WO2019210651A1 - Ultra-thin micro-bridge rectifier - Google Patents

Ultra-thin micro-bridge rectifier Download PDF

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Publication number
WO2019210651A1
WO2019210651A1 PCT/CN2018/110814 CN2018110814W WO2019210651A1 WO 2019210651 A1 WO2019210651 A1 WO 2019210651A1 CN 2018110814 W CN2018110814 W CN 2018110814W WO 2019210651 A1 WO2019210651 A1 WO 2019210651A1
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Prior art keywords
boss
inclined section
chip
platform
pin
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PCT/CN2018/110814
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French (fr)
Chinese (zh)
Inventor
陆敏琴
聂磊
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扬州虹扬科技发展有限公司
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Publication of WO2019210651A1 publication Critical patent/WO2019210651A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation

Definitions

  • the invention relates to the technical field of rectifiers, and in particular to an ultra-thin micro bridge stack rectifier.
  • the existing product structure is that the P poles of two chips of the four PN junction diode chips and the N poles of the two chips are placed on the connection frame, and two diodes of different polarities are respectively bridged by two bridge pieces of the same shape.
  • the connection frame between the chip and the input terminal, and the diode chips are arranged in parallel to form a module chip array.
  • the disadvantages are as follows: 1. The two sides of the chip occupy a large space inside, and cannot place a large-sized chip. At present, the maximum size can only be placed into the 84 mil die. The current is 4A, which can't meet the customer's demand for high current products. 2.
  • a bridge connects two diode chips with different polarities and the connection frame of the input end to form a three-point soldering.
  • the requirements for the flatness of the frame and the chip are greatly improved, and the difficulty of soldering is increased. If there is a little unevenness, it is easy to cause soldering. And the welding is not reliable, even the phenomenon of offset, affecting product yield, production efficiency, product reliability, reducing the service life of the product, increasing customer complaints, and intangible costs have also increased.
  • the patent publication CN 103022023 B discloses an ultra-thin micro-bridge rectifier, in which the P poles of two chips of the four PN junction diode chips and the N poles of the two chips are placed on the connection frame, with two The bridging pieces of the same shape respectively bridge the connecting frames of the diode chips and the input terminals of different polarities, and the plastic sealing is molded into a bridge rectifier.
  • the patent is arranged in parallel, so that the space is large and only small crystal grains can be placed. .
  • the object of the present invention is to provide an ultra-thin micro-bridge stack rectifier, which solves the technical problem that the rectifier chip in the prior art has large space, low rectifier current and high welding difficulty.
  • An ultra-thin micro-bridge stack rectifier comprising a lead, a chip and a soldering surface, wherein the lead is connected to the soldering surface by a slanted section, and the chip is mounted on the soldering surface;
  • the pin includes a first pin, a second pin, a third pin, and a fourth pin
  • the chip includes a first chip, a second chip, a third chip, and a fourth chip
  • the soldering surface includes a first platform surface, a second platform surface, a third platform surface, a fourth platform surface, a first convex surface, a second convex surface, a third convex surface, and a fourth convex surface
  • the inclined section includes a first inclined section, a second inclined section, a third inclined section and a fourth inclined section;
  • the first pin is connected to the first platform surface by a first inclined section, and the first platform surface is connected with a second platform surface;
  • the second lead is connected to the first boss surface through a second inclined section, the first boss surface is connected to the second boss surface, and the first boss surface is provided with a first boss on the bottom surface thereof, a second boss is disposed on a bottom surface of the second boss surface;
  • the third lead is connected with a third boss surface connected by a third inclined section, the third boss surface is connected with a third platform surface, and the third boss surface is provided with a third boss;
  • the fourth pin is connected with a fourth platform surface connected by a fourth inclined section, the fourth platform surface is connected with a fourth boss surface, and the fourth boss surface is provided with a fourth boss;
  • the first inclined section is consistent with the second inclined section structure, the third inclined section and the fourth inclined section are identical in structure, and the relative heights of the two ends of the first inclined section are greater than the relative heights of the two ends of the third inclined section;
  • the N surface of the first chip is connected to the bottom surface of the first platform surface, and the P surface is connected to the upper surface of the third protrusion;
  • the N surface of the second chip is connected to the bottom surface of the second platform surface, and the P surface is connected to the upper surface of the fourth boss;
  • the N surface of the third chip is connected to the upper surface of the third platform surface, and the P surface is connected to the bottom surface of the second protrusion;
  • the N surface of the fourth chip is connected to the upper surface of the fourth platform surface, and the P surface is connected to the bottom surface of the first boss;
  • the first boss, the second boss, the third boss and the fourth boss are all square bosses.
  • the present invention can also be improved as follows:
  • first inclined segment forms an angle of 120-150 degrees with the first pin
  • third inclined segment forms an angle of 150-160 degrees with the third pin
  • a first through hole is defined in the inclined section, and a width of the inclined section is larger than an area of the lead.
  • the beneficial effect of using the step is that the first through hole of the inclined section can improve the package.
  • the reliability and airtightness of the inclined section can increase the heat dissipation area of the rectifier and improve the heat dissipation effect.
  • connection segments between them are connection segments between them.
  • a second through hole is formed in the connecting section, and the beneficial effect of the step is to avoid the force pulling the die due to different mutual expansion coefficients of the material during the welding and molding process, and to buffer the stress. effect.
  • the outer side of the inclined section is provided with a groove, and the beneficial effect of the step is to enhance the adhesion between the invention and the package material, so that the package material has the opportunity to penetrate into the interior of the invention, and the two types of tight bonding are combined to form a Overall, it ensures the appearance of the product is complete, no cracking problem; and the groove can increase the surface roughness and friction.
  • an end of the pin connected to the inclined section is provided with an indentation, and the beneficial effect of the step is that the indentation can alleviate the buffer during the decomposition, and the die is not damaged, thereby ensuring product quality and reliability.
  • the surface of the square boss is a square surface having a length of 2.8-3.0 mm and a width of 2.8-3.0 mm.
  • the beneficial effect of the step is to improve the welding surface, facilitate the placement of large grains, and increase the current.
