WO2019205702A1

WO2019205702A1 - Array substrate, and manufacturing method thereof

Info

Publication number: WO2019205702A1
Application number: PCT/CN2018/124496
Authority: WO
Inventors: 陈黎暄; 林旭林; 杨流洋; 马远洋; 陈孝贤
Original assignee: 深圳市华星光电半导体显示技术有限公司
Priority date: 2018-04-25
Filing date: 2018-12-27
Publication date: 2019-10-31
Also published as: CN108594550A; CN108594550B

Abstract

An array substrate and a manufacturing method thereof. The array substrate comprises a base substrate (10) and multiple criss-crossed metal traces (20) provided on the base substrate (10). The base substrate (10) has multiple transparent regions (11). A portion of the metal traces (20) that are located within the multiple transparent regions (11) are each provided with a metal oxide layer (21) on side surfaces thereof. The metal oxide layer (21) improves depolarization at edges and bent locations of the metal traces (20) in the transparent regions (11), thereby reducing light leakage of the transparent regions, and enhancing the contrast of liquid crystal display panels.

Description

Array substrate and manufacturing method thereof

Technical field

The present invention relates to the field of display technologies, and in particular, to an array substrate and a method of fabricating the same.

Background technique

With the development of display technology, liquid crystal display (LCD) has gradually replaced cathode ray tube (Cathode) due to its high image quality, power saving, thin body and wide application range. Ray Tube (CRT) display screens are widely used in mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, desktop computers and other consumer electronic products, becoming the mainstream in display devices.

Most of the liquid crystal displays on the market are backlight type liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is Thin Film Transistor Array Substrate (TFT Array Substrate) and color filter (Color) Filter, CF) is filled with liquid crystal molecules between the substrates, and a driving voltage is applied to the two substrates to control the rotation direction of the liquid crystal molecules to refract the light of the backlight module to generate a picture.

In the conventional liquid crystal display panel, in order to increase the storage capacitance and the like, a cross structure or intersection of metal wires is often left in the light transmitting region. When the polarized light passes through the cross structure or intersection of the metal, the polarization direction of the partially polarized light will be deflected, resulting in partial leakage of the polarized light after filtering through the polarizer in the vertical direction. For incident horizontally polarized light, non-horizontal or vertical metal corners or metal edges can affect the polarization of horizontally polarized light, and a diffraction-like phenomenon occurs, while the polarization direction changes partially, causing light leakage under dark images. However, if the metal wire structure is not disposed in the light transmitting region, the high-resolution liquid crystal display panel may have insufficient charging efficiency and insufficient storage capacity.

technical problem

It is an object of the present invention to provide an array substrate in which the depolarization phenomenon of the metal trace edge and the curved position of the light transmitting region is greatly improved, and the light leakage in the light transmitting region is reduced.

It is an object of the present invention to provide a method for fabricating an array substrate, which can greatly improve the depolarization phenomenon of the metal trace edge and the curved position in the light-transmitting region, and reduce light leakage in the light-transmitting region.

Technical solution

To achieve the above object, the present invention provides an array substrate comprising: a substrate substrate and a plurality of criss-crossing metal traces disposed on the substrate; the substrate comprising a plurality of arrays a light transmitting region; the metal trace is disposed on a side of the portion of the plurality of light transmitting regions and is provided with a metal oxide layer.

The material of the metal trace is copper; the metal oxide layer is copper oxide.

The invention also provides a method for fabricating an array substrate, comprising the following steps:

Step S1, providing a substrate; forming a first metal layer on the substrate;

The substrate substrate includes a plurality of light-transmissive regions arranged in an array;

Step S2, forming a plurality of criss-crossing metal traces in the first metal layer, and forming a metal oxide layer on sides of the metal traces in the plurality of light transmissive regions.

The step S2 is specifically: first patterning the first metal layer, forming a plurality of criss-crossing metal traces, and then introducing oxygen or ozone, and oxidizing the metal on the side of the metal traces in the plurality of light-transmitting regions to form a metal Oxide layer.

The specific step of the step S2 is: first introducing oxygen, oxidizing a side of the first metal layer in the plurality of transparent regions to form a metal oxide layer, and then patterning the first metal layer to form a plurality of criss-crossing metal walks. a wire and a metal oxide layer on a side of the metal trace in the plurality of light transmissive regions.

