WO2019205587A1 - 显示装置 - Google Patents

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Publication number
WO2019205587A1
WO2019205587A1 PCT/CN2018/115265 CN2018115265W WO2019205587A1 WO 2019205587 A1 WO2019205587 A1 WO 2019205587A1 CN 2018115265 W CN2018115265 W CN 2018115265W WO 2019205587 A1 WO2019205587 A1 WO 2019205587A1
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WO
WIPO (PCT)
Prior art keywords
conductive
substrate
display device
orthographic projection
backlight module
Prior art date
Application number
PCT/CN2018/115265
Other languages
English (en)
French (fr)
Inventor
吴昊
张晓萍
尹辉
景奇
张铮
次刚
马晓
罗振华
张罗
曹学文
刘彬彬
苏伟
金亨奎
蔡斯特
Original Assignee
京东方科技集团股份有限公司
北京京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 北京京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/473,080 priority Critical patent/US11199749B2/en
Publication of WO2019205587A1 publication Critical patent/WO2019205587A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136204—Arrangements to prevent high voltage or static electricity failures
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133334—Electromagnetic shields
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0288—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0296—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices involving a specific disposition of the protective devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a display device.
  • the profile cutting design of the first substrate of the display screen and the end of the color film substrate becomes more and more common, and the LED is closer and closer to the edge of the screen when the display module is in the display module.
  • the LED may be exposed to static electricity such as a light-off or a blast.
  • the backlight module comprising an LED light group
  • the display panel includes a first substrate and a second substrate disposed in a direction away from the backlight module, and the first substrate includes a non-occlusion region not covered by the second substrate, and the LED lamp group is An orthographic projection of the first substrate is located in the non-occlusion region;
  • the protective cover plate is located at a light exiting side of the display panel
  • a casing located at a side of the backlight module facing away from the display panel, and the casing is grounded;
  • the method further includes: a flexible circuit board connected to the first substrate;
  • the flexible circuit board includes a first ground end, and the conductive structure is electrically connected to the first ground end.
  • the conductive structure includes: a conductive shielding layer on a side of the first substrate adjacent to the second substrate;
  • the conductive shielding layer is located in the non-occlusion region of the first substrate, and an orthographic projection of the conductive shielding layer on the first substrate covers at least one of the LEDs in the LED light group.
  • the first substrate is provided with a contact pad in the non-obscured region
  • the conductive shielding layer is electrically connected to the contact pad, and the first ground end is electrically connected to the contact pad.
  • the orthographic projection of the conductive shielding layer on the first substrate covers an orthographic projection of the light emitting diodes at both ends of the LED light group on the first substrate.
  • the material of the conductive shielding layer comprises a transparent conductive material.
  • the conductive structure includes: a conductive buffer portion, and a conductive connection portion;
  • One end of the conductive buffer portion is connected to a side of the protective cover plate facing the first substrate, and the other end is connected to the first substrate at a position of the non-occlusion region;
  • the conductive connection portion is attached to the side of the first substrate and the backlight module corresponding to the LED light group, and the conductive connection portion is overlapped with the conductive buffer portion;
  • An orthographic projection of the conductive buffer on the first substrate does not overlap with an orthographic projection of the flexible circuit board on the first substrate;
  • the conductive connection portion has no overlapping area with the flexible circuit board.
  • the protective cover is disposed on a side close to the display panel with a second ground end disposed at a ground;
  • the conductive buffer portion is electrically connected to the second ground end.
  • the conductive structure further includes: a conductive layer located on a side of the backlight module adjacent to the casing;
  • the conductive layer overlaps the conductive connection and is electrically connected to the casing.
  • the orthographic projection of the conductive layer on the first substrate at least covers an orthographic projection of the LED light group on the first substrate.
  • the material of the conductive layer comprises graphite.
  • the material of the conductive buffer portion comprises a conductive foam.
  • the conductive connection portion is a conductive adhesive coating.
  • the backlight module further includes: a metal back plate located on a side of the LED light group facing away from the display panel, and the light emitting diode lamp group and the a reflective sheet between the metal back sheets;
  • the metal back plate is electrically connected to the conductive structure.
  • FIG. 1 is a schematic structural diagram of a display device according to an embodiment of the present disclosure
  • FIG. 2 is a second schematic structural diagram of a display device according to an embodiment of the present disclosure.
  • FIG. 3 is a third schematic structural diagram of a display device according to an embodiment of the present disclosure.
  • FIG. 4 is a fourth schematic structural diagram of a display device according to an embodiment of the present disclosure.
  • an embodiment of the present disclosure provides a display device.
  • the present disclosure will be further described in detail in the following examples for the purpose of the present disclosure.
  • FIG. 1 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure
  • FIG. 3 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.
  • the present disclosure provides a display device, as shown in FIGS. 1 and 2, including:
  • the backlight module 1 includes a light-emitting diode lamp set 8;
  • the display panel 2 includes a first substrate 5 and a second substrate 6 disposed in a direction away from the backlight module 1 , and the first substrate 5 includes a non-occlusion region not covered by the second substrate 6 (shown by a broken line A in the figure)
  • the orthographic projection of the LED lamp set 8 on the first substrate 5 is located in the non-occlusion area A;
  • the protective cover 12 is located on the light exit side of the display panel 2;
  • the casing 15 is located on a side of the backlight module 1 facing away from the display panel 2, and the casing 15 is grounded;
  • the conductive structure 18, the orthographic projection of the conductive structure 18 on the first substrate 5 and the orthographic projection of the LED array 8 on the first substrate 5 at least partially overlap, and the conductive structure 18 connects the protective cover 12 and the casing 15.