  • first platform surface and the second platform surface are perpendicular to each other
  • first convex surface and the second convex surface are perpendicular to each other
  • third platform surface and the third convex surface are perpendicular to each other
  • fourth platform The surface and the fourth land are perpendicular to each other.
  • the invention provides an ultra-thin micro-bridge stack rectifier, comprising a lead, a chip and a soldering surface, and an inclined section is arranged between the pin and the soldering surface, so that the combination of the material pieces is facilitated, and the area of the inclined section is increased, thereby improving
  • the heat dissipation effect extends the service life of the product;
  • the invention increases the indentation at the end of the lead wire, and the first through hole is opened in the inclined section, so that the reliability and airtightness of the package in the subsequent process can be improved, and the indentation is behind
  • the channel is decomposed, it acts as a buffer, which can effectively prevent the chip from being pulled;
  • the boss of the present invention is square, which improves the precision of chip placement, ensures that the chip does not rotate, and the offset phenomenon;
  • the inclined section in the present invention The groove is also opened, so that in the packaging process, the adhesion between the product and the package material can be increased, and the package material has the opportunity to
  • FIG. 1 is a schematic structural view of an ultra-thin micro bridge stack rectifier according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a super-thin micro-bridge stack rectifier before being superposed according to an embodiment of the present invention
  • FIG. 3 is a side view of an ultra-thin microbridge stack rectifier according to an embodiment of the present invention.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or integrated; can be mechanical connection, or can be electrical connection; can be directly connected, or can be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction of two elements.
  • installation can be understood on a case-by-case basis.
  • the first feature "on” or “below” the second feature may be the direct contact of the first and second features, or the first and second features are indirectly through the intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.
  • an ultra-thin micro-bridge stack rectifier provided by the present invention has a thickness of 1.5-1.65 mm, and includes a lead 1, a chip 2 and a soldering surface 3, and the lead 1 and the soldering surface 3 Connected by the inclined section 4, the chip 2 is mounted on the welding surface 3, the present invention is mainly formed by superimposing two webs on top of each other, and FIG. 2 is a schematic structural view before lamination;
  • the pin 1 includes a first pin 101, a second pin 102, a third pin 103, and a fourth pin 104.
  • the chip 2 includes a first chip 201 and a second chip 202.
  • the third chip 203 and the fourth chip 204, the welding surface 3 includes a first platform surface 301, a second platform surface 302, a third platform surface 303, a fourth platform surface 304, a first convex surface 305, and a second convex surface.
  • the inclined section 4 includes a first inclined section 401, a second inclined section 402, a third inclined section 403 and a fourth inclined section 404;
  • the first pin 101 is connected to the first platform surface 301 through the first inclined section 401, and the first platform surface 301 is connected to the second platform surface 302;
  • the second pin 102 is connected to the first boss surface 305 and connected by the second inclined section 402.
  • the first boss surface 305 is connected with the second boss surface 306.
  • the first boss surface 305 is provided with a second surface.
  • a boss 501, the second boss 3 is provided on the bottom surface of the second boss 502;
  • the third pin 103 is connected to the third land 307 via a third inclined section 403, the third land 307 is connected to the third platform surface 303, and the third surface of the third boss 307 is provided with a third surface.
  • the fourth pin 104 is connected to the fourth platform surface 304 and connected by the fourth inclined section 404.
  • the fourth platform surface 304 is connected with a fourth boss surface 308, and the fourth boss surface 308 is provided with a fourth surface.
  • the first inclined section 401 is identical to the second inclined section 402.
  • the third inclined section 403 and the fourth inclined section 404 are identical in structure, and the relative height of the two ends of the first inclined section 401 is greater than the third inclined section 403. The relative height of the end;
  • the N surface of the first chip 201 is connected to the bottom surface of the first platform surface 301, and the P surface is connected to the upper surface of the third protrusion 503;
  • the N surface of the second chip 202 is connected to the bottom surface of the second platform surface 302, and the P surface is connected to the upper surface of the fourth boss 504;
  • the N surface of the third chip 203 is connected to the upper surface of the third platform surface 303, and the P surface is connected to the bottom surface of the second protrusion 502;
  • the N surface of the fourth chip 204 is connected to the upper surface of the fourth platform surface 304, and the P surface is connected to the bottom surface of the first boss 501;
  • the first boss 501, the second boss 502, the third boss 503, and the fourth boss 504 are all square bosses.
  • the first inclined segment 401 forms an angle of 120-150 degrees with the first pin 101
  • the third inclined segment 403 forms an angle of 150-160 degrees with the third pin 103
  • the first tilt The segment 401 is higher than the third inclined segment 403, which facilitates assembly of the product, that is, the soldering surface of the first pin connection is located above the soldering surface of the third pin connection; likewise, the soldering surface of the second pin connection is located at the fourth pin Above the welded surface of the connection.
  • the first through hole 6 is defined in the inclined section 4, and the width of the inclined section 4 is greater than the width of the pin 1.
  • the first through hole 6 can improve the reliability and airtightness after the package, and the tilt
  • the large width of the segment 4 can increase the heat dissipation area of the rectifier and improve the heat dissipation effect.
  • the through hole can better lock the molding compound and the invention, and also reduces the cross section and increases the airtightness. effect.
  • a connecting section 7 is disposed between the 304 and the fourth platform surface 308.
  • the connecting section 7 is provided with a second through hole 8 , and the second through hole 8 of the connecting section 7 can ensure the material in the welding and molding process. Forces that are different in different mutual expansion coefficients pull the chip and act as a buffer.
  • the outer side of the inclined section 4 is provided with a groove 9 to enhance the adhesion between the copper material and the encapsulating material, so that the encapsulating material has the opportunity to penetrate into the interior of the copper material, thereby promoting the two kinds of tight bonding to form a whole and ensuring the appearance of the product. Complete, seamless cracking problem.
  • one end of the pin 1 connected to the inclined section 4 is provided with an indentation 10, and the indentation 10 can alleviate the buffer during decomposition, and does not damage the die, thereby ensuring product quality and reliability.
  • the surface of the square boss 5 is a square surface having a length of 2.8-3.0 mm and a width of 2.8-3.0 mm, thereby improving the welding surface, facilitating the placement of large crystal grains and increasing the current.