The step S2 is specifically: first depositing a metal oxide layer on the first metal layer through the metal oxide target, and then patterning the first metal layer and the metal oxide layer to form a plurality of criss-crossing metal walks. a line, and a metal oxide layer on the side of the metal trace in the plurality of light transmissive regions.

The step S2 is specifically: first patterning the first metal layer, forming a plurality of criss-crossing metal traces, depositing a metal oxide layer on the metal trace through the metal oxide target, and patterning The metal oxide layer forms a metal oxide layer on a side of the metal trace in the plurality of light transmissive regions

The step S2 is specifically: first patterning the first metal layer to form a plurality of criss-crossing metal traces, and then oxidizing the side of the metal traces in the plurality of light-transmitting regions by the oxidant solution to form a plurality of a metal oxide layer on the side of the metal trace in the light transmitting region.

The oxidation temperature is below 350°, the oxidation time is less than or equal to 3 minutes, and the gas flow rate is less than 3000 SCCM.

The invention also provides a method for fabricating an array substrate, which comprises the following steps:

Step S1, providing a substrate; forming a first metal layer on the substrate;

Step S2, forming a plurality of criss-crossing metal traces in the first metal layer, and forming a metal oxide layer on sides of the metal traces in the plurality of light-transmitting regions;

The specific step of the step S2 includes the following one:

First patterning the first metal layer to form a plurality of criss-crossing metal traces, and then introducing oxygen or ozone to oxidize a side of the metal traces in the plurality of light-transmitting regions to form a metal oxide layer;

First introducing oxygen gas, oxidizing a side of the first metal layer in the plurality of light-transmissive regions to form a metal oxide layer, and then patterning the first metal layer to form a plurality of criss-crossing metal traces and located in the plurality of light-transmitting regions A metal oxide layer on the side of the metal trace.

Step S1, providing a substrate; forming a first metal layer on the substrate;

The specific step of the step S2 includes the following one:

First depositing a metal oxide layer on the first metal layer through the metal oxide target, and then patterning the first metal layer and the metal oxide layer to form a plurality of criss-crossing metal traces, and being located in the plurality of light transmissive layers a metal oxide layer on the side of the metal trace in the region;

First patterning the first metal layer to form a plurality of criss-crossing metal traces, depositing a metal oxide layer on the metal trace through the metal oxide target, patterning the metal oxide layer to form a a metal oxide layer on the side of the metal trace in the plurality of light transmissive regions.

Beneficial effect

Advantageous Effects of the Invention: The array substrate of the present invention comprises a base substrate and a plurality of criss-crossing metal traces disposed on the base substrate; the base substrate has a plurality of light transmissive regions; The metal oxide layer is disposed on the side of the portion of the plurality of light-transmissive regions, and the metal oxide layer is beneficial for greatly improving the depolarization phenomenon of the metal trace edge and the bending position of the light-transmitting region, reducing light leakage in the light-transmitting region, and improving liquid crystal. The contrast of the display panel. The method for fabricating an array substrate of the present invention comprises forming a plurality of criss-crossing metal traces in a first metal layer on a base substrate, and a metal oxide layer on a side of the metal traces in the plurality of light-transmitting regions, the metal The oxide layer is beneficial for greatly improving the depolarization phenomenon of the edge and the bending position of the metal trace in the light-transmitting region, reducing the light leakage in the light-transmitting region, and improving the contrast of the liquid crystal display panel.

DRAWINGS

The detailed description of the present invention and the accompanying drawings are to be understood,

In the drawings,

1 is a plan view of an array substrate of the present invention;

2 is an enlarged view of a metal trace of the array substrate of the present invention;

3 is a simulation diagram of a time domain finite difference method of an array substrate of the present invention;

4 is a flow chart of a method of fabricating an array substrate of the present invention.

Embodiments of the invention

In order to further clarify the technical means and effects of the present invention, the following detailed description will be made in conjunction with the preferred embodiments of the invention and the accompanying drawings.

Referring to FIG. 1 and FIG. 2, the array substrate of the present invention includes: a substrate substrate 10 and a plurality of criss-crossing metal traces 20 disposed on the substrate substrate 10; the substrate substrate 10 includes a plurality of arrays The light-transmissive regions 11 are arranged; the metal traces 20 are disposed on the sides of the portions of the plurality of light-transmissive regions 11 .

