WO2019196726A1 - 支架、输入输出组件和终端 - Google Patents

支架、输入输出组件和终端 Download PDF

Info

Publication number
WO2019196726A1
WO2019196726A1 PCT/CN2019/081325 CN2019081325W WO2019196726A1 WO 2019196726 A1 WO2019196726 A1 WO 2019196726A1 CN 2019081325 W CN2019081325 W CN 2019081325W WO 2019196726 A1 WO2019196726 A1 WO 2019196726A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
input
hole
bracket
module
Prior art date
Application number
PCT/CN2019/081325
Other languages
English (en)
French (fr)
Inventor
贾玉虎
赵斌
许海平
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201820506786.8U external-priority patent/CN208386604U/zh
Priority claimed from CN201820506901.1U external-priority patent/CN208386607U/zh
Priority claimed from CN201820507037.7U external-priority patent/CN208386608U/zh
Priority claimed from CN201810317232.8A external-priority patent/CN108390970B/zh
Priority claimed from CN201820506788.7U external-priority patent/CN208386606U/zh
Priority claimed from CN201810316733.4A external-priority patent/CN108390969B/zh
Priority claimed from CN201810317244.0A external-priority patent/CN108390971B/zh
Priority claimed from CN201820506787.2U external-priority patent/CN208386605U/zh
Priority claimed from CN201820507039.6U external-priority patent/CN208386609U/zh
Priority claimed from CN201810317084.XA external-priority patent/CN108401045A/zh
Priority claimed from CN201810315979.XA external-priority patent/CN108616619B/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP19773330.6A priority Critical patent/EP3609168B1/en
Priority to US16/493,286 priority patent/US11330090B2/en
Publication of WO2019196726A1 publication Critical patent/WO2019196726A1/zh

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1626Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0277Details of the structure or mounting of specific components for a printed circuit board assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10568Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element