  • the first platform surface 301 and the second platform surface 302 are perpendicular to each other, and the third land surface 305 and the second land surface 307 are perpendicular to each other, and the third platform surface 303 and the third land surface 307 are perpendicular to each other.
  • the fourth landing surface 304 and the fourth projection surface 308 are perpendicular to each other, which minimizes the size of the rectifier product.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)

Abstract

Disclosed by the present invention is an ultra-thin micro-bridge rectifier, comprising a pin, a chip and a welding surface, wherein the pin and the welding surface are connected therebetween by means of an inclined segment, and the chip is mounted on the welding surface. The present invention solves the technical problems in existing technology in which the occupied space of a rectifier chip is large, the current of the rectifier is small, and welding difficulty is high.

Description

一种超薄微型桥堆整流器Ultra-thin micro bridge stack rectifier 技术领域Technical field
本发明涉及整流器技术领域，尤其涉及一种超薄微型桥堆整流器。The invention relates to the technical field of rectifiers, and in particular to an ultra-thin micro bridge stack rectifier.
背景技术Background technique
现有的产品结构是四个PN结二极管芯片中的二个芯片的P极和二个芯片的N极置于连接框架上，用二个形状相同的桥接片分别桥接二个极性不同的二极管芯片和输入端的连接框架，二极管芯片两两平行排列构成一模块芯片阵列这样的弊端：1.芯片两两排列内部占用较大空间，无法放置大规格的芯片，目前最大只能放入84MIL晶粒，电流为4A,不能满足客户需求大电流的产品。2.一个桥接连接二个极性不同的二极管芯片和输入端的连接框架，形成三点焊接，对框架、芯片平整度的要求大大提高，增加焊接的难度，若有一点不平整，容易造成虚焊和焊接不牢靠，甚至有偏移的现象，影响了产品良率、生产效率、产品可靠性，降低了产品的使用寿命，增加了客户抱怨，无形中成本也有所增加。The existing product structure is that the P poles of two chips of the four PN junction diode chips and the N poles of the two chips are placed on the connection frame, and two diodes of different polarities are respectively bridged by two bridge pieces of the same shape. The connection frame between the chip and the input terminal, and the diode chips are arranged in parallel to form a module chip array. The disadvantages are as follows: 1. The two sides of the chip occupy a large space inside, and cannot place a large-sized chip. At present, the maximum size can only be placed into the 84 mil die. The current is 4A, which can't meet the customer's demand for high current products. 2. A bridge connects two diode chips with different polarities and the connection frame of the input end to form a three-point soldering. The requirements for the flatness of the frame and the chip are greatly improved, and the difficulty of soldering is increased. If there is a little unevenness, it is easy to cause soldering. And the welding is not reliable, even the phenomenon of offset, affecting product yield, production efficiency, product reliability, reducing the service life of the product, increasing customer complaints, and intangible costs have also increased.
授权公告号为CN 103022023 B的专利公开了一种超薄微型桥堆整流器，四个PN结二极管芯片中的二个芯片的P极和二个芯片的N极置于连接框架上，用二个形状相同的桥接片分别桥接二个极性不同的二极管芯片和输入端的连接框架，塑封模压制成桥堆整流器，该专利是平行排列的，这样占用空间大，只能放入较小的晶粒。The patent publication CN 103022023 B discloses an ultra-thin micro-bridge rectifier, in which the P poles of two chips of the four PN junction diode chips and the N poles of the two chips are placed on the connection frame, with two The bridging pieces of the same shape respectively bridge the connecting frames of the diode chips and the input terminals of different polarities, and the plastic sealing is molded into a bridge rectifier. The patent is arranged in parallel, so that the space is large and only small crystal grains can be placed. .
发明内容Summary of the invention
本发明的目的是提供一种超薄微型桥堆整流器，解决了现有技术中的整流器芯片占用空间大、整流器电流小，焊接难度高的技术问题。The object of the present invention is to provide an ultra-thin micro-bridge stack rectifier, which solves the technical problem that the rectifier chip in the prior art has large space, low rectifier current and high welding difficulty.
一种超薄微型桥堆整流器，包括引脚、芯片和焊接面，所述引脚与焊接面之间通过倾斜段连接，所述芯片安装在焊接面上；An ultra-thin micro-bridge stack rectifier comprising a lead, a chip and a soldering surface, wherein the lead is connected to the soldering surface by a slanted section, and the chip is mounted on the soldering surface;
所述引脚包括第一引脚、第二引脚、第三引脚和第四引脚，所述芯片包 括第一芯片、第二芯片、第三芯片和第四芯片，所述焊接面包括第一平台面、第二平台面、第三平台面、第四平台面、第一凸台面、第二凸台面、第三凸台面和第四凸台面，所述倾斜段包括第一倾斜段、第二倾斜段、第三倾斜段和第四倾斜段；The pin includes a first pin, a second pin, a third pin, and a fourth pin, and the chip includes a first chip, a second chip, a third chip, and a fourth chip, and the soldering surface includes a first platform surface, a second platform surface, a third platform surface, a fourth platform surface, a first convex surface, a second convex surface, a third convex surface, and a fourth convex surface, the inclined section includes a first inclined section, a second inclined section, a third inclined section and a fourth inclined section;
所述第一引脚与第一平台面通过第一倾斜段连接，所述第一平台面连接有第二平台面；The first pin is connected to the first platform surface by a first inclined section, and the first platform surface is connected with a second platform surface;
所述第二引脚连接有第一凸台面通过第二倾斜段连接，所述第一凸台面连接有第二凸台面，所述第一凸台面的底面上设置有第一凸台，所述第二凸台面的底面上设置有第二凸台；The second lead is connected to the first boss surface through a second inclined section, the first boss surface is connected to the second boss surface, and the first boss surface is provided with a first boss on the bottom surface thereof, a second boss is disposed on a bottom surface of the second boss surface;
所述第三引脚连接有第三凸台面通过第三倾斜段连接，所述第三凸台面连接有第三平台面，所述第三凸台面上表面设置有第三凸台；The third lead is connected with a third boss surface connected by a third inclined section, the third boss surface is connected with a third platform surface, and the third boss surface is provided with a third boss;
所述第四引脚连接有第四平台面通过第四倾斜段连接，所述第四平台面连接有第四凸台面，所述第四凸台面上表面设置有第四凸台；The fourth pin is connected with a fourth platform surface connected by a fourth inclined section, the fourth platform surface is connected with a fourth boss surface, and the fourth boss surface is provided with a fourth boss;
所述第一倾斜段与第二倾斜段结构一致，所述第三倾斜段和第四倾斜段结构一致，所述第一倾斜段两端的相对高度大于第三倾斜段两端的相对高度；The first inclined section is consistent with the second inclined section structure, the third inclined section and the fourth inclined section are identical in structure, and the relative heights of the two ends of the first inclined section are greater than the relative heights of the two ends of the third inclined section;
所述第一芯片的N面与所述第一平台面的底面连接，P面与所述第三凸台的上表面连接；The N surface of the first chip is connected to the bottom surface of the first platform surface, and the P surface is connected to the upper surface of the third protrusion;
所述第二芯片的N面与所述第二平台面的底面连接，P面与所述第四凸台的上表面连接；The N surface of the second chip is connected to the bottom surface of the second platform surface, and the P surface is connected to the upper surface of the fourth boss;
所述第三芯片的N面与所述第三平台面的上表面连接，P面与所述第二凸台的底面连接；The N surface of the third chip is connected to the upper surface of the third platform surface, and the P surface is connected to the bottom surface of the second protrusion;
所述第四芯片的N面与所述第四平台面的上表面连接，P面与所述第一凸台的底面连接；The N surface of the fourth chip is connected to the upper surface of the fourth platform surface, and the P surface is connected to the bottom surface of the first boss;
所述第一凸台、第二凸台、第三凸台和第四凸台均为方形凸台。The first boss, the second boss, the third boss and the fourth boss are all square bosses.
