WO2019210685A1 - 一种聚苯胺导电薄膜 - Google Patents

一种聚苯胺导电薄膜 Download PDF

Info

Publication number
WO2019210685A1
WO2019210685A1 PCT/CN2018/118796 CN2018118796W WO2019210685A1 WO 2019210685 A1 WO2019210685 A1 WO 2019210685A1 CN 2018118796 W CN2018118796 W CN 2018118796W WO 2019210685 A1 WO2019210685 A1 WO 2019210685A1
Authority
WO
WIPO (PCT)
Prior art keywords
parts
polyaniline
conductive film
taking
solution
Prior art date
Application number
PCT/CN2018/118796
Other languages
English (en)
French (fr)
Inventor
顾黎明
Original Assignee
苏州知瑞光电材料科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州知瑞光电材料科技有限公司 filed Critical 苏州知瑞光电材料科技有限公司
Publication of WO2019210685A1 publication Critical patent/WO2019210685A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2427/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2427/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2427/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2427/18—Homopolymers or copolymers of tetrafluoroethylene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

Definitions

  • the invention belongs to the field of thin films, and in particular relates to a polyaniline conductive film.
  • polyaniline has many advantages such as simple synthesis, low price, adjustable conductivity, good environmental stability, etc., especially in the fields of metal corrosion protection, electrostatic discharge, electromagnetic interference shielding, etc.
  • the prospect of scale application has become the most widely studied class of conductive polymer materials.
  • the present invention adopts the following technical solutions:
  • a polyaniline conductive film made of the following raw materials by weight:
  • the dopant is selected from one of p-toluenesulfonic acid or citric acid.
  • the initiator is selected from one of ammonium persulfate, potassium persulfate or sodium persulfate.
  • the solvent is a mixed solution of acetone and dimethylformamide in a volume ratio of 1:5-7.
  • the polyaniline conductive film of the present invention is prepared by the following steps:
  • silane coupling agent kh560 taking silane coupling agent kh560, adding it to the weight of 10-13 times of absolute ethanol, raising the temperature to 55-60 ° C, adding dodecyl mercaptan, stirring for 4-20 minutes, to obtain compound Silane solution;
  • the invention firstly uses the stearic acid to treat the light calcium carbonate, improves the surface reactivity of the light calcium carbonate by the surface adsorption of stearic acid, and then disperses the treated ethanol and dodecyl mercaptan with the silane coupling agent. Blending, through high temperature esterification, thereby improving the dispersion compatibility of calcium carbonate between organic polymers, and promoting the mechanical stability of the finished polyaniline film.
  • the invention introduces an acid dopant in the process of aniline polymerization, which can effectively improve the conductive stability of the finished polyaniline, and the added tert-butyl-p-diphenol can improve the storage stability of the polyaniline conductive film, and the invention passes the invention.
  • the addition of polytetrafluoroethylene wax to the solvent can effectively improve the tensile strength of the finished film and promote the composite strength between the raw materials.
  • a polyaniline conductive film weighing each raw material by weight:
  • the solvent is a mixed solution of acetone and dimethylformamide in a volume ratio of 1:7.
  • the polyaniline conductive film is specifically prepared by the following steps:
  • silane coupling agent kh560 taking silane coupling agent kh560, adding it to 13 times the weight of absolute ethanol, raising the temperature to 60 ° C, adding dodecyl mercaptan, stirring for 20 minutes, to obtain a composite silane solution;
  • a polyaniline conductive film weighing each raw material by weight:
  • the solvent is a mixed solution of acetone and dimethylformamide in a volume ratio of 1:5.
  • the polyaniline conductive film is specifically prepared by the following steps:
  • silane coupling agent kh560 taking silane coupling agent kh560, adding it to the weight of 10 times of absolute ethanol, raising the temperature to 55 ° C, adding dodecyl mercaptan, stirring for 4 minutes, to obtain a composite silane solution;
  • the conductivity was tested by the four-probe method and the result was 0.80 S/cm.
  • the conductivity was tested by the four-probe method and found to be 0.86 S/cm.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

本发明公开了一种聚苯胺导电薄膜，它是由下述重量份的原料制成的：硬脂酸3-4份、苯胺120-140份、引发剂3-5份、十二烷基硫醇1-2份、掺杂剂1-2份、三丁基三氯化锡0.3-0.5份、溶剂170-200份、叔丁基对二苯酚0.8-1份、轻质碳酸钙6-8份、聚四氟乙烯蜡2-3份、硅烷偶联剂kh560 0.7-1份。本发明在苯胺聚合过程中引入了酸掺杂剂，能够有效地提高聚苯胺成品的导电稳定性，同时加入的叔丁基对二苯酚则能够提高聚苯胺导电薄膜的贮存稳定性。