Definitions

  • the present application relates to the field of consumer electronics, and more particularly to a stand, an input and output component, and a terminal.
  • the mobile phone can be configured with multiple functional modules, and multiple functional modules often need to cooperate with each other to work normally. However, when the mobile phone is impacted in use, the relative positions of the multiple functional modules are easily changed and cannot be well. to cooperate in work.
  • Embodiments of the present application provide a bracket, an input and output assembly, and a terminal.
  • the bracket of the embodiment of the present application includes a body, the body includes a first surface and a second surface opposite to each other, and the second surface is provided with at least one receiving cavity, and the first surface is open with at least one of the receiving cavity Corresponding at least one through hole, at least one of the receiving cavity is configured to fix the input and output module and expose the input/output module from the second surface, and at least one of the through holes is used for the first The input and output modules are exposed.
  • the input/output component of the embodiment of the present application includes an input and output module and the bracket of the above embodiment, and the input and output module is installed in the receiving cavity of the bracket.
  • the input and output component of the embodiment of the present application includes the bracket of the above embodiment and at least one input/output module corresponding to the receiving cavity, and an outer wall of at least one of the input and output modules is formed with an outer wall a thread, the external thread being combined with the internal thread to mount the input and output module in the corresponding receiving cavity.
  • the terminal of the embodiment of the present application includes a housing and the input and output assembly of the above embodiment, and the input and output assembly is installed in the housing.
  • the input/output component of the embodiment of the present application includes an input and output module and the bracket of the above embodiment, the input and output module includes an infrared imaging module, a visible light imaging module, a laser projector, and a receiver; the infrared imaging mode a set is installed in the first cavity, the visible light imaging module is installed in the second cavity, the laser projection module is installed in the third cavity, and the receiver is installed in the fourth cavity Inside.
  • the input/output component of the embodiment of the present application includes an input and output module and the bracket of the above embodiment, the input and output module includes a laser projection module, a receiver, and an infrared imaging module; the infrared imaging module is installed in the In the first cavity, the receiver is installed in the second cavity, and the laser projection module is installed in the third cavity.
  • the input and output component of the embodiment of the present application includes an input and output module and the bracket of the above embodiment, the input and output module includes a laser projection module, a visible light imaging module, and an infrared imaging module; Installed in the first cavity, the visible light imaging module is mounted in the second cavity, and the laser projection module is mounted in the third cavity.
  • the terminal of the embodiment of the present application includes a housing and the input and output assembly of the above embodiment, and the input and output assembly is installed in the housing.
  • the input/output component of the embodiment of the present application includes the bracket, the input/output module, and the circuit board mounted on the bracket, and the input/output module is installed in the receiving cavity and from the through
  • the flexible circuit board includes a first segment and a second segment, the first segment being coupled to the first surface and electrically coupled to the input and output module, the second segment including a mating combination And a connecting portion, the joint portion is combined with the second surface, the connecting portion is spaced apart from the second surface and is used for electrical connection with an external device.
  • the terminal of the embodiment of the present application includes a main board and the input/output assembly of the above embodiment, and the main board is provided with a mounting port; the bracket is mounted on the mounting port, and the connecting portion is electrically connected to the main board.
  • FIG. 1 is a perspective exploded view of a terminal according to some embodiments of the present application.
  • FIGS 2 and 3 are schematic diagrams of the planar assembly of the input and output assemblies of certain embodiments of the present application.
  • FIGS. 4 and 5 are perspective exploded views of input and output components of certain embodiments of the present application.
  • FIG. 6 is a schematic structural view of a bracket of an input and output assembly according to some embodiments of the present application.
  • FIG. 7 to 10 are partial structural views of a laser projection module of an input/output assembly according to some embodiments of the present application.
  • FIG. 11 is a perspective exploded view of a terminal according to some embodiments of the present application.
  • FIG 12 and 13 are schematic illustrations of the planar assembly of the input and output assemblies of certain embodiments of the present application.
  • 16 is a schematic structural view of a bracket of an input and output assembly according to some embodiments of the present application.
  • 17 is a cross-sectional view of an input and output assembly of certain embodiments of the present application.
  • FIG. 18 is a schematic structural view of a bracket of an input and output assembly according to some embodiments of the present application.
  • FIG. 19 is a perspective exploded view of a terminal according to some embodiments of the present application.
  • 20 and 21 are schematic illustrations of the planar assembly of the input and output assemblies of certain embodiments of the present application.
  • 22 and 23 are perspective exploded views of input and output components of certain embodiments of the present application.
  • FIG. 24 is a partial schematic structural diagram of a terminal according to an embodiment of the present application.
  • FIG. 25 is a perspective exploded view of a terminal according to some embodiments of the present application.
  • 26 and 27 are schematic illustrations of the planar assembly of the input and output assemblies of certain embodiments of the present application.
  • FIG. 30 is a schematic structural view of a bracket of an input and output assembly according to some embodiments of the present application.
  • FIG. 31 is a partial schematic structural diagram of a terminal according to an embodiment of the present application.
  • FIG. 32 is a perspective exploded view of a terminal according to some embodiments of the present application.
  • 33 and 34 are schematic illustrations of the planar assembly of the input and output assemblies of certain embodiments of the present application.
  • 35 and 36 are perspective exploded views of input and output components of certain embodiments of the present application.
  • 37 is a plan assembly view of an input and output assembly of certain embodiments of the present application.
  • 38 is a schematic perspective view showing the flexible circuit board, the receiver, the infrared fill light, the proximity sensor, and the light sensor of the terminal according to the embodiment of the present application.
  • FIG. 39 is a partial schematic structural diagram of a terminal according to an embodiment of the present application.
  • FIG. 40 is a perspective exploded view of a terminal according to some embodiments of the present application.
  • 41 and 42 are schematic illustrations of the planar assembly of the input and output assemblies of certain embodiments of the present application.
  • 43 and 44 are perspective exploded views of input and output components of certain embodiments of the present application.
  • FIG. 45 is a partial schematic structural diagram of a terminal according to an embodiment of the present application.
  • the first feature "on” or “below” the second feature may be the direct contact of the first and second features, or the first and second features are indirectly through the intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.
  • the bracket 32 of the present application includes a body 321 .
  • the body 321 includes a first surface 3211 and a second surface 3212 opposite to each other.
  • the second surface 3212 defines at least one receiving cavity 322 .
  • the first surface 3211 is opened.
  • At least one through hole 323 corresponding to the at least one receiving cavity 322, at least one receiving cavity 322 is used for fixing the input and output module 31, and the input/output module 31 is exposed from the second surface 3212, and at least one through hole 323 is used for
  • the first face 3211 exposes the input and output module 31.
  • the terminal 100 of the embodiment of the present application includes a housing 10 , a main board 20 , and an input and output assembly 30 .
  • the terminal 100 may be a mobile phone, a tablet computer, a laptop computer, a game machine, a head display device, an access control system, a teller machine, etc.
  • the embodiment of the present application is described by taking the terminal 100 as a mobile phone as an example. It can be understood that the specific form of the terminal 100 may be other There are no restrictions here.
  • the housing 10 can serve as a mounting carrier for the main board 20 and the input/output assembly 30.
  • the housing 10 can provide protection against dust, water, and fall of the main board 20 and the input/output assembly 30.
  • Components such as display screens and batteries are installed.
  • the housing 10 includes a front housing 11 and a rear housing 12, and the front housing 11 and the rear housing 12 are coupled to each other and the main board 20 and the input/output assembly 30 are received between the front housing 11 and the rear housing 12, and the front housing 11 and the rear housing 12 are Made of stainless steel, aluminum alloy, plastic and other materials.
  • the main board 20 is fixed in the housing 10.
  • the main board 20 can be fixed to the front case 11 or the rear case 12 by screwing, snapping, or the like.
  • the main board 20 can be connected to the input/output modules 31 (FIG. 3) of the input/output unit 30.
  • the main board 20 can also be connected to the processing chip, the control chip, etc. of the terminal 100.
  • the lines laid on the main board 20 can be used for transmitting electrical signals.
  • the main board 20 is formed with a mounting opening for the input/output assembly 30 to pass through, reducing the space occupied by the main board 20 and the input/output unit 30 when installed in the housing 10.
  • the input and output assembly 30 is mounted in the housing 10 , and the input and output assembly 30 includes an input and output module 31 and a bracket 32 .
  • the input and output module 31 is mounted on the bracket 32 . on.
  • the input/output module 31 can send a signal to the outside world or receive an external signal, or have the function of sending a signal to the outside world and receiving a signal from the outside, wherein the signal can be a light signal, a sound signal, a touch signal, or the like. It can be understood that the specific type of the input/output module 31 and the number of each input/output module 31 may vary according to different functional requirements of the terminal 100.
  • the input/output module 31 includes a laser projection module 311 , an infrared imaging module 313 , a visible light imaging module 312 , and a receiver 314 .
  • the laser projection module 311 can be used to project a laser pattern to a target object outside the terminal 100.
  • the laser can be infrared light
  • the infrared imaging module 313 can be used to receive an infrared signal from the outside to generate an infrared image.
  • the infrared The imaging module 313 can receive the laser pattern reflected by the target object, and the laser projection module 311 and the infrared imaging module 313 are used together to obtain the depth information of the target object.
  • the visible light imaging module 312 can receive visible light signals from the outside to generate a color image, and the visible light imaging module 312, the infrared imaging module 313, and the laser projection module 311 can be used together to obtain a depth image of the target user, and the receiver 314 is driving the signal. Under the action, the sound wave is emitted outward to realize the function of calling.
  • the input/output module 31 can be provided with a connector 33.
  • the connector 33 can be inserted into a specific connector on the main board 20 to connect the input/output module 31 and the main board 20, and the connector 33 is pulled out from the connector.
  • the input and output module 31 can be separated from the main board 20.
  • the bracket 32 is an integrally formed structure, and the bracket 32 includes a body 321 .
  • the bracket 32 is fixed in the housing 10 and is used to mount the input/output module 31.
  • the body 321 includes a first surface 3211, a second surface 3212, and a sidewall 3213.
  • the first surface 3211 is opposite to the second surface 3212.
  • the sidewall 3213 connects the first surface 3211 with the second surface 3212.
  • the sidewall 3213 includes opposite sides. Top side wall 3214 and bottom side wall 3215.
  • the front casing 11 can abut against the first surface 3211, and the rear casing 12 can abut against the second surface 3212 to clamp the bracket 32, avoiding the bracket 32 and the input/output module 31.
  • the bracket 32 Moving along the thickness direction of the terminal 100 (such as the Z direction in FIG. 1), the bracket 32 is mounted corresponding to the position of the mounting opening of the main board 20, and the side wall 3213 of the bracket 32 can be opposed to the inner wall of the mounting opening, so that the bracket 32 is stuck.
  • the bracket 32 and the input/output module 31 can be prevented from moving in the width direction of the terminal 100 (along the Z direction perpendicular to FIG. 1).
  • At least one receiving cavity 322 is defined in the second surface 3212 .
  • the first surface 3211 defines at least one through hole 323 corresponding to the at least one receiving cavity 322 .
  • the receiving cavity 322 is located on the top sidewall 3214 . Between the bottom side wall 3215.
  • At least one receiving cavity 322 is used for fixedly mounting the input/output module 31.
  • the input/output module 31 is mounted on the bracket 32, the input/output module 31 is exposed from the second surface 3212, and the input/output module 31 also passes through the through hole. 323 is exposed from the first side 3211.
  • the exposure means that the input/output module 31 can be seen from the first surface 3211 or the second surface 3212.
  • the input/output module 31 can pass through the through hole 323 of the first surface 3211.
  • the first surface 3211 is exposed, and the input/output module 31 may not pass through the through hole 323, but the input/output module 31 can be seen through the through hole 323.
  • a limiting ring 324 is formed on the bracket 32. Specifically, the opening size of the through hole 323 is smaller than the size of the corresponding receiving cavity 322 to form the limiting ring 324.
  • the receiving cavity 322 is defined by the limiting ring 324 and the inner wall extending around the limiting ring 324. form.
  • the specific shape of the receiving cavity 322 corresponds to the shape of the corresponding input/output module 31.
  • the cavity of the receiving cavity 322 can be slightly larger than the input and output module 31 to facilitate dispensing in the receiving cavity 322, and the cavity of the receiving cavity 322.
  • the body can also be slightly smaller than the input and output module 31 so that the input and output module 31 can be installed in the receiving cavity 322 by an interference fit.
  • the specific number of the receiving chambers 322 may also be equal to the specific number of the input and output modules 31.
  • the receiving cavity 322 includes a first cavity 3221 , a second cavity 3222 , a third cavity 3223 , and a fourth cavity 3224 .
  • the first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth cavity 3224 are sequentially arranged, and the through hole 323 includes a first hole 3231, a second hole 3232, a third hole 3233, and a fourth hole 3234, and the first hole 3231
  • the second hole 3232 corresponds to the second cavity 3222
  • the third hole 3233 corresponds to the third cavity 3223
  • the fourth hole 3234 corresponds to the fourth cavity 3224.
  • the plurality of receiving cavities 322 may be spaced apart from each other, or any two, three, or four or the like receiving cavities 322 may be in communication with each other.
  • the first cavity 3221 can be used to mount the laser projection module 311
  • the second cavity 3222 can be used to mount the visible light imaging module 312
  • the third cavity 3223 can be used to mount the receiver 314, and the fourth cavity 3224 can be used to mount the infrared imaging module 313.
  • the centers of the first cavity 3221, the second cavity 3222, and the fourth cavity 3224 are located on the same straight line L (as shown in FIG.
  • the laser projection module 311 passes through the first hole 3231
  • the visible light imaging module 312 passes through the second hole 3232.
  • the infrared imaging module 313 The light exiting surface of the laser projection module 311, the light incident surface of the visible light imaging module 312, and the light incident surface of the infrared imaging module 313 may be located on the same plane.
  • the center of the third cavity 3223 is located between the straight line L and the bottom side wall 3215, the receiver 314 is installed in the fourth cavity 3224, the receiver 314 may not pass through the fourth hole 3234, and the sound wave emitted by the receiver 314 may pass through the fourth hole 3234. And enter the outside world.
  • the bracket 32 when the bracket 32 is integrally formed, when the plurality of input/output modules 31 are mounted in the receiving cavity 322, the relative positions of the input/output modules 31 are not easily changed, and the plurality of input and output modules are not changed. Group 31 is better able to work together. Specifically, the positions of the plurality of receiving cavities 322 do not change. As long as the input/output modules 31 are fixed in the receiving cavity 322, the relative positions between the input and output modules 31 do not change.
  • the structure of the terminal 100 is simplified, and the installation in the terminal 100 is saved. space.
  • the first surface 3211 is provided with a bracket positioning hole 325 for positioning the mounting position of the bracket 32.
  • the number of the bracket positioning holes 325 may be one or more.
  • the number of the bracket positioning holes 325 is two, and the two bracket positioning holes 325 are opened at diagonally opposite positions of the body 321 .
  • a front housing positioning post 110 may be protruded from the front housing 11 .
  • the front housing positioning post 110 extends into the bracket positioning hole 325 and the bracket.
  • the positioning hole 325 is matched, and the mounting position of the bracket 32 can be quickly positioned by the cooperation of the front housing positioning post 110 and the bracket positioning hole 325, and the bracket 32 is further prevented from shaking in the housing 10.
  • the input/output assembly 30 further includes a flexible circuit board 34.
  • the receiver 314 includes a connecting elastic piece 3141, and the connecting elastic piece 3141 is directed along the first surface 3211. The direction of the two sides 3212 is convex, and the connecting elastic piece 3141 is in contact with the flexible circuit board 34 to electrically connect the receiver 314 and the flexible circuit board 34.
  • one end of the flexible circuit board 34 may be connected to the main board 20, and the flexible circuit board 34 may be formed with a contact 345, and the connecting elastic piece 3141 is in contact with the contact 345 to electrically connect the receiver 314 and the flexible circuit board 34.
  • the connecting elastic piece 3141 can electrically connect the receiver 314 and the main board 20 with any set of contacts 345, so that as long as the sound output of the receiver 314 is Corresponding to the third hole 3233, the receiver 314 can be installed in the third cavity 3223 at a plurality of angles, and both can connect the connecting elastic piece 3141 with the contact 345.
  • the flexible circuit board 34 includes a first segment 341 and a second segment 342.
  • the first segment 341 is in contact with the first surface 3211
  • the second segment 342 is in contact with the second surface 3212.
  • the connecting elastic piece 3141 is in contact with the second length 342.
  • the input and output assembly 30 further includes an infrared fill light 35, a proximity sensor 36, and a light sensor 37.
  • the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are all coupled to the first segment 341.
  • the flexible circuit board 34 further includes a connecting section 343 connecting the first section 341 and the second section 342, and the connecting section 343 can be attached to the top sidewall 3214.
  • the infrared fill light 35 is for emitting infrared light outward
  • the proximity sensor 36 is for detecting the distance of the target object to the terminal 100
  • the light sensor 37 is for detecting the intensity of the ambient light, wherein the proximity sensor 36 and the light sensor 37 can be set.
  • the infrared fill light 35, the proximity sensor 36, the light sensor 37, and the receiver 314 can be connected through a flexible circuit board 34, and the overall structure of the input/output assembly 30 is relatively simple and compact.
  • the bracket 32 further includes a bracket positioning post 326 protruding from the first surface 3211, and the bracket positioning post 326 corresponds to the position of the third cavity 3223.
  • the bracket positioning post 326 is located between the straight line L and the top side wall 3214.
  • the bracket positioning post 326 can be used to position components mounted on the bracket 32, such as the flexible circuit board 34, the infrared fill light 35, the proximity sensor 36, or the light sensor 37 described above to prevent sloshing of the components. More specifically, the bracket positioning post 326 penetrates and fixes the first segment 341 of the flexible circuit board 34. Therefore, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 disposed on the first segment 341 are also fixed.
  • the center of the third cavity 3223 and the bracket positioning post 326 can be respectively located on both sides of the straight line L.
  • the bracket 32 further includes a bracket positioning block 327.
  • the bracket positioning block 327 protrudes from the second surface 3212, and the bracket positioning block 327 is The position of the third cavity 3223 corresponds.
  • the bracket positioning block 327 can be used to position the flexible circuit board 34 mounted on the bracket 32 to prevent the flexible circuit board 34 from swaying. Specifically, the bracket positioning block 327 penetrates and fixes the second section 342 of the flexible circuit board 34.
  • the flexible circuit board 34 is provided with a soft board positioning hole 344 for positioning the flexible circuit board 34 on the bracket 32 . Installation location. Specifically, the soft board positioning hole 344 may be opened on any one or more of the first segment 341, the second segment 342 or the connecting segment 343. In the embodiment shown in FIGS.
  • the soft plate positioning hole 344 At the same time, the first segment 341 and the second segment 342 are opened, and the position of the flexible plate positioning hole 344 can be corresponding to the position of the bracket positioning post 326 and the bracket positioning block 327, and the first position when the flexible circuit board 34 is mounted
  • the segment 341 is engaged with the first surface 3211 and the flexible plate positioning hole 344 is engaged with the bracket positioning post 326, the second segment 342 is engaged with the second surface 3212, and the soft plate positioning hole 344 is engaged with the bracket positioning block 327.
  • the position of the flexible circuit board 34 is less likely to sway.
  • the bracket 32 further includes a fixing protrusion 328 protruding outward from the side wall 3213 , and the fixing protrusion 328 is used for fixing the bracket 32 .
  • the number of the fixing protrusions 328 may be single or plural. When the number of the fixing protrusions 328 is plural, the plurality of fixing protrusions 328 may protrude from opposite sides of the side wall 3213.
  • the fixing protrusion 328 is used for fixing the bracket 32.
  • the fixing protrusion 328 can be directly fixed to the housing 10 by a fastener, or the bracket 32 and the main board 20 can be fixed to the housing 10 by fasteners. .
  • the fixing protrusion 328 is provided with a fixing hole 3282, and the main board 20 and the front housing 11 are provided with mounting holes at positions corresponding to the fixing holes 3282, and can be fastened by fasteners (such as The screw) passes through the fixing hole 3282 and the mounting hole to fix the bracket 32 and the main board 20 to the front case 11.
  • fasteners such as The screw
  • the laser projection module 311 includes a substrate assembly 3111, a lens barrel 3112, a light source 3113, a collimating element 3114, a diffractive optical element (DOE) 3115, and a protective cover 3116. .
  • DOE diffractive optical element
  • the substrate assembly 3111 includes a substrate 31111 and a circuit board 31112.
  • the circuit board 31112 is disposed on the substrate 31111.
  • the circuit board 31112 is used to connect the light source 3113 with the main board 20 of the terminal 100.
  • the circuit board 31112 may be a hard board, a soft board or a soft and hard board.
  • the lens barrel 3112 is fixedly connected to the substrate assembly 3111.
  • the lens barrel 3112 is formed with a receiving cavity 31121.
  • the lens barrel 3112 includes a top wall 31122 and an annular peripheral wall 31124 extending from the top wall 31122.
  • the peripheral wall 31124 is disposed on the substrate assembly 3111.
  • the through hole 31125 is communicated with the accommodating cavity 31121.
  • the peripheral wall 31124 can be connected to the circuit board 31112 by an adhesive.
  • a protective cover 3116 is disposed on the top wall 31122.
  • the protective cover 3116 includes a baffle 31162 having a light-emitting through hole 31160 and an annular side wall 31164 extending from the baffle 31162.
  • the light source 3113 and the collimating element 3114 are both disposed in the accommodating cavity 31121, and the diffractive optical element 3115 is mounted on the lens barrel 3112.
  • the collimating element 3114 and the diffractive optical element 3115 are sequentially disposed on the illuminating light path of the light source 3113.
  • the collimating element 3114 collimates the laser light emitted by the light source 3113, and the laser passes through the collimating element 3114 and then passes through the diffractive optical element 3115 to form a laser pattern.
  • the light source 3113 may be a Vertical Cavity Surface Emitting Laser (VCSEL) or an edge-emitting laser (EEL). In the embodiment shown in FIG. 7, the light source 3113 is an edge emitting laser.
  • the light source 3113 may be a Distributed Feedback Laser (DFB).
  • the light source 3113 is for emitting laser light into the accommodating cavity 31121. Referring to FIG. 8 , the light source 3113 has a columnar shape as a whole, and the light source 3113 forms a light emitting surface 31131 away from one end surface of the substrate assembly 3111. The laser light is emitted from the light emitting surface 31131, and the light emitting surface 31131 faces the collimating element 3114.
  • the light source 3113 is fixed on the substrate assembly 3111.
  • the light source 3113 can be adhered to the substrate assembly 3111 through the sealant 3117.
  • a side of the light source 3113 opposite to the light emitting surface 31131 is bonded to the substrate assembly 3111.
  • the side surface 31132 of the light source 3113 may also be adhered to the substrate assembly 3111.
  • the sealant 3117 may surround the surrounding side surface 31132. Alternatively, only one side of the side surface 31132 may be bonded to the substrate assembly 3111 or adhered. A plurality of faces and substrate assemblies 3111 are bonded.
  • the sealant 3117 may be a thermal conductive adhesive to conduct heat generated by the operation of the light source 3113 to the substrate assembly 3111.
  • the diffractive optical element 3115 is carried on the top wall 31122 and housed in the protective cover 3116.
  • the opposite sides of the diffractive optical element 3115 are respectively in contact with the protective cover 3116 and the top wall 31122.
  • the baffle 31162 includes an abutting surface 31163 adjacent to the light-passing hole 31125, and the diffractive optical element 3115 is in contact with the abutting surface 31163.
  • the diffractive optical element 3115 includes opposite diffractive incident faces 31152 and diffractive exit faces 31154.
  • the diffractive optical element 3115 is carried on the top wall 31122, and the diffraction exit surface 31154 is in contact with the surface of the baffle 31162 near the light-passing hole 31125 (the abutting surface 31163), and the diffractive incident surface 31152 is in contact with the top wall 31122.
  • the light-passing hole 31125 is aligned with the accommodating cavity 31121, and the light-emitting through-hole 31160 is aligned with the light-passing hole 31125.
  • the top wall 31122, the annular side wall 31164, and the baffle 31162 are in contact with the diffractive optical element 3115, thereby preventing the diffractive optical element 3115 from coming off the protective cover 3116 in the light exiting direction.
  • the protective cover 3116 is adhered to the top wall 31122 by glue.
  • the light source 3113 of the laser projection module 311 adopts an edge emitting laser.
  • the temperature of the transmitting laser is smaller than that of the VCSEL array.
  • the edge emitting laser is a single-point light emitting structure, it is not necessary to design an array structure, and the manufacturing is simple.
  • the laser projection module 311 has a lower light source cost.
  • the gain of the power is obtained through the feedback of the grating structure.
  • the side emitting laser is placed vertically, and since the edge emitting laser has a slender strip structure, the emitting laser is prone to accidents such as dropping, shifting, or shaking, so by setting
  • the sealant 3117 is capable of holding the edge emitting laser to prevent accidents such as dropping, displacement or shaking of the emitting laser.
  • the light source 3113 can also be fixed to the substrate assembly 3111 in a fixed manner as shown in FIG.
  • the laser projection module 311 includes a plurality of support blocks 3118.
  • the support block 3118 can be fixed on the substrate assembly 3111.
  • the plurality of support blocks 3118 collectively surround the light source 3113.
  • the light source 3113 can be directly mounted on the plurality of support blocks during installation. Between 3118. In one example, the plurality of support blocks 3118 collectively clamp the light source 3113 to further prevent the light source 3113 from shaking.
  • the protective cover 3116 can be omitted.
  • the diffractive optical element 3115 can be disposed in the accommodating cavity 31121, and the diffraction exit surface 31154 of the diffractive optical element 3115 can be opposed to the top wall 31122, and the laser passes through the diffractive optical element. After 3115, the light passing hole 31125 is further worn out. Thus, the diffractive optical element 3115 is not easily peeled off.
  • the substrate 31111 can be omitted, and the light source 3113 can be directly fixed on the circuit board 31112 to reduce the overall thickness of the laser projection module 311.
  • the input and output assembly 30 is mounted in the housing 10 , and the input and output assembly 30 includes an input and output module 31 and a bracket 32 .
  • the input and output module 31 is mounted on the bracket 32 . on.
  • the input/output module 31 can send a signal to the outside world or receive an external signal, or have the function of sending a signal to the outside world and receiving a signal from the outside, wherein the signal can be a light signal, a sound signal, a touch signal, or the like. It can be understood that the specific type of the input/output module 31 and the number of each input/output module 31 may vary according to different functional requirements of the terminal 100.
  • the input/output module 31 includes a laser projection module 311 , an infrared imaging module 313 , a visible light imaging module 312 , and a receiver 314 .
  • the laser projection module 311 can be used to project a laser pattern to a target object outside the terminal 100.
  • the laser can be infrared light
  • the infrared imaging module 313 can be used to receive an infrared signal from the outside to generate an infrared image.
  • the infrared The imaging module 313 can receive the laser pattern reflected by the target object, and the laser projection module 311 and the infrared imaging module 313 are used together to obtain the depth information of the target object.
  • the visible light imaging module 312 can receive visible light signals from the outside to generate a color image, and the visible light imaging module 312, the infrared imaging module 313, and the laser projection module 311 can be used together to obtain a depth image of the target user, and the receiver 314 is driving the signal. Under the action, the sound wave is emitted outward to realize the function of calling.
  • the input/output module 31 can be provided with a connector 33.
  • the connector 33 can be inserted into a specific connector on the main board 20 to connect the input/output module 31 and the main board 20, and the connector 33 is pulled out from the connector.
  • the input and output module 31 can be separated from the main board 20.
  • the outer wall 310 of at least one of the input and output modules 31 is formed with an external thread.
  • the outer wall 310 of the infrared imaging module 313 in the present embodiment is formed with an external thread.
  • the outer wall 310 of any one, two, three or four of the laser projection module 311, the visible light imaging module 312, the infrared imaging module 313, and the receiver 314 is formed with external threads.
  • the number of input and output modules 31 in the input and output component 30 may also be one, two, three, four, or any number.
  • the bracket 32 is an integrally formed structure, and the bracket 32 includes a body 321 .
  • the bracket 32 is fixed in the housing 10 and is used to mount the input/output module 31.
  • the body 321 includes a first surface 3211, a second surface 3212, and a sidewall 3213.
  • the first surface 3211 is opposite to the second surface 3212.
  • the sidewall 3213 connects the first surface 3211 with the second surface 3212.
  • the sidewall 3213 includes opposite sides. Top side wall 3214 and bottom side wall 3215.
  • the front casing 11 can abut against the first surface 3211, and the rear casing 12 can abut against the second surface 3212 to clamp the bracket 32, avoiding the bracket 32 and the input/output module 31.
  • the bracket 32 Moving along the thickness direction of the terminal 100 (such as the Z direction in FIG. 11), the bracket 32 is mounted corresponding to the position of the mounting opening of the main board 20, and the side wall 3213 of the bracket 32 can be opposed to the inner wall of the mounting opening, so that the bracket 32 is stuck.
  • the bracket 32 and the input/output module 31 can be prevented from moving in the width direction of the terminal 100 (along the Z direction perpendicular to FIG. 11).
  • At least one receiving cavity 322 is defined in the second surface 3212 .
  • the first surface 3211 defines at least one through hole 323 corresponding to the at least one receiving cavity 322 .
  • the receiving cavity 322 is located on the top sidewall 3214 . Between the bottom side wall 3215.
  • the inner wall 3220 of the at least one receiving cavity 322 of the receiving cavity 322 is formed with an internal thread.
  • the inner wall 3220 of the partial receiving cavity 322 may have no internal threads.
  • At least one receiving cavity 322 is used for fixedly mounting the input/output module 31. When the input/output module 31 is mounted on the bracket 32, the input/output module 31 is exposed from the second surface 3212, and the input/output module 31 also passes through the through hole.
  • the exposure means that the input/output module 31 can be seen from the first surface 3211 or the second surface 3212.
  • the input/output module 31 can pass through the through hole 323 of the first surface 3211.
  • the first surface 3211 is exposed, and the input/output module 31 may not pass through the through hole 323, but the input/output module 31 can be seen through the through hole 323.
  • a limiting ring 324 is formed on the bracket 32. Specifically, the opening size of the through hole 323 is smaller than the size of the corresponding receiving cavity 322 to form the limiting ring 324.
  • the receiving cavity 322 is defined by the limiting ring 324 and the inner wall extending around the limiting ring 324. form.
  • the input/output module 31 When the input/output module 31 is mounted in the receiving cavity 322 of the inner wall 3220 without the internal thread, the input/output module 31 can be installed in the receiving cavity 322 along the direction of the second surface 3212 pointing to the first surface 3211, until the input/output module 31 is opposite to the limit ring 324, indicating that the input/output module 31 is mounted in position, and the glue can be dispensed into the receiving cavity 322 at this time. Specifically, the gap between the input/output module 31 and the inner wall of the receiving cavity 322 can be made. After the glue is solidified, the input/output module 31 is fixedly mounted in the receiving cavity 322.
  • the specific shape of the receiving cavity 322 corresponds to the shape of the corresponding input/output module 31.
  • the cavity of the receiving cavity 322 can be slightly larger than the input and output module 31 to facilitate dispensing in the receiving cavity 322, and the cavity of the receiving cavity 322.
  • the body can also be slightly smaller than the input and output module 31 so that the input and output module 31 can be installed in the receiving cavity 322 by an interference fit.
  • the specific number of the receiving chambers 322 may also be equal to the specific number of the input and output modules 31.
  • the number of the receiving cavities 322 in which the inner wall 3220 is formed with internal threads is equal to the number of the input and output modules 31 in which the outer wall 310 is formed with external threads.
  • the receiving cavity 322 includes a first cavity 3221 , a second cavity 3222 , a third cavity 3223 , and a fourth cavity 3224 .