在上述技术方案的基础上，本发明还可以做如下改进：Based on the above technical solutions, the present invention can also be improved as follows:
进一步地，所述第一倾斜段与第一引脚形成120-150度的夹角，所述第三倾斜段与第三引脚形成150-160度的夹角，采用本步的有益效果是通过倾斜段能够便于叠合组装形成整流器。Further, the first inclined segment forms an angle of 120-150 degrees with the first pin, and the third inclined segment forms an angle of 150-160 degrees with the third pin, and the beneficial effect of using the step is The tilting section can facilitate the assembly of the stack to form a rectifier.
进一步地，所述倾斜段上均开设有第一通孔，且倾斜段的宽度均大于所 述引脚的面积，采用本步的有益效果是通过倾斜段的第一通孔，可以提高封装后的牢靠度和气密性，倾斜段的面积较大能够增加整流器的散热面积，提高散热效果。Further, a first through hole is defined in the inclined section, and a width of the inclined section is larger than an area of the lead. The beneficial effect of using the step is that the first through hole of the inclined section can improve the package. The reliability and airtightness of the inclined section can increase the heat dissipation area of the rectifier and improve the heat dissipation effect.
进一步地，所述第一平台面与第二平台面之间、第一凸台面与第二凸台面之间、第三凸台面与第三平台面之间、第四凸台面与第四平台面之间均设置有连接段。Further, between the first platform surface and the second platform surface, between the first boss surface and the second boss surface, between the third boss surface and the third platform surface, the fourth boss surface and the fourth platform surface There are connection segments between them.
进一步地，所述连接段上开设有第二通孔，采用本步的有益效果是在焊接和塑封过程中避免因物料不同相互膨胀系数不同而存在的力拉伤晶粒，起到缓冲应力的作用。Further, a second through hole is formed in the connecting section, and the beneficial effect of the step is to avoid the force pulling the die due to different mutual expansion coefficients of the material during the welding and molding process, and to buffer the stress. effect.
进一步地，所述倾斜段的外侧开设有凹槽，采用本步的有益效果是增强本发明与封装料的密合度，让封装料有渗入本发明内部的机会，促使两种紧密结合，形成一个整体，确保产品外观完整，无缝隙开裂的问题；而凹槽能够增加表面粗糙度与摩擦度。Further, the outer side of the inclined section is provided with a groove, and the beneficial effect of the step is to enhance the adhesion between the invention and the package material, so that the package material has the opportunity to penetrate into the interior of the invention, and the two types of tight bonding are combined to form a Overall, it ensures the appearance of the product is complete, no cracking problem; and the groove can increase the surface roughness and friction.
进一步地，所述引脚与所述倾斜段连接的一端设置有压痕，采用本步的有益效果是通过压痕能够缓解分解时的缓冲，不会拉伤晶粒，确保产品品质和可靠性。Further, an end of the pin connected to the inclined section is provided with an indentation, and the beneficial effect of the step is that the indentation can alleviate the buffer during the decomposition, and the die is not damaged, thereby ensuring product quality and reliability. .
进一步地，所述方形凸台的表面为长为2.8-3.0mm，宽2.8-3.0mm的方形表面，采用本步的有益效果是提高焊接面，便于放置大晶粒，提高电流。Further, the surface of the square boss is a square surface having a length of 2.8-3.0 mm and a width of 2.8-3.0 mm. The beneficial effect of the step is to improve the welding surface, facilitate the placement of large grains, and increase the current.
进一步地，所述第一平台面与第二平台面相互垂直，所述第一凸台面和第二凸台面相互垂直，所述第三平台面与第三凸台面相互垂直，所述第四平台面与第四凸台面相互垂直，采用本步的有益效果是保证焊接时，能够尽量减小整流器产品的尺寸。Further, the first platform surface and the second platform surface are perpendicular to each other, the first convex surface and the second convex surface are perpendicular to each other, and the third platform surface and the third convex surface are perpendicular to each other, and the fourth platform The surface and the fourth land are perpendicular to each other. The beneficial effect of this step is to ensure that the size of the rectifier product is minimized during soldering.