It should be noted that the plurality of criss-crossing metal traces 20 on the base substrate 10 have a plurality of intersections. In the design theory, the intersections of the plurality of metal traces 20 are vertical structures, but a plurality of metals are produced in actual production. When the trace 20 is traced, the intersection of the plurality of metal traces 20 is necessarily an arc structure, and the intersection of the curved structures affects the polarization direction of the incident polarized light of the liquid crystal display panel, resulting in light leakage of the liquid crystal display panel, and thus the present invention A metal oxide layer 21 is disposed on a side of a portion of the metal traces 20 located in the plurality of light-transmissive regions 11, which is advantageous for greatly improving the depolarization of the edges and bending positions of the metal traces 20 of the light-transmitting region 11, and reducing the light-transmitting region. 11 light leakage, improve the contrast of the liquid crystal display panel. As shown in FIG. 3, the present invention simulates the ability of the metal oxide layer 21 to be deflected by a Finite-Difference Time-Domain (FDTD) method, and places the metal trace 20 having only one metal oxide layer 21 on one side. In the three-dimensional coordinate system, the metal trace 20 is placed in the XY plane and placed at an oblique angle. The surface light source along the Z direction is irradiated on the metal trace 20, and the electric field of the light source is along the y direction, and an electric field is formed near the edge of the metal trace 20. The scattered light along the x direction can be observed that the metal trace 20 has a light leakage side on the side of the metal oxide layer 21 that is smaller than the light leakage side of the metal trace 20 on the side of the metal oxide layer 21, indicating that the present invention is on the metal trace 20. The metal oxide layer 21 is disposed on the side surface to reduce the light leakage phenomenon at the curved position of the metal trace 20. Moreover, since the metal oxide layer 21 is disposed on the side of the metal trace 20, the upper surface of the metal trace 20 is not excessively oxidized, which is advantageous for preventing poor conduction of the metal trace 20.

Further, the angle between the polarization direction of the incident light of the array substrate and the metal trace 20 is 30° to 60°, preferably 45°, and the degree of light leakage of the metal trace 20 can be greatly reduced.

Specifically, the array substrate further includes a first metal layer M1 disposed on the base substrate 10, and a second metal layer M2 disposed on the first metal layer M1 and insulated from the first metal layer M1; the metal The trace 20 is located in the first metal layer M1, and the first metal layer M1 further includes a plurality of gate lines 22 extending in the horizontal direction spaced apart from the metal traces 20, and a gate connected to the gate lines 22. The second metal layer M2 includes a plurality of data lines 30 extending in a vertical direction, a source 31 connected to the data line 30, and a drain 32 spaced apart from the source 31; the plurality of gate lines 22 and a plurality of data lines 30 enclose a plurality of light transmissive regions 11; the gate electrodes 23, the source electrodes 31 and the drain electrodes 32 constitute a thin film transistor T.

Specifically, the array substrate further includes a pixel electrode 12 disposed on the second metal layer M2 and located in the transparent region 11; the pixel electrode 12 is connected to the drain 32 of the thin film transistor T via a via VH.

Specifically, the material of the pixel electrode 12 is indium tin oxide (ITO).

Specifically, the material of the metal trace 20 is copper; and the metal oxide layer 21 is copper oxide.

Specifically, the pixel electrode 12 includes: a trunk 121 having a cross shape, a plurality of pixel electrode branches 122 extending from the trunk 121 in different directions, and an end connecting all the pixel electrode branches 122 (with the pixel electrode branch 122 away from the trunk) One end of 121 is the end) and the closed frame 123 of the trunk 121.

Specifically, the metal trace 20 includes a horizontal portion 201 parallel to the gate line 22, and a first vertical portion 202 perpendicularly intersecting the horizontal portion 201; the horizontal portion 201 and the first vertical portion The portion 202 is disposed corresponding to the trunk 121 of the pixel electrode 12 such that the metal trace 20 and the pixel electrode 12 form a storage capacitor structure. Since the overlapping area of the metal trace 20 and the pixel electrode 12 is large, the capacitance of the storage capacitor is also large. The charging efficiency of the array substrate can be improved.