  • the display device provided by the embodiment of the present disclosure is configured by grounding the casing and providing a conductive structure connecting the protective cover and the casing, and the orthographic projection of the conductive structure on the first substrate and the LED lamp group on the first substrate
  • the upper orthographic projection has at least partially overlapping regions.
  • the conductive structure 18 may be in a direction perpendicular to the surface of the display panel. At least a portion of the LED lamp set 8 is shielded to mitigate damage to the LED lamp set 8 by static electricity in a direction perpendicular to the surface of the display panel.
  • the display panel 2 may be a liquid crystal display panel.
  • the LED light group 8 in the backlight module 1 may be located at one side of the backlight module 1 or two of the backlight modules 1 . Or a plurality of side edges, which are not limited herein, a plurality of light emitting diodes 14 may be included in the LED group 8.
  • the LEDs 14 may be arranged in one or more rows, and the number of the LEDs 14 is not The arrangement is limited.
  • FIG. 1 and FIG. 2 further comprising: a flexible circuit board 11 connected to the first substrate 5;
  • the flexible circuit board 11 includes a first ground terminal (not shown), and the conductive structure 18 is electrically connected to the first ground terminal.
  • the conductive structure 18 includes: a conductive shielding layer 9 located on a side of the first substrate 5 adjacent to the second substrate 6;
  • the conductive shielding layer 9 is located in the non-occlusion area A of the first substrate 5, and the orthographic projection of the conductive shielding layer 9 on the first substrate 5 covers at least the LED light group 8.
  • the first substrate 5 is provided with a contact pad (not shown) in the non-occlusion area A;
  • the conductive shielding layer 9 is electrically connected to the contact pad, and the first ground end is electrically connected to the contact pad.
  • the first ground end of the flexible circuit board 11 can be connected to the contact pad located in the non-occlusion area A, and the contact pad and the conductive shielding layer 9 are both located in the non-occlusion area A of the first substrate 5. Therefore, the contact pad and the conductive shielding layer 9 can be connected by a conductor such as a wire, thereby achieving electrical connection between the conductive shielding layer 9 and the first ground end.
  • the orthographic projection of the conductive shielding layer 9 on the first substrate 5 covers at least one orthographic projection of one light emitting diode 14 on the first substrate 5, so that the static electricity generated on the side of the first substrate 5 close to the protective cover 12 can be blocked. The damage of the LED can not only protect the LED 14 from static electricity, but also reduce the coating range of the electrostatic shielding layer 9, thereby reducing the production cost of the display module.
  • a driving chip or other traces may be disposed in the non-occlusion area A of the first substrate 5, in order to prevent the conductive shielding layer 9 from being short-circuited with the driving chip or other traces, in the display device provided by the embodiment of the present disclosure,
  • the orthographic projection of the conductive shielding layer 9 on the first substrate 5 covers the orthographic projection of the light emitting diodes 14 on both ends of the LED lamp group 8 on the first substrate 5, thereby preventing static electricity from being transmitted from both ends of the LED lamp group 8 to the light emission.
  • the diodes damage the light-emitting diodes.
  • the conductive shield layer 9 is set to The orthographic projection on the first substrate 5 blocks the light-emitting diodes at both ends to function as a good anti-static.
  • the material of the conductive shielding layer 9 includes a transparent conductive material, and for example, a transparent conductive oxide material such as indium tin oxide (ITO) may be used. This can achieve the discharge of static electricity without affecting the display effect of the display module.
  • a transparent conductive oxide material such as indium tin oxide (ITO)
  • the conductive structure 18 includes: a conductive buffer portion 13, and a conductive connecting portion 10;
  • One end of the conductive buffer portion 13 is connected to the side of the protective cover 12 facing the first substrate 5, and the other end is connected to the first substrate 5 at a position of the non-occlusion area;
  • the conductive connecting portion 10 is attached to the side of the first substrate 5 and the backlight module 1 and the light-emitting diode group 8 , and the conductive connecting portion 10 is overlapped with the conductive buffer portion 13 ;
  • the orthographic projection of the conductive buffer portion 13 on the first substrate 5 does not overlap with the orthographic projection of the flexible circuit board 11 on the first substrate 5;
  • the conductive connection portion 10 has no overlapping area with the flexible circuit board 11.
  • the conductive buffer portion 13 is filled between the non-occlusion region of the first substrate 5 and the protective cover, and the orthographic projection of the conductive buffer portion 13 on the first substrate 5 and the orthographic projection of the flexible circuit board 11 on the first substrate 5 are absent.
  • the conductive buffer portion 13 is overlapped to avoid the short circuit, and the function of the flexible circuit board 11 is affected. Further, the conductive buffer portion 13 can be connected to the first substrate 5 through the conductive shielding layer 9, thereby The conductive buffer portion 13 is electrically connected to the first ground end of the flexible circuit board 11.