本发明的有益效果：The beneficial effects of the invention:
本发明提供一种超薄微型桥堆整流器，包括引脚、芯片和焊接面，引脚与焊接面之间设置有倾斜段，这样便于料片组合安装，同时增大倾斜段的面积，这样提高散热效果，延长产品的使用寿命；本发明在引线端部增加压痕，在倾斜段开设有第一通孔，这样能够提高在后道工序中封装的牢靠度和气密性，而压痕在后道分解时，起到缓冲的作用，能够有效防止芯片被拉伤；本发明中的凸台为方形，这样提高芯片放置精准度，确保芯片不会旋转，偏移 现象；本发明中的倾斜段还开设有凹槽，这样在封装过程中，能够增加产品与封装料的密合度，让封装料有渗入铜材内部的机会，促使两种紧密结合，形成一个整体，确保产品外观完整，无缝隙开裂的问题。The invention provides an ultra-thin micro-bridge stack rectifier, comprising a lead, a chip and a soldering surface, and an inclined section is arranged between the pin and the soldering surface, so that the combination of the material pieces is facilitated, and the area of the inclined section is increased, thereby improving The heat dissipation effect extends the service life of the product; the invention increases the indentation at the end of the lead wire, and the first through hole is opened in the inclined section, so that the reliability and airtightness of the package in the subsequent process can be improved, and the indentation is behind When the channel is decomposed, it acts as a buffer, which can effectively prevent the chip from being pulled; the boss of the present invention is square, which improves the precision of chip placement, ensures that the chip does not rotate, and the offset phenomenon; the inclined section in the present invention The groove is also opened, so that in the packaging process, the adhesion between the product and the package material can be increased, and the package material has the opportunity to penetrate into the interior of the copper material, thereby promoting the two tightly combined to form a whole body, ensuring a complete appearance of the product without gaps. Cracking problem.
附图说明DRAWINGS
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings to be used in the specific embodiments or the description of the prior art will be briefly described below, and obviously, the attached in the following description The drawings are some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative work.
图1为本发明具体实施例所述的一种超薄微型桥堆整流器的结构示意图；1 is a schematic structural view of an ultra-thin micro bridge stack rectifier according to an embodiment of the present invention;
图2为本发明具体实施例所述的一种超薄微型桥堆整流器的叠合之前的结构示意图；2 is a schematic structural view of a super-thin micro-bridge stack rectifier before being superposed according to an embodiment of the present invention;
图3为本发明具体实施例所述的一种超薄微型桥堆整流器的侧视图；3 is a side view of an ultra-thin microbridge stack rectifier according to an embodiment of the present invention;
附图标记：Reference mark:
1-引脚；2-芯片；3-焊接面；4-倾斜段；5-方形凸台；6-第一通孔；7-连接段；8-第二通孔；9-凹槽；10-压痕；101-第一引脚；102-第二引脚；103-第三引脚；104-第四引脚；201-第一芯片；202-第二芯片；203-第三芯片；204-第四芯片；301-第一平台面；302-第二平台面；303-第三平台面；304-第四平台面；305-第一凸台面；306-第二凸台面；307-第三凸台面；308-第四凸台面；401-第一倾斜段；402-第二倾斜段；403-第三倾斜段；404-第四倾斜段；501-第一凸台；502-第二凸台；503-第三凸台；504-第四凸台。1-pin; 2-chip; 3-welding surface; 4-inclined section; 5-square boss; 6-first through hole; 7-connection section; 8-second through hole; 9-groove; - indentation; 101 - first pin; 102 - second pin; 103 - third pin; 104 - fourth pin; 201 - first chip; 202 - second chip; 203 - third chip; 204-fourth chip; 301-first platform surface; 302-second platform surface; 303-third platform surface; 304-fourth platform surface; 305-first convex surface; 306-second convex surface; Third convex mesa; 308-fourth mesa; 401-first inclined section; 402-second inclined section; 403-third inclined section; 404-fourth inclined section; 501-first boss; 502- Two bosses; 503 - third bosses; 504 - fourth bosses.
具体实施方式detailed description
下面将结合附图对本发明技术方案的实施例进行详细的描述。以下实施例仅用于更加清楚地说明本发明的技术方案，因此只作为示例，而不能以此来限制本发明的保护范围。The embodiments of the technical solution of the present invention will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention, and thus are only examples, and are not intended to limit the scope of the present invention.
需要注意的是，除非另有说明，本申请使用的技术术语或者科学术语应当为本发明所属领域技术人员所理解的通常意义。It should be noted that the technical terms or scientific terms used herein should be used in the ordinary meaning as understood by those skilled in the art to which the invention belongs, unless otherwise stated.
在本申请的描述中，需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“顶”、“底”“内”和“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。In the description of the present application, it is to be understood that the terms "length", "width", "upper", "lower", "front", "back", "top", "bottom", "inside" and "outside" The orientation or positional relationship of the instructions is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, rather than indicating or implying that the device or component referred to has a specific orientation, The orientation and construction of the orientation are not to be construed as limiting the invention.
此外，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。在本发明的描述中，“多个”的含义是两个以上，除非另有明确具体的限定。Moreover, the terms "first", "second", and the like are used for the purpose of description only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined.
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or integrated; can be mechanical connection, or can be electrical connection; can be directly connected, or can be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction of two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。In the present application, the first feature "on" or "below" the second feature may be the direct contact of the first and second features, or the first and second features are indirectly through the intermediate medium, unless otherwise explicitly stated and defined. contact. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.