Specifically, the metal trace 20 further includes a second vertical portion 203 disposed between the pixel electrode 12 and the data line 30 and perpendicularly intersecting the horizontal portion 201.

Referring to FIG. 4, based on the above array substrate, the present invention further provides a method for fabricating an array substrate, comprising the following steps:

Step S1, providing a substrate 10; forming a first metal layer M1 on the substrate 10;

The base substrate 10 includes a plurality of arrays of light transmissive regions 11;

Step S2, forming a plurality of criss-crossing metal traces 20 in the first metal layer M1, and forming a metal oxide layer 21 on the side of the metal traces 20 in the plurality of light-transmitting regions 11.

Specifically, the step S2 is specifically: first patterning the first metal layer M1, forming a plurality of criss-crossing metal traces 20, and then introducing oxygen or ozone to oxidize the metal in the plurality of transparent regions 11 A metal oxide layer 21 is formed on the side of the trace 20.

Specifically, the step S2 is specifically: first introducing oxygen, oxidizing the side of the first metal layer M1 in the plurality of transparent regions 11 to form a metal oxide layer 21, and then patterning the first metal layer M1 to form A plurality of criss-crossing metal traces 20 and a metal oxide layer 21 located on a side of the plurality of light-transmissive regions 11 in the metal traces 20.

Specifically, the oxidation temperature is less than 350°, the oxidation time is no more than 3 minutes, and the gas flow rate is less than 3000 SCCM (standard milliliters per minute).

Specifically, the step S2 is specifically: first depositing a metal oxide layer 21 on the first metal layer M1 through a metal oxide target, and then patterning the first metal layer M1 and the metal oxide layer 21 to form A plurality of criss-crossing metal traces 20 and a metal oxide layer 21 located on the side of the metal traces 20 in the plurality of light transmissive regions 11.

Specifically, the metal oxide layer 21 has a thickness of less than or equal to 150 nm.

Specifically, the step S2 is specifically: first patterning the first metal layer M1, forming a plurality of criss-crossing metal traces 20, and depositing a layer on the metal traces 20 through the metal oxide target. The metal oxide layer 21 is patterned to form the metal oxide layer 21 on the side of the metal traces 20 in the plurality of light transmissive regions 11.

Specifically, the step S2 is specifically: first patterning the first metal layer M1, forming a plurality of criss-crossing metal traces 20, and oxidizing the metal traces 20 in the plurality of transparent regions 11 by the oxidant solution. The side surface forms a metal oxide layer 21 located on the side of the metal trace 20 in the plurality of light-transmissive regions 11; in order to oxidize only the side surface of the metal trace 20 without causing the metal trace 20 to peel off, the oxidant solution needs to be diluted. And control the oxidation time.

Specifically, the oxidant solution is hydrogen peroxide.

In summary, the array substrate of the present invention includes a base substrate and a plurality of criss-crossing metal traces disposed on the base substrate; the base substrate has a plurality of light transmissive regions; the metal traces A metal oxide layer is disposed on a side surface of a portion of the plurality of light-transmitting regions, and the metal oxide layer is beneficial for greatly improving the depolarization phenomenon of the metal trace edge and the bending position of the light-transmitting region, reducing light leakage in the light-transmitting region, and improving liquid crystal display. The contrast of the panel. The method for fabricating an array substrate of the present invention comprises forming a plurality of criss-crossing metal traces in a first metal layer on a base substrate, and a metal oxide layer on a side of the metal traces in the plurality of light-transmitting regions, the metal The oxide layer is beneficial for greatly improving the depolarization phenomenon of the edge and the bending position of the metal trace in the light-transmitting region, reducing the light leakage in the light-transmitting region, and improving the contrast of the liquid crystal display panel.

In the above, various other changes and modifications can be made in accordance with the technical solutions and technical concept of the present invention, and all such changes and modifications are within the scope of the claims of the present invention. .