  • one end of the conductive connecting portion 10 can be overlapped with the conductive buffer portion 13 , and the other end directly or indirectly connected to the casing 15 . Bonding, thereby achieving electrical connection between the conductive buffer portion 13 and the casing 15, and the conductive connecting portion 10 and the flexible circuit board 11 have no overlapping area, and thus the conductive connecting portion 10 does not affect the flexible circuit board 11 toward the casing. 15 back bends.
  • the protective cover 12 is disposed on the side close to the display panel 2 with a second grounding end (not shown) disposed at the ground;
  • the conductive buffer portion 13 is electrically connected to the second ground terminal.
  • the second ground end may be disposed at a position opposite to the conductive buffer portion 13 of the protective cover 12, so that the second ground end
  • the conductive buffer portion 13 can be directly in contact with the connection.
  • the electrostatic discharge path of the conductive structure 18 is increased by connecting the conductive buffer portion 13 to the second ground end. For example, when static electricity appears on the side of the backlight module, the static electricity can be released at the casing 15 and the static electricity can be conducted.
  • the first ground end on the flexible circuit board 11 is released, and may be discharged to the second ground end on the protective cover 12 for release, or when static electricity is generated on the side of the protective cover 12 of the display device, the static electricity may be transmitted to A portion of the second grounding end of the protective cover 12 is released, and may be conducted to the first grounding end of the flexible circuit board 11 for release, or may be transmitted to the casing for release, thereby improving the electrostatic discharge capability of the conductive structure. And the static electricity can be quickly removed to prevent the influence of static electricity on the LED lamp set 8 or other structures.
  • the conductive structure 18 may further include: a conductive layer 3 located on a side of the backlight module 1 near the casing 15;
  • the conductive layer 3 is overlapped with the conductive connecting portion 10 and electrically connected to the casing 15.
  • the conductive property is improved as compared with directly connecting the conductive connecting portion 10 to the casing 15. Thereby, static electricity can be smoothly discharged through the casing 15.
  • This arrangement can form conductive paths for the conductive layer 3, the conductive connection portion 10, and the conductive shield layer 9.
  • the static electricity is first transmitted to the conductive connecting portion 10 through the conductive layer 3, and then transmitted to the conductive shielding layer 9 on the first substrate 5 through the conductive connecting portion 10,
  • the conductive shielding layer 9 is grounded, so that static electricity is transmitted to the ground through the conductive shielding layer 9, thereby completing the discharge of static electricity.
  • the orthographic projection of the conductive layer 3 on the first substrate 5 at least covers the orthographic projection of the LED lamp group 8 on the first substrate 5, that is, the conductive layer 3 can be disposed.
  • the strip-shaped area at the corresponding position of the LED lamp set 8 can block the damage of the static-light-emitting diode group 8 from the side of the backlight module 1 close to the casing 15 and can ensure the conductive property of the conductive layer 3.
  • the setting range of the conductive layer 3 is reduced, thereby reducing the production cost of the display module.
  • the material of the conductive layer 3 may include graphite, which may be a graphite bonding layer and a graphite coating of the latter, that is, the conductive layer 3 may be formed on the backlight module 1 near the casing 15 by coating or attaching. One side.
  • the material of the conductive buffer portion comprises a conductive foam
  • the conductive foam is formed by using the conductive foam
  • the first substrate 5 and the protective cover can be relatively well filled. Between 12, it is ensured that the first ground end on the protective cover can be in good contact with the conductive structure.
  • the conductive connection portion 10 is a conductive adhesive coating, and the conductive adhesive coating may be directly attached to the side of the display panel 2 and the backlight module 1 during the manufacturing process. Easy to operate.
  • the conductive connection portion may be a planar conductive adhesive coating or a linear conductive adhesive coating.
  • the efficiency of electrostatic conduction can be effectively improved.
  • the static electricity is generated in the peripheral area of the display module and conducted to the area where the light emitting diode is located, the amount of static electricity is small, and the conductive adhesive coating can be set as a plurality of linear conductive adhesive coatings in order to save production cost.
  • the backlight module 1 may further include: a metal back plate 16 located on a side of the LED lamp group 8 facing away from the display panel 2, and a light-emitting diode lamp group 8 and the metal back plate 16 between the reflective sheet 4;
  • the metal backing plate 16 is electrically connected to the electrically conductive structure 18.
  • the backlight module 1 can also include a light guide plate 17, which can be disposed at the side of the light guide plate 17, and the reflective sheet 4 is disposed between the light guide plate 17 and the metal back plate 16, and the reflective sheet 4 can be The light of the light guide plate 17 on the side close to the metal back plate 16 is reflected back to the light guide plate 17 again, thereby improving light utilization efficiency.
  • the metal back plate 16 and the conductive layer 3 can be directly overlapped, thereby achieving electrical connection between the metal back plate 16 and the conductive structure 18, thereby prolonging the path of electrostatic transmission and preventing electrostatic damage to the LED lamp set.
  • the metal back plate 16 can be electrically conductive
  • the conductive connecting portion 10 and the casing 15 can also be connected through the metal back plate 16, so that the conductive layer 3 can be omitted, and the surface of the metal back plate 16 and the reflective sheet 4 can be electrostatically conductive. The function. At this time, a conductive path of the metal back plate 16, the conductive connection portion 10, and the conductive shield layer 9 can be formed.