实施例Example
如图1所示，本发明所提供的一种超薄微型桥堆整流器，厚度为1.5-1.65mm，它包括引脚1、芯片2和焊接面3，所述引脚1与焊接面3之间通过倾斜段4连接，所述芯片2安装在焊接面3上，本发明主要由两个料片上下叠合而成，图2为叠合之前的结构示意图；As shown in FIG. 1 , an ultra-thin micro-bridge stack rectifier provided by the present invention has a thickness of 1.5-1.65 mm, and includes a lead 1, a chip 2 and a soldering surface 3, and the lead 1 and the soldering surface 3 Connected by the inclined section 4, the chip 2 is mounted on the welding surface 3, the present invention is mainly formed by superimposing two webs on top of each other, and FIG. 2 is a schematic structural view before lamination;
如图2所示，所述引脚1包括第一引脚101、第二引脚102、第三引脚103和第四引脚104，所述芯片2包括第一芯片201、第二芯片202、第三芯片203和第四芯片204，所述焊接面3包括第一平台面301、第二平台面302、 第三平台面303、第四平台面304、第一凸台面305、第二凸台面306、第三凸台面307和第四凸台面308，所述倾斜段4包括第一倾斜段401、第二倾斜段402、第三倾斜段403和第四倾斜段404；As shown in FIG. 2, the pin 1 includes a first pin 101, a second pin 102, a third pin 103, and a fourth pin 104. The chip 2 includes a first chip 201 and a second chip 202. The third chip 203 and the fourth chip 204, the welding surface 3 includes a first platform surface 301, a second platform surface 302, a third platform surface 303, a fourth platform surface 304, a first convex surface 305, and a second convex surface. a mesa 306, a third convex surface 307 and a fourth convex surface 308, the inclined section 4 includes a first inclined section 401, a second inclined section 402, a third inclined section 403 and a fourth inclined section 404;
所述第一引脚101与第一平台面301通过第一倾斜段401连接，所述第一平台面301连接有第二平台面302；The first pin 101 is connected to the first platform surface 301 through the first inclined section 401, and the first platform surface 301 is connected to the second platform surface 302;
所述第二引脚102连接有第一凸台面305通过第二倾斜段402连接，所述第一凸台面305连接有第二凸台面306，所述第一凸台面305的底面上设置有第一凸台501，所述第二凸台面3的底面上设置有第二凸台502；The second pin 102 is connected to the first boss surface 305 and connected by the second inclined section 402. The first boss surface 305 is connected with the second boss surface 306. The first boss surface 305 is provided with a second surface. a boss 501, the second boss 3 is provided on the bottom surface of the second boss 502;
所述第三引脚103连接有第三凸台面307通过第三倾斜段403连接，所述第三凸台面307连接有第三平台面303，所述第三凸台面307上表面设置有第三凸台503；The third pin 103 is connected to the third land 307 via a third inclined section 403, the third land 307 is connected to the third platform surface 303, and the third surface of the third boss 307 is provided with a third surface. Boss 503;
所述第四引脚104连接有第四平台面304通过第四倾斜段404连接，所述第四平台面304连接有第四凸台面308，所述第四凸台面308上表面设置有第四凸台504；The fourth pin 104 is connected to the fourth platform surface 304 and connected by the fourth inclined section 404. The fourth platform surface 304 is connected with a fourth boss surface 308, and the fourth boss surface 308 is provided with a fourth surface. Boss 504;
所述第一倾斜段401与第二倾斜段402结构一致，所述第三倾斜段403和第四倾斜段404结构一致，所述第一倾斜段401两端的相对高度大于第三倾斜段403两端的相对高度；The first inclined section 401 is identical to the second inclined section 402. The third inclined section 403 and the fourth inclined section 404 are identical in structure, and the relative height of the two ends of the first inclined section 401 is greater than the third inclined section 403. The relative height of the end;
所述第一芯片201的N面与所述第一平台面301的底面连接，P面与所述第三凸台503的上表面连接；The N surface of the first chip 201 is connected to the bottom surface of the first platform surface 301, and the P surface is connected to the upper surface of the third protrusion 503;
所述第二芯片202的N面与所述第二平台面302的底面连接，P面与所述第四凸台504的上表面连接；The N surface of the second chip 202 is connected to the bottom surface of the second platform surface 302, and the P surface is connected to the upper surface of the fourth boss 504;
所述第三芯片203的N面与所述第三平台面303的上表面连接，P面与所述第二凸台502的底面连接；The N surface of the third chip 203 is connected to the upper surface of the third platform surface 303, and the P surface is connected to the bottom surface of the second protrusion 502;
所述第四芯片204的N面与所述第四平台面304的上表面连接，P面与所述第一凸台501的底面连接；The N surface of the fourth chip 204 is connected to the upper surface of the fourth platform surface 304, and the P surface is connected to the bottom surface of the first boss 501;
所述第一凸台501、第二凸台502、第三凸台503和第四凸台504均为方形凸台。The first boss 501, the second boss 502, the third boss 503, and the fourth boss 504 are all square bosses.
其中，所述第一倾斜段401与第一引脚101形成120-150度的夹角，所述第三倾斜段403与第三引脚103形成150-160度的夹角，同时第一倾斜段401高于第三倾斜段403，这样便于组装产品，即第一引脚连接的焊接面位 于第三引脚连接的焊接面上方；同样，第二引脚连接的焊接面位于第四引脚连接的焊接面上方。Wherein, the first inclined segment 401 forms an angle of 120-150 degrees with the first pin 101, and the third inclined segment 403 forms an angle of 150-160 degrees with the third pin 103, and the first tilt The segment 401 is higher than the third inclined segment 403, which facilitates assembly of the product, that is, the soldering surface of the first pin connection is located above the soldering surface of the third pin connection; likewise, the soldering surface of the second pin connection is located at the fourth pin Above the welded surface of the connection.
其中，所述倾斜段4上均开设有第一通孔6，且倾斜段4的宽度均大于所述引脚1的宽度，第一通孔6可以提高封装后的牢靠度和气密性，倾斜段4的大宽度能够增加整流器的散热面积，提高散热效果，在后续进行塑封时，通孔可以更好的让塑封料与本发明相互锁定；同时也减小了横截面，增加气密性的效果。The first through hole 6 is defined in the inclined section 4, and the width of the inclined section 4 is greater than the width of the pin 1. The first through hole 6 can improve the reliability and airtightness after the package, and the tilt The large width of the segment 4 can increase the heat dissipation area of the rectifier and improve the heat dissipation effect. In the subsequent plastic sealing, the through hole can better lock the molding compound and the invention, and also reduces the cross section and increases the airtightness. effect.
其中，所述第一平台面301与第二平台面302之间、第一凸台面305与第二凸台面306之间、第三凸台面307与第三平台面303之间、第四凸台面304与第四平台面308之间均设置有连接段7，所述连接段7上开设有第二通孔8，连接段7的第二通孔8能够保证在焊接和塑封过程中避免因物料不同相互膨胀系数不同而存在的力拉伤芯片，起到缓冲应力的作用。Wherein, between the first platform surface 301 and the second platform surface 302, between the first convex surface 305 and the second convex surface 306, between the third convex surface 307 and the third platform surface 303, and the fourth convex surface A connecting section 7 is disposed between the 304 and the fourth platform surface 308. The connecting section 7 is provided with a second through hole 8 , and the second through hole 8 of the connecting section 7 can ensure the material in the welding and molding process. Forces that are different in different mutual expansion coefficients pull the chip and act as a buffer.