Claims

An array substrate, comprising: a substrate substrate; and a plurality of criss-crossing metal traces disposed on the substrate; the substrate comprising a plurality of arrays of light transmissive regions; The metal traces are provided with metal oxide layers on the sides of the portions of the plurality of light transmissive regions.
The array substrate according to claim 1, wherein the metal trace is made of copper; and the metal oxide layer is copper oxide.
A method for fabricating an array substrate, comprising the steps of:

Step S1, providing a substrate; forming a first metal layer on the substrate;

The substrate substrate includes a plurality of light-transmissive regions arranged in an array;

Step S2, forming a plurality of criss-crossing metal traces in the first metal layer, and forming a metal oxide layer on sides of the metal traces in the plurality of light transmissive regions.
The method of fabricating an array substrate according to claim 3, wherein the step S2 is specifically: first patterning the first metal layer to form a plurality of criss-crossing metal traces, and then introducing oxygen or Ozone, which oxidizes the side of the metal traces in the plurality of light-transmissive regions to form a metal oxide layer.
The method of fabricating an array substrate according to claim 3, wherein the step S2 comprises the steps of: first introducing oxygen gas, oxidizing a side of the first metal layer in the plurality of light-transmitting regions to form a metal oxide layer, and then The first metal layer is patterned to form a plurality of criss-cross metal traces and a metal oxide layer on the sides of the metal traces in the plurality of light-transmissive regions.
The method of fabricating an array substrate according to claim 3, wherein the step S2 is specifically: first depositing a metal oxide layer on the first metal layer through a metal oxide target, and then patterning The first metal layer and the metal oxide layer form a plurality of criss-crossing metal traces and a metal oxide layer on the side of the metal traces in the plurality of light-transmissive regions.
The method of fabricating an array substrate according to claim 3, wherein the step S2 is specifically: first patterning the first metal layer to form a plurality of criss-crossing metal traces, and passing through the metal oxide target A metal oxide layer is deposited on the metal trace, and the metal oxide layer is patterned to form a metal oxide layer on a side of the metal trace in the plurality of light transmissive regions.
The method of fabricating an array substrate according to claim 3, wherein the step S2 is specifically: first patterning the first metal layer to form a plurality of criss-crossing metal traces, and then oxidizing by an oxidant solution Located on the side of the metal traces in the plurality of light transmissive regions, forming a metal oxide layer on the side of the metal traces in the plurality of light transmissive regions.
The method of fabricating an array substrate according to claim 4 or 5, wherein the oxidation temperature is lower than 350°, the oxidation time is less than or equal to 3 minutes, and the gas flow rate is less than 3000 SCCM.
The method of fabricating an array substrate according to claim 3, wherein the metal trace is made of copper; and the metal oxide layer is copper oxide.
A method for fabricating an array substrate, comprising the steps of:

Step S1, providing a substrate; forming a first metal layer on the substrate;

The substrate substrate includes a plurality of light-transmissive regions arranged in an array;

Step S2, forming a plurality of criss-crossing metal traces in the first metal layer, and forming a metal oxide layer on sides of the metal traces in the plurality of light-transmitting regions;

The specific step of the step S2 includes the following one:

First patterning the first metal layer to form a plurality of criss-crossing metal traces, and then introducing oxygen or ozone to oxidize a side of the metal traces in the plurality of light-transmitting regions to form a metal oxide layer;

First introducing oxygen gas, oxidizing a side of the first metal layer in the plurality of light-transmissive regions to form a metal oxide layer, and then patterning the first metal layer to form a plurality of criss-crossing metal traces and located in the plurality of light-transmitting regions A metal oxide layer on the side of the metal trace.
A method for fabricating an array substrate, comprising the steps of:

Step S1, providing a substrate; forming a first metal layer on the substrate;

The substrate substrate includes a plurality of light-transmissive regions arranged in an array;

Step S2, forming a plurality of criss-crossing metal traces in the first metal layer, and forming a metal oxide layer on sides of the metal traces in the plurality of light-transmitting regions;

The specific step of the step S2 includes the following one:

First depositing a metal oxide layer on the first metal layer through the metal oxide target, and then patterning the first metal layer and the metal oxide layer to form a plurality of criss-crossing metal traces, and being located in the plurality of light transmissive layers a metal oxide layer on the side of the metal trace in the region;

First patterning the first metal layer to form a plurality of criss-crossing metal traces, depositing a metal oxide layer on the metal trace through the metal oxide target, patterning the metal oxide layer to form a a metal oxide layer on the side of the metal trace in the plurality of light transmissive regions.