  • the static electricity is first transmitted to the conductive connecting portion 10 through the conductive layer 3, and then transmitted to the conductive shielding layer 9 on the first substrate 5 through the conductive connecting portion 10, because the conductive shielding layer 9
  • the grounding is set, so that static electricity is transmitted to the ground through the conductive shielding layer 9, thereby completing the discharge of static electricity.
  • the above display device provided by the embodiment of the present disclosure is provided by grounding the casing, and providing a conductive structure connecting the protective cover and the casing, and setting the conductive structure to the first ground end on the flexible circuit board and protecting
  • the second grounding end of the cover plate is connected to form a plurality of electrostatic discharge paths in a three-dimensional form.

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Abstract

一种显示装置，包括：显示面板（2）；背光模组（1），背光模组（1）包括发光二极管灯组（8），显示面板（2）包括沿远离背光模组（1）方向依次设置的第一基板（5）和第二基板（6），第一基板（5）包括未被第二基板（6）覆盖的非遮挡区，发光二极管灯组（8）在第一基板（5）的正投影位于非遮挡区中；保护盖板（12）位于显示面板（2）的出光侧；机壳（15）位于背光模组（1）背离显示面板（2）的一侧，且机壳（15）接地设置；导电结构（18）在第一基板（5）的正投影与发光二极管灯组（8）在第一基板（5）的正投影至少存在部分交叠区域，且导电结构（18）连接保护盖板（12）与机壳（15）。

Description

显示装置
本申请要求在2018年4月25日提交中国专利局、申请号为201810378434.3、公开名称为“一种显示模组及显示装置”的中国专利申请的优先权，其全部内容以引入的方式并入本申请中。
技术领域
本公开涉及显示技术领域，特别是涉及一种显示装置。
背景技术
随着全面屏在手机等移动终端中的应用，对于显示屏的第一基板以及彩膜基板端部的异形切割设计日趋普遍，会使发光二极管距离屏幕边缘越来越近，当在显示模组周边区域产生静电并传导至发光二极管所在区域时，会导致发光二极管出现灭灯、爆灯等静电损伤的情况。
发明内容
本公开实施例提供的一种显示装置，其中，包括：
显示面板；
背光模组，所述背光模组包括发光二极管灯组；
所述显示面板包括沿远离所述背光模组方向依次设置的第一基板和第二基板，所述第一基板包括未被所述第二基板覆盖的非遮挡区，所述发光二极管灯组在所述第一基板的正投影位于所述非遮挡区中；
保护盖板，所述保护盖板位于所述显示面板的出光侧；
机壳，位于所述背光模组背离所述显示面板的一侧，且所述机壳接地设置；
导电结构，所述导电结构在所述第一基板的正投影与所述发光二极管灯组在所述第一基板的正投影至少存在部分交叠区域，且所述导电结构连接所 述保护盖板与所述机壳。
可选地，在本公开实施例中，还包括：与所述第一基板连接的柔性电路板；
所述柔性电路板包括第一接地端，所述导电结构与所述第一接地端电连接。
可选地，在本公开实施例中，所述导电结构，包括：位于所述第一基板靠近所述第二基板一侧的导电屏蔽层；
所述导电屏蔽层位于所述第一基板的所述非遮挡区内，且所述导电屏蔽层在所述第一基板上的正投影至少覆盖所述发光二极管灯组中一个发光二极管在所述第一基板上的正投影；
所述第一基板在所述非遮挡区内设有接触衬垫；
所述导电屏蔽层与所述接触衬垫电连接，所述第一接地端与所述接触衬垫电连接。
可选地，在本公开实施例中，所述导电屏蔽层在所述第一基板上的正投影覆盖所述发光二极管灯组两端的发光二极管在所述第一基板上的正投影。
可选地，在本公开实施例中，所述导电屏蔽层的材料包括透明导电材料。
可选地，在本公开实施例中，所述导电结构，包括：导电缓冲部，以及导电连接部；
所述导电缓冲部的一端与所述保护盖板面向所述第一基板一侧连接，另一端在所述非遮挡区的位置处与所述第一基板连接；
所述导电连接部贴附于所述第一基板和所述背光模组与所述发光二极管灯组对应的侧边处，且所述导电连接部与所述导电缓冲部搭接；
所述导电缓冲部在所述第一基板上的正投影与所述柔性电路板在所述第一基板上的正投影无交叠；
所述导电连接部与所述柔性电路板无搭接区域。
可选地，在本公开实施例中，所述保护盖板在靠近所述显示面板的一侧设有接地设置的第二接地端；