其中，所述倾斜段4的外侧开设有凹槽9，这样增强铜材与封装料的密合度，让封装料有渗入铜材内部的机会，促使两种紧密结合，形成一个整体，确保产品外观完整，无缝隙开裂的问题。Wherein, the outer side of the inclined section 4 is provided with a groove 9 to enhance the adhesion between the copper material and the encapsulating material, so that the encapsulating material has the opportunity to penetrate into the interior of the copper material, thereby promoting the two kinds of tight bonding to form a whole and ensuring the appearance of the product. Complete, seamless cracking problem.
其中，所述引脚1与所述倾斜段4连接的一端设置有压痕10，通过压痕10能够缓解分解时的缓冲，不会拉伤晶粒，确保产品品质和可靠性。Wherein, one end of the pin 1 connected to the inclined section 4 is provided with an indentation 10, and the indentation 10 can alleviate the buffer during decomposition, and does not damage the die, thereby ensuring product quality and reliability.
其中，所述方形凸台5的表面为长为2.8-3.0mm，宽2.8-3.0mm的方形表面，这样提高焊接面，便于放置大晶粒，提高电流。Wherein, the surface of the square boss 5 is a square surface having a length of 2.8-3.0 mm and a width of 2.8-3.0 mm, thereby improving the welding surface, facilitating the placement of large crystal grains and increasing the current.
其中，所述第一平台面301与第二平台面302相互垂直，所述第一凸台面305和第二凸台面306相互垂直，所述第三平台面303与第三凸台面307相互垂直，所述第四平台面304与第四凸台面308相互垂直，这样能够尽量减小整流器产品的尺寸。The first platform surface 301 and the second platform surface 302 are perpendicular to each other, and the third land surface 305 and the second land surface 307 are perpendicular to each other, and the third platform surface 303 and the third land surface 307 are perpendicular to each other. The fourth landing surface 304 and the fourth projection surface 308 are perpendicular to each other, which minimizes the size of the rectifier product.
本发明的说明书中，说明了大量具体细节。然而，能够理解，本发明的实施例可以在没有这些具体细节的情况下实践。在一些实例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。In the description of the invention, numerous specific details are illustrated. However, it is understood that the embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of the description.
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例 中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means a specific feature described in connection with the embodiment or example. A structure, material or feature is included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification, as well as features of various embodiments or examples, may be combined and combined.
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围，其均应涵盖在本发明的权利要求和说明书的范围当中。Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. The scope is intended to be included within the scope of the claims and the description of the invention.

Claims (9)

  1. 一种超薄微型桥堆整流器，其特征在于，包括引脚、芯片和焊接面，所述引脚与焊接面之间通过倾斜段连接，所述芯片安装在焊接面上；An ultra-thin micro-bridge stack rectifier, comprising: a lead, a chip and a soldering surface, wherein the pin and the soldering surface are connected by an inclined section, and the chip is mounted on the soldering surface;
    所述引脚包括第一引脚、第二引脚、第三引脚和第四引脚，所述芯片包括第一芯片、第二芯片、第三芯片和第四芯片，所述焊接面包括第一平台面、第二平台面、第三平台面、第四平台面、第一凸台面、第二凸台面、第三凸台面和第四凸台面，所述倾斜段包括第一倾斜段、第二倾斜段、第三倾斜段和第四倾斜段；The pin includes a first pin, a second pin, a third pin, and a fourth pin, and the chip includes a first chip, a second chip, a third chip, and a fourth chip, and the soldering surface includes a first platform surface, a second platform surface, a third platform surface, a fourth platform surface, a first convex surface, a second convex surface, a third convex surface, and a fourth convex surface, the inclined section includes a first inclined section, a second inclined section, a third inclined section and a fourth inclined section;
    所述第一引脚与第一平台面通过第一倾斜段连接，所述第一平台面连接有第二平台面；The first pin is connected to the first platform surface by a first inclined section, and the first platform surface is connected with a second platform surface;
    所述第二引脚连接有第一凸台面通过第二倾斜段连接，所述第一凸台面连接有第二凸台面，所述第一凸台面的底面上设置有第一凸台，所述第二凸台面的底面上设置有第二凸台；The second lead is connected to the first boss surface through a second inclined section, the first boss surface is connected to the second boss surface, and the first boss surface is provided with a first boss on the bottom surface thereof, a second boss is disposed on a bottom surface of the second boss surface;
    所述第三引脚连接有第三凸台面通过第三倾斜段连接，所述第三凸台面连接有第三平台面，所述第三凸台面上表面设置有第三凸台；The third lead is connected with a third boss surface connected by a third inclined section, the third boss surface is connected with a third platform surface, and the third boss surface is provided with a third boss;
    所述第四引脚连接有第四平台面通过第四倾斜段连接，所述第四平台面连接有第四凸台面，所述第四凸台面上表面设置有第四凸台；The fourth pin is connected with a fourth platform surface connected by a fourth inclined section, the fourth platform surface is connected with a fourth boss surface, and the fourth boss surface is provided with a fourth boss;
    所述第一倾斜段与第二倾斜段结构一致，所述第三倾斜段和第四倾斜段结构一致，所述第一倾斜段两端的相对高度大于第三倾斜段两端的相对高度；The first inclined section is consistent with the second inclined section structure, the third inclined section and the fourth inclined section are identical in structure, and the relative heights of the two ends of the first inclined section are greater than the relative heights of the two ends of the third inclined section;
    所述第一芯片的N面与所述第一平台面的底面连接，P面与所述第三凸台的上表面连接；The N surface of the first chip is connected to the bottom surface of the first platform surface, and the P surface is connected to the upper surface of the third protrusion;
    所述第二芯片的N面与所述第二平台面的底面连接，P面与所述第四凸台的上表面连接；The N surface of the second chip is connected to the bottom surface of the second platform surface, and the P surface is connected to the upper surface of the fourth boss;
    所述第三芯片的N面与所述第三平台面的上表面连接，P面与所述第二凸台的底面连接；The N surface of the third chip is connected to the upper surface of the third platform surface, and the P surface is connected to the bottom surface of the second protrusion;
    所述第四芯片的N面与所述第四平台面的上表面连接，P面与所述第一凸台的底面连接；The N surface of the fourth chip is connected to the upper surface of the fourth platform surface, and the P surface is connected to the bottom surface of the first boss;
    所述第一凸台、第二凸台、第三凸台和第四凸台均为方形凸台。The first boss, the second boss, the third boss and the fourth boss are all square bosses.