  • the first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth cavity 3224 are sequentially arranged, and the through hole 323 includes a first hole 3231, a second hole 3232, a third hole 3233, and a fourth hole 3234, and the first hole 3231
  • the second hole 3232 corresponds to the second cavity 3222
  • the third hole 3233 corresponds to the third cavity 3223
  • the fourth hole 3234 corresponds to the fourth cavity 3224.
  • the plurality of receiving cavities 322 may be spaced apart from each other, or any two, three, or four or the like receiving cavities 322 may be in communication with each other.
  • the first cavity 3221 can be used to mount the laser projection module 311, the second cavity 3222 can be used to mount the visible light imaging module 312, the third cavity 3223 can be used to mount the receiver 314, and the fourth cavity 3224 can be used to mount the infrared imaging module 313.
  • the first cavity 3221, the second cavity 3222, and the inner wall 3220 of the third cavity 3223 are not internally threaded, and the laser projection module 311 is adhered in the first cavity 3221 by glue, and the visible light imaging module 312 is bonded by glue.
  • the receiver 314 is glued in the third cavity 3223; the inner wall 3220 of the fourth cavity 3224 is formed with internal threads, the external thread of the outer wall 310 of the infrared imaging module 313 and the inner wall of the fourth cavity 3224.
  • the internal thread of 3220 is screwed (combined) to mount infrared imaging module 313 within fourth cavity 3224 (see Figure 17).
  • the centers of the first cavity 3221, the second cavity 3222, and the fourth cavity 3224 are located on the same straight line L (as shown in FIG.
  • the laser projection module 311 passes through the first hole 3231
  • the visible light imaging module 312 passes through the second hole 3232.
  • the infrared imaging module 312 The light exiting surface of the laser projection module 311, the light incident surface of the visible light imaging module 312, and the light incident surface of the infrared imaging module 313 may be located on the same plane.
  • the center of the third cavity 3223 is located between the straight line L and the bottom side wall 3215, the receiver 314 is installed in the fourth cavity 3224, the receiver 314 may not pass through the fourth hole 3234, and the sound wave emitted by the receiver 314 may pass through the fourth hole 3234. And enter the outside world.
  • the bracket 32 when the bracket 32 is integrally formed, when the plurality of input/output modules 31 are mounted in the receiving cavity 322, the relative positions of the input/output modules 31 are not easily changed, and the plurality of input and output modules are not changed. Group 31 is better able to work together. Specifically, the positions of the plurality of receiving cavities 322 do not change. As long as the input/output modules 31 are fixed in the receiving cavity 322, the relative positions between the input and output modules 31 do not change.
  • the structure of the terminal 100 is simplified, and the installation in the terminal 100 is saved. space.
  • the inner wall 3220 of the at least one receiving cavity 322 of the receiving cavity 322 is formed with an internal thread for facilitating the mounting of the input and output module 31 having the external thread formed on the outer wall 310 into the receiving cavity 322 in which the inner wall 3220 is formed with an internal thread.
  • the input/output assembly 30 is mounted in the housing 10.
  • the input/output assembly 30 includes an input/output module 31 and a bracket 32.
  • the input/output module 31 is mounted on the bracket 32. on.
  • the input/output module 31 can send a signal to the outside world or receive an external signal, or have the function of sending a signal to the outside world and receiving a signal from the outside, wherein the signal can be a light signal, a sound signal, a touch signal, or the like. It can be understood that the specific type of the input/output module 31 and the number of each input/output module 31 may vary according to different functional requirements of the terminal 100.
  • the input/output module 31 includes an infrared imaging module 313, a visible light imaging module 312, a laser projection module 311, and a receiver 314.
  • the infrared imaging module 313 can be configured to receive an infrared light signal from the outside to generate an infrared image.
  • the visible light imaging module 312 can receive visible light signals from the outside to generate a color image.
  • the laser projection module 311 can be used to project a laser pattern to a target object outside the terminal 100, and the laser can be an infrared laser.
  • the receiver 314 emits a sound wave under the action of the driving signal to implement a function such as a call.
  • the infrared imaging module 313 can receive the laser pattern emitted by the laser projection module 311 and reflected by the target object.
  • the laser projection module 311 and the infrared imaging module 313 are used together to obtain the depth information of the target object.
  • the infrared imaging module 313, the visible light imaging module 312, and the laser projection module 311 can be used together to obtain a depth image of the target user.
  • the input/output module 31 can be provided with a connector 33, and the connector 33 can be inserted into the motherboard 20.
  • the input and output module 31 and the main board 20 are electrically and mechanically connected to a specific connector. When the connector 33 is pulled out from the connector, the input/output module 31 can be separated from the main board 20 and disconnected therebetween. Electrical connection.
  • the bracket 32 is an integrally formed structure, and the bracket 32 is used for mounting the input/output module 31.
  • the bracket 32 includes a body 321 .
  • the body 321 includes a first face 3211, a second face 3212, and a sidewall 3213.
  • the first side 3211 and the second side 3212 are opposite each other.
  • the side wall 3213 connects the first surface 3211 and the second surface 3212.
  • the side wall 3213 includes opposite top side walls 3214 and bottom side walls 3215.
  • the bracket 32 is mounted corresponding to the position of the mounting opening of the main board 20, and the side wall 3213 of the bracket 32 can be opposed to the inner wall of the mounting opening, so that the bracket 32 is stuck.
  • the mounting port only the position of the main board 20 needs to be fixed, so that the bracket 32 and the input/output module 31 can be prevented from moving in the width direction of the terminal 100 (in the Y direction in FIG. 19).
  • the second surface 3212 is provided with a receiving cavity 322.
  • the first surface 3211 defines a through hole 323 corresponding to the receiving cavity 322.
  • the receiving cavity 322 is located between the top sidewall 3214 and the bottom sidewall 3215.
  • the receiving cavity 322 is configured to receive the input/output module 31.
  • the specific shape of the receiving cavity 322 corresponds to the shape of the corresponding input/output module 31.
  • the cavity of the receiving cavity 322 can be slightly larger than the input and output module 31 to facilitate dispensing in the receiving cavity 322, and the cavity of the receiving cavity 322 can also be It is slightly smaller than the input/output module 31 so that the input/output module 31 can be installed in the receiving cavity 322 by an interference fit.
  • the number of the receiving chambers 322 can be equal to the number of the input and output modules 31.
  • the input/output module 31 is mounted on the bracket 32, the input/output module 31 is exposed from the through hole 323.
  • the exposure means that the input/output module 31 can be seen from the first surface 3211 or the second surface 3212.
  • the input/output module 31 can pass through the through hole 323 of the first surface 3211.
  • the first surface 3211 is exposed, and the input/output module 31 may not pass through the through hole 323, but the input/output module 31 can be seen through the through hole 323.
  • the receiving cavity 322 includes a first cavity 3221, a second cavity 3222, a third cavity 3223, and a fourth cavity 3224.
  • the first cavity 3221, the second cavity 3222, and the third cavity 3223 are sequentially arranged, and the sequential arrangement may be sequentially arranged along the length direction of the bracket 32, and may be sequentially arranged from left to right, or may be arranged from right to left. .
  • the fourth cavity 3224 is located between the second cavity 3222 and the third cavity 3223. In other embodiments, the fourth cavity 3224 may also be located in the first cavity 3221 and the second cavity 3222.
  • the fourth cavity 3224 is located on the side of the first cavity 3221 opposite to the second cavity 3222; or the fourth cavity 3224 is located on the side of the third cavity 3223 opposite the second cavity 3222.
  • the first cavity 3221 is used to mount the infrared imaging module 313, the second cavity 3222 is used to mount the visible light imaging module 312, the third cavity 3223 is used to mount the laser projection module 311, and the fourth cavity 3224 is used to mount the receiver 314. That is, the infrared imaging module 313, the visible light imaging module 312, the laser projection module 311, and the receiver 314 can be sequentially installed in the first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth cavity 3234.
  • the sidewall 3213 includes a plurality of partition walls 3218. The plurality of receiving cavities 322 may be spaced apart from each other.
  • first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth cavity 3224 are sequentially spaced by the partition wall 3218 (as shown in FIG. 5), or may be any two, or three.
  • the receiving chambers 322 are connected to each other, for example, the first chamber 3221 is in communication with the second chamber 3222, and the second chamber 3222 is spaced apart from the fourth chamber 3224.
  • the through hole 323 includes a first through hole 3231, a second through hole 3232, a third through hole 3233, and a fourth through hole 3234, a first through hole 3231, a second through hole 3232, a third through hole 3233, and a fourth through hole 3234 is respectively connected to the first cavity 3221, the second cavity 3222, the third cavity 3223 and the fourth cavity 3224, that is, the first through hole 3231 communicates with the first cavity 3221, and the second through hole 3232 and the second cavity
  • the third through hole 3233 is in communication with the third cavity 3223
  • the fourth through hole 3234 is in communication with the fourth cavity 3224.
  • the fourth through hole 3234 also corresponds to the sound outlet of the receiver 314.
  • the aperture of the fourth through hole 3234 can be smaller than the aperture of the sound outlet of the receiver 314.
  • the receiver 314 can not pass through the fourth through hole 3234, and the sound wave emitted by the receiver 314 can pass through the fourth through hole 3234 and enter the outside.
  • the centers of the first through holes 3231, the second through holes 3232, and the third through holes 3233 are located on the same straight line L, and the fourth through holes 3234 are located between the straight line L and the bottom side wall 3215 (as shown in FIG. 20).
  • the projection module 311 passes through the third through hole 3233, and the optical axes of the three are located in the same plane, which is easy for the three to work together.
  • the top surface of the through-hole 323 of the infrared imaging module 313, the visible light imaging module 312, and the laser projection module 311 is also flush, specifically, the light-input surface of the infrared imaging module 313 and the visible light imaging module 312
  • the light surface and the light exit surface of the laser projection module 311 may be located on the same plane.
  • the mobile phone is configured with multiple functional modules, and multiple functional modules often require multiple brackets to fix the functional modules one by one on the mobile phone, resulting in a large space occupied by multiple brackets, Conducive to the thin and light of mobile phones.
  • the plurality of input/output modules 31 can be mounted on the same bracket 32 and housed in the receiving cavity 322, so that the installation space inside the terminal 100 is saved. This facilitates the thinning of the terminal 100.
  • the input/output modules 31 mounted on the same bracket 32 do not change the relative positions of the plurality of input/output modules 31 due to the movement of the bracket 32, so that the plurality of input and output modules 31 can be better. to cooperate in work.
  • the top sidewall 3214 is formed with a notch 3216
  • the first surface 3211 is formed with a recess 3217 that communicates with the notch 3216
  • the input and output assembly 30 also includes an infrared fill light 35, a proximity sensor 36, and a light sensor 37.
  • the infrared fill light 35 is for emitting infrared light outward
  • the proximity sensor 36 is for detecting the distance of the target object to the terminal 100
  • the light sensor 37 is for detecting the intensity of the ambient light, wherein the proximity sensor 36 and the light sensor 37 can be set.
  • the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are mounted in the recess 3217. In the embodiment of the present application, the position where the recess 3217 is formed corresponds to the position of the fourth cavity 3224.
  • the input and output assembly 30 further includes a flexible circuit board 34.
  • the receiver 314 includes a connecting elastic piece 3141.
  • the connecting elastic piece 3141 is convex along the first surface 3211 and directed to the second surface 3212.
  • the connecting elastic piece 3141 is in contact with the flexible circuit board 34 to electrically connect the receiver 314 and the flexible circuit board 34.
  • one end of the flexible circuit board 34 may be connected to the main board 20, and the flexible circuit board 34 may be formed with a contact 345, and the connecting elastic piece 3141 is in contact with the contact 345 to electrically connect the receiver 314 and the flexible circuit board 34.
  • the connecting elastic piece 3141 can electrically connect the receiver 314 and the main board 20 with any set of contacts 345, so that as long as the sound output of the receiver 314 is
  • the second through holes 3232 are opposite to each other, and the receiver 314 can be installed in the second cavity 3222 at a plurality of angles, and both can connect the connecting elastic pieces 3141 to the contacts 345.
  • the flexible circuit board 34 includes a first segment 341 and a second segment 342.
  • the first section 341 is in contact with the first surface 3211 (the first section 341 is attached to the bottom of the recess 3217 when the recess 3217 is opened on the first surface 3211), and the second section 342 is attached to the second surface 3212.
  • the connecting elastic piece 3141 is in contact with the second length 342.
  • the input and output assembly 30 further includes an infrared fill light 35, a proximity sensor 36, and a light sensor 37. The infrared fill light 35, the proximity sensor 36, and the light sensor 37 are all mounted on the first segment 341.
  • the flexible circuit board 34 further includes a connecting section 343 connecting the first section 341 and the second section 342, and the connecting section 343 passes through the notch 3216.
  • the first segment 341 is received within the recess 3217, and the second segment 342 extends from the connecting segment 343 along the top sidewall 3142 toward the bottom sidewall 3145.
  • the infrared fill light 35, the proximity sensor 36, the light sensor 37, and the receiver 314 can be connected through a flexible circuit board 34, and the overall structure of the input/output assembly 30 is relatively simple and compact.
  • the bracket 32 further includes a bracket positioning post 326 that projects from the bottom of the recess 3217.
  • the bracket positioning post 326 is located between the straight line L and the top side wall 3214.
  • the bracket positioning post 326 can be used to position components mounted on the bracket 32, such as the flexible circuit board 34, the infrared fill light 35, the proximity sensor 36, or the light sensor 37 described above to prevent sloshing of the components.
  • the bracket positioning post 326 penetrates and fixes the first segment 341 of the flexible circuit board 34. Therefore, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 disposed on the first segment 341 are also fixed.
  • the center of the fourth cavity 3224 and the bracket positioning post 326 may be respectively located on both sides of the straight line L.
  • the number of the bracket positioning posts 326 may be plural, and the plurality of bracket positioning posts 326 are respectively disposed at the periphery of the infrared fill light 35, the proximity sensor 36, and the photo sensor 37, thereby further fixing the components.
  • the bracket 32 further includes a bracket positioning block 327 corresponding to the position of the second cavity 3222.
  • the bracket positioning block 327 is convex from the second surface 3212. Out.
  • the bracket positioning block 327 can be used to position the flexible circuit board 34 mounted on the bracket 32 to prevent the flexible circuit board 34 from swaying.
  • the bracket positioning block 327 penetrates and fixes the second section 342 of the flexible circuit board 34.
  • the flexible circuit board 34 is provided with a flexible board positioning hole 344 for positioning the flexible circuit board 34 on the bracket 32.
  • the flexible board positioning hole 344 may be opened on any one or more of the first segment 341, the second segment 342 or the connecting segment 343. In the embodiment shown in FIGS.
  • the flexible plate positioning hole 344 At the same time, the first segment 341 and the second segment 342 are opened, and the position of the flexible plate positioning hole 344 can be corresponding to the position of the bracket positioning post 326 and the bracket positioning block 327, and the first position when the flexible circuit board 34 is mounted
  • the segment 341 is in contact with the first surface 3211 (the first segment 341 is attached to the bottom of the recess 3217 when the recess 3217 is opened on the first surface 3211) and the soft plate positioning hole 344 is engaged with the bracket positioning post 326.
  • the two segments 342 are attached to the second surface 3212 and the flexible plate positioning holes 344 are engaged with the bracket positioning block 327.
  • the position of the flexible circuit board 34 is less likely to sway.
  • the terminal 100 further includes a cover 40 , and the cover 40 and the input and output modules 31 are respectively located on opposite sides of the front case 11 .
  • the front shell 11 is provided with a first through hole 111, a second through hole 112, a third through hole 113, and a fourth through hole 114.
  • the first through hole 111 corresponds to the infrared imaging module 313, the second through hole 112 corresponds to the visible light imaging module 312, the third through hole 113 corresponds to the laser projection module 311, and the fourth through hole 114 corresponds to the receiver 314.
  • the cover plate 40 is formed with an infrared transmitting ink 50 at a position corresponding to the first through hole 111 and the third through hole 113, and the cover plate 40 defines an sound emitting hole 41 corresponding to the fourth through hole 114.
  • the cover 40 may be light transmissive, and the material of the cover 40 may be light transmissive glass, resin, plastic, or the like.
  • the cover plate 40 covers the first through hole 111, the second through hole 112, the third through hole 113, and the fourth through hole 114.
  • the external light passes through the cover 40 and enters the infrared imaging module 313 through the first through hole 111.
  • the sound wave emitted by the receiver 314 passes through the fourth through hole 114 and then passes through the sound hole 41.
  • the laser light emitted by the laser projection module 311 passes through the third through hole 113 and passes through the cover 40.
  • the external light passes through the cover 40 and passes through the second through hole 112 to enter the visible light imaging module 312.
  • the cover plate 40 is formed with an infrared ray transmitting ink 50 at a position corresponding to the first through hole 111 and the third through hole 113.
  • the infrared transmission ink 50 has a high transmittance to infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user is difficult to use in normal use.
  • the area of the terminal 100 covered by the infrared ray transmitting ink 50 is seen.
  • the input and output assembly 30 is mounted in the housing 10.
  • the input and output assembly 30 includes an input and output module 31 and a bracket 32.
  • the input and output module 31 is mounted on the bracket. 32.
  • the input/output module 31 can send a signal to the outside world or receive an external signal, or have the function of sending a signal to the outside world and receiving a signal from the outside, wherein the signal can be a light signal, a sound signal, a touch signal, or the like. It can be understood that the specific type of the input/output module 31 and the number of each input/output module 31 may vary according to different functional requirements of the terminal 100.
  • the input/output module 31 includes an infrared imaging module 313, a laser projection module 311, a visible light imaging module 312, and a receiver 314.
  • the laser projection module 311 can be used to project a laser pattern to a target object outside the terminal 100.
  • the laser can be an infrared laser.
  • the infrared imaging module 313 can be used to receive an infrared signal from the outside to generate an infrared image. In one example, the infrared The imaging module 313 can receive the laser pattern emitted by the laser projection module 311 and reflected by the target object.
  • the laser projection module 311 and the infrared imaging module 313 are used together to obtain the depth information of the target object.
  • the visible light imaging module 312 can receive the visible light signal of the outside to generate a color image, and the infrared imaging module 313, the laser projection module 311 and the visible light imaging module 312 can be used together to obtain the depth image of the target user, and the input and output module 31
  • a connector 33 can be provided.
  • the connector 33 can be inserted into a specific connector on the main board 20 to electrically and mechanically connect the input/output module 31 and the main board 20.
  • the connector 33 can be pulled out from the connector.
  • the input and output module 31 is separated from the main board 20 and disconnects the electrical connection therebetween.
  • the receiver 314 emits sound waves outwardly under the action of the drive signal to implement a function such as a call.
  • the bracket 32 is an integrally formed structure, and the bracket 32 is used to mount the input/output module 31.
  • the bracket 32 includes a body 321 .
  • the body 321 includes a first face 3211, a second face 3212, and a sidewall 3213.
  • the first side 3211 and the second side 3212 are opposite each other.
  • the side wall 3213 connects the first surface 3211 and the second surface 3212.
  • the side wall 3213 includes opposite top side walls 3214 and bottom side walls 3215.
  • the bracket 32 is mounted corresponding to the position of the mounting opening of the main board 20, and the side wall 3213 of the bracket 32 can be opposed to the inner wall of the mounting opening, so that the bracket 32 is stuck.
  • the mounting port only the position of the main board 20 needs to be fixed, so that the bracket 32 and the input/output module 31 can be prevented from moving in the width direction of the terminal 100 (in the Y direction in FIG. 25).
  • the second surface 3212 is provided with a receiving cavity 322.
  • the first surface 3211 defines a through hole 323 corresponding to the receiving cavity 322.
  • the receiving cavity 322 is located between the top sidewall 3214 and the bottom sidewall 3215.
  • the receiving cavity 322 is configured to receive the input/output module 31.
  • the specific shape of the receiving cavity 322 corresponds to the shape of the corresponding input/output module 31.
  • the cavity of the receiving cavity 322 can be slightly larger than the input and output module 31 to facilitate dispensing in the receiving cavity 322, and the cavity of the receiving cavity 322 can also be It is slightly smaller than the input/output module 31 so that the input/output module 31 can be installed in the receiving cavity 322 by an interference fit.
  • the specific number of the receiving chambers 322 may also be equal to the specific number of the input and output modules 31.
  • the input/output module 31 is mounted on the bracket 32, the input/output module 31 is exposed from the through hole 323.
  • the exposure means that the input/output module 31 can be seen from the first surface 3211 or the second surface 3212.
  • the input/output module 31 can pass through the through hole 323 of the first surface 3211.
  • the first surface 3211 is exposed, and the input/output module 31 may not pass through the through hole 323, but the input/output module 31 can be seen through the through hole 323.
  • the receiving cavity 322 includes a first cavity 3221, a second cavity 3222, a third cavity 3223, and a fourth cavity 3224 which are sequentially arranged.
  • the first cavity 3221 is used to mount the infrared imaging module 313, the second cavity 3222 is used to mount the receiver 314, the third cavity 3223 is used to mount the laser projection module 311, and the fourth cavity 3224 is used to mount the visible light imaging module 312. That is, the infrared imaging module 313, the receiver 314, the laser projection module 311, and the visible light imaging module 312 can be sequentially installed in the first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth cavity 3224. .
  • the first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth cavity 3224 are sequentially arranged.
  • the first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth cavity 3224 are arranged from left to right, and can also be understood as a first cavity 3221 and a second cavity.
  • 3222, the third cavity 3223 and the fourth cavity 3224 are arranged in order from right to left.
  • the fourth cavity 3224, the first cavity 3221, the second cavity 3222, and the third cavity 3223 are sequentially arranged.
  • the sidewall 3213 includes a plurality of partition walls 3218.
  • the plurality of receiving cavities 322 may be spaced apart from each other.
  • first cavity 3221, the second cavity 3222, the third cavity 3223, and the fourth cavity 3224 are sequentially spaced by the partition wall 3218 (as shown in FIG. 30), or may be any two, or three.
  • the receiving chambers 322 are connected to each other.
  • the first chamber 3221 is in communication with the second chamber 3222, and the second chamber 3222 is spaced apart from the third chamber 3223.
  • the through hole 323 includes a first through hole 3231, a second through hole 3232, a third through hole 3233, and a fourth through hole 3234, a first through hole 3231, a second through hole 3232, a third through hole 3233, and a fourth through hole 3234 is respectively connected to the first cavity 3221, the second cavity 3222, the third cavity 3223 and the fourth cavity 3224, that is, the first through hole 3231 communicates with the first cavity 3221, and the second through hole 3232 and the second cavity
  • the third through hole 3233 is in communication with the third cavity 3223
  • the fourth through hole 3234 is in communication with the fourth cavity 3224.
  • the second through hole 3232 also corresponds to the sound outlet of the receiver 314.
  • the aperture of the second through hole 3232 can be smaller than the aperture of the sound outlet of the receiver 314.
  • the receiver 314 can not pass through the second through hole 3232, and the sound wave emitted by the receiver 314 can pass through the second through hole 3232 and enter the outside.
  • the centers of the first through holes 3231, the third through holes 3233, and the fourth through holes 3234 are located on the same straight line L, and the second through holes 3232 are located between the straight line L and the bottom side wall 3215 (as shown in FIG. 26).
  • the infrared imaging module 313 passes through the first through hole 3231, and the laser projection module 311 passes through the third through hole 3233, and the visible light is visible.
  • the imaging module 312 passes through the fourth through hole 3234, and the optical axes of the three are located in the same plane, which is easy for the three to work together.
  • the top surface of the through-hole 323 of the infrared imaging module 313, the laser projection module 311, and the visible light imaging module 312 is also flush, specifically, the light-incident surface of the infrared imaging module 313 and the light output of the laser projection module 311
  • the light incident surfaces of the surface and visible light imaging module 312 may be located on the same plane.
  • the mobile phone is configured with multiple functional modules, and multiple functional modules often require multiple brackets to fix the functional modules one by one on the mobile phone, resulting in a large space occupied by multiple brackets, Conducive to the thin and light of mobile phones.
  • the plurality of input/output modules 31 can be mounted on the same bracket 32 and housed in the receiving cavity 322, so that the installation space inside the terminal 100 is saved. This facilitates the thinning of the terminal 100.
  • the input/output modules 31 mounted on the same bracket 32 do not change the relative positions of the plurality of input/output modules 31 due to the movement of the bracket 32, so that the plurality of input and output modules 31 can be better. to cooperate in work.
  • the top sidewall 3214 is formed with a notch 3216
  • the first face 3211 is formed with a recess 3217 that communicates with the notch 3216
  • the input and output assembly 30 also includes an infrared fill light 35, a proximity sensor 36, and a light sensor 37.
  • the infrared fill light 35 is for emitting infrared light outward
  • the proximity sensor 36 is for detecting the distance of the target object to the terminal 100
  • the light sensor 37 is for detecting the intensity of the ambient light, wherein the proximity sensor 36 and the light sensor 37 can be set.
  • the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are mounted in the recess 3217.
  • the input/output assembly 30 further includes a flexible circuit board 34.
  • the receiver 314 includes a connecting elastic piece 3141.
  • the connecting elastic piece 3141 is convex along the first surface 3211 and directed to the second surface 3212.
  • the connecting elastic piece 3141 is in contact with the flexible circuit board 34 to electrically connect the receiver 314 and the flexible circuit board 34.
  • one end of the flexible circuit board 34 may be connected to the main board 20, and the flexible circuit board 34 may be formed with a contact 345, and the connecting elastic piece 3141 is in contact with the contact 345 to electrically connect the receiver 314 and the flexible circuit board 34.
  • the connecting elastic piece 3141 can electrically connect the receiver 314 and the main board 20 with any set of contacts 345, so that as long as the sound output of the receiver 314 is
  • the second through holes 3232 are opposite to each other, and the receiver 314 can be installed in the second cavity 3222 at a plurality of angles, and both can connect the connecting elastic pieces 3141 to the contacts 345.
  • the flexible circuit board 34 includes a first segment 341 and a second segment 342.
  • the first section 341 is in contact with the first surface 3211 (the first section 341 is attached to the bottom of the recess 3217 when the recess 3217 is opened on the first surface 3211), and the second section 342 is attached to the second surface 3212.
  • the connecting elastic piece 3141 is in contact with the second length 342.
  • the input and output assembly 30 further includes an infrared fill light 35, a proximity sensor 36, and a light sensor 37. The infrared fill light 35, the proximity sensor 36, and the light sensor 37 are all mounted on the first segment 341.
  • the flexible circuit board 34 further includes a connecting section 343 connecting the first section 341 and the second section 342, and the connecting section 343 passes through the notch 3216.
  • the first segment 341 is received within the recess 3217, and the second segment 342 extends from the connecting segment 343 along the top sidewall 3142 toward the bottom sidewall 3145.
  • the infrared fill light 35, the proximity sensor 36, the light sensor 37, and the receiver 314 can be connected through a flexible circuit board 34, and the overall structure of the input/output assembly 30 is relatively simple and compact.
  • the bracket 32 further includes a bracket positioning post 326 that projects from the bottom of the recess 3217.
  • the bracket positioning post 326 is located between the straight line L and the top side wall 3214.
  • the bracket positioning post 326 can be used to position components mounted on the bracket 32, such as the flexible circuit board 34, the infrared fill light 35, the proximity sensor 36, or the light sensor 37 described above to prevent sloshing of the components. More specifically, the bracket positioning post 326 penetrates and fixes the first segment 341 of the flexible circuit board 34. Therefore, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 disposed on the first segment 341 are also fixed.
  • the center of the second cavity 3222 and the bracket positioning post 326 can be respectively located on both sides of the straight line L.
  • the number of the bracket positioning posts 326 may be plural, and the plurality of bracket positioning posts 326 are respectively disposed at the periphery of the infrared fill light 35, the proximity sensor 36, and the photo sensor 37, thereby further fixing the components.
  • the bracket 32 further includes a bracket positioning block 327 corresponding to the position of the second surface 3212.
  • the bracket positioning block 327 is convex from the second surface 3212. Out.
  • the bracket positioning block 327 can be used to position the flexible circuit board 34 mounted on the bracket 32 to prevent the flexible circuit board 34 from swaying.
  • the bracket positioning block 327 penetrates and fixes the second section 342 of the flexible circuit board 34.
  • the flexible circuit board 34 is provided with a flexible board positioning hole 344 for positioning the flexible circuit board 34 on the bracket 32.
  • the flexible board positioning hole 344 may be opened on any one or more of the first segment 341, the second segment 342 or the connecting segment 343. In the embodiment shown in FIGS.
  • the flexible plate positioning hole 344 At the same time, the first segment 341 and the second segment 342 are opened, and the position of the flexible plate positioning hole 344 can be corresponding to the position of the bracket positioning post 326 and the bracket positioning block 327, and the first position when the flexible circuit board 34 is mounted
  • the segment 341 is in contact with the first surface 3211 (the first segment 341 is attached to the bottom of the recess 3217 when the recess 3217 is opened on the first surface 3211) and the soft plate positioning hole 344 is engaged with the bracket positioning post 326.
  • the two segments 342 are attached to the second surface 3212 and the flexible plate positioning holes 344 are engaged with the bracket positioning block 327.
  • the position of the flexible circuit board 34 is less likely to sway.
  • the terminal 100 further includes a cover 40 , and the cover 40 and the input and output modules 31 are respectively located on opposite sides of the front case 11 .
  • the front shell 11 is provided with a first through hole 111, a second through hole 112, a third through hole 113, and a fourth through hole 114.
  • the first through hole 111 corresponds to the infrared imaging module 313
  • the second through hole 112 corresponds to the receiver 314
  • the third through hole 113 corresponds to the laser projection module 311
  • the fourth through hole 114 corresponds to the visible light imaging module 312 .
  • the cover plate 40 is formed with an infrared transmitting ink 50 at a position corresponding to the first through hole 111 and the third through hole 113, and the cover plate 40 defines an sound emitting hole 41 corresponding to the second through hole 112.
  • the cover 40 may be light transmissive, and the material of the cover 40 may be light transmissive glass, resin, plastic, or the like.
  • the cover plate 40 covers the first through hole 111, the second through hole 112, the third through hole 113, and the fourth through hole 114.
  • the external light passes through the cover 40 and enters the infrared imaging module 313 through the first through hole 111.
  • the sound wave emitted by the receiver 314 passes through the second through hole 112 and then passes through the sound hole 41.
  • the laser light emitted by the laser projection module 311 passes through the third through hole 113 and passes through the cover 40.
  • the external light passes through the cover 40 and passes through the fourth through hole 114 to enter the visible light imaging module 312.
  • the cover plate 40 is formed with an infrared ray transmitting ink 50 at a position corresponding to the first through hole 111 and the third through hole 113.
  • the infrared transmission ink 50 has a high transmittance to infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user is difficult to use in normal use.
  • the area of the terminal 100 covered by the infrared ray transmitting ink 50 is seen.
  • the input/output assembly 30 is mounted in the housing 10.
  • the input/output assembly 30 includes an input/output module 31 and a bracket 32.
  • the input/output module 31 is mounted on the bracket 32. on.
  • the input/output module 31 can send a signal to the outside world or receive an external signal, or have a function of emitting a signal to the outside world and receiving a signal from the outside, wherein the signal can be a light signal, a sound signal, a touch signal, or the like. It can be understood that the specific type of the input/output module 31 and the number of each input/output module 31 may vary according to different functional requirements of the terminal 100.
  • the input and output module 31 includes an infrared imaging module 313, a visible light imaging module 312, and a laser projection module 311.
  • the laser projection module 311 can be used to project a laser pattern to a target object outside the terminal 100.
  • the laser can be an infrared laser.
  • the infrared imaging module 313 can be used to receive an infrared signal from the outside to generate an infrared image.
  • the infrared The imaging module 313 can receive the laser pattern emitted by the laser projection module 311 and reflected by the target object.
  • the laser projection module 311 and the infrared imaging module 313 are used together to obtain the depth information of the target object.
  • the visible light imaging module 312 can receive the visible light signal from the outside to generate a color image.
  • the infrared imaging module 313, the visible light imaging module 312, and the laser projection module 311 can also be used to obtain the depth image of the target user.
