dans un sens d'écoulement. En outre, l'invention concerne une installation de production de vide présentant des exigences de débit élevé et au moins un sas. Le problème de la présente invention concerne la réalisation d'un dispositif d'aération simple qui permet une aération rapide d'un sas d'une installation de production de vide. Le problème est résolu par un dispositif d'aération qui est caractérisé en ce que le dispositif d'aération présente, dans le sens d'écoulement, un accumulateur de gaz sous pression en amont de la vanne et un récipient tampon en aval de la vanne.
PCT/DE2019/100467 2018-05-29 2019-05-27 Dispositif d'aération et installation de production de vide WO2019228592A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112019002724.7T DE112019002724A5 (de) 2018-05-29 2019-05-27 Belüftungsvorrichtung und vakuumproduktionsanlage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018112853.3A DE102018112853A1 (de) 2018-05-29 2018-05-29 Belüftungsvorrichtung und Vakuumproduktionsanlage
DE102018112853.3 2018-05-29

Publications (1)

Publication Number Publication Date
WO2019228592A1 true WO2019228592A1 (fr) 2019-12-05

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PCT/DE2019/100467 WO2019228592A1 (fr) 2018-05-29 2019-05-27 Dispositif d'aération et installation de production de vide

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CN (2) CN110541154A (fr)
DE (2) DE102018112853A1 (fr)
WO (1) WO2019228592A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018112853A1 (de) * 2018-05-29 2019-12-05 Meyer Burger (Germany) Gmbh Belüftungsvorrichtung und Vakuumproduktionsanlage
CN114939445B (zh) * 2022-03-29 2023-12-22 合肥通用机械研究院有限公司 一种大型真空度变化试验装置及应用该装置的试验方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111681A (ja) * 1997-10-06 1999-04-23 Tokyo Ohka Kogyo Co Ltd 減圧処理装置
WO1999053538A1 (fr) * 1998-04-14 1999-10-21 Matrix Integrated Systems, Inc. Architecture synchrone multiplexee a surcharge presque nulle pour systemes de traitement sous vide
EP1582607A1 (fr) * 2004-03-31 2005-10-05 Applied Films GmbH & Co. KG Système de sas pour dispositif de traitement sous vide et procédé de sa mise en oeuvre
DE102011011279A1 (de) 2011-02-15 2012-08-16 Von Ardenne Anlagentechnik Gmbh Apparatur zur Leitung des Gasstromes beim Belüften innerhalb eines Vakuumgehäuses
DE102015117753A1 (de) 2015-10-19 2017-04-20 Von Ardenne Gmbh Vakuumschleusenanordnung, Vakuumanordnung und Verfahren
DE102016107830A1 (de) 2016-04-27 2017-11-02 Von Ardenne Gmbh Vakuumkammeranordnung und Verfahren zum Betreiben einer Vakuumkammeranordnung

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Publication number Priority date Publication date Assignee Title
US4739787A (en) * 1986-11-10 1988-04-26 Stoltenberg Kevin J Method and apparatus for improving the yield of integrated circuit devices
KR100855582B1 (ko) * 2007-01-12 2008-09-03 삼성전자주식회사 액 공급 장치 및 방법, 상기 장치를 가지는 기판 처리설비, 그리고 기판 처리 방법
CN203333739U (zh) * 2013-05-27 2013-12-11 深圳市生波尔机电设备有限公司 真空箱体充气缓冲器及真空镀膜箱
JP5940199B1 (ja) * 2015-06-26 2016-06-29 株式会社日立国際電気 半導体装置の製造方法、基板処理装置およびプログラム
DE102018112853A1 (de) * 2018-05-29 2019-12-05 Meyer Burger (Germany) Gmbh Belüftungsvorrichtung und Vakuumproduktionsanlage

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111681A (ja) * 1997-10-06 1999-04-23 Tokyo Ohka Kogyo Co Ltd 減圧処理装置
WO1999053538A1 (fr) * 1998-04-14 1999-10-21 Matrix Integrated Systems, Inc. Architecture synchrone multiplexee a surcharge presque nulle pour systemes de traitement sous vide
EP1582607A1 (fr) * 2004-03-31 2005-10-05 Applied Films GmbH & Co. KG Système de sas pour dispositif de traitement sous vide et procédé de sa mise en oeuvre
DE102011011279A1 (de) 2011-02-15 2012-08-16 Von Ardenne Anlagentechnik Gmbh Apparatur zur Leitung des Gasstromes beim Belüften innerhalb eines Vakuumgehäuses
DE102015117753A1 (de) 2015-10-19 2017-04-20 Von Ardenne Gmbh Vakuumschleusenanordnung, Vakuumanordnung und Verfahren
DE102016107830A1 (de) 2016-04-27 2017-11-02 Von Ardenne Gmbh Vakuumkammeranordnung und Verfahren zum Betreiben einer Vakuumkammeranordnung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 199927, Derwent World Patents Index; AN 1999-319152, XP002794196 *

Also Published As

Publication number Publication date
CN210886214U (zh) 2020-06-30
CN110541154A (zh) 2019-12-06
DE102018112853A1 (de) 2019-12-05
DE112019002724A5 (de) 2021-04-22

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