  2. 根据权利要求1所述的一种超薄微型桥堆整流器，其特征在于，所述第一倾斜段与第一引脚形成120-150度的夹角，所述第三倾斜段与第三引脚形成150-160度的夹角。The ultra-thin micro-bridge stack rectifier according to claim 1, wherein the first inclined section forms an angle of 120-150 degrees with the first lead, and the third inclined section and the third lead The feet form an angle of 150-160 degrees.
  3. 根据权利要求2所述的一种超薄微型桥堆整流器，其特征在于，所述倾斜段上均开设有第一通孔，且倾斜段的宽度均大于所述引脚的面积。The ultra-thin micro-bridge stack rectifier according to claim 2, wherein the inclined section is provided with a first through hole, and the width of the inclined section is larger than the area of the lead.
  4. 根据权利要求3所述的一种超薄微型桥堆整流器，其特征在于，所述第一平台面与第二平台面之间、第一凸台面与第二凸台面之间、第三凸台面与第三平台面之间、第四凸台面与第四平台面之间均设置有连接段。The ultra-thin micro-bridge stack rectifier according to claim 3, wherein between the first platform surface and the second platform surface, between the first boss surface and the second boss surface, and the third boss surface A connecting section is disposed between the fourth landing surface and the fourth landing surface and the fourth landing surface.
  5. 根据权利要求4所述的一种超薄微型桥堆整流器，其特征在于，所述连接段上开设有第二通孔。The ultra-thin micro-bridge stack rectifier according to claim 4, wherein the connecting section is provided with a second through hole.
  6. 根据权利要求1-5任一所述的一种超薄微型桥堆整流器，其特征在于，所述倾斜段的外侧开设有凹槽。An ultra-thin micro-bridge stack rectifier according to any one of claims 1 to 5, characterized in that the outer side of the inclined section is provided with a groove.
  7. 根据权利要求6所述的一种超薄微型桥堆整流器，其特征在于，所述引脚与所述倾斜段连接的一端设置有压痕。An ultra-thin micro-bridge stack rectifier according to claim 6, wherein one end of said pin connected to said inclined section is provided with an indentation.
  8. 根据权利要求7所述的一种超薄微型桥堆整流器，其特征在于，所述方形凸台的表面为长为2.8-3.0mm，宽2.8-3.0mm的方形表面。The ultra-thin micro-bridge stack rectifier according to claim 7, wherein the surface of the square boss is a square surface having a length of 2.8-3.0 mm and a width of 2.8-3.0 mm.
  9. 根据权利要求8所述的一种超薄微型桥堆整流器，其特征在于，所述第一平台面与第二平台面相互垂直，所述第一凸台面和第二凸台面相互垂直，所述第三平台面与第三凸台面相互垂直，所述第四平台面与第四凸台面相互垂直。The ultra-thin micro-bridge stack rectifier according to claim 8, wherein the first platform surface and the second platform surface are perpendicular to each other, and the first boss surface and the second land surface are perpendicular to each other, The third platform surface and the third land surface are perpendicular to each other, and the fourth platform surface and the fourth land surface are perpendicular to each other.
PCT/CN2018/110814 2018-05-03 2018-10-18 Ultra-thin micro-bridge rectifier WO2019210651A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202839600U (en) * 2012-07-06 2013-03-27 广东良得电子科技有限公司 Ultrathin full-wave rectifier
CN103401438A (en) * 2013-08-13 2013-11-20 苏州工业园区凯众通微电子技术有限公司 Novel surface-mounted bridge-type rectifier and manufacturing method thereof
US20140264860A1 (en) * 2013-03-12 2014-09-18 Jung-Chi HSIEN Rectifier diode
CN206834176U (en) * 2017-02-20 2018-01-02 乐山无线电股份有限公司 A kind of low-thermal resistance high-power paster rectifier bridge
CN108389854A (en) * 2018-05-03 2018-08-10 扬州虹扬科技发展有限公司 A kind of ultrathin miniature bridge rectifier

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102157480A (en) * 2011-01-30 2011-08-17 常州银河世纪微电子有限公司 Bridge rectifier
CN103022023B (en) * 2012-11-02 2016-04-13 敦南微电子（无锡）有限公司 Ultrathin miniature bridge rectifier
CN205069621U (en) * 2015-09-22 2016-03-02 常州星海电子有限公司 Ultra -thin high -efficient ABF rectifier bridge
US9761507B1 (en) * 2016-04-07 2017-09-12 Diodes Incorporated Stacked rectifiers in a package
CN206558497U (en) * 2017-03-24 2017-10-13 王刚 A kind of leads of semiconductor device framework of use TO types encapsulation
CN208093555U (en) * 2018-05-03 2018-11-13 扬州虹扬科技发展有限公司 A kind of ultrathin miniature bridge rectifier

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202839600U (en) * 2012-07-06 2013-03-27 广东良得电子科技有限公司 Ultrathin full-wave rectifier
US20140264860A1 (en) * 2013-03-12 2014-09-18 Jung-Chi HSIEN Rectifier diode
CN103401438A (en) * 2013-08-13 2013-11-20 苏州工业园区凯众通微电子技术有限公司 Novel surface-mounted bridge-type rectifier and manufacturing method thereof
CN206834176U (en) * 2017-02-20 2018-01-02 乐山无线电股份有限公司 A kind of low-thermal resistance high-power paster rectifier bridge
CN108389854A (en) * 2018-05-03 2018-08-10 扬州虹扬科技发展有限公司 A kind of ultrathin miniature bridge rectifier

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