  • the input and output module 31 can be used.
  • the connector 33 can be disposed on the motherboard, and the connector 33 can be electrically and mechanically connected to the input and output module 31 and the motherboard 20, and the connector 33 can be pulled out from the connector.
  • the input/output module 31 is separated from the main board 20 and the electrical connection therebetween is disconnected.
  • the bracket 32 is an integrally formed structure, and the bracket 32 is used to mount the input/output module 31.
  • the bracket 32 includes a body 321 .
  • the body 321 includes a first face 3211, a second face 3212, and a sidewall 3213.
  • the first side 3211 and the second side 3212 are opposite each other.
  • the side wall 3213 connects the first surface 3211 and the second surface 3212.
  • the side wall 3213 includes opposite top side walls 3214 and bottom side walls 3215.
  • the bracket 32 is mounted corresponding to the position of the mounting opening of the main board 20, and the side wall 3213 of the bracket 32 can be opposed to the inner wall of the mounting opening, so that the bracket 32 is stuck.
  • the mounting port only the position of the main board 20 needs to be fixed, so that the bracket 32 and the input/output module 31 can be prevented from moving in the width direction of the terminal 100 (in the Y direction in FIG. 32).
  • the second surface 3212 defines a receiving cavity 322.
  • the receiving cavity 322 is located between the top sidewall 3214 and the bottom sidewall 3215.
  • the first surface 3211 defines a through hole 323 corresponding to the receiving cavity 322.
  • the receiving cavity 322 is configured to receive the input/output module 31.
  • the specific shape of the receiving cavity 322 corresponds to the shape of the corresponding input/output module 31.
  • the cavity of the receiving cavity 322 can be slightly larger than the input and output module 31 to facilitate dispensing in the receiving cavity 322, and the cavity of the receiving cavity 322 can also be It is slightly smaller than the input/output module 31 so that the input/output module 31 can be installed in the receiving cavity 322 by an interference fit.
  • the specific number of the receiving chambers 322 may also be equal to the specific number of the input and output modules 31.
  • the input/output module 31 is mounted on the bracket 32, the input/output module 31 is exposed from the through hole 323.
  • the receiving cavity 322 includes a first cavity 3221, a second cavity 3222, and a third cavity 3223 which are sequentially arranged.
  • the first cavity 3221, the second cavity 3222, and the third cavity 3223 are arranged in order from left to right, and can also be understood as a first cavity 3221, a second cavity 3222, and a third cavity. 3223 is arranged from right to left.
  • the first cavity 3221 is used to mount the infrared imaging module 313, the second cavity 3222 is used to mount the visible light imaging module 312, and the third cavity 3223 is used to mount the laser projection module 311. That is to say, the infrared imaging module 313, the visible light imaging module 312, and the laser projection module 311 can be sequentially mounted in the first cavity 3221, the second cavity 3222, and the third cavity 3223.
  • the plurality of receiving cavities 322 may be spaced apart from each other.
  • the first cavity 3221, the second cavity 3222, and the third cavity 3223 may be sequentially spaced by the spacing cavity 329 (as shown in FIG. 34), or may be any two or three receiving cavities.
  • the 322 is in communication with each other, for example, the first cavity 3221 is in communication with the second cavity 3222, and the second cavity 3222 is spaced apart from the third cavity 3223.
  • the through hole 323 includes a first through hole 3231, a second through hole 3232, and a third through hole 3233, and the first through hole 3231, the second through hole 3232, and the third through hole 3233 are respectively connected to the first cavity 3221 and the second cavity 3222
  • the first through hole 3231 is in communication with the first cavity 3221
  • the second through hole 3232 is in communication with the second cavity 3222
  • the third through hole 3233 is in communication with the third cavity 3223.
  • the centers of the first through hole 3231, the second through hole 3232, and the third through hole 3233 are located on the same straight line L (as shown in FIG. 33).
  • the infrared imaging module 313 is exposed from the first through hole 3231, and the visible light imaging module 312 is exposed from the second through hole 3232.
  • the group 311 is exposed from the third through hole 3233, and the optical axes of the three are located in the same plane, so that it is easy for the three to work together.
  • the top surface of the infrared imaging module 313, the laser projection module 311 and the visible light imaging module 312 are flush, specifically, the light incident surface of the infrared imaging module 313, the light emitting surface of the laser projection module 311, and the visible light imaging module 312.
  • the illuminating surfaces can be on the same plane.
  • the exposure means that the input/output module 31 can be seen from the first surface 3211 or the second surface 3212.
  • the input/output module 31 can pass through the through hole 323 of the first surface 3211 and The input/output module 31 may not pass through the through hole 323 when exposed from the first surface 3211, but the input/output module 31 may be seen through the through hole 323.
  • the terminal usually projects the structured light to the target object by using the laser projection module, and then uses the image acquisition device (such as an infrared camera) to collect the laser modulated by the target object to obtain the depth image of the target object, so the terminal acquires the target object.
  • the image acquisition device such as an infrared camera
  • the depth image often requires multiple function modules to cooperate with each other. However, when the position of a certain function module is changed, the relative position of the function module and other function modules are changed and the work function is not well matched. For example, the resulting depth image is less accurate.
  • the bracket 32 is integrally formed, the infrared imaging module 313, the visible light imaging module 312, and the laser projection module 311 are mounted on the same bracket 32, and the relative positions of the three are not generated. Change, so that it works well.
  • the plurality of input/output modules 31 are collectively housed in the receiving cavity 322 of the bracket 32, and a plurality of brackets are not provided to fix the plurality of input/output modules 31, thereby saving the installation space inside the terminal 100.
  • the second surface 3212 is provided with a first compartment 3291, and the first compartment 3291 is spaced apart from the first cavity 3221 and the second cavity 3222.
  • the body 321 further includes a plurality of partition walls 3218.
  • the top side wall 3214, the bottom side wall 3215, and the partition wall 3218 together form a spacing chamber 329.
  • the compartment 329 includes a first compartment 3291.
  • the second surface 3212 is provided with a second compartment 3292, and the second compartment 3292 is spaced apart by the second cavity 3222 and the third cavity 3223.
  • the body 321 further includes a plurality of partition walls 3218.
  • the top side wall 3214, the bottom side wall 3215, and the partition wall 3218 together form a spacing chamber 329.
  • the compartment 329 includes a second compartment 3292.
  • the first compartment 3291 and the second compartment 3292 in the above embodiment are provided with a heat dissipating material 320. Since the heat generated during the operation of the input/output module 31 is relatively concentrated, some optical components of the input/output module 31 are likely to cause temperature drift, which affects the accuracy of the input/output module 31. In addition, the input/output module 31 is in a high temperature environment for a long time, and the service life of the input/output module 31 is shortened.
  • the heat dissipating material 320 is disposed in the first compartment 3291 and the second compartment 3292, and can reduce the heat interaction between the two adjacent input and output modules 31 while dissipating heat for the single input/output module 31.
  • the heat dissipating material 320 may be a thermal grease, a thermally conductive metal (such as silver, copper, gold, etc.), or a ceramic material.
  • the heat dissipating material 320 is a thermal grease
  • the heat dissipating material 320 may be laid on the surfaces of the second surface 3212 and the partition wall 3218.
  • the heat dissipating material 320 When the heat dissipating material 320 is a heat conductive metal, the heat dissipating material 320 may be laid on the surface of the second surface 3212 and the partition wall 3218 in a single layer or a plurality of layers, for example, a silver layer and a copper layer are alternately laid. When the heat dissipating material 320 is a ceramic material, the heat dissipating material 320 may fill the entire compartment 329.
  • the bracket 32 defines a first positioning slot 3219 at a sidewall of the first through hole 3231, and the first positioning slot 3219 is configured to define a mounting position of the infrared imaging module 313.
  • the infrared imaging module 313 includes a first protrusion 3131 formed at a periphery of the lens barrel.
  • the position and number of the first positioning grooves 3219 correspond to the positions and numbers of the first protruding portions 3131.
  • the number of the first protrusions 3131 may be one or more. In this embodiment, the number of the first protrusions 3131 is two, and the two first protrusions 3131 are formed on the mirror of the infrared imaging module 313.
  • the number of the first positioning grooves 3219 is also two, and the two first positioning grooves 3219 are respectively opened on the opposite side walls of the first through holes 3231.
  • the bracket 32 defines a second positioning slot 3210 on a sidewall of the second through hole 3232, and the second positioning slot 3210 defines a mounting position of the visible light imaging module 312.
  • the visible light imaging module 312 includes a second protrusion 3121 formed at a periphery of the lens barrel.
  • the position and number of the second positioning grooves 3210 correspond to the positions and numbers of the second protruding portions 3121.
  • the number of the second protrusions 3121 may be one or more. In this embodiment, the number of the second protrusions 3121 is two, and the two second protrusions 3121 are formed on the mirror of the visible light imaging module 312.
  • the two sides of the circumference of the cylinder are opposite to each other, and the number of the second positioning grooves 3210 is also two, and the two second positioning grooves 3210 are respectively opened on the opposite side walls of the second through holes 3232.
  • the visible light imaging module 312 is mounted on the second cavity 3222 and exposed from the second through hole 3232, the second positioning groove 3210 is engaged with the second protruding portion 3121 to indicate that the mounting is in place.
  • the top sidewall 3214 defines a notch 3216 at a location corresponding to the third cavity 3223 . Since the space of the third cavity 3223 is small, the notch 3216 can be opened at a position corresponding to the third cavity 3223 on the top sidewall 3214. When the smaller volume laser projection module 311 is installed, it is convenient to dispense the glue in the third cavity 3223. Referring to FIG. 32, when the bracket 32 on which the input/output module 31 is mounted is mounted on the casing 10, the protruding structure of the casing 10 extends into the notch 3216 to limit the mounting position of the bracket 32.
  • the first surface 3211 is provided with a bracket positioning hole 325 for positioning the mounting position of the bracket 32.
  • the number of the bracket positioning holes 325 may be one or more.
  • the number of the bracket positioning holes 325 is two, and the two bracket positioning holes 325 are opened at diagonally opposite positions of the body 321.
  • the front housing 11 may be convexly formed with a front housing positioning post 110.
  • the front housing positioning post 110 extends into the bracket positioning hole 325 and the bracket.
  • the positioning hole 325 is matched, and the mounting position of the bracket 32 can be quickly positioned by the cooperation of the front housing positioning post 110 and the bracket positioning hole 325, and the bracket 32 is further prevented from shaking in the housing 10.
  • the input and output assembly 30 further includes a receiver 314, an infrared fill light 35, a proximity sensor 36, and a light sensor 37.
  • the terminal 100 further includes a flexible mounting on the housing 10.
  • the circuit board 34, the receiver 314, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are all mounted on the flexible circuit board 34.
  • the receiver 314 emits sound waves outwardly under the action of the driving signal to implement a function such as a call.
  • the infrared fill light 35 is for emitting infrared light outward
  • the proximity sensor 36 is for detecting the distance of the target object to the terminal 100
  • the light sensor 37 is for detecting the intensity of the ambient light.
  • the flexible circuit board 34 is fixed inside the casing 10 under the clamping action of the front case 11 and the rear case 12. One end of the flexible circuit board 34 can be connected to the main board 20.
  • the receiver 314, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 can all be electrically connected to the main board 20 through the same flexible circuit board 34.
  • the flexible circuit board 34 includes a first segment 341, a second segment 342, and a connecting segment 343.
  • the connecting section 343 connects the first section 341 with the second section 342, and the first section 341 is disposed in parallel with the second section 342.
  • the infrared fill light 35, the proximity sensor 36 and the light sensor 37 are both disposed on the first segment 341, and the receiver 314 is disposed on the second segment 342.
  • a contact 345 can be formed on the second segment 342.
  • the receiver 314 includes a sound outlet 3142 and a connecting elastic piece (not shown) on opposite sides of the receiver 314, and the connecting elastic piece protrudes in a direction away from the sound outlet 3142 of the receiver 314.
  • the connecting tabs are in contact with the contacts 345 to electrically connect the receiver 314 to the flexible circuit board 34.
  • the contacts 345 on the flexible circuit board 34 can have multiple sets, and the connecting springs can electrically connect the receiver 314 and the main board 20 to any one of the contacts 345.
  • the receiver 314, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are all located on a side of the first cavity 3221 opposite the second cavity 3222. It can be understood that in the direction along the length of the bracket 32, the flexible circuit board 34, the infrared imaging module 313, the visible light module 312 and the laser projection mode are mounted with the receiver 314, the infrared fill light 35, the proximity sensor 36 and the light sensor 37. Group 311 is arranged in order.
  • the receiver 314, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are both located on the side of the third cavity 3223 opposite the second cavity 3222, at this time, in the direction along the length of the bracket 32, infrared imaging
  • the module 313, the visible light module 312, the laser projection module 311, and the flexible circuit board 34 on which the receiver 314, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are mounted are sequentially arranged.
  • the terminal 100 further includes a cover 40, and the cover 40 and the input/output module 31 are respectively located on opposite sides of the front case 11.
  • the front shell 11 is provided with a first through hole 111, a second through hole 112 and a third through hole 113.
  • the first through hole 111 corresponds to the infrared imaging module 313
  • the second through hole 112 corresponds to the visible light imaging module 312
  • the third through hole 113 corresponds to the laser projection module 311 .
  • the cover plate 40 is formed with an infrared ray transmitting ink 50 at a position corresponding to the first through hole 111 and the third through hole 113, respectively.
  • the cover 40 may be light transmissive, and the material of the cover 40 may be light transmissive glass, resin, plastic, or the like.
  • the cover plate 40 covers the first through hole 111, the second through hole 112, and the third through hole 113.
  • the external light passes through the cover 40 and enters the infrared imaging module 313 through the first through hole 111.
  • the external light passes through the cover 40 and passes through the second through hole 112 to enter the visible light imaging module 312.
  • the laser light emitted by the laser projection module 311 passes through the third through hole 113 and passes through the cover 40.
  • the cover plate 40 is formed with an infrared ray transmitting ink 50 at a position corresponding to the first through hole 111 and the third through hole 113.
  • the infrared transmission ink 50 has a high transmittance to infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user is difficult to use in normal use.
  • the area of the terminal 100 covered by the infrared ray transmitting ink 50 is seen. Therefore, it is difficult for the user to see the internal structure of the terminal 100 through the first through hole 111 and the third through hole 113 (that is, the infrared imaging module 313 and the laser projection module 311 are difficult to see), and the appearance of the terminal 100 is beautiful.
  • the terminal 100 of the embodiment of the present application includes a housing 10, a main board 20, and an input and output assembly 30.
  • the terminal 100 may be a mobile phone, a tablet computer, a laptop computer, a game machine, a head display device, an access control system, a teller machine, etc.
  • the embodiment of the present application is described by taking the terminal 100 as a mobile phone as an example. It can be understood that the specific form of the terminal 100 may be other There are no restrictions here.
  • the housing 10 can serve as a mounting carrier for the main board 20 and the input/output assembly 30.
  • the housing 10 can provide protection against dust, water, and fall of the main board 20 and the input/output assembly 30.
  • Components such as display screens and batteries are installed.
  • the housing 10 includes a front housing 11 and a rear housing 12, and the front housing 11 and the rear housing 12 are coupled to each other and the main board 20 and the input/output assembly 30 are received between the front housing 11 and the rear housing 12, and the front housing 11 and the rear housing 12 are Made of stainless steel, aluminum alloy, plastic and other materials.
  • the main board 20 is fixed in the housing 10 .
  • the main board 20 can be fixed to the front case 11 or the rear case 12 by screwing, snapping, or the like.
  • the main board 20 can be connected to the input/output modules 31 and the flexible circuit board 34 of the input/output unit 30.
  • the main board 20 can also be connected to the processing chip, the control chip, etc. of the terminal 100.
  • the lines laid on the main board 20 can be used for transmitting electrical signals.
  • the main board 20 is formed with a mounting opening 21 (FIG. 43) through which the input and output assembly 30 passes, reducing the space occupied by the main board 20 and the input/output unit 30 when mounted in the housing 10.
  • the input and output assembly 30 is mounted in the housing 10 .
  • the input and output assembly 30 includes an input and output module 31 , a bracket 32 and a flexible circuit board 34 .
  • the input and output module 31 and the flexible circuit board 34 are mounted on On the bracket 32.
  • the input/output module 31 can send a signal to the outside world or receive an external signal, or have the function of sending a signal to the outside world and receiving a signal from the outside, wherein the signal can be a light signal, a sound signal, a touch signal, or the like. It can be understood that the specific type of the input/output module 31 and the number of each input/output module 31 may vary according to different functional requirements of the terminal 100.
  • the input/output module 31 includes an infrared imaging module 313, a visible light imaging module 312, a laser projection module 311, and a receiver 314.
  • the laser projection module 311 can be used to project a laser pattern to a target object outside the terminal 100.
  • the laser can be an infrared laser.
  • the infrared imaging module 313 can be used to receive an infrared signal from the outside to generate an infrared image.
  • the infrared The imaging module 313 can receive the laser pattern emitted by the laser projection module 311 and reflected by the target object.
  • the laser projection module 311 and the infrared imaging module 313 are used together to obtain the depth information of the target object.
  • the visible light imaging module 312 can receive the visible light signal of the outside to generate a color image, and the infrared imaging module 313, the visible light imaging module 312 and the laser projection module 311 can be used together to obtain the depth image of the target user, and the input and output module 31
  • a connector 34 can be provided.
  • the connector 34 can be inserted into a specific connector 22 (such as FIG. 44) on the main board 20 to electrically and mechanically connect the input/output module 31 and the main board 20, and the connector 34 is connected from the connector.
  • the upper and lower extractions can separate the input/output module 31 from the main board 20 and disconnect the electrical connection therebetween.
  • the receiver 314 emits a sound wave under the action of the driving signal to implement a function such as a call.
  • the bracket 32 is an integrally formed structure, and each input/output module 31 is fixed on the bracket 32 .
  • the bracket 32 includes a body 321 .
  • the body 321 includes a first face 3211, a second face 3212, and a sidewall 3213.
  • the first side 3211 and the second side 3212 are opposite each other.
  • the side wall 3213 connects the first surface 3211 and the second surface 3212.
  • the side wall 3213 includes opposite top side walls 3214 and bottom side walls 3215.
  • the side wall 3213 of the bracket 32 can be opposed to the inner wall of the mounting opening 21, so that the bracket 32 is stuck in the installation.
  • the input/output unit 30 can be prevented from moving in the width direction of the terminal 100 (in the Y direction in Fig. 40).
  • the first surface 3211 is provided with a receiving cavity 322.
  • the second surface 3212 defines a through hole 323 communicating with the receiving cavity 322.
  • the receiving cavity 322 is located between the top side wall 3214 and the bottom side wall 3215.
  • the receiving cavity 322 is configured to receive the input/output module 31.
  • the specific shape of the receiving cavity 322 corresponds to the shape of the corresponding input/output module 31.
  • the cavity of the receiving cavity 322 can be slightly larger than the input and output module 31 to facilitate dispensing in the receiving cavity 322, and the cavity of the receiving cavity 322 can also be It is slightly smaller than the input/output module 31 so that the input/output module 31 can be installed in the receiving cavity 322 by an interference fit.
  • the specific number of the receiving chambers 322 may also be equal to the specific number of the input and output modules 31.
  • the input/output module 31 is mounted on the bracket 32, the input/output module 31 is exposed from the through hole 323.
  • the exposure means that the input/output module 31 can be seen from the first surface 3211 or the second surface 3212.
  • the input/output module 31 can pass through the through hole 323 of the second surface 3212.
  • the second surface 3212 is exposed, and the input/output module 31 may not pass through the through hole 323, but the input/output module 31 can be seen through the through hole 323.
  • the receiving cavity 322 includes a first cavity 3221, a second cavity 3222, a third cavity 3223, and a fourth cavity 3224.
  • the fourth cavity 3224 is located between the first cavity 3221 and the second cavity 3222.
  • the first cavity 3221 is used to mount the infrared imaging module 313, the second cavity 3222 is used to mount the visible light imaging module 312, the third cavity 3223 is used to mount the laser projection module 311, and the fourth cavity 3224 is used to receive the receiver 314. That is, the infrared imaging module 313, the receiver 314, the visible light imaging module 312, and the laser projection module 311 can be sequentially installed in the first cavity 3221, the fourth cavity 3224, the second cavity 3222, and the third cavity 3223. .
  • first cavity 3221, the fourth cavity 3224, the second cavity 3222, and the third cavity 3223 are sequentially arranged.
  • first cavity 3221, the fourth cavity 3224, the second cavity 3222 and the third cavity 3223 are arranged from left to right, which can also be understood as the first cavity 3221 and the fourth cavity.
  • 3224, the second cavity 3222 and the third cavity 3223 are arranged in order from right to left.
  • Side wall 3213 includes a partition wall 3218 (Fig. 44).
  • the plurality of receiving cavities 322 may be spaced apart from each other.
  • first cavity 3221, the fourth cavity 3224, the second cavity 3222, and the third cavity 3223 are sequentially spaced by the partition wall 3218, and may be any two or three receiving cavities 322.
  • the first cavity 3221 is in communication with the fourth cavity 3224, and the second cavity 3222 is spaced apart from the third cavity 3223.
  • the through hole 323 includes a first through hole 3231, a second through hole 3232, a third through hole 3233, and an sound through hole 3234, and the first through hole 3231, the second through hole 3232, the third through hole 3233, and the sound through hole 3234 is respectively connected to the first cavity 3221, the second cavity 3222, the third cavity 3223 and the fourth cavity 3224, that is, the first through hole 3231 communicates with the first cavity 3221, and the second through hole 3232 and the second cavity 3222 is connected, the third through hole 3233 is in communication with the third cavity 3223, and the sound through hole 3234 is in communication with the fourth cavity 3224.
  • the sounding through hole 3234 is opposite to the sound outlet of the receiver 314, and the aperture of the sounding through hole 3234 is smaller than the aperture of the sound outlet of the receiver 314.
  • the receiver 314 may not pass through the sounding through hole 3234, and the receiver 314
  • the emitted sound waves can pass through the sound through hole 3234 and enter the outside.
  • the centers of the first through hole 3231, the second through hole 3232, and the third through hole 3233 are located on the same straight line L (as shown in FIG. 41), and the sound through hole 3234 is located between the straight line L and the bottom side wall 3215, and the fourth cavity
  • the center of 3224 is located between line L and bottom side wall 3215.
  • the infrared imaging module 313 passes through the first through hole 3231, and the visible light imaging module 312 passes through the second through hole 3232.
  • the projection module 311 passes through the third through hole 3233, and the optical axes of the three are located in the same plane, which is easy for the three to work together.
  • the top surface of the through-hole 323 of the infrared imaging module 313, the visible light imaging module 312, and the laser projection module 311 is also flush, specifically, the light-input surface of the infrared imaging module 313 and the visible light imaging module 312
  • the light surface and the light exit surface of the laser projection module 311 may be located on the same plane.
  • the flexible circuit board 34 is mounted on the bracket 32.
  • the flexible circuit board 34 can be a printed circuit board, a flexible circuit board, or a soft and hard bonded board.
  • the flexible circuit board 34 includes a first segment 341, a second segment 342, and a connecting segment 343.
  • the connecting section 343 connects the first section 341 with the second section 342.
  • the first segment 341 is combined with the first surface 3211 and electrically connected to the input and output module 31.
  • the first segment 341 can be bonded to the first face 3211 by gluing, and the first segment 341 can also be pressed by the rear case 12 and attached to the first face 3211.
  • the receiver 314 is electrically coupled to the first segment 341, the shape of which corresponds to the shape of the receiver 314.
  • the first segment 341 can be formed with a contact 345 (such as FIG. 43), and the receiver 314 includes a connecting elastic piece 3141 protruding along the second surface 3212 toward the first surface 3211 (FIG. 44), and the elastic piece is connected.
  • the 3141 is in contact with the contact 345 on the first segment 341 to electrically connect the receiver 314 to the flexible circuit board 34.
  • the contacts 345 on the first segment 341 can have multiple sets, and the connecting elastic piece 3141 can electrically connect the receiver 314 and the main board 20 with any set of contacts 345.
  • the second segment 342 includes a mating joint portion 3421 and a joint portion 3422.
  • the joint portion 3421 is coupled to the second surface 3212, and the connection portion 3422 is spaced apart from the second surface 3212 and is for electrical connection with an external device.
  • the joint portion 3421 can be bonded to the second surface 3212 by gluing, and the joint portion 3421 can also be pressed by the front shell 11 and attached to the second surface 3212.
  • the joint portion 3421 is provided with a sound hole 3423 corresponding to the sound output through hole 3234 (Fig. 43). In this way, the receiver 314 may not pass through the sound through hole 3234, and the sound wave emitted by the receiver 314 may pass through the sound through hole 3234 and the sound hole 3423 and enter the outside.
  • the connecting portion 3422 extends in a direction away from the body 32 to be electrically connected to an external device.
  • the external device is the main board 20.
  • a connecting seat 22 is disposed on the surface of the main board 20, and the connecting portion 3422 extends toward the connector 34 and is electrically and mechanically connected to the connecting base 22.
  • the connecting section 343 is in conformity with the top side wall 3214. Specifically, the top side wall 3214 is formed with a notch 3216 through which the connecting section 343 passes.
  • the first segment 341 and the second segment 342 are respectively located on opposite sides of the bracket 32.
  • the flexible circuit board 34 can also be electrically connected to other input/output modules 31, for example, one or more of the flexible circuit board 34 and the infrared imaging module 313, the visible light imaging module 312, and the laser projection module 311. And the input/output module 31 is electrically connected to an external device.
  • brackets are usually used to fix components (such as infrared cameras, laser projectors, receivers, etc.).
  • the brackets are spaced from the main board, and components mounted on the brackets are not easily connected to the main board.
  • the first segment 341 and the second segment 342 of the flexible circuit board 34 are electrically connected to the input/output module 31, and the first segment 341 and the second segment 342 are
  • the joint portion 3421 is mounted on the bracket 32, and the connecting portion 3422 of the second segment 342 is electrically connected to the external device to connect the input/output module 31 to the main board 20.
  • the input and output assembly 30 further includes an infrared fill light 35 , a proximity sensor 36 , and a light sensor 37 .
  • the infrared fill light 35 is for emitting infrared light outward
  • the proximity sensor 36 is for detecting the distance of the target object to the terminal 100
  • the light sensor 37 is for detecting the intensity of the ambient light, wherein the proximity sensor 36 and the light sensor 37 can be set.
  • the infrared fill light 35, the proximity sensor 36, and the light sensor 37 are all connected to the second segment 342.
  • the infrared fill light 35, the proximity sensor 36 and the light sensor 37 are both connected to the joint portion 3421 and located between the connecting portion 343 and the sound hole 3423, so that the infrared fill light 35 and the proximity sensor are better.
  • 36 and the light sensor 37 are fixed to the bracket 32.
  • the bracket 32 protrudes from the first surface 3211 and/or the second surface 3212 to form a bracket positioning post 326 , and the flexible circuit board 34 defines a soft board positioning hole 344 .
  • the bracket positioning post 326 extends into the soft board positioning hole 344.
  • the bracket positioning post 326 corresponds to the position of the fourth cavity 3224.
  • the bracket positioning post 326 and the soft board positioning hole 344 cooperate to position the mounting position of the flexible circuit board 34 on the bracket 32.
  • the bracket positioning post 326 may be formed only on the first surface 3211, or may be formed only on the second surface 3212, and the bracket positioning post 326 may be formed on the first surface 3211 and the second surface 3212 at the same time.
  • the number and position of the flexible plate positioning holes 344 correspond to the number and position of the bracket positioning posts 326.
  • the soft plate positioning holes 344 may be opened only in the first segment 341, or may be opened only on the second segment 342, or It is opened in the first section 341 and the second section 342.
  • the bracket positioning post 326 formed on the first face 3211 corresponds to the position of the fourth cavity 3224.
  • the bracket positioning post 326 can be used for positioning the first segment 341 mounted on the bracket 32 to prevent the first segment 341 from swaying.
  • the bracket positioning post 326 passes through the soft plate positioning hole 344 of the first segment 341 and is fixed.
  • a bracket positioning post 326 formed on the second side 3212 is located between the top side wall 3214 and the bottom side wall 3215.
  • the bracket positioning post 326 can be used to position components mounted on the bracket 32, such as the above-mentioned joint portion 3421, the infrared fill light 35, the proximity sensor 36, or the light sensor 37 to prevent the components from shaking.
  • the bracket positioning post 326 passes through the soft plate positioning hole 344 of the joint portion 3421 and fixes the second segment 342. Therefore, the infrared fill light 35, the proximity sensor 36, and the light sensor 37 disposed on the second segment 342 are also fixed.
  • the center of the fourth cavity 3224 and the bracket positioning post 326 can be respectively located on both sides of the straight line L.
  • the bracket 32 further includes a securing projection 328 that projects outwardly from the sidewall 3213 and the securing projection 328 is used to secure the bracket 32.
  • the number of the fixing protrusions 328 may be single or plural. When the number of the fixing protrusions 328 is plural, the plurality of fixing protrusions 328 may protrude from opposite sides of the side wall 3213. Specifically, the fixing protrusion 328 may be directly fixed to the housing 10 by a fastener, or the bracket 32 and the main board 20 may be fixed to the housing 10 by fasteners. In the embodiment shown in FIG. 40 and FIG.
  • the fixing protrusion 328 is provided with a fixing hole 3282
  • the main board 20 and the front housing 11 are provided with mounting holes at positions corresponding to the fixing holes 3282, and can be fastened by fasteners.
  • the screw passes through the fixing hole 3282 and the mounting hole to fix the bracket 32 and the main board 20 to the front case 11.
  • the stability of the bracket 32 mounted in the housing 10 is further enhanced by the fixing projection 328 fixing the bracket 32.
  • the second surface 3212 is provided with a bracket positioning hole 325 for positioning the mounting position of the bracket 32 .
  • the number of the bracket positioning holes 325 may be one or more.
  • the number of the bracket positioning holes 325 is two, and the two bracket positioning holes 325 are opened at diagonally opposite positions of the body 321.
  • a front housing positioning post (not shown) may be formed on the front housing 11.
  • the front housing positioning post protrudes into the bracket positioning hole 325 and is positioned with the bracket.
  • the mounting position of the front housing positioning post and the bracket positioning hole 325 can quickly locate the mounting position of the bracket 32, and further prevent the bracket 32 from shaking in the housing 10.
  • the terminal 100 further includes a cover 40, and the cover 40 and the input/output module 31 are respectively located on opposite sides of the front case 11.
  • the front shell 11 is provided with a first through hole 111, a second through hole 112, a third through hole 113, and a fourth through hole 114.
  • the first through hole 111 corresponds to the infrared imaging module 313, the second through hole 112 corresponds to the receiver 314, the third through hole 113 corresponds to the visible light imaging module 312, and the fourth through hole 114 corresponds to the laser projection module 311.
  • the cover plate 40 is formed with an infrared transmitting ink 50 at a position corresponding to the first through hole 111 and the fourth through hole 114, and the cover plate 40 defines an sound emitting hole 41 corresponding to the second through hole 112.
  • the cover 40 may be light transmissive, and the material of the cover 40 may be light transmissive glass, resin, plastic, or the like.
  • the cover plate 40 covers the first through hole 111, the second through hole 112, the third through hole 113, and the fourth through hole 114.
  • the external light passes through the cover 40 and enters the infrared imaging module 313 through the first through hole 111.
  • the sound wave emitted by the receiver 314 passes through the second through hole 112 and then passes through the sound hole 41.
  • the external light passes through the cover 40 and enters the visible light imaging module 312 through the third through hole 113.
  • the laser light emitted by the laser projection module 311 passes through the fourth through hole 114 and passes through the cover 40.
  • the cover plate 40 is formed with an infrared ray transmitting ink 50 at a position corresponding to the first through hole 111 and the fourth through hole 114.
  • the infrared transmission ink 50 has a high transmittance to infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user is difficult to use in normal use.
  • the area of the terminal 100 covered by the infrared ray transmitting ink 50 is seen.
  • the appearance of the terminal 100 is more beautiful.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, for example two, three, unless specifically defined otherwise.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