所述导电缓冲部与所述第二接地端电连接。
可选地，在本公开实施例中，所述导电结构，还包括：位于所述背光模组靠近所述机壳一侧的导电层；
所述导电层与所述导电连接部搭接，且与所述机壳电连接。
可选地，在本公开实施例中，所述导电层在所述第一基板上的正投影至少覆盖所述发光二极管灯组在所述第一基板上的正投影。
可选地，在本公开实施例中，所述导电层的材料包括石墨。
可选地，在本公开实施例中，所述导电缓冲部的材料包括导电泡棉。
可选地，在本公开实施例中，所述导电连接部为导电胶涂层。
可选地，在本公开实施例中，所述背光模组，还包括：位于所述发光二极管灯组背离所述显示面板一侧的金属背板，以及位于所述发光二极管灯组与所述金属背板之间的反射片；
所述金属背板与所述导电结构电连接。
附图说明
图1为本公开实施例提供的显示装置的结构示意图之一；
图2为本公开实施例提供的显示装置的结构示意图之二；
图3为本公开实施例提供的显示装置的结构示意图之三；
图4为本公开实施例提供的显示装置的结构示意图之四。
附图标记：
1、背光模组；2、显示面板；3、导电层；4、反射片；5、第一基板；6、第6基板；7、非遮挡区；8、发光二极管灯组；9、导电屏蔽层；10、导电连接部；11、柔性电路板；12、保护盖板；13、导电缓冲部；14、发光二极管；15、机壳；16、金属背板；17、导光板；18、导电结构。
具体实施方式
为减少背光模组中的发光二极管由于静电原因导致的损坏，从而减少显 示装置的静电损失，延长显示装置的使用寿命，本公开实施例提供了一种显示装置。为使本公开的目的、技术方案和优点更加清楚，以下举实施例对本公开作进一步详细说明。
图1为本公开实施例提供的显示装置的俯视结构示意图，图2和图4为本公开实施例提供的显示装置的截面示意图，图3为本公开实施例提供的显示装置的侧视图。
本公开提供了一种显示装置，如图1和图2所示，包括：
显示面板2；
背光模组1，背光模组1包括发光二极管灯组8；
显示面板2包括沿远离背光模组1方向依次设置的第一基板5和第二基板6，第一基板5包括未被第二基板6覆盖的非遮挡区(如图中虚线框A所示)，发光二极管灯组8在第一基板5的正投影位于非遮挡区A中；
保护盖板12，保护盖板12位于显示面板2的出光侧；
机壳15，位于背光模组1背离显示面板2的一侧，且机壳15接地设置；
导电结构18，导电结构18在第一基板5的正投影与发光二极管灯组8在第一基板5的正投影至少存在部分交叠区域，且导电结构18连接保护盖板12与机壳15。
本公开实施例提供的显示装置，通过将机壳接地设置，并设置连接保护盖板与机壳的导电结构，且该导电结构在第一基板上的正投影与发光二极管灯组在第一基板上的正投影具有至少部分交叠区域，当在显示装置具有发光二极管灯组所在的边角处有静电传导过来时，导电结构可以通过机壳将静电进行释放，防止静电对发光二极管灯组产生影响，减少发光二极管由于静电导致的损坏，从而减少显示装置的静电损伤，延长显示装置的使用寿命。
参照图2，在显示装置的使用过程中，由于手指触摸显示屏或者显示装置的表面与其他物体之间的摩擦，因而在保护盖板12一侧容易产生静电，此外，由于机壳15一般为整面设置的导体，且机壳15接地设置，因而机壳15具有比较好的静电释放能力，通过设置连接机壳15与保护盖板12的导电结构18， 可以构成立体的静电防护系统，当保护盖板12表面或者显示装置的侧边处产生静电，静电可以通过导电结构18传导至机壳15释放，从而起到保护发光二极管灯组8的作用。
此外，由于导电结构18在第一基板5的正投影与发光二极管灯组8在第一基板5的正投影至少存在部分交叠区域，因而，导电结构18可以在垂直于显示面板表面的方向上遮挡至少部分发光二极管灯组8，从而缓解垂直于显示面板表面的方向上的静电对发光二极管灯组8的损伤。
在本公开实施例中，上述显示面板2可以为液晶显示面板，背光模组1中的发光二极管灯组8可以位于背光模组1的一个侧边处，也可以位于背光模组1的两个或多个侧边处，此处不做限定，发光二极管灯组8中可以包括多个发光二极管14，一般可以将发光二极管14排列成一行或多行，此处不对发光二极管14的个数和排列方式进行限定。
具体地，本公开实施提供的上述显示装置中，同样参照图1和图2，还包括：与第一基板5连接的柔性电路板11；
柔性电路板11包括第一接地端(图中未示出)，导电结构18与第一接地端电连接。
通过将导电结构18与柔性电路板11上的第一接地端连接，可以将静电通过第一接地端传导到大地进行释放，增加了静电释放的路径，当显示装置的周边区域产生静电后，可以通过导电结构18传导至柔性电路板11的第一接地端释放，也可以传导至机壳15上进行释放，提高了静电释放的能力和速度，从而进一步缓解静电对发光二极管灯组8的损伤，从而能够有效的提高静电释放的效率，提升显示装置的使用寿命。
具体地，本公开实施例提供的上述显示装置中，如图1和图2所示，上述导电结构18，包括：位于第一基板5靠近第二基板6一侧的导电屏蔽层9；
导电屏蔽层9位于第一基板5的非遮挡区A内，且导电屏蔽层9在第一基板5上的正投影至少覆盖发光二极管灯组8中
一个发光二极管14在第一基板5上的正投影；
第一基板5在非遮挡区A内设有接触衬垫(图中未示出)；
导电屏蔽层9与接触衬垫电连接，第一接地端与接触衬垫电连接。
在实际应用中，柔性电路板11中的第一接地端可以与位于非遮挡区A内的接触衬垫连接，而接触衬垫与导电屏蔽层9均位于第一基板5的非遮挡区A内，因而可以通过导线等导体连接接触衬垫与导电屏蔽层9，从而实现导电屏蔽层9与第一接地端的电连接。此外，导电屏蔽层9在第一基板5上的正投影至少覆盖一个发光二极管14在第一基板5上的正投影，从而可以阻挡在第一基板5靠近保护盖板12一侧产生的静电对发光二极管的损伤，这样不仅能够起到对发光二极管14的静电防护，还能够减少静电屏蔽层9的涂覆范围，从而降低显示模组的生产成本。