Description

一种聚苯胺导电薄膜 技术领域
本发明属于薄膜领域，具体涉及一种聚苯胺导电薄膜。
 背景技术
在目前已发现的导电高分子中，聚苯胺因其合成简单、价格低廉、电导率可调、环境稳定性好等诸多优点，尤其它在金属腐蚀防护、静电释放、电磁干扰屏蔽等领域有大规模应用的前景，成为研究最为广泛的一类导电高分子材料。
 技术问题
然而为了更进一步的提高聚苯胺的导电性能，增大其应用领域，目前往往会将其与导电无机粒子共混，这样虽然可以提高导电性能，但是由于无机粒子与聚苯胺的相容性差，也会造成成品的稳定性差，尤其是做成复合薄膜时，更容易造成薄膜的均匀稳定性不好，导电薄膜的品质降低。
 技术解决方案
本发明的目的在于针对现有技术的缺陷和不足，提供一种聚苯胺导电薄膜。
为实现上述目的，本发明采用以下技术方案：
一种聚苯胺导电薄膜，它是由下述重量份的原料制成的：
硬脂酸3-4份、苯胺120-140份、引发剂3-5份、十二烷基硫醇1-2份、掺杂剂1-2份、三丁基三氯化锡0.3-0.5份、溶剂170-200份、叔丁基对二苯酚0.8-1份、轻质碳酸钙6-8份、聚四氟乙烯蜡2-3份、硅烷偶联剂kh560 0.7-1份。
所述的掺杂剂选自对甲基苯磺酸或柠檬酸中的一种。
所述的引发剂选自过硫酸铵、过硫酸钾或过硫酸钠中的一种。
所述的溶剂为体积比为1:5-7的丙酮与二甲基甲酰胺的混合溶液。
优选地，本发明所述的聚苯胺导电薄膜，由包括以下步骤制得：
（1）取引发剂，加入到其重量25-30倍的去离子水中，搅拌均匀，得引发剂水溶液；
（2）取硅烷偶联剂kh560，加入到其重量10-13倍的无水乙醇中，升高温度为55-60℃，加入十二烷基硫醇，保温搅拌4-20分钟，得复合硅烷溶液；
（3）取硬脂酸，加热熔化，与轻质碳酸钙混合，加入到混合料重量60-70倍的去离子水中，超声5-10分钟，与上述复合硅烷溶液混合，送入到反应釜中，控制反应釜压力为0.9-1mpa，升高温度为90-95℃，保温搅拌1-2小时，出料冷却，离心分离，将沉淀干燥，得有机改性碳酸钙；
（4）取聚四氟乙烯蜡，加入到溶剂中，搅拌均匀，得蜡溶剂；
（5）取叔丁基对二苯酚，加入到其重量7-10倍的氯仿中，搅拌均匀，加入掺杂剂，超声10-20分钟，加入苯胺，搅拌均匀，送入到反应釜中，通入氮气，调节反应釜温度为65-70℃，加入上述引发剂水溶液，保温搅拌4-5小时，出料冷却，得聚苯胺溶液；
（6）取上述有机改性碳酸钙，加入到上述聚苯胺溶液中，搅拌均匀，加入三丁基三氯化锡，在80-90℃下保温搅拌30-40分钟，抽滤，将滤饼水洗，常温干燥，得改性聚苯胺；
（7）取上述改性聚苯胺，加入到蜡溶剂中，搅拌均匀，旋涂成膜，即得所述聚苯胺导电薄膜。
 有益效果
本发明首先采用硬脂酸处理轻质碳酸钙，通过硬脂酸的表面吸附作用来改善轻质碳酸钙表面的反应活性，然后与硅烷偶联剂分散处理的乙醇、十二烷基硫醇的共混，通过高温酯化，从而改善了碳酸钙在有机聚合物间的分散相容性，对于提高聚苯胺成品薄膜的力学稳定性起到了很好促进效果；
本发明在苯胺聚合过程中引入了酸掺杂剂，能够有效的提高聚苯胺成品的导电稳定性，同时加入的叔丁基对二苯酚则能够提高聚苯胺导电薄膜的贮存稳定性，本发明通过在溶剂中加入聚四氟乙烯蜡，可以有效的改善成品薄膜的抗张强度，同时促进各原料间的复合强度。
 本发明的最佳实施方式
下面结合实施例对本发明做进一步地描述。
实施例 1
一种聚苯胺导电薄膜，按重量份数计，称取各原料：
硬脂酸4份、苯胺140份、过硫酸钠5份、十二烷基硫醇2份、对甲基苯磺酸2份、三丁基三氯化锡0.5份、溶剂200份、叔丁基对二苯酚1份、轻质碳酸钙8份、聚四氟乙烯蜡3份、硅烷偶联剂kh560 1份。
所述的溶剂为体积比为1:7的丙酮与二甲基甲酰胺的混合溶液。
该聚苯胺导电薄膜具体由包括以下步骤而制得：
（1）取过硫酸钠，加入到其重量30倍的去离子水中，搅拌均匀，得引发剂水溶液；
（2）取硅烷偶联剂kh560，加入到其重量13倍的无水乙醇中，升高温度为60℃，加入十二烷基硫醇，保温搅拌20分钟，得复合硅烷溶液；
（3）取硬脂酸，加热熔化，与轻质碳酸钙混合，加入到混合料重量70倍的去离子水中，超声10分钟，与上述复合硅烷溶液混合，送入到反应釜中，控制反应釜压力为1mpa，升高温度为95℃，保温搅拌2小时，出料冷却，离心分离，将沉淀干燥，得有机改性碳酸钙；
（4）取聚四氟乙烯蜡，加入到溶剂中，搅拌均匀，得蜡溶剂；
（5）取叔丁基对二苯酚，加入到其重量10倍的氯仿中，搅拌均匀，加入对甲基苯磺酸，超声20分钟，加入苯胺，搅拌均匀，送入到反应釜中，通入氮气，调节反应釜温度为70℃，加入上述过硫酸钠水溶液，保温搅拌5小时，出料冷却，得聚苯胺溶液；
（6）取上述有机改性碳酸钙，加入到上述聚苯胺溶液中，搅拌均匀，加入三丁基三氯化锡，在90℃下保温搅拌40分钟，抽滤，将滤饼水洗，常温干燥，得改性聚苯胺；
（7）取上述改性聚苯胺，加入到蜡溶剂中，搅拌均匀，旋涂成膜，即得所述聚苯胺导电薄膜。
实施例 2
一种聚苯胺导电薄膜，按重量份数计，称取各原料：
硬脂酸3份、苯胺120份、过硫酸铵3份、十二烷基硫醇1份、柠檬酸1份、三丁基三氯化锡0.3份、溶剂170份、叔丁基对二苯酚0.8份、轻质碳酸钙6份、聚四氟乙烯蜡2份、硅烷偶联剂kh560 0.7份。
所述的溶剂为体积比为1:5的丙酮与二甲基甲酰胺的混合溶液。
该聚苯胺导电薄膜具体由包括以下步骤而制得：
（1）取过硫酸铵，加入到其重量25倍的去离子水中，搅拌均匀，得引发剂水溶液；
（2）取硅烷偶联剂kh560，加入到其重量10倍的无水乙醇中，升高温度为55℃，加入十二烷基硫醇，保温搅拌4分钟，得复合硅烷溶液；
（3）取硬脂酸，加热熔化，与轻质碳酸钙混合，加入到混合料重量60倍的去离子水中，超声5分钟，与上述复合硅烷溶液混合，送入到反应釜中，控制反应釜压力为0.9mpa，升高温度为90℃，保温搅拌1小时，出料冷却，离心分离，将沉淀干燥，得有机改性碳酸钙；
（4）取聚四氟乙烯蜡，加入到溶剂中，搅拌均匀，得蜡溶剂；
（5）取叔丁基对二苯酚，加入到其重量7倍的氯仿中，搅拌均匀，加入柠檬酸，超声10分钟，加入苯胺，搅拌均匀，送入到反应釜中，通入氮气，调节反应釜温度为65℃，加入上述过硫酸铵水溶液，保温搅拌4-5小时，出料冷却，得聚苯胺溶液；
（6）取上述有机改性碳酸钙，加入到上述聚苯胺溶液中，搅拌均匀，加入三丁基三氯化锡，在80℃下保温搅拌30分钟，抽滤，将滤饼水洗，常温干燥，得改性聚苯胺；
（7）取上述改性聚苯胺，加入到蜡溶剂中，搅拌均匀，旋涂成膜，即得所述聚苯胺导电薄膜。
性能测试：
实施例1的聚苯胺导电薄膜：
厚度1.6mm；
拉伸强度10.2Mpa；
电导率采用四探针法进行测试，结果为 0.80S/cm；
实施例2的聚苯胺导电薄膜：
厚度1.7mm；
拉伸强度11.3Mpa；
电导率采用四探针法进行测试，结果为 0.86S/cm。

Claims (5)

  1. 一种聚苯胺导电薄膜，其特征在于：它是由下述重量份的原料制成的：
    硬脂酸3-4份、苯胺120-140份、引发剂3-5份、十二烷基硫醇1-2份、掺杂剂1-2份、三丁基三氯化锡0.3-0.5份、溶剂170-200份、叔丁基对二苯酚0.8-1份、轻质碳酸钙6-8份、聚四氟乙烯蜡2-3份、硅烷偶联剂kh560 0.7-1份。
  2. 根据权利要求1所述的一种聚苯胺导电薄膜，其特征在于：所述的掺杂剂选自对甲基苯磺酸或柠檬酸中的一种。
  3. 根据权利要求1所述的一种聚苯胺导电薄膜，其特征在于：所述的引发剂选自过硫酸铵、过硫酸钾或过硫酸钠中的一种。
  4. 根据权利要求1所述的一种聚苯胺导电薄膜，其特征在于：所述的溶剂为体积比为1:5-7的丙酮与二甲基甲酰胺的混合溶液。
  5. 根据权利要求1所述的一种聚苯胺导电薄膜，其特征在于：该聚苯胺导电薄膜由包括以下步骤制得：     （1）取引发剂，加入到其重量25-30倍的去离子水中，搅拌均匀，得引发剂水溶液；
    （2）取硅烷偶联剂kh560，加入到其重量10-13倍的无水乙醇中，升高温度为55-60℃，加入十二烷基硫醇，保温搅拌4-20分钟，得复合硅烷溶液；
    （3）取硬脂酸，加热熔化，与轻质碳酸钙混合，加入到混合料重量60-70倍的去离子水中，超声5-10分钟，与上述复合硅烷溶液混合，送入到反应釜中，控制反应釜压力为0.9-1mpa，升高温度为90-95℃，保温搅拌1-2小时，出料冷却，离心分离，将沉淀干燥，得有机改性碳酸钙；
    （4）取聚四氟乙烯蜡，加入到溶剂中，搅拌均匀，得蜡溶剂；
    （5）取叔丁基对二苯酚，加入到其重量7-10倍的氯仿中，搅拌均匀，加入掺杂剂，超声10-20分钟，加入苯胺，搅拌均匀，送入到反应釜中，通入氮气，调节反应釜温度为65-70℃，加入上述引发剂水溶液，保温搅拌4-5小时，出料冷却，得聚苯胺溶液；
    （6）取上述有机改性碳酸钙，加入到上述聚苯胺溶液中，搅拌均匀，加入三丁基三氯化锡，在80-90℃下保温搅拌30-40分钟，抽滤，将滤饼水洗，常温干燥，得改性聚苯胺；
    （7）取上述改性聚苯胺，加入到蜡溶剂中，搅拌均匀，旋涂成膜，即得所述聚苯胺导电薄膜。
PCT/CN2018/118796 2018-05-02 2018-11-30 一种聚苯胺导电薄膜 WO2019210685A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810408330.2 2018-05-02
CN201810408330.2A CN108485261A (zh) 2018-05-02 2018-05-02 一种聚苯胺导电薄膜

Publications (1)

Publication Number Publication Date
WO2019210685A1 true WO2019210685A1 (zh) 2019-11-07

Family

ID=63313491

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/118796 WO2019210685A1 (zh) 2018-05-02 2018-11-30 一种聚苯胺导电薄膜

Country Status (2)

Country Link
CN (1) CN108485261A (zh)
WO (1) WO2019210685A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108485261A (zh) * 2018-05-02 2018-09-04 苏州知瑞光电材料科技有限公司 一种聚苯胺导电薄膜

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102532892A (zh) * 2012-01-20 2012-07-04 北京师范大学 导电聚合物薄膜及其制备方法
EP3050932A1 (en) * 2015-01-30 2016-08-03 Shin-Etsu Chemical Co., Ltd. Conductive polymer composition, coated article, patterning process, and substrate
CN107118555A (zh) * 2017-06-22 2017-09-01 常州大学 溶液共混法制备聚酰胺酰亚胺基抗静电薄膜的方法
CN107418111A (zh) * 2017-08-01 2017-12-01 中国科学技术大学 用于应变和/或压力传感的导电性高分子复合物的制备方法
CN108485261A (zh) * 2018-05-02 2018-09-04 苏州知瑞光电材料科技有限公司 一种聚苯胺导电薄膜
CN108517118A (zh) * 2018-05-02 2018-09-11 苏州知瑞光电材料科技有限公司 一种聚苯胺导电薄膜的制备方法
CN108641409A (zh) * 2018-05-02 2018-10-12 苏州知瑞光电材料科技有限公司 一种轻质碳酸钙超细粉体材料及其在聚苯胺导电薄膜中的应用

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102532892A (zh) * 2012-01-20 2012-07-04 北京师范大学 导电聚合物薄膜及其制备方法
EP3050932A1 (en) * 2015-01-30 2016-08-03 Shin-Etsu Chemical Co., Ltd. Conductive polymer composition, coated article, patterning process, and substrate
CN107118555A (zh) * 2017-06-22 2017-09-01 常州大学 溶液共混法制备聚酰胺酰亚胺基抗静电薄膜的方法
CN107418111A (zh) * 2017-08-01 2017-12-01 中国科学技术大学 用于应变和/或压力传感的导电性高分子复合物的制备方法
CN108485261A (zh) * 2018-05-02 2018-09-04 苏州知瑞光电材料科技有限公司 一种聚苯胺导电薄膜
CN108517118A (zh) * 2018-05-02 2018-09-11 苏州知瑞光电材料科技有限公司 一种聚苯胺导电薄膜的制备方法
CN108641409A (zh) * 2018-05-02 2018-10-12 苏州知瑞光电材料科技有限公司 一种轻质碳酸钙超细粉体材料及其在聚苯胺导电薄膜中的应用

Also Published As

Publication number Publication date
CN108485261A (zh) 2018-09-04

Similar Documents

Publication Publication Date Title
CN107174973B (zh) 一种石墨烯纤维素复合膜的制备方法
CN106517849A (zh) 一种氧化-磺化淀粉减水剂的制备方法
CN108976977B (zh) 石墨烯原位聚合改性导电防腐水性胶乳液及其制造方法
WO2019210685A1 (zh) 一种聚苯胺导电薄膜
CN107840956A (zh) 一种溶胶型聚苯胺导电薄膜及其制备方法
CN109206677B (zh) 一种超支化聚合物改性炭黑表面及其在橡胶加工中的应用
CN108641409A (zh) 一种轻质碳酸钙超细粉体材料及其在聚苯胺导电薄膜中的应用
CN109337340A (zh) 一种乙酰化聚酯改性导电薄膜及其制备方法
CN110028602B (zh) 一种降低工业聚乙烯醇中杂质含量的方法
CN112940204A (zh) 一种用于附聚的聚丁二烯胶乳的制备方法及制备的abs树脂
CN102060964B (zh) 氨基丙烯酸树脂的制备方法及应用
CN108517118A (zh) 一种聚苯胺导电薄膜的制备方法
CN109970910B (zh) 一种三元聚合物水煤浆分散剂及在水煤浆制备上的应用
CN108929609B (zh) 封装型改性氧化石墨烯/聚丙烯酸酯纳米复合涂饰剂及其制备方法
CN108276563A (zh) 一种防腐聚噻吩导电材料及其制备方法
CN105153757A (zh) 一种高耐水氧化铁黑颜料及其制备方法
CN113150489B (zh) 一种abs复合材料及其制备方法
CN112724844B (zh) 一种适用全流程喷塑工艺的丙烯酸酯胶
CN111548578B (zh) 一种抗氧化pvc通信管及其制备方法
CN115717000B (zh) 橡胶相容性纳米碳酸钙的制备方法
CN114907681B (zh) 一种高强度聚碳酸酯薄膜及其制备方法
CN115124960B (zh) 一种耐高温耐水煮型环氧树脂灌封胶及其制备方法
CN108841224A (zh) 一种石墨烯掺杂水性防腐涂料及其制备方法
CN109705463A (zh) 一种高分子聚丙烯薄膜及其制备方法
CN111073281A (zh) 一种胶化聚苯胺导电薄膜及其制备方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18917286

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18917286

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 18917286

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 07.05.2021)

122 Ep: pct application non-entry in european phase

Ref document number: 18917286

Country of ref document: EP

Kind code of ref document: A1