一种终端(100)、输入输出组件(30)和支架(32)。支架(32)包括本体(321),本体(321)包括相背的第一面(3211)和第二面(3212),第二面(3212)开设有至少一个收容腔(322),第一面(3211)开设有与至少一个收容腔(322)对应的至少一个通孔(323),至少一个收容腔(322)用于固定安装输入输出模组(31)并使输入输出模组(31)从第二面(3212)暴露,至少一个通孔(323)用于从第一面(3211)暴露输入输出模组(31)。

Description

支架、输入输出组件和终端
优先权信息
本申请请求2018年04月10日向中国国家知识产权局提交的、专利号为201810317084.X、201820506787.2、201810316733.4、201820507039.6、201810317232.8、201820506901.1、201810317244.0、201820507037.7、201820506788.7、201820506786.8和201810315979.X的专利的优先权和权益;本申请通过参照将上述专利的全文并入此处。
技术领域
本申请涉及消费性电子技术领域,更具体而言,涉及一种支架、输入输出组件和终端。
背景技术
手机可以配置有多个功能模组,而多个功能模组往往需要互相配合才能正常工作,然而,手机在使用中受到撞击时,多个功能模组的相对位置容易发生改变而不能很好地配合工作。
发明内容
本申请实施方式提供一种支架、输入输出组件和终端。
本申请实施方式的支架包括本体,所述本体包括相背的第一面和第二面,所述第二面开设有至少一个收容腔,所述第一面开设有与至少一个所述收容腔对应的至少一个通孔,至少一个所述收容腔用于固定安装输入输出模组并使所述输入输出模组从所述第二面暴露,至少一个所述通孔用于从所述第一面暴露所述输入输出模组。
本申请实施方式的输入输出组件包括输入输出模组和上述实施方式所述的支架,所述输入输出模组安装在所述支架的所述收容腔内。
本申请实施方式的输入输出组件包括上述实施方式所述的支架和与所述收容腔对应的至少一个输入输出模组,所述输入输出模组中的至少一个输入输出模组的外壁形成有外螺纹,所述外螺纹与所述内螺纹结合以使所述输入输出模组安装在对应的所述收容腔内。
本申请实施方式的终端包括壳体和上述实施方式所述的输入输出组件,所述输入输出组件安装在所述壳体内。
本申请实施方式的输入输出组件包括输入输出模组和上述实施方式所述的支架,所述输入输出模组包括红外成像模组、可见光成像模组、激光投射器和受话器;所述红外成像模组安装在所述第一腔内,所述可见光成像模组安装在所述第二腔内,所述激光投射模组安装在所述第三腔内,所述受话器安装在所述第四腔内。
本申请实施方式的输入输出组件包括输入输出模组和上述实施方式所述的支架,所述输入输出模组包括激光投射模组、受话器和红外成像模组;所述红外成像模组安装在所述第一腔内,所述受话器安装在所述第二腔内,所述激光投射模组安装在所述第三腔内。
本申请实施方式的输入输出组件包括输入输出模组和上述实施方式所述的支架,所述输入输出模组包括激光投射模组、可见光成像模组和红外成像模组;所述红外成像模组安装在所述第一腔内,所述可见光成像模组安装在所述第二腔内,所述激光投射模组安装在所述第三腔内。
本申请实施方式的终端包括壳体和上述实施方式所述的输入输出组件,所述输入输出组件安装在所述壳体内。
本申请实施方式的输入输出组件包括上述实施方式所述的支架、输入输出模组和安装在所述支架上的电路板,所述输入输出模组安装在所述收容腔内并从所述通孔暴露;所述柔性电路板包括第一段和第二段,所述第一段与所述第一面结合且与所述输入输出模组电连接,所述第二段包括相接的结合部和连接部,所述结合部与所述第二面结合,所述连接部与所述第二面间隔且用于与外部设备电连接。
本申请实施方式的终端包括主板和上述实施方式所述的输入输出组件,所述主板上开设有安装口;所述支架安装在所述安装口,所述连接部与所述主板电连接。
本申请的实施方式的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解,其中:
图1是本申请某些实施方式的终端的立体分解示意图。
图2和图3是本申请某些实施方式的输入输出组件的平面装配示意图。
图4和图5是本申请某些实施方式的输入输出组件的立体分解示意图。
图6是本申请某些实施方式的输入输出组件的支架的结构示意图。
图7至图10是本申请某些实施方式的输入输出组件的激光投射模组的部分结构示意图。
图11是本申请某些实施方式的终端的立体分解示意图。
图12和图13是本申请某些实施方式的输入输出组件的平面装配示意图。
图14和图15是本申请某些实施方式的输入输出组件的立体分解示意图。
图16是本申请某些实施方式的输入输出组件的支架的结构示意图。
图17是本申请某些实施方式的输入输出组件的剖视图。
图18是本申请某些实施方式的输入输出组件的支架的结构示意图。
图19是本申请某些实施方式的终端的立体分解示意图。
图20和图21是本申请某些实施方式的输入输出组件的平面装配示意图。
图22和图23是本申请某些实施方式的输入输出组件的立体分解示意图。
图24是本申请实施方式的终端的部分结构示意图。
图25是本申请某些实施方式的终端的立体分解示意图。
图26和图27是本申请某些实施方式的输入输出组件的平面装配示意图。
图28和图29是本申请某些实施方式的输入输出组件的立体分解示意图。
图30是本申请某些实施方式的输入输出组件的支架的结构示意图。
图31是本申请实施方式的终端的部分结构示意图。
图32是本申请某些实施方式的终端的立体分解示意图。
图33和图34是本申请某些实施方式的输入输出组件的平面装配示意图。
图35和图36是本申请某些实施方式的输入输出组件的立体分解示意图。
图37是本申请某些实施方式的输入输出组件的平面装配示意图。
图38是本申请实施方式的终端的柔性电路板、受话器、红外补光灯、接近传感器和光感器的立体装配示意图。
图39是本申请实施方式的终端的部分结构示意图。
图40是本申请某些实施方式的终端的立体分解示意图。
图41和图42是本申请某些实施方式的输入输出组件的平面装配示意图。
图43和图44是本申请某些实施方式的输入输出组件的立体分解示意图。
图45是本申请实施方式的终端的部分结构示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外,下面结合附图描述的本申请的实施方式是示例性的,仅用于解释本申请的实施方式,而不能理解为对本申请的限制。
在本申请中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。
请参阅图4及图5,本申请支架32包括本体321,本体321包括相背的第一面3211和第二面3212,第二面3212开设有至少一个收容腔322,第一面3211开设有与至少一个收容腔322对应的至少一个通孔323,至少一个收容腔322用于固定安装输入输出模组31并使输入输出模组31从第二面3212暴露,至少一个通孔323用于从第一面3211暴露输入输出模组31。
请参阅图1,本申请实施方式的终端100包括壳体10、主板20和输入输出组件30。终端100可以是手机、平板电脑、手提电脑、游戏机、头显设备、门禁系统、柜员机等,本申请实施例以终端100是手机为例进行说明,可以理解,终端100的具体形式可以是其他,在此不作限制。
请参阅图1,壳体10可以作为主板20和输入输出组件30的安装载体,壳体10可以给主板20和输入输出组件30提供防尘、防水、防摔的保护,壳体10上还可以安装有显示屏、电池等元器件。壳体10包括前壳11和后壳12,前壳11与后壳12互相结合并将主板20和输入输出组件30收容在前壳11与后壳12之间,前壳11与后壳12可以采用不锈钢、铝合金、塑料等材料制成。
请参阅图1,主板20固定在壳体10内,具体地,主板20可以通过螺合、卡合等方式固定在前壳 11或后壳12上。主板20可以与输入输出组件30的各输入输出模组31(如图3)连接,主板20上还可以连接终端100的处理芯片、控制芯片等,主板20上铺设的线路可以用于传输电信号。主板20上形成有安装口,安装口供输入输出组件30穿过,减小主板20与输入输出组件30安装在壳体10内时占用的空间。
请参阅图1至图3,本申请第一实施例中,输入输出组件30安装在壳体10内,输入输出组件30包括输入输出模组31和支架32,输入输出模组31安装在支架32上。
输入输出模组31可以向外界发出信号或者接收外界的信号,或者同时具备向外界发出信号和接收外界的信号的功能,其中信号可以是光线信号、声音信号、触摸信号等。可以理解,依据终端100的不同功能需求,输入输出模组31的具体种类和每种输入输出模组31的数量可以有所变化。
请结合图4和图5,在本申请实施例中,输入输出模组31包括激光投射模组311、红外成像模组313、可见光成像模组312和受话器314。其中,激光投射模组311可用于向终端100外的目标物体投射激光图案,激光可以是红外光,红外成像模组313可用于接收外界的红外光信号以生成红外图像,在一个例子中,红外成像模组313可以接收由目标物体反射的激光图案,激光投射模组311和红外成像模组313共同用于获得目标物体的深度信息。可见光成像模组312可接收外界的可见光信号以生成彩色图像,可见光成像模组312、红外成像模组313和激光投射模组311可以共同用于获得目标用户的深度图像,受话器314在驱动信号的作用下向外发出声波实现通话等功能。输入输出模组31上可以设置有连接器33,连接器33可以插入到主板20上特定的连接座上,以连接输入输出模组31与主板20,将连接器33从连接座上拔出则可以将输入输出模组31与主板20分离。
请参阅图1至图3,支架32为一体成型结构,支架32包括本体321。支架32固定在壳体10内且用于安装输入输出模组31。本体321包括第一面3211、第二面3212和侧壁3213,第一面3211与第二面3212相背,侧壁3213连接第一面3211与第二面3212,侧壁3213包括相背的顶侧壁3214和底侧壁3215。在将输入输出组件30安装在壳体10内时,前壳11可以与第一面3211相抵,后壳12可以与第二面3212相抵以夹持支架32,避免支架32和输入输出模组31沿终端100的厚度方向(如图1中的Z方向)移动,同时,支架32与主板20的安装口的位置对应安装,支架32的侧壁3213可以与安装口的内壁相抵,使得支架32卡在安装口内,只需要将主板20的位置固定,就可避免支架32和输入输出模组31沿终端100的宽度方向(沿垂直于图1中的Z方向)移动。
请结合图4和图5,第二面3212上开设有至少一个收容腔322,第一面3211开设有与至少一个收容腔322对应的至少一个通孔323,收容腔322均位于顶侧壁3214和底侧壁3215之间。至少一个收容腔322用于固定安装输入输出模组31,当输入输出模组31安装在支架32上时,输入输出模组31从第二面3212暴露,且输入输出模组31还通过通孔323从第一面3211暴露。在本申请实施方式中,暴露指的是可以从第一面3211或从第二面3212看到输入输出模组31,例如,输入输出模组31可以穿过第一面3211的通孔323从第一面3211暴露,输入输出模组31也可以未穿过通孔323,但通过通孔323可以看到输入输出模组31。
支架32上形成有限位环324,具体地,通孔323的开口尺寸小于对应的收容腔322的尺寸以形成限位环324,收容腔322由限位环324和环绕限位环324延伸的内壁形成。在安装输入输出模组31时,可以将输入输出模组31沿第二面3212指向第一面3211的方向安装在收容腔322内,直至输入输出模组31与限位环324相抵,表明输入输出模组31安装到位,此时可以向收容腔322内点胶,具体地,可以向输入输出模组31与收容腔322的内壁之间的间隙内点胶,等胶水固化后,输入输出模组31被固定安装在收容腔322。
可以理解,收容腔322的具体形状与对应的输入输出模组31的形状对应,收容腔322的腔体可以略大于输入输出模组31以便于在收容腔322内点胶,收容腔322的腔体也可以略小于输入输出模组31以使输入输出模组31可通过过盈配合安装在收容腔322内。收容腔322的具体数量也可以与输入输出模组31的具体数量相等。
请继续参阅图4及图5,在本申请实施例中,收容腔322包括第一腔3221、第二腔3222、第三腔3223和第四腔3224。第一腔3221、第二腔3222、第三腔3223和第四腔3224依次排列,通孔323包括第一孔3231、第二孔3232、第三孔3233和第四孔3234,第一孔3231与第一腔3221对应,第二孔3232与第二腔3222对应,第三孔3233与第三腔3223对应,第四孔3234与第四腔3224对应。多个收容腔322可以互相间隔,也可以是任意两个、三个、或四个等的收容腔322互相连通。第一腔3221可用于安装激光投射模组311,第二腔3222可用于安装可见光成像模组312,第三腔3223可用于安装受话器314,第四腔3224可用于安装红外成像模组313。第一腔3221、第二腔3222、第四腔3224的中心位于同一直线L(如图2所示)上,激光投射模组311、可见光成像模组312和红外成像模组313安装后,三者的光轴位于同一平面内,易于三者互相配合工作,具体地,激光投射模组311从第一孔3231穿出,可见 光成像模组312从第二孔3232穿出,红外成像模组313从第四孔3234穿出,更具体地,激光投射模组311的出光面、可见光成像模组312的入光面和红外成像模组313的入光面可以是位于同一个平面上。第三腔3223的中心位于直线L与底侧壁3215之间,受话器314安装在第四腔3224内,受话器314可以未穿过第四孔3234,受话器314发出的声波可以穿过第四孔3234并进入外界。
综上,本申请实施方式的终端100,由于支架32一体成型,当多个输入输出模组31安装在收容腔322内时,输入输出模组31的相对位置不易发生变化,多个输入输出模组31能够更好地配合工作。具体地,多个收容腔322的位置不会发生变化,只要将输入输出模组31固定在收容腔322内,输入输出模组31之间的相对位置也不会发生变化。同时,由于多个输入输出模组31可以同时安装在一个支架32上,而不需要为多个输入输出模组31设置多个安装架,简化了终端100的结构,节约了终端100内的安装空间。
请参阅图2、图4、图12和图14,在某些实施方式中,第一面3211上开设有支架定位孔325,支架定位孔325用于定位支架32的安装位置。具体地,支架定位孔325的数量可以是一个或多个,本申请实施例中,支架定位孔325的数量为两个,且两个支架定位孔325开设在本体321的斜对角的位置。对应的,请结合图1,前壳11上可以凸出形成有前壳定位柱110,当第一面3211与前壳11相抵时,前壳定位柱110伸入支架定位孔325中且与支架定位孔325配合,通过前壳定位柱110与支架定位孔325的配合可以快速定位支架32的安装位置,且进一步避免支架32在壳体10内晃动。
请参阅图4、图5、图14和图15,在某些实施方式中,输入输出组件30还包括柔性电路板34,受话器314包括连接弹片3141,连接弹片3141沿着第一面3211向第二面3212的方向凸出,连接弹片3141与柔性电路板34抵触以电连接受话器314与柔性电路板34。具体地,柔性电路板34的一端可以连接到主板20上,柔性电路板34上可以形成有触点345,连接弹片3141与触点345抵触以电连接受话器314与柔性电路板34。在一个例子中,柔性电路板34上的触点345可以有多组,连接弹片3141与任意一组触点345抵触均能电连接受话器314与主板20,如此,只要受话器314的出音口与第三孔3233对应,受话器314可以以多个角度被安装在第三腔3223内,且均可以使连接弹片3141与触点345抵触。
请参阅图2至图4、及图12至图14,在某些实施方式中,柔性电路板34包括第一段341和第二段342。第一段341与第一面3211贴合,第二段342与第二面3212贴合。连接弹片3141与第二段342抵触。输入输出组件30还包括红外补光灯35、接近传感器36和光感器37,红外补光灯35、接近传感器36和光感器37均连接在第一段341上。
在本申请实施例中,柔性电路板34还包括连接第一段341和第二段342的连接段343,连接段343可以与顶侧壁3214相贴合。红外补光灯35用于向外发射红外光,接近传感器36用于检测目标物体到终端100的距离,光感器37用于检测环境光的强度,其中,接近传感器36和光感器37可以集成为一个模组。如此,通过一个柔性电路板34就可以连接红外补光灯35、接近传感器36、光感器37和受话器314,输入输出组件30的整体结构较简单紧凑。
请参阅图2、图4、图12和图14,在某些实施方式中,支架32还包括自第一面3211凸出的支架定位柱326,支架定位柱326与第三腔3223的位置对应,支架定位柱326位于直线L与顶侧壁3214之间。支架定位柱326可以用于定位安装在支架32上的元件,例如上述的柔性电路板34、红外补光灯35、接近传感器36或光感器37等元件,防止元件发生晃动。更具体地,支架定位柱326穿设并固定住柔性电路板34的第一段341,因此,设置在第一段341上的红外补光灯35、接近传感器36及光感器37也被固定住,第三腔3223的中心与支架定位柱326可以分别位于直线L的两侧。
请参阅图3、图5、图13、图15和图16,在某些实施方式中,支架32还包括支架定位块327,支架定位块327自第二面3212凸出,支架定位块327与第三腔3223的位置对应。支架定位块327可以用于定位安装在支架32上的柔性电路板34,防止柔性电路板34发生晃动,具体地,支架定位块327穿设并固定住柔性电路板34的第二段342。
请参阅图4、图5、图14和图15,在某些实施方式中,柔性电路板34上开设有软板定位孔344,软板定位孔344用于定位柔性电路板34在支架32上的安装位置。具体地,软板定位孔344可以开设在第一段341、第二段342或连接段343的任意一段或多段上,在如图4和图5所示的实施例中,软板定位孔344同时开设在第一段341和第二段342上,软板定位孔344开设的位置可以与上述的支架定位柱326和支架定位块327的位置对应,在安装柔性电路板34时,将第一段341与第一面3211贴合且将软板定位孔344与支架定位柱326配合,将第二段342与第二面3212贴合且将软板定位孔344与支架定位块327配合,如此,柔性电路板34的位置不易发生晃动。
请参阅图2至图5、及图18,在某些实施方式中,支架32还包括固定凸出328,固定凸出328自侧壁3213向外凸出,固定凸出328用于固定支架32。固定凸出328的数量可以是单个或多个,当固定凸出328的数量是多个时,多个固定凸出328可以从侧壁3213的相背的两侧凸出。固定凸出328用于固 定支架32,具体地,可以通过紧固件直接将固定凸出328固定在壳体10上,也可以通过紧固件将支架32和主板20共同固定在壳体10上。在如图1和图2所示的实施例中,固定凸出328上开设有固定孔3282,主板20和前壳11与固定孔3282对应的位置开设有安装孔,可以通过紧固件(如螺钉)穿过固定孔3282和安装孔,以将支架32和主板20固定在前壳11上。通过固定凸出328固定支架32,进一步提高支架32安装在壳体10内的稳定性。
请参阅图6,当然,可以理解,固定凸出328也不是必须的,支架32在前壳11与后壳12的夹持作用下,支架32的位置也具有较好的稳定性。
请参阅图7,在某些实施方式中,激光投射模组311包括基板组件3111、镜筒3112、光源3113、准直元件3114、衍射光学元件(diffractive optical elements,DOE)3115、及保护盖3116。
基板组件3111包括基板31111和电路板31112。电路板31112设置在基板31111上,电路板31112用于连接光源3113与终端100的主板20,电路板31112可以是硬板、软板或软硬结合板。
镜筒3112与基板组件3111固定连接,镜筒3112形成有容置腔31121,镜筒3112包括顶壁31122及自顶壁31122延伸的环形的周壁31124,周壁31124设置在基板组件3111上,顶壁31122开设有与容置腔31121连通的通光孔31125。周壁31124可以与电路板31112通过粘胶连接。
保护盖3116设置在顶壁31122上。保护盖3116包括开设有出光通孔31160的挡板31162及自挡板31162延伸的环形侧壁31164。
光源3113与准直元件3114均设置在容置腔31121内,衍射光学元件3115安装在镜筒3112上,准直元件3114与衍射光学元件3115依次设置在光源3113的发光光路上。准直元件3114对光源3113发出的激光进行准直,激光穿过准直元件3114后再穿过衍射光学元件3115以形成激光图案。
光源3113可以是垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL)或者边发射激光器(edge-emitting laser,EEL),在如图7所示的实施例中,光源3113为边发射激光器,具体地,光源3113可以为分布反馈式激光器(Distributed Feedback Laser,DFB)。光源3113用于向容置腔31121内发射激光。请结合图8,光源3113整体呈柱状,光源3113远离基板组件3111的一个端面形成发光面31131,激光从发光面31131发出,发光面31131朝向准直元件3114。光源3113固定在基板组件3111上,具体地,光源3113可以通过封胶3117粘结在基板组件3111上,例如光源3113的与发光面31131相背的一面粘接在基板组件3111上。请结合图7和图9,光源3113的侧面31132也可以粘接在基板组件3111上,封胶3117包裹住四周的侧面31132,也可以仅粘结侧面31132的某一个面与基板组件3111或粘结某几个面与基板组件3111。此时封胶3117可以为导热胶,以将光源3113工作产生的热量传导至基板组件3111中。
请参阅图7,衍射光学元件3115承载在顶壁31122上并收容在保护盖3116内。衍射光学元件3115的相背两侧分别与保护盖3116及顶壁31122抵触,挡板31162包括靠近通光孔31125的抵触面31163,衍射光学元件3115与抵触面31163抵触。
具体地,衍射光学元件3115包括相背的衍射入射面31152和衍射出射面31154。衍射光学元件3115承载在顶壁31122上,衍射出射面31154与挡板31162的靠近通光孔31125的表面(抵触面31163)抵触,衍射入射面31152与顶壁31122抵触。通光孔31125与容置腔31121对准,出光通孔31160与通光孔31125对准。顶壁31122、环形侧壁31164及挡板31162与衍射光学元件3115抵触,从而防止衍射光学元件3115沿出光方向从保护盖3116内脱落。在某些实施方式中,保护盖3116通过胶水粘贴在顶壁31122上。
上述的激光投射模组311的光源3113采用边发射激光器,一方面边发射激光器较VCSEL阵列的温漂较小,另一方面,由于边发射激光器为单点发光结构,无需设计阵列结构,制作简单,激光投射模组311的光源成本较低。
分布反馈式激光器的激光在传播时,经过光栅结构的反馈获得功率的增益。要提高分布反馈式激光器的功率,需要通过增大注入电流和/或增加分布反馈式激光器的长度,由于增大注入电流会使得分布反馈式激光器的功耗增大并且出现发热严重的问题,因此,为了保证分布反馈式激光器能够正常工作,需要增加分布反馈式激光器的长度,导致分布反馈式激光器一般呈细长条结构。当边发射激光器的发光面31131朝向准直元件3114时,边发射激光器呈竖直放置,由于边发射激光器呈细长条结构,边发射激光器容易出现跌落、移位或晃动等意外,因此通过设置封胶3117能够将边发射激光器固定住,防止边发射激光器发生跌落、位移或晃动等意外。
请参阅图7和图10,在某些实施方式中,光源3113也可以采用如图10所示的固定方式固定在基板组件3111上。具体地,激光投射模组311包括多个支撑块3118,支撑块3118可以固定在基板组件3111上,多个支撑块3118共同包围光源3113,在安装时可以将光源3113直接安装在多个支撑块3118之间。在一个例子中,多个支撑块3118共同夹持光源3113,以进一步防止光源3113发生晃动。
在某些实施方式中,保护盖3116可以省略,此时衍射光学元件3115可以设置在容置腔31121内,衍射光学元件3115的衍射出射面31154可以与顶壁31122相抵,激光穿过衍射光学元件3115后再穿出通光孔31125。如此,衍射光学元件3115不易脱落。
在某些实施方式中,基板31111可以省去,光源3113可以直接固定在电路板31112上以减小激光投射模组311的整体厚度。
本申请第二实施例中,请参阅图11至图13,输入输出组件30安装在壳体10内,输入输出组件30包括输入输出模组31和支架32,输入输出模组31安装在支架32上。
输入输出模组31可以向外界发出信号或者接收外界的信号,或者同时具备向外界发出信号和接收外界的信号的功能,其中信号可以是光线信号、声音信号、触摸信号等。可以理解,依据终端100的不同功能需求,输入输出模组31的具体种类和每种输入输出模组31的数量可以有所变化。
请结合图14和图15,在本申请实施例中,输入输出模组31包括激光投射模组311、红外成像模组313、可见光成像模组312和受话器314。其中,激光投射模组311可用于向终端100外的目标物体投射激光图案,激光可以是红外光,红外成像模组313可用于接收外界的红外光信号以生成红外图像,在一个例子中,红外成像模组313可以接收由目标物体反射的激光图案,激光投射模组311和红外成像模组313共同用于获得目标物体的深度信息。可见光成像模组312可接收外界的可见光信号以生成彩色图像,可见光成像模组312、红外成像模组313和激光投射模组311可以共同用于获得目标用户的深度图像,受话器314在驱动信号的作用下向外发出声波实现通话等功能。输入输出模组31上可以设置有连接器33,连接器33可以插入到主板20上特定的连接座上,以连接输入输出模组31与主板20,将连接器33从连接座上拔出则可以将输入输出模组31与主板20分离。输入输出模组31中的至少一个输入输出模组31的外壁310形成有外螺纹。本实施方式中的红外成像模组313的外壁310形成有外螺纹。在其他实施方式中,激光投射模组311、可见光成像模组312、红外成像模组313及受话器314中的任意一个、两个、三个或四个的外壁310形成有外螺纹。在其他实施方式中,输入输出组件30中的输入输出模组31的数量也可以为一个、两个、三个、四个或任意多个。
请参阅图11至图13,支架32为一体成型结构,支架32包括本体321。支架32固定在壳体10内且用于安装输入输出模组31。本体321包括第一面3211、第二面3212和侧壁3213,第一面3211与第二面3212相背,侧壁3213连接第一面3211与第二面3212,侧壁3213包括相背的顶侧壁3214和底侧壁3215。在将输入输出组件30安装在壳体10内时,前壳11可以与第一面3211相抵,后壳12可以与第二面3212相抵以夹持支架32,避免支架32和输入输出模组31沿终端100的厚度方向(如图11中的Z方向)移动,同时,支架32与主板20的安装口的位置对应安装,支架32的侧壁3213可以与安装口的内壁相抵,使得支架32卡在安装口内,只需要将主板20的位置固定,就可避免支架32和输入输出模组31沿终端100的宽度方向(沿垂直于图11中的Z方向)移动。
请结合图14至图16,第二面3212上开设有至少一个收容腔322,第一面3211开设有与至少一个收容腔322对应的至少一个通孔323,收容腔322均位于顶侧壁3214和底侧壁3215之间。收容腔322中的至少一个收容腔322的内壁3220形成有内螺纹。部分收容腔322的内壁3220可以没有内螺纹。至少一个收容腔322用于固定安装输入输出模组31,当输入输出模组31安装在支架32上时,输入输出模组31从第二面3212暴露,且输入输出模组31还通过通孔323从第一面3211暴露。在本申请实施方式中,暴露指的是可以从第一面3211或从第二面3212看到输入输出模组31,例如,输入输出模组31可以穿过第一面3211的通孔323从第一面3211暴露,输入输出模组31也可以未穿过通孔323,但通过通孔323可以看到输入输出模组31。
支架32上形成有限位环324,具体地,通孔323的开口尺寸小于对应的收容腔322的尺寸以形成限位环324,收容腔322由限位环324和环绕限位环324延伸的内壁形成。在内壁3220形成有内螺纹的收容腔322内安装外壁310形成有外螺纹的输入输出模组31时,内螺纹与外螺纹螺合(结合)以使输入输出模组31安装到收容腔322内(请参阅图17)。在内壁3220没有内螺纹的收容腔322内安装输入输出模组31时,可以将输入输出模组31沿第二面3212指向第一面3211的方向安装在收容腔322内,直至输入输出模组31与限位环324相抵,表明输入输出模组31安装到位,此时可以向收容腔322内点胶,具体地,可以向输入输出模组31与收容腔322的内壁之间的间隙内点胶,等胶水固化后,输入输出模组31被固定安装在收容腔322。