在具体实施时，在第一基板5的非遮挡区A内可以设置驱动芯片或其他走线，为了避免导电屏蔽层9与驱动芯片或其他走线短路，本公开实施例提供的显示装置中，导电屏蔽层9在第一基板5上的正投影覆盖发光二极管灯组8两端的发光二极管14在第一基板5上的正投影，从而防止静电从发光二极管灯组8的两端处传输至发光二极管，而损伤发光二极管，此外，对于位于发光二极管灯组8内部的发光二极管14，非遮挡区A内的其他走线也可以起到静电防护的作用，因此，将导电屏蔽层9设置为在第一基板5上的正投影遮挡两端处的发光二极管就能起到良好的防静电的作用。
具体地，本公开实施例提供的上述显示装置中，导电屏蔽层9的材料包括透明导电材料，例如可以采用氧化铟锡(Indium tin oxide，ITO)等透明导电氧化物材料。这样可以在实现静电释放的同时不影响显示模组显示效果。
具体地，本公开实施例提供的上述显示装置中，如图2和图3所示，导电结构18，包括：导电缓冲部13，以及导电连接部10；
导电缓冲部13的一端与保护盖板12面向第一基板5一侧连接，另一端在非遮挡区的位置处与第一基板5连接；
导电连接部10贴附于第一基板5和背光模组1与发光二极管灯组8对应的侧边处，且导电连接部10与导电缓冲部13搭接；
导电缓冲部13在第一基板5上的正投影与柔性电路板11在第一基板5上的正投影无交叠；
导电连接部10与柔性电路板11无搭接区域。
导电缓冲部13填充于第一基板5的非遮挡区与保护盖板之间，且导电缓冲部13在第一基板5上的正投影与柔性电路板11在第一基板5上的正投影无交叠，从而将导电缓冲部13避开柔性电路板11，防止产生短路，影响柔性电路板11的功能，此外，可以将导电缓冲部13通过导电屏蔽层9与第一基板5连接，从而使导电缓冲部13与柔性电路板11的第一接地端实现电连接。
此外，通过在导电连接部10贴附于第一基板5和背光模组1的侧边处，可以通过导电连接部10的一端与导电缓冲部13搭接，另一端直接或间接与机壳15搭接，从而实现导电缓冲部13与机壳15之间的电连接，而且，导电连接部10与柔性电路板11无搭接区域，因而导电连接部10不会影响柔性电路板11朝向机壳15背面弯折。
进一步地，本公开实施例提供的上述显示装置，参照图2和图3，保护盖板12在靠近显示面板2的一侧设有接地设置的第二接地端(图中未示出)；
导电缓冲部13与第二接地端电连接。
在具体实施时，为了便于使导电缓冲部13与第二接地端实现电连接，可以将第二接地端设置在保护盖板12与导电缓冲部13相对的位置处，从而使第二接地端与导电缓冲部13可以直接接触连接。通过将导电缓冲部13与第二接地端连接，增加了导电结构18的静电释放路径，例如当显示装置在背光模组一侧出现静电时，静电可以在机壳15处释放一部分，静电可以传导至柔性电路板11上的第一接地端进行释放，也可以传导至保护盖板12上的第二接地端进行释放，或者当显示装置在保护盖板12一侧出现静电时，静电可以传导至保护盖板12上的第二接地端释放一部分，也可以传导至柔性电路板11上的第一接地端进行释放，也可以传导至机壳上进行释放，从而提高了导电结构的静电释放能力，并且可以迅速将静电导走，防止静电对发光二极管灯组8或者其他结构的影响。
具体地，本公开实施例提供的上述显示装置，如图2和图3所示，导电结构18，还可以包括：位于背光模组1靠近机壳15一侧的导电层3；
导电层3与导电连接部10搭接，且与机壳15电连接。
通过在背光模组1与机壳15之间设置导电层3，且通过导电层3与导电连接部10搭接，相比于将导电连接部10直接与机壳15连接，提高了导电性能，从而使静电能够通过机壳15顺利导出。
这样设置可以形成导电层3、导电连接部10以及导电屏蔽层9的导电通路。当有静电从显示装置的机壳15的一侧传导过来时，静电首先通过导电层3传递到导电连接部10，再通过导电连接部10传递到第一基板5上的导电屏蔽层9，由于导电屏蔽层9接地设置，因此，静电便通过导电屏蔽层9传递到大地，从而完成静电的释放。
此外，为了进一步保护发光二极管灯组8，导电层3在第一基板5上的正投影至少覆盖发光二极管灯组8在第一基板5上的正投影，也就是说，可以将导电层3设置为仅在于发光二极管灯组8对应位置处的条形区域，从而可以阻挡从背光模组1靠近机壳15一侧的静电对发光二极管灯组8的损伤，而且可以在保证导电层3导电性能的同时减少导电层3的设置范围，从而降低显示模组的生产成本。
具体地，导电层3的材料可以包括石墨，可以是石墨粘结层后者石墨涂层，也就是可以通过涂覆或者贴附的方式将导电层3形成在背光模组1靠近机壳15的一侧。
在具体实施时，本公开实施例提供的上述显示装置中，上述导电缓冲部的材料包括导电泡棉，采用导电泡棉形成导电缓冲部，能够比较好的填充在第一基板5与保护盖板12之间，保证保护盖板上的第一接地端与导电结构能够良好接触。
具体地，本公开实施例提供的上述显示装置中，导电连接部10为导电胶涂层，在制作过程中，可以将导电胶涂层直接贴附于显示面板2和背光模组1的侧边处，操作简便。导电连接部可以为面状的导电胶涂层，也可以为线状 的导电胶涂层。导电胶涂层设置为面状时可以有效的提高静电传导的效率。而当在显示模组周边区域产生静电并传导至发光二极管所在区域的静电量较少，以及为了节省生产成本可以将导电胶涂层设置为多条线状的导电胶涂层
在实际应用中，本公开实施例提供的上述显示装置中，上述背光模组1，还可以包括：位于发光二极管灯组8背离显示面板2一侧的金属背板16，以及位于发光二极管灯组8与金属背板16之间的反射片4；
金属背板16与导电结构18电连接。
此外，背光模组1一般还可以包括导光板17，发光二极管灯组8可以设置在导光板17的侧边处，反射片4设置于导光板17与金属背板16之间，反射片4可以将导光板17在靠近金属背板16一侧的光线再次反射回导光板17，从而提高光线利用率。可以将金属背板16与导电层3直接搭接，从而实现金属背板16与导电结构18的电连接，从而可以延长静电传输的路径，防止静电损伤发光二极管灯组。
此外，由于金属背板16可以导电，也可以通过金属背板16连接导电连接部10与机壳15，因而可以省略导电层3，由金属背板16与反射片4贴合的表面实现静电传导的功能。这时可以形成金属背板16、导电连接部10以及导电屏蔽层9的导电通路。当有静电从显示模组的下方传导过来时，静电首先通过导电层3传递到导电连接部10，再通过导电连接部10传递到第一基板5上的导电屏蔽层9，由于导电屏蔽层9接地设置，因此，静电便通过导电屏蔽层9传递到大地，从而完成静电的释放。
本公开实施例提供的上述显示装置，通过将机壳接地设置，并设置连接保护盖板与机壳的导电结构，并且，将导电结构设置为与柔性电路板上的第一接地端以及与保护盖板上的第二接地端连接，从而在立体形态上形成了多个静电释放路径，当一个位置处出现静电，可以将静电向多个位置传导进行释放，静电释放能力较强，可以防止静电对发光二极管灯组产生影响，减少发光二极管由于静电导致的损坏，从而减少显示装置的静电损伤，延长显示装置的使用寿命。
尽管已描述了本公开的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本公开范围的所有变更和修改。
显然，本领域的技术人员可以对本公开实施例进行各种改动和变型而不脱离本公开实施例的精神和范围。这样，倘若本公开实施例的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (13)

  1. 一种显示装置，其中，包括：
    显示面板；
    背光模组，所述背光模组包括发光二极管灯组；
    所述显示面板包括沿远离所述背光模组方向依次设置的第一基板和第二基板，所述第一基板包括未被所述第二基板覆盖的非遮挡区，所述发光二极管灯组在所述第一基板的正投影位于所述非遮挡区中；
    保护盖板，所述保护盖板位于所述显示面板的出光侧；
    机壳，位于所述背光模组背离所述显示面板的一侧，且所述机壳接地设置；
    导电结构，所述导电结构在所述第一基板的正投影与所述发光二极管灯组在所述第一基板的正投影至少存在部分交叠区域，且所述导电结构连接所述保护盖板与所述机壳。
  2. 如权利要求1所述的显示装置，其中，还包括：与所述第一基板连接的柔性电路板；
    所述柔性电路板包括第一接地端，所述导电结构与所述第一接地端电连接。
  3. 如权利要求2所述的显示装置，其中，所述导电结构，包括：位于所述第一基板靠近所述第二基板一侧的导电屏蔽层；
    所述导电屏蔽层位于所述第一基板的所述非遮挡区内，且所述导电屏蔽层在所述第一基板上的正投影至少覆盖所述发光二极管灯组中一个发光二极管在所述第一基板上的正投影；
    所述第一基板在所述非遮挡区内设有接触衬垫；
    所述导电屏蔽层与所述接触衬垫电连接，所述第一接地端与所述接触衬垫电连接。
  4. 如权利要求3所述的显示装置，其中，所述导电屏蔽层在所述第一基 板上的正投影覆盖所述发光二极管灯组两端的发光二极管在所述第一基板上的正投影。
  5. 如权利要求3所述的显示装置，其中，所述导电屏蔽层的材料包括透明导电材料。
  6. 如权利要求2所述的显示装置，其中，所述导电结构，包括：导电缓冲部，以及导电连接部；
    所述导电缓冲部的一端与所述保护盖板面向所述第一基板一侧连接，另一端在所述非遮挡区的位置处与所述第一基板连接；
    所述导电连接部贴附于所述第一基板和所述背光模组与所述发光二极管灯组对应的侧边处，且所述导电连接部与所述导电缓冲部搭接；
    所述导电缓冲部在所述第一基板上的正投影与所述柔性电路板在所述第一基板上的正投影无交叠；
    所述导电连接部与所述柔性电路板无搭接区域。
  7. 如权利要求6所述的显示装置，其中，所述保护盖板在靠近所述显示面板的一侧设有接地设置的第二接地端；
    所述导电缓冲部与所述第二接地端电连接。
  8. 如权利要求6所述的显示装置，其中，所述导电结构，还包括：位于所述背光模组靠近所述机壳一侧的导电层；
    所述导电层与所述导电连接部搭接，且与所述机壳电连接。
  9. 如权利要求8所述的显示装置，其中，所述导电层在所述第一基板上的正投影至少覆盖所述发光二极管灯组在所述第一基板上的正投影。
  10. 如权利要求8所述的显示装置，其中，所述导电层的材料包括石墨。
  11. 如权利要求6～10任一项所述的显示装置，其中，所述导电缓冲部的材料包括导电泡棉。
  12. 如权利要求6～10任一项所述的显示装置，其中，所述导电连接部为导电胶涂层。
  13. 如权利要求6～10任一项所述的显示装置，其中，所述背光模组，还 包括：位于所述发光二极管灯组背离所述显示面板一侧的金属背板，以及位于所述发光二极管灯组与所述金属背板之间的反射片；
    所述金属背板与所述导电结构电连接。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113179623A (zh) * 2021-04-06 2021-07-27 武汉华星光电半导体显示技术有限公司 显示模组
CN113284419A (zh) * 2021-05-24 2021-08-20 合肥鑫晟光电科技有限公司 一种显示面板、显示设备及车载显示设备