可以理解,收容腔322的具体形状与对应的输入输出模组31的形状对应,收容腔322的腔体可以略大于输入输出模组31以便于在收容腔322内点胶,收容腔322的腔体也可以略小于输入输出模组31以使输入输出模组31可通过过盈配合安装在收容腔322内。收容腔322的具体数量也可以与输入输出模组31的具体数量相等。内壁3220形成有内螺纹的收容腔322的数量与外壁310形成有外螺纹的输入输出模组31的数量相等。
请继续参阅图14至图16,在本申请实施例中,收容腔322包括第一腔3221、第二腔3222、第三腔3223和第四腔3224。第一腔3221、第二腔3222、第三腔3223和第四腔3224依次排列,通孔323包括第一孔3231、第二孔3232、第三孔3233和第四孔3234,第一孔3231与第一腔3221对应,第二孔3232与第二腔3222对应,第三孔3233与第三腔3223对应,第四孔3234与第四腔3224对应。多个收容腔322可以互相间隔,也可以是任意两个、三个、或四个等的收容腔322互相连通。第一腔3221可用于安装激光投射模组311,第二腔3222可用于安装可见光成像模组312,第三腔3223可用于安装受话器314,第四腔3224可用于安装红外成像模组313。具体地,第一腔3221、第二腔3222和第三腔3223的内壁3220均没有内螺纹,激光投射模组311通过胶水粘接在第一腔3221内,可见光成像模组312通过胶水粘接在第二腔3222内,受话器314通过胶水粘接在第三腔3223内;第四腔3224的内壁3220形成有内螺纹,红外成像模组313的外壁310的外螺纹与第四腔3224的内壁3220的内螺纹螺合(结合)以使红外成像模组313安装在第四腔3224内(请参阅图17)。第一腔3221、第二腔3222、第四腔3224的中心位于同一直线L(如图12所示)上,激光投射模组311、可见光成像模组312和红外成像模组313安装后,三者的光轴位于同一平面内,易于三者互相配合工作,具体地,激光投射模组311从第一孔3231穿出,可见光成像模组312从第二孔3232穿出,红外成像模组312从第四孔3234穿出,更具体地,激光投射模组311的出光面、可见光成像模组312的入光面和红外成像模组313的入光面可以是位于同一个平面上。第三腔3223的中心位于直线L与底侧壁3215之间,受话器314安装在第四腔3224内,受话器314可以未穿过第四孔3234,受话器314发出的声波可以穿过第四孔3234并进入外界。
综上,本申请实施方式的终端100,由于支架32一体成型,当多个输入输出模组31安装在收容腔322内时,输入输出模组31的相对位置不易发生变化,多个输入输出模组31能够更好地配合工作。具体地,多个收容腔322的位置不会发生变化,只要将输入输出模组31固定在收容腔322内,输入输出模组31之间的相对位置也不会发生变化。同时,由于多个输入输出模组31可以同时安装在一个支架32上,而不需要为多个输入输出模组31设置多个安装架,简化了终端100的结构,节约了终端100内的安装空间。再者,收容腔322中的至少一个收容腔322的内壁3220形成有内螺纹,便于将外壁310形成有外螺纹的输入输出模组31安装到内壁3220形成有内螺纹的收容腔322内。
本申请第三实施例中,请参阅图19至图21,输入输出组件30安装在壳体10内,输入输出组件30包括输入输出模组31和支架32,输入输出模组31安装在支架32上。
输入输出模组31可以向外界发出信号或者接收外界的信号,或者同时具备向外界发出信号和接收外界的信号的功能,其中信号可以是光线信号、声音信号、触摸信号等。可以理解,依据终端100的不同功能需求,输入输出模组31的具体种类和每种输入输出模组31的数量可以有所变化。
请结合图22和图23,在本申请实施例中,输入输出模组31包括红外成像模组313、可见光成像模组312、激光投射模组311和受话器314。其中,红外成像模组313可用于接收外界的红外光信号以生成红外图像。可见光成像模组312可接收外界的可见光信号以生成彩色图像。激光投射模组311可用于向终端100外的目标物体投射激光图案,激光可以是红外激光。受话器314在驱动信号的作用下向外发出声波实现通话等功能。在一个例子中,红外成像模组313可以接收激光投射模组311发射并由目标物体反射形成的激光图案,激光投射模组311和红外成像模组313共同用于获得目标物体的深度信息。红外成像模组313、可见光成像模组312和激光投射模组311可以共同用于获得目标用户的深度图像,输入输出模组31上可以设置有连接器33,连接器33可以插入到主板20上特定的连接座上,以电性及机械连接输入输出模组31与主板20,将连接器33从连接座上拔出则可以将输入输出模组31与主板20分离并断开二者之间的电性连接。
请参阅图19至图21,支架32为一体成型结构,支架32用于安装输入输出模组31。支架32包括本体321。
本体321包括第一面3211、第二面3212和侧壁3213。第一面3211和第二面3212相背,侧壁3213连接第一面3211与第二面3212,侧壁3213包括相背的顶侧壁3214和底侧壁3215。在将输入输出组件30安装在壳体10内时,前壳11可以与第一面3211相抵,后壳12可以与第二面3212相抵以夹持支架32,避免支架32和输入输出模组31沿终端100的厚度方向(如图19中的Z方向)移动,同时,支架32与主板20的安装口的位置对应安装,支架32的侧壁3213可以与安装口的内壁相抵,使得支架32卡在安装口内,只需要将主板20的位置固定,就可避免支架32和输入输出模组31沿终端100的宽度方向(如图19中的Y方向)移动。
请结合图22和图23,第二面3212开设有收容腔322。第一面3211开设有与收容腔322对应的通孔323,收容腔322位于顶侧壁3214和底侧壁3215之间。收容腔322用于收容输入输出模组31。收容腔322的具体形状与对应的输入输出模组31的形状对应,收容腔322的腔体可以略大于输入输出模组31以便于在收容腔322内点胶,收容腔322的腔体也可以略小于输入输出模组31以使输入输出模组31 可通过过盈配合安装在收容腔322内。收容腔322的数量可以与输入输出模组31的数量相等。当输入输出模组31安装在支架32上时,输入输出模组31从通孔323暴露。在本申请实施方式中,暴露指的是可以从第一面3211或从第二面3212看到输入输出模组31,例如,输入输出模组31可以穿过第一面3211的通孔323从第一面3211暴露,输入输出模组31也可以未穿过通孔323,但通过通孔323可以看到输入输出模组31。
具体地,收容腔322包括第一腔3221、第二腔3222、第三腔3223和第四腔3224。其中第一腔3221、第二腔3222和第三腔3223依次排列,依次排列可以是沿支架32的长度方向依次排列,具体可以是从左至右依次排列,也可以是从右至左依次排列。在如图23所示的实施例中,第四腔3224位于第二腔3222与第三腔3223之间,在其他实施例中,第四腔3224也可以位于第一腔3221与第二腔3222之间;或者第四腔3224位于第一腔3221的与第二腔3222相背的一侧;或者第四腔3224位于第三腔3223的与第二腔3222相背的一侧。
第一腔3221用于安装红外成像模组313,第二腔3222用于安装可见光成像模组312,第三腔3223用于安装激光投射模组311,第四腔3224用于安装受话器314。也即是说,可以将红外成像模组313、可见光成像模组312、激光投射模组311和受话器314依次安装在第一腔3221、第二腔3222、第三腔3223和第四腔3234内。侧壁3213包括多个间隔壁3218。多个收容腔322可以互相间隔,例如第一腔3221、第二腔3222、第三腔3223和第四腔3224通过间隔壁3218依次间隔(如图5),也可以是任意两个、或三个等的收容腔322互相连通,例如第一腔3221与第二腔3222连通,第二腔3222与第四腔3224间隔等。
通孔323包括第一通孔3231、第二通孔3232、第三通孔3233和第四通孔3234,第一通孔3231、第二通孔3232、第三通孔3233和第四通孔3234分别与第一腔3221、第二腔3222、第三腔3223和第四腔3224连通,也即是说,第一通孔3231与第一腔3221连通,第二通孔3232与第二腔3222连通,第三通孔3233与第三腔3223连通、第四通孔3234与第四腔3224连通。另外,第四通孔3234还与受话器314的出音口对应。第四通孔3234的孔径可小于受话器314的出音口的孔径,如此,受话器314可以未穿过第四通孔3234,受话器314发出的声波可以穿过第四通孔3234并进入外界。第一通孔3231、第二通孔3232和第三通孔3233的中心位于同一直线L上,第四通孔3234位于直线L与底侧壁3215之间(如图20所示)。在红外成像模组313、可见光成像模组312和激光投射模组311安装后,红外成像模组313从第一通孔3231穿出,可见光成像模组312从第二通孔3232穿出,激光投射模组311从第三通孔3233穿出,三者的光轴位于同一平面内,易于三者互相配合工作。红外成像模组313、可见光成像模组312和激光投射模组311的穿出通孔323的顶面也齐平,具体地,红外成像模组313的入光面、可见光成像模组312的入光面和激光投射模组311的出光面可以是位于同一个平面上。
在相关技术中,手机配置有多个功能模组,而多个功能模组往往需要多个支架以将功能模组一一固定在手机上,导致多个支架占用手机内部的空间较大,不利于手机的轻薄化。
综上,本申请实施方式的终端100,由于支架32一体成型,可以将多个输入输出模组31安装在同一个支架32上并收容在收容腔322内,如此,节约终端100内部的安装空间,利于实现终端100的轻薄化。另外,安装在同一个支架32上的输入输出模组31不会因支架32发生移动而造成多个输入输出模组31的相对位置发生变化,从而使多个输入输出模组31能够更好地配合工作。
请参阅图20和图22,在某些实施方式中,顶侧壁3214形成有缺口3216,第一面3211上形成有凹陷3217,凹陷3217与缺口3216连通。输入输出组件30还包括红外补光灯35、接近传感器36和光感器37。红外补光灯35用于向外发射红外光,接近传感器36用于检测目标物体到终端100的距离,光感器37用于检测环境光的强度,其中,接近传感器36和光感器37可以集成为一个模组。红外补光灯35、接近传感器36和光感器37安装在凹陷3217内。在本申请实施例中,凹陷3217形成的位置与第四腔3224的位置对应。
请参阅图22和图23,在某些实施方式中,输入输出组件30还包括柔性电路板34,受话器314包括连接弹片3141,连接弹片3141沿着第一面3211指向第二面3212的方向凸出,连接弹片3141与柔性电路板34抵触以电连接受话器314与柔性电路板34。具体地,柔性电路板34的一端可以连接到主板20上,柔性电路板34上可以形成有触点345,连接弹片3141与触点345抵触以电连接受话器314与柔性电路板34。在一个例子中,柔性电路板34上的触点345可以有多组,连接弹片3141与任意一组触点345抵触均能电连接受话器314与主板20,如此,只要受话器314的出音口与第二通孔3232相对,受话器314可以以多个角度被安装在第二腔3222内,且均可以使连接弹片3141与触点345抵触。
请参阅图20至图22,在某些实施方式中,柔性电路板34包括第一段341和第二段342。第一段341与第一面3211贴合(在第一面3211上开设有凹陷3217时,第一段341与凹陷3217的底部贴合),第二段342与第二面3212贴合。连接弹片3141与第二段342抵触。输入输出组件30还包括红外补光灯 35、接近传感器36和光感器37,红外补光灯35、接近传感器36和光感器37均安装在第一段341上。
在本申请实施例中,柔性电路板34还包括连接第一段341和第二段342的连接段343,连接段343穿过缺口3216。具体地,第一段341收容在凹陷3217内,第二段342自连接段343沿着顶侧壁3142指向底侧壁3145的方向延伸。如此,通过一个柔性电路板34就可以连接红外补光灯35、接近传感器36、光感器37和受话器314,输入输出组件30的整体结构较简单紧凑。
请参阅图20和图22,在某些实施方式中,支架32还包括自凹陷3217的底部凸出的支架定位柱326。支架定位柱326位于直线L与顶侧壁3214之间。支架定位柱326可以用于定位安装在支架32上的元件,例如上述的柔性电路板34、红外补光灯35、接近传感器36或光感器37等元件,防止元件发生晃动。具体地,支架定位柱326穿设并固定住柔性电路板34的第一段341,因此,设置在第一段341上的红外补光灯35、接近传感器36及光感器37也被固定住,第四腔3224的中心与支架定位柱326可以分别位于直线L的两侧。支架定位柱326的数量可以为多个,多个支架定位柱326分别设置在红外补光灯35、接近传感器36和光感器37的周缘,如此进一步固定元件。
请参阅图21和图23,在某些实施方式中,支架32还包括支架定位块327,支架定位块327与第二腔3222的位置对应,具体地,支架定位块327自第二面3212凸出。支架定位块327可以用于定位安装在支架32上的柔性电路板34,防止柔性电路板34发生晃动,具体地,支架定位块327穿设并固定住柔性电路板34的第二段342。
请参阅图22和图23,在某些实施方式中,柔性电路板34上开设有软板定位孔344,软板定位孔344用于定位柔性电路板34在支架32上的安装位置。具体地,软板定位孔344可以开设在第一段341、第二段342或连接段343的任意一段或多段上,在如图22和图23所示的实施例中,软板定位孔344同时开设在第一段341和第二段342上,软板定位孔344开设的位置可以与上述的支架定位柱326和支架定位块327的位置对应,在安装柔性电路板34时,将第一段341与第一面3211贴合(在第一面3211上开设有凹陷3217时,第一段341与凹陷3217的底部贴合)且将软板定位孔344与支架定位柱326配合,将第二段342与第二面3212贴合且将软板定位孔344与支架定位块327配合,如此,柔性电路板34的位置不易发生晃动。
请参阅图19和图24,在某些实施方式中,终端100还包括盖板40,盖板40与输入输出模组31分别位于前壳11的相背两侧。前壳11开设有第一穿孔111、第二穿孔112、第三穿孔113、及第四穿孔114。第一穿孔111与红外成像模组313对应,第二穿孔112与可见光成像模组312对应,第三穿孔113与激光投射模组311对应,第四穿孔114与受话器314对应。盖板40在与第一穿孔111及第三穿孔113对应处形成有红外透过油墨50,盖板40开设与第四穿孔114对应的出声孔41。
具体地,盖板40可以是透光的,盖板40的材料可以是透光的玻璃、树脂、塑料等。盖板40覆盖第一穿孔111、第二穿孔112、第三穿孔113、及第四穿孔114。外界光线穿过盖板40后经过第一穿孔111进入红外成像模组313。受话器314发出的声波穿过第四穿孔114后再穿过出声孔41。激光投射模组311发出的激光穿过第三穿孔113后穿出盖板40,外界光线穿过盖板40后经过第二穿孔112进入可见光成像模组312。在本实施例中,盖板40在与第一穿孔111及第三穿孔113对应处形成有红外透过油墨50。红外透过油墨50对红外光有较高的透过率,例如可达到85%或以上,且对可见光有较高的衰减率,例如可达到70%以上,使得用户在正常使用中,肉眼难以看到终端100上被红外透过油墨50覆盖的区域。如此,用户难以通过第一穿孔111和第三穿孔113看到终端100的内部结构(即,难以看到红外成像模组313及激光投射模组311),终端100的外形较美观。
在本申请第四实施例中,请参阅图25至图27,输入输出组件30安装在壳体10内,输入输出组件30包括输入输出模组31和支架32,输入输出模组31安装在支架32上。
输入输出模组31可以向外界发出信号或者接收外界的信号,或者同时具备向外界发出信号和接收外界的信号的功能,其中信号可以是光线信号、声音信号、触摸信号等。可以理解,依据终端100的不同功能需求,输入输出模组31的具体种类和每种输入输出模组31的数量可以有所变化。
请结合图28和图29,在本申请实施例中,输入输出模组31包括红外成像模组313、激光投射模组311、可见光成像模组312和受话器314。其中,激光投射模组311可用于向终端100外的目标物体投射激光图案,激光可以是红外激光,红外成像模组313可用于接收外界的红外光信号以生成红外图像,在一个例子中,红外成像模组313可以接收激光投射模组311发射并由目标物体反射形成的激光图案,激光投射模组311和红外成像模组313共同用于获得目标物体的深度信息。可见光成像模组312可接收外界的可见光信号以生成彩色图像,红外成像模组313、激光投射模组311和可见光成像模组312可以共同用于获得目标用户的深度图像,输入输出模组31上可以设置有连接器33,连接器33可以插入到主板20上特定的连接座上,以电性及机械连接输入输出模组31与主板20,将连接器33从连接座上拔出则可以将输入输出模组31与主板20分离并断开二者之间的电性连接。受话器314在驱动信号的作用下向 外发出声波实现通话等功能。
请参阅图25至图27,支架32为一体成型结构,支架32用于安装输入输出模组31。支架32包括本体321。
本体321包括第一面3211、第二面3212和侧壁3213。第一面3211和第二面3212相背,侧壁3213连接第一面3211与第二面3212,侧壁3213包括相背的顶侧壁3214和底侧壁3215。在将输入输出组件30安装在壳体10内时,前壳11可以与第一面3211相抵,后壳12可以与第二面3212相抵以夹持支架32,避免支架32和输入输出模组31沿终端100的厚度方向(如图25中的Z方向)移动,同时,支架32与主板20的安装口的位置对应安装,支架32的侧壁3213可以与安装口的内壁相抵,使得支架32卡在安装口内,只需要将主板20的位置固定,就可避免支架32和输入输出模组31沿终端100的宽度方向(如图25中的Y方向)移动。
请结合图28和图29,第二面3212开设有收容腔322。第一面3211开设有与收容腔322对应的通孔323,收容腔322位于顶侧壁3214和底侧壁3215之间。收容腔322用于收容输入输出模组31。收容腔322的具体形状与对应的输入输出模组31的形状对应,收容腔322的腔体可以略大于输入输出模组31以便于在收容腔322内点胶,收容腔322的腔体也可以略小于输入输出模组31以使输入输出模组31可通过过盈配合安装在收容腔322内。收容腔322的具体数量也可以与输入输出模组31的具体数量相等。当输入输出模组31安装在支架32上时,输入输出模组31从通孔323暴露。在本申请实施方式中,暴露指的是可以从第一面3211或从第二面3212看到输入输出模组31,例如,输入输出模组31可以穿过第一面3211的通孔323从第一面3211暴露,输入输出模组31也可以未穿过通孔323,但通过通孔323可以看到输入输出模组31。
具体地,收容腔322包括依次排列的第一腔3221、第二腔3222、第三腔3223和第四腔3224。第一腔3221用于安装红外成像模组313,第二腔3222用于安装受话器314,第三腔3223用于安装激光投射模组311,第四腔3224用于安装可见光成像模组312。也即是说,可以将红外成像模组313、受话器314、激光投射模组311和可见光成像模组312依次安装在第一腔3221、第二腔3222、第三腔3223和第四腔3224内。在一个例子中,第一腔3221、第二腔3222、第三腔3223和第四腔3224依次排列。在沿支架32的长度方向上,可以理解为第一腔3221、第二腔3222、第三腔3223和第四腔3224从左至右依次排列,也可以理解为第一腔3221、第二腔3222、第三腔3223和第四腔3224从右至左依次排列。在另一个例子中,第四腔3224、第一腔3221、第二腔3222和第三腔3223依次排列。侧壁3213包括多个间隔壁3218。多个收容腔322可以互相间隔,例如第一腔3221、第二腔3222、第三腔3223和第四腔3224通过间隔壁3218依次间隔(如图30),也可以是任意两个、或三个等的收容腔322互相连通,例如第一腔3221与第二腔3222连通,第二腔3222与第三腔3223间隔。
通孔323包括第一通孔3231、第二通孔3232、第三通孔3233和第四通孔3234,第一通孔3231、第二通孔3232、第三通孔3233和第四通孔3234分别与第一腔3221、第二腔3222、第三腔3223和第四腔3224连通,也即是说,第一通孔3231与第一腔3221连通,第二通孔3232与第二腔3222连通,第三通孔3233与第三腔3223连通、第四通孔3234与第四腔3224连通。另外,第二通孔3232还与受话器314的出音口对应。第二通孔3232的孔径可小于受话器314的出音口的孔径,如此,受话器314可以未穿过第二通孔3232,受话器314发出的声波可以穿过第二通孔3232并进入外界。第一通孔3231、第三通孔3233和第四通孔3234的中心位于同一直线L上,第二通孔3232位于直线L与底侧壁3215之间(如图26所示)。在红外成像模组313、激光投射模组311和可见光成像模组312安装后,红外成像模组313从第一通孔3231穿出,激光投射模组311从第三通孔3233穿出,可见光成像模组312从第四通孔3234穿出,三者的光轴位于同一平面内,易于三者互相配合工作。红外成像模组313、激光投射模组311和可见光成像模组312的穿出通孔323的顶面也齐平,具体地,红外成像模组313的入光面、激光投射模组311的出光面和可见光成像模组312的入光面可以是位于同一个平面上。
在相关技术中,手机配置有多个功能模组,而多个功能模组往往需要多个支架以将功能模组一一固定在手机上,导致多个支架占用手机内部的空间较大,不利于手机的轻薄化。
综上,本申请实施方式的终端100,由于支架32一体成型,可以将多个输入输出模组31安装在同一个支架32上并收容在收容腔322内,如此,节约终端100内部的安装空间,利于实现终端100的轻薄化。另外,安装在同一个支架32上的输入输出模组31不会因支架32发生移动而造成多个输入输出模组31的相对位置发生变化,从而使多个输入输出模组31能够更好地配合工作。
请参阅图26和图28,在某些实施方式中,顶侧壁3214形成有缺口3216,第一面3211上形成有凹陷3217,凹陷3217与缺口3216连通。输入输出组件30还包括红外补光灯35、接近传感器36和光感器37。红外补光灯35用于向外发射红外光,接近传感器36用于检测目标物体到终端100的距离,光感器37用于检测环境光的强度,其中,接近传感器36和光感器37可以集成为一个模组。红外补光灯35、 接近传感器36和光感器37安装在凹陷3217内。
请参阅图28和图29,在某些实施方式中,输入输出组件30还包括柔性电路板34,受话器314包括连接弹片3141,连接弹片3141沿着第一面3211指向第二面3212的方向凸出,连接弹片3141与柔性电路板34抵触以电连接受话器314与柔性电路板34。具体地,柔性电路板34的一端可以连接到主板20上,柔性电路板34上可以形成有触点345,连接弹片3141与触点345抵触以电连接受话器314与柔性电路板34。在一个例子中,柔性电路板34上的触点345可以有多组,连接弹片3141与任意一组触点345抵触均能电连接受话器314与主板20,如此,只要受话器314的出音口与第二通孔3232相对,受话器314可以以多个角度被安装在第二腔3222内,且均可以使连接弹片3141与触点345抵触。
请参阅图26至图28,在某些实施方式中,柔性电路板34包括第一段341和第二段342。第一段341与第一面3211贴合(在第一面3211上开设有凹陷3217时,第一段341与凹陷3217的底部贴合),第二段342与第二面3212贴合。连接弹片3141与第二段342抵触。输入输出组件30还包括红外补光灯35、接近传感器36和光感器37,红外补光灯35、接近传感器36和光感器37均安装在第一段341上。
在本申请实施例中,柔性电路板34还包括连接第一段341和第二段342的连接段343,连接段343穿过缺口3216。具体地,第一段341收容在凹陷3217内,第二段342自连接段343沿着顶侧壁3142指向底侧壁3145的方向延伸。如此,通过一个柔性电路板34就可以连接红外补光灯35、接近传感器36、光感器37和受话器314,输入输出组件30的整体结构较简单紧凑。
请参阅图26和图28,在某些实施方式中,支架32还包括自凹陷3217的底部凸出的支架定位柱326。支架定位柱326位于直线L与顶侧壁3214之间。支架定位柱326可以用于定位安装在支架32上的元件,例如上述的柔性电路板34、红外补光灯35、接近传感器36或光感器37等元件,防止元件发生晃动。更具体地,支架定位柱326穿设并固定住柔性电路板34的第一段341,因此,设置在第一段341上的红外补光灯35、接近传感器36及光感器37也被固定住,第二腔3222的中心与支架定位柱326可以分别位于直线L的两侧。支架定位柱326的数量可以为多个,多个支架定位柱326分别设置在红外补光灯35、接近传感器36和光感器37的周缘,如此进一步固定元件。
请参阅图27和图29,在某些实施方式中,支架32还包括支架定位块327,支架定位块327与第二面3212的位置对应,具体地,支架定位块327自第二面3212凸出。支架定位块327可以用于定位安装在支架32上的柔性电路板34,防止柔性电路板34发生晃动,具体地,支架定位块327穿设并固定住柔性电路板34的第二段342。
请参阅图28和图29,在某些实施方式中,柔性电路板34上开设有软板定位孔344,软板定位孔344用于定位柔性电路板34在支架32上的安装位置。具体地,软板定位孔344可以开设在第一段341、第二段342或连接段343的任意一段或多段上,在如图28和图29所示的实施例中,软板定位孔344同时开设在第一段341和第二段342上,软板定位孔344开设的位置可以与上述的支架定位柱326和支架定位块327的位置对应,在安装柔性电路板34时,将第一段341与第一面3211贴合(在第一面3211上开设有凹陷3217时,第一段341与凹陷3217的底部贴合)且将软板定位孔344与支架定位柱326配合,将第二段342与第二面3212贴合且将软板定位孔344与支架定位块327配合,如此,柔性电路板34的位置不易发生晃动。
请参阅图25和图31,在某些实施方式中,终端100还包括盖板40,盖板40与输入输出模组31分别位于前壳11的相背两侧。前壳11开设有第一穿孔111、第二穿孔112、第三穿孔113、及第四穿孔114。第一穿孔111与红外成像模组313对应,第二穿孔112与受话器314对应,第三穿孔113与激光投射模组311对应,第四穿孔114与可见光成像模组312对应。盖板40在与第一穿孔111及第三穿孔113对应处形成有红外透过油墨50,盖板40开设与第二穿孔112对应的出声孔41。
具体地,盖板40可以是透光的,盖板40的材料可以是透光的玻璃、树脂、塑料等。盖板40覆盖第一穿孔111、第二穿孔112、第三穿孔113、及第四穿孔114。外界光线穿过盖板40后经过第一穿孔111进入红外成像模组313。受话器314发出的声波穿过第二穿孔112后再穿过出声孔41。激光投射模组311发出的激光穿过第三穿孔113后穿出盖板40,外界光线穿过盖板40后经过第四穿孔114进入可见光成像模组312。在本实施例中,盖板40在与第一穿孔111及第三穿孔113对应处形成有红外透过油墨50。红外透过油墨50对红外光有较高的透过率,例如可达到85%或以上,且对可见光有较高的衰减率,例如可达到70%以上,使得用户在正常使用中,肉眼难以看到终端100上被红外透过油墨50覆盖的区域。如此,用户难以通过第一穿孔111和第三穿孔113看到终端100的内部结构(即,难以看到红外成像模组313及激光投射模组311),终端100的外形较美观。
本申请第五实施例中,请参阅图32至图34,输入输出组件30安装在壳体10内,输入输出组件30包括输入输出模组31和支架32,输入输出模组31安装在支架32上。
输入输出模组31可以向外界发出信号或者接收外界的信号,或者同时具备向外界发出信号和接收 外界的信号的功能,其中信号可以是光线信号、声音信号、触摸信号等。可以理解,依据终端100的不同功能需求,输入输出模组31的具体种类和每种输入输出模组31的数量可以有所变化。
在本申请实施例中,输入输出模组31包括红外成像模组313、可见光成像模组312和激光投射模组311。其中,激光投射模组311可用于向终端100外的目标物体投射激光图案,激光可以是红外激光,红外成像模组313可用于接收外界的红外光信号以生成红外图像,在一个例子中,红外成像模组313可以接收激光投射模组311发射并由目标物体反射形成的激光图案,激光投射模组311和红外成像模组313共同用于获得目标物体的深度信息。可见光成像模组312可接收外界的可见光信号以生成彩色图像,红外成像模组313、可见光成像模组312和激光投射模组311也可以共同用于获得目标用户的深度图像,输入输出模组31上可以设置有连接器33,连接器33可以插入到主板20上特定的连接座上,以电性及机械连接输入输出模组31与主板20,将连接器33从连接座上拔出则可以将输入输出模组31与主板20分离并断开二者之间的电性连接。
请参阅图32至图34,支架32为一体成型结构,支架32用于安装输入输出模组31。支架32包括本体321。
本体321包括第一面3211、第二面3212和侧壁3213。第一面3211和第二面3212相背,侧壁3213连接第一面3211与第二面3212,侧壁3213包括相背的顶侧壁3214和底侧壁3215。在将输入输出组件30安装在壳体10内时,前壳11可以与第一面3211相抵,后壳12可以与第二面3212相抵以夹持支架32,避免支架32和输入输出模组31沿终端100的厚度方向(如图32中的Z方向)移动,同时,支架32与主板20的安装口的位置对应安装,支架32的侧壁3213可以与安装口的内壁相抵,使得支架32卡在安装口内,只需要将主板20的位置固定,就可避免支架32和输入输出模组31沿终端100的宽度方向(如图32中的Y方向)移动。
请结合图35和图36,第二面3212开设有收容腔322,收容腔322位于顶侧壁3214和底侧壁3215之间。第一面3211开设有与收容腔322对应的通孔323。收容腔322用于收容输入输出模组31。收容腔322的具体形状与对应的输入输出模组31的形状对应,收容腔322的腔体可以略大于输入输出模组31以便于在收容腔322内点胶,收容腔322的腔体也可以略小于输入输出模组31以使输入输出模组31可通过过盈配合安装在收容腔322内。收容腔322的具体数量也可以与输入输出模组31的具体数量相等。当输入输出模组31安装在支架32上时,输入输出模组31从通孔323暴露。具体地,收容腔322包括依次排列的第一腔3221、第二腔3222和第三腔3223。在沿支架32的长度方向上,可以理解为第一腔3221、第二腔3222和第三腔3223从左至右依次排列,也可以理解为第一腔3221、第二腔3222和第三腔3223从右至左依次排列。第一腔3221用于安装红外成像模组313,第二腔3222用于安装可见光成像模组312,第三腔3223用于安装激光投射模组311。也即是说,可以将红外成像模组313、可见光成像模组312和激光投射模组311依次安装在第一腔3221、第二腔3222、第三腔3223。多个收容腔322可以互相间隔,例如第一腔3221、第二腔3222和第三腔3223通过间隔腔329(如图34)依次间隔,也可以是任意两个、或三个等的收容腔322互相连通,例如第一腔3221与第二腔3222连通,第二腔3222与第三腔3223间隔。
通孔323包括第一通孔3231、第二通孔3232和第三通孔3233,第一通孔3231、第二通孔3232和第三通孔3233分别与第一腔3221、第二腔3222和第三腔3223连通,也即是说,第一通孔3231与第一腔3221连通,第二通孔3232与第二腔3222连通,第三通孔3233与第三腔3223连通。第一通孔3231、第二通孔3232和第三通孔3233的中心位于同一直线L上(如图33)。在红外成像模组313、可见光成像模组312和激光投射模组311安装后,红外成像模组313从第一通孔3231暴露,可见光成像模组312从第二通孔3232暴露,激光投射模组311从第三通孔3233暴露,三者的光轴位于同一平面内,易于三者互相配合工作。红外成像模组313、激光投射模组311和可见光成像模组312的顶面齐平,具体地,红外成像模组313的入光面、激光投射模组311的出光面和可见光成像模组312的入光面可以是位于同一个平面上。在本申请实施方式中,暴露指的是可以从第一面3211或从第二面3212看到输入输出模组31,例如,输入输出模组31可以穿过第一面3211的通孔323并从第一面3211暴露,输入输出模组31也可以未穿过通孔323,但通过通孔323可以看到输入输出模组31。
在相关技术中,终端通常利用激光投射模组向目标物体投射结构光,然后利用图像获取装置(如红外摄像头)采集被目标物体调制后的激光以得到目标物体的深度图像,因此终端获取目标物体的深度图像往往需要多个功能模组相互配合,然而当某个功能模组的位置发生改变时,使得该功能模组与其他的功能模组的相对位置发生改变而不能很好地配合工作,例如得到的深度图像精度较低。
综上,本申请实施方式的终端100,由于支架32一体成型,红外成像模组313、可见光成像模组312和激光投射模组311安装在同一个支架32上,三者的相对位置不会发生改变,从而较好地配合工作。另外,多个输入输出模组31一并收容在支架32的收容腔322内,而不用设置多个支架来固定多个输入 输出模组31,节约了终端100内部的安装空间。
请参阅图34和图36,在某些实施方式中,第二面3212开设有第一间隔腔3291,第一间隔腔3291间隔第一腔3221和第二腔3222。具体地,本体321还包括多个间隔壁3218。顶侧壁3214、底侧壁3215和间隔壁3218共同形成间隔腔329。间隔腔329包括第一间隔腔3291。在红外成像模组313和可见光成像模组312安装在支架32上后,第一间隔腔3291间隔红外成像模组313和可见光成像模组312。
请继续参阅图34和图36,在某些实施方式中,第二面3212开设有第二间隔腔3292,第二间隔腔3292间隔第二腔3222和第三腔3223。具体地,本体321还包括多个间隔壁3218。顶侧壁3214、底侧壁3215和间隔壁3218共同形成间隔腔329。间隔腔329包括第二间隔腔3292。在可见光成像模组312和激光投射模组311安装在支架32后,第二间隔腔3292间隔可见光成像模组312和激光投射模组311。
请参阅图34和图37,在某些实施方式中,上述实施方式中的第一间隔腔3291和第二间隔腔3292设置有散热材料320。由于输入输出模组31工作时产生的热量比较集中,容易造成输入输出模组31的一些光学元件产生温漂,影响输入输出模组31的精度。另外,输入输出模组31长期处于高温环境,缩短输入输出模组31的使用寿命。在第一间隔腔3291内和第二间隔腔3292内设置散热材料320,在能为单个输入输出模组31散热的同时,还能减少相邻两个输入输出模组31产生的热量的相互影响。在本实施例中,散热材料320可以为导热硅脂、导热金属(比如银、铜、金等),还可以为陶瓷材料。当散热材料320为导热硅脂时,散热材料320可以铺设在第二面3212及间隔壁3218的表面上。当散热材料320为导热金属时,散热材料320可以以单层或者多层的形式铺设在第二面3212及间隔壁3218的表面上,例如,银层、铜层交替铺设。当散热材料320为陶瓷材料时,散热材料320可以填充满整个间隔腔329。
请参阅图35和图36,在某些实施方式中,支架32在第一通孔3231的侧壁开设有第一定位槽3219,第一定位槽3219用于限定红外成像模组313的安装位置。具体地,红外成像模组313包括形成在镜筒周缘的第一凸出部3131。第一定位槽3219的位置和数量与第一凸出部3131的位置和数量对应。第一凸出部3131的数量可以是一个或多个,本实施例中,第一凸出部3131的数量为两个,且两个第一凸出部3131形成在红外成像模组313的镜筒周缘相背的两侧,第一定位槽3219的数量也为两个,且两个第一定位槽3219分别开设在第一通孔3231的相对两侧的侧壁上。在红外成像模组313安装在第一腔3221并从第一通孔3231暴露时,第一定位槽3219与第一凸出部3131卡合以表示安装到位。
请参阅图35和图36,在某些实施方式中,支架32在第二通孔3232的侧壁开设有第二定位槽3210,第二定位槽3210用于限定可见光成像模组312的安装位置。具体地,可见光成像模组312包括形成在镜筒周缘的第二凸出部3121。第二定位槽3210的位置和数量与第二凸出部3121的位置和数量对应。第二凸出部3121的数量可以是一个或多个,本实施例中,第二凸出部3121的数量为两个,且两个第二凸出部3121形成在可见光成像模组312的镜筒周缘相背的两侧,第二定位槽3210的数量也为两个,且两个第二定位槽3210分别开设在第二通孔3232的相对两侧的侧壁上。在可见光成像模组312安装在第二腔3222并从第二通孔3232暴露时,第二定位槽3210与第二凸出部3121卡合以表示安装到位。
请参阅图34和图36,在某些实施方式中,顶侧壁3214在与第三腔3223对应的位置开设有缺口3216。由于第三腔3223的空间较小,故可以在顶侧壁3214上与第三腔3223对应的位置开设缺口3216。在安装体积较小的激光投射模组311时,便于在第三腔3223内点胶。请结合图32,在将安装好输入输出模组31的支架32安装在壳体10上时,壳体10的凸出结构伸入缺口3216,以限位支架32的安装位置。
请参阅图33和图35,在某些实施方式中,第一面3211上开设有支架定位孔325,支架定位孔325用于定位支架32的安装位置。具体地,支架定位孔325的数量可以是一个或多个,本实施例中,支架定位孔325的数量为两个,且两个支架定位孔325开设在本体321的斜对角的位置。对应的,请结合图32,前壳11上可以凸出形成有前壳定位柱110,当第一面3211与前壳11相抵时,前壳定位柱110伸入支架定位孔325中且与支架定位孔325配合,通过前壳定位柱110与支架定位孔325的配合可以快速定位支架32的安装位置,且进一步避免支架32在壳体10内晃动。
请参阅图32和图38,在某些实施方式中,输入输出组件30还包括受话器314、红外补光灯35、接近传感器36和光感器37,终端100还包括安装在壳体10上的柔性电路板34,受话器314、红外补光灯35、接近传感器36和光感器37均安装在柔性电路板34上。具体地,受话器314在驱动信号的作用下向外发出声波实现通话等功能。红外补光灯35用于向外发射红外光,接近传感器36用于检测目标物体到终端100的距离,光感器37用于检测环境光的强度。在前壳11和后壳12的夹持作用下,柔性电路板34固定在壳体10的内部。柔性电路板34的一端可以连接到主板20上。受话器314、红外补光灯35、接近传感器36和光感器37均可以通过同一个柔性电路板34电连接主板20,如此,输入输出组件30的整体结构较简单紧凑。
请参阅图38,在某些实施方式中,柔性电路板34包括第一段341、第二段342和连接段343。连接段343连接第一段341与第二段342,第一段341与第二段342平行设置。红外补光灯35、接近传感器 36和光感器37均设置在第一段341上,受话器314设置在第二段342上。第二段342上可以形成有触点345。受话器314包括位于受话器314相背两侧的出音口3142和连接弹片(图未示),连接弹片沿着远离受话器314的出音口3142的方向凸出。连接弹片与触点345抵触以电连接受话器314与柔性电路板34。在一个例子中,柔性电路板34上的触点345可以有多组,连接弹片与任意一组触点345抵触均能电连接受话器314与主板20。
请参阅图36和图38,在某些实施方式中,受话器314、红外补光灯35、接近传感器36和光感器37均位于第一腔3221的与第二腔3222相背的一侧。可以理解,在沿支架32长度的方向上,安装有受话器314、红外补光灯35、接近传感器36和光感器37的柔性电路板34、红外成像模组313、可见光模组312和激光投射模组311依次排列。或者,受话器314、红外补光灯35、接近传感器36和光感器37均位于第三腔3223的与第二腔3222相背的一侧,此时,在沿支架32长度的方向上,红外成像模组313、可见光模组312、激光投射模组311和安装有受话器314、红外补光灯35、接近传感器36和光感器37的柔性电路板34依次排列。
请参阅图32和图39,在某些实施方式中,终端100还包括盖板40,盖板40与输入输出模组31分别位于前壳11的相背两侧。前壳11开设有第一穿孔111、第二穿孔112及第三穿孔113。第一穿孔111与红外成像模组313对应,第二穿孔112与可见光成像模组312对应,第三穿孔113与激光投射模组311对应。盖板40在分别在与第一穿孔111和第三穿孔113对应处形成有红外透过油墨50。
具体地,盖板40可以是透光的,盖板40的材料可以是透光的玻璃、树脂、塑料等。盖板40覆盖第一穿孔111、第二穿孔112和第三穿孔113。外界光线穿过盖板40后经过第一穿孔111进入红外成像模组313。外界光线穿过盖板40后经过第二穿孔112进入可见光成像模组312。激光投射模组311发出的激光穿过第三穿孔113后穿出盖板40。在本实施例中,盖板40在与第一穿孔111及第三穿孔113对应处形成有红外透过油墨50。红外透过油墨50对红外光有较高的透过率,例如可达到85%或以上,且对可见光有较高的衰减率,例如可达到70%以上,使得用户在正常使用中,肉眼难以看到终端100上被红外透过油墨50覆盖的区域。如此,用户难以通过第一穿孔111和第三穿孔113看到终端100的内部结构(即难以看到红外成像模组313及激光投射模组311),终端100的外形较美观。
在本申请第六实施例中,请参阅图40,本申请实施方式的终端100包括壳体10、主板20和输入输出组件30。终端100可以是手机、平板电脑、手提电脑、游戏机、头显设备、门禁系统、柜员机等,本申请实施例以终端100是手机为例进行说明,可以理解,终端100的具体形式可以是其他,在此不作限制。
请参阅图40,壳体10可以作为主板20和输入输出组件30的安装载体,壳体10可以给主板20和输入输出组件30提供防尘、防水、防摔的保护,壳体10上还可以安装有显示屏、电池等元器件。壳体10包括前壳11和后壳12,前壳11与后壳12互相结合并将主板20和输入输出组件30收容在前壳11与后壳12之间,前壳11与后壳12可以采用不锈钢、铝合金、塑料等材料制成。
请参阅图40至图42,主板20固定在壳体10内,具体地,主板20可以通过螺合、卡合等方式固定在前壳11或后壳12上。主板20可以与输入输出组件30的各输入输出模组31和柔性电路板34连接,主板20上还可以连接终端100的处理芯片、控制芯片等,主板20上铺设的线路可以用于传输电信号。主板20上形成有安装口21(如图43),安装口21供输入输出组件30穿过,减小主板20与输入输出组件30安装在壳体10内时占用的空间。
请参阅图40至图42,输入输出组件30安装在壳体10内,输入输出组件30包括输入输出模组31、支架32和柔性电路板34,输入输出模组31和柔性电路板34安装在支架32上。
输入输出模组31可以向外界发出信号或者接收外界的信号,或者同时具备向外界发出信号和接收外界的信号的功能,其中信号可以是光线信号、声音信号、触摸信号等。可以理解,依据终端100的不同功能需求,输入输出模组31的具体种类和每种输入输出模组31的数量可以有所变化。
请结合图43和图44,在本申请实施例中,输入输出模组31包括红外成像模组313、可见光成像模组312、激光投射模组311和受话器314。其中,激光投射模组311可用于向终端100外的目标物体投射激光图案,激光可以是红外激光,红外成像模组313可用于接收外界的红外光信号以生成红外图像,在一个例子中,红外成像模组313可以接收激光投射模组311发射并由目标物体反射形成的激光图案,激光投射模组311和红外成像模组313共同用于获得目标物体的深度信息。可见光成像模组312可接收外界的可见光信号以生成彩色图像,红外成像模组313、可见光成像模组312和激光投射模组311可以共同用于获得目标用户的深度图像,输入输出模组31上可以设置有连接器34,连接器34可以插入到主板20上特定的连接座22(如图44)上,以电性及机械连接输入输出模组31与主板20,将连接器34从连接座上拔出则可以将输入输出模组31与主板20分离并断开二者之间的电性连接。受话器314在驱动信号的作用下向外发出声波实现通话等功能。
请参阅图40至图42,支架32为一体成型结构,各输入输出模组31固定在支架32上。支架32包括本体321。
本体321包括第一面3211、第二面3212和侧壁3213。第一面3211和第二面3212相背,侧壁3213连接第一面3211与第二面3212,侧壁3213包括相背的顶侧壁3214和底侧壁3215。在将输入输出组件30安装在壳体10内时,前壳11可以与第二面3212相抵,后壳12可以与第一面3211相抵以夹持支架32,避免输入输出组件30沿终端100的厚度方向(如图40中的Z方向)移动,同时,支架32与主板20的安装口21的位置对应安装,支架32的侧壁3213可以与安装口21的内壁相抵,使得支架32卡在安装口21内,只需要将主板20的位置固定,就可避免输入输出组件30沿终端100的宽度方向(如图40中的Y方向)移动。
请结合图43和图44,第一面3211开设有收容腔322。第二面3212开设有与收容腔322连通的通孔323。收容腔322位于顶侧壁3214与底侧壁3215之间。收容腔322用于收容输入输出模组31。收容腔322的具体形状与对应的输入输出模组31的形状对应,收容腔322的腔体可以略大于输入输出模组31以便于在收容腔322内点胶,收容腔322的腔体也可以略小于输入输出模组31以使输入输出模组31可通过过盈配合安装在收容腔322内。收容腔322的具体数量也可以与输入输出模组31的具体数量相等。当输入输出模组31安装在支架32上时,输入输出模组31从通孔323暴露。在本申请实施方式中,暴露指的是可以从第一面3211或从第二面3212看到输入输出模组31,例如,输入输出模组31可以穿过第二面3212的通孔323从第二面3212暴露,输入输出模组31也可以未穿过通孔323,但通过通孔323可以看到输入输出模组31。
收容腔322包括第一腔3221、第二腔3222、第三腔3223和第四腔3224。第四腔3224位于第一腔3221与第二腔3222之间。第一腔3221用于安装红外成像模组313,第二腔3222用于安装可见光成像模组312,第三腔3223用于安装激光投射模组311,第四腔3224用于收容受话器314。也即是说,可以将红外成像模组313、受话器314、可见光成像模组312和激光投射模组311依次安装在第一腔3221、第四腔3224、第二腔3222和第三腔3223内。在一个例子中,第一腔3221、第四腔3224、第二腔3222和第三腔3223依次排列。在沿支架32的长度方向上,可以理解为第一腔3221、第四腔3224、第二腔3222和第三腔3223从左至右依次排列,也可以理解为第一腔3221、第四腔3224、第二腔3222和第三腔3223从右至左依次排列。侧壁3213包括间隔壁3218(如图44)。多个收容腔322可以互相间隔,例如第一腔3221、第四腔3224、第二腔3222和第三腔3223通过间隔壁3218依次间隔,也可以是任意两个、或三个的收容腔322互相连通,例如第一腔3221与第四腔3224连通,第二腔3222与第三腔3223间隔。
通孔323包括第一通孔3231、第二通孔3232、第三通孔3233和出音通孔3234,第一通孔3231、第二通孔3232、第三通孔3233和出音通孔3234分别与第一腔3221、第二腔3222、第三腔3223和第四腔3224连通,也即是说,第一通孔3231与第一腔3221连通,第二通孔3232与第二腔3222连通,第三通孔3233与第三腔3223连通,出音通孔3234和第四腔3224连通。另外,出音通孔3234与受话器314的出音口相对,而且出音通孔3234的孔径小于受话器314的出音口的孔径,如此,受话器314可以未穿过出音通孔3234,受话器314发出的声波可以穿过出音通孔3234并进入外界。第一通孔3231、第二通孔3232和第三通孔3233的中心位于同一直线L(如图41)上,出音通孔3234位于直线L与底侧壁3215之间,且第四腔3224的中心位于直线L与底侧壁3215之间。在红外成像模组313、可见光成像模组312和激光投射模组311安装后,红外成像模组313从第一通孔3231穿出,可见光成像模组312从第二通孔3232穿出,激光投射模组311从第三通孔3233穿出,三者的光轴位于同一平面内,易于三者互相配合工作。红外成像模组313、可见光成像模组312和激光投射模组311的穿出通孔323的顶面也齐平,具体地,红外成像模组313的入光面、可见光成像模组312的入光面和激光投射模组311的出光面可以是位于同一个平面上。
请结合图43和图44,柔性电路板34安装在支架32上。柔性电路板34可以是印刷电路板、柔性电路板或软硬结合板。柔性电路板34包括第一段341、第二段342和连接段343。连接段343连接第一段341与第二段342。
第一段341与第一面3211结合且与输入输出模组31电连接。第一段341可以通过胶合的方式与第一面3211结合,第一段341也可以由后壳12压紧并贴合在第一面3211上。受话器314与第一段341电连接,第一段341的形状与受话器314的形状对应。具体地,第一段341上可以形成有触点345(如图43),受话器314包括沿着第二面3212向第一面3211的方向凸出的连接弹片3141(如图44),连接弹片3141与第一段341上的触点345抵触以电连接受话器314与柔性电路板34。在一个例子中,第一段341上的触点345可以有多组,连接弹片3141与任意一组触点345抵触均能电连接受话器314与主板20。
第二段342包括相接的结合部3421和连接部3422。结合部3421与第二面3212结合,连接部3422与第二面3212间隔且用于与外部设备电连接。结合部3421可以通过胶合的方式与第二面3212结合,结合部3421也可以由前壳11压紧并贴合在第二面3212上。结合部3421开设有与出音通孔3234对应的出音孔3423(如图43)。如此,受话器314可以未穿过出音通孔3234,受话器314发出的声波可以穿过出音通孔3234和出音孔3423并进入外界。
连接部3422向远离本体32的方向延伸,以与外部设备电连接。在如图40所示的实施例中,外部设备为主板20。主板20的表面上设置有连接座22,连接部3422向连接器34延伸并与连接座22电性及机械连接。
连接段343与顶侧壁3214相贴合。具体地,顶侧壁3214形成有缺口3216,连接段343穿过缺口3216。第一段341与第二段342分别位于支架32相背的两侧。当然,柔性电路板34也可以与其他输入输出模组31电连接,例如柔性电路板34与红外成像模组313、可见光成像模组312、激光投射模组311中的任意一个或多个电连接,并将输入输出模组31与外部设备电连接。
在手机中,通常采用支架固定元器件(如红外摄像头、激光投射器、受话器等),然而支架与主板间隔,安装在支架上的元器件不便于连接到主板上。
综上,本申请实施方式的输入输出组件30和终端100中,柔性电路板34的第一段341和第二段342与输入输出模组31电连接,第一段341和第二段342的结合部3421安装在支架32上,第二段342的连接部3422与外部设备电连接,以实现输入输出模组31连接到主板20上。
请参阅图43和图44,在某些实施方式中,输入输出组件30还包括红外补光灯35、接近传感器36和光感器37。红外补光灯35用于向外发射红外光,接近传感器36用于检测目标物体到终端100的距离,光感器37用于检测环境光的强度,其中,接近传感器36和光感器37可以集成为一个模组。红外补光灯35、接近传感器36和光感器37均连接在第二段342上。具体地,红外补光灯35、接近传感器36和光感器37均连接在结合部3421上,且位于连接段343与出音孔3423之间,从而较好地将红外补光灯35、接近传感器36和光感器37固定在支架32上。
请参阅图43和图44,在某些实施方式中,支架32自第一面3211和/或第二面3212凸出形成有支架定位柱326,柔性电路板34开设有软板定位孔344,支架定位柱326伸入软板定位孔344内。支架定位柱326与第四腔3224的位置对应。支架定位柱326和软板定位孔344配合以定位柔性电路板34在支架32上的安装位置。具体地,支架定位柱326可以只形成在第一面3211上,也可以只形成在第二面3212上,还可以同时在第一面3211和第二面3212上形成支架定位柱326。软板定位孔344的数量和位置与支架定位柱326的数量和位置对应,例如,软板定位孔344可以只开设在第一段341,也可以只开设在第二段342上,还可以同时开设在第一段341和第二段342上。
更具体地,形成在第一面3211的支架定位柱326与第四腔3224的位置对应。支架定位柱326可以用于定位安装在支架32上的第一段341,防止第一段341发生晃动,具体地,支架定位柱326穿设第一段341的软板定位孔344并固定住第一段341。形成在第二面3212的支架定位柱326位于顶侧壁3214与底侧壁3215之间。此时,支架定位柱326可以用于定位安装在支架32上的元件,例如上述的结合部3421、红外补光灯35、接近传感器36或光感器37等元件,防止元件发生晃动。支架定位柱326穿设结合部3421的软板定位孔344并固定住第二段342,因此,设置在第二段342上的红外补光灯35、接近传感器36及光感器37也被固定住,第四腔3224的中心与支架定位柱326可以分别位于直线L的两侧。
请参阅图42至图44,在某些实施方式中,支架32还包括固定凸出328,固定凸出328自侧壁3213向外凸出,固定凸出328用于固定支架32。固定凸出328的数量可以是单个或多个,当固定凸出328的数量是多个时,多个固定凸出328可以从侧壁3213的相背的两侧凸出。具体地,可以通过紧固件直接将固定凸出328固定在壳体10上,也可以通过紧固件将支架32和主板20共同固定在壳体10上。在如图40和图42所示的实施例中,固定凸出328上开设有固定孔3282,主板20和前壳11与固定孔3282对应的位置开设有安装孔,可以通过紧固件(如螺钉)穿过固定孔3282和安装孔,以将支架32和主板20固定在前壳11上。通过固定凸出328固定支架32,进一步提高支架32安装在壳体10内的稳定性。
请参阅图41和图43,在某些实施方式中,第二面3212上开设有支架定位孔325,支架定位孔325用于定位支架32的安装位置。具体地,支架定位孔325的数量可以是一个或多个,本实施例中,支架定位孔325的数量为两个,且两个支架定位孔325开设在本体321的斜对角的位置。对应的,前壳11上可以凸出形成有前壳定位柱(图未示),当第二面3212与前壳11相抵时,前壳定位柱伸入支架定位孔325中且与支架定位孔325配合,通过前壳定位柱与支架定位孔325的配合可以快速定位支架32的安装位置,且进一步避免支架32在壳体10内晃动。
请参阅图40和图45,在某些实施方式中,终端100还包括盖板40,盖板40与输入输出模组31分别位于前壳11的相背两侧。前壳11开设有第一穿孔111、第二穿孔112、第三穿孔113、及第四穿孔114。 第一穿孔111与红外成像模组313对应,第二穿孔112与受话器314对应,第三穿孔113与可见光成像模组312对应,第四穿孔114与激光投射模组311对应。盖板40在与第一穿孔111及第四穿孔114对应处形成有红外透过油墨50,盖板40开设与第二穿孔112对应的出声孔41。
具体地,盖板40可以是透光的,盖板40的材料可以是透光的玻璃、树脂、塑料等。盖板40覆盖第一穿孔111、第二穿孔112、第三穿孔113、及第四穿孔114。外界光线穿过盖板40后经过第一穿孔111进入红外成像模组313。受话器314发出的声波穿过第二穿孔112后再穿过出声孔41。外界光线穿过盖板40后经过第三穿孔113进入可见光成像模组312。激光投射模组311发出的激光穿过第四穿孔114后穿出盖板40。在本实施例中,盖板40在与第一穿孔111及第四穿孔114对应处形成有红外透过油墨50。红外透过油墨50对红外光有较高的透过率,例如可达到85%或以上,且对可见光有较高的衰减率,例如可达到70%以上,使得用户在正常使用中,肉眼难以看到终端100上被红外透过油墨50覆盖的区域。如此,用户难以通过第一穿孔111和第四穿孔114看到终端100的内部结构(即,难以看到红外成像模组313及激光投射模组311),终端100的外形较美观。
在本说明书的描述中,参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中,“多个”的含义是至少两个,例如两个,三个,除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本申请的限制,本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型,本申请的范围由权利要求及其等同物限定。