CN113593409A (zh) * 2021-07-09 2021-11-02 武汉华星光电半导体显示技术有限公司 显示模组及显示装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108535903B (zh) 2018-04-25 2022-03-04 京东方科技集团股份有限公司 一种显示模组及显示装置
KR20210010763A (ko) * 2019-07-19 2021-01-28 삼성디스플레이 주식회사 표시 장치
US20210191185A1 (en) * 2019-11-22 2021-06-24 K-Tronics (Suzhou) Technology Co., Ltd. Glass backplane and method of manufacturing the same, and display apparatus
CN111487814B (zh) * 2020-05-26 2022-08-02 武汉天马微电子有限公司 背光模组及显示装置
CN112349207B (zh) * 2020-11-10 2023-02-21 京东方科技集团股份有限公司 一种背光模组和显示面板
CN113345340B (zh) * 2021-08-06 2021-12-17 惠科股份有限公司 显示屏和拼接显示屏

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090067112A1 (en) * 2007-09-12 2009-03-12 Epson Imaging Devices Corporation Electro-optical device and electronic apparatus
CN101866069A (zh) * 2009-04-17 2010-10-20 群康科技(深圳)有限公司 显示装置
CN102620195A (zh) * 2012-03-13 2012-08-01 深圳市华星光电技术有限公司 背光模组及液晶显示器
US20140133174A1 (en) * 2012-11-09 2014-05-15 Apple Inc. Displays and Display Chassis Structures
CN106980209A (zh) * 2017-06-02 2017-07-25 厦门天马微电子有限公司 液晶显示装置
KR20180079044A (ko) * 2016-12-30 2018-07-10 엘지디스플레이 주식회사 표시장치
CN108535903A (zh) * 2018-04-25 2018-09-14 京东方科技集团股份有限公司 一种显示模组及显示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101932105B1 (ko) * 2011-11-08 2019-03-20 엘지디스플레이 주식회사 액정 표시 패널 및 이를 포함하는 액정 표시 장치
CN106773295A (zh) * 2016-12-21 2017-05-31 武汉华星光电技术有限公司 一种背光模组

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090067112A1 (en) * 2007-09-12 2009-03-12 Epson Imaging Devices Corporation Electro-optical device and electronic apparatus
CN101866069A (zh) * 2009-04-17 2010-10-20 群康科技(深圳)有限公司 显示装置
CN102620195A (zh) * 2012-03-13 2012-08-01 深圳市华星光电技术有限公司 背光模组及液晶显示器
US20140133174A1 (en) * 2012-11-09 2014-05-15 Apple Inc. Displays and Display Chassis Structures
KR20180079044A (ko) * 2016-12-30 2018-07-10 엘지디스플레이 주식회사 표시장치
CN106980209A (zh) * 2017-06-02 2017-07-25 厦门天马微电子有限公司 液晶显示装置
CN108535903A (zh) * 2018-04-25 2018-09-14 京东方科技集团股份有限公司 一种显示模组及显示装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113179623A (zh) * 2021-04-06 2021-07-27 武汉华星光电半导体显示技术有限公司 显示模组
CN113284419A (zh) * 2021-05-24 2021-08-20 合肥鑫晟光电科技有限公司 一种显示面板、显示设备及车载显示设备
CN113284419B (zh) * 2021-05-24 2022-11-29 合肥鑫晟光电科技有限公司 一种显示面板、显示设备及车载显示设备
CN113593409A (zh) * 2021-07-09 2021-11-02 武汉华星光电半导体显示技术有限公司 显示模组及显示装置
CN113593409B (zh) * 2021-07-09 2022-09-09 武汉华星光电半导体显示技术有限公司 显示模组及显示装置

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