Claims (87)

  1. 一种支架,其特征在于,所述支架包括本体,所述本体包括相背的第一面和第二面,所述第二面开设有至少一个收容腔,所述第一面开设有与至少一个所述收容腔对应的至少一个通孔,至少一个所述收容腔用于固定安装输入输出模组并使所述输入输出模组从所述第二面暴露,至少一个所述通孔用于从所述第一面暴露所述输入输出模组。
  2. 根据权利要求1所述的支架,其特征在于,所述支架为一体成型结构,所述输入输出模组至少包括成像模组。
  3. 根据权利要求1所述的支架,其特征在于,所述支架为一体成型结构,所述输入输出模组至少包括成像模组,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述支架还包括自所述侧壁向外凸出的固定凸出,所述固定凸出用于固定所述支架。
  4. 根据权利要求2或3所述的支架,其特征在于,所述成像模组包括可见光成像模组及/或红外成像模组。
  5. 根据权利要求2或3所述的支架,其特征在于,所述输入输出模组还包括激光投射模组及/或受话器。
  6. 根据权利要求2或3所述的支架,其特征在于,所述通孔的开口尺寸小于对应的所述收容腔的尺寸以形成限位环,所述收容腔由所述限位环及环绕所述限位环延伸的内壁形成。
  7. 根据权利要求2或3所述的支架,其特征在于,所述第一面上开设有支架定位孔,所述支架定位孔用于定位所述支架的安装位置。
  8. 根据权利要求2或3所述的支架,其特征在于,至少一个所述收容腔包括第一腔、第二腔、第三腔和第四腔,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述侧壁包括相背的顶侧壁和底侧壁,所述第一腔、所述第二腔、所述第三腔和所述第四腔依次排列,所述第一腔、所述第二腔和所述第四腔的中心位于同一直线上,所述第三腔的中心位于所述直线与所述底侧壁之间。
  9. 根据权利要求8所述的支架,其特征在于,所述支架还包括自所述第一面凸出的支架定位柱,所述支架定位柱与所述第三腔的位置对应,所述支架定位柱位于所述直线与所述顶侧壁之间。
  10. 根据权利要求8所述的支架,其特征在于,所述支架还包括自所述第二面凸出的支架定位块,所述支架定位块与所述第三腔的位置对应。
  11. 根据权利要求1所述的支架,其特征在于,所述支架为一体成型结构,所述收容腔中的至少一个收容腔的内壁形成有内螺纹。
  12. 根据权利要求11所述的支架,其特征在于,所述输入输出模组包括可见光成像模组及/或红外成像模组。
  13. 根据权利要求11所述的支架,其特征在于,所述输入输出模组还包括激光投射模组及/或受话器。
  14. 根据权利要求11所述的支架,其特征在于,所述通孔的开口尺寸小于对应的所述收容腔的尺寸以形成限位环,所述收容腔由所述限位环及环绕所述限位环延伸的内壁形成。
  15. 根据权利要求11所述的支架,其特征在于,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述支架还包括自所述侧壁向外凸出的固定凸出,所述固定凸出用于固定所述支架。
  16. 根据权利要求11所述的支架,其特征在于,至少一个所述收容腔包括第一腔、第二腔、第三腔和第四腔,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述侧壁包括相背的顶侧壁和底侧壁,所述第一腔、所述第二腔、所述第三腔和所述第四腔依次排列,所述第一腔、所述第二腔和所述第四腔的中心位于同一直线上,所述第三腔的中心位于所述直线与所述底侧壁之间。
  17. 根据权利要求16所述的支架,其特征在于,所述支架还包括自所述第二面凸出的支架定位块,所述支架定位块与所述第三腔的位置对应。
  18. 根据权利要求1所述的支架,其特征在于,所述输入输出模组包括红外成像模组、可见光成像模组、激光投射模组和受话器,至少一个所述收容腔包括依次排列的第一腔、第二腔和第三腔,所述第一腔用于安装所述红外成像模组,所述第二腔用于安装所述可见光成像模组,所述第三腔用于安装所述激光投射模组,所述收容腔还包括第四腔,所述第四腔用于安装所述受话器。
  19. 根据权利要求18所述的支架,其特征在于,所述第四腔位于所述第一腔与所述第二腔之间;或所述第四腔位于所述第二腔与所述第三腔之间。
  20. 根据权利要求18所述的支架,其特征在于,所述通孔包括第一通孔、第二通孔、第三通孔和第四通孔,所述第一通孔与所述第一腔连通,所述第二通孔与所述第二腔连通,所述第三通孔与所述第三腔连通,所述第四通孔与所述第四腔连通。
  21. 根据权利要求20所述的支架,其特征在于,所述第一通孔、所述第二通孔和所述第三通孔的中 心位于同一直线上。
  22. 根据权利要求21所述的支架,其特征在于,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述侧壁包括相背的顶侧壁和底侧壁,所述第四通孔位于所述直线与所述底侧壁之间。
  23. 根据权利要求18所述的支架,其特征在于,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述侧壁包括相背的顶侧壁和底侧壁,所述顶侧壁形成有缺口,所述第一面上形成有凹陷,所述凹陷与所述缺口连通。
  24. 根据权利要求23所述的支架,其特征在于,所述凹陷形成的位置与所述第四腔的位置对应。
  25. 根据权利要求23所述的支架,其特征在于,所述支架还包括自所述凹陷的底部凸出的支架定位柱。
  26. 根据权利要求1所述的支架,其特征在于,所述支架为为一体成型结构,所述输入输出模组包括激光投射模组、受话器和红外成像模组,至少一个所述收容腔包括依次排列的第一腔、第二腔和第三腔,所述第一腔用于安装所述红外成像模组,所述第二腔用于安装所述受话器,所述第三腔用于安装所述激光投射模组。
  27. 根据权利要求26所述的支架,其特征在于,所述通孔包括第一通孔、第二通孔和第三通孔,所述第一通孔与所述第一腔连通,所述第二通孔与所述第二腔连通并与所述受话器的出音口对应,所述第三通孔与所述第三腔连通。
  28. 根据权利要求27所述的支架,其特征在于,所述输入输出模组还包括可见光成像模组,所述收容腔还包括第四腔,所述第四腔用于收容所述可见光成像模组,所述第一腔、所述第二腔、所述第三腔、及所述第四腔依次排列;或
    所述第四腔、所述第一腔、所述第二腔、所述第三腔依次排列。
  29. 根据权利要求28所述的支架,其特征在于,所述第二腔与所述第一腔间隔;或
    所述第二腔与所述第一腔连通。
  30. 根据权利要求28所述的支架,其特征在于,所述通孔还包括第四通孔,所述第四通孔与所述第四腔对应。
  31. 根据权利要求30所述的支架,其特征在于,所述第一通孔、所述第三通孔和所述第四通孔的中心位于同一直线上。
  32. 根据权利要求30所述的支架,其特征在于,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述侧壁包括相背的顶侧壁和底侧壁,所述第一通孔、所述第三通孔和所述第四通孔的中心位于同一直线上,所述第二通孔位于所述直线与所述底侧壁之间。
  33. 根据权利要求26所述的支架,其特征在于,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述侧壁包括相背的顶侧壁和底侧壁,所述顶侧壁形成有缺口,所述第一面上形成有凹陷,所述凹陷与所述缺口连通。
  34. 根据权利要求33所述的支架,其特征在于,所述支架还包括自所述凹陷的底部凸出的支架定位柱。
  35. 根据权利要求1所述的支架,其特征在于,所述支架为为一体成型结构,所述输入输出模组包括激光投射模组、可见光成像模组和红外成像模组,至少一个所述收容腔包括依次排列的第一腔、第二腔和第三腔,所述第一腔用于安装所述红外成像模组,所述第二腔用于安装所述可见光成像模组,所述第三腔用于安装所述激光投射模组。
  36. 根据权利要求35所述的支架,其特征在于,所述通孔包括第一通孔、第二通孔和第三通孔,所述第一通孔、所述第二通孔和所述第三通孔分别与所述第一腔、所述第二腔和所述第三腔连通。
  37. 根据权利要求36所述的支架,其特征在于,所述第一通孔、所述第二通孔、所述第三通孔的中心位于同一直线上。
  38. 根据权利要求35所述的支架,其特征在于,所述第二面开设有第一间隔腔,所述第一间隔腔间隔所述第一腔和所述第二腔。
  39. 根据权利要求38所述的支架,其特征在于,所述第二面开设有第二间隔腔,所述第二间隔腔间隔所述第二腔和所述第三腔。
  40. 根据权利要求36所述的支架,其特征在于,所述支架在所述第一通孔的侧壁开设有第一定位槽,所述第一定位槽用于限定所述红外成像模组的安装位置。
  41. 根据权利要求40所述的支架,其特征在于,所述支架在所述第二通孔的侧壁开设有第二定位槽,所述第二定位槽用于限定所述可见光成像模组的安装位置。
  42. 根据权利要求35所述的支架,其特征在于,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述侧壁包括相背的顶侧壁和底侧壁,所述顶侧壁在与所述第三腔对应的位置开设有缺口。
  43. 根据权利要求35所述的支架,其特征在于,所述第一面上开设有支架定位孔,所述支架定位孔用于定位所述支架的安装位置。
  44. 一种输入输出组件,其特征在于,包括:
    输入输出模组;和
    权利要求1至10任意一项所述的支架,所述输入输出模组安装在所述支架的所述收容腔内。
  45. 根据权利要求44所述的输入输出组件,其特征在于,所述输入输出模组包括受话器,所述输入输出组件还包括安装在所述支架上的柔性电路板,所述受话器包括沿着所述第一面向所述第二面的方向凸出的连接弹片,所述连接弹片与所述柔性电路板抵触以电连接所述受话器与所述柔性电路板。
  46. 根据权利要求45所述的输入输出组件,其特征在于,所述柔性电路板包括与所述第一面贴合的第一段和与所述第二面贴合的第二段,所述连接弹片与所述第二段抵触,所述输入输出组件还包括红外补光灯、接近传感器和光感器,所述红外补光灯、所述接近传感器和所述光感器均连接在所述第一段上。
  47. 根据权利要求45或46所述的输入输出组件,其特征在于,所述柔性电路板上开设有软板定位孔,所述软板定位孔用于定位所述柔性电路板在所述支架上的安装位置。
  48. 一种输入输出组件,其特征在于,包括:
    权利要求11至17中的任意一项所述的支架;和
    与所述收容腔对应的至少一个输入输出模组,所述输入输出模组中的至少一个输入输出模组的外壁形成有外螺纹,所述外螺纹与所述内螺纹结合以使所述输入输出模组安装在对应的所述收容腔内。
  49. 一种终端,其特征在于,包括:
    壳体;和
    权利要求44至48任意一项所述的输入输出组件,所述输入输出组件安装在所述壳体内。
  50. 根据权利要求49所述的终端,其特征在于,所述终端还包括固定在所述壳体内的主板,所述输入输出模组与所述主板电连接,所述主板形成有安装口,所述支架穿设所述安装口。
  51. 根据权利要求50所述的终端,其特征在于,所述壳体包括前壳和后壳,所述前壳和所述后壳分别与所述第一面和所述第二面相抵以夹持所述支架。
  52. 一种输入输出组件,其特征在于,包括:
    输入输出模组,所述输入输出模组包括红外成像模组、可见光成像模组、激光投射器和受话器;和
    权利要求18至25任意一项所述的支架,所述红外成像模组安装在所述第一腔内,所述可见光成像模组安装在所述第二腔内,所述激光投射模组安装在所述第三腔内,所述受话器安装在所述第四腔内。
  53. 根据权利要求52所述的输入输出组件,其特征在于,所述输入输出组件还包括安装在所述支架上的柔性电路板,所述受话器包括沿着所述第一面向所述第二面的方向凸出的连接弹片,所述连接弹片与所述柔性电路板抵触以电连接所述受话器与所述柔性电路板。
  54. 根据权利要求53所述的输入输出组件,其特征在于,所述柔性电路板包括与所述第一面贴合的第一段和与所述第二面贴合的第二段,所述连接弹片与所述第二段抵触,所述输入输出组件还包括红外补光灯、接近传感器和光感器,所述红外补光灯、所述接近传感器和所述光感器均连接在所述第一段上。
  55. 根据权利要求53或54所述的输入输出组件,其特征在于,所述柔性电路板上开设有软板定位孔,所述软板定位孔用于定位所述柔性电路板在所述支架上的安装位置。
  56. 一种终端,其特征在于,包括:
    壳体;和
    权利要求52至55任意一项所述的输入输出组件,所述输入输出组件安装在所述壳体内。
  57. 根据权利要求56所述的终端,其特征在于,所述终端还包括固定在所述壳体内的主板,所述输入输出模组与所述主板电连接,所述主板形成有安装口,所述支架穿设所述安装口且与所述主板固定连接。
  58. 根据权利要求57所述的终端,其特征在于,所述壳体包括前壳和后壳,所述前壳与所述第一面相抵且所述后壳与所述第二面相抵以夹持所述支架。
  59. 根据权利要求58所述的终端,其特征在于,所述终端还包括盖板,所述盖板与所述输入输出模组分别位于所述前壳的相背两侧,所述前壳开设有第一穿孔、第二穿孔、第三穿孔及第四穿孔,所述第一穿孔与所述红外成像模组对应,所述第二穿孔与所述可见光成像模组对应,所述第三穿孔与所述激光投射模组对应,所述第四穿孔与所述受话器对应,所述盖板在与所述第一穿孔及所述第三穿孔对应处形成有红外透过油墨,所述盖板开设与所述第四穿孔对应的出声孔。
  60. 一种输入输出组件,其特征在于,包括:
    输入输出模组,所述输入输出模组包括激光投射模组、受话器和红外成像模组;和
    权利要求26至34任意一项所述的支架,所述红外成像模组安装在所述第一腔内,所述受话器安装 在所述第二腔内,所述激光投射模组安装在所述第三腔内。
  61. 根据权利要求60所述的输入输出组件,其特征在于,所述输入输出组件还包括安装在所述支架上的柔性电路板,所述受话器包括沿着所述第一面向所述第二面的方向凸出的连接弹片,所述连接弹片与所述柔性电路板抵触以电连接所述受话器与所述柔性电路板。
  62. 根据权利要求60所述的输入输出组件,其特征在于,所述柔性电路板包括与所述第一面贴合的第一段和与所述第二面贴合的第二段,所述连接弹片与所述第二段抵触,所述输入输出组件还包括红外补光灯、接近传感器和光感器,所述红外补光灯、所述接近传感器和所述光感器均连接在所述第一段上。
  63. 根据权利要求61或62所述的输入输出组件,其特征在于,所述柔性电路板上开设有软板定位孔,所述软板定位孔用于定位所述柔性电路板在所述支架上的安装位置。
  64. 一种终端,其特征在于,包括:
    壳体;和
    权利要求60至63任意一项所述的输入输出组件,所述输入输出组件安装在所述壳体内。
  65. 根据权利要求64所述的终端,其特征在于,所述终端还包括固定在所述壳体内的主板,所述输入输出模组与所述主板电连接,所述主板形成有安装口,所述支架穿设所述安装口且与所述主板固定连接。
  66. 根据权利要求64所述的终端,其特征在于,所述壳体包括前壳和后壳,所述前壳和所述后壳分别与所述第一面和所述第二面相抵以夹持所述支架。
  67. 根据权利要求66所述的终端,其特征在于,所述终端还包括盖板,所述盖板与所述输入输出模组分别位于所述前壳的相背两侧,所述前壳开设有第一穿孔、第二穿孔及第三穿孔,所述第一穿孔与所述红外成像模组对应,所述第二穿孔与所述受话器对应,所述第三穿孔与所述激光投射模组对应,所述盖板在与所述第一穿孔及所述第三穿孔对应处形成有红外透过油墨,所述盖板开设与所述第二穿孔对应的出声孔。
  68. 一种输入输出组件,其特征在于,包括:
    输入输出模组,所述输入输出模组包括激光投射模组、可见光成像模组和红外成像模组;和
    权利要求35-43任意一项所述的支架,所述红外成像模组安装在所述第一腔内,所述可见光成像模组安装在所述第二腔内,所述激光投射模组安装在所述第三腔内。
  69. 一种终端,其特征在于,包括:
    壳体;和
    权利要求68所述的输入输出组件,所述输入输出组件安装在所述壳体内。
  70. 根据权利要求69所述的终端,其特征在于,所述终端还包括固定在所述壳体内的主板,所述输入输出模组与所述主板电连接,所述主板形成有安装口,所述支架穿设所述安装口且与所述主板固定连接。
  71. 根据权利要求69所述的终端,其特征在于,所述壳体包括前壳和后壳,所述前壳和所述后壳分别与所述第一面和所述第二面相抵以夹持所述支架。
  72. 根据权利要求69所述的终端,其特征在于,所述输入输出组件还包括受话器、红外补光灯、接近传感器和光感器,所述终端还包括安装在所述壳体上的柔性电路板,所述受话器、所述红外补光灯、所述接近传感器和所述光感器均安装在所述柔性电路板上。
  73. 根据权利要求72所述的终端,其特征在于,所述柔性电路板包括第一段、第二段和连接段,所述连接段连接所述第一段与所述第二段,所述第一段与所述第二段平行设置,所述红外补光灯、所述接近传感器和所述光感器均连接在所述第一段上,所述受话器连接在所述第二段上。
  74. 根据权利要求72或73所述的终端,其特征在于,所述受话器、所述红外补光灯、所述接近传感器和所述光感器均位于所述第一腔的与所述第二腔相背的一侧;或所述受话器、所述红外补光灯、所述接近传感器和所述光感器均位于所述第三腔的与所述第二腔相背的一侧。
  75. 根据权利要求74所述的终端,其特征在于,所述终端还包括盖板,所述盖板与所述输入输出模组分别位于所述前壳的相背两侧,所述前壳开设有第一穿孔、第二穿孔及第三穿孔,所述第一穿孔与所述红外成像模组对应,所述第二穿孔与所述可见光成像模组对应,所述第三穿孔与所述激光投射模组对应,所述盖板在与所述第一穿孔及所述第三穿孔对应处形成有红外透过油墨。
  76. 一种输入输出组件,其特征在于,包括:
    权利要求1所述的支架;
    输入输出模组,所述输入输出模组安装在所述收容腔内并从所述通孔暴露;和
    安装在所述支架上的柔性电路板,所述柔性电路板包括第一段和第二段,所述第一段与所述第一面结合且与所述输入输出模组电连接,所述第二段包括相接的结合部和连接部,所述结合部与所述第二面 结合,所述连接部与所述第二面间隔且用于与外部设备电连接。
  77. 根据权利要求76所述的输入输出组件,其特征在于,所述收容腔包括第四腔,所述输入输出模组包括受话器,所述受话器收容在所述第四腔内,所述受话器包括沿着所述第二面向所述第一面的方向凸出的连接弹片,所述连接弹片与所述第一段抵触以电连接所述受话器与所述柔性电路板。
  78. 根据权利要求77所述的输入输出组件,其特征在于,所述通孔包括出音通孔,所述出音通孔与所述第四腔连通,所述出音通孔与所述受话器的出音口对应,所述结合部开设有与所述出音通孔对应的出音孔。
  79. 根据权利要求77所述的输入输出组件,其特征在于,至少一个所述收容腔还包括第一腔,第二腔和第三腔,所述输入输出模组还包括红外成像模组、可见光成像模组和激光投射模组,所述红外成像模组收容在所述第一腔,所述可见光成像模组收容在所述第二腔,所述激光投射模组收容在所述第三腔。
  80. 根据权利要求79所述的输入输出组件,其特征在于,至少一个所述通孔还包括第一通孔、第二通孔和第三通孔,所述第一通孔与所述第一腔连通,所述第二通孔与所述第二腔连通,所述第三通孔与所述第三腔连通。
  81. 根据权利要求80所述的输入输出组件,其特征在于,所述第一通孔、所述第二通孔和所述第三通孔的中心位于同一直线上。
  82. 根据权利要求81所述的输入输出组件,其特征在于,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述侧壁包括相背的顶侧壁和底侧壁,所述第四腔位于所述直线与所述底侧壁之间。
  83. 根据权利要求77所述的输入输出组件,其特征在于,所述输入输出组件还包括红外补光灯、接近传感器和光感器,所述红外补光灯、所述接近传感器和所述光感器均连接在所述第二段上。
  84. 根据权利要求76所述的输入输出组件,其特征在于,所述支架自所述第一面和/或所述第二面凸出形成有支架定位柱,所述柔性电路板开设有软板定位孔,所述支架定位柱伸入所述软板定位孔内。
  85. 根据权利要求76所述的输入输出组件,其特征在于,所述本体包括侧壁,所述侧壁连接所述第一面与所述第二面,所述支架还包括自所述侧壁向外凸出的固定凸出,所述固定凸出用于固定所述支架。
  86. 一种终端,其特征在于,包括:
    主板,所述主板上开设有安装口;和
    权利要求76-85任一项所述的输入输出组件,所述支架安装在所述安装口,所述连接部与所述主板电连接。
  87. 根据权利要求86所述的终端,其特征在于,所述终端还包括壳体,所述壳体包括前壳和后壳,所述前壳和所述后壳分别与所述第二面和所述第一面相抵以夹持所述支架。
PCT/CN2019/081325 2018-04-10 2019-04-03 支架、输入输出组件和终端 WO2019196726A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP19773330.6A EP3609168B1 (en) 2018-04-10 2019-04-03 Support, input/output assembly and terminal
US16/493,286 US11330090B2 (en) 2018-04-10 2019-04-03 Bracket, input/output assembly and terminal

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
CN201820506788.7 2018-04-10
CN201820506788.7U CN208386606U (zh) 2018-04-10 2018-04-10 框体、输入输出组件及电子装置
CN201810316733.4A CN108390969B (zh) 2018-04-10 2018-04-10 支架、输入输出组件和终端
CN201810317084.X 2018-04-10
CN201820506787.2 2018-04-10
CN201820507039.6U CN208386609U (zh) 2018-04-10 2018-04-10 支架、输入输出组件和终端
CN201820506787.2U CN208386605U (zh) 2018-04-10 2018-04-10 支架、输入输出组件和电子装置
CN201820506901.1U CN208386607U (zh) 2018-04-10 2018-04-10 支架、输入输出组件和终端
CN201820506786.8U CN208386604U (zh) 2018-04-10 2018-04-10 框架、输入输出组件及电子装置
CN201820506786.8 2018-04-10
CN201820506901.1 2018-04-10
CN201810315979.XA CN108616619B (zh) 2018-04-10 2018-04-10 输入输出组件和电子装置
CN201820507039.6 2018-04-10
CN201810317244.0 2018-04-10
CN201820507037.7 2018-04-10
CN201810317084.XA CN108401045A (zh) 2018-04-10 2018-04-10 支架、输入输出组件和电子装置
CN201810315979.X 2018-04-10
CN201810317232.8 2018-04-10
CN201810317244.0A CN108390971B (zh) 2018-04-10 2018-04-10 支架、输入输出组件和终端
CN201810316733.4 2018-04-10
CN201810317232.8A CN108390970B (zh) 2018-04-10 2018-04-10 支架、输入输出组件和终端
CN201820507037.7U CN208386608U (zh) 2018-04-10 2018-04-10 支架、输入输出组件和终端

Publications (1)

Publication Number Publication Date
WO2019196726A1 true WO2019196726A1 (zh) 2019-10-17

Family

ID=68163920

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/081325 WO2019196726A1 (zh) 2018-04-10 2019-04-03 支架、输入输出组件和终端

Country Status (3)

Country Link
US (1) US11330090B2 (zh)
EP (1) EP3609168B1 (zh)
WO (1) WO2019196726A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102340537B1 (ko) * 2020-06-30 2021-12-20 삼성전기주식회사 멀티 카메라 모듈
DE102021102309B3 (de) 2021-02-02 2022-02-17 Ford Global Technologies Llc Überwachungseinheit für einen Fahrzeuginnenraum
WO2023235523A1 (en) * 2022-06-02 2023-12-07 Apple Inc. Seal for an electronic device

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107483692A (zh) * 2017-08-22 2017-12-15 广东欧珀移动通信有限公司 盖体组件、壳体组件、壳体组件的加工方法及移动终端
US20170364172A1 (en) * 2016-06-21 2017-12-21 Samsung Electronics Co., Ltd. Cover window and electronic device including same
CN108390971A (zh) * 2018-04-10 2018-08-10 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN108390970A (zh) * 2018-04-10 2018-08-10 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN108390969A (zh) * 2018-04-10 2018-08-10 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN108401045A (zh) * 2018-04-10 2018-08-14 Oppo广东移动通信有限公司 支架、输入输出组件和电子装置
CN108616619A (zh) * 2018-04-10 2018-10-02 Oppo广东移动通信有限公司 输入输出组件和电子装置
CN208386607U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN208386606U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 框体、输入输出组件及电子装置
CN208386604U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 框架、输入输出组件及电子装置
CN208386608U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN208386605U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 支架、输入输出组件和电子装置
CN208386609U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 支架、输入输出组件和终端

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101938536B (zh) * 2009-06-29 2013-10-09 深圳富泰宏精密工业有限公司 电子元件装配结构
US8320621B2 (en) 2009-12-21 2012-11-27 Microsoft Corporation Depth projector system with integrated VCSEL array
US9008355B2 (en) 2010-06-04 2015-04-14 Microsoft Technology Licensing, Llc Automatic depth camera aiming
KR101848871B1 (ko) * 2011-08-03 2018-04-13 엘지전자 주식회사 이동 단말기
US9191643B2 (en) 2013-04-15 2015-11-17 Microsoft Technology Licensing, Llc Mixing infrared and color component data point clouds
US9979427B2 (en) * 2014-09-09 2018-05-22 Ppip Llc Privacy and security systems and methods of use
KR102342269B1 (ko) 2015-02-27 2021-12-22 삼성전자주식회사 관통 홀을 포함하는 전자 장치
KR20170035237A (ko) 2015-09-22 2017-03-30 엘지전자 주식회사 이동 단말기 및 그 제어방법
KR102499120B1 (ko) 2016-02-17 2023-02-15 삼성전자주식회사 안테나를 포함하는 전자 장치
CN106506734A (zh) 2016-11-01 2017-03-15 惠州Tcl移动通信有限公司 一种超薄电子装置及其摄像头固定结构
CN206698329U (zh) 2016-11-08 2017-12-01 聚晶半导体股份有限公司 摄像模块和摄像装置
CN206332721U (zh) 2017-01-09 2017-07-14 广东欧珀移动通信有限公司 输入输出模组和电子装置
WO2018156986A1 (en) * 2017-02-26 2018-08-30 Ring Inc. Automatic exposure control for audio/video recording and communication devices
CN206669265U (zh) 2017-04-13 2017-11-24 邓利 一种手机外接摄像头安装架
CN107105573A (zh) 2017-05-24 2017-08-29 广东欧珀移动通信有限公司 电子元器件支架、电子元器件组件和移动终端
CN107451542B (zh) 2017-07-14 2020-09-01 Oppo广东移动通信有限公司 虹膜识别模组排列结构及移动终端
CN107343122A (zh) 2017-08-02 2017-11-10 深圳奥比中光科技有限公司 3d成像装置
CN206674128U (zh) 2017-09-08 2017-11-24 深圳奥比中光科技有限公司 结构稳定的3d成像装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170364172A1 (en) * 2016-06-21 2017-12-21 Samsung Electronics Co., Ltd. Cover window and electronic device including same
CN107483692A (zh) * 2017-08-22 2017-12-15 广东欧珀移动通信有限公司 盖体组件、壳体组件、壳体组件的加工方法及移动终端
CN108616619A (zh) * 2018-04-10 2018-10-02 Oppo广东移动通信有限公司 输入输出组件和电子装置
CN108390970A (zh) * 2018-04-10 2018-08-10 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN108390969A (zh) * 2018-04-10 2018-08-10 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN108401045A (zh) * 2018-04-10 2018-08-14 Oppo广东移动通信有限公司 支架、输入输出组件和电子装置
CN108390971A (zh) * 2018-04-10 2018-08-10 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN208386607U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN208386606U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 框体、输入输出组件及电子装置
CN208386604U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 框架、输入输出组件及电子装置
CN208386608U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 支架、输入输出组件和终端
CN208386605U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 支架、输入输出组件和电子装置
CN208386609U (zh) * 2018-04-10 2019-01-15 Oppo广东移动通信有限公司 支架、输入输出组件和终端

Also Published As

Publication number Publication date
EP3609168A1 (en) 2020-02-12
EP3609168A4 (en) 2020-03-25
US11330090B2 (en) 2022-05-10
EP3609168B1 (en) 2023-08-23
US20210329108A1 (en) 2021-10-21

Similar Documents

Publication Publication Date Title
CN108390969B (zh) 支架、输入输出组件和终端
CN108390970B (zh) 支架、输入输出组件和终端
CN108390971B (zh) 支架、输入输出组件和终端
WO2019196726A1 (zh) 支架、输入输出组件和终端
WO2020038068A1 (zh) 成像装置及电子设备
TWI677714B (zh) 鐳射投射結構和電子裝置
TWI771569B (zh) 鐳射投射模組、深度相機及電子裝置
CN108616619B (zh) 输入输出组件和电子装置
CN108401045A (zh) 支架、输入输出组件和电子装置
WO2020038056A1 (zh) 飞行时间组件及电子设备
WO2019196524A1 (zh) 输入输出组件和终端
CN108390979B (zh) 壳体和终端
CN108600437B (zh) 支架组件、输入输出组件和电子装置
WO2020038055A1 (zh) 飞行时间组件及移动终端
WO2019228055A1 (zh) 支架结构、输入输出组件和电子装置
CN108989507B (zh) 输入输出组件和移动设备
CN208386608U (zh) 支架、输入输出组件和终端
US20220113130A1 (en) Laser Projection Unit, Depth Camera and Electronic Device
WO2019196530A1 (zh) 壳体和终端
CN208386606U (zh) 框体、输入输出组件及电子装置
CN208386604U (zh) 框架、输入输出组件及电子装置
CN208386605U (zh) 支架、输入输出组件和电子装置
CN110290304B (zh) 深度相机及终端
WO2019196541A1 (zh) 壳体组件和移动终端
CN110365817B (zh) 壳体组件和移动